Display device

Abstract

A display device is provided. The display device includes a base layer including a display area and a non-display area; a display device layer disposed on the base layer to overlap the display area; a plurality of pads disposed on the base layer to overlap the non-display area; an encapsulation layer disposed on the display device layer; a touch sensor including a touch insulating layer overlapping the display area and the non-display area, and a conductive pattern disposed on the display area, wherein the plurality of pads includes a first lower pad electrically connected to the display device layer and disposed on the base layer, a second lower pad spaced apart from the first lower pad in a plan view and disposed on the base layer, a first upper pad disposed on the first lower pad and electrically connected to the first lower pad, and a second upper pad electrically connected to the conductive pattern and disposed on the second lower pad, wherein the touch insulating layer is disposed between the first lower pad and the first upper pad and between the second lower pad and the second upper pad.

Description

[0001] This application is a divisional application of the application for invention patent application No. 201710638744.X, filed in the China National Intellectual Property Office on July 31, 2017, the title of which is "Organic Light Emitting Display Module". TECHNICAL FIELD

[0002] The present disclosure relates to a display device, and more particularly, to a display device integrated with a touch sensing unit. BACKGROUND

[0003] Various display devices used in multimedia devices such as televisions, mobile phones, desktop computers, navigation devices, and game consoles are being developed. Such display devices include a keyboard or a mouse as an input unit. In addition, in recent years, display devices include a touch sensing member as an input unit. SUMMARY

[0004] The present disclosure provides a display device that removes a stepped portion between a pad unit of a display panel and a pad unit of a touch sensing member to reduce defects occurring in a manufacturing process.

[0005] The present disclosure also provides a display device having improved reliability when a boundary region between an active region and a pad region on a display panel is curved.

[0006] Embodiments of the inventive concept provide an organic light emitting display module including a base layer, a first circuit layer, a device layer, an encapsulation layer, a plurality of touch electrodes, a second circuit layer, and a boundary layer. The base layer includes an active region, a pad region, and a boundary region between the active region and the pad region. The first circuit layer is disposed on the active region of the base layer and includes a plurality of inorganic layers and a first conductive pattern. The device layer is disposed on the first circuit layer and includes an organic light emitting device configured to generate light by using an electrical signal provided from the first conductive pattern. The encapsulation layer is disposed on the device layer. The plurality of touch electrodes is disposed on the encapsulation layer. The second circuit layer is disposed on the pad region of the base layer and includes a plurality of inorganic layers and a second conductive pattern. The boundary layer is disposed on the boundary region of the base layer and includes an organic layer and a third conductive pattern configured to electrically connect the first conductive pattern to the second conductive pattern. The boundary layer can not include an inorganic layer disposed on the base layer.

[0007] In embodiments, the plurality of inorganic layers of the first circuit layer can include a first functional layer contacting the base layer, and the plurality of inorganic layers of the second circuit layer can include a second functional layer directly contacting the base layer.

[0008] In an embodiment, the second conductive pattern can include a display panel pad and a touch sensing member pad. The display panel pad can be disposed on the second functional layer and electrically connected to the first conductive pattern. The touch sensing member pad can be disposed adjacent to the display panel pad on the second functional layer, electrically connected to the plurality of touch electrodes, and insulated from the first conductive pattern.

[0009] In an embodiment, the display panel pad can include a lower display panel pad and an upper display panel pad disposed on the lower display panel pad and electrically connected to the lower display panel pad.

[0010] In an embodiment, the touch sensing member pad can include a lower touch sensing member pad and an upper touch sensing member pad disposed on the lower touch sensing member pad.

[0011] In an embodiment, the first conductive pattern can include a transistor including a control electrode, an input electrode, and an output electrode, the input electrode, the output electrode, the lower display panel pad, and the lower touch sensing member pad can be disposed on the same layer.

[0012] In an embodiment, the second conductive pattern can further include a dummy electrode disposed on the same layer as the control electrode.

[0013] In an embodiment, the organic light emitting display module can further include a touch signal line extending from at least one of the plurality of touch electrodes to contact the upper touch sensing member pad.

[0014] In an embodiment, the second circuit layer can further include a plurality of insulating layers disposed between the upper display panel pad and the lower display panel pad, the plurality of insulating layers can be disposed between the upper touch sensing member pad and the lower touch sensing member pad.

[0015] In an embodiment, the lower touch sensing member pad can be electrically insulated from the upper touch sensing member pad.

[0016] In an embodiment, the lower touch sensing member pad can be electrically connected to the upper touch sensing member pad.

[0017] In an embodiment, the upper display panel pad can contact the lower display panel pad, and the upper touch sensing member pad can contact the lower touch sensing member pad.

[0018] In an embodiment, the first functional layer and the second functional layer can include a barrier layer and a buffer layer, respectively.

[0019] In an embodiment, the organic light emitting display module can further include a driving circuit overlapped with the pad area and configured to control an electrical signal flowing between the display panel pad and the first conductive pattern.

[0020] In an embodiment, the first circuit layer can further include an organic layer disposed on the first conductive pattern, and the boundary layer can further include an organic layer disposed on the third conductive pattern.

[0021] In an embodiment, the boundary region of the base layer and the boundary layer can be bendable.

[0022] In an embodiment of the inventive concept, an organic light emitting display device includes an organic light emitting display panel and a touch sensing member disposed on the organic light emitting display panel.

[0023] In an embodiment, the organic light emitting display panel can include a base layer, a conductive pattern, a device layer, and an encapsulation layer. The base layer can include an active region, a pad region, and a boundary region between the active region and the pad region. The conductive pattern can overlap the active region, be disposed on the base layer, be formed by a low temperature poly-Si (LTPS) process, and include a display panel pad and a touch sensing member pad disposed adjacent to the display panel pad, wherein the touch sensing member pad and the display panel pad can receive an electrical signal from the outside. The device layer can be disposed on the conductive pattern and include an organic light emitting device configured to generate light by using the electrical signal provided from the conductive pattern. The encapsulation layer can be disposed on the device layer.

[0024] In an embodiment, the touch sensing member can include a plurality of touch electrodes and a plurality of touch signal lines. The plurality of touch electrodes can be disposed on the encapsulation layer. The plurality of touch signal lines can extend from the plurality of touch electrodes and be electrically connected to the conductive pattern, wherein a portion of the touch signal lines overlapping the boundary region can be disposed between two organic layers.

[0025] In an embodiment, the organic light emitting display device can further include a printed circuit board electrically connected to the touch sensing member pad and the display panel pad, wherein a portion of the organic light emitting display panel and the touch sensing member overlapping the boundary region can be bent.

[0026] In an embodiment of the inventive concept, an organic light emitting display module includes a base layer, a first functional layer, a plurality of transistors, a device layer, an encapsulation layer, a plurality of touch electrodes, a second functional layer, a first display panel pad, a first touch sensing member pad, a second display panel pad, a second touch sensing member pad, and a boundary layer.

