Heat sink with easy solder structure

Abstract

The present application provides a heat dissipation device with easy welding structure to solve the problem of difficult improvement of welding efficiency of the existing heat dissipation device. It comprises two plate bodies, a partition and a pump. The inner surfaces of the two plate bodies are respectively connected with the partition, one of the plate bodies and the partition has a first chamber, the other plate body and the partition has a second chamber, and the first chamber and the second chamber are connected by a communication port and a return port of the partition. The pump drives a working fluid to circulate in the first chamber and the second chamber. The outer surfaces of the two plate bodies each have a weld ring groove, so that the plate thickness of the two plate bodies at the weld ring groove is thinner to form an easy welding structure, and the two plate bodies are laser welded to the partition along the two weld ring grooves.

Description

Technical Field

[0001] This invention relates to a heat dissipation device, and more particularly to a heat dissipation device with a solderable structure that helps electronic devices maintain a proper operating temperature. Background Technology

[0002] Please refer to Figure 1 This is a partially enlarged side sectional view of a conventional heat dissipation device 9. The conventional heat dissipation device 9 has a lower plate 91 and an upper plate 92. The lower plate 91 is generally flat, while the upper plate 92 is partially protruding by stamping. After laser welding, the lower plate 91 and the upper plate 92 together define a chamber 93 internally. A capillary structure 94 is sintered onto the inner surface of the upper plate 92, and the capillary structure 94 and a working fluid L are both located in the chamber 93. Thus, the lower plate 91 can be attached to a heat source H of the electronic device, absorbing the heat energy of the heat source H. The working fluid L undergoes a gas-liquid phase change in the chamber 93, dissipating the heat energy from the heat source H, allowing the heat source H to be maintained at a suitable operating temperature and preventing overheating of the electronic device. A similar embodiment of this conventional heat dissipation device 9 has been disclosed in Taiwan Patent Publication No. 202026807.

[0003] However, even though both the lower plate 91 and the upper plate 92 are thin plates, the thickness of the laser-welded joint is no different from that of other parts; that is, when the lower plate 91 and the upper plate 92 are laser-welded, the material at the joint absorbs the laser energy and forms a molten pool together. W The time required for laser welding (eld pool) is independent of the selected welding position, and there is no way to shorten the time or reduce the welding energy consumption. Therefore, it is difficult to improve the laser welding efficiency of the existing heat dissipation device 9, and it is also difficult to further reduce the cost of laser welding.

[0004] Therefore, there is indeed a need to improve the existing heat dissipation devices. Summary of the Invention

[0005] To address the aforementioned problems, the present invention aims to provide a heat dissipation device with an easy-to-solder structure, which allows at least one plate to have a particularly thin plate thickness at the point where laser welding is to be performed, thereby shortening the time required for the material to form a molten pool and reducing welding energy consumption.

[0006] A further objective of this invention is to provide a heat dissipation device with an easy-to-solder structure, which can improve the convenience and quality of soldering.

[0007] Another object of the present invention is to provide a heat dissipation device with a solderable structure that can improve the heat dissipation efficiency of the heat source.

[0008] Another object of the present invention is to provide a heat dissipation device with an easy-to-solder structure, which can improve the ease of assembly.

[0009] The directional terms or their approximate terms used throughout this invention, such as "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and "side," are primarily for reference to the directions in the accompanying drawings. These directional terms or their approximate terms are only used to assist in explaining and understanding the various embodiments of this invention and are not intended to limit the invention. Furthermore, the term "axial direction" throughout this invention refers to the direction in which the rotational axis of the pump impeller extends.

[0010] The use of the quantifiers “a” or “an” for the components and parts described throughout this invention is for convenience and to provide the general meaning of the scope of the invention; in this invention, it should be interpreted as including one or at least one, and a single concept also includes multiple cases, unless it clearly means otherwise.

[0011] The terms "combination," "integration," or "assembly" used throughout this invention mainly refer to the types of connections that allow for separation without damaging the components, or connections that make the components inseparable. These are options that those skilled in the art can choose based on the material of the components to be connected or the assembly requirements.

[0012] A heat dissipation device with an easily solderable structure according to the present invention includes: two plates, each having an outer surface and an inner surface opposite to each other, the inner surfaces of the two plates being connected, and the two plates forming a cavity filled with a working fluid; wherein, at least one of the two plates has a weld bead groove on its outer surface, the weld bead groove surrounding the outer perimeter of the cavity, the weld bead groove having a bottom surface, the minimum distance from the bottom surface of the groove to the inner surface of the same plate being less than the minimum distance from the outer surface of the same plate to the inner surface of the same plate, and the two plates being laser-welded together along the weld bead groove.

[0013] Another heat dissipation device with an easily solderable structure according to the present invention includes: two plates, each having an outer surface and an inner surface opposite to each other; a partition, wherein the inner surfaces of the two plates are respectively in contact with the partition, one of the plates and the partition having a first chamber, and the other plate and the partition having a second chamber, and the first chamber and the second chamber being connected by a communication port and a return port of the partition; and a pump driving a working fluid to circulate in the first chamber and the second chamber; wherein each of the outer surfaces of the two plates has a weld bead groove, the two weld bead grooves respectively surrounding the outer perimeter of the first chamber and the second chamber, each weld bead groove having a bottom surface, the minimum distance from the bottom surface of the groove to the inner surface of the same plate being less than the minimum distance from the outer surface of the same plate to the inner surface of the same plate, and the two plates are laser welded to the partition along the two weld bead grooves respectively.

