USB module

Abstract

The invention relates to a USB module comprising a first USB interface for connecting a first USB-compatible device with a first USB cable, wherein the first USB cable is configured as a multi-core cable and comprises at least one first configuration line, a second interface for connecting a second USB-compatible device with a second USB cable, wherein the second USB cable is configured as a multi-core cable and comprises at least one second configuration line, a housing with a housing interior, wherein a port between the first USB interface and the second interface is arranged in the housing interior and the port is at least able to connect the first configuration line with the second configuration line, characterized in that the port comprises at least one semiconductor component which is provided for referencing at least one output signal at the USB module on the configuration connection between the first configuration line and the second configuration line to the earth potential of the USB module.

Description

Technical Field

[0001] This invention relates to a USB module. Background Technology

[0002] Universal Serial Bus (USB) is a standardized serial bus system used to connect computers and computer peripherals. USB connections are wired connections and can transmit charging current in addition to data. The amount of charging current transmitted via a USB cable is limited to avoid negatively impacting data transmission. This limitation in charging current determines the maximum permissible USB cable length. The higher the permissible charging current, the shorter the maximum permissible USB cable length. In the case of a direct USB connection between a computer and a computer peripheral, the relevant USB cable length is the distance between the USB port or USB module on the computer and the computer peripheral.

[0003] USB-based data transfer is used in many fields, including automotive technology. In vehicles, unlike computer connections, USB modules should generally be located away from the main electronic device on the vehicle side where external devices are connected. This is due to the limitations of component placement in a vehicle caused by installation space and / or thermal constraints; therefore, it is generally more practical to place the USB module away from the main electronic device. The main electronic device typically has one or more groups consisting of a DC / DC converter, a USB hub, and / or a host unit. The distance between the vehicle-side main electronic device and the USB module in the vehicle is determined via an additional USB cable connection, which is usually not visible under the trim panel. The total length of the USB cable between the vehicle-side main electronic device and the external device consists of the length of the USB cable between the external device and the USB module, and the length of the USB cable between the USB module and the vehicle-side main electronic device.

[0004] As more and more external devices are used in vehicles, the need for higher charging currents via USB connections is also increasing. However, high charging currents, especially when using longer USB cables, can lead to undesirable high deviations, i.e., voltage drops between the ground potential of the USB power supply (i.e., the main electronic device on the vehicle side) and the USB current sink (i.e., the connected external device).

[0005] Deviation, or so-called "ground voltage drop," can negatively impact data transmission, especially when the difference is too high, particularly exceeding 250mV. This fault particularly affects USB 2.0 communication and communication via the CC line of the USB Type-C port. According to the USB standard, the 250mV threshold is actually limited only to the USB cable between the USB module and the external device. Therefore, typically only the aforementioned remote solutions (where the host electronic device is far from the USB module) are feasible, as a short USB cable is used between the USB module and the external device, and the full 250mV ground voltage drop is not exhausted on this cable. However, with a longer USB cable and / or a higher charging current between the USB module and the external device, the 250mV threshold may be exhausted on this cable alone, thus causing interference in data transmission between the external device and the host electronic device, along with the USB cable between the host electronic device and the USB module.

[0006] Document US 8,990,592 B2 describes a level shifter that modifies the voltage levels on USB data lines, for example, to compensate for the so-called ground offset effect. The level shifter can be part of an interface power regulator, enabling adaptive shifting of signal levels based on the current level drawn by the device from the power line (e.g., during charging). By changing the voltage levels at the data D+ and D- lines according to the drawn current intensity, the performance of USB host interfaces and USB hub interfaces can be significantly improved. However, continuous shifting or regulation is necessary. Summary of the Invention

[0007] Therefore, the object of the present invention is to provide a USB module that enables reliable data transmission between a host electronic device and a connected external device in a simple manner, even with a long USB cable connection and / or a high charging current.

