Speaker assembly and electronic device

Abstract

The embodiment of the application provides a kind of loudspeaker assembly and electronic equipment, the loudspeaker assembly is by the first surface of one of two adjacent loudspeaker modules in one loudspeaker module and the second surface of another loudspeaker module in two adjacent loudspeaker modules It is located on the same side of support, the second surface of one of two adjacent loudspeaker modules in one loudspeaker module and the first surface of another loudspeaker module in two adjacent loudspeaker modules It is located on the same side of support, and one of two adjacent loudspeaker modules in one loudspeaker module and another loudspeaker module in two adjacent loudspeaker modules are connected by support, reduce or avoid the problem that electronic equipment appears noise, improve the call effect and external sound quality of electronic equipment, to improve the experience of user.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a speaker assembly and electronic device. Background Technology

[0002] With the development of electronic technology, communication equipment has become indispensable in people's daily lives. Loudspeakers (such as moving-coil loudspeakers, piezoelectric loudspeakers, or other external amplifiers) are essential accessories for transmitting sound in communication devices such as telephones, walkie-talkies, and mobile phones. A loudspeaker is a transducer that converts electrical signals into sound signals, and the performance of a loudspeaker greatly affects sound quality. The audio electrical energy in a loudspeaker vibrates its cone or diaphragm through electromagnetic, piezoelectric, or electrostatic effects, causing it to resonate with the surrounding air and produce sound.

[0003] In related technologies, electronic devices (such as laptops) typically have speakers located on the keyboard side. These speakers are connected to the laptop's mid-frame, which also has multiple keyboard keys connected to it. Specifically, a laptop may have one, two, or more speakers.

[0004] However, the above solutions are prone to noise, resulting in poor call quality and speakerphone quality of electronic devices, which affects the user experience. Summary of the Invention

[0005] This application provides a speaker assembly and an electronic device that can reduce or avoid noise problems in electronic devices, improve call quality and external sound quality, thereby enhancing the user experience.

[0006] A first aspect of this application provides a speaker assembly, which includes at least: a bracket and at least two speaker modules; each of the at least two speaker modules has a first surface and a second surface opposite to each other; the first surface of one of the two adjacent speaker modules and the second surface of the other of the two adjacent speaker modules are located on the same side of the bracket, and the second surface of one of the two adjacent speaker modules and the first surface of the other of the two adjacent speaker modules are located on the same side of the bracket; and one of the two adjacent speaker modules and the other of the two adjacent speaker modules are connected through the bracket.

[0007] The speaker assembly provided in this application embodiment has its first surface of one of two adjacent speaker modules and its second surface of the other of two adjacent speaker modules located on the same side of the bracket, and its second surface of one of two adjacent speaker modules and its first surface of the other of two adjacent speaker modules located on the same side of the bracket, and the two adjacent speaker modules connected by the bracket, which can ensure that the two adjacent speaker modules are arranged in opposite directions.

[0008] In this way, the direction of the reverse force generated by one of the two adjacent speaker modules relative to the middle frame of the electronic device is opposite to the direction of the reverse force generated by the other of the two adjacent speaker modules relative to the middle frame of the electronic device. This allows the reverse forces generated by the speaker components relative to the middle frame to be greatly canceled out, effectively reducing the output force of the speaker components on the electronic device during operation. This can reduce or avoid noise problems in the electronic device, improve the call quality and external sound quality of the electronic device, and thus improve the user experience to a certain extent.

[0009] In one possible implementation, the at least two speaker modules include: a first speaker module and a second speaker module; the first speaker module and the second speaker module are connected by the bracket; and the first surface of the first speaker module and the second surface of the second speaker module are located on the first side of the bracket, and the second surface of the first speaker module and the first surface of the second speaker module are located on the second side of the bracket.

[0010] In this way, the speaker assembly includes a first speaker module and a second speaker module, which are connected by a bracket. The first surface of the first speaker module and the second surface of the second speaker module are located on the same side of the bracket, and the second surface of the first speaker module and the first surface of the second speaker module are located on the same side of the bracket. This ensures that the first speaker module and the second speaker module are arranged in opposite directions. Thus, the direction of the reverse force generated by the first speaker module relative to the middle frame of the electronic device is opposite to the direction of the reverse force generated by the second speaker module relative to the middle frame of the electronic device. This allows the reverse forces generated by the speaker assembly relative to the middle frame to be greatly canceled out, effectively reducing the output force of the speaker assembly on the electronic device during operation. This reduces or avoids noise problems in the electronic device, improves the call quality and external sound quality of the electronic device, and thus enhances the user experience to a certain extent.