[0014] Therefore, the heat dissipation device with an easy-to-weld structure of the present invention, because the plate is thinner at the weld groove, forms an easy-to-weld structure, so that the laser beam can penetrate the plate more easily during laser welding. The time required for the materials at the junction to absorb laser energy and form a molten pool together is less than the time required for other thicker parts of the plate. The energy consumed by the overall laser welding is also relatively reduced, which has the effects of improving laser welding efficiency and reducing laser welding cost.

[0015] The chamber may contain a capillary structure. This improves the efficiency of the gas-liquid phase change of the working fluid.

[0016] Each of the two plates can have a weld bead groove on its outer surface. This allows for easy laser welding on both sides of the heat dissipation device with its easy-to-weld structure, improving welding convenience.

[0017] The two weld bead annular grooves can be staggered. This avoids deformation or damage to the corresponding weld bead annular grooves, thus improving welding quality.

[0018] The two weld bead annular grooves can be positioned relative to each other. This allows laser welding to be performed from the same location on either side without needing to reposition the laser head and workpiece, thus improving process efficiency.

[0019] In this configuration, at least one of the two plates may have multiple support pillars located within the chamber, and the outer surface of the plate with the multiple support pillars may have a recess at each support pillar. Thus, the plate thickness at the recessed area can be reduced to form an easily weldable structure, which improves laser welding efficiency and reduces energy consumption.

[0020] The heat dissipation device with a solderable structure may further include a pump that drives the working fluid to circulate within the chamber. Thus, the heat dissipation device with a solderable structure can form a liquid-cooled heat dissipation module, offering advantages such as excellent applicability.

[0021] In this configuration, at least one of the two plates may have multiple spacers located in the first or second chamber, and a flow channel may be formed between any two adjacent spacers. The outer surface of the plate with the multiple spacers may have a groove at each spacer. In this way, the plate thickness at the groove can be reduced to form an easy-to-solder structure, which has the effects of improving laser welding efficiency and reducing energy consumption.

[0022] In this configuration, at least one of the two plates may have multiple support pillars located in the first or second chamber, and the outer surface of the plate with the multiple support pillars may have a notch at each support pillar. Thus, the plate thickness at the notch can be reduced to form a weldable structure, which improves laser welding efficiency and reduces energy consumption.

[0023] The partition can have a recessed groove filled with a phase-change fluid. This groove can be sealed by a cover and is not connected to the first or second chamber. This effectively acts as a heat spreader on the partition, improving heat dissipation efficiency from the heat source.

[0024] The partition can have a recessed groove containing a rough structure. This improves the efficiency of heat dissipation from the heat source.

[0025] In this configuration, at least one of the two plates may have multiple spacers located within the first or second chamber, and a flow channel may be formed between any two adjacent spacers. A rough structure may connect the partition or the plate, and the rough structure may span the multiple flow channels. This improves assembly convenience and heat dissipation efficiency.

[0026] In this configuration, at least one of the two plates has multiple spacers located within the first or second chamber, with a flow channel formed between any two adjacent spacers. At least one of the two plates also has an auxiliary heat dissipation section that spans the multiple flow channels. This design improves the efficiency of heat dissipation from the heat source.

[0027] The auxiliary heat dissipation section may have a protruding wall in one of the first or second chambers. This protruding wall may form a groove on the outer side of the plate, which may be filled with a phase-change fluid. The groove may be sealed by a cover and is not connected to the first or second chamber. In this way, it functions as a heat spreader on the plate, improving the heat dissipation efficiency of the heat source.

[0028] The auxiliary heat dissipation unit may have a cover attached to the surface of the plate facing the partition. A phase change cavity may be formed within the cover, and the phase change cavity may be filled with a phase change fluid. The phase change cavity is not connected to the first chamber or the second chamber. In this way, it is equivalent to setting a heat spreader on the plate, which has the effect of improving the heat dissipation efficiency of the heat source.

[0029] The weld bead groove can be formed on the plate using an etching process. This improves the forming yield and facilitates the development of thinner profiles.

[0030] The weld bead annular groove can have two opposing sidewalls, which can be connected to the bottom surface of the groove. This improves the convenience of laser welding.

[0031] The inner surface and the bottom surface of the groove can be connected to a circumferential surface of the same plate. In this way, the weld groove extends to the outer side of the plate, giving the weld groove a larger opening for forming, which improves the convenience and efficiency of forming.

