Display device manufacturing method, insert substrate, and computer program stored in readable medium

Abstract

A method for manufacturing a display device includes: performing a first repair process of detecting a first defective light emitting diode (LED) from a plurality of LEDs disposed on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to an electrode pattern inserted into a substrate and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process of detecting a second defective LED from the plurality of LEDs attached to the electrode pattern and replacing the second defective LED.

Description

Technical Field

[0001] The present disclosure relates to a manufacturing method of a display device, and more particularly, to a manufacturing method for providing an image using a light emitting diode, an insert substrate for use in a manufacturing process of a display device, and a computer program stored in a readable medium to execute the manufacturing method of a display device. Background Art

[0002] Display devices can be classified as either an emissive display in which each pixel emits light by itself or a non-emissive display that requires a separate light source.

[0003] Liquid crystal displays (LCDs), which are still widely used, are typical non-emissive displays. Since non-emissive displays require a backlight unit that provides light from the back of a display panel, a liquid crystal layer that acts as a switch to pass / block light, and a color filter that changes the provided light to a desired color, their structure is complex and limited in achieving a thinner thickness.

[0004] On the other hand, emissive displays, where each pixel emits light through a light-emitting element specific to that pixel, do not require components such as a backlight unit, a liquid crystal layer, or a color filter. This simplifies the structure, allows for high design freedom, and allows for a thinner display. Furthermore, emissive displays can offer improved contrast ratios, brightness, and viewing angles.

[0005] Micro-light-emitting diode (μLED) display panels are flat-panel displays composed of multiple inorganic LEDs, each 100 microns or smaller. Compared to liquid crystal display (LCD) panels, which require a backlight, micro-LED display panels offer better contrast, response time, and energy efficiency. Both organic LEDs and micro-LEDs, which are inorganic light-emitting elements, have good energy efficiency, but micro-LEDs outperform OLEDs in brightness and luminous efficiency, and have a longer lifespan. Summary of the Invention

[0006] Technical issues

[0007] Provided is a method for manufacturing a display device capable of more accurately detecting defective light emitting diodes during a process of manufacturing the display device and minimizing a defect rate of the display device.

[0008] Solution to the problem

[0009] According to one aspect of the present disclosure, a method for manufacturing a display device is provided, including: performing a first repair process, the first repair process detecting a first defective LED from a plurality of light emitting diodes (LEDs) arranged on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to an electrode pattern inserted into a substrate, and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process, the second repair process detecting a second defective LED from the plurality of LEDs attached to the electrode pattern and replacing the second defective LED.

[0010] The method may also include: attaching a plurality of LEDs attached to the electrode pattern of the insertion substrate to a carrier substrate, and separating the insertion substrate from the plurality of LEDs; transferring the plurality of LEDs attached to the carrier substrate to a backplane; and performing a third repair process, the third repair process detecting a third defective LED among the plurality of LEDs transferred to the backplane and repairing a sub-pixel corresponding to the third defective LED.

[0011] The first repair process may include detecting a first defective LED by performing a photoluminescence (PL) inspection.

[0012] The adhesive material may be provided over the electrode pattern of the interposer substrate, or the electrode pattern may be provided on the adhesive material applied to the interposer substrate.

[0013] Attaching the plurality of LEDs to the electrode pattern of the interposer substrate may include connecting an anode of each of the plurality of LEDs to a first electrode of the electrode pattern; and connecting a cathode of each of the plurality of LEDs to a second electrode of the electrode pattern.

[0014] The second repair process may include attaching the first repair LED to the electrode pattern of the interposer substrate based on the first defective LED being removed in the first repair process, and then performing an electroluminescence (EL) inspection.

[0015] The second repair process may further include replacing the second defective LED with a second repair LED based on the detection of the second defective LED by performing the EL inspection.

[0016] The back plate may include a main area where the plurality of LEDs are disposed, and a repair area where a third repair LED can be mounted.

[0017] The backplate may include a plurality of anode pads configured to connect to anodes of the plurality of LEDs; a repair anode pad; and at least one cathode pad configured to connect to cathodes of the plurality of LEDs and to a cathode of a third repair LED.

[0018] The third repair process may include: performing an electroluminescence (EL) inspection; and installing a third repair LED corresponding to the third defective LED in the repair area.

[0019] The third repair process may further include cutting the third defective LED.

[0020] According to one aspect of the present disclosure, an insertion substrate is provided, comprising: a substrate; an electrode pattern disposed on the substrate and configured to: connect to a plurality of light emitting diodes (LEDs) disposed on the sapphire substrate and provide power to the plurality of LEDs; and an adhesive material configured to provide an adhesive force for attaching the plurality of LEDs to the electrode pattern.

[0021] An adhesive material may be disposed over the electrode pattern.

[0022] An adhesive material may be disposed between the substrate and the electrode pattern.

[0023] The electrode pattern may include a first electrode configured to be connected to an anode of each of the plurality of LEDs; and a second electrode configured to be connected to a cathode of each of the plurality of LEDs.

[0024] According to one aspect of the present disclosure, a non-transitory computer-readable recording medium storing a computer program is provided, which is executed by a computing device to perform a method for manufacturing a display device, the method including: performing a first repair process, the first repair process detecting a first defective LED from a plurality of light-emitting diodes (LEDs) arranged on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to an electrode pattern inserted into a substrate, and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process, the second repair process detecting a second defective LED from the plurality of LEDs attached to the electrode pattern and replacing the second defective LED.

[0025] The method may also include: attaching a plurality of LEDs attached to the electrode pattern of the insertion substrate to a carrier substrate, and separating the insertion substrate from the plurality of LEDs; transferring the plurality of LEDs attached to the carrier substrate to a backplane; and performing a third repair process, the third repair process detecting a third defective LED among the plurality of LEDs transferred to the backplane and repairing a sub-pixel corresponding to the third defective LED.

[0026] Performing the first repair process may include detecting a first defective LED by performing a photoluminescence (PL) inspection.

[0027] Performing the second repair process may include: based on the first defective LED being removed in the first repair process, attaching the first repair LED to the electrode pattern of the insertion substrate, and then performing an electroluminescence (EL) inspection; and based on the second defective LED being detected by performing the EL inspection, replacing the second defective LED with the second repair LED.

[0028] Performing the third repair process may include: performing an electroluminescence inspection; and mounting a third repair LED corresponding to the third defective LED in the repair region of the back panel.

[0029] Advantageous Effects of the Invention

[0030] According to an embodiment of a method for manufacturing a display device, an insert substrate, and a computer program stored in a recording medium to execute the method for manufacturing a display device, defective light-emitting diodes can be detected more accurately during the manufacturing process of the display device, and the defect rate of the display device can be minimized.

