Substrate processing apparatus

Abstract

The present application provides a substrate processing device, comprising: a substrate holding unit holding a substrate horizontally; a processing liquid supply unit having a processing liquid nozzle that sprays a processing liquid to supply the processing liquid to the upper surface of the substrate; a moving unit moving the processing liquid supply unit between a processing position where the processing liquid nozzle opposes the upper surface of the substrate and a retreat position where the processing liquid nozzle retreats from the position opposing the upper surface of the substrate, the processing liquid supply unit having: a first flow path formed in the processing liquid nozzle, one end opposing the central region of the substrate and the other end opposing the peripheral region of the substrate in a state where the processing liquid supply unit is positioned at the processing position; a second flow path extending from the one end of the first flow path to supply the processing liquid to the one end of the first flow path; and a plurality of spray outlets formed in the processing liquid nozzle, arranged in the direction in which the first flow path extends, and spraying the processing liquid in the first flow path to the upper surface of the substrate.

Description

[0001] This application is a divisional application of patent application CN201810495772.5, filed on May 17, 2018, entitled "Substrate Processing Apparatus". Technical Field

[0002] This invention relates to a substrate processing apparatus for processing substrates. Substrates that are processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for field emission display devices such as organic EL (electroluminescence) display devices, substrates for optical discs, substrates for magnetic disks, substrates for optical discs, substrates for photomasks, ceramic substrates, substrates for solar cells, etc. Background Technology

[0003] Japanese Patent Application Publication No. 2015-115492 discloses a substrate processing apparatus capable of processing the upper surface of a substrate with a chemical solution. This substrate processing apparatus has a chemical nozzle with multiple nozzles for ejecting chemical solution. The chemical nozzle is mounted on an arm, which is connected to a support shaft. A swing drive mechanism rotates the support shaft about a vertical axis, positioning the chemical nozzle directly above the center of rotation of the substrate (as described in Japanese Patent Application Publication No. 2015-115492). Figure 7 The first position shown) and the position directly above a portion of the periphery of the substrate (Japanese Patent Application Publication No. 2015-115492). Figure 8 The arm moves between the second position shown. Liquid is supplied from inside the arm to the liquid nozzle.

[0004] For example, Japanese Patent Application Publication No. 2015-115492 Figure 2 As shown in the liquid spray nozzle, among nozzles with multiple spray outlets arranged in the direction of the flow path extension, there is a tendency for the flow rate of liquid ejected from the spray outlet located near the top of the flow path (far from the arm) to be greater than the flow rate of liquid ejected from the spray outlet located near the base of the flow path (closer to the arm).

[0005] Here, the distance traveled per unit time by the nozzle opposite the peripheral region of the substrate relative to the upper surface of the substrate along the rotation direction of the substrate is greater than the distance traveled per unit time by the nozzle opposite the central region of the substrate along the rotation direction of the substrate relative to the upper surface of the substrate. Therefore, if the flow rate of the liquid supplied to the peripheral region of the substrate is not set to be greater than the flow rate of the liquid supplied to the central region of the substrate, the processing of the central region of the substrate will proceed more rapidly than that of the peripheral region. As a result, there is a concern that the upper surface of the substrate will not be processed uniformly.

[0006] For example, Japanese Patent Application Publication No. 2015-115492 Figure 7 As shown, when the center of the liquid nozzle is positioned directly above the rotation center of the substrate and the liquid is sprayed from the nozzle onto the upper surface of the substrate, the flow rate of the liquid supplied to the peripheral area of ​​the substrate cannot be set to be greater than the flow rate of the liquid supplied to the central area of ​​the substrate. Therefore, when using the liquid nozzle disclosed in Japanese Patent Application Publication No. 2015-115492, there is a concern that the upper surface of the substrate may not be uniformly treated.

[0007] Furthermore, in conventional medicine spray nozzles without a heated nozzle structure, the temperature of the arm and nozzle is similar to the surrounding space (around room temperature), causing the medicine to cool within the arm and nozzle. Therefore, even if a sufficiently heated medicine is supplied to the nozzle, there is a concern that the temperature of the medicine may decrease by the time it exits the spray nozzle. Summary of the Invention

[0008] Therefore, one object of the present invention is to provide a substrate processing apparatus capable of processing the upper surface of a substrate with a processing liquid at a desired high temperature and capable of reducing processing unevenness on the upper surface of the substrate.

[0009] One embodiment of the present invention provides a substrate processing apparatus comprising: a substrate holding unit for holding a substrate horizontally; a processing liquid supply unit having a processing liquid nozzle for dispensing processing liquid and supplying processing liquid to an upper surface of the substrate; and a moving unit for moving the processing liquid supply unit between a processing position and a retraction position, the processing position being a position where the processing liquid nozzle is opposite to the upper surface of the substrate, and the retraction position being a position where the processing liquid nozzle retracts from the position opposite to the upper surface of the substrate. Furthermore, the processing liquid supply unit further comprises: a first flow path formed in the processing liquid nozzle, wherein, when the processing liquid supply unit is in the processing position, one end of the first flow path is opposite to a central region of the substrate and the other end of the first flow path is opposite to an outer peripheral region of the substrate; a second flow path extending back from the first flow path and supplying processing liquid to the first flow path end; and a plurality of nozzles formed in the processing liquid nozzle and arranged along the direction of extension of the first flow path to spray processing liquid within the first flow path onto the upper surface of the substrate.

[0010] According to this structure, processing liquid is supplied from the second flow path to one end of the first flow path. Furthermore, multiple nozzles are arranged in the direction extending from the first flow path. Therefore, in the processing liquid nozzle, the flow rate of processing liquid ejected from the nozzle located near the top (near the other end) of the first flow path becomes greater than the flow rate of processing liquid ejected from the nozzle located near the base (near one end) of the first flow path. Therefore, in the processing liquid nozzle, the flow rate ejected from the nozzle at the other end of the first flow path is greater than the flow rate ejected from the nozzle at one end of the first flow path. On the other hand, when the processing liquid supply unit is in the processing position, one end of the first flow path faces the central region of the substrate, and the other end of the first flow path faces the outer peripheral region of the substrate. Therefore, the flow rate of processing liquid supplied to the outer peripheral region of the upper surface of the substrate can be increased compared to the flow rate of processing liquid supplied to the central region of the upper surface of the substrate. Therefore, processing unevenness on the upper surface of the substrate can be reduced.

[0011] Furthermore, since the second flow path, which supplies processing liquid to one end of the first flow path, extends back from one end of the first flow path, the first and second flow paths can be positioned in contact with each other. Moreover, since the entire processing liquid supply unit moves via the moving unit, the first and second flow paths can remain close to each other even during movement of the processing liquid supply unit. Therefore, the processing liquid in the first flow path can be kept warm by the processing liquid in the second flow path. Thus, the temperature drop of the processing liquid heading towards the nozzle can be suppressed. As a result, since the temperature of the processing liquid ejected from the nozzle and falling onto the upper surface of the substrate can be maintained at a high temperature, the upper surface of the substrate can be treated with a processing liquid at the desired high temperature.

[0012] As described above, the upper surface of the substrate can be treated with a processing liquid at a desired high temperature, and the processing unevenness of the upper surface of the substrate can be reduced.

[0013] In one embodiment of the present invention, the first flow path extends parallel to the upper surface of the substrate. Therefore, the difference in distance between the spray nozzles and the upper surface of the substrate among multiple spray nozzles can be reduced. Therefore, the difference in heat loss of the processing liquid from the time the processing liquid exits the spray nozzle until it lands on the upper surface of the substrate can be reduced among multiple spray nozzles. Thus, uneven processing on the upper surface of the substrate can be reduced.

[0014] In one embodiment of the present invention, the second flow path extends parallel to the first flow path. Therefore, the first and second flow paths can be brought close together over the entire area in the direction in which the first flow path extends. This allows for efficient heat preservation of the process liquid in the first flow path by the process liquid in the second flow path. Furthermore, by extending the first and second flow paths parallel to each other, the process liquid in the first flow path is uniformly kept warm over the entire area in the direction in which the first flow path extends. In other words, it prevents the occurrence of localized areas where the process liquid in the first flow path is not kept warm. Therefore, it reduces the temperature difference of the process liquid ejected from the nozzles between multiple nozzles. Therefore, it reduces processing non-uniformity on the upper surface of the substrate.

[0015] In one embodiment of the present invention, the processing fluid supply unit further includes a flow path forming pipe, which forms a second flow path. The flow path forming pipe is fixed together with the processing fluid nozzle. That is, the flow path forming pipe with the second flow path also serves as a component supporting the processing fluid nozzle. Therefore, miniaturization of the processing fluid supply unit can be achieved.

[0016] In one embodiment of the invention, the second flow path is formed at the processing fluid nozzle. Therefore, the second flow path can be positioned further close to the first flow path. Consequently, the processing fluid in the first flow path can be kept warm more efficiently by the processing fluid within the second flow path.

[0017] The treatment fluid nozzle has a dual-tube structure, consisting of an inner tube and an outer tube. Furthermore, the inner tube divides the first flow path, and the inner and outer tubes divide the second flow path. Therefore, the second flow path can be positioned further close to the first flow path. This allows for more efficient heat preservation of the treatment fluid in the first flow path through the treatment fluid within the second flow path.

[0018] In one embodiment of the invention, the moving unit includes a rotating unit that rotates the treatment fluid supply unit about a rotation axis along the vertical direction. Therefore, by a simple action of rotating about the rotation axis, the treatment fluid supply unit can be moved between a processing position and a retraction position.

