An on-line atmospheric plasma wafer cleaning apparatus

Abstract

The application discloses an online atmospheric plasma wafer cleaning device, which comprises a cleaning frame, a feeding mechanism, a carrying mechanism, an identification positioning mechanism, a cleaning mechanism, a sealing mechanism, a three-axis transfer mechanism and a cleaning workbench arranged in the cleaning frame. The feeding mechanism, the carrying mechanism and the identification positioning mechanism are arranged at the front end of the cleaning frame. The carrying mechanism is arranged at the left side of the front end of the cleaning frame. The identification positioning mechanism is arranged at the right side of the front end of the cleaning frame. The sealing mechanism is arranged at the rear end of the cleaning frame. The application can realize the cleaning of bare wafers or back membrane wafers at the same time. The cleaning environment can be kept in a low-oxygen environment at any time through online automatic air charging, so that the air replacement waiting time is greatly saved. The cleaning environment is in a dust-free level through the arrangement of the cleaning frame, the sealing mechanism and the cleaning workbench, so that the manual operation is completely replaced, and the application has good market application value.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and in particular to an online atmospheric plasma wafer cleaning device. Background Technology

[0002] In the integrated circuit manufacturing process, impurities such as residual oil, photoresist, and oxides may remain on the wafer surface. During the manufacturing process, the presence of these contaminants can seriously affect the processing shape and precision, leading to damage to the internal structure of the chip and reducing the yield of silicon carbide microelectromechanical devices and high-power electronic devices.

[0003] Plasma cleaning equipment is widely used in the semiconductor industry for cleaning, causing minimal damage to surfaces and circuits, achieving cleanliness, economy, and safety. Existing wafer plasma equipment solutions are mainly vacuum offline types, such as patent CN202010266787.1. Offline types require manual operation, making it difficult to improve the cleanliness level of the surrounding space, resulting in dust accumulation on the wafer surface and affecting wafer yield. At the same time, the vacuum chamber has low efficiency. After the wafer is placed, the air inside the equipment needs to be purged, and then a protective gas needs to be filled in, ionized, and ultraviolet light is released. Then, a strong oxidizing gas is introduced for cleaning, which takes a lot of time and results in excessively long waiting times.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an online atmospheric plasma wafer cleaning device.

[0006] The present invention provides an online atmospheric plasma wafer cleaning device, comprising a cleaning frame and a feeding mechanism, a transport mechanism, an identification and positioning mechanism, a cleaning mechanism, a sealing mechanism, a three-axis transfer mechanism, and a cleaning worktable disposed within the cleaning frame. The feeding mechanism, transport mechanism, and identification and positioning mechanism are all located at the front end of the cleaning frame. The feeding mechanism is located at the outer middle of the front end of the cleaning frame. The transport mechanism is located on the left side of the front end of the cleaning frame. The identification and positioning mechanism is located on the right side of the front end of the cleaning frame. The sealing mechanism is located at the rear end of the cleaning frame. The three-axis transfer mechanism, the cleaning worktable, and the cleaning mechanism are all disposed inside the sealing mechanism. The three-axis transfer mechanism is located at the lower part of the sealing mechanism. The cleaning worktable is located at the working end of the three-axis transfer mechanism. The cleaning mechanism is vertically disposed inside the top of the sealing mechanism. A sealing component for feeding and isolating from the outside is also disposed at the middle of the front end of the sealing mechanism.

[0007] Preferably, the cleaning frame includes a frame body, a fan filter unit, and a crane sensor. The fan filter unit is located at the top front end of the frame body, and the crane sensor is located on the outer wall of the top front end of the frame body. The crane sensor interacts with the crane conveying the material to achieve online product reception and online processing.

[0008] Preferably, the feeding mechanism includes a bare wafer opening and closing device, a bare wafer carrier, a back-film wafer opening and closing device, and a back-film wafer carrier. The bare wafer opening and closing device and the back-film wafer opening and closing device are arranged side by side at the front end of the cleaning frame. The bare wafer carrier is disposed on the bare wafer opening and closing device, and the back-film wafer carrier is disposed on the back-film wafer opening and closing device. The feeding mechanism is used to receive products or to place cleaned products for the overhead crane mechanism to pick them up again.

