Backlight module and preparation method thereof, and display panel

Abstract

The present invention provides a backlight module and a preparation method thereof, and a display panel, which belongs to the field of display technology, and can at least partially solve the problems of the cumbersome preparation process and low preparation efficiency of the existing display panel. A backlight module of the present invention includes: a light source; a flexible circuit board connected to the light source and used to provide voltage to the light source, and the flexible circuit board has a first gold finger; a back plate, used to carry the light source and the flexible circuit board, the back plate has a mounting through hole, and at least part of the first gold finger is penetrated in the mounting through hole; a connecting structure, the first end of the connecting structure has a second gold finger, and the second gold finger is connected to the first gold finger of the flexible circuit board.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular relates to a backlight module and a preparation method thereof, and a display panel. Background Art

[0002] With the continuous development of display technology, the market demand for display panels is also increasing. In the preparation process of display panels in the prior art, it is necessary to manually pass the gold fingers of the flexible circuit board in the backlight module through the mounting holes of the backboard to connect the flexible circuit board with the array substrate, so as to provide voltage to the light source of the backlight module.

[0003] However, since the above process needs to be completed manually, the preparation process of the display panel is complicated and the preparation efficiency is low. Summary of the invention

[0004] The present invention at least partially solves the problems of complicated preparation process and low preparation efficiency of existing display panels, and provides a method for preparing a backlight module that can realize automated preparation.

[0005] The technical solution adopted to solve the technical problem of the present invention is a backlight module. Based on the above-mentioned method for preparing the backlight module, the backlight module includes: a light source; a flexible circuit board connected to the light source and used to provide voltage to the light source, and the flexible circuit board has a first gold finger; a back plate for carrying the light source and the flexible circuit board, the back plate has a mounting through hole, and at least part of the first gold finger is penetrated through the mounting through hole; a connecting structure, one end of the connecting structure has a second gold finger, and the second gold finger is connected to the first gold finger of the flexible circuit board.

[0006] It is further preferred that, in a first direction, a size of the connection structure is larger than a size of the mounting through hole of the back plate, and the first direction is a direction parallel to a maximum size of the mounting through hole.

[0007] Further preferably, the first gold finger has a first binding area, the second gold finger has a second binding area, the first binding area has a plurality of first welding sub-areas, the second binding area has a plurality of second welding sub-areas, and the first welding sub-areas are connected to the second welding sub-areas to realize the connection between the first gold finger and the second gold finger.

[0008] Further preferably, a plurality of the first welding sub-areas are arranged in an array or in a row, and a plurality of the second welding sub-areas are arranged in an array or in a row.

[0009] Further preferably, the first gold finger of the flexible circuit board includes a first strip structure and a second strip structure connected to the first strip structure, the first strip structure is perpendicular to the second strip structure; and the second gold finger of the connecting structure is connected to the second strip structure.

[0010] Further preferably, the backlight module of this embodiment further includes: protective glue, which is arranged in the first binding area or the second binding area and located on the surface of the first gold finger away from the second gold finger or the surface of the second gold finger away from the first gold finger.

[0011] The technical solution adopted to solve the technical problem of the present invention is a method for preparing a backlight module, comprising: installing a light source and a flexible circuit board on a back panel, the flexible circuit board is electrically connected to the light source, the back panel has a mounting through hole, the flexible circuit board has a first gold finger, at least part of the first gold finger is inserted into the mounting through hole; connecting the second gold finger at the first end of the connecting structure to the first gold finger.

[0012] Further preferably, the installation of the light source and the flexible circuit board on the back panel includes: using automatic installation equipment to install the light source and the flexible circuit board on the back panel; the connection of the second gold finger at the first end of the connecting structure with the first gold finger includes: using automatic welding equipment to perform welding connection between the first gold finger and the second gold finger.

[0013] It is further preferred that, in a first direction, a size of the connection structure is larger than a size of the mounting through hole of the back plate, and the first direction is a direction parallel to a maximum size of the mounting through hole.

[0014] Further preferably, the connecting the first gold finger and the second gold finger by welding comprises: coating protective glue on a surface opposite to the welding surface of the first gold finger, and coating protective glue on a surface opposite to the welding surface of the second gold finger.

