Antenna package and image display device

Abstract

The present invention provides an antenna package and an image display device. The antenna package according to an exemplary embodiment of the present invention includes: a first antenna device including a first antenna unit, the first antenna unit including a first radiator; a second antenna device including a second antenna unit, the second antenna unit including a second radiator with a polarization direction perpendicular to the first radiator; a first circuit board electrically connected to the first antenna unit; a second circuit board electrically connected to the second antenna unit; and a third circuit board on which at least one antenna driving integrated circuit (IC) chip independently electrically connected to the first circuit board and the second circuit board is installed. By supplying power to two antenna devices with different polarization directions respectively, signal interference and signal loss can be prevented, and dual polarization can be achieved.

Description

Technical Field

[0001] The present invention relates to an antenna package and an image display device, and more particularly to an antenna package including an antenna device and a relay structure, and an image display device including the antenna package. Background Art

[0002] Recently, according to the development of information society, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are implemented in the form of smartphones by combining with image display devices. In this case, an antenna can be coupled to the image display device to perform a communication function.

[0003] Recently, as mobile communication technology becomes more advanced, it is necessary to couple an antenna for performing communication in a high frequency band or an ultra-high frequency band corresponding to 3G, 4G, or 5G, for example, to an image display device.

[0004] However, when the driving frequency of the antenna is increased, signal interference and signal loss may increase in the high frequency band or the ultra-high frequency band. In particular, when transmitting / receiving two polarized waves at the same time, the signal efficiency may be further reduced.

[0005] Therefore, it is necessary to design an antenna package that can prevent signal interference and signal loss while achieving high frequency or ultra-high frequency radiation characteristics through the antenna device.

[0006] For example, Korean Patent Publication No. 2013-0095451 discloses an antenna formed integrally with a display panel, but does not consider a structure for improving signal efficiency in a high frequency band or an ultra-high frequency band as described above.

[0007] Prior art literature

[0008] Patent Literature

[0009] Korean Patent Publication No. 2013-0095451 Summary of the invention

[0010] An object of the present invention is to provide an antenna package having improved radiation characteristics and signal efficiency.

[0011] Another object of the present invention is to provide an image display device including an antenna package having improved radiation characteristics and signal efficiency.

[0012] In order to achieve the above object, the present invention adopts the following technical solutions.

[0013] 1. An antenna package, comprising: a first antenna device including a first antenna unit, the first antenna unit including a first radiator; a second antenna device including a second antenna unit, the second antenna unit including a second radiator having a polarization direction perpendicular to the first radiator; a first circuit board electrically connected to the first antenna unit; a second circuit board electrically connected to the second antenna unit; and a third circuit board on which at least one antenna driver integrated circuit (IC) chip independently electrically connected to the first circuit board and the second circuit board is mounted.

[0014] 2. The antenna package according to 1 above, wherein the first antenna device and the second antenna device are located at the same level.

[0015] 3. The antenna package according to 2 above, wherein the first antenna unit includes a plurality of first antenna units arranged in a column direction, and the second antenna unit includes a plurality of second antenna units arranged in a row direction, the row direction being perpendicular to the column direction in the plane direction.

[0016] 4. According to the antenna package of 3 above, one antenna driver IC chip is arranged on the third circuit board.

[0017] 5. The antenna package according to 4 above, wherein the third circuit board includes a first connection wiring electrically connecting the first antenna unit and the antenna driver IC chip, and a second connection wiring electrically connecting the second antenna unit and the antenna driver IC chip.

[0018] 6. The antenna package according to 5 above, wherein the first connection wiring and the second connection wiring extend in directions perpendicular to each other in a planar direction.

[0019] 7. The antenna package according to the above 4 further includes: a first connector, which is arranged on the first circuit board so as to be electrically connected to the first antenna unit; and a second connector, which is arranged on the second circuit board so as to be electrically connected to the second antenna unit.

[0020] 8. According to the antenna package of the above 7, it also includes: a third connector, which is arranged on the third circuit board and coupled with the first connector to electrically connect the first antenna unit and the antenna driver IC chip to each other; and a fourth connector, which is arranged on the third circuit board and coupled with the second connector to electrically connect the second antenna unit and the antenna driver IC chip to each other.

[0021] 9. The antenna package according to 1 above, wherein the first circuit board and the second circuit board are respectively flexible printed circuit boards (FPCBs), and the third circuit board is a rigid printed circuit board.

[0022] 10. The antenna package according to 1 above, wherein the first antenna unit and the second antenna unit are independently and separately disposed on one antenna dielectric layer.

[0023] 11. The antenna package according to 10 above, wherein the first circuit board and the second circuit board are formed as one body with the antenna dielectric layer.

[0024] 12. The antenna package according to 1 above, further comprising a circuit element or a control element mounted on the third circuit board.

[0025] 13. An image display device, comprising: a display panel; and the above antenna package coupled to the display panel.

[0026] 14. The image display device according to 13 above, wherein the first antenna unit and the second antenna unit are independently and separately provided on the top surface of the display panel.

[0027] 15. The image display device according to 14 above, wherein the first antenna unit and the second antenna unit are disposed adjacent to each other, wherein one corner portion of the top surface of the display panel is interposed between the first antenna unit and the second antenna unit.

