Positioning System and Device of Die Bonder and Method for Placing Dies on Die Bonder

Abstract

A method for placing crystal grains on a die bonder includes the following steps: respectively disposing a substrate and a positioning element on a first surface and a second surface of a stage; respectively acquiring crystal grain image information of crystal grains on a pick-and-place device and positioning image information of known feature information; comparing the crystal grain image information of the crystal grains with the positioning image information. Determine the crystal grain position corresponding to the substrate for the crystal grains according to the positioning image information, and place the crystal grains at the crystal grain position corresponding to the substrate through the pick-and-place device. In addition, a positioning system of a die bonder and a positioning device of a die bonder are also proposed.

Description

Technical Field

[0001] The present invention relates to a positioning system, a positioning device, and a method for placing dies, and particularly to a positioning system, a positioning device, and a method for placing dies of a die bonder that can place dies with high precision. Background Art

[0002] In general die bonding processes, dies are precisely adhered to a carrier plate with positioning marks by alignment methods. However, when there are no positioning marks on the carrier plate, the method is different. Existing die bonders use a pick-and-place unit to pick up dies located in a die supply module. The stage will first move a stroke and be positioned, and then the die will be transported to a stage to make the die bond with a substrate, and then the next die will be repeated. During this repeated process, the pick-and-place unit only knows the position where the die is to be placed on the substrate. For die bonding operations that require precision, any movement of the stage may reduce the precision of the die placement position. Moreover, some manufacturers use existing dies on the substrate as a reference for positioning. However, if the placement positions of the existing dies are already offset, the position errors of the subsequent dies placed based on this will become larger and larger. In addition, a common practice is to perform additional processing on the existing substrate to create alignment marks to provide an alignment mechanism. However, this will leave residual additional alignment marks on the substrate after die bonding, and additional processing is required to remove the alignment marks, which will only increase the troubles in the production line and the product shipping schedule.

[0003] Therefore, how to improve and provide a "positioning system, positioning device, and method for placing dies of a die bonder" to avoid the above-mentioned problems is an urgent issue for those in the relevant technical fields. Summary of the Invention

[0004] The present invention provides a positioning system, a positioning device, and a method for placing dies of a die bonder. By capturing positioning image information of known feature information set on the back of the carrier plate, the die position on the substrate is determined to improve the precision during die bonding.

[0005] An embodiment of the present invention provides a positioning system for a die bonder, which is applicable to a plurality of dies. The positioning system of the die bonder includes a stage, a substrate, a pick-and-place device, a positioning element, a die acquisition element, a feature acquisition element, and a control unit. The stage includes a first surface and a second surface opposite to each other. The substrate is disposed on the first surface of the stage. The pick-and-place device is used to place each die at a corresponding die position on the substrate. The positioning element is disposed on the second surface of the stage, and the positioning element includes a plurality of known feature information. The die acquisition element is used to acquire a die image information of each die on the pick-and-place device. The feature acquisition element is used to acquire a positioning image information of each known feature information. The control unit is used to connect the stage, the pick-and-place device, the die acquisition element, and the feature acquisition element. The control unit receives and compares the die image information of each die with the corresponding positioning image information, and the control unit determines the die position corresponding to each die according to each positioning image information, so that the pick-and-place device places each die at the corresponding die position on the substrate.

[0006] Another embodiment of the present invention provides a positioning device for a die bonder, which is applicable to a die bonder for placing a plurality of dies. The die bonder includes a pick-and-place device and a substrate. The pick-and-place device is used to place each die at a corresponding die position on the substrate. The positioning device of the die bonder includes a stage, a positioning element, and a feature acquisition element. The stage includes a first surface and a second surface opposite to each other, and the first surface of the stage is used to dispose the substrate. The positioning element is disposed on the second surface of the stage, and the positioning element includes a plurality of known feature information, and each known feature information corresponds to the die position of the die respectively. The feature acquisition element is used to acquire a positioning image information of each known feature information, and according to each positioning image information, the pick-and-place device places each die at the corresponding die position on the substrate.

