Semiconductor device and method of detecting the same

Abstract

The application discloses a kind of semiconductor equipment and its detection method, first by controlling surface data acquisition equipment to collect the surface data of current area;Next, the surface data of current area is obtained, and according to the surface data, control line scanning equipment is focused on scanning to current area, to form at least one line scanning image by photographing current area;Wherein, while the photographing of current area is completed in the current line scanning image, the current line scanning image is obtained, and the current line scanning image is identified and processed;And while the photographing of the last line scanning image of current area is completed, control surface data acquisition equipment starts to collect the surface data of next area;Finally, until the last line scanning image of the last area is identified and processed, detection ends;Thus, the efficiency of the whole detection process is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a semiconductor device and its testing method. Background Technology

[0002] High-precision line scanning equipment is increasingly used in panel inspection, mask inspection, and array inspection. To meet the requirements of different inspection processes, different inspection equipment and diverse inspection methods have been developed.

[0003] Due to limitations in the field of view and depth of focus of high-precision line scanning equipment, for large objects with undulating surfaces, the equipment needs to scan multiple times, each time targeting different areas sequentially. To obtain a clear image, the line scanning equipment needs to perform focus tracking based on the surface shape data of the object under the action of a motion mechanism. Conventional inspection processes typically involve acquiring surface shape data for all areas, then tracking the focus based on the surface shape data of each area to acquire an image, and finally performing image recognition and processing after all images have been acquired. This method is time-consuming and inefficient. Summary of the Invention

[0004] This invention provides a semiconductor device and its testing method to solve the problems of long testing time and low efficiency in existing semiconductor devices.

[0005] To achieve the above objectives, one embodiment of the present invention provides a semiconductor device testing method, comprising the following steps:

[0006] The control surface data acquisition device collects surface data of the current area;

[0007] Acquire the surface data of the current area, and control the line scanning device to perform focus scanning on the current area based on the surface data, so as to take a picture of the current area and form at least one line scan image;

[0008] Specifically, while the current line scan image of the current area is being captured, the current line scan image is acquired and then identified and processed.

[0009] And at the same time as the last line scan image of the current area is taken, control the face shape data acquisition device to start acquiring face shape data of the next area;

[0010] The aforementioned steps are repeated sequentially until the last line scan image of the last region is identified and processed, at which point the detection ends; wherein, each region is a scanning area divided on the surface of the device under test.

[0011] Optionally, after acquiring the current line scan image, and during the process of recognizing and processing the current line scan image, the method further includes:

[0012] At the same time as the next line scan image of the current area is captured, the next line scan image is acquired.

[0013] Optionally, before controlling the line scanning device to perform focus scanning on the current area to capture an image of the current area and form at least one line scan image, the method further includes:

[0014] Create a thread pool;

[0015] After controlling the line scanning device to perform focus scanning on the current area to capture an image of the current area and form at least one line scan image, the method further includes:

[0016] Each of the line scan images is assigned to a corresponding thread.

[0017] Optionally, acquiring the current line scan image and performing recognition and processing on the current line scan image simultaneously with the completion of capturing the current line scan image in the current region includes:

[0018] At the same time as the current line scan image in the current area is captured, the current line scan image is acquired, and the thread corresponding to the current line scan image is started to recognize and process the current line scan image.

[0019] Optionally, the method further includes the following steps before acquiring the current line scan image:

[0020] Create a memory pool;

[0021] After acquiring the current line scan image, the following is also included:

[0022] Allocate a first memory space to store the current line scan image.

[0023] Optionally, after recognizing and processing the current line scan image, the method further includes:

[0024] Release the first memory space and terminate the thread corresponding to the line scan image.

[0025] Optionally, after acquiring the next line scan image, the process further includes:

[0026] Allocate a second memory space to store the next line scan image.