[0031] In addition, according to an embodiment of a method for manufacturing a display device, an insert substrate, and a computer program stored in a recording medium to execute the method for manufacturing a display device, the number of final repairs used to repair the light-emitting diodes transferred to the backplane can be minimized, and the risk of damage caused by the final repairs can be reduced.

[0032] Furthermore, according to embodiments of the display device manufacturing method, the insert substrate, and the computer program stored in a recording medium for executing the display device manufacturing method, the number and size of electrode pads provided on the backplane for final repair can be reduced. Consequently, the pixel size of the display device can be reduced, and high resolution can be provided.

[0033] The display module according to an embodiment of the present disclosure can be applied as a single unit to wearable devices, portable devices, handheld devices, electronic products and / or electrical devices using a display, and can be applied to display devices such as personal computer (PC) monitors, high-resolution TVs, signs and electronic displays through a matrix-type arrangement of multiple components. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a perspective view showing an example of a display device according to an embodiment.

[0035] Figure 2 is an exemplary diagram illustrating pixels constituting a unit module of a display device according to an embodiment.

[0036] Figure 3 FIG. 1 is a schematic diagram of a thin film transistor driving circuit for individually driving pixels of a display device according to an embodiment.

[0037] Figure 4 is a cross-sectional view of a sub-pixel of a display device according to an embodiment.

[0038] Figure 5 is a cross-sectional view showing an anisotropic conductive film connected to a back plate according to an embodiment.

[0039] Figure 6is a flowchart of a method for manufacturing a display device according to an embodiment.

[0040] Figure 7 is a flowchart of a method for manufacturing a display device according to an embodiment.

[0041] Figure 8 2 is a diagram illustrating a first repair process in the method for manufacturing a display device according to an embodiment.

[0042] Figure 9 2 is a diagram illustrating a second repair process in the method for manufacturing the display device according to the embodiment.

[0043] Figure 10 is a diagram illustrating a process of attaching a light emitting diode to a carrier substrate after a second repair process according to an embodiment.

[0044] Figure 11 is a diagram illustrating an example of a method of transferring a plurality of light emitting diodes to a backplane according to an embodiment.

[0045] Figure 12 is a plan view of an interposer substrate according to an embodiment.

[0046] Figure 13A is a cross-sectional view of an interposer substrate according to an embodiment.

[0047] Figure 13B is a cross-sectional view of an interposer substrate according to another embodiment.

[0048] Figure 14 is a diagram illustrating a light emitting diode attached to an electrode pad of an interposer substrate according to an embodiment.

[0049] Figure 15 is a plan view of a unit pixel according to an embodiment.

[0050] Figure 16 is a cross-sectional view of a unit pixel according to an embodiment.

[0051] Figure 17 is a cross-sectional view of a unit pixel provided with a repair light emitting diode according to an embodiment.

[0052] Figure 18 is a cross-sectional view of a sub-pixel provided with a repaired light emitting diode according to an embodiment.

[0053] Figure 19 is a circuit diagram of a sub-pixel provided with a repair light emitting diode according to an embodiment.

[0054] Figure 20 is a plan view of a unit pixel according to another embodiment. DETAILED DESCRIPTION

[0055] The embodiments and features described and shown in the present disclosure are merely examples, and various modifications of alternative embodiments and drawings may exist at the time this application is filed.

[0056] In this specification, similar reference numerals represent similar elements. All elements of the embodiments of the present disclosure will not be described, and descriptions that are well known in the art or that overlap with each other in the exemplary embodiments will be omitted. The terms used in the specification (such as "~ components", "~ modules", "~ members", "~ blocks", etc.) can be implemented with software and / or hardware, and multiple "~ components", "~ modules", "~ members" or "~ blocks" can be implemented with a single element, or a single "~ component", "~ module", "~ member" or "~ block" can include multiple elements.

[0057] It will also be understood that the term "connected" and its derivatives refer to both direct and indirect connections, and that an indirect connection includes a connection through a wireless communication network.

[0058] Unless otherwise indicated, the terms "comprise (or include)" and "include (or include)" are inclusive or open-ended and do not exclude additional, unrecited elements or method steps. The term "component" and its derivatives refer to both when a component is in contact with another component and when another component is present between two components.

[0059] In addition, when a layer is described as being “on” another layer or substrate, the layer may be directly on the other layer or substrate, or a third layer may be disposed therebetween.

[0060] Although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section.

[0061] The singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.

[0062] The reference numerals used for method steps are for ease of explanation only and do not limit the order of the steps. Therefore, unless the context clearly indicates otherwise, the written instructions may be practiced in other ways. For clarity, illustration, and convenience, the relative sizes and depictions of these elements are not necessarily to scale and may be exaggerated.

[0063] Hereinafter, embodiments of a display device and a method of manufacturing the display device according to embodiments will be described in detail with reference to the accompanying drawings.

[0064] Figure 1 is a perspective view showing a display device according to an embodiment, and Figure 2 is a plan view of a unit module of a display device according to an embodiment.

[0065] The display device 1 may correspond to a light-emitting type display device in which a light-emitting diode is provided for each pixel P so that each pixel P emits self-light.

[0066] Unlike a liquid crystal display device, since the display device 1 does not require components such as a backlight unit, a liquid crystal layer, and a polarizing plate, the display device 1 can have a thin thickness and a simple structure, enabling various designs.

[0067] The light-emitting diodes provided in the pixels P of the display device 1 can be implemented as inorganic materials. Inorganic light-emitting diodes have a faster response speed than organic light-emitting diodes (OLEDs) and can achieve high brightness with low power consumption. In addition, OLEDs are susceptible to moisture exposure and oxygen and require a sealing process due to their poor durability, while inorganic light-emitting diodes do not require a sealing process and have strong durability.

[0068] The light emitting diodes used in the display device 1 may be micro LEDs having a short side length within 250 μm. In this way, by using micro unit LEDs, the pixel size can be reduced and high resolution can be achieved.

[0069] The display device 1 having ultra-small pixels and a thin thickness due to micro LEDs can be applied to various fields. Figure 1 As shown, a plurality of display modules 10 can be tiled and installed in a cabinet 21, thereby providing a large screen. The display module 10 can be manufactured by transferring a plurality of micro LEDs to a substrate.

[0070] Figure 1 The 3D coordinate system of XYZ axes shown in FIG is based on the display device 1. The plane where the screen of the display device 1 is located is the XZ plane, and the direction in which an image is output or light is emitted by a light emitting diode is the positive Y direction.

[0071] Reference Figure 2 , the display module 10 may have an M×N (M, N is an integer of 2 or greater) array of pixels, and the unit pixel P may be three sub-pixels SP(R), SP(G) and SP(B) corresponding to R, G, and B, respectively.

[0072] However, Figure 1 and Figure 2 The structure is merely an example embodiment of the display device 1, and the display device 1 does not necessarily have to be manufactured by tiling a plurality of unit modules 10. The display device 1 may include an M×N pixel array without a tiling process.

