Pressure spring, pressure structure, terminal and pressure triggering method

Abstract

The application relates to a pressure spring, a pressure structure, a terminal and a pressure triggering method. The triggering method comprises the following steps: through force borne by the cover plate assembly, the distance between the spring body and the second pin is changed, so that the capacitance value of the spring body and the second pin is changed, and the capacitance value signal is output. The pressure calibration strategy and scheme of the pressure triggering method have the beneficial effects that the size fluctuation of different materials can be solved, and the pressure function effect of the product is ensured.

Description

Technical Field

[0001] This application relates to the field of button technology, and in particular to pressure springs, pressure structures, terminals, and pressure triggering methods. Background Technology

[0002] With the trend of intelligent automotive interiors, technologies from consumer electronics, especially mobile phones, such as touch technology and pressure sensing technology, have matured and been implemented in automotive interiors. Traditional physical button switch panels in cars are also being upgraded to switch panels with touch intelligent surface technology. In the process of vigorously promoting touch technology, the mainstream technology on the market is currently capacitive touch technology. In order to meet the requirement that users can operate even when wearing gloves, the touch threshold is generally set to be relatively low, which leads to the sensing function being too sensitive and frequent false triggering.

[0003] The current solution involves introducing pressure-sensitive touch detection technology. The function is triggered only when both conditions are met: the touch receives a signal and the surface pressure reaches a set value. Pressure-sensitive touch technology in automotive applications primarily uses three structures: piezoresistive strain sensors, pressure sensors based on microelectromechanical systems (MEMS) technology, and capacitive touch diaphragms.

[0004] The structures of sensors such as resistance strain gauge sensors, pressure sensors based on microelectromechanical systems (MEMS) technology, and capacitive pressure sensors based on capacitive touch diaphragms are relatively complex. Pressure sensors based on MEMS technology require complex assembly in the application terminal, necessitating additional silicone pads, PCBs, or lead-connector connectors. These sensors suffer from complex installation methods, poor assembly tolerance compatibility, and high costs. Furthermore, their advanced manufacturing processes result in high sensor prices, leading to an overall high cost for the solution. Resistance strain gauge sensors, on the other hand, suffer from excessively high temperatures due to the heat generated by the strain gauge. Different environments cause significant resistance variations, resulting in noticeable zero-point drift and overly complex zero-adjustment circuits. High resistance also leads to high impedance and poor resistance to external electromagnetic interference. Additionally, the opaque nature of resistance strain gauges significantly limits their application in automotive touch button designs that require character backlighting. Based on capacitive touch diaphragms and capacitive pressure sensors, this solution requires two touch diaphragms. The leads of each diaphragm need to be connected to the PCB via connectors, resulting in numerous assembly parts and higher costs. Furthermore, capacitive touch diaphragms and capacitive pressure sensors require a near-flat cover shape. Arched covers are too rigid to deform, preventing functionality. Similarly, if the cover surface has an uneven surface, even with consistent material thickness, the back of the cover may also be uneven, making it difficult to fit the touch diaphragm and rendering the function unusable. Compatibility with curved or uneven cover surfaces is poor.

[0005] Application content

[0006] This application provides a pressure spring, including a spring body, with at least a first connecting arm and a second connecting arm connected to the side of the spring body, and the height of the spring body is higher than the height of the free ends of the first connecting arm and the second connecting arm.

[0007] Optionally, the spring body has a square structure, and the first connecting arm and the second connecting arm are respectively connected to opposite sides of the spring body.

[0008] Optionally, both the first connecting arm and the second connecting arm include a connecting part, a bending part, and a fixing part connected in sequence. The connecting part is connected to the spring body, and the fixing part is connected to the pins of the PCB board. The bending part is composed of at least two non-collinear connecting plates or the bending part is composed of an arc-shaped plate.

[0009] Optionally, the fixing portions of the first connecting arm and the second connecting arm protrude inward, making the first connecting arm and the second connecting arm "L" shaped; the spring body is provided with a first groove that matches the fixing portion.

[0010] Optionally, the spring body has a circular structure, and a third connecting arm is provided on the outer side of the spring body. The first connecting arm, the second connecting arm, and the third connecting arm are respectively arranged along the outer side of the spring body.

