Lower surface brush, brush base and substrate cleaning device

Abstract

The present application relates to a lower surface brush, a brush base, and a substrate cleaning device. The lower surface brush is provided with a base portion, a first cleaning portion, and a second cleaning portion. The first cleaning portion protrudes upward from the upper surface of the base portion, and is disposed on the upper surface of the base portion in such a manner that, when viewed from above, it extends in one direction through the geometric center of the base portion. The second cleaning portion protrudes upward from the upper surface of the base portion, and is disposed on the upper surface of the base portion in such a manner that it follows the outer edge of the base portion. Alternatively, one or more pairs of second cleaning portions can protrude upward from the upper surface of the base portion, and be disposed on the upper surface of the base portion in such a manner that they face each other across the first cleaning portion.

Description

TECHNICAL FIELD

[0001] The present application relates to a lower surface brush for cleaning a lower surface of a substrate, a brush base, and a substrate cleaning apparatus. BACKGROUND

[0002] In order to perform various processes on various substrates such as a substrate for a flat panel display (FPD) for a liquid crystal display device or an organic EL (Electro Luminescence) display device, a semiconductor substrate, a substrate for an optical disc, a substrate for a magnetic disc, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, a substrate processing apparatus can be used. In order to clean a substrate, a substrate cleaning apparatus is used.

[0003] For example, in a substrate cleaning apparatus described in Japanese Patent Application Publication No. 2017-139442, a plurality of chuck pins provided in a rotary plate hold a state in which the outer peripheral end portion of a substrate abuts, and the rotary plate is rotated around a rotation axis. Further, the upper surface of a cleaning brush having a substantially cylindrical shape is brought into contact with the back surface of the substrate that is rotated. In this state, the cleaning brush is moved between the center portion and the peripheral portion of the back surface of the substrate, and thus the entire back surface of the substrate is cleaned, and contaminants adhering to the back surface of the substrate are removed. SUMMARY

[0004] In a substrate cleaning apparatus, if the diameter of a cleaning brush is small, the throughput decreases. However, if the diameter of the cleaning brush is increased, the contact area of the cleaning brush with the substrate becomes large. In this case, since the load per unit area of the cleaning brush becomes small, the removal efficiency of contaminants decreases. On the other hand, in a case where the load of the cleaning brush is increased, the substrate is warped, and thus the removal efficiency of contaminants decreases. Further, if the load of the cleaning brush is increased, the substrate is detached from the holding portion such as a chuck pin.

[0005] An object of the present application is to provide a lower surface brush, a brush base, and a substrate cleaning apparatus that can efficiently clean a lower surface of a substrate.

[0006] (1) A lower surface brush according to one aspect of the present application can be used to clean a lower surface of a substrate, and includes: a base portion having a first upper surface; a first cleaning portion protruding upward from the first upper surface of the base portion, and disposed on the first upper surface of the base portion in a manner that extends in one direction through the geometric center of the base portion in a plan view; and a second cleaning portion protruding upward from the first upper surface of the base portion, and disposed on the first upper surface of the base portion in a manner along the outer edge of the base portion.

[0007] The lower surface brush maintains a large cleaning area while reducing the contact area between the lower surface of the substrate and the brush. Therefore, even with a relatively small load applied to the lower surface brush, the lower surface of the substrate and the brush maintain sufficient contact under load. This results in efficient and effective cleaning of the lower surface of the substrate.

[0008] (2) A lower surface brush according to another embodiment of the present invention can be used to clean the lower surface of a substrate, and includes: a base portion having a first upper surface; a first cleaning portion protruding upward from the first upper surface of the base portion and extending in one direction through the geometric center of the base portion when viewed from above, and disposed on the first upper surface of the base portion; and one or more pairs of second cleaning portions protruding upward from the first upper surface of the base portion and disposed on the first upper surface of the base portion facing each other across the first cleaning portions.

[0009] The lower surface brush maintains a large cleaning area while reducing the contact area between the lower surface of the substrate and the brush. Therefore, even with a relatively small load applied to the lower surface brush, the lower surface of the substrate and the brush maintain sufficient contact under load. This results in efficient and effective cleaning of the lower surface of the substrate.

[0010] (3) Alternatively, a through-hole for liquid drainage can be formed in the abutment portion, extending in the vertical direction. According to this configuration, when cleaning fluid is used to clean the lower surface of the substrate, the cleaning fluid will not remain on the lower surface brush but will drain through the through-hole. Therefore, cleaning fluid can be used to clean the lower surface of the substrate more efficiently.

[0011] (4) Alternatively, the system can be configured such that liquid can be discharged to the outside from the periphery of the base portion through the space between the first cleaning section and the second cleaning section. According to this configuration, when cleaning liquid can be used on the lower surface of the substrate, the cleaning liquid will not remain on the lower surface brush but will be discharged through the space between the first cleaning section and the second cleaning section. Therefore, cleaning liquid can be used to clean the lower surface of the substrate more efficiently.

[0012] (5) Alternatively, the base portion may have a circular, oblong, or elliptical shape when viewed from above, and the first cleaning portion may be arranged to extend between the two furthest points on the outer edge of the base portion when viewed from above. In this case, it is easier to maintain a larger cleaning area.

[0013] (6) Alternatively, when viewed from above, the length between the two points on the pedestal is greater than 1 / 3 and less than 1 / 2 of the substrate diameter. In this case, the entire lower surface of the substrate can be cleaned efficiently without excessively increasing the size of the lower surface brush.

[0014] (7) A brush base according to another embodiment of the present invention has a second upper surface that can be connected to the base portion of a lower surface brush according to the first embodiment or other embodiments of the present invention, and a lower surface opposite to the second upper surface. An inclined portion sloping outward and downward is formed in the peripheral region of the lower surface. In this brush base, when cleaning fluid can be used to clean the lower surface of the substrate by the lower surface brush, the cleaning fluid is not guided towards the inner side of the lower surface of the brush base, but is discharged outward along the inclined portion. Therefore, the lower surface of the substrate can be cleaned efficiently.

[0015] (8) A substrate cleaning apparatus according to another embodiment of the present invention includes: a substrate holding section for holding a substrate; and a lower surface brush according to the first embodiment or another embodiment of the present invention for cleaning the lower surface of the substrate held by the substrate holding section. In the substrate cleaning apparatus, the lower surface of the substrate held by the substrate holding section is cleaned by the lower surface brush. As a result, the lower surface of the substrate can be cleaned efficiently.

[0016] (9) Alternatively, the substrate cleaning apparatus may also include a moving device that moves the lower surface brush between a first horizontal position that can clean the outer region of the lower surface surrounding the central region of the lower surface of the substrate, and a second horizontal position that can clean the central region of the lower surface of the substrate. In this case, the entire lower surface of the substrate can be cleaned efficiently.

[0017] (10) Alternatively, the substrate holding portion may rotate the substrate at least when the outer region of the lower surface of the substrate is being cleaned by the lower surface brush. In this case, the outer region of the lower surface of the substrate is cleaned more efficiently. Thus, the entire lower surface of the substrate can be cleaned more efficiently.

[0018] (11) Alternatively, the substrate cleaning apparatus may also include a rotation drive device that enables the lower surface brush to rotate about a vertical axis passing through the geometric center of the base portion. In this case, it is easier to maintain a larger area that the lower surface brush can clean. Attached Figure Description

[0019] Figure 1 This is a perspective view of the brush unit including a lower surface brush and a brush base according to the first embodiment of the present invention.