[0073] Furthermore, the unit pixel P does not necessarily include a red sub-pixel SP(R) emitting red light, a green sub-pixel SP(G) emitting green light, and a blue sub-pixel SP(B) emitting blue light, but may include sub-pixels emitting yellow or white light.

[0074] In embodiments described later, an example embodiment will be described in which a unit pixel P is composed of a red subpixel SP(R) emitting red light, a green subpixel SP(G) emitting green light, and a blue subpixel SP(B) emitting blue light.

[0075] Figure 3 is a schematic diagram of a thin film transistor (TFT) driving circuit for individually driving pixels of a display device according to an embodiment, and Figure 4 is a cross-sectional view of a sub-pixel of a display device according to an embodiment.

[0076] Reference Figure 3 The TFT may include a plurality of data lines DL, a plurality of power lines VL, and a plurality of gate lines GL. The gate lines GL may be arranged in a row direction, and the data lines DL may be arranged in a column direction to form an electrode pattern. The area divided by the data lines DL and the gate lines GL may correspond to the sub-pixel SP.

[0077] The data line DL may transmit a data signal corresponding to an image to the sub-pixel SP, and the gate line GL may transmit a scan signal for turning on / off the sub-pixel SP to the sub-pixel SP. The power line VL may supply a power voltage V to the sub-pixel SP for a period corresponding to one frame. DD .

[0078] When the scan driver 130 applies a scan signal to the gate line GL, the sub-pixel SP connected to the gate line GL to which the scan signal is applied may be turned on. When the data driver 140 applies a data voltage V corresponding to the image signal DATA When applied to the data line DL, the data voltage V DATA The power may be input to the turned-on sub-pixel SP among the sub-pixels connected to the data line DL.

[0079] The scan driver 130 and the data driver 140 may be electrically connected to the back plate 100. For example, the scan driver 130 and the data driver 140 may be mounted on a tape carrier package (TCP) in the form of a chip, or may be mounted on a flexible printed circuit (FPC) or film in the form of a chip. In addition, the scan driver 130 and the data driver 140 may be mounted directly below the back plate 100. The back plate 100 may be referred to as a TFT substrate.

[0080] The light emitting diode 300 may be provided for each sub-pixel SP, and a TFT driving circuit for driving the light emitting diode 300 may include a switching transistor 200 ′, a driving transistor 200 , and a capacitor 201 .

[0081] The switching transistor 200 ′ and the driving transistor 200 may be implemented as PMOS transistors. However, the present disclosure is not limited thereto, and the switching transistor 200 ′ and the driving transistor 200 may be implemented as NMOS transistors.

[0082] A gate electrode of the switching transistor 200' may be connected to the gate line GL, a source electrode of the switching transistor 200' may be connected to the data line DL, and a drain electrode of the switching transistor 200' may be connected to one end of the capacitor 201 and the gate electrode of the driving transistor 200. The other end of the capacitor 201 may be connected to the power line VL.

[0083] Reference Figure 4 , the source electrode 240 of the driving transistor 200 may be connected to the power line (VL), and the drain electrode 230 of the driving transistor 200 may be connected to the anode 310 of the light emitting diode 300. The cathode 320 of the light emitting diode 300 may be connected to the reference voltage V SS . Reference voltage V SS is lower than the power voltage V DD voltage, and grounding can be provided by using a ground voltage or the like.

[0084] The sub-pixel SP may operate as follows. First, when a scan signal is applied to the gate line GL and the switching transistor 200' is turned on, the data voltage V applied to the data line DL DATA The voltage may be transmitted to one end of the capacitor 201 and the gate electrode 220 of the driving transistor 200 .

[0085] and the gate-source voltage V GS The corresponding voltage can be maintained by the capacitor 201 for a predetermined time. The driving transistor 200 can be driven by the gate-source voltage V GS The corresponding driving current I GS is applied to the anode 310 of the light emitting diode 300 to cause the light emitting diode 300 to emit light.

[0086] At this time, when the high data voltage V DATA When the gate-source voltage V GS Reduced, and a small amount of drive current I GS is applied to the anode 310 of the light emitting diode 300, so that the light emitting diode 300 displays a low grayscale. On the other hand, when the low data voltage VDATA When the gate-source voltage V GS increases, and a large amount of drive current I GS is applied to the anode 310 of the light emitting diode 300, so that the light emitting diode 300 displays a high gray scale.

[0087] refer to Figure 4 , shows a cross section of the backplane 100 to which the light emitting diodes 300 are transferred. The backplane 100 may also be referred to as a TFT substrate.

[0088] The buffer layer 103 may be formed on the substrate 101, and the driving transistor 200 may be disposed on the buffer layer 103. An upper portion of the substrate 101 may be directed in the positive Y direction.

[0089] The substrate 101 may be made of various materials. For example, the substrate 101 may be formed of transparent glass containing SiO 2 as a main component, may be formed of transparent plastic to have flexibility, or may be formed of metal.

[0090] The plastic of the substrate 101 may be an organic material selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyacrylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC), and cellulose acetate propionate (CAP), which are insulating organic materials.

[0091] The metal of the substrate 101 may be selected from the group consisting of iron, chromium, manganese, nickel, titanium, molybdenum, stainless steel (SUS), Invar alloy, Inconel alloy, and Kovar alloy.

[0092] The buffer layer 103 may provide a flat surface on the upper portion of the substrate 101 and may prevent contaminants or moisture from penetrating the substrate 101. The buffer layer 103 may include an inorganic material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, or titanium nitride, or an organic material such as polyimide, polyester, or acrylic, and may be formed of a plurality of stacked layers of the exemplary materials.

[0093] The driving transistor 200 disposed on the buffer layer 103 may include an active layer 210, a gate electrode 220, a drain electrode 230, and a source electrode 240. The active layer 210 may be made of a semiconductor material and may include a source region 210a, a drain region 210b, and a channel region 210c between the source region 210a and the drain region 210b.

[0094] The gate electrode 220 may be disposed on a portion of the active layer 210 corresponding to the channel region 210 c. The source electrode 240 and the drain electrode 230 may be electrically connected to the source region 210 a and the drain region 210 b of the active layer 210 , respectively. Although an embodiment in which the gate electrode 220 of the driving transistor 200 is implemented as a top gate type disposed on the active layer 210 is shown, the gate electrode 220 may also be disposed below the active layer 210 .

[0095] A first insulating layer 111 made of an inorganic insulating material may be provided between the active layer 210 and the gate electrode 220, and a second insulating layer 112 may be provided on the gate electrode 220. The first insulating layer 111 may be a gate insulating layer, and the second insulating layer 112 may be an interlayer insulating layer. On the other hand, one component being provided on another component may include a structure in which the entirety of one component is located on top of the other component, or may include a structure in which one component surrounds or covers the entirety or portion of the other component. Furthermore, one component covering another component may include not only a structure in which one component covers the entirety of the other component, but may also include a situation in which a hole is formed in one component so that a portion of the other component is exposed through the hole.