[0007] Another embodiment of the present invention provides a method for placing dies on a die bonder, which is applicable to a die bonder. The die bonder includes a stage, a pick-and-place device, and a positioning element. The stage includes a first surface and a second surface opposite to each other, and the pick-and-place device picks and places each die. The method for placing dies on the die bonder includes the following steps: respectively disposing the substrate and the positioning element on the first surface and the second surface of the stage, wherein the positioning element includes a plurality of known feature information; respectively acquiring a die image information of each die on the pick-and-place device and a positioning image information of each known feature information; comparing the die image information of each die with the corresponding positioning image information. Determining a die position corresponding to each die on the substrate according to each positioning image information, and placing each die at the corresponding die position on the substrate through the pick-and-place device.

[0008] Based on the above, in the positioning system of the die bonder, the positioning device of the die bonder, and the method for placing dies on the die bonder of the present invention, the die position where the die is to be placed is determined according to the positioning image information of the known feature information configured on the back surface of the stage, thereby improving the accuracy during die bonding.

[0009] Furthermore, the present invention can provide a positioning mechanism for placing the die without setting positioning elements on the substrate. Therefore, there is no need to remove the positioning elements from the substrate after die bonding, and the known feature information on the back of the stage of the present invention can be reused, improving the convenience of use.

[0010] In addition, when the stage and the substrate thereon move, the positioning elements arranged on the back of the stage also move synchronously, so that there is no relative position change between the positioning elements and the substrate. Therefore, it can be ensured that the position of each known feature information on the positioning elements relative to the substrate does not change, which can be used as a reference for subsequent die placement and die bonding alignment.

[0011] To make the present invention more obvious and understandable, specific embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the positioning device of the die bonder of the present invention.

[0013] Figure 2 It is a schematic diagram of the die bonding surface of the substrate.

[0014] Figure 3 It is a schematic diagram of the arrangement of the known feature information I of the present invention.

[0015] Figure 4 It is a schematic diagram of the die positions on the die bonding surface of the substrate of the present invention.

[0016] Figure 5A It is a schematic diagram of the positioning system of the die bonder of the present invention.

[0017] Figure 5B It is a schematic diagram of an embodiment of the pick-and-place device of the present invention.

[0018] Figure 6 It is a flowchart of the method for placing dies of the die bonder of the present invention.

[0019] Figure 7A It is a schematic diagram of an embodiment of the die image information of the present invention.

[0020] Figure 7B It is a schematic diagram of an embodiment of the positioning image information of the present invention.

[0021] Figure 7C It is a schematic diagram of an embodiment of comparing the die image information with the positioning image information according to the present invention.

[0022] Figure 7D It is a schematic diagram of an embodiment of placing a die at the corresponding die position on the substrate according to the present invention.

[0023] Figure 8A Schematic diagram of another embodiment of the grain image information of the present invention.

[0024] Figure 8B Schematic diagram of another embodiment of the positioning image information of the present invention.

[0025] Figure 8C Schematic diagram of another embodiment of comparing the grain image information according to the positioning image information of the present invention.

[0026] Figure 8D Schematic diagram of another embodiment of placing the grain at the corresponding grain position on the substrate of the present invention.

[0027] List of reference numerals: 30 - grain; 50 - substrate; 52 - die bonding surface; 54 - setting surface; 100 - positioning device of die bonder; 110 - stage; 112 - first surface; 114 - second surface; 120 - positioning element; 122 - known feature information; 122A - first known feature information; 122B - second known feature information; 130 - feature acquisition element; 200 - positioning system of die bonder; 210 - pick-and-place device; 212 - suction element; 214 - rotating element; 220 - grain acquisition element; 230 - control unit; A1 - axial direction; C1, C2, C3, C4 - objects; G1, G2 - moving position information; L1 - direction of substrate; L2, L3 - moving directions; M1 - grain image information; M2 - positioning image information; P - grain position; P1 - first grain position; P2 - second grain position; S100 - method of placing grain by die bonder; S110 - S140 - steps; X - first direction; Y - second direction; Z - third direction. Detailed Description of the Invention

[0028] The following further describes the specific embodiments of the present invention in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and cannot be used to limit the protection scope of the present invention.

[0029] For the convenience and clarity of description, the thickness or size of each element in the drawings is represented in an exaggerated, omitted or schematic manner for the understanding and reading of those skilled in the art. And the sizes of the elements are not completely their actual sizes, and are not used to limit the implementable conditions of the present invention, so they do not have technical substantial significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed in this case can cover.

