Packaged device, packaged module, and electronic apparatus

Abstract

This application provides a packaging device including a circuit board, electronic components, a package body, a housing, and at least one first heat dissipation component. The electronic components are electrically connected to the circuit board. The package body encapsulates the circuit board and electronic components and is thermally conductive. The housing houses the circuit board, electronic components, and package body, and at least one side of the housing has a thermally conductive first portion. Each first heat dissipation component is connected to the first portion and embedded in the package body. This application also provides a packaging module using this packaging device and an electronic device using this packaging device or the packaging module. By adding a first heat dissipation component to the packaging device, in conjunction with the first portion, this application can effectively improve the heat dissipation efficiency of the packaging device and facilitate the miniaturization and high-density packaging of the packaging module.

Description

Technical Field

[0001] This application relates to a packaged device with good heat dissipation, a packaged module using the packaged device, and an electronic device using the packaged device or the packaged module. Background Technology

[0002] To meet increasingly higher power demands, power semiconductor devices, especially power supply-grade power semiconductor devices, are evolving towards miniaturization and higher density. As the size of power semiconductor devices shrinks and the density of internal components increases, heat dissipation will have a significant impact on improving the operating efficiency of power semiconductor devices.

[0003] However, most existing power semiconductor devices achieve heat dissipation through encapsulation glue and housings, which have limited heat dissipation capacity and cannot dissipate internal heat in time. This may lead to excessively high temperatures in power semiconductor devices, affecting their operating efficiency and lifespan, and in severe cases, may cause internal components to fail or burn out. Summary of the Invention

[0004] A first aspect of this application provides a packaging device, the packaging device including a circuit board, electronic components, a package body, a housing, and at least one first heat dissipation component, the electronic components being electrically connected to the circuit board; the package body being used to encapsulate the circuit board and the electronic components, the package body being thermally conductive; the housing being used to house the circuit board, the electronic components, and the package body, at least one side of the housing having a thermally conductive first portion; each of the first heat dissipation components being connected to the first portion and embedded within the package body.

[0005] This application, by adding a first heat dissipation component inside the packaged device and connecting the first heat dissipation component to a thermally conductive first part, enables rapid conduction of heat inside the packaged device (especially heat at heat accumulation points) to the outer shell, thereby achieving heat dissipation inside the packaged device and improving heat dissipation efficiency; the connection between the first heat dissipation component and the first part facilitates the assembly of circuit boards and electronic components inside the packaged device and the filling of the packaged body; moreover, the added first heat dissipation component makes full use of the internal space of the packaged device, which is conducive to the miniaturization and thinning of the packaged device; in addition, the first heat dissipation component can be directly formed on the first part during the molding of the outer shell, which simplifies the manufacturing process, reduces costs, and facilitates mass production.

[0006] In some embodiments, at least one of the first heat dissipation components includes a first cavity and a first capillary structure and a first working fluid located within the first cavity.

[0007] By setting the first heat dissipation component in a two-phase structure, the high thermal conductivity of the two-phase structure can enhance the rapid and timely removal of heat from the packaged device (especially the packaged device with high heat source density and small package volume). It can quickly and timely remove the heat from the heat source in the package, greatly reducing the thermal resistance caused by heat accumulation, thereby improving heat dissipation efficiency.

[0008] In some embodiments, the first portion includes a second cavity and a second capillary structure and a second working fluid located within the second cavity.

[0009] By setting the first part as a two-phase structure, the high thermal conductivity of the two-phase structure, combined with the first heat dissipation component, can enhance the rapid and timely heat dissipation of the packaged device (especially the packaged device with high heat source density and small package volume), greatly reducing the thermal resistance caused by heat accumulation. In particular, when both the first part and the first heat dissipation component are two-phase structures, the contact area between the working fluid and the heat source can be increased, thereby improving the heat dissipation efficiency.

[0010] In some embodiments, the first portion and the first heat dissipation component form a third cavity, wherein a third capillary structure and a third working fluid are provided in the third cavity.

[0011] By molding the first part and the first heat dissipation component into an integrated cavity structure, the contact area between the third working fluid and the heat source can be increased, thereby improving the heat dissipation efficiency.

[0012] In some embodiments, at least one of the first heat dissipation components is disposed through the circuit board.

[0013] By embedding the first heat dissipation component through the circuit board, the heat accumulated on the side of the circuit board away from the first part can be carried away by the first heat dissipation component, thereby achieving the purpose of timely and rapid heat dissipation.

[0014] In some embodiments, at least two sides of the housing have the first thermally conductive portion, and the at least two sides are connected to each other, arranged opposite each other, or spaced apart from each other.

[0015] By adding a thermally conductive first part to different sides of the housing, the heat dissipation area is increased, further improving the heat dissipation efficiency of the packaged device, and also facilitating the miniaturization and thinning of the packaged device.

[0016] In some embodiments, when the at least two surfaces are connected to each other, the first portion on the at least two surfaces forms a fourth cavity, and the fourth cavity is provided with a fourth capillary structure and a fourth working fluid; or when the at least two surfaces are arranged opposite to each other or spaced apart from each other, the first portion on any two surfaces is connected by at least one first heat dissipation component.

