Coil component and method of manufacturing the same

Abstract

The technical problem of the present application is to improve the self-resonance frequency in a coil component having a structure in which a spiral coil pattern is embedded in a body. The coil component (1) of the present application includes a coil pattern (C) embedded in a body (10). The body (10) includes a support (11) having a cavity formed therein and an insulating layer (13) laminated to the support (11) to cover the cavity, so that a hollow (S) is formed in the inside of the body (10). The coil pattern (C) includes first intervals (31-34) arranged along the inner wall (11a) of the cavity and second intervals (41-45) arranged on the insulating layer (14), and the end of the first interval (31-34) and the end of the second interval (41-45) corresponding thereto are connected to each other. Thus, most of the inner diameter region of the coil pattern (C) is constituted by the hollow (S), so that the stray capacitance generated between adjacent turns of the coil pattern (C) can be greatly reduced, and the self-resonance frequency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a coil component and a manufacturing method thereof, and particularly relates to a coil component having a structure in which a spiral coil pattern is embedded in a base body and a manufacturing method thereof. BACKGROUND

[0002] As a coil component having a structure in which a spiral coil pattern is embedded in a base body, a coil component described in Patent Literature 1 is known.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 2006-324489 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, in the coil component described in Patent Literature 1, it is difficult to sufficiently increase a self-resonant frequency (SRF).

[0008] Therefore, an object of the present application is to increase a self-resonant frequency in a coil component having a structure in which a spiral coil pattern is embedded in a base body.

[0009] MEANS FOR SOLVING THE PROBLEMS

[0010] The coil component of the present application includes a base body, a coil pattern embedded in the base body and spirally wound across a plurality of turns, and a first terminal electrode and a second terminal electrode provided on a surface of the base body and connected to one end and the other end of the coil pattern, respectively, the base body including a support body in which a cavity is formed and a first insulating layer laminated to the support body to cover the cavity, so that a hollow is formed in the inside of the base body, the coil pattern including a plurality of first sections provided along an inner wall of the cavity and a plurality of second sections provided on the first insulating layer, one end of the plurality of first sections and one end of the plurality of second sections corresponding thereto are connected to each other, and the other end of the plurality of first sections and the other end of the plurality of second sections corresponding thereto are connected to each other.

[0011] According to the present application, since a large part of an inner diameter region of the coil pattern is constituted by the hollow, a stray capacitance generated between adjacent turns of the coil pattern can be greatly reduced. Thus, a self-resonant frequency can be increased.

[0012] In the present application, the base body can further include a second insulating layer covering the inner wall of the cavity, and the first sections of the coil pattern can be provided to the inner wall of the cavity via the second insulating layer. Thus, a material having electrical conductivity can be used as a material of the support body. In this case, the support body can be constituted by silicon. Thus, it is easy to form the hollow in the support body.

[0013] In the present application, it can also be that the first insulating layer is composed of a resin-based insulating material. Thus, since the first insulating layer has flexibility, even in the case where an external force is applied, the portion covering the hollow is not easily broken. In this case, it can also be that a filler is added to the resin-based insulating material that constitutes the first insulating layer. Thus, the strength of the first insulating layer can be improved.

[0014] In the present application, it can also be that the body further includes a third insulating layer that covers the first insulating layer to bury the plurality of second intervals and is composed of a resin-based insulating material, the first terminal electrode and the second terminal electrode are provided on the third insulating layer, and the resin-based insulating material that constitutes the third insulating layer has a lower dielectric constant than the resin-based insulating material that constitutes the first insulating layer. Thus, the stray capacitance generated between the first terminal electrode and the second terminal electrode and the coil pattern can be reduced.

[0015] In the present application, it can also be that the first terminal electrode and the second terminal electrode are arranged in the axial direction of the coil pattern. Thus, since the potential difference between the first terminal electrode and the second terminal electrode and the coil pattern is suppressed, the stray capacitance can be further reduced.

[0016] In this case, it can also be that the first terminal electrode and the second terminal electrode are not formed on the surface of the body perpendicular to the axial direction but are formed on the surface of the body along the axial direction. Thus, since the magnetic flux is difficult to interfere with the first terminal electrode and the second terminal electrode, the generation of eddy current can be suppressed.

