High-frequency packaging

Abstract

According to the present invention, one end of a first signal pin (106) is connected to a first signal line (103) of a differential coplanar line (102), and the other end is bent away from a mounting surface. One end of a second signal pin (107) is connected to a second signal line (104) of a differential coplanar line (102), and the other end is bent away from the mounting surface. One end of a ground pin (108) is connected to a ground line (105) of the differential coplanar line (102), and the other end is bent away from the mounting surface.

Description

Technical Field

[0001] The present invention relates to a high frequency package comprising differential coplanar lines. Background Art

[0002] Devices designed to handle high-speed differential signals, including those for digital coherent optical transmission, utilize high-frequency signal device packages that incorporate differential coplanar circuitry. In these circuits, two ground lines are arranged to sandwich two adjacent signal lines. In differential coplanar circuitry, proper high-frequency design is crucial, including impedance matching between the ground and signal lines, or between two adjacent signal lines, from the printed circuit board to the semiconductor chip. In this high-frequency design, the distance between wiring, the distance between pins connected to the wiring and used for mounting, and the shape of the pins are crucial parameters.

[0003] Related technical literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 4934733.

[0006] Non-patent literature

[0007] Non-Patent Document 1: Implementation Agreement for Integrated Dual Polarization Intradyne Coherent Receivers, IA#OIF-DPC-RX-01.2, November 14, 2013 (November 14, 2013).

[0008] Non-patent document 2: Chang Fei Yee, “Key high-speed connector layout techniques,” [retrieved on July 10, 2020] (https: / / www.edn.com / key-high-speed-connector-layout-techniques / ). Summary of the Invention

[0009] Problems to be solved by the present invention

[0010] However, standardization organizations such as the "Optical Internetworking Forum" have determined the size and position of pins to be soldered and mounted, which should be satisfied by the high-frequency signal device package that holds the semiconductor chip and is mounted on the printed board. Therefore, it is impossible to freely determine the distance and shape of the pins. As described in Non-Patent Document 1, the shape of the high-frequency pins is defined (see Figure 9), and does not allow the spacing between the signal (+) / (-) leads, which is necessary to improve high-frequency characteristics, to be changed. As described above, due to the low degree of freedom in high-frequency design in high-speed signal transmission, it is impossible to appropriately set the electromagnetic coupling used as the differential transmission path between the two signal lines.

[0011] For example, Non-Patent Document 1 shows an optical receiving module 400 including a DC terminal 403 and an output terminal 404, and an optical circuit 401 is mounted on the optical receiving module 400. The optical circuit is configured to perform optical signal processing on optical signals input from two input ports 402a and 402b, as shown in FIG. Figure 10 In this technology, the details of the structure of the high-frequency pins that affect the high-frequency characteristics of the optical receiving module including a plurality of high-frequency pins are not disclosed. In addition, in non-patent document 2, the three-dimensional shape of the pins is shown (see Figure 11 ). It is assumed that the spacing between metal pads on the printed circuit board and the distance between pins are equal from the contact surface. Because the impedance increases in the portion exposed to air, it is preferable to keep the two signal pins as close as possible even from the middle. However, this configuration is not shown in detail and is not mentioned at all.

[0012] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to appropriately set electromagnetic coupling serving as a differential transmission path between two signal lines in a high-frequency package including a differential coplanar line.

[0013] Means of solving the problem

[0014] According to the present invention, a high-frequency package is provided. The high-frequency package includes: a package body, the package body including a substrate made of an insulator; a differential coplanar line formed on the substrate, the differential coplanar line being formed by a first ground line, a first signal line, a second signal line, and a second ground line; a first ground pin arranged on one side of the mounting surface of the package body and bent so that one end is connected to the first ground line and the other end is away from the mounting surface; a first signal pin arranged on the side of the mounting surface of the package body and bent so that one end is connected to the first signal line and the other end is away from the mounting surface and extends in the same direction as the first ground pin; and a second A signal pin is provided on the one side of the mounting surface of the package body, is bent so that one end is connected to the second signal line, and the other end is away from the mounting surface, and extends in the same direction as the first ground pin; and a second ground pin is arranged on the one side of the mounting surface of the package body, is bent so that one end is connected to the second ground line, and the other end is away from the mounting surface, and extends in the same direction as the first ground pin, wherein the distance between the other end side of the first signal pin and the other end side of the second signal pin is different from the distance between one end side of the first signal pin and one end side of the second signal pin.