[0020] Figure 2 yes Figure 1 A three-dimensional view of the brushed lower surface.

[0021] Figure 3 yes Figure 1 A top view of the brush on the lower surface.

[0022] Figure 4 yes Figure 1 A longitudinal sectional view of the brush unit.

[0023] Figure 5This diagram is used to illustrate the action of brushing cells.

[0024] Figure 6 This is a perspective view of the lower surface of the brush in the variation example.

[0025] Figure 7 This is a three-dimensional view of the lower surface of the brush in the reference example.

[0026] Figure 8 This is a perspective view of the lower surface brush according to the second embodiment of the present invention.

[0027] Figure 9 This is a perspective view of the lower surface brush of the first variation example.

[0028] Figure 10 This is a perspective view of the lower surface brush of the second variation example.

[0029] Figure 11 This is a schematic top view of the substrate cleaning apparatus according to the third embodiment of the present invention.

[0030] Figure 12 It means Figure 11 A three-dimensional view of the internal structure of the substrate cleaning device.

[0031] Figure 13 It means Figure 11 A block diagram illustrating the configuration of the control system for the substrate cleaning apparatus.

[0032] Figure 14 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0033] Figure 15 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0034] Figure 16 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0035] Figure 17 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0036] Figure 18 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0037] Figure 19 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0038] Figure 20It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0039] Figure 21 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0040] Figure 22 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0041] Figure 23 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0042] Figure 24 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus.

[0043] Figure 25 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. Detailed Implementation

[0044] Hereinafter, the lower surface brush, brush base, and substrate cleaning apparatus according to embodiments of the present invention will be described using the accompanying drawings. In the following description, substrate refers to semiconductor substrates, substrates for FPD (Flat Panel Display) such as liquid crystal display devices or organic EL (ElectroLuminescence) display devices, substrates for optical discs, substrates for magnetic disks, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, or substrates for solar cells, etc.

[0045] [1] First Embodiment

[0046] (1) Composition of the brush unit

[0047] Figure 1 This is a perspective view of the brush unit including a lower surface brush and a brush base according to the first embodiment of the present invention. Figure 1 As shown, the brush unit 300 is constructed by mounting a lower surface brush 100 on a brush base 200. The lower surface brush 100 may be made of a relatively soft resin material such as PVA (polyvinyl alcohol) or PTFE (polytetrafluoroethylene). The brush base 200 may also be made of a relatively hard resin such as PVC (polyvinyl chloride) or PP (polypropylene).

[0048] Figure 2 yes Figure 1 The lower surface is brushed with a 100-degree 3D model of its appearance. Figure 3 yes Figure 1 A top view of the lower surface brushed with 100. (See example.)Figure 2 and Figure 3 As shown, the lower surface brush 100 includes a base portion 110 and cleaning portions 120 and 130. The base portion 110 has a circular plate shape. In top view, the geometric center 101 of the base portion 110 is defined as... Figure 3 ).

[0049] Cleaning portions 120 and 130 are formed on the upper surface of the base portion 110, protruding upwards from the upper surface. Cleaning portion 120 is arranged to extend radially along the base portion 110 through its geometric center 101. Cleaning portion 130 is arranged along the outer edge of the base portion 110. Cleaning portion 130 can contact both ends of cleaning portion 120. The protrusion of cleaning portions 120 and 130 relative to the upper surface of the base portion 110 is, for example, 5 mm to 6 mm. The width of cleaning portion 120 and the width of cleaning portion 130 may be equal or unequal.

[0050] A plurality of through holes 111, a plurality of through holes 112, and a plurality of through holes 113 are formed in the base portion 110. Each through hole 111-113 extends in the vertical direction. The through holes 111 are used to connect the base portion 110 to... Figure 1 The brush base 200, in this example, has 10 holes. Specifically, eight through holes 111 are arranged at approximately equal angular intervals in the peripheral area of ​​the base portion 110. Two through holes 111 are arranged facing each other across the cleaning portion 120 in the central area of ​​the base portion 110.

[0051] Through holes 112 are used to connect the brush base 200 to a motor that rotates the brush unit 300, etc., and four such holes are provided in this example. The four through holes 112 are arranged at approximately equal angular intervals in the central region of the base portion 110, surrounding the geometric center 101 of the base portion 110. Through holes 113 are used to drain the cleaning solution during substrate cleaning, and ten such holes are provided in this example. The ten through holes 113 are regularly arranged along the peripheral region of the base portion 110, along the cleaning section 130.

[0052] The brush base 200 is a plate-shaped component having the same shape as the base portion 110 of the lower surface brush 100. Figure 4 yes Figure 1 A longitudinal sectional view of brush unit 300. (See attached image.) Figure 4 As shown, a downwardly recessed portion 210 is formed in the central region of the lower surface of the brush base 200. Furthermore, an outwardly and downwardly inclined portion 220 is formed in the peripheral region of the lower surface of the brush base 200. Moreover, a plurality of screw holes 201, a plurality of through holes 202, and a plurality of through holes 203 are formed in the brush base 200.

[0053] Multiple screw holes 201 are provided on the upper surface of the brush base 200, each corresponding to a plurality of through holes 111 of the lower surface brush 100. Multiple through holes 202 are arranged in a vertically extending manner, each corresponding to a plurality of through holes 112 of the lower surface brush 100. Multiple through holes 203 are arranged in a vertically extending manner, each corresponding to a plurality of through holes 113 of the lower surface brush 100.

[0054] Multiple threaded components 310 ( Figure 1 Multiple through holes 111 of the lower surface brush 100 are inserted from above. The lower end of each threaded component 310 is screwed into the corresponding threaded hole 201 in the brush base 200. Thus, the lower surface brush 100 is connected to the brush base 200, and the brush unit 300 is completed. In the brush unit 300, the multiple through holes 113 of the lower surface brush 100 are respectively connected to the multiple through holes 203 of the brush base 200.

[0055] The brush unit 300 is mounted on a rotating shaft 400, such as a motor. Specifically, the rotating shaft 400 is inserted into the recess 210 of the brush base 200 from below. Multiple threaded holes 401 are formed in the rotating shaft 400, each corresponding to a through hole 202 in the brush base 200. Multiple threaded components 320 ( Figure 1 Multiple through holes 112 in the lower surface of the brush 100 are inserted from above. The lower end of each threaded component 320 is screwed into the corresponding screw hole 401 in the rotating shaft 400 through the corresponding through hole 202 in the brush base 200.

[0056] (2) The action of brushing units

[0057] The brush unit 300 can be used to clean the lower surface of the substrate. Hereinafter, the central portion of the lower surface of the substrate will be referred to as the central region of the lower surface. The region surrounding the central region of the lower surface will be referred to as the outer region of the lower surface. Furthermore, the lower surface of the substrate refers to the side of the substrate facing downwards. Therefore, when the circuit-forming surface (front side) of the substrate faces downwards, the front side of the substrate is the lower surface; when the side opposite to the front side (back side) faces downwards, the back side of the substrate is the lower surface.

[0058] Figure 5 This diagram illustrates the operation of brush unit 300. When cleaning the central region of the lower surface of substrate W, as shown... Figure 5 As shown in the upper layer, the brush unit 300 moves below the central region of the lower surface of the substrate W. Then, the upper end of the brush unit 300 contacts the lower surface of the substrate W. Afterward, the brush unit 300 rotates about a vertical axis passing through the geometric center 101 of the pedestal portion 110, thereby removing contaminants adhering to the central region of the lower surface of the substrate W. In this example, the substrate W is not rotated during the cleaning of the central region of the lower surface of the substrate W, but the substrate W can also be rotated.