[0008] Specifically, this objective is achieved by a USB module including a first USB interface for connecting a first USB-compatible device to a first USB cable and a USB plug, wherein the first USB cable is multi-core and includes at least one first configuration line. The USB module also includes a second interface for connecting a second USB-compatible device to a second USB cable, wherein the second USB cable is multi-core and includes at least one second configuration line. Furthermore, the USB module includes a housing with an internal cavity, wherein a port is disposed within the housing cavity between the first USB interface and the second interface, and this port allows at least the first configuration line to connect to the second configuration line. The port includes at least one semiconductor component configured such that at least one output signal at the USB module at the configured connection between the first and second configuration lines references the ground potential of the USB module.

[0009] The first USB interface is preferably a USB socket, particularly a USB Type-C socket, into which a corresponding USB plug can be inserted. In an alternative embodiment, the USB module can also be a USB plug. USB modules are based on standardized USB cable connections and are widely used. Many external devices can connect to electronic devices via USB connections; therefore, USB modules can be used in a variety of ways in vehicles.

[0010] The interface is preferably configured as a printed circuit board, which facilitates the integration of other electronic components, such as semiconductor components. The semiconductor components can be integrated into the interface during manufacturing, or alternatively, can be integrated subsequently. This integration of semiconductor components into the interface enables a simple construction of the USB module, especially without altering the external dimensions of the USB module.

[0011] The output signal at the USB module, connected between the two configuration lines, references the USB module's ground potential, resulting in compensation for the ground voltage drop across the USB cable looking down the signal direction. This compensation allows for the full allowable ground voltage drop of 250mV across the USB cable looking down the signal direction. Ultimately, the compensation also enables the use of longer USB cables and / or higher charging currents along the entire length of the USB cable between the host electronic device and the connected external device.

[0012] Optionally, at least one semiconductor component is configured to alternatively reference the ground potential of the USB module at the configuration connection between the first configuration line and the third configuration line.

[0013] In one preferred embodiment, the first USB cable between the external device and the USB module has a configuration line CC, while in another preferred embodiment, the second USB cable between the USB module and the host electronic device has two configuration lines CC1 and CC2. Depending on the orientation of the USB plug on the first USB cable in the USB module, the configuration connection can be implemented via configuration lines CC1-CC or alternatively via CC2-CC. This allows the configuration connection to be applied independently of the hardware-side connection of the configuration lines.

[0014] Optionally, ports having at least one semiconductor component are arranged on a paddle-card. This arrangement of ports with semiconductor components on the paddle-card enables separate pre-installation, independent of integration into the USB module. Separate pre-installation can be advantageous in terms of process technology and can lead to simplified and / or faster integration into the USB module.

[0015] Optionally, the first USB cable further includes at least one first and a third data line, and the second USB cable further includes at least one second and a fourth data line, with the first and third data lines, as well as the second and fourth data lines, all leading to at least one semiconductor component. Data can be exchanged between the host electronic device and the external device via the data lines. Data exchange can be performed in parallel with the charging current. In particular, the charging current does not interfere with data exchange on the data lines.

[0016] Optionally, at least one semiconductor component is configured to process, in terms of signal technology, first and / or third data signals received via a first data line and output via a second data line, and / or received via a third data line and output via a fourth data line. Due to the USB cable used, signal distortion can occur in the data signals. The semiconductor component can correct this signal distortion, so that the corresponding data signals reach their destination with minimal distortion. Correction is also known as signal refresh and signal transmission improvement.

[0017] Optionally, at least one semiconductor component is configured to process, in terms of signal technology, second and / or fourth data signals received via a second data line and output via a first data line, and / or received via a fourth data line and output via a third data line. This signal processing has the advantages of the aforementioned alternative data connections.

[0018] Optionally, USB 2.0 communication is used for the signals on the first, second, third, and / or fourth data lines. USB 2.0 communication is a common and widely used USB standard. Using this standard enables communication with a large number of external devices.

[0019] Optionally, the USB module is further configured to direct charging current from a second USB-compatible device that can be connected to the USB module to at least one first USB-compatible device (300) that can be connected. The ability to allow charging current to flow through the USB module is a desirable feature, enabling the charging of connected external devices while in use.