[0027] In an embodiment, the base layer can include an active area, a pad area, and a boundary area between the active area and the pad area. The first functional layer can be disposed on the active area of the base layer and include an inorganic material. The plurality of transistors can be disposed on the first functional layer. The device layer can include an organic light emitting device configured to generate light by using an electrical signal provided from at least one of the plurality of transistors. The encapsulation layer can be disposed on the device layer and include an organic material and an inorganic material. The plurality of touch electrodes can be disposed on the encapsulation layer. The second functional layer can be disposed on the pad area of the base layer and include an inorganic material. The first display panel pad can be disposed on the second functional layer and electrically connected to at least one of the plurality of transistors. The first touch sensing member pad can be disposed adjacent to the first display panel pad on the second functional layer and insulated from the plurality of transistors. The second display panel pad can be disposed on the first display panel pad and electrically connected to the first display panel pad. The second touch sensing member pad can be disposed on the first touch sensing member pad and electrically connected to at least one of the plurality of touch electrodes. The boundary layer can be disposed on the boundary area of the base layer and include an organic material. The boundary layer does not include an inorganic layer disposed on the base layer. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0029] Figure 1A is a perspective view illustrating a first operation mode of a display device according to an embodiment of the inventive concept;

[0030] Figure 1B is a perspective view illustrating a second operation mode of a display device according to an embodiment of the inventive concept;

[0031] Figure 1C is a perspective view illustrating a third operation mode of a display device according to an embodiment of the inventive concept;

[0032] Figure 2A is a perspective view illustrating a first operation mode of a display device according to an embodiment of the inventive concept;

[0033] Figure 2B is a perspective view illustrating a second operation mode of a display device according to an embodiment of the inventive concept;

[0034] Figure 3 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0035] Figure 4is a cross-sectional view of a display module according to an embodiment of the inventive concept;

[0036] Figure 5 is a plan view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0037] Figure 6 is an equivalent circuit diagram of a pixel according to an embodiment of the inventive concept;

[0038] Figure 7 and Figure 8 is a partial cross-sectional view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0039] Figure 9 is a plan view of a touch sensing member according to an embodiment of the inventive concept;

[0040] Figure 10 is Figure 9 is an enlarged view of a portion AA of

[0041] Figure 11 is a cross-sectional view taken along line I-I' of Figure 10

[0042] is a cross-sectional view taken along line II-II' of Figure 12 Figure 5 and Figure 9 is a view of display panel pads and touch sensing member pads of

[0043] Figure 13A is a cross-sectional view taken along line III-III' of Figure 12

[0044] Figure 13B is a cross-sectional view taken along line IV-IV' of Figure 12

[0045] Figure 13C is a cross-sectional view taken along line II-II' of Figure 12

[0046] Figure 14A is a cross-sectional view taken along line III-III' of Figure 12

[0047] Figure 14B is a cross-sectional view taken along line IV-IV' of Figure 12

[0048] Figure 14C and Figure 14D is a cross-sectional view taken along line II-II' of Figure 12

[0049] Figure 15A is a cross-sectional view taken along line III-III' of Figure 12 ​​​​​​​is a sectional view taken along the line II-II' of

[0050] Figure 15B is a sectional view taken along the line III-III' of Figure 12

[0051] Figure 15C is a sectional view taken along the line IV-IV' of Figure 12

[0052] Figure 16A is a sectional view taken along the line II-II' of Figure 12

[0053] Figure 16B is a sectional view taken along the line III-III' of Figure 12

[0054] Figure 16C is a sectional view taken along the line IV-IV' of Figure 12

[0055] Figure 17A is a sectional view taken along the line II-II' of Figure 12

[0056] Figure 17B is a sectional view taken along the line III-III' of Figure 12

[0057] Figure 17C and Figure 17D is a sectional view taken along the line IV-IV' of Figure 12

[0058] Figure 18A is a sectional view taken along the line II-II' of Figure 12

[0059] Figure 18B is a sectional view taken along the line III-III' of Figure 12

[0060] Figure 18C is a sectional view taken along the line IV-IV' of Figure 12

[0061] Figure 19A is a sectional view taken along the line II-II' of Figure 12

[0062] Figure 19B is a sectional view taken along the line III-III' of Figure 12

[0063] Figure 19C is a sectional view taken along the line IV-IV' of Figure 12 ​​​​​​​​​​​​​a sectional view taken along line IV-IV' of FIG. 4;

[0064] Figure 20A a sectional view taken along line II-II' of FIG. 2; Figure 12

[0065] Figure 20B a sectional view taken along line III-III' of FIG. 3; Figure 12

[0066] Figure 20C a sectional view taken along line IV-IV' of FIG. 4; Figure 12

[0067] Figure 21A a sectional view taken along line II-II' of FIG. 2; Figure 12

[0068] Figure 21B a sectional view taken along line III-III' of FIG. 3; Figure 12

[0069] Figure 21C a sectional view taken along line IV-IV' of FIG. 4; Figure 12

[0070] Figure 22 and Figure 23 are plan views of a display module and a printed circuit board according to embodiments of the inventive concept; and

[0071] Figure 24 are views showing a curved shape of a display module according to embodiments of the inventive concept. DETAILED DESCRIPTION

[0072] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings. In this specification, it will also be understood that when a component (or area, layer, part) is referred to as being "on" another component, it can be directly on the other component or an intervening third component can also be present. It will be further understood that groups of components or repeated component

[0073] Like reference numerals refer to like elements throughout. Also, in the drawings, the thickness, ratio, and size of components can be exaggerated for the sake of clarity. The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0074] ​​​​​​It will be understood that, although the terms such as "first" and "second" are used herein to describe various elements, the elements should not be limited by these terms. The terms are used only to distinguish a component from other components with a relative concept. For example, an element referred to as a first element in one embodiment can be referred to as a second element in another embodiment without departing from the scope of the appended claims. The singular form of a term can include the plural form unless indicated to the contrary.

[0075] In addition, to explain the relational association of components shown in the drawings, "below," "under," "above," "on," and the like are used. The terms can be relative concepts and described based on the directions expressed in the drawings.

[0076] The meaning of "include" or "comprise" indicates a property, a fixed number, a step, an operation, an element, a component, or a combination thereof, but does not exclude other properties, fixed numbers, steps, operations, elements, components, or combinations thereof.

[0077] Figure 1A is a perspective view showing a first operation mode of a display device DD according to an embodiment of the inventive concept. Figure 1B is a perspective view showing a second operation mode of the display device DD according to the embodiment of the inventive concept. Figure 1C is a perspective view showing a third operation mode of the display device DD according to the embodiment of the inventive concept.

[0078] As Figure 1A As shown in FIG. 1A, in the first operation mode, a display surface IS on which an image IM is displayed is parallel to a surface defined by a first direction axis DR1 and a second direction axis DR2. A normal direction of the display surface IS, that is, a thickness direction of the display device DD is indicated as a third direction axis DR3. A front surface (or a top surface) and a rear surface (or a bottom surface) of each member are distinguished by the third direction axis DR3. However, the directions as indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 can be relative concepts, and thus, can become different directions. Hereinafter, the first direction to the third direction can be the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and can be represented by the same reference numerals, respectively. Although a flexible display device is shown in the current embodiment, embodiments of the inventive concept are not limited thereto. The display device DD according to the current embodiment can be a rigid display device.

[0079] Figures 1A to 1C A foldable display device is shown as an example of the flexible display device DD. Figure 2A and Figure 2BA foldable display apparatus is shown as an example of the flexible display apparatus DD. Alternatively, the display apparatus DD can be a rollable flexible display apparatus, but is not particularly limited. The flexible display apparatus DD according to embodiments of the inventive concept can be used for large electronic apparatuses such as televisions and monitors, and medium and small electronic apparatuses such as mobile phones, desktop PCs, navigation units for vehicles, game consoles, and smart watches.

[0080] As shown in Figure 1A , the display surface IS of the flexible display apparatus DD can include a plurality of areas. The flexible display apparatus DD includes a display area DD-DA on which an image IM is displayed, and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA can be an area on which no image is displayed. Figure 1A A vase is shown as an example of the image IM. For example, the display area DD-DA can have a rectangular shape. The non-display area DD-NDA can surround the display area DD-DA. However, embodiments of the inventive concept are not limited thereto. For example, the shapes of the display area DD-DA and the non-display area DD-NDA can be designed relatively.

[0081] The flexible display apparatus DD can include a housing HS. The housing HS can be provided outside the flexible display apparatus DD to accommodate internal components. Hereinafter, for convenience of description, the housing HS can be shown or described separately or not.

