A DPC ceramic substrate measurement method, device, equipment and system

Abstract

The invention discloses a DPC ceramic substrate measurement method, device, equipment and system, belonging to the field of DPC ceramic substrates; it is suitable for ceramic substrates with at least two layers of coating; when electroplating the ceramic substrate, the bottom layer (or the first layer) is the same as the normal electroplating method, that is, a dry film is applied to the ceramic substrate, if the dry film is a positive photoresist, the test point of the bottom layer is not exposed, but the test points of other coatings are exposed; if the dry film is a negative photoresist, the test point of the bottom layer is exposed, but the test points of other coatings are not exposed; in this way, no matter what type of dry film is used, after development, the other coatings except the bottom layer will be dissolved at the test point, and at this time, the test points of other coatings are pits; in this way, the thickness of the coating on the ceramic substrate is obtained according to the height of the bottom of the pit (the first height value) to the height of the top layer of the coating (the second height value). The present application adopts this method, and while being able to obtain the coating thickness, the operation is simple and the cost is low.

Description

Technical Field

[0001] The present invention relates to the field of DPC ceramic substrates, and in particular to a DPC ceramic substrate measuring method, device, equipment and system. Background Art

[0002] Thin film method is the main method for metal film deposition in microelectronics manufacturing, among which direct copper plating is the most representative. Direct copper plating (DPC) mainly uses surface deposition processes such as evaporation and magnetron sputtering to metallize the substrate surface. First, titanium is sputtered under vacuum conditions, then copper particles, and finally electroplating is used for thickening. Then, the circuit is made by ordinary PCB process, and finally the thickness of the circuit is increased by electroplating / chemical plating deposition.

[0003] The preparation method of DPC includes vacuum coating, wet coating, exposure and development, etching and other process steps, so the price of its products is relatively high. The DPC process is suitable for most ceramic substrates.

[0004] DPC ceramic substrates have the advantage of high thermal conductivity and are widely used in the packaging of LED light sources. DPC ceramic substrates need to be plated with thick copper during the production process. Currently, in the DPC ceramic substrate industry, the copper plating thickness generally needs to reach more than 50um. The common practice is to deposit thick copper by dry film exposure and development. During the electroplating process, due to current fluctuations and the influence of various factors, the product thickness often does not match within the specified time. At present, the measurement technology for the copper thickness of the plate during this electroplating process is limited. The maximum thickness of the x-ray that can penetrate the copper thickness on the market can be measured at 40μm, and it cannot penetrate more than 40μm. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art, the present invention provides a DPC ceramic substrate measurement method, device, equipment and system to solve the problem that copper plating on DPC ceramic substrates cannot be measured.

[0006] The technical solution adopted by the present invention to solve its technical problem is:

[0007] First,

[0008] A method for measuring a DPC ceramic substrate, wherein the ceramic substrate has at least two layers of plating during electroplating, comprising the following steps:

[0009] When electroplating the ceramic substrate, a dry film is applied to the ceramic substrate to form a bottom layer of the ceramic substrate;

[0010] Determine the test points on the ceramic substrate, determine whether to expose the test points on the bottom layer according to the dry film type, and determine whether to expose the test points on other coatings except the bottom layer, so that the test points on the other coatings are pits after development;

[0011] A first height value of the bottom of the pit and a second height value of the top coating are measured, and the thickness of the coating on the ceramic substrate is obtained according to the first height value and the second height value.

[0012] Further, judging whether to expose the test points of the bottom layer according to the dry film type, and judging whether to expose the test points on other coating layers except the bottom layer, comprises:

[0013] When the dry film type is positive resist, the test points on the bottom layer are not exposed, but the test points on other coating layers are exposed.

[0014] Further,

[0015] The step of judging whether to expose the test points of the bottom layer according to the dry film type, and judging whether to expose the test points on other coating layers except the bottom layer, comprises:

[0016] When the dry film type is a negative resist, the bottom layer test points are exposed, and the test points on other coating layers are not exposed.

[0017] Furthermore, there are a plurality of test points, and the plurality of test points are arranged side by side and at intervals on the ceramic substrate.

[0018] Further, obtaining the thickness of the coating on the ceramic substrate according to the first height value and the second height value includes:

[0019] The difference between the second height value and the first height value plus the thickness of the bottom dry film is taken as the thickness of the coating on the ceramic substrate.

[0020] Furthermore, it also includes:

[0021] When the coating thickness is less than the target thickness, the ceramic substrate is electroplated again. When electroplating again, whether the exposure of the test point of the newly added coating is opposite to that of the bottom layer, so that the test point is still a pit after development.

