Component Processor

Abstract

The present disclosure relates to a system (100) for processing components (102). The system (100) includes a turret assembly (200) including a turret (202) rotatable about a horizontal axis (204); and a plurality of end effectors (206) surrounding the turret (202) and radially aligned from the horizontal axis (204). The system (100) also includes a support assembly (300) arranged to support a source substrate (302) including segmented components (102); and a component transfer assembly (400) arranged to support a component transfer medium (402) for receiving the segmented components (102) from the end effectors (206). The turret assembly (200), the support assembly (300) and the component transfer assembly (400) are arranged perpendicular to each other. During the rotation of the turret (202), the end effector (206) continuously picks up the segmented components (102) from the source substrate (302) and places the picked-up segmented components (102) on the component transport medium (402).

Description

Technical Field

[0001] The present disclosure generally relates to component handlers. In particular, the present disclosure describes various embodiments of systems and methods for handling components, such as semiconductor dies, using a rotatable turret. Background Art

[0002] Semiconductor products such as semiconductor integrated circuits are typically manufactured in wafer form or packaged form and then segmented into multiple components, such as semiconductor dies. The segmented components typically undergo further processing steps until they are packaged and distributed. Each processing step can occur at a different and separate processing station and / or via a different processing module. Typically, each component is first picked up at a first location and transferred between different processing stations and then unloaded at a second location on a transport medium. Depending on the processing requirements, the components are processed at the processing station while in motion or while temporarily stationary at the processing station. In various processes, the segmented components are typically transported from one station to another in batches. The components are typically transported in an automated, compact and high-speed environment, so it is important to minimize the risk of damaging the components and to achieve high throughput and accuracy when transferring the components.

[0003] Some existing devices known in the semiconductor industry for handling and transferring components include tape and reel assemblies and the component handler described in WO2009 / 128790. The latter is a rotating component handler with a flip mechanism driven by a motor. The flipper uses a cam and a follower mechanism to rotatably flip the flip head from a retracted position to an unloaded position. One problem with this component handler is that the high rotational speed of the flip mechanism exerts high friction on the cam and follower mechanism, thereby prematurely shortening the life of the cam and follower mechanism.

[0004] Therefore, in order to solve or alleviate at least one of the above problems and / or disadvantages, it is necessary to provide an improved component processor. Summary of the invention

[0005] According to a first aspect of the present disclosure, there is a system for processing components. The system includes a turret assembly, which includes: a turret that can rotate around a horizontal axis; and a plurality of end effectors attached to the turret and arranged around the periphery of the turret, the end effectors being radially aligned from the horizontal axis. The system also includes: a support assembly, which is arranged to support a source substrate including segmented components, the support assembly being arranged perpendicular to the turret assembly; and an element conveying assembly, which is arranged to support an element conveying medium for receiving segmented components from the end effector, the element conveying assembly being arranged perpendicular to the turret assembly. The turret assembly is disposed between the support assembly and the element conveying assembly, and during the rotation of the turret, the end effector continuously picks up segmented components from the source substrate and places the picked-up segmented components on the element conveying medium.

[0006] According to a second aspect of the present disclosure, there is a method for processing components. The method includes: supporting a source substrate on a support assembly arranged perpendicular to a turret assembly, the source substrate including segmented components; supporting a component conveying medium on a component conveying assembly arranged perpendicular to the turret assembly, the component conveying medium being used to receive segmented components from a plurality of end effectors of the turret assembly; rotating a turret of the turret assembly about a horizontal axis, the end effectors being attached to the turret and arranged around the periphery of the turret and radially aligned from the horizontal axis; during the rotation of the turret, actuating the end effectors to continuously pick up segmented components from the source substrate and place the picked up segmented components on the component conveying medium, wherein the turret assembly is disposed between the support assembly and the component conveying assembly.

[0007] According to a third aspect of the present disclosure, there is a turret assembly for processing components. The turret assembly includes: a turret rotatable about a horizontal axis; and a plurality of end effectors attached to the turret and arranged at the periphery of the turret, the end effectors being radially aligned from the horizontal axis, wherein during the rotation of the turret, the end effectors pick up segmented components from a source substrate and place the picked segmented components on a component transport medium; and wherein the source substrate, the turret assembly and the component transport medium are arranged perpendicular to each other, and the turret assembly is disposed between the source substrate and the component transport medium.

[0008] Therefore, an element processor according to the present disclosure is disclosed herein. Various features, aspects and advantages of the present disclosure will become more apparent from the following detailed description of embodiments of the present disclosure, which are given by way of non-limiting example only, and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a schematic diagram of a system for processing elements according to some embodiments of the present disclosure.

[0010] Figure 2 is a flowchart illustration of a method for processing an element according to some embodiments of the present disclosure.

[0011] Figure 3 is a schematic diagram of an end effector for a processing element according to some embodiments of the present disclosure.

[0012] Figure 4 is another schematic diagram of a system for processing elements according to some embodiments of the present disclosure.

[0013] Figure 5 is another schematic diagram of a system for processing elements according to some embodiments of the present disclosure.

[0014] Figure 6 is another schematic diagram of a system for processing elements according to some embodiments of the present disclosure.

[0015] FIG. 7A to FIG. 7D is a schematic diagram of different stages of a system for processing an element according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0016] For the sake of brevity and clarity, the description of the embodiments of the present disclosure is directed to the element processor according to the accompanying drawings. Although the various aspects of the present disclosure will be described in conjunction with the embodiments provided herein, it should be understood that they are not intended to limit the present disclosure to these embodiments. On the contrary, the present disclosure is intended to cover the replacement, modification and equivalent of the embodiments described herein, which are included in the scope of the present disclosure as defined by the appended claims. In addition, in the following detailed description, specific details are set forth in order to provide a thorough understanding of the present disclosure. However, a person of ordinary skill in the art, i.e., a technician, will recognize that the present disclosure can be practiced without specific details and / or with multiple details resulting from a combination of aspects of a particular embodiment. In many cases, well-known systems, methods, processes and elements are not described in detail to avoid unnecessary confusion of aspects of the embodiments of the present disclosure.