[0019] In one embodiment of the present invention, the plurality of nozzles are configured such that the flow rate of the processing liquid supplied to the region on the upper surface of the substrate opposite to the other end of the first flow path is greater than the flow rate of the processing liquid supplied to the region on the upper surface of the substrate opposite to one end of the first flow path. Here, as described above, when the processing liquid supply unit is in the processing position, one end of the first flow path faces the central region of the substrate, and the other end of the first flow path faces the outer peripheral region of the substrate. Therefore, the flow rate of the processing liquid supplied to the outer peripheral region of the upper surface of the substrate can be further increased than the flow rate of the processing liquid supplied to the central region of the upper surface of the substrate. As a result, since the temperature drop of the processing liquid in the outer peripheral region of the upper surface of the substrate can be suppressed, the reduction in the etching rate of the outer peripheral region of the upper surface of the substrate can be prevented.

[0020] In one embodiment of the present invention, the substrate processing apparatus further includes an attraction unit that attracts the processing liquid in the first flow path.

[0021] Here, when the supply of processing liquid from the second flow path to the first flow path is stopped, processing liquid may sometimes remain in the first flow path, which has multiple nozzles. When the processing liquid supply unit moves while processing liquid remains in the first flow path, the remaining processing liquid may sometimes form droplets and fall onto the upper surface of the substrate. This undesirable falling of processing liquid raises concerns about the formation of particles on the upper surface of the substrate. Therefore, by using an suction unit to attract the processing liquid in the first flow path, it is possible to prevent processing liquid from remaining in the first flow path when the supply of processing liquid is stopped. Thus, it is possible to suppress the falling of processing liquid onto the substrate when the supply of processing liquid is stopped.

[0022] In one embodiment of the present invention, the suction unit includes: a suction flow path connected near one end of the first flow path; and a suction device that suctions the interior of the first flow path via the suction flow path. Therefore, the suction device can efficiently suction the processing liquid within the first flow path. On the other hand, it can prevent excessive suction of the processing liquid in the second flow path. Therefore, it can suppress excessive suction of the processing liquid and prevent waste of the processing liquid, and can efficiently remove the processing liquid from the first flow path.

[0023] In one embodiment of the present invention, the first flow path includes: a liquid accumulation section for accumulating the processing liquid supplied from the second flow path; and a spray flow path extending laterally from the liquid accumulation section to connect each of the spray outlets and the liquid accumulation section.

[0024] According to this structure, when the supply of processing liquid from the second flow path to the first flow path is stopped, processing liquid may sometimes remain in the accumulation section and the ejection flow path. Since the ejection flow path extends laterally from the accumulation section, the processing liquid in the ejection flow path is less likely to be affected by the weight of the processing liquid in the accumulation section. Therefore, when the supply of processing liquid is stopped, it is possible to prevent the processing liquid from falling onto the substrate through the ejection outlet via the ejection flow path.

[0025] In one embodiment of the invention, the ejection flow path includes: a vertical flow path extending upward from the nozzle; and an inclined flow path connecting the vertical flow path and the liquid accumulation section, inclined relative to the horizontal direction as it moves upward from the liquid accumulation section toward the vertical flow path. Therefore, even if treatment liquid remains in the ejection flow path, it can easily return to the liquid accumulation section via the inclined flow path. Thus, the weight of the treatment liquid within the ejection flow path can be further reduced.

[0026] In one embodiment of the invention, the nozzle is located above the bottom of the liquid accumulation section. Therefore, compared to a structure where the nozzle is located below the liquid accumulation section, the spray path can be shortened. Consequently, the weight of the treatment liquid within the spray path can be further reduced.

[0027] In one embodiment of the present invention, the cross-sectional area of ​​the ejection flow path is smaller than the cross-sectional area of ​​the liquid accumulation section. Therefore, since the surface tension of the processing liquid acting within the ejection flow path can be increased, the processing liquid is more likely to remain within the ejection flow path. Thus, it is possible to suppress the processing liquid from falling onto the substrate when the supply of processing liquid is stopped.

[0028] In one embodiment of the invention, the processing fluid supply unit includes a heat insulation member surrounding the processing fluid nozzle, thereby insulating the nozzle from the ambient gas surrounding it. This further enhances the heat preservation of the processing fluid within the first flow path.

[0029] Hereinafter, the above-mentioned or further other objects, features and effects of the present invention will be clarified by referring to the accompanying drawings and describing the following embodiments. Attached Figure Description

[0030] Figure 1 This is a schematic top view illustrating the internal layout of the substrate processing apparatus according to the first embodiment of the present invention.

[0031] Figure 2 This is a schematic diagram of the processing unit included in the substrate processing apparatus.

[0032] Figure 3 This is a side view of the processing liquid supply unit and the surrounding area of ​​the processing liquid supply unit of the processing unit.

[0033] Figure 4 This is a top view of the processing fluid supply unit.

[0034] Figure 5 It is along Figure 4 A cross-sectional view cut along the VV line.

[0035] Figure 6 This is a bottom view of the processing fluid nozzle and the surrounding area of ​​the processing fluid supply unit.

[0036] Figure 7 It is along Figure 5 A sectional view cut along line VII-VII.

[0037] Figure 8 This is a block diagram illustrating the electrical structure of the main parts of the substrate processing apparatus.

[0038] Figure 9 This is a flowchart illustrating an example of substrate processing using the substrate processing apparatus.

[0039] Figure 10A This is used to illustrate the pre-dispense of the substrate processing. Figure 9 A graphical side view of S2).

[0040] Figure 10B This is a pre-allocation used to illustrate the substrate processing ( Figure 9 A graphical side view of S2).

[0041] Figure 10C This is a solution treatment used to illustrate the substrate processing. Figure 9 A graphical side view of S3.

[0042] Figure 11 It means in Figure 9 A graph showing an example of how the temperature of the processing liquid supplied to the processing liquid nozzle changes over time during substrate processing.

[0043] Figure 12 It means in Figure 9 A graph showing another example of how the temperature of the processing liquid supplied to the processing liquid nozzle changes over time during substrate processing.

[0044] Figure 13 This is a cross-sectional view of the processing liquid nozzle according to the second embodiment of the present invention.

[0045] Figure 14 This is a bottom view of the treatment fluid nozzle according to the third embodiment of the present invention.

[0046] Figure 15This is a side view of the processing fluid supply unit and the periphery of the processing fluid supply unit according to the fourth embodiment of the present invention.

[0047] Figure 16 It is along Figure 15 A sectional view cut along the XVI-XVI line.

[0048] Figure 17 This is a cross-sectional view of the processing liquid nozzle according to the fifth embodiment of the present invention. Detailed Implementation

[0049] <First Implementation>

[0050] Figure 1 This is a schematic top view illustrating the internal layout of the substrate processing apparatus 1 according to the first embodiment of the present invention.

[0051] The substrate processing apparatus 1 is a single-sheet device for processing substrates W, such as silicon wafers, one by one. In this embodiment, the substrate W is a circular substrate. The substrate processing apparatus 1 includes: multiple processing units 2 for processing the substrate W with processing liquids such as chemical solutions and rinsing solutions; a loading port LP for holding a container C that holds the multiple substrates W processed in the processing units 2; transport robots IR and CR for transporting the substrates W between the loading port LP and the processing units 2; and a controller 3 for controlling the substrate processing apparatus 1. The transport robot IR transports the substrate W between the container C and the transport robot CR. The transport robot CR transports the substrate W between the transport robot IR and the processing units 2. The multiple processing units 2, for example, have the same structure.

[0052] Figure 2 This is a schematic diagram illustrating an example of the structure of processing unit 2.

[0053] Processing unit 2 includes a rotary chuck 5, a cylindrical cup 6, a liquid supply unit 7, a moving unit 8, a rinsing liquid supply unit 9, and a standby container 10. The rotary chuck 5 holds a substrate W in a horizontal position while rotating the substrate W about a vertical axis of rotation A1 passing through the center of the substrate W. The cup 6 surrounds the rotary chuck 5. The liquid supply unit 7 supplies liquid to the upper surface (surface) of the substrate W. The moving unit 8 moves the liquid supply unit 7 at least horizontally. The rinsing liquid supply unit 9 supplies a rinsing liquid such as deionized water (DIW) to the upper surface of the substrate W. Viewed from above, the standby container 10 is positioned around the cup 6.

[0054] Processing unit 2 also includes a chamber 14 for accommodating cup 6 (see reference). Figure 1An inlet / outlet (not shown) is formed in chamber 14 for moving substrate W into or out of chamber 14. Chamber 14 is provided with a gate unit (not shown) for opening and closing the inlet / outlet.

[0055] The rotary chuck 5 includes a chuck pin 20, a rotary base 21, a rotary shaft 22 attached to the center of the lower surface of the rotary base 21, and an electric motor 23 that provides rotational force to the rotary shaft 22. The rotary shaft 22 extends vertically along the rotation axis A1. The rotary base 21 is attached to the upper end of the rotary shaft 22.

[0056] The rotating base 21 has a circular plate shape along the horizontal direction. A plurality of chuck pins 20 are arranged circumferentially at intervals on the periphery of the upper surface of the rotating base 21. The rotating base 21 and the chuck pins 20 are included in a substrate holding unit that holds the substrate W horizontally. The substrate holding unit is also called a substrate holding member.

[0057] The rotating shaft 22 is rotated by the electric motor 23, causing the substrate W to rotate about the rotation axis A1. The electric motor 23 is included in the substrate rotation unit that rotates the substrate W about the rotation axis A1.