[0022] Second,

[0023] A DPC ceramic substrate measuring device, wherein the ceramic substrate has at least two layers of plating during electroplating, and the device comprises:

[0024] A bottom layer processing module, used for applying a dry film to the ceramic substrate to form a bottom layer of the ceramic substrate when electroplating the ceramic substrate;

[0025] A test point processing module, used to determine the test points on the ceramic substrate, determine whether to expose the test points on the bottom layer according to the dry film type, and determine whether to expose the test points on other coatings except the bottom layer, so that the test points on the other coatings are pits after development;

[0026] The thickness measurement module is used to measure a first height value of the bottom of the pit and a second height value of the top coating, and obtain the coating thickness on the ceramic substrate according to the first height value and the second height value.

[0027] Thirdly,

[0028] A DPC ceramic substrate measuring device, comprising:

[0029] processor;

[0030] a memory for storing instructions executable by the processor;

[0031] The processor is configured to execute the method described in any one of the technical solutions of the first aspect.

[0032] Fourthly,

[0033] A DPC ceramic substrate measurement system, comprising:

[0034] The measuring device as described in the technical solution of the third aspect; and

[0035] Electroplating equipment, used for electroplating ceramic substrates.

[0036] Beneficial effects:

[0037] The technical solution of the present application provides a DPC ceramic substrate measurement method, device, equipment and system, which is suitable for ceramic substrates with at least two layers of coating; when electroplating the ceramic substrate, the bottom layer (or the first layer) is the same as the normal electroplating method, that is, a dry film is applied to the ceramic substrate. If the dry film is a positive photoresist, the test points of the bottom layer are not exposed, but the test points of other coatings are exposed; if the dry film is a negative photoresist, the test points of the bottom layer are exposed, but the test points of other coatings are not exposed; no matter what type of dry film is used, after development, the other coatings except the bottom layer will be dissolved at the test point, and the test points of other coatings are pits; the thickness of the coating on the ceramic substrate is obtained according to the height of the bottom of the pit (the first height value) to the height of the top layer of the coating (the second height value). The present application adopts this method, which is simple to operate and low in cost while being able to obtain the coating thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 This is a flow chart of a DPC ceramic substrate measurement method provided by an embodiment of the present invention;

[0040] Figure 2 is a schematic diagram of the structure of a ceramic substrate after development provided by an embodiment of the present invention;

[0041] Figure 3 It is a structural schematic diagram of a DPC ceramic substrate measuring device provided by an embodiment of the present invention;

[0042] Figure 4 It is a structural schematic diagram of a DPC ceramic substrate measuring device provided by an embodiment of the present invention;

[0043] Figure 5 It is a structural schematic diagram of a DPC ceramic substrate measurement system provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present invention is described in detail below in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other implementation methods obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0045] Reference Figure 1 The embodiment of the present invention provides a method for measuring a DPC ceramic substrate, wherein the ceramic substrate has at least two layers of plating during electroplating, comprising the following steps:

[0046] When electroplating the ceramic substrate, a dry film is applied to the ceramic substrate to form the bottom layer of the ceramic substrate;

[0047] Determine the test points on the ceramic substrate, determine whether to expose the test points on the bottom layer according to the dry film type, and determine whether to expose the test points on other coatings except the bottom layer, so that the test points on other coatings are pits after development;

[0048] The first height value of the bottom of the pit and the second height value of the top coating are measured, and the thickness of the coating on the ceramic substrate is obtained according to the first height value and the second height value.

[0049] Specifically, when the dry film type is positive photoresist, the test points on the bottom layer are not exposed, and the test points on other coating layers are exposed. When the dry film is positive photoresist, during development, the exposed areas will be dissolved, and the unexposed areas will not be dissolved.

[0050] When the dry film type is negative photoresist, the bottom layer test points are exposed, and the test points on other coating layers are not exposed. When the dry film is negative photoresist, during development, the exposed areas will not be dissolved, while the unexposed areas will be dissolved.

[0051] After development, the structure of the ceramic substrate test point is as follows Figure 2 As shown, the ceramic substrate 21 and the bottom layer 22 are intact, and the test points 24 of other coating layers 23 are dissolved.

[0052] As a further supplement to the above embodiment, there are multiple test points, which are arranged side by side and spaced apart on the ceramic substrate. When the first height value of the bottom of the pit is finally measured, the average value of the first height values ​​at the multiple test points can be taken as the first height value, so as to more accurately offset the error.

[0053] It should be noted that when actually measuring the first height value and the second height value, a positioning point is determined, and the ceramic substrate at the positioning point is grasped or clamped by a manipulator, so that the test point on the ceramic substrate is located at a position convenient for measurement by the measuring device. Optionally, the measuring device can be a laser rangefinder or a profile scanner, or even a measuring ruler. This application is not limited here.