[0017] By adding a thermally conductive first part to multiple surfaces of the housing, especially the first part of a two-phase heat dissipation component, the heat dissipation inside the packaged device can be further enhanced, particularly for packages with high heat source density and small package volume. This allows for rapid and timely heat dissipation, thereby improving heat dissipation efficiency. Furthermore, installing a heat dissipation device on one heat dissipation surface of the housing contributes to the miniaturization and thinning of the packaged device.

[0018] In some embodiments, at least one of the first heat dissipation components is provided on the surface of at least one second heat dissipation component, and each of the second heat dissipation components extends inside the package.

[0019] The addition of a second heat dissipation component makes full use of the internal space of the packaged device, which can further enhance the heat dissipation efficiency of the packaged device.

[0020] In some embodiments, at least one of the second heat dissipation components extends toward the electronic component.

[0021] The second heat dissipation component extends towards the electronic components, which can accelerate the dissipation of heat near the electronic components.

[0022] The first aspect of this application provides a packaging module, which includes a packaging device as described above and a heat dissipation device located on the outer surface of the first part.

[0023] The packaging device of this application has high heat dissipation efficiency. A heat dissipation device is provided on the outer surface of a thermally conductive first part of the housing to achieve efficient heat dissipation. While improving the heat dissipation effect of the packaging module, it is also beneficial to reduce the size of the packaging module.

[0024] A third aspect of this application provides an electronic device, which includes the packaging device or the packaging module described above.

[0025] In the electronic device, the packaging device can play a good role in heat dissipation, avoiding the formation of local hot spots in the packaging body. It can dissipate heat well while increasing the power consumption of electronic components, thereby improving the working efficiency and service life of the electronic device. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a packaged module.

[0027] Figure 2 This is a schematic diagram of the structure of a packaged device.

[0028] Figure 3 This is a schematic diagram of another type of packaging module.

[0029] Figure 4This is a schematic diagram of the structure of a packaging device according to an embodiment of this application.

[0030] Figure 5 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0031] Figure 6 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0032] Figure 7 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0033] Figure 8 yes Figure 7 A schematic diagram of the structure of the first heat dissipation component.

[0034] Figure 9 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0035] Figure 10 yes Figure 9 A schematic diagram of the first part of the structure.

[0036] Figure 11 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0037] Figure 12 yes Figure 11 A schematic diagram showing the structure in which the first heat dissipation component is connected to the first part.

[0038] Figure 13 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0039] Figure 14 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0040] Figure 15 This is a schematic diagram of the structure of a packaging device according to another embodiment of this application.

[0041] Figure 16 This is a schematic diagram of the structure of a packaging module according to an embodiment of this application.

[0042] Figure 17 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0043] Explanation of main component symbols

[0044] Package module 1000', 1000

[0045] Packaged devices 100', 100, 200, 300, 400, 500, 600

[0046] Outer shell 1',1

[0047] Part 1 11', 11, 11a

[0048] Second cavity 111

[0049] Fourth Wall 1111

[0050] Fifth Wall 1112

[0051] Sixth Wall 1113

[0052] Second capillary structure 112

[0053] Second working fluid 113

[0054] Part 2, 12', 12

[0055] Circuit board 2',2

[0056] Electronic components 3',3

[0057] Package 4',4

[0058] First heat dissipation component 5, 5a

[0059] First cavity 51

[0060] First Wall 511

[0061] Second Wall 512

[0062] Third Wall 513

[0063] First capillary structure 52

[0064] First working fluid 53

[0065] Second heat dissipation component 6

[0066] Third cavity 71

[0067] Evaporator 711

[0068] Condenser 712

[0069] Third capillary structure 72

[0070] Third working fluid 73

[0071] Fourth cavity 81

[0072] Fourth capillary structure 82

[0073] Fourth working medium 83

[0074] Heat dissipation device 1100', 1100

[0075] Thermal conductive layer 1200', 1200

[0076] Electronic equipment 2000

[0077] Casing 2100 Detailed Implementation

[0078] like Figure 1 The diagram shows a packaging module 1000'. The packaging module 1000' includes a packaging device 100' and a heat dissipation device 1100', with the packaging device 100' connected to the heat dissipation device 1100' via a thermally conductive layer 1200'. The packaging device 100' can be a power semiconductor device used for power processing, including frequency conversion, voltage conversion, current conversion, and power management.

[0079] like Figure 2 As shown, the aforementioned packaged device 100' includes a housing 1', a circuit board 2' located inside the housing 1', electronic components 3' located inside the housing 1' and electrically connected to the circuit board 2', and a package body 4' that encapsulates the circuit board 2' and electronic components 3'. The housing 1' includes a first part 11' and a second part 12' disposed opposite to the first part 11'. The circuit board 2' and electronic components 3' are the main heat sources. The first part 11' is thermally conductive and serves as a heat dissipation shell. The second part 12' is made of a material with low thermal conductivity and can be understood as a non-primary heat dissipation shell. The first part 11' is bonded to the heat dissipation device 1100' via a thermally conductive layer 1200' to achieve heat dissipation for the packaged device 100'. Typically, this structure has low heat dissipation efficiency and poor heat dissipation effect. Heat easily accumulates near the second part 12' inside the packaged device 100' and cannot be dissipated in time, easily leading to the burnout of the internal circuit board 2' and electronic components 3', affecting the performance and lifespan of the packaged module 1000'.

