Light detector

Abstract

The present application relates to a light detector. The light detector is provided with a light receiving element and a package. The package has: a housing member formed of ceramic; a wiring including a pad connected to a terminal of the light receiving element by a lead wire; and a light transmitting member. On a bottom wall of the housing member, a placement surface on which the light receiving element is mounted by an adhesive member is formed. On the bottom wall or a side wall of the housing member, a pad surface on which the pad is disposed is formed at a position closer to an opening side of the housing member than the placement surface. A through hole is formed in the side wall. At least a part of an inner side end portion of the through hole is located at a position closer to the opening side than a surface of the light receiving element on the opening side.

Description

Technical Field

[0001] This disclosure relates to a photodetector. Background Technology

[0002] A photodetector is known to have a light-receiving element and a package containing the light-receiving element, wherein the package has a housing member made of ceramic and a light-transmitting member mounted on the housing member in such a way as to cover an opening in a recess of the housing member (see, for example, Patent Document 1). The housing member made of ceramic has superior heat dissipation and heat resistance compared to a housing member made of, for example, resin.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-216142 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] In the photodetector described above, when the wiring is disposed within the package, a technical problem arises as to how to reliably implement the electrical connection between the wiring and the light-receiving element. On the other hand, a technical problem arises as to how to reliably prevent condensation from occurring within the package.

[0008] The purpose of this disclosure is to provide a photodetector that can reliably implement the electrical connection between the wiring disposed in the package and the light-receiving element housed in the package, and can reliably prevent condensation from occurring in the package.

[0009] Solutions for solving technical problems

[0010] A photodetector according to one aspect of this disclosure includes: a light-receiving element having a light-receiving portion and a terminal; and a package housing the light-receiving element, the package housing having: a housing member having a bottom wall and a side wall defining an opening opposite to the bottom wall, and being formed of ceramic; a wiring having a pad for connecting to a terminal via a wire, and being disposed on the housing member; and a light-transmitting member mounted on the side wall in a manner covering the opening, a mounting surface on the bottom wall having the light-receiving element mounted by an adhesive member, a pad surface having a pad disposed on the bottom wall or the side wall having a position closer to the opening than the mounting surface, and a through hole having a through hole communicating between the inside and outside of the package housing in the side wall, at least a portion of the inner end of the through hole being located closer to the opening than the surface of the light-receiving element on the opening side.

[0011] In one aspect of the photodetector disclosed herein, in a ceramic housing component, the pad surface of the pads on which wiring is disposed is located closer to the opening side of the housing component than the mounting surface on which the light-receiving element is mounted via an adhesive component. Therefore, the adhesive component cannot easily reach the pad surface, and thus, the terminals of the corresponding light-receiving element and the pads of the wiring are reliably connected by wires. Furthermore, in another aspect of the photodetector disclosed herein, in a ceramic housing component, at least a portion of the inner end of a through-hole formed in the sidewall is located closer to the opening side of the housing component than the surface of the light-receiving element on the opening side. Therefore, the inner end of the through-hole is less likely to be blocked by the adhesive component, thus ensuring ventilation inside and outside the package, thereby reliably preventing condensation inside the package. Through the above, the photodetector according to one aspect of the present disclosure can reliably implement the electrical connection between the wiring disposed in the package and the light-receiving element housed within the package, and can reliably prevent condensation inside the package.

[0012] In one aspect of the photodetector disclosed herein, at least a portion of the inner end of the through-hole can be located further towards the opening than the pad surface. Therefore, even if foreign objects enter the package through the through-hole, they can be easily captured on the pad surface. Furthermore, the light-receiving portion of the light-receiving element is separated from the inner end of the through-hole only by the amount of the pad surface. Through these means, even if foreign objects enter the package through the through-hole, their arrival at the light-receiving portion of the light-receiving element can be suppressed.