[0020] Optionally, at least one semiconductor component has an application-specific integrated circuit (ASIC). The ASIC is directly adaptable to the desired data processing function. Typically, data processing speed is optimized to achieve extremely high speeds. Power consumption is typically significantly lower than other data processing components, such as microcontrollers.

[0021] Alternatively, the USB module is a USB Type-C module. The USB Type-C module is constructed with mirror symmetry, allowing the USB plug to be inserted into the USB socket in both orientations. This increases the ease of use of the USB connection.

[0022] Some implementation methods are described below:

[0023] For example, the USB module is USB Type-C (also known as "USB-C"). Accordingly, the first configuration line is, for example, the so-called CC line, and the second configuration line is the CC1 line, where CC is an abbreviation for "Configuration Channel". Signals used for negotiating charging power (so-called "power negotiation") are exchanged via the CC line. In another embodiment, the USB module can be a different USB type.

[0024] In one embodiment, the first USB interface is a USB receptacle designed to accommodate a USB plug. The USB plug terminates at one end of a first USB cable. The first USB cable establishes a USB connection from the USB module to a first USB-compatible device (e.g., a USB terminal device detachably disposed in a vehicle).

[0025] In one embodiment of the USB socket, a port within the housing connects all wires of the first USB cable to corresponding wires of the second cable. At least the first and second configuration wires are connected via at least one semiconductor component.

[0026] In one embodiment, the second interface is configured to accommodate the wires of a multi-core second USB cable. In a preferred embodiment, the USB module terminates the second USB cable. The wires of the second USB cable can be soldered directly to the port, or they can be connected to the port via a plug connector. The second USB cable is preferably installed in a vehicle and establishes a connection from the USB module to a second USB-compatible device (e.g., to a USB hub in the vehicle).

[0027] The first USB cable preferably has a length of more than 0.5m, more preferably more than 0.75m, even more preferably more than 1m, and most preferably more than 1.25m. The second USB cable preferably has a length of more than 1m, more preferably more than 1.5m, even more preferably more than 2m, and most preferably more than 2.5m.

[0028] According to one embodiment, at least one semiconductor component is specifically configured to reference a first output signal at a USB module on a first configuration line to the ground potential of the USB module, wherein the first output signal is generated by a first input signal at a USB module on a second configuration line. Furthermore, it is configured to reference a second output signal at a USB module on the second configuration line to the ground potential of the USB module in the opposite signal direction, wherein the second output signal is generated by a second input signal at a USB module on the first configuration line.

[0029] In an alternative embodiment, at least one semiconductor component is configured to reference a third output signal at the USB module on the first configuration line to the ground potential of the USB module, wherein the third output signal is generated by a third input signal at the USB module on the third configuration line. Furthermore, a fourth output signal at the USB module on the third configuration line is referenced to the ground potential of the USB module in the opposite signal direction, wherein the fourth output signal is generated by a fourth input signal at the USB module on the first configuration line.

[0030] In this way, the ground voltage drop along the second USB cable can be compensated for when the signal travels from the second USB-compatible device to the first USB-compatible device, thus allowing the maximum permissible ground voltage drop to be fully utilized by the first USB cable. Overall, the maximum permissible ground voltage drop on both the first and second USB cables can be fully utilized regardless of the signal direction.

[0031] According to one embodiment, the first USB cable further includes at least one first data line, and the second USB cable further includes at least one second data line, wherein both the first data line and the second data line are directed to at least one semiconductor component.

[0032] In a preferred embodiment, at least one semiconductor component is configured to process, in terms of signal technology, a first data signal received via a first data line and output via a second data line. Similarly, at least one semiconductor component is configured to process, in terms of signal technology, a second data signal received via a second data line and output via a first data line. Attached Figure Description

[0033] Furthermore, other advantages and features of the invention can be seen from the preferred embodiments described below. The features described therein and above can be implemented individually or in combination, provided that these features do not contradict each other. The following description of the preferred embodiments is carried out with reference to the accompanying drawings.