[0058] The liquid supply unit 7 includes a first liquid nozzle 30 for spraying liquid, a first liquid conduit 31 for supporting the first liquid nozzle 30, a second liquid nozzle 40 for spraying liquid, and a second liquid conduit 41 for supporting the second liquid nozzle 40. The first liquid nozzle 30 has a plurality of first nozzle outlets 30a for spraying liquid onto the upper surface of the substrate W. The second liquid nozzle 40 has a second nozzle outlet 40a for spraying liquid onto the upper surface of the substrate W. The liquid supply unit 7 is an example of a processing liquid supply unit that supplies processing liquid to the upper surface of the substrate W. The first liquid nozzle 30 is an example of a processing liquid nozzle included in a processing liquid supply unit.

[0059] The solution may be phosphoric acid, for example, used as an etching solution. The solution may be a liquid other than phosphoric acid. That is, the solution may be a liquid containing at least one of sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, ammonia, hydrogen peroxide, organic acids (e.g., citric acid, oxalic acid, etc.), organic bases (e.g., TMAH: tetramethylammonium hydroxide, etc.), surfactants, and preservatives.

[0060] The first liquid nozzle 30 is connected to the first liquid supply pipe 35 via the first liquid piping 31. A first electric valve 32, a first flow meter 33, and a first temperature sensor 34 are installed on the first liquid supply pipe 35. Phosphoric acid or other liquids are supplied from the liquid supply source to the first liquid supply pipe 35. The first electric valve 32 switches whether to supply liquid to the first liquid nozzle 30 and changes the flow rate of the liquid supplied to the first liquid nozzle 30. The first flow meter 33 detects the flow rate of the liquid flowing through the first liquid supply pipe 35. The first temperature sensor 34 detects the temperature of the liquid within the first liquid supply pipe 35.

[0061] The second medicine nozzle 40 is connected to a second medicine supply pipe 45 via a second medicine piping 41. A second electric valve 42, a second flow meter 43, and a second temperature sensor 44 are installed on the second medicine supply pipe 45. Phosphoric acid or other medicine solutions are supplied from a medicine supply source to the second medicine supply pipe 45. The second electric valve 42 switches whether to supply medicine to the second medicine nozzle 40 and changes the flow rate of the medicine supplied to the second medicine nozzle 40. The second flow meter 43 detects the flow rate of the medicine solution flowing through the second medicine supply pipe 45. The second temperature sensor 44 detects the temperature of the medicine solution within the second medicine supply pipe 45.

[0062] The liquid supply unit 7 moves between a processing position and a retracted position via the moving unit 8. When the liquid supply unit 7 is in the processing position, the first liquid nozzle 30 is opposite to the substrate W. When the liquid supply unit 7 is in the retracted position, the first liquid nozzle 30 retracts from the position opposite to the substrate W. In the processing position, the second liquid nozzle 40, like the first liquid nozzle 30, is also opposite to the substrate W. In the retracted position, the second liquid nozzle 40 also retracts from the position opposite to the substrate W.

[0063] The moving unit 8 includes a rotating shaft 25 extending vertically, a retaining member 26 connected to the rotating shaft 25, and a rotating unit 27 providing a driving force to the rotating shaft 25 to rotate about the rotation axis A2. The retaining member 26 includes an arm 26a extending in a direction orthogonal to the rotation axis A2, and a support portion 26b supporting the first liquid tubing 31 and the second liquid tubing 41. Rotating the rotating shaft 25 via the rotating unit 27 causes the retaining member 26, the first liquid tubing 31, and the second liquid tubing 41 to rotate about the rotation axis A2. This causes the first liquid nozzle 30 and the second liquid nozzle 40 to rotate about the rotation axis A2. The rotating unit 27 is, for example, an electric motor.

[0064] The moving unit 8 may include: a ball screw (not shown) for raising and lowering the rotating shaft 25; and an electric motor (not shown) for providing driving force to the ball screw. Raising and lowering the rotating shaft 25 via the moving unit 8 causes the retainer 26, the first liquid pipe 31, and the second liquid pipe 41 to rise and fall. Consequently, the first liquid nozzle 30 and the second liquid nozzle 40 rise and fall.

[0065] The rinsing fluid supply unit 9 includes a rinsing fluid nozzle 50 that supplies rinsing fluid to the upper surface of the substrate W. A rinsing fluid pipe 51 is connected to the rinsing fluid nozzle 50. A rinsing fluid valve 52 is installed on the rinsing fluid pipe 51. A rinsing fluid such as DIW is supplied from a rinsing fluid supply source to the rinsing fluid pipe 51. The rinsing fluid valve 52 opens and closes the flow path of the rinsing fluid. The rinsing fluid nozzle 50 is a fixed nozzle. Unlike this embodiment, the rinsing fluid nozzle 50 may be a movable nozzle capable of moving in both the horizontal and vertical directions.

[0066] The rinsing solution is not limited to DIW; it can be carbonated water, electrolyzed ionized water, ozone water, hydrochloric acid water with a dilution concentration (e.g., around 10 ppm to 100 ppm), alkaline ionized water containing ammonia, or reduced water (containing hydrogen).

[0067] The standby container 10 is a container for receiving the medicine sprayed from the first medicine nozzle 30 and the second medicine nozzle 40, which retract from the upper surface of the substrate W. The standby container 10 has a bottomed cylindrical shape. When the medicine supply unit 7 is in the retracted position, the first medicine nozzle 30 and the second medicine nozzle 40 are located above the standby container 10. A drain pipe 55 for discharging the medicine inside the standby container 10 is connected to the bottom of the standby container 10. A drain valve 56 is installed on the drain pipe 55 to open and close the flow path of the medicine inside the drain pipe 55.

[0068] Next, use Figures 3-6 The structure of the liquid medicine supply unit 7 is explained in detail.

[0069] Figure 3 This is a side view of the liquid medicine supply unit 7 and its surrounding area. Figure 4 This is a top view of the medicine supply unit 7. Figure 5 It is along Figure 4 A cross-sectional view cut along the VV line. Figure 6 It is a bottom view of the first liquid nozzle 30 and its surrounding area.

[0070] Reference Figure 3The second liquid pipe 41 includes a horizontal portion 41a and a downward portion 41b. The horizontal portion 41a extends horizontally in a direction away from the rotation axis A2. The downward portion 41b is connected to the horizontal portion 41a. The downward portion 41b extends obliquely downward relative to the horizontal direction as it moves away from the rotation axis A2. The second liquid nozzle 40 is connected to the downward portion 41b. The second liquid nozzle 40 extends obliquely downward relative to the horizontal direction as it moves away from the rotation axis A2. At the top of the second liquid nozzle 40, there is a spray portion 40b with a second spray outlet 40a formed.

[0071] A first liquid nozzle 30 extends horizontally. The first liquid nozzle 30 has one end 30b opposite to the side facing the rotation axis A2 and another end 30c facing the rotation axis A2. A first liquid tubing 31 folds back from one end 30b of the first liquid nozzle 30 and extends horizontally. The first liquid tubing 31 includes an upper horizontal portion 31a, a downward portion 31b, and a lower horizontal portion 31c. The upper horizontal portion 31a extends horizontally in a direction away from the rotation axis A2. The downward portion 31b extends downward from the upper horizontal portion 31a. The lower horizontal portion 31c extends horizontally from the lower end of the downward portion 31b in a direction approaching the rotation axis A2. The upper horizontal portion 31a and the lower horizontal portion 31c extend parallel to the first liquid nozzle 30. The downward portion 31b extends vertically. The lower horizontal portion 31c is connected to one end 30b of the first liquid nozzle 30.

[0072] The first liquid nozzle 30 is fixed to the first liquid pipe 31 by a bracket 28 extending downward from the upper horizontal portion 31a of the first liquid pipe 31.

[0073] Reference Figure 4 The processing unit 2 further includes a suction unit 11 for suctioning the liquid in the first liquid nozzle 30. The suction unit 11 includes a suction pipe 65 and a suction device 60. The suction pipe 65 branches off to the first liquid pipe 31. The suction device 60 suctions the interior of the first flow path 70 provided in the first liquid nozzle 30 through a suction flow path 65a formed within the suction pipe 65. The suction device 60 is a vacuum pump or the like. A suction valve 66 is installed on the suction pipe 65 to open and close the suction flow path 65a. The suction pipe 65 connects to the connection portion 31d of the upper horizontal portion 31a and the lower portion 31b of the first liquid pipe 31. The suction pipe 65, along with the first liquid pipe 31 and the second liquid pipe 41, is supported by the support portion 26b of the retainer 26.

[0074] Reference Figure 5A first flow path 70 extending horizontally is formed within the first liquid nozzle 30. The direction in which the first flow path 70 extends is the same as the direction in which the first liquid nozzle 30 extends. The first flow path 70 extends parallel to the upper surface of the substrate W. The direction in which the first flow path 70 extends is referred to as the length direction L. The first flow path 70 has one end 70a facing the side opposite to the rotation axis A2 and another end 70b facing the rotation axis A2.

[0075] A second flow path 80 is formed within the first liquid pipe 31, extending from one end 70a of the first flow path 70 and then reversing back. Specifically, the second flow path 80 is formed in the upper horizontal portion 31a of the first liquid pipe 31, and a reversing flow path 85 connecting one end 70a of the first flow path 70 and the second flow path 80 is formed in the lower horizontal portion 31b and the lower horizontal portion 31c of the first liquid pipe 31. The first liquid pipe 31 is an example of a flow path forming pipe with the second flow path 80. In the first flow path 70, the treatment liquid flows from one end 70a to the other end 70b. In the direction of the treatment liquid flow, one end 70a is located upstream of the other end 70b.