[0011] In one possible implementation, the bracket includes: a first part and a second part; the first part is connected to the first speaker module, and the second part is connected to the second speaker module; and the first part is connected to the second part.

[0012] The first part of the bracket is connected to the first speaker module, and the second part of the bracket is connected to the second speaker module. The connection between the first part and the second part ensures that the first speaker module and the second speaker module are connected through the bracket. In this way, when the direction of the opposing force generated by one of the first speaker module and the second speaker module relative to the middle frame of the electronic device is opposite to the direction of the opposing force generated by the other of the first speaker module and the second speaker module relative to the middle frame of the electronic device, it can be ensured that the opposing force generated by one of the first speaker module and the second speaker module relative to the middle frame of the electronic device is relatively canceled out. This allows the opposing force generated by the speaker assembly relative to the middle frame to be greatly canceled out, thereby effectively reducing the output force of the speaker assembly on the electronic device during operation.

[0013] In one possible implementation, the first part and the second part are integrally formed. This ensures better connection reliability between the first speaker module and the second speaker module, allowing for smoother force transmission between them. This significantly reduces the counterforce generated by the speaker assembly relative to the mid-frame, effectively lowering the output force exerted on the electronic device by the speaker assembly during operation.

[0014] In one possible implementation, the first part is connected to the second part via a connector. The connector used to connect the first and second parts can further absorb vibrational energy.

[0015] In one possible implementation, the connector is an elastic element. By making the connector an elastic element, the effectiveness of the connector in absorbing vibrational energy can be better ensured.

[0016] In one possible implementation, the at least two speaker modules further include: a third speaker module; the second speaker module is located between the first speaker module and the third speaker module, and the second speaker module is connected to the third speaker module; the first surface of the first speaker module, the second surface of the second speaker module, and the first surface of the third speaker module are located on the same side of the bracket, and the second surface of the first speaker module, the first surface of the second speaker module, and the second surface of the third speaker module are located on the same side of the bracket.

[0017] In this way, the speaker assembly includes a first speaker module, a second speaker module, and a third speaker module. The second speaker module is located between the first speaker module and the third speaker module and is connected to the third speaker module. The first surface of the first speaker module, the second surface of the second speaker module, and the first surface of the third speaker module are all located on the same side of the bracket. The second surface of the first speaker module, the first surface of the second speaker module, and the second surface of the third speaker module are all located on the same side of the bracket. This ensures that the second speaker module and the third speaker module are arranged in opposite directions. In this way, the direction of the reverse force generated by the second speaker module relative to the middle frame of the electronic device is opposite to the direction of the reverse force generated by the third speaker module relative to the middle frame of the electronic device. This allows the reverse force generated by the speaker assembly relative to the middle frame to be greatly canceled out. This can effectively reduce the output force of the speaker assembly on the electronic device during operation, thereby reducing or avoiding the problem of noise in the electronic device, improving the call effect and external sound quality of the electronic device, and thus improving the user experience to a certain extent.

[0018] In one possible implementation, the speaker module includes an electromagnetic component and an audio component; both the electromagnetic component and the audio component are connected to the bracket, with the electromagnetic component located on one side of the bracket and the audio component located on the other side; the electromagnetic component provides an electrical signal to the audio component, enabling the audio component to convert the electrical signal into an acoustic signal. Thus, the speaker module is driven by the electromagnetic component to drive the audio component to produce sound, ensuring the normal operation of the speaker module.

[0019] In one possible implementation, the electromagnetic component includes: a magnet and magnetic conductive plates located on both sides of the magnet; the magnetic conductive plates are connected to the bracket.

[0020] In this way, the magnet and the magnetic plates located on both sides of the magnet work together to cut magnetic field lines to form the magnetic circuit part of the speaker assembly, providing a magnetic field for the audio components.

[0021] In one possible implementation, the audio component includes a voice coil, a dome, and a diaphragm; the dome is located between the voice coil and the diaphragm, and the diaphragm is connected to the support.

[0022] In this way, the voice coil, dome, and diaphragm form the entire vibration system of the loudspeaker assembly. When the voice coil is energized, the current flows through the voice coil, causing the magnetic field generated by the voice coil to change. The magnetic force between the electromagnetic component and the voice coil changes, and the voice coil will vibrate back and forth, causing the distance between the electromagnetic component and the voice coil to change. This vibration of the voice coil will drive the dome and the diaphragm to vibrate, thereby causing the diaphragm to push the air to produce sound.

[0023] A second aspect of this application provides an electronic device, which includes at least: a mid-frame and at least one speaker assembly as described above; the mid-frame is connected to the speaker assembly.