[0054] It should be noted that, the dry film type is described as negative photoresist. Since the test point of the bottom layer (or the first layer) will not be dissolved during development after being exposed, the bottom of the pit at the test point is not the bottom of the coating, and it should be added with the thickness of the bottom dry film. Therefore, the coating thickness on the ceramic substrate is obtained according to the first height value and the second height value, including: taking the difference between the second height value and the first height value plus the thickness of the bottom dry film as the coating thickness on the ceramic substrate.

[0055] As an optional implementation of the embodiment of the present invention, the following further includes:

[0056] When the coating thickness is less than the target thickness, the ceramic substrate is electroplated again; when electroplating again, whether the exposure at the test point of the newly added coating is the same as the other coating treatments, or the opposite to the bottom layer treatment, that is, if the bottom layer is exposed, the newly added coating is not exposed, and if the bottom layer is not exposed, the newly added coating is exposed. So that the test point is still a pit after development. That is, the solution of the embodiment of the present invention does not affect the coating in other areas because the test point is processed in the form of a pit. Therefore, if the coating thickness is not enough after measurement, it can be directly electroplated on the existing basis without starting from the bottom layer, saving material and time costs.

[0057] It should be noted that the present application only controls whether the test points of each layer are exposed, and does not change whether other areas except the test points are exposed, that is, whether other areas are exposed is handled according to user needs.

[0058] The embodiment of the present invention provides a DPC ceramic substrate measurement method, which is suitable for ceramic substrates with at least two layers of coating; when electroplating the ceramic substrate, the bottom layer (or the first layer) is the same as the normal electroplating method, that is, a dry film is applied to the ceramic substrate, if the dry film is a positive photoresist, the test points of the bottom layer are not exposed, but the test points of other coatings are exposed; if the dry film is a negative photoresist, the test points of the bottom layer are exposed, but the test points of other coatings are not exposed; no matter what type of dry film is used, after development, the other coatings except the bottom layer will be dissolved at the test point, and the test points of other coatings are pits; in this way, the thickness of the coating on the ceramic substrate is obtained according to the height of the bottom of the pit (the first height value) to the height of the top layer of the coating (the second height value). The present application adopts this method, which is simple to operate and low in cost while being able to obtain the coating thickness.

[0059] In one embodiment, the present invention provides a DPC ceramic substrate measuring device, wherein the ceramic substrate is electroplated with at least two layers, such as Figure 3 As shown, the device comprises:

[0060] The bottom layer processing module 31 is used to apply a dry film to the ceramic substrate to form the bottom layer of the ceramic substrate when the ceramic substrate is electroplated.

[0061] The test point processing module 32 is used to determine the test points on the ceramic substrate, determine whether to expose the test points on the bottom layer according to the dry film type, and determine whether to expose the test points on other coating layers except the bottom layer, so that the test points on other coating layers are pits after development; there are multiple test points, and the multiple test points are arranged side by side and spaced on the ceramic substrate. Specifically, when the dry film type is positive resist, the test points on the bottom layer are not exposed, and the test points on other coating layers are exposed. When the dry film type is negative resist dry film, the test points on the bottom layer are exposed, and the test points on other coating layers are not exposed.

[0062] The thickness measurement module 33 is used to measure the first height value of the bottom of the pit and the second height value of the top coating, and obtain the coating thickness on the ceramic substrate according to the first height value and the second height value. Specifically, the thickness measurement module 23 measures the height value of the highest point of the edge of the pit of the ceramic substrate and the height value of the bottom of the pit; the height of the pit is obtained by subtracting the height value of the bottom from the height value of the highest point.

[0063] The method of obtaining the coating thickness on the ceramic substrate according to the first height value and the second height value includes: taking the difference between the second height value and the first height value plus the thickness of the bottom dry film as the coating thickness on the ceramic substrate.

[0064] As an optional implementation of the embodiment of the present invention, the following further includes:

[0065] When the coating thickness is less than the target thickness, the ceramic substrate is electroplated again; when electroplated again, during exposure, the test point processing module 32 is used to process the test points of the newly added coating in a manner opposite to the exposure processing at the underlying test points, so that the test points of the newly added coating are still pits after development.