[0082] As shown in Figures 1A to 1C , the display apparatus DD can include a plurality of areas defined according to a form of operation. The display apparatus DD can include a bending area BA bent with respect to a bending axis BX, a first non-bending area NBA1 not bent, and a second non-bending area NBA2 not bent. As shown in Figure 1B , the display apparatus DD can be bent inwardly to make the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. As shown in Figure 1C , the display apparatus DD can be bent outwardly to make the display surface IS exposed to the outside.

[0083] In embodiments of the inventive concept, the display apparatus DD can include a plurality of bending areas BA. In addition, the bending areas BA can be formed to correspond to an operation of a user for manipulating the display apparatus DD. For example, unlike Figure 1B and Figure 1C , the bending areas BA can be formed to be parallel to the first direction axis DR1 or formed in a diagonal direction. The bending areas BA can have a variable surface area determined according to a radius of curvature thereof. In embodiments of the inventive concept, the display apparatus DD can have a shape repeating only the operation modes of Figure 1A and Figure 1B .

[0084] Figure 2A is a perspective view showing a first operation mode of a display device according to an embodiment of the inventive concept. Figure 2B is a perspective view showing a second operation mode of a display device according to an embodiment of the inventive concept. Figure 2A and Figure 2B shows the display device folding the non-display area DD-NDA as an example of a foldable display device DD. As described above, the display device DD according to an embodiment of the inventive concept does not limit the number of bending areas BA and non-bending areas NBA and the position of the bending areas.

[0085] Figure 3 is a cross-sectional view of the display device DD according to an embodiment of the inventive concept. Figure 4 is a cross-sectional view of the display module DM according to an embodiment of the inventive concept. Figure 3 shows a cross-sectional view defined by the second direction axis DR2 and the third direction axis DR3, Figure 4 shows a cross-sectional view defined by the first direction axis DR1 and the third direction axis DR3.

[0086] As Figure 3 shown in FIG. 1A, the display device DD includes a protective film PM, a window WM, a display module DM, a first adhesive member AM1, and a second adhesive member AM2. The display module DM is disposed between the protective film PM and the window WM. The first adhesive member AM1 is bonded to the display module DM and the protective film PM, and the second adhesive member AM2 is bonded to the display module DM and the window WM. In an embodiment of the inventive concept, the first adhesive member AM1 and the second adhesive member AM2 can be omitted. The protective film PM and the window WM can be continuously manufactured by a coating process.

[0087] The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside and an adhesive surface AS1 bonded to the first adhesive member AM1. The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external impact.

[0088] The protective film PM can include a plastic film. The protective film PM can include one selected from the group consisting of polyether sulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and combinations thereof.

[0089] The material for forming the protective film PM is not limited to a plastic resin. For example, the protective film PM can include an organic / inorganic composite material. The protective film PM can include a porous organic layer and an inorganic material filled into the pores of the porous organic layer. The protective film PM can further include a functional layer disposed on a plastic film. The functional layer can include a resin layer. The functional layer can be formed by a coating process.

[0090] The window WM protects the display module DM from external impact and provides an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface AS2 bonded to the second adhesive member AM2. Figures 1A to 1C The display surface IS of the display device DD can be the second outer surface OS-U.

[0091] In the display device DD of the present embodiment, Figure 2A and Figure 2B In the display device DD of the present embodiment, the window WM can not be disposed on the bending area BA. However, embodiments of the present inventive concept are not limited thereto. For example, in another embodiment of the present inventive concept, the window WM can also be disposed on the bending area BA.

[0092] The display module DM includes an organic light emitting display panel DP and a touch sensing unit TS integrally formed through a continuous process. The organic light emitting display panel DP generates an image (see reference numeral IM) corresponding to input image data. The organic light emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing each other in a thickness direction DR3. Figure 1A

[0093] The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS can be directly disposed on the second display panel surface BS1-U. In the present embodiment, the touch sensing unit TS can be manufactured together with the organic light emitting display panel DP through a continuous process.

[0094] Although not shown separately, the display module DM according to embodiments of the present inventive concept can further include an anti-reflection layer. The anti-reflection layer can include a color filter, a layer stack of a conductive layer / dielectric layer / conductive layer, or an optical member. The anti-reflection layer can absorb, destructively interfere, or polarize light incident from the outside to reduce the reflectance of external light.

[0095] Each of the first adhesive member AM1 and the second adhesive member AM2 can be an optically clear adhesive film (OCA), an optically clear resin (OCR), or a pressure sensitive adhesive film (PSA). Each of the first adhesive member AM1 and the second adhesive member AM2 can include a photocurable adhesive material or a heat-curable adhesive material. However, embodiments of the present inventive concept are not specifically limited thereto.

[0096] ​Although not specifically shown, the display device DD may also include a frame structure supporting the functional layers to maintain... Figures 1A to 2B The state is shown in the diagram. The frame structure may include a hinged structure or a hinged chain structure.

[0097] like Figure 4 As shown, the organic light-emitting display panel DP includes a substrate layer SUB, a first circuit layer CL1 disposed on the substrate layer SUB, a light-emitting device layer ELL, and a thin film encapsulation layer TFE. The substrate layer SUB may include at least one plastic film. The substrate layer SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate as a flexible substrate.

[0098] The first circuit layer CL1 may include multiple insulating layers, multiple conductive layers, and a semiconductor layer. The multiple conductive layers of the first circuit layer CL1 may constitute signal lines or circuit portions of a pixel. The light-emitting device layer ELL may include an organic light-emitting diode (OLED). A thin-film encapsulation layer TFE seals the light-emitting device layer ELL. The thin-film encapsulation layer TFE may include at least two inorganic thin films and an organic thin film disposed between the at least two inorganic thin films. The thin-film encapsulation layer TFE can protect the light-emitting device layer ELL from external substances such as moisture and dust particles.

[0099] In the current embodiment of the inventive concept, the touch sensing unit TS can be a single-layer type. That is, the touch sensing unit TS can include a single conductive layer. Here, a single conductive layer means that "the conductive layer is not divided by an insulating layer". The stacked structure of the first metal layer / second metal layer / metal oxide layer can correspond to a single conductive layer because the first metal layer and the second metal layer are not insulated by the metal oxide layer, while the stacked structure of the first metal layer / insulating layer / metal oxide layer can correspond to a double conductive layer.

[0100] A single conductive layer can be patterned to form multiple touch electrodes and multiple touch signal lines. That is, the sensor of the touch sensing unit TS can be disposed on the same layer. The sensor can be directly disposed on the thin-film encapsulation layer TFE. Additionally, a portion of each touch signal line can be disposed on the same layer as the sensor. A portion of each touch signal line can be disposed on the first circuit layer CL1. The structure of the touch sensing unit TS will be described in detail later.

[0101] Each of the touch signal lines and sensors may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. Each of the touch signal lines and sensors may include a metal layer such as molybdenum, silver, titanium, copper, aluminum, and alloys thereof. The touch signal lines and sensors may be made of the same material or different materials from each other.

[0102] When compared with the structure of the display module DM including the multi-layer type touch sensing member, the display module DM according to the embodiment of the inventive concept can include a single-layer type touch sensing member to simplify the structure thereof. Although the display module DM is bent as shown in FIGS. 1A and 1B, the display module DM according to the embodiment of the inventive concept can be bent as shown in FIGS. 2A and 2B. Figure 1B and Figure 1C As shown in FIGS. 1A and 1B, the display module DM according to the embodiment of the inventive concept can include a single-layer type touch sensing member. As shown in FIGS. 2A and 2B, the display module DM according to the embodiment of the inventive concept can include a single-layer type touch sensing member. However, the display module DM according to the embodiment of the inventive concept is not limited thereto. For example, the display module DM according to the embodiment of the inventive concept can include a multi-layer type touch sensing member.