[0013] In one aspect of the photodetector disclosed herein, the through-hole may also have a bend. This prevents foreign objects from entering the package via the through-hole.

[0014] In one aspect of the photodetector disclosed herein, the inner surface of the through-hole may also be circular in shape at the bend. This prevents damage to the housing component at the bend, thus suppressing the intrusion of foreign matter into the package due to such damage.

[0015] In one aspect of the photodetector disclosed herein, there may be only one through-hole. Therefore, compared to the case where there are multiple through-holes, it is possible to suppress the intrusion of foreign objects into the package via the through-hole.

[0016] In one aspect of the photodetector disclosed herein, the inner surface of the sidewall may have a corner when viewed from the direction opposite to the opening from the bottom wall, and the inner end of the through hole is located at the corner. This allows for smooth ventilation between the inside and outside of the package.

[0017] In one aspect of the photodetector disclosed herein, the sidewall may have a corner when viewed from the direction opposite to the opening from the bottom wall, and a through-hole may be formed at the corner. This allows for an increase in the length of the through-hole, thereby suppressing foreign matter from entering the package body through the through-hole.

[0018] In one aspect of the photodetector disclosed herein, the sidewalls may be composed of multiple sidewall portions, and the outer end of the through-hole is located on the outer surface of the sidewall portion having the greatest thickness among the multiple sidewall portions. This allows for an increase in the length of the through-hole, thereby suppressing foreign objects from entering the package through the through-hole.

[0019] In one aspect of the photodetector disclosed herein, a recess may be formed on the outer surface of the sidewall, and the outer end of the through-hole may be located in the recess. This can suppress the intrusion of foreign objects into the outer end of the through-hole.

[0020] In one aspect of the photodetector disclosed herein, the wiring may include: a plurality of connectors extending along the outer surface of the sidewall in a direction opposite to the opening on the bottom wall; the distance between the connector closest to the outer end of the through-hole and the outer end of the through-hole is greater than the distance between the connector closest to the outer end of the through-hole and a second connector closest to the outer end of the through-hole. This prevents molten solder from clogging the outer end of the through-hole during photodetector installation.

[0021] In one aspect of the photodetector disclosed herein, when viewed from a direction opposite to the opening on the bottom wall, the center position of the light-receiving portion can also coincide with the center position of the package body in at least a predetermined direction. Therefore, when installing the photodetector, alignment of the light-receiving portion can be performed with the package body as a reference in at least a predetermined direction.

[0022] In one aspect of the photodetector disclosed herein, when viewed from a direction opposite to the opening on the bottom wall, the inner end of the through-hole can also be located in at least a predetermined direction at a position opposite to the center position of the light-receiving portion relative to the center position of the package. Thus, in at least a predetermined direction, the light-receiving portion of the light-receiving element is separated from the inner end of the through-hole, thereby preventing foreign objects from reaching the light-receiving portion of the light-receiving element, even if foreign objects enter the package through the through-hole.

[0023] In one aspect of the photodetector disclosed herein, a gap may be formed between the light-receiving element and the sidewall. Therefore, even if a foreign object enters the package through a through-hole, it can be easily captured in the gap between the light-receiving element and the sidewall, thus preventing the foreign object from reaching the light-receiving portion of the light-receiving element.

[0024] In one aspect of the photodetector disclosed herein, the height difference between the surface of the opening side of the light-receiving element and the pad surface can also be less than the thickness of the light-receiving element. Therefore, it is easy to implement the connection of the wires relative to the terminals and pads of the corresponding light-receiving elements.

[0025] The effects of the invention

[0026] According to this disclosure, a photodetector can be provided that can reliably implement the electrical connection between the wiring disposed in the package and the light-receiving element housed in the package, and can reliably prevent condensation from occurring in the package. Attached Figure Description

[0027] Figure 1 This is a top view of a light detector implemented in one way.

[0028] Figure 2 yes Figure 1 The side view of the photodetector shown.

