Component packaging method and component packaging structure

Abstract

A component packaging method and component packaging structure, the method comprising: forming a plurality of metal pads on a carrier, and forming metal wires between adjacent metal pads; forming a patterned shielding layer, the shielding layer covering the metal pads and exposing the metal wires; etching the metal wires to form grooves; mounting components on the carrier, wherein the components are electrically connected to at least a portion of the metal pads; forming an encapsulation colloid layer, and the encapsulation colloid layer at least fills the grooves between the components and the carrier. The present invention can form an isolation area between adjacent metal pads, improve the signal short circuit problem, and avoid delamination between the encapsulation colloid layer and the carrier.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a component packaging method and a component packaging structure. Background Art

[0002] At present, the demand for terminal electronic products is increasingly leaning towards light, thin, short and small, which has led to the development of chip packaging towards high density and thinness. In order to achieve thinness, embedded trace substrate (ETS) technology has been developed and widely used.

[0003] In the existing ETS technology, a carrier board having a plurality of metal pads is provided, and then components are mounted on the carrier board, and then a packaging colloid material is filled so that the components and the metal pads are embedded in the packaging colloid material.

[0004] However, since the distance between components and the carrier is often small, voids are easily formed during the filling process of the encapsulation colloid material, and then due to the accumulation of water vapor, signal short circuit problems may occur. Even when the void is large, delamination between the encapsulation colloid material and the carrier may occur.

[0005] There is an urgent need for a component packaging method that can improve the signal short circuit problem and avoid delamination between the packaging colloid layer and the carrier board. Summary of the invention

[0006] The technical problem solved by the present invention is to provide a component packaging method and a component packaging structure, which can form an isolation area between adjacent metal pads, improve the signal short circuit problem, and avoid delamination between the packaging colloid layer and the carrier board.

[0007] To solve the above technical problems, an embodiment of the present invention provides a component packaging method, comprising: forming a plurality of metal pads on a carrier, and forming metal wires between adjacent metal pads; forming a patterned shielding layer, wherein the shielding layer covers the metal pads and exposes the metal wires; etching the metal wires to form grooves; mounting components on the carrier, wherein the components are electrically connected to at least a portion of the metal pads; and forming a packaging colloid layer, wherein the packaging colloid layer at least fills the groove between the components and the carrier.

[0008] Optionally, the distance between the edge of the shielding layer and the adjacent metal wire is less than or equal to a first preset distance.

[0009] Optionally, the distance between the edge of the shielding layer and the adjacent metal pad is greater than or equal to a second preset distance.

[0010] Optionally, the metal pad and the metal line are formed by the same process.

[0011] Optionally, the material of the metal pad and the metal wire is selected from: copper, aluminum, silver, gold, platinum, and titanium.

[0012] Optionally, the material of the metal wire is copper, and the etchant used to etch the metal wire is aqua regia.

[0013] Optionally, before forming the patterned shielding layer, the method further comprises: forming a solder resist layer covering the carrier board, wherein solder openings of the solder resist layer expose metal pads that need to be electrically connected to the components.

[0014] Optionally, before mounting components on the carrier board, the method further includes: removing the shielding layer.

[0015] Optionally, the packaging colloid layer also covers the components and the metal pad.

[0016] Optionally, the carrier board is selected from: a prepreg sheet and a core board.

[0017] To solve the above technical problems, an embodiment of the present invention provides a component packaging structure, comprising: a carrier board, on which components are mounted; a plurality of metal pads, located on the carrier board, wherein the components are electrically connected to at least a portion of the metal pads; a groove, located on the surface of the carrier board; and a packaging colloid layer, at least filling the groove between the component and the carrier board; wherein the groove is formed by etching the metal wire on the carrier board, and the metal wire is formed between adjacent metal pads.

[0018] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0019] In an embodiment of the present invention, a metal wire is formed between adjacent metal pads, and then the metal wire is etched to form a groove under the protection of the metal pad by a shielding layer. The groove can be used to increase the height difference between the component and the carrier, which is beneficial to the filling of the packaging colloid material, thereby forming an isolation area between adjacent metal pads, improving the signal short circuit problem, and avoiding the delamination between the packaging colloid layer and the carrier.

