Multiband fused antenna assembly
By designing an equivalent circuit of conductive material patches and insulating dielectric layers in a multi-band fusion antenna assembly, the radiation pattern distortion problem caused by coupling between antenna elements is solved, radiation efficiency is improved, and device miniaturization is promoted.
Patent Information
- Application Number
- CN202011233919.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-11-06
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2040-11-06
AI Technical Summary
In multi-band fusion antennas, the coupling between antenna elements of different frequency bands leads to radiation pattern distortion and affects radiation efficiency. In particular, when the spacing between antenna elements is reduced, the low-frequency antenna blocks the high-frequency antenna radiator, causing electromagnetic field scattering and reflection, which degrades the performance of the multi-frequency common aperture antenna array.
By designing first and second radiators in a multi-band fusion antenna assembly, an equivalent circuit is formed using conductive material patches and an insulating dielectric layer. This increases capacitance and inductance, filters out induced current, reduces coupling effects, and controls the coupling current by adjusting the area and position of the conductive material patches, thereby achieving signal decoupling.
It effectively reduces coupling between radiators of different frequency bands, reduces radiation pattern distortion, improves the radiation efficiency of multi-frequency common aperture antenna arrays, and promotes equipment miniaturization.
Smart Images

Figure CN114447605B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of communication, and in particular to a multi-band fusion antenna assembly. BACKGROUND
[0002] With the development of wireless communication, multiple frequency bands in second / third / fourth / fifth generation (2G / 3G / 4G / 5G) mobile communication technology coexist in a base station antenna system. From the perspective of product research and development and system installation, in order to save valuable space resources, reduce installation difficulty, and improve the compatibility and multifunctionality of the communication system, integrating different frequency bands of antennas together and designing a multi-band common aperture antenna array is an inevitable trend of development of base station antennas.
[0003] However, due to the limited size of the base station antenna array, when the distance between the antenna elements is reduced, the spatial distribution of the antenna elements of different frequency bands often overlaps and nests, and the coupling between the antenna elements will significantly affect the performance of the antenna array. The radiator of the large-size low-frequency antenna element located above will shield the radiator of the small-size high-frequency antenna element below (as shown in FIG. 1), so that when the radiator of the high-frequency antenna element works, the low-frequency antenna array will induce high-frequency current, thereby causing electromagnetic field scattering and reflection, which will cause the radiation pattern of the high-frequency antenna element to be distorted, thereby deteriorating the radiation efficiency of the entire multi-band common aperture antenna array. Figure 1 SUMMARY
[0004] Embodiments of the present application provide a radiator, a multi-band fusion antenna assembly, an antenna, and an electronic device, which can reduce the coupling of the radiation signals of the radiators of different frequency bands in the multi-band fusion antenna, reduce the distortion of the radiation pattern of the antenna element, and improve the radiation efficiency of the multi-band common aperture antenna array.
[0005] In a first aspect, a multi-band fusion antenna assembly is provided. The multi-band fusion antenna assembly includes a ground plate, a first radiator, and a second radiator. The first radiator is configured to radiate signals in a first frequency range, and the second radiator is configured to radiate signals in a second frequency range. The ground plate is configured to reflect part of the signals radiated by the first radiator and part of the signals radiated by the second radiator. The first radiator has a first height that is less than a second height of the second radiator, and the first height and the second height are heights in a direction perpendicular to the ground plate. The first radiator includes a first set of radiating arms and a first set of baluns. The first set of radiating arms is coupled to a first feed circuit corresponding to the first radiator through the first set of baluns. The second radiator includes a second set of radiating arms and a second set of baluns. The second set of radiating arms is coupled to a second feed circuit corresponding to the second radiator through the second set of baluns. The second set of radiating arms includes at least one second radiating arm. Each second radiating arm in the second set of radiating arms is provided with a plurality of conductive material patches. An insulating medium layer is provided between each conductive material patch and the second radiating arm. In this way, a first capacitance is formed between each conductive material patch and the second radiating arm, a second capacitance is formed between adjacent conductive material patches, the second radiating arm opposite to each conductive material patch is equivalent to a first inductance, and each conductive material patch is equivalent to a second inductance. The first capacitance and the second capacitance in the equivalent circuit formed in this way have a characteristic of being conductive to signals in the first frequency range, and the first inductance and the second inductance have a characteristic of being high-resistance to signals in the first frequency range. This can effectively filter out induced current of signals in the first frequency range coupled on the second radiator when the first radiator is working, that is, the induced current of signals in the first frequency range formed on the second radiator has a decoupling effect. Therefore, the influence of the second radiator on the radiation pattern of the first radiator can be reduced, the distortion of the radiation pattern of the antenna element can be reduced, and the radiation efficiency of the multi-band common-aperture antenna array can be improved. In addition, according to the working frequency of the first radiator, the values of the first capacitance, the second capacitance, the first inductance, and the second inductance can be adjusted by changing the area (for example, the shape) and the position (for example, the period of the distance between the conductive material patches) of the conductive material patches. This can also achieve control of the coupling current generated on the second radiator when the first radiator is working.
[0006] In a possible implementation, the plurality of conductive material patches are distributed along a direction in which current flows through the second radiating arm in which the plurality of conductive material patches are located. Since the radiation pattern of the first radiating arm is mainly related to the induced current of signals in the first frequency range coupled to the second radiating arm, it is necessary to decouple the signals of the first radiating arm coupled to the second radiating arm in the direction in which the current flows through the second radiating arm. Therefore, the plurality of conductive material patches are distributed along the direction in which the current flows through the second radiating arm in which the plurality of conductive material patches are located.
[0007] In a possible implementation, at least one first conductive via is arranged in the insulating dielectric layer, and each first conductive via is connected with one conductive material patch. Since the added first conductive via is equivalent to an increase in the area of the conductive material patch, the area of the conductive material patch facing the second radiating arm can be increased, and the inductive area between the conductive material patches can be increased, which is equivalent to an increase in the capacitance of the first capacitor and the second capacitor. Due to the conductive characteristic of the first capacitor to signals in the first frequency range, it is ensured that signals coupled from the first radiating arm to the second radiating arm can be fully coupled to the conductive material patch. Due to the conductive characteristic of the second capacitor to signals in the first frequency range, it is ensured that signals coupled from the first radiating arm to the second radiating arm can be transmitted between the conductive material patches.
[0008] In a possible implementation, the at least one first conductive via is arranged on both sides of the second radiating arm where the conductive material patch is located, and arranged in sequence along the direction in which the current flows through the second radiating arm where the conductive material patch is located. In this way, since the at least one first conductive via is mainly arranged on both sides of the second radiating arm in sequence along the direction in which the current flows through the second radiating arm where the conductive material patch is located, the capacitive coupling between the second radiating arm and the conductive material patch can be mainly improved, that is, the capacitance of the first capacitor can be mainly increased, and it is ensured that signals coupled from the first radiating arm to the second radiating arm can be fully coupled to the conductive material patch.