[0029] Figure 3 yes Figure 1 The image shows a bottom view of the light detector.

[0030] Figure 4 It is along Figure 2 The cross-sectional view shown along line IV-IV.

[0031] Figure 5 It is along Figure 4 The cross-sectional view of the VV line shown.

[0032] Figure 6 This is a cross-sectional view of a modified photodetector.

[0033] Figure 7 This is a cross-sectional view of a modified photodetector. Detailed Implementation

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, identical or equivalent parts in each drawing will be labeled with the same symbols, and repeated descriptions will be omitted.

[0035] like Figure 1 , Figure 2 and Figure 3 As shown, the photodetector 1 includes a light-receiving element 2 and a package 3 that houses the light-receiving element 2. The package 3 includes a housing component 4, multiple wirings 5, and a light-transmitting component 6. Hereinafter, the incident direction of light relative to the photodetector 1 will be referred to as the Z direction, a direction perpendicular to the Z direction will be referred to as the X direction, and a direction perpendicular to both the Z and X directions will be referred to as the Y direction.

[0036] The light-receiving element 2 is a back-illuminated solid-state imaging element (such as a CMOS image sensor). The light-receiving element 2 is, for example, a rectangular plate with the X and Y directions extending along its sides and the Z direction as its thickness direction. As an example, the length of each side of the light-receiving element 2 is approximately tens of millimeters, and the thickness of the light-receiving element 2 is approximately several hundred micrometers.

[0037] The light-receiving element 2 includes a light-receiving section 21 and multiple terminals 22. The light-receiving section 21 is, for example, rectangular in shape with the X and Y directions extending along its sides. As an example, the length of each side of the light-receiving section 21 is approximately several millimeters to tens of millimeters. The light-receiving section 21 is biased towards one side in the X direction within the light-receiving element 2. Figure 1 The middle is the left side) and one side in the Y direction ( Figure 1 (The upper side is shown in the middle). In the area outside the light-receiving section 21 of the light-receiving element 2, circuits such as a CMOS readout circuit, a vertical scanning circuit, and a horizontal scanning circuit are provided (illustrations omitted). Multiple terminals 22 are arranged along the outer edge of the surface 2a of the light-receiving element 2. Each terminal 22 is embedded in the surface 2a, protruding from it. Each terminal 22 is electrically connected to the circuitry of the light-receiving element 2.

[0038] The housing component 4 includes a bottom wall 41 and a side wall 42, and is made of ceramic. The bottom wall 41 and the side wall 42 are integrally formed by sintering a laminate. The bottom wall 41 is the portion of the housing component 4 between the plane containing the mounting surface 41a (described later) and the outer surface 41b. The bottom wall 41 is, for example, a rectangular plate with the X and Y directions as the extension directions of each side and the Z direction as the thickness direction. As an example, the length of each side of the bottom wall 41 is about tens of millimeters, and the thickness of the bottom wall 41 (i.e., the distance between the plane containing the mounting surface 41a and the outer surface 41b) is about several hundred micrometers. The side wall 42 defines an opening 40 in the Z direction opposite to the bottom wall 41. The side wall 42 is, for example, a rectangular frame extending along the outer edge of the bottom wall 41. As an example, the height of the side wall 42 is about several hundred micrometers, and the thickness of the side wall 42 is about several millimeters.

[0039] The sidewall 42 is composed of multiple sidewall portions 43, 44, 45, and 46. Sidewall portion 43 is located on one side in the X direction. Figure 1 The middle section is on the left side. Side wall portion 44 is located on the other side in the X direction ( Figure 1 The middle section is on the right side. The side wall portion 45 is located on one side in the Y direction ( Figure 1 The middle is the upper side). The side wall portion 46 is located on the other side in the Y direction ( Figure 1 (Middle is the bottom side).