[0009] Preferably, the handling mechanism includes a handling frame, a transverse linear motor slide, and a handling robot. There are two transverse linear motor slides arranged longitudinally parallel to each other on the cleaning frame. The handling frame is mounted on the two transverse linear motor slides. The handling robot is mounted on the handling frame, and there are two handling robots arranged side-by-side on the handling frame. Each handling robot has two robotic arms. The front ends of the two robotic arms are respectively equipped with a bare wafer gripper and a back-film wafer gripper for handling wafers. Both the bare wafer gripper and the back-film wafer gripper can be detachably mounted on the front ends of the two robotic arms. The handling robot can simultaneously grasp two wafers of the same type or two wafers of different types.

[0010] Preferably, the identification mechanism includes a bare wafer identification unit and a backsheet wafer identification unit. The bare wafer identification unit is disposed within the cleaning frame, and the backsheet wafer identification unit is disposed above the bare wafer identification unit. The bare wafer identification unit includes a base plate and a DD motor, a rotary table, a line laser, and a bare wafer barcode scanner disposed on the base plate. The base plate is disposed on the cleaning frame, the DD motor is disposed in the middle of the base plate, the rotary table is disposed on the DD motor, and the line laser and bare wafer barcode scanner... All the guns are vertically mounted on the side of the DD motor. The rotary table is equipped with a pneumatic suction cup for adsorbing products. The back-film wafer identification unit includes a support frame, a placement stage, a clamping assembly, and a back-film wafer barcode scanner. The support frame is vertically mounted on the base plate, the placement stage is mounted on the support frame, the clamping assembly is located in the middle of the placement stage, and the back-film wafer barcode scanner is located on the side of the placement stage. The identification mechanism reads and identifies product information on bare wafers or back-film wafers waiting to be cleaned.

[0011] Preferably, the sealing mechanism includes a sealing chamber, an exhaust pipe, a sealing cover, and a sealing assembly. The exhaust pipe is located at the bottom of the sealing chamber, the sealing cover is located at the top of the sealing chamber, and the sealing assembly is located at the middle of the front end of the sealing chamber. The sealing chamber is also provided with an inflation connector for replenishing gas, through which replacement gas is injected into the sealing chamber.

[0012] Preferably, the cleaning mechanism is vertically mounted on the sealed upper cover, with its working end facing the sealed housing. The cleaning mechanism is a plasma cleaner.

[0013] Preferably, the three-axis transfer mechanism is an XYZ-axis transfer platform.

[0014] Preferably, the cleaning workbench includes a base frame, a sealing cavity body, a heating platform, a blue film protective plate, and a cooling platform. The bottom of the base frame is located at the working end of the three-axis transfer mechanism. The sealing cavity body is located within the base frame. The heating platform is located on the upper left side of the sealing cavity body. The blue film protective plate is supported above the heating platform by multiple pillars, forming a feeding channel for material loading between the blue film protective plate and the multiple pillars. The cooling platform is located on the upper right side of the sealing cavity body. Height adjustment blocks are provided on the left, right, and rear sides of the sealing cavity body. The height adjustment blocks are vertically installed inside the base frame. The height adjustment blocks allow manual adjustment of the vertical position of the sealing cavity body on the base frame, thereby adjusting the gap between the sealing cavity body and the sealing cover. An air pipe connector is also provided on the rear side of the sealing cavity body. A heating pneumatic suction nozzle is provided inside the heating platform. The heating platform is electrically heated. A cooling pneumatic suction nozzle is provided inside the cooling platform. A compressed gas connector for cooling is also provided inside the cooling platform.

[0015] Compared to existing technologies, the advantages of this invention are as follows: By interacting with the online transport information of the cleaning frame and the overhead crane, the invention enables automated online cleaning of products. The cleaning workbench can simultaneously clean bare wafers or backsheet wafers. The product information is automatically identified by the identification mechanism, and online automatic air inflation keeps the cleaning environment in a low-oxygen environment at all times, effectively preventing oxidation of the product during cleaning and greatly saving air replacement waiting time. By setting up the cleaning frame, sealing mechanism and cleaning workbench, the cleaning environment is kept at a dust-free level, completely replacing manual operation and having good market application value. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2This is a schematic diagram of the internal structure of the overall structure of the present invention;

[0018] Figure 3 This is a partial structural schematic diagram of the present invention;

[0019] Figure 4 This is a schematic diagram of the handling mechanism structure of the present invention;

[0020] Figure 5 This is a schematic diagram of the handling robot structure of the present invention;

[0021] Figure 6 This is a schematic diagram of the identification mechanism structure of the present invention;

[0022] Figure 7 This is a schematic diagram of the sealing mechanism of the present invention;

[0023] Figure 8 This is a schematic diagram of the cleaning workbench structure of the present invention.

