Light-emitting substrate, light-emitting device, and vehicle

Abstract

The present disclosure provides a light-emitting substrate, a light-emitting device, and a vehicle. The light-emitting substrate includes a light-emitting device, and the light-emitting device includes a first electrode, a light-emitting layer, and a second electrode that are stacked. The light-emitting substrate includes: a base substrate; a first conductive layer and a second conductive layer that are arranged on one side of the base substrate, the first conductive layer including a first electrode and an electrode lead, the first electrode and the electrode lead being interconnected, and the second conductive layer including a first electrode signal line; wherein the first electrode and the first electrode signal line are separately arranged on the surface of the base substrate, and the electrode lead is directly connected to the first electrode signal line. By arranging for the electrode lead to be in direct contact with the first electrode signal line, rather than being connected via a via, dark spot defects can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a light-emitting substrate, a light-emitting device, and a vehicle. Background Art

[0002] Organic Light-Emitting Diode (OLED) has the advantages of self-luminescence, wide viewing angle, fast response time, high luminous efficiency, low operating voltage and simple process, and is hailed as the next generation "star" light-emitting device. Summary of the Invention

[0003] The present disclosure provides a light-emitting substrate, including a light-emitting device, wherein the light-emitting device includes a first electrode, a light-emitting layer, and a second electrode stacked in layers; the light-emitting substrate includes:

[0004] substrate;

[0005] A first conductive layer and a second conductive layer are provided on one side of the base substrate, the first conductive layer includes the first electrode and an electrode lead, the first electrode and the electrode lead are connected to each other, and the second conductive layer includes a first electrode signal line;

[0006] The first electrode and the first electrode signal line are separately arranged on the surface of the base substrate, and the electrode lead is directly in contact with and connected to the first electrode signal line.

[0007] In an optional implementation, the first conductive layer and the second conductive layer are respectively located in different film layers, and the electrode lead and the first electrode signal line are overlapped with each other.

[0008] In an optional implementation, the first electrode signal line includes a first overlapping portion, and the first overlapping portion at least partially covers a surface of the electrode lead on a side facing away from the base substrate.

[0009] In an optional implementation, the first electrode signal line includes a second overlapping portion, and the electrode lead at least partially covers a surface of the second overlapping portion that is away from the base substrate.

[0010] In an optional implementation, the material of the first conductive layer includes metal oxide, and the material of the second conductive layer includes metal.

[0011] In an optional implementation, the first conductive layer and the second conductive layer are located in the same film layer and are an integral structure.

[0012] In an optional implementation, the electrode lead is a strip-shaped structure that at least partially surrounds the first electrode.

[0013] In an optional implementation, one end of the strip structure is connected to the first electrode, and the other end is directly connected to the first electrode signal line.

[0014] In an optional implementation, within the plane where the substrate is located and in the normal direction of the strip structure surrounding the first electrode, the width of the strip structure is greater than or equal to 5 micrometers and less than or equal to 10 micrometers.

[0015] In an optional implementation, the light-emitting substrate further includes:

[0016] a pixel defining layer, disposed on a side of the first conductive layer and the second conductive layer facing away from the base substrate, and used to define an opening area;

[0017] In which, the light-emitting layer and the second electrode are arranged on the side of the pixel defining layer away from the base substrate, and the light-emitting layer is located between the first electrode and the second electrode; the orthographic projections of the light-emitting layer and the first electrode on the base substrate respectively cover the orthographic projection of the opening area on the base substrate, and the orthographic projections of the electrode lead and the first electrode signal line on the base substrate respectively are located within the range of the orthographic projection of the pixel defining layer on the base substrate.

[0018] In an optional implementation, the light-emitting substrate includes a plurality of the light-emitting devices; the first electrodes and the electrode leads connected to each other constitute an electrode unit, the first conductive layer includes a plurality of discretely arranged electrode units, and the first electrodes in each of the electrode units are located in different light-emitting devices.

[0019] In an optional implementation, the light-emitting substrate includes a plurality of the light-emitting devices, and the light-emitting colors of the plurality of light-emitting devices are the same.

[0020] In an optional implementation, the light-emitting substrate includes a plurality of the light-emitting devices arranged in an array; the second conductive layer includes a plurality of the first electrode signal lines, and the first electrodes of the light-emitting devices located in the same row or column are connected to the same first electrode signal line.

