A method for repairing a circuit board with activity-induced heating

Abstract

The application discloses a kind of movable heating circuit board repair methods, the repair method includes S1: data acquisition, S2: inductive heating desoldering, and S3: new component re-soldering etc.Step, compared with prior art, movable heating circuit board repair method provided by the application has processing flexible, repair efficiency is high, repair success rate is high, processing coverage is wide, adaptability is strong, heat is sufficient, heat source controllability is strong, can adapt to the desoldering or welding requirement of element of wide size range, can reach the expected heating effect well, positioning is accurate, work stable and other beneficial effects.

Description

Technical Field

[0001] This invention belongs to the field of precision machining technology, and specifically relates to a circuit board rework machine. Background Technology

[0002] Circuit boards typically consist of a substrate, solder, and electronic components. After the circuit design is completed, the circuit lines are printed on the substrate. For the positions of electronic components in the circuit design, pads need to be reserved on the substrate. During manufacturing, the specified components are moved to their corresponding positions, and their metal pads are aligned with the pads on the substrate. Solder is applied to the pads, and then a specified heat source is used to heat the solder until it melts. The molten solder bonds the electronic components to the pads, thus connecting the electronic components to the substrate and completing the circuit board soldering process.

[0003] With the development of electronic technology and the advancement of packaging technology, circuits are becoming increasingly large-scale, circuit layouts are becoming increasingly compact, and the size of individual electronic components is becoming smaller. The number of electronic components requiring soldering on a single substrate is also increasing, and the spacing between adjacent electronic components is becoming smaller. The precision requirements for circuit board manufacturing are also increasing. For the same reason, after a single circuit board is formed in one piece, the probability of individual electronic components in localized areas being damaged, misaligned, missing, or detached due to their own faults or processing errors is multiplying. However, existing technologies lack rework equipment for circuit boards after one-piece forming, and there are no effective remedial measures for defective products that occur during production. As a result, if one or several electronic components fail, the entire circuit board is completely scrapped. This not only significantly increases production costs but also wastes raw materials. Therefore, designing a circuit board rework method that can perform corresponding rework operations on circuit boards with localized faults or individual electronic components requiring rework, and remedying defective products in the production process, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] To address the aforementioned problems, the present invention aims to provide a circuit board repair method. This method utilizes the coordinated operation of multiple devices and flexible device scheduling. After removing faulty components from a circuit board exhibiting a partial fault based on the principle of induction heating, new components are then replaced. This method efficiently, quickly, and flexibly repairs circuit boards of various sizes and shapes, making it suitable for a wider range of circuit board repair scenarios.

[0005] To achieve the above objectives, the technical solution of the present invention is as follows:

[0006] A method for repairing a circuit board with active heating, the method being as follows:

[0007] S1: Data Acquisition: Inspect the circuit board and acquire the actual coordinate parameters of the circuit board and the parts that need to be reworked during this processing;

[0008] S2: Induction heating desoldering: Based on the actual coordinate parameters of the circuit board and the part that needs to be repaired, the induction heating source is moved to the location that needs to be repaired, the original electronic components at that location are desoldered, the original electronic components are removed, and the original pads at that location are exposed.

[0009] S3: Resoldering new components: Grab a new component with the same model and function as the original electronic component, transport it to the location requiring repair, and then move the induction heating source to that location to heat it a second time before soldering the new component to the original pads.

[0010] Furthermore, S1 specifically refers to:

[0011] S11: Perform AOI inspection on the circuit board to obtain the circuit board's external dimensions, the position coordinates of the faulty device on the circuit board, the fault type, the model of the faulty device, and the pose of the faulty device on the circuit board as ideal parameters.

[0012] S12: Set up a loading platform with Y-axis freedom, place the circuit board that needs to be reworked on the loading platform, and transfer the ideal parameters of the circuit board and the part that needs to be reworked to the loading platform.

[0013] S13: The camera is directed to take pictures of the circuit board from above the loading platform. The pictures of the circuit board are analyzed to identify and locate the marked points on the circuit board.