[0011] Optionally, the first connecting arm, the second connecting arm, and the third connecting arm each include a connecting part, a bending part, and a fixing part connected in sequence. The connecting part is connected to the spring body, and the fixing part is connected to the pins of the PCB board. The bending part is composed of at least two non-collinear connecting plates or the bending part is composed of an arc-shaped plate.

[0012] In addition, this application also provides a pressure structure, including a PCB board and at least one pressure spring as described above. The PCB board is provided with at least a first pin, a second pin, and a third pin. The first pin is connected to a first connecting arm, the third pin is connected to a second connecting arm, and the second pin is disposed adjacent to the spring body and forms a capacitor.

[0013] In addition, this application also provides a terminal, including a cover plate assembly, a bracket, and the aforementioned pressure structure, wherein the PCB board is disposed at the lower end of the bracket, and the cover plate assembly is movably disposed at the upper end of the bracket; the cover plate assembly is provided with a pressure support column, which passes through the bracket and is disposed at the upper end of the pressure spring.

[0014] Optionally, the lower end of the cover plate assembly is provided with at least one bolt post, the bracket is provided with a fixing hole, the bolt post extends into the fixing hole and is limited by bolt screwing; a buffer silicone is also provided between the bolt post and the fixing hole.

[0015] Optionally, the cover plate assembly includes a light box, a touch film, and a cover plate connected in sequence. LED beads are also provided on the PCB board. The light source of the LED beads is projected outward through a first light-transmitting hole provided on the bracket, a second light-transmitting hole provided on the light box, and an indicator character provided on the cover plate.

[0016] In addition, this application also provides a pressure triggering method based on the above-mentioned terminal, the method comprising:

[0017] By applying force to the cover plate assembly, the distance between the spring body and the second pin is changed, thereby changing the capacitance value between the spring body and the second pin, and outputting a capacitance value signal.

[0018] Optionally, the pressure structure includes a PCB board and multiple pressure springs. The capacitance value output by the sensing structure is equal to the sum of the capacitances between the multiple pressure springs and the PCB board. The pressure is triggered by outputting a corresponding position signal through the touch diaphragm of the terminal.

[0019] Its beneficial effects are as follows: The pressure spring of this application can be an integrated pressure metal sheet, simplifying the complex structure of the pressure sensor. It can be manufactured using conventional sheet metal processes, resulting in a significant cost advantage. The terminal of this application, through the structural design of the pressure support column of the cover plate, avoids the planar limitations of the cover plate shape in the current capacitive touch diaphragm solution, increasing the freedom of interior styling design and meeting and enriching users' diverse needs for interior styling. At the same time, it avoids the problem of the opacity of the resistance strain gauge itself, greatly increasing the feasibility of functional character layout. Because the pressure structure of this application adopts a capacitive technology solution, it converts pressure into displacement parameters of the pressure metal sheet, and then into a capacitive signal. There is no heat generation during the energy conversion process, which avoids the problem of excessive temperature caused by the heat generation of the strain gauge in the resistance strain gauge sensor. This leads to large changes in the resistance value of the strain gauge and obvious zero-point drift in different environments. The pressure spring of this application can be an integrated pressure metal sheet, with a cantilever structure providing elasticity. The fixing feet are directly soldered to the PCB. Combined with the pre-compression concept of the pressure support column, it can greatly simplify the assembly process and reduce the number of materials required for other pressure sensing solutions. For example, it eliminates the need for silicone pads attached to the pressure sensor surface to absorb assembly tolerances, insulating adhesive as in capacitive diaphragm pressure solutions, lead wires for touch diaphragms, and corresponding connectors. This reduces the difficulty and cost of assembly processes, significantly enhancing product competitiveness. The terminal of this application can use a common touch diaphragm processing IC to achieve the desired functionality, eliminating the need for additional pressure sensor analysis ICs and simplifying the circuitry. The pressure calibration strategy and scheme of this application's pressure triggering method can address the impact of dimensional fluctuations in different materials, ensuring the pressure function performance of the product. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the pressure spring in an embodiment of this application. Figure 1 .

[0022] Figure 2 This is a schematic diagram of the pressure spring in an embodiment of this application. Figure 2 .

[0023] Figure 3 This is a schematic diagram of the pins of the PCB board according to an embodiment of this application.

[0024] Figure 4 This is a schematic diagram of the pressure spring in an embodiment of this application in a state where it is not under force.