[0009] In a possible implementation, the at least one first conductive via is arranged at both ends of the conductive material patch in the direction in which the current flows through the second radiating arm where the conductive material patch is located, and arranged in sequence along a direction perpendicular to the direction in which the current flows through the second radiating arm where the conductive material patch is located. In this way, since the at least one first conductive via is mainly arranged at both ends of the conductive material patch in sequence along a direction perpendicular to the direction in which the current flows through the second radiating arm where the conductive material patch is located, the at least one first conductive via added is equivalent to an increase in the area facing between the conductive material patch and the conductive material patch, which is equivalent to an increase in the capacitance of the second capacitor, and thus the capacitive coupling between the conductive material patches can be mainly improved. It is ensured that signals coupled from the first radiating arm to the second radiating arm can be transmitted between the conductive material patches.
[0010] In a possible implementation, any of the plurality of conductive material patches is in a sheet structure or a bent strip structure. For example, the shape of the conductive material patch can be a snake shape. In this way, the development length of the conductive material patch can be increased, which is equivalent to an increase in the conduction length of the first inductor, thereby increasing the impedance to signals in the first frequency range.
[0011] In a possible implementation, the two adjacent conductive material patches are in a sheet structure, and the two adjacent conductive material patches are in an interdigital structure at the two adjacent ends. In this way, the capacitive coupling between the conductive material patches is increased, which is equivalent to increasing the capacitance of the second capacitor, and ensures that the signal coupled from the first radiating arm to the second radiating arm can be transmitted between the conductive material patches.
[0012] In a possible implementation, at least one second conductive via is arranged in the insulating medium layer, one end of each second conductive via is connected to a conductive material patch, and the other end of each second conductive via is connected to the second radiating arm. In this way, an inductance is added between the conductive material patch and the second radiating arm where the conductive material patch is located, and the filtering characteristics of the equivalent circuit are improved.
[0013] In a possible implementation, on any second radiating arm in the second radiating arm group, the direction of the current flowing through the second radiating arm is distributed in at least two rows of conductive material patches. In this way, the flexibility of controlling the coupled current generated on the second radiating body when the first radiating body is working can be increased.
[0014] In a possible implementation, the horizontal and / or vertical center distance between the first radiating arm group and the second radiating arm group is less than or equal to λ, where λ is the wavelength of the center frequency of the first frequency range. Generally, when the horizontal and / or vertical center distance between the first radiating arm group and the second radiating arm group is less than or equal to λ, the second radiating body will affect the radiation pattern of the first radiating body, and when the scheme provided in the embodiments of the present application is adopted, the influence of the second radiating body on the radiation pattern of the first radiating body can be minimized, so that the distance between the first radiating arm group and the second radiating arm group can be smaller, and the structure of the two is more compact, thereby facilitating the miniaturization of the device.
[0015] In a possible implementation, the maximum size of the path through which the current flows in each conductive material patch is mλ, where λ is the wavelength of the center frequency of the first frequency range, and m≤0.15. In this way, the signal of the first radiating arm coupled by the second radiating arm can be effectively coupled to the conductive material patch.
[0016] In a possible implementation, a plurality of conductive material patches are arranged on one side of each second radiating arm perpendicular to the ground plate. Two arrangement modes of the conductive material patches are provided. For example, the plurality of conductive material patches are arranged on the side of each second radiating arm close to the ground plate, or the plurality of conductive material patches are arranged on the side of each second radiating arm away from the ground plate.
[0017] In a possible implementation, the second radiator is single-polarized or dual-polarized. The single-polarization can be polarization in any direction, for example, polarization perpendicular to the ground or polarization horizontal to the ground; the dual-polarization can be one polarization perpendicular to the ground or one polarization horizontal to the ground, or a pair of intersecting ±45° polarizations. In this scheme, different polarization modes of the second radiator are provided, enriching the polarization modes of the second radiator. In addition, the dual-polarization form can be more conducive to reducing polarization loss in a complex environment.
[0018] In a possible implementation, the polarization mode of the second radiator includes linear polarization, circular polarization, and elliptical polarization. Exemplarily, the linear polarization includes horizontal polarization and vertical polarization, the elliptical polarization includes left-handed elliptical polarization and right-handed elliptical polarization, and the circular polarization includes left-handed circular polarization and right-handed circular polarization. In this scheme, different polarization modes of the second radiator are provided, enriching the polarization modes of the second radiator, so that the intensity of the radiated signal can be adapted to different environments.
[0019] In a possible implementation, the maximum frequency of the first frequency range is higher than the maximum frequency of the second frequency range, and the minimum frequency of the first frequency range is higher than the minimum frequency of the second frequency range. Because the sizes of the radiators in different frequency ranges are different, for example, the radiator radiating a signal in a higher frequency range is usually smaller in size, and the radiator radiating a signal in a lower frequency range is usually larger in size. When multiple radiators of large size are arranged on the antenna, the space between the radiators is large, so the radiators of large size can be integrated with the radiators of small size. In the integration, the radiators of large size can be arranged above the radiators of small size, so that the radiators of small size are arranged in the space between the radiators of large size, realizing the multi-band fusion antenna.
[0020] In a second aspect, a radiator for a multi-band fusion antenna is provided. The radiator is arranged on a ground plate of the multi-band fusion antenna. The radiator includes a set of radiating arms and a set of baluns. The set of radiating arms is coupled to a feeding circuit corresponding to the radiator through the set of baluns. The set of radiating arms includes at least one radiating arm. Each of the radiating arms in the set of radiating arms is provided with a plurality of conductive material patches. An insulating medium layer is arranged between the plurality of conductive material patches and each of the radiating arms.
[0021] In a possible implementation, the plurality of conductive material patches are distributed along the direction in which current flows through the radiating arm on which the plurality of conductive material patches are located.
[0022] In a possible implementation, at least one first conductive via is arranged in the insulating medium layer. Each of the first conductive vias is connected to one of the conductive material patches.
[0023] In a possible implementation, the at least one first conductive via is located on both sides of the radiating arm where the conductive material patch is located, and is arranged in sequence along a direction in which a current flows through the radiating arm where the conductive material patch is located.
[0024] In a possible implementation, the at least one first conductive via is located at both ends of the conductive material patch in a direction in which a current flows through the radiating arm where the conductive material patch is located, and is arranged in sequence along a direction perpendicular to the direction in which the current flows through the radiating arm where the conductive material patch is located.
[0025] In a possible implementation, at least one second conductive via is arranged in the insulating medium layer, one end of each of the second conductive vias is connected to one of the conductive material patches, and the other end of each of the second conductive vias is connected to the radiating arm where the conductive material patch is located.
[0026] In a possible implementation, any of the conductive material patches in the plurality of conductive material patches is in a sheet structure or a bent strip structure.
[0027] In a possible implementation, when two adjacent conductive material patches are in a sheet structure, the two adjacent conductive material patches are in an interdigital structure at two adjacent ends.
[0028] In a possible implementation, on any of the radiating arms in the group of radiating arms, at least two rows of the conductive material patches are distributed in a direction in which a current flows through any of the radiating arms.
[0029] In a possible implementation, a plurality of conductive material patches are arranged on one side of each radiating arm perpendicular to the ground plate. Two arrangement modes of the conductive material patches are provided. For example, the plurality of conductive material patches are arranged on one side of each radiating arm close to the ground plate, or the plurality of conductive material patches are arranged on one side of each radiating arm away from the ground plate.
[0030] In a third aspect, an antenna is provided, including the multi-band fusion antenna assembly in any of the possible implementation modes of the first aspect and at least two groups of feeding circuits, wherein a first radiator of the multi-band fusion antenna assembly is coupled to a first feeding circuit corresponding to the first radiator; and a second radiator of the multi-band fusion antenna assembly is coupled to a second feeding circuit corresponding to the second radiator.