[0030] Figure 1 Schematic diagram of the positioning device of the die bonder of the present invention. Please refer to Figure 1。The positioning device 100 of the die bonder in this embodiment is applicable to a die bonder for placing multiple die chips. The positioning device 100 of the die bonder includes a stage 110, a positioning element 120, and a feature acquisition element 130. The stage 110 includes a first surface 112 and a second surface 114 that are opposite to each other. Among them, the first surface 112 of the stage 110 can be referred to as the front surface, and the second surface 114 of the stage 110 can be referred to as the back surface. The stage 110 can move along the first direction X (such as the X-axis), the second direction Y (such as the Y-axis), and rotate around the third direction Z (such as the Z-axis).

[0031] In this embodiment, the first surface 112 of the stage 110 is used to set the substrate 50. Among them, the substrate 50 has a die bonding surface 52 and a setting surface 54 that are opposite to each other. The die bonding surface 52 of the substrate 50 is used to place the die chips, and the setting surface 54 of the substrate 50 is used to be fixed on the stage 110. The present invention does not limit the means of how the substrate 50 is fixed on the first surface 112 of the stage 110. In one embodiment, a vacuum adsorption element (not shown) can be provided in the stage 110 to adsorb and fix the position of the substrate 50. In another embodiment, the substrate 50 can be fixed on the stage 110 by using a pasting element (not shown). In addition, as Figure 2 shown, Figure 2 is a schematic diagram of the die bonding surface 52 of the substrate 50. There are no marked positions on the die bonding surface 52 of the substrate 50. The die bonding surface 52 is only used to place each die chip. In other words, there is no need to provide a positioning element (mark, symbol) on the substrate 50 in this embodiment.

[0032] Please refer back to Figure 1 , in this embodiment, the positioning element 120 is provided on the second surface 114 of the stage 110. The positioning element 120 includes a plurality of known feature information 122, and each known feature information 122 is respectively provided at different positions on the second surface 114 of the stage 110. In this embodiment, each known feature information 122 is a protrusion protruding from the second surface 114 of the stage 110 or an engraving or marking.

[0033] In addition, referring to Figure 1 , Figure 3 and Figure 4 at the same time, each known feature information 122 corresponds to the die chip position P on the substrate 50 where the die chip is desired to be placed and bonded. In other words, the present invention can design the shape and arrangement of the known feature information 122 on different positioning elements 120 according to the actual die chip position P on the substrate 50 where the die chip is desired to be placed and bonded. For example, as Figure 3 shown, a plurality of known feature information 122 are planes (or protrusions) with a specific repetitive structural pattern, and the shape of the known feature information 122 is a rectangle or a rectangle. In other embodiments, the known feature information 122 can be lines, characters, triangles, crosses, or other regular features.

[0034] In this embodiment, along the third direction Z (Z-axis), the first known feature information 122A in the positioning element 120 corresponds to the first die position P1 on the die bonding surface 52 of the substrate 50 (since this first die position P1 does not actually exist, it is represented by a dashed line); similarly, the second known feature information 122B in the positioning element 120 corresponds to the second die position P2 on the die bonding surface 52 of the substrate 50 (since this second die position P2 does not actually exist, it is represented by a dashed line). When the stage 110 and the substrate 50 thereon move, the positioning element 120 disposed on the back surface of the stage 110 also moves synchronously, so that there is no relative position change between the positioning element 120 and the substrate 50. Therefore, the position of each known feature information 122 on the positioning element 120 relative to the substrate 50 will not change, which can be used as a reference for subsequent die placement and die bonding alignment.

[0035] Please refer back to Figure 1 , in this embodiment, the feature acquisition element 130 is located below the stage 110, that is, the feature acquisition element 130 is located below the second surface 114 of the stage 110. The feature acquisition element 130 is used to acquire the positioning image information of the known feature information 122. In other words, in this embodiment, according to the acquired positioning image information of the known feature information 114 disposed on the back surface (second surface 114) of the stage 110, the die position where each die is to be placed on the die bonding surface 52 of the substrate 50 is determined, thereby improving the accuracy during die bonding. It should be noted that the feature acquisition element 130 can be an image acquisition element such as a charge coupled device (CCD), a complementary metal-oxide-semiconductor (CMOS) photosensitive element, etc., but is not limited thereto.