[0014] S14: Based on the analysis of the marking points on the circuit board, the actual placement posture of the current circuit board is obtained. The ideal parameters are superimposed on the current circuit board to obtain the actual coordinate parameters of the faulty device in the circuit board under the actual placement posture of the current circuit board.

[0015] Furthermore, S2 specifically refers to:

[0016] S21: An induction heating source with degrees of freedom in the X-axis and Z-axis directions is set, and the projection point of the induction heating head in the XY plane is marked as the active heating point.

[0017] S22: Based on the actual coordinate parameters of the faulty components in the circuit board, the loading platform and the induction heating source are moved simultaneously to move closer to each other, so that the points on the circuit board that need to be repaired are superimposed on the active heating points.

[0018] S23: Detect the current circuit board substrate thickness, and the size and height data of components at the parts requiring repair;

[0019] S24: Based on the current substrate thickness of the circuit board and the size and height of the components at the location requiring repair, adjust the height of the induction heating head in the induction heating source along the Z-axis direction, and control the alternating magnetic field generated by the induction heating head to cover the location requiring repair and melt the solder.

[0020] S25: Recycle and remove loose original components to complete desoldering;

[0021] S26: The induction heating source circuit board continuously heats the pads and residual solder layer on the pads to level them.

[0022] Furthermore, S2 also includes:

[0023] S27A: Set a soldering head with X-axis and Z-axis degrees of freedom, and use the projection point of the real-time solder outlet of the soldering head in the XY plane as the active soldering point.

[0024] S28A: Based on the actual coordinate parameters of the faulty device, the loading platform and the soldering head are moved simultaneously to overlap the points on the circuit board that need to be repaired with the active soldering points.

[0025] S29A: Allows the soldering tip to move downwards along the Z-axis to complete the desoldering and reapply solder to the exposed pads on the circuit board.

[0026] Furthermore, S2 also includes:

[0027] S27B: Set up a flux head with X-axis and Z-axis degrees of freedom, and use the projection point of the real-time flux outlet position of the flux head in the XY plane as the fluxing point.

[0028] S28B: Based on the actual coordinate parameters of the faulty device, the loading platform and flux head are moved simultaneously to overlap the points on the circuit board that need to be repaired with the fluxing points.

[0029] S29B: Allows the flux tip to move down the Z-axis to reapply solder to the pads on the circuit board.

[0030] Furthermore, S3 specifically refers to:

[0031] S31: Pre-classify and store new components that are fully functional and correspond to the existing components on the circuit board;

[0032] S32: While applying solder or flux, the camera is scheduled to capture images of the new components stored in the classification. Based on the captured images, each new component is located, the specific coordinates of the new components required in the current rework are obtained, and the new components with the same function and model as the original components that were desoldered and removed are selected and retrieved.

[0033] S33: The camera is positioned to take a downward-facing, upward-facing shot of the newly captured component. The image of the captured component is analyzed to identify the pad orientation of the currently captured component.

[0034] S34: Compare the pad pose of the newly captured component with the actual coordinate parameters of the circuit board and the part that needs to be reworked. Analyze whether the pad pose of the newly captured component is consistent with the original pad pose at the part that needs to be reworked. If there is a deviation, adjust the capture pose until the two poses are consistent.

[0035] Furthermore, S3 also includes:

[0036] S35: Based on the actual coordinate parameters of the circuit board and the part requiring repair, control the loading platform carrying the circuit board and the robotic arm that grips the component to move closer to each other, and place the gripped new component onto the circuit board on which solder and / or flux have been reapplied.

[0037] S36: Based on the actual coordinate parameters of the circuit board and the parts requiring repair, overlap the coordinates of the induction heating head and the pads on the circuit board where solder or flux has been reapplied.

[0038] S37: Allows the induction heating head in the induction heating source to move downward along the Z-axis direction, controls the alternating magnetic field generated by the induction heating head to induction heat the pads, the pads of the new component, and the reapplied solder, and solders the new component to the circuit board.