[0024] The electronic device provided in this application embodiment includes at least a mid-frame and at least one speaker assembly. The speaker assembly is located on the same side through the first surface of one of two adjacent speaker modules and the second surface of the other of two adjacent speaker modules, the second surface of one of two adjacent speaker modules and the first surface of the other of two adjacent speaker modules are located on the same side, and one of two adjacent speaker modules is connected to the other of two adjacent speaker modules, which can ensure that the two adjacent speaker modules are arranged in opposite directions.

[0025] In this way, the direction of the reverse force generated by one of the two adjacent speaker modules relative to the middle frame of the electronic device is opposite to the direction of the reverse force generated by the other of the two adjacent speaker modules relative to the middle frame of the electronic device. This allows the reverse forces generated by the speaker components relative to the middle frame to be greatly canceled out, effectively reducing the output force of the speaker components on the electronic device during operation. This can reduce or avoid noise problems in the electronic device, improve the call quality and external sound quality of the electronic device, and thus improve the user experience to a certain extent.

[0026] In one possible implementation, a sound outlet is formed on the middle frame, and a sound outlet channel is formed between the middle frame and the speaker assembly, with the sound outlet connected to the sound outlet channel.

[0027] In this way, the sound emitted by the speaker assembly can flow out through the sound outlet located on the middle frame through the sound outlet channel between the middle frame and the speaker assembly, thereby ensuring the sound output function of the speaker assembly.

[0028] In one possible implementation, a sub-sound output channel is formed between the mid-frame and each speaker module in the speaker assembly; at least two of the sub-sound output channels are interconnected, and at least two of the sub-sound output channels are connected to the sound outlet.

[0029] By interconnecting at least two sub-sound output channels formed between at least two speaker modules and the mid-frame, the sound emitted by at least two speaker modules can be converged into a single sound output channel, maintaining the overall audio experience of the electronic device.

[0030] In one possible implementation, the electronic device is a laptop computer; the laptop computer includes: a mid-frame, a keyboard assembly, and at least one of the speaker assemblies; the at least one speaker assembly is connected to the mid-frame, and the mid-frame is also connected to the keyboard assembly. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0032] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the overall structure of a speaker assembly in an electronic device according to an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of the overall structure of a speaker assembly in an electronic device according to an embodiment of this application;

[0035] Figure 5 A schematic diagram showing the disassembled structure of a speaker assembly in an electronic device according to an embodiment of this application;

[0036] Figure 6 This is a schematic diagram of the overall structure of a speaker assembly in an electronic device according to an embodiment of this application;

[0037] Figure 7 This is a comparison diagram showing the force output of a speaker assembly relative to the mid-frame in the prior art and the force output of a speaker assembly relative to the mid-frame provided in an embodiment of this application.

[0038] Figure 8 This is a schematic diagram of the overall structure of a speaker assembly in an electronic device according to an embodiment of this application;

[0039] Figure 9 This is a schematic diagram of the structure of a speaker assembly and a mid-frame in an electronic device provided in an embodiment of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100 - Speaker assembly; 10 - Speaker module; 101 - First surface;

[0042] 102 - Second surface; 11 - Support; 111 - First part;

[0043] 112 - Part Two; 121 - Electromagnetic Components; 1211 - Magnet;

[0044] 1212 - Magnetic plate; 122 - Audio components; 1221 - Voice coil;

[0045] 1222 - Dome; 1223 - Diaphragm; 20 - First loudspeaker module;

[0046] 30 - Second speaker module; 40 - Third speaker module; 50 - Connector;

[0047] 200 - Laptop computer; 201 - Mid-frame; 2011 - Speaker vent;

[0048] 2012 - Sound output channel; 202 - Keyboard assembly; 203 - Housing. Detailed Implementation

[0049] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0050] With the development of electronic technology, mobile phones have become indispensable in people's daily lives, and speakers (such as dynamic speakers, piezoelectric speakers or other external amplifiers) are also an indispensable component of mobile phones. A speaker is a transducer that converts electrical energy into sound energy. Specifically, it converts the electrical signal of the amplifier into the mechanical vibration of the diaphragm, which in turn causes changes in the density of the surrounding air, so as to transform the sound waves and produce sound.

[0051] This application provides an electronic device, including but not limited to mobile or fixed terminals with speakers such as laptops, mobile phones, tablets, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), dashcams, wearable devices, virtual reality devices, Bluetooth speakers / headphones, or in-vehicle pre-installed devices.