[0059] When cleaning the outer region of the lower surface of substrate W, such as Figure 5 As shown in the lower layer, the brush unit 300 moves below the outer region of the lower surface of the substrate W. At this time, a portion of the brush unit 300 may also protrude slightly outward from the substrate W. Next, the upper end of the brush unit 300 contacts the lower surface of the substrate W. Then, by rotating the substrate W, contaminants adhering to the outer region of the lower surface of the substrate W are removed. In this example, the brush unit 300 does not rotate when cleaning the outer region of the lower surface of the substrate W, but the brush unit 300 may also rotate.

[0060] In this example, the diameter of the lower surface brush 100 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. In this case, by moving the brush unit 300 between below the central region and below the outer region of the lower surface of the substrate W, the entire lower surface of the substrate W is cleaned efficiently. Therefore, it is not necessary to excessively increase the size of the lower surface brush 100. Furthermore, the diameter of the substrate W is, for example, 300 mm. Figure 5 As shown by the dashed line, the area that the brush unit 300 can clean when it moves below the central region of the lower surface of the substrate W may slightly overlap with the area that the brush unit 300 can clean when it moves below the outer region of the lower surface of the substrate W.

[0061] When cleaning the lower surface of substrate W, a cleaning solution can be supplied to the lower surface of substrate W. In this case, contaminants adhering to the lower surface of substrate W can be removed more efficiently. The cleaning solution supplied to the lower surface of substrate W is formed on... Figure 4 The cleaning fluid is discharged to the lower surface of the brush 100 through multiple through holes 113 and multiple through holes 203 formed in the brush base 200. Therefore, it is possible to prevent the cleaning fluid from remaining on the lower surface of the brush 100.

[0062] Here, as Figure 4 As shown, an inclined portion 220 is formed on the peripheral region of the lower surface of the brush base 200, sloping outward and downward. Therefore, cleaning fluid discharged onto the lower surface of the brush base 200 is not guided to the inside of the brush base 200, but is guided to the outside along the inclined portion 220 and discharged from the brush base 200. This prevents cleaning fluid from adhering to the rotating shaft 400 or the motor, etc.

[0063] (3) Variation Example

[0064] In this embodiment, the lower surface brush 100 has a circular shape when viewed from above, but the embodiment is not limited to this. The lower surface brush 100 may also have other shapes when viewed from above. In this case, the cleaning section 120 is arranged such that it extends between the two furthest points on the outer edge of the base section 110 when viewed from above. This allows for maintaining a larger cleaning area. Hereinafter, a variation of the lower surface brush 100 will be described. Figure 2Brush 100 different dots on the lower surface.

[0065] Figure 6 This is a perspective view of the lower surface of a modified example with a brush size of 100. For example... Figure 6 As shown, in the modified lower surface brush 100, the base portion 110 has an elongated oval shape. The cleaning portion 120 is arranged such that, when viewed from above, it passes through the geometric center 101 of the base portion 110 and extends parallel to the long side of the base portion 110. The brush base 200, like the base portion 110 of the lower surface brush 100, has an elongated oval shape. In this example, the lower surface brush 100 has an elongated oval shape when viewed from above.

[0066] Alternatively, the base portion 110 may also have an elliptical plate shape. In this case, the cleaning portion 120 is arranged such that, when viewed from above, it passes through the geometric center 101 of the base portion 110 and extends in a manner coinciding with the major axis of the base portion 110. Furthermore, when viewed from above, the geometric center 101 of the base portion 110 is the intersection of the major and minor axes of the base portion 110. The brush base 200, like the base portion 110 of the lower surface brush 100, has an elliptical shape. In this example, the lower surface brush 100 has an elliptical shape when viewed from above.

[0067] (4) Effect

[0068] In the lower surface brush 100 of this embodiment, the cleaning section 120 is provided on the upper surface of the base section 110, protruding upward from the upper surface and extending in one direction through the geometric center 101 of the base section 110 when viewed from above. Furthermore, the cleaning section 130 is provided on the upper surface of the base section 110, protruding upward from the upper surface and along the outer edge of the base section 110.

[0069] According to the aforementioned configuration, a large cleaning area can be maintained, while reducing the contact area between the lower surface of the substrate W and the lower surface brush 100. Therefore, even when the load applied to the lower surface brush 100 is relatively small, the lower surface of the substrate W and the lower surface brush 100 maintain sufficient load contact. Consequently, the lower surface of the substrate W can be cleaned efficiently.

[0070] (5) Reference Example

[0071] Figure 7 This is a three-dimensional view of the lower surface of the brush in the reference example. For example... Figure 7 As shown, the lower surface brush 100A of the reference example, except for the absence of the cleaning section 130 and the lack of a through hole 113 formed in the base section 110, has the same characteristics as... Figure 6 The lower surface brush 100 has the same configuration as the variation example. Alternatively, a through hole 203 may not be formed in the brush base corresponding to the lower surface brush 100A.

[0072] When cleaning the outer region of the lower surface of the substrate W using the brush unit including the lower surface brush 100A of the reference example, it is preferable to rotate the brush unit. Alternatively, it is preferable to detect the direction of the lower surface brush 100A by means of an encoder or the like. Furthermore, when cleaning the outer region of the lower surface of the substrate W, it is preferable to control the direction of the lower surface brush 100A below the outer region of the lower surface of the substrate W, such that the cleaning section 120 is oriented in a direction orthogonal to the tangent (normal direction) of the outer edge of the substrate W.

[0073] [2] Second Embodiment

[0074] (1) Composition of the brush unit

[0075] Regarding the lower surface brush 100 and brush base 200 of the second embodiment, the differences between them and those of the lower surface brush 100 and brush base 200 of the first embodiment will be explained. Figure 8 This is a perspective view of the lower surface brush 100 according to the second embodiment of the present invention. Figure 8 As shown, in this embodiment, the lower surface brush 100 includes one or more pairs of cleaning sections 140 arranged opposite each other with respect to the cleaning section 120, instead of... Figure 1 Cleaning section 130.

[0076] In this example, the lower surface brush 100 includes three pairs of cleaning portions 140. Each cleaning portion 140 is formed on the upper surface of the base portion 110, extending from the outside of the base portion 110 toward the geometric center 101 of the base portion 110 and protruding upward from the upper surface of the base portion 110. The protrusion of the cleaning portion 140 relative to the upper surface of the base portion 110 is, for example, 5 mm to 6 mm. The width of the cleaning portion 120 may be equal to or unequal to the width of the cleaning portion 140. Furthermore, the inner end of each cleaning portion 140 may also contact the cleaning portion 120.

[0077] By Figure 8 The lower surface of the brush is connected to 100. Figure 1 The brush base 200 constitutes the brush unit 300. The operation of the brush unit 300 in this embodiment is the same as that of the brush unit 300 in the first embodiment.

[0078] When a cleaning solution is used during substrate cleaning, the cleaning solution supplied to the lower surface of the substrate W passes between the cleaning sections 120 and 140 and is discharged to the outside from the periphery of the base portion 110. This prevents the cleaning solution from remaining on the lower surface brush 100. Therefore, in this embodiment, the base portion 110 of the lower surface brush 100 may not be formed. Figure 4 Through hole 113. Similarly, it is not necessary to form a through hole in brush base 200. Figure 4The through hole 203. However, the implementation is not limited to this. The through hole 113 may also be formed on the base portion 110 of the lower surface brush 100, or on the brush base 200.