[0021] The present disclosure provides a light-emitting device, comprising any one of the light-emitting substrates described above.

[0022] The present disclosure provides a vehicle comprising any one of the light emitting devices described above.

[0023] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for the embodiments or related technical descriptions. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the sizes and shapes of the figures in the drawings do not reflect the actual scale. The purpose is only to illustrate the content of the present invention. The same or similar numbers in the drawings represent the same or similar elements or elements with the same or similar functions.

[0025] Figure 1 The cross-sectional structure diagram of a light-emitting substrate in the related art is schematically shown;

[0026] Figure 2 The cross-sectional structure diagram of the first light-emitting substrate provided by the present disclosure is schematically shown;

[0027] Figure 3 The following schematically shows a preparation process diagram of the first light-emitting substrate provided by the present disclosure;

[0028] Figure 4 The cross-sectional structure diagram of the second light-emitting substrate provided by the present disclosure is schematically shown;

[0029] Figure 5 The following schematically shows a preparation process diagram of the second light-emitting substrate provided by the present disclosure;

[0030] Figure 6 The cross-sectional structure diagram of the third light-emitting substrate provided by the present disclosure is schematically shown;

[0031] Figure 7 The following schematically shows a preparation process diagram of the third light-emitting substrate provided by the present disclosure;

[0032] Figure 8 The light-emitting schematic diagrams of two light-emitting substrates are schematically shown. DETAILED DESCRIPTION

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0034] In the accompanying drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. Exemplary embodiments are described herein with reference to cross-sectional views that are schematic representations of idealized embodiments. As such, deviations from the shapes of the figures are to be expected as a result of, for example, manufacturing techniques and / or tolerances. Thus, the embodiments described herein should not be construed as limited to the specific shapes of the regions as shown herein, but rather include deviations in shape that result from, for example, manufacturing. For example, a region illustrated or described as flat may typically have rough and / or nonlinear features. Furthermore, sharp corners illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

[0035] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprise" or "include" when used in this specification indicate the presence of the stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or combinations thereof.

[0036] In the related art OLED light emitting substrate, refer to Figure 1 A passivation layer 13 is provided between the anode 11 of the light-emitting device and the anode signal line 12. The anode 11 and the anode signal line 12 are connected via vias provided in the passivation layer 13, thereby transmitting the anode signal from the anode signal line 12 to the anode 11. However, the inventors have discovered that the anode 11 is prone to breakpoint defects at the via hole location, resulting in interruption of the anode signal and, in turn, causing dark spot defects.

[0037] In order to solve the above problems, the present disclosure provides a light-emitting substrate, including a light-emitting device, Figure 2 、 Figure 4 and Figure 6 The cross-sectional structural diagrams of several light-emitting substrates provided by the present disclosure are schematically shown. Figure 2 、 Figure 4 and Figure 6 As shown, the light emitting device includes a first electrode 221, a light emitting layer 25 and a second electrode 26 which are stacked.

[0038] In a specific implementation, the light-emitting device can be an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (Mini LED), a micron light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc.

[0039] like Figure 2 、 Figure 4 and Figure 6 As shown, the light-emitting substrate includes: a base substrate 21; a first conductive layer 22 and a second conductive layer 23 arranged on one side of the base substrate 21, the first conductive layer 22 includes a first electrode 221 and an electrode lead 222, the first electrode 221 and the electrode lead 222 are interconnected (not shown in the cross-sectional view), and the second conductive layer 23 includes a first electrode signal line 231.

[0040] The first electrode 221 and the first electrode signal line 231 are separately disposed on the surface of the base substrate 21 , and the electrode lead 222 is directly in contact with and connected to the first electrode signal line 231 .

[0041] The first electrode signal line 231 is used to input a first electrode signal. The driving circuit of the light-emitting substrate can transmit the first electrode signal to the first electrode 221 through the first electrode signal line 231 .

[0042] Reference Figure 3 、 Figure 5 and Figure 7 The following schematically shows the preparation process of several light-emitting substrates. Figure 3 、 Figure 5 and Figure 7 As shown, the first electrode 221 and the first electrode signal line 231 are staggered and arranged on the surface of the base substrate 21. The first electrode 221 and the first electrode signal line 231 are connected by an electrode lead 222, so that the first electrode signal on the first electrode signal line 231 can be transmitted to the first electrode 221 through the electrode lead 222.