[0036] Figure 5A is a schematic diagram of the positioning system of the die bonder of the present invention. Please refer to Figure 5A . The positioning system 200 of the die bonder in this embodiment is applicable to placing the die 30 on the die bonding surface 52 of the substrate 50 to bond the die 30 to the substrate 50. The positioning system 200 of the die bonder in this embodiment includes a pick-and-place device 210, a die acquisition element 220, a control unit 230, and a positioning device 100 of the die bonder. The positioning device 100 of the die bonder includes a stage 110, a positioning element 120, and a feature acquisition element 130. The positioning device 100 of the die bonder can be referred to as described above Figure 1 and will not be repeated here.

[0037] In this embodiment, the pick-and-place device 210 is used to place each die 30 at the corresponding die position on the substrate 50. The pick-and-place device 210 of this embodiment has a suction element 212, and the suction element 212 is used to adsorb the die 30. In one embodiment, referring to Figure 5B as shown, the pick-and-place device 210 may have a plurality of suction elements 212 and a rotating element 214. The plurality of suction elements 212 are respectively arranged on the rotating element 214, and the rotating element 214 can rotate around an axis A1, where the axis A1 is, for example, the X axis, the Y axis or the Z axis. After a certain suction element 212 sucks the die 30 and places it on the substrate 50, the rotating element 214 rotates around the axis A1, so that another suction element 212 that has sucked the die 30 is placed at a different position on the substrate 50.

[0038] Please refer back to Figure 5A , in this embodiment, the die acquisition element 220 is arranged above the first surface 112 of the carrier 110. The die acquisition element 220 is used to acquire a die image information M1 of each die 30 on the pick-and-place device 210, and the feature acquisition element 130 is used to acquire a positioning image information M2 of the known feature information 122. It should be noted that the feature acquisition element 130 and the die acquisition element 220 can be image acquisition elements such as charge-coupled devices (CCDs, Charge Coupled Devices), complementary metal-oxide semiconductor (CMOS, Complementary Metal-Oxide Semiconductor) photosensitive elements, etc., but are not limited thereto.

[0039] In this embodiment, the control unit 230 is used to connect the stage 110, the pick-and-place device 210, the die acquisition element 220 and the feature acquisition element 130. The control unit 230 can be implemented by hardware (such as integrated circuits), software (such as program instructions executed by a processor) or a combination thereof.

[0040] Under this configuration, the control unit 230 can provide a moving position information G1 of each die 30 to the pick-and-place device 210, where the moving position information G2 includes rotation along the first direction X (such as the X-axis), the second direction Y (such as the Y-axis), or the third direction Z (such as the Z-axis). In this embodiment, according to the moving position information G1, the pick-and-place device 210 first moves along the first direction X and the second direction Y, so that the die 30 is above the die-bonding surface 52 of the substrate 50. Then, before the pick-and-place device 210 moves in the direction of the substrate 50 (i.e., the third direction Z), the control unit 230 receives and compares the die image information M1 of the die 30 with the corresponding positioning image information M2, and the control unit 230 determines the die position corresponding to the die 30 according to the positioning image information M2. In other words, in this embodiment, by comparing the die image information M1 of each die 30 with the corresponding positioning image information M2, the relative positions of the die 30 on the carrier 110 and the pick-and-place device 210 are adjusted in a timely manner, so that the pick-and-place device 210 can accurately place each die 30 at the die position corresponding to the die-bonding surface 52 of the substrate 50, achieving a more accurate die-bonding operation. Before placing the next die, the control unit 230 provides a moving position information G2 of the carrier 110 to the carrier 110 to move the carrier 110.

[0041] The following Figure 6 is used to illustrate the method for placing dies by the die bonder of the present invention. Please also refer to Figures 1 to 5B . The method S100 for placing dies by the die bonder of the present invention is applicable to a die bonder, and the die bonder can refer to Figure 5A the described components. The method S100 for placing dies by the die bonder of the present invention includes the following steps S110 to S140. First, step S110 is performed, where the substrate 50 and the positioning element 120 are respectively arranged on the first surface 112 and the second surface 114 of the carrier 110, and the positioning element 120 includes a plurality of known feature information 122. In addition, step 110 includes the following steps: setting each known feature information 122 at different positions on the second surface 114 of the carrier 110, where such as Figure 4 , each known feature information 122 corresponds to the die position P where the die is desired to be placed and die-bonded on the substrate 50. In other words, the present invention can design the shape and arrangement of the known feature information 122 on different positioning elements 120 according to the actual die position P where the die is desired to be placed and die-bonded on the substrate 50.