[0052] In this embodiment, a laptop computer 200 is used as an example for illustration. Figures 1-2 The overall structure and disassembled structure of the notebook computer 200 are shown separately. See [link / reference]. Figure 1 and Figure 2 As shown, the laptop computer 200 may include at least: a mid-frame 201, a keyboard assembly 202, a housing 203, and at least one speaker assembly 100, wherein the mid-frame 201 is connected to the speaker assembly 100 and the mid-frame 201 is also connected to the keyboard assembly 202.

[0053] The number of speaker assemblies 100 can be one, two, three, or more, and this application embodiment does not limit this. For example, Figure 1 In the case of a notebook computer 200, there may be two speaker assemblies 100. The two speaker assemblies 100 have the same structure and may be symmetrically arranged in the housing 203.

[0054] It should be noted that the position of the speaker assembly 100 within the housing 203 can be flexibly configured. Figure 1 The present invention only provides one example of the position of the speaker assembly 100 within the housing 203, and this should not be considered as a particular limitation of this application.

[0055] The middle frame 201 can be a metal frame, and the material of the middle frame 201 can be aluminum or aluminum alloy, or it can also be stainless steel. It should be noted that the material of the middle frame 201 includes, but is not limited to, the above-mentioned materials. The keyboard assembly 202 and the housing 203 can be made of metal or plastic, and this application embodiment does not limit them in this regard.

[0056] Since the speaker assembly 100 is driven by electromagnetic force to drive the diaphragm to produce sound, the speaker assembly 100 will vibrate when it is in operation. The vibration of the speaker assembly 100 will cause the middle frame 201 to vibrate. The vibration of the middle frame 201 will further cause the keyboard assembly 202 to vibrate relative to the middle frame 201 and the housing 203. For example, the keyboard assembly 202 will collide with the middle frame 201 and the housing 203, resulting in noise. This leads to poor call quality and external sound quality of the electronic device, affecting the user experience.

[0057] Based on this, this application provides a speaker assembly in which the first surface of one of two adjacent speaker modules and the second surface of the other adjacent speaker module are located on the same side, the second surface of one of two adjacent speaker modules and the first surface of the other adjacent speaker module are located on the same side, and one of two adjacent speaker modules is connected to the other adjacent speaker module. This ensures that the adjacent speaker modules are arranged in opposite directions. In this way, the direction of the reverse force generated by one of the adjacent speaker modules relative to the frame of the electronic device is opposite to the direction of the reverse force generated by the other adjacent speaker module relative to the frame of the electronic device. This allows the reverse force generated by the speaker assembly relative to the frame to be greatly canceled out, effectively reducing the output force of the speaker assembly on the electronic device during operation. This reduces or avoids noise problems in the electronic device, improves the call quality and external sound quality of the electronic device, and thus improves the user experience to a certain extent.

[0058] The specific structure of the speaker assembly will be described in detail below with reference to the accompanying drawings.

[0059] Reference Figure 3 or Figure 4 As shown, this application embodiment provides a speaker assembly 100, which can convert audio electrical signals into sound signals. Electronic devices (such as laptop computers 200) can play music or make hands-free calls through the speaker assembly 100. Specifically, the speaker assembly 100 may include at least: a bracket 11 and at least two speaker modules 10, wherein each of the at least two speaker modules 10 has a first surface 101 and a second surface 102 facing each other.

[0060] In this embodiment of the application, the first surface 101 of one of the two adjacent speaker modules 10 and the second surface 102 of the other two adjacent speaker modules 10 are located on the same side of the bracket 11, the second surface 102 of one of the two adjacent speaker modules 10 and the first surface 101 of the other two adjacent speaker modules 10 are located on the same side of the bracket 11, and the two adjacent speaker modules 10 are connected by the bracket 11.

[0061] In this way, the two adjacent speaker modules 10 are arranged in opposite directions. The direction of the reverse force generated by one of the two adjacent speaker modules 10 relative to the middle frame 201 of the laptop 200 is opposite to the direction of the reverse force generated by the other speaker module 10 relative to the middle frame 201 of the laptop 200. This allows the reverse force generated by the speaker assembly 100 relative to the middle frame 201 to be greatly canceled out. This effectively reduces the output force of the speaker assembly 100 on the laptop 200 during operation, thereby reducing or avoiding noise problems in the laptop 200, improving the call quality and external sound quality of the laptop 200, and thus improving the user experience to a certain extent.

[0062] Continue to refer to Figure 4As shown in the embodiments of this application, at least two speaker modules 10 may include: a first speaker module 20 and a second speaker module 30, wherein the first speaker module 20 and the second speaker module 30 are connected by a bracket 11, and the first surface 101 of the first speaker module 20 and the second surface 102 of the second speaker module 30 are located on the first side of the bracket 11, and the second surface 102 of the first speaker module 20 and the first surface 101 of the second speaker module 30 are located on the second side of the bracket 11.