[0080] like Figure 3 As shown, combined with Figure 2 To improve the heat dissipation efficiency of the aforementioned packaging module 1000', the second part 12' of the packaging device 100' can be designed as a heat dissipation shell, and another heat dissipation device 1100' can be bonded to the surface of the second part 12' through a thermally conductive layer 1200' to enhance the heat dissipation effect. However, for the structure of the internally high-density packaged electronic components 3', the heat dissipation effect of the packaging module 1000' with two heat dissipation devices 1100' is still limited; moreover, since heat dissipation devices 1100' are added on both sides of the packaging device 100', the overall thickness of the packaging module 1000' increases, which is not conducive to the miniaturization and thinning of the packaging module 1000'.

[0081] In order to improve the heat dissipation efficiency of the packaged device 100' in the above-mentioned packaged module 1000', this application provides a packaged device. The embodiments of this application are described below with reference to the accompanying drawings.

[0082] Please see Figure 4 This embodiment provides a packaged device 100 with good heat dissipation performance. The packaged device 100 includes a housing 1 and a circuit board 2, electronic components 3, a package body 4, and at least one first heat dissipation component 5 located within the housing 1. The electronic components 3 are electrically connected to the circuit board 2. The circuit board 2, electronic components 3, and each first heat dissipation component 5 are all encapsulated within the package body 4, and the package body 4 is thermally conductive. At least one side of the housing 1 has a thermally conductive first portion 11. Each first heat dissipation component 5 is connected to the inner surface of the first portion 11. Here, the inner surface is defined as the surface of the housing 1 closest to the package body 4. It is understood that the housing 1 also includes an outer surface opposite to the inner surface, where the outer surface is defined as the surface of the housing 1 furthest from the package body 4.

[0083] like Figure 4 As shown, the outer shell 1 is roughly cubic in structure. The first part 11 is made of a thermally conductive material, which can be a metal, such as copper or aluminum, or a plastic with added thermally conductive filler, such as graphene particles, metal particles, or metal oxide particles. It is understood that the outer shell 1 also has a second part 12 with lower thermal conductivity, which is positioned opposite to the first part 11; that is, the second part 12 can be understood as a non-primary heat dissipation shell.

[0084] like Figure 4 As shown, circuit board 2 can be a double-sided board, with electronic components 3 provided on both opposite surfaces, and circuit board 2 is encapsulated in approximately the center of package 4. It is understood that circuit board 2 can also be a single-sided board. The number of circuit boards 2 can be one or multiple, with multiple circuit boards 2 electrically connected to each other.

[0085] like Figure 4 As shown, electronic component 3 may include one or more passive devices, including but not limited to resistors, capacitors, inductors, filters, couplers, etc. Electronic component 3 may also include one or more active devices, such as active chips, including but not limited to power chips, digital chips, radio frequency chips, etc. Electronic components 3 are generally packaged on circuit board 2, and the package 4 completely covers each electronic component 3.

[0086] like Figure 4As shown, the encapsulation body 4 is made of an insulating and thermally conductive encapsulation material, typically comprising an insulating resin and an insulating and thermally conductive filler. The insulating resin can be selected from resins such as epoxy resin, BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). The insulating and thermally conductive filler can be selected from particles such as nano-silica powder, nano-silicon nitride powder, nano-silicon carbide powder, nano-boron nitride powder, and nano-alumina powder. For example, the insulating and thermally conductive encapsulation material can be obtained by uniformly dispersing an epoxy resin matrix and a thermally conductive insulating filler. The epoxy resin matrix is ​​a modified epoxy resin treated with nano-silica. The thermally conductive insulating material is modified silicon carbide powder treated with a silane coupling agent. The encapsulation body 4, obtained by filling the thermally conductive and insulating material with modified nano-epoxy resin, possesses characteristics such as high thermal conductivity, good dielectric properties, low coefficient of thermal expansion, high strength, high hardness, and non-toxicity, making it suitable for encapsulating precision electronic components. It is understood that other materials possessing characteristics such as high thermal conductivity, good dielectric properties, low coefficient of thermal expansion, high strength, high hardness, and non-toxicity can also be used in the encapsulation device 100 provided in this application.

[0087] like Figure 4 As shown, the first heat dissipation component 5 is made of a thermally conductive material, which can be a metal, such as copper or aluminum, or a plastic with added thermally conductive filler. The thermally conductive filler can be graphene particles, metal particles, metal oxide particles, etc.