[0043] like Figure 2 、 Figure 4 and Figure 6 As shown, there is no insulating layer between the electrode lead 222 and the first electrode signal line 231, and the connection between the two is not through a via, but a direct contact connection, thereby greatly reducing the probability of breakpoints appearing on the connection path between the first electrode 221 and the first electrode signal line 231.

[0044] The light-emitting substrate provided by the present disclosure realizes the connection between the first electrode 221 and the first electrode signal line 231 by setting the electrode lead 222 to be in direct contact with the first electrode signal line 231. There is no need to set an insulating layer between the first conductive layer 22 and the first electrode signal line 231, and no need for via connection. Therefore, it can avoid the occurrence of breakpoints in the first conductive layer 22 at the via position, thereby reducing the probability of signal interruption between the first electrode 221 and the first electrode signal line 231, improving the dark spot defects caused by the via, and improving the product yield and reliability.

[0045] Reference Figure 8 , FIG a shows a schematic diagram of the light-emitting substrate with dark spots in the related art, and FIG b shows a schematic diagram of the light-emitting substrate provided by the present disclosure. Figure 8 As shown, the light-emitting substrate provided by the present disclosure can improve dark spot defects.

[0046] In addition, since no insulating layer is provided between the electrode lead 222 and the first electrode signal line 231 , a mask process can be omitted, thereby reducing process complexity and process cost.

[0047] In the present disclosure, the patterns in the first conductive layer 22 can be formed simultaneously through a single patterning process, and the patterns in the second conductive layer 23 can be formed simultaneously through a single patterning process. The patterning process generally includes one or more process steps such as film formation, photoresist coating, exposure, development, etching, and photoresist stripping.

[0048] In a specific implementation, there are many ways to achieve direct contact between the electrode lead 222 and the first electrode signal line 231. For example, the two can be connected by overlapping (eg Figure 2 and Figure 4 The two can also be an integrated structure located in the same film layer (such as Figure 6 shown), etc.

[0049] In the first optional implementation, Figure 2 and Figure 4 As shown, the first conductive layer 22 and the second conductive layer 23 are located in different film layers, and the electrode lead 222 and the first electrode signal line 231 are overlapped with each other.

[0050] Optionally, refer to Figure 2 The first electrode signal line 231 includes a first overlapping portion P1 , and the first overlapping portion P1 at least partially covers a surface of the electrode lead 222 facing away from the base substrate 21 .

[0051] Reference Figure 3 Schematically shows Figure 2 The schematic diagram of the preparation process of the light-emitting substrate is shown in FIG. Figure 3 As shown, the substrate 21 (such as Figure 3 As shown in FIG. a), a first conductive layer 22 is preferentially formed on one side surface, and a first electrode 221 and an electrode lead 222 connected to each other are simultaneously formed, as shown in FIG. Figure 3 As shown in FIG. b; then a second conductive layer 23 is formed on the side of the first conductive layer 22 away from the base substrate 21 to form a first electrode signal line 231, as shown Figure 3 As shown in Figure c in the figure, the first electrode signal line 231 has a first overlapping portion P1, and the orthographic projection of the first overlapping portion P1 on the base substrate 21 overlaps with the orthographic projection of the electrode lead 222 on the base substrate 21. The surface of the first overlapping portion P1 on the side close to the base substrate 21 directly contacts the surface of the electrode lead 222 on the side facing away from the base substrate 21, achieving lateral overlap between the first electrode signal line 231 and the electrode lead 222.

[0052] Thus, by providing the first overlapping portion P1 on the first electrode signal line 231, a lateral overlap is achieved between the first electrode signal line 231 and the electrode lead 222, thereby achieving direct contact connection between the first electrode signal line 231 and the electrode lead 222. Since no insulating layer is required between the first conductive layer 22 and the first electrode signal line 231, and thus no via connection is required, dark spot defects caused by vias can be improved.

[0053] The orthographic projection shape of the first overlapping portion P1 on the base substrate 21 can be a rectangle, a square, a strip, a circle, etc., which is not limited in the present disclosure.

[0054] Optionally, refer to Figure 4 The first electrode signal line 231 includes a second overlapping portion P2 , and the electrode lead 222 at least partially covers a surface of the second overlapping portion P2 that is away from the base substrate 21 .