[0079] Furthermore, when cleaning the outer region of the lower surface of the substrate W, the brush unit 300 can be rotated. Alternatively, the direction of the lower surface brush 100 can be detected by an encoder or the like. Moreover, when cleaning the outer region of the lower surface of the substrate W, the direction of the lower surface brush 100 can be controlled below the outer region of the lower surface of the substrate W, with the cleaning unit 120 oriented in a direction orthogonal to the tangent (normal direction) of the outer edge of the substrate W.

[0080] (2) Variation Example

[0081] In this embodiment, each cleaning section 140 extends from the outer side of the base section 110 toward the geometric center 101 of the base section 110, but the embodiment is not limited to this. Each cleaning section 140 may also not extend from the outer side of the base section 110 toward the geometric center 101 of the base section 110. Furthermore, similar to the variation of the first embodiment, the shape of the lower surface brush 100 when viewed from above may be an oblong shape, an elliptical shape, or other shapes. Hereinafter, the lower surface brush 100 of the variation will be described... Figure 8 Brush 100 different dots on the lower surface.

[0082] Figure 9 This is a perspective view of the lower surface of the first variation example, brush 100. (See image below.) Figure 9 As shown, in the lower surface brush 100 of the first variation, a portion of the cleaning portion 140 bends from the outside of the base portion 110 and extends toward the geometric center 101 of the base portion 110. A portion of the cleaning portion 140 may bend from the outside of the base portion 110 and extend toward the geometric center 101 of the base portion 110.

[0083] Figure 10 This is a perspective view of the lower surface of the second variation, brushed with 100. (See image below.) Figure 10 As shown, the lower surface brush 100 of the second variation includes a pair of cleaning sections 140. Furthermore, the base portion 110 has an elongated oval plate shape. The cleaning section 120 is arranged such that, when viewed from above, it passes through the geometric center 101 of the base portion 110 and extends parallel to the long side of the base portion 110. The pair of cleaning sections 140 are arranged along a pair of long sides of the base portion 110, respectively.

[0084] (3) Effect

[0085] In the lower surface brush 100 of this embodiment, the cleaning section 120 is provided on the upper surface of the base section 110, protruding upward from the upper surface and extending in one direction through the geometric center 101 of the base section 110 when viewed from above. Furthermore, one or more pairs of cleaning sections 140 are provided on the upper surface of the base section 110, protruding upward from the upper surface of the base section 110 and facing each other across the cleaning section 120.

[0086] According to the aforementioned configuration, a large cleaning area can be maintained, while reducing the contact area between the lower surface of the substrate W and the lower surface brush 100. Therefore, even when the load applied to the lower surface brush 100 is relatively small, the lower surface of the substrate W and the lower surface brush 100 maintain sufficient load contact. Consequently, the lower surface of the substrate W can be cleaned efficiently.

[0087] [3] Third embodiment

[0088] (1) Composition of substrate cleaning equipment

[0089] As a third embodiment, the detailed configuration of a substrate cleaning apparatus including the lower surface brush 100 of the first or second embodiment will be described. Figure 11 This is a schematic top view of the substrate cleaning apparatus according to the third embodiment of the present invention. Figure 12 It means Figure 11 A perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, the X, Y, and Z directions, which are orthogonal to each other, are defined to clarify the positional relationships. Figure 11 and Figure 12 In the subsequent specific figures, arrows are used to indicate the X, Y, and Z directions as appropriate. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

[0090] like Figure 11 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, lower holding device 20, platform device 30, transfer device 40, lower surface cleaning device 50, cup device 60, upper surface cleaning device 70, end cleaning device 80, and opening / closing device 90. These components are housed within the unit housing 2. Figure 12 In the middle, the outer shell of the unit is represented by a dashed line.

[0091] The unit housing 2 has a rectangular bottom portion 2a and four sidewall portions 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom portion 2a. Sidewall portions 2b and 2c face each other, and sidewall portions 2d and 2e face each other. A rectangular opening is formed in the center of the sidewall portion 2b. This opening serves as a loading / unloading outlet 2x for the substrate W, used when loading and unloading the substrate W into and out of the unit housing 2. Figure 12In the diagram, the loading / unloading outlet 2x is represented by a thick dashed line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading outlet 2x toward the outside of the unit housing 2 (from side wall 2c toward side wall 2b) is called the front, and the opposite direction (from side wall 2b toward side wall 2c) is called the rear.

[0092] An opening and closing device 90 is provided in the side wall portion 2b, in the portion forming the loading and unloading outlet 2x and in the surrounding area. The opening and closing device 90 includes a baffle 91 configured to open and close the loading and unloading outlet 2x, and a baffle drive portion 92 for driving the baffle 91. Figure 12 In the diagram, baffle 91 is indicated by a thick dashed line. The baffle drive unit 92 drives the baffle 91 to open the loading / unloading outlet 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. Furthermore, the baffle drive unit 92 drives the baffle 91 to close the loading / unloading outlet 2x when the substrate W is being cleaned in the substrate cleaning apparatus 1.

[0093] A platform assembly 30 is disposed at the center of the bottom portion 2a. The platform assembly 30 includes a linear guide 31, a movable platform 32, and a platform drive unit 33. The linear guide 31 includes two guide rails, which are arranged to extend in the Y direction from near the side wall portion 2b to near the side wall portion 2c when viewed from above. The movable platform 32 is configured to move in the Y direction on the two guide rails of the linear guide 31. The platform drive unit 33 includes, for example, a pulse motor, to move the movable platform 32 in the Y direction on the linear guide 31.

[0094] On the movable stage 32, a lower holding device 20 and a lower surface cleaning device 50 are arranged in the Y direction. The lower holding device 20 includes an adsorption holding part 21 and an adsorption holding drive part 22. The adsorption holding part 21 is a so-called rotating chuck, which has a circular adsorption surface that can adsorb and hold the lower surface of the substrate W, and is configured to rotate about an axis extending in the vertical direction (the axis in the Z direction). Figure 11 In the figure, the shape of the substrate W held by the lower holding device 20 is represented by a dashed line.

[0095] The adsorption-holding drive unit 22 includes a motor. The motor of the adsorption-holding drive unit 22 is mounted on a movable stage 32 with its rotation axis projecting upwards. The adsorption-holding unit 21 is mounted on the upper end of the rotation axis of the adsorption-holding drive unit 22. Furthermore, an attraction path for adsorbing and holding the substrate W in the adsorption-holding unit 21 is formed on the rotation axis of the adsorption-holding drive unit 22. This attraction path is connected to a suction device (not shown). The adsorption-holding drive unit 22 rotates the adsorption-holding unit 21 about the rotation axis.

[0096] On the movable base 32, near the lower holding device 20, a connecting device 40 is also provided. The connecting device 40 includes multiple (three in this example) support pins 41, pin connecting members 42, and a pin lifting drive 43. The pin connecting members 42 are formed to surround the adsorption holding part 21 when viewed from above, and connect the multiple support pins 41. The multiple support pins 41 extend upward from the pin connecting members 42 by a certain length in a state where they are interconnected by the pin connecting members 42. The pin lifting drive 43 causes the pin connecting members 42 to rise and fall on the movable base 32. As a result, the multiple support pins 41 rise and fall relative to the adsorption holding part 21.