[0017] The method of manufacturing the coil component of the present application includes: a first step of forming a hollow in a support body; a second step of forming a plurality of first intervals of a coil pattern along the inner wall of the cavity; a third step of forming the hollow by covering the cavity with a first insulating layer; a fourth step of exposing one end and the other end of the plurality of first intervals by forming an opening portion in the first insulating layer; and a fifth step of connecting one end of the plurality of first intervals and one end of the plurality of second intervals corresponding thereto to each other and connecting the other end of the plurality of first intervals and the other end of the plurality of second intervals corresponding thereto to each other by forming a plurality of second intervals of the coil pattern on the first insulating layer.

[0018] According to the present application, it is possible to easily manufacture a coil component having a coil pattern in which the majority of the inner diameter region is a hollow.

[0019] It can also be that the method of manufacturing the coil component of the present application further includes a step of forming a second insulating layer that covers the inner wall of the cavity after the first step is performed and before the second step is performed. Thus, a material having electrical conductivity can be used as the material of the support body.

[0020] Also, the manufacturing method of the coil component of the present application can further include a sixth step of forming a third insulating layer made of a resin insulating material on the first insulating layer to bury the plurality of second sections, and a seventh step of forming a first terminal electrode and a second terminal electrode connected to one end and the other end of the coil pattern, respectively, on the third insulating layer, the first insulating layer being made of a resin insulating material, the resin insulating material constituting the third insulating layer having a lower relative dielectric constant than the resin insulating material constituting the first insulating layer.

[0021] Effects of the Invention

[0022] According to the present application, in the coil component having a structure in which a spiral coil pattern is buried in a base body, the self-resonance frequency can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 Figure 1 (a) is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.

[0024] Figure 2 Figure 2 (a) is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side. Figure 1 (b) is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side. Figure 2 (b) is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side. Figure 1 (b) is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.

[0025] Figure 3 Figure 3 is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.

[0026] Figure 4 Figure 4 is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.

[0027] Figure 5 Figure 5 is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.

[0028] Figure 6 Figure 6 is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.

[0029] Figure 7 Figure 7 is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.

[0030] Figure 8 Figure 8 is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side.​​​​​​​​​​​​​​​​

[0031]

Figure 9

[0032]

Figure 10

[0033] Symbol Explanation

[0034] 1 and 2 coil components

[0035] 10 body

[0036] 11 Support

[0037] 11a Inner wall of chamber

[0038] 11b Outer Peripheral Surface

[0039] 12-14 Insulation layer

[0040] 31-34, Interval 1

[0041] 31a~34a One end of the first interval

[0042] 31b~34b, the other end of the first interval

[0043] 41-45, second interval

[0044] One end of the second interval 41a~44a

[0045] The other end of the second interval 42b~45b

[0046] Openings 51a~54a, 51b~54b

[0047] 71, 72 Through-hole conductors

[0048] 71a, 72a openings

[0049] C coil pattern

[0050] E1 and E2 terminal electrodes

[0051] S cavity Detailed Implementation

[0052] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0053] <First Implementation>

[0054] Figure 1is a general perspective view for explaining the structure of the coil component 1 of the first embodiment of the present application, (a) is a view as seen from the upper surface side, and (b) is a view as seen from the mounting surface side. Further, Figure 2 (a) is a general cross-sectional view along Figure 1 (b) of the A-A line, Figure 2 (b) is a general cross-sectional view along Figure 1 (b) of the B-B line.

[0055] The coil component 1 of the first embodiment is a chip-type electronic component capable of surface mounting, as shown in Figure 1 and Figure 2 has a base body 10, a coil pattern C embedded in the base body 10, and terminal electrodes El, E2 provided on the surface of the base body 10.

[0056] The base body 10 is composed of a support body 11 and insulating layers 12 to 14. The support body 11 is composed of a material having sufficient mechanical strength such as silicon, and has a cavity with the z direction as the depth direction provided in the xy plane. The surface of the support body 11 has an inner wall 11a of the cavity and an outer peripheral surface 11b surrounding the cavity. The inner wall 11a of the cavity has a bottom surface constituting the xy plane and a tapered surface between the bottom surface and the outer peripheral surface 11b. The tapered surface is a region in which the depth linearly changes with the x direction position or the y direction position, and by providing such a tapered surface, the first interval of the coil pattern C described later is easily formed. On the other hand, the outer peripheral surface 11b is annular and constitutes the xy plane.

