Antenna package structure and method of manufacturing an antenna package structure

Abstract

The application provides an antenna packaging structure and a manufacturing method thereof. The antenna and the chip are arranged on two sides of a substrate layer. The antenna layer is composed of an antenna support, a first antenna layer above the antenna support and a second antenna layer below the antenna support. The antenna support and the antenna layer interlayer medium are made of low dielectric loss materials, thereby forming a heterogeneous antenna structure to reduce current leakage, stray capacitance and other problems caused by dielectric loss in the packaging structure and to reduce the size of the antenna packaging structure.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and more specifically to an antenna packaging structure and a method for manufacturing the antenna packaging structure. Background Technology

[0002] With the popularization of high-tech electronic products and the increase in people's demands, especially to meet the needs of mobility, most high-tech electronic products have added wireless communication functions. Currently, wireless communication devices typically include an antenna module and one or more integrated circuits. Antenna modules and integrated circuits can be arranged in several different ways (e.g., antenna in package (AIP), antenna on package (AOP), antenna on chip (AOC), etc.).

[0003] Electrical signals between antenna modules and integrated circuits typically require transmission through one or more conductive lines and / or one or more vias. These lines and vias are made of or filled with conductive materials and are in contact with and / or at least partially surrounded by dielectric materials. Because conventional dielectric materials (such as silicon or molding compounds) have high dielectric losses, problems such as current leakage and stray capacitance are prone to occur. Furthermore, due to the limitations of conventional dielectric materials, the reliability of the packaging structure under conditions such as high temperature and high pressure is poor, and it is not conducive to the miniaturization of the packaging structure. Summary of the Invention

[0004] The purpose of this invention is to provide an antenna packaging structure and a method for manufacturing the antenna packaging structure.

[0005] This invention provides an antenna packaging structure, which includes: a substrate layer, at least one antenna support, a first antenna layer, a molding compound, and at least one chip;

[0006] The substrate layer includes at least one chip circuit layer, at least one antenna control layer and at least one second antenna layer stacked sequentially, wherein the dielectric loss tangent of the interlayer dielectric of the second antenna layer is less than 0.01.

[0007] The antenna support is disposed on the second antenna layer, and its dielectric loss tangent is less than 0.01;

[0008] The first antenna layer is disposed on the antenna support member and is electrically connected to the second antenna layer through electromagnetic radiation or physical contact.

[0009] The chip is disposed on the chip circuit layer relative to the antenna support;

[0010] The molding compound covers the substrate layer, the antenna support, the first antenna layer, and the chip.

[0011] As a further improvement of the present invention, the antenna support is one or more of an organic composite substrate, a glass component, and a low-temperature co-fired ceramic component.

[0012] As a further improvement of the present invention, at least the interlayer dielectric material of the second antenna layer is a resin with a dielectric constant of not more than 3.9 or a filler-filled polymer dielectric material.

[0013] As a further improvement of the present invention, the antenna control layer includes antenna signal control lines and antenna signal transmission and reception lines.

[0014] As a further improvement of the present invention, the upper surface of the antenna support is further provided with a first moisture barrier layer, the first moisture barrier layer covering the first antenna layer and exposed to or embedded in the encapsulation layer.

[0015] As a further improvement of the present invention, the antenna packaging structure further includes interconnection structures disposed on the second antenna layer and / or the chip circuit layer, wherein the interconnection structures on the second antenna layer are at least electrically connected to the ground line of the substrate layer, and the interconnection structures on the chip circuit layer are electrically connected to the substrate layer.

[0016] As a further improvement of the present invention, the interconnect structure includes a main body made of dielectric material and a conductive hole located at least inside the main body and communicating with its upper and lower surfaces. The conductive hole is provided with a metal connector or conductive filler to be electrically connected to at least the ground line layer. The interconnect structure located on one side of the second antenna layer is distributed between the gaps in the antenna support and its periphery.

[0017] As a further improvement of the present invention, the portion of the interconnect structure located on both sides of the packaging structure is further provided with a lateral antenna layer, the lateral antenna layer being disposed toward the side edge of the antenna packaging structure.

[0018] As a further improvement of the present invention, the sidewall of the interconnect structure is provided with a heat dissipation structure and / or a second moisture barrier layer, the second moisture barrier layer being exposed to or embedded outside the encapsulation layer.

[0019] As a further improvement of the present invention, the molding layer includes a first molding layer and a second molding layer. The first molding layer covers at least the upper surface of the substrate layer, the side surface of the antenna support, the side surface of the interconnect structure, and the first antenna layer. The second molding layer covers at least the side surface of the chip and the side surface of the interconnect structure. The first molding layer and the second molding layer are made of different materials.