[0096] That is, the gate insulating layer 111 may be formed on the buffer layer 103 provided with the active layer 210 to cover the active layer 210 , and the interlayer insulating layer 112 may be formed on the gate insulating layer 112 provided with the gate electrode 220 to cover the gate electrode 220 .

[0097] The source electrode 240 and the drain electrode 230 may be provided on the interlayer insulating layer 112. Holes through which the source electrode 240 and the drain electrode 230 pass may be formed in the interlayer insulating layer 112 and the gate insulating layer 111. The source electrode 240 and the drain electrode 230 may be electrically connected to the source region 210a and the drain region 210b of the active layer 210, respectively, through the holes.

[0098] "Electrically connecting" may include direct soldering of conductive materials, connection via separate wiring, and / or layers through which current flows (e.g., anisotropic conductive film (ACF)). Any method may be used as long as current flows between the two connected components. Furthermore, "connecting" certain components may include electrically connecting them.

[0099] The third insulating layer 113 may be provided on the interlayer insulating layer 112 . The third insulating layer 113 may be a planarization layer. The planarization layer 113 may be provided on the interlayer insulating layer 112 to cover the source electrode 240 , the drain electrode 230 , and the interlayer insulating layer 112 .

[0100] An anode pad 410 connected to the anode 310 of the light-emitting diode 300 and a cathode pad 420 connected to the cathode 320 of the light-emitting diode 300 may be provided on the planarization layer 113. The anode pad 410 and the cathode pad 420 are made of a conductive material such as a metal and are exposed from the upper insulating layer 114 to be electrically connected to other electrodes. In order to distinguish the electrodes of the light-emitting diode 300 from the electrodes of the back plate 100, the term "pad" is used only for the electrode pads of the back plate 100, and the terms anode and cathode are used for the electrodes of the light-emitting diode 300.

[0101] A hole for connecting the drain electrode 230 and the anode pad 410 may be formed in the third insulating layer 113. The anode pad 410 may be electrically connected to the drain electrode 230 through the hole. The source electrode 240 may be connected to a supply voltage V DD The power line VL, and the gate electrode 220 can be connected to the power line VL, which provides the data voltage V DATA The cathode pad 420 may be connected to a reference voltage Vss and may provide a ground to the light emitting diode 300 connected to the cathode pad 420.

[0102] Fourth insulating layer 114 may be disposed on third insulating layer 113 provided with anode pad 410 and cathode pad 420. Fourth insulating layer 114 may be referred to as upper insulating layer 114. Upper insulating layer 114 may cover third insulating layer 113, anode pad 410, and cathode pad 420.

[0103] The insulating layer may be formed of an organic insulating material or an inorganic insulating material. In addition, the insulating layer may be formed by alternating organic insulating materials and inorganic insulating materials.

[0104] Reference Figure 4 , connection holes 114H may be formed in upper insulating layer 114 covering anode pad 410 and upper insulating layer 114 covering cathode pad 420, respectively. Anode pad 410 and cathode pad 420 may be exposed through connection holes 114H formed in upper insulating layer 114, and anode 310 and cathode 320 of light emitting diode 300 may be electrically connected to anode pad 410 and cathode pad 420, respectively, through connection holes 114H.

[0105] The structure from the substrate 101 to the upper insulating layer 114 may be defined as the back panel 100 . The display module 10 and / or the display device 1 may be manufactured by transferring the light emitting diodes 300 onto the back panel 100 .

[0106] Reference Figure 4, the light emitting diode 300 may include a pn diode, an anode 310 and a cathode 320. The anode 310 and the cathode 320 may be formed of various conductive materials such as metals, conductive oxides, and conductive polymers. The anode 310 may be electrically connected to the anode pad 410 of the back plate 100, and the cathode 320 may be electrically connected to the cathode pad 420 of the back plate 100.

[0107] The pn diode may include a p-doped portion 330 on the anode 310 side, an n-doped portion 370 on the cathode 320 side, and a quantum well between the p-doped portion 330 and the n-doped portion 370. Conversely, a light emitting diode in which the doping portion on the cathode 320 side is a p-doped portion and the doping portion on the anode 310 side is an n-doped portion may be used.

[0108] The display device 1 according to the embodiment may be a top-emission type display device in which light is emitted in a direction opposite to the substrate 101. Therefore, when a driving current is applied to the anode 310 of the light-emitting diode 300 through the anode pad 410 and the current flows from the anode 310 to the cathode 320, light is emitted in the opposite direction (i.e., the positive Y direction) of the substrate 101. The light-emitting diode 300 configured as described above may be defined as a flip-chip LED.

[0109] The electrical connection between the electrodes can be performed by various bonding methods. For example, a bonding method using an ACF can be applied. The bonding method used to form a flip-chip LED can be defined as a flip-chip bonding method.

[0110] Figure 5 The AFC is shown connected to the backplane.

[0111] Reference Figure 5 The ACF 120 may be disposed on the upper insulating layer 114 having the connection holes 114H formed therein. The ACF 120 may uniformly disperse conductive particles in an insulating adhesive organic material and may be provided in the form of a film. The ACF 120 may have conductivity in the thickness direction and insulation in the planar direction.

[0112] When heat is applied to ACF 120 and light emitting diode 300 is pressed against ACF 120, current may flow in the thickness direction of the film to which pressure is applied. Therefore, anode 310 of light emitting diode 300 may be electrically connected to anode pad 410, and cathode 320 of light emitting diode 300 may be electrically connected to cathode pad 420.

[0113] As described above, the light emitting diodes 300 may be implemented as micro LEDs. A plurality of light emitting diodes 300 may be picked up on a wafer and transferred to the back plate 100 by a transfer mechanism. The plurality of LEDs 300 may be transferred to the back plate 100 by compressing the plurality of LEDs 300 to the ACF 120.

[0114] However, the method of transferring the light emitting diode 300 to the back plate 100 is not limited to the above method. In order to connect the light emitting diode 300 to the anode pad 410 and the cathode pad 420, a soldering method using metal ink such as silver (Ag), gold (Au), or copper (Cu) may be used. In addition, a laser ablation method of transferring the light emitting diode 300 to a target position of the back plate 100 by irradiating a laser may be used.

[0115] Hereinafter, the entire process until the light emitting diode 300 is transferred to the back panel 100 , that is, a method of manufacturing the display device 1 will be described.

[0116] Figure 6 and Figure 7 is a flowchart of a method for manufacturing a display device according to an embodiment, Figure 8 and Figure 9 1 is a diagram illustrating a first repair process and a second repair process in a method for manufacturing a display device according to an embodiment, Figure 10 is a diagram showing a process of attaching a light emitting diode to a carrier substrate after a second repair process, and Figure 11 is a diagram illustrating an example of a method of transferring a plurality of light emitting diodes to a backplane.