[0097] The lower surface cleaning device 50 includes a brush unit 300, two liquid nozzles 52, a gas ejection section 53, a lifting support section 54, a movable support section 55, a lower surface brush rotation drive section 55a, a lower surface brush lifting drive section 55b, and a lower surface brush moving drive section 55c. The movable support section 55 is configured to move relative to the lower holding device 20 in the Y direction within a certain area on the movable platform 32. Figure 12 As shown, a lifting support 54 is provided on the movable support 55 in a height-adjustable manner. The lifting support 54 has an upper surface 54u that is inclined downward in a direction away from the adsorption and holding part 21 (rearward in this example).

[0098] The brush unit 300 includes a lower surface brush 100 and a brush base 200 as described in the first or second embodiment. Alternatively, the brush unit 300 may also include a portion 220 where the lower surface does not have an inclined portion. Figure 4 The brush base is replaced by a brush base 200 of the first or second embodiment. For example... Figure 11 As shown, the brush unit 300 and the surface brush 100 below it face upwards and can pass through the geometric center 101 of the base portion 110. Figure 3 The shaft extends vertically and rotates, and is mounted on the upper surface 54u of the lifting support 54. The area of ​​the base portion 110 of the lower surface brush 100 is larger than the area of ​​the adsorption surface of the adsorption holding portion 21.

[0099] Two liquid nozzles 52 are respectively located near the brush unit 300 and mounted on the upper surface 54u of the lifting support 54 with the liquid outlet facing upwards. The liquid nozzles 52 are connected to the lower surface cleaning fluid supply unit 56. Figure 13The lower surface cleaning fluid supply unit 56 supplies cleaning fluid to the liquid nozzle 52. When the brush unit 300 cleans the substrate W, the liquid nozzle 52 supplies the cleaning fluid supplied from the lower surface cleaning fluid supply unit 56 to the lower surface of the substrate W. In this embodiment, pure water (deionized water) can be used as the cleaning fluid supplied to the liquid nozzle 52. Alternatively, carbonated water, ozone water, hydrogen water, electrolyzed ionized water, SCl (a mixture of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide) can be used instead of pure water as the cleaning fluid supplied to the liquid nozzle 52.

[0100] The gas ejection section 53 is a slit-shaped gas injection nozzle with a gas outlet extending in one direction. The gas ejection section 53 is mounted on the upper surface 54u of the lifting support section 54, positioned between the brush unit 300 and the adsorption holding section 21 when viewed from above, with the gas outlet facing upwards. The gas ejection section 53 is connected to the ejection gas supply section 57. Figure 13 The ejector gas supply unit 57 supplies gas to the gas ejector unit 53. In this embodiment, nitrogen can be used as the gas supplied to the gas ejector unit 53. The gas ejector unit 53 ejects the gas supplied from the ejector gas supply unit 57 onto the lower surface of the substrate W when the substrate W is cleaned by the brush unit 300 and during the drying of the lower surface of the substrate W (described later). In this case, a strip-shaped air curtain extending in the X direction is formed between the brush unit 300 and the adsorption holding unit 21. As the gas supplied to the gas ejector unit 53, inert gases such as argon or helium can also be used instead of nitrogen.

[0101] The lower surface brush rotation drive unit 55a includes a rotating shaft 400 ( Figure 4 The motor rotates the brush unit 300 when the substrate W is being cleaned by the brush unit 300. As a result, the area that the brush unit 300 can clean can be maintained at a large size.

[0102] The lower surface brush lifting drive unit 55b includes a stepper motor or cylinder to lift the lifting support unit 54 relative to the movable support unit 55. The lower surface brush moving drive unit 55c includes a motor to move the movable support unit 55 in the Y direction on the movable platform 32. Here, the position of the lower holding device 20 in the movable platform 32 is fixed. Therefore, when the movable support unit 55 is moved in the Y direction by the lower surface brush moving drive unit 55c, the movable support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 on the movable platform 32 when it is closest to the lower holding device 20 is called the approach position, and the position of the lower surface cleaning device 50 on the movable platform 32 when it is farthest from the lower holding device 20 is called the departure position.

[0103] A cup device 60 is also provided in the center of the bottom part 2a. The cup device 60 includes a cup 61 and a cup drive part 62. The cup 61 is raised and lowered so as to surround the lower holding device 20 and the base device 30 when viewed from above. Figure 12 In the diagram, cup 61 is indicated by a dashed line. The cup driving unit 62 moves cup 61 between a lower cup position and an upper cup position depending on which portion of the lower surface of the substrate W needs to be cleaned by the brush unit 300. The lower cup position is when the upper end of cup 61 is at a height below the substrate W held by the adsorption and holding unit 21. Similarly, the upper cup position is when the upper end of cup 61 is at a height above the adsorption and holding unit 21.

[0104] At a height above the measuring cup 61, facing each other across the base assembly 30 when viewed from above, are a pair of upper holding devices 10A and 10B. Upper holding device 10A includes a lower clamping plate 11A, an upper clamping plate 12A, a lower clamping plate drive unit 13A, and an upper clamping plate drive unit 14A. Upper holding device 10B includes a lower clamping plate 11B, an upper clamping plate 12B, a lower clamping plate drive unit 13B, and an upper clamping plate drive unit 14B.

[0105] The lower clamps 11A and 11B are symmetrically arranged with respect to a vertical plane extending in the Y direction (front-to-back direction) from the center of the adsorption holding part 21 when viewed from above, and are configured to move in the X direction within a common horizontal plane. Each of the lower clamps 11A and 11B has two support plates that can support the lower periphery of the substrate W from below. The lower clamp drive parts 13A and 13B move the lower clamps 11A and 11B either closer together or further apart.

[0106] Like the lower clamps 11A and 11B, the upper clamps 12A and 12B are symmetrically arranged in a vertical plane extending in the Y direction (front-back direction) relative to the center of the adsorption holding part 21 when viewed from above, and are configured to be movable in the X direction within a common horizontal plane. Each of the upper clamps 12A and 12B has two holding plates configured to abut against two portions of the outer peripheral end of the substrate W, thereby holding the outer peripheral end of the substrate W. The upper clamp drive parts 14A and 14B move the upper clamps 12A and 12B either by bringing them closer together or by moving them further apart.

[0107] like Figure 11 As shown, an upper surface cleaning device 70 is provided on one side of the cup 61, near the upper holding device 10B when viewed from above. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0108] The rotating support shaft 71 extends vertically and is supported on the bottom surface 2a by the upper surface cleaning drive unit 74, allowing it to be raised, lowered, and rotated. The arm 72, as... Figure 12 As shown, the arm 72 is positioned above the upper holding device 10B, extending horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is mounted at the front end of the arm 72.

[0109] The spray nozzle 73 is connected to the upper surface cleaning fluid supply unit 75. Figure 13 The upper surface cleaning fluid supply unit 75 supplies cleaning fluid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning fluid supplied to the spray nozzle 73, and nitrogen is used as the gas supplied to the spray nozzle 73. When the spray nozzle 73 cleans the upper surface of the substrate W, it mixes the cleaning fluid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, which is then sprayed downwards.

[0110] Alternatively, carbonated water, ozone water, hydrogen water, electrolyzed ionized water, SC1 (a mixture of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide) can be used instead of pure water as the cleaning fluid supplied to the spray nozzle 73. Furthermore, inert gases such as argon or helium can be used instead of nitrogen as the gas supplied to the spray nozzle 73.