[0066] The DPC ceramic substrate measuring device provided by the embodiment of the present invention has at least two layers of coating when the ceramic substrate is electroplated. When the ceramic substrate is electroplated, the bottom layer processing module applies a dry film to the ceramic substrate to form the bottom layer of the ceramic substrate; the test point processing module determines the test point on the ceramic substrate, determines whether to expose the test point of the bottom layer according to the dry film type, and determines whether to expose the test point on other coating layers except the bottom layer, so that the test point on other coating layers is a pit after development; the thickness measurement module measures the first height value of the bottom of the pit and the second height value of the top coating layer, and obtains the thickness of the coating on the ceramic substrate according to the first height value and the second height value. When electroplating a ceramic substrate, the bottom layer (or the first layer) is the same as the normal electroplating method, that is, a dry film is applied to the ceramic substrate. If the dry film is a positive photoresist, the test points of the bottom layer are not exposed, but the test points of other coatings are exposed; if the dry film is a negative photoresist, the test points of the bottom layer are exposed, but the test points of other coatings are not exposed; no matter what type of dry film is used, after development, the coatings other than the bottom layer will be dissolved at the test points, and the test points of other coatings will be pits; thus, the thickness of the coating on the ceramic substrate is obtained according to the height of the bottom of the pit (the first height value) to the height of the top layer of the coating (the second height value). The measuring device provided by the embodiment of the present invention can obtain the coating thickness while reducing the difficulty of operation and the cost.

[0067] In one embodiment, the present invention provides a DPC ceramic substrate measuring device, such as Figure 4 As shown, including:

[0068] Processor 41;

[0069] A memory 42 for storing instructions executable by the processor 41;

[0070] The processor 41 is configured to execute the measurement method provided in the above embodiment. The method has been described in detail above and will not be described again here.

[0071] In one embodiment, the present invention also provides a DPC ceramic substrate measurement system, such as Figure 5 As shown, including:

[0072] The measuring device 51 as provided in the above embodiment; and

[0073] The electroplating equipment 52 is used to electroplate the ceramic substrate.

[0074] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0075] It should be noted that, in the description of this application, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" refers to at least two.

[0076] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0077] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0078] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0079] In addition, each functional unit in each embodiment of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0080] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0081] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0082] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A method for measuring a DPC ceramic substrate, characterized in that: The ceramic substrate is electroplated with at least two layers of plating, and the method comprises the following steps: When electroplating the ceramic substrate, a dry film is applied to the ceramic substrate to form a bottom layer of the ceramic substrate; Determine the test points on the ceramic substrate, determine whether to expose the test points on the bottom layer according to the dry film type, and determine whether to expose the test points on other coatings except the bottom layer, so that the test points on the other coatings are pits after development; Measure a first height value of the bottom of the pit and a second height value of the top coating, and obtain the coating thickness on the ceramic substrate according to the first height value and the second height value; wherein, obtaining the coating thickness on the ceramic substrate according to the first height value and the second height value includes: taking the difference between the second height value and the first height value plus the thickness of the bottom dry film as the coating thickness on the ceramic substrate.

2. The method according to claim 1, characterized in that: The step of judging whether to expose the test points of the bottom layer according to the dry film type, and judging whether to expose the test points on other coating layers except the bottom layer, comprises: When the dry film type is positive resist, the test points on the bottom layer are not exposed, but the test points on other coating layers are exposed.

3. The method according to claim 1, characterized in that: The step of judging whether to expose the test points of the bottom layer according to the dry film type, and judging whether to expose the test points on other coating layers except the bottom layer, comprises: When the dry film type is a negative resist, the bottom layer test points are exposed, and the test points on other coating layers are not exposed.

4. The method according to claim 1, characterized in that: There are a plurality of test points, and the plurality of test points are arranged side by side and at intervals on the ceramic substrate.

5. The method according to claim 1, characterized in that Also includes: When the coating thickness is less than the target thickness, electroplating the ceramic substrate again; When electroplating is performed again, whether the exposure at the test point of the newly added coating is opposite to that of the bottom layer, so that the test point is still a pit after development.

6. A DPC ceramic substrate measuring device, characterized in that: The ceramic substrate is plated with at least two layers during electroplating, and the device comprises: A bottom layer processing module, used for applying a dry film to the ceramic substrate to form a bottom layer of the ceramic substrate when electroplating the ceramic substrate; A test point processing module, used to determine the test points on the ceramic substrate, determine whether to expose the test points on the bottom layer according to the dry film type, and determine whether to expose the test points on other coatings except the bottom layer, so that the test points on the other coatings are pits after development; The thickness measurement module is used to measure the first height value of the bottom of the pit and the second height value of the top coating, and obtain the coating thickness on the ceramic substrate according to the first height value and the second height value; specifically, it is used to add the difference between the second height value and the first height value plus the thickness of the bottom dry film as the coating thickness on the ceramic substrate.

7. A DPC ceramic substrate measuring device, characterized in that: include: processor; a memory for storing instructions executable by the processor; The processor is configured to execute the method according to any one of claims 1 to 5.

8. A DPC ceramic substrate measurement system, characterized in that: include: The measuring device as claimed in claim 7; as well as Electroplating equipment, used for electroplating ceramic substrates.

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