[0025] Figure 5 This is a schematic diagram of the stress state of the pressure spring sheet according to an embodiment of this application.

[0026] Figure 6 This is an exploded view of the terminal according to an embodiment of this application.

[0027] Figure 7 This is a terminal cross-sectional view of an embodiment of this application.

[0028] Figure 8 This is a schematic diagram of a panel component according to an embodiment of this application.

[0029] Figure 9 This is a schematic diagram of terminal pressing according to an embodiment of this application. Detailed Implementation

[0030] Please refer to the diagrams, where the same component symbols represent the same components. The principles of this application are illustrated by way of example implementation in a suitable computing environment. The following description is based on the specific embodiments of this application exemplified, and should not be construed as limiting other specific embodiments not detailed herein.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] Example 1,

[0033] In such Figure 1-9In the illustrated embodiment, this application provides a pressure spring 200, including a spring body 210. At least a first connecting arm 220 and a second connecting arm 230 are connected to the side of the spring body 210. The height of the spring body 210 is higher than the height of the free ends of the first connecting arm 220 and the second connecting arm 230. In this embodiment, the pressure spring is used to form an inductive capacitor with the PCB board. The first and second connecting arms can be soldered to the pins of the PCB board. Since the spring body is higher than the free ends of the first and second connecting arms, a height difference is formed between the spring body and the PCB board, i.e., the spring body and the second pin of the PCB board form two parallel capacitor plates. The first and second connecting arms can be inclined plates or arc-shaped plates. The pressure spring can be a metal plate structure, so the first and second connecting arms can be deformed to change the height of the spring body, thereby changing the capacitance value between the spring body and the PCB board; thus achieving button triggering. The pressure spring of this application can be a one-piece pressure metal sheet, simplifying the complex structure of pressure sensors. It can be manufactured using conventional sheet metal processes, resulting in a significant cost advantage. The pressure spring of this application can be a one-piece pressure metal sheet, with a cantilever structure providing elasticity. The fixing feet are directly soldered to the PCB. Combined with the pre-compression concept of the pressure support column, it can greatly simplify the assembly process and reduce the amount of materials required for other pressure sensing solutions.

[0034] In some embodiments, the spring body 210 has a square structure, and the first connecting arm 220 and the second connecting arm 230 are respectively connected to opposite sides of the spring body. Both the first connecting arm 220 and the second connecting arm 230 include a connecting portion 221, a bending portion 222, and a fixing portion 223 connected in sequence. The connecting portion 221 is connected to the spring body 210, and the fixing portion is connected to the pins of the PCB board. The bending portion 222 is composed of at least two non-collinear connecting plates or is composed of an arc-shaped plate. The fixing portions of the first connecting arm 220 and the second connecting arm 230 protrude inwards, making the first connecting arm 220 and the second connecting arm 230 "L"-shaped. The spring body 210 is provided with a first groove 211 matching the fixing portion. In this embodiment, the height of the spring body changes through the deformation of the first connecting arm and the second connecting arm. A one-piece metal spring structure is used to optimize the complex structure of the pressure sensor. Figure 4 As shown, the functionality is as follows: the fixing parts of the first and second connecting arms are on the same plane and are fixed to the PCB by soldering. The free ends of the first and second connecting arms can increase the solder contact area and reduce deflection. The first and second connecting arms not only provide the spring body with the ability to return to its initial position after being deformed by pressure, but also transmit the capacitance signal from the fixing part to the spring body. After being powered on, the spring body receives charging and stores charge through the first and second connecting arms. When the upper surface of the spring body is subjected to force, the displacement signal is converted into a capacitance signal.

[0035] In some embodiments, the spring body 210 has a circular structure, and a third connecting arm 240 is provided on the outer side of the spring body 210. The first connecting arm 220, the second connecting arm 230, and the third connecting arm 240 are respectively arranged along the outer side of the spring body 210. The first connecting arm, the second connecting arm, and the third connecting arm each include a connecting part, a bending part, and a fixing part connected in sequence. The connecting part is connected to the spring body, and the fixing part is connected to the pins of the PCB board. The bending part is composed of at least two non-collinear connecting plates or an arc-shaped plate. In this embodiment, the third connecting arm can also be provided on the outer side of the elastic body to make its structure more stable. The first connecting arm, the second connecting arm, and the third connecting arm can be equidistantly connected on the outer side of the spring body. In some embodiments, the pressure spring can be increased from 2 connecting arms to 3 connecting arms by adding a fixing foot. When the metal plane deflects and moves downward during the pressing process, the number of connecting arms can be increased to more than 4. The method and principle are the same as those of this solution and are all within the protection scope of this application.