[0040] A mounting surface 41a is formed on the bottom wall 41. The mounting surface 41a is the inner surface of the bottom wall 41 on the side of the opening 40. On the mounting surface 41a, the light-receiving element 2 is mounted by the adhesive member 7 with the surface 2a of the light-receiving element 2 facing the opening 40 side. The surface 2a of the light-receiving element 2 on the opening 40 side is located in the Z direction between the mounting surface 41a and the end face 42a of the side wall 42 (the end face of the side wall 42 opposite to the bottom wall 41). A gap is formed between the light-receiving element 2 and the side wall 42. As an example, the width of this gap is about several hundred μm.

[0041] A pad surface 42b is formed on the sidewall 42. The pad surface 42b extends along the inner edge of the sidewall 42. In the Z direction, the pad surface 42b is located closer to the opening 40 than the mounting surface 41a of the bottom wall 41, and closer to the bottom wall 41 than the end face 42a of the sidewall 42. That is, the pad surface 42b is located between the mounting surface 41a and the end face 42a in the Z direction. The height difference between the surface 2a of the light-receiving element 2 and the pad surface 42b (i.e., the distance between the surface 2a and the pad surface 42b in the Z direction) is less than the thickness of the light-receiving element 2. In this embodiment, the height difference between the surface 2a of the light-receiving element 2 and the pad surface 42b is approximately 0. In addition, the width of the gap formed between the light-receiving element 2 and the sidewall 42 is less than the width of the pad surface 42b (the width of the pad surface 42b in the direction perpendicular to the extension direction of the pad surface 42b extending along the inner edge of the sidewall 42).

[0042] Multiple wirings 5 ​​are disposed in the housing component 4. Each wiring 5 extends from the pad surface 42b, through the interior of the sidewall 42 and the outer surface 42c of the sidewall 42, to the outer surface 41b of the bottom wall 41. The material of each wiring 5 is, for example, metal. Each wiring 5 includes pads 51 and 52 and a connecting portion 53. The pad 51 is disposed on the pad surface 42b. The pad 52 is disposed along the outer edge of the outer surface 41b of the bottom wall 41. The connecting portion 53 extends in the Z direction on the outer surface 42c of the sidewall 42. The housing component 4 and the multiple wirings 5 ​​are integrally formed, for example, by firing a laminate of a green sheet with a wiring pattern. The terminals 22 of the corresponding light-receiving element 2 and the pads 51 of the wiring 5 are electrically connected by wires 8.

[0043] The light-transmitting component 6 is mounted on the sidewall 42 in a manner that covers the opening 40. The light-transmitting component 6 is mounted to the end face 42a of the sidewall 42 via an adhesive component 9. The material of the light-transmitting component 6 is, for example, glass. The light-transmitting component 6 is, for example, a rectangular plate with the X and Y directions as the extension directions of each side and the Z direction as the thickness direction. As an example, the length of each side of the light-transmitting component 6 is approximately tens of millimeters, and the thickness of the light-transmitting component 6 is approximately several hundred micrometers. The light-transmitting component 6 is separate from the light-receiving element 2 and the multiple conductive lines 8.

[0044] As described above, the light-receiving part 21 is biased towards one side in the X direction within the light-receiving element 2. Figure 1 (The middle is on the left). However, when viewed from the Z direction (the direction opposite to the opening 40 on the bottom wall 41), the center position C1 of the light-receiving part 21 coincides with the center position C2 of the package body 3 in the X direction (the specified direction). This is achieved by making the side located in the X direction ( Figure 1 The thickness of the side wall portion 43 (left side) is greater than that of the other side located in the X direction (right side). Figure 1The thickness of the sidewall portion 44 (right side) is achieved by adjusting the thickness of the sidewall portion 44. In addition, the center position C1 of the light-receiving portion 21 is also the center of gravity of the light-receiving portion 21 when viewed from the Z direction, and the center position C2 of the package 3 is also the center of gravity of the package 3 when viewed from the Z direction.