[0017] In embodiments of the present disclosure, the description of a given element in a particular figure or consideration or use of a particular element number or reference thereto in corresponding descriptive material may encompass the same, equivalent or similar element or element number in another figure or descriptive material related thereto.

[0018] References to "one embodiment / example", "another embodiment / example", "some embodiments / examples", "some other embodiments / examples", etc. indicate that the embodiment / example so described may include a particular feature, structure, characteristic, property, element, or limitation, but not every embodiment / example must include that particular feature, structure, characteristic, property, element, or limitation. Furthermore, repeated use of the phrase "in one embodiment / example" or "in another embodiment / example" does not necessarily refer to the same embodiment / example.

[0019] The terms "comprise", "include", "have", etc. do not exclude the presence of other features / elements / steps than those listed in the embodiments. Listing certain features / elements / steps in mutually different embodiments does not mean that the combination of these features / elements / steps cannot be used in the embodiments.

[0020] As used herein, the terms "one" and "an" are defined as one or more than one. Unless otherwise stated, the use of " / " in a graphic or related text should be understood to mean "and / or". According to known mathematical definitions, the term "set" is defined as a non-empty finite organization of elements that mathematically exhibit at least one cardinality (for example, a set as defined herein can correspond to a unit, a singlet state or a single element set, or a multi-element set). The narration of a specific numerical value or a numerical range herein is understood to include or be a narration of an approximate numerical value or a numerical range. As used herein, the terms "first", "second", "third", "fourth", etc. are only used as labels or identifiers, and are not intended to impose numerical requirements on their related terms. As used herein, the term "each other" represents the mutual relationship between two or more elements.

[0021] In a representative or exemplary embodiment of the present disclosure, Figure 1 As shown, there is a system 100 for processing a component 102. The system 100 includes a turret assembly 200, a support assembly 300 disposed perpendicular to the turret assembly 200, and a component transfer assembly 400 disposed perpendicular to the turret assembly 200. Specifically, the turret assembly 200 is disposed between the support assembly 300 and the component transfer assembly 400. In many embodiments, the support assembly 300 is disposed below the turret assembly 200 and the component transfer assembly 400 is disposed above the turret assembly 200.

[0022] Turret assembly 200 is configured to pick up or retrieve singulated or individual components 102 from support assembly 300, transfer the picked singulated components 102 toward component transport assembly 400, and place or release the picked singulated components 102 at component transport assembly 400. Segmented components 102 may be semiconductor or integrated circuit dies, chips, or packages.

[0023] The turret assembly 200 includes a turret 202 that is rotatable about a horizontal axis 204. Figure 1 As shown, the horizontal axis 204 refers to the Y-axis, and the turret 202 can rotate about the XZ-plane. The turret assembly 200 also includes a plurality of end effectors 206, which are attached to the turret 202 and arranged around the periphery of the turret 202. The end effectors 206 are configured to pick up and place the segmented components 102. In addition, the end effectors 206 are radially aligned from the horizontal axis 204 so that the picking and placing of the segmented components 102 is along the radial direction of the turret 202. The end effectors 206 can also be referred to as pick and placers having a pick head for retrieving and releasing the segmented components 102.

[0024] The support assembly 300 is arranged to support a source substrate 302 including a segmented element 102. In many embodiments, the source substrate 302 is a semiconductor wafer having segmented semiconductor dies as the element 102. The support assembly 300 includes a support portion 304 for supporting the source substrate 302, such as a wafer support or holding structure for supporting the segmented wafer. The wafer support structure can be a wafer stage, such as a wafer stage having a highly planar or super-planar support surface. The wafer and / or element 102 can be supported on the wafer stage by a wafer support medium, such as a film frame, an adhesive film, a tape, or a substrate, as will be readily understood by those skilled in the art.

[0025] In some embodiments, the support portion 304 includes a plurality of suction ports for facilitating the source substrate 302 to be matched to the surface of the support portion 304. The suction ports can be activated to hold the support portion 304 for removing the element 102, and can be disabled to release the source substrate 302 to be discarded or disposed of. It should be understood that there may be other means for engaging or holding the source substrate 302 on the support portion 304. For example, a porous portion may be formed inside the support portion 304 in place of the suction port. The porous portion may be exposed to negative pressure or positive pressure to achieve the same function as the suction port as will be readily understood by those skilled in the art.

[0026] In some embodiments, there is a support drive mechanism 306 for actuating the support assembly 300 to move the source substrate 302 for the end effector 206 to pick up the segmented element 102. Specifically, the support actuation mechanism 306 moves the source substrate 302 to position the next segmented element 102 for the next end effector 206 to pick up. The support actuation mechanism 306 can be part of the support assembly 300 or separately connected to the support assembly 300. For example, the support actuation mechanism 306 is coupled to the support portion 304 or integrated with the support portion 304 to actuate the support portion 304 to move the source substrate 302. In some embodiments, the support assembly 300 includes an ejection mechanism (which can cooperate with the support portion 304) to help the end effector 206 pick up the element 102. For example, the ejection mechanism can include a pin for vertically pushing the element 102 from the source substrate 302 to the end effector 206. Such an ejection mechanism can be configured in a manner that is readily understood by those skilled in the art.

[0027] The component transport assembly 400 is arranged to support a component transport medium 402 for receiving the segmented components 102 from the end effector 206. The end effector thus transports the segmented components 102 from the source substrate 302 to the component transport medium 402. In many embodiments, the component transport medium 402 is a film or membrane, such as a die attach film mounted on a film frame, to which the components 102 to be released can be easily attached. As will be readily appreciated by those skilled in the art, there are various types of die attach films suitable for semiconductor components 102.