[0034] The diagram shows:

[0035] Figure 1A and Figure 1B Showing a cover ( Figure 1A ) and without lid ( Figure 1B A perspective view of an implementation of the USB module;

[0036] Figure 2 A perspective view of the housing cavity of an embodiment of the USB module is shown;

[0037] Figure 3 A schematic diagram of a port in an embodiment of a USB module is shown;

[0038] Figure 4 A schematic diagram illustrating an implementation of a USB connection between a computer and a connected external device; and

[0039] Figure 5 A schematic diagram illustrating an implementation of a USB connection between a main electronic device and a connected external device in a vehicle is shown. Detailed Implementation

[0040] Figure 1A and 1B A perspective view of a USB module 100 is shown. The USB module 100 includes a first USB interface 110 for connecting a first USB-compatible device 300 to a first USB cable 210, wherein the first USB cable 210 is configured as multi-core and includes at least one first configuration line 211 (see...). Figure 3 In addition, a method for connecting a second USB-compatible device 200 (see...) is provided. Figure 3 The second interface 120 (see) is connected to the second USB cable 220. Figure 2 The second USB cable 220 is also constructed as a multi-core cable and includes at least one configuration line 221.

[0041] The USB module 100 also includes a housing 130, the housing having an inner cavity 131 (see...). Figure 2 The device has a port 150 between the first USB interface 110 and the second interface 120, wherein the port is configured to connect the first configuration line 211 and the second configuration line 221.

[0042] Port 150 includes at least one semiconductor component 151, wherein the at least one semiconductor component 151 is configured to modify the input signal on the second configuration line 221 at the USB module 100 such that the output signal generated on the first configuration line 211 at the USB module is related to the ground potential of the first USB interface 110. In the opposite signal direction, the at least one semiconductor component 151 is configured to modify the input signal on the first configuration line 211 at the USB module 100 such that the output signal generated on the second configuration line 221 at the USB module 100 is related to the ground potential of the second interface 120. The ground potentials of the first USB interface 110 and the second interface 120 correspond to the ground potential GND-2 of the USB module 100.

[0043] In a preferred embodiment, port 150 in the housing cavity connects all wires of the first USB cable 210 to corresponding wires of the second USB cable 220. At least two configuration lines 211 and 221 are connected via at least one semiconductor component 151.

[0044] The USB module 100 shown in the figure is a USB Type-C. Therefore, the first configuration line 211 is the CC line. The second configuration line 221 is the CC1 line. Signals for negotiating charging power (so-called "power negotiation") are exchanged via the CC line connection. In another embodiment, the USB module 100 can also be a different USB type.

[0045] The first USB interface 110 is a USB socket configured to accommodate a USB plug 230. The USB plug 230 terminates a first USB cable 210. The first USB cable 210 leads to a first USB-compatible device 300 disposed or installed in the vehicle, such as a USB terminal device. In one embodiment, the first USB interface 110 utilizes a cover 111 (see...). Figure 1A ) is protected, or in another embodiment there is no cover 111 (see Figure 1B ).

[0046] Second interface 120 (see) Figure 2 The USB module 100 is constructed to accommodate multiple wires of the multi-core second USB cable 220. The USB module 100 terminates the second USB cable 220 and is preferably fixedly connected to the second USB cable 220.

[0047] The second cable 220 is preferably fixedly installed in the vehicle and leads to a second USB-compatible device 200, such as a USB hub and / or host electronic device.

[0048] Figure 4A schematic diagram of a USB connection between a computer 200 and a connected external device 300 is shown. In this configuration, the USB module or USB coupling element 201 is directly connected to the host electronic device 200, i.e., the computer. When signals are transmitted via the first USB cable 210, the ground voltage drop occurs only through the first USB cable 210. In this configuration, the first USB cable 210 can fully utilize the maximum permissible ground voltage drop.