[0063] It is understood that in the embodiments of this application, the physical structure and acoustic parameters of the first speaker module 20 and the second speaker module 30 are the same. Thus, the first speaker module 20 and the second speaker module 30 are arranged in opposite directions. The direction of the reverse force generated by the first speaker module 20 relative to the middle frame of the laptop 200 is opposite to the direction of the reverse force generated by the second speaker module 30 relative to the middle frame of the laptop 200, so that the reverse force generated by the speaker assembly 100 relative to the middle frame can be completely canceled.

[0064] Alternatively, in other embodiments, the physical structure and acoustic parameters of the first speaker module 20 and the second speaker module 30 may be inconsistent. In this way, the first speaker module 20 and the second speaker module 30 are arranged in opposite directions. The direction of the reverse force generated by the first speaker module 20 relative to the middle frame of the laptop 200 is opposite to the direction of the reverse force generated by the second speaker module 30 relative to the middle frame of the laptop 200. The reverse force generated by the speaker assembly 100 relative to the middle frame can still be offset to some extent, thereby effectively reducing the output force of the speaker assembly 100 on the laptop 200 during operation to a certain extent.

[0065] In one possible implementation, see Figure 5 As shown, the bracket 11 may include a first portion 111 and a second portion 112, wherein the first portion 111 is connected to one of the first speaker module 20 and the second speaker module 30, and the second portion 112 is connected to the other of the first speaker module 20 and the second speaker module 30, and the first portion 111 is connected to the second portion 112. For example, Figure 3 In the middle, the first part 111 is connected to the first speaker module 20, and the second part 112 is connected to the second speaker module 30.

[0066] The first part 111 is connected to the second part 112, ensuring that the first speaker module 20 and the second speaker module 30 are connected. Thus, when the direction of the opposing force generated by one of the first speaker modules 20 and 30 relative to the mid-frame of the laptop 200 is opposite to the direction of the opposing force generated by the other of the first speaker modules 20 and 30 relative to the mid-frame of the laptop 200, it ensures that the opposing forces generated by one of the first speaker modules 20 and 30 relative to the mid-frame of the laptop 200 are relatively canceled out. This allows the opposing force generated by the speaker assembly 100 relative to the mid-frame to be greatly canceled out, thereby effectively reducing the output force of the speaker assembly 100 on the laptop 200 during operation.

[0067] It is easy to understand that the first part 111 can be integrally formed with the second part 112. This ensures better connection reliability between the first speaker module 20 and the second speaker module 30, making the force transmission between the first speaker module 20 and the second speaker module 30 smoother. This ensures that the reverse force generated by the speaker assembly 100 relative to the mid-frame can be greatly offset, effectively reducing the output force of the speaker assembly 100 on the laptop 200 during operation.

[0068] As an alternative implementation, the bracket 11 can be a plastic bracket. In this way, the bracket 11 of one of the two adjacent speaker modules 10 and the bracket 11 of the other of the two adjacent speaker modules 10 can be integrally formed by injection molding.

[0069] Of course, in some other embodiments, the first part 111 and the second part 112 may also be a separate design, and this application does not limit this.

[0070] In one possible implementation, the first part 111 and the second part 112 can be connected in a detachable manner, for example, by plugging, bonding, threading, pinning or snap-fitting, etc., wherein the specific structure of the detachable connection is not limited in the embodiments of this application.

[0071] Furthermore, the first part 111 and the second part 112 can also be connected in a non-detachable manner. For example, when the bracket 11 is made of metal, the two can be connected by welding.

[0072] Continue to refer to Figure 5As shown in the embodiments of this application, each speaker module 10 may include an electromagnetic component 121 and an audio component 122. Both the electromagnetic component 121 and the audio component 122 are connected to the bracket 11, with the electromagnetic component 121 located on one side of the bracket 11 and the audio component 122 located on the other side of the bracket 11. The electromagnetic component 121 provides an electrical signal to the audio component 122, enabling the audio component 122 to convert the electrical signal into a sound signal. Thus, the speaker module 10 is driven by the electromagnetic component 121, which in turn drives the audio component 122 to produce sound, ensuring the normal operation of the speaker module 10.