[0036] Example 2,

[0037] In some embodiments, this application also provides a pressure structure, including a PCB board and at least the aforementioned pressure spring. The PCB board 100 is provided with at least a first pin PIN1, a second pin PIN2, and a third pin PIN3. The first pin PIN1 is connected to a first connecting arm, the third pin PIN3 is connected to a second connecting arm, and the second pin PIN2 is disposed adjacent to the spring body and forms a capacitor. In this embodiment, one or more pressure springs can be provided on a PCB board. The first connecting arm and the second connecting arm of the pressure spring are respectively soldered to the first pin and the third pin of the PCB board. The circuit connection method of the pressure-sensing metal sheet is as follows: Figure 8 As shown, there are two possible solutions:

[0038] First, the self-capacitive scheme: the pattern on the PCB is defined as follows: the first and third pins are GND, the second pin is the receiver RX, and the entire spring body is connected to the PCB through the first pin PIN1 and the third pin PIN3, defined as GND. The area between the spring body and PIN2 is the effective parallel plate capacitance area.

[0039] Second, the mutual capacitance scheme, the pattern on the PCB is defined as follows: the first pin PIN1 and the third pin PIN3 are the transmitter TX, the second pin PIN2 is the receiver RX, and the entire pressure spring is connected to the PCB through PIN1 and PIN3, which is defined as TX. The area of ​​PIN2 is the effective parallel plate capacitance area. This scheme only needs to use an IC that supports touch diaphragm to be compatible with pressure sensing function, and does not require an additional signal conversion IC for pressure signal processing.

[0040] The distance H0 between the pressure structure spring body and the welding plane of the fixing part is 1. The cantilever is in a symmetrical cross shape. According to the basic principle of parallel plate capacitor, the capacitance value of parallel plate capacitor is C = ε0 * ε r *A / H0, where C is the capacitance, ε0 is the vacuum permittivity, and ε r The relative permittivity of the medium between the plates, A is the effective area of ​​the plates, and H0 is the distance between the two parallel plates, such as... Figure 3-5 As shown, the sensing pattern on the PCB is a fixed electrode, i.e., a fixed plate, and the spring body on the pressure spring is a moving electrode, i.e., a moving plate. When the spring body is assembled and not subjected to external pressure, the initial height is H0, corresponding to the capacitance value Ct. When the geometric center of the spring body is subjected to external pressure, the spring body will slightly deflect clockwise and move downward, with the distance changing from H0 to H1, corresponding to the capacitance C1. The change in capacitance ΔC = C1 - C0. The pressure sensing processing unit can receive the change in capacitance and compare it with the trigger threshold reference value Cj set by the software program. When the change is greater than the threshold value, the function is triggered.

[0041] Example 3,

[0042] In some embodiments, this application also provides a terminal, including a cover plate assembly 400, a bracket 300, and the aforementioned pressure structure. A PCB board 100 is disposed at the lower end of the bracket 300, and the cover plate assembly 400 is movably disposed at the upper end of the bracket. The cover plate assembly is provided with a pressure support column 401, which passes through the bracket and is disposed at the upper end of the pressure spring 200. At least one bolt post 402 is provided at the lower end of the cover plate assembly, and the bracket 300 is provided with a fixing hole. The bolt post 402 extends into the fixing hole and is limited by bolt screwing. A buffer silicone 500 is also provided between the bolt post and the fixing hole. The cover plate assembly 400 includes a light box 405, a touch film 404, and a cover plate 404 connected in sequence. LED beads are also provided on the PCB board. The light source of the LED beads is projected outward through a first light-transmitting hole provided in the bracket, a second light-transmitting hole provided in the light box, and an indicator character provided in the cover plate. In this embodiment, the application example of the terminal product, the cover assembly consists of a cover plate, a touch diaphragm, and a light box. The touch diaphragm is adhered to the back of the cover plate using optical adhesive (OCA). The cover plate and light box can be fixed using ultrasonic welding, structural adhesive, or laser welding. The surface of the cover plate has printed switch panel function characters (A, B, C...H). The cover plate can be manufactured using IML technology, with a black background and the character areas cut out using semi-transparent ink to achieve hidden characters. The back of the cover assembly has a light hole structure for allowing the characters to pass through and the main structure for pressure sensing, including three pressure support pillars and four screw pillars, as well as leads for connecting the touch diaphragm.

