A flipping device for a wafer transfer system, and its assembling device and method

Abstract

The present invention discloses an assembly method for a flipping device for a wafer transmission system, comprising the following steps: S01: fixing a fixed block in a supporting base via a first positioning unit, wherein the fixed block includes a hollow chamber; S02: extending a motor output shaft into the hollow chamber to ensure that the motor output shaft does not contact the inner wall of the fixed block during rotation; S03: removing the fixed block in the first positioning unit and fixing a wafer simulation disk in the supporting base via the first positioning unit; S04: installing a flipping assembly on the outside of the wafer simulation disk, wherein the motor output shaft is fixedly connected to the flipping assembly, and the axis centerline of the motor output shaft and the axis centerline of the flipping assembly coincide with one of the diameters of the wafer simulation disk. The present invention greatly improves the assembly efficiency of the wafer flipping device and promotes further development in the field of wafer transmission.

Description

Technical Field

[0001] The present invention belongs to the field of wafer transmission, and in particular to a flipping device for a wafer transmission system and an assembling device and method thereof. Background Art

[0002] In the semiconductor industry, automated wafer flipping equipment must be assembled before wafer flipping can be performed during production. During assembly, it is particularly important to ensure that the centerline of the flip assembly and the motor output shaft align. If the centerlines of the flip assembly and the motor output shaft do not align, the flip assembly will cause the wafer to swing significantly during flipping, preventing it from being accurately placed in the designated position.

[0003] Therefore, during the installation of wafer flipping equipment, it is necessary to accurately locate the position of the motor output shaft or motor, and also accurately locate the axis position of the flipping assembly, and ensure that the two axis lines coincide. Currently, assembly mainly relies on assemblers using measurement tools and repeatedly testing and adjusting to determine the final installation position. This makes the installation process of wafer flipping equipment cumbersome and inefficient. Summary of the Invention

[0004] The present invention aims to at least partially address one of the problems in the related art. To this end, the present invention provides a flipping device for a wafer transfer system, an assembly device, and a method thereof. The assembly method is efficient and rapid, greatly improving the assembly efficiency of the wafer flipping device and promoting further development in the field of wafer transfer.

[0005] In order to achieve the above-mentioned object, the present invention proposes the following technical solution: a method for assembling a wafer flipping device, comprising the following steps:

[0006] S01: fixing a fixing block in a supporting base through a first positioning unit, wherein the fixing block includes a hollow chamber;

[0007] S02: inserting the motor output shaft into the hollow chamber and adjusting the position of the motor to ensure that the motor output shaft does not contact the inner wall of the fixed block during the rotation process; fixing the adjusted motor in the motor base;

[0008] S03: removing the fixing block in the first positioning unit, and fixing the wafer simulation disk in the supporting base through the first positioning unit; wherein the axis of the motor output shaft coincides with one diameter of the wafer simulation disk;

[0009] S04: Installing a flip assembly on the outside of the wafer simulation disk, the motor output shaft is fixedly connected to the flip assembly, and the axis of the motor output shaft, the axis of the flip assembly and one of the diameters of the wafer simulation disk coincide with each other.

[0010] Furthermore, the first positioning unit is located on the upper surface of the supporting base; the first positioning unit includes a first positioning groove and a first positioning pin, the first positioning pin is evenly distributed around the first positioning groove, and the first positioning groove and the first positioning pin coincide with the center line in the extension direction of the motor output shaft.

[0011] Furthermore, the bearing base and the motor base are fixed in the bottom plate, and the motor base and the bottom plate are fixedly connected via a second positioning pin.

[0012] Furthermore, in step S02, a micrometer is used to measure the circular runout of the motor output shaft, and the position of the motor in the motor base is adjusted to ensure that the circular runout error is less than a set threshold.

[0013] Furthermore, in step S04, a left fixing member and a right fixing member are installed on both sides of the supporting base, and a center line connecting the left fixing member and the right fixing member is perpendicular to the axis of the flip assembly.

[0014] Furthermore, in step S04, the motor output shaft and the axis of the flip assembly are located on the same horizontal line.