[0024] Reference numerals: 100, Cleaning frame; 200, Feeding mechanism; 300, Transporting mechanism; 400, Identification and positioning mechanism; 500, Cleaning mechanism; 600, Sealing mechanism; 700, Three-axis transfer mechanism; 800, Cleaning workbench; 101, Frame body; 102, Fan filter unit; 103, Overhead crane sensor; 210, Back-film wafer opening and closing device; 220, Bare wafer opening and closing device; 230, Back-film wafer carrier; 240, Bare wafer carrier; 301, Transport frame; 302, Horizontal linear motor slide; 303, Transporting robot; 3 031. Wafer fixture; 410. Bare wafer identification unit; 420. Backsheet wafer identification unit; 411. Base plate; 412. DD motor; 413. Rotary stage; 414. Line laser; 415. Bare wafer barcode scanner; 421. Support frame; 422. Placement stage; 423. Clamping assembly; 424. Backsheet wafer barcode scanner; 601. Sealed enclosure; 602. Exhaust pipe; 603. Sealed top cover; 604. Sealing assembly; 801. Base frame; 802. Sealed cavity frame; 803. Heating stage; 804. Blue film protection plate; 805. Cooling stage. Detailed Implementation

[0025] It should be noted that the above-mentioned technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this invention specification; and, for those skilled in the art, improvements or modifications can be made based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0026] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0027] It should be noted that when a component is described as being "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is described as being "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention.

[0029] The present invention will now be described in detail with reference to the accompanying drawings.

[0030] like Figure 1 , Figure 2 , Figure 3As shown, one embodiment of the present invention is an online atmospheric plasma wafer cleaning device, comprising a cleaning frame 100 and a feeding mechanism 200, a transport mechanism 300, an identification and positioning mechanism 400, a cleaning mechanism 500, a sealing mechanism 600, a three-axis transfer mechanism 700, and a cleaning worktable 800 disposed within the cleaning frame 100. The feeding mechanism 200, transport mechanism 300, and identification and positioning mechanism 400 are all disposed at the front end of the cleaning frame 100. The feeding mechanism 200 is disposed at the outer middle of the front end of the cleaning frame 100, the transport mechanism 300 is disposed on the left side of the front end of the cleaning frame 100, the identification and positioning mechanism 400 is disposed on the right side of the front end of the cleaning frame 100, and the sealing mechanism 600 is disposed at the rear end of the cleaning frame 100. The three-axis transfer mechanism 700, the cleaning workbench 800, and the cleaning mechanism 500 are all disposed inside the sealing mechanism 600. The three-axis transfer mechanism 700 is disposed at the lower part of the sealing mechanism 600, the cleaning workbench 800 is disposed at the working end of the three-axis transfer mechanism 700, and the cleaning mechanism 500 is vertically disposed inside the top of the sealing mechanism 600. A sealing component 604 for feeding and isolating the outside is also disposed at the middle position of the front end of the sealing mechanism 600. The identification and positioning mechanism 400 is used to automatically identify the type of wafer to be cleaned and to locate the center of the wafer. The sealing mechanism 600 is used to perform low-oxygen treatment on the environment of the cleaning workbench 800. The cleaning workbench 800 is used to place the wafer to be cleaned and to perform pre-cleaning heating and post-cleaning cooling on the wafer.

[0031] Preferably, the cleaning frame 100 includes a frame body 101, a fan filter unit 102, and a crane sensor 103. The fan filter unit 102 is disposed at the top front end of the frame body 101, and the crane sensor 103 is disposed on the outer wall of the top front end of the frame body 101. The fan filter unit 102 is used to purify the air in the working environment of the feeding mechanism 200, the conveying mechanism 300, and the identification and positioning mechanism 400, and plays a role in filtering and purifying exhaust gas and dust in the air. The crane sensor 103 is used to send signals to the crane from the feeding mechanism for docking and information exchange. Then the crane places the bare wafer and the back film wafer on the feeding mechanism 200.