[0015] Effects of the present invention

[0016] As described above, according to the present invention, electromagnetic coupling serving as a differential transmission path between two signal lines can be appropriately set because each pin is bent so that one end of each pin is arranged on the mounting surface of the package body and the other end is away from the mounting surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A is a plan view showing the configuration of a high-frequency package according to a first embodiment of the present invention;

[0018] Figure 1B is a perspective view showing the configuration of a portion of a high-frequency package according to a first embodiment of the present invention;

[0019] Figure 1C is a perspective view showing the configuration of a portion of a high-frequency package according to a first embodiment of the present invention;

[0020] Figure 2 is a plan view showing the configuration of a high-frequency package according to a second embodiment of the present invention;

[0021] Figure 3 is a perspective view showing the configuration of a high-frequency package according to a third embodiment of the present invention;

[0022] Figure 4 is a perspective view showing the configuration of a high-frequency package according to a fourth embodiment of the present invention;

[0023] Figure 5 is a perspective view showing the configuration of a high-frequency package according to a fifth embodiment of the present invention;

[0024] Figure 6 is a plan view showing the configuration of a high-frequency package according to a sixth embodiment of the present invention;

[0025] Figure 7 is a plan view showing the configuration of a high-frequency package according to a seventh embodiment of the present invention;

[0026] Figure 8 is a perspective view showing the configuration of a high-frequency package;

[0027] Figure 9 is an explanatory diagram showing the structure of a conventional high-frequency package;

[0028] Figure 10 is a view showing the configuration of a conventional light receiving module; and

[0029] Figure 11 is a perspective view showing the configuration of a portion of a conventional high-frequency package. DETAILED DESCRIPTION

[0030] A high-frequency package according to an embodiment of the present invention will be described below.

[0031] [First embodiment]

[0032] First, refer to Figure 1A 、 Figure 1B and Figure 1C A high frequency package 100 according to a first embodiment of the present invention is described. The high frequency package 100 includes a package body 101 and a differential coplanar line 102. Note that, Figure 1A The mounting surface of the package body 101 is shown.

[0033] Package body 101 includes a substrate 101a made of an insulator (dielectric), and differential coplanar lines 102 are formed on substrate 101a. For example, on substrate 101a, a photoelectric conversion chip 121 is connected to the input and output terminals of each differential coplanar line 102. Optical fibers 122 and 123 connected to photoelectric conversion chip 121 convert optical signals into high-frequency electrical signals. Photoelectric conversion chip 121 performs a differential amplification (balanced) photoelectric conversion function using, for example, two photodiodes.

[0034] The differential coplanar line 102 includes a first signal line 103, a second signal line 104, and a plurality of ground lines (ground planes) 105 arranged so as to interpose these signal lines. The ground lines 105 are arranged along the first signal line 103 and the second signal line 104. The first signal line 103, the second signal line 104, and the ground lines 105 are formed, for example, by metal wiring formed on the package body 101 (substrate 101a).

[0035] The high-frequency package 100 further includes a first signal pin 106 , a second signal pin 107 and a ground pin 108 .

[0036] The first signal pins 106 are arranged on one side of the mounting surface of the package body 101. In addition, each first signal pin 106 is bent so that one end is connected to the first signal line 103 of the differential coplanar line 102 and the other end is away from the mounting surface.