[0015] Furthermore, the method further includes step S05: disassembling the supporting base and the wafer simulation disc to form a wafer flipping device.

[0016] An assembly device for a flipping device of a wafer transfer system, comprising:

[0017] The supporting base is provided with a first positioning unit, and the wafer simulation disk is fixed in the first positioning unit; a flip assembly is provided on the outer side of the wafer simulation disk, and the axis of the flip assembly coincides with one of the diameters of the wafer simulation disk;

[0018] The motor base is provided with a motor, and the motor output shaft is fixedly connected to the flip assembly; the axis of the motor output shaft, the axis of the flip assembly coincide with one of the diameters of the wafer simulation disk.

[0019] Furthermore, it also includes a fixed block, which includes a hollow chamber inside; the fixed block is fixed in the supporting base through a first positioning unit, and when the motor output shaft extends into the interior of the hollow chamber, the motor output shaft does not contact the inner wall of the fixed block during the rotation process.

[0020] A flipping device for a wafer transmission system is assembled using any one of the above-mentioned assembly methods.

[0021] Compared with the prior art, the above technical solution provided by the present invention has the following advantages: in this application, the wafer simulation disc and the fixed block are both installed based on the same first positioning unit. Through this installation method, it can be ensured that the axis of the flip assembly coincides with the axis of the motor output shaft, which is exactly the purpose of this application. During the flipping process of the wafer flipping device assembled in this way, the flipping assembly and the wafer connected to the end of the motor output shaft will not swing, ensuring the accuracy of the flipping; at the same time, the device used in the assembly method of this application is simple, and the assembly method is efficient and fast, which greatly improves the assembly efficiency of the wafer flipping device and promotes the further development of the wafer transmission field. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0024] In the attached figure:

[0025] Attachment Figure 1 Schematic diagram of the fixing block being fixed to the supporting base via the first positioning unit in the present invention;

[0026] Attachment Figure 2 Schematic diagram of the wafer simulation disk being fixed to the supporting base via the first positioning unit in the present invention;

[0027] Attachment Figure 3 Schematic diagram of the positions of the fixed block and the wafer simulation disk in the supporting base in the present invention;

[0028] Figure numbers: 1. Carrying base; 11. Fixing block; 12. Wafer simulation disk; 13. First positioning unit; 131. First positioning pin; 132. First positioning groove; 14. Left fixing member; 15. Right fixing member; 16. Flip assembly; 2. Motor base; 21. Motor output shaft; 22. Second positioning pin; 23. Motor; 3. Bottom plate. DETAILED DESCRIPTION

[0029] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings and are constructed and operated in specific directions. They are only for the convenience of describing the technical solution and do not indicate that the devices or components referred to must have specific directions. Therefore, they should not be understood as limiting the present invention.

[0030] It should also be noted that, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected", "fixed", and "set" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intervening elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0031] In the following description, specific details such as particular system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0032] Please participate in the attached Figure 1-3 The present invention provides a method for assembling a flipping device for a wafer transfer system, comprising the following steps:

[0033] S01: Fix the fixing block 11 in the supporting base 1 through the first positioning unit 13, wherein the fixing block 11 includes a hollow chamber;

[0034] S02: Extend the motor output shaft 21 into the hollow chamber and adjust the position of the motor 23 to ensure that the motor output shaft 21 does not contact the inner wall of the fixed block 11 during the rotation process; fix the adjusted motor 23 in the motor base 2;

[0035] S03: Remove the fixing block 11 in the first positioning unit 13, and fix the wafer simulation disk 12 in the supporting base 1 through the first positioning unit 13; wherein the axis of the motor output shaft 21 coincides with one of the diameters of the wafer simulation disk 12;

[0036] S04: Install the flip assembly 16 outside the wafer simulation disk 12, the motor output shaft 21 is fixedly connected to the flip assembly 16, and the axis of the motor output shaft 21 and the axis of the flip assembly 16 coincide with one of the diameters of the wafer simulation disk 12.