[0028] 16. The image display device according to 15 above, wherein the first antenna unit is disposed adjacent to a corner along a lengthwise edge of the display panel, and the second antenna unit is disposed adjacent to a corner along a widthwise edge of the display panel.

[0029] 17. An image display device according to 13 above, wherein a third circuit board is arranged below the display panel, and the first circuit board and the second circuit board are each extended from the top surface of the display panel along the side surface and bottom surface of the display panel by bending, thereby being electrically connected to the third circuit board.

[0030] According to an embodiment of the present invention, the first antenna unit included in the first antenna device and the second antenna unit included in the second antenna device can be arranged to have polarization directions perpendicular to each other. Therefore, dual polarization can be achieved while preventing signal interference and signal loss, and the fading phenomenon that causes the signal amplitude and phase of the antenna unit to fluctuate irregularly can be reduced. In addition, for example, since a plurality of antenna devices are arranged separately in space, a resonant frequency of a frequency band with less signal interference can be selected, or a plurality of resonant frequencies can be synthesized and sent / received.

[0031] According to an exemplary embodiment, the first antenna device and the second antenna device can be electrically connected to a third circuit board on which an antenna driving integrated circuit chip is mounted through the first circuit board and the second circuit board, respectively. In addition, according to some embodiments, the first circuit board and the second circuit board can be electrically connected to the third circuit board independently through a connector. Thus, the bonding process and the adhesion process can be omitted, and a stable circuit board connection can be easily achieved.

[0032] The antenna package may be applied to a display device including a mobile communication device capable of transmitting and receiving signals in a 3G, 4G, 5G or higher high frequency band or an ultra-high frequency band, thereby improving optical characteristics such as radiation characteristics and light transmittance. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description made in conjunction with the accompanying drawings, in which:

[0034] Figure 1 and Figure 2 is a schematic plan view of an antenna package according to an exemplary embodiment;

[0035] Figure 3 is a schematic diagram showing dual polarization of an antenna package according to an exemplary embodiment;

[0036] Figure 4 is a schematic cross-sectional view showing an antenna package according to an exemplary embodiment;

[0037] Figure 5 is a plan view showing an image display device according to an exemplary embodiment; and

[0038] Figure 6 and Figure 7 is a schematic plan view of an antenna package and an image display device including the same according to an exemplary embodiment. DETAILED DESCRIPTION

[0039] An embodiment of the present invention provides an antenna package including a circuit board including a plurality of antenna devices and an antenna driving integrated circuit (IC) chip electrically connected to the antenna devices.

[0040] The antenna device may be, for example, a microstrip patch antenna, a monopole antenna, or a dipole antenna manufactured in the form of a transparent film. For example, the antenna device may be applied to a communication device for high frequency or ultra-high frequency (e.g., 3G, 4G, 5G or higher) communication. However, regarding the application of the antenna device, the use of the antenna device is not limited to a display device, and the antenna device may be applied to various structures, such as vehicles, household appliances, buildings, glass windows, etc.

[0041] Furthermore, an embodiment of the present invention provides an image display device including the antenna package.

[0042] Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, since the attached drawings of the present disclosure are given only to illustrate one of the preferred embodiments of the present invention so as to easily understand the technical spirit of the present invention through the above invention, it should not be interpreted as being limited to the description shown in the drawings.

[0043] The terms “upper surface”, “side”, “bottom surface”, “front surface”, “rear surface” and the like used herein do not indicate absolute positions but are used to distinguish relative positions between components.

[0044] Figure 1 and Figure 2 is a schematic plan view of an antenna package according to an exemplary embodiment.

[0045] Reference Figure 1 and Figure 2 The antenna package includes a first antenna device 100, a second antenna device 200, a first circuit board 150 electrically connected to the first antenna device 100, a second circuit board 250 electrically connected to the second antenna device 200, and a third circuit board 300 independently electrically connected to the first circuit board 150 and the second circuit board 250.

[0046] In some embodiments, the first antenna device 100 and the second antenna device 200 may include a first antenna unit 110 and a second antenna unit 210 disposed on an antenna dielectric layer 90 , respectively.

[0047] The antenna dielectric layer 90 may include an insulating material having a predetermined dielectric constant. For example, the antenna dielectric layer 90 may include a foldable transparent resin material having flexibility.

[0048] For example, the antenna dielectric layer 90 may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, polybutylene terephthalate, etc.; cellulose resins such as diacetyl cellulose, triacetyl cellulose, etc.; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate, polyethyl (meth)acrylate, etc.; styrene resins such as polystyrene, acrylonitrile-styrene copolymers, etc.; polyolefin resins such as polyethylene, polypropylene, cyclic olefins or polyolefins having a norbornene structure, ethylene-propylene copolymers, etc.; vinyl chloride resins; amide resins such as nylon, aromatic polyamide; imide resins; polyether sulfonic acid resins; sulfonic acid resins; polyether ether ketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. They may be used alone or in combination of two or more.

[0049] In some embodiments, the antenna dielectric layer 90 may include an adhesive material such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0050] In some embodiments, the antenna dielectric layer 90 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0051] In some embodiments, the dielectric constant of the antenna dielectric layer 90 may be adjusted to be within a range of about 1.5 to 12. When the dielectric constant exceeds about 12, signal loss of the transmission lines 114 and 214 excessively increases, thereby possibly reducing signal sensitivity and signal efficiency during high frequency band communications.