[0032] Preferably, the feeding mechanism 200 includes a bare wafer opening and closing device 220, a bare wafer carrier 240, a back-film wafer opening and closing device 210, and a back-film wafer carrier 230. The bare wafer opening and closing device 220 and the back-film wafer opening and closing device 210 are arranged side by side at the front end of the cleaning frame 100. The bare wafer carrier 240 is disposed on the bare wafer opening and closing device 220, and the back-film wafer carrier 230 is disposed on the back-film wafer opening and closing device 210. After the trolley transports the product to the feeding mechanism 200, the corresponding bare wafer opening and closing device 220 or the back-film wafer opening and closing device 210 is opened according to the model of the transported product, so that the corresponding product is placed on the bare wafer carrier 240 or the back-film wafer carrier 230, waiting for the handling mechanism 300 to handle it.

[0033] Furthermore, depending on the needs, the feeding mechanism can be configured as two identical bare wafer opening and closing devices 220, or two identical back film wafer opening and closing devices 210, or one back film wafer opening and closing device 210 and one bare wafer opening and closing device 220 can be arranged side by side, and the wafer carrier can be matched accordingly to meet the processing needs of different types of products.

[0034] Preferably, such as Figure 4 As shown, Figure 5 As shown, the handling mechanism 300 includes a handling frame 301, a transverse linear motor slide 302, and a handling robot 303. There are two transverse linear motor slides 302, arranged longitudinally parallel to each other on the cleaning frame 100. The handling frame 301 is mounted on the two transverse linear motor slides 302. The handling robot 303 is mounted on the handling frame 301. The handling robot 301 has two robotic arms. The front ends of the two robotic arms are respectively equipped with a bare wafer chuck and a back-film wafer chuck for handling wafers. Both the bare wafer chuck and the back-film wafer chuck are detachably mounted on the front ends of the two robotic arms. At the end, the horizontal linear motor slide 302 is used to drive the handling robot 303 to move laterally. Both the bare wafer chuck and the back-film wafer chuck are equipped with pneumatic suction cups. When a product needs to be picked up, the pneumatic suction cups work. The wafer chucks 3031 of the two robotic arms can be two identical bare wafer chucks, two identical back-film wafer chucks, or one bare wafer chuck and the other back-film wafer chuck. The wafer chuck 3031 is selected according to the type of product to be cleaned, so as to realize the rapid switching of different wafer chucks 3031. The wafer chuck can be a wafer tooth fork or a wafer expansion ring chuck. The matching wafer chuck is selected according to the model of the product being processed.

[0035] Preferably, such as Figure 6As shown, the identification mechanism includes a bare wafer identification unit 410 and a back-film wafer identification unit 420. The bare wafer identification unit 410 is disposed within the cleaning frame 100, and the back-film wafer identification unit 420 is disposed above the bare wafer identification unit 410. The bare wafer identification unit 410 includes a base plate 411 and a DD motor 412, a rotary table 413, a line laser 414, and a bare wafer barcode scanner 415 disposed on the base plate 411. The base plate 411 is disposed on the cleaning frame 100, and the DD motor 412 is disposed in the middle of the base plate 411. The rotating stage 413 is mounted on the DD motor 412. The line laser 414 and the bare wafer barcode scanner 415 are both vertically mounted on the side of the DD motor 412. The rotating stage 413 has an internal pneumatic suction cup for adsorbing products. When the transport mechanism 300 places the bare wafer onto the rotating stage 413, the pneumatic suction cup adsorbs the wafer. The line laser 414 determines the center of the wafer and the position of the QR code. The DD motor 412 then operates, rotating the rotating stage 413 to the designated position. The bare wafer barcode scanner 415 then reads the product information. The information is then transmitted to the cleaning control center. Once the information is identified, the transport mechanism 300 transports the product to the cleaning workbench 800. The back film wafer identification unit 420 includes a support frame 421, a placement stage 422, a clamping assembly 423, and a back film wafer barcode scanner 424. The support frame 421 is vertically mounted on the base plate 411, the placement stage 422 is mounted on the support frame 421, the clamping assembly 423 is positioned in the middle of the placement stage 422, and the back film wafer barcode scanner 424 is positioned on the side of the placement stage 422. The transport mechanism 300 transports the back film wafer... The wafer is placed on the support frame 421, and the clamping assembly 423 clamps and positions the back-film wafer. Then, the back-film wafer barcode scanner 424 scans the barcode information on the product and uploads it to the cleaning control center. After scanning, the clamping assembly 423 releases the product, and the product waits for the transport mechanism 300 to transport it to the cleaning workbench 800 for cleaning. The identification mechanism can scan the product information of the product to be cleaned, which makes it easy for the cleaning workbench 800 to select the cleaning method. The clamping assembly 423 is a clamping cylinder, and the identification mechanism enables rapid reading of product information to avoid cleaning chaos.