[0039] The advantages of this invention are that, compared with the prior art, the rework method provided by this invention has the following beneficial effects:

[0040] Flexible processing, high rework efficiency, and high rework success rate: The method provided by this invention gives the loading platform a degree of freedom in the Y-axis direction, allowing the circuit board to be inspected to be flexibly transported along the Y-axis direction. In conjunction with the transport of the circuit board, the processes of induction heating desoldering, component gripping, and resoldering new components are all carried out by the loading platform and other devices in coordination and flexible movement. The parts of the circuit board that need to be reworked do not need to be moved to a fixed position for a certain processing process, and the overall rework efficiency of the circuit board is high.

[0041] Wide processing coverage and strong adaptability: The rework method provided by this invention gives all components that will actually process the circuit board a degree of freedom in the X-axis and Z-axis directions, while giving the Y-axis degree of freedom to the loading platform. The loading platform and other components work together to process a wide range of areas, which can handle circuit boards of various sizes and facilitate precise rework of various rework points in different locations.

[0042] Sufficient heat, strong heat source controllability, adaptability to the desoldering or soldering requirements of components with a wide range of sizes, and good achievement of the expected heating effect: In the rework method provided in this application, an induction heating source is selected as the heat source for soldering or desoldering. Due to the mature development of induction heating technology, compared with resistance heating sources or laser heating sources, the induction heating source can generate sufficiently high temperatures, and key parameters such as the amount of heat generated and the location of heat generation can be calculated in detail based on parameters such as the magnitude of the AC current, the alternating frequency, the shape of the induction heating source, and the distance between the induction heating source and the circuit board. The final soldering result is more controllable.

[0043] Precise positioning and stable operation: For each component requiring rework on every circuit board, the rework method provided in this application undergoes triple positioning: First, AOI inspection is used to obtain the ideal coordinate parameters of the circuit board and the area requiring rework as the first positioning measure. After the first positioning measure, specific, digital appearance parameters of the circuit board, the specific positions of each component on the circuit board, the specific position coordinates of the faulty component requiring rework on the circuit board, and its mounting posture are obtained. Second, after the circuit board is placed on the loading platform, a camera is used to capture marker points to obtain the actual coordinates of the circuit board and the area requiring rework. As a second positioning measure, the parameters ensure that the ideal coordinate system established by AOI inspection can be superimposed on the actual circuit board, providing guidance for the actual coordinates and pose of the parts requiring repair in subsequent processing. Finally, after the new component is picked up, the pose of the picked-up component is captured and analyzed by the camera, and the actual pose of the new component is adjusted to be superimposed on the actual circuit board, ensuring that each processing component is accurately aligned with the required position. This allows for precise processing of faulty parts while ensuring that the new component is accurately aligned with the circuit board, and that the pads of the new component are accurately soldered to the original pads. Attached Figure Description

[0044] Figure 1 The device described in the specific embodiment is a circuit board rework method using active induction heating. Specifically, A is a loading platform, mainly used for transferring the circuit board in steps S2-S3; B is an X-axis beam, used to provide a foundation for other components with X-axis freedom of movement in steps S2-S3; C is an active induction heating source, used to provide heat for desoldering or resoldering new components in steps S2 and S3; D is a soldering head, used for fluxing operations described in steps S27A-S29A; and E is a component-grabbing robot, mainly used for grasping new components in step S3.

[0045] Figure 2 This is a flowchart of a circuit board rework method for active induction heating provided in a specific implementation. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0047] To achieve the above objectives, the technical solution of the present invention is as follows:

[0048] Please see Figure 1-2 .

[0049] This specific embodiment provides a method for repairing a circuit board with active heating. This wafer repair method is applied in Mini LED or Micro LED displays. When a partial fault occurs on the display circuit board, the faulty individual R, G, B light-emitting elements need to be removed and new R, G, B light-emitting elements with the same function as the original R, G, B light-emitting elements need to be re-soldered.