[0015] Further preferably, the protective adhesive at least includes an anti-oxidation adhesive layer and a reinforcing adhesive layer.

[0016] The technical solution adopted to solve the technical problem of the present invention is a display panel, comprising: the above-mentioned backlight module; an array substrate, and the second end of the connection structure of the backlight module is connected to the array substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1A schematic structural diagram of a backlight module according to an embodiment of the present invention;

[0019] Figure 2 A partial structural schematic diagram of a backlight module according to an embodiment of the present invention;

[0020] Figure 3 A schematic structural diagram of a back plate of a backlight module according to an embodiment of the present invention;

[0021] Figure 4 A schematic diagram of the structure of a first gold finger of a flexible circuit board according to an embodiment of the present invention;

[0022] Figure 5a and Figure 5b It is a schematic structural diagram of a first binding area of ​​a first golden finger according to an embodiment of the present invention;

[0023] Figure 6 It is a cross-sectional schematic diagram of a first binding area of ​​a first gold finger according to an embodiment of the present invention;

[0024] Figure 7 A structural schematic diagram of a connection structure of an embodiment of the present invention;

[0025] Figure 8 A schematic diagram of a process for preparing a backlight module according to an embodiment of the present invention;

[0026] Among them, the figure markings are: 1, backplane; 11, mounting through hole; 2, light source; 3, flexible circuit board; 31, first gold finger; 32, first binding area; 321, first welding sub-area; 33, first strip structure; 34, second strip structure; 4, connection structure; 41, second gold finger; 51, anti-oxidation adhesive layer; 52, reinforcing adhesive layer. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0028] The present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, the same elements are represented by similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale. In addition, some well-known parts may not be shown in the drawings.

[0029] Many specific details of the present invention are described below, such as component structures, materials, dimensions, processing techniques and technologies, in order to more clearly understand the present invention. However, as those skilled in the art will appreciate, the present invention may be implemented without following these specific details.

[0030] Embodiment 1:

[0031] like Figures 1 to 8 As shown, this embodiment provides a backlight module, which includes: a light source 2, a flexible circuit board 3, a backboard 1 and a connection structure 4.

[0032] The flexible circuit board 3 is connected to the light source 2 and used to provide voltage to the light source 2. The flexible circuit board 3 has a first gold finger 31. The back plate 1 is used to carry the light source 2 and the flexible circuit board 3. The back plate 1 has a mounting through hole 11. At least part of the first gold finger 31 is penetrated in the mounting through hole 11. The connection structure 4 has a second gold finger 41 at the first end. The second gold finger 41 is connected to the first gold finger 31 of the flexible circuit board 3.

[0033] Among them, Figure 1 As shown, the back plate 1 is used to carry the remaining structures in the backlight module, and the structure of the back plate 1 is equivalent to a coverless box body with a receiving cavity, and the receiving cavity is used to receive the light source 2, the flexible circuit board 3 or the remaining structures of the backlight module. The mounting through hole 11 can be set on the side wall of the back plate 1, and the size of the mounting through hole 11 can match the size of the first gold finger 31, that is, the first gold finger 31 can pass through the mounting through hole 11.

[0034] The flexible circuit board 3 is electrically connected to the light source 2 in order to provide voltage to the light source 2 so that the light source 2 can be lit. It should be noted that the light source 2 here can be an LED light bar, or other suitable light sources 2.

[0035] The first gold finger 31 of the flexible circuit board 3 is connected to the array substrate through the connection structure 4 , that is, the first gold finger 31 of the flexible circuit board 3 only needs to lead the voltage input end of the flexible circuit board 3 out of the mounting through hole 11 of the back plate 1 .

[0036] It should be noted that, in the backlight module of the prior art, the gold finger end of the flexible circuit board 3 is directly connected to the array substrate through the mounting through hole 11 of the back plate 1, which requires the structure of the gold finger end of the flexible circuit board 3 to be relatively large and complex (equivalent to the flexible circuit board 3 and the connection structure 4 in this embodiment). Therefore, the process of installing the flexible circuit board 3 is relatively cumbersome, especially the process of passing the gold finger end of the flexible circuit board 3 through the mounting through hole 11 of the back plate 1 requires manual operation to avoid damage to the structure of the gold finger end of the flexible circuit board 3.