[0036] Preferably, such as Figure 7As shown, the sealing mechanism 600 includes a sealing housing 601, an exhaust pipe 602, a sealing cover 603, and a sealing assembly 604. The exhaust pipe 602 is located at the bottom of the sealing housing 601, the sealing cover 603 is located at the top of the sealing housing 601, and the sealing assembly 604 is located at the middle of the front end of the sealing housing 601. The sealing housing 601 is also equipped with an inflation connector for replenishing gas. When the equipment is turned on, external argon gas is connected through the inflation connector. After the argon gas enters the sealing housing 601, it flows through the exhaust pipe 602 and the exhaust pipe 603. 2. To allow the high-oxygen-content gas inside the sealed chamber 601 to be discharged, the sealing component 604 is an electric slide gate valve. When the sealed chamber 601 is in a low-oxygen working environment, the sealing component 604 is in the closed state. When the conveying mechanism 300 needs to interact with the sealing mechanism 600 to move products, the sealing component 604 is in the open state, effectively isolating the sealed chamber 601 from the outside world and effectively ensuring that the sealed chamber 601 is in a low-oxygen environment. The opening and closing state of the sealing component 604 ensures that the cleaning workbench 800 is in a low-oxygen environment during operation.

[0037] Preferably, the cleaning mechanism 500 is vertically mounted on the sealing cover 603, with its working end facing the inside of the sealing housing 601, and the cleaning mechanism 500 is a plasma cleaner.

[0038] Preferably, the three-axis transfer mechanism 700 is an XYZ axis transfer platform. The three-axis transfer mechanism 700 is used to cooperate with the transfer and cleaning action of the cleaning workbench 800. When receiving and feeding materials, the cleaning workbench 800 is transferred to the working range of the transport mechanism 300. When cleaning is required, the cleaning workbench 800 is transferred to the bottom of the cleaning mechanism 500 to wait for the cleaning action.

[0039] Preferably, such as Figure 8As shown, the cleaning workbench 800 includes a base frame 801, a sealed cavity body, a heating platform 803, a blue film protection plate 804, and a cooling platform 805. The bottom of the base frame 801 is located at the working end of the three-axis transfer mechanism 700. The sealed cavity body is located inside the base frame 801. The heating platform 803 is located on the upper left side of the sealed cavity body. The blue film protection plate 804 is mounted above the heating platform 803 by multiple support pillars. A feeding channel for feeding materials is formed between the blue film protection plate 804 and the multiple support pillars.The cooling platform 805 is located on the upper right side of the sealing cavity body. Height adjustment blocks are provided on the left, right, and rear sides of the sealing cavity body. These height adjustment blocks can be vertical limiting slides, vertical sliding adjustment blocks, or upper slide rails with limiting mechanisms, as long as they allow the sealing cavity body to move up and down within the base frame 801. This adjusts the distance between the sealing cavity body and the sealing cover 603, facilitating plasma cleaning. During cleaning, the height adjustment blocks are first manually adjusted to maintain a distance of approximately 1mm between the upper surface of the sealing cavity body and the sealing cover 603, minimizing the open area at the top of the sealing cavity body. The heating stage 803 is designed to facilitate plasma cleaning. The height adjustment blocks are vertically mounted inside the base frame 801. These blocks allow manual adjustment of the sealing cavity body's vertical position on the base frame 801, thereby adjusting the gap between the sealing cavity body and the sealing cover. A gas pipe connector is located at the rear of the sealing cavity body for connecting replacement gas. When the equipment is started, argon gas is injected into the sealing cavity body through the gas pipe connector, maintaining the oxygen content within the sealing cavity body below 100 ppm. This prevents oxidation of the product during plasma cleaning of bare wafers or back-film wafers. The heating stage 803 is electrically heated, and the cooling stage 805 is equipped with a cooling pneumatic suction nozzle and a compressed gas connector for cooling. When cleaning only bare wafers, the heating stage 803 needs to be heated to a set temperature. The bare wafer is transported onto the heating stage 803 by the transport mechanism 300, where the heating pneumatic suction nozzle adsorbs the wafer. Once the appropriate temperature is reached, the cleaning mechanism 500 performs plasma cleaning on the wafer on the heating stage 803. After cleaning, the transport mechanism 300 then removes the bare wafer from the heat. The wafer is transferred to the cooling platform 805 for cooling. When the wafer requiring cleaning is a back-film wafer, the transport mechanism 300 repeats the above transport actions, but the heating platform 803 does not heat the wafer. The back-film wafer is protected by the blue protective plate 804, which protects the protective film on the back-film wafer. After cleaning, the transport mechanism 300 transfers the cleaned bare wafer or back-film wafer back to the feeding mechanism 200. This alternating cleaning method allows for the separate cleaning of two types of wafers. Since both the heating platform 803 and the cooling platform 805 are within the sealed enclosure 601, oxidation of the product is effectively prevented during heating or cooling.