[0028] The component transport assembly 400 may include a holding portion 404 for firmly holding the component transport medium 402. In some embodiments, the holding portion 404 includes a porous portion formed inside the holding portion 404, which can be exposed to negative pressure or positive pressure to promote the component transport medium 402 to match the surface of the holding portion 404. The negative pressure at the holding portion 404 can be activated to hold the component transport medium 402 for placing the component 102, and disabled to release the component transport medium 402 for transfer to a subsequent processing stage. The porous portion is in fluid communication with a vacuum source. The negative pressure enables the component transport medium 402 to be tightly and substantially flatly held in the holding portion 404. This prevents or at least reduces the sagging of the component transport medium 402 caused by the total weight of the component 102 placed on the bottom holding surface of the component transport medium 402. This arrangement advantageously ensures that the vertical position and height of the component transport assembly 400 relative to the turret assembly 200 are not affected or minimally affected by the sagging of the component transport medium 402. Although a porous portion is described for retaining portion 404, it should be understood that other means for engaging or retaining element transport medium 402 to prevent or reduce sagging thereof may be present.

[0029] In some embodiments, there is a component transport actuator 406 for actuating the component transport assembly 400 to move the component transport medium 402 for the end effector 206 to place the segmented component 102. Specifically, the component transport actuator 406 moves the component transport medium 402 to position it for the next segmented component 102 to be placed by the next end effector 206. The component transport actuator 406 can be part of the component transport assembly 400 or separately connected to the component transport assembly 400. For example, the component transport actuator 406 is coupled to the holding portion 404 or integrated with the holding portion 404 to actuate the holding portion 404, thereby moving the component transport medium 402.

[0030] In the representative or exemplary embodiments of the present disclosure, Figure 2For reference, there is a method 500 for processing components 102 performed by the system 100. In step 502, a source substrate 302 is supported on a support assembly 300 arranged perpendicular to the turret assembly 200, the source substrate 302 including the segmented components 102. In step 504, a component transport medium 402 is supported on a component transport assembly 400 arranged perpendicular to the turret assembly 200, the component transport medium 402 being used to receive the segmented components 102 from the plurality of end effectors 206 of the turret assembly 200.

[0031] In step 506, turret 202 of turret assembly 200 rotates about horizontal axis 204, and end effector 206 is attached to turret 202 and arranged around the periphery of turret 202 and radially aligned from horizontal axis 204. In step 508, during the rotation of turret 202, end effector 206 is actuated to continuously pick up segmented components 102 from source substrate 302 and place the picked up segmented components 102 on component transport medium 402.

[0032] The turret assembly 200 disposed between the support assembly 300 and the component transfer assembly 400 is thus configured to retrieve and release the components 102 directly from the source substrate 302 onto the component transfer medium 402 using the end effector 206. In many embodiments, the turret assembly 200 retrieves the components 102 from the support assembly 300 disposed below it and transfers the components 102 to the component transfer assembly 400 disposed above it. The retrieval and release of the components 102 are performed during the continuous rotation of the turret 202, with intermittent pauses during the pick and place of the components 102 so that the components are continuously transferred as the turret 202 rotates.

[0033] The turret 202 can be configured to rotate in a clockwise or counterclockwise manner, but the various parts of the system 100 can be rearranged according to the direction of rotation. The turret 202 can also be configured to adjust its rotation speed. During the rotation of the turret 202, the turret 202 pauses rotation at the loading position to pick up the component 102 and pauses rotation at the unloading position to place the component 102. When the turret 202 rotates continuously from the loading position to the unloading position to transfer the component 102 from the support assembly 300 to the component transfer assembly 400, the turret 202 can pause rotation at various stages or steps during the transfer, such as performing other processing on the component 102 during the transfer. In some embodiments, the rotation is paused at a position between the loading and unloading positions, such as an image capture position for alignment, as will be further described below.

[0034] In some embodiments, the turret 202 is generally circular so that the end effector 206 is radially equidistant from the horizontal axis 204. The horizontal axis 204 is located in the XZ-plane relative to or parallel to the ground. The arrangement of the rotatable turret 202 advantageously reduces the floor space occupied and makes the system 100 more compact. Another advantage of rotating the turret 202 about the horizontal axis 204 is that the turret assembly 200 is less affected by vibrations that are prone to occur in the vertical axis turret caused by the vertical forces in the end effector during the retrieval / pickup and release / placement steps. The turret assembly 200 includes a drive mechanism, such as a rotary drive or other type of drive mechanism, and can optionally cooperate with a transmission mechanism for rotating the turret 202. In many embodiments, the turret assembly 200 includes a motor for rotating the turret 202. The motor can be battery-powered or electrically driven, and can be a stepper motor or a servo motor. The motor or actuation mechanism is configured to rotate the turret 202 in a controlled manner so that the turret 202 rotates and pauses at intervals to pick up and place the components 102. It should be understood that other types of motors or actuation mechanisms may be used to achieve rotation or angular displacement of the turret 202 .

[0035] The turret assembly 200 can be configured to hold a desired number of end effectors 206 on the turret 202. The number of end effectors 206 can be predetermined to match the desired throughput of the system 100, such as two, three, or four end effectors 206 attached to and arranged around the periphery of the turret 202. Having a greater number of end effectors 206 increases throughput as the turret 202 rotates through smaller angular displacements between successive end effectors 206, thus increasing the rate at which the end effectors 206 retrieve and release segmented elements 102. It should be understood that the number of end effectors 206 can be calculated by a skilled artisan based on the desired throughput.

[0036] Additionally, turret assembly 200 may be configured for a range of radii of turret 202 such that end effector 206 may be configured to rotate about horizontal axis 204 at a shorter or longer radius, depending on the configuration of the various components of system 100. Turret 202 may be designed to include certain features or elements to reduce its weight and / or inertial mass to increase the efficiency of turret assembly 200. Such design features or elements will be readily understood by those skilled in the art.