[0031] In a fourth aspect, an electronic device is provided, including a radio frequency circuit and an antenna as described in the third aspect connected to the radio frequency circuit, and the radio frequency circuit is configured to send a signal processed by the radio frequency circuit through the antenna.
[0032] The technical effects brought by the possible implementation manners of any one of the second aspect to the fourth aspect can refer to the technical effects brought by the different implementation manners of the first aspect, which will not be described here again. BRIEF DESCRIPTION OF DRAWINGS
[0033] Figure 1 A radiation pattern diagram of an antenna provided for an embodiment of the present application;
[0034] Figure 2 A structure diagram of a base station of a BBU-AAU architecture provided for an embodiment of the present application;
[0035] Figure 3 A structure diagram of a base station of a BBU-AAU architecture provided for another embodiment of the present application;
[0036] Figure 4 A structure diagram of a multi-band fusion antenna assembly provided for an embodiment of the present application;
[0037] Figure 5 A structure diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0038] Figure 6 A structure diagram of a multi-band fusion antenna assembly provided for still another embodiment of the present application;
[0039] Figure 7 A structure diagram of a multi-band fusion antenna assembly provided for still another embodiment of the present application;
[0040] Figure 8 A structure diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0041] Figure 9 A structure diagram of a multi-band fusion antenna assembly provided for still another embodiment of the present application;
[0042] Figure 10 A structure diagram of a multi-band fusion antenna assembly provided for still another embodiment of the present application;
[0043] Figure 11 A structure diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0044] Figure 12 A partial structure diagram of a second radiator provided for an embodiment of the present application;
[0045] Figure 13 A partial structure diagram of a second radiator provided for another embodiment of the present application;
[0046] Figure 14 A partial structure schematic diagram of a second radiator provided for another embodiment of the present application;
[0047] Figure 15 A partial structure schematic diagram of a second radiator provided for another embodiment of the present application;
[0048] Figure 16 A partial structure schematic diagram of a second radiator provided for another embodiment of the present application;
[0049] Figure 17 A partial structure schematic diagram of a second radiator provided for another embodiment of the present application;
[0050] Figure 18 A partial structure schematic diagram of a multi-band fusion antenna assembly provided for an embodiment of the present application;
[0051] Figure 19 A partial structure schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0052] Figure 20 An equivalent circuit schematic diagram of a multi-band fusion antenna assembly provided for an embodiment of the present application;
[0053] Figure 21 A partial structure schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0054] Figure 22 A partial structure schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0055] Figure 23 A partial structure schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0056] Figure 24 A partial structure schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0057] Figure 25 An equivalent circuit schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0058] Figure 26 A partial structure schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0059] Figure 27 An equivalent circuit schematic diagram of a multi-band fusion antenna assembly provided for another embodiment of the present application;
[0060] Figure 28 A normalized gain simulation diagram of RCS of a second radiator of a multi-band fusion antenna provided for an embodiment of the present application;
[0061] Figure 29 A simulation diagram of an antenna pattern of a multi-band fusion antenna provided for an embodiment of the present application;
[0062] Figure 30 A diagram of actual gain curves of the multi-band fusion antenna under each antenna direction provided for an embodiment of the present application;
[0063] Figure 31 A diagram of peak gain curves of the multi-band fusion antenna under each operating frequency provided for an embodiment of the present application. DETAILED DESCRIPTION
[0064] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.
[0065] Antenna array: two or more single antennas working at the same frequency are arranged according to certain requirements to form an array through feeding and spatial arrangement, also called antenna array.
[0066] Antenna array area: the area of the antenna array.
[0067] Antenna element: the antenna element is the most basic unit of the antenna, which has the functions of guiding and amplifying electromagnetic waves. Usually, the antenna element is a conductor. When an alternating current flows through the antenna element, electromagnetic wave radiation can occur, and the radiation capacity is related to the structure of the antenna element. In the embodiments of the present application, the radiating arm can be used as an antenna element.
[0068] Scattering: scattering is a phenomenon that when the surface curvature of an object irradiated by a projected wave is large or even not smooth, the secondary radiation wave of the object is diffused and distributed in a certain rule in the angle domain.
[0069] Pattern: refers to the pattern of the relative field strength (normalized modulus) of the radiation field at a certain distance from the antenna, which is usually represented by two mutually perpendicular plane patterns in the maximum radiation direction of the antenna.
[0070] Antenna bandwidth: the frequency range within which the antenna electrical parameters are within the allowable range, wherein the center frequency is the midpoint of the frequency of the antenna bandwidth.
[0071] Polarization: a parameter describing the spatial direction of the antenna radiated electromagnetic wave vector. Since the electric field and the magnetic field have a constant relationship, the spatial direction of the electric field vector is generally used as the polarization direction of the antenna radiated electromagnetic wave.
[0072] Wavelength: The distance a wave travels in one vibration period, usually represented by λ.
[0073] The electronic device provided in the embodiments of the present application may be a multi-band fusion base station, or other communication equipment with similar functions. Taking a multi-band fusion base station as an example, the base station can be divided into different architectures such as baseband unit (BBU)-active antenna unit (AAU), centralized unit-distributed unit (CU-DU)-AAU, BBU-remote radio unit (RRU)-antenna, CU-DU-RRU-Antenna, and integrated base station (gNB). Taking a base station with a BBU-AAU architecture as an example, refer to Figure 2 As shown, the base station includes a BBU 11 and an AAU 12; wherein the BBU 11 transmits the generated baseband digital signal through the AAU 12. Figure 3 As shown, AAU12 includes n (an integer greater than or equal to 1) signal transmission channels, each signal transmission channel includes a digital to analog converter 121 (DAC, digital to analog converter), a radio frequency circuit 122 and an antenna 123, wherein the digital to analog converter 121 is used to convert the baseband digital signal output by the baseband processing unit into an analog signal, and the radio frequency circuit 122 is used to convert the analog signal into a low-power radio frequency signal and then output it to the antenna 123 for outward radiation. The radio frequency circuit 122 may include: a power amplifier (PA) and a filter and other circuits, wherein the PA is used to amplify the low-power radio frequency signal, and the filter is used to filter the radio frequency signal. It can be understood that the embodiments of the present application are not limited to the above Figure 2 、 Figure 3 The base station shown, and any of the above-mentioned electronic devices that require an antenna to radiate radio frequency signals outward belong to the application scenarios of the embodiments of the present application.
[0074] Embodiments of the present application provide an antenna, comprising a multi-band fusion antenna assembly and at least two groups of feeding circuits, wherein the multi-band fusion antenna assembly comprises at least a first radiator and a second radiator, which can be considered as antenna dipoles, and are respectively used for radiating signals of different frequency bands. The first radiator and the second radiator correspond to the first feeding circuit and the second feeding circuit respectively, the first radiator is coupled to the first feeding circuit, and the second radiator is coupled to the second feeding circuit. The multi-band fusion antenna assembly in the present application is described in detail below.