[0052] In some embodiments, the first antenna unit 110 and the second antenna unit 210 may be separately and independently disposed on the top surface of one antenna dielectric layer 90. In this case, for example, a step may be prevented from occurring between a portion where the antenna units 110 and 210 are located and other portions on the image display device described below. Therefore, for example, the display characteristics of the image display device may be stably and consistently achieved.

[0053] For example, a plurality of first antenna units 110 may be arranged in an array along a column direction of the first antenna device 100 to form a column of first antenna units 110 .

[0054] For example, a plurality of second antenna units 210 may be arranged in an array along a horizontal direction perpendicular to the vertical direction to form a horizontal row of second antenna units 210 .

[0055] In some embodiments, the vertical column of first antenna elements 110 and the horizontal row of second antenna elements 210 may partially overlap or be spaced apart from each other in the vertical column direction on antenna dielectric layer 90 .

[0056] For example, among the second antenna units 210 in the horizontal row of the second antenna units 210, the second antenna unit 210 closest to the vertical column of the first antenna unit 110 may be arranged to partially or completely overlap with the first antenna unit 110 in the vertical column of the first antenna unit 110 in the vertical column direction on the antenna dielectric layer 90. In this case, the arrangement efficiency of the antenna units 110 and 210 may be improved, so that the volume of the antenna package may be reduced. Therefore, the space efficiency of the image display device may be improved by reducing the area occupied by the antenna package in the image display device described below.

[0057] For example, among the second antenna units 210 in the horizontal row of the second antenna units 210, the second antenna unit 210 closest to the vertical column of the first antenna unit 110 may be arranged to be spaced apart from the first antenna unit 110 in the vertical column of the first antenna unit 110 by a predetermined distance in the horizontal row direction on the antenna dielectric layer 90 and not overlapped in the vertical column direction. In this case, signal interference and disturbance between the antenna units 110 and 210 may be reduced. Therefore, the antenna gain of the antenna units 110 and 210 may be improved.

[0058] The first antenna unit 110 of the first antenna device 100 may include a first radiator 112 and a first transmission line 114. The second antenna unit 210 of the second antenna device 200 may include a second radiator 212 and a second transmission line 214. The radiators 112 and 212 may have, for example, a polygonal flat plate shape, and the first transmission line 114 and the second transmission line 214 may extend from one side of the first radiator 112 and the second radiator 212, respectively. The transmission lines 114 and 214 may be integrally formed with the radiators 112 and 212 as a substantially single member.

[0059] According to an exemplary embodiment, the radiators 112 and 212 can provide signal transmission / reception in a high frequency band or an ultra-high frequency band (e.g., 3G, 4G, 5G or higher). As a non-limiting example, the resonant frequency of the antenna units 110 and 210 can be approximately 24 to 29.5 GHz and / or approximately 37 to 45 GHz.

[0060] In an exemplary embodiment, the second antenna device 200 may be located at the same level as the first antenna device 100 , and the polarization direction of the second antenna unit 210 may be perpendicular to the polarization direction of the first antenna unit 110 .

[0061] For example, the first antenna unit 110 and the second antenna unit 210 may be arranged on the antenna dielectric layer 90 so that the polarization directions of the first radiator 112 and the second radiator 212 are perpendicular to each other. For example, one of the radiators 112 and 212 may be vertically polarized and the other may be horizontally polarized.

[0062] For example, two antenna units 110 and 210 having polarization directions perpendicular to each other can be powered independently. Therefore, dual polarization can be achieved while preventing signal interference and signal loss, and reducing fading that causes the signal amplitude and phase of the antenna units to fluctuate irregularly.

[0063] In addition, for example, since a plurality of antenna devices are spatially separated, it is possible to select a resonant frequency of a frequency band with less signal interference, or synthesize and transmit / receive a plurality of resonant frequencies.

[0064] In some embodiments, the first radiator 112 and the second radiator 212 may be formed to have the same area and shape. In this case, dual polarization may be achieved while preventing signal interference and signal loss by spatially separating the arrangement of the antenna units 110 and 210 having the same resonant frequency.

[0065] In some embodiments, radiators 112 and 212 can control the resonant frequency capable of driving the antenna by adjusting the area of ​​each radiator.

[0066] For example, the first antenna unit 110 of the first antenna device 100 and the second antenna unit 210 of the second antenna device 200 may be formed to have different areas and / or shapes, and thus may have different resonant frequencies. In this case, for example, two different types of signal transmission / reception may be implemented in one antenna package, so that high frequency or ultra-high frequency and broadband signal transmission / reception may be implemented through dual polarization.

[0067] The first antenna unit 110 and the second antenna unit 210 may further include a first signal pad 116 and a second signal pad 216, respectively. The first signal pad 116 and the second signal pad 216 may be connected to one end of each of the first transmission line 114 and the second transmission line 214.

[0068] In some embodiments, the first signal pad 116 and the second signal pad 216 may be provided as an integral component with the first transmission line 114 and the second transmission line 214, respectively, and the distal ends of the first transmission line 114 and the second transmission line 214 may be provided as the first signal pad 116 and the second signal pad 216, respectively.