[0111] The upper surface cleaning drive unit 74 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 71 and rotate it simultaneously. According to the above configuration, by moving the spray nozzle 73 in an arc shape on the upper surface of the substrate W, which is held and rotated by the adsorption and holding unit 21, the entire upper surface of the substrate W can be cleaned.

[0112] like Figure 11 As shown, on the other side of the cup 61, an end cleaning device 80 is provided near the upper holding device 10A when viewed from above. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, an inclined brush 83, and an inclined brush drive unit 84.

[0113] The rotating support shaft 81 extends vertically and is supported on the bottom surface 2a by the inclined brush drive unit 84, allowing it to be raised, lowered, and rotated. Arm 82, as... Figure 12 As shown, the upper side holding device 10A is positioned above the upper side holding device 10A, extending horizontally from the upper end of the rotating support shaft 81. At the front end of the arm 82, a beveled brush 83 is provided, protruding downwards and rotatable about an axis in the vertical direction.

[0114] The beveled brush 83 is formed of, for example, PVA sponge or PVA sponge with dispersed abrasive particles, with an inverted conical trapezoidal shape in the upper half and a conical trapezoidal shape in the lower half. According to the beveled brush 83, the outer peripheral end of the substrate W can be cleaned in the central portion of the outer peripheral surface in the vertical direction.

[0115] The inclined brush drive unit 84 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 81 and rotate it simultaneously. According to this configuration, the central portion of the outer peripheral surface of the inclined brush 83 contacts the outer peripheral end of the substrate W, which is held and rotated by the adsorption and holding unit 21, thereby cleaning the entire outer peripheral end of the substrate W.

[0116] Here, the bevel brush drive unit 84 also includes a motor built into the arm 82. The motor causes the bevel brush 83, which is located at the front end of the arm 82, to rotate about an axis in the vertical direction. Therefore, when cleaning the outer peripheral end of the substrate W, the cleaning force of the bevel brush 83 at the outer peripheral end of the substrate W is increased by rotating the bevel brush 83.

[0117] Figure 13 It means Figure 11 A block diagram of the control system of the substrate cleaning apparatus 1. Figure 13 The control unit 9 includes a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). RAM serves as the CPU's operating area. ROM stores the system program. The storage device stores the control program. By causing the CPU to execute the substrate cleaning program stored in the storage device on the RAM, the operation of each part of the substrate cleaning apparatus 1 is controlled.

[0118] like Figure 13 As shown, the control unit 9 mainly controls the lower clamping drive units 13A and 13B and the upper clamping drive units 14A and 14B in order to receive the substrate W into the substrate cleaning apparatus 1 and hold it above the adsorption and holding unit 21. In addition, the control unit 9 mainly controls the adsorption and holding drive unit 22 in order to adsorb and hold the substrate W by the adsorption and holding unit 21 and rotate the adsorbed and held substrate W.

[0119] Furthermore, the control unit 9 mainly controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. Additionally, the control unit 9 controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0120] Furthermore, the control unit 9 controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57 in order to clean the lower surface of the substrate W. Additionally, the control unit 9 controls the cup drive unit 62 to catch the cleaning liquid that splashes from the substrate W when it is held by the adsorption and holding unit 21 during cleaning.

[0121] Furthermore, the control unit 9 controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the adsorption and holding unit 21. Additionally, the control unit 9 controls the inclined brush drive unit 84 to clean the outer peripheral end of the substrate W held by the adsorption and holding unit 21. Furthermore, the control unit 9 controls the baffle drive unit 92 to open and close the loading / unloading outlet 2x of the unit housing 2 when loading and unloading the substrate W into and out of the substrate cleaning apparatus 1.

[0122] (2) Operation of the substrate cleaning device

[0123] Figures 14-25 It is used to explain Figure 11 A schematic diagram illustrating an example of the operation of the substrate cleaning apparatus 1. Figures 14-25 In the figures, the upper layer shows a top view of the substrate cleaning apparatus 1. Furthermore, the middle layer shows a side view of the lower holding device 20 and its surrounding portion viewed along the Y direction, and the lower layer shows a side view of the lower holding device 20 and its surrounding portion viewed along the X direction. The side views of the middle layer and... Figure 11 The side view of the AA line corresponds to the side view of the lower layer. Figure 11 The BB line side view corresponds to this. Furthermore, to facilitate understanding of the shape and operational status of each component in the substrate cleaning apparatus 1, the scaling ratio of some components differs between the top view and the middle and lower side views. Additionally, Figures 14-25 In the diagram, cup 61 is represented by a two-dot dashed line, while the shape of substrate W is represented by a thicker one-dot dashed line.

[0124] In the initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the baffle 91 of the opening and closing device 90 closes the loading and unloading outlet 2x. Furthermore, as... Figure 11As shown, the lower clamps 11A and 11B maintain a distance between them that is sufficiently greater than the diameter of the substrate W. Similarly, the upper clamps 12A and 12B also maintain a distance between them that is sufficiently greater than the diameter of the substrate W. Furthermore, the movable stage 32 of the stage assembly 30 is configured such that the center of the adsorption holding portion 21 is located at the center of the cup 61 when viewed from above. The lower surface cleaning device 50 is positioned close to the movable stage 32. The lifting support portion 54 of the lower surface cleaning device 50 is positioned such that the upper end of the brush unit 300 is below the adsorption holding portion 21. The transfer device 40 is positioned such that the plurality of support pins 41 are below the adsorption holding portion 21. In the cup assembly 60, the cup 61 is located in the lower cup position. In the following description, the center position of the cup 61 when viewed from above will be referred to as the planar reference position rp. Furthermore, the position of the movable base 32 on the bottom surface 2a when the center of the adsorption and holding part 21 is located at the plane reference position rp when viewed from above is referred to as the first horizontal position.

[0125] The substrate W is transferred into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is transferred in, the baffle 91 opens the transfer outlet 2x. Then, as... Figure 14 As shown by the thick solid arrow a1, the robotic arm (substrate holding part) RH of the substrate transfer robot (not shown) moves the substrate W into the approximate central position inside the cell housing 2 through the loading / unloading outlet 2x. At this time, the substrate W held by the robotic arm RH is as follows: Figure 14 As shown, it is located between the lower clamping plate 11A and the upper clamping plate 12A and the lower clamping plate 11B and the upper clamping plate 12B.

[0126] Next, as Figure 15 As indicated by the thick solid arrow a2, the lower clamps 11A and 11B are positioned below the peripheral portion of the lower surface of the substrate W, bringing them close together. In this state, the robot arm RH is lowered and withdrawn from the loading / unloading outlet 2x. Thus, multiple portions of the peripheral portion of the lower surface of the substrate W held by the robot arm RH are supported by the multiple support pieces of the lower clamps 11A and 11B. After the robot arm RH withdraws, the baffle 91 closes the loading / unloading outlet 2x.