[0037] Second signal pins 107 are arranged on one side of the mounting surface of package body 101. Furthermore, each second signal pin 107 is bent so that one end is connected to second signal line 104 of differential coplanar line 102 and the other end is away from the mounting surface. Furthermore, second signal pins 107 extend in the same direction as first signal pins 106. Note that a ceramic spacer may be arranged between one end of first signal pin 106 and one end of second signal pin 107.

[0038] Ground pins 108 are arranged on one side of the mounting surface of package body 101. Furthermore, each ground pin 108 is bent so that one end is connected to ground line 105 of differential coplanar circuit 102 and the other end is away from the mounting surface. Furthermore, ground pins 108 extend in the same direction as first signal pins 106.

[0039] In the first embodiment, an example is shown in which two differential coplanar lines 102 are provided, and the ground line 105 is shared by these two. In addition, an example is shown in which a ground pin 108 arranged between adjacent differential coplanar lines 102 is shared by these two. Note that a plurality of differential coplanar lines 102, or three or more differential coplanar lines 102, may be provided in one high-frequency package 100.

[0040] In addition to the configuration described above, in high-frequency package 100, the distance between the other end side of first signal pin 106 and the other end side of second signal pin 107 is different from the distance between one end side of first signal pin 106 and one end side of second signal pin 107. For example, the distance between the other end side of first signal pin 106 and the other end side of second signal pin 107 is greater than the distance between one end side of first signal pin 106 and one end side of second signal pin 107. Note that in the first embodiment, the other end side tip of ground pin 108, the other end side tip of first signal pin 106, and the other end side tip of second signal pin 107 are arranged on the same line.

[0041] High-frequency package 100 is mounted on mounting board 130. As is well known, mounting board 130 has a multilayer wiring structure, including a surface metal layer, two metal layers, three metal layers, or the like, with dielectric layers interposed between the metal layers. Furthermore, the metal layers are connected by through-wiring, for example, extending through the dielectric layers. Spacers 124 are also placed in some areas to maintain a constant distance between a portion of high-frequency package 100 and mounting board 130.

[0042] On the surface of the mounting board 130, for example, a resin layer 131 made of a heat-resistant resin has a plurality of openings 132a, 132b, 132c, 132d, 132e, 132f, and 132g formed therein. The openings 132a, 132d, and 132g define a ground terminal 135. Furthermore, the openings 132b and 132e define a first signal terminal 133. Furthermore, the openings 132c and 132f define a second signal terminal 134.

[0043] When the high-frequency package 100 is mounted on the mounting board 130 , the ground pin 108 is connected to the ground terminal 135 . In addition, the first signal line 103 is connected to the first signal terminal 133 . Furthermore, the second signal line 104 is connected to the second signal terminal 134 .

[0044] According to the first embodiment, the distance between the first signal pin 106 and the second signal pin 107 on the mounting surface of the package body 101 is different from the distance between the first signal pin 106 and the second signal pin 107 on the mounting board 130 .

[0045] In other words, each pin is bent so that one end of each pin is disposed on the mounting surface of package body 101 and the other end is away from the mounting surface. Therefore, the distance between first signal pin 106 and second signal pin 107 on the mounting surface can be made different from the distance between first signal pin 106 and second signal pin 107 on mounting board 130.

[0046] As a result, according to the first embodiment, even if the distance between the first signal pin 106 and the second signal pin 107 on the mounting surface is fixed, the distance between the first signal pin 106 and the second signal pin 107 in the package body 101 can be freely designed. For example, when the distance between the other end side of the first signal pin 106 and the other end side of the second signal pin 107 is made larger than the distance between the one end side of the first signal pin 106 and the one end side of the second signal pin 107, the electromagnetic coupling between the signal lines can be made stronger (by improving the electrostatic capacitance) on the package body 101 side, and the differential characteristic impedance can be optimized and the crosstalk to the adjacent differential channels can be reduced.

[0047] As described above, according to the first embodiment, the electromagnetic coupling serving as the differential transmission path between two signal lines can be appropriately set.