[0055] Reference Figure 5 Schematically shows Figure 4 The schematic diagram of the preparation process of the light-emitting substrate is shown in FIG. Figure 5 As shown, the substrate 21 (such as Figure 5 As shown in FIG. a), a second conductive layer 23 is preferentially formed on one side surface to form a first electrode signal line 231. Figure 5 As shown in FIG. b; then the first conductive layer 22 is formed on the side of the second conductive layer 23 away from the base substrate 21, and the first electrode 221 and the electrode lead 222 connected to each other are formed simultaneously, as shown in FIG. Figure 5As shown in Figure c in the figure, the first electrode signal line 231 has a second overlapping portion P2, the orthographic projection of the second overlapping portion P2 on the base substrate 21 overlapping the orthographic projection of the electrode lead 222 on the base substrate 21. The surface of the second overlapping portion P2 facing away from the base substrate 21 directly contacts the surface of the electrode lead 222 closer to the base substrate 21, achieving lateral overlap between the first electrode signal line 231 and the electrode lead 222.

[0056] Thus, by providing the second overlapping portion P2 on the first electrode signal line 231, a lateral overlap is achieved between the first electrode signal line 231 and the electrode lead 222, thereby achieving direct contact connection between the first electrode signal line 231 and the electrode lead 222. Since no insulating layer is required between the first conductive layer 22 and the first electrode signal line 231, and thus no via connection is required, dark spot defects caused by vias can be improved.

[0057] The orthographic projection shape of the second overlapping portion P2 on the base substrate 21 can be a rectangle, a square, a strip, a circle, etc., which is not limited in the present disclosure.

[0058] Optionally, the material of the first conductive layer 22 includes metal oxide.

[0059] For example, the material of the first conductive layer 22 may include at least one of transparent metal oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), and graphene oxide, which is not limited in this embodiment.

[0060] When the light-emitting substrate is a bottom-emitting substrate, the light transmittance of the bottom-emitting light-emitting substrate can be improved by setting the material of the first conductive layer 22 to be a metal oxide with high transparency.

[0061] Furthermore, since metal oxides, such as ITO, have high impedance characteristics, selecting a metal oxide as the material for the first conductive layer 22 can increase the resistance of the first conductive layer 22. When a short circuit occurs between the first electrode 221 and the second electrode 26 of a light-emitting device in the light-emitting substrate, the larger resistance can reduce the risk of burning out other light-emitting devices due to the large short-circuit current.

[0062] It should be noted that the material of the first conductive layer 22 may also be metal materials such as platinum, gold, aluminum or copper, and the present disclosure does not limit this.

[0063] Optionally, the material of the second conductive layer 23 includes metal.

[0064] In a specific implementation, the material of the second conductive layer 23 may include at least one of titanium, aluminum, molybdenum, platinum, gold, and copper, which is not limited in this embodiment. For example, the material of the second conductive layer 23 may be titanium / aluminum / titanium, etc.

[0065] By setting the material of the second conductive layer 23 to metal, the transmission resistance of the first electrode signal line 231 can be reduced, the uniformity of the first electrode signal on the light-emitting substrate can be improved, and the brightness uniformity of the light-emitting substrate can be improved.

[0066] It should be noted that the material of the second conductive layer 23 may also be transparent metal oxides such as indium tin oxide (ITO), indium zinc oxide (IZO) or graphene oxide, and this embodiment does not limit this.

[0067] When a metal material is used as the material for the second conductive layer 23, due to its advantages of good film-forming properties and resistance to overetching, the manufacturing accuracy of the first overlapping portion P1 or the second overlapping portion P2 in the second conductive layer 23 can be improved, ensuring that the contact area between the electrode lead 222 and the first electrode signal line 231 meets the requirements. In addition, due to the low resistivity of metal materials, by providing the first overlapping portion P1 or the second overlapping portion P2 in the second conductive layer 23, the contact resistance between the electrode lead 222 and the first electrode signal line 231 can be reduced.

[0068] In the second optional implementation, refer to Figure 6 The first conductive layer 22 and the second conductive layer 23 are located in the same film layer and are an integrated structure.

[0069] In this embodiment, the first conductive layer 22 and the second conductive layer 23 can be provided in the same layer and made of the same material. The first conductive layer 22 and the second conductive layer 23 can be an integral structure formed simultaneously using the same patterning process.