[0073] Specifically, the electromagnetic component 121 may include a magnet 1211 and magnetic guide plates 1212 located on both sides of the magnet 1211, with the magnetic guide plates 1212 connected to the bracket 11. The magnet 1211 and the magnetic guide plates 1212 on both sides of the magnet 1211 cooperate to generate cutting magnetic field lines to form the magnetic circuit portion of the speaker assembly 100, providing a magnetic field for the audio component 122.

[0074] The audio component 122 may include a voice coil 1221, a dome 1222, and a diaphragm 1223, wherein the dome 1222 is located between the voice coil 1221 and the diaphragm 1223, and the diaphragm 1223 is connected to the support 11. The voice coil 1221, the dome 1222, and the diaphragm 1223 form the entire vibration system of the loudspeaker assembly 100.

[0075] Specifically, the voice coil 1221 can be inserted into the magnetic circuit section. When the voice coil 1221 is energized, the current flows through the voice coil 1221, causing the magnetic field generated by the voice coil 1221 to change. The magnetic force between the electromagnetic component 121 and the voice coil 1221 changes, and the voice coil 1221 will vibrate back and forth, causing the distance between the electromagnetic component 121 and the voice coil 1221 to change. In this way, the vibration of the voice coil 1221 will drive the dome 1222 and the diaphragm 1223 to vibrate, thereby causing the diaphragm 1223 to push the air to produce sound.

[0076] In this embodiment, to achieve better external sound output, a speaker module 10 with a larger amplitude or greater driving force can be selected. It should be noted that the speaker module 10 may include, but is not limited to, the structure described above, and may also include positioning devices, etc., to achieve more functions.

[0077] Additionally, in some embodiments, see Figure 6 As shown, the first part 111 can be connected to the second part 112 via a connector 50. The connector 50, used to connect the first part 111 and the second part 112, can further absorb vibration energy.

[0078] As an optional implementation, the connector 50 can be an elastic element. By making the connector 50 an elastic element, the effect of the connector 50 in absorbing vibration energy can be better ensured. For example, the material of the connector 50 can be sponge, plastic, etc. It is understood that the embodiments of this application do not limit the specific material and shape of the connector 50, nor are they limited to the above examples.

[0079] Moreover, in this embodiment, the length of the connector 50 can be flexibly adjusted according to the needs of the actual application scenario. Specifically, in actual use, the length of the connector 50 can be set according to the actual size of the speaker module 10, and this embodiment does not limit it.

[0080] In addition, it should be noted that, see Figure 7 As shown, L1 is a graph showing the torque versus frequency when a speaker assembly vibrates in the opposite direction relative to the mid-frame in the prior art, and L2 is a graph showing the torque versus frequency when the speaker assembly 100 vibrates in the opposite direction relative to the mid-frame 201 in this embodiment of the application. Figure 7 As can be seen, for the speaker assembly 100, the driving forces of the first speaker module 20 and the second speaker module 30 are in opposite directions. Therefore, the opposing forces generated by the first speaker module 20 and the second speaker module 30 relative to the middle frame 201 can cancel each other out, thereby greatly reducing the force output to the overall structure of the laptop 200.

[0081] In addition, in order to solve the noise problem, when two speaker components 100 are set in the laptop 200, the two speaker components 100 are usually stacked in opposite directions so that the opposing forces generated by the two speaker components 100 relative to the middle frame 201 can cancel each other out. However, stacking the speaker components 100 will make the overall thickness of the laptop 200 thicker.

[0082] In this embodiment of the application, when two speaker components 100 are provided in the laptop 200, by setting the two speaker components 100 in opposite directions on the same plane, the problem of noise can be solved while the laptop 200 is made thinner and lighter.

[0083] Furthermore, such as Figure 8As shown in the embodiments of this application, at least two speaker modules 10 may further include: a third speaker module 40, a second speaker module 30 located between the first speaker module 20 and the third speaker module 40, and the second speaker module 30 connected to the third speaker module 40, the first surface 101 of the first speaker module 20, the second surface 102 of the second speaker module 30 and the first surface 101 of the third speaker module 40 located on the same side of the bracket 11, and the second surface 102 of the first speaker module 20, the first surface 101 of the second speaker module 30 and the second surface 102 of the third speaker module 40 located on the same side of the bracket 11.

[0084] In this way, the second speaker module 30 and the third speaker module 40 are arranged in opposite directions. The direction of the reverse force generated by the second speaker module 30 relative to the middle frame of the laptop 200 is opposite to the direction of the reverse force generated by the third speaker module 40 relative to the middle frame of the laptop 200. This allows the reverse force generated by the speaker assembly 100 relative to the middle frame to be greatly canceled out, which can effectively reduce the output force of the speaker assembly 100 on the laptop 200 during operation. This can reduce or avoid the problem of noise in the laptop 200, improve the call effect and external sound quality of the laptop 200, and thus improve the user experience to a certain extent.