[0027] To achieve the above objectives, another embodiment of the present invention provides a semiconductor device for implementing the semiconductor device testing method as described above, comprising: an industrial control computer, a surface data acquisition device, and a line scanning device; wherein the industrial control computer is connected to the surface data acquisition device and the line scanning device respectively;

[0028] The industrial control computer is used to control the surface data acquisition device to acquire surface data of the current area;

[0029] The industrial control computer acquires the surface data of the current area, and controls the line scanning device to perform focus scanning on the current area based on the surface data, so as to take a picture of the current area and form at least one line scan image;

[0030] Simultaneously, while the line scanning device completes capturing the current line scan image of the current area, the industrial control computer acquires the current line scan image and performs recognition and processing on the current line scan image;

[0031] Furthermore, while the line scanning device finishes taking the last line scan image of the current area, the industrial control computer controls the surface data acquisition device to start acquiring surface data of the next area.

[0032] Each of the aforementioned regions refers to a scanning area defined on the surface of the device under test.

[0033] Optionally, each of the regions is a strip region, and the path detected by the semiconductor device is a bow-shaped or Z-shaped path.

[0034] Optionally, the surface data acquisition device is a distance sensor; the line scanning device is a CCD line scanning camera or a CMOS line scanning camera.

[0035] According to the semiconductor device and its detection method proposed in the embodiments of the present invention, firstly, the surface pattern data of the current region is acquired by controlling the surface pattern data acquisition device; then, the surface pattern data of the current region is acquired, and based on the surface pattern data, the line scan device is controlled to perform focus scanning on the current region to take pictures of the current region and form at least one line scan image; wherein, at the same time as the current line scan image of the current region is taken, the current line scan image is acquired and identified and processed; and at the same time as the last line scan image of the current region is taken, the surface pattern data acquisition device is controlled to start acquiring the surface pattern data of the next region; finally, the detection ends when the last line scan image of the last region is identified and processed; wherein, each region is a scanning area divided on the surface of the device under test. Therefore, by acquiring the next image of the current region while recognizing and processing the current image of the current region, the steps of image recognition and processing overlap with the steps of acquiring the image, saving time. In addition, after acquiring the last image of the current region, the surface data of the next region is acquired, which further overlaps the steps of image recognition and processing with the steps of acquiring the surface data of the next region, saving time. Thus, the efficiency of the entire detection process is improved.

[0036] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the surface structure of the device under test;

[0039] Figure 2 This is a Gantt chart of the existing semiconductor device testing methods;

[0040] Figure 3 This is a flowchart of the semiconductor device testing method proposed in the embodiments of the present invention;

[0041] Figure 4 This is a schematic diagram of the structure of the semiconductor device proposed in the embodiments of the present invention;

[0042] Figure 5 It is a line scan path diagram of the surface of the device under test;

[0043] Figure 6 This is a Gantt chart of the semiconductor device testing process according to an embodiment of the present invention. Detailed Implementation

[0044] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0045] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0046] In a standard testing process, the surface profile data of each line of the device under test (DUT) is first acquired and saved to a storage device. Then, the surface profile data is used to test each line. The testing process proceeds one line at a time, until the next line is completed, and then the entire DUT is tested sequentially. To ensure the accuracy of the test results, the next line can only be tested after the current line has been tested. This results in a long overall testing time. Figure 1 This is a schematic diagram of the surface structure of the device under test (DUT). The standard testing process first obtains the surface data of line 201 on the DUT 200 in the forward direction according to the line number, and then obtains the surface data of line 202 in the reverse direction. Then, the surface data of the remaining line areas are obtained sequentially in the forward and reverse directions. Next, each line is inspected. The inspection process includes image acquisition and algorithm processing. First, line 201 is inspected in the forward direction. After line 201 is inspected, line 202 is inspected in the reverse direction, and then the remaining lines are inspected sequentially in the forward and reverse directions. The total time is the sum of the time spent acquiring surface data for each line and the time spent inspecting each line. The time distribution is as follows: Figure 2 The standard process is shown in the Gantt chart.