[0057] The insulating layer 12 is a thin film covering the inner wall 11a of the cavity and the outer peripheral surface 11b, and is composed of, for example, silicon oxide. The insulating layer 12 is not necessarily provided in the present application, but in the case where a conductive material such as silicon is used as the material of the support body 11, the insulating layer 12 is required to insulate the support body 11 and the coil pattern C.

[0058] The insulating layer 13 is composed of a resin-based insulating material attached to the outer peripheral surface 11b of the support body 11 to cover the cavity. The insulating layer 13 is not in contact with the inner wall 11a of the cavity, and thus a hollow S is formed inside the base body 10 by the support body 11 and the insulating layer 13. The hollow S is filled with air, and thus the relative dielectric constant ε of the hollow S is approximately 1. The hollow S can also be filled with an inert gas such as nitrogen. Thus, oxidation of the coil pattern C exposed to the hollow S can be suppressed. Further, the insulating layer 14 is laminated on the surface of the insulating layer 13. Here, the insulating layer 13 is composed of a resin-based insulating material in which a filler such as silica is added to an epoxy or acrylic resin material. In contrast, the insulating layer 14 is composed of a resin material not containing a filler such as a bismaleimide and a liquid crystal polymer.

[0059] As described above, the insulating layer 13 is made of a resin insulating material having high strength and flexibility, so even if the hollow S is formed by adhering the insulating layer 13 to the outer circumferential surface lib of the support 11, breakage of the insulating layer 13 due to external force is not likely to occur. On the other hand, the resin insulating material constituting the insulating layer 14 is made of a resin material having a low relative dielectric constant, and no filler such as silica is added, so the resin insulating material constituting the insulating layer 14 has a lower relative dielectric constant than the resin insulating material constituting the insulating layer 13. As an example, the relative dielectric constant ε of the resin insulating material constituting the insulating layer 13 at 1 GHz is about 3.3, and the relative dielectric constant ε of the resin insulating material constituting the insulating layer 14 at 1 GHz is about 2.4.

[0060] Figure 3 is a schematic perspective view for illustrating the structure of the coil pattern C embedded in the body 10. In addition, Figure 4 is a schematic perspective view for illustrating the state of the coil pattern C as viewed from the z direction.

[0061] As shown in Figures 2 to 4 , the coil pattern C is constituted by the first intervals 31 to 34 disposed on the support 11 via the insulating layer 12, and the second intervals 41 to 45 disposed on the insulating layer 13. In addition, one ends 31a to 34a of the first intervals 31 to 34 are connected to one ends 41a to 44a of the second intervals 41 to 44, respectively, and the other ends 31b to 34b of the first intervals 31 to 34 are connected to the other ends 42b to 45b of the second intervals 42 to 45, respectively. As shown in Figure 2 , the portions of the first intervals 31 to 34 formed on the inner wall 11a of the chamber are exposed to the hollow S, and the second intervals 41 to 45 are embedded in the insulating layer 14. Here, the relative dielectric constant ε of the hollow S is about 1, so the stray capacitance between the first intervals 31 to 34 adjacent in the x direction is greatly reduced. Also, for the second intervals 41 to 45, since they are embedded in the insulating layer 14 having a low relative dielectric constant, the stray capacitance between the second intervals 41 to 45 adjacent in the x direction is also reduced.

[0062] Based on the above structure, a coil pattern C is formed by spirally winding multiple turns. The coil axis of the coil pattern C is in the x-direction. The other end 41b of the second section 41 constitutes one end of the coil pattern C and is connected to the terminal electrode E1 via a through-hole conductor 71 provided through the insulating layer 14. On the other hand, one end 45a of the second section 45 constitutes the other end of the coil pattern C and is connected to the terminal electrode E2 via a through-hole conductor 72 provided through the insulating layer 14. The terminal electrodes E1 and E2 are bottom surface terminals formed only on the xy surfaces of the substrate 10. That is, the terminal electrodes E1 and E2 do not cover the yz surfaces of the substrate 10, so that when mounted on a circuit board using solder, the yz surfaces of the substrate 10 are not covered by the fillet of the solder. As a result, the mounting density can be increased, and the magnetic flux generated by the coil pattern C is less likely to interfere with the terminal electrodes E1 and E2 and the solder, thus suppressing the generation of eddy currents.