[0069] According to some embodiments, a first ground pad 118 and a second ground pad 218 may be disposed around the first signal pad 116 and the second signal pad 216, respectively. For example, a pair of first ground pads 118 may be disposed to face each other with the first signal pad 116 interposed therebetween. In addition, a pair of second ground pads 218 may be disposed to face each other with the second signal pad 216 interposed therebetween. The first ground pad 118 may be electrically and physically separated from the first transmission line 114 and the first signal pad 116. The second ground pad 218 may be electrically and physically separated from the second transmission line 214 and the second signal pad 216. Therefore, the noise generated when the radiation signal is transmitted / received through the signal pads 116 and 216 may be effectively filtered or reduced.

[0070] In this case, the first ground pad 118 and the second ground pad 218 may also be respectively provided as ground layers of the first radiator 112 and the second radiator 212 , and vertical radiation may be achieved through the radiators 112 and 212 .

[0071] In some embodiments, a separate ground layer may be formed under the radiators 112 and 212 , and a conductive member of the display device on which the antenna device is mounted may be provided as a ground layer for the radiators 112 and 212 .

[0072] The conductive member may include, for example, a gate electrode of a thin film transistor (TFT) included in the display panel, various wirings such as a scan line or a data line, or various electrodes such as a pixel electrode, a common electrode, and the like.

[0073] In one embodiment, for example, various structures including conductive materials disposed below the display panel may be provided as a ground layer. For example, a metal plate (e.g., a stainless steel (SUS) plate), a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, a digital converter, etc. may be provided as a ground layer.

[0074] The antenna units 110 and 210 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), molybdenum (Mo), tin (Sn), calcium (Ca), or an alloy containing at least one thereof. They may be used alone or in combination of two or more.

[0075] For example, the antenna units 110 and 210 may include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC) alloy) to achieve low resistance. In some embodiments, the antenna units 110 and 210 may include copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa) alloy) in consideration of low resistance and fine line width patterns.

[0076] In some embodiments, the antenna elements 110 and 210 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), or zinc oxide (ZnOx).

[0077] In some embodiments, the antenna units 110 and 210 may include a stacked structure of a transparent conductive oxide layer and a metal layer, for example, a double-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer can improve the signal transmission speed by reducing the resistance while improving the flexibility, and the transparent conductive oxide layer can improve the corrosion resistance and transparency.

[0078] The antenna units 110 and 210 may each include a blackened portion, thereby reducing the surface reflectivity of the antenna units 110 and 210, thereby reducing the pattern from being seen due to light reflection.

[0079] In one embodiment, the surface of the metal layer included in the antenna units 110 and 210 may be converted into a metal oxide or a metal sulfide to form a black layer. In one embodiment, a black layer, such as a black material coating or plating, may be formed on the antenna units 110 and 210 or the metal layer. Here, the black material coating or plating may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or oxides, sulfides, or alloys containing at least one thereof.

[0080] The composition and thickness of the blackened layer may be adjusted in consideration of the effect of reducing the reflectivity.

[0081] In some embodiments, the radiators 112 and 212 and the transmission lines 114 and 214 may include a mesh pattern structure to improve light transmittance. In this case, a dummy mesh electrode (not shown) may be formed around the first radiator 112 and the first transmission line 114 and around the second radiator 212 and the second transmission line 214.

[0082] Considering the reduction of power supply resistance, the improvement of noise absorption efficiency, and horizontal radiation characteristics, the signal pads 116 and 216 and the ground pads 118 and 218 may be formed as a solid structure made of the above-mentioned metal or alloy.

[0083] In some embodiments, the radiators 112 and 212 have a mesh pattern structure, and the transmission lines 114 and 214 , the signal pads 116 and 216 , and the ground pads 118 and 218 may be formed as solid metal patterns.

[0084] In this case, the radiators 112 and 212 are disposed in a display area of ​​the image display device, and the transmission lines 114 and 214 , the signal pads 116 and 216 , and the ground pads 118 and 218 may be disposed in a non-display area or a bezel area of ​​the image display device.

[0085] In an exemplary embodiment, the first circuit board 150 may include a first core layer 160 and a first signal wiring 170 formed on a surface of the first core layer 160. The second circuit board 250 may include a second core layer 260 and a second signal wiring 270 formed on a surface of the second core layer 260. For example, the first circuit board 150 and the second circuit board 250 may be flexible printed circuit boards (FPCBs), respectively.

[0086] In some embodiments, the antenna dielectric layer 90 may be provided as the first circuit board 150. In this case, the first circuit board 150 (e.g., the first core layer 160 of the first circuit board 150) may be provided as a member substantially integral with the antenna dielectric layer 90. In addition, the first signal wiring 170 described below is directly connected to the first transmission line 114, so that the first signal pad 116 and the first ground pad 118 may be omitted.

[0087] In some embodiments, the antenna dielectric layer 90 may be provided as a second circuit board 250. In this case, the second circuit board 250 (e.g., the second core layer 260 of the second circuit board 250) may be provided as a member substantially integral with the antenna dielectric layer 90. In addition, the second signal wiring 270 described below is directly connected to the second transmission line 214, so that the second signal pad 216 and the second ground pad 218 may be omitted.

[0088] The first core layer 160 and the second core layer 260 may include, for example, a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. The first core layer 160 and the second core layer 260 may include inner insulating layers included in the first circuit board 150 and the second circuit board 250, respectively.