[0032] The working fluid can be a non-conductive liquid. This eliminates the need for an additional waterproof structure on the pump stator, simplifying the structure of the heat dissipation device with its easily solderable design and improving manufacturing convenience. Attached Figure Description

[0033] Figure 1 : A partially enlarged side sectional view of an existing heat dissipation device;

[0034] Figure 2 : An exploded perspective view of a partial cross-section of the first embodiment of the present invention;

[0035] Figure 3 Cross-sectional view of the first embodiment of the present invention;

[0036] Figure 4 : An exploded perspective view of a partial cross-section of the second embodiment of the present invention;

[0037] Figure 5 Cross-sectional view of the second embodiment of the present invention;

[0038] Figure 6 Cross-sectional view of the third embodiment of the present invention;

[0039] Figure 7 : An exploded perspective view of the fourth embodiment of the present invention;

[0040] Figure 8 : A combined front view of the fourth embodiment of the present invention;

[0041] Figure 9 :along Figure 8 AA-line cross-section;

[0042] Figure 10 : An exploded perspective view of the fifth embodiment of the present invention;

[0043] Figure 11 : An exploded perspective view of a portion of the first plate, the second plate, and the partition plate according to the fifth embodiment of the present invention;

[0044] Figure 12 : A combined front view of the fifth embodiment of the present invention;

[0045] Figure 13 :along Figure 12 BB line cross-section;

[0046] Figure 14 :like Figure 13 A cross-sectional view of a heat dissipation device with an easily weldable structure and another weld bead annular groove type;

[0047] Figure 15 : An exploded perspective view of the sixth embodiment of the present invention;

[0048] Figure 16 The sixth embodiment of the present invention combines the following edges. Figure 15 A cross-sectional view of the CC line;

[0049] Figure 17 : A partial cross-sectional view of the seventh embodiment of the present invention;

[0050] Figure 18 : An exploded perspective view of the eighth embodiment of the present invention;

[0051] Figure 19 The eighth embodiment of the present invention combines the following edges. Figure 18 A cross-sectional view of the DD line;

[0052] Figure 20 :like Figure 15 And a cross-sectional view of the rough structure connected to the second plate.

[0053] Explanation of reference numerals in the attached figures

[0054] [This Invention]

[0055] 1: First board

[0056] 11: First outer surface

[0057] 12: First inner surface

[0058] 13: Weld bead annular groove

[0059] 131: Ditch bottom surface

[0060] 132: Sidewall

[0061] 14: Circumferential surface

[0062] 15: Outer convex part

[0063] 16: Spacer bar

[0064] 17: Groove

[0065] 18: Support column

[0066] 19: Concave / Negative

[0067] 2: Second board

[0068] 21: Second outer surface

[0069] 22: Second inner surface

[0070] 23: Weld bead annular groove

[0071] 24: Support column

[0072] 25: Concave

[0073] 26: Spacer bar

[0074] 27: Groove

[0075] 28: Outer convex part

[0076] 29: Auxiliary heat dissipation unit

[0077] 291: Protruding Wall

[0078] 292: Groove

[0079] 293: Cover plate

[0080] 294: Cover

[0081] 295: Phase Change Cavity

[0082] 3: Pump

[0083] 4: partition

[0084] 41: Connecting Port

[0085] 42: Return port

[0086] 43: Container

[0087] 44: Cover plate

[0088] D1, D2: Minimum distance

[0089] F: Flow channel

[0090] H: Heat source

[0091] L, L1: Working fluid

[0092] L2: Phase change fluid

[0093] P1: Capillary structure

[0094] P2: Rough structure

[0095] S: Chamber

[0096] S1: First Chamber

[0097] S2: Second chamber

[0098]

existing

[0099] 9: Heat dissipation device

[0100] 91: Lower board

[0101] 92:On the board

[0102] 93: Chamber

[0103] 94: Capillary structure

[0104] H: Heat source

[0105] L: Working fluid. Detailed Implementation

[0106] To make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments of the present invention are described below in detail with reference to the accompanying drawings:

[0107] Please refer to Figure 2 As shown, this is a first embodiment of the heat dissipation device with an easy-to-solder structure of the present invention, which includes two plates that can be joined together. For ease of explanation, the two plates are referred to as a first plate 1 and a second plate 2, respectively. However, the present invention does not limit the two plates to their relative positions in the drawings. That is to say, although the plate located above is labeled as the first plate 1 and the other is labeled as the second plate 2 in the drawings of this embodiment, in other embodiments, the plate located above can also be referred to as the second plate 2 and the other as the first plate 1, which is understood by those skilled in the art.

[0108] The first plate 1 and the second plate 2 may each be made of, for example, copper, aluminum, titanium, stainless steel or other thermally conductive materials, and the materials of the first plate 1 and the second plate 2 may be the same or different. The first plate 1 has a first outer surface 11 and a first inner surface 12 opposite to each other, and the second plate 2 has a second outer surface 21 and a second inner surface 22 opposite to each other so as to be in contact.

[0109] Please refer to Figure 2 , Figure 3 As shown, the present invention does not limit the form of the first plate 1 and the second plate 2, as long as they can be combined to form a cavity S for filling a working fluid L. The working fluid L can be, for example, but is not limited to, a non-conductive liquid. For example, in this embodiment, the first plate 1 and the second plate 2 can each reduce the thickness of the plate from the inside to form a recess, and have a ring wall surrounding the periphery of the recess. The first inner surface 12 of the first plate 1 and the second inner surface 22 of the second plate 2 refer to the inner surface of their respective ring walls; that is, the first inner surface 12 and the second inner surface 22 of this embodiment do not include the area with the recess. Therefore, the first inner surface 12 of the first plate 1 and the second inner surface 22 of the second plate 2 can respectively surround the periphery of the two recesses, and after the first inner surface 12 and the second inner surface 22 are in contact, the two recesses can jointly form the cavity S. When the thickness of the first plate 1 and the second plate 2 is extremely thin, the two recesses can be formed by etching; when the thickness of the first plate 1 and the second plate 2 is relatively thick, the two recesses can be formed by milling.