[0088] In this embodiment, the first heat dissipation component 5 can be welded or bonded to the inner surface of the first part 11 by a heat-conducting layer. By welding or bonding with a heat-conducting layer, the first heat dissipation component 5 is provided on the first part 11. The first heat dissipation component 5 extends into the interior of the package 4. Due to the high thermal conductivity of metal, the first heat dissipation component 5 can quickly conduct heat from inside the package 4 to the heat-conducting first part 11 of the outer shell 1, and then transfer it to the outside through the first part 11 of the outer shell 1, thereby achieving the purpose of rapid heat dissipation from inside the package 4.

[0089] In this embodiment, the first heat dissipation component 5 is in contact with the package body 4. To increase the contact area between the first heat dissipation component 5 and the package body 4, the first heat dissipation component 5 can be designed with different shapes, such as columnar, boss structure, block, sheet, trapezoidal structure, disk structure, etc. It is understood that the first heat dissipation component 5 can also be other irregular shapes. In this embodiment, the shape of the first heat dissipation component 5 is columnar. The number of first heat dissipation components 5 can be determined according to the volume of the actual package device 100 and the density of the internal electronic components 3, with the aim of achieving the best heat dissipation effect. For example, multiple first heat dissipation components 5 can be set in the location with a large number of electronic components 3, thereby quickly dissipating the accumulated heat.

[0090] like Figure 5 As shown, it is understood that in other embodiments, the surface of the first heat dissipation component 5 may also be provided with at least one second heat dissipation component 6. The second heat dissipation component 6 extends inside the package body 4, thereby increasing the contact area between the heat dissipation component and the package body 4 and improving the heat dissipation efficiency of the package device 100. In this embodiment, the second heat dissipation component 6 extends toward the electronic component 3, which facilitates the rapid removal of heat from the vicinity of the electronic component 3 (especially the electronic component 3 far from the first part 11) from the package device 100. It is understood that the second heat dissipation component 6 can be designed in different shapes, such as columnar, boss structure, block, sheet, trapezoidal structure, disk structure, etc., any shape that can increase its contact area with the package body 4.

[0091] In this embodiment, the extension distance of the end of the first heat dissipation component 5 away from the first part 11 within the package 4 can be determined based on the placement position of the electronic component 3. In this embodiment, the end of the first heat dissipation component 5 away from the first part 11 extends to the location within the package 4 where the electronic component 3 is encapsulated, especially at locations where multiple electronic components 3 are concentrated. Within the package 4, the electronic component 3 is the primary heat-generating element. Placing the first heat dissipation component 5 close to the electronic component 3 allows for timely and rapid heat dissipation, preventing heat accumulation near the electronic component 3 and ensuring its normal operation.

[0092] like Figure 4 As can be understood, in other embodiments, at least one end of the first heat dissipation component 5, away from the first portion 11, extends through the circuit board 2. When the electronic component 3 is disposed on the surface of the circuit board 2 away from the first portion 11, the first heat dissipation component 5 can be extended through the circuit board 2, thereby allowing the first heat dissipation component 5 to be as close as possible to the heat source, thus achieving the purpose of timely and rapid heat dissipation. Specifically, before the circuit board 2 is packaged, a window can be opened at a corresponding position on the circuit board 2, so that the first heat dissipation component 5 can extend from the side of the circuit board 2 near the first portion 11 through the circuit board 2 to the other side of the circuit board 2.

[0093] like Figure 6 As can be understood, in other embodiments, at least one end of the first heat dissipation component 5, away from the first part 11, is connected to the inner surface of the second part 12. This first heat dissipation component 5 can directly penetrate the package 4 to connect the first part 11 and the second part 12, allowing the heat accumulated in the second part 12 to be directly dissipated through the first part 11, eliminating the need for a heat dissipation device on the outer surface of the second part 12. Especially when the second part 12 is a surface with low thermal conductivity, the heat accumulated in the second part 12 is difficult to dissipate, easily causing heat accumulation and damage to the package device 100. The first heat dissipation component 5 can smoothly dissipate the heat accumulated near the second part 12, improving the overall heat dissipation efficiency of the package device 100 and enhancing the heat dissipation effect of different parts of the package device 100. Furthermore, it eliminates the need for a heat dissipation device on the outside of the second part 12, which is beneficial for the miniaturization and thinning of the package device 100. In this embodiment, the first heat dissipation component 5 connected to the second part 12 can be installed through the circuit board 2, i.e., a window is opened at a corresponding position on the circuit board 2, allowing the first heat dissipation component 5 to pass through the circuit board 2 and thus connect to the second part 12.

[0094] In the packaging device 100 provided in this embodiment, by adding the first heat dissipation component 5 inside the packaging device 100 and connecting the first heat dissipation component 5 to the first thermally conductive part 11 of the outer shell 1, the heat inside the package 4 (especially the heat at the heat accumulation location) can be quickly conducted to the first part 11, thereby achieving efficient heat dissipation inside the packaging device 100 and improving heat dissipation efficiency; the first heat dissipation component 5 is directly formed on the first part 11, which facilitates the assembly of the circuit board 2 and electronic components 3 inside the packaging device 100 and the filling of the package 4; moreover, the added first heat dissipation component 5 makes full use of the internal space of the packaging device 100, which is conducive to the miniaturization and thinning of the packaging device 100; in addition, the first heat dissipation component 5 can be directly formed on the first part 11 during the molding of the outer shell 1, which is simple in manufacturing process, low in cost, and easy to mass-produce.