[0075] Referring to Figure 4 , Figure 5 , Figure 6 It can be seen from FIG. 1 that the multi-band fusion antenna assembly 100 provided by the embodiments of the present application can comprise one or more first radiators 102, and can comprise one or more second radiators 103. For the convenience of illustration, in Figures 4-6 FIG. 1, the minimum number of radiators required to be included in the multi-band fusion antenna assembly 100 is represented by the first radiator 102 (which is shown as a "T" shape in the figure but is relatively low) and the second radiator 103 (which is shown as a "T" shape in the figure but is relatively high). For example, Figure 7 FIG. 2 shows that the multi-band fusion antenna assembly 100 comprises four first radiators (102-1, 102-2, 102-3, 102-4) and one second radiator 103; Figure 8 FIG. 3 shows that the multi-band fusion antenna assembly 100 comprises a plurality of first radiators (which are represented by, for example, 102-1, 102-n in the figure, and other similar ones are not labeled) and two second radiators (103-1, 103-2). Meanwhile, as shown in Figure 4 FIG. 4, the multi-band fusion antenna assembly 100 further comprises a ground plate 101, and the two radiators 102, 103 are respectively arranged on the ground plate 101. In the present application, the ground plate 101 can also be referred to as a reflecting plate, which plays a role of grounding and also reflects part of the radiated signals of the first radiator and part of the radiated signals of the second radiator. The larger the area of the ground plate is, the more radiated signals can be reflected.
[0076] In the embodiments of the present application, the first radiator 102 is configured to radiate signals in a first frequency range, and the second radiator 103 is configured to radiate signals in a second frequency range; due to the different sizes of the radiators in different frequency ranges, for example, the radiator radiating signals in a higher frequency range is usually smaller in size, and the radiator radiating signals in a lower frequency range is usually larger in size. When multiple radiators of large size are arranged on an antenna, the space between the radiators is large, and therefore the radiators of large size can be integrated with the radiators of small size. In the integration, the radiators of large size can be arranged above the radiators of small size, so that the radiators of small size are arranged in the space between the radiators of large size, thereby realizing a multi-band integrated antenna. For example, as shown in FIG. 1, the first radiator 102 is arranged above the second radiator 103, and the second radiator 103 is arranged in the space between the first radiators 102. Figure 4 As shown in FIG. 1, the first height H1 of the first radiator 102 is smaller than the second height H2 of the second radiator 103, where the first height H1 and the second height H2 are the heights in the direction perpendicular to the ground plate 101. In this way, the space can be greatly saved, which is beneficial to the miniaturization of the device.
[0077] The first radiator 102 includes a first radiator arm group and a first balun group. The first radiator arm group includes at least one (i.e., one or more) first radiator arm. The first balun group includes at least one first balun. The first radiator arm group is coupled to the first feeding circuit 104-1 corresponding to the first radiator through the first balun group. For example, as shown in FIG. 1, the first radiator arm 1021 is coupled to the first feeding circuit 104-1 through the first balun 1022. Figure 4 The second radiator 103 includes a second radiator arm group and a second balun group. The second radiator arm group includes at least one second radiator arm. The second balun group includes at least one second balun. The second radiator arm group is coupled to the second feeding circuit 104-2 corresponding to the second radiator through the second balun group. For example, as shown in FIG. 1, the second radiator arm 1031 is coupled to the second feeding circuit 104-2 through the second balun 1034. Figure 4 The second radiator 103 includes a second radiator arm group and a second balun group. The second radiator arm group includes at least one second radiator arm. The second balun group includes at least one second balun. The second radiator arm group is coupled to the second feeding circuit 104-2 corresponding to the second radiator through the second balun group. For example, as shown in FIG. 1, the second radiator arm 1031 is coupled to the second feeding circuit 104-2 through the second balun 1034.
[0078] In an antenna, the number of radiator arms and baluns is not limited. For example, as shown in FIG. 1, the first radiator 102 includes two first radiator arms 1021 and two first baluns 1022, and the second radiator 103 includes two second radiator arms 1031 and two second baluns 1034. Figures 4-6In the embodiment, the second radiating arm group includes four second radiating arms (1031-1, 1031-2, 1031-3, 1031-4), the second balun group includes two second baluns (1034-1, 1034-2), the second radiating arms 1031-1, 1031-3 are coupled to the second feeding circuit 104-2 through the second balun 1034-1; the second radiating arms 1031-2, 1031-4 are coupled to the second feeding circuit 104-2 through the second balun 1034-2. The structure of the first radiating arm group can refer to the prior art, for example Figure 4 , Figure 8 , the first radiating arm group includes four first radiating arms (1021-1, 1021-2, 1021-3, 1021-4), wherein the four first radiating arms constitute Figure 8 the "X" structure shown in the embodiment), the first balun group includes two first baluns (1022), the first radiating arms (1021-1, 1021-3) are coupled to the first feeding circuit 104-1 through one second balun 1022; the first radiating arms (1021-2, 1021-4) are coupled to the first feeding circuit 104-1 through another second balun 1022.
[0079] wherein, Figure 4 It is also shown that the multi-frequency fusion antenna is connected with Figure 3 the AAU in Figure 4 As shown in the figure, the radio frequency circuit 122-1 is coupled to the first feeding circuit 104-1, so that the radio frequency signal (signal of the first frequency range) output by the radio frequency circuit 122-1 can be output to the first balun through the port provided by the first feeding circuit 104-1, and then radiated out through the first radiating arm group. The radio frequency circuit 122-2 is coupled to the second feeding circuit 104-2, so that the radio frequency signal (signal of the second frequency range) output by the radio frequency circuit 122-1 can be output to the second balun through the port provided by the second feeding circuit 104-2, and then radiated out through the second radiating arm group.
[0080] wherein, in the two types of radiators described above, referring to Figure 7 and Figure 8 As shown in the figure, all the first radiators (102-1, …, 102-n, for simplicity, the labels of some first radiators are not shown in the figure) are coupled to the first feeding circuit 104-1 through the first balun 1022, and all the second radiators (103-1, …, 103-n, for simplicity, the labels of some second radiators are not shown in the figure) are coupled to the second feeding circuit 104-2 through the second balun 1034. Figure 8The first radiators (omitted in the figure) can share a first feeding circuit 104-1, that is, all the first radiators are coupled to a corresponding first feeding circuit, or each first radiator (102-1, ... 102-n) can use a first feeding circuit respectively, for example, each first radiator (102-1, ... 102-n) is coupled to a first feeding circuit respectively. All the second radiators (103-1, 103-2) can share a second feeding circuit, that is, all the second radiators (103-1, 103-2) are coupled to a corresponding first feeding circuit, or each second radiator (103-1, 103-2) can be coupled to a second feeding circuit respectively. In addition, for the first radiator or the second radiator, the balun and the feeding circuit can be coupled via a coaxial line or a microstrip line.
[0081] like Figure 9 As shown, it is a schematic diagram of coupling the balun and the feeding circuit using a coaxial line. In this method, the balun a is connected to one end of the coaxial line b through the first interface, and the feeding circuit c is connected to the other end of the coaxial line b through the second interface; when the balun and the feeding circuit are connected using a microstrip line.
[0082] like Figure 10 Figure 2 shows a schematic diagram of a balun and a feed circuit coupled using a microstrip line. In this method, the microstrip line is typically provided on a printed circuit board (PCB). Balun a is typically connected to microstrip line d on the PCB. A first connector is provided on the PCB for inputting or outputting signals on microstrip line d. Feed circuit c is connected to the first connector on the PCB via a second connector. Balun a can be the first balun 1022 or the second balun 1034, and feed circuit c can be the first feed circuit 104-1 or the second feed circuit 104-2.
