Semiconductor strip cutting and sorting equipment, package drying equipment and handling equipment

Abstract

Embodiments of the present invention provide semiconductor strip cutting and sorting equipment, package drying device and conveying device. The package drying device for drying singulated packages in the semiconductor strip cutting and sorting equipment according to the embodiment of the present invention comprises: a base for placing the packages; a gantry for being movable above or below the base; an air jet unit for being arranged on the gantry and spraying air toward the packages placed on the base; and a suction unit for being arranged adjacent to the air jet unit in the gantry and sucking liquid scattered from the packages.

Description

Technical Field

[0001] The present invention relates to a package drying device in a semiconductor strip cutting and sorting device, and more particularly to a device for rapidly and effectively drying singulated packages. Background Art

[0002] Semiconductor manufacturing processes are processes for manufacturing semiconductor elements on wafers, including exposure, evaporation, etching, ion implantation, cleaning, etc. Semiconductor strip cutting and sorting equipment cuts a strip with multiple packages into individual packages, cleans, dries, and inspects each package, and then sorts and loads it into a final storage container, i.e., a tray, into normal or defective states.

[0003] Inspection of each package is performed using a visual inspection device such as a camera. For precise inspection, each package needs to be free of foreign matter that may hinder the inspection. The cleaning liquid used to clean the cut package may also become an obstacle during the inspection process, so it is necessary to manage it so that no cleaning liquid remains on the package. Summary of the invention

[0004] Therefore, embodiments of the present invention provide a package drying device capable of quickly and effectively removing a cleaning liquid remaining in singulated semiconductor packages and a semiconductor strip cutting and sorting apparatus including the package drying device.

[0005] The problems to be solved by the present invention are not limited to those mentioned above, and other problems to be solved that are not mentioned can be clearly understood by those skilled in the art from the following description.

[0006] According to an embodiment of the present invention, a package drying device for drying individual packages in a semiconductor strip cutting and sorting device includes: a base on which the package is placed; a gantry which is movably arranged above or below the base; a jet unit which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit which is arranged adjacent to the jet unit in the gantry and sucks liquid scattered from the package.

[0007] According to an embodiment of the present invention, the base may include: a placement portion for placing the packaging body; and a protruding portion that protrudes more than the placement portion.

[0008] According to an embodiment of the present invention, the placement portion may have the same size and shape as the package body.

[0009] According to an embodiment of the present invention, the protruding portion may protrude from the seating portion to a height equal to a thickness of the package body.

[0010] According to an embodiment of the present invention, the jet unit may jet air in an inclined direction.

[0011] According to an embodiment of the present invention, the suction unit may be located in a direction in which the jet unit is inclined.

[0012] According to an embodiment of the present invention, the suction unit may be inclined in a direction opposite to a direction in which the jet unit is inclined.

[0013] According to an embodiment of the present invention, a package transporting device for transporting singulated packages in a semiconductor strip cutting and sorting device includes: a turning table including a base for placing the package and a rotating shaft for rotating the base; a drying unit for drying the package placed on the base; and a portable fixture table for receiving the package from the turning table. The drying unit includes: a gantry, which is arranged to be movable above or below the base; an air jet unit, which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit, which is arranged adjacent to the air jet unit in the gantry and sucks liquid scattered from the package.

[0014] The semiconductor strip cutting and sorting equipment according to an embodiment of the present invention includes: a loading unit for loading a semiconductor strip configured with a plurality of packages; a cutting unit for cutting the semiconductor strip and conveying individualized semiconductor packages; and a sorting unit for drying and inspecting the semiconductor packages and storing them in a tray. The sorting unit includes: a turning table including a base for placing the packages and a rotating shaft for rotating the base; a drying unit for drying the packages placed on the base; and a portable fixture table for receiving the packages from the turning table. The base includes: a placing portion for placing the packages; and a protruding portion formed in the remaining area of ​​the base except the placing portion and protruding from the placing portion. The drying unit includes: a gantry for being movably arranged above or below the base; an air jet unit arranged on the gantry for jetting air toward the packages placed on the base; and a suction unit arranged adjacent to the air jet unit in the gantry for sucking liquid scattered from the packages.

[0015] According to an embodiment of the present invention, the suction unit is configured as an air jet unit that jets air toward the package body and a device that sucks water vapor scattered from the package body, thereby removing water vapor from the package body and preventing the water vapor from scattering to the surrounding area.