[0063] like Figure 4 As shown, terminal electrode E1 overlaps at least with the second section 41, and terminal electrode E2 overlaps at least with the second section 45. Therefore, stray capacitance is generated between terminal electrode E1 and the second section 41, and between terminal electrode E2 and the second section 45. However, in this embodiment, since the insulating layer 14 located between them is made of a resin-based insulating material with a low relative permittivity, the stray capacitance generated between terminal electrodes E1, E2 and the second sections 41, 45 can be reduced. Furthermore, since the insulating layer 14 is embedded in the second sections 41-45, the stray capacitance between adjacent second sections 41-45 in the x-direction can be reduced, that is, the stray capacitance generated between adjacent turns of the coil pattern C. Thus, the reduction in self-resonant frequency due to stray capacitance can be prevented.

[0064] In addition, in the present embodiment, the terminal electrode E1 also has an overlap with a portion of the second section 42, and the terminal electrode E2 also has an overlap with a portion of the second section 44. Thus, stray capacitance also occurs between the terminal electrode E1 and the second section 42, and between the terminal electrode E2 and the second section 44. Here, since the second section 42 is farther from the terminal electrode E1 than the second section 41, the stray capacitance per unit area of the terminal electrode E1 and the second section 42 is greater than the stray capacitance per unit area of the terminal electrode E1 and the second section 41, due to the voltage drop. Similarly, since the second section 44 is farther from the terminal electrode E2 than the second section 45, the stray capacitance per unit area of the terminal electrode E2 and the second section 44 is greater than the stray capacitance per unit area of the terminal electrode E2 and the second section 45, due to the voltage drop. As described above, the effect of using a resin-based insulating material having a low relative permittivity as the material of the resin layer 14 is more pronounced when each of the terminal electrodes E1, E2 has an overlap with a plurality of the second sections 41 to 45.

[0065] As described above, in the coil component 1 of the present embodiment, since the portions of the first sections 31 to 34 that are formed on the inner wall 11a of the cavity are exposed to the hollow S, the stray capacitance between the first sections 31 to 34 adjacent in the x direction can be greatly reduced. In addition, with the second sections 41 to 45, since they are buried in the insulating layer 14 having a low relative permittivity, the stray capacitance between the second sections 41 to 45 adjacent in the x direction can also be reduced. Thus, the stray capacitance generated between adjacent turns of the coil pattern C can be greatly reduced, and the self-resonance frequency can be increased.

[0066] Furthermore, in the present embodiment, since the support body 11 is made of a material having high strength such as silicon, the mechanical strength of the body 10 can be ensured, and the reduction in the self-resonance frequency due to the stray capacitance can be prevented.

[0067] In addition, in the present embodiment, since the terminal electrodes E1, E2 are arranged in the axial direction (x direction) of the coil pattern C, the terminal electrode E1 does not overlap with a second section (for example, the second sections 44, 45) that is farther from the terminal electrode E1, and similarly, the terminal electrode E2 does not overlap with a second section (for example, the second sections 41, 42) that is farther from the terminal electrode E2. Thus, since the potential difference between the terminal electrodes E1, E2 and the second sections 41, 42, 44, 45 that overlap with them is suppressed, the stray capacitance can be further reduced compared to when the terminal electrodes E1, E2 are arranged in the y direction.

[0068] Next, the manufacturing method of the coil component 1 of the present embodiment will be described.

[0069] Figures 5 to 9is a process diagram for explaining a manufacturing method of the coil component 1 of the present embodiment. In Figures 5 to 9 (a) is a substantially perspective view, (b) is a substantially plan view, and (c) is a yz substantially sectional view.

[0070] First, as shown in Figure 5 , a support 11 made of silicon or the like is prepared, and a chamber having the z direction as a depth direction is formed using an RIE method or the like. By this, an inner wall 11a is formed in a portion corresponding to the chamber, and an annular outer peripheral surface 11b is formed around the chamber. If silicon is used as the material of the support 11, the chamber can be formed with high precision. Further, the angle of the taper of the inner wall 11a can be adjusted by the RIE conditions.