[0047] Figure 3 This is a flowchart of a semiconductor device testing method proposed in an embodiment of the present invention. Figure 3 As shown, the semiconductor device testing method includes the following steps:

[0048] S101, control the surface data acquisition device to acquire surface data of the current area;

[0049] The surface of the device under test 200 is divided into multiple regions before scanning, such as multiple strip-shaped regions (e.g., Figure 1 As shown), the surface data acquisition device can be a distance sensor, and the surface data acquisition device can move along... Figure 1The device scans the surface of the device under test 200 in a bow-shaped path to obtain surface data of the device under test 200. In this embodiment, the industrial control computer first controls the surface data acquisition device to acquire surface data of the current area (e.g., area 201).

[0050] S102, acquire the surface data of the current area, and control the line scanning device to perform focus scanning on the current area based on the surface data, so as to take a picture of the current area and form at least one line scan image;

[0051] Next, after the surface data acquisition device acquires the surface data of region 201, the industrial control computer acquires the surface data of region 201 and controls the line scanning device to perform focus scanning on region 201 based on the surface data of region 201, thereby taking a picture of region 201 to form at least one line scan image; wherein, the line scanning device can be a CCD line scan camera or a CMOS line scan camera.

[0052] S103: At the same time as the current line scan image of the current area is captured, the current line scan image is acquired and the current line scan image is identified and processed.

[0053] It should be noted that when the online scanning device takes a picture of area 201 to form the first online scanning image, the industrial control computer acquires the first online scanning image and performs recognition and processing on the first online scanning image. At the same time, the online scanning device takes a picture of area 201 to form the second online scanning image, and when the second online scanning image is taken, the industrial control computer acquires the second online scanning image and performs recognition and processing on the second online scanning image.

[0054] S104, and at the same time as the last line scan image of the current area is taken, control the surface data acquisition device to start acquiring surface data of the next area;

[0055] Understandably, after the last line scan image of region 201 is captured, the industrial control computer acquires and processes this last line scan image. Simultaneously, the industrial control computer controls the surface data acquisition device to acquire surface data of region 202. After acquiring the surface data of region 202, the industrial control computer, based on this data, controls the line scan device to perform focus-tracking scanning of region 202, sequentially acquiring at least one line scan image of region 202. After acquiring the first line scan image of region 202, the industrial control computer performs recognition and processing on it. After the line scan device acquires the second line scan image of region 202, the industrial control computer can acquire and process it; and so on.

[0056] S105, until the last line scan image of the last region is identified and processed, the detection ends; where each region is a scan area divided on the surface of the device under test.

[0057] Therefore, by using the above method, while recognizing and processing the last image of the previous region, the surface data of the next region can be collected. This allows for a temporal overlap between the steps of collecting the surface data of the next region and recognizing and processing the last image of the previous region. Consequently, compared to the existing technology that collects all surface data of the device under test, takes pictures of the device under test, acquires all images, and then finally recognizes and processes the images, this method significantly shortens the detection time and improves the detection efficiency.

[0058] Optionally, after acquiring the current line scan image, and during the process of recognizing and processing the current line scan image, the method further includes:

[0059] While the next line scan image of the current area is being captured, the next line scan image is acquired.

[0060] It should be noted that, since the time for image recognition and processing is longer than the time for the line scanning device to scan and capture an image, while recognizing and processing the previous line scan image, the line scanning device can also acquire the next line scan image after capturing it, and then recognize and process the next line scan image.

[0061] Therefore, after the online scanning device acquires a line scan image, the industrial control computer acquires a line scan image and performs recognition and processing on that image. There is no need to wait for the previous line scan image to be recognized and processed before acquiring the next line scan image. This allows for time overlap between the process of recognizing and processing the previous line scan image and the step of acquiring the next image, thus shortening the overall detection time.

[0062] Optionally, before controlling the line scanning device to perform focus scanning on the current area to take a picture of the current area and form at least one line scan image, the method further includes:

[0063] Create a thread pool;

[0064] After controlling the line scanning device to perform focus scanning on the current area to capture at least one line scan image of the current area, the process also includes:

[0065] Each line scan image is assigned to a corresponding thread.