[0089] For example, the first signal wiring 170 and the second signal wiring 270 may be provided as power supply lines. Specifically, the first signal wiring 170 and the second signal wiring 270 may be provided on one surface of each of the first core layer 160 and the second core layer 260 (eg, surfaces of each of the antenna units 110 and 210 facing each other).

[0090] For example, the first circuit board 150 may further include a first cover film formed on one surface of the first core layer 160 to cover the first signal wiring 170. For example, the second circuit board 250 may further include a second cover film formed on one surface of the second core layer 260 to cover the second signal wiring 270.

[0091] In some embodiments, the extension direction of the first core layer 160 and the first signal wiring 170 may be formed to be perpendicular to the extension direction of the second core layer 260 and the second signal wiring 270. In this case, the polarization direction of the first antenna unit 110 powered by the first signal wiring 170 and the polarization direction of the second antenna unit 210 powered by the second signal wiring 270 may be formed to be perpendicular to each other. Therefore, dual polarization can be achieved while preventing signal interference and signal loss, and the fading phenomenon that causes the signal amplitude and phase of the antenna unit to fluctuate irregularly can be reduced.

[0092] The first signal wiring 170 and the second signal wiring 270 may be connected or bonded to the first signal pad 116 of the first antenna unit 110 and the second signal pad 216 of the second antenna unit 210, respectively. For example, the first cover film and the second cover film of the first circuit board 150 and the second circuit board 250 may be partially removed to expose one end of each of the first signal wiring 170 and the second signal wiring 270. The exposed ends of the first signal wiring 170 and the second signal wiring 270 may be adhered to the first signal pad 116 and the second signal pad 216, respectively.

[0093] For example, after a conductive adhesive structure such as anisotropic conductive film (ACF) is attached to the first signal pad 116 and the second signal pad 216, respectively, the bonding areas of the first circuit board 150 and the second circuit board 250, where one end of each of the first antenna signal wiring 170 and the second antenna signal wiring 270 is located, may be respectively disposed on the conductive adhesive structure. Thereafter, the bonding areas of the first circuit board 150 and the second circuit board 250 may be respectively attached to the first antenna device 100 and the second antenna device 200 through a heat treatment / pressing process, and the first signal wiring 170 and the second signal wiring 270 may be respectively electrically connected to the first signal pad 116 and the second signal pad 216.

[0094] like Figure 1 and Figure 2 As shown, the first signal wiring 170 can be independently connected or bonded to each first signal pad 116 of the first antenna unit 110. The second signal wiring 270 can be independently connected or bonded to each second signal pad 216 of the second antenna unit 210. In this case, the power supply signal and the control signal can be independently provided from the first antenna driver integrated circuit (IC) chip 310 to the first antenna unit 110 and the second antenna unit 210, respectively.

[0095] In some embodiments, a predetermined number of first antenna units 110 may be coupled to each other through a first signal wiring 170 , and a predetermined number of second antenna units 210 may be coupled to each other through a second signal wiring 270 .

[0096] In some embodiments, the first circuit board 150 and the second circuit board 250 may be formed integrally with the antenna dielectric layer 90. For example, the first core layer 160 and the second core layer 260 may be formed integrally with the antenna dielectric layer 90 using substantially the same member. Therefore, a separate heating and pressing process such as bonding or attachment is not required, thereby preventing signal loss and mechanical damage in the antenna devices 100 and 200 that may be caused by the heating and pressing process.

[0097] In some embodiments, the first circuit board 150 or the first core layer 160 may include a first portion 163 and a second portion 165 having different widths, and the second portion 165 may have a reduced width compared to the first portion 163. The second circuit board 250 or the second core layer 260 may include a third portion 263 and a fourth portion 265 having different widths, and the fourth portion 265 may have a reduced width compared to the third portion 263.

[0098] For example, the first portion 163 and the third portion 263 may be provided as main substrate portions of the first circuit board 150 and the second circuit board 250, respectively. One end of each of the first portion 163 and the third portion 263 includes a bonding region. For example, the first signal wiring 170 may extend from the bonding region toward the second portion 165 on the first portion 163. For example, the second signal wiring 270 may extend from the bonding region toward the fourth portion 265 on the third portion 263.

[0099] The first signal wiring 170 may include a bent portion located on the first portion 163, as shown in a dotted circle, and the second signal wiring 270 may include a bent portion located on the third portion 263. Therefore, the first signal wiring 170 may extend at a smaller interval or a greater wiring density than the first portion 163 on the second portion 165 having a relatively narrow width, and the second signal wiring 270 may extend at a smaller interval or a greater wiring density than the third portion 263 on the fourth portion 265 having a relatively narrow width.

[0100] The first circuit board 150 and the second circuit board 250 mentioned above may be electrically connected to the third circuit board 300 .

[0101] In some embodiments, the second portion 165 of the first antenna device 100 and the fourth portion 265 of the second antenna device 200 may be provided as a connector connection portion. For example, the second portion 165 and the fourth portion 265 may be bent toward the rear of the image display device to be electrically connected to the third circuit board 300. Therefore, the circuit connection of the first signal wiring 170 and the second signal wiring 270 may be easily achieved by using the second portion 165 and the fourth portion 265 having a reduced width.