[0040] Furthermore, both the bottom of the heating stage and the bottom of the cooling stage are equipped with lifting mechanisms. The heating stage and the cooling stage move up and down within the sealed cavity through the lifting mechanisms, thereby adjusting the distance between the heating stage and the cooling stage and the sealed top cover. By moving the heating stage and the cooling stage up and down through the lifting mechanisms, the distance between the product and the cleaning mechanism is changed when the cleaning mechanism completes the cleaning action, so as to achieve synchronous cleaning of the back film wafer and the bare wafer. This allows for adjustment of the cleaning distance of the cleaning mechanism for the bare wafer or the back film wafer, thus protecting the back film wafer during cleaning. The lifting mechanism can be a lifting drive mechanism such as a lead screw stepper motor to achieve lifting drive.

[0041] The working principle of this invention is as follows: After the cleaning equipment is turned on, the fan filter unit 102 is activated to purify the air inside the cleaning equipment. Simultaneously, the air-filling structure on the sealing mechanism 600 is ventilated, and the sealed cavity body on the cleaning workbench 800 is also ventilated, ensuring that the oxygen content inside the cleaning workbench 800 is within the range required for operation. When the overhead crane transports the product to the front end of the feeding mechanism 200, the overhead crane interacts with the overhead crane through the overhead crane sensor 103. The overhead crane places the bare wafer or back-film wafer on the feeding mechanism 200. The transport mechanism 300 then transports the corresponding product to the bare wafer identification unit 410 or the back-film wafer identification unit 420 for information identification. After information identification is completed, the transport mechanism 300 transports the product to the cleaning workbench 800 again. The corresponding cleaning action is selected according to the product. After the product is cleaned, the transport mechanism 300 transports the product back to the feeding mechanism 200 to await retrieval.