[0110] On the other hand, the first outer surface 11 of the first plate 1 may also have a weld bead groove 13, which may surround the periphery of the cavity S. The weld bead groove 13 may be formed by a material removal method, so that the plate thickness of the first plate 1 at the location of the weld bead groove 13 is thinner (compared to the portion adjacent to the weld bead groove 13) to form an easy-to-weld structure; that is, the present invention excludes bending the plate by means of stamping or the like, and forms an annular groove on the outer surface of the plate without changing the plate thickness.

[0111] In detail, the weld bead annular groove 13 in this embodiment can also be etched or milled depending on the thickness of the first plate 1. The weld bead annular groove 13 does not penetrate to the first inner surface 12 but has a groove bottom surface 131, and the minimum distance D1 from the groove bottom surface 131 to the first inner surface 12 is less than the minimum distance D2 from the first outer surface 11 to the first inner surface 12. The present invention does not limit the shape of the weld bead annular groove 13, with the principle of enabling the local thickness of the first plate 1 to be thinned to form an easy-to-weld structure; in this embodiment, the weld bead annular groove 13 can be an annular groove recessed from the first outer surface 11, so that the weld bead annular groove 13 can have two opposing sidewalls 132, and the two sidewalls 132 can be directly or indirectly connected to the groove bottom surface 131, and the groove bottom surface 131 can be selected from at least one of a plane, an inclined plane and an arc surface, and is not limited to the shape shown in the figures of this embodiment.

[0112] Thus, when assembling the heat dissipation device with the easy-to-solder structure, the first plate 1 and the second plate 2 can be laser-welded together along the weld bead groove 13, so that the first inner surface 12 of the first plate 1 and the second inner surface 22 of the second plate 2 can be firmly bonded. Since the first plate 1 is thinner at the location of the weld bead groove 13 to form the easy-to-solder structure, the laser beam can penetrate the first plate 1 more easily during laser welding from the first plate 1 side. This reduces the time required for the materials at the junction of the first plate 1 and the second plate 2 to absorb laser energy and form a molten pool compared to other thicker areas, thereby improving laser welding efficiency. Furthermore, the overall energy consumed by laser welding is also relatively reduced, achieving the effect of reducing laser welding costs.

[0113] Similarly, the second outer surface 21 of the second plate 2 can also have another weld bead groove 23, which also surrounds the periphery of the cavity S, so that the effect described above can be achieved when laser welding is performed from the side of the second plate 2. Therefore, both sides of the heat dissipation device with the easy-to-solder structure can be easily laser welded. The two weld bead grooves 13 and 23 can be formed as follows: Figure 3 The phase misalignment shown is intended to prevent deformation or damage to the corresponding weld annular groove 23 (or weld annular groove 13) during laser welding from the weld annular groove 13 (or the weld annular groove 23).

[0114] The assembled heat dissipation device with a solderable structure can be thermally connected to a heat source H of the electronic device via the first plate 1 or the second plate 2, for example, through direct contact or indirect contact using a thermally conductive material such as a thermal pad. Taking the second plate 2 as an example of thermally connecting the heat source H, the first plate 1 can be connected to a heat sink assembly, or a cooling fan can drive airflow through the first plate 1, ensuring that the temperature of the first plate 1 is lower than that of the second plate 2. Thus, during the operation of the electronic device, when the temperature of the heat source H rises, the second plate 2 can absorb the heat energy from the heat source H, causing the liquid working fluid L in the chamber S to absorb heat, rise in temperature, and vaporize. Meanwhile, the gaseous working fluid L can release heat, cool down, and condense back into liquid working fluid L upon contact with the relatively low-temperature first plate 1. Therefore, the heat dissipation device with a solderable structure can continuously generate gas-liquid phase changes with the working fluid L to effectively remove the heat energy from the heat source H, help the heat source H dissipate heat to maintain an appropriate operating temperature, and prevent the electronic device from overheating and affecting its performance.

[0115] Please refer to Figure 4 , Figure 5 As shown, this is a second embodiment of the heat dissipation device with an easy-to-solder structure of the present invention. In this embodiment, a second plate 2 similar to the first embodiment can be selected, and the second plate 2 has the weld bead groove 23. In addition, changing the first plate 1 to a thinner flat plate helps to reduce the overall thickness of the heat dissipation device with an easy-to-solder structure.

[0116] In addition to laser welding the first plate 1 and the second plate 2 together along the weld bead groove 23 of the second plate 2, the second plate 2 may also have a plurality of support pillars 24 located in the cavity S. The height of the plurality of support pillars 24 is approximately the same as the depth of the cavity S, so that the plurality of support pillars 24 can abut against the first plate 1, providing an auxiliary support effect, which helps the cavity S maintain a roughly fixed volume and prevents the heat dissipation device with the easy-to-weld structure from undergoing local deformation. The second outer surface 21 of the second plate 2 may have a recess 25 at each aligning support pillar 24. The recess 25 may be formed by a material removal method, so that the plate thickness of the second plate 2 at the recess 25 can also be reduced (compared to the form without the recess 25) to form an easy-to-weld structure. Thus, when assembling the heat dissipation device with the easy-to-solder structure, the second plate 2 and the first plate 1 can be laser-welded together according to each recess 25, and the laser welding process time and energy consumption can be shortened by using the multiple recesses 25. Similarly, in the structure of the first embodiment described above, the first plate 1 and the second plate 2 can each have multiple support columns 24 so that they can be joined and laser-welded together by the corresponding support columns 24.