[0037] During the installation of the wafer flipping device, if the motor output shaft 21 and the axis of the flipping assembly 16 are not on the same line, the flipping process will be offset, so that the wafer cannot be placed in the specified position. This application is to provide an assembly device for a flipping device, which is used to set the motor output shaft 21 and the axis of the flipping assembly 16 on the same line to ensure the flipping effect of the wafer. In this application, the flipping assembly 16 refers to the component used to clamp the wafer during the wafer flipping process; the axis of the flipping assembly 16 refers to the center line of the flipping assembly 16 that remains stationary during the flipping process, and the axis of the flipping assembly 16 coincides with one of the diameters of the wafer it clamps; this diameter can be considered as the axis of the wafer during the flipping process.

[0038] This application first determines the position of the motor through the first positioning unit 13 and the fixed block 11. The fixed block 11 contains a hollow chamber for positioning the motor output shaft 21. Among them, the motor output shaft 21 is fixedly connected to the motor, and the positioning process of the motor output shaft 21 is the positioning process of the motor 23. The fixed block 11 is fixed with the first positioning unit 13 as the reference, and the motor output shaft 21 is fixed with the hollow chamber of the fixed block 11 as the reference. During the entire fixing process, it can be regarded as the motor 23 being fixed with the first positioning unit 13 as the reference; during this process, the up, down, left and right positions of the motor 23 in the motor base 2 can be adjusted until the motor output shaft 21 does not contact the inner wall of the fixed block 11 during the rotation process, that is, the axis of the motor output shaft 21 coincides with the axis of the hollow chamber; here, the axis of the hollow chamber can be regarded as the center line of the hollow chamber in the direction of extension of the motor shaft. After the position of the motor 23 is fixed, tighten the screws connecting it to fix it in the motor base 2.

[0039] After fixing the motor, remove the fixed block 11, continue to install the wafer simulation disk 12 based on the first positioning unit 13, and install the flip assembly 16 based on the wafer simulation disk 12. Since the wafer simulation disk 12 and the fixed block 11 in this application are both installed based on the same first positioning unit 13, this installation method can ensure that the axis of the flip assembly 16 coincides with the axis of the motor output shaft 21, which is exactly the purpose of this application. During the flipping process of the wafer flipping device assembled in this way, the flip assembly 16 and the wafer connected to the end of the motor output shaft 21 will not swing, ensuring the accuracy of the flipping; at the same time, the device used in the assembly method of this application is simple, and the assembly method is efficient and fast, which greatly improves the assembly efficiency of the wafer flipping device and promotes the further development of the wafer transmission field.

[0040] In order to form the final wafer flipping device, this application finally needs to remove the supporting base 1 and the wafer simulation disc 12 to form a flipping device that integrates the motor 23, the motor output shaft 21 and the flipping assembly 16. The role of the wafer simulation disc 12 in this application is to position the flipping assembly 16. Its size is the same as that of the wafer and is used to simulate the wafer. After the wafer simulation disc 12 is removed, the wafer to be flipped is placed in the position of the original wafer simulation disc 12, and the motor drives the wafer to flip through the motor output shaft 21 and the flipping assembly 16.

[0041] As a specific embodiment, in this application, the first positioning unit 13 is located on the upper surface of the support base 1. The placement of the first positioning unit 13 on the upper surface of the support base 1 facilitates the subsequent removal and replacement of the fixing block 11 and the wafer simulation disk 12. The positioning holes in the fixing block 11 can be located on the side of the fixing block 11 to avoid the hollow cavity.

[0042] Specifically, the first positioning unit 13 includes a first positioning groove 132 and a first positioning pin 131. The first positioning pin 131 is evenly distributed around the first positioning groove 132, and the center line of the first positioning groove 132 and the first positioning pin 131 in the extension direction of the motor output shaft 21 coincides. The extension direction of the motor output shaft 21 here refers to the direction of the axis of the motor output shaft 21. In view of the different shapes of the fixed block 11 and the wafer simulation disk 12, the present application designs the first positioning groove 132 to fix the fixed block 11, and the fixed block 11 can be embedded in the first positioning groove 132 during assembly; the surface of the wafer simulation disk 12 can be provided with a positioning hole that matches the first positioning groove 132. During assembly, the positioning hole on the surface of the wafer simulation disk 12 is matched with the first positioning pin 131. Since the center lines of the first positioning groove 132 and the first positioning pin 131 in the extension direction of the motor output shaft 21 coincide with each other, by reasonably setting the depth of the first positioning groove 132, the height of the fixed block 11 and the thickness of the wafer simulation disk 12, it can be ensured that the axis line of the motor output shaft 21, that is, the axis line of the hollow cavity of the fixed block 11, the axis line of the flip assembly 16 and one of the diameters of the wafer simulation disk 12 coincide with each other.