[0070] Reference Figure 7 Schematically shows Figure 6 The schematic diagram of the preparation process of the light-emitting substrate is shown in FIG. Figure 7 As shown, the substrate 21 (such as Figure 7 As shown in FIG. a), the first conductive layer 22 and the second conductive layer 23 are formed by the same patterning process on one side of the surface, and the first electrode signal line 231, the first electrode 221 and the electrode lead 222 are formed simultaneously. Figure 7As shown in Figure b in the figure, the first electrode signal line 231 is connected to the electrode lead 222, and the electrode lead 222 is connected to the first electrode 221. The first electrode signal line 231, the electrode lead 222 and the first electrode 221 are an integrated structure connected to each other, thereby achieving direct contact connection between the first electrode signal line 231 and the electrode lead 222.

[0071] In this implementation, the materials of the first conductive layer 22 and the second conductive layer 23 can be transparent metal oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), and graphene oxide, and at least one of metal materials such as titanium, aluminum, molybdenum, platinum, gold, and copper, which are not limited in this embodiment.

[0072] It should be noted that the implementation of direct contact connection between the electrode lead 222 and the first electrode signal line 231 is not limited to the above two. As long as the contact connection is not through a via hole, it falls within the protection scope of the present disclosure.

[0073] In an optional implementation, Figure 3 、 Figure 5 and Figure 7 As shown, the electrode lead 222 is a strip-shaped structure that at least partially surrounds the first electrode 221 .

[0074] Because the strip structure is narrow and long, it acts like a high-impedance resistor. When a short circuit occurs between the first electrode 221 and the second electrode 26 of a light-emitting device, the high-impedance electrode lead 222, connected in series with the first electrode 221, acts as a shunt, preventing a large short-circuit current from spreading to other light-emitting devices through the first electrode signal line 231 and reducing the risk of burning out the other light-emitting devices.

[0075] like Figure 3 、 Figure 5 and Figure 7 As shown, when the orthographic projection of the first electrode 221 on the base substrate 21 is a rectangle, the strip structure can surround one side of the rectangle (such as Figure 3 、 Figure 5 and Figure 7 shown), two sides, three sides, or four sides.

[0076] like Figure 3 、 Figure 5 and Figure 7 As shown, one end of the strip structure is connected to the first electrode 221 , and the other end is directly connected to the first electrode signal line 231 .

[0077] In a specific implementation, the length and width of the strip structure can be designed according to actual needs. Optionally, in the plane of the base substrate 21 and along the normal direction of the strip structure surrounding the first electrode 221, the width of the strip structure (i.e., the width of the narrow side of the strip structure) can be greater than or equal to 5 microns and less than or equal to 10 microns.

[0078] In an optional implementation, Figure 2 、 Figure 4 and Figure 6 As shown, the light emitting substrate may further include a pixel defining layer 24. The pixel defining layer 24 is disposed on a side of the first conductive layer 22 and the second conductive layer 23 away from the base substrate 21, and is used to define an opening area.

[0079] The light emitting layer 25 and the second electrode 26 are disposed on a side of the pixel defining layer 24 facing away from the base substrate 21 , and the light emitting layer 25 is located between the first electrode 221 and the second electrode 26 .

[0080] That is, the light emitting layer 25 is arranged on the side of the pixel defining layer 24 away from the base substrate 21, and the second electrode 26 is arranged on the side of the light emitting layer 25 away from the base substrate 21. In the opening area, the first electrode 221, the light emitting layer 25 and the second electrode 26 are stacked to form a light emitting device.

[0081] In practical applications, the second electrodes 26 of the plurality of light-emitting devices may be an integrated structure interconnected with each other, which is not limited in the present disclosure.

[0082] In a specific implementation, the orthographic projection of the light emitting layer 25 on the base substrate 21 can cover the orthographic projection of the opening area on the base substrate 21. In this way, the area of ​​the opening area can be fully utilized, the light emitting area can be increased, and the light emitting efficiency can be improved.

[0083] In a specific implementation, the orthographic projection of the first electrode 221 on the base substrate 21 can cover the orthographic projection of the opening area on the base substrate 21. In this way, the area of ​​the opening area can be fully utilized, the light-emitting area can be increased, and the light-emitting efficiency can be improved.