[0103] Figure 5 is a plan view of an organic light emitting display panel DP according to an embodiment of the inventive concept. Figure 6 is an equivalent circuit diagram of a pixel PX according to an embodiment of the inventive concept. Figure 7 and Figure 8 are partial cross-sectional views of an organic light emitting display panel DP according to an embodiment of the inventive concept.

[0104] As shown in Figure 5 , the organic light emitting display panel DP includes a display area DA and a non-display area NDA. The display area DA and the non-display area NDA of the organic light emitting display panel DP can correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP are not necessarily required to correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. For example, the display area DA and the non-display area NDA of the organic light emitting display panel DP can vary according to the structure / design of the organic light emitting display panel DP.

[0105] The organic light emitting display panel DP can include a plurality of signal lines SGL and a plurality of pixels PX. An area on which the plurality of pixels PX are disposed can be defined as the display area DA. In the present embodiment, the non-display area NDA can be defined as along the edges of the display area DA and surrounding the display area DA.

[0106] The plurality of signal lines SGL include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. The gate lines GL are connected to corresponding pixels among the plurality of pixels PX, and the data lines DL are connected to corresponding pixels PX among the plurality of pixels PX, respectively. The power lines PL are connected to the plurality of pixels PX. A gate driving circuit DCV to which the gate lines GL are connected can be disposed on one side of the non-display area NDA. The control signal lines CSL can provide a control signal to the gate driving circuit DCV.

[0107] A part of the gate lines GL, the data lines DL, the power lines PL, and the control signal lines CSL can be disposed on the same layer, and the other parts can be disposed on different layers from each other. When the signal lines disposed on one layer among the gate lines GL, the data lines DL, the power lines PL, and the control signal lines CSL are defined as first signal lines, the signal lines disposed on a different layer can be defined as second signal lines. The signal lines disposed on a further layer can be defined as third signal lines.

[0108] Each of the gate lines GL, the data lines DL, the power lines PL, and the control signal lines CSL can include a signal line unit and a lower pad PD-D connected to an end of the signal line unit. The signal line unit can be defined as a part other than the lower pad PD-D of each of the gate lines GL, the data lines DL, the power lines PL, and the control signal lines CSL.

[0109] In an embodiment of the inventive concept, the lower pad PD-D can include a lower display panel pad PD-DPD and a lower touch sensing member pad PD-TSD. The lower pad PD-D can be formed by the same process as a process for driving a transistor of the pixel PX. For example, the transistor for driving the pixel PX and the lower pad PD-D can be formed by the same low temperature poly-silicon (LTPS) process or low temperature poly-oxide (LTPO) process.

[0110] In an embodiment of the inventive concept, the lower display panel pad PD-DPD can include a control pad CSL-P, a data pad DL-P, and a power pad PL-P. Although a gate pad unit is not shown, the gate pad unit can be overlapped with the gate driving circuit DCV and connected to the gate driving circuit DCV. Although not specifically shown, a part of the non-display area NDA on which the control pad CSL-P, the data pad DL-P, and the power pad PL-P are aligned is defined as a pad area. As described below, pads of the touch sensing unit TS can be disposed adjacent to the pads of the organic light emitting display panel DP described above.

[0111] Figure 6 An example of the pixel PX connected to one gate line GL, one data line DL, and a power line PL is shown. However, embodiments of the inventive concept are not limited to the configuration of the pixel PX. For example, the pixel PX can have various configurations.

[0112] The pixel PX includes an organic light emitting diode OLED as a display device. The organic light emitting diode OLED can be a top emission type diode or a bottom emission type diode. The pixel PX includes a first transistor TFT1 (or a switching transistor), a second transistor TFT2 (or a driving transistor), and a capacitor CP as circuit units for driving the organic light emitting diode OLED. The organic light emitting diode OLED generates light in response to an electric signal provided from the transistors TFT1 and TFT2. The cathode of the organic light emitting diode OLED is connected to a second power supply voltage (ELVSS).

[0113] The gate line GL can be used to receive a first power supply voltage (ELVDD). The first transistor TFT1 outputs a data signal applied to the data line DL in response to a scan signal applied to the gate line GL. The capacitor CP charges a voltage corresponding to the data signal received from the first transistor TFT1.

[0114] The second transistor TFT2 is connected to the organic light emitting diode OLED. The second transistor TFT2 controls a driving current flowing through the organic light emitting diode OLED to correspond to an amount of charge stored in the capacitor CP. The organic light emitting diode OLED emits light during the conduction of the second transistor TFT2.

[0115] Figure 7 is a cross-sectional view of a portion corresponding to the first transistor TFT1 and the capacitor CP of the equivalent circuit of Figure 6 Figure 8 is a cross-sectional view of a portion corresponding to the second transistor TFT2 and the organic light emitting diode OLED of the equivalent circuit of Figure 6 As shown in

[0116] Figure 7 and Figure 8 , the first circuit layer CL1 is disposed on the substrate layer SUB. A semiconductor pattern AL1 (hereinafter, referred to as a first semiconductor pattern) of the first transistor TFT1 and a semiconductor pattern AL2 (hereinafter, referred to as a second semiconductor pattern) of the second transistor TFT2 are disposed on the substrate layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be selected from amorphous silicon, polysilicon, and metal oxide semiconductor. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be formed of the same material. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be formed of different materials.

[0117] The first circuit layer CL1 includes a first conductive pattern (see reference numeral CDP1 of Figure 12 and the organic / inorganic layers BR, BF, 12, 14, and 16. The first conductive pattern (see reference numeral CDP1 of Figure 12 ​​The capacitor CP (hereinafter, referred to as a first capacitor) can include a first transistor TFT1, a second transistor TFT2, and electrodes E1 and E2. The organic / inorganic layers BR, BF, 12, 14, and 16 can include first functional layers BR and BF, a first insulating layer 12, a second insulating layer 14, and a third insulating layer 16.

[0118] The first functional layers BR and BF can be disposed on one surface of the base layer SUB. The first functional layers BR and BF can include at least one of a barrier layer BR and a buffer layer BF. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be disposed on the barrier layer BR or the buffer layer BF.

[0119] The first insulating layer 12 covering the first semiconductor pattern AL1 and the second semiconductor pattern AL2 is disposed on the base layer SUB. The first insulating layer 12 includes an organic layer and / or an inorganic layer. Specifically, the first insulating layer 12 can include a plurality of inorganic thin films. The plurality of inorganic thin films can include a silicon nitride layer and a silicon oxide layer.

[0120] A control electrode GE1 of the first transistor TFT1 (hereinafter, referred to as a first control electrode) and a control electrode GE2 of the second transistor TFT2 (hereinafter, referred to as a second control electrode) are disposed on the first insulating layer 12. A first electrode E1 of the capacitor CP is disposed on the first insulating layer 12. The first control electrode GE1, the second control electrode GE2, and the first electrode E1 can be manufactured by the same photolithography process as that of the gate line GL (see Figure 5 ). That is, the first control electrode GE1, the second control electrode GE2, and the first electrode E1 can be formed of the same material as that of the gate line GL, have the same layer structure as that of the gate line GL, and are disposed on the same layer as the gate line GL.

[0121] The second insulating layer 14 covering the first control electrode GE1 and the second control electrode GE2 and the first electrode E1 is disposed on the first insulating layer 12. The second insulating layer 14 includes an organic layer and / or an inorganic layer. Specifically, the second insulating layer 14 can include a plurality of inorganic thin films. The plurality of inorganic thin films can include a silicon nitride layer and a silicon oxide layer.