[0117] The method for manufacturing the display device 1 can be implemented by a manufacturing device.

[0118] Reference Figure 6 and Figure 8 , a sapphire substrate 510 including a plurality of light-emitting diodes 300 is prepared (operation 601). The light-emitting diodes 300 can be formed on one surface of the sapphire substrate 510 of the wafer. The wafer formed with the light-emitting diodes 300 is prepared through a separate process. Since the process of forming the light-emitting diodes 300 on the sapphire substrate 510 is well known, a detailed description will be omitted.

[0119] Subsequently, a first repair process (operation 602) may be performed to detect and remove a first defective LED 301 among the plurality of LEDs disposed on the sapphire substrate 510. Defective LEDs may exist among the plurality of LEDs 300 disposed on the wafer. Therefore, an inspection process is required to detect defective LEDs on the sapphire substrate 510. The first defective LED 301 detected in the first repair process may be removed by being picked up by a stamp or the like.

[0120] The first repair process may include performing photoluminescence (PL) inspection to detect a first defective LED 301. PL inspection may be a testing method that irradiates light having a specific energy to a plurality of light-emitting diodes, captures emission of energy absorbed by the light-emitting diodes as light, and detects defective LEDs by image processing and analyzing the captured light.

[0121] Next, an insert substrate 520 including electrode patterns 521 and 522 and an adhesive material 523 may be provided (operation 603). The electrode patterns 521 and 522 of the insert substrate 520 may be electrodes for supplying power to the plurality of light-emitting diodes 300. The electrode patterns 521 and 522 may transmit externally supplied power to the plurality of light-emitting diodes 300 so that the plurality of light-emitting diodes 300 emit light. The adhesive material 523 may be used to attach the plurality of light-emitting diodes 300 to the electrode patterns 521 and 522.

[0122] When the interposer substrate 520 is provided, the plurality of light-emitting diodes 300 may be attached to the electrode patterns 521 and 522 of the interposer substrate 520, and the sapphire substrate 510 may be separated (operation 604). When the plurality of light-emitting diodes 300 are attached to the electrode patterns 521 and 522 of the interposer substrate 520, the anode 310 of each of the plurality of light-emitting diodes 300 may be connected to the first electrode 521 of the electrode patterns 521 and 522, and the cathode 320 of each of the plurality of light-emitting diodes 300 may be connected to the second electrode 522 of the electrode patterns 521 and 522.

[0123] The sapphire substrate 510 may be removed through a laser lift-off (LLO) process. Separation of the sapphire substrate 510 through the LLO process is well known, and a detailed description thereof will be omitted.

[0124] After the first defective LED 301 is removed in the first repair process, the first repair LED 302 can be attached to the electrode pattern 521 and the electrode pattern 522 of the interposer substrate 520. The first repair LED 302 can be attached to a position of the interposer substrate 520 corresponding to the position of the first defective LED 301 in the sapphire substrate 510. That is, the empty space on the interposer substrate 520 created by removing the first defective LED 301 can be filled with the first repair LED 302.

[0125] Next, refer to Figure 6 and Figure 9 , a second repair process (605) may be performed, which detects a second defective LED 303 among the plurality of light emitting diodes 300 on the interposer substrate 520 and repairs the second defective LED 303. The second defective LED 303 may refer to a defective LED that was not discovered in the first repair process.

[0126] In the second repair process, an electroluminescence (EL) inspection may be performed on the interposer substrate 520. The second repair process may include replacing the second defective LED 303 with the second repair LED 304 when the second defective LED 303 is detected by performing the EL inspection. The second defective LED 303 detected in the second repair process may be simply removed by picking it up with a poke, etc. The second repair LED 304 may be attached to the position where the second defective LED 303 was removed.

[0127] EL inspection can be a testing method for detecting defective LEDs by supplying power to a plurality of LEDs 300 and capturing and / or measuring light emitted from the plurality of LEDs 300. EL inspection can detect defects more accurately than PL inspection. That is, defects not detected by PL inspection can be detected by EL inspection.

[0128] As described above, by performing the process of repairing defective LEDs before transferring the plurality of LEDs 300 to the back panel 100, the defect rate of the display device 1 can be reduced. In particular, since the second repair process can cause the plurality of LEDs to emit light without requiring a complex wiring structure, LED defects can be repaired more easily than by repairing defects by illuminating the LEDs at the back panel 100. Furthermore, since the second repair process performs EL inspection, defective LEDs can be detected more accurately.

[0129] Next, refer to Figure 7 and Figure 10, the plurality of LEDs 300 on the insert substrate 520 can be attached to the carrier substrate 530, and the insert substrate 520 can be separated (operation 701). In order to transfer the light-emitting diodes 300 to the backplane 100, the insert substrate 520 must be removed. In other words, the anode 310 and cathode 320 of the light-emitting diode 300 must be separated from the insert substrate 520. Therefore, a process of attaching the plurality of LEDs 300 on the insert substrate 520 to the carrier substrate 530 can be performed. To this end, an adhesive layer 531 can be provided on the carrier substrate 530. The adhesive layer 531 can be used to attach the plurality of LEDs 300 to the carrier substrate 530. In this case, the light-emitting surface of the light-emitting diode 300 can be attached to the carrier substrate 530. The LLO process can also be used to separate the insert substrate 520. When the insert substrate 520 is separated, the electrode patterns 521 and 522 and the adhesive material 523 can also be removed.

[0130] The adhesive layer 531 may include various materials. For example, the adhesive layer 531 may be selectively provided from acrylic acid, polymethyl methacrylate (PMMA), methyl methacrylate (MMA), methacrylic acid (MAA), butyl methacrylate acrylate (BMA), polycarbonate (PC), polyurethane (PU), epoxy resin, polyvinyl chloride (PVC), a photocurable resin composition, a thermosetting resin composition, a naturally curing resin composition, a transparent resin composition, and a conductive paste. The type of the adhesive layer 531 is not limited to the above-mentioned types.

[0131] When the plurality of LEDs 300 are attached to the carrier substrate 530 via the adhesive layer 531, the adhesive layer 531 that does not contact the light emitting surfaces of the plurality of LEDs 300 may be removed. Removal of the adhesive layer 531 may be performed by various methods. For example, the adhesive layer 531 may be partially removed by etching or laser irradiation.

[0132] Then, refer to Figure 11 , the plurality of LEDs 300 on the carrier substrate 530 can be transferred to the backplane 100 (operation 702). As described above, there are many methods for transferring the light emitting diodes 300, but Figure 11 The embodiment shown in FIG can use a laser ablation method in which one or more light emitting diodes 300 are transferred to a target position of the back plate 100 by irradiating with laser. In addition, the plurality of LEDs 300 can be electrically connected to the back plate 100 through the ACF 120 provided on the back plate 100.