[0020] As a further improvement of the present invention, the antenna packaging structure is further provided with an electromagnetic shielding layer outside the plastic encapsulation layer. The electromagnetic shielding layer covers at least the chip and the chip circuit layer laterally. The electromagnetic shielding layer includes: an adhesive layer attached to the plastic encapsulation layer, a protective layer exposed to air, and a main shielding layer disposed between the adhesive layer and the protective layer. The sidewall of the interconnect structure is provided with a metal structure. The metal structure is exposed to the plastic encapsulation layer and electrically connected to the electromagnetic shielding layer. A portion of the electromagnetic shielding layer forms a pad on the back of the chip or forms a pad by bonding the plastic encapsulation layer to the back of the chip through an opening.

[0021] As a further improvement of the present invention, the antenna packaging structure further includes a microwave integrated circuit and / or a power management chip and / or a passive device disposed on the chip circuit layer.

[0022] The present invention also provides a packaging method for an antenna packaging structure, comprising the following steps:

[0023] A temporary carrier board is provided, on which a chip circuit layer, an antenna control layer, and at least one second antenna layer located on the antenna control layer are disposed, forming a substrate layer, wherein the second antenna layer uses a dielectric material with a dielectric loss tangent of less than 0.01 as the interlayer dielectric.

[0024] An interconnect structure is disposed on the substrate layer, and the interconnect structure is electrically connected to a ground line layer on the substrate layer;

[0025] At least one antenna support with a dielectric loss tangent of less than 0.01 is disposed on the second antenna layer, and a first antenna layer is disposed on the antenna support.

[0026] A first molding compound layer is used to encapsulate the substrate layer, the interconnect structure, the antenna support, and the first antenna layer.

[0027] Remove the temporary carrier board, set interconnect structure components and at least one chip on the chip circuit layer, fill to form a second molding layer, and cut to form a single antenna package structure.

[0028] As a further improvement of the present invention, the antenna support is one or more of an organic composite substrate, a glass component, and a low-temperature co-fired ceramic component.

[0029] As a further improvement of the present invention, the first molding compound layer covers at least the upper surface of the substrate layer, the side surface of the antenna support, the side surface of the interconnect structure and the first antenna layer, and the second molding compound layer covers at least the side surface of the chip and the side surface of the interconnect structure. The first molding compound layer and the second molding compound layer are made of different materials.

[0030] As a further improvement of the present invention, at least the interlayer dielectric material of the second antenna layer is a resin with a dielectric constant of not more than 3.9 or a filler-filled polymer dielectric material.

[0031] As a further improvement of the present invention, the chip circuit layer includes antenna signal control circuitry and antenna signal transmission and reception circuitry.

[0032] As a further improvement to the present invention, the following steps are also included:

[0033] A first moisture-proof layer is formed on the upper surface of the antenna support, and the first moisture-proof layer covers the first antenna layer.

[0034] As a further improvement of the present invention, the interconnect structure includes a main body made of dielectric material and a metal connector located at least inside the main body and communicating with its upper and lower surfaces, the metal connector being electrically connected to at least a ground line layer on the substrate layer.

[0035] As a further improvement of the present invention, the interconnection structure provided on one side of the second antenna layer is distributed between the gaps in the antenna support and its periphery.

[0036] As a further improvement of the present invention, the portion of the interconnect structure located on both sides of the packaging structure is further provided with a lateral antenna layer, the lateral antenna layer being disposed toward the side edge of the antenna packaging structure.

[0037] As a further improvement of the present invention, the sidewall of the interconnect structure is provided with a heat dissipation structure and / or a second moisture barrier layer, the second moisture barrier layer being exposed to or embedded in the encapsulation layer.

[0038] As a further improvement of the present invention, before cutting to form a single antenna package, the following step is also included:

[0039] Partially cut the first or second molding layer;

[0040] An electromagnetic shielding layer is formed by sequentially depositing an adhesive layer, a main shielding layer, and a protective layer on the outside of the antenna packaging structure, wherein the electromagnetic shielding layer at least covers the chip and the chip circuit layer.

[0041] As a further improvement of the present invention, the antenna packaging structure also includes a microwave integrated circuit, a power management chip, and passive devices disposed on the chip circuit layer.

[0042] The beneficial effects of the present invention are as follows: The present invention separates the antenna and the chip on both sides of the substrate layer. The antenna layer is composed of an antenna support, a first antenna layer located above the antenna support, and a second antenna layer located below the antenna support. The dielectric between the antenna support and the antenna layer is made of a low dielectric loss material, thereby forming a heterogeneous antenna structure, which reduces problems such as current leakage and stray capacitance in the packaging structure caused by dielectric loss, and reduces the size of the antenna packaging structure. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of the antenna packaging structure according to one embodiment of the present invention.

[0044] Figure 2 This is a schematic diagram of the substrate layer and antenna layer in an antenna packaging structure according to another embodiment of the present invention, wherein the upper surface of the interconnect structure is higher than the upper surface of the first antenna layer.

[0045] Figure 3 This is a schematic diagram of the substrate layer and antenna layer in an antenna packaging structure according to another embodiment of the present invention, wherein the upper surface of the antenna support is further provided with a first moisture barrier layer.