[0102] In addition, the bonding stability of the first circuit board 150 and the first antenna device 100 can be improved by the first portion 163 having an increased width, and the bonding stability of the second circuit board 250 and the second antenna device 200 can be improved by the third portion 263 having an increased width. When the antenna units 110 and 210 of the antenna devices 100 and 200 are arranged in an array form, sufficient distribution space for the signal wirings 170 and 270 can be provided by the first portion 163 and the third portion 263.

[0103] According to an exemplary embodiment, the first circuit board 150 and the third circuit board 300 may be electrically connected to each other through the first-third circuit board connection connector 180. The second circuit board 250 and the third circuit board 300 may be electrically connected to each other through the second-third circuit board connection connector 280.

[0104] In some embodiments, the first-third circuit board connection connector 180 and the second-third circuit board connection connector 280 are configured as board-to-board (B2B) connectors. In addition, the first-third circuit board connection connector 180 may include a first connector 183 and a third connector 185, and the second-third circuit board connection connector 280 may include a second connector 283 and a fourth connector 285.

[0105] For example, the first-third circuit board connection connector 180 may be mounted on the second portion 165 of the first circuit board 150 by surface mounting technology (SMT) to be electrically connected to the distal end portion of the first signal wiring 170. For example, the second-third circuit board connection connector 280 may be mounted on the fourth portion 265 of the second circuit board 250 by surface mounting technology (SMT) to be electrically connected to the distal end portion of the second signal wiring 270.

[0106] In an exemplary embodiment, the third circuit board 300 may be a main board of the image display device, and may be a rigid printed circuit board. For example, the third circuit board 300 may include a resin (e.g., epoxy resin) layer (e.g., prepreg) impregnated with an inorganic material (e.g., glass fiber) as a base insulating layer, and may include circuit wiring distributed on a surface of the base insulating layer and inside thereof.

[0107] In an exemplary embodiment, at least one antenna driving IC chip 310 may be mounted on the third circuit board 300 .

[0108] In some embodiments, one antenna driving IC chip 310 may be mounted on the third circuit board 300. In this case, the plurality of antenna units 110 and 210 may be electrically connected to one antenna driving IC chip 310. Thus, the antenna units 110 and 210 having different polarization directions may be driven by power provided from one antenna driving IC chip 310, and dual polarization in a high frequency band or an ultra-high frequency band may be stably implemented while preventing signal loss and signal interference.

[0109] In some embodiments, the antenna driving IC chip 310 may be separately disposed on the third circuit board 300 , and may be electrically connected to the first circuit board 150 and the second circuit board 250 .

[0110] In some embodiments, the third connector 185 can be electrically connected to the antenna driver IC chip 310 via a first connection wiring 313 included in the third circuit board 300, and the fourth connector 285 can be electrically connected to the antenna driver IC chip 310 via a second connection wiring 315 included in the third circuit board 300.

[0111] In some embodiments, the first connection wiring 313 and the second connection wiring 315 may extend in directions perpendicular to each other in a plane direction. Thus, the space efficiency of the antenna package and the display device described below may be improved while achieving dual polarization to prevent signal interference.

[0112] like Figure 2 As shown by the arrows in the figure, the first connector 183 mounted on the first circuit board 150 and the third connector 185 mounted on the third circuit board 300 may be coupled to each other, and the second connector 283 mounted on the second circuit board 250 and the fourth connector 285 mounted on the third circuit board 300 may be coupled to each other. For example, the first connector 183 and the second connector 283 may be provided as plug connectors, and the third connector 185 and the fourth connector 285 may be provided as socket connectors.

[0113] Therefore, the connection between the first circuit board 150 and the third circuit board 300 and the electrical connection between the antenna driving IC chip 310 and the first antenna unit 110 may be realized through the first-third circuit board connection connector 180. In addition, the connection between the second circuit board 250 and the third circuit board 300 and the electrical connection between the antenna driving IC chip 310 and the second antenna unit 210 may be realized through the second-third circuit board connection connector 280.

[0114] Therefore, power supply / control signals (eg, phase, beam tilt signals, etc.) from one antenna driving IC chip 310 may be separately and independently applied to the first antenna unit 110 and the second antenna unit 210 .

[0115] In addition, a relay structure electrically connected to the first circuit board 150, the first-third circuit board connection connector 180 and the third circuit board 300, and a relay structure electrically connected to the second circuit board 250, the second-third circuit board connection connector 280 and the third circuit board 300 may be formed.

[0116] In some embodiments, as described above, the first circuit board 150, the second circuit board 250, and the third circuit board 300 may be electrically coupled to each other using the connectors 180 and 280. Therefore, the first circuit board 150, the second circuit board 250, and the third circuit board 300 may be easily coupled to each other using the connectors 180 and 280 without an additional heating or pressing process such as an adhering process, a bonding process, or the like.

[0117] Therefore, it is possible to suppress dielectric loss due to thermal damage of the substrate and resistance increase due to wiring damage caused in the heating and pressing process, and suppress signal loss in the antenna units 110 and 210.

[0118] In some embodiments, the connection of the first circuit board 150 to the third circuit board 300 and the connection of the second circuit board 250 to the third circuit board 300 may be achieved through a heating and pressing process such as an adhering process and a bonding process.