[0133] Subsequently, a third repair process (operation 703) may be performed, in which a third defective LED is detected among the plurality of LEDs 300 transferred to the back panel 100 and the third defective LED is repaired. The third defective LED may refer to a defective LED that was not found in the second repair process. The third repair process may include performing an EL inspection and installing a third repaired light emitting diode corresponding to the third defective LED in the repair area of ​​the back panel 100. The third repair process will be described below. Figures 15 to 20 Described in detail in.

[0134] The above-mentioned repair process can be performed by various manufacturing devices and / or manufacturing systems that perform the method for manufacturing the display device. Various manufacturing devices and / or manufacturing systems can include an inspection device for detecting defective LEDs.

[0135] Figure 12 is a plan view of an interposer substrate according to an embodiment.

[0136] Reference Figure 12 , an electrode pattern 521 and an electrode pattern 522 may be provided on the interposer substrate 520. The electrode pattern 521 and the electrode pattern 522 may include a first electrode 521 connected to the anode 310 of the light emitting diode 300, and a second electrode 522 connected to the cathode 320 of the light emitting diode 300. Conversely, the first electrode 521 may be connected to the cathode 320, and the second electrode 522 may be connected to the anode 310.

[0137] The electrode patterns 521 and 522 may be provided in various shapes. Figure 12 In the embodiment, the first electrode 521 and the second electrode 522 can be formed in a fine-tooth comb shape or a ring shape with one side open, and can be arranged to cross each other, but are not limited thereto. For example, the electrode pattern 521 and the electrode pattern 522 can be formed in a mesh shape or a ring shape.

[0138] When the plurality of LEDs 300 are attached to the electrode patterns 521 and 522, current can flow through the first electrode 521, the light-emitting diodes 300, and the second electrode 522. That is, the first electrode 521 can correspond to the positive electrode, and the second electrode 522 can correspond to the negative electrode. The first electrode 521 can receive the test voltage Vs, and the second electrode 522 can provide the ground GND. Therefore, when the electrode patterns 521 and 522 are connected to an external power source, current can flow through the plurality of LEDs 300, causing the plurality of LEDs 300 to emit light. The external power source can be a manufacturing device that performs the manufacturing method of the display device 1 according to an embodiment.

[0139] The insert substrate 520 may include various materials, such as transparent glass, flexible transparent plastic, a silicon substrate, or metal.

[0140] Figure 13A and Figure 13B is a cross-sectional view of an interposer substrate according to an embodiment.

[0141] Figure 13A and Figure 13B Different embodiments of the interposer substrate 520 are shown that can be manufactured by different processes. Figure 13A As shown, an adhesive material 523 may be applied to the electrode pattern 521 and the electrode pattern 522. That is, after the electrode pattern 521 and the electrode pattern 522 are formed on the interposer substrate 520, the adhesive material 523 may be applied. Figure 13A , the adhesive material 523 is shown to cover all of the electrode pattern 521 and the electrode pattern 522, but some of the electrode pattern 521 and the electrode pattern 522 may be exposed from the adhesive material 523. For example, the adhesive material 523 may not be applied to the upper surfaces of the electrode pattern 521 and the electrode pattern 522.

[0142] Alternatively, Figure 13B As shown, the electrode pattern 521 and the electrode pattern 522 may be disposed on the adhesive material 523. That is, after first applying the adhesive material 523 on the interposer substrate 520, the electrode pattern 521 and the electrode pattern 522 may be disposed on the adhesive material 523.

[0143] The adhesive material 523 can provide adhesive force so that the plurality of LEDs 300 are attached to the electrode patterns 521 and 522. The adhesive material 523 can include various materials. For example, the adhesive material 523 can include acrylic acid, polymethyl methacrylate (PMMA), methyl methacrylate (MMA), methacrylic acid (MAA), butyl methacrylate (BMA), polycarbonate (PC), polyurethane (PU), epoxy resin, polyvinyl chloride (PVC), a photocurable resin composition, a thermosetting resin composition, a natural curing resin composition, a transparent resin composition, and a conductive paste.

[0144] Figure 14 is a diagram illustrating a light emitting diode attached to an electrode pad of an interposer substrate according to an embodiment.

[0145] Reference Figure 14 , the plurality of LEDs 300 may be electrically connected to a first electrode 521 and a second electrode 522 provided on the interposer substrate 520. That is, the anode 310 of the light emitting diode 300 may be connected to the first electrode 521, and the cathode 320 of the light emitting diode 300 may be connected to the second electrode 522. Alternatively, the first electrode 521 may be connected to the cathode 320, and the second electrode 522 may be connected to the anode 310.

[0146] When the plurality of LEDs 300 are attached to the electrode patterns 521 and 522, current may flow through the first electrode 521, the light emitting diodes 300, and the second electrode 522. Therefore, the plurality of LEDs 300 may emit light. Defects of the light emitting diodes 300 may be detected by measuring the light emitted by the plurality of LEDs 300.

[0147] In the embodiment of the method for manufacturing the display device 1, since the above-described interposer substrate 520 is provided, defect inspection of the plurality of LEDs 300 can be easily performed. That is, since the interposer substrate 520 is provided, EL inspection can be performed before the light emitting diodes 300 are transferred to the back plate 100 without requiring a complex wiring structure such as a TFT circuit.

[0148] Therefore, the number of final repairs for repairing the light-emitting diodes 300 transferred to the back panel 100 can be minimized, and side effects caused by the final repair can be reduced. In addition, the number and size of electrode pads provided on the back panel 100 for final repair can be reduced. Therefore, the pixel size of the display device 1 can be reduced, and high resolution can be achieved.

[0149] The following describes a third repair process. During the third repair process, a third defective LED may be detected among the plurality of LEDs 300 transferred to the backplane 100, and a third repair LED corresponding to the third defective LED may be installed in the repair area of ​​the backplane 100. The third defective LED may be detected using EL testing. The structure of the electrode pads used to mount the third repair LED is described below.

[0150] Figure 15 is a plan view of a unit pixel according to an embodiment, and Figure 16 is a cross-sectional view of a unit pixel according to an embodiment.

[0151] Reference Figure 15 and Figure 16 , the light emitting diode 300 may be implemented in a rectangular or similar shape having a width W and a length L. The width and length of the light emitting diode 300 are parameters perpendicular to each other, and the longer of the two parameters may be defined as the length L, and the shorter parameter may be defined as the width W. The anode 310 of the light emitting diode 300 may be disposed at one end in the longitudinal direction, and the cathode 320 of the light emitting diode 300 may be disposed at the other end in the longitudinal direction.

[0152] However, the shape of the light emitting diode 300 is not limited thereto, and the light emitting diode 300 may take a planar shape as long as a width and a length such as a hexagon, an octagon, or an ellipse can be defined.