[0127] Next, as Figure 16As shown by the thick solid arrow a3, the upper clamps 12A and 12B are brought closer together by abutting against the outer peripheral ends of the substrate W through multiple holding tabs. By abutting multiple portions of the outer peripheral ends of the substrate W with the multiple holding tabs of the upper clamps 12A and 12B, the substrate W, supported by the lower clamps 11A and 11B, is also held by the upper clamps 12A and 12B. Thus, the center of the substrate W held by the upper holding devices 10A and 10B coincides with or nearly coincides with the planar reference position rp when viewed from above. Furthermore, as... Figure 16 As shown by the thick solid arrow a4, the adsorption holding part 21 is offset from the plane reference position rp by a specific distance, while the geometric center 101 of the brush unit 300 ( Figure 3 The movable platform 32 is moved forward from the first horizontal position by means of the reference position rp on the plane. At this time, the position of the movable platform 32 on the bottom part 2a is called the second horizontal position.

[0128] Next, as Figure 17 As indicated by the thick solid arrow a5, the lifting support 54 rises by contacting the brush unit 300 with the central region of the lower surface of the substrate W. Furthermore, as... Figure 17 As indicated by the thick solid arrow a6, the brush unit 300 is rotated (rotated) about an axis in the vertical direction. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically removed by the brush unit 300.

[0129] Figure 17 The lower layer shows an enlarged side view of the contact portion between the brush unit 300 and the lower surface of the substrate W, within the white box. As shown in the white box, with the brush unit 300 in contact with the substrate W, the liquid nozzle 52 and the gas ejection section 53 are held close to the lower surface of the substrate W. At this time, the liquid nozzle 52, as indicated by white arrow a51, sprays cleaning fluid towards the lower surface of the substrate W near the brush unit 300. Thus, by guiding the cleaning fluid supplied from the liquid nozzle 52 to the lower surface of the substrate W to the contact portion between the brush unit 300 and the substrate W, the contaminants removed from the lower surface of the substrate W by the brush unit 300 are rinsed away by the cleaning fluid. In this way, in the lower surface cleaning apparatus 50, the liquid nozzle 52 and the brush unit 300 are mounted together in the lifting support section 54. This allows for efficient supply of cleaning fluid to the portion of the lower surface of the substrate W cleaned by the brush unit 300. Therefore, the consumption of cleaning fluid is reduced, while excessive dispersion of the cleaning fluid is suppressed.

[0130] In addition, the rotation speed of the brush unit 300 when cleaning the lower surface of the substrate W is maintained at a speed such that the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W does not scatter to the side of the brush unit 300.

[0131] Here, the upper surface 54u of the lifting support 54 is inclined downwards in a direction away from the adsorption and holding part 21. In this case, if the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lifting support 54, the cleaning liquid caught by the upper surface 54u will be guided in a direction away from the adsorption and holding part 21.

[0132] Furthermore, when the lower surface of the substrate W is cleaned by the brush unit 300, the gas ejection section 53, as shown... Figure 17 As indicated by the white arrow a52 within the dialogue box, gas is sprayed toward the lower surface of the substrate W at a position between the brush unit 300 and the adsorption holding portion 21. In this embodiment, the gas ejection portion 53 is mounted on the lifting support portion 54 with the gas ejection port extending in the X direction. In this case, when gas is sprayed onto the lower surface of the substrate W from the gas ejection portion 53, a strip-shaped air curtain extending in the X direction is formed between the brush unit 300 and the adsorption holding portion 21. This prevents the cleaning liquid containing contaminants from scattering toward the adsorption holding portion 21 when the lower surface of the substrate W is cleaned by the brush unit 300. Therefore, it prevents the cleaning liquid containing contaminants from adhering to the adsorption holding portion 21 when the lower surface of the substrate W is cleaned by the brush unit 300, and keeps the adsorption surface of the adsorption holding portion 21 clean.

[0133] in addition, Figure 17 In the example, as shown by the white arrow a52, gas is ejected from the gas ejection section 53 towards the brush unit 300 at an angle upward, but the present invention is not limited to this. The gas ejection section 53 may also eject gas towards the lower surface of the substrate W in the Z direction.

[0134] Next, in Figure 17 In this state, when the cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the brush unit 300 is stopped, and the lifting support 54 is lowered so that the upper end of the brush unit 300 is separated from the substrate W by a specific distance. Furthermore, the spraying of cleaning fluid from the liquid nozzle 52 onto the substrate W is stopped. At this time, gas continues to be sprayed onto the substrate W from the gas ejection section 53.

[0135] After that, as Figure 18 As indicated by the thick solid arrow a7, the movable stage 32 moves rearward with the adsorption holding part 21 positioned at the planar reference position rp. That is, the movable stage 32 moves from the second horizontal position to the first horizontal position. At this time, by continuing to spray gas onto the substrate W from the gas ejection part 53, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0136] Next, as Figure 19 As indicated by the thick solid line arrow a8, the lifting support 54 is lowered such that the brush unit 300 is located below the adsorption surface (upper end) of the adsorption holding part 21. Furthermore, as...Figure 19 As shown by the thick solid arrow a9, the multiple retaining plates of the upper clamps 12A and 12B move away from the outer periphery of the substrate W, causing the upper clamps 12A and 12B to move away from each other. At this time, the substrate W is supported by the lower clamps 11A and 11B.

[0137] After that, as Figure 19 As indicated by the thick solid arrow a10, the pin connecting member 42 is raised such that the upper ends of the multiple support pins 41 are positioned slightly above the lower clamps 11A and 11B. Thus, the substrate W, supported by the lower clamps 11A and 11B, is received by the multiple support pins 41.

[0138] Next, as Figure 20 As indicated by the thick solid arrow a11, the lower clamps 11A and 11B are moved away from each other. At this time, the lower clamps 11A and 11B are moved to a position that does not coincide with the substrate W supported by the multiple support pins 41 when viewed from above. As a result, the upper holding devices 10A and 10B return to their initial state.

[0139] Next, as Figure 21 As indicated by the thick solid arrow a12, the pin connecting member 42 is lowered such that the upper ends of the multiple support pins 41 are located below the adsorption holding part 21. As a result, the substrate W supported on the multiple support pins 41 is received by the adsorption holding part 21. In this state, the adsorption holding part 21 adsorbs and holds the central region of the lower surface of the substrate W. Thus, the center of the substrate W adsorbed and held by the lower holding device 20 coincides with or nearly coincides with the planar reference position rp when viewed from above. Simultaneously with or after the pin connecting member 42 is lowered, as... Figure 21 As indicated by the thick solid arrow a13, the cup 61 is raised from the lower cup position to the upper cup position.

[0140] Next, as Figure 22 As shown by the thick solid arrow a14, the adsorption holding part 21 rotates about an axis in the vertical direction (the axis of rotation of the adsorption holding drive part 22). As a result, the substrate W adsorbed and held in the adsorption holding part 21 rotates in a horizontal position.

[0141] Next, the rotating support shaft 71 of the upper surface cleaning device 70 is rotated and lowered. Thus, as... Figure 22 As indicated by the thick solid arrow a15, the spray nozzle 73 is moved to a position above the substrate W and then lowered such that the distance between the spray nozzle 73 and the substrate W is a predetermined distance. In this state, the spray nozzle 73 sprays a mixture of cleaning fluid and gas onto the upper surface of the substrate W. Furthermore, the rotating support shaft 71 is rotated. Thus, as... Figure 22As indicated by the thick solid arrow a16, the spray nozzle 73 moves to a position above the rotating substrate W. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid onto it.