[0042] Next, step S120 is performed, where a die image information M1 of the die 30 on the pick-and-place device 210 and a positioning image information M2 of the known feature information 122 are respectively collected. Such as Figure 5AAs shown, the grain image information M1 of each grain on the pick-and-place device 210 is collected by the grain collection element 220, and the positioning image information M2 of the known feature information 122 is collected by the feature collection element 130. It can be seen that the feature collection element 130 can only collect the known feature information 122 corresponding to the grain position in the positioning element 120, rather than all the known feature information 122 in the positioning element 120. Therefore, the resolution of the collected image can be improved, which is beneficial for accurately judging the grain position of the placed grain subsequently.

[0043] In addition, before step S120, the following steps are further included: According to the position of each grain 30 to be placed on the die bonding surface 52 of the substrate 50, the control unit 230 provides a moving position information G2 of the stage 110 to the stage 110 to move the stage 110, where the moving position information G2 includes moving along the first direction X (such as the X-axis), the second direction Y (such as the Y-axis), and rotating around the third direction Z (such as the Z-axis), etc. In this embodiment, according to the moving position information G2, the stage 110 first moves along the first direction X and the second direction Y. Then, according to the position of each grain 30 to be placed on the die bonding surface 52 of the substrate 50, the control unit 230 can provide a moving position information G1 of each grain 30 to the pick-and-place device 210, where the moving position information G2 includes moving along the first direction X (such as the X-axis), the second direction Y (such as the Y-axis), or rotating around the third direction Z (such as the Z-axis), etc. In this embodiment, according to the moving position information G1, the pick-and-place device 210 first moves along the first direction X and the second direction Y, so that the pick-and-place device 210 moves the grain 30 above the die bonding surface 52.

[0044] Next, step S130 is performed to compare the grain image information M1 of each grain 30 with the corresponding positioning image information M2. As Figure 5A shown, the control unit 230 receives and compares the grain image information M1 of the grain 30 with the corresponding positioning image information M2. Then, step S140 is performed to determine the corresponding grain position of each grain 30 on the substrate 50 according to the positioning image information M2, and the grain 30 is placed on the corresponding grain position of the substrate 50 by the pick-and-place device 210. In other words, in this embodiment, by comparing the grain image information M1 of each grain 30 with the corresponding positioning image information M2, the relative positions of the stage 110 and the grain 30 on the pick-and-place device 210 are adjusted in a timely manner, so that the pick-and-place device 210 can accurately place each grain 30 on the corresponding grain position of the die bonding surface 52 of the substrate 50, achieving a more accurate die bonding operation.

[0045] Specifically, between the above step S130 and step S140, the following steps are included: Detect whether the grain image information M1 deviates from the corresponding positioning image information M2. As Figure 7AAs shown, the grain image information M1 collected by the grain acquisition element 220, and the object C1 is to acquire the image of the grain 30; as Figure 7B As shown, the positioning image information M2 collected by the feature acquisition element 130, and the object C2 is to acquire the image of the known feature information 122. The shape of the known feature information 122 is, for example, a cross, so the object C2 is also an image of a cross. The control unit 230 receives and compares the grain image information M1 of the grain 30 with the corresponding positioning image information M2. If the control unit 230 detects that each grain image information M1 does not deviate from the corresponding positioning image information M2. For example Figure 7C As shown, taking the object C2 (dashed line) of the positioning image information M2 as the comparison reference, if the center position of the object C1 in the grain image information M1 coincides with the center position of the object C2, then the control unit 230 detects that the grain image information M1 does not deviate from the corresponding positioning image information M2. Then, the control unit 230 can provide a movement position information G1 of each grain 30 to the pick-and-place device 210, and place the grain 30 on the corresponding grain position of the substrate 50 in the direction L1 (i.e., the third direction Z) of the substrate through the pick-and-place device 210.