[0045] A through hole 10 is formed at the corner 47 of the sidewall 42. The corner 47 is the corner of the sidewall 42 as viewed from the Z direction, and is the corner formed by the sidewall portion 43 and the sidewall portion 46. Only one through hole 10 is formed in the sidewall 42. The through hole 10 connects the inside of the package 3 (i.e., the inner space of the package 3) with the outside of the package 3 (i.e., the outer space of the package 3). The inner end 11 of the through hole 10 is located on the inner surface 42d of the sidewall 42, and the outer end 12 of the through hole 10 is located on the outer surface 42c of the sidewall 42. When viewed from the Z direction, the inner end 11 of the through hole 10 is located in the Y direction (a predetermined direction) on the opposite side from the center position C2 of the package 3 and the center position C1 of the light-receiving portion 21.

[0046] like Figure 4 and Figure 5 As shown, the inner end portion 11 of the through-hole 10 is located in the Z direction closer to the opening 40 than the surface 2a of the light-receiving element 2. In this embodiment, the entire through-hole 10, including the inner end portion 11 and the outer end portion 12, is located in the Z direction closer to the opening 40 than the pad surface 42b. The cross-sectional shape of the through-hole 10 is, for example, rectangular. As an example, the width and height of the through-hole 10 are both approximately several hundred μm, and the width of the through-hole 10 is greater than its height.

[0047] The inner end 11 of the through hole 10 is located at the corner 47a inside the corner 47. The corner 47a is the corner of the inner surface 42d of the sidewall 42 when viewed from the Z direction. The outer end 12 of the through hole 10 is located on the outer surface of the sidewall portion 43. The sidewall portion 43 is the sidewall portion with the largest thickness among the multiple sidewall portions 43, 44, 45, and 46 constituting the sidewall 42. The through hole 10 has multiple bends 13. When viewed from the Z direction, the inner surface 10a of the through hole 10 has a circular shape at each bend 13 (i.e., a chamfered R shape).

[0048] Multiple grooves 48 and one groove (recess) 49 are formed on the outer surface 42c of the sidewall 42. Each groove 48 and 49 extends along the Z direction. The cross-sectional shape of each groove 48 and 49 is, for example, U-shaped. As an example, the width and depth of each groove 48 and 49 are approximately several hundred μm. A connection portion 53 of wiring 5 is disposed in each groove 48. The outer end 12 of the through hole 10 is located in the groove 49. No connection portion 53 of wiring 5 is disposed in the groove 49. The distance D1 between the connection portion 53 closest to the outer end 12 of the through hole 10 and the outer end 12 of the through hole 10 is greater than the distance D2 between the second connection portion 53 closest to the outer end 12 of the through hole 10 and the connection portion 53 closest to the outer end 12 of the through hole 10.

[0049] As explained above, in the photodetector 1, in the ceramic housing 4, the pad surface 42b of the pads 51 of each wiring 5 is located closer to the opening 40 than the mounting surface 41a of the light-receiving element 2, which is mounted by the adhesive member 7. Therefore, the adhesive member 7 cannot easily reach the pad surface 42b, and thus, the terminals 22 of the corresponding light-receiving element 2 and the pads 51 of the wiring 5 are reliably connected by the wires 8. Furthermore, in the photodetector 1, in the ceramic housing 4, the inner end 11 of the through hole 10 formed in the sidewall 42 is located closer to the opening 40 than the surface 2a of the light-receiving element 2. Therefore, the inner end 11 of the through hole 10 is less likely to be blocked by the adhesive member 7, thus ensuring ventilation inside and outside the package 3 and reliably preventing condensation inside the package 3 (e.g., condensation caused by the temperature difference generated during the reflow process when mounting the photodetector 1). Through the above, based on the photodetector 1, the electrical connection between the multiple wirings 5 ​​disposed in the package 3 and the photoreceiving element 2 housed in the package 3 can be reliably implemented, and condensation inside the package 3 can be reliably prevented.