[0016] The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic structure of a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention is shown.

[0018] Figure 2 as well as Figure 3 The inversion table is shown in a state where the package is sucked.

[0019] Figure 4 The process of removing moisture from a package by jetting air is shown.

[0020] Figures 5 to 8 A base on which a package body is mounted is shown according to an embodiment of the present invention.

[0021] Fig. 9 The structure of a drying unit for drying a package body according to an embodiment of the present invention is shown.

[0022] Fig.10 A structure of a drying unit for drying a package body according to another embodiment of the present invention is shown.

[0023] (Explanation of Reference Numerals)

[0024] 100: Loading unit 200: Cutting unit

[0025] 205: Temporary storage unit 210: Strip picker

[0026] 220: Package picker 230: Guide frame

[0027] 240: Chuck 250: Cutter

[0028] 260: Cleaning unit 300: Sorting unit

[0029] 310: Turning table 311: Peripheral frame

[0030] 312: Base 313: Rotation axis

[0031] 320: Drying unit 321: Gantry

[0032] 322: Jet unit 323: Suction unit

[0033] 324: moving body 325: first connecting member

[0034] 326: Second connecting member

[0035] 330B: Ball inspection unit 330M: Mark inspection unit

[0036] 340: First pallet fixture driving component 341: First pallet fixture platform

[0037] 345: Second pallet fixture driving component 346: Second pallet fixture stage

[0038] 350: First transport tray driving component 351: First transport tray

[0039] 352: Second unloading tray 355: Unloading tray driving component

[0040] 356: Second transport tray 360: Inspection section

[0041] 370: Sorting picker 380: Sorting picker drive component

[0042] 800: Classification Section P: Semiconductor Package

[0043] S:Semiconductor strip DETAILED DESCRIPTION

[0044] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0045] In order to clearly describe the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the entire specification.

[0046] In addition, among the multiple embodiments, the same reference numerals are used for components having the same structure and only a representative embodiment is described, and in the remaining embodiments, only the structure different from the representative embodiment is described.

[0047] Throughout the specification, when it is stated that a part is "connected (or coupled)" to another part, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" with other components placed in between. In addition, when it is stated that a part "includes" a certain constituent element, unless otherwise stated, it means that other constituent elements may be included rather than excluded.

[0048] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having the same meaning as that in the context of the relevant technology, and will not be ideally or excessively interpreted as formal meanings unless explicitly defined in this application.

[0049] Figure 1 FIG. 2 shows a schematic structure of a semiconductor strip cutting and sorting device 10 according to an embodiment of the present invention. Figure 1, a semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100 , a cutting unit 200 , and a sorting unit 300 .

[0050] The semiconductor strip cutting and sorting apparatus 10 according to the embodiment of the present invention includes a loading unit 100 for loading a semiconductor strip S configured with a plurality of packages, a cutting unit 200 for cutting the semiconductor strip S and transferring singulated packages P, and a sorting unit 300 for drying and inspecting the packages P and storing them in a tray.

[0051] The loading unit 100 transfers the semiconductor strip S sent from the outside to the temporary storage unit 205 of the cutting unit 200. Figure 1 As shown in detail, the loading unit 100 may include a magazine for loading the semiconductor strips S and a pusher for pushing and delivering the semiconductor strips S. The semiconductor strips S supplied to the loading unit 100 may be located in the temporary storage unit 205 .

[0052] The strip picker 210 holds the semiconductor strip S located in the temporary storage unit 205 and transfers it to the chuck 240. The package picker 220 holds the package P cut by the cutter 250 and transferred by the chuck 240 by vacuum adsorption and transfers it to the cleaning unit 260 and the turning table 310. The guide frame 230 provides a path for the strip picker 210 and the package picker 220 to move in the X-axis direction. The guide frame 230 can be combined with a driving unit for moving the strip picker 210 and the package picker 220.

[0053] The chuck 240 can transfer the semiconductor strip S and the package P between the strip picker 210 and the cutter 250 and between the cutter 250 and the package picker 220, respectively. The chuck 240 can move in the Y-axis direction, can rotate around the Z-axis direction, and can place the semiconductor strip S. The chuck 240 adsorbs the semiconductor strip S transferred by the strip picker 210 and transfers it to the cutter 250. In addition, the chuck 240 transfers a plurality of packages P cut by the cutter 250 to the package picker 220. That is, the chuck 240 can reciprocate between the cutter 250 and the first guide frame 230. It can be that the package picker 220 adsorbs the semiconductor package P cleaned in the cleaning unit 260 and transfers it to the flip table 310, and the semiconductor package P transferred to the flip table 310 is dried by the drying unit 320. The flip table 310 can move along the guide frame 230.