[0076] The second flow path 80 extends horizontally. The second flow path 80 extends parallel to the first flow path 70 and is connected to the first flow path 70 via a reversing flow path 85. Therefore, in a top view, the second flow path 80 overlaps with the first flow path 70. An attraction flow path 65a connects to the portion where the second flow path 80 and the reversing flow path 85 intersect (near one end 70a of the first flow path 70).

[0077] When the liquid supply unit 7 is in the processing position ( Figure 3 and Figure 4 In the state shown, the first liquid nozzle 30 is opposite to the upper surface of the substrate W. For details, refer to... Figure 3 One end 30b of the first liquid nozzle 30 faces the central region of the upper surface of the substrate W, and the other end 30c of the first liquid nozzle 30 faces the outer peripheral region of the upper surface of the substrate W. Therefore, when the liquid supply unit 7 is in the processing position, the first flow path 70 is disposed above the substrate W. Furthermore, one end 70a of the first flow path 70 faces the central region of the upper surface of the substrate W, and the other end 70b of the first flow path 70 faces the outer peripheral region of the upper surface of the substrate W.

[0078] The central region of the upper surface of substrate W refers to the region including the rotation center of the upper surface of substrate W. The rotation center of the upper surface of substrate W refers to the position on the upper surface of substrate W that intersects the rotation axis A1. The outer peripheral region of the upper surface of substrate W refers to the region near the periphery of the upper surface of substrate W.

[0079] like Figure 6As shown, a plurality of first spray outlets 30a are formed on the lower surface 30d of the first liquid nozzle 30. The plurality of first spray outlets 30a are arranged along the length direction L. Specifically, the plurality of first spray outlets 30a are spaced equally apart from each other. When the liquid supply unit 7 is positioned in the processing position, the first spray outlet 30a near one end 70a sprays the liquid in the first flow path 70 into the central region of the upper surface of the substrate W, and the first spray outlet 30a near the other end 70b sprays the liquid in the first flow path 70 into the outer peripheral region of the upper surface of the substrate W.

[0080] The distance between the first nozzles 30a near the other end 70b of the first flow path 70 (second interval P2) is smaller than the distance between the first nozzles 30a near one end 70a of the first flow path 70 (first interval P1). That is, the plurality of first nozzles 30a are configured such that the flow rate of the liquid supplied to the region on the upper surface of the substrate W opposite to the other end 70b of the first flow path 70 (the outer peripheral region of the upper surface of the substrate W) is greater than the flow rate of the liquid supplied to the region on the upper surface of the substrate W opposite to the one end 70a of the first flow path 70 (the central region of the upper surface of the substrate W). Furthermore, intervals P1 and P2 are the center-to-center distances between adjacent first nozzles 30a. In this embodiment, a total of twelve first nozzles 30a are provided. Only the interval P2 between the four first nozzles 30a counting from the fourth nozzle closest to the other end 70b is smaller than the interval P1 between the other first nozzles 30a.

[0081] Alternatively, unlike this embodiment, only one first nozzle 30a may be provided near one end 70a of the first flow path 70. Furthermore, only one first nozzle 30a may be provided near the other end 70b of the first flow path 70.

[0082] Next, use Figure 7 The structure of the first flow path 70 is explained in detail. Figure 7 It is along Figure 5 A sectional view cut along line VII-VII.

[0083] Reference Figure 7 The first flow path 70 includes: a liquid collection section 71 for collecting liquid medicine supplied from the second flow path 80; and a plurality of ejection flow paths 72 connecting a plurality of first ejection outlets 30a and the liquid collection section 71. The liquid collection section 71 has a cylindrical shape extending laterally along the length direction L of the first flow path 70 to the sides of the plurality of first ejection outlets 30a. Each ejection flow path 72 extends laterally from the liquid collection section 71. An ejection flow path 72 is connected to each first ejection outlet 30a.

[0084] Each ejection flow path 72 includes: a cylindrical vertical flow path 72a extending upward from the corresponding first ejection outlet 30a; and an inclined flow path 72b connecting the corresponding vertical flow path 72a and the liquid accumulation section 71. The inclined flow path 72b is inclined relative to the horizontal direction as it moves upward from the liquid accumulation section 71 toward the corresponding vertical flow path 72a. The inclined flow path 72b is cylindrical. The diameter D1 of the vertical flow path 72a and the diameter D2 of the inclined flow path 72b are smaller than the diameter D3 of the liquid accumulation section 71. Therefore, the cross-sectional area of ​​the ejection flow path 72 is smaller than the cross-sectional area of ​​the liquid accumulation section 71.

[0085] The lower surface 30d of the first liquid nozzle 30 includes: a first surface 30e, located below the liquid accumulation portion 71; and a second surface 30f, connected to the first surface 30e by a step 30g. The second surface 30f is located above the bottom 71a (lower end) of the liquid accumulation portion 71. The second surface 30f is a flat surface. The first spray outlet 30a is formed on the second surface 30f. Therefore, the first spray outlet 30a is located above the bottom 71a (lower end) of the liquid accumulation portion 71.

[0086] A reinforcing member 36 extending along the length direction L passes through the first liquid nozzle 30. The reinforcing member 36 is, for example, a hollow rod made of stainless steel.

[0087] Figure 8 This is a block diagram illustrating the electrical structure of the main parts of the substrate processing apparatus 1. The controller 3 includes a microcomputer that controls the controlled objects of the substrate processing apparatus 1 according to a predetermined program. More specifically, the controller 3 includes a processor (CPU) 3A and a memory 3B storing the program, and is configured to execute various controls for substrate processing by executing the program through the processor 3A. In particular, the controller 3 controls the actions of the handling robots IR and CR, the electric motor 23, the moving unit 8, the suction device 60, and valves 32, 42, 52, 56, 66, etc.

[0088] Figure 9 This is a flowchart illustrating an example of substrate processing in substrate processing apparatus 1. Figure 9 This indicates the substrate processing performed by the controller 3. In the substrate processing, substrates W are processed sequentially, one by one. In the substrate processing of each substrate W, for example, as... Figure 9 As shown, the following steps are performed sequentially: substrate loading (S1), pre-dispense (S2), chemical treatment (S3), rinsing (S4), drying (S5), and substrate removal (S6).

[0089] In the substrate processing, firstly, the unprocessed substrate W is moved from the container C into the processing unit 2 by the transport robots IR and CR, and then handed over to the rotary chuck 5 (S1). Then, until the substrate W is removed by the transport robot CR, the substrate W is spaced upward from the upper surface of the rotating base 21 by the chuck pin 20 and kept horizontal (substrate holding process).

[0090] After the substrate W is loaded and before its upper surface is treated with the chemical solution, a pre-dispensing (S2) of the chemical solution is initiated, spraying it from the first chemical solution nozzle 30 and the second chemical solution nozzle 40. In the substrate processing where the processing unit 2 processes substrates W one by one, by performing the pre-dispensing (S2), the temperature difference of the chemical solution supplied to the substrate W during chemical solution treatment (S3) between substrates W processed in the same processing unit 2 can be reduced. Therefore, the quality variation between substrates W can be reduced. The second chemical solution nozzle 40 has only one second outlet 40a, but the first chemical solution nozzle 30 has multiple first outlets 30a. Therefore, the flow rate of the processing liquid sprayed from the second chemical solution nozzle 40 (flowing within the second chemical solution nozzle 40) is generally smaller than the flow rate of the processing liquid sprayed from the first chemical solution nozzle 30 (flowing within the first chemical solution nozzle 30). Therefore, the temperature of the processing liquid flowing within the second chemical solution nozzle 40 is more susceptible to changes in the surrounding environment than the temperature of the processing liquid flowing within the first chemical solution nozzle 30. Therefore, temperature control via pre-allocation (S2) becomes more important for the second liquid nozzle 40 than for the first liquid nozzle 30.

[0091] Figure 10A and Figure 10B This is a pre-allocation used to illustrate the substrate processing ( Figure 9 A graphical side view of S2). Figure 10C This is a chemical solution treatment used to illustrate substrate processing. Figure 9 A graphical side view of S3.

[0092] In pre-allocation (S2), such as Figure 10A As shown, the moving unit 8 positions the liquid supply unit 7 in the retracted position. Then, the first electric valve 32 and the second electric valve 42 are opened. As a result, liquid medicine is sprayed from the plurality of first spray outlets 30a of the first liquid medicine nozzle 30 and the second spray outlets 40a of the second liquid medicine nozzle 40. The liquid medicine sprayed from the first spray outlets 30a and the second spray outlets 40a is received by the standby container 10. The liquid medicine in the standby container 10 is drained from the standby container 10 by opening the drain valve 56.

[0093] After the medicine is sprayed from the multiple first spray outlets 30a of the first medicine nozzle 30 and the second spray outlets 40a of the second medicine nozzle 40 for a predetermined time, the first electric valve 32 and the second electric valve 42 are closed. Thus, as... Figure 10BAs shown, the ejection of medicine from the plurality of first spray outlets 30a of the first medicine nozzle 30 and the second spray outlet 40a of the second medicine nozzle 40 is stopped.

[0094] Then, after a pre-allocation of the solution over a constant time period (S2), the chemical treatment begins (S3). Specifically, as follows... Figure 10C As shown, the electric motor 23 rotates the rotating base 21. This causes the substrate W, held horizontally by the chuck pin 20, to rotate (substrate rotation process). Then, the moving unit 8 moves the liquid supply unit 7 to the processing position. Then, the first electric valve 32 and the second electric valve 42 are opened. This causes liquid to be sprayed from the plurality of first spray outlets 30a of the first liquid nozzle 30 and the second spray outlets 40a of the second liquid nozzle 40. The liquid sprayed from the first spray outlets 30a and the second spray outlets 40a falls onto the upper surface of the substrate W. The supplied liquid is distributed across the entire upper surface of the substrate W by centrifugal force. Thus, the upper surface of the substrate W is treated with the liquid.