[0122] The data line DL (see Figure 5) can be provided on the second insulating layer 14. An input electrode SE1 (hereinafter, referred to as a first input electrode) and an output electrode DE1 (hereinafter, referred to as a first output electrode) of the first transistor TFT1 are provided on the second insulating layer 14. An input electrode SE2 (hereinafter, referred to as a second input electrode) and an output electrode DE2 (hereinafter, referred to as a second output electrode) of the second transistor TFT2 are provided on the second insulating layer 14. The first input electrode SE1 is branched from a corresponding data line of the data lines DL. A power supply line PL (see Figure 5 ) can be provided on the same layer as the data lines DL. The second input electrode SE2 can be branched from the power supply line PL.

[0123] The second electrode E2 of the capacitor CP is provided on the second insulating layer 14. The second electrode E2 can be manufactured by the same photolithography process as each of the data lines DL and the power supply line PL. In addition, the second electrode E2 can be formed of the same material as each of the data lines DL and the power supply line PL, have the same structure as each of the data lines DL and the power supply line PL, and be provided on the same layer as each of the data lines DL and the power supply line PL.

[0124] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern AL1 through first and second vias CH1 and CH2 that pass through the first and second insulating layers 12 and 14, respectively. The first output electrode DE1 can be electrically connected to the first electrode E1. For example, the first output electrode DE1 can be connected to the first electrode E1 through a via (not shown) that passes through the second insulating layer 14. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern AL2 through third and fourth vias CH3 and CH4 that pass through the first and second insulating layers 12 and 14, respectively. According to another embodiment of the inventive concept, each of the first and second transistors TFT1 and TFT2 can have a bottom gate structure.

[0125] A third insulating layer 16 that covers the first input electrode SE1, the first output electrode DE1, the second input electrode SE2, and the second output electrode DE2 is provided on the second insulating layer 14. The third insulating layer 16 includes an organic layer and / or an inorganic layer. In particular, the third insulating layer 16 can include an organic material to provide a planar surface.

[0126] One of the first, second, and third insulating layers 12, 14, and 16 can be omitted depending on the circuit structure of the pixel. Each of the second and third insulating layers 14 and 16 can be defined as an interlayer dielectric layer. The interlayer dielectric layer can be provided between a lower conductive pattern and an upper conductive pattern, the lower conductive pattern being provided below the interlayer dielectric layer, and the upper conductive pattern being provided above the interlayer dielectric layer, to insulate the conductive patterns from each other.

[0127] The first circuit layer CL1 includes a dummy conductive pattern. The dummy conductive pattern is disposed on the same layer as the semiconductor patterns AL1 and AL2, the control electrodes GE1 and GE2, or the output electrodes DE1 and DE2. The dummy conductive pattern can be disposed on the non-display area NDA (see FIG. 1). The dummy conductive pattern will be described in detail later. Figure 5 ) on the non-display area NDA (see FIG. 1). The dummy conductive pattern will be described in detail later.

[0128] The light emitting device layer ELL is disposed on the third insulating layer 16. The pixel definition layer PXL and the organic light emitting diode OLED are disposed on the third insulating layer 16. The anode AE is disposed on the third insulating layer 16. The anode AE is connected to the second output electrode DE2 through the fifth through-hole CH5 passing through the third insulating layer 16. The opening OP is defined in the pixel definition layer PXL. The opening OP of the pixel definition layer PXL exposes at least a portion of the anode AE.

[0129] The light emitting device layer ELL can include an emission area PXA and a non-emission area NPXA adjacent to the emission area PXA. The non-emission area NPXA can surround the emission area PXA. In the current embodiment, the emission area PXA is defined to correspond to the anode AE. However, embodiments of the inventive concept are not limited to the emission area PXA described above. That is, if a region emits light, the region can be defined as the emission area PXA. The emission area PXA can be defined to correspond to a portion of the anode AE exposed through the opening OP.

[0130] The hole control layer HCL can be commonly disposed on the emission area PXA and the non-emission area NPXA. Although not specifically shown, a common layer such as the hole control layer HCL can be commonly disposed on a plurality of pixels PX (see FIG. 1). Figure 5 ) on the non-display area NDA (see FIG. 1). The dummy conductive pattern will be described in detail later.

[0131] The organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML can be disposed to cover the opening OP. The organic light emitting layers EML adjacent to each other are electrically separated from each other.

[0132] The electron control layer ECL is disposed on the organic light emitting layer EML. The cathode CE is disposed on the electron control layer ECL. The cathode CE is commonly disposed on a plurality of pixels PX.

[0133] Although the patterned organic light emitting layer EML is shown as an example in the current embodiment, the organic light emitting layer EML can be commonly disposed on a plurality of pixels PX. Here, the organic light emitting layer EML can emit white light. In addition, the organic light emitting layer EML can have a multi-layer structure.

[0134] In the present embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In the present embodiment, a cover layer covering the cathode CE can also be provided. Here, the thin film encapsulation layer TFE directly covers the cover layer. The thin film encapsulation layer TFE can include an organic layer including an organic material and an inorganic layer including an inorganic material.

[0135] Figure 9 is a plan view of the touch sensing unit TS according to an embodiment of the inventive concept.

[0136] In the present embodiment, a 1-layer capacitive touch sensing member TS is shown as an example. The 1-layer capacitive touch sensing member TS can be driven in a self-capacitance manner or in a mutual capacitance manner. However, embodiments of the inventive concept are not limited to the driving manner for acquiring coordinate information. In addition, the touch sensing member TS can not be limited to a 1-layer structure. For example, the touch sensing member TS can have a 2-layer structure.

[0137] The touch sensing member TS can include first touch patterns TE1-1 to TE-3, first touch signal lines SL1, second touch patterns TE2-1 to TE2-3, second touch signal lines SL2, and a touch sensing member upper pad PD-U.

[0138] The first touch patterns TE1-1 to TE1-3 extend in a first direction DR1 and are arranged in a second direction DR2. Each of the first touch patterns TE1-1 to TE1-3 can have a mesh shape defining a plurality of touch openings OP-TC.

[0139] Each of the first touch patterns TE1-1 to TE1-3 includes a plurality of first sensing patterns SP1 and a plurality of first connection patterns CP1. The first sensing patterns SP1 are arranged in the first direction DR1. Each of the first connection patterns CP1 connects two adjacent first sensing patterns SP1 arranged along the first direction DR1.

[0140] Each of the first touch signal lines SL1 can be connected to one end of the first touch patterns TE1-1 to TE1-3 and to a pad in the pad area. The first touch signal lines SL1 can have the same layer structure as the layer structure of the first touch patterns TE1-1 to TE1-3.

[0141] The second touch patterns TE2-1 to TE2-3 are insulated from and cross the first touch patterns TE1-1 to TE1-3. The second touch patterns TE2-1 to TE2-3 are insulated from the first touch patterns TE1-1 to TE1-3 by an insulation pattern IL-P. The insulation pattern IL-P can include an inorganic material or an organic material. The inorganic material can include silicon oxide or silicon nitride. The organic material can include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl-based resin, an epoxy-based resin, a polyurethane-based resin, a cellulose-based resin, and a perylene-based resin.

[0142] Each of the second touch patterns TE2-1 to TE2-3 can have a mesh shape defining a plurality of touch openings OP-TC.

[0143] Each of the second touch patterns TE2-1 to TE2-3 includes a plurality of second sensing patterns SP2 and a plurality of second connection patterns CP2. The second sensing patterns SP2 are arranged in a second direction DR2. Each of the second connection patterns CP2 connects two adjacent second sensing patterns SP2 arranged along the second direction DR2.

[0144] Each of the second connection patterns CP2 can have a bridging function. The insulation pattern IL-P is disposed on the first connection patterns CP1, and the second connection patterns CP2 are disposed on the insulation pattern IL-P.

[0145] Each of the second touch signal lines SL2 can also be connected to one end of the second touch patterns TE2-1 to TE2-3 and to a pad in the pad area. The second touch signal lines SL2 can have the same layer structure as the layer structure of the second touch patterns TE2-1 to TE2-3.