[0048] [Second embodiment]

[0049] Next, we will refer to Figure 2 A second embodiment of the present invention will be described. Figure 2 The mounting surface of the package body 101 is shown. High-frequency package 100 includes package body 101 and differential coplanar line 102. Package body 101 includes substrate 101a, and differential coplanar line 102 is formed on substrate 101a. Differential coplanar line 102 includes a first signal line 103, a second signal line 104, and a plurality of ground lines 105. High-frequency package 100 also includes a first signal pin 106 and a second signal pin 107. These components are the same as those in the first embodiment described above.

[0050] In the second embodiment, the ground pin 108a is longer than the first signal pin 106 and the second signal pin 107. Note that in the second embodiment, the other end of the ground pin 108a, the other end of the first signal pin 106, and the other end of the second signal pin 107 are arranged on the same line. Therefore, the ground pin 108a extends further on one end of the high-frequency package 100 than the first signal pin 106 and the second signal pin 107.

[0051] [Third embodiment]

[0052] Next, we will refer to Figure 3A high-frequency package 100a according to a third embodiment of the present invention is described. High-frequency package 100a includes a package body 101 and a differential coplanar line 102. Package body 101 includes a substrate 101a, and differential coplanar line 102 is formed on substrate 101a. Differential coplanar line 102 includes a first signal line 103, a second signal line 104, and a plurality of ground lines 105. High-frequency package 100a also includes a first signal pin 106, a second signal pin 107, and a ground pin 108a. These components are the same as those in the second embodiment described above.

[0053] In the third embodiment, the package body 101 (substrate 101a) includes a metal layer 109, and the ground line 105 is connected to the metal layer 109. In addition, the metal layer 109 includes a notch 110, which is located in a first connection portion between one end of the first signal pin 106 and the first signal line 103 and a second connection portion between one end of the second signal pin 107 and the second signal line 104.

[0054] [Fourth embodiment]

[0055] Next, we will refer to Figure 4 A high-frequency package 100 b according to a fourth embodiment of the present invention will be described. Figure 4 The high-frequency package 100b is shown as viewed from the mounting surface of the package body 101. The high-frequency package includes the package body 101 and a differential coplanar line 102. The package body 101 includes a substrate 101a, and the differential coplanar line 102 is formed on the substrate 101a. The differential coplanar line 102 includes a first signal line 103, a second signal line 104, and a plurality of ground lines 105. The high-frequency package 100b also includes a first signal pin 106 and a second signal pin 107. These components are the same as those in the second embodiment described above.

[0056] In the fourth embodiment, an embedded portion 118 is provided at one end of the ground pin 108b. This embedded portion is partially embedded in the substrate 101a along the thickness direction. Furthermore, the portion of the ground pin 108b including the embedded portion 118 can be formed thicker than the remaining portion. When the portion including the embedded portion 118 is formed thicker than the remaining portion, crosstalk between adjacent channels can be further reduced.

[0057] [Fifth embodiment]

[0058] Next, we will refer to Figure 5 A high-frequency package 100 c according to a fifth embodiment of the present invention will be described. Figure 5The figure shows a state viewed from the mounting surface of the package body 101. The high-frequency package 100c includes the package body 101 and a differential coplanar line 102. The package body 101 includes a substrate 101a, and the differential coplanar line 102 is formed on the substrate 101a. The differential coplanar line 102 includes a first signal line 103, a second signal line 104, and a plurality of ground lines 105. These components are the same as those in the second embodiment. In the fifth embodiment, as in the second embodiment, a second signal pin 107 is also provided.