[0083] It is understood that the connection method between the first balun and the first feed circuit and the connection method between the second balun and the second feed circuit can be the same or different. The feed circuit provided in the embodiments of the present application can be in the form of a PCB, wherein the PCB is provided with conductive traces. To realize the function of the feed circuit, the feed circuit can specifically include components such as a power divider and a phase shifter.
[0084] In the present application, each second radiation arm in the second radiation arm group (eg Figure 4 A plurality of conductive material patches 1032 are provided on the second radiation arm 1031 in the embodiment, wherein an insulating dielectric layer 1033 is provided between the plurality of conductive material patches 1032 and the second radiation arm 1031.
[0085] The conductive material patch 1032 can be based on various conductive materials, and generally uses various metals with high conductivity, such as copper. In one implementation,Figure 11 As shown, the conductive material patches 1032 are generally in a sheet structure, such as a rectangular metal strip line. The conductive material patches 1032 are parallel to the second radiating arms 1031 (including 1031-1, 1031-2, 1031-3, 1031-4) and arranged in a row, and each conductive material patch 1032 is equivalent to an inductor. The conductive material patches 1032 and the radiating arms 1031 of the second radiator 103 can be respectively printed on the upper and lower surfaces of the PCB board, i.e., the PCB board is used as an insulating dielectric layer 1033, and the conductive material patches 1032 and the second radiating arms 1031 of the second radiator 103 form a coupling capacitor therebetween. The distance between the conductive material patches 1032 arranged on the second radiating arms 1031 can be periodic or aperiodic, and a coupling capacitor is formed between adjacent conductive material patches 1031.
[0086] In the embodiments of the present application, as shown in Figure 5 , the plurality of conductive material patches 1032 are distributed along the direction of the current flowing through the second radiating arms 1031 where the plurality of conductive material patches 1032 are located, wherein Figure 5 the direction of the current I is shown in Figure 4 , and since the radio frequency signal is usually an alternating current signal, the direction of the current on the second radiating arm 1031-1 is usually in two opposite directions. Among them, the plurality of conductive material patches 1032 are arranged on one side of each second radiating arm 1033 perpendicular to the direction of the ground plate 101. For example Figure 11 , the conductive material patches 1032 are arranged above (or front) the second radiating arms 1033, and can also be arranged below or behind the second radiating arms 1033 (as shown in Figure 11 ). In some examples, the conductive material patches 1032 can also extend to both sides of the second radiating arms 1031 perpendicular to the direction of the current I in the second radiating arms 1031. As shown in Figure 12 , the width W2 of the second radiating arms 1031 can be greater than the width W1 of the conductive material patches 1032, or the width W2 of the second radiating arms 1031 can also be less than or equal to the width W1 of the conductive material patches 1032. In combination with Figure 13 , Figure 14 , Figure 12 , the top view structural schematic diagram of the local structure of the second radiator is shown, Figure 13 , the structural view of the structure shown in Figure 12 along the A direction, Figure 14 , the structural view of the structure shown in Figure 12 along the B direction. The conductive material patches 1032 are arranged on one side of the second radiating arms 1031 close to the ground plate 102 Figure 4 .
[0087] In combination with Figure 15 ,Figure 16 、 Figure 17 As shown, Figure 15 is a schematic diagram of a top view of the local structure of the second radiator. Figure 16 For Figure 15 The structure shown is a structural view along the A direction, Figure 17 For Figure 15 The conductive material patch 1032 is arranged on the second radiation arm 1031 away from the ground plane 102 ( Figure 4 ) side.
[0088] In addition, if Figure 11 As shown, two adjacent conductive material patches are sheet-like structures. In order to increase the capacitive coupling between the conductive material patches 1032, as shown in FIG. Figure 18 As shown, two adjacent conductive material patches 1032-1 and 1032-2 have interdigital structures 1036 (or interdigital structures) at their adjacent ends. This effectively increases the area of facing conductive material patches 1032-1 and 1032-2, and thus increases the capacitance between the two conductive material patches 1032-1 and 1032-2, ensuring that the signal coupled from the first radiator to the second radiator can be transmitted between conductive material patches 1032-1 and 1032-2.
[0089] In addition, in order to increase the inductance of the conductive material patch 1032 to increase the impedance of the signal coupled from the first radiator to the second radiator, refer to Figure 19 As shown, any conductive material patch 1032 among the multiple conductive material patches is a bent strip structure, which can increase the unfolded length of the conductive material patch 1032, which is equivalent to increasing the conduction length of the current in the conductive material patch 1032, thereby increasing the impedance to high-frequency signals. Figure 19 As shown, the conductive material patch 1032 may be serpentine in shape.
[0090] Thus, for each conductive material patch 1032, a first capacitor C1 is formed between it and the second radiation arm 1031, and a second capacitor C2 is formed between adjacent conductive material patches 1032. The second radiation arm 1031 opposite to each conductive material patch 1032 is equivalent to the first inductor L1, and each conductive material patch 1032 itself is equivalent to the second inductor L2, thus forming the following: Figure 20In the equivalent circuit shown, capacitors C1 and C2 in the equivalent circuit have the characteristic of conducting signals in the first frequency range, and inductors L1 and L2 have a high impedance effect on signals in the first frequency range. Therefore, the equivalent circuit formed by C1, C2, L1, and L2 can effectively filter out the induced current of the first frequency range signal coupled on the second radiator when the first radiator is working, that is, it has a decoupling effect on the induced current formed on the second radiator by the signal in the first frequency range, thereby reducing the impact of the second radiator on the radiation pattern of the first radiator, reducing the radiation pattern distortion of the antenna element, and improving the radiation efficiency of the multi-frequency co-aperture antenna array. In addition, according to the operating frequency of the first radiator, by changing the area (e.g., shape) and position (e.g., the period of the distance between the conductive material patches 1032) of the conductive material patch 1032 to adjust the values of L1, L2, C1, and C2, it is also possible to control the coupling current generated on the second radiator when the first radiator is working.
[0091] In the embodiment of the present application, the maximum frequency of the first frequency range is higher than the maximum frequency of the second frequency range, and the minimum frequency of the first frequency range is higher than the minimum frequency of the second frequency range. In this way, since the first radiator 102 is used to radiate signals in the first frequency range and the second radiator 103 is used to radiate signals in the second frequency range, the size of the first radiator 102 is usually smaller and the size of the second radiator 103 is larger. Therefore, the first radiator 102 can be set below the second radiator 103. That is, the length of the first balun 1022 connected to the first radiating arm 1021 is less than the length of the second balun 1034 connected to the second radiating arm 1031. In some embodiments, as Figure 8 As shown, in the first radiator 102 and the second radiator 103, the center horizontal distance L and / or the center vertical distance H of the first radiating arm group and the second radiating arm group are less than or equal to λ, where λ is the center frequency wavelength of the first frequency range. Figure 5 、 Figure 6 、 Figure 8For example, the first radiation arm group includes four first radiation arms (1021-1, 1021-2, 1021-3, 1021-4), the second radiation arm group includes four second radiation arms (1031-1, 1031-2, 1031-3, 1031-4), the center of the first radiation arm group is the geometric center of the four first radiation arms (1021-1, 1021-2, 1021-3, 1021-4), and the center of the second radiation arm group is the geometric center of the four second radiation arms (1031-1, 1031-2, 1031-3, 1031-4). Generally, when the horizontal distance and / or the vertical distance between the centers of the first radiation arm group and the second radiation arm group is less than or equal to λ, the second radiator will affect the radiation pattern of the first radiator. Therefore, in the prior art, to avoid the second radiator affecting the radiation pattern of the first radiator, the horizontal distance and / or the vertical distance between the centers of the first radiation arm group and the second radiation arm group is usually set to be greater than λ, which is not conducive to the miniaturization of the device. When the scheme provided in the embodiments of the present application is used, the influence of the second radiator on the radiation pattern of the first radiator can be minimized, and therefore, the distance between the first radiation arm group and the second radiation arm group (for example, the horizontal distance and / or the vertical distance between the centers of the first radiation arm group and the second radiation arm group can be configured to be less than or equal to λ) can be smaller, so that the structure of the two is more compact, thereby facilitating the miniaturization of the device.