[0020] Furthermore, the distance between the edge of the shielding layer and the adjacent metal line is less than or equal to a first preset distance. On the basis of the shielding layer protecting the metal pad, the width of the metal line can be increased as much as possible and the distance between the shielding layer and the metal line can be reduced, thereby increasing the width of the subsequently formed groove and forming a larger isolation area between adjacent metal pads, more effectively improving the signal short circuit problem, and more effectively avoiding the delamination between the encapsulation colloid layer and the carrier board.

[0021] Furthermore, the distance between the edge of the shielding layer and the adjacent metal pad is greater than or equal to a second preset distance, so that the shielding layer can extend a certain distance on the basis of covering the metal pad, thereby more effectively protecting the metal pad.

[0022] Furthermore, the metal pad and the metal line are formed by the same process, and the metal pad forming process in the prior art can be reused, effectively reducing manufacturing costs and research and development complexity. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 to Figure 2 It is a schematic diagram and a top view of a device cross-sectional structure corresponding to a component packaging method in the prior art;

[0024] Figure 3 is a flow chart of a component packaging method in an embodiment of the present invention;

[0025] Figures 4 to 9 It is a schematic diagram of the device cross-sectional structure and a top view corresponding to each step in a component packaging method in an embodiment of the present invention. DETAILED DESCRIPTION

[0026] As mentioned earlier, in order to achieve thinness, ETS technology was developed and widely used.

[0027] Combined with reference Figure 1 and Figure 2 , Figure 1 to Figure 2 It is a schematic diagram and a top view of a device cross-sectional structure corresponding to a component packaging method in the prior art. Figure 2 yes Figure 1 Sectional view along cutting line A1-A2, Figure 1 yes Figure 2 Sectional view along cutting line A3-A4.

[0028] Specifically, a plurality of metal pads 110 are formed on a carrier 100 , and then components 120 are mounted on the carrier 100 , wherein the components 120 are electrically connected to at least a portion of the metal pads 110 .

[0029] In the ETS technology, the metal pad 110 is embedded in the carrier 100 , that is, the surface of the metal pad 110 is lower than the surface of the carrier 100 .

[0030] It is understandable that the component 120 may face the carrier 100 with its active surface, and may be electrically connected to one or more metal pads 110 according to the component design scheme.

[0031] Specifically, flux may be used to weld the component 120 and the metal pad 110. It is understandable that the distance between the welded component 120 and the carrier 100 is small. In a specific implementation, other appropriate connection structures may be used to achieve electrical connection between the component 120 and the metal pad 110.

[0032] Then, an encapsulation glue layer 130 is formed so that the component 120 and the metal pad 110 are embedded in the encapsulation glue layer 130 .

[0033] The inventor of the present invention has found through research that in the prior art, the distance d between the component 120 and the carrier 100 is very small, which results in the easy appearance of a gap 131 during the process of filling the encapsulation colloid layer 130 .

[0034] On the one hand, due to the accumulation of water vapor, a signal short circuit problem may occur. Specifically, a short circuit may occur between adjacent metal pads 110, or between the active surface of the component 120 and the metal pad 110. Figure 2 In the area encircled by the dotted line, a short circuit may occur between adjacent metal pads 110 due to the conductivity of water vapor.

[0035] On the other hand, when the gap 131 is larger, delamination may occur between the encapsulant layer 130 and the carrier 100 .

[0036] In an embodiment of the present invention, a metal wire is formed between adjacent metal pads, and then the metal wire is etched to form a groove under the protection of the metal pad by a shielding layer. The groove can be used to increase the height difference between the component and the carrier, which is beneficial to the filling of the packaging colloid material, thereby forming an isolation area between adjacent metal pads, improving the signal short circuit problem, and avoiding the delamination between the packaging colloid layer and the carrier.