[0054] The classification unit 300 classifies the semiconductor packages P according to the inspection results of the semiconductor packages P. The classification unit 300 may be referred to as a transport device for transporting the individual packages P. More specifically, the classification unit 300 independently picks up the semiconductor packages P loaded on the first and second travel jig stages 341 and 346 after the inspection by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360, and classifies them in sequence according to the inspection results and transports them to other locations. The first travel jig stage 341 and the second travel jig stage 346 may be moved by the first travel jig driving component 340 and the second travel jig driving component 345, respectively.

[0055] The sorting unit 300 for this purpose may include a sorting picker 370 , a sorting picker driving part 380 , a first carry-out tray 351 , a second carry-out tray 356 , a first carry-out tray driving part 350 , and a second carry-out tray driving part 355 .

[0056] The sorting picker 370 picks up the semiconductor package P that has been inspected by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 and is loaded on the first accompanying fixture table 341 and the second accompanying fixture table 346 respectively, and transfers it to the first carry-out tray 351 and the second carry-out tray 356 to be described later.

[0057] The sorting picker driving part 380 may be formed in a guide rail shape and arranged along the X-axis direction, and a part thereof is arranged adjacent to the alignment inspection unit 360. The sorting picker driving part 380 moves the sorting picker 370 in the X-axis direction. For this purpose, the sorting picker driving part 380 may be equipped with a driving tool for moving the sorting picker 370.

[0058] The first unloading tray 351 and the second unloading tray 356 can be loaded with qualified semiconductor packages P and unqualified semiconductor packages P respectively and unloaded to other locations. Different from this, the first unloading tray 351 and the second unloading tray 356 can also evaluate the grade of the semiconductor packages P according to the manufacturing status and load them respectively according to the grade. For example, the first unloading tray 351 can be loaded with semiconductor packages P of grade A, and the second unloading tray 356 can be loaded with semiconductor packages P of grade B whose manufacturing status is lower than grade A.

[0059] When the sorting picker 370 picks up the semiconductor packages P from the first accompanying fixture table 341 and the second accompanying fixture table 346 and loads them all on the first carrying tray 351 or the second carrying tray 356, the first carrying tray 351 or the second carrying tray 356 moves in the Y-axis direction to transfer the semiconductor packages P to other locations.

[0060] The first output tray driving part 350 moves the first output tray 351. The first output tray driving part 350 may have a built-in driving means for moving the first output tray 351.

[0061] The second output tray driving part 355 moves the second output tray 356. The second output tray driving part 355 may have a built-in driving means for moving the second output tray 356.

[0062] The semiconductor strip cutting and sorting device 10 can cut, clean, dry, inspect, and sort the semiconductor strips S as described above and discharge them to other locations. On the other hand, the package picker 220 according to the embodiment of the present invention is not limited to being included in the semiconductor strip cutting and sorting device 10, and can be applied to a general semiconductor package manufacturing system. Hereinafter, an apparatus and method for quickly and effectively drying the package P in the drying unit 320 using a cleaning liquid in the cleaning unit 260 will be described.

[0063] Generally, the semiconductor strip S and the package P are composed of a spherical surface B formed with a ball (Ball) for electrical connection and a marking surface M engraved with a mark of each package P. On the other hand, the state in which the spherical surface B of the package P faces upward and the marking surface M faces downward is referred to as a dead bug, and the state in which the marking surface M of the package P faces upward and the spherical surface B faces downward is referred to as a live bug. The cutting and cleaning processes in the cutting unit 200 are performed in the dead bug state in which the spherical surface B faces upward, and each package P is transferred to the flip table 310 through the package picker 220 in the dead bug state.

[0064] Reference Figure 2 (a) and Figure 3 (a), the flip table 310 includes: a peripheral frame 311 that can move in the horizontal direction; a base 312 that absorbs and fixes the package P; and a rotation axis 313 that allows the base 312 to rotate relative to the peripheral frame 311. The base 312 can rotate around the rotation axis 313 in a state of sucking the marking surface M of the package P. Figure 2 As in (a), the spherical surface B of the package P faces upward. Alternatively, Figure 3 As shown in (b), the spherical surface B of the package P faces downward.