[0046] In another embodiment. As Figure 8A As shown, the grain image information M1 collected by the grain acquisition element 220, and the object C3 is to acquire the image of the grain 30; as Figure 8B As shown, the positioning image information M2 collected by the feature acquisition element 130, and the object C4 is to acquire the image of the known feature information 122. The shape of the known feature information 122 is, for example, a rectangle, so the object C4 is also an image of a rectangle. The control unit 230 receives and compares the grain image information M1 of the grain 30 with the corresponding positioning image information M2. If the control unit 230 detects that each grain image information M1 deviates from the corresponding positioning image information M2.

[0047] For example Figure 8C As shown, taking the object C4 (dashed line) of the positioning image information M2 as the comparison reference, the center position of the object C3 in the grain image information M1 does not coincide with the center position of the object C4, then the control unit 230 detects that the grain image information M1 deviates from the corresponding positioning image information M2. If so, the control unit 230 obtains the offset distance between the grain image information M1 and the corresponding positioning image information M2 as the movement position information G1, G2. Then, according to the movement position information G1, G2, the relative positions of the carrier 110 and the grain 30 on the pick-and-place device 210 are adjusted. It can be seen that in this embodiment, by comparing the grain image information M1 of the grain 30 with the corresponding positioning image information M2, the relative positions of the carrier 110 and the grain 30 on the pick-and-place device 210 are adjusted in a timely manner to achieve a more accurate die bonding operation. For example Figure 8DAs shown, according to the offset distance, as the moving position information G1, the control unit 230 provides the moving position information G2 of the stage 110 to the stage 110, so that the stage 110 moves along a moving direction L2 until the center position of the object C4 in the positioning image information M2 coincides with the center position of the object C4 in the die image information M1. Or, according to the offset distance, as the moving position information G2, the control unit 230 provides the moving position information G1 of each die 30 to the pick-and-place device 210, so that the pick-and-place device 210 moves along a moving direction L3 (opposite to the moving direction L2) until the center position of the object C4 in the die image information M1 coincides with the center position of the object C4 in the positioning image information M2.

[0048] In summary, in the positioning system of the die bonder, the positioning device of the die bonder, and the method for placing dies of the die bonder according to the present invention, the die position where the die is to be placed is determined according to the positioning image information collected for the known feature information arranged on the back of the stage, thereby improving the accuracy during die bonding.

[0049] Furthermore, the present invention can provide a positioning mechanism for die placement without setting positioning elements on the substrate. Therefore, the positioning elements do not need to be removed additionally after die bonding, and the known feature information on the back of the stage of the present invention can be reused, improving the usability.

[0050] In addition, when the stage and the substrate thereon move, the positioning elements arranged on the back of the stage also move synchronously, so that there is no relative position change between the positioning elements and the substrate. Therefore, it can be ensured that the position of each known feature information on the positioning elements relative to the substrate does not change, which can be used as a reference for subsequent die placement and die bonding alignment.

[0051] In addition, the present invention can adjust the relative positions of the dies on the stage and the pick-and-place device in a timely manner according to the comparison of the die image information of each die and the corresponding positioning image information, so as to achieve a more accurate die bonding operation.

[0052] In addition, the present invention does not collect all the known feature information in the positioning elements, but only collects a known feature information corresponding to the die position of each die. Therefore, the resolution of the collected image can be improved, which is beneficial to accurately judging the die position subsequently.

[0053] Although the present invention has been disclosed as above with embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended patent application scope.

Claims

1. A positioning system for a die bonder, applicable to multiple die, characterized in that The positioning system of the die bonder includes: A stage, including a first surface and a second surface opposite to each other; A substrate, disposed on the first surface of the stage; A pick-and-place device, configured to place each of the dies at a die position corresponding to the substrate; A positioning element, disposed on the second surface of the stage, the positioning element including a plurality of known feature information; A die acquisition element, configured to acquire die image information of each of the dies on the pick-and-place device; A feature acquisition element, disposed on the opposite side of the second surface of the stage, configured to acquire positioning image information of each of the known feature information; and A control unit, configured to connect the stage, the pick-and-place device, the die acquisition element, and the feature acquisition element. The control unit receives and compares the die image information of each of the dies with the corresponding positioning image information, and the control unit determines the die position corresponding to each of the dies based on each of the positioning image information, so that the pick-and-place device places each of the dies at the die position corresponding to the substrate.