[0037] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0038] Reference Figure 3 , Figure 31 is a flow chart of a component packaging method according to an embodiment of the present invention. The component packaging method may include steps S31 to S35:

[0039] Step S31: forming a plurality of metal pads on a carrier, and forming metal lines between adjacent metal pads;

[0040] Step S32: forming a patterned shielding layer, wherein the shielding layer covers the metal pad and exposes the metal line;

[0041] Step S33: etching the metal line to form a groove;

[0042] Step S34: mounting components on the carrier, wherein the components are electrically connected to at least a portion of the metal pad;

[0043] Step S35: forming a packaging colloid layer, wherein the packaging colloid layer at least fills the groove between the component and the carrier.

[0044] Combine the following Figures 4 to 9 Each of the above steps is described below.

[0045] Figures 4 to 9 It is a schematic diagram of the device cross-sectional structure and a top view corresponding to each step in a component packaging method in an embodiment of the present invention.

[0046] Combined with reference Figure 4 and Figure 5 , Figure 5 yes Figure 4 Sectional view along cutting line B1-B2, Figure 4 yes Figure 5 Sectional view along cutting line B3-B4.

[0047] Specifically, a plurality of metal pads 210 are formed on the carrier 200 , and metal lines 211 are formed between adjacent metal pads 210 .

[0048] The metal pad 210 may be embedded in the carrier 200 , that is, the surface of the metal pad 210 is lower than the surface of the carrier 200 .

[0049] Furthermore, the carrier board 200 may be selected from: a prepreg sheet and a core board.

[0050] In specific implementation, the prepreg sheet is also called a semi-cured (Pre-pregnant, PP) sheet, which can be a thin sheet of insulating material for a printed circuit board (Printed Circuit Board, PCB). The prepreg sheet is mainly used as an adhesive material and insulating material for the inner conductive pattern of a multi-layer printed circuit board.

[0051] The core board can also be called Core material. It is the basic material for making printed circuit boards. It has a certain hardness and thickness and is copper-clad on both sides.

[0052] Furthermore, the metal pad 210 and the metal line 211 may be formed by the same process.

[0053] In a specific implementation, an etching process may be used to form a metal trench, and then metal may be filled into the metal trench to form the metal pad 210 and the metal line 211 .

[0054] In the embodiment of the present invention, the metal pad 210 and the metal line 211 are formed by the same process, and the metal pad forming process in the prior art can be reused, thereby effectively reducing manufacturing costs and research and development complexity.

[0055] Furthermore, the material of the metal pad 210 and the metal wire 211 may be selected from: copper, aluminum, silver, gold, platinum, and titanium.

[0056] Specifically, considering the balance between device quality, economy and process complexity, in a specific implementation, copper may be used to form the metal pad 210 and the metal line 211 .

[0057] Combined with reference Figure 6 and Figure 7 , Figure 7 yes Figure 6 Sectional view along cutting line C1-C2, Figure 6 yes Figure 7 Sectional view along cutting line C3-C4.

[0058] Specifically, a patterned shielding layer 260 may be formed, and the shielding layer 260 may cover the metal pad 210 and expose the metal line 211 (see Figure 4 or Figure 5 ), and then the metal line 211 is etched to form a trench 212.

[0059] Furthermore, the distance between the edge of the shielding layer 260 and the adjacent metal line 211 is less than or equal to a first preset distance.

[0060] It should be noted that the distance between the shielding layer 260 and the metal line 211 can be reduced by increasing the design width of the metal line 211 .

[0061] As a non-limiting example, the first preset distance may be selected from: 20 μm to 100 μm, for example, may be 50 μm.

[0062] In an embodiment of the present invention, the distance between the edge of the shielding layer 260 and the adjacent metal line 211 is less than or equal to a first preset distance. On the basis of the shielding layer 260 protecting the metal pad 210, the width of the metal line 211 can be increased as much as possible, and the distance between the shielding layer 260 and the metal line 211 can be reduced, thereby increasing the width of the subsequently formed groove 212, forming a larger isolation area between adjacent metal pads 210, more effectively improving the signal short circuit problem, and more effectively avoiding the delamination between the encapsulation colloid layer and the carrier 200.