[0037] refer to Figure 3, each end effector 206 includes a pick-up head 208 for picking up and placing the segmented element 102. In some embodiments, the pick-up head 208 includes a suction tip or nozzle, or any other suitable type of element gripper for retrieving, holding and releasing the element 102 as will be readily appreciated by those skilled in the art. For example, each pick-up head 208 is a nozzle fluidly connected to a fluid source (e.g., pneumatic or hydraulic or a combination thereof) such that negative and positive fluid pressures, such as vacuum pressure, can be actuated to retrieve and release the element 102.

[0038] The pick-up head 208 may apply a predetermined force to the component 102 at the point of contact with the component 102 during the retrieval step. The force allows the component 102 to be stably held or clamped by the pick-up head 208 to prevent or mitigate the risk of displacement of the component 102. Without this force, component displacement may occur due to misalignment of the component 102 with the source substrate 302, which may result in poor contact between the pick-up head 208 and the component 102 and the component 102 not being properly held by the pick-up head 208. The misalignment may include one or more misalignments of the source substrate 302 relative to the support assembly 300 along the X-axis, the Y-axis, and / or the tilt angle in the XY-plane.

[0039] A sensor may be located on the pick head 208 that is configured to measure the force that the pick head 208 applies to the component 102 during the retrieval step. The force may be adjusted based on the sensor measurement, such as by increasing the force to stabilize the pick head 208's hold on the component 102 or by decreasing the force to avoid applying excessive force on the component 102, which may cause damage to the component 102.

[0040] The segmented elements 102 are individually picked up or retrieved from the source substrate 302 by the end effector 206 from a top-down direction. Figure 3 As shown, when the end effector 206 is in a loading position relative to the element 102 of the source substrate 302, the pick-up head 208 can be moved vertically from the standby position to the pick-up position by a predetermined distance to achieve the retrieval of the element 102. Since the end effector 206 is oriented in a radial direction away from the center of the turret 202, the force applied by each pick-up head 208 on the element 102 is generally transmitted through the center of the turret 202 and the horizontal axis 204. The unbalanced forces that are prone to occur in the vertical axis turret with a vertically oriented end effector are significantly reduced, thereby reducing interference such as shock and vibration to other parts of the system 100. The reduced interference therefore minimizes the extraneous movement of the end effector 206 during the retrieval and release steps. Therefore, during the retrieval step, the segmented element 102 can be retrieved by the end effector 206 without a significant risk of dislodging from the pick-up head 208.

[0041] In the loading position of the source substrate 302 during the retrieval step, the pick-up head 208 is in a downward orientation relative to the top holding surface of the segmented component 102, which is in a generally flat position corresponding to the horizontal XY-plane. In the unloading position at the component transport medium 402 during the release step, the pick-up head 208 is in an upward orientation relative to the bottom holding surface of the component transport medium 402, which is in a generally flat position corresponding to the horizontal XY-plane. In this arrangement, the holding surface of the component transport medium 402 is in a downward orientation and directly facing the top holding surface of the source substrate 302, which is in an upward orientation.

[0042] In many embodiments, the end effectors 206 are equiangularly positioned at the periphery of the turret 202. The end effectors 206 are equiangularly spaced from each other relative to the horizontal axis 204, which substantially keeps the weight of the turret assembly 200 balanced. For example, at one moment of rotation, one end effector 206 is in a loaded position and the other end effector 206 is in an unloaded position, and the total weight of the turret assembly 200 is substantially balanced relative to the horizontal axis 204.

[0043] In such Figure 4 In some of the embodiments shown, there is a first end effector 206a and a second end effector 206b directly opposite each other, i.e., the end effectors 206ab are positioned 180° apart from each other. The two end effectors 206ab are configured in a similar manner in structure and are also similar in spatial configuration relative to the turret 202. For example, when the first end effector 206a is in an unloading position at the top of the turret 202 to place a first piece of segmented components 102a on the component transport medium 402, the second end effector 206b is in a loading position at the bottom of the turret to pick up a second piece of segmented components 102b from the source substrate 302. The rotation of the turret 202 is paused to allow the first segmented components 102a to be placed on the component transport medium 402 and the second segmented components 102b to be picked up from the source substrate 302. Subsequently, the turret 202 resumes rotation to move the second end effector 206b and the held second segmented component 102b to the unloading position at the component transport medium 402, and simultaneously moves the first end effector 206a to the loading position 302 at the source substrate. The second segmented component 102b is ready to be placed on the component transport medium 402, and the first end effector 206a is ready to pick up another segmented component 102.

[0044] Thus, the first end actuator 206a and the second end actuator 206b rotate together with the turret 202, so that at one moment of the turret rotation, the first end actuator 206a is in an appropriate position to vertically place the first segmented element 102a on the element transport medium 402, for example in a bottom-up direction, and the second end actuator 206b is in an appropriate position to vertically pick up the second segmented element 102b from the source substrate 302, for example in a top-down direction.

[0045] In such Figure 1 In some embodiments shown, the turret assembly 200 includes four end effectors 206a-d that are equiangularly positioned around the turret 202, i.e., 90° apart from each other. In some embodiments, the turret assembly 200 includes three end effectors 206a-c that are equiangularly positioned around the turret 202, i.e., 120° apart from each other. However, it should be understood that the end effectors 206 can be spaced at different angular distances. For example, in a turret assembly 200 having three end effectors 206a-c, the first and second end effectors 206ab can be angularly spaced 180° apart, the second and third end effectors 206bc can be angularly spaced 90° apart, and the first and third end effectors 206ac can be angularly spaced 90° apart.