[0037] In the backlight module of the present embodiment, the first gold finger 31 of the flexible circuit board 3 is connected to the array substrate through the connecting structure 4, that is, the first gold finger 31 of the flexible circuit board 3 only needs to lead the voltage input end of the flexible circuit board 3 out of the mounting through hole 11 of the back plate 1, so that the structure of the first gold finger 31 of the flexible circuit board 3 is simpler than the gold finger end of the flexible circuit board 3 in the prior art. Therefore, the preparation of the backlight module of the present embodiment can be automated, that is, the preparation of the backlight module of the present embodiment can be completed using automated equipment without the need for manual operation by the staff, thereby making the preparation of the backlight module of the present embodiment simpler, and can improve production efficiency and save costs.

[0038] Preferably, Figure 1 and Figure 2 As shown, in the first direction, the size of the connection structure 4 is larger than the size of the mounting through hole 11 of the back plate 1 , and the first direction is a direction parallel to the maximum size of the mounting through hole 11 .

[0039] Among them, since in the backlight module of this embodiment, the first gold finger 31 of the flexible circuit board 3 is connected to the array substrate through the connecting structure 4, that is, the first gold finger 31 of the flexible circuit board 3 only needs to lead the voltage input end of the flexible circuit board 3 out of the mounting hole 11 of the back plate 1, so the structure of the first gold finger 31 of the flexible circuit board 3 is relatively small, and therefore the size of the mounting hole 11 can also be relatively small; in order to ensure the stable connection between the flexible circuit board 3 and the array substrate, the size of the connecting structure 4 needs to be designed to be larger.

[0040] The first gold finger 31 of the flexible circuit board 3 is led out of the mounting hole 11 of the back plate 1 before being welded to the second gold finger 41. Therefore, even if the size of the connecting structure 4 is larger than the size of the mounting hole 11 of the back plate 1, it will not affect the installation of the light source 2 and the flexible circuit board 3.

[0041] It should be noted that, in the backlight module of the prior art, the gold finger end of the flexible circuit board 3 is directly connected to the array substrate through the mounting through hole 11 of the back plate 1, which requires the structure of the gold finger end of the flexible circuit board 3 to be relatively large and complex (equivalent to the flexible circuit board 3 and the connecting structure 4 in this embodiment). Therefore, the mounting through hole 11 of the back plate 1 also needs to be set relatively large to enable the gold finger end of the flexible circuit board 3 to pass through. A larger mounting through hole 11 will reduce the strength of the back plate 1, thereby increasing the risk of deformation of the back plate 1.

[0042] In the backlight module of the present embodiment, the first gold finger 31 of the flexible circuit board 3 is connected to the array substrate through the connecting structure 4, that is, the first gold finger 31 of the flexible circuit board 3 only needs to lead the voltage input end of the flexible circuit board 3 out of the mounting through hole 11 of the back plate 1, so that the structure of the first gold finger 31 of the flexible circuit board 3 is relatively small. Therefore, compared with the prior art, the size of the mounting through hole 11 of the back plate 1 of the present embodiment is smaller, thereby enhancing the strength of the back plate 1 and reducing the deformation risk of the back plate 1.

[0043] Preferably, Figures 4 to 7 As shown, the first gold finger 31 has a first binding area 32, the second gold finger 41 has a second binding area, the first binding area 32 has multiple first welding sub-areas 321, the second binding area has multiple second welding sub-areas, the first welding sub-areas 321 are connected to the second welding sub-areas to realize the connection between the first gold finger 31 and the second gold finger 41.

[0044] That is to say, the connection between the first gold finger 31 and the second gold finger 41 is achieved by welding between the first welding sub-area 321 and the second welding sub-area.

[0045] It should be noted that the second welding sub-region in the second welding sub-region is similar to the first welding sub-region 321 , which is not shown in the figure.

[0046] Preferably, the plurality of first welding sub-areas 321 are arranged in an array or in a row, and the plurality of second welding sub-areas are arranged in an array or in a row.

[0047] One of the situations is: Figure 5a As shown, a plurality of first welding sub-areas 321 are arranged in an array, and a plurality of second welding sub-areas are arranged in an array, and the first welding sub-areas 321 correspond to the second welding sub-areas one by one.