[0063] Furthermore, the distance between the edge of the shielding layer 260 and the adjacent metal pad 210 is greater than or equal to a second preset distance.

[0064] It should be noted that the distance between the shielding layer 260 and the metal pad 210 can be reduced by increasing the coverage size (eg, coverage width) of the shielding layer 260 .

[0065] As a non-limiting example, the second preset distance may be selected from: 1 μm to 30 μm, for example, may be 10 μm.

[0066] In an embodiment of the present invention, the distance between the edge of the shielding layer 260 and the adjacent metal pad 210 is greater than or equal to a second preset distance, so that the shielding layer 260 can extend a certain distance on the basis of covering the metal pad 210, thereby preventing the etchant from penetrating from the side and damaging the metal pad 210, thereby more effectively protecting the metal pad 210.

[0067] Furthermore, the material of the metal wire 211 may be copper, and the etchant used to etch the metal wire 211 may be aqua regia.

[0068] In the embodiment of the present invention, when copper is used to form the metal line 211 , since aqua regia is an acidic solution that can chemically react with copper, the groove 212 can be formed.

[0069] Combined with reference Figure 8 and Fig. 9 , Fig. 9 yes Figure 8 The cross-section along the cutting line D1-D2, Figure 8 yes Fig. 9 Cross-sectional view along cutting line D3-D4.

[0070] Specifically, the component 220 may be mounted on the carrier 200, wherein the component 220 is electrically connected to at least a portion of the metal pad 210. Then, a packaging colloid layer 230 is formed, and the packaging colloid layer 230 at least fills the groove 212 between the component 220 and the carrier 200 (see Figure 6 or Figure 7 ).

[0071] It should be pointed out that in Figure 8 In the specific embodiment shown, flux may be used to weld the component 220 and the metal pad 210 , and other appropriate connection structures may be used to achieve electrical connection between the component 220 and the metal pad 210 .

[0072] It is understandable that the component 220 may face the carrier 200 with its active surface, and may be electrically connected to one or more metal pads 210 according to the component design scheme. The component 220 may be a chip to be packaged or other appropriate components.

[0073] It should be pointed out that compared with Figure 1 As shown in the distance d, due to the formation of the groove 212 , the distance D between the component 120 and the carrier 100 is larger, and it is not easy to form a gap during the process of filling the encapsulation glue layer 230 into the groove 212 .

[0074] It should also be pointed out that even if a gap 231 as shown in the figure appears in the area outside the groove 212, since the size of the gap 231 is small and one side of the gap 231 is the packaging colloid layer 230 filled into the groove 212, the problem of signal short circuit or delamination in the prior art will not occur.

[0075] Furthermore, before mounting the component 220 on the carrier 200, the process may further include: removing the shielding layer 260 (see Figure 6 or Figure 7 ), so as to avoid affecting the connection quality when the component 220 and the metal pad 210 are electrically connected (such as welding or other appropriate connection methods).

[0076] In the embodiment of the present invention, a metal line 211 is formed between adjacent metal pads 210 (see Figure 4 or Figure 5 ), and then, under the protection of the shielding layer 260 on the metal pad 210, the metal wire 211 is etched to form a groove 212, and the groove 212 can be used to increase the height difference between the component 220 and the carrier 200, which is beneficial to the filling of the encapsulation colloid layer 230, thereby forming an isolation area between adjacent metal pads 210, or forming an isolation area between the active surface of the component 220 and the metal pad 210, effectively improving the signal short circuit problem and avoiding the delamination between the encapsulation colloid layer 230 and the carrier 200.

[0077] Furthermore, before forming the patterned shielding layer, a solder resist layer (not shown) may be formed to cover the carrier 200 , and the soldering windows of the solder resist layer expose the metal pads 210 that need to be electrically connected to the components 220 .

[0078] It should be noted that, on the basis of enabling the component 220 to be electrically connected to the metal pad 210 , the welding window can fully expose the metal pad 210 or partially expose the metal pad 210 .