[0043] Specifically, a pre-compression concept is required between the pressure support column and the pressure spring to eliminate dimensional tolerances during assembly. The pre-compression dimension is defined as L0, which is set between 0.2mm and 0.3mm and can be adjusted according to the stroke S required to press the cover plate. The initial distance between the metal plane of the pressure spring and the sensing pattern on the PCB board is defined as H0, which is set between 0.6mm and 0.8mm. After pre-compression during assembly, the distance Hp between the pressure spring and the sensing pattern on the PCB board is 0.3mm-0.6mm. The length of the pressure support column after assembly is defined as L1, and the tolerance of L1 is ±0.1mm. Because of the cantilever structure of the integrated pressure metal sheet, elasticity and the pre-compression concept design ensure that the spring body and the pressure support column are always in close contact without any play. Three pressure metal plates, a, b, and c, are placed on the PCB board. These three pressure metal plates are soldered onto the PCB in a triangular arrangement, avoiding the backlight LEDs of the function key characters, and equally dividing the function key area. The cover plate is supported by the buffer silicone pad and the pressure spring on the pressure support column. Because the distance between the function character and the support point of the buffer silicone pad and the pressure support column of the cover plate is different, the same force Fp applied to different characters will correspond to different pressing strokes. Different pressing strokes will result in different travel of the pressure metal plates.

[0044] Example 4,

[0045] In some embodiments, this application also provides a pressure triggering method based on the above-described terminal. This method includes: changing the distance between the spring body and the second pin by applying force to the cover plate assembly, thereby changing the capacitance value between the spring body and the second pin, and outputting a capacitance value signal. The pressure structure includes a PCB board and multiple pressure springs. The capacitance value output by the sensing structure is equal to the sum of the capacitances between the multiple pressure springs and the PCB board. In this embodiment, due to dimensional tolerance fluctuations during material production, the length of the pressure support column will fluctuate, causing fluctuations in the initial pressure metal sheet and the PCB sensing pattern's spacing Hp. The relationship between the capacitance values ​​of the pressure metal sheet corresponding to each button's pressure level can be recorded through the online calibration process of the production process, as shown in Table 1.

[0046]

[0047] Table 1

[0048] Different pressures are applied using a load cell, resulting in three levels: Level 1, Level 2, and Level 3. The geometric center of each functional character on the cover is located, and the cover's displacements H1, H2, and H3 are recorded. Simultaneously, the touch chip receives capacitance values ​​Ct from three different pressure springs at these pressure levels using testing software. These three capacitance values ​​are then summed to obtain capacitance values ​​Ct1, Ct2, and Ct3 corresponding to different pressure levels, i.e., Ct1 = C1a + C1b + C1c, where C1a is the capacitance value of the first pressure spring, C1b is the capacitance value of the second pressure spring, and C1c is the capacitance value of the third pressure spring. This data is recorded in the product software to obtain the trigger capacitance values ​​for each character key at different pressure levels, thus achieving multi-level pressure touch. When a user operates a specific function key, the scenario is as follows: pressing the corresponding operation character, the touch diaphragm recognizes the position and function of the specific key character, but does not trigger it. Simultaneously, when the pressure reaches the corresponding level, the touch chip detects the corresponding capacitance value, and only then is the key function triggered. This effectively prevents accidental touch triggering. Furthermore, different functions can be defined according to different pressure levels, achieving different functions for multi-level pressure touch. In the pressure calibration scheme of this application, three pressure metal springs are used. The number of pressure metal springs can be optimized according to the number of function keys on the cover. For example, one pressure metal spring can be used for 1-4 keys, and two pressure metal springs can be used for 5-7 keys. The larger the number of function characters, the larger the size of the cover will be. The corresponding number of pressure metal springs can be determined based on the force and displacement analysis. In the pressure calibration scheme of this application, the calculated capacitance threshold is calculated by summing the values ​​of three pressure metal springs corresponding to different pressure levels. An alternative scheme is to use the distances La, Lb, and Lc between the geometric center distances of different key characters and the placement positions of different pressure sensing metal springs as weighting coefficients and then summing them as the trigger threshold. Another alternative scheme is to use the maximum value of the three pressure metal springs as the trigger threshold.