[0095] Next, after a constant time of chemical treatment (S3), a rinsing process (S4) is performed to remove the chemical solution from the substrate W by replacing the chemical solution on the substrate W with a rinsing solution such as DIW.

[0096] Specifically, the first electric valve 32 and the second electric valve 42 are closed, and the rinsing fluid valve 52 is opened. This supplies (sprays) rinsing fluid from the rinsing fluid nozzle 50 onto the upper surface of the substrate W. The rinsing fluid sprayed from the rinsing fluid nozzle 50 falls onto the central region of the upper surface of the substrate W. The rinsing fluid supplied to the substrate W is distributed across the entire upper surface of the substrate W by centrifugal force. The medication on the substrate W is rinsed by this rinsing fluid. During this process, the moving unit 8 retracts the medication supply unit 7 to a retracted position. Before moving the medication supply unit 7, the suction device 60 draws the medication from the first flow path 70 of the first medication nozzle 30.

[0097] Next, a drying process (S5) is performed to dry the substrate W. Specifically, the rinsing liquid valve 52 is closed. Then, the electric motor 23 rotates the substrate W at a high rotational speed (e.g., 3000 rpm). As a result, a large centrifugal force acts on the rinsing liquid on the substrate W, causing the rinsing liquid on the substrate W to be thrown to the surrounding area of ​​the substrate W. In this way, the rinsing liquid is removed from the substrate W, and the substrate W is dried. Then, after a predetermined time has elapsed since the substrate W started rotating at high speed, the electric motor 23 stops rotating the substrate W through the rotating base 21.

[0098] Then, the transport robot CR enters the processing unit 2, picks up the processed substrate W from the rotary chuck 5, and moves it out of the processing unit 2 (S6). The substrate W is then transferred from the transport robot CR to the transport robot IR, which receives it into the container C. Then, the processing of the next unprocessed substrate W begins.

[0099] Next, use Figure 11 Here is a detailed example of pre-allocation (S2). Figure 11 It means in Figure 9 A graph illustrating an example of how the temperature of the liquid ejected from the first liquid nozzle 30 changes over time during substrate processing. Figure 11 In the diagram, the horizontal axis represents the processing time t, and the vertical axis represents the temperature T of the liquid medicine ejected from the first liquid medicine nozzle 30. The ejection temperature T is detected by the first temperature sensor 34. Therefore, strictly speaking, the ejection temperature T is the temperature of the liquid medicine within the first liquid medicine supply pipe 35. Figure 11 In this paper, the changes in ejection temperature T over time are shown for the first to third substrates W processed in the continuous processing of substrate W. Here, since the change in ejection temperature of the second liquid nozzle 40 over time is almost the same as the change in ejection temperature T of the first liquid nozzle 30 over time, a detailed explanation is omitted.

[0100] In the pre-allocation (S2), for example, the spray flow rate of the liquid medicine is set to the same spray flow rate (processing flow rate) as the liquid medicine in the liquid medicine treatment (S3), and the liquid medicine is started to be sprayed from the first liquid medicine nozzle 30 into the standby container 10. That is, the spray flow rate of the liquid medicine is set to be constant. The spray flow rate of the liquid medicine refers to the flow rate detected by the first flow meter 33. The setting of the spray flow rate of the liquid medicine is performed by changing the opening degree of the first electric valve 32. The time when the liquid medicine starts to be sprayed from the first liquid medicine nozzle 30 into the standby container 10 is set as t0 (pre-allocation start process).

[0101] A continuous supply of new medicine is provided to the medicine supply unit 7. Therefore, as processing time t elapses, the temperature of the medicine supply unit 7 (specifically, the walls of the first medicine nozzle 30 and the first medicine pipe 31) and the components surrounding the medicine supply unit 7 rises. Conversely, the medicine supply unit 7 and the components surrounding it draw heat from the medicine flowing inside the first medicine nozzle 30 and the first medicine pipe 31. Therefore, the ejection temperature T of the medicine ejected from the first medicine nozzle 30 at the start of pre-dispensing (time t0) is considerably lower than the equilibrium temperature (saturation temperature T1) between the temperature of the medicine supply unit 7 and the components surrounding it and the temperature of the medicine flowing inside the first medicine nozzle 30 and the first medicine pipe 31.

[0102] As the liquid medicine supply unit 7 and the components surrounding it continue to spray liquid medicine from the first liquid medicine nozzle 30, the temperature rises, thereby reducing the heat absorbed by the liquid medicine supply unit 7 and the components surrounding it. By further continuing to spray liquid medicine from the first liquid medicine nozzle 30, liquid medicine at a saturation temperature T1 is sprayed from the first liquid medicine nozzle 30.

[0103] Let t1 be the time when the spray temperature T reaches the saturation temperature T1. The period from the start of pre-dispensing (time t0) to the time when the liquid medicine at saturation temperature T1 is sprayed from the first liquid medicine nozzle 30 (time t1) (hereinafter referred to as the "reaching period") depends on the temperature of the liquid medicine supply unit 7 and the components surrounding the liquid medicine supply unit 7 before the start of pre-dispensing. The greater the difference between the temperature of the liquid medicine supply unit 7 and the components surrounding the liquid medicine supply unit 7 before the start of pre-dispensing and the saturation temperature T1, the longer the reaching period. The smaller the difference between the temperature of the liquid medicine supply unit 7 and the components surrounding the liquid medicine supply unit 7 before the start of pre-dispensing and the saturation temperature T1, the shorter the reaching period.

[0104] When processing unit 2 continuously processes substrate W, at the start of continuous processing (e.g., processing of the first substrate W and the second substrate W), the temperature of the pre-dispensing solution supply unit 7 and the components surrounding the solution supply unit 7 is relatively low. In particular, during the processing of the first substrate W, the temperature of the pre-dispensing solution supply unit 7 and the components surrounding the solution supply unit 7 sometimes drops to, for example, room temperature (e.g., about 25°C).

[0105] exist Figure 11 In the example shown, if the time elapsed since the start of pre-dispensing reaches the saturation temperature T1, dispensing of medicine from the first medicine nozzle 30 is stopped (pre-dispensing stop process). Then, the moving unit 8 moves the medicine supply unit 7 toward the processing position (medicine supply unit moving process). During the movement of the medicine supply unit 7, since no new medicine is supplied to the medicine supply unit 7, the temperature of the medicine supply unit 7 gradually decreases, thereby reducing the temperature of the medicine in the first medicine nozzle 30 and the first medicine pipe 31. When the medicine supply unit 7 reaches the processing position, the first electric valve 32 is reopened. Thus, the supply of medicine from the first medicine nozzle 30 to the upper surface of the substrate W begins (medicine supply process). The time when the medicine supply unit 7 reaches the processing position is set as t2.

[0106] like Figure 11 As shown, the later the substrate W is processed, the earlier the times t1 and t2 are. Although not illustrated, the times t1 and t2 in the processing of the fourth and subsequent substrates W are almost equal to the times t1 and t2 in the processing of the third substrate W.

[0107] That is, in Figure 11 In the example shown, the pre-allocation period for the first substrate W is set to be longer than the pre-allocation period for the second substrate W, and the pre-allocation period for the second substrate W is set to be longer than the pre-allocation period for the third substrate W. The pre-allocation periods for the fourth and subsequent substrates W are almost the same as the pre-allocation period for the third substrate.

[0108] By performing pre-dispensing using this method, the difference in the spray temperature T at the start of the chemical treatment can be reliably reduced in each substrate treatment.

[0109] Next, use Figure 12 Here is another example of pre-allocation (S2) explained in detail. Figure 12 It means in Figure 9 A graph illustrating another example of how the temperature of the liquid ejected from the first liquid nozzle 30 changes over time during substrate processing. Figure 12 In this diagram, the horizontal axis is set to the processing time t, and the vertical axis is set to the ejection temperature T. Figure 12 In this paper, the changes in ejection temperature T over time are shown for the first to third substrates W processed in the continuous processing of substrate W. Here, since the change in ejection temperature of the second liquid nozzle 40 over time is almost the same as the change in ejection temperature T of the first liquid nozzle 30 over time, a detailed explanation is omitted.

[0110] The moment when the liquid is first sprayed from the first liquid nozzle 30 into the standby container 10, i.e., the start of pre-dispensing, is set to t0. Then, the moment when the liquid supply unit 7 starts supplying liquid to the upper surface of the substrate W from the first liquid nozzle 30 after the pre-dispensing is completed and moves to the processing position is set to t3. Regardless of which substrate W is being processed, the start time of liquid supply is set in such a way that the time from time t0 to time t3 is constant (liquid supply time setting process). Then, at the moment when the constant period has elapsed since the start of pre-dispensing (which is time t3), the opening of the first electric valve 32 is adjusted to control the spray flow rate so that the spray temperature T of the liquid sprayed from the first liquid nozzle 30 is a target temperature T2 that is lower than the saturation temperature T1. If the spray flow rate decreases, the spray temperature T decreases because the heat of the entire liquid supplied to the liquid supply unit 7 is smaller. On the other hand, if the spray flow rate is increased, the spray temperature T increases because the heat of the entire liquid supplied to the liquid supply unit 7 is larger.