[0066] Understandably, to enable parallel recognition and processing of multiple line scan images, the industrial control computer creates a thread pool before controlling the line scan device to perform focus tracking scanning of the current area to capture multiple line scan images. This ensures that after the line scan device performs focus tracking scanning of the current area to capture multiple line scan images, each line scan image corresponds to a specific thread. By using threads to process multiple line scan images in parallel, the detection time is further shortened.

[0067] Optionally, simultaneously with the completion of capturing the current line scan image in the current area, the current line scan image is acquired, and the current line scan image is recognized and processed, including:

[0068] While the current line scan image of the current area is being captured, the thread corresponding to the current line scan image is started to recognize and process the current line scan image.

[0069] It should be noted that after the online scanning device scans and captures multiple line scan images, each line scan image is pre-assigned a corresponding thread. Once the industrial control computer acquires the line scan image, it starts that thread to recognize and process it. The number of threads depends on the processing power of the industrial control computer's CPU. The number of threads and the number of line scan images that can be processed in parallel depends on the number of threads initially created.

[0070] Optionally, the method further includes the following steps before acquiring the current line scan image:

[0071] Create a memory pool;

[0072] After acquiring the current line scan image, the following steps are also included:

[0073] Allocate the first memory space to store the current line scan image.

[0074] Optionally, after recognizing and processing the current line scan image, the method further includes:

[0075] Release the first memory space and terminate the thread corresponding to the line scan image.

[0076] It should be noted that a memory pool is created before the industrial control computer acquires the line scan image. Therefore, after acquiring a line scan image, a memory space can be allocated to store it. This memory space is released after the line scan image recognition and processing are completed, and the thread corresponding to that line scan image is terminated. This facilitates control during the detection process and avoids unnecessary resource consumption.

[0077] Optionally, after acquiring the next line scan image of the current area, the process may also include:

[0078] Allocate a second memory space to store the next line scan image.

[0079] In other words, if the line scanning device captures the next line scanning image while recognizing and processing the previous line scan image, the industrial control computer can also capture the next line scan image and allocate a memory space to store it.

[0080] Therefore, by acquiring the next image of the current region while recognizing and processing the current image of the current region, the image recognition and processing steps overlap with the image acquisition steps, saving time. Furthermore, after acquiring the last image of the current region, the surface data of the next region is acquired, further overlapping the image recognition and processing steps with the acquisition of the next region's surface data, saving even more time. Moreover, the creation of thread pools and memory pools makes the entire detection process easier to manage, and parallel processing further saves time and avoids unnecessary resource consumption and storage waste, thus improving the efficiency of the entire detection process.

[0081] Figure 4 This is a schematic diagram of the structure of a semiconductor device proposed in an embodiment of the present invention. The device is used to implement the aforementioned semiconductor device testing method. The device 100 includes: an industrial control computer 4, a surface data acquisition device 1, and a line scanning device 2; the industrial control computer 4 is connected to the surface data acquisition device 1 and the line scanning device 2 respectively via connecting cables 3.

[0082] Industrial computer 4 is used to control surface data acquisition device 1 to acquire surface data of the current area;

[0083] The industrial control computer 4 acquires the surface data of the current area, and controls the line scanning device 2 to perform focus scanning on the current area based on the surface data, so as to take pictures of the current area and form at least one line scan image;

[0084] In this process, while the online scanning device 2 takes a picture of the current line scan image of the current area, the industrial control computer 4 acquires the current line scan image and performs recognition and processing on the current line scan image.

[0085] Furthermore, while the industrial control computer 4 and the online scanning device 2 are taking pictures of the last line scan image of the current area, the control device 1 starts collecting the surface data of the next area.

[0086] Each region is a scanning area defined on the surface of the device under test 200.