[0048] Another situation is: Figure 5b As shown, a plurality of first welding sub-areas 321 are arranged in a row, a plurality of second welding sub-areas are arranged in a row, and the first welding sub-areas 321 correspond to the second welding sub-areas one by one.

[0049] The provision of the plurality of first welding sub-areas 321 and the second welding sub-areas makes the connection between the first gold finger 31 and the second gold finger 41 more stable, thereby making the first gold finger 31 and the second gold finger 41 have greater mechanical strength.

[0050] Preferably, the first gold finger 31 of the flexible circuit board 3 includes a first strip structure 33 and a second strip structure 34 connected to the first strip structure 33 , and the first strip structure 33 is perpendicular to the second strip structure 34 ; the second gold finger 41 of the connecting structure 4 is connected to the second strip structure 34 .

[0051] Among them, Figure 4 As shown, the first golden finger 31 is L-shaped, and the two sides of the L-shape are the first strip structure 33 and the second strip structure 34 , and the first strip structure 33 is inserted into the mounting through hole 11 .

[0052] Preferably, the backlight module further includes: protective glue, which is disposed in the first binding area 32 or the second binding area and located on the surface of the first golden finger 31 away from the second golden finger 41 or on the surface of the second golden finger 41 away from the first golden finger 31 .

[0053] That is to say, there is protective glue on the non-welding surfaces of the first gold finger 31 and the second gold finger 41 to prevent the first gold finger 31 and the second gold finger 41 from being damaged due to welding.

[0054] Specifically, Figure 6 As shown, the protective glue at least includes an anti-oxidation glue layer 51 and a reinforcing glue layer 52. The anti-oxidation glue layer 51 is in contact with the first gold finger 31 or the surface opposite to the welding surface of the first gold finger 31, and the reinforcing glue layer 52 is in contact with the anti-oxidation glue layer 51, which is equivalent to the anti-oxidation glue layer 51 being located between the first gold finger 31 or the first gold finger 31 and the reinforcing glue layer 52.

[0055] It should be noted that the distribution structure of the protective adhesive in the second binding area is similar to the distribution structure of the protective adhesive in the first binding area 32 , and will not be described in detail herein.

[0056] Embodiment 2:

[0057] like Figures 1 to 8 As shown, this embodiment provides a method for preparing a backlight module, based on the backlight module in Embodiment 1, comprising:

[0058] S11, install the light source 2 and the flexible circuit board 3 on the back plate 1, the flexible circuit board 3 is electrically connected to the light source 2, the back plate 1 has a mounting through hole 11, the flexible circuit board 3 has a first gold finger 31, and at least part of the first gold finger 31 is inserted into the mounting through hole 11.

[0059] Among them, Figure 1 As shown, the back plate 1 is used to carry the remaining structures in the backlight module, and the structure of the back plate 1 is equivalent to a coverless box body with a receiving cavity, and the receiving cavity is used to receive the light source 2, the flexible circuit board 3 or the remaining structures of the backlight module. The mounting through hole 11 can be set on the side wall of the back plate 1, and the size of the mounting through hole 11 can match the size of the first gold finger 31, that is, the first gold finger 31 can pass through the mounting through hole 11.

[0060] The flexible circuit board 3 is electrically connected to the light source 2 in order to provide voltage to the light source 2 so that the light source 2 can be lit. It should be noted that the light source 2 here can be an LED light bar, or other suitable light sources 2.

[0061] Specifically, installing the light source 2 and the flexible circuit board 3 on the back plate 1 includes: installing the light source 2 and the flexible circuit board 3 on the back plate 1 using an automatic installation device.

[0062] That is to say, in this step, the electrical connection between the flexible circuit board 3 and the light source 2 and the insertion of the first gold finger 31 through the installation through hole 11 are all completed by the automatic installation equipment without manual operation.

[0063] S12 , connecting the second golden finger 41 at the first end of the connection structure 4 to the first golden finger 31 .

[0064] The connection structure 4 is mainly used to connect the flexible circuit board 3 of the backlight module with the electrodes of the array substrate, so that the connection structure 4 transmits the electrical signal to the flexible circuit board 3, thereby making the light source 2 emit light.