[0043] In order to accurately determine the distance between the motor 23 and the flip assembly 16, in this application, the supporting base 1 and the motor base 2 are fixed in the base plate 3, and the motor base 2 and the base plate 3 are fixedly connected by a second positioning pin 22; when installing the motor base 2, it is fixed by the second positioning pin 22, so as to ensure that the distance between the motor 23 and the flip assembly 16 is constant.

[0044] In step S02, a micrometer can be used to measure the circular runout of the motor output shaft 21, and the position of the motor 23 in the motor base 2 can be adjusted to ensure that the circular runout error is less than a set threshold. Alternatively, the inner diameter of the hollow chamber can be set to a cylindrical chamber slightly larger than the motor output shaft 21, and the rotation process of the motor output shaft 21 can be observed to ensure that it does not contact the inner wall of the fixed block 11 during rotation.

[0045] In step S04, after the wafer simulation disk 12 is fixed, the flip assembly 16 needs to be installed on its outside. Before installing the flip assembly 16, the left fixing member 14 and the right fixing member 15 can be installed on both sides of the supporting base 1. The center line of the left fixing member 14 and the right fixing member 15 is perpendicular to the axis of the flip assembly 16; through the setting of the left fixing member 14 and the right fixing member 15, the position of the axis of the flip assembly 16 relative to the wafer simulation disk 12 can be ensured, and the axis of the motor output shaft 21, the axis of the flip assembly 16 and one of the diameters of the wafer simulation disk 12 can be ensured to coincide.

[0046] In the wafer flipping device assembled using the assembly method of the present application, the axis of the motor output shaft 21 coincides with the axis of the flip assembly 16 and is a horizontal line parallel to the chassis surface. If the axis of the flip assembly 16 and the motor output shaft 21 coincide and have a certain angle with the horizontal direction, the wafer will swing up and down during the flipping process. Only by ensuring that the axis of the flip assembly 16 and the motor output shaft 21 are on the same horizontal line can we ensure that when the motor drives the flip assembly 16 to flip the wafer, the wafer will not deviate up, down, left, or right.

[0047] Please participate in the attached Figure 1-3 The present invention also provides an assembly device for a flipping device of a wafer transport system, comprising: a supporting base 1, a motor base 2, a wafer simulation disk 12 and a fixing block 11; wherein:

[0048] The supporting base 1 is provided with a first positioning unit 13, and the wafer simulation disk 12 is fixed in the first positioning unit 13; a flip assembly 16 is provided on the outside of the wafer simulation disk 12, and the axis of the flip assembly 16 coincides with one of the diameters of the wafer simulation disk 12; the first positioning unit 13 is located on the upper surface of the supporting base 1; the first positioning unit 13 includes a first positioning groove 132 and a first positioning pin 131, and the first positioning pin 131 is evenly distributed around the first positioning groove 132, and the center line of the first positioning groove 132 and the first positioning pin 131 in the extension direction of the motor output shaft 21 coincides.

[0049] The motor base 2 is provided with a motor 23, and the motor output shaft 21 is fixedly connected to the flip assembly 16; the axis of the motor output shaft 21 and the axis of the flip assembly 16 coincide with one of the diameters of the wafer simulation disk 12;

[0050] The fixed block 11 includes a hollow chamber inside; the fixed block 11 is fixed in the supporting base 1 through the first positioning unit 13. When the motor output shaft 21 extends into the hollow chamber, the motor output shaft 21 does not contact the inner wall of the fixed block 11 during the rotation process.