[0046] In such Figure 5 and Figure 6 In some embodiments shown, the system 100 further includes an image capture device 600 configured to capture images of the segmented element 102 held by the end effector 206 during the rotation of the turret 202. During the capture of each image of the segmented element 102, the element 102 can be in motion (the turret 202 is continuously rotating) or temporarily stationary (the turret 202 is paused from rotating). The image capture device 600 can be radially aligned from the horizontal axis 204. Specifically, the image capture device 600 can be positioned in any suitable or ergonomic position in a radial direction facing the center of the turret 202. For example, the image capture device 600 is aligned with the X-axis and directly faces the end effector 206 in the image capture position for image capture of the segmented element 102 held by the end effector 206. This arrangement enables the image capture device 600 to capture a good image of the bottom surface of the segmented element 102 because the surface is aligned with the center of the field of view of the image capture device 600. It should be appreciated that image capture device 600 may be positioned or rearranged differently depending on the direction of rotation of turret 202 .

[0047] System 100 may include an illumination device to facilitate capturing a clearer and more accurate image of segmented element 102. The illumination device may include one or more of a ring light, a xenon lamp, a light emitting diode (LED) lamp, or white light. The illumination intensity from the illumination device may be varied as desired.

[0048] The system 100 may also include a computer system 700 communicatively linked to the image capture device 600. The computer system 700 includes an image processing module for processing the captured image of the segmented element 102. In some embodiments, the image processing module is configured to detect whether the bottom surface of the segmented element 102 is aligned with the center of the field of view of the image capture device 600, and capture one or more images of the bottom surface of the segmented element 102 in response to the positive detection of the alignment. The computer system 700 may include a data storage module (e.g., a hard drive, a solid-state drive, or a storage device) for storing the captured images. In addition, as will be further described below, the image processing module is configured to calculate the misalignment of the segmented element 102 maintained based on the captured image.

[0049] The computer system 700 includes one or more computers, laptops, microcomputers, mainframe computers, any non-transient and tangible machines that can execute machine-readable code, cloud-based servers, distributed server networks, and computer system networks. The computer system 700 can be implemented in hardware or software or a combination thereof. In addition, the computer system 700 includes a processor, a memory, and various other modules or elements. The modules and their elements are configured to perform various operations or steps and are configured as part of the processor. Such operations or steps are performed by non-transient instructions in response to processor operations or executions. The memory is used to store instructions read during program execution and data that may be read. In some contexts, the memory may be referred to as a computer-readable storage medium and / or a non-transient computer-readable medium. Non-transient computer-readable media include all computer-readable media, with the only exception being the transient propagation signal itself.

[0050] In some embodiments, the computer system 700 stores a digital map or data set of the source substrate 302 on a data storage module. The digital map identifies the location of the segmented components 102 relative to the source substrate 302. In addition, the digital map can identify the location of defective segmented components 102. Specifically, the digital map provides a record of which of the components 102 of the source substrate 302 are good and which are defective. This may depend on the results of electrical tests and visual inspections that can be performed during front-end and back-end processing before the components 102 are transferred from the source substrate 302. The digital map of the source substrate 302 is constantly updated during the front-end and back-end processing, especially after each set of electrical tests and visual inspections that the source substrate 302 is subjected to. In the digital map, the data field corresponding to the location of each segmented component 102 is updated with a specific and different data element. The data element describes at least whether the segmented component 102 is electrically good or damaged and visually good or defective. Good or non-defective components 102 are transferred from the source substrate 302 to the component transfer medium 402, while defective components 102 are discarded.

[0051] Prior to being transferred to the support assembly 300, the plurality of source substrates 302 may be stored on a storage medium, such as a wafer stack. Each source substrate 302 has an associated identifier, such as an optical code, and each digital image of the source substrate 302 is digitally linked to the identifier. Some non-limiting examples of optical codes include a Quick Response (QR) code, a barcode, an EZ code, a high-capacity color barcode, a Shot code, a Maxi code, a GTIN12 code, a GTIN-13 code, and an Aztec code. The identifier may be a physical identifier, such as a substrate identification number or a barcode engraved or marked on a surface of the source substrate 302, such as at a peripheral surface of the source substrate 302 to provide its identification.

[0052] Before the source substrate 302 is transferred to the support assembly 300, a digital map of the source substrate 302 can be provided to determine the positions of the segmented elements 102 to be retrieved. Each position is determined in XY-θ coordinates, i.e., a linear position along the X-axis and the Y-axis and an angular position θ on the horizontal XY-plane. The XY-θ coordinates of each segmented element 102 are referenced to a predefined reference.

[0053] When the segmented elements 102 of the source substrate 302 are picked up by the end effector 206 and moved to the image capture position, e.g. Figure 5 As shown, the third end effector 206c holds the third segmented element 102c, and the image capture device 600 captures one or more images of the bottom surface of the segmented element 102. Figure 5In the example shown, the first end effector 206a, the second end effector 206b, and the third end effector 206c rotate together with the turret 202. At one moment of the turret rotation, the first end effector 206a is in a position to vertically place the first segmented component 102a on the component transport medium 402 from the bottom-up direction, the second end effector 206b is in a position to vertically pick up the second segmented component 102b from the source substrate 302 along the top-down direction, and the third end effector 206c holds the third segmented component 102c and is in a position for capturing one or more images of the third segmented component 102c.

[0054] The captured images are transmitted to the computer system 700, and its computing module calculates the actual position of the segmented element 102 based on the captured images. The actual position is in XY-θ coordinates of a predefined benchmark of the digital map of the reference source substrate 302. Although the image capture device 600 is described as capturing images to calculate the actual position, as will be readily appreciated by those skilled in the art, there may be other ways of measuring or determining the actual position and coordinates of the segmented element 102.

[0055] The calculation module then compares the actual position of the segmented element 102 with the reference position of the same segmented element 102 from the digital map. Based on the comparison, the calculation module calculates the misalignment of the segmented element 102 relative to the digital map of the source substrate 302 and calculates the correct position for placing the segmented element 102 on the element transport medium 402.