[0065] Specifically, the first gold finger 31 and the second gold finger 41 are connected by welding using automatic welding equipment.

[0066] In this step, the first gold finger 31 and the second gold finger 41 can be connected by welding, and the connection process is completed by automatic welding equipment without manual operation.

[0067] It should be noted that, in the preparation process of the backlight module of the prior art, the gold finger end of the flexible circuit board 3 is directly connected to the array substrate through the mounting through hole 11 of the back plate 1, which requires the structure of the gold finger end of the flexible circuit board 3 to be relatively large and complex (equivalent to the flexible circuit board 3 and the connection structure 4 in this embodiment). Therefore, the process of installing the flexible circuit board 3 is relatively cumbersome, especially the process of passing the gold finger end of the flexible circuit board 3 through the mounting through hole 11 of the back plate 1 requires manual operation to avoid damage to the structure of the gold finger end of the flexible circuit board 3.

[0068] During the preparation of the backlight module of the present embodiment, the first gold finger 31 of the flexible circuit board 3 is connected to the array substrate through the connecting structure 4, that is, the first gold finger 31 of the flexible circuit board 3 only needs to lead the voltage input end of the flexible circuit board 3 out of the mounting through hole 11 of the back plate 1, so that the structure of the first gold finger 31 of the flexible circuit board 3 is simpler than the gold finger end of the flexible circuit board 3 in the prior art. Therefore, the preparation of the backlight module of the present embodiment can be automated, that is, the preparation of the backlight module of the present embodiment can be completed using automated equipment without manual operation by the staff, thereby making the preparation of the backlight module of the present embodiment simpler, and can improve production efficiency and save costs.

[0069] In addition, connecting the first gold finger 31 and the second gold finger 41 by welding includes: coating protective glue on the surface opposite to the welding surface of the first gold finger 31 , and coating protective glue on the surface opposite to the welding surface of the second gold finger 41 .

[0070] That is, before welding, protective glue needs to be applied on the non-welding surfaces of the first gold finger 31 and the second gold finger 41 to prevent the first gold finger 31 and the second gold finger 41 from being damaged during the welding process.

[0071] Specifically, Figure 6 As shown, the protective glue at least includes an anti-oxidation glue layer 51 and a reinforcing glue layer 52. The anti-oxidation glue layer 51 is in contact with the first gold finger 31 or the surface opposite to the welding surface of the first gold finger 31, and the reinforcing glue layer 52 is in contact with the anti-oxidation glue layer 51, which is equivalent to the anti-oxidation glue layer 51 being located between the first gold finger 31 or the first gold finger 31 and the reinforcing glue layer 52.

[0072] Preferably, in the first direction (such as Figure 2 ), the size of the connecting structure 4 is larger than the size of the mounting through hole 11 of the back plate 1, and the first direction is parallel to the direction of the maximum size of the mounting through hole 11.

[0073] Among them, since in the preparation process of the backlight module of this embodiment, the first gold finger 31 of the flexible circuit board 3 is connected to the array substrate through the connecting structure 4, that is, the first gold finger 31 of the flexible circuit board 3 only needs to lead the voltage input end of the flexible circuit board 3 out of the mounting hole 11 of the back plate 1, so the structure of the first gold finger 31 of the flexible circuit board 3 is relatively small, and therefore the size of the mounting hole 11 can also be relatively small; and in order to ensure the stable connection between the flexible circuit board 3 and the array substrate, the size of the connecting structure 4 needs to be designed to be larger.

[0074] The first gold finger 31 of the flexible circuit board 3 is led out of the mounting hole 11 of the back plate 1 before being welded to the second gold finger 41. Therefore, even if the size of the connecting structure 4 is larger than the size of the mounting hole 11 of the back plate 1, it will not affect the installation of the light source 2 and the flexible circuit board 3.

[0075] It should be noted that, in the preparation process of the backlight module in the prior art, the gold finger end of the flexible circuit board 3 is directly connected to the array substrate through the mounting through hole 11 of the back plate 1, which requires the structure of the gold finger end of the flexible circuit board 3 to be relatively large and complex (equivalent to the flexible circuit board 3 and the connection structure 4 in this embodiment). Therefore, the mounting through hole 11 of the back plate 1 also needs to be set relatively large to enable the gold finger end of the flexible circuit board 3 to pass through. A larger mounting through hole 11 will reduce the strength of the back plate 1, thereby increasing the risk of deformation of the back plate 1.