[0095] like Figure 7 As shown, another embodiment of the packaging device 200 of this application differs from the packaging device 100 in that: the first heat dissipation component 5a has a two-phase structure, which includes a first cavity 51 and a first capillary structure 52 and a first working fluid 53 located within the first cavity 51. In this embodiment, the first capillary structure 52 is formed on the inner wall of the first cavity 51, and the first working fluid 53 is adsorbed within the first capillary structure 52.

[0096] like Figure 8As shown, the first cavity 51 is generally a hollow cuboid structure. The first cavity 51 includes a first wall 511, a second wall 512 opposite to the first wall 511, and a third wall 513 connecting the first wall 511 and the second wall 512 at both ends. A first capillary structure 52 is formed on the first wall 511, the second wall 512, and the third wall 513. The first capillary structure 52 is formed by adding copper powder into the first cavity 51 and then sintering it. It is understood that the method of forming the first capillary structure 52 is not limited to copper powder sintering; it can also be achieved by etching the inner surfaces of the first wall 511, the second wall 512, and the third wall 513 to form fine grooves. Because the first capillary structure 52 is a fine internal structure with an irregular arrangement, Figure 7 The first capillary structure 52 is shown only schematically. In this embodiment, the material of the first cavity 51 can be a thermally conductive material, specifically a metal (e.g., copper, aluminum, etc.) or a plastic with added thermally conductive filler, wherein the thermally conductive filler can be graphene particles, metal particles, metal oxide particles, etc. The first working fluid 53 can be a liquid or gaseous refrigerant, such as a coolant. It is understood that the specific dosage of the first working fluid 53 can be adjusted and designed according to the specific product. The first working fluid 53 is used to transport heat. If too much first working fluid 53 is placed in the first cavity 51, it will lead to an increase in thermal resistance, thereby reducing the heat dissipation effect. For example, the total amount of the first working fluid 53 in the first cavity 51 is usually a few grams. In one embodiment, the dosage of the first working fluid 53 in the first cavity 51 is such that the packaged device 100 is not working. It is understood that in other embodiments, the first cavity 51 can also be other shapes, such as cylindrical, trapezoidal, etc.

[0097] like Figure 7 and Figure 8As shown, when the packaged device 200 is in use, the circuit board 2 and electronic components 3 are the main heat sources. The end of the first cavity 51 near the first part 11 is defined as the condensation end, and the end away from the first part 11 or near the heat source is defined as the evaporation end. The first working fluid 53 (specifically, a coolant) is used to vaporize when heated at the evaporation end of the first cavity 51 and condense into a liquid at the condensation end of the first cavity 51. The first wall 511 is the condensation end away from the heat source, and the second wall 512 is the evaporation end near the heat source. The heat dissipation principle of the first heat dissipation component 5a is as follows: When the heat generated by the heat source is conducted to the second wall 512 (evaporation end) of the first cavity 51 through the thermally conductive encapsulation body 4, the first working fluid 53 (specifically coolant) located in the first cavity 51 is rapidly vaporized to form steam. Under the power of thermal diffusion, the steam flows to the first wall 511 (condensation end) of the first cavity 51 and condenses into liquid at the condensation end of the first cavity 51, releasing heat. The released heat is conducted out through the first part 11, achieving the effect of heat dissipation and cooling, thereby ensuring the relatively low temperature state of the condensation end of the first cavity 51. As the coolant at the evaporation end of the first cavity 51 evaporates less and less, more and more coolant condenses and accumulates at the condensation end of the first cavity 51. Due to capillary action, the coolant at the condensation end of the first cavity 51 will flow back to the evaporation end of the first cavity 51. Due to the capillary effect of the first capillary structure 52, regardless of how the packaged device 200 is placed, such as the first part 11 being on top and the second part 12 being on the bottom, the coolant at the condensation end of the first cavity 51 can be quickly returned to the evaporation end of the first cavity 51.

[0098] Understandably, the first heat dissipation component 5a can be installed through the circuit board 2 according to the actual layout of the heat source, or the first heat dissipation component 5a can be connected to the second part 12 to achieve timely and rapid heat dissipation of heat sources in different locations.

[0099] Compared to the aforementioned embodiments, the packaging device 200 of this embodiment, by configuring the first heat dissipation component 5a into the aforementioned gas-liquid two-phase structure, has high thermal conductivity, which enhances the heat dissipation from the inside of the package 4 in the packaging device 200. In particular, the internal heat of the packaging device 200 with high heat source density and small package volume can be quickly and timely dissipated, thereby improving heat dissipation efficiency. Moreover, the high thermal conductivity of the gas-liquid two-phase structure of the first heat dissipation component 5a ensures that the heat generated by the electronic component 3 (i.e., the heat source) is rapidly and evenly distributed throughout the first part 11 and then dissipated through the first part 11, greatly reducing the thermal resistance caused by heat accumulation.