[0153] As described above, the unit pixel P according to the embodiment may include three sub-pixels SP(R), SP(G), and SP(B). The sub-pixels SP(R), SP(G), and SP(B) may include main areas MA1, MA2, and MA3, each of which is provided with an LED 300 (300R, 300G, 300B), and repair areas RA1, RA2, and RA3, each of which is provided with a third repair LED 300' (300R', 300G', 300B'). In other words, the backplane 100 may include main areas MA1, MA2, and MA3, each of which is provided with a plurality of LEDs 300, and repair areas RA1, RA2, and RA3, each of which may be provided with a third repair LED. When the light-emitting diode 300 fails to emit light, the third repair LED 300' may be provided in the repair areas RA1, RA2, and RA3.

[0154] like Figure 15 As shown, red LED 300R, green LED 300G, and blue LED 300B can be arranged in main regions MA1, MA2, and MA3, respectively. Multiple LEDs 300R, 300G, and 300B can be arranged along the width W direction (X direction) of LED 300. Similarly, multiple anode pads 410R, 410G, and 410B can be arranged along the width W direction (X direction) of LED 300. Repair regions RA1, RA2, and RA3 can be arranged in the length L direction (Z direction) of main LED 300 relative to main regions MA1, MA2, and MA3.

[0155] Hereinafter, in order to distinguish from the third repair LEDs 300 ′ ( 300R′, 300G′, 300B′), the LEDs 300 disposed in the main areas MA1 , MA2 , and MA3 will be referred to as main light emitting diodes 300 and described.

[0156] A repair anode pad 430 (430R, 403G, 430B) for connecting to the anode 310' of the third repair LED 300' may be provided on the back plate 100. A cathode pad 420 may be provided between the anode pads 410 (410R, 410G, 410B) and the repair anode pad 430. The repair anode pads 430 (430R, 403G, 430B) may be arranged along the X direction. That is, the cathode pad 420 may serve as a common ground electrode connected to the cathode 320 of the main light emitting diode 300 and the cathode 320' of the third repair LED 300' and may provide grounding.

[0157] Reference Figure 16, the repair anode pad 430 may be disposed on the planarization layer 113 together with the anode pad 410 and the cathode pad 420. The upper insulating layer 114 may be disposed on the planarization layer 113, and connection holes 114H may be formed in the upper insulating layer 114 and respectively located on the anode pad 410, the cathode pad 420, and the repair anode pad 430. The main light emitting diode 300 may be connected to the anode pad 410 and the cathode pad 420 by various bonding methods such as bonding using the ACF 120 and solder bonding.

[0158] After performing the light emitting test on the light emitting diode 300, if the light emitting diode 300 is not defective, the display device 1 can be completed without connecting the third repair LED 300'. However, when a defective LED (third defective LED) is detected among the plurality of LEDs 300, a third repair LED corresponding to the defective LED can be mounted on the back panel 100.

[0159] Figure 17 is a plan view of a unit pixel mounted with a repaired light emitting diode according to an embodiment, Figure 18 is a cross-sectional view of a sub-pixel mounted with a repaired light emitting diode according to an embodiment, and Figure 19 is a circuit diagram of a sub-pixel equipped with a repaired light emitting diode according to an embodiment.

[0160] refer to Figure 17 and Figure 18 , a defect may be detected in the blue LED 300B among the plurality of main LEDs 300. That is, the blue LED 300B may correspond to the third defective LED. In this case, a third blue repair LED 300B′ corresponding to the blue LED 300B may be mounted on the back panel 100. That is, the third repair LED 300′ may have the same color as the third defective LED.

[0161] In addition, the blue light emitting diode 300B as the third defective LED may be cut. The third defective LED 300B may be cut by laser irradiation. Alternatively, a wiring connected to the third defective LED 300B may be cut.

[0162] Reference Figure 18 , the anode 310B' of the third repair LED 300B' may be electrically connected to the repair anode pad 430B, and the cathode 320B' of the third repair LED 300B' may be electrically connected to the cathode pad 420. That is, the main light emitting diode 300B and the third repair LED 300B' may share the cathode pad 420.

[0163] Figure 18 The circuit of the sub-pixel SP shown can be set to Figure 19 As shown in FIG. 4 , since the main LED 300 and the third repair LED 300 ′ share the cathode pad 420 , they can be connected to the same reference voltage Vss. In addition, the repair anode pad 430 and the anode pad 410 can receive the driving current from the same driving transistor 200 .

[0164] Because the third repair process is performed after the plurality of LEDs 300 have been transferred to the backplane 100, there is a risk of damaging wiring, such as the TFT circuits provided on the backplane 100, when removing defective LEDs. Damaged wiring on the backplane 100 is difficult to repair. Therefore, to reduce this risk, the second repair process can be performed using the aforementioned interposer substrate 520. By using the interposer substrate 520, defect detection and repair can be easily performed before the light-emitting diodes 300 are transferred to the backplane 100.

[0165] Furthermore, by performing the second repair process, the number of times the third repair process is performed can be reduced. Furthermore, the number and size of electrode pads for mounting the third repair LED can be reduced. Therefore, the pixel size of the display device 1 can be reduced, and high resolution can be achieved.

[0166] Figure 20 is a plan view of a unit pixel according to another exemplary embodiment.

[0167] Reference Figure 20 , a plurality of anode pads 410 (410R, 410G, 410B) and a plurality of cathode pads 420 (420R, 420G, 420B) may be formed with Figure 15 and Figure 17 The structure shown is different from the structure shown. The plurality of main light emitting diodes 300R, 300G and 300B can be connected to separate cathode pads 420R, 420G and 420B respectively. Even when the cathode pad 420 is not shared, the plurality of LEDs 300R, 300G and 300B can be connected to a common reference voltage Vss.

[0168] Furthermore, the anode pads 410 (410R, 410G, 410B) and cathode pads 420 (420R, 420G, 420B) can be sized to include repair areas RA1, RA2, and RA3, thereby allowing the main LEDs 300R, 300G, 300B and the third repair LED 300' to be mounted. In other words, the main LED 300 and the third repair LED 300' can be arranged on the same anode pad 410 and the same cathode pad 420 in the X direction. That is, when a defect is detected in the main LED 300, the anode 310' of the third repair LED 300' can be connected to the anode pad 410, and the cathode 320' of the third repair LED 300' can be connected to the cathode pad 420.

[0169] Furthermore, the structure of the electrode pads for mounting the light-emitting diodes can be modified in various embodiments. For example, the red light-emitting diode 300R and the green light-emitting diode 300G can share a cathode pad, and the blue light-emitting diode 300B can be connected to a separate cathode pad. In other words, at least one cathode pad can be provided. Furthermore, an anode pad can be shared, and multiple cathode pads can be provided.