[0119] In this case, for example, the antenna driving IC chip 310 and the first signal wiring 170 are electrically connected through the first connection wiring 313 provided on the third circuit board 300, so that power supply and drive control can be performed on the first antenna device 100. In addition, for example, the antenna driving IC chip 310 and the second signal wiring 270 are electrically connected through the second connection wiring 315 provided on the third circuit board 300, so that power supply and drive control can be performed on the second antenna device 200.

[0120] In some embodiments, in addition to the antenna driving IC chip 310, a circuit element 320 and a control element 330 may be mounted on the third circuit board 300. The circuit element 320 may include, for example, a capacitor, such as a multilayer ceramic capacitor (MLCC), an inductor, a resistor, etc. The control element 330 may include, for example, a touch sensor driving IC chip, an application processor (AP) chip, etc.

[0121] Figure 3 is a schematic diagram illustrating dual polarization of an antenna package according to an exemplary embodiment.

[0122] Specifically, Figure 3 It can be a schematic diagram of dual polarization with two antenna devices arranged with polarization directions perpendicular to each other. The polarization direction can, for example, represent the vibration direction of the wave when it travels, and Figure 3 The electric field direction may indicate the direction in which the electric field is formed.

[0123] Reference Figure 3 , the first antenna device 100 and the second antenna device 200 can be connected with Figure 3 The two antenna arrangements of are arranged similarly and in this case dual polarization can be achieved.

[0124] Figure 4 is a schematic cross-sectional view illustrating an antenna package according to an exemplary embodiment.

[0125] Reference Figure 4 According to some embodiments, the first antenna device 100 and the second antenna device 200 may be disposed on the top surface of the display panel 405 of the image display device described below. Figure 4 , for convenience of description, the second antenna device 200, the second circuit board 250, and the second-third circuit board connecting connector 280 are not shown.

[0126] In some embodiments, the first antenna unit 110 of the first antenna device 100 and the second antenna unit 210 of the second antenna device 200 may be separately disposed on the top surface of the display panel 405 .

[0127] In some embodiments, the first circuit board 150 electrically connected to the first antenna device 100 and the second circuit board 250 electrically connected to the second antenna device 200 may extend by bending from the top surface of the display panel 405 along the side and bottom surfaces thereof, respectively.

[0128] In this case, in some embodiments, the first connector 183 may be fastened to the third connector 185 mounted on the third circuit board 300 by bending the second portion 165 having a relatively narrow width of the first circuit board 150, and the second connector 283 may be fastened to the fourth connector 285 mounted on the third circuit board 300 by bending the fourth portion 265 having a relatively narrow width of the second circuit board 250. Therefore, electrical connection between the third circuit board 300 disposed under the display panel 405 and the first circuit board 150 and the second circuit board 250 may be easily achieved.

[0129] Figure 5 is a plan view showing an image display device according to an exemplary embodiment.

[0130] Reference Figure 5 , the image display device 400 may be implemented in the form of a smart phone, for example. Figure 4 The front or window surface of the image display device 400 is shown. The front of the image display device 400 may include a display area 410 and a peripheral area 420. For example, the peripheral area 420 may correspond to a light shielding portion or a frame portion of the image display device.

[0131] Figure 6 and Figure 7 is a schematic plan view of an antenna package and an image display device including the antenna package according to an exemplary embodiment. For ease of description, Figure 6 and Figure 7 It may be a plan view shown by enlarging components included in the antenna package relative to the size actually occupied in the image display device.

[0132] Reference Figure 6 and Figure 7 , the first antenna device 100 and the second antenna device 200 included in the above-mentioned antenna package may be disposed toward the front of the image display device 400, and may be disposed, for example, on the top surface of the display panel 405. In some embodiments, the first radiator 112 and the second radiator 212 may partially or completely overlap the display area 410.

[0133] In this case, the first radiator 112 and the second radiator 212 may include a mesh pattern structure, and a reduction in transmittance due to the first radiator 112 and the second radiator 212 may be prevented. The signal pads 116 and 216 and the ground pads 118 and 218 included in the first antenna unit 110 and the second antenna unit 210 are formed as solid metal patterns and may be disposed in the peripheral area 420 to prevent image quality from being deteriorated.

[0134] In some embodiments, the first circuit board 150 may be disposed on the rear of the image display device 400 , for example, by bending the second portion 165 , and may extend toward the third circuit board 300 (eg, main board) on which the antenna driving IC chip 310 is mounted.

[0135] In some embodiments, the second circuit board 250 can be set on the rear of the image display device 400, for example, by bending the fourth portion 265 from the side of the image display device 400 or extending it from the rear of the image display device 400, and can extend toward the third circuit board 300 (e.g., a main board) on which the antenna driving IC chip 310 is mounted.

[0136] In some embodiments, the first circuit board 150 and the third circuit board 300 are connected to each other via the first-third circuit board connection connector 180 , so that the first antenna device 100 can be powered and driven by the antenna driving IC chip 310 .

[0137] In some embodiments, the second circuit board 250 and the third circuit board 300 are connected to each other via the second-third circuit board connection connector 280 , so that the second antenna device 200 can be powered and driven by the antenna driving IC chip 310 .

[0138] In some embodiments, the first antenna unit 110 and the second antenna unit 210 may be disposed adjacent to each other with one corner portion of the top surface of the display panel 405 of the image display device 400 interposed therebetween.

[0139] For example, the first antenna unit 110 may be disposed near a corner along a lengthwise edge of the display panel 405 , and the second antenna unit 210 may be disposed near a corner along a widthwise edge of the display panel 405 .