[0071] Next, after an insulating layer 12 made of silicon oxide or the like is formed on the inner wall 11a and the outer peripheral surface 11b, first intervals 31 to 34 of a coil pattern C are formed on the surface of the insulating layer 12. Most of the first intervals 31 to 34 are formed at positions covering the inner wall 11a of the chamber, and both ends thereof are formed at positions covering the outer peripheral surface 11b. As a method of forming the first intervals 31 to 34, the following steps can be performed, that is, after a thin power supply film is formed on the entire surface of the insulating layer 12, a photosensitive resist is applied using a spray method or the like, an opening portion is formed in the photosensitive resist by exposure and development, and the first intervals 31 to 34 are grown in the opening portion by plating. By this, the continuous first intervals 31 to 34 which cross the chamber in the y direction are formed. Here, since the chamber has a taper, it is difficult for disconnection or film thickness deviation or the like to occur in the first intervals 31 to 34.

[0072] Next, as shown in Figure 7 , a thin film-shaped insulating layer 13 is attached to the outer peripheral surface 11b of the support 11 via the insulating layer 12. By this, the chamber is closed, and a hollow S is formed. The above process can also be performed in an inert gas such as nitrogen. In this way, the hollow S can be filled with an inert gas such as nitrogen. Further, end portions 31a to 34a, 31b to 34b of the first intervals 31 to 34 which are formed on the outer peripheral surface 11b are buried in the insulating layer 13. Next, by performing exposure and development on the insulating layer 13, opening portions 51a to 54a, 51b to 54b are formed in the insulating layer 13. Here, the opening portions 51a to 54a are respectively provided at positions at which one ends 31a to 34a of the first intervals 31 to 34 are exposed, and the opening portions 51b to 54b are respectively provided at positions at which the other ends 31b to 34b of the first intervals 31 to 34 are exposed. Here, the insulating layer 13 is made of a resin-based insulating material in which a filler is added to a resin material having high strength, and thus high workability can be ensured.

[0073] Next, as shown in Figure 8As shown, second sections 41 to 45 are formed on the surface of insulating layer 13. The formation of the second sections 41 to 45 can be achieved through the following steps: after forming a thin power supply film over the entire surface, a photosensitive film is adhered; openings are formed on the photosensitive film through exposure and development; and the second sections 41 to 45 are grown at the openings through electroplating. At this time, one end 41a to 44a of the second sections 41 to 44 is positioned overlapping with the openings 51a to 54a, and the other end 42b to 45b of the second sections 42 to 45 is positioned overlapping with the openings 51b to 54b. Thus, one end 31a to 34a of the first sections 31 to 34 is connected to one end 41a to 44a of the second sections 41 to 44, and the other end 31b to 34b of the first sections 31 to 34 is connected to the other end 42b to 45b of the second sections 42 to 45.

[0074] Next, as Figure 9 As shown, an insulating layer 14 is formed over the entire surface to embed the second sections 41 to 45. Thus, adjacent second sections 41 to 45 in the x-direction are insulated by a resin-based insulating material with a relatively low permittivity. Next, openings 71a and 72a are formed in the insulating layer 14 to expose the other end 41b of the second section 41 and one end 45a of the second section 45. Furthermore, terminal electrodes E1 and E2 are formed at positions overlapping with the openings 71a and 72a, respectively, completing the coil component 1 of this embodiment.

[0075] As described above, in the manufacturing method of the coil component 1 of this embodiment, after forming a cavity in the support 11 and forming the first intervals 31 to 34 in the inner wall 11a of the cavity, the insulating layer 13 is attached in a way that closes the cavity. Therefore, it is possible to form a cavity S inside the body 10. As a result, a coil pattern C with low stray capacitance can be embedded in the body 10.

[0076] <Second Implementation Method>

[0077] Figure 10 This is a general cross-sectional view used to illustrate the structure of the coil component 2 according to the second embodiment of the present invention.

[0078] like Figure 10 As shown, the coil component 2 of the second embodiment differs from the coil component 1 of the first embodiment in that the insulating layer 14 is made of the same resin-based insulating material as the insulating layer 13. Since the other basic structures are the same as those of the coil component 1 of the first embodiment, the same reference numerals are used for the same elements, and repeated descriptions are omitted. As exemplified by the coil component 2 of this embodiment, it is not necessary for the second interval 41 to 44 to be covered by a resin-based insulating material with a relatively low permittivity in this invention.