[0092] In the embodiments of the present application, the maximum size of the path through which the current flows in each conductive material patch 1032 is mλ, where λ is the center frequency wavelength of the first frequency range, and m≤0.15. Among them, the maximum size of the path through which the current flows in the conductive material patch 1032 is mainly related to the shape of the conductive material patch. Generally, in the direction perpendicular to the ground plate, the thickness of the conductive material patch is usually the smallest size in its structure, and the thickness is not considered in the present application to affect the path of the current flow. The path of the current flow is mainly considered in the plane of the conductive material patch perpendicular to the thickness direction of the conductive material patch. As shown in Figure 11 、 Figure 18 The conductive material patch 1032 is a sheet structure, and the maximum size of the path through which the current flows is the length of the current flowing along the center line of the conductive material patch 1032 in the conductive material patch 1032; in combination with Figure 20As shown, the conductive material patch 1032 is a bent strip structure, and the maximum dimension of the current flowing through the conductive material patch 1032 is the length of the current flowing along the center line of each part of the conductive material patch 1032 from one end to the other end of the conductive material patch 1032. In this way, it can be ensured that the signal of the first radiation arm coupled by the second radiation arm is effectively coupled to the conductive material patch. In addition, the distance between adjacent conductive material patches 1032 is less than or equal to λ / 100, so as to ensure strong coupling between adjacent conductive material patches 1032 and ensure that the signal of the first radiation arm coupled to the second radiation arm can be transmitted between the conductive material patches.
[0093] In the embodiments of the present application, in order to improve the capacitive coupling amount (i.e., the capacitance value of C1 in Figure 20 ) between the second radiation arm 1031 of the second radiator 103 and the conductive material patch 1032, at least one first conductive via 1035 (as shown in Figure 21 ) is arranged in the insulating dielectric layer 1033, and each first conductive via 1035 is connected with one conductive material patch 1032. Due to the conduction characteristics of C1 to the signal in the first frequency range, it is ensured that the signal of the first radiation arm coupled to the second radiation arm can be fully coupled to the conductive material patch 1032. In addition, the first conductive via 1035 can increase the inductive area between the conductive material patches, thereby increasing the capacitive coupling amount (i.e., the capacitance value of C2 in Figure 20 ) between the conductive material patch 1032-1 and the conductive material patch 1032-2. Due to the conduction characteristics of C2 to the signal in the first frequency range, it is ensured that the signal of the first radiation arm coupled to the second radiation arm can be transmitted between the conductive material patches.
[0094] As shown in Figure 22 , the at least one first conductive via 1035 is located on both sides of the second radiation arm 1031 where the conductive material patch is located, and is arranged in sequence along the direction of the current I flowing through the second radiation arm 1031 where the conductive material patch 1032 is located. In addition, the conductive material patch 1032 is not connected with the second radiation arm 1031. Since the at least one first conductive via 1035 is mainly arranged in sequence on both sides of the second radiation arm 1031 along the direction of the current flowing through the second radiation arm 1031, it can mainly improve the capacitive coupling amount between the second radiation arm 1031 and the conductive material patch 1035, i.e., mainly increase the capacitance value of the first capacitance C1, and ensure that the signal of the first radiation arm coupled to the second radiation arm can be fully coupled to the conductive material patch.
[0095] In order to improve the capacitive coupling amount between the conductive material patches 1032, refer to Figure 23As shown, at least one first conductive via 1035 is arranged at both ends of the conductive material patch 1032 in the direction of the second radiating arm 1031 where the conductive material patch 1032 is located, and arranged in sequence in the direction perpendicular to the current I flowing through the second radiating arm 1031 where the conductive material patch 1032 is located. In this way, since the at least one first conductive via 1035 is mainly arranged in sequence at both ends of the conductive material patch 1032 in the direction perpendicular to the current flowing through the second radiating arm 1031, the amount of capacitive coupling between the conductive material patches can be mainly improved. For example, Figure 23 In the embodiment shown in FIG. 10, the first conductive via 1035-1 connected to the conductive material patch 1032-1 is opposite to the first conductive via 1035-2 connected to the conductive material patch 1032-2, and the increased first conductive via is equivalent to increasing the opposite area between the conductive material patches and the conductive material patches, which is equivalent to increasing the capacitance value of the second capacitor, thereby ensuring that the signal coupled from the first radiating arm to the second radiating arm can be transmitted between the conductive material patches.
[0096] In the embodiment of the present application, in order to improve Figure 20 The filtering characteristics of the equivalent circuit shown in FIG. 11 can be achieved by arranging at least one second conductive via 1037 in the insulating dielectric layer 1033 (for example, as shown in FIG. 12). Figure 24 As shown in FIG. 12, one end of each second conductive via 1037 is connected to one conductive material patch 1032, and the other end of the second conductive via 1037 is connected to the second radiating arm 1031. In this way, it is equivalent to adding an inductor between the conductive material patch 1032 and the second radiating arm 1031. For reference, Figure 25 As shown in FIG. 13, the inductor L3 is added in the equivalent circuit.
[0097] In order to achieve the conductive characteristics of the first conductive via and the second conductive via described above, the first conductive via and the second conductive via can be a metalized via. In addition, it can be understood that the first conductive via or the second conductive via can be arranged in each or part of the plurality of conductive material patches. In addition, in combination with Figure 11 As shown in FIG. 14, it should be noted that when the width W1 of one conductive material patch is less than or equal to the width W2 of the second radiating arm where it is located, only the second conductive via described above can be arranged for the conductive material patch; and when the width W1 of one conductive material patch is greater than the width W2 of the second radiating arm where it is located, the first conductive via and the second conductive via can be arranged for the conductive material patch.
[0098] In addition, in order to increase the flexibility of controlling the coupled current generated on the second radiating body when the first radiating body is working, as shown in FIG. 15, Figure 26As shown, on any second radiation arm in the second radiation arm group, there are at least two rows of conductive material patches 1032 distributed in the direction of current flowing through any second radiation arm 1031. Taking two rows of conductive material patches 1032 as an example, its equivalent circuit is as follows: Figure 27 As shown, capacitor C1' is the capacitance between any conductive material patch 1032-2 in the newly added row of conductive material patches 1032 and the second radiating arm 1031. Capacitor C2' is the capacitance between any conductive material patch 1032-2 and the adjacent conductive material patch 1032-3. L2' is the inductance of any conductive material patch 1032-2. In addition, capacitor C3 is introduced between two adjacent rows of conductive material patches (1032-1 and 1032-2) in a direction perpendicular to the current flow in the second radiating arm 1031.