[0051] As an embodiment, in the present application, the wafer simulation disk 12 and the fixing block 11 are not located in the supporting base 1 at the same time, but are installed separately when the flip assembly 16 and the motor are positioned.

[0052] As another embodiment, the center of the wafer simulation disk 12 in the present application is provided with a through hole that matches the fixed block 11. After the fixed block 11 positions the motor, it does not need to be disassembled. The wafer simulation disk 12 can be positioned and installed directly through the first positioning groove 132 around the fixed block 11, as shown in the attached figure. Figure 3 shown.

[0053] In the present application, the first positioning pin 131 may include a plurality of first positioning holes, or may be configured as a complete groove shape. Similarly, the second positioning pin 22 may include a plurality of second positioning holes, or may be configured as a complete groove shape.

[0054] The present application also provides a flipping device for a wafer transfer system, which is assembled using the above-mentioned assembly method.

[0055] It is understandable that the above embodiments only express the preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A method for assembling a flip device for a wafer transfer system, characterized in that: The steps include: S01: fixing a fixing block in a supporting base through a first positioning unit, wherein the fixing block includes a hollow chamber; The first positioning unit includes: a first positioning groove and a first positioning pin, the first positioning pin is evenly distributed around the first positioning groove, and the fixing block is embedded in the first positioning groove to be fixed in the bearing base; S02: inserting the motor output shaft into the hollow chamber and adjusting the position of the motor to ensure that the motor output shaft does not contact the inner wall of the fixed block during the rotation process; fixing the adjusted motor in the motor base; S03: removing the fixing block in the first positioning groove and fixing the wafer simulation disk in the supporting base via the first positioning pin; wherein the first positioning groove and the first positioning pin coincide with the center line of the motor output shaft in the extension direction, and the axis of the motor output shaft coincides with one diameter of the wafer simulation disk; S04: A left fixing member and a right fixing member are installed on both sides of the supporting base, and the center line of the left fixing member and the right fixing member is perpendicular to the axis of the flip assembly; the flip assembly is installed on the outside of the wafer simulation disk through the left fixing member and the right fixing member, and the motor output shaft is fixedly connected to the flip assembly, and the axis of the motor output shaft and the axis of the flip assembly coincide with one of the diameters of the wafer simulation disk.

2. The method for assembling a flipping device for a wafer transfer system according to claim 1, wherein: The bearing base and the motor base are fixed in the bottom plate, and the motor base is fixedly connected to the bottom plate via a second positioning pin.

3. The method for assembling a flipping device for a wafer transfer system according to claim 1, wherein: In step S02, a micrometer is used to measure the circular runout of the motor output shaft, and the position of the motor in the motor base is adjusted to ensure that the circular runout error is less than a set threshold.

4. The method for assembling a flipping device for a wafer transfer system according to claim 1, wherein: The method further includes step S05: disassembling the supporting base and the wafer simulation disc to form a wafer flipping device.

5. An assembly device for a flipping device of a wafer transfer system, characterized in that: include: The supporting base is provided with a first positioning unit, which includes: a first positioning groove and a first positioning pin, the first positioning pin is evenly distributed around the first positioning groove, and a fixed block, the fixed block includes a hollow chamber inside; the fixed block is embedded in the first positioning groove to be fixed in the supporting base, and when the motor output shaft extends into the interior of the hollow chamber, the motor output shaft does not contact the inner wall of the fixed block during the rotation process, and the wafer simulation disk is fixed in the supporting base through the first positioning pin; a left fixing part and a right fixing part are installed on both sides of the supporting base, and the center line of the left fixing part and the right fixing part is perpendicular to the axis of the flip assembly; a flip assembly is installed on the outside of the wafer simulation disk through the left fixing part and the right fixing part, and the axis of the flip assembly coincides with one of the diameters of the wafer simulation disk; a motor base is provided with a motor, and the motor output shaft is fixedly connected to the flip assembly; the axis of the motor output shaft and the axis of the flip assembly coincide with one of the diameters of the wafer simulation disk.

6. A flipping device for a wafer transfer system, assembled using the assembly method according to any one of claims 1 to 4.

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