[0065] Figure 4 The process of removing moisture from a package by jetting air is shown. Figure 4 , cleaning liquid remains around the package body P placed on the base 312, and the jet unit 322 jets air toward the package body P from above to remove moisture. Figure 4As indicated by the dotted line in the figure, water vapor accumulates due to the step between the base 312 and the package P. It is difficult to remove the accumulated water vapor even by spraying air, and spraying air toward the step generates noise and may adversely affect the working environment.

[0066] At the same time, if air is sprayed onto the package P, part of the water vapor evaporates and the other part of the water vapor may be scattered to other devices around it. Figure 1 As shown, a visual inspection device such as a ball inspection unit 330B may be provided around the drying unit 320. If water vapor is scattered to the visual inspection device, it may have a bad influence on the subsequent inspection function.

[0067] Therefore, an embodiment of the present invention provides a drying device capable of quickly and effectively removing moisture from the package body P. According to an embodiment of the present invention, the suction unit 323 is formed together with the jet unit 322 to suck the scattered moisture, thereby preventing the moisture from scattering to the peripheral devices. In addition, according to an embodiment of the present invention, a placement portion 312A for placing the package body P and a protrusion 312B protruding from the placement portion 312A are formed on the base 312 to remove the step between the package body P and the base 312, thereby preventing moisture from accumulating on the step.

[0068] According to an embodiment of the present invention, a package drying device for drying individual packages P in a semiconductor strip cutting and sorting device 10 includes: a base 312 for placing the package P; a gantry 321, which is arranged to be movable above the base 312; a jet unit 322, which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit 323, which is arranged adjacent to the jet unit 322 in the gantry 321 and sucks liquid scattered from the package P.

[0069] Figures 5 to 7 A base 312 is shown on which the package is mounted, according to an embodiment of the present invention. Figure 5 The base 312 is shown without the package P mounted thereon. Figure 6 The base 312 is shown with the package P placed thereon. Figure 7 Still another form of base 312 is shown.

[0070] like Figure 5 as well as Figure 6 As shown, the base 312 includes a placement portion 312A for placing the package body P and a protruding portion 312B that protrudes from the placement portion 312A. Figure 5 As shown, a receiving portion 312A formed in a groove shape capable of receiving a package is arranged in the base 312. In addition, a protruding portion 312B protruding upward from the receiving portion 312A is formed in the remaining area of ​​the base 312 except the receiving portion 312A.

[0071] According to an embodiment of the present invention, the mounting portion 312A may have the same size and shape as the package body P. Figure 5 as well as Figure 6 As shown, the placement portion 312A is formed in a manner having the same size and shape as the package body P, and the protrusion 312B is formed in the remaining area. The package body P is embedded in the placement portion 312A formed in the form of a groove, and there is no step or it is very narrow between the package body P and the protrusion 312B, so that the cleaning liquid cannot penetrate. The placement portion 312A can be formed to be the same as the package body P or slightly larger, and it can be designed according to the embodiment in consideration of tolerance and the size that the cleaning liquid can penetrate.

[0072] According to an embodiment of the present invention, the protrusion 312B may protrude from the mounting portion 312A to a height equal to the thickness of the package body P. The protrusion height of the protrusion 312B is configured to be the same as that of the package body P, thereby preventing a step from being generated between the package body P and the protrusion 312B, and ultimately preventing water vapor from accumulating on the step and the cleaning liquid from remaining in the package body P.

[0073] On the other hand, the base 312 can be provided in various shapes. Figure 5 as well as Figure 6 As shown, the placement portion 312A can be configured in an array form, such as Figure 7 As shown, the placement portions 312A may be configured so that the packages P are not adjacent to each other in the row direction and the column direction.

[0074] According to an embodiment of the present invention, the base 312 can be changed according to the type of the package P. That is, when processing a package P of a different type from the previous process, another type of base 312 can be used. In addition, the base 312 can be divided into two models, one for common use for various types of packages P, and the other for changing according to the type of the package P.