[0111] As described above, when the processing unit 2 continuously processes the substrates W, the temperature of the liquid supply unit 7 and the components surrounding the liquid supply unit 7 is relatively low when continuous processing begins (e.g., processing of the first and second substrates W). Therefore, the ejection flow rate in the pre-dispensing of the first substrate W is set to be greater than the ejection flow rate in the pre-dispensing of the second substrate W, and the ejection flow rate in the pre-dispensing of the second substrate W is set to be greater than the ejection flow rate in the pre-dispensing of the third substrate W. The ejection flow rate in the pre-dispensing of the fourth and subsequent substrates W is almost the same as the ejection flow rate in the pre-dispensing of the third substrate.

[0112] After the liquid medicine is supplied from the first liquid medicine nozzle 30 to the upper surface of the substrate W, the controller 3 adjusts the opening degree of the first electric valve 32 (opening degree adjustment process) in a manner that reduces the difference in ejection temperature T for each substrate treatment, for example. The controller 3 performs feedback control based on the flow rate detected by the first flow meter 33. Figure 12 The example shown illustrates how the target temperature T3 changes after the start of drug supply as the processing time t in drug treatment (S3) elapses. Even in this case, by constantly detecting the flow rate by the first flow meter 33 and constantly adjusting the opening of the first electric valve 32, the difference in ejection temperature T for each substrate treatment can be reduced.

[0113] According to this method, since the target temperatures T2 and T3 are lower than the saturation temperature T1, not only can the pre-dispensing time (S2) be shortened, but the consumption of the chemical solution can also be reduced. Moreover, by implementing feedback control, the difference in ejection temperature T for each substrate processing can be further reduced.

[0114] Generally, in a nozzle with a flow path that is closed at one end, the pressure of the treatment fluid near one end of the flow path is greater than that in other parts of the flow path. Therefore, there is a tendency for the flow rate of the treatment fluid ejected from the nozzle located near the top of the flow path to be greater than the flow rate of the treatment fluid ejected from the nozzle located near the base of the flow path.

[0115] According to the first embodiment, liquid medicine is supplied from the second flow path 80 to one end 70a of the first flow path 70. Furthermore, a plurality of first nozzles 30a are arranged in the direction in which the first flow path 70 extends (length direction L). Therefore, in the first liquid medicine nozzle 30, the flow rate of the first nozzle 30a located near the other end 70b of the first flow path 70 is greater than the flow rate of the first nozzle 30a located near one end 70a of the first flow path 70.

[0116] On the other hand, when the liquid supply unit 7 is in the processing position, one end 70a of the first flow path 70 faces the central region of the substrate W, and the other end 70b of the first flow path 70 faces the outer peripheral region of the substrate W. Therefore, the flow rate of the liquid supplied to the outer peripheral region of the upper surface of the substrate W can be increased compared to the flow rate of the liquid supplied to the central region of the upper surface of the substrate W. Therefore, processing unevenness on the upper surface of the substrate W can be reduced.

[0117] Furthermore, since the second flow path 80, which supplies the liquid medicine to one end 70a of the first flow path 70, extends back from one end 70a of the first flow path 70, the first flow path 70 and the second flow path 80 can be positioned close to each other. Moreover, since the entire liquid medicine supply unit 7 moves via the moving unit 8, the first flow path 70 and the second flow path 80 remain close to each other during the movement of the liquid medicine supply unit 7. Therefore, the processing liquid in the first flow path 70 can be kept warm by the processing liquid in the second flow path 80. Thus, the temperature drop of the liquid medicine toward the first nozzle 30a can be suppressed. As a result, since the temperature of the processing liquid ejected from the first nozzle 30a and falling onto the upper surface of the substrate W can be maintained at a high temperature, the upper surface of the substrate W can be treated with a processing liquid at the desired high temperature.

[0118] As described above, the upper surface of the substrate W can be treated with a processing liquid at a desired high temperature, and the processing unevenness of the upper surface of the substrate W can be reduced.

[0119] Furthermore, according to the first embodiment, the first flow path 70 extends parallel to the upper surface of the substrate W. Therefore, the difference in distance between the first spray outlet 30a and the upper surface of the substrate W among the plurality of first spray outlets 30a can be reduced. Therefore, the difference in heat loss of the processing liquid from the first spray outlet 30a to its landing on the upper surface of the substrate W can be reduced among the plurality of first spray outlets 30a. Thus, processing unevenness on the upper surface of the substrate W can be reduced.

[0120] Furthermore, according to the first embodiment, the second flow path 80 extends parallel to the first flow path 70. Therefore, the first flow path 70 and the second flow path 80 can be brought close together over the entire region in the direction (length direction L) in which the first flow path 70 extends. This allows for efficient heat preservation of the processing liquid within the first flow path 70 by the processing liquid within the second flow path 80. Moreover, by extending the first flow path 70 and the second flow path 80 parallel to each other, the liquid in the first flow path 70 is uniformly kept warm over the entire region in the length direction L. In other words, it is possible to prevent the liquid in the first flow path 70 from being partially unheated. Therefore, the temperature difference of the ejected liquid between the first nozzles 30a can be reduced. Therefore, processing unevenness on the upper surface of the substrate W can be reduced.

[0121] Furthermore, by bringing the first flow path 70 and the second flow path 80 closer together, the drug supply unit 7 can be miniaturized.

[0122] Furthermore, the second flow path 80 turns back from one end 70a of the first flow path 70 and extends parallel to the first flow path 70. Therefore, the liquid flowing through the upstream portion of the second flow path 80 keeps the liquid flowing through the periphery of the other end 70b of the first flow path 70 warm compared to the liquid flowing through the periphery of one end 70a of the first flow path 70. This reduces the temperature difference of the liquid within the first flow path 70.

[0123] Furthermore, according to the first embodiment, the liquid supply unit 7 also includes a first liquid pipe 31 (flow path forming pipe) forming a second flow path 80. The first liquid pipe 31 supports the first liquid nozzle 30. That is, the first liquid pipe 31 forming the second flow path 80 also serves as a component supporting the first liquid nozzle 30. Therefore, miniaturization of the liquid supply unit 7 can be achieved.

[0124] Furthermore, according to the first embodiment, the moving unit 8 includes a rotating unit 27 that rotates the liquid medicine supply unit 7 about a rotation axis A2 along the vertical direction. Therefore, the liquid medicine supply unit 7 can be moved between a processing position and a retreating position by a simple operation of rotating about the rotation axis A2.

[0125] Furthermore, according to the first embodiment, the plurality of first nozzles 30a are configured such that the flow rate of the processing liquid supplied to the region on the upper surface of the substrate W opposite to the other end 70b of the first flow path 70 is greater than the flow rate of the processing liquid supplied to the region on the upper surface of the substrate W opposite to one end 70a of the first flow path 70. Therefore, the flow rate of the processing liquid supplied to the outer peripheral region of the upper surface of the substrate W can be further increased than the flow rate of the processing liquid supplied to the central region of the upper surface of the substrate W. Consequently, since the temperature drop of the processing liquid in the outer peripheral region of the upper surface of the substrate W can be suppressed, the reduction in the etching rate in the outer peripheral region of the upper surface of the substrate W can be prevented.

[0126] Furthermore, according to the first embodiment, the processing unit 2 includes an aspiration unit 11 for aspirating the liquid medicine within the first flow path 70. Here, when switching from a state where liquid medicine is supplied from the second flow path 80 to the first flow path 70 to a state where the supply of liquid medicine from the second flow path 80 to the first flow path 70 is stopped, liquid medicine may remain in the first flow path 70. If the moving unit 8 moves the liquid medicine supply unit 7 in this state, the liquid medicine remaining in the first flow path 70 may sometimes form droplets and fall onto the upper surface of the substrate W. There is a concern that particles may be generated on the upper surface of the substrate W due to this undesirable falling liquid medicine. Therefore, by having the aspiration unit 11 aspirate the liquid medicine within the first flow path 70, it is possible to prevent liquid medicine from remaining in the first flow path 70 when the supply of liquid medicine is stopped. Thus, it is possible to prevent the liquid medicine from falling onto the substrate W when the supply of liquid medicine is stopped.

[0127] Furthermore, according to the first embodiment, the suction unit 11 includes: a suction flow path 65a connected to the vicinity 80a of one end 70a of the first flow path 70; and a suction device 60 that suctions the interior of the first flow path 70 through the suction flow path 65a. Therefore, the suction device 60 can efficiently suction the liquid medicine within the first flow path 70. On the other hand, it can prevent excessive suction of the liquid medicine in the second flow path 80. Therefore, it can suppress excessive suction of the liquid medicine, thus preventing waste, and can efficiently remove the liquid medicine from the first flow path 70.

[0128] Furthermore, according to the first embodiment, the first flow path 70 includes: a liquid accumulation section 71 for accumulating the liquid medicine supplied from the second flow path 80; and a spray flow path 72 extending laterally from the liquid accumulation section 71. Each spray flow path 72 connects the corresponding first spray outlet 30a and the liquid accumulation section 71.

[0129] Therefore, the liquid medicine supplied from the second flow path 80 to the first flow path 70 passes sequentially through the accumulation section 71 and the ejection flow path 72 before being ejected from the first ejection outlet 30a. If the supply of liquid medicine from the second flow path 80 to the first flow path 70 is stopped, the liquid medicine in the first flow path 70 remains in the accumulation section 71 and the ejection flow path 72. Since the ejection flow path 72 extends laterally from the accumulation section 71, it is difficult for the weight of the liquid medicine in the accumulation section 71 to be applied to the processing liquid in the ejection flow path 72. Compared to a structure where the ejection flow path 72 extends downward from the accumulation section 71, it is difficult for the weight of the liquid medicine in the accumulation section 71 to be applied to the liquid medicine in the ejection flow path 72. Therefore, when the supply of liquid medicine is stopped, it is possible to prevent the liquid medicine from falling onto the substrate W through the ejection flow path 72 from the first ejection outlet 30a.