[0050] The repair method is as follows:

[0051] S1: Data Acquisition: Inspect the circuit board and acquire the actual coordinate parameters of the circuit board and the parts that need to be reworked during this processing;

[0052] S2: Induction heating desoldering: Based on the actual coordinate parameters of the circuit board and the part that needs to be repaired, the induction heating source is moved to the location that needs to be repaired, the original electronic components at that location are desoldered, the original electronic components are removed, and the original pads at that location are exposed.

[0053] S3: Resoldering new R, G, B light-emitting components: Grab new R, G, B light-emitting components with the same model and function as the original electronic components, transport them to the location requiring repair, and then move the induction heating source to that location to heat them a second time before soldering the new R, G, B light-emitting components to the original pads.

[0054] Furthermore, in this specific embodiment, S1 specifically refers to:

[0055] S11: Perform AOI inspection on the circuit board to obtain the circuit board's external dimensions, the position coordinates of the faulty device on the circuit board, the fault type, the model of the faulty device, and the pose of the faulty device on the circuit board as ideal parameters.

[0056] S12: Set up a loading platform with Y-axis freedom, place the circuit board that needs to be reworked on the loading platform, and transfer the ideal parameters of the circuit board and the part that needs to be reworked to the loading platform.

[0057] S13: The camera is directed to take pictures of the circuit board from above the loading platform. The pictures of the circuit board are analyzed to identify and locate the marked points on the circuit board.

[0058] S14: Based on the analysis of the marking points on the circuit board, the actual placement posture of the current circuit board is obtained. The ideal parameters are superimposed on the current circuit board to obtain the actual coordinate parameters of the faulty device in the circuit board under the actual placement posture of the current circuit board.

[0059] Furthermore, in this specific embodiment, S2 specifically refers to:

[0060] S21: An induction heating source with degrees of freedom in the X-axis and Z-axis directions is set, and the projection point of the induction heating head in the XY plane is marked as the active heating point.

[0061] S22: Based on the actual coordinate parameters of the faulty components in the circuit board, the loading platform and the induction heating source are moved simultaneously to move closer to each other, so that the points on the circuit board that need to be repaired are superimposed on the active heating points.

[0062] S23: Detect the current circuit board substrate thickness, and the size and height data of the original R, G, and B light-emitting elements at the location requiring repair;

[0063] S24: Based on the current substrate thickness of the circuit board and the size and height of the original R, G, and B light-emitting elements at the location requiring repair, adjust the height of the induction heating head in the induction heating source along the Z-axis direction, and control the alternating magnetic field generated by the induction heating head to cover the location requiring repair and melt the solder.

[0064] S25: Remove loose original R, G, B light-emitting elements to complete desoldering;

[0065] S26: The induction heating source circuit board continuously heats the pads and residual solder layer on the pads to level them.

[0066] Furthermore, in this specific embodiment, S2 also includes:

[0067] S27A: Set a soldering head with X-axis and Z-axis degrees of freedom, and use the projection point of the real-time solder outlet of the soldering head in the XY plane as the active soldering point.

[0068] S28A: Based on the actual coordinate parameters of the faulty device, the loading platform and the soldering head are moved simultaneously to overlap the points on the circuit board that need to be repaired with the active soldering points.

[0069] S29A: Allows the soldering tip to move downwards along the Z-axis to complete the desoldering and reapply solder to the exposed pads on the circuit board;

[0070] Furthermore, in this specific embodiment, S2 also includes:

[0071] S27B: Set up a flux head with X-axis and Z-axis degrees of freedom, and use the projection point of the real-time flux outlet position of the flux head in the XY plane as the fluxing point.

[0072] S28B: Based on the actual coordinate parameters of the faulty device, the loading platform and flux head are moved simultaneously to overlap the points on the circuit board that need to be repaired with the fluxing points.

[0073] S29B: Allows the flux tip to move down the Z-axis to reapply solder to the pads on the circuit board.