[0087] That is, the surface of the device under test 200 is divided into multiple regions before scanning, such as multiple strip-shaped regions (e.g., Figure 1As shown), the surface data acquisition device 1 can be a distance sensor, and the surface data acquisition device 1 can move along... Figure 1 The direction in the middle is the bow-shaped path or along Figure 5 The device scans the surface of the device under test (DUT) 200 using a zigzag path to obtain surface profile data. In this embodiment, firstly, the industrial control computer 4 controls the surface profile data acquisition device 1 to acquire surface profile data of the current region (e.g., region 201). Then, after the surface profile data acquisition device 1 acquires the surface profile data of region 201, the industrial control computer 4 acquires the surface profile data of region 201 and controls the line scanning device 2 to perform focus scanning on region 201 based on the surface profile data, thereby taking a picture of region 201 to form at least one line scan image; wherein, the line scanning device 2 can be a CCD line scan camera or a CMOS line scan camera.

[0088] It should be noted that when the online scanning device 2 takes a picture of area 201 to form the first online scanning image, the industrial control computer 4 acquires the first online scanning image and performs recognition and processing on the first online scanning image. At the same time, the online scanning device 2 takes a picture of area 201 to form the second online scanning image, and when the second online scanning image is taken, the industrial control computer 4 acquires the second online scanning image and performs recognition and processing on the second online scanning image.

[0089] Understandably, after the last line scan image of region 201 is captured, the industrial control computer 4 acquires the last line scan image of region 201 and performs recognition and processing on it. Simultaneously, the industrial control computer 4 controls the surface data acquisition device 1 to acquire surface data of region 202. After acquiring the surface data of region 202, the industrial control computer 4, based on the surface data of region 202, controls the line scan device 2 to perform focus-tracking scanning of region 202, sequentially acquiring multiple line scan images of region 202. After the industrial control computer 4 acquires the first line scan image of region 202, it performs recognition and processing on the first line scan image. After the line scan device 2 acquires the second line scan image of region 202, the industrial control computer 4 can acquire the second line scan image and perform recognition and processing on the second line scan image; and so on. This process continues until the industrial control computer 4 finishes recognizing and processing the last line scan image of the last region, at which point the entire detection process ends.

[0090] Therefore, when the semiconductor device 100 is recognizing and processing the last image of the previous region, it can collect surface data of the next region. This allows for a temporal overlap between the steps of collecting surface data of the next region and recognizing and processing the last image of the previous region. As a result, compared to the existing technology that collects all surface data of the device under test, takes pictures of the device under test, acquires all images, and then finally recognizes and processes the images, the detection time is greatly shortened and the detection efficiency is improved.

[0091] Optionally, each region is a strip-shaped area, and the path for semiconductor device detection is in a bow shape (e.g., ...). Figure 1 (as shown) or Z-shaped (such as) Figure 5 (As shown).

[0092] Figure 6 This is a Gantt chart illustrating the semiconductor device testing process according to an embodiment of the present invention. Throughout the testing process, from the second line to the penultimate line, there is a period of time for both surface data reading and algorithm processing. The length of this period is equal to the algorithm processing time minus the image acquisition time. The total time is the sum of the time spent acquiring surface data for each line and the time spent acquiring the image for each line, plus the time for one algorithm processing step minus the image acquisition time. The time distribution is as follows: Figure 6 As shown, through process improvement, if the entire product inspection is divided into N lines, the total time saved is N-1 algorithm processing times minus the image acquisition time. This shortens the overall inspection process time and improves inspection efficiency.

[0093] Optionally, after the industrial control computer 4 acquires the current line scan image and performs recognition and processing on the current line scan image, it also acquires the next line scan image at the same time as the next line scan image of the current area is captured.

[0094] It should be noted that, since the time for image recognition and processing is longer than the time for the line scanning device 2 to scan and capture an image, during the process of recognizing and processing the previous line scan image, after the line scanning device 2 has completed capturing the next line scan image, it can also acquire the next line scan image and then recognize and process the next line scan image.

[0095] Therefore, after the online scanning device 2 acquires a line scan image, the industrial control computer 4 acquires a line scan image and performs recognition and processing on the image. There is no need to wait for the previous line scan image to be recognized and processed before acquiring the next line scan image. This allows for time overlap between the process of recognizing and processing the previous line scan image and the step of acquiring the next image, thus shortening the overall detection time.