[0049] and Figure 4 on the contrary, Figure 5 A schematic diagram illustrating an implementation of a USB connection in a vehicle is shown. Here, the main electronic device 200 is positioned away from the USB module 100 and is connected to the USB module 100 via a second USB cable 220. (Reference) Figure 5 The ground reference is described as follows: Configuration signals from the first USB-compatible device 300 to the USB module 100 are initially referenced to the ground potential GND-3 of the first USB-compatible device 300. A first ground voltage drop U-drop 1 occurs when the configuration signal is transmitted via the first USB cable 210. At least one semiconductor component 151 is designed, according to an embodiment, to reference the ground potential GND2 of the USB module 100 when configuration signals are forwarded to the second USB-compatible device 200. A second ground voltage drop U-Drop 2 is generated when the configuration signal is forwarded from the USB module 100 to the second USB-compatible device 200. However, because the configuration signal references the ground potential GND2 of the USB module 100 in the semiconductor component 151, the two ground voltage drops U-Drop 1 and U-Drop 2 are not added together, but rather compensate for the first ground voltage drop U-Drop 1, so that even when a cable connection is used between the USB module 100 and the second USB-compatible device 200, only ground voltage drop 2 is counted. Grounding voltage drops U-Drop1 and U-Drop2 can each have maximum grounding voltage drops, especially up to 250mV. In the opposite signal direction, the configuration signal from the second USB compatible device 200 first references the ground potential GND-1 of the second USB compatible device 200.

[0050] In this way, in the case of a signal direction from the main electronic device 200 in the vehicle to the external device 300, ground voltage drop can be compensated along the second USB cable 220, so that the maximum permissible ground voltage drop can be fully utilized by the first and second USB cables 210, 220 alone. The same applies to the opposite signal direction.

[0051] It can not only guide two configuration lines 211, 221 to one or more semiconductor components 151. The first USB line 210 also includes at least one first data line 212, and the second USB line 220 also includes at least one second data line 222, wherein both the first data line 212 and the second data line 222 are guided to at least one semiconductor component 151.

[0052] like Figure 3 As shown, additional lines, such as additional configuration lines 223 and additional data lines 214 and 224 of the two USB cables 210 and 220, can also be routed to semiconductor component 151, and the functionality of semiconductor component 151 can also be provided by multiple semiconductor components.

[0053] Data cables 212, 214, 222 and 224 are the D+ or D- lines of the first and second USB cables 210, 220 (also marked "Dp1" and "Dn1").

[0054] Reference Figure 2 A port 150 is formed within the housing cavity 131 of the USB module 100. An assembly position 133 for arranging at least one semiconductor component 151 is provided on the port 150. In one embodiment, a printed circuit card is used as the port 150, although other circuit carriers or structures, such as stamped grids and / or directly integrated semiconductors, are also feasible.

[0055] What needs to be mentioned now is that... Figure 3 In the embodiment shown, on one hand, the two data lines 212, 214 and the configuration line 211 of the first USB cable, and on the other hand, the two data lines 222, 224 and the two configuration lines 221, 223 of the second USB cable 220 are guided to the semiconductor component 151.

[0056] At least one semiconductor component 151 is designed to process, in terms of signal technology, a first data signal received via a first data line 212 and output via a second data line 222. Similarly, at least one semiconductor component 151 is designed to process, in terms of signal technology, a second data signal received via a second data line 222 and output via a first data line 212.

[0057] Input signals from the first USB-compatible device 300 at the USB module 100 on the first configuration line 211 are always referenced to the ground potential GND-3 of the first USB-compatible device 300. Semiconductor component 151 converts the input signals such that the corresponding output signal on the second configuration line 221 at the USB module 100 is referenced to the ground potential GND-2 of the USB module 100. In the opposite signal direction, input signals from the second USB-compatible device 200 at the USB module on the second configuration line 221 are always referenced to the ground potential GND-1 of the second USB-compatible device 200. Semiconductor component 151 converts the input signals such that the corresponding output signal on the first configuration line 211 is referenced to the ground potential GND-2 of the USB module 100. The signals are bidirectional.

[0058] In one implementation, semiconductor component 151 is implemented as an ASIC (Application-Specific Integrated Circuit). In other implementations, other variations are possible.