[0142] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotating support shaft 81 of the end cleaning device 80 also rotates and descends. Thus, as... Figure 22 As indicated by the thick solid arrow a17, the beveled brush 83 is moved to a position above the outer peripheral end of the substrate W. Furthermore, it is lowered so that the central portion of the outer peripheral surface of the beveled brush 83 contacts the outer peripheral end of the substrate W. In this state, the beveled brush 83 is rotated (rotation) about an axis in the vertical direction. As a result, contaminants adhering to the outer peripheral end of the substrate W are physically removed by the beveled brush 83. The contaminants removed from the outer peripheral end of the substrate W are rinsed by a cleaning solution of a mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

[0143] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support 54 is raised by the brush unit 300 contacting the outer region of the lower surface of the substrate W. Additionally, as... Figure 22 As indicated by the thick solid arrow a18, the brush unit 300 can rotate (rotate) about an axis in the vertical direction. Furthermore, the liquid nozzle 52 sprays cleaning fluid towards the lower surface of the substrate W, and the gas ejection section 53 sprays gas towards the lower surface of the substrate W. In this state, as... Figure 22 As indicated by the thick solid arrow a19, the movable support 55 further moves back and forth between an approaching position and a departing position on the movable platform 32. This cleans the entire outer region of the lower surface of the substrate W, which is brushed 300 times and held and rotated by the adsorption and holding part 21.

[0144] Next, when the cleaning of the upper surface, outer peripheral end, and outer region of the lower surface of the substrate W is complete, the spraying of the mixing fluid from the spray nozzle 73 onto the substrate W is stopped. Furthermore, as... Figure 23 As indicated by the thick solid line arrow a20, the spray nozzle 73 has moved to one side of the cup 61 (the initial position). Furthermore, as... Figure 23 As indicated by the thick solid arrow a21, the inclined brush 83 moves to the other side of the cup 61 (the initial position). Furthermore, the rotation of the brush unit 300 is stopped, and the lifting support 54 is lowered so that the upper end of the brush unit 300 is a specific distance away from the substrate W. Additionally, the spraying of cleaning fluid from the liquid nozzle 52 onto the substrate W and the spraying of gas from the gas ejection unit 53 onto the substrate W are stopped. In this state, the adsorption and holding unit 21 rotates at high speed, thereby shaking off the cleaning fluid adhering to the substrate W and drying the entire substrate W.

[0145] Next, as Figure 24As indicated by the thick solid line arrow a22, the cup 61 is lowered from the upper cup position to the lower cup position. Furthermore, this is to facilitate the insertion of the new substrate W into the unit housing 2, as shown... Figure 24 As shown by the thick solid line arrow a23, the lower clamps 11A and 11B are brought close to each other to a position that can support the new substrate W.

[0146] Finally, the substrate W is removed from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is removed, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 25 As shown by the thick solid arrow a24, the robotic arm (substrate holding section) RH of the substrate transfer robot (not shown) enters the unit housing 2 through the transfer inlet / outlet 2x. Then, the robotic arm RH receives the substrate W from the adsorption holding section 21 and exits through the transfer inlet / outlet 2x. After the robotic arm RH exits, the baffle 91 closes the transfer inlet / outlet 2x.

[0147] (3) Effect

[0148] In the substrate cleaning apparatus 1 of this embodiment, the lower surface of the substrate W, held by the upper holding device 10A, 10B or the lower holding device 20, is cleaned by the lower surface brush 100 of the first or second embodiment. Here, the lower surface brush 100 is moved to the first and second horizontal positions, respectively, when cleaning the outer region of the lower surface of the substrate W and when cleaning the central region of the lower surface. When cleaning the outer region of the lower surface of the substrate W, the substrate W is rotated. As a result, the entire lower surface of the substrate W can be cleaned efficiently and effectively.

[0149] [4] Correspondence between the constituent elements of the technical solution and the various parts of the implementation method

[0150] Hereinafter, examples of the correspondence between the constituent elements of the technical solution and the constituent elements of the implementation method will be described, but the present invention is not limited to the following examples. As constituent elements of the technical solution, various other elements having the structure or function described in the technical solution may also be used.

[0151] In the described embodiment, substrate W is an example of a substrate, lower surface brush 100 is an example of a lower surface brush, base portion 110 is an example of a base portion, and geometric center 101 is an example of a geometric center. Cleaning portion 120 is an example of a first cleaning portion, cleaning portion 130 or cleaning portion 140 is an example of a second cleaning portion, through hole 113 is an example of a through hole, inclined portion 220 is an example of an inclined portion, and brush base 200 is an example of a brush base. Upper holding device 10A, 10B or lower holding device 20 is an example of a substrate holding portion, substrate cleaning device 1 is an example of a substrate cleaning device, platform drive portion 33 is an example of a moving device, and lower surface brush rotation drive portion 55a is an example of a rotation drive device.

Claims

1. A lower surface brush for cleaning the lower surface of a substrate, comprising: The base portion has a first upper surface; A first cleaning section protrudes upward from the first upper surface of the base portion and extends in one direction through the geometric center of the base portion when viewed from above; and A second cleaning section protrudes upward from the first upper surface of the base portion and is disposed on the first upper surface of the base portion along the outer edge of the base portion; and The base portion provided for the first cleaning unit and the base portion provided for the second cleaning unit are common components.

2. A lower surface brush for cleaning the lower surface of a substrate, comprising: The base portion has a first upper surface; A first cleaning section protrudes upward from the first upper surface of the base portion and extends in one direction through the geometric center of the base portion when viewed from above; and One or more pairs of second cleaning portions protrude upward from the first upper surface of the base portion and are disposed on the first upper surface of the base portion in an opposing manner with respect to the first cleaning portions; and The base portion provided for the first cleaning unit and the base portion provided for the second cleaning unit are common components; The first cleaning section and the second cleaning section are configured in a non-contact and separate manner.

3. The lower surface brush according to claim 1 or 2, wherein a through hole for discharging liquid is formed in the base portion in a manner extending in the vertical direction.

4. The lower surface brush according to claim 2 is configured to discharge liquid from the periphery of the base portion to the outside through the space between the first cleaning portion and the second cleaning portion.

5. The lower surface brush according to claim 1 or 2, wherein the base portion has a circular, oblong, or elliptical shape when viewed from above, and The first cleaning section is arranged such that it extends between the two points furthest apart on the outer edge of the base section when viewed from above.

6. The lower surface brush according to claim 5, wherein, when viewed from above, the length between the two points of the base portion is greater than 1 / 3 and less than 1 / 2 of the substrate diameter.

7. A brush base comprising: a second upper surface for connection to the base portion of a lower surface brush as described in any one of claims 1 to 6; and The lower surface opposite to the second upper surface; and An inclined portion that slopes outward and downward is formed in the peripheral region of the lower surface.

8. A substrate cleaning apparatus, comprising: Substrate holding section, for holding substrate; and The lower surface brush according to any one of claims 1 to 6 cleans the lower surface of the substrate held by the substrate holding portion.

9. The substrate cleaning apparatus according to claim 8, further comprising a moving device for moving the lower surface brush between a first horizontal position capable of cleaning the outer region of the lower surface surrounding the central region of the lower surface of the substrate, and a second horizontal position capable of cleaning the central region of the lower surface of the substrate.

10. The substrate cleaning apparatus of claim 9, wherein the substrate holding portion rotates the substrate at least when the region outside the lower surface of the substrate is cleaned by the lower surface brush.

11. The substrate cleaning apparatus according to any one of claims 8 to 10, further comprising a rotation drive mechanism capable of rotating the lower surface brush about a vertical axis passing through the geometric center of the base portion.

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