[0117] Please refer to Figure 6As shown, this is a third embodiment of the heat dissipation device with an easy-to-solder structure according to the present invention. In this embodiment, a weld bead annular groove 13 can be provided in the first plate 1. The first plate 1 has a circumferential surface 14 located between a first outer surface 11 and a first inner surface 12 of the first plate 1, and the circumferential surface 14 connects the first inner surface 12 and a groove bottom surface 131 of the weld bead annular groove 13; that is, the weld bead annular groove 13 extends to the outside of the first plate 1, so that the weld bead annular groove 13 has a larger opening for forming. The minimum distance D1 from the groove bottom surface 131 of the weld bead annular groove 13 to the first inner surface 12 is smaller than the minimum distance D2 from the first outer surface 11 to the first inner surface 12. In addition, the chamber S can also have a capillary structure P1, which helps to improve the gas-liquid phase change efficiency of the working fluid L.

[0118] It is worth mentioning that the heat dissipation device with a solderable structure in the first to third embodiments described above can be a vapor chamber (VC), a flat heat pipe (FHP), or a similar device. The weld bead annular groove 13 can be provided on the first plate 1, or on the second plate 2, or both. When both are provided, the weld bead annular groove 13 on the first plate 1 and the weld bead annular groove 23 on the second plate 2 can be of the same or different types, which is understandable to those skilled in the art, and therefore not limited to the types disclosed in the figures.

[0119] Please refer to Figure 7 , Figure 8 As shown, this is the fourth embodiment of the heat dissipation device with an easy-to-solder structure of the present invention. The heat dissipation device with an easy-to-solder structure in this embodiment can be a liquid-cooled heat dissipation module. There is a chamber S between the first plate 1 and the second plate 2 which are laser-welded together, and a working fluid L is driven by a pump 3 to circulate in the chamber S.

[0120] In detail, the recess for forming the chamber S can be located inside the first plate 1 and / or the second plate 2. In this embodiment, the chamber S can form a meandering flow channel, and the pump 3 can drive the working fluid L from the head end to the tail end of the flow channel and continuously circulate it. In this embodiment, an external protrusion 15 can also be provided on the first plate 1, and at least a portion of the pump 3 can be accommodated in the external protrusion 15. The external protrusion 15 can be integrally formed with other parts of the first plate 1 to prevent leakage, for example, by stamping. Alternatively, a through-hole can be provided on the first plate 1, and a convex cap can be aligned with the through-hole and attached to the first outer surface 11 of the first plate 1, so that the convex cap forms the external protrusion 15 of the first plate 1. The present invention does not limit the scope of the invention.

[0121] Please refer to Figure 9 As shown, in this embodiment, the weld bead annular groove 13 can be provided on the first plate 1, or the weld bead annular groove 23 can be provided on the second plate 2, or both can be provided. When both are provided, the weld bead annular groove 13 of the first plate 1 and the weld bead annular groove 23 of the second plate 2 can be the same or different in form, and can be in a relative or staggered position. This is understandable to those skilled in the art, and therefore not limited to the forms shown in the figures. When the weld bead annular groove 13 of the first plate 1 and the weld bead annular groove 23 of the second plate 2 are in a relative position, the heat dissipation device with an easy-to-solder structure can be laser welded from the same position on either side without needing to re-align the relative positions of the laser head and the workpiece.

[0122] Please refer to Figure 8 As shown, the assembled heat dissipation device with a solderable structure can be locally thermally connected to a heat source H of the electronic device via the first plate 1 or the second plate 2, for example, through direct contact or indirect contact using a thermally conductive material such as a thermal pad. Taking the local thermal connection of the second plate 2 to the heat source H as an example, a heat sink assembly can be connected to the part of the first plate 1 or the second plate 2 away from the heat source H, or a cooling fan can drive airflow through the area away from the heat source H, thus ensuring that the temperature at the area away from the heat source H is lower than the temperature at the adjacent heat source H. In this way, when the temperature of the heat source H rises, the second plate 2 can locally absorb the heat energy from the heat source H, causing the working fluid L flowing near the heat source H to absorb heat and rise in temperature. Subsequently, when flowing away from the heat source H, it releases heat and cools down upon contact with the relatively low-temperature plate portion, and flows back into the pump 3 to start another cycle. Therefore, the planar circulating liquid cooling heat dissipation module can effectively remove the heat energy from the heat source H, help the heat source H dissipate heat to maintain an appropriate operating temperature, and prevent the electronic device from overheating and affecting its performance.

[0123] Please refer to Figure 10 , Figure 13 As shown, this is the fifth embodiment of the heat dissipation device with a solderable structure according to the present invention. This embodiment of the heat dissipation device with a solderable structure can be a liquid-cooled heat dissipation module, with a partition 4 located between a first plate 1 and a second plate 2, dividing the liquid-cooled heat dissipation module into a first chamber S1 and a second chamber S2. In this embodiment, the first chamber S1 is located between the first plate 1 and the partition 4, and the second chamber S2 is located between the second plate 2 and the partition 4. The partition 4 also has a connecting port 41 and a return port 42, allowing the first chamber S1 and the second chamber S2 to form axial layers, connected by the connecting port 41 and the return port 42, so that a working fluid L1 driven by a pump 3 circulates in the first chamber S1 and the second chamber S2. The working fluid L1 can be a non-conductive liquid, and the stator of the pump 3 does not need to have an additional waterproof structure.