[0042] It should be noted that the above-mentioned technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this invention specification; and, for those skilled in the art, improvements or modifications can be made based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An online atmospheric plasma wafer cleaning device, characterized in that, The system includes a cleaning frame and a feeding mechanism, a conveying mechanism, an identification and positioning mechanism, a cleaning mechanism, a sealing mechanism, a three-axis transfer mechanism, and a cleaning worktable disposed within the cleaning frame. The feeding mechanism, conveying mechanism, and identification and positioning mechanism are all disposed at the front end of the cleaning frame. The feeding mechanism is disposed at the outer middle of the front end of the cleaning frame. The conveying mechanism is disposed on the left side of the front end of the cleaning frame. The identification and positioning mechanism is disposed on the right side of the front end of the cleaning frame. The sealing mechanism is disposed at the rear end of the cleaning frame. The three-axis transfer mechanism, the cleaning worktable, and the cleaning mechanism are all disposed inside the sealing mechanism. The three-axis transfer mechanism is disposed at the lower part of the sealing mechanism. The cleaning worktable is disposed at the working end of the three-axis transfer mechanism. The cleaning mechanism is vertically disposed inside the top of the sealing mechanism. A sealing component for feeding and isolating from the outside is also disposed at the middle of the front end of the sealing mechanism. The cleaning frame includes a frame body, a fan filter unit, and a crane sensor. The fan filter unit is located at the top front end of the frame body, and the crane sensor is located on the outer wall of the top front end of the frame body. The feeding mechanism includes a bare wafer opening and closing device, a bare wafer carrier, a back-film wafer opening and closing device, and a back-film wafer carrier. The bare wafer opening and closing device and the back-film wafer opening and closing device are arranged side by side at the front end of the cleaning frame. The bare wafer carrier is disposed on the bare wafer opening and closing device, and the back-film wafer carrier is disposed on the back-film wafer opening and closing device. The handling mechanism includes a handling frame, a transverse linear motor slide, and a handling robot. There are two transverse linear motor slides, which are arranged longitudinally and parallel to each other on the cleaning frame. The handling frame is set on the two transverse linear motor slides. The handling robot is set on the handling frame. The handling robot is equipped with two robotic arms. The front end of the two robotic arms is respectively equipped with a bare wafer chuck and a back-film wafer chuck for handling wafers. Both the bare wafer chuck and the back-film wafer chuck can be detachably installed on the front end of the two robotic arms. The identification and positioning mechanism includes a bare wafer identification unit and a back-film wafer identification unit. The bare wafer identification unit is disposed within the cleaning frame, and the back-film wafer identification unit is disposed above the bare wafer identification unit. The bare wafer identification unit includes a base plate and a DD motor, a rotary table, a line laser, and a bare wafer barcode scanner disposed on the base plate. The base plate is disposed on the cleaning frame, the DD motor is disposed in the middle of the base plate, the rotary table is disposed on the DD motor, and the line laser and the bare wafer barcode scanner are both vertically disposed on the side of the DD motor. The rotary table is provided with a pneumatic suction cup for adsorbing products. The back-film wafer identification unit includes a support frame, a placement stage, a clamping assembly, and a back-film wafer barcode scanner. The support frame is vertically disposed on the base plate, the placement stage is disposed on the support frame, the clamping assembly is disposed in the middle of the placement stage, and the back-film wafer barcode scanner is disposed on the side of the placement stage. The sealing mechanism includes a sealing chamber, an exhaust pipe, a sealing cover, and a sealing assembly. The exhaust pipe is located at the bottom of the sealing chamber, the sealing cover is located at the top of the sealing chamber, and the sealing assembly is located at the middle of the front end of the sealing chamber. The sealing chamber is also provided with an inflation connector for replenishing gas.

2. The online atmospheric plasma wafer cleaning equipment according to claim 1, characterized in that, The cleaning mechanism is vertically mounted on the sealed upper cover, with its working end facing the sealed box. The cleaning mechanism is a plasma cleaner.

3. The online atmospheric plasma wafer cleaning equipment according to claim 1, characterized in that, The three-axis transfer mechanism is an XYZ axis transfer platform.

4. The online atmospheric plasma wafer cleaning equipment according to claim 3, characterized in that, The cleaning workbench includes a base frame, a sealing cavity body, a heating platform, a blue film protective plate, and a cooling platform. The bottom of the base frame is located at the working end of the three-axis transfer mechanism. The sealing cavity body is located within the base frame. The heating platform is located on the upper left side of the sealing cavity body. The blue film protective plate is supported above the heating platform by multiple pillars, forming a feeding channel for material loading between the blue film protective plate and the pillars. The cooling platform is located on the upper right side of the sealing cavity body. Height adjustment blocks are provided on the left, right, and rear sides of the sealing cavity body. These height adjustment blocks are vertically installed inside the base frame. The height adjustment blocks allow manual adjustment of the vertical position of the sealing cavity body on the base frame, thereby adjusting the gap between the sealing cavity body and the sealing cover. An air pipe connector is also provided on the rear side of the sealing cavity body. The heating platform is electrically heated and contains a heating pneumatic suction nozzle. The cooling platform is also equipped with a cooling pneumatic suction nozzle and a compressed gas connector for cooling.

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