[0100] Please see Figure 9The packaging device 300 of another embodiment of this application differs from the packaging device 100 in that: the first part 11a has a two-phase structure, which includes a second cavity 111 and a second capillary structure 112 and a second working fluid 113 located within the second cavity 111. The second capillary structure 112 is formed on the inner wall of the second cavity 111, and the second working fluid 113 is adsorbed within the second capillary structure 112. The material of the second cavity 111 can be a thermally conductive material, specifically a metal (e.g., copper, aluminum, etc.) or a plastic with added thermally conductive filler, wherein the thermally conductive filler can be graphene particles, metal particles, metal oxide particles, etc. The second working fluid 113 can be a liquid or gaseous refrigerant, such as a coolant.

[0101] like Figure 10 As shown, in this embodiment, the second cavity 111 is generally a hollow cuboid structure, including a fourth wall 1111, a fifth wall 1112 opposite to the fourth wall 1111, and a sixth wall 1113 connecting the fourth wall 1111 and the fifth wall 1112 at both ends. The second capillary structure 112 is formed on the fourth wall 1111, the fifth wall 1112, and the sixth wall 1113. The fourth wall 1111 is the condensation end away from the heat source, and the fifth wall 1112 is the evaporation end close to the heat source. Referring to the heat dissipation principle of the first heat dissipation component 5a in the aforementioned packaged device 200, the heat dissipation principle of the first part 11a in use of the packaged device 300 is as follows: When the heat generated by the heat source is conducted to the fifth wall 1112 of the second cavity 111 through the thermally conductive package body 4 and the first heat dissipation component 5, the second working fluid 113 located in the second cavity 111 (specifically adsorbed in the second capillary structure 112) is rapidly vaporized to form steam. Under the power of thermal diffusion, the steam flows to the fourth wall 1111 of the second cavity 111, condenses into liquid on the fourth wall 1111, and releases heat. The released heat is further conducted to the outside through the fourth wall 1111, achieving the effect of heat dissipation and cooling, thereby ensuring the relatively low temperature state of the fourth wall 1111. As the coolant located on the fifth wall 1112 evaporates less and less due to heat, more and more coolant condenses and accumulates on the fourth wall 1111. Due to the capillary action of the second capillary structure 112, the coolant on the fourth wall 1111 will flow back to the fifth wall 1112. Due to the capillary effect of the second capillary structure 112, regardless of the placement of the encapsulation device 300, such as the first part 11a on top and the second part 12 on the bottom, the coolant at the condensation end of the first cavity 51 can be rapidly returned to the evaporation end of the first cavity 51. It is understood that in other embodiments, the second cavity 111 can also be of other shapes, such as cylindrical, trapezoidal, etc.

[0102] Compared with the aforementioned embodiments, the packaging device 300 in this embodiment, by setting the first part 11a in the aforementioned two-phase structure, combined with the first heat dissipation component 5, can enhance the heat dissipation inside the package body 4 in the packaging device 300. In particular, the heat inside the packaging device 300 with high heat source density and small package volume can be quickly and timely dissipated, thereby improving heat dissipation efficiency. Moreover, the gas-liquid two-phase structure of the first part 11a has high thermal conductivity, and the heat generated by the electronic component 3 (i.e., the heat source) will be quickly and evenly distributed throughout the first part 11a, and then dissipated through the condensation end of the first part 11a, greatly reducing the thermal resistance caused by hot spots.

[0103] Please see Figure 11 In another embodiment of this application, the packaging device 400 differs from the packaging device 100 in that both the first portion 11a and the first heat dissipation component 5a are two-phase structures, and the cavities of the first portion 11a and the first heat dissipation component 5a may or may not be connected. In this embodiment, the cavities of the first portion 11a and the first heat dissipation component 5a are connected, that is, the first portion 11a and the first heat dissipation component 5a form a third cavity 71, which contains a third capillary structure 72 and a third working fluid 73. In this embodiment, the first portion 11a and the first heat dissipation component 5a are integrally formed, the third capillary structure 72 is located on the sidewall of the third cavity 71, and the third working fluid 73 is adsorbed within the third capillary structure 72.

[0104] Combination Figure 11 and Figure 12 The third cavity 71 includes an evaporation end 711 near the heat source and a condensation end 712 in contact with the outside. The heat generated by the heat source is conducted to the evaporation end 711 of the third cavity 71 through the thermally conductive encapsulation body 4. The third working fluid 73 adsorbed in the third capillary structure 72 is rapidly vaporized by heat to form steam. The steam flows to the condensation end 712 of the third cavity 71 under the power of thermal diffusion, condenses into liquid, and releases heat. The released heat is further conducted to the outside through the condensation end 712, achieving the effect of heat dissipation and cooling, thereby ensuring the relatively low temperature state of the condensation end 712. As the coolant at the evaporation end 711 evaporates less and less due to heat, more and more coolant condenses and accumulates at the condensation end 712. Due to the capillary effect of the third capillary structure 72, the coolant at the condensation end 712 will flow back to the evaporation end 711.