[0124] In detail, the first inner surface 12 of the first plate 1 and the second inner surface 22 of the second plate 2 face the partition 4 respectively. In this embodiment, the thickness of the first plate 1 and the second plate 2 can be reduced from the inside to form a recess, so that the first inner surface 12 of the first plate 1 and the second inner surface 22 of the second plate 2 can respectively surround the two recesses. After the first inner surface 12 and the second inner surface 22 are respectively in contact with the partition 4, the recess of the first plate 1 and the partition 4 can jointly form the first chamber S1, and the recess of the second plate 2 and the partition 4 can jointly form the second chamber S2. When the thickness of the first plate 1 and the second plate 2 is extremely thin, the two recesses can be formed by etching; when the thickness of the first plate 1 and the second plate 2 is relatively thick, the two recesses can be formed by milling.

[0125] Please refer to Figure 11 , Figure 13 As shown, the first outer surface 11 of the first plate 1 may have a weld bead groove 13, which may surround the periphery of the first chamber S1. The weld bead groove 13 may be formed by a material removal method, so that the plate thickness of the first plate 1 at the location of the weld bead groove 13 is thinner (compared to the portion adjacent to the weld bead groove 13) to form an easy-to-weld structure. Similarly, the second outer surface 21 of the second plate 2 may have a weld bead groove 23, which may surround the periphery of the second chamber S2. The weld bead groove 23 may be formed by a material removal method, so that the plate thickness of the second plate 2 at the location of the weld bead groove 23 is thinner (compared to the portion adjacent to the weld bead groove 23) to form an easy-to-weld structure. Thus, when assembling the heat dissipation device with the easy-to-solder structure, the first plate 1 and the partition plate 4 can be laser welded together along the weld groove 13, and the second plate 2 and the partition plate 4 can be laser welded together along the weld groove 23. The laser welding process time and energy consumption can be shortened by using the two weld grooves 13 and 23.

[0126] Furthermore, the two weld bead annular grooves 13 and 23 can be as follows: Figure 13 As shown, it is an annular groove recessed from the first outer surface 11 and the second outer surface 21; or as... Figure 14 As shown, the two weld bead grooves 13 and 23 extend to the outer sides of the first plate 1 and the second plate 2, respectively; or as shown... Figure 19 As shown, the two weld bead annular grooves 13 and 23 are each one of the aforementioned types, and the present invention does not limit them.

[0127] In addition, please refer to Figure 10 , Figure 13As shown, the first plate 1 and the second plate 2 may each have multiple spacer bars 16 and 26 located in the first chamber S1 and the second chamber S2, respectively. The multiple spacer bars 16 and 26 located in the same chamber are generally parallel to each other and extend generally along the direction connecting the connecting port 41 and the return port 42 (i.e., the flow direction of the working fluid L1), forming a flow channel F between any two adjacent spacer bars 16 and 26. This helps guide the working fluid L1 to flow more uniformly and smoothly in the first chamber S1 or the second chamber S2. The multiple spacer bars 16 and 26 may not extend to the periphery of the connecting port 41 in the first chamber S1 and the second chamber S2, so that the working fluid L1 gathers near the connecting port 41 and passes through the connecting port 41 more smoothly. Furthermore, the first outer surface 11 of the first plate 1 and the second outer surface 21 of the second plate 2 may each have a groove 17 and 27 at the corresponding spacers 16 and 26. These grooves 17 and 27 can be formed using a material removal method, allowing the thickness of the first plate 1 and the second plate 2 at the locations of the grooves 17 and 27 to be reduced (compared to the configuration without the grooves 17 and 27), thus creating a solderable structure. In this way, when assembling the heat dissipation device with the solderable structure, the second plate 2 and the first plate 1 can be laser-welded together at each groove 17 and 27, and the multiple grooves 17 and 27 can shorten the laser welding process time and reduce energy consumption.

[0128] Please refer to Figure 12 , Figure 13As shown, the first plate 1 and the second plate 2 may each have multiple support columns 18 and 24. These multiple support columns 18 and 24 are located in the first chamber S1 and the second chamber S2, and are mainly located where the spacers 16 and 26 are not present. The height of the multiple support columns 18 and 24 and the multiple spacers 16 and 26 can be approximately the same as the depth of the first chamber S1 or the second chamber S2 (excluding the location where the pump 3 is located), so that the multiple support columns 18 and 24 and the multiple spacers 16 and 26 can abut against the partition plate 4, providing auxiliary support and helping the first chamber S1 or the second chamber S2 maintain a generally fixed volume, preventing local deformation of the heat dissipation device with a solderable structure. The first outer surface 11 of the first plate 1 may have a recess 19 at each aligning support column 16. This recess 19 can be formed using a material removal method, making the plate thickness of the first plate 1 thinner at the recess 19 location (compared to the form without the recess 19) to create a solderable structure. Similarly, the second outer surface 21 of the second plate 2 may have a recess 25, which can also be formed using a material removal method, making the plate thickness of the second plate 2 thinner at the recess 25 location (compared to the form without the recess 25) to create a solderable structure. Thus, when assembling the heat dissipation device with the solderable structure, the first plate 1 can be laser-welded to the partition plate 4 at each recess 19, and the second plate 2 can be laser-welded to the partition plate 4 at each recess 25. The multiple recesses 19 and 25 shorten the laser welding process time and reduce energy consumption.