[0085] As an optional implementation, a connector 50 can also be provided between the second speaker module 30 and the third speaker module 40. In this way, the second speaker module 30 is connected to the third speaker module 40 through the connector 50, and the connector 50 can absorb vibration energy.

[0086] It is easy to understand that, in the embodiments of this application, at least two speaker modules 10 may also include: a fourth speaker module, or even a fifth speaker module, etc. The embodiments of this application do not limit the specific number and specifications of speaker modules 10 in speaker assembly 100.

[0087] In addition, such as Figure 9 As shown in this embodiment, a sound outlet 2011 can be formed on the mid-frame 201 of the laptop 200, and a sound outlet channel 2012 is formed between the mid-frame 201 and the speaker assembly 100, with the sound outlet 2011 and the sound outlet channel 2012 connected. In this way, the sound emitted by the speaker assembly 100 can flow out through the sound outlet 2011 on the mid-frame 201 via the sound outlet channel 2012 between the mid-frame 201 and the speaker assembly 100, thereby ensuring that the sound generated by the speaker assembly 100 is transmitted outwards, realizing the external playback function.

[0088] In one possible implementation, a sub-sound output channel can be formed between the middle frame 201 and each speaker module 10 in the speaker assembly 100, at least two sub-sound output channels are interconnected, and at least two sub-sound output channels are connected to the sound outlet 2011.

[0089] By interconnecting at least two sub-sound output channels formed between at least two speaker modules 10 and the mid-frame 201, the sound emitted by at least two speaker modules 10 can be converged into a single sound output channel 2012, maintaining the overall audio experience of the laptop 200.

[0090] Furthermore, by setting up multiple sub-sound channels, the space inside the sound cavity of the laptop 200 can be increased, thereby increasing the airflow speed, reducing airflow noise, and further improving the call quality and external sound quality of the laptop 200.

[0091] It is understood that in some embodiments, each speaker assembly 100 may also be provided with a cover (not shown), wherein the cover may be a single structural unit or may be formed by assembling multiple parts. A sound cavity is formed between the inner wall of the cover and the outer wall of the speaker assembly 100, and the cover may also be provided with at least one opening, which can serve as a sound outlet 2011 connecting the sound cavity and the external space of the laptop computer 200.

[0092] Furthermore, it should be noted that when multiple sub-sound output channels are provided, the multiple sub-sound output channels can correspond one-to-one with multiple sound output ports 2011, or the multiple sub-sound output channels can correspond to one sound output port 2011. This application embodiment does not limit this.

[0093] When the middle frame 201 has multiple sound outlets 2011, the multiple sound outlets 2011 can be evenly spaced. This not only enhances the sound output effect and sound quality uniformity of the sound outlets 2011, but also improves the aesthetic appearance of the laptop 200.

[0094] In addition, in this embodiment, a microphone, or caller ID, can also be installed inside the laptop 200. The microphone is used to convert sound signals into electrical signals. When making a phone call or sending a voice message, the user can speak by bringing their mouth close to the microphone to input the sound signal into the microphone. In this embodiment, a sound inlet (not shown in the figure) opposite to the microphone can also be opened on the middle frame 201, so that external sounds can be input into the microphone through the sound inlet.

[0095] A power interface can also be provided on the middle frame 201, located between the sound outlet 2011 and the sound inlet. The power interface can be a USB Type-C interface or a Micro USB interface.

[0096] It should be understood that the locations of the sound outlet 2011, the sound inlet, and the power interface are not limited to those described above. In some other examples, the locations of the sound outlet 2011, the sound inlet, and the power interface can be adjusted according to actual needs. In this embodiment, the laptop computer 200 may be equipped with at least one microphone. In some embodiments, the laptop computer 200 may be equipped with two microphones, which, in addition to collecting sound signals, can also perform noise reduction. In other embodiments, the laptop computer 200 may be equipped with three, four, or more microphones, which can collect sound signals, reduce noise, identify sound sources, and perform directional recording, etc.

[0097] In this embodiment, the speaker assembly 100 and the microphone can be electrically connected to the processor on the circuit board via the audio module. This allows the speaker assembly 100, microphone, audio module, and processor to perform audio functions, such as music playback and recording. The audio module can be located within the processor, or some of its functions can be integrated into the processor. The audio module can convert digital audio information into analog audio signals for output, convert analog audio input into digital audio signals, and encode and decode audio signals.