[0056] Misalignment between the actual position of the segmented elements and their reference position from the digital map can be corrected by actuating the element transport assembly 400 to move the element transport medium 402 before placing the segmented elements 102 on the element transport medium 402. In some embodiments, the element transport actuation mechanism 406 actuates the element transport assembly 400 to move the element transport medium 402 to correct the misalignment.

[0057] The computer system 700 includes an actuation control module for controlling the component transport actuation mechanism 406 to correct misalignment including XY-θ deviation (deviation along the X-axis, Y-axis and / or the tilt angle on the XY-plane). The component transport actuation mechanism 406 is configured to actuate the component transport assembly 400 and move the component transport medium 402 along the X-axis, Y-axis and / or the tilt angle on the XY-plane. The component transport actuation mechanism 406 can thus align the component transport medium 402 to the segmented components 102 by correcting or compensating for the misalignment of the XY-θ deviation calculated above. Each segmented component 102 can then be accurately placed in the correct position on the component transport medium 402.

[0058] In some embodiments, the component transport actuator 406 is further configured to actuate the component transport assembly 400 and vertically move the component transport medium 402 along the Z-axis. This can be done to adjust the vertical distance between the component transport medium 402 and the end effector 206 before the end effector 206 places the segmented component 102 on the component transport medium 402. In addition, the vertical distance between the end effector 206 and the component transport medium 402 can be different, for example, depending on the thickness of the component transport medium 402. The component transport actuator 406 can actuate the component transport assembly 400 and thereby move the component transport medium 402 downward or upward to adjust the vertical distance to the end effector 206 so that the end effector 206 can correctly place the segmented component 102 on the component transport medium 402.

[0059] In some embodiments, the support actuation mechanism 306 actuates the support assembly 300 to align the segmented elements 102 of the source substrate 302 with the end effector 206. The support assembly 300 may be actuated to compensate for any misalignment determined from the digital map of the source substrate 302.

[0060] The drive control module is used to control the support drive mechanism 306 to drive the source substrate 302 along the X-axis, the Y-axis and / or the tilt angle on the XY-plane. Therefore, the support actuation mechanism 306 can align the segmented elements 102 with the end effector 206 by actuating the support assembly 300 to move the source substrate 302 and thereby center the segmented elements 102 of the source substrate 302 with the pick-up head 208 of the end effector. Each segmented element 102 can then be accurately picked up at the correct position of the source substrate 302. Such a support assembly 300 can therefore carry, firmly hold and accurately position the source substrate 302 in a manner that is easily understood by those skilled in the art.

[0061] In some embodiments, the support actuation mechanism 306 is further configured to actuate the support assembly 300 and vertically move the source substrate 302 along the Z-axis. This can adjust the vertical distance between the source substrate 302 and the end effector 206 before the end effector 206 picks up the segmented element 102 from the source substrate 302. In addition, the vertical distance between the end effector 206 and the source substrate 302 can be different, for example, depending on the thickness of the source substrate 302. The support actuation mechanism 306 can actuate the support assembly 300 and thereby move the source substrate 302 downward or upward to adjust the vertical distance to the end effector 206 so that the end effector 206 can correctly pick up the segmented element 102 from the source substrate 302.

[0062] In many embodiments, the source substrate 302 has been inspected before the component 102 is transferred from the source substrate 302 to the component transport medium 402. Before the source substrate 302 is transferred to the support assembly 300, or when the source substrate 302 has been placed on the support assembly 300 but before the component 102 is positioned to the end effector for picking up, the inspection 206 can be performed on the source substrate 302. During these inspections, the digital map of the source substrate 302 is continuously updated to accurately correct for misalignment during the transfer of the component 102 from the source substrate 302 to the component transport medium 402.

[0063] In some embodiments, the system 100 does not include the image capture device 600. The computer system 700 therefore performs the correction of the misalignment based on the digital map of the source substrate 302 and does not process any captured images of the segmented elements 102. This is possible because the digital map is constantly updated during the inspection and the actual coordinates of the segmented elements 102 can be accurately derived from the digital map. In these embodiments, the image capture device 600 does not have to capture images of the segmented elements 102 to correct the misalignment. By using the digital map, the actuation control module controls the support actuation mechanism 306 to actuate the support assembly 300 and move the source substrate 302 to accurately position the segmented elements 102 under the end effector 206, i.e., the center of each segmented element 102 is directly located under the corresponding end effector 206. Therefore, the segmented elements 102 can be directly transferred to the element transfer medium 402 with minimal intervention steps, because the misalignment of the segmented elements 102 will be minimal.

[0064] In some embodiments, the source substrate 302, such as a film frame holding the segmented elements 102, has undergone a stretching process that distributes the segmented elements 102 on the source substrate 302. The stretching process can be performed to increase the spacing or gap between the elements to facilitate the pickup of the end effector 206. As a result of the stretching process, the actual coordinates of each segmented element 102 deviate from the coordinates stored on the digital map. In these embodiments, the system 100 includes an image capture device 600 that cooperates with the computer system 700 to perform misalignment correction based on the digital map. During the transport of the segmented elements 102, as described above, the image capture device 600 captures one or more images of each segmented element 102, and the captured images are processed to correct the misalignment of the segmented elements 102.

[0065] The computer system 700 may be connected via a communication network or interface to one or more other parts of a broader semiconductor manufacturing system, including, for example, another component processor, a die sorting device, a system controller, etc. The computer system 700 may be able to receive, retrieve, or access a digital map of the source substrate 302 from which the singulated components 102 are to be transferred, as well as other data related to the processing of the components 102.

[0066] The system 100 is preferably operated automatically by a computer system 700, for example in cooperation with a semiconductor manufacturing system. Each end effector 206 located around the periphery of the rotating turret 202 is capable of transporting a segmented component 102 from a retrieval or loading position where the segmented component 102 is picked up from the source substrate 302 to a release or unloading position where the segmented component 102 is placed on the component transport medium 402. The rotation of the turret 202 about the horizontal axis 204 gradually moves each segmented component 102 from the loading position to the unloading position, so that the end effector 206 can continuously pick up the segmented component 102 from the source substrate 302 and place the picked segmented component 102 on the component transport medium 402.