[0059] In the fifth embodiment, as in the aforementioned fourth embodiment, an embedding portion 118 is provided at one end of the ground pin 108b, which is partially embedded in the substrate 101a along the thickness direction. In addition, in the fifth embodiment, an embedding portion 116 is provided at one end of the first signal pin 106a, which is partially embedded in the substrate 101a along the thickness direction. In the fifth embodiment, each line of the differential coplanar line 102 connected to the pin is embedded in the package body 101 (substrate 101a), and the embedding portion of each pin is connected to the embedded line. When a portion of one end of the pin is embedded in this manner, the differential coplanar line 102 can be embedded in the substrate 101a on one side of the mounting surface of the package body 101. As a result, on one side of the mounting surface of the package body 101, the leakage of the electromagnetic field into the space can be suppressed, and the problems of EMI (electromagnetic interference) or EMC (electromagnetic compatibility) can be reduced.

[0060] [Sixth embodiment]

[0061] Next, we will refer to Figure 6 A high-frequency package 100 d according to a sixth embodiment of the present invention will be described. Figure 6 The figure shows a state viewed from the mounting surface of the package body 101. High-frequency package 100d includes package body 101 and differential coplanar line 102. Package body 101 includes substrate 101a, and differential coplanar line 102 is formed on substrate 101a. Differential coplanar line 102 includes a first signal line 103, a second signal line 104, and a plurality of ground lines 105. These components are the same as those in the fifth embodiment. In the sixth embodiment, as in the fifth embodiment, first signal pin 106a and second signal pin 107 are also provided.

[0062] In the sixth embodiment, an embedded portion 118a is provided at one end of the ground pin 108c. This embedded portion is partially embedded in the substrate 101a along the thickness direction. Furthermore, the portion of the ground pin 108c including the embedded portion 118a is wider than the rest of the portion. This structure can further stabilize the ground potential on the mounting surface of the package body 101, and can further ensure the stability of the ground potential of the package body 101.

[0063] [Seventh embodiment]

[0064] Next, we will refer to Figure 7 A high-frequency package 100 e according to a seventh embodiment of the present invention will be described. Figure 7 The figure shows a state viewed from the mounting surface of the package body 101. The high-frequency package 100e includes the package body 101 and a differential coplanar line 102. The package body 101 includes a substrate 101a, and the differential coplanar line 102 is formed on the substrate 101a. The differential coplanar line 102 includes a first signal line 103, a second signal line 104, and a plurality of ground lines 105. A ground pin 108c is also provided. These components are the same as those in the aforementioned sixth embodiment.

[0065] In the seventh embodiment, one end of the first signal pin 106b includes a narrow portion 116a that is narrower than the other regions, and one end of the second signal pin 107a includes a narrow portion 117 that is narrower than the other regions. With this configuration, the distance to the ground pin 108c adjacent to the first signal pin 106b and the second signal pin 107a is wider than the other regions. Compared to the configuration according to the first embodiment, this configuration can make it possible to increase the distance between, for example, one end of the signal pin and one end of the ground pin.

[0066] like Figure 8 As shown, the differential coplanar line 202 arranged on the surface side opposite to the mounting surface of the package body 201 of the high-frequency package 200 may also have a side-coupled line structure formed by a first signal line 203, a second signal line 204, and a ground line 205. With this configuration, conversion between optical signals and high-frequency electrical signals can be performed between the optical fibers 222 and 223 via a single-ended X2-type photoelectric conversion chip 221 formed by a photodiode or the like.

[0067] Note that in the high-frequency package 200 , as described above, the package body 201 includes the substrate 201 a made of an insulator, and further includes the first signal pin 206 , the second signal pin 207 , and the ground pin 208 .

[0068] As described above, according to the present invention, electromagnetic coupling serving as a differential transmission path between two signal lines can be appropriately set because each pin is bent so that one end of each pin is arranged on the mounting surface of the package body and the other end is away from the mounting surface.

[0069] Note that the present invention is not limited to the above-described embodiments, and it is apparent that those skilled in the art can make many modifications and combinations within the technical scope of the present invention.

[0070] Description of Reference Signs

[0071] 100…high-frequency package, 101…package body, 101a…substrate, 102…differential coplanar line, 103…first signal line, 104…second signal line, 105…ground line, 106…first signal pin, 107…second signal pin, 108…ground pin, 121…photoelectric conversion chip, 122…optical fiber, 123…optical fiber.