[0084] In a specific implementation, the orthographic projection of the electrode lead 222 on the base substrate 21 can be located within the orthographic projection of the pixel defining layer 24 on the base substrate 21. The pixel defining layer 24 isolates the electrode lead 222 from the second electrode 26, thereby preventing a short circuit between the electrode lead 222 and the second electrode 26. Furthermore, by completely shielding the electrode lead 222 with the pixel defining layer 24, the electrode lead 222 can be prevented from occupying the opening area, thereby improving the aperture ratio.

[0085] In a specific implementation, the orthographic projection of the first electrode signal line 231 on the base substrate 21 can be located within the orthographic projection of the pixel defining layer 24 on the base substrate 21. The pixel defining layer 24 isolates the first electrode signal line 231 from the second electrode 26, thereby preventing a short circuit between the first electrode signal line 231 and the second electrode 26. Furthermore, by completely shielding the first electrode signal line 231 with the pixel defining layer 24, the first electrode signal line 231 can be prevented from occupying the aperture area, thereby improving the aperture ratio.

[0086] Optionally, the light-emitting substrate includes a plurality of light-emitting devices. Accordingly, the interconnected first electrodes 221 and electrode leads 222 constitute an electrode unit, and the first conductive layer 22 may include a plurality of discrete electrode units, with the first electrodes 221 in each electrode unit being located in a different light-emitting device.

[0087] By discretely disposing multiple electrode units, adjacent electrode units can be disconnected at the pixel-defining layer 24, thus enabling pixelation of the light-emitting substrate. With a pixelated light-emitting substrate, if a light-emitting device burns out, the discrete electrode units can reduce the impact on other light-emitting devices, effectively preventing the burnout from spreading further, thereby further extending the life of the display backplane.

[0088] In an optional implementation, the light-emitting substrate includes multiple light-emitting devices, and the multiple light-emitting devices emit the same color. When the multiple light-emitting devices in the light-emitting substrate emit the same color, the light-emitting layers 25 in the multiple light-emitting devices can use the same light-emitting material.

[0089] It should be noted that the light emitting colors of the light emitting devices may also be different, and this disclosure does not limit this.

[0090] In an optional implementation, the light-emitting substrate includes a plurality of light-emitting devices arranged in an array, the second conductive layer 23 includes a plurality of first electrode signal lines 231 , and the first electrodes 221 of the light-emitting devices in the same row or column can be connected to the same first electrode signal line 231 .

[0091] Specifically, the first electrodes 221 of the light-emitting devices in the same row or column may be connected in series or in parallel with the same first electrode signal line 231 (eg, Figure 3 、 Figure 5 and Figure 7 The present disclosure does not limit this.

[0092] like Figure 3 、 Figure 5 and Figure 7As shown, when the first electrodes 221 of the light-emitting devices in the same row or column are connected in parallel with the same first electrode signal line 231, when a light-emitting device in the light-emitting substrate burns out, the impact on other light-emitting devices can be further avoided, thereby improving the service life of the light-emitting substrate.

[0093] Optionally, Figure 2 The manufacturing process of the light-emitting substrate may include the following steps:

[0094] Step S01, providing a substrate 21, such as Figure 3 As shown in Figure a;

[0095] Step S02: a first conductive layer 22 is formed on one side of the base substrate 21, and a first electrode 221 and an electrode lead 222 are formed to be connected to each other. Figure 3 As shown in Figure b;

[0096] Step S03: a second conductive layer 23 is formed on the side of the first conductive layer 22 facing away from the base substrate 21 to form a first electrode signal line 231. Figure 3 As shown in Figure c, the first electrode signal line 231 has a first overlapping portion P1, and the surface of the first overlapping portion P1 close to the side of the base substrate 21 is in direct contact with the surface of the electrode lead 222 away from the base substrate 21, thereby realizing lateral overlapping between the first electrode signal line 231 and the electrode lead 222.

[0097] Step S04: forming a pixel defining layer 24 on the side of the first conductive layer 22 and the second conductive layer 23 facing away from the base substrate 21. Figure 3 As shown in Figure d.

[0098] Step S05: On the side of the pixel defining layer 24 facing away from the base substrate 21, a light emitting layer 25 and a first electrode 26 are sequentially formed to obtain Figure 2 The light-emitting substrate shown. Figure 2 Shown Figure 3 Schematic diagram of the cross-sectional structure at the AA' position.