[0046] Figure 4 This is a schematic diagram of an antenna packaging structure according to another embodiment of the present invention, wherein the interconnecting components located on both sides of the packaging structure are provided with lateral antenna layers.

[0047] Figure 5 This is a schematic diagram of the substrate layer and antenna layer in an antenna packaging structure according to another embodiment of the present invention, wherein the interconnection structure is a complete block structure.

[0048] Figure 6 This is a schematic diagram of the substrate layer and antenna layer in an antenna packaging structure according to another embodiment of the present invention, wherein the interconnect structure is integrated within the antenna support.

[0049] Figure 7 This is a schematic diagram of an antenna packaging structure according to another embodiment of the present invention, which is provided with an inter-board connector.

[0050] Figure 8 and Figure 9 This is a schematic diagram of an antenna packaging structure in another embodiment of the invention, which also has an electromagnetic shielding layer on the outside of the packaging layer.

[0051] Figure 10 This is a flowchart illustrating the manufacturing process of an antenna packaging structure according to one embodiment of the present invention.

[0052] Figures 11 to 14 This is a schematic diagram of the manufacturing process steps of the antenna packaging structure according to one embodiment of the present invention. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0054] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0055] For ease of explanation, this document uses terms indicating relative spatial position, such as "above," "below," "behind," and "front," to describe the relationship of one unit or feature shown in the accompanying drawings relative to another unit or feature. Terms indicating relative spatial position can include different orientations of the device during use or operation besides those shown in the figures. For example, if the device in the figures is flipped, a unit described as being "below" or "above" other units or features will be located "below" or "above" other units or features. Therefore, the exemplary term "below" can encompass both "below" and "above" spatial orientations.

[0056] like Figure 1 As shown, the present invention provides an antenna packaging structure, which includes: a substrate layer 1, at least one antenna support 2, a first antenna layer 3, a molding layer 4, at least one chip 5, and an interconnect structure 6.

[0057] The substrate layer 1 includes a chip circuit layer 11, an antenna control layer 12 and at least one second antenna layer 13 stacked sequentially, wherein the dielectric loss tangent of the interlayer dielectric of the second antenna layer 13 is less than 0.01.

[0058] The antenna control layer 12 includes antenna signal control lines and antenna signal transmission and reception lines.

[0059] Specifically, in this embodiment, the interlayer dielectric material of the second antenna layer 13 is a resin with a dielectric constant of no more than 3.9 or a polymer dielectric material with filler. By selecting a material with low dielectric constant and low dielectric loss as the interlayer dielectric material of the second antenna layer 13, the dielectric loss and capacitive reactance in the antenna circuit can be reduced, thereby reducing problems such as current leakage and stray capacitance caused by dielectric loss.

[0060] The antenna support 2 is located on the second antenna layer 13, and its dielectric loss tangent is less than 0.01.

[0061] Furthermore, the first antenna layer 3 is disposed on the antenna support 2, and is electrically connected to the substrate layer 1 through conductive holes 62 or connecting lines located in the antenna support 2. The first antenna layer 3 can also be electrically connected to the substrate layer 1 without physical contact, and form a non-contact electrical connection for electromagnetic radiation with the second antenna layer 13. The antenna support 2 is made of a low dielectric loss material, which enables the antenna circuit to form a heterogeneous split structure. As the main component of the antenna circuit and structure, the antenna support 2 can reduce the dielectric loss in the circuit.

[0062] Specifically, the shape of the antenna support 2 can be set according to the planar arrangement of the first antenna layer 3 and the number of antenna modules in the first antenna layer 3. The horizontal outline of the antenna support 2 is roughly similar to the planar arrangement of the first antenna layer 3, and the projection of the first antenna layer 3 on the horizontal plane is completely within the outline of the antenna support 2. This allows the antenna support 2 with low dielectric loss to provide good support for the first antenna while reducing the space it occupies in the packaging structure.

[0063] Furthermore, the antenna support 2 is one or more of an organic composite single-layer or multi-layer substrate, a glass component, and a low-temperature co-fired ceramic component. The organic composite substrate and the glass component have both low dielectric loss and low dielectric constant, while the low-temperature co-fired ceramic component has both low dielectric loss and high dielectric constant. By using antenna support 2 with different dielectric constants while ensuring low dielectric loss, the packaging structure can be adapted to chips 5 with different usage conditions, meeting the requirements for high-density integration of the packaging structure.

[0064] The antenna support 2 is attached to the substrate layer 1 by means of materials such as chip film or adhesive paste. The chip film or adhesive paste generally has a low dielectric loss constant and a thickness of less than 50 μm.

[0065] Chip 5 is disposed on chip circuit layer 11 relative to antenna support 2, that is, chip 5 and antenna layer are disposed on opposite surfaces of substrate layer 1. Distributing the antenna layer and chip 5 on opposite sides of substrate layer 1 allows for layered arrangement of circuit layers on substrate layer 1, with chip 5 and chip circuit layer 11 on one side and antenna control circuit layer and antenna layer on the other, facilitating sequential wiring design on substrate layer 1. Furthermore, it reduces signal interference from antenna layer to chip 5.