[0079] In the embodiment of the present invention, the carrier 200 can be protected by forming a solder resist green oil layer with a certain size of solder openings. The specific formation process of the solder resist green oil layer and the specific size of the solder openings can be achieved by conventional processes.

[0080] Furthermore, the material of the encapsulation colloid layer 230 may be a resin material, thereby producing a better molding effect.

[0081] In specific implementations, other conventional colloid materials may also be used, and there is no limitation on the selection of specific colloid materials in the embodiments of the present invention.

[0082] Furthermore, the encapsulation colloid layer 230 may also cover the component 220 and the metal liner 210 , so that the component 220 and the metal liner 210 are both embedded in the encapsulation colloid layer 230 .

[0083] In the embodiment of the present invention, a component packaging structure is also disclosed, which can be referred to Figure 8 The component packaging structure may include: a carrier 200, on which components 220 are mounted; a plurality of metal pads 210, located on the carrier 200, wherein the components 220 are electrically connected to at least a portion of the metal pads 210; a groove, located on the surface of the carrier 200; and a packaging colloid layer 230, at least filling the groove between the component 220 and the carrier 200; wherein the groove is formed by etching the metal wire on the carrier 200, and the metal wire is formed between adjacent metal pads 210.

[0084] Furthermore, the metal pad 210 and the metal line may be formed by the same process.

[0085] Furthermore, the metal pad 210 may protrude from the surface of the carrier 200 .

[0086] Furthermore, the material of the metal pad 210 and the metal wire may be selected from: copper, aluminum, silver, gold, platinum, and titanium.

[0087] Furthermore, the component packaging structure may further include: a solder resist layer covering the carrier 200 , wherein a solder resist window of the solder resist layer exposes a metal pad 210 that needs to be electrically connected to the component 220 .

[0088] Furthermore, the encapsulation colloid layer 230 may also cover the component 220 and the metal pad 210 .

[0089] Furthermore, the carrier board 200 may be formed of insulating material.

[0090] For the principles, specific implementations and beneficial effects of the component packaging structure, please refer to the relevant description of the component packaging method mentioned above, which will not be repeated here.

[0091] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A component packaging method, characterized in that: include: forming a plurality of metal pads on the carrier, and forming metal lines between adjacent metal pads; forming a patterned shielding layer, wherein the shielding layer covers the metal pad and exposes the metal line; Etching the metal line to form a groove; Mounting components on the carrier, wherein the components are electrically connected to at least a portion of the metal pad; A packaging colloid layer is formed, and the packaging colloid layer at least fills the groove between the component and the carrier.

2. The method according to claim 1, characterized in that The distance between the edge of the shielding layer and the adjacent metal wire is less than or equal to a first preset distance.

3. The method according to claim 1, characterized in that The distance between the edge of the shielding layer and the adjacent metal pad is greater than or equal to a second preset distance.

4. The method according to claim 1, characterized in that The metal pad and the metal line are formed by adopting the same process.

5. The method according to claim 1, characterized in that: The material of the metal pad and the metal wire is selected from: copper, aluminum, silver, gold, platinum, and titanium.

6. The method according to claim 5, characterized in that The material of the metal wire is copper, and the etchant used to etch the metal wire is aqua regia.

7. The method according to claim 1, characterized in that Before forming the patterned shielding layer, the method further comprises: A solder resist green oil layer is formed to cover the carrier board, and a soldering window of the solder resist green oil layer exposes a metal pad that needs to be electrically connected to the component.

8. The method according to claim 1, characterized in that Before mounting components on the carrier board, the method further includes: The shielding layer is removed.

9. The method according to claim 1, characterized in that: The packaging colloid layer also covers the components and the metal pad.

10. The method according to claim 1, characterized in that The carrier board is selected from: a prepreg sheet and a core board.

11. A component packaging structure, characterized in that: include: A carrier board, on which components are mounted; a plurality of metal pads located on the carrier, wherein the components are electrically connected to at least a portion of the metal pads; A groove is located on the surface of the carrier plate; A packaging colloid layer, at least filling the groove between the component and the carrier; The grooves are formed by etching metal lines on the carrier, and the metal lines are formed between adjacent metal pads.

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