[0099] The antenna in the embodiment of the present application may be an array antenna, for example, Figure 8 As shown, the antenna in the embodiment of the present application includes two antenna arrays, wherein the first antenna array includes 4 columns of antenna elements (8 antenna elements per column, a total of 32 antenna elements, each antenna element is Figure 8 The antenna elements in the first antenna array are implemented by the first radiating arm group of the first radiator 102, and are used to transmit signals in the first frequency range. The second antenna array includes a column of antenna elements (two antenna elements per column, a total of two antenna elements, each antenna element is in the Figure 8 , which is shown as 4 squares arranged together), wherein the antenna elements in the second antenna array are realized by the second radiating arm group of the second radiator 103 mentioned above, and are used to transmit signals in the second frequency range. In some embodiments, the second radiating arm 1031 can be linear, polygonal or circular. In some embodiments, the second radiator 103 is a single-polarization radiator (which can be considered to be used to realize a single-polarization antenna) or a dual-polarization radiator (which can be considered to be used to realize a dual-polarization antenna), wherein single polarization can be polarization in any direction, such as polarization perpendicular to the ground or horizontal to the ground; dual polarization can be a polarization perpendicular to the ground or a polarization horizontal to the ground, or a pair of intersecting ±45° polarizations, wherein different polarization modes of the second radiator are provided in this solution, which enriches the polarization modes of the second radiator. In addition, the use of dual polarization can be more conducive to reducing polarization losses in complex environments. For example, the second radiating arm group of the second radiator contains one or more second radiating arms, a single or two second radiating arms can form a single polarization, and two or four second radiating arms can also form a dual polarization, for example, referring to Figure 5As shown, the second radiation arms 1031-1 and 1031-3 form one polarization, and the second radiation arms 1031-2 and 1031-4 form another polarization; in some embodiments, the polarization mode of the second radiator 103 can be any of the following polarization modes: linear polarization, circular polarization, and elliptical polarization. Exemplarily, linear polarization includes horizontal polarization and vertical polarization, elliptical polarization includes left-handed elliptical polarization and right-handed elliptical polarization, and circular polarization includes left-handed circular polarization and right-handed circular polarization. Different polarization modes of the second radiator are provided in this solution, enriching the polarization modes of the second radiator, so as to adapt to the intensity requirements of radiation signals in different environments.
[0100] Taking the dual-polarization mode as an example, as Figure 5 , Figure 6 , Figure 8 shown, the second radiator 103 forms a cross-shaped antenna oscillator. Both the first radiator 102 and the second radiator 103 are ±45° polarized. Among them, as Figure 5 shown, multiple conductive material patches 1032 are distributed along the direction of the second radiation arm 1031 where the current flows through the multiple conductive material patches 1032, and Figure 5 shows the direction of the current I. Since the radio frequency signal is usually an alternating current signal, the current directions on the second radiation arm 1031-1 are usually two opposite directions. As Figure 6 shown, in the embodiment, a structural design diagram of a second radiation arm group is provided. The second radiation arm group is in a cross shape, and the two opposite "squares" respectively represent +45° and -45° polarizations, and are respectively fed by a pair of orthogonal second baluns (1304-1 and 1304-2). For example: the second radiation arm 1031-1 is fed by the second balun 1304-1; the second radiation arm 1031-2 is fed by the second balun 1304-2. Conductive material patches 1032 are provided on the outer frame (i.e., the radiation arm) of the "cross" shape.
[0101] Refer to Figure 28 , which is a schematic diagram of the simulation of half of the antenna provided in this application based on the above Figure 8 (for example, including one second radiator in the upper half and 16 first radiators). Specifically, Figure 28 is the simulation result of the normalized (normalized) gain (dB) of the radar cross-section (radar cross-section, RCS) of the second radiator 103. As shown in the figure, near the frequency of 3.98 GHz, using the solution provided in the embodiment of this application (conductive material patches are provided on the radiation arms of the second radiator) can achieve a 6 dB RCS optimization compared with the solution of the prior art (conductive material patches are not provided on the radiation arms of the second radiator).
[0102] In addition, refer to Figure 29As shown in Figure 2, simulation examples of antenna patterns in three cases are provided. Figure 29 (a) is the antenna pattern of the first radiator (i.e., the high-frequency antenna element) in an ideal state when it is working; Figure 29 (b) is the antenna pattern of the first radiator of the multi-frequency co-aperture antenna array in the prior art (the first radiator (i.e., the high-frequency antenna element) and the second radiator (i.e., the low-frequency antenna element, without the conductive material patch) coexist) when the first radiator is working; Figure 29 (c) is the antenna pattern of the first radiator of the multi-frequency co-aperture antenna array provided by the embodiment of the present application (the first radiator (i.e., high-frequency antenna element) and the second radiator (i.e., low-frequency antenna element, provided with a conductive material patch) coexist) when the first radiator is working; among them, by comparing the antenna patterns in the three cases, it can be seen that Figure 29 (b) The presence of the second radiator has a greater impact on the antenna pattern of the first radiator (compared to Figure 29 Compared with (a), the antenna pattern of the first radiator in (b) is greatly distorted). In (c), since a conductive material patch is provided on the radiating arm of the second radiator, the effect on the antenna pattern of the first radiator is relatively low, and the electric field distribution and pattern distortion of (b) are basically restored.
[0103] Figure 30 Provides the actual gain curve of each antenna direction (θ / °) when the first radiator (ie, the high-frequency antenna element) is working when the antenna only includes the first radiator; and based on the above Figure 8 The structure of the antenna element shown in the provided antenna, the actual gain curve of each antenna direction (θ / °) when the first radiator of the multi-frequency co-aperture antenna array in the prior art (the first radiator (i.e., the high-frequency antenna element) and the second radiator (i.e., the low-frequency antenna element, without a conductive material patch) coexist) is working; and based on the above Figure 8 The structural configuration of the antenna element shown in the provided antenna, the actual gain (realized gain) curve of the first radiator in each antenna direction (θ / °) of the multi-frequency co-aperture antenna array provided in the embodiment of the present application (the first radiator (i.e., the high-frequency antenna element) and the second radiator (i.e., the low-frequency antenna element, provided with a conductive material patch) coexist); wherein, the solution provided by the embodiment of the present application is basically consistent with the actual gain curve when only the first radiator works alone, especially around 30°, the solution provided by the embodiment of the present application has a 2.5dB improvement in the actual gain of the antenna compared with the prior art.
[0104] Based on the above Figure 8 The antenna element structure configuration shown in the antenna is provided. Figure 31The peak gain curve of the first radiator of the multi-frequency common-aperture antenna array (the first radiator (i.e., high-frequency antenna element) coexists with the second radiator (i.e., low-frequency antenna element, no conductive material patch is arranged)) in the prior art at each operating frequency when the first radiator is working is provided; and the peak gain curve of the first radiator of the multi-frequency common-aperture antenna array (the first radiator (i.e., high-frequency antenna element) coexists with the second radiator (i.e., low-frequency antenna element, a conductive material patch is arranged)) in the embodiment of the present application at each operating frequency when the first radiator is working is provided; wherein the embodiment of the present application has an improvement of 0.06 dB on the peak gain of the antenna relative to the prior art near 0.90 GHz.