[0050] In the photodetector 1, since the inner end 11 of the through-hole 10 is located closer to the opening 40 than the surface 2a of the light-receiving element 2, air can be smoothly discharged from inside the package 3 to outside the package 3. Furthermore, since the inner end 11 of the through-hole 10 is located closer to the opening 40 than the surface 2a of the light-receiving element 2, even if gas is generated by the self-adhesive member 9, the gas can be efficiently discharged from inside the package 3 to outside the package 3. Moreover, since the inner end 11 of the through-hole 10 is located closer to the opening 40 than the surface 2a of the light-receiving element 2, the inner end 11 of the through-hole 10 is less likely to be blocked by the adhesive member 7. Therefore, the distance between the light-receiving element 2 and the sidewall 42 can be reduced, thereby achieving miniaturization of the photodetector 1. In addition, when the light-receiving element 2 is a back-incident solid-state imaging element, and a resin adhesive component is used between the support substrate and the device layer, condensation is likely to occur inside the package 3 due to the hygroscopicity of the resin adhesive component. Therefore, it is particularly effective to provide a through hole 10 in the receiving component 4.

[0051] In the photodetector 1, the inner end 11 of the through-hole 10 is located closer to the opening 40 than the pad surface 42b. Therefore, even if foreign objects enter the package 3 through the through-hole 10, they are easily captured on the pad surface 42b. Furthermore, the light-receiving portion 21 is separated from the inner end 11 of the through-hole 10 only by the pad surface 42b. Through these measures, even if foreign objects enter the package 3 through the through-hole 10, their arrival at the light-receiving portion 21 can be prevented.

[0052] In the photodetector 1, since the inner end 11 of the through hole 10 is located closer to the opening 40 than the pad surface 42b, the freedom of laying multiple wirings 5 ​​can be ensured in the part of the side wall 42 that is closer to the bottom wall 41 than the pad surface 42b.

[0053] In the photodetector 1, the through-hole 10 has multiple bends 13. This prevents foreign objects from entering the package 3 through the through-hole 10.

[0054] In the photodetector 1, the inner surface 10a of the through hole 10 is circular in each bend 13. As a result, the housing member 4 is less likely to be damaged in each bend 13, and thus, foreign objects caused by such damage can be prevented from entering the package 3.

[0055] In the photodetector 1, there is one through-hole 10. Therefore, compared with the case where there are multiple through-holes 10, it is possible to suppress foreign objects from entering the package 3 through the through-hole 10.

[0056] In the photodetector 1, the inner end 11 of the through hole 10 is located at the corner 47a of the inner surface 42d of the sidewall 42. This allows for smooth ventilation between the inside and outside of the package 3.

[0057] In the photodetector 1, a through-hole 10 is formed at the corner 47 of the sidewall 42. This increases the length of the through-hole 10, thereby preventing foreign objects from entering the package 3 through the through-hole 10.

[0058] In the photodetector 1, the outer end 12 of the through hole 10 is located on the outer surface of the side wall portion 43, which has the largest thickness among the multiple side wall portions 43, 44, 45, and 46. As a result, the length of the through hole 10 can be increased, thereby preventing foreign objects from entering the package 3 through the through hole 10.

[0059] In the photodetector 1, the outer end 12 of the through hole 10 is located in the groove 49 formed on the outer surface 42c of the sidewall 42. This can suppress the intrusion of foreign objects into the outer end 12 of the through hole 10.

[0060] In the photodetector 1, the distance D1 between the connecting portion 53 closest to the outer end 12 of the through hole 10 and the outer end 12 of the through hole 10 is greater than the distance D2 between the connecting portion 53 closest to the outer end 12 of the through hole 10 and the second connecting portion 53 closest to the outer end 12 of the through hole 10. This prevents molten solder from clogging the outer end 12 of the through hole 10 during the installation of the photodetector 1.