2. The positioning system of the die bonder according to claim 1, wherein, Each of the known feature information is respectively disposed at different positions on the second surface of the stage, and each of the known feature information corresponds to the die position of the die.

3. The positioning system of the die bonder according to claim 1, characterized in that Each of the known feature information is a protrusion protruding from the second surface of the stage, or an engraving or a mark.

4. The positioning system of the die bonder according to claim 1, characterized in that, Each of the known feature information is a texture having a specific repetitive structure, and the shape of the known feature information includes a line, a character, a rectangle, a triangle, or a cross.

5. The positioning system of the die bonder according to claim 1, characterized in that Only each of the dies is placed on the substrate.

6. A positioning device for a die bonder, applicable to a die bonder for placing a plurality of dies, the die bonder including a pick-and-place device and a substrate, the pick-and-place device being used to place each of the dies at a die position corresponding to the substrate, characterized in that, The positioning device of the die bonder includes: A stage, including a first surface and a second surface opposite to each other, the first surface of the stage being used to dispose the substrate; A positioning element, disposed on the second surface of the stage, the positioning element including a plurality of known feature information, each of the known feature information corresponding to the die position of the die; and A feature acquisition element, disposed on the opposite side of the second surface of the stage, configured to acquire positioning image information of each of the known feature information, wherein based on each of the positioning image information, the pick-and-place device places each of the dies at the die position corresponding to the substrate.

7. The positioning device of the die bonding machine according to claim 6, wherein, Each of the known feature information is respectively disposed at different positions on the second surface of the stage.

8. The positioning device of the die bonder according to claim 6, characterized in that, Each of the known feature information is a protrusion protruding from the second surface of the stage, or an engraving or a mark.

9. The positioning device of the die bonder according to claim 6, characterized in that, Each of the known feature information is a texture having a specific repetitive structure, and the shape of the known feature information includes a line, a character, a rectangle, a triangle, or a cross.

10. A method for placing crystal grains on a die bonder, applicable to a die bonder, the die bonder comprising a stage, a pick-and-place device and a positioning element, the stage including a first surface and a second surface opposite to each other, the pick-and-place device picking and placing each of the crystal grains, characterized in that, The method for placing dies by the die bonder includes the following steps: Respectively dispose a substrate and the positioning element on the first surface and the second surface of the stage, wherein the positioning element includes a plurality of known feature information; Respectively acquire die image information of each of the dies on the pick-and-place device and positioning image information of each of the known feature information disposed on the opposite side of the second surface of the stage; Compare the die image information of each of the dies with the corresponding positioning image information; and Determine the position of each of the grains corresponding to a grain position on the substrate according to each of the positioning image information, and place each of the grains at the corresponding grain position on the substrate by the pick-and-place device.

11. The method for placing a die on a die bonding machine according to claim 10, wherein The step of respectively disposing the substrate and the positioning element on the first surface and the second surface of the stage includes the following steps: Set each of the known feature information at different positions on the second surface of the stage, wherein each of the known feature information corresponds to the grain position of the grain.

12. The method for placing crystal grains in the die bonder according to claim 10, characterized in that, Before the step of respectively collecting the grain image information of each of the grains on the pick-and-place device and the positioning image information of each of the known feature information, the following steps are included: Provide a movement position information of each of the grains to the pick-and-place device; and According to the movement position information, the pick-and-place device moves each of the grains onto the substrate.

13. The method for placing crystal grains in the die bonder according to claim 10, wherein, Before the step of respectively collecting the grain image information of each of the grains on the pick-and-place device and the positioning image information of each of the known feature information, the following steps are included: Provide a movement position information of the stage to the stage; and According to the movement position information, move the stage.

14. The method for placing crystal grains in the die bonder according to claim 10, wherein The step of comparing the grain image information of each of the grains with the corresponding positioning image information includes the following steps: Detect whether each of the grain image information is offset from the corresponding positioning image information; If not, place each of the grains at the corresponding grain position on the substrate in the direction of the substrate by the pick-and-place device; If so, obtain an offset distance between each of the grain image information and the corresponding positioning image information as a movement position information; and According to the movement position information, adjust the relative positions of the stage and the grain on the pick-and-place device.

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