[0105] Although the present application is described in conjunction with specific features and embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications and variations as can come within the scope of the present application. Obviously, many modifications and variations of the present application are possible in light of its teachings. It is therefore to be understood that within the scope of the appended claims and their equivalents, the present application can be practiced otherwise than as specifically described.
Claims
1. A multi-band converged antenna assembly, comprising: comprising a ground plate, a first radiator and a second radiator; The first radiator is used to radiate signals in a first frequency range, and the second radiator is used to radiate signals in a second frequency range; The ground plane is used to reflect part of the signal radiated by the first radiator and part of the signal radiated by the second radiator; A first height of the first radiator is smaller than a second height of the second radiator, and the first height and the second height are heights perpendicular to the ground plane; The first radiator includes a first radiating arm group and a first balun group, and the first radiating arm group is coupled to a first feeding circuit corresponding to the first radiator through the first balun group; The second radiator includes a second radiating arm group and a second balun group, the second radiating arm group is coupled to a second feeding circuit corresponding to the second radiator through the second balun group; the second radiating arm group includes at least one second radiating arm; A plurality of conductive material patches are provided on each second radiating arm in the second radiating arm group, wherein an insulating dielectric layer is provided between the plurality of conductive material patches and each second radiating arm; At least one first conductive via is provided in the insulating dielectric layer, each of the first conductive vias is connected to one of the conductive material patches, and the conductive material patch is not connected to the second radiation arm through the first conductive via.
2. The multi-band fused antenna assembly of claim 1, wherein, The plurality of conductive material patches are distributed along a direction in which current flows through the second radiation arm where the plurality of conductive material patches are located.
3. The multi-band fusion antenna assembly according to claim 1, characterized in that: At least one first conductive via is located on both sides of the second radiation arm where the conductive material patch is located, and is arranged sequentially along a direction in which current flows through the second radiation arm where the conductive material patch is located.
4. The multi-band fused antenna assembly of claim 1, wherein, At least one of the first conductive vias is located at both ends of the conductive material patch in the direction of current flowing through the second radiation arm where the conductive material patch is located, and is arranged in sequence perpendicular to the direction of current flowing through the second radiation arm where the conductive material patch is located.
5. The multi-band fused antenna assembly of any of claims 1-4, wherein, At least one second conductive via is provided in the insulating dielectric layer, one end of each second conductive via is connected to one of the conductive material patches, and the other end of each second conductive via is connected to the second radiation arm.
6. The multi-band fused antenna assembly of any of claims 1-4, wherein, Any of the plurality of conductive material patches is a sheet-like structure or a bent strip-like structure.
7. The multi-band fused antenna assembly of claim 6, wherein, The two adjacent conductive material patches are sheet-like structures, and the two adjacent conductive material patches are interdigitated structures at two adjacent ends.
8. The multi-band fused antenna assembly of any of claims 1-4, wherein, On any second radiation arm in the second radiation arm group, at least two rows of conductive material patches are distributed in the direction in which current flows through any second radiation arm.
9. The multi-band fused antenna assembly of any of claims 1-4, wherein, A horizontal distance and / or a vertical distance between the centers of the first radiation arm group and the second radiation arm group is less than or equal to λ, where λ is a center frequency wavelength of the first frequency range.
10. The multi-band fused antenna assembly of any of claims 1-4, wherein, The maximum size of the path through which the current flows in each of the conductive material patches is mλ, where λ is the center frequency wavelength of the first frequency range, and m≤0.
15.
11. The multi-band fused antenna assembly of any of claims 1-4, wherein, The plurality of conductive material patches are arranged on each of the second radiating arms on the side close to the ground plate, or the plurality of conductive material patches are arranged on each of the second radiating arms on the side away from the ground plate.
12. The multi-band fused antenna assembly of any of claims 1-4, wherein, The plurality of conductive material patches are arranged on each of the second radiating arms on the side perpendicular to the ground plate.
13. The multi-band fused antenna assembly of any of claims 1-4, wherein, The maximum frequency of the first frequency range is higher than the maximum frequency of the second frequency range, and the minimum frequency of the first frequency range is higher than the minimum frequency of the second frequency range.
14. A radiator for a multi-band fusion antenna, characterized in that: The radiator is arranged on the ground plate of the multi-band fusion antenna, the radiator comprises a radiating arm group and a balun group, the radiating arm group is coupled to the feeding circuit corresponding to the radiator through the balun group; the radiating arm group comprises at least one radiating arm; Each of the radiating arms in the radiating arm group is provided with a plurality of conductive material patches, and an insulating medium layer is arranged between the plurality of conductive material patches and each of the radiating arms. At least one first conductive via is arranged in the insulating medium layer, each of the first conductive vias is connected with one of the conductive material patches, and the conductive material patches are not connected with the radiating arms through the first conductive vias.
15. The radiator of claim 14, wherein, The plurality of conductive material patches are distributed along the direction of current flowing through the radiating arms where the plurality of conductive material patches are located.
16. The radiator of claim 14, wherein, At least one of the first conductive vias is located on both sides of the radiating arm where the conductive material patch is located, and is arranged in sequence along the direction of current flowing through the radiating arm where the conductive material patch is located.
17. The radiator of claim 14, wherein, At least one of the first conductive vias is located at both ends of the conductive material patch in the direction of current flowing through the radiating arm where the conductive material patch is located, and is arranged in sequence along the direction perpendicular to the direction of current flowing through the radiating arm where the conductive material patch is located.
18. Radiator according to any of claims 14-17, characterised in that At least one second conductive via is arranged in the insulating medium layer, one end of each of the second conductive vias is connected with one of the conductive material patches, and the other end of each of the second conductive vias is connected with the radiating arm.
19. Radiator according to any of claims 14-17, characterised in that Any of the conductive material patches in the plurality of conductive material patches is in a sheet structure or a folded strip structure.
20. The radiator of claim 19, wherein, When two adjacent conductive material patches are in a sheet structure, the two adjacent conductive material patches are in an interdigital structure at two adjacent ends.
21. The radiator according to any one of claims 14-17, characterized in that In any of the radiating arms in the radiating arm group, at least two rows of conductive material patches are distributed along the direction of current flowing through any of the radiating arms.
22. The radiator according to any one of claims 14-17, characterized in that The plurality of conductive material patches are arranged on each of the radiating arms on the side perpendicular to the ground plate.
23. An antenna, characterized by Comprising: The multi-band fusion antenna assembly and at least two groups of feeding circuits according to any one of claims 1-13, wherein a first radiator of the multi-band fusion antenna assembly is coupled to a first feeding circuit corresponding to the first radiator; and a second radiator of the multi-band fusion antenna assembly is coupled to a second feeding circuit corresponding to the second radiator.
24. An electronic device, comprising: An antenna as claimed in claim 23, in combination with radio frequency circuitry for transmitting signals processed by the radio frequency circuitry through the antenna.
Citation Information
Patent Citations
Dipole unit with load of sheet-shaped metal group and antenna apparatus employing dipole unit
CN106450751A