[0098] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the laptop computer 200. In other embodiments of this application, the laptop computer 200 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. For example, the laptop computer 200 may also include devices such as cameras (e.g., front-facing and rear-facing cameras) and flash.

[0099] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0100] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0101] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "may include" and "have," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A notebook computer, characterized by comprising: The notebook computer comprises a loudspeaker assembly and a middle frame; The loudspeaker assembly comprises at least: a support, a first loudspeaker module and a second loudspeaker module; The first loudspeaker module and the second loudspeaker module each have opposite first surfaces and second surfaces, the first surface of the first loudspeaker module and the second surface of the second loudspeaker module face the same direction, the first loudspeaker module has a first electromagnetic component comprising the first surface and a first audio component comprising the second surface, and the second loudspeaker module has a second electromagnetic component comprising the first surface and a second audio component comprising the second surface; The first electromagnetic component is located at a first side of the support, and the first audio component is located at a second side of the support; the second electromagnetic component is located at the second side of the support, and the second audio component is located at the first side of the support, the first side and the second side being different; The support comprises a first part and a second part, the first part is used for mounting the first audio component, the second part is used for mounting the second audio component, the first part is connected with the second part, the first part and the second part are integrally formed, the first part and the second part do not coincide in projection on the same plane in the extension direction of a first axis, the first axis being parallel to the length direction of the first loudspeaker module or the second loudspeaker module; wherein the first electromagnetic component comprises a first magnetic steel and first and second magnetic conductive plates located on both sides of the first magnetic steel, the distance from the second magnetic conductive plate to the first audio component is less than the distance from the first magnetic conductive plate to the first audio component, the second electromagnetic component comprises a second magnetic steel and third and fourth magnetic conductive plates located on both sides of the second magnetic steel, the distance from the fourth magnetic conductive plate to the second audio component is less than the distance from the third magnetic conductive plate to the second audio component, the first and third magnetic conductive plates are connected with the support, the first audio component has a first diaphragm, the second audio component has a second diaphragm, the first and second diaphragms are connected with the support, the first diaphragm and the second diaphragm are connected in projection on the same plane in the extension direction of a second axis, the first magnetic conductive plate and the third magnetic conductive plate do not coincide in projection on the same plane in the extension direction of the second axis, the second axis being perpendicular to the first surface or the second surface, and the second axis being perpendicular to the first axis; The middle frame is connected with the loudspeaker assembly, an audio outlet channel is configured between the middle frame and the loudspeaker assembly, the middle frame has an audio outlet, the audio outlet channel is connected with the audio outlet, the first diaphragm is used to push air to make the first loudspeaker module emit sound, the second diaphragm is used to push air to make the second loudspeaker module emit sound, and the sound emitted by the first loudspeaker module and the sound emitted by the second loudspeaker module converge and are transmitted to the outside of the notebook computer through the audio outlet.

2. The notebook computer of claim 1, wherein, The first speaker module is connected with the second speaker module through the support.

3. The notebook computer of claim 1 or 2, wherein, The support is made of plastic material.

4. The notebook computer of any of claims 1 or 2, wherein, The first part is connected with the second part through a connecting piece.

5. The notebook computer of claim 4, wherein, The connecting piece is an elastic piece.

6. The notebook computer of any of claims 1 or 2, wherein, The speaker assembly further comprises a third speaker module. The second speaker module is located between the first speaker module and the third speaker module, and the second speaker module is connected with the third speaker module. The first surface of the first speaker module faces the same direction as the second surface of the second speaker module and the first surface of the third speaker module, and the second surface of the first speaker module faces the same direction as the first surface of the second speaker module and the second surface of the third speaker module. The electromagnetic assembly is used to provide an electric signal for the audio assembly, so that the audio assembly converts the electric signal into an acoustic signal.

7. The notebook computer of claim 6, wherein, The first audio assembly further comprises a first voice coil and a first dome, and the first dome is located between the first voice coil and the first diaphragm; the second audio assembly further comprises a second voice coil and a second dome, and the second dome is located between the second voice coil and the second diaphragm.

8. The notebook computer of claim 1, wherein, The notebook computer further comprises a keyboard assembly, and the keyboard assembly is connected with the middle frame.

9. The notebook computer of claim 8, wherein, The notebook computer further comprises a housing, the speaker assembly comprises a first speaker assembly and a second speaker assembly, the first speaker assembly is arranged on one side of the keyboard assembly and close to one side of the housing, and the second speaker assembly is arranged on the other side of the keyboard assembly and close to the other side of the housing.

10. The notebook computer of claim 9, wherein, The first speaker assembly and the second speaker assembly are symmetrically arranged in the housing.

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