[0076] During the preparation process of the backlight module of the present embodiment, the first gold finger 31 of the flexible circuit board 3 is connected to the array substrate through the connecting structure 4, that is, the first gold finger 31 of the flexible circuit board 3 only needs to lead the voltage input end of the flexible circuit board 3 out of the mounting through hole 11 of the back plate 1, so that the structure of the first gold finger 31 of the flexible circuit board 3 is relatively small. Therefore, compared with the prior art, the size of the mounting through hole 11 of the back plate 1 of the present embodiment is smaller, thereby enhancing the strength of the back plate 1 and reducing the deformation risk of the back plate 1.

[0077] Embodiment 3:

[0078] This embodiment provides a display panel, including:

[0079] The backlight module in embodiment 2;

[0080] The array substrate, the second end of the connecting structure 4 of the backlight module is connected to the array substrate.

[0081] Specifically, the display device can be any product or component with a display function, such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or the like.

[0082] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0083] According to the embodiments of the present invention as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modified use based on the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A backlight module, characterized in that: include: light source; A flexible circuit board, connected to the light source and used to provide voltage to the light source, wherein the flexible circuit board has a first gold finger; A back plate, used for carrying the light source and the flexible circuit board, the back plate having a mounting through hole, at least a portion of the first gold finger is inserted into the mounting through hole, and the voltage input end of the flexible circuit board is led out of the mounting through hole of the back plate; A connection structure, wherein a first end of the connection structure has a second gold finger, and the second gold finger is connected to the first gold finger of the flexible circuit board; In a first direction, the size of the connection structure is larger than the size of the mounting through hole of the back plate, and the first direction is a direction parallel to the maximum size of the mounting through hole; The first gold finger has a first binding area, the second gold finger has a second binding area, the first binding area has a plurality of first welding sub-areas, the second binding area has a plurality of second welding sub-areas, the first welding sub-areas are connected to the second welding sub-areas to achieve connection between the first gold finger and the second gold finger; The backlight module further includes: a protective glue disposed in the first binding area or the second binding area; The protective glue is located on the surface of the first gold finger away from the second gold finger; the protective glue includes an anti-oxidation glue layer and a reinforcing glue layer, wherein the anti-oxidation glue layer is located between the first gold finger and the reinforcing glue layer; or, the protective glue is located on the surface of the second gold finger away from the first gold finger; the protective glue includes an anti-oxidation glue layer and a reinforcing glue layer, wherein the anti-oxidation glue layer is located between the second gold finger and the reinforcing glue layer; The first gold finger of the flexible circuit board includes a first strip structure and a second strip structure connected to the first strip structure, and the first strip structure is perpendicular to the second strip structure; The first strip structure is inserted into the mounting through hole; and the second gold finger of the connecting structure is connected to the second strip structure.

2. The backlight module according to claim 1, characterized in that: The plurality of first welding sub-areas are arranged in an array or in a row, and the plurality of second welding sub-areas are arranged in an array or in a row.

3. A method for preparing a backlight module, characterized in that: The method for preparing a backlight module according to any one of claims 1 to 2 comprises: The light source and the flexible circuit board are mounted on a back plate, wherein the flexible circuit board is electrically connected to the light source, the back plate has a mounting through hole, the flexible circuit board has a first gold finger, and at least a portion of the first gold finger is inserted into the mounting through hole; Connect the second golden finger at the first end of the connection structure to the first golden finger.

4. The method for preparing a backlight module according to claim 3, characterized in that: The step of installing the light source and the flexible circuit board on the backplane comprises: installing the light source and the flexible circuit board on the backplane using an automatic installation device; The step of connecting the second gold finger at the first end of the connection structure to the first gold finger comprises: using automatic welding equipment to perform welding connection between the first gold finger and the second gold finger.

5. A display panel, characterized in that: include: The backlight module according to any one of claims 1 to 2; An array substrate, to which the second end of the connection structure of the backlight module is connected.

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