[0129] On the other hand, please refer to Figure 10 As shown, in this embodiment, an outward protrusion 28 can be provided on the second plate 2, and at least a portion of the pump 3 can be accommodated within the outward protrusion 28. The outward protrusion 28 can be integrally formed with other parts of the second plate 2 to prevent leakage, for example, by stamping. Alternatively, a through-hole can be provided on the second plate 2, and a convex cap can be aligned with the through-hole and attached to the second outer surface 21 of the second plate 2, so that the convex cap forms the outward protrusion 28 of the second plate 2. The present invention does not impose any limitations on these provisions.

[0130] Please refer to Figure 11 , Figure 13As shown, the partition 4 can be generally flat, or more specifically, a groove 43 can be recessed on one of its surfaces. The groove 43 can be filled with a phase-change fluid L2, and is sealed by a cover plate 44, preventing it from communicating with the first chamber S1 or the second chamber S2. In other words, the phase-change fluid L2 in the groove 43 will not mix with the working fluid L1 circulating in the first chamber S1 and the second chamber S2. The phase-change fluid L2 and the working fluid L1 can have the same or different compositions, and the phase-change fluid L2 is preferably a non-conductive liquid. Therefore, the groove 43, the cover plate 44, and the phase-change fluid L2 can function as a heat spreader on the partition 4, and their range and position can be adjusted according to the needs of the heat source H, thus helping to improve the heat dissipation efficiency of the heat dissipation device with its easily solderable structure for the heat source H.

[0131] Please refer to again Figure 10 , Figure 13 As shown, the assembled heat dissipation device with a solderable structure can be thermally connected to a heat source H of the electronic device via the first plate 1 or the second plate 2, for example, through direct contact or indirect contact using a thermally conductive material such as a thermal pad. Taking the second plate 2 as an example of thermally connecting the heat source H, the first plate 1 can be connected to a heat sink assembly, or a cooling fan can drive airflow through the first plate 1, so that the temperature of the first plate 1 is lower than the temperature of the second plate 2. Thus, during the operation of the electronic device, when the temperature of the heat source H rises, the second plate 2 can absorb the heat energy from the heat source H, causing the working fluid L1 flowing through the second chamber S2 to absorb heat and rise in temperature. Subsequently, when flowing through the first chamber S1, it releases heat and cools down due to contact with the relatively low-temperature first plate 1. Therefore, the heat dissipation device with a solderable structure can effectively remove heat from the heat source H by continuously circulating the working fluid L1 between the first chamber S1 and the second chamber S2, thus helping to dissipate heat and maintain an appropriate operating temperature, preventing the electronic device from overheating and affecting its performance. The electronic devices to which this solderable heat dissipation device is applicable include, but are not limited to, mobile phones, tablet computers, handheld game consoles, laptops, desktop computers, camera equipment, smart wearable devices, AR / VR glasses, or electronic medical devices.

[0132] Please refer to Figure 15 , Figure 16 As shown, this is the sixth embodiment of the heat dissipation device with an easy-to-solder structure of the present invention. This embodiment generally follows the structure of the aforementioned fifth embodiment, and in this embodiment, the heat dissipation plate disposed on the partition 4 can be moved to the first plate 1 or the second plate 2; or the partition 4 can retain its heat dissipation plate, and an additional heat dissipation plate can be added to the first plate 1 or the second plate 2. The following description takes the example of moving the heat dissipation plate disposed on the partition 4 to the second plate 2, but it is not limited thereto.

[0133] In detail, the second plate 2 may have an auxiliary heat dissipation section 29, which may have a protruding wall 291 protruding from the second chamber S2. The protruding wall 291 may form a groove 292 on the outer side of the second plate 2. The groove 292 may be filled with a phase change fluid L2. The groove 292 may be closed by a cover plate 293 and is not in communication with the second chamber S2 or the first chamber S1. Preferably, the auxiliary heat dissipation section 29 spans multiple flow channels F in the second chamber S2, and the multiple spacers 26 of the second plate 2 may be arranged in conjunction with the auxiliary heat dissipation section 29 to be disconnected front and back. Therefore, this embodiment can further improve the heat dissipation efficiency of the heat source H by means of the auxiliary heat dissipation section 29.

[0134] Please refer to Figure 17 As shown, this is the seventh embodiment of the heat dissipation device with a solderable structure of the present invention. In this embodiment, the auxiliary heat dissipation part 29 can be a cover 294 with an internal groove, and the cover 294 is attached to the surface of the second plate 2 facing the partition 4, so that the groove in the cover 294 can form a phase change cavity 295. The phase change cavity 295 can be filled with a phase change fluid L2, and the phase change cavity 295 is not connected to the second chamber S2 or the first chamber S1. Therefore, this embodiment can also further improve the heat dissipation efficiency of the heat source H by means of the auxiliary heat dissipation part 29.