[0067] The loading position and the unloading position are positioned along a vertical line perpendicular to the source substrate 302 and / or the component transport medium 402, such that the source substrate 302 is arranged in a face-to-face orientation relative to the component transport medium 402. In this arrangement, when the segmented component 102 is picked up by the end effector 206 in the loading position, it is in a top-down orientation, meaning that the top surface of the segmented component 102 faces upward. When the end effector 206 places the segmented component 102 in the unloading position, it is in a bottom-up orientation, meaning that the bottom surface of the segmented component 102 faces upward, such that the bottom surface is attached to the component transport medium 402. This arrangement advantageously allows the segmented component 102 to be transferred directly from the source substrate 302 to the component transport medium 402 with minimal intervening steps for reorienting the segmented component 102, such as flipping the component 102.

[0068] Reference below FIG. 7A to FIG. 7D Describing exemplary operation of system 100 for component processing, FIG. 7A to FIG. 7D Different stages of operation are shown. In this operation, the component 102 is a semiconductor die 102 separated from a source substrate 302, which is a semiconductor wafer 302. The turret assembly 200 includes four end effectors 206a-d positioned equiangularly around the turret 202. The wafer 302 is supported on a support portion 304, which can be a wafer stage 304, and the support assembly 300 is referred to as a wafer stage assembly 300. The wafer stage assembly 300 also includes a support actuator mechanism 306. The component transfer medium 402 is a chip attach film 402 for attaching the bare die 102 thereto.

[0069] The wafer 302 is first retrieved from a storage medium such as a wafer stack by a robotic device, a wafer handler, or other devices known to those skilled in the art. The wafer 302 is retrieved and transferred to the support assembly 300, where it is placed on the wafer stage 304. A wafer handler or similar device for handling the wafer 302 can be integrated with the support assembly 300 or as the support assembly 300, or cooperate with the support assembly 300 separately. After the wafer 302 is placed on the wafer stage 304, the support actuator mechanism 306 is activated to actuate the wafer stage 304 and move the wafer 302 to align the first die 102a with the first end effector 206a. The movement of the wafer 302 is determined by the digital map of the wafer to compensate for any misalignment between the first end effector 206a and the first die 102a.

[0070] like Fig. 7A As shown, the first end effector 206a is in a loading position to pick up the first die 102a. Figure 7B As shown, the turret 202 rotates 90° clockwise to move the picked-up first die 102a to the image capture position. At the same time, the second end effector 206b moves to the loading position to pick up the second die 102b from the wafer 302.

[0071] In the image capture position, the image capture device 600 captures one or more images of the bottom surface of the first die 102a. The calculation module then calculates the actual position of the first die 102a based on the captured images, and further calculates the misalignment between the actual position of the first die 102a and the reference position from the digital map. The actuation control module then controls the component transfer actuation mechanism 406 to correct the misalignment. The component transfer actuation mechanism 406 is activated to actuate the component transfer assembly 400 and move the chip attach film 402 to correct the misalignment. In the loading position, the second end effector 206b picks up the second die 102b.

[0072] like Figure 7C As shown, the turret 202 rotates 90° clockwise to transfer the first die 102a to the unloading position. At the same time, the second die 102b is transferred to the image capturing position, and the third end effector 206c is transferred to the loading position to pick up the third die 102c from the wafer 302.

[0073] In the unloading position, the component transfer assembly 400 has been actuated to move the die attach film 402 to compensate for the misalignment. Thus, the first die 102 a can be accurately placed in the correct position on the die attach film 402 .

[0074] In the image capture position, the image capture device 600 captures one or more images of the bottom surface of the second die 102b. In the loading position, the third end effector 206c picks up the third die 102c.

[0075] like Fig.7D As shown, the turret 202 rotates 90° clockwise to move the second die 102b to the unloading position. At the same time, the third die 102c moves to the image capture position, and the fourth end effector 206d moves to the loading position to pick up the fourth die 102d from the wafer 302. It should be understood that the above description of the unloading, alignment and placement of the first die 102a is similarly or similarly applicable to the second die 102b, the third die 102c and the fourth die 102d, and will not be repeated for the sake of brevity. It should also be understood that all the dies 102 of the wafer 302 are continuously picked up and placed by the end effector 206 in a similar manner by rotating the turret 202.

[0076] As described in various embodiments herein, the system 100 is configured for processing the component 102 by transferring the component 102 from the support assembly 300 to the component transfer assembly 400, both of which are arranged perpendicular to the turret assembly 200. This vertical arrangement allows the component 102 to be transferred directly from the source substrate 302 to the component transfer medium 402 with minimal intervention steps for redirecting the component 102. This reduces the risk of the component 102 being dislodged from the end effector 206 because there are fewer intervention steps during the transfer. The transfer of the component 102 can be accomplished with high throughput, such as by increasing the number of end effectors 206 of the turret assembly 200, and with high accuracy, since misalignment can be corrected by actuating the component transfer assembly 400 to move the component transfer medium before the component 102 is placed on the component transfer medium. The high throughput and accuracy will increase the efficiency of semiconductor products manufactured and distributed from the semiconductor facility, thereby potentially leading to higher revenue.

[0077] With respect to the vertical arrangement, various embodiments of the present disclosure have been described in which the support assembly 300 is disposed below the turret assembly 200 and the component transfer assembly 400 is disposed above the turret assembly 200. However, there may be other embodiments in which the support assembly 300 is disposed above the turret assembly 200 and the component transfer assembly 400 is disposed below the turret assembly 200. In these embodiments, the turret 202 transfers the component 102 from the source substrate 302 disposed above the turret 202 to the component transfer medium 402 disposed below the turret 202. The end effector 206 vertically picks up the component 102 from the source substrate 302 in a bottom-up direction and vertically places the component 102 on the component transfer medium 402 in a top-down direction. As will be readily appreciated by those skilled in the art, the various parts of the system 100 may be rearranged according to the vertical arrangement.