[0105] Compared with the previous embodiments, the encapsulation device 400 of this embodiment, by setting both the first part 11a and the first heat dissipation component 5a as a two-phase structure, increases the area of ​​the evaporation end 711 of the third cavity 71 when the first part 11a and the first heat dissipation component 5a are interconnected. This increases the contact area between the coolant circulating in the third cavity 71 and the heat source, enabling the heat to be carried away from a larger area simultaneously, thereby improving heat dissipation efficiency. Moreover, the gas-liquid two-phase structure of the first heat dissipation component 5a and the first part 11a has high thermal conductivity. The heat generated by the electronic component 3 (i.e., the heat source) is quickly and evenly distributed to the evaporation end 711 of the entire third cavity 71, and then dissipated through the condensation end 712, greatly reducing the thermal resistance caused by hot spots.

[0106] Please see Figure 13 and Figure 14 Another embodiment of the packaging device 500 differs from the packaging device 100 (or 200, 300, 400) in the foregoing embodiments in that: at least two surfaces of the housing 1 are provided with a thermally conductive first portion 11 (or 11a), and the positional relationship of the at least two surfaces with the thermally conductive first portion 11 (or 11a) can be interconnected, oppositely arranged, or spaced apart. When at least two surfaces are interconnected, the first portions 11 (or 11a) located thereon can be interconnected; when at least two surfaces are oppositely arranged or spaced apart, the first portions 11 (or 11a) located thereon are connected through at least one first heat dissipation component 5 (5a). The structure of the first portion 11 (or 11a) and the first heat dissipation component 5 (or 5a) is detailed above and will not be elaborated further here.

[0107] Please see Figure 13 and Figure 14 In this embodiment, the outer shell 1 has three adjacent surfaces with heat-conducting first portions 11a. Each first portion 11a is a two-phase structure, and the three two-phase first portions 11a are interconnected to form a fourth cavity 81. The fourth cavity 81 contains a fourth capillary structure 82 and a fourth working fluid 83. The three first portions 11a can be integrally formed during the molding process. In addition, in this embodiment, at least one first heat dissipation component 5a is provided on at least one first portion 11a, and the first heat dissipation component 5a is also interconnected with the corresponding first portion 11a to form a third cavity 71.

[0108] Compared with the previous embodiments, the packaging device 500 of this embodiment can further enhance the heat dissipation inside the packaging device 500 by adding a heat-conducting first part 11 (11a) to multiple surfaces of the outer shell 1, especially by adding a first part 11a of a two-phase heat dissipation component. In particular, the heat dissipation inside the packaging device 500 with high heat source density and small packaging volume can be quickly and timely dissipated, thereby improving heat dissipation efficiency.

[0109] Please see Figure 15 Another embodiment of the packaging device 600 of this application differs from the packaging device 100 (or 200, 300, 400, 500) in the aforementioned embodiments in that the second heat dissipation component 6 has a two-phase structure. In this embodiment, the specific structure of the second heat dissipation component 6 is roughly the same as that of the first heat dissipation component 5a. For details, please refer to the structure of the first heat dissipation component 5a in the aforementioned embodiments, which will not be elaborated here. In this embodiment, the second heat dissipation component 6 is connected to the first heat dissipation component 5a. By adding a two-phase structure second heat dissipation component 6 and simultaneously connecting the second heat dissipation component 6 to the first heat dissipation component 5a, the internal space of the package 4 is fully utilized, and the heat dissipation efficiency of the packaging device 600 is further enhanced.

[0110] This application monitors the temperature of packaged devices 100' and 300 during use, and obtains the temperatures of heat sources at different locations inside the packaged devices as shown in Table 1. It is understood that heat sources 1, 2, 3, etc., at different locations in Table 1 can be electronic components distributed at different locations inside the packaged devices.

[0111] Table 1

[0112] Devices Packaged device 100' Packaged device 300 Heat source 1 122.2℃ 114.4℃ Heat source 2 123.7℃ 112.6℃ Heat source 3 123.6℃ 110.4℃ Heat source 4 119.2℃ 110.7℃ Heat source 5 110.8℃ 108.7℃ Heat source 6 111.6℃ 108.6℃ Heat source 7 111.5℃ 108.8℃ Heat source 8 110℃ 105.2℃

[0113] As can be seen from Table 1, the temperature of each heat source in the packaged device 300 of this application is lower than that of the packaged device 100', and the heat dissipation capacity of the packaged device 300 of this application is improved by more than 30% compared with that of the packaged device 100'.

[0114] The packaging device 100 (or 200, 300, 400, 500, 600) provided in this application, while utilizing the original surface area of ​​the packaging device, adds a first heat dissipation component 5 (or 5a) inside the packaging device 100 (or 200, 300, 400, 500, 600). This enables rapid heat dissipation from inside the package 4 (especially heat accumulation points) to the first part 11 (11a), thereby achieving rapid heat dissipation inside the packaging device 100 (or 200, 300, 400, 500, 600) and improving heat dissipation efficiency; the first heat dissipation component... 5 (or 5a) is formed on the first portion 11 (or 11a), facilitating the encapsulation of the packaged device 100 (or 200, 300, 400, 500, 600). Furthermore, the added first heat dissipation component 5 (or 5a) fully utilizes the internal space of the packaged device 100 (or 200, 300, 400, 500, 600), contributing to the miniaturization and thinning of the packaged device 100 (or 200, 300, 400, 500, 600). The first heat dissipation component 5 (or 5a) is disposed on the first portion 11 (or 11a), resulting in a simple manufacturing process, low cost, and ease of mass production. Additionally, by further providing a second heat dissipation component 6 on the first heat dissipation component 5 (or 5a), the internal space of the package 4 can be fully utilized, increasing the contact area between the heat dissipation component and the package 4, further improving the heat dissipation effect.