[0099] Optionally, Figure 4 The manufacturing process of the light-emitting substrate may include the following steps:

[0100] Step S11, providing a substrate 21, such as Figure 5 As shown in Figure a;

[0101] Step S12: a second conductive layer 23 is formed on one side surface of the base substrate 21 to form a first electrode signal line 231. Figure 5 As shown in Figure b;

[0102] Step S13, forming a first conductive layer 22 on the side of the second conductive layer 23 away from the base substrate 21, and simultaneously forming a first electrode 221 and an electrode lead 222 connected to each other, such as Figure 5 As shown in Figure c, the first electrode signal line 231 has a second overlapping portion P2, and the surface of the second overlapping portion P2 facing away from the base substrate 21 is in direct contact with the surface of the electrode lead 222 close to the base substrate 21, thereby realizing lateral overlapping between the first electrode signal line 231 and the electrode lead 222.

[0103] Step S14: forming a pixel defining layer 24 on the side of the first conductive layer 22 and the second conductive layer 23 facing away from the base substrate 21. Figure 5 As shown in Figure d.

[0104] Step S15, forming the light emitting layer 25 and the first electrode 26 in sequence on the side of the pixel defining layer 24 away from the base substrate 21, and obtaining Figure 4 The light-emitting substrate shown. Figure 4 Shown Figure 5 Schematic diagram of the cross-sectional structure at the BB' position.

[0105] Optionally, Figure 6 The manufacturing process of the light-emitting substrate may include the following steps:

[0106] Step S21, providing a substrate 21, such as Figure 7 As shown in Figure a;

[0107] Step S22, a first conductive layer 22 and a second conductive layer 23 are formed on one side of the base substrate 21 by the same process, and a first electrode signal line 231, a first electrode 221 and an electrode lead 222 are formed simultaneously. Figure 7 As shown in Figure b; wherein, the first electrode signal line 231 is connected to the electrode lead 222, the electrode lead 222 is connected to the first electrode 221, the first electrode signal line 231, the electrode lead 222 and the first electrode 221 are an integrated structure connected to each other, thereby realizing direct contact connection between the first electrode signal line 231 and the electrode lead 222.

[0108] Step S23: forming a pixel defining layer 24 on the side of the first conductive layer 22 and the second conductive layer 23 facing away from the base substrate 21. Figure 7 As shown in Figure c.

[0109] Step S24, forming the light emitting layer 25 and the first electrode 26 in sequence on the side of the pixel defining layer 24 away from the base substrate 21, and obtaining Figure 6 The light-emitting substrate shown. Figure 6 Shown Figure 7 Schematic diagram of the cross-sectional structure at the CC' position.

[0110] The present disclosure also provides a light-emitting device, which includes the light-emitting substrate provided by any of the above embodiments.

[0111] Those skilled in the art will appreciate that the light-emitting device has the advantages of a front-light-emitting substrate.

[0112] In some embodiments, the light-emitting device may be a lighting device, in which case the light-emitting substrate serves as a light source to achieve a lighting function. For example, the light-emitting device may be used as a backlight module in a liquid crystal display device, a lamp for internal or external lighting, or various signal lights.

[0113] In a specific implementation, the light emitting devices in the light emitting substrate may emit the same color, for example, red, orange or white, etc. Thus, the light emitting substrate may be used to manufacture lighting devices in vehicles, such as taillights, signal lights, etc.

[0114] In other embodiments, the light-emitting device may be a display device, in which case the light-emitting substrate is used to realize the function of displaying an image (i.e., a picture). The light-emitting device may include a display or a product including a display. Among them, the display may be a flat panel display (FPD), a microdisplay, etc. If divided according to whether the user can see the back of the display, the display may be a transparent display or an opaque display. If divided according to whether the display can be bent or curled, the display may be a flexible display or an ordinary display (which may be called a rigid display). Exemplarily, products including displays may include: computer monitors, televisions, billboards, laser printers with display functions, telephones, mobile phones, electronic paper, personal digital assistants (PDAs), laptop computers, digital cameras, tablet computers, notebook computers, navigation systems, camcorders, viewfinders, vehicles, large-area walls, theater screens, or stadium signs, etc.

[0115] The present disclosure also provides a vehicle, comprising the lighting device provided by any one of the items.

[0116] The taillights of the vehicle provided by the present disclosure may adopt the above-mentioned light emitting device. It will be understood by those skilled in the art that the vehicle has the advantages of the front light emitting device.