[0059] In addition to at least one semiconductor component 151, port 150 can also integrate other functional modules. For example, there are one or more ground interfaces 190 to which the ground potential GND-2 of the USB module 100 is applied. Temperature sensor 160 can measure the temperature at or within the second USB cable 220 via interface 161. Lighting device 170 can infer the status at or within the second USB cable 220 via status interface 171 and generate a corresponding light signal, for example, by means of an LED. Voltage in the second USB cable 220 can be measured via measurement interface 182. The actual voltage in the second USB cable 220 or the potential at the line of the second USB cable 220 is applied to voltage interface 181. Interfaces 181, 182, 161, and 190 can be connected to the corresponding lines of the second USB cable 220.

[0060] The USB terminal device (first USB compatible device 300) can be connected to the USB module 100 via a first USB cable 210. The USB module 100 is fixedly connected to and terminates the second USB cable 220. In one embodiment, the second USB cable 220 is connected to a USB hub or other host electronic device (second USB compatible device 200) via a USB coupling element 201.

[0061] In one embodiment, the second USB-compatible device 200 is a USB power source that provides charging current, and the first USB-compatible device 300 is a USB current sensor that receives charging current.

[0062] The implementation of the USB module 100, particularly the USB socket, is especially required to be remotely installed in the vehicle (hereinafter also referred to as "remote solution") for various reasons (such as installation space, thermal limitations) of the second USB compatible device 200 (e.g., DC / DC converter, USB hub, head unit, etc.).

[0063] However, in the case of a remotely installed USB module 100, a problem arises where the ground voltage drop of the first USB cable 210 is added to the ground voltage drop of the second USB cable 220, resulting in a total ground voltage drop between the first and second USB compatible devices 200, 300. This total ground voltage drop is not allowed to exceed a maximum value of 250mV, thus typically less than 250mV is allowed on each USB cable 210, 220. However, due to the increased charging current, the ground voltage drop on each USB cable 210, 220 increases. From ground voltage drops exceeding the threshold (specifically 250mV), USB communication between the first and second USB compatible devices 200, 300 can be interfered with. Since the wire cross-section of the USB cables 210, 220 cannot be arbitrarily increased, the wire length and / or maximum feasible charging current between the USB module 100 and the first or second USB compatible device 200, 300 are limited in the current remote solution.

[0064] If the ground voltage drop exceeds 250mV, USB 2.0 communication via data lines 212, 214, 222, and 224, as well as communication via CC lines 211, 221, and 223, will be interfered with.

[0065] Currently, remote solutions generally only work because the first USB cable 210 is very short, especially less than 0.5m, and does not fully utilize the 250mV allowable ground voltage drop.

[0066] The implementation of USB module 100 allows for compensation of ground voltage drop occurring on the first line along the signal direction in a remote solution, so that a ground voltage drop of 250mV, feasible according to the USB specification, can also be fully utilized on the second line along the signal direction. Furthermore, signal quality processing of the data signal is possible via at least one semiconductor component 151, thereby compensating for losses occurring during signal transmission in the USB cable.

[0067] exist Figure 3The diagram schematically illustrates an embodiment with a semiconductor component 151, via which USB Type-C signals D+ / D- and CC signals for USB 2.0 communication are guided. The semiconductor component 151 is preferably constructed as an ASIC, and the electronic circuitry integrated within the ASIC influences the transmitted signals in such a way that the output signal (especially the CC connection) references the ground potential GND-2 of the USB module 100, and preferably compensates for signal distortion caused by the input signals in the USB cables 210, 220. USB 3.0 / 3.1 signals are disregarded because they are decoupled via DC capacitors, thus avoiding grounding voltage drop issues.