[0074] Furthermore, in this specific embodiment, S3 specifically refers to:

[0075] S31: Pre-classify and store the new R, G, and B light-emitting elements that are fully functional and correspond to the original R, G, and B light-emitting elements on the circuit board;

[0076] S32: While applying solder or flux, the camera is scheduled to capture images of the new R, G, and B light-emitting elements stored in the classification. Based on the captured images, each new R, G, and B light-emitting element is located. The specific coordinates of the new R, G, and B light-emitting elements required in the current rework are obtained. The new R, G, and B light-emitting elements with the same function and model as the original R, G, and B light-emitting elements that have been desoldered and removed are selected and retrieved.

[0077] S33: The camera is directed to take a picture of the newly captured R, G, and B light-emitting elements from below, and the image of the captured new R, G, and B light-emitting elements is analyzed to identify the pad pose of the currently captured new R, G, and B light-emitting elements.

[0078] S34: Compare the pad pose of the newly captured R, G, and B light-emitting elements with the actual coordinate parameters of the circuit board and the area requiring repair. Analyze whether the pad pose of the newly captured R, G, and B light-emitting elements is consistent with the original pad pose at the area requiring repair. If there is a deviation, adjust the capture pose until the two poses are consistent.

[0079] Furthermore, in this specific embodiment, S3 also includes:

[0080] S35: Based on the actual coordinate parameters of the circuit board and the parts requiring repair, control the loading platform carrying the circuit board and the robotic arm that picks up the R, G, and B light-emitting elements to move closer to each other, and place the picked-up new R, G, and B light-emitting elements onto the circuit board that has been reapplied with solder and / or flux.

[0081] S36: Based on the actual coordinate parameters of the circuit board and the parts requiring repair, overlap the coordinates of the induction heating source and the pads on the circuit board where solder / flux has been reapplied.

[0082] S37: Allow the induction heating head in the induction heating source to move downward along the Z-axis direction, control the alternating magnetic field generated by the induction heating head again, and use the alternating magnetic field to induction heat the pads, the pads of the new R, G, B light-emitting elements and the reapplied solder, so as to solder the new R, G, B light-emitting elements to the circuit board.

[0083] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for reworking a circuit board with active induction heating, characterized in that, The repair method is as follows: S1: Data Acquisition: Inspect the circuit board and acquire the actual coordinate parameters of the circuit board and the parts that need to be reworked during this processing; S2: Induction heating desoldering: Based on the actual coordinate parameters of the circuit board and the part that needs to be repaired, the induction heating source is moved to the location that needs to be repaired, the original electronic components at that location are desoldered, the original electronic components are removed, and the original pads at that location are exposed. S3: Resoldering new components: Grab a new component with the same model and function as the original electronic component, transport it to the location where it needs to be repaired, and then move the induction heating source to that location to heat it a second time before soldering the new component to the original pads. Specifically, S1 is: S11: Perform AOI inspection on the circuit board to obtain the circuit board's external dimensions, the position coordinates of the faulty device on the circuit board, the fault type, the model of the faulty device, and the pose of the faulty device on the circuit board as ideal parameters. S12: Set up a loading platform with Y-axis freedom, place the circuit board that needs to be reworked on the loading platform, and transfer the ideal parameters of the circuit board and the part that needs to be reworked to the loading platform. S13: The camera is directed to take pictures of the circuit board from above the loading platform. The pictures of the circuit board are analyzed to identify and locate the marked points on the circuit board. S14: Based on the analysis of the markings on the circuit board, the actual placement of the current circuit board is determined. The ideal parameters are superimposed onto the current circuit board to obtain the actual coordinate parameters of the faulty device in the circuit board under the actual placement of the current circuit board. Specifically, S3 is: S33: The camera is positioned to take a downward-facing, upward-facing shot of the newly captured component. The image of the captured component is analyzed to identify the pads of the currently captured component. S34: Compare the pad pose of the newly captured component with the actual coordinate parameters of the circuit board and the part that needs to be reworked. Analyze whether the pad pose of the newly captured component is consistent with the original pad pose at the part that needs to be reworked. If there is a deviation between the two, adjust the capture pose until the two poses are consistent. Using AOI inspection to obtain the ideal coordinate parameters of the circuit board and the parts that need to be repaired as the first positioning measure, after the first positioning measure, the specific digital appearance parameters of the circuit board, the specific position of each component on the circuit board, the specific position coordinates of the faulty component that needs to be repaired on the circuit board, and its component installation posture parameters can be obtained. After the circuit board is placed on the loading platform, the camera captures the marked points to obtain the actual coordinate parameters of the circuit board and the parts that need to be reworked as a second positioning measure. After the second positioning measure, the ideal coordinate system originally established by AOI inspection can be superimposed with the actual circuit board. After the new component is retrieved, the camera captures and analyzes the pose of the retrieved component, and adjusts the actual pose of the new component to make it overlap with the actual circuit board.