Claims

1. A high-frequency package, comprising: The package body includes a substrate made of an insulator; a differential coplanar circuit formed on the substrate; a first signal pin, arranged on one side of the mounting surface of the package body and bent so that one end is connected to the first signal line of the differential coplanar line and the other end is away from the mounting surface; a second signal pin, arranged on the side of the mounting surface of the package body, bent so that one end is connected to the second signal line of the differential coplanar circuit and the other end is away from the mounting surface, and extends in the same direction as the first signal pin; as well as a ground pin, arranged on the side of the mounting surface of the package body, bent so that one end is connected to the ground line of the differential coplanar line and the other end is away from the mounting surface, and extends in the same direction as the first signal pin, wherein the distance between the other end side of the first signal pin and the other end side of the second signal pin is different from the distance between the one end side of the first signal pin and the one end side of the second signal pin; An embedding portion is provided at the one end of the ground pin, the embedding portion being partially embedded in the substrate along a thickness direction; and a portion of the one end of the ground pin including the embedding portion is formed thicker than other regions.

2. The high frequency package according to claim 1, wherein The end of the other end side of the ground pin, the end of the other end side of the first signal pin, and the end of the other end side of the second signal pin are arranged on the same line, and The ground pin is longer than the first signal pin and the second signal pin.

3. The high frequency package according to claim 1 or 2, wherein The package body includes a metal layer, the ground line is connected to the metal layer, and The metal layer includes a notch located in a first connection portion between the one end of the first signal pin and the first signal line and in a second connection portion between the one end of the second signal pin and the second signal line.

4. The high frequency package according to claim 1 or 2, wherein Each of the one end of the first signal pin and the one end of the second signal pin includes a narrow portion formed narrower than other regions and having a wider distance from the narrow portion to the ground pin adjacent to the first signal pin and the second signal pin than other regions.

5. A high-frequency package comprising: A package body comprising a substrate made of an insulator; a differential coplanar circuit formed on the substrate; a first signal pin, arranged on one side of the mounting surface of the package body and bent so that one end is connected to the first signal line of the differential coplanar line and the other end is away from the mounting surface; a second signal pin, arranged on the side of the mounting surface of the package body, bent so that one end is connected to the second signal line of the differential coplanar circuit and the other end is away from the mounting surface, and extends in the same direction as the first signal pin; as well as a ground pin, arranged on the side of the mounting surface of the package body, bent so that one end is connected to the ground line of the differential coplanar line and the other end is away from the mounting surface, and extends in the same direction as the first signal pin, wherein the distance between the other end side of the first signal pin and the other end side of the second signal pin is different from the distance between the one end side of the first signal pin and the one end side of the second signal pin; An embedding portion is provided at the one end of the ground pin, the embedding portion is partially embedded in the substrate along a thickness direction, and a portion of the one end of the ground pin including the embedding portion is formed wider than other regions.

6. A high-frequency package comprising: A package body comprising a substrate made of an insulator; a differential coplanar circuit formed on the substrate; a first signal pin, arranged on one side of the mounting surface of the package body and bent so that one end is connected to the first signal line of the differential coplanar line and the other end is away from the mounting surface; a second signal pin, arranged on the side of the mounting surface of the package body, bent so that one end is connected to the second signal line of the differential coplanar circuit and the other end is away from the mounting surface, and extends in the same direction as the first signal pin; as well as a ground pin, arranged on the side of the mounting surface of the package body, bent so that one end is connected to the ground line of the differential coplanar line and the other end is away from the mounting surface, and extends in the same direction as the first signal pin, wherein the distance between the other end side of the first signal pin and the other end side of the second signal pin is different from the distance between the one end side of the first signal pin and the one end side of the second signal pin; An embedded portion is provided at one end of the ground pin and partially embedded in the substrate along the thickness direction, and an embedded portion is provided at one end of the first signal pin and partially embedded in the substrate along the thickness direction.

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