[0146] The first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are capacitively coupled to each other. Since a touch sensing signal is applied to the first touch patterns TE1-1 to TE1-3, a capacitor is disposed between the first sensing patterns SP1 and the second sensing patterns SP2.

[0147] The shapes of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are merely examples, and therefore, embodiments of the inventive concept are not limited thereto. For example, connecting patterns CP1 and CP2 may be defined as the portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 intersect each other, and sensing patterns SP1 and SP2 may be defined as the portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 do not overlap each other. For example, each of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may have a strip shape with a predetermined width.

[0148] The touch sensor component pad PD-U can be disposed at the ends of the first touch signal line SL1 and the second touch signal line SL2. The touch sensor component pad PD-U can include the upper display panel pad PD-PDU and the upper touch sensor component pad PD-TSU. The touch sensor component pad PD-U can be formed using the same process as the first touch patterns TE1-1 to TE-3, the first touch signal line SL1, the second touch patterns TE2-1 to TE2-3, and the second touch signal line SL2.

[0149] Figure 10 yes Figure 9 A magnified view of part AA. Figure 11 It is along Figure 10 A sectional view taken from line I-I'.

[0150] The display area DA includes multiple emitting areas PXA and non-emitting areas NPXA surrounding the multiple emitting areas PXA. The first sensing pattern SP1 may have a grid shape superimposed on the non-emitting areas NPXA. Although not specifically shown, the second sensing pattern SP2 and the touch signal lines SL1 and SL2 may also have a grid shape superimposed on the non-emitting areas NPXA.

[0151] The first sensing pattern SP1 includes a plurality of vertical portions SP1-C extending in a first direction DR1 and a plurality of horizontal portions SP1-L extending in a second direction DR2. The plurality of vertical portions SP1-C and the plurality of horizontal portions SP1-L can be defined as grid lines. The grid lines can have a linewidth of a few micrometers.

[0152] Multiple vertical portions SP1-C and multiple horizontal portions SP1-L can be connected to each other to define multiple touch openings TS-OP. Although a structure is shown where a touch opening TS-OP corresponds one-to-one with an emission area PXA, embodiments of the inventive concept are not limited thereto. One touch opening TS-OP may correspond to two or more emission areas PXA. Although Figure 10 and Figure 11 The image shows the exposed grid lines, but the display module DM (see...) Figure 4 It may also include an insulating layer disposed on the thin film encapsulation layer TFE to cover the grid lines.

[0153] Figure 12 yes Figure 5 and Figure 9 The image shows a view of the display panel pad PD-DP and the touch sensing component pad PD-TS. The display module DM may include an active region AR-ACV, a pad region AR-PD, and a boundary region AR-BD disposed between the active region AR-ACV and the pad region AR-PD.

[0154] In the active region AR-ACV, the display module DM includes a first conductive pattern CDP1. In the pad region AR-PD, the display module DM includes a second conductive pattern CDP2. In the boundary region AR-BD, the display module DM includes a third conductive pattern CDP3. Each of the first conductive patterns CDP1 to the third conductive patterns CDP3 may include metal as a pattern for conducting electrical signals used to drive the display panel DP or the touch sensing component TS.

[0155] The display panel pads PD-DP and touch sensing component pads PD-TS can be arranged adjacent to each other. Alternatively, the display panel pads PD-DP and touch sensing component pads PD-TS can be arranged parallel to each other. However, embodiments of the inventive concept are not limited to this. For example, if necessary, the display panel pads PD-DP and touch sensing component pads PD-TS can be separated from each other, but not arranged parallel to each other.

[0156] Figure 13A It is along Figure 12 The sectional view taken from line II-II'. Figure 13B It is along Figure 12 The sectional view taken from line III-III'. Figure 13C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 13A to 13C An embodiment of the inventive concept is shown.

[0157] The reference shows the touch sensing component pads. Figure 13A The substrate layer SUB includes an active region AR-ACV, a pad region AR-PD, and a boundary region AR-BD located between the active region AR-ACV and the pad region AR-PD.

[0158] In the active area AR-ACV, the pad area AR-PD, and the boundary area AR-BD according to embodiments of the inventive concept, the active area AR-ACV can be an area including the light emitting device layer ELL, the pad area AR-PD can be an area including the display panel pad PD-DP and the touch sensing member pad PD-TS to which a signal is applied from a printed circuit board, and the boundary area AR-BD can be an area between the active area AR-ACV and the pad area AR-PD.

[0159] The circuit layers CL1 and CL2 are disposed on the substrate layer SUB. The circuit layers CL1 and CL2 include a first circuit layer CL1 and a second circuit layer CL2. The first circuit layer CL1 is disposed on the active area AR-ACV of the substrate layer SUB. The second circuit layer CL2 is disposed on the pad area AR-PD of the substrate layer SUB.

[0160] The light emitting device layer ELL and the thin film encapsulation layer TFE are disposed on the first circuit layer CL1. The first circuit layer CL1 and the second circuit layer CL2 can include a functional layer BR and BF, respectively. For convenience, in the functional layers BR and BF, the functional layer of the first circuit layer CL1 can be referred to as a first functional layer, and the functional layer of the second circuit layer CL2 can be referred to as a second functional layer.

[0161] Because Figure 7 and Figure 8 The first circuit layer CL1, the light emitting device layer ELL, and the thin film encapsulation layer TFE are illustrated in FIGS. 1A and 1B, and thus a detailed description thereof will be omitted.

[0162] The touch sensing member TS can be disposed on the thin film encapsulation layer TFE. The touch sensing member TS includes, in a cross-section, a touch inorganic layer IL-T, an insulating pattern IL-P, a plurality of touch electrodes, and a touch protection layer PVX. Each of the touch inorganic layer IL-T and the insulating pattern IL-P can include an inorganic material. The touch protection layer PVX can include an organic material.

[0163] Referring to Figure 9 , the plurality of touch electrodes can form first touch patterns TE1-1 to TE1-3, a first touch signal line SL1, second touch patterns TE2-1 to TE2-3, and a second touch signal line SL2.

[0164] The second circuit layer CL2 can include a second conductive pattern CDP2 (see Figure 12 ) and organic / inorganic layers BR, BF, 12, 14, and 16. The second conductive pattern CDP2 can include the display panel pad PD-DP and the touch sensing member pad PD-TS. The organic / inorganic layers BR, BF, 12, 14, and 16 can include second functional layers BR and BF, a first insulating layer 12, a second insulating layer 14, and a third insulating layer 16.

[0165] The display panel pad PD-DP can be disposed on the second functional layer and electrically connected to the first circuit layer CL1. At least one of the first insulating layer 12 and the second insulating layer 14 can be disposed between the display panel pad PD-DP and the second functional layer.

[0166] The display panel pad PD-DP can include a lower display panel pad PD-DPD and an upper display panel pad PD-DPU. The lower display panel pad PD-DPD is electrically connected to the first conductive pattern CDP1 through the third conductive pattern CDP3. The upper display panel pad PD-DPU is disposed on the lower display panel pad PD-DPD and electrically connected to the lower display panel pad PD-DPD. Accordingly, an electrical signal applied to the upper display panel pad PD-DPU is applied to the first conductive pattern CDP1 of the first circuit layer CL1 via the lower display panel pad PD-DPD.

[0167] The boundary layer BDL is disposed on the boundary area AR-BD of the substrate layer SUB. The boundary layer BDL can include an organic layer OG and a third conductive pattern CDP3. The organic layer OG can contact a top surface of the substrate layer SUB and be disposed between the first circuit layer CL1 and the second circuit layer CL2. More specifically, the organic layer OG can be disposed between the first functional layer and the second functional layer.