[0066] In some embodiments of the present invention, a bottom filler 51 may be provided between the chip 5 and the chip circuit layer 11. The chip 5 may or may not have a back metal.

[0067] In some embodiments of the present invention, the antenna packaging structure further includes a microwave integrated circuit and / or a power management chip and / or passive devices disposed on the chip circuit layer 11. Passive devices include capacitors, resistors, or other functional devices such as heat sinks and reinforcing ribs.

[0068] The antenna package structure also includes interconnect structure 6 disposed on the second antenna layer 13 and / or chip circuit layer 11, which includes antenna-side interconnect structure 6a and chip-side interconnect structure 6b. Antenna-side interconnect structure 6a is at least electrically connected to a ground line on substrate layer 1. Chip-side interconnect structure 6b is at least electrically connected to signal and ground lines on substrate layer 1.

[0069] Furthermore, in this embodiment, the interconnect structure 6 includes a main body 61 made of dielectric material, and conductive holes 62 located at least inside the main body 61, connecting its upper and lower surfaces. The conductive holes 62 can be through holes, stacked holes, or interlayer electrical interconnects. Metal connectors or conductive fillers are provided within the conductive holes 62 to ensure electrical connection at least to the ground plane layer. Interconnect structures 6 are provided on both the second antenna layer 13 and the chip circuit layer 11. The antenna-side interconnect structures 6a are distributed between the gaps within the antenna support 2 and on its periphery, maximizing the effective use of space within the package structure.

[0070] The upper and lower surfaces of the main body 61 are plated with a designed metal layer, which may be higher than, equal to, or lower than the upper and lower surfaces of the main body. The interconnect structure 6 is electrically connected to at least the grounding line layer by solder or conductive adhesive / paste.

[0071] Furthermore, the main body 61 can also be an organic composite single-layer or multi-layer substrate with low dielectric loss, a glass component, or a low-temperature co-fired ceramic component to further reduce dielectric loss within the packaging structure. Alternatively, the main body 61 can also be an organic polymer resin with inorganic fillers, or an organic polymer resin with glass fiber cloth and fillers, or a synthetic resin or other polymer material with a certain structural strength.

[0072] The sidewall of the interconnect structure 6 is provided with a heat dissipation structure 63 and / or a second moisture barrier layer 64.

[0073] Specifically, in this embodiment, the chip-side interconnect structure 6b is provided with a second moisture-proof layer 64 exposed to the molding compound layer 4, and the heat dissipation structure is a columnar or thin-layer structure made of a material with high thermal conductivity, such as a copper pillar or an electroplated copper layer. This further improves the reliability of the packaging structure under high temperature and high humidity conditions.

[0074] The metal surface on the antenna-side interconnect structure 6a may be higher than, equal to or lower than the upper surface of the first antenna layer 3.

[0075] Specifically, in this embodiment, the metal surface on the antenna-side interconnect structure 6a is flush with the upper surface of the first antenna layer 3.

[0076] like Figure 2 As shown, in some other embodiments of the present invention, the upper surface of the interconnect structure 6 is higher than the upper surface of the first antenna layer 3, and the upper surface of the interconnect structure 6 is exposed to the molding layer 4, thereby improving the heat dissipation capacity of the package structure and facilitating the stacking of other components on top of the interconnect structure to expand the package structure.

[0077] like Figure 3 As shown, in some other embodiments of the present invention, the upper surface of the antenna support 2 is further provided with a first moisture barrier layer 7, the first moisture barrier layer 7 covers the first antenna layer 3, and the upper surfaces of the first moisture barrier layer 7 and the interconnect structure 6 are exposed to the encapsulation layer 4. The first moisture barrier layer 7 provides moisture-proof protection for the first antenna layer 3, improves the reliability of the encapsulation structure under high humidity conditions, and the exposed interconnect structure 6 and the first moisture barrier layer 7 are beneficial to improving the heat dissipation capacity of the encapsulation structure.

[0078] like Figure 4 As shown, in some other embodiments of the present invention, the portions of the interconnect structure 6 located on both sides of the package structure are further provided with lateral antenna layers 65, which are disposed toward the side edge of the antenna package structure. The interconnect structure 6 contains lines or conductive connectors that electrically connect the lateral antenna layers 65 and the antenna control layer 12.

[0079] like Figure 5 As shown, in some other embodiments of the present invention, the antenna-side interconnect structure 6a is a complete block structure, which has solder bumps 66 at least at the four corners and the center, and is connected to the substrate layer 1 through the solder bumps 66.

[0080] like Figure 6 As shown, in some other embodiments of the present invention, the antenna-side interconnect structure 6a is integrated within the antenna support 2, thereby further improving the integration of the package structure.