[0140] Therefore, the radiators 112 and 212 may have polarization directions perpendicular to each other. In addition, the signal loss may be suppressed by reducing the total length of the first circuit board 150 and the second circuit board 250 and the signal wirings 170 and 270, thereby improving the signal efficiency of the antenna device. In addition, the area occupied by the antenna devices 100 and 200 in the image display device 400 may be reduced, thereby improving the space efficiency of the image display device 400.

[0141] As described above, the two antenna devices of an antenna package can be arranged to have polarization directions perpendicular to each other by being spatially separated, thereby realizing an antenna package that minimizes signal interference and signal loss while achieving dual polarization and multi-axis radiation in high or ultra-high frequency bands.

[0142] Description of Reference Numerals

[0143] 90: Antenna dielectric layer

[0144] 100: First antenna device

[0145] 110: First antenna unit

[0146] 112: First Radiator

[0147] 114: First Transmission Line

[0148] 116: First signal pad

[0149] 118: First ground pad

[0150] 150: First circuit board

[0151] 160: First core layer

[0152] 170: First signal wiring

[0153] 180: First-third circuit board connection connector

[0154] 200: Second Antenna Device

[0155] 210: Second antenna unit

[0156] 212: Second radiator

[0157] 214: Second transmission line

[0158] 216: Second signal pad

[0159] 218: Second ground pad

[0160] 250: Second circuit board

[0161] 260: Second core layer

[0162] 270: Second signal wiring

[0163] 280: Second-third circuit board connection connector

[0164] 300: The third circuit board

[0165] 310: Antenna driver integrated circuit (IC) chip

[0166] 313: First connection wiring

[0167] 315: Second connection wiring

[0168] 320: Circuit components

[0169] 330: Control elements

[0170] 400: Image display device

Claims

1. An antenna package, It is characterized in that It includes: a first antenna arrangement comprising a first antenna element, the first antenna element comprising a first radiator; A second antenna device comprising a second antenna unit, wherein the second antenna unit comprises a second radiator having a polarization direction perpendicular to that of the first radiator; a first circuit board, electrically connected to the first antenna unit; a second circuit board, electrically connected to the second antenna unit; a third circuit board on which is mounted at least one antenna driving integrated circuit chip independently electrically connected to the first circuit board and the second circuit board; A first connector, which is arranged on the first circuit board so as to be electrically connected to the first antenna unit; a second connector, which is disposed on the second circuit board so as to be electrically connected to the second antenna unit; a third connector, which is disposed on the third circuit board and coupled to the first connector to electrically connect the first antenna unit and the antenna driving integrated circuit chip to each other; as well as A fourth connector is disposed on the third circuit board and coupled to the second connector to electrically connect the second antenna unit and the antenna driving integrated circuit chip to each other.

2. The antenna package according to claim 1, It is characterized in that The first antenna arrangement and the second antenna arrangement are located at the same level.

3. The antenna package according to claim 2, It is characterized in that The first antenna unit includes a plurality of first antenna units arranged in a column direction, and The second antenna unit includes a plurality of second antenna units arranged in a horizontal row direction, and the horizontal row direction is perpendicular to the vertical column direction in a plane direction.

4. The antenna package according to claim 3, It is characterized in that One of the antenna driving integrated circuit chips is disposed on the third circuit board.

5. The antenna package according to claim 4, It is characterized in that The third circuit board includes a first connection wiring electrically connecting the first antenna unit and the antenna driving integrated circuit chip, and a second connection wiring electrically connecting the second antenna unit and the antenna driving integrated circuit chip.

6. The antenna package according to claim 5, It is characterized in that The first connection wiring and the second connection wiring extend in directions perpendicular to each other in a planar direction.

7. The antenna package according to claim 1, It is characterized in that The first circuit board and the second circuit board are respectively flexible printed circuit boards, and the third circuit board is a rigid printed circuit board.

8. The antenna package according to claim 1, It is characterized in that The first antenna unit and the second antenna unit are independently and separately arranged on an antenna dielectric layer.

9. The antenna package according to claim 8, It is characterized in that The first circuit board and the second circuit board are formed integrally with the antenna dielectric layer.

10. The antenna package according to claim 1, It is characterized in that It also includes circuit elements or control elements mounted on the third circuit board.

11. An image display device, It is characterized in that It includes: Display panel; as well as The antenna package according to claim 1 coupled to the display panel.

12. The image display device according to claim 11, It is characterized in that The first antenna unit and the second antenna unit are independently and separately disposed on a top surface of the display panel.

13. The image display device according to claim 12, It is characterized in that The first antenna unit and the second antenna unit are disposed adjacent to each other, with one corner portion of the top surface of the display panel interposed between the first antenna unit and the second antenna unit.

14. The image display device according to claim 13, It is characterized in that The first antenna unit is disposed adjacent to the corner portion along a lengthwise edge of the display panel, and the second antenna unit is disposed adjacent to the corner portion along a widthwise edge of the display panel.

15. The image display device according to claim 11, It is characterized in that The third circuit board is arranged below the display panel, and The first circuit board and the second circuit board are each extended from the top surface of the display panel along the side surface and the bottom surface of the display panel by being bent, thereby being electrically connected to the third circuit board.

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