[0096] Optionally, before the industrial computer 4 controls the line scanning device 2 to perform focus scanning on the current area to take a picture of the current area and form at least one line scan image, the industrial computer 4 also creates a thread pool so that each line scan image corresponds to a corresponding thread.

[0097] Understandably, to enable parallel recognition and processing of multiple line scan images, the industrial control computer 4 creates a thread pool before controlling the line scan device 2 to perform focus-tracking scanning of the current area to capture images and form multiple line scan images. This ensures that after controlling the line scan device 2 to perform focus-tracking scanning of the current area to capture images and form multiple line scan images, each line scan image corresponds to a specific thread. By using threads to enable parallel processing of multiple line scan images, the detection time is further shortened.

[0098] Optionally, while the online scanning device 2 completes the capture of the current line scan image of the current area, the industrial control computer 4 acquires the current line scan image, starts the thread corresponding to the current line scan image, and performs recognition and processing on the current line scan image.

[0099] It should be noted that after the online scanning device 2 scans and captures multiple line scan images, each line scan image is pre-assigned a corresponding thread. Once the industrial control computer 4 acquires the line scan image, it starts that thread to recognize and process the image. The number of threads depends on the processing power of the industrial control computer 4's CPU. The number of threads and line scan images created initially allows for parallel processing.

[0100] Optionally, a memory pool is created before the industrial computer 4 acquires the current line scan image; and a first memory space is allocated after the industrial computer 4 acquires the current line scan image to store the current line scan image. After the industrial computer 4 recognizes and processes the current line scan image, the first memory space is released and the thread corresponding to the line scan image is terminated.

[0101] It should be noted that before the industrial control computer 4 acquires the line scan image, a memory pool is created. Therefore, after acquiring a line scan image, a memory space can be allocated to store it. This memory space is released after the line scan image recognition and processing are completed, and the thread corresponding to that line scan image is terminated. This facilitates control during the detection process and avoids unnecessary resource consumption.

[0102] Optionally, while the online scanning device 2 completes taking the next line scan image of the current area, the industrial control computer 4, after acquiring the next line scan image, also allocates a second memory space to store the next line scan image.

[0103] In other words, if the line scanning device 2 captures the next line scanning image while recognizing and processing the previous line scan image, the industrial control computer 4 can also capture the next line scan image and allocate a memory space to store the line scan image.

[0104] Therefore, by acquiring the next image of the current region while recognizing and processing the current image of the current region, the image recognition and processing steps overlap with the image acquisition steps, saving time. Furthermore, after acquiring the last image of the current region, the surface data of the next region is acquired, further overlapping the image recognition and processing steps with the acquisition of the next region's surface data, saving even more time. Moreover, the creation of thread pools and memory pools makes the entire detection process easier to manage, and parallel processing further saves time and avoids unnecessary resource consumption and storage waste, thus improving the efficiency of the entire detection process.

[0105] In summary, the semiconductor device and its detection method according to the embodiments of the present invention firstly acquire surface pattern data of the current region by controlling a surface pattern data acquisition device; then, acquire the surface pattern data of the current region, and based on the surface pattern data, control a line scan device to perform focus scanning on the current region to take pictures of the current region and form at least one line scan image; wherein, while the current line scan image of the current region is being taken, the current line scan image is acquired and identified and processed; and while the last line scan image of the current region is being taken, the surface pattern data acquisition device is controlled to start acquiring surface pattern data of the next region; finally, the detection ends when the last line scan image of the last region is identified and processed; wherein, each region is a scanning area divided on the surface of the device under test. Therefore, by acquiring the next image of the current region while recognizing and processing the current image of the current region, the steps of image recognition and processing overlap with the steps of acquiring the image, saving time. In addition, after acquiring the last image of the current region, the surface data of the next region is acquired, which further overlaps the steps of image recognition and processing with the steps of acquiring the surface data of the next region, saving time. Thus, the efficiency of the entire detection process is improved.