[0168] Unlike the first circuit layer CL1 and the second circuit layer CL2, the boundary layer BDL can not include an inorganic layer including an inorganic material. Accordingly, flexibility of the boundary layer BDL can be improved, and a portion of the display panel DP overlapping the boundary area AR-BD can be easily bent.

[0169] The organic layer OG can also be disposed on the third conductive pattern CDP3. The organic layer disposed on the third conductive pattern CDP3 can be formed by the same process as that of the third insulating layer 16 or the pixel definition layer PXL.

[0170] The third conductive pattern CDP3 can be formed by the same process as that of the lower display panel pad PD-DPD. However, embodiments of the inventive concept are not limited thereto. For example, the third conductive pattern CDP3 can be formed by a separate process to contact the lower display panel pad PD-DPD and then be electrically connected to the lower display panel pad PD-DPD.

[0171] Referring to Figure 13BThe touch signal line SL2 of the touch sensing member TS is electrically connected to the third conductive pattern CDP3 on the active area AR-ACV. The third conductive pattern CDP3 is electrically connected to the upper touch sensing member pad PD-TSU on the pad area AR-PD. Here, the third conductive pattern CDP3 can be electrically insulated from the lower touch sensing member pad PD-TSD.

[0172] Referring to Figure 9 and Figure 13B , the touch sensing member TS includes the first and second touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 disposed on the active area AR-ACV, the touch sensing member pad PD-TS disposed on the pad area AR-PD, and the touch signal lines SL1 and SL2 electrically connecting the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 to the touch sensing member pad PD-TS.

[0173] The touch sensing member pad PD-TS can include a lower touch sensing member pad PD-TSD and an upper touch sensing member pad PD-TSU. The upper touch sensing member pad PD-TSU is electrically connected to the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 through the touch signal lines SL1 and SL2 and the third conductive pattern CDP3. That is, the upper touch sensing member pad PD-TSU is electrically connected to the sensing patterns SP1 and SP2 through the touch signal lines SL1 and SL2 and the third conductive pattern CDP3.

[0174] The lower touch sensing member pad PD-TSD can be electrically insulated from the upper touch sensing member pad PD-TSU. However, embodiments of the inventive concept are not limited thereto. According to another embodiment of the inventive concept, the lower touch sensing member pad PD-TSD can be electrically connected to the upper touch sensing member pad PD-TSU.

[0175] The upper touch sensing member pad PD-TSU is disposed on the lower touch sensing member pad PD-TSD. The upper touch sensing member pad PD-TSU can be disposed at a height increased by the thickness of the lower touch sensing member pad PD-TSD.

[0176] In Figure 13B , unlike the third conductive pattern CDP3 of Figure 13A , the third conductive pattern CDP3 is not electrically connected to the first conductive pattern CDP1. However, embodiments of the inventive concept are not limited thereto. For example, if necessary, Figure 13B , the third conductive pattern CDP3 and the first conductive pattern CDP1 of

[0177] In Figure 13B , because other components are electrically connected to Figure 13AThe components are basically the same, so descriptions of the other components will be omitted.

[0178] The measured length HH1 from the substrate layer SUB to the upper display panel pad PD-DPU is essentially the same as the measured length HH2 from the substrate layer SUB to the upper touch sensing component pad PD-TSU.

[0179] Although not shown, in another embodiment of the inventive concept, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the boundary region AR-BD. That is, in this case, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the entire surface of the active region AR-ACV, the pad region AR-PD, and the boundary region AR-BD.

[0180] Reference Figure 13C The upper display panel pad PD-DPU and the upper touch sensing component pad PD-TSU can be disposed on the same layer. The upper display panel pad PD-DPU can be electrically connected to the lower display panel pad PD-DPD through the sixth through-hole CH6. Although not shown, a dummy electrode can be disposed on the first insulating layer 12.

[0181] Therefore, in the process of attaching the printed circuit board to the display panel pads PD-DP and the touch sensing component pads PD-TS, since the display panel pads PD-DP and the touch sensing component pads PD-TS have the same height, the pressure applied to the pads PD-DP and PD-TS can be the same. This prevents defects that may occur during the printed circuit board attachment process. Furthermore, the durability against externally applied stress can be improved based on the manipulation operation of the flexible display device DD.

[0182] Figure 14A It is along Figure 12 The sectional view taken from line II-II'. Figure 14B It is along Figure 12 The sectional view taken from line III-III'. Figure 14C and Figure 14D They are along Figure 12 A sectional view taken from line IV-IV'. Figures 14A to 14C An embodiment of the inventive concept is shown.

[0183] Reference Figure 14A Description and reference Figure 13A The descriptions are essentially the same, so their descriptions will be omitted.

[0184] Reference Figure 14B and Figure 14CThe upper touch sensing component pad PD-TSU can be electrically connected to the lower touch sensing component pad PD-TSD through the seventh through hole CH7.

[0185] Figure 14D The diagram shows that each of the sixth through-hole CH6 and the seventh through-hole CH7 has a ratio of Figure 14C The width of each through hole is greater than the width of the state.

[0186] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0187] Figure 15A It is along Figure 12 The sectional view taken from line II-II'. Figure 15B It is along Figure 12 The sectional view taken from line III-III'. Figure 15C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 15A to 15C An embodiment of the inventive concept is shown.

[0188] Reference Figure 15A and Figure 15C The upper display panel pad PD-DPU contacts the lower display panel pad PD-DPD. (Refer to...) Figure 15B and Figure 15C The upper touch sensing component pad PD-TSU contacts the lower touch sensing component pad PD-TSD.

[0189] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0190] Figure 16A It is along Figure 12 The sectional view taken from line II-II'. Figure 16B It is along Figure 12 The sectional view taken from line III-III'. Figure 16C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 16A to 16C An embodiment of the inventive concept is shown.

[0191] Unlike the third conductive pattern CDP3 described above, Figure 16A and Figure 16B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 via electrode GE3, which is formed using the same process as the control electrodes GE1 and GE2.

[0192] about Figure 16A and Figure 16B Descriptions of other components and Figure 13A and Figure 13B The description of the components of Figure 16C The description of Figure 13C is substantially the same as the description of

[0193] Figure 17A is a sectional view taken along line II-II' of Figure 12 Figure 17B is a sectional view taken along line III-III' of Figure 12 Figure 17C and Figure 17D is a sectional view taken along line IV-IV' of Figure 12 Figures 17A to 17D An embodiment of the inventive concept is illustrated.

[0194] Figure 17A and Figure 17B The third conductive pattern CDP3 of

[0195] The description of the other components of Figure 17A and Figure 17B is substantially the same as the description of the components of Figure 14A and Figure 14B The description of Figure 17C and Figure 17D is substantially the same as the description of Figure 14C and 14D The description of the other components of

[0196] Figure 18A is a sectional view taken along line II-II' of Figure 12 Figure 18B is a sectional view taken along line III-III' of Figure 12 Figure 18C is a sectional view taken along line IV-IV' of Figure 12 An embodiment of the inventive concept is illustrated. Figures 18A to 18C

[0197] Figure 18A The third conductive pattern CDP3 of Figure 18B is electrically connected to the first conductive pattern CDP1 by an electrode GE3 formed by the same process as the control electrodes GE1 and GE2.

[0198] The description of the other components of Figure 18A and Figure 18B is substantially the same as the description of the components of Figure 15A and Figure 15B ​​​​​​The descriptions of the components are essentially the same, therefore their descriptions will be omitted. Regarding Figure 18C Description and about Figure 15C The descriptions are essentially the same, so their descriptions will be omitted.

[0199] Figure 19A It is along Figure 12 The sectional view taken from line II-II'. Figure 19B It is along Figure 12 The sectional view taken from line III-III'. Figure 19C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 19A to 19C An embodiment of the inventive concept is shown.