[0081] like Figure 7 As shown, in some other embodiments of the present invention, the chip-side interconnect structure 6b is omitted from the package structure, and an inter-board connector 70 is provided therein. The structure of the inter-board connector 70 is similar to that of the chip-side interconnect structure 6b. Conductive lines or conductive holes 62 are provided in the dielectric material and electrically connected to the circuit of the substrate layer 1. The inter-board connector 70 makes it easier to connect other electronic components or other electronic structures, so as to facilitate the expansion of the package structure.

[0082] The molding layer 4 encapsulates the substrate layer 1, the antenna support 2, the first antenna layer 3, and the chip 5. The molding layer 4 is filled with molding compound, which can be epoxy resin, polyimide, dry film, or other filler-containing polymer composite materials. The molding layer 4 provides physical support for the encapsulation structure and protects the components within the encapsulation structure.

[0083] Furthermore, in this embodiment, the molding compound 4 includes a first molding compound 41 and a second molding compound 42. The first molding compound 41 covers at least the upper surface of the substrate layer 1, the side surface of the antenna support 2, the side surface of the antenna-side interconnect structure 6a, and the first antenna layer 3. The second molding compound 42 covers at least the side surface of the chip 5 and the side surface of the chip-side interconnect structure 6b. The first molding compound 41 and the second molding compound 42 may use different or the same molding compound. By using different materials, the warpage problem of the package structure can be adjusted by utilizing the differences in the coefficient of thermal expansion of different molding compounds.

[0084] like Figure 8 and Figure 9 As shown, in some other embodiments of the present invention, the antenna packaging structure is further provided with an electromagnetic shielding layer 8 outside the packaging layer. The electromagnetic shielding layer 8 covers at least the sides of the chip 5 and the sides or sides of the chip circuit layer 11 to reduce electromagnetic interference received by the chip 5. The pads designed as a part of the electromagnetic shielding layer 8 can also be bonded to the back of the chip 5 by a second molding compound 42 with an opening on the back of the chip 5, and a solder cap or solder ball is formed on the pad to improve heat dissipation or mechanical reliability.

[0085] Specifically, the electromagnetic shielding layer 8 includes: an adhesive layer bonded to the molding layer 4, a protective layer exposed to air, and a main shielding layer disposed between the adhesive layer and the protective layer. The adhesive layer is a metal material with high adhesion, such as copper, or an organic material with high adhesion, to enhance the bonding strength between the electromagnetic shielding layer 8 and the encapsulation structure. The main shielding layer is a sputtered sandwich metal thin film material such as copper, stainless steel, or titanium, or a conductive composite material such as a conductive resin containing high-density metal fillers like silver / copper, or a combination of at least two of the above materials, capable of shielding or absorbing electromagnetic waves. The protective layer is a stainless steel (7% NiV) or CrCu alloy layer, or an organic moisture-proof layer, to further enhance the reliability of the encapsulation structure under high humidity conditions.

[0086] Furthermore, the chip-side interconnect structure 6b has a metal structure on its sidewall, which is exposed to the molding layer 4 and electrically connected to the electromagnetic shielding layer 8. The electromagnetic shielding layer 8 can also be electrically connected to the bottom surface metal of the interconnect structure 6.2.

[0087] Depending on the sequence of process steps in the manufacturing process, the position of the horizontal cut surface covered by the electromagnetic shielding layer 8 varies.

[0088] like Figure 10 As shown, the present invention also provides a packaging method for an antenna packaging structure, comprising the following steps:

[0089] S1: As Figure 11 As shown, a temporary carrier board 9 is provided. At least one chip circuit layer 11, at least one antenna control layer 12, and at least one second antenna layer 13 located on the antenna control layer 12 are disposed on the temporary carrier board 9 to form a substrate layer 1. The second antenna layer 13 uses a dielectric material with a dielectric loss tangent of less than 0.01 as the interlayer dielectric. The substrate layer 1 can be a prefabricated substrate strip or a single substrate particle, or a redistribution stack layer formed on the temporary carrier board by multiple layers of fine metal wiring and dielectric layer openings.

[0090] The temporary carrier plate 9 is a low-cost sacrificial substrate with a certain degree of rigidity and a temporary debonding layer or etch-blocking layer, such as glass, silicon, or composite polymers, used for structural support. The temporary carrier plate 9 can also be a high-temperature film with a single-sided temporary adhesive layer and a reinforcing frame. The temporary carrier plate 9 can be rectangular, square, or circular.

[0091] Furthermore, the antenna control layer 12 includes antenna signal control lines and antenna signal transmission and reception lines.

[0092] Specifically, in this embodiment, at least the dielectric material between the second antenna layer 13 is a resin with a dielectric constant of no more than 3.9 or a filler-filled polymer dielectric material.

[0093] S2: As Figure 11 As shown, interconnection structures are provided on substrate layer 1, and the interconnection structures are electrically connected to the ground line layer on substrate layer 1.