[0075] For example, Figure 8 As shown, the base 312 may include a base plate 3122 commonly used for multiple types of packages P and an adsorption plate 3121 detachably coupled to the base plate 3122. The adsorption plate 3121 directly in contact with the package P includes a placement portion 312A and a protrusion 312B, and the placement portion 312A and the protrusion 312B may have different shapes according to the type of package P. For example, the size and dimension of the placement portion 312A or the protrusion height of the protrusion 312B may be different according to the type of package P.

[0076] Fig. 9 as well as Fig.10 The structure of a drying unit for drying a package body according to an embodiment of the present invention is shown. Fig. 9 The drying unit 320 is shown to be located above the base 312. Fig.10 The drying unit 320 is shown as being located below the base 312 .

[0077] Reference Fig. 9 as well as Fig.10 The package P is placed in the placement portion 312A between the protrusions 312B of the base 312. The drying device for removing moisture from the package P includes: a gantry 321, which is movably provided above or below the base 312; an air jet unit 322, which is provided on the gantry and sprays air toward the package placed on the base; and a suction unit 323, which is provided adjacent to the air jet unit 322 in the gantry 321 and sucks liquid scattered from the package P.

[0078] like Fig. 9 as well as Fig.10 As shown, the moving body 324 is configured to move in a horizontal direction (e.g., x direction) along with the gantry 321, the jet unit 322 is coupled to the moving body 324 via a first coupling member 325, and the suction unit 323 is coupled to the moving body 324 via a second coupling member 326. That is, the jet unit 322 and the suction unit 323 can move in a horizontal direction (e.g., x direction) together with the moving body 324 that moves along with the gantry 321.

[0079] According to an embodiment of the present invention, the jet unit 322 can jet air in an inclined direction. Fig. 9 as well as Fig.10 As shown, the jet unit 322 can jet air in a vertical direction (e.g., z direction) at a certain angle toward the package P. Unlike the case where water vapor splashes everywhere when jetting in a vertical direction, the jet unit 322 jets air toward the package P in an inclined state, thereby guiding the water vapor in a certain direction and making it easier to manage.

[0080] According to an embodiment of the present invention, the suction unit 323 may be located in a direction in which the jet unit 322 is inclined. Fig. 9 as well as Fig.10 The jet unit 322 is inclined in the +x direction to jet air, and the suction unit 323 is located in the +x direction from the jet unit 322. Fig. 9 as well as Fig.10 In this way, the suction unit 323 is arranged in the direction in which the air injection unit 322 is inclined, so that the guided water vapor can be removed more easily by the suction unit 323.

[0081] According to an embodiment of the present invention, the suction unit 323 may be inclined in a direction opposite to the direction in which the jet unit 322 is inclined. Fig. 9 as well as Fig.10As shown, the jet unit 322 is inclined in a direction (e.g., −x direction) opposite to the inclination direction (+x direction) of the suction unit 323 to suck the water vapor. In this way, the inclination direction of the suction unit 323 is configured to be opposite to the inclination direction of the jet unit 322, so that the water vapor guided by the jet unit 322 can be more easily sucked by the suction unit 323.

[0082] The drying device for removing moisture from the package P described above can be constituted as a part of the package transport device and the semiconductor strip cutting and sorting device 10. The package transport device for transporting singulated packages in the semiconductor strip cutting and sorting device 10 according to an embodiment of the present invention includes: a turning table 310 including a base 312 for placing the package P and a rotating shaft 313 for rotating the base 312; a drying unit 320 for drying the package P placed on the base 312; and a traveling fixture table 341, 346 for receiving the package P from the turning table 310. The drying unit 320 includes: a gantry 321 disposed above or below the base 312 to be movable; an air jet unit 322 disposed on the gantry and jetting air toward the package placed on the base; and a suction unit 323 disposed adjacent to the air jet unit 322 in the gantry 321 and sucking liquid scattered from the package P.

[0083] The semiconductor strip cutting and sorting device 10 according to the embodiment of the present invention includes: a loading unit 100 for loading a semiconductor strip S equipped with a plurality of packages; a cutting unit 200 for cutting the semiconductor strip S and transferring singulated semiconductor packages P; and a sorting unit 300 for drying and inspecting the semiconductor packages P and storing them in trays 351 and 356. The sorting unit 300 includes: a turning table 310 including a base 312 for placing the packages P and a rotating shaft 313 for rotating the base 312; a drying unit 320 for drying the packages P placed on the base 312; and accompanying jig tables 341 and 346 for receiving the packages P from the turning table 310. The drying unit 320 includes: a gantry 321, which is movably arranged above or below the base 312; a jet unit 322, which is arranged on the gantry and sprays air toward a package placed on the base; and a suction unit 323, which is adjacent to the jet unit 322 in the gantry 321 and sucks liquid scattered from the package P.