[0061] In the photodetector 1, when viewed from the Z direction, the center position C1 of the light-receiving part 21 coincides with the center position C2 of the package 3 in the X direction. Therefore, when installing the photodetector 1, the alignment of the light-receiving part 21 can be performed in the X direction with the package 3 as a reference.

[0062] In the photodetector 1, when viewed from the Z direction, the inner end 11 of the through hole 10 is located in the Y direction on the opposite side of the center position C2 of the package body 3 and the center position C1 of the light-receiving part 21. Therefore, in the Y direction, the light-receiving part 21 is separated from the inner end 11 of the through hole 10, so even if foreign objects enter the package body 3 through the through hole 10, it is possible to prevent foreign objects from reaching the light-receiving part 21.

[0063] In the photodetector 1, a gap is formed between the light-receiving element 2 and the sidewall 42. Therefore, even if foreign objects enter the package 3 through the through-hole 10, they are easily captured in the gap between the light-receiving element 2 and the sidewall 42, thus preventing foreign objects from reaching the light-receiving portion 21. In the photodetector 1, since the width of the gap formed between the light-receiving element 2 and the sidewall 42 is smaller than the width of the pad surface 42b, the overall miniaturization of the package 3 can be achieved. Even if the width of this gap is reduced, the inner end 11 of the through-hole 10 is located closer to the opening 40 than the surface 2a of the light-receiving element 2; therefore, the inner end 11 of the through-hole 10 is less likely to be blocked by the adhesive component 7.

[0064] In photodetector 1, the height difference between the surface 2a of the light-receiving element 2 and the pad surface 42b is less than the thickness of the light-receiving element 2. Therefore, it is easy to connect the wire 8 to the corresponding terminal 22 of the light-receiving element 2 and the pad 51 of the wiring 5.

[0065] This disclosure is not limited to the embodiments described above. For example, regarding the position of the inner end portion 11 of the through hole 10, it is sufficient that at least a portion of the inner end portion 11 of the through hole 10 is located in the Z direction closer to the opening 40 than the pad surface 42b. If the entire inner end portion 11 of the through hole 10 is located in the Z direction closer to the opening 40 than the mounting surface 41a, it is possible to prevent the inner end portion 11 of the through hole 10 from being blocked by the adhesive component 7.

[0066] Alternatively, at least a portion of the inner end 11 of the through hole 10 may be located in the Z direction closer to the opening 40 than the surface 2a of the light-receiving element 2. In this case, it is also possible to... Figure 6 As shown, the pad surface 42b is located in the Z direction closer to the opening 40 than the surface 2a of the light-receiving element 2, and at least a portion of the inner end 11 of the through hole 10 is located in the Z direction between the pad surface 42b and the surface 2a of the light-receiving element 2. Alternatively, it can be as follows... Figure 7 As shown, the surface 2a of the light-receiving element 2 is located closer to the opening 40 in the Z direction than the pad surface 42b, and at least a portion of the inner end 11 of the through hole 10 is located closer to the opening 40 in the Z direction than the pad surface 42b and the surface 2a of the light-receiving element 2.

[0067] Furthermore, the shape and number of through holes 10 are not limited to those described above, as long as they are formed on the sidewall 42. For example, the through hole 10 may have at least one bend 13. Alternatively, the through hole 10 may not have a bend 13. Additionally, the outer end 12 of the through hole 10 may be located in a recess other than a groove 48. Furthermore, multiple through holes 10 may be formed on the sidewall 42.

[0068] Alternatively, the light-receiving element 2 can also be a surface-incident solid-state imaging element. Alternatively, the light-receiving element 2 can also be a PD array, etc. Furthermore, the pad surface 42b can be formed on the bottom wall 41 or the side wall 42. However, from the viewpoint of miniaturizing the package 3 as a whole, it is preferable to form the pad surface 42b on the side wall 42 compared to forming it on the bottom wall 41.