[0200] Reference Figure 19A and Figure 19C The display panel pads (PD-DP) have a single-layer structure. (Refer to...) Figure 19B and 19C The touch sensing component pad PD-TS has a single-layer structure.

[0201] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0202] Figure 20A It is along Figure 12 The sectional view taken from line II-II'. Figure 20B It is along Figure 12 The sectional view taken from line III-III'. Figure 20C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 20A to 20C An embodiment of the inventive concept is shown.

[0203] Reference Figure 20A and Figure 20C The display panel pads (PD-DP) have a single-layer structure. (Refer to...) Figure 20B and Figure 20C The touch sensing component pad PD-TS has a single-layer structure.

[0204] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0205] As exemplified by the embodiments of the inventive concept Figures 19A to 19C and Figures 20A to 20C As shown, since the display panel pad PD-DP and the touch sensing component pad PD-TS are set at the same height and have a single-layer structure, defects that may occur in the manufacturing process can be reduced.

[0206] Figure 21A It is along Figure 12 The sectional view taken from line II-II'. Figure 21B It is along Figure 12 The sectional view taken from line III-III'. Figure 21C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 21A to 21C An embodiment of the inventive concept is shown.

[0207] The second conductive pattern CDP2 may include a dummy electrode ET-D, a display panel pad PD-DP, and a touch sensing component pad PD-TS.

[0208] The dummy electrode ET-D may be made of the same material as the control electrode GE2 of the first circuit layer CL1. The dummy electrode ET-D can be formed using the same process as the control electrode GE2. The dummy electrode ET-D can be insulated from other electrodes and performs the function of adjusting the height of the display panel pad PD-DP on the pad area AR-PD.

[0209] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0210] Figure 22 and Figure 23 A display module DM, as well as printed circuit boards PCB and PCB-1, are shown according to an embodiment of the inventive concept.

[0211] Reference Figure 22 The pads PD-TS and PD-DP of the display module DM are electrically connected to the pad PD-PCB of the printed circuit board PCB. The integrated circuit DIC can be mounted on the printed circuit board PCB. The integrated circuit DIC can be formed using a flexible printed circuit on-chip (COF) method. The integrated circuit DIC can transmit data to / receive data from the display module DM via the pads PD-PCB, PD-TS, and PD-DP.

[0212] Reference Figure 23 The integrated circuit DIC-1 can be placed on the pad area AR-PD of the display module DM. Here, the integrated circuit DIC-1 can be formed using the chip-on-plastic (COP) method.

[0213] Although touch signal lines SL1 and SL2 are not connected Figure 23 The integrated circuit DIC-1 is used, but embodiments of the inventive concept are not limited thereto. In embodiments of the inventive concept, each of the touch signal lines SL1 and SL2 may have a structure connected to the integrated circuit DIC-1.

[0214] Figure 24A bending shape of the display module DM according to an embodiment of the inventive concept is shown. Referring to Figure 24 The display module DM can be bent in the boundary area AR-BD. As described above, the boundary area AR-BD of the display module DM can not include the inorganic material layer but only the organic material layer. Accordingly, the boundary area AR-BD can have flexibility sufficient to be bent.

[0215] According to an embodiment of the inventive concept, the pad unit of the display panel and the pad unit of the touch sensing member can be disposed at the same height.

[0216] According to an embodiment of the inventive concept, the bending portion of the display panel can have improved flexibility.

[0217] It will be apparent to those skilled in the art that various modifications and changes can be made to the inventive concept. Therefore, the disclosure is intended to cover the modifications and changes, which fall within the scope of the inventive concept, as defined by the appended claims and their equivalents. Accordingly, the scope of the present invention is not to be limited by the foregoing detailed description, but is to be defined by the widest scope allowable by the law, including the scope of equivalents of the claims and their equivalents.

Claims

1. A display device, the display device comprising: The substrate layer includes the display area and the non-display area; A display device layer is disposed on the substrate layer and stacked with the display area; Multiple pads are disposed on the substrate layer and stacked with the non-display area; An encapsulation layer is disposed on the display device layer; The touch sensor includes a touch insulating layer superimposed on the display area and the non-display area, and a conductive pattern disposed on the display area. The plurality of pads includes: a first lower pad electrically connected to the display device layer and disposed on the substrate layer; a second lower pad spaced apart from the first lower pad in a plan view and disposed on the substrate layer; a first upper pad disposed on the first lower pad and electrically connected to the first lower pad; and a second upper pad electrically connected to the conductive pattern and disposed on the second lower pad. The touch insulating layer is disposed between the first lower pad and the first upper pad, and between the second lower pad and the second upper pad.

2. The display device according to claim 1, wherein, The touch insulating layer includes: a first touch insulating layer disposed directly on the encapsulation layer; and a second touch insulating layer disposed on the first touch insulating layer. The conductive pattern includes: a first conductive pattern disposed on the first touch insulating layer and covered by the second touch insulating layer; and a second conductive pattern disposed on the second touch insulating layer.

3. The display device according to claim 2, wherein, One of the first conductive pattern and the second conductive pattern, the first upper pad, and the second upper pad comprise the same material.

4. The display device according to claim 2, wherein, The first lower pad is electrically connected to the first upper pad on the non-display area through a first contact hole defined in the first touch insulating layer and the second touch insulating layer, and The second lower pad is electrically connected to the second upper pad on the non-display area through a second contact hole defined in the first touch insulating layer and the second touch insulating layer.

5. The display device according to claim 2, wherein, The first lower pad contacts the first upper pad through a first contact hole defined in the first touch insulating layer and the second touch insulating layer, and The second lower pad contacts the second upper pad through a second contact hole defined in the first touch insulating layer and the second touch insulating layer.

6. The display device according to claim 1, wherein, The conductive pattern includes: The first conductive pattern is directly disposed on the encapsulation layer and is covered by the touch insulating layer; and A second conductive pattern is disposed on the touch insulating layer.

7. The display device according to claim 6, wherein, One of the first conductive pattern and the second conductive pattern, the first upper pad and the second upper pad are formed of the same material and are formed on the same plane.

8. The display device according to claim 6, wherein, The first lower pad is electrically connected to the first upper pad on the non-display area via a first contact hole defined in the touch insulating layer, and The second lower pad is electrically connected to the second upper pad on the non-display area via a second contact hole defined in the touch insulating layer.

9. The display device according to claim 1, wherein, The touch insulating layer is directly disposed on the encapsulation layer, and the conductive pattern is disposed on the touch insulating layer.

10. The display device according to claim 1, wherein, The first lower pad is electrically connected to the first upper pad on the non-display area via a first contact hole defined in the touch insulating layer, and The second lower pad is electrically connected to the second upper pad on the non-display area via a second contact hole defined in the touch insulating layer.

11. The display device according to claim 10, wherein, The first lower pad contacts the first upper pad through the first contact hole, and the second lower pad contacts the second upper pad through the second contact hole.

12. A display device, the display device comprising: The substrate layer includes the display area and the non-display area; A display device layer is disposed on the substrate layer and stacked with the display area; The first pad is disposed on the substrate layer and overlapped with the non-display area; The second pad is disposed on the first pad; An encapsulation layer is disposed on the display device layer; as well as The touch sensor includes a touch insulating layer superimposed on the display area and the non-display area, and a conductive pattern disposed on the display area. The touch insulating layer is disposed between the first pad and the second pad.

13. The display device according to claim 12, wherein, The second pad is electrically connected to the conductive pattern.

14. The display device according to claim 12, wherein, The touch insulating layer includes: First touch insulating layer; and The second touch insulating layer is disposed on the first touch insulating layer.

15. The display device according to claim 12, wherein, The second pad and the conductive pattern comprise the same material.

16. The display device of claim 12, further comprising a transistor disposed between the substrate layer and the display device layer and electrically connected to the display device layer. in, The transistor includes electrodes made of the same material as the first pad.

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