[0084] This embodiment and the drawings attached to this specification only clearly indicate a part of the technical concept included in the present invention. It is obvious that modifications and specific embodiments that can be easily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of the present invention are all included in the scope of rights of the present invention.

[0085] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, but rather to the appended claims. All concepts that are equivalent to or equivalently modified to the claims belong to the scope of the concept of the present invention.

Claims

1. A package drying device for drying individual packages in a semiconductor strip cutting and sorting device, in, The package drying device comprises: A base for placing the package body; A gantry frame is movably arranged above or below the base; an air jet unit, disposed on the gantry and jetting air toward the packaging body placed on the base; and a suction unit, which is disposed adjacent to the jet unit in the gantry and sucks the liquid scattered from the package, The jet unit and the suction unit are configured to move together with a moving body that moves along with the gantry. The jet unit jets air in a direction inclined toward the moving direction of the moving body, The suction unit is located in the direction in which the jet unit is inclined, and the suction unit is inclined in a direction opposite to the direction in which the jet unit is inclined.

2. The package drying device according to claim 1, in, The base comprises: a placement portion for placing the package body; and The protruding portion is more protruding than the placing portion.

3. The package drying device according to claim 2, in, The mounting portion has the same size and shape as the packaging body.

4. The package drying device according to claim 2, in, The protrusion protrudes from the seating portion by a height equal to a thickness of the package body.

5. A package handling device for handling individual packages in a semiconductor strip cutting and sorting device, in, The package handling device comprises: A turning table, comprising a base for placing the packaging body and a rotating shaft for rotating the base; A drying unit, drying the packaging body placed on the base; and A portable fixture table receives the package from the flip table, The drying unit comprises: A gantry frame is movably arranged above or below the base; an air jet unit, disposed on the gantry and jetting air toward the packaging body placed on the base; and a suction unit, which is disposed adjacent to the jet unit in the gantry and sucks the liquid scattered from the package, The jet unit and the suction unit are configured to move together with a moving body that moves along with the gantry. The jet unit jets air in a direction inclined toward the moving direction of the moving body, The suction unit is located in the direction in which the jet unit is inclined, and the suction unit is inclined in a direction opposite to the direction in which the jet unit is inclined.

6. The package transport device according to claim 5, in, The base comprises: a placement portion for placing the package body; and The protruding portion is more protruding than the placing portion.

7. The package transporting device according to claim 6, in, The mounting portion has the same size and shape as the packaging body.

8. The package transporting device according to claim 6, in, The protrusion protrudes from the seating portion by a height equal to a thickness of the package body.

9. A semiconductor strip cutting and sorting device, in, include: A loading unit for loading a semiconductor strip equipped with a plurality of packages; a cutting unit for cutting the semiconductor strip and transferring singulated semiconductor packages; as well as The classification unit dries and inspects the semiconductor packages and stores them in trays. The taxonomic units include: A turning table, comprising a base for placing the packaging body and a rotating shaft for rotating the base; A drying unit, drying the packaging body placed on the base; and A portable fixture table receives the package from the flip table, The base comprises: a placement portion for placing the package body; and a protrusion formed in the remaining area of ​​the base except the placement portion and protruding more than the placement portion, The drying unit comprises: A gantry frame is movably arranged above or below the base; an air jet unit, disposed on the gantry and jetting air toward the packaging body placed on the base; and a suction unit, which is disposed adjacent to the jet unit in the gantry and sucks the liquid scattered from the package, The jet unit and the suction unit are configured to move together with a moving body that moves along with the gantry. The jet unit jets air in a direction inclined toward the moving direction of the moving body, The suction unit is located in the direction in which the jet unit is inclined, and the suction unit is inclined in a direction opposite to the direction in which the jet unit is inclined.

10. The semiconductor strip cutting and sorting device according to claim 9, in, The mounting portion has the same size and shape as the packaging body.

11. The semiconductor strip cutting and sorting device according to claim 9, in, The protrusion protrudes from the seating portion by a height equal to a thickness of the package body.

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