[0130] Furthermore, according to the first embodiment, the ejection flow path 72 includes: a vertical flow path 72a extending upward from the first ejection outlet 30a; and an inclined flow path 72b connecting the vertical flow path 72a and the liquid accumulation section 71. The inclined flow path 72b is inclined upward relative to the horizontal direction from the liquid accumulation section 71 toward the vertical flow path 72a. Therefore, even if there is residual drug liquid in the ejection flow path 72, the drug liquid can easily return to the liquid accumulation section 71 through the inclined flow path 72b. Therefore, the weight of drug liquid applied in the ejection flow path 72 can be further reduced.

[0131] Furthermore, according to the first embodiment, the first nozzle 30a is located above the bottom 71a of the liquid accumulation section 71. Therefore, compared to a structure where the first nozzle 30a is located below the liquid accumulation section 71, the spray path 72 can be shortened. Thus, the weight of the liquid medicine applied within the spray path 72 can be further reduced.

[0132] Furthermore, according to the first embodiment, the cross-sectional area of ​​the ejection flow path 72 is smaller than the cross-sectional area of ​​the liquid accumulation section 71. Therefore, since the surface tension of the liquid acting within the ejection flow path 72 can be increased, the liquid is more likely to remain within the ejection flow path 72. Thus, it is possible to suppress the liquid from falling onto the substrate W when the supply of liquid stops.

[0133] <Second Implementation>

[0134] Next, the second embodiment of the present invention will be described. Figure 13 This is a cross-sectional view of the first liquid nozzle 30 in the second embodiment. Figure 13 This is a cross-sectional view taken when the first liquid nozzle 30 is cut along a plane orthogonal to the length direction L. Figure 13 In this drawing, components that are the same as those described so far are marked with the same reference numerals and the description is omitted.

[0135] In the first liquid nozzle 30 of the second embodiment, unlike the first embodiment, the lower surface 30d of the first liquid nozzle 30 does not have a step 30g; the lower surface 30d is a flat surface. Furthermore, the first nozzle outlet 30a is formed on the lower surface 30d. Therefore, the first nozzle outlet 30a is located lower than the bottom 71a of the liquid accumulation portion 71. Since the lower surface 30d of the first liquid nozzle 30 is a flat surface, the processing (manufacturing) steps of the first liquid nozzle 30 can be simplified.

[0136] <Third Implementation Method>

[0137] Next, the third embodiment of the present invention will be described. Figure 14 This is a bottom view of the first liquid nozzle 30 in the third embodiment. Figure 14 In this drawing, components that are the same as those described so far are marked with the same reference numerals and the description is omitted.

[0138] In the first liquid nozzle 30 of the third embodiment, unlike the first embodiment, the first outlet 30a near the other end 70b of the first flow path 70 is larger than the first outlet 30a near one end 70a of the first flow path 70. The diameter d2 of the first outlet 30a near the other end 70b is larger than the diameter d1 of the first outlet 30a near one end 70a of the first flow path 70. That is, similar to the first embodiment, the plurality of first outlets 30a are configured such that the flow rate of the liquid supplied to the outer peripheral region of the upper surface of the substrate W is greater than the flow rate of the liquid supplied to the central region of the upper surface of the substrate W.

[0139] In the third embodiment, a total of eleven first nozzles 30a are provided. The diameter d2 of the three first nozzles 30a counting from the other end 70b is larger than the diameter d1 of the other first nozzles 30a.

[0140] According to the third embodiment, the flow rate of the solution supplied to the outer peripheral region of the upper surface of the substrate W can be further increased than the flow rate of the solution supplied to the central region of the upper surface of the substrate W. Therefore, since the temperature drop of the solution in the outer peripheral region of the upper surface of the substrate W can be suppressed, a decrease in the etching rate of the outer peripheral region of the upper surface of the substrate W can be prevented.

[0141] In the third embodiment, the distances between the first nozzles 30a are equal (P1 = P2). In this embodiment, similar to the first embodiment, the distance (spacement P2) between the first nozzles 30a near the other end 70b of the first flow path 70 can be smaller than the distance (spacement P1) between the first nozzles 30a near one end 70a of the first flow path 70 (P2 < P1). This allows for a further increase in the flow rate of the liquid medicine supplied to the outer peripheral region of the upper surface of the substrate W compared to the flow rate of the liquid medicine supplied to the central region of the upper surface of the substrate W.

[0142] <Fourth Implementation>

[0143] Next, the fourth embodiment of the present invention will be described. Figure 15 This is a side view of the liquid medicine supply unit 7 and the periphery of the liquid medicine supply unit 7 according to the fourth embodiment of the present invention. Figure 16 It is along Figure 15 A sectional view cut along the XVI-XVI line. Figure 15 and Figure 16 In this drawing, components identical to those described above are labeled with the same reference numerals and their descriptions are omitted. Figure 15 For ease of explanation, the illustrations of the second liquid nozzle 40 and the second liquid piping 41 are omitted.

[0144] The fourth embodiment of the liquid supply unit 7 includes a first liquid nozzle 90 having a double-tube structure consisting of an inner tube 91 and an outer tube 92, replacing the first liquid nozzle 30 and the first liquid piping 31 of the first embodiment. In the first liquid nozzle 90, a first flow path 70 is divided by the inner tube 91, and a second flow path 80 is divided by the inner tube 91 and the outer tube 92.

[0145] The outer tube 92 includes: a cylindrical tube 93 having one end 93a facing away from the rotation axis A2 and another end 93b facing the rotation axis A2; and a wall portion 94 blocking one end 93a of the cylindrical tube 93. A first liquid supply tube 35 is connected to the other end 93b of the cylindrical tube 93. The outer tube 92 is supported by the retainer 26 of the moving unit 8.

[0146] The inner tube 91 includes: a cylindrical tube 95 that divides out a liquid accumulation section 71; a plurality of protruding tubes 96 that extend from the cylindrical tube 95 to the outside of the outer tube 92; and a dividing wall 97 that divides out the other end 70b of the first flow path 70.

[0147] The protruding tube 96 divides the ejection flow path 72 and is bent with its tip pointing downwards. At the tip of each protruding tube 96, a plurality of first ejection outlets 90a are formed for ejecting liquid medicine onto the upper surface of the substrate W.

[0148] A gap 98 is provided between the upper part of the tube 95 and the wall portion 94. Through this gap 98, the second flow path 80 is turned back from one end 70a of the first flow path 70.

[0149] When the liquid supply unit 7 is positioned in the processing position, a plurality of first spray outlets 90a are opposite to the upper surface of the substrate W. Specifically, the first spray outlet 90a near one end 70a is opposite to the central region of the upper surface of the substrate W, and the first spray outlet 90a near the other end 70b is opposite to the outer peripheral region of the upper surface of the substrate W.

[0150] In the fourth embodiment, no gap is provided between the lower end of the outer tube 92 and the lower end of the inner tube 91, but a gap may also be provided between the lower end of the outer tube 92 and the lower end of the inner tube 91, and this gap constitutes part of the second flow path 80.

[0151] According to the fourth embodiment, as described above, the first liquid nozzle 90 has a double-tube structure consisting of an inner tube 91 and an outer tube 92. Furthermore, a first flow path 70 is divided by the inner tube 91, and a second flow path 80 is divided by the inner tube 91 and the outer tube 92. Therefore, the second flow path 80 can be positioned further close to the first flow path 70. This allows for more efficient heat preservation of the liquid in the first flow path 70 through the liquid in the second flow path 80. Furthermore, compared to a structure with folded-back piping, the liquid supply unit 7 can be miniaturized.

[0152] <Fifth Implementation>

[0153] Next, the fifth embodiment of the present invention will be described. Figure 17 This is a cross-sectional view of the first liquid nozzle 30 according to the fifth embodiment. Figure 17 In this document, components that are identical to those described above are marked with the same reference numerals and their descriptions are omitted.

[0154] The fifth embodiment of the liquid supply unit 7 does not include a first liquid supply pipe 31. In addition to the first flow path 70, the first liquid nozzle 30 of the liquid supply unit 7 also has a second flow path 80 and a reversing flow path 85. Since the reversing flow path 85 does not actually appear... Figure 17In the cross-section shown, it is therefore indicated by a double-dotted line. Therefore, the second flow path 80 can be positioned further close to the first flow path 70. This allows for more efficient heat preservation of the liquid in the first flow path 70 via the liquid in the second flow path 80. Furthermore, compared to a structure with folded-back piping (e.g., the structure of the first embodiment), the liquid supply unit 7 can be miniaturized.

[0155] Furthermore, the liquid supply unit 7 of the fifth embodiment also includes a heat insulation member 100, which surrounds the first liquid nozzle 30 and insulates the first liquid nozzle 30 from the ambient gas surrounding it. Therefore, the liquid within the first flow path 70 can be kept warm more efficiently. Preferably, the first liquid nozzle 30 is formed of a material with high thermal conductivity, such as a fluorinated resin. Examples of fluorinated resins include PTFE (polytetrafluoroethylene). If the temperature of the treatment liquid is below 100°C, PE (polyethylene) can be used. The heat insulation member 100 does not necessarily need to cover the entire surface of the first liquid nozzle 30.

[0156] The present invention is not limited to the embodiments described above, and can be implemented in other ways.