[0094] Specifically, in this embodiment, the interconnect structure 6 includes a main body 61 made of dielectric material and a metal connector located inside the main body 61 that connects its upper and lower surfaces. The metal connector is electrically connected to the ground line layer on the substrate layer 1.

[0095] The upper and lower surfaces of the main body 61 are plated with a designed metal layer, and the antenna-side interconnect structure 6a is electrically connected to the grounding line layer by solder or conductive adhesive / paste.

[0096] Furthermore, the main body 61 can be a single-layer or multi-layer organic composite substrate with low dielectric loss, a glass component, or a low-temperature co-fired ceramic component to further reduce dielectric loss within the packaging structure. Alternatively, the main body 61 can also be an organic polymer resin with inorganic fillers, or an organic polymer resin with glass fiber cloth and fillers, or a synthetic resin or other polymer material with a certain structural strength.

[0097] In some other embodiments of the present invention, the portions of the interconnect structure located on both sides of the package structure are further provided with lateral antenna layers 65, which are disposed toward the side edge of the antenna package structure.

[0098] In some other embodiments of the present invention, the sidewall of the interconnect structure 6 is provided with a heat dissipation structure 63 and / or a second moisture barrier layer 64, the second moisture barrier layer 64 being exposed to the molding layer 4.

[0099] In some other embodiments of the present invention, the interconnect structure 6 is a complete block structure with solder bumps at least at the four corners and the center, and is connected to the overlay layer through the solder bumps.

[0100] S3: As Figure 11 As shown, an antenna support 2 with a dielectric loss tangent of less than 0.01 is provided on the second antenna layer 13, and a first antenna layer 3 is provided on the antenna support 2.

[0101] Specifically, in this embodiment, the antenna support 2 is one or more of a single-layer or multi-layer organic composite substrate, a glass component, and a low-temperature co-fired ceramic component.

[0102] The antenna support 2 is attached to the substrate layer 1 by means of materials such as chip back film or adhesive paste.

[0103] The interconnection structure 6 located on one side of the second antenna layer 13 is distributed between the gaps in the antenna support 2 and its periphery, and the upper surface of the interconnection structure 6 is not lower than the upper surface of the first antenna layer 3.

[0104] S4: As Figure 12 As shown, the first molding layer 41 covers the substrate layer 1, the interconnect structure 6, the antenna support 2, and the first antenna layer 3.

[0105] An organic polymer resin with inorganic filler, or an organic polymer resin with fiberglass cloth and filler, or a polymer composite material with filler such as epoxy resin, polyimide, or dry film is deposited on the substrate layer 1 to encapsulate the interconnect structure, antenna support 2 and the first antenna layer 3 to form the first encapsulation layer 41.

[0106] When the upper surface of the interconnect structure 6 is significantly higher than the upper surface of the first antenna layer 3, the encapsulation layer 4 can be polished to expose the upper surface of the interconnect structure 6.

[0107] In some other embodiments of the present invention, the step of further filling with molding compound is included:

[0108] Before the antenna support 2 is cut or after it is attached to the substrate layer 1, a first moisture barrier layer 7 is formed on the upper surface of the antenna support 2, and the first moisture barrier layer 7 covers the first antenna layer 3.

[0109] After the molding compound is filled, the molding layer 4 can be sanded down according to design and performance requirements to expose the upper surface of the interconnect structure 6 and the upper surface of the first moisture barrier layer 7. In one embodiment, the upper surface of the interconnect structure 6 and / or the upper surface of the first moisture barrier layer 7 can be directly protected during the molding process, so that no molding layer covers the upper surface of the interconnect structure 6 and / or the upper surface of the first moisture barrier layer 7.

[0110] S5: As Figure 13 and Figure 14 As shown, the temporary carrier board 9 is removed, and interconnect structures 6 and at least one chip 5 are disposed on the chip circuit layer 11. The chip 5 may or may not have a back metal layer. A second molding compound 42 is then applied, and the chip is cut to form a monolithic antenna package structure. In one embodiment, before the final cut, the second molding compound 42 may be thinned and / or laser-drilled / grooved to expose the interface pads of the chip-side interconnect structure 6b and / or at least a portion of the back side of the chip 5, and subsequently, solder caps or solder balls are applied to the interface pads of the chip-side interconnect structure 6b and / or the back metal of the chip.

[0111] The temporary carrier 9 was peeled off by laser debonding, mechanical stripping, chemical etching, and mechanical grinding.

[0112] The complete encapsulation structure is divided into individual encapsulation structures along the cutting path using a saw blade or laser cutting device.

[0113] Furthermore, in some embodiments of the present invention, the step of encapsulating chip 5 is further included:

[0114] A filler 51 is applied between chip 5 and chip circuit layer 11.

[0115] Furthermore, in some embodiments of the present invention, setting chip 5 also includes the step of:

[0116] Microwave integrated circuits and / or power management chips and / or passive devices are disposed on the chip circuit layer 11. Passive devices include capacitors, resistors, etc., or other functional devices such as heat sinks, reinforcing ribs, etc.