[0078] In the foregoing detailed description, embodiments of the present disclosure related to element processors are described with reference to the accompanying drawings provided. The description of various embodiments herein is not intended to call for or be limited to specific or particular representations of the present disclosure, but is merely used to illustrate non-limiting examples of the present disclosure. The present disclosure is used to solve at least one of the problems mentioned and problems related to the prior art. Although only some embodiments of the present disclosure are disclosed herein, it will be apparent to those of ordinary skill in the art that various changes and / or modifications may be made to the disclosed embodiments without departing from the scope of the present disclosure in light of the present disclosure. Therefore, the scope of the present disclosure and the scope of the appended claims are not limited to the embodiments described herein.

Claims

1. A system for processing a component, the system comprising: Turret assembly, including: a turret rotatable about a horizontal axis; and a plurality of end effectors attached to the turret and arranged around a periphery of the turret, the end effectors being radially aligned from a horizontal axis; a support assembly arranged to move a source substrate to a retrieval position, the support assembly being arranged below the turret assembly so that one of a plurality of end effectors is positioned in a vertical downward direction above an element in an XY-θ coordinate position of the source substrate for retrieving an element from the source substrate; a component transport assembly arranged to move a component transport medium with reference to a digital map position of a component on a source substrate to a component release position corresponding to an XY-θ coordinate position of a source substrate for receiving a component from an end effector of the turret assembly, the component transport assembly being arranged above the turret assembly so that one of a plurality of end effectors of the turret assembly is positioned in a vertically upward direction for releasing a component directly from the end effector of the turret assembly; and an image capture device radially aligned from the horizontal axis and configured to capture an image of an element held by the end effector during rotation of the turret, Therein, any deviations in the XY-θ coordinate position of the component captured by the image capture device are corrected or compensated by the component transfer assembly before the component is placed on the component transfer medium.

2. The system of claim 1, wherein the XY-θ coordinates of each element included in the digital map location are referenced to a predetermined datum of the source substrate. 3 . The system of claim 1 , further comprising a computer system configured to calculate a misalignment of the maintained components based on the captured images.

4. The system according to claim 3, wherein: The misalignment is calculated relative to a digital map of the source substrate, the digital map being used to identify the location of the component relative to the source substrate and the location of defective components.

5. The system according to claim 1, further comprising: a component transfer actuation mechanism for actuating the component transfer assembly to correct for misalignment; and A support actuation mechanism is used to actuate a support assembly to align elements of the source substrate with the end effector, wherein the support assembly includes a highly flat or hyper-flat wafer stage for supporting the source substrate.

6. The system of claim 5, further comprising a first end effector and a second end effector such that during one instant of rotation of the turret, The first end effector is positioned to vertically position the first component on the component transport medium; and The second end effector is in a position to vertically pick up a second component from the source substrate, Each end effector includes a suction nozzle.

7. The system of claim 6, further comprising a third end effector, such that during one moment of rotation of the turret, the third end effector holds a third element and is in a position for capturing an image of the third element.

8. A method for processing a component, the method comprising: moving a source substrate supported on a support assembly disposed below a turret assembly to a retrieval position such that one of a plurality of end effectors is disposed in a vertical downward direction over the element in the XY-θ coordinate position of the source substrate for retrieving the element from the source substrate; moving a component transport medium on a component transport assembly to a component release position corresponding to an XY-θ coordinate position of a source substrate, the component transport assembly being disposed above a turret assembly corresponding to a digital map position of the component on the source substrate, the component transport medium being adapted to directly receive components from a plurality of end effectors of the turret assembly such that one of the plurality of end effectors of the turret assembly is positioned in a vertically upward direction for releasing the component from the end effector to the component transport medium; rotating a turret of the turret assembly about a horizontal axis, the end effector being attached to and disposed about the turret and radially aligned from the horizontal axis; capturing an image of an element held by the end effector during rotation of the turret via an image capture device aligned radially from a horizontal axis; During the rotation of the turret, actuating the end effector to continuously pick up components from a source substrate and place the picked up components on a component transport medium; and Any deviations in the XY-θ coordinate position of the component captured by the image capture device prior to placement of the component on the component transport medium are corrected or compensated by the component transport assembly.

9. The method of claim 8, wherein the XY-θ coordinates of each element included in the digital map location are referenced to a predetermined datum of the source substrate.

10. The method of claim 8, further comprising calculating a misalignment of the held component based on the captured image.

11. The method of claim 10, wherein the misalignment is calculated relative to a digital map of the source substrate, the digital map being used to identify the position of the component relative to the source substrate and the position of defective components.

12. The method of claim 11, wherein correcting or compensating for any deviation in the component XY-θ coordinate position comprises actuating the component transport assembly to correct the misalignment.

13. The method of claim 8, wherein moving the component transport medium on the component transport assembly to a component release position corresponding to the XY-θ coordinate position of the source substrate comprises actuating a support assembly to align the component of the source substrate to the end effector.

14. The method of claim 13, further comprising rotating the first end effector and the second end effector together with the turret such that during one instant of the rotation: The first end effector is positioned to vertically position the first component on the component transfer medium; and The second end effector is in a position to vertically pick up a second component from the source substrate, Each end effector includes a suction nozzle.

15. The method of claim 14, further comprising rotating a third end effector with the turret such that during one moment of the rotation, the third end effector holds a third element and is in position to capture one or more images of the third element.

16. The method according to claim 8, wherein: The source substrate is a semiconductor wafer, the component is a semiconductor bare die, and / or the component transfer medium is a die attach film.

Images