[0068] Reference number list

[0069] 100 USB modules

[0070] 110 First USB Port

[0071] 111 Cover

[0072] 120 interface

[0073] 130 housing

[0074] 131 Internal cavity of the shell

[0075] 133 Assembly position

[0076] Port 150

[0077] 151 Semiconductor Components

[0078] 160 Temperature Sensor

[0079] 161 interface

[0080] 170 lighting fixtures

[0081] 171 State Interface

[0082] 181 Voltage Interface

[0083] 182 Measurement Interface

[0084] 190, 290, 390 ground interfaces

[0085] 200 Second USB compatible devices

[0086] 201 USB coupling element

[0087] 210 First USB data cable

[0088] 211 First Configuration Line

[0089] 212 First Data Cable

[0090] 214 Third Data Line

[0091] 220 Second USB cable

[0092] 221 Second Configuration Line

[0093] 222 Second Data Line

[0094] 223 Third Configuration Line

[0095] 224 Fourth Data Line

[0096] 230 USB plug

[0097] 300 First USB-compatible devices

[0098] 301 USB coupling element

[0099] GND-1, GND-2, GND-3 ground potential

[0100] U drop 1, U drop 2 are the first and second ground voltage drops.

Claims

1. A USB module (100), comprising: a first USB interface (110) for connecting a first USB-compatible device (300) with a first USB cable (210) and a USB plug (230), wherein the first USB cable (210) is configured as a multi-core cable and comprises at least one first configuration line (211); a second interface (120) for connecting a second USB-compatible device (200) with a second USB cable (220), wherein the second USB cable (220) is configured as a multi-core cable and comprises at least one second configuration line (221); and a housing (130) having a housing interior (131), wherein a port (150) between the first USB interface (110) and the second interface (120) is arranged in the housing interior (131), and the port (150) is at least capable of connecting the first configuration line (211) with the second configuration line (221), characterized in that the port (150) comprises at least one semiconductor component (151) which is provided for referencing at least one output signal at the USB module (100) on a configuration connection between the first configuration line (211) and the second configuration line (221) to a ground potential (GND-2) of the USB module (100), wherein the USB module (100) is configured for forwarding a configuration signal received from the first USB-compatible device (300) on the first configuration line (211) after referencing to the ground potential (GND-2) of the USB module (100) to the second USB-compatible device (200) on the second configuration line (221), so that a second ground drop occurring when the configuration signal is sent along the second configuration line (221) compensates a first ground drop occurring when the configuration signal is sent to the first configuration line (211).

2. The USB module (100) according to claim 1, wherein The at least one semiconductor component (151) is configured for alternatively referencing an output signal at the USB module on a configuration connection between the first configuration line (211) and a third configuration line (223) to the ground potential (GND-2) of the USB module (100).

3. The USB module (100) according to claim 1 or 2, wherein The port (150) with the at least one semiconductor component (151) is arranged on a paddle card.

4. The USB module (100) according to claim 1 or 2, wherein The first USB cable (210) further comprises at least one first data line (212) and a third data line (214), and wherein the second USB cable (220) further comprises at least one second data line (222) and a fourth data line (224), and wherein the first data line (212) and the third data line (214) and the second data line (222) and the fourth data line (224) are both guided to the at least one semiconductor component (151).

5. The USB module (100) according to claim 4, wherein At least one of the semiconductor components (151) is configured to process a first data signal received via the first data line (212) and output via the second data line (222) and / or a third data signal received via the third data line (214) and output via the fourth data line (224) in terms of signal technology.

6. The USB module (100) according to claim 4, wherein At least one of the semiconductor components (151) is configured to process a second data signal received via the second data line (222) and output via the first data line (212) and / or a fourth data signal received via the fourth data line (224) and output via the third data line (214) in terms of signal technology.

7. The USB module (100) according to claim 4, wherein USB 2.0 communication is used for signals on the first data line (212), the second data line (222), the third data line (214) and / or the fourth data line (224).

8. The USB module (100) according to claim 1 or 2, which is further configured to direct a charging current flowing from a second USB-compatible device (200) connectable to the USB module (100) to at least one connectable first USB-compatible device (300).

9. The USB module (100) according to claim 1 or 2, wherein At least one of the semiconductor components (151) is an ASIC.

10. The USB module (100) according to claim 1 or 2, wherein The USB module (100) is a USB Type-C.

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