[0049] The terms “a” and “a”, and similar words (especially in the appended claims) used in describing the concept of this application should be interpreted as covering both the singular and the plural. Furthermore, unless otherwise stated herein, numerical ranges are referred to herein merely as a shortcut for each individual value belonging to the relevant range, and each individual value is incorporated herein as if it were stated separately. Additionally, unless otherwise indicated herein or the context clearly suggests otherwise, the steps of all methods described herein can be performed in any suitable order. Changes to this application are not limited to the order of the described steps. Unless otherwise claimed, the use of any and all instances or exemplary language (e.g., “for example”) provided herein is merely for the purpose of better illustrating the concept of this application and is not intended to limit the scope of the concept of this application. Various modifications and adaptations will be readily apparent to those skilled in the art without departing from the spirit and scope.

[0050] The electronic device control method, apparatus, storage medium, and electronic device provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A pressure terminal, characterized by The pressure structure comprises a PCB board and at least one pressure spring; The PCB board is arranged at the lower end of the support, and the cover plate assembly is movably arranged at the upper end of the support; the cover plate assembly is provided with a pressure support column, which passes through the support and is arranged at the upper end of the pressure spring; The pressure spring comprises a spring body, and at least a first connecting arm and a second connecting arm are connected to the side edges of the spring body; the height of the spring body is higher than the heights of the free ends of the first connecting arm and the second connecting arm; The PCB board is provided with at least a first pin, a second pin and a third pin; the first pin is connected to the first connecting arm, the third pin is connected to the second connecting arm, and the second pin is arranged adjacent to the spring body and forms a capacitor; The lower end of the cover plate assembly is provided with at least one bolt column, the support is provided with a fixing hole, the bolt column is arranged in the fixing hole and is limited by a bolt, and a buffer silica gel is arranged between the bolt column and the fixing hole; The first connecting arm and the second connecting arm are respectively connected to opposite sides of the spring body, and a third connecting arm is further arranged outside the spring body; the first connecting arm, the second connecting arm and the third connecting arm are respectively arranged along the outside of the spring body; The cover plate assembly comprises a lamp box, a touch film and a cover plate which are sequentially connected; the PCB board is further provided with an LED lamp bead; the support is provided with a first light-transmitting hole; the lamp box is provided with a second light-transmitting hole; and the cover plate is provided with indicating characters; the light source of the LED lamp bead sequentially passes through the first light-transmitting hole, the second light-transmitting hole and the indicating characters and projects outward.

2. A pressure terminal according to claim 1, characterized in that The spring body is in a square structure.

3. A pressure terminal according to claim 2, characterised in that The first connecting arm and the second connecting arm each comprise a connecting portion, a bending portion and a fixing portion which are sequentially connected; the connecting portion is connected to the spring body, and the fixing portion is connected to the pin of the PCB board; the bending portion is composed of at least two non-collinear connecting plates or is composed of an arc-shaped plate.

4. A pressure terminal according to claim 2, wherein The fixing portions of the first connecting arm and the second connecting arm are inwardly protruding, so that the first connecting arm and the second connecting arm are in an "L" shape; the spring body is provided with a first groove matched with the fixing portion.

5. A pressure terminal according to claim 1, wherein The spring body is in a circular structure.

6. A pressure terminal according to claim 5, characterised in that The first connecting arm, the second connecting arm and the third connecting arm each comprise a connecting portion, a bending portion and a fixing portion which are sequentially connected; the connecting portion is connected to the spring body, and the fixing portion is connected to the pin of the PCB board; the bending portion is composed of at least two non-collinear connecting plates or is composed of an arc-shaped plate.

7. A pressure trigger method based on the pressure terminal of any of claims 1-6, characterized by, The method comprises: The distance between the spring body and the second pin is changed by the stress of the cover plate assembly, so that the capacitance value of the spring body and the second pin is changed, and a capacitance value signal is output.

8. The pressure triggered method of claim 7, wherein, The pressure structure comprises a PCB board and a plurality of pressure springs; the capacitance value output by the terminal is equal to the sum of the capacitances between the plurality of pressure springs and the PCB board; and the terminal outputs a position signal corresponding to the position of the touch film, and the pressure trigger is performed.

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