[0069] Explanation of symbols:

[0070] 1…photodetector, 2…light-receiving element, 2a…surface, 21…light-receiving part, 22…terminal, 3…package, 4…receiving component, 40…opening, 41…bottom wall, 41a…mounting surface, 42…side wall, 42b…pad surface, 42c…outer surface, 42d…inner surface, 43, 44, 45, 46…side wall portion, 47…corner portion, 47a…corner portion, 49…groove (recess), 5…wiring, 51…pad, 53…connection portion, 6…light-transmitting component, 7…bonding component, 8…wire, 10…through hole, 10a…inner surface, 11…inner end, 12…outer end, 13…bend.

Claims

1. A light detector, wherein provided are: a light-receiving element provided with a light-receiving portion and a terminal; and a package that houses the light-receiving element, the package has: a housing member including a bottom wall and a side wall that defines an opening opposite the bottom wall, and is formed of ceramic; a wiring including a pad connected to the terminal by a lead wire, and is provided to the housing member; and a light-transmitting member installed to the side wall in a manner of covering the opening, in the bottom wall, a placement surface on which the light-receiving element is installed by an adhesive member is formed, in the bottom wall or the side wall, a pad surface on which the pad is disposed is formed at a position closer to the opening side than the placement surface, in the side wall, a through-hole that communicates between inside and outside of the package is formed, at least a part of an inner side end portion of the through-hole is located at a position closer to the opening side than a surface of the light-receiving element on the opening side, a gap is formed between the light-receiving element and the side wall, and a width of the gap is smaller than a width of the pad surface in a direction perpendicular to an extending direction of the pad surface along an inner edge of the side wall.

2. The light detector according to claim 1, wherein at least a part of the inner side end portion of the through-hole is located at a position closer to the opening side than the pad surface.

3. The light detector according to claim 1 or 2, wherein the through-hole has a curved portion.

4. The light detector according to claim 3, wherein an inner surface of the through-hole is in a circular shape at the curved portion.

5. The light detector according to any one of claims 1 to 4, wherein the through-hole is one.

6. The light detector according to any one of claims 1 to 5, wherein an inner side surface of the side wall has a corner portion when viewed in a direction in which the bottom wall opposes the opening, the inner side end portion of the through-hole is located at the corner portion.

7. The light detector according to any one of claims 1 to 6, wherein the side wall has an angular portion when viewed in a direction in which the bottom wall opposes the opening, the through-hole is formed at the angular portion.

8. The light detector according to any one of claims 1 to 7, wherein the side wall is composed of a plurality of side wall portions, an outer side end portion of the through-hole is located at an outer side surface of a side wall portion having a largest thickness among the plurality of side wall portions.

9. The light detector according to any one of claims 1 to 8, wherein a recessed portion is formed at an outer side surface of the side wall, an outer side end portion of the through-hole is located at the recessed portion.

10. The light detector according to any one of claims 1 to 9, wherein the wiring includes a plurality of connection portions that extend in a direction in which the bottom wall opposes the opening along an outer side surface of the side wall, a distance between a connection portion closest to an outer side end portion of the through-hole and the outer side end portion of the through-hole is greater than a distance between the connection portion closest to the outer side end portion of the through-hole and a connection portion second closest to the outer side end portion of the through-hole.

11. The light detector according to any one of claims 1 to 10, wherein ​ The center position of the light-receiving portion coincides with the center position of the package body in at least a prescribed direction when viewed in a direction opposite to the bottom wall from the opening.

12. The light detector according to any one of claims 1 to 11, wherein The inner side end portion of the through-hole is located at a position opposite to the center position of the light-receiving portion with respect to the center position of the package body in at least a prescribed direction when viewed in a direction opposite to the bottom wall from the opening.

13. The light detector according to any one of claims 1 to 12, wherein The surface of the opening side of the light-receiving element has a height difference from the pad face smaller than the thickness of the light-receiving element.

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