[0106] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0107] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for testing semiconductor devices, characterized in that, Includes the following steps: The control surface data acquisition device collects surface data of the current area; Acquire the surface data of the current area, and control the line scanning device to perform focus scanning on the current area based on the surface data, so as to take a picture of the current area and form at least one line scan image; Specifically, while the current line scan image of the current area is being captured, the current line scan image is acquired and then identified and processed. The time for recognizing and processing the current line scan image is greater than the time for the line scan device to scan and capture an image. Therefore, there is a time difference between recognizing and processing the previous line scan image and after the line scan device completes capturing the line scan image. During this time difference, the next line scan image is acquired, and then the next line scan image is recognized and processed. And at the same time as the last line scan image of the current area is taken, the face data acquisition device is controlled to start acquiring face data of the next area, so that there is a time overlap between the steps of acquiring face data of the next area and recognizing and processing the last image of the previous area; The aforementioned steps are repeated sequentially until the last line scan image of the last region is identified and processed, at which point the detection ends; wherein, each region is a scanning area divided on the surface of the device under test.

2. The semiconductor device testing method according to claim 1, characterized in that, After acquiring the current line scan image, and during the process of recognizing and processing the current line scan image, the method further includes: At the same time that the line scanning device completes taking the next line scan image of the current area, the next line scan image is acquired.

3. The semiconductor device testing method according to claim 1, characterized in that, Before controlling the line scanning device to perform focus scanning on the current area to take a picture of the current area and form at least one line scan image, the method further includes: Create a thread pool; After controlling the line scanning device to perform focus scanning on the current area to capture an image of the current area and form at least one line scan image, the method further includes: Each of the line scan images is assigned to a corresponding thread.

4. The semiconductor device testing method according to claim 3, characterized in that, Simultaneously with the completion of capturing the current line scan image in the current area, the acquisition of the current line scan image and the recognition and processing of the current line scan image include: At the same time as the current line scan image in the current area is captured, the current line scan image is acquired, and the thread corresponding to the current line scan image is started to recognize and process the current line scan image.

5. The semiconductor device testing method according to claim 4, characterized in that, Before acquiring the current line scan image, the following steps are also included: Create a memory pool; After acquiring the current line scan image, the following is also included: Allocate a first memory space to store the current line scan image.

6. The semiconductor device testing method according to claim 5, characterized in that, After recognizing and processing the current line scan image, the process also includes: Release the first memory space and terminate the thread corresponding to the line scan image.

7. The semiconductor device testing method according to claim 5, characterized in that, Simultaneously with the completion of capturing the next line scan image of the current area, after acquiring the next line scan image, the process also includes: Allocate a second memory space to store the next line scan image.

8. A semiconductor device, characterized in that, A method for implementing the semiconductor device testing method as described in any one of claims 1-7 includes: an industrial control computer, a surface data acquisition device, and a line scanning device; wherein the industrial control computer is connected to the surface data acquisition device and the line scanning device respectively. The industrial control computer is used to control the surface data acquisition device to acquire surface data of the current area; The industrial control computer acquires the surface data of the current area, and controls the line scanning device to perform focus scanning on the current area based on the surface data, so as to take a picture of the current area and form at least one line scan image; Simultaneously, while the line scanning device completes capturing the current line scan image of the current area, the industrial control computer acquires the current line scan image and performs recognition and processing on the current line scan image; Furthermore, while the line scanning device finishes taking the last line scan image of the current area, the industrial control computer controls the surface data acquisition device to start acquiring surface data of the next area. Each of the aforementioned regions refers to a scanning area defined on the surface of the device under test.

9. The semiconductor device according to claim 8, characterized in that, Each of the aforementioned regions is a strip-shaped region, and the path detected by the semiconductor device is either bow-shaped or zig-shaped.

10. The semiconductor device according to claim 8, characterized in that, The surface data acquisition device is a distance sensor; the line scanning device is a CCD line scanning camera or a CMOS line scanning camera.

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