[0157] For example, the various embodiments described above can be combined arbitrarily. For example, the liquid medicine supply unit 7 of the first to fourth embodiments may include a heat insulation member 100.

[0158] Furthermore, the structure of the drug supply unit 7 can also be applied to units that supply treatment fluids other than drugs (such as rinsing fluids).

[0159] Furthermore, the second flow path 80 does not necessarily need to be parallel to the first flow path 70; the second flow path 80 can extend at an angle relative to the first flow path 70, or it can extend in a curved manner. Additionally, the reversing flow path 85 can be omitted, and the second flow path 80 can be directly connected to the first flow path 70. Furthermore, the first flow path 70 does not necessarily need to extend horizontally; it can be inclined relative to the horizontal direction with its other end 70b positioned lower than one end 70a. In this way, the flow rate of the liquid ejected from the first nozzle 30a at the other end 70b side of the first flow path 70 can be further increased compared to the flow rate of the liquid ejected from the first nozzle 30a at one end 70a side of the first flow path 70.

[0160] Furthermore, the moving unit 8 does not necessarily include the rotating unit 27. The moving unit 8 may include: a ball screw mechanism that moves the liquid supply unit 7 in a straight line along the horizontal direction; and an electric motor that provides driving force to the ball screw mechanism.

[0161] Furthermore, in the substrate processing, pre-dispensing (S2) can begin before the substrate is moved in (S1). This shortens the time from when the substrate W is moved into the processing unit 2 to when the liquid medicine is supplied to the upper surface of the substrate W.

[0162] In addition to the features described in the claims, the following features can be extracted from this specification and drawings. These features can be arbitrarily combined with the features described in the invention.

[0163] A1. The substrate processing apparatus further includes: a substrate holding unit for holding the substrate horizontally;

[0164] A processing liquid supply unit includes a processing liquid nozzle for dispensing processing liquid and supplying processing liquid to the upper surface of the substrate; and

[0165] A moving unit moves the processing liquid supply unit between a processing position and a retracting position. The processing position is the position where the processing liquid nozzle is opposite to the upper surface of the substrate, and the retracting position is the position where the processing liquid nozzle retracts from the position opposite to the upper surface of the substrate.

[0166] The processing fluid supply unit also includes:

[0167] Multiple nozzles are arranged along the direction in which the treatment fluid nozzle extends; and

[0168] A first flow path includes: a liquid accumulation section for accumulating treatment liquid; and a spray flow path extending laterally from the liquid accumulation section to connect each of the spray outlets to the liquid accumulation section.

[0169] According to the invention described in A1, the processing liquid supplied to the first flow path sequentially passes through the liquid accumulation section and the ejection flow path and is ejected from the ejection port. Therefore, by ejecting the processing liquid from the ejection port while the processing liquid supply unit is moved to the processing position, the processing liquid can be made to fall onto the upper surface of the substrate.

[0170] Here, when no processing fluid is supplied to the first flow path, the processing fluid remains in the accumulation section and the ejection flow path. Since the ejection flow path extends laterally from the accumulation section, the weight of the processing fluid in the accumulation section is difficult to apply to the processing fluid in the ejection flow path. Compared to a structure where the ejection flow path extends downward from the accumulation section, the weight of the processing fluid in the accumulation section is less likely to apply to the processing fluid in the ejection flow path. Therefore, it is possible to prevent unwanted processing fluid from falling from the processing fluid nozzle onto the substrate after the processing fluid supply is stopped.

[0171] A2. The substrate processing apparatus according to A1, wherein the first flow path is configured such that, when the processing liquid supply unit is located in the processing position, one end faces the central region of the substrate and the other end faces the outer peripheral region of the substrate.

[0172] The processing fluid supply unit further includes a second flow path, which extends back from one end of the first flow path and supplies processing fluid to that end of the first flow path.

[0173] According to the invention described in A2, a processing liquid is supplied from the second flow path to one end of the first flow path. Furthermore, a plurality of nozzles are arranged in the direction in which the first flow path extends. Therefore, in the processing liquid nozzles, the flow rate of the nozzles near the other end of the first flow path is greater than the flow rate of the nozzles near one end of the first flow path. On the other hand, when the processing liquid supply unit is in the processing position, one end of the first flow path faces the central region of the substrate, and the other end of the first flow path faces the outer peripheral region of the substrate. Therefore, the flow rate of the processing liquid supplied to the outer peripheral region of the upper surface of the substrate can be increased compared to the flow rate of the processing liquid supplied to the central region of the upper surface of the substrate. Therefore, processing unevenness on the upper surface of the substrate can be reduced.

[0174] Furthermore, since the second flow path, which supplies the processing liquid to one end of the first flow path, extends back from one end of the first flow path, the first and second flow paths can be positioned close to each other. Moreover, since the entire processing liquid supply unit moves via the moving unit, the first and second flow paths can remain close to each other even during movement of the processing liquid supply unit. Therefore, the processing liquid in the first flow path can be kept warm by the processing liquid in the second flow path. Thus, the temperature drop of the processing liquid heading towards the nozzle can be suppressed. As a result, since the temperature of the processing liquid ejected from the nozzle and falling onto the upper surface of the substrate can be maintained at a high temperature, the upper surface of the substrate can be treated with a processing liquid at the desired high temperature.

[0175] As described above, the upper surface of the substrate can be treated with a processing liquid at a desired high temperature, and the processing unevenness of the upper surface of the substrate is reduced.

[0176] The embodiments of the present invention have been described in detail, but these are merely specific examples used to clarify the technical content of the present invention. The present invention should not be limited to these specific examples, and the scope of the present invention is defined only by the appended claims.

[0177] This application corresponds to Japan Patent Office Patent Application No. 2017-099269 filed on May 18, 2017, the entire disclosure of which is incorporated herein by reference.

Claims

1. A substrate processing apparatus, wherein, have: The substrate holding unit holds the substrate horizontally. A processing liquid supply unit includes a processing liquid nozzle for dispensing processing liquid and supplying processing liquid to the upper surface of the substrate; and A moving unit moves the processing liquid supply unit between a processing position and a retracting position. The processing position is the position where the processing liquid nozzle is opposite to the upper surface of the substrate, and the retracting position is the position where the processing liquid nozzle retracts from the position opposite to the upper surface of the substrate. The processing fluid supply unit also includes: A first flow path is formed in the processing liquid nozzle. When the processing liquid supply unit is in the processing position, one end of the first flow path is opposite to the central region of the substrate and the other end of the first flow path is opposite to the outer peripheral region of the substrate. The second flow path extends horizontally from one end of the first flow path and back to supply the processing fluid to that end of the first flow path. A reversing flow path connects one end of the first flow path to the second flow path and extends downward from the second flow path; as well as Multiple nozzles are formed in the processing liquid nozzle and arranged along the direction extending from the first flow path to spray the processing liquid within the first flow path onto the upper surface of the substrate. The substrate processing apparatus also includes a suction unit that suctions the processing liquid within the first flow path. The suction unit includes: a suction flow path, which is connected near one end of the first flow path to the portion where the second flow path and the return flow path intersect; And a suction device, which draws in the interior of the first flow path via the suction flow path.

2. The substrate processing apparatus according to claim 1, wherein, The first flow path extends parallel to the upper surface of the substrate.

3. The substrate processing apparatus according to claim 1 or 2, wherein, The second flow path extends parallel to the first flow path.

4. The substrate processing apparatus according to claim 3, wherein, The processing fluid supply unit further includes a flow path forming pipe, which forms the second flow path. The flow path forming piping is fixed together with the treatment liquid nozzle.

5. The substrate processing apparatus according to claim 3, wherein, The second flow path is formed at the treatment fluid nozzle.

6. The substrate processing apparatus according to claim 1 or 2, wherein, The plurality of nozzles are configured such that the flow rate of the processing liquid supplied to the region on the upper surface of the substrate opposite to the other end of the first flow path is greater than the flow rate of the processing liquid supplied to the region on the upper surface of the substrate opposite to one end of the first flow path.

7. The substrate processing apparatus according to claim 1 or 2, wherein, The first flow path includes: a liquid accumulation section for accumulating the processing liquid supplied from the second flow path; and a spray flow path extending laterally from the liquid accumulation section to connect each of the spray outlets to the liquid accumulation section.

8. The substrate processing apparatus according to claim 7, wherein, The ejection flow path includes: a vertical flow path extending upward from the ejection outlet; and an inclined flow path connecting the vertical flow path and the liquid accumulation section, and inclined relative to the horizontal direction as it moves upward from the liquid accumulation section toward the vertical flow path.

9. The substrate processing apparatus according to claim 7, wherein, The spray outlet is located above the bottom of the liquid accumulation section.

10. The substrate processing apparatus according to claim 7, wherein, The cross-sectional area of ​​the ejected flow path is smaller than the cross-sectional area of ​​the liquid accumulation section.

11. The substrate processing apparatus according to claim 1 or 2, wherein, The processing fluid supply unit includes a heat insulation component that surrounds the processing fluid nozzle and insulates the processing fluid nozzle from the ambient gas surrounding the nozzle.

12. The substrate processing apparatus according to claim 1 or 2, wherein, The moving unit includes a rotating unit that causes the treatment fluid supply unit to rotate about a rotation axis along the vertical direction. The rotating unit includes: A retainer is connected to the rotating shaft; The support portion supports the second flow path and the suction flow path on the retainer.

13. The substrate processing apparatus according to claim 12, wherein, The suction unit draws in the treatment liquid within the first flow path before the moving unit moves the treatment liquid nozzle from the treatment position to the retraction position.

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