[0135] Please refer to Figure 18 , Figure 19 As shown, this is the eighth embodiment of the heat dissipation device with an easy-to-solder structure of the present invention. This embodiment generally follows the structure of the aforementioned fifth embodiment, and the heat dissipation plate provided on the partition 4 can be replaced with a rough structure P2.

[0136] Specifically, the partition 4 may have a rough structure P2 within the receiving groove 43, which may be, for example, formed by sintering copper powder. Preferably, the rough structure P2 does not protrude from the receiving groove 43 where it faces the plurality of spacers 16 of the first plate 1, to prevent it from being crushed and deformed by the spacers 16. Additionally, the second chamber S2 may also have a rough structure P2; for example, it may be as follows: Figure 19 As shown, the rough structure P2 is connected to the surface of the partition 4 facing the second plate 2, or as... Figure 20As shown, the rough structure P2 is connected to the surface of the second plate 2 facing the partition 4, and the multiple spacers 26 of the second plate 2 can be connected in a way that allows the rough structure P2 to be separated. Preferably, the rough structure P2 located in the second chamber S2 spans multiple flow channels F within the second chamber S2. Therefore, the heat dissipation device with a solderable structure can further improve the heat dissipation efficiency against the heat source H by means of the rough structure P2.

[0137] It is worth mentioning that the heat dissipation device with a solderable structure in the aforementioned fifth to eighth embodiments can be a liquid-cooled heat dissipation module or a similar device. Since the first plate 1 and the second plate 2 are laser-welded to the partition 4 respectively, it is preferable that each of the first plate 1 and the second plate 2 has a weld bead groove 13 and 23. This ensures that when laser welding is performed from both sides of the heat dissipation device with a solderable structure, there are thinner sections of the plate available for welding to form a solderable structure, thereby shortening the laser welding process time and reducing energy consumption. Furthermore, the weld bead groove 13 of the first plate 1 and the weld bead groove 23 of the second plate 2 can be of the same or different types, which is understandable to those skilled in the art, and therefore not limited to the types shown in the figures. In addition, the weld bead groove 13 of the first plate 1 and the weld bead groove 23 of the second plate 2 can form a shape such as... Figure 13 , Figure 14 , Figure 19 The phase misalignment shown can also form as follows: Figure 16 , Figure 17 , Figure 20 The relative positions shown; and when in relative positions, the partition 4 that separates the first plate 1 and the second plate 2 can be used to avoid the situation of local deformation or damage to the relative plates during laser welding, and the heat dissipation device with easy-to-weld structure can be laser welded from the same position on either side without re-aligning the relative positions of the laser head and the workpiece, which helps to improve process efficiency.

[0138] In summary, the heat dissipation device with an easy-to-weld structure of the present invention, due to the thinner plate thickness at the weld groove, forms an easy-to-weld structure, which allows the laser beam to penetrate the plate more easily during laser welding. This reduces the time required for the materials at the junction to absorb laser energy and form a molten pool compared to other thicker areas, and also relatively reduces the overall energy consumed in laser welding. This has the advantages of improving laser welding efficiency and reducing laser welding costs.

[0139] Although the present invention has been disclosed using the above preferred embodiments, it is not intended to limit the present invention. Any modifications and alterations made by those skilled in the art to the above embodiments without departing from the spirit and scope of the present invention shall still fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A heat dissipating device having a solderable structure, characterized by comprising: The application relates to a heat dissipation device, comprising: two plate bodies, each having an outer surface and an inner surface; a partition plate, the inner surfaces of the two plate bodies are connected with the partition plate, a first cavity is formed between one of the plate bodies and the partition plate, a second cavity is formed between the other plate body and the partition plate, the first cavity and the second cavity are connected by a communication port and a return port of the partition plate, at least one of the plate bodies has a plurality of interval strips in the first cavity or the second cavity, a flow channel is formed between any two adjacent interval strips, at least one of the plate bodies has an auxiliary heat dissipation part which spans the flow channels, the auxiliary heat dissipation part has a cover which is combined with the surface of the plate body facing the partition plate, a phase change cavity is formed in the cover, the phase change cavity is filled with a phase change fluid, and the phase change cavity is not communicated with the first cavity or the second cavity; and a pump which drives a working fluid to circulate in the first cavity and the second cavity; wherein the outer surfaces of the two plate bodies each have a weld ring groove, the two weld ring grooves are arranged around the periphery of the first cavity and the second cavity respectively, each weld ring groove has a groove bottom surface, the minimum distance from the groove bottom surface to the inner surface of the same plate body is smaller than the minimum distance from the outer surface of the same plate body to the inner surface of the same plate body, and the two plate bodies are laser welded with the partition plate along the two weld ring grooves, the weld ring groove has two opposite side walls connected with the groove bottom surface.

2. The heat dissipating device having a solderable structure according to claim 1, wherein, The two weld ring grooves are staggered.

3. The heat dissipating device having a solderable structure according to claim 1, wherein, The two weld ring grooves are opposite.

4. The heat dissipating device having a solderable structure according to any one of claims 1 to 3, wherein The plate body is formed by etching process to form the weld ring groove.

5. The heat dissipating device having a solderable structure according to any one of claims 1 to 3, wherein The inner surface and the groove bottom surface are connected with a circumferential surface of the same plate body.

6. The heat dissipating device having a solderable structure according to any one of claims 1 to 3, wherein The working fluid is non-conductive liquid.

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