[0117] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0118] Finally, it should be noted that, unless otherwise defined, the terms "first", "second" and similar terms used in this document do not indicate any order, quantity or importance, but are only used to distinguish different components. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, commodity or device. In the absence of further restrictions, an element defined by the sentence "including a..." does not exclude the presence of other identical elements in the process, method, commodity or device that includes the element. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0119] The above is a detailed introduction to a light-emitting substrate, a light-emitting device and a vehicle provided by the present disclosure. Specific examples are used herein to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only used to help understand the method and core idea of ​​the present disclosure. At the same time, for those skilled in the art, according to the idea of ​​the present disclosure, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present disclosure.

[0120] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0121] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

[0122] References herein to "one embodiment," "an embodiment," or "one or more embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Furthermore, please note that instances of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0123] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present disclosure may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0124] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in the claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present disclosure may be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. A light-emitting substrate comprising a light-emitting device, wherein the light-emitting device comprises a first electrode, a light-emitting layer, and a second electrode stacked in layers; The light-emitting substrate comprises: substrate; A first conductive layer and a second conductive layer are provided on one side of the base substrate, the first conductive layer includes the first electrode and an electrode lead, the first electrode and the electrode lead are connected to each other, and the second conductive layer includes a first electrode signal line; Wherein, the first electrode and the first electrode signal line are separately arranged on the surface of the base substrate, and the electrode lead is directly connected to the first electrode signal line; The electrode lead is a strip-shaped structure at least partially surrounding the first electrode; One end of the strip structure is connected to the first electrode, and the other end is directly connected to the first electrode signal line; The light-emitting substrate further includes: a pixel defining layer, disposed on a side of the first conductive layer and the second conductive layer facing away from the base substrate, and used to define an opening area; The electrode lead and the first electrode signal line are respectively isolated from the second electrode by the pixel defining layer.

2. The light-emitting substrate according to claim 1, wherein The first conductive layer and the second conductive layer are respectively located in different film layers, and the electrode lead and the first electrode signal line are overlapped with each other.

3. The light-emitting substrate according to claim 2, wherein The first electrode signal line includes a first overlapping portion, and the first overlapping portion at least partially covers a surface of the electrode lead on a side facing away from the base substrate.

4. The light-emitting substrate according to claim 2, wherein The first electrode signal line includes a second overlapping portion, and the electrode lead at least partially covers a surface of the second overlapping portion that is away from the base substrate.

5. The light-emitting substrate according to claim 2, wherein The material of the first conductive layer includes metal oxide, and the material of the second conductive layer includes metal. The light-emitting substrate according to claim 1 , wherein: The first conductive layer and the second conductive layer are located in the same film layer and are an integrated structure.

7. The light-emitting substrate according to claim 1, wherein In the plane where the substrate is located and along the normal direction of the strip structure surrounding the first electrode, the width of the strip structure is greater than or equal to 5 micrometers and less than or equal to 10 micrometers.

8. The light-emitting substrate according to any one of claims 1 to 7, wherein: The light-emitting substrate also include: In which, the light-emitting layer and the second electrode are arranged on the side of the pixel defining layer away from the base substrate, and the light-emitting layer is located between the first electrode and the second electrode; the orthographic projections of the light-emitting layer and the first electrode on the base substrate respectively cover the orthographic projection of the opening area on the base substrate, and the orthographic projections of the electrode lead and the first electrode signal line on the base substrate respectively are located within the range of the orthographic projection of the pixel defining layer on the base substrate.

9. The light-emitting substrate according to claim 8, wherein The light-emitting substrate includes a plurality of the light-emitting devices; the first electrodes and the electrode leads connected to each other constitute an electrode unit; the first conductive layer includes a plurality of discretely arranged electrode units; and the first electrodes in each electrode unit are located in different light-emitting devices.

10. The light-emitting substrate according to any one of claims 1 to 7, wherein: The light-emitting substrate includes a plurality of the light-emitting devices, and the light-emitting colors of the plurality of light-emitting devices are the same.

11. The light-emitting substrate according to any one of claims 1 to 7, wherein: The light-emitting substrate includes a plurality of the light-emitting devices arranged in an array; the second conductive layer includes a plurality of the first electrode signal lines, and the first electrodes of the light-emitting devices located in the same row or column are connected to the same first electrode signal line.

12. A light-emitting device comprising the light-emitting substrate according to any one of claims 1 to 11.

13. A vehicle comprising the light emitting device according to claim 12.

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