[0115] See also Figure 16 The above embodiments of this application provide a packaging module 1000, which includes a packaging device 100 (or 200, 300, 400, 500, 600) and a heat dissipation device 1100. The heat dissipation device 1100 is disposed on the outer surface of the first part 11 (or 11a). By using the packaging device 100 (or 200, 300, 400, 500, 600) provided in the embodiments of this application, a heat dissipation device 1100 is disposed on the outer surface of the first part 11 (11a) to achieve efficient heat dissipation. While improving the heat dissipation effect of the packaging module 1000, it is also beneficial to reduce the size of the packaging module 1000.

[0116] In this embodiment, the encapsulation device 100 (or 200, 300, 400, 500, 600) can be connected to the heat dissipation device 1100 through a thermally conductive layer 1200. This thermally conductive layer 1200 can be a thermally conductive adhesive. Adding a thermally conductive layer 1200 between the encapsulation device 100 (or 200, 300, 400, 500, 600) and the heat dissipation device 1100 can improve thermal conductivity. It is understood that other methods can also be used to connect the encapsulation device 100 (or 200, 300, 400, 500, 600) and the heat dissipation device 1100, such as screw connections. To further improve thermal conductivity, a sealing gasket can be added between the encapsulation device 100 (or 200, 300, 400, 500, 600) and the heat dissipation device 1100.

[0117] like Figure 17 As shown, this application embodiment also provides an electronic device 2000 that applies the above-described packaging device 100 (or 200, 300, 400, 500, 600) or the above-described packaging module 1000, which includes a housing 2100 and the above-described packaging device 100 (or 200, 300, 400, 500, 600) or the above-described packaging module 1000 disposed in the housing 2100. Figure 17 The electronic device 2000 shown is a mobile phone, but is not limited to mobile phones. The electronic device 2000 can be any electronic device that needs to be equipped with the above-mentioned packaging device 100 (or 200, 300, 400, 500, 600) or the above-mentioned packaging module 1000.

[0118] In the electronic device 2000, the packaging device 100 (or 200, 300, 400, 500, 600) can play a good role in heat dissipation. Even when the power consumption of electronic components 3 is increased, there will be no problem of poor heat dissipation, thereby improving the service life of the electronic device 2000.

[0119] It should be noted that the above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features described in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A packaged device, characterized in that, include: Circuit board; Electronic components are electrically connected to the circuit board; A package for encapsulating the circuit board and the electronic components, the package being thermally conductive; A housing for accommodating the circuit board, the electronic components, and the package, wherein at least one side of the housing has a thermally conductive first portion, the circuit board is spaced apart from the first portion, and the housing further includes a second portion disposed opposite to the first portion; as well as At least one first heat dissipation component, each of the first heat dissipation components being connected to the first portion and embedded within the package, wherein at least one end of the first heat dissipation component away from the first portion passes through the circuit board and is connected to the second portion.

2. The packaged device according to claim 1, characterized in that, At least one of the first heat dissipation components includes a first cavity and a first capillary structure and a first working fluid located within the first cavity.

3. The packaged device according to claim 1, characterized in that, The first part includes a second cavity and a second capillary structure and a second working fluid located within the second cavity.

4. The packaging device according to claim 1, characterized in that, The first part and the first heat dissipation component form a third cavity, and the third cavity is provided with a third capillary structure and a third working fluid.

5. The packaged device according to any one of claims 1 to 4, characterized in that, The housing has at least two thermally conductive first portions on its surfaces, which are connected to each other, arranged opposite each other, or spaced apart from each other.

6. The packaged device according to claim 5, characterized in that, When the at least two surfaces are interconnected, the first portion on the at least two surfaces forms a fourth cavity, and the fourth cavity contains a fourth capillary structure and a fourth working fluid; or When the at least two surfaces are arranged opposite each other or spaced apart, the first portions on any two surfaces are connected by at least one of the first heat dissipation components.

7. The packaged device according to claim 1 or 2, characterized in that, At least one of the first heat dissipation components has at least one second heat dissipation component on its surface, and at least one of the second heat dissipation components extends inside the package.

8. The packaged device according to claim 7, characterized in that, At least one of the second heat dissipation components extends toward the electronic component.

9. A packaging module, characterized in that, It includes the packaging device as described in any one of claims 1 to 8 and a heat dissipation device located on the outer surface of the first portion.

10. An electronic device, characterized in that, It includes the packaging device as described in any one of claims 1 to 8, or the packaging module as described in claim 9.

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