2. The method for reworking a circuit board with active induction heating as described in claim 1, characterized in that, Specifically, S2 is: S21: An induction heating source with degrees of freedom in the X-axis and Z-axis directions is set, and the vertical projection point of the induction heating head in the XY plane is marked as the active heating point. S22: Based on the actual coordinate parameters of the faulty components in the circuit board, the loading platform and the induction heating source are moved simultaneously to move closer to each other, so that the points on the circuit board that need to be repaired are superimposed on the active heating points. S23: Detect the current circuit board substrate thickness, and the size and height data of components at the parts requiring repair; S24: Based on the current substrate thickness of the circuit board and the size and height of the components at the location requiring repair, adjust the height of the induction heating head in the induction heating source along the Z-axis direction, and control the alternating magnetic field generated by the induction heating head to cover the location requiring repair and melt the solder. S25: Recycle and remove loose original components to complete desoldering; S26: The induction heating source circuit board continuously heats the pads and residual solder layer on the pads to level them.

3. The method for reworking a circuit board with active induction heating as described in claim 2, characterized in that, S2 further includes: S27A: Set a soldering head with X-axis and Z-axis degrees of freedom, and use the projection point of the real-time solder outlet of the soldering head in the XY plane as the active soldering point. S28A: Based on the actual coordinate parameters of the pads of the faulty device, the loading platform and the soldering head are moved simultaneously to overlap the points on the circuit board that need to be repaired with the active soldering points. S29A: Allows the soldering tip to move downwards along the Z-axis to reapply solder to the exposed pads on the circuit board after desoldering.

4. The method for reworking a circuit board with active induction heating as described in claim 2, characterized in that, S2 further includes: S27B: Set up a flux head with X-axis and Z-axis degrees of freedom, and use the projection point of the real-time flux outlet position of the flux head in the XY plane as the fluxing point. S28B: Based on the actual coordinate parameters of the faulty device, the loading platform and flux head are moved simultaneously to overlap the points on the circuit board that need to be repaired with the fluxing points. S29B: Allows the flux tip to move down the Z-axis to reapply solder to the pads on the circuit board.

5. The method for reworking a circuit board with active induction heating as described in any one of claims 2-4, characterized in that, Specifically, S3 is: S31: Pre-classify and store new components that are fully functional and correspond to the existing components on the circuit board; S32: While applying solder or flux, select and retrieve a new component with the same function and model as the original component that was desoldered and removed.

6. The method for reworking a circuit board with active induction heating as described in claim 5, characterized in that, S3 further includes: S35: Based on the actual coordinate parameters of the circuit board and the part requiring repair, control the loading platform to move the circuit board closer to the new component and place the picked-up new component on the circuit board on which solder and / or flux have been reapplied. S36: Based on the actual coordinate parameters of the circuit board and the part requiring repair, move the induction heating head in the induction heating source above the pads on which solder and / or flux have been applied; S37: Allows the induction heating head in the induction heating source to move downward along the Z-axis direction, controls the alternating magnetic field generated by the induction heating head to induction heat the pads, the pads of the new component, and the reapplied solder, and solders the new component to the circuit board.

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