[0117] In some embodiments of the present invention, before cutting to form a single antenna package, the following steps are included:

[0118] Partial cutting of the sealing layer;

[0119] An adhesive layer, a main shielding layer, and a protective layer are sequentially deposited on the outside of the antenna package structure to form an electromagnetic shielding layer 8. The electromagnetic shielding layer 8 covers at least the side of the chip 5 and the side or side of the chip circuit layer 11.

[0120] Specifically, the electromagnetic shielding layer 8 includes: an adhesive layer bonded to the molding layer 4, a protective layer exposed to air, and a main shielding layer disposed between the adhesive layer and the protective layer. The adhesive layer is a highly adhesive metallic material such as copper, or a highly adhesive organic material. The main shielding layer is a sputtered interlayer metal thin film material such as copper, stainless steel, or titanium, or a conductive composite material such as a conductive resin containing high-density metal fillers like silver / copper, or a combination of at least two of the above materials. The protective layer is a stainless steel, NiV (7%), or CrCu alloy layer, or an organic moisture-barrier layer, etc.

[0121] It should be noted that the order of some steps in this invention can be changed or adjusted. For example, steps S2 and S3 can be swapped or performed simultaneously. Alternatively, the chip 5 and substrate layer 1 can be set on the temporary carrier board 9 first, and then the temporary carrier board 9 can be removed to form the antenna support 2 and antenna layer, etc., as long as a relatively distributed chip and antenna layer packaging structure can be formed.

[0122] In summary, this invention separates the antenna and the chip on opposite sides of the substrate layer. The antenna layer is composed of an antenna support, a first antenna layer above the antenna support, and a second antenna layer below the antenna support. The dielectric between the antenna support and the antenna layer is made of a low dielectric loss material, thereby forming a heterogeneous antenna structure. This reduces problems such as current leakage and stray capacitance within the package structure caused by dielectric loss, and also helps to reduce the size of the antenna package structure.

[0123] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0124] The detailed descriptions listed above are merely specific descriptions of feasible implementations of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent implementations or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. An antenna packaging structure, characterized in that, The antenna packaging structure includes: a substrate layer, at least one antenna support, a first antenna layer, a molding layer, at least one chip, and interconnect structure components; The substrate layer is a rewiring stack layer formed on a temporary carrier by multiple layers of fine metal wiring and dielectric layer openings. The substrate layer includes at least one chip circuit layer, at least one antenna control layer and at least one second antenna layer stacked sequentially, wherein the dielectric loss tangent of the interlayer dielectric of the second antenna layer is less than 0.

01. The antenna support is disposed on the second antenna layer, and its dielectric loss tangent is less than 0.01; The first antenna layer is disposed on the antenna support member and is electrically connected to the second antenna layer through electromagnetic radiation or physical contact; the interconnection structure includes an antenna-side interconnection structure disposed on one side of the second antenna layer, and the antenna-side interconnection structure is at least electrically connected to a ground line on the substrate layer; the antenna-side interconnection structure is distributed between the gaps in the antenna support member and its periphery, and the antenna-side interconnection structure is arranged at intervals with the antenna support member; The chip is disposed on the chip circuit layer relative to the antenna support; The molding compound covers the substrate layer, the antenna support, the first antenna layer, and the chip.

2. The antenna packaging structure according to claim 1, characterized in that, The antenna support is one or more of the following: an organic composite substrate, a glass component, and a low-temperature co-fired ceramic component.

3. The antenna packaging structure according to claim 2, characterized in that, At least the interlayer dielectric material of the second antenna layer is a resin with a dielectric constant of no more than 3.9 or a filler-filled polymer dielectric material.

4. The antenna packaging structure according to claim 3, characterized in that, The antenna control layer includes antenna signal control lines and antenna signal transmission and reception lines.

5. The antenna packaging structure according to claim 2, characterized in that, The upper surface of the antenna support is further provided with a first moisture barrier layer, which covers the first antenna layer and is exposed to or embedded in the encapsulation layer.

6. The antenna packaging structure according to claim 2, characterized in that, The antenna packaging structure further includes chip-side interconnect structures disposed on the chip circuit layer, and the chip-side interconnect structures on the chip circuit layer are electrically connected to the substrate layer.

7. The antenna packaging structure according to claim 6, characterized in that, The interconnect structure includes a main body made of dielectric material and a conductive hole located at least inside the main body, connecting its upper and lower surfaces. The conductive hole is provided with a metal connector or conductive filler to be electrically connected to at least the grounding line layer.

8. The antenna packaging structure according to claim 6, characterized in that, The interconnect structure is further provided with a lateral antenna layer on the portion located on both sides of the packaging structure, and the lateral antenna layer is disposed toward the side edge of the antenna packaging structure.

9. The antenna packaging structure according to claim 6, characterized in that, The sidewall of the interconnect structure is provided with a heat dissipation structure and / or a second moisture barrier layer, the second moisture barrier layer being exposed to or embedded outside the encapsulation layer.