[0170] The above-described method for manufacturing a display device can be performed by various manufacturing devices and / or manufacturing systems. The manufacturing device and / or manufacturing system may include an inspection device for detecting defective LEDs. In addition, the manufacturing device and / or manufacturing system may include a computing device that executes a computer program.

[0171] The method for manufacturing a display device according to the embodiment may be implemented as a computer program executed by a computer. The computer program may be stored on a non-transitory computer-readable recording medium.

[0172] A computer program according to an embodiment may be stored in a recording medium to execute a method for manufacturing a display device, and may be executed in combination with a computing device. The method for manufacturing a display device executed in combination with the computing device may include: preparing a sapphire substrate including a plurality of light-emitting diodes (LEDs); performing a first repair process to detect a first defective LED from the plurality of LEDs and remove the first defective LED; preparing an insert substrate including an electrode pattern and an adhesive material; attaching the plurality of LEDs to the electrode pattern and separating the sapphire substrate; and performing a second repair process to detect a second defective LED from the plurality of LEDs and repair the second defective LED.

[0173] The manufacturing method of the display device may further include: attaching a plurality of LEDs on the insertion substrate to a carrier substrate and separating the insertion substrate; transferring the plurality of LEDs on the carrier substrate to a backplane; and performing a third repair process, the third repair process detecting a third defective LED among the plurality of LEDs transferred to the backplane and repairing the third defective LED.

[0174] Performing the first repair process may include detecting a first defective LED by performing a photoluminescence (PL) inspection.

[0175] Performing the second repair process may include: based on the first defective LED being removed in the first repair process, attaching the first repair LED to the electrode pattern of the insertion substrate, and then performing an electroluminescence (EL) inspection; and based on the second defective LED being detected by performing the EL inspection, replacing the second defective LED with the second repair LED.

[0176] Performing the third repair process may include: performing an electroluminescence (EL) inspection; and mounting a third repair LED corresponding to the third defective LED in the repair region of the back panel.

[0177] According to an embodiment of a method for manufacturing a display device, an insert substrate, and a computer program stored in a recording medium to execute the method for manufacturing a display device, defective light-emitting diodes can be detected more accurately during the manufacturing process of the display device, and the defect rate of the display device can be minimized.

[0178] In addition, according to an embodiment of a method for manufacturing a display device, an insert substrate, and a computer program stored in a recording medium to execute the method for manufacturing a display device, the number of final repairs used to repair the light-emitting diodes transferred to the backplane can be minimized, and the risk of damage caused by the final repairs can be reduced.

[0179] Furthermore, according to embodiments of the display device manufacturing method, the insert substrate, and the computer program stored in a recording medium for executing the display device manufacturing method, the number and size of electrode pads provided on the backplane for final repair can be reduced. Consequently, the pixel size of the display device can be reduced, and high resolution can be provided.

[0180] The display module according to an embodiment of the present disclosure can be applied as a single unit to wearable devices, portable devices, handheld devices, electronic products and / or electrical devices using a display, and can be applied to display devices such as personal computer (PC) monitors, high-resolution TVs, signs and electronic displays through a matrix-type arrangement of multiple components.

[0181] Although certain embodiments have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A method for manufacturing a display device, comprising: performing a first repair process that detects a first defective light emitting diode (LED) disposed on a sapphire substrate and removes the first defective LED such that a first plurality of LEDs remain on the sapphire substrate; attaching the first plurality of LEDs to the electrode pattern of the interposer substrate and separating the sapphire substrate from the first plurality of LEDs; as well as A second repair process is performed, wherein the second repair process detects a second defective LED among the first plurality of LEDs that have been separated from the sapphire substrate and attached to the electrode pattern, and replaces the second defective LED with a second repair LED so that a second plurality of LEDs are arranged on the insertion substrate, wherein the second repair LED is one of the second plurality of LEDs.

2. The method according to claim 1, further comprising: attaching the second plurality of LEDs attached to the electrode pattern of the interposer substrate to a carrier substrate, and separating the interposer substrate from the second plurality of LEDs; transferring the second plurality of LEDs attached to the carrier substrate to a backplane; as well as performing a third repair process that detects a third defective LED among the second plurality of LEDs transferred to the backplane and repairs a sub-pixel corresponding to the third defective LED, The back plate includes a main area where the second plurality of LEDs are arranged, and a repair area where a third repair LED can be installed.

3. The method according to claim 1, wherein The first repair process includes detecting the first defective LED by performing photoluminescence (PL) inspection.

4. The method according to claim 1, wherein An adhesive material is provided over the electrode pattern of the interposer substrate, or the electrode pattern is provided on the adhesive material applied to the interposer substrate.

5. The method according to claim 1, wherein The electrode pattern for attaching the first plurality of LEDs to the interposer substrate includes: connecting an anode of each of the first plurality of LEDs to a first electrode of the electrode pattern; and A cathode of each of the first plurality of LEDs is connected to the second electrode of the electrode pattern.

6. The method according to claim 1, wherein The second repair process includes attaching a first repair LED to an electrode pattern of the interposer substrate based on the first defective LED being removed in the first repair process, and then performing an electroluminescence (EL) inspection.

7. The method according to claim 6, wherein: The second repair process further includes: Based on the detection of the second defective LED by performing the EL inspection, the second defective LED is replaced with the second repair LED.

8. The method according to claim 1, further comprising: The second plurality of LEDs is attached to a backplane comprising a main area where the second plurality of LEDs are located and a repair area where a third repair LED can be mounted.

9. The method according to claim 8, wherein The backplane comprises: a plurality of anode pads configured to connect to anodes of the second plurality of LEDs; Repairing the anode pad; and At least one cathode pad is configured to connect to cathodes of the second plurality of LEDs and to a cathode of the third repair LED.

10. The method according to claim 8, further comprising: Perform electroluminescence (EL) inspection; as well as The third repair LED is mounted in the repair area. The method of claim 10 , further comprising cutting the third defective LED.

12. An interposer substrate, comprising: substrate; a first electrode pattern disposed on the substrate, the first electrode pattern being configured to be connected to an anode of each of a plurality of light emitting diodes (LEDs) disposed on the sapphire substrate and to supply power to the plurality of LEDs; a second electrode pattern disposed on the substrate, the second electrode pattern being configured to: be connected to a cathode of each of the plurality of LEDs disposed on the sapphire substrate; as well as an adhesive material configured to provide an adhesive force for attaching the plurality of LEDs to the first electrode pattern and the second electrode pattern, The first electrode pattern and the second electrode pattern are respectively formed into a ring shape with one side open, and are arranged to cross each other.

13. The interposer substrate according to claim 12, wherein The adhesive material is disposed over the first electrode pattern and the second electrode pattern.

14. The interposer substrate according to claim 12, wherein The adhesive material is disposed between the substrate and the first and second electrode patterns.

Images