[0079] The preferred embodiments of the present application have been described above, but the present application is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present application, and of course, these modifications are included in the scope of the present application.

Claims

1. A coil component characterized by comprising: a body; a coil pattern embedded in the body and spirally wound across a plurality of turns; and a first terminal electrode and a second terminal electrode provided on a surface of the body and connected to one end and the other end of the coil pattern, respectively, the body including a support formed with a cavity and a first insulating layer laminated to the support to cover the cavity, thereby forming a hollow in an inside of the body, the coil pattern including a plurality of first sections provided along an inner wall of the cavity and a plurality of second sections provided on the first insulating layer, one end of the plurality of first sections and one end of the plurality of second sections corresponding thereto are connected to each other, the other end of the plurality of first sections and the other end of the plurality of second sections corresponding thereto are connected to each other, the first insulating layer is made of a resin-based insulating material to which a filler is added, the body further includes a third insulating layer covering the first insulating layer to embed the plurality of second sections and made of a resin-based insulating material, the first terminal electrode and the second terminal electrode are provided on the third insulating layer, the resin-based insulating material constituting the third insulating layer has a lower relative dielectric constant than the resin-based insulating material constituting the first insulating layer.

2. The coil component according to claim 1, characterized in that the body further includes a second insulating layer covering the inner wall of the cavity, the first sections of the coil pattern are provided on the inner wall of the cavity via the second insulating layer.

3. The coil component according to claim 2, characterized in that the support is made of silicon.

4. The coil component according to any one of claims 1 to 3, characterized in that the first terminal electrode and the second terminal electrode are arranged in an axial direction of the coil pattern.

5. The coil component according to claim 4, characterized in that the first terminal electrode and the second terminal electrode are not formed on a surface of the body perpendicular to the axial direction but are formed on a surface of the body along the axial direction.

6. A manufacturing method of a coil component characterized by comprising: a first step of forming a cavity in a support; a second step of forming a plurality of first sections of a coil pattern along an inner wall of the cavity; a third step of forming a hollow by covering the cavity with a first insulating layer; a fourth step of exposing one end and the other end of the plurality of first sections by forming an opening portion in the first insulating layer; a fifth step of connecting one end of the plurality of first sections and one end of a plurality of second sections of the coil pattern corresponding thereto to each other and connecting the other end of the plurality of first sections and the other end of the plurality of second sections corresponding thereto to each other by forming the plurality of second sections of the coil pattern on the first insulating layer; a sixth step of embedding the plurality of second sections by forming a third insulating layer made of a resin-based insulating material on the first insulating layer; and a seventh step of forming a first terminal electrode and a second terminal electrode connected to one end and the other end of the coil pattern, respectively, on the third insulating layer. ​ ​ ​ The first insulating layer is made of a resin-based insulating material to which a filler is added, The resin-based insulating material that constitutes the third insulating layer has a lower relative dielectric constant than the resin-based insulating material that constitutes the first insulating layer.

7. The method of manufacturing a coil component according to claim 6, wherein Further provided are: a step of forming a second insulating layer that covers the inner wall of the cavity after the first step and before the second step.

8. A coil component characterized by comprising: includes: a body having a cavity; and a coil pattern that is buried in the body and is wound in multiple turns, a first section of each turn of the coil pattern is exposed at the cavity, and a second section of each turn of the coil pattern is buried in the insulating material that constitutes the body and is not exposed at the cavity, the second section of each turn of the coil pattern has an inner surface covered by a first insulating layer and an outer surface covered by a second insulating layer, the first insulating layer and the second insulating layer include different insulating materials from each other, the second insulating layer has a lower relative dielectric constant than the first insulating layer.

9. The coil component according to claim 8, wherein the first section of each turn of the coil pattern has an inner surface exposed at the cavity and an outer surface covered by the body.

10. The coil component according to claim 9, wherein the body includes a support body having a cavity to form the cavity, and the outer surface of the first section of each turn of the coil pattern is covered by the inner wall of the cavity.

11. The coil component according to claim 8, wherein Further includes: a first terminal electrode connected to one end of the coil pattern and a second terminal electrode connected to the other end of the coil pattern, the first terminal electrode and the second terminal electrode are formed in the second insulating layer.

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