10. The antenna packaging structure according to claim 6, characterized in that, The molding compound includes a first molding compound and a second molding compound. The first molding compound covers at least the upper surface of the substrate layer, the side surface of the antenna support, the side surface of the interconnect structure, and the first antenna layer. The second molding compound covers at least the side surface of the chip and the side surface of the interconnect structure. The first molding compound and the second molding compound are made of the same or different materials.

11. The antenna packaging structure according to claim 6, characterized in that, The antenna packaging structure also has an electromagnetic shielding layer outside the plastic encapsulation layer. The electromagnetic shielding layer covers at least the side of the chip and the chip circuit layer. The electromagnetic shielding layer includes: an adhesive layer attached to the plastic encapsulation layer, a protective layer exposed to air, and a main shielding layer disposed between the adhesive layer and the protective layer. The sidewall of the interconnect structure is provided with a metal structure. The metal structure is exposed to the plastic encapsulation layer and electrically connected to the electromagnetic shielding layer. A portion of the electromagnetic shielding layer forms a pad on the back of the chip or forms a pad by bonding the plastic encapsulation layer to the back of the chip through an opening.

12. The antenna packaging structure according to claim 1, characterized in that, The antenna packaging structure also includes microwave integrated circuits and / or power management chips and / or passive devices disposed on the chip circuit layer.

13. A packaging method for an antenna packaging structure, characterized in that, Including the following steps: A temporary carrier board is provided, on which a chip circuit layer, an antenna control layer, and at least one second antenna layer located on the antenna control layer are disposed, forming a substrate layer, wherein the second antenna layer uses a dielectric material with a dielectric loss tangent of less than 0.01 as the interlayer dielectric. The substrate layer is a rewiring stack layer formed on a temporary carrier by multiple layers of fine metal wiring and dielectric layer openings. An interconnect structure is disposed on the substrate layer, and the interconnect structure is electrically connected to a ground line layer on the substrate layer; At least one antenna support with a dielectric loss tangent of less than 0.01 is disposed on the second antenna layer, and a first antenna layer is disposed on the antenna support. The interconnection structure includes an antenna-side interconnection structure disposed on one side of the second antenna layer, the antenna-side interconnection structure being electrically connected to at least a ground line on the substrate layer; the antenna-side interconnection structure is distributed between the gaps in the antenna support and its periphery, and the antenna-side interconnection structure is arranged at intervals with the antenna support; A first molding compound layer is used to encapsulate the substrate layer, the interconnect structure, the antenna support, and the first antenna layer. Remove the temporary carrier board, set interconnect structure components and at least one chip on the chip circuit layer, fill to form a second molding layer, and cut to form a single antenna package structure.

14. The packaging method according to claim 13, characterized in that, The antenna support is one or more of the following: an organic composite substrate, a glass component, and a low-temperature co-fired ceramic component.

15. The packaging method according to claim 13, characterized in that, The first molding compound covers at least the upper surface of the substrate layer, the side of the antenna support, the side of the interconnect structure, and the first antenna layer; the second molding compound covers at least the side of the chip and the side of the interconnect structure; and the first molding compound and the second molding compound are made of different materials.

16. The packaging method according to claim 13, characterized in that, At least the interlayer dielectric material of the second antenna layer is a resin with a dielectric constant of no more than 3.9 or a filler-filled polymer dielectric material.

17. The packaging method according to claim 13, characterized in that, The chip circuit layer includes antenna signal control circuitry and antenna signal transmission and reception circuitry.

18. The packaging method according to claim 13, characterized in that, It also includes the following steps: A first moisture-proof layer is formed on the upper surface of the antenna support, and the first moisture-proof layer covers the first antenna layer.

19. The packaging method according to claim 13, characterized in that, The interconnect structure includes a body made of dielectric material and a metal connector located at least inside the body and communicating with its upper and lower surfaces, the metal connector being electrically connected to at least a ground line layer on the substrate layer.

20. The packaging method according to claim 19, characterized in that, The interconnect structure located on both sides of the packaging structure also has a lateral antenna layer, which is disposed toward the side edge of the antenna packaging structure.

21. The packaging method according to claim 19, characterized in that, The sidewall of the interconnect structure is provided with a heat dissipation structure and / or a second moisture barrier layer, the second moisture barrier layer being exposed to or embedded in the encapsulation layer.

22. The packaging method according to claim 13, characterized in that, Before cutting and forming a single antenna package, the following steps are also included: Partially cut the first or second molding layer; An electromagnetic shielding layer is formed by sequentially depositing an adhesive layer, a main shielding layer, and a protective layer on the outside of the antenna packaging structure, wherein the electromagnetic shielding layer at least covers the chip and the chip circuit layer.

23. The packaging method according to claim 13, characterized in that, The antenna packaging structure also includes a microwave integrated circuit, a power management chip, and passive devices disposed on the chip circuit layer.

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