Electrical assembly comprising a compression assembly for a cable connector module

Abstract

An electrical assembly (1102) includes an electronic package (1106) having an integrated circuit component (1156) and an interposer assembly (1108) having compressible interposer contacts (1200) electrically connected thereto. A cable connector module (1104) is coupled to the interposer assembly. A cover assembly (1130) is coupled to an upper surface (1152) of the electronic package by the cable connector module. The cover assembly includes a bridge assembly (1134) having independently movable plates (1190) in a plate stack (1192). A load plate (1120) engages upper edges (1196) of the plates of the bridge assembly and presses against the plates to drive the bridge assembly into the cable connector module using compression hardware (1116). As the load plate presses the plates of the bridge assembly into the cable connector module, the cable connector module compresses the interposer contacts of the interposer assembly.

Description

Technical Field

[0001] The main topic of this article is electronic components. Background Technology

[0002] A continuing trend is towards smaller, lighter, and higher-performance communication components and higher-density systems, such as those used in Ethernet switches or other system components. Typically, a system includes receptacle connectors mounted to a main board. The receptacle connectors receive electronic packages, such as ASICs. Electrical signals are routed between the ASIC and the main board through the receptacle connectors. The signals then travel along traces on the main board to another component, such as a transceiver connector. Long electrical paths through the main board degrade the system's electrical performance. Additionally, the wiring between the receptacle connectors and other components on the main board occupies board space. Conventional systems are striving to meet the signal output requirements from electronic packages by needing shorter signal path lengths and a greater number of conductors while maintaining good electrical performance throughout the system.

[0003] Reliable electronic components are still needed for high-speed data signaling in data communication systems. Summary of the Invention

[0004] According to the present invention, an electrical component is provided. The electrical component includes an electronic package, the electronic package including a package substrate having an upper surface and a lower surface. The electronic package includes an integrated circuit component on the upper surface of the package substrate. The electronic package includes a lower package contact electrically connected to the integrated circuit component and configured to be electrically connected to a main circuit board. The electronic package includes an upper package contact electrically connected to the integrated circuit component. The electronic component includes an inserter assembly electrically connected to the electronic package. Each inserter assembly includes an array of inserter contacts. The inserter contacts are compressible. Each inserter contact has an upper mating interface and a lower mating interface. The lower mating interface of the inserter contact mates with a corresponding upper package contact. The inserter assembly defines a separable interface from the electronic package. The electrical component includes a cable connector module coupled to the inserter assembly. Each cable connector module includes a cable connector housing that retains a connector module substrate. Each cable connector module has a cable extending from the cable connector module and communicatively coupled to the connector module substrate. The connector module substrate has cable connector module contacts. The cable connector module contacts mate with the upper mating interfaces of corresponding inserter contacts. The electrical assembly includes a cover assembly coupled to the upper surface of an electronic package. The cover assembly includes a cover having a plate and a partition wall extending from the plate to form a connector module cavity configured to receive a corresponding cable connector module. The plate includes a window associated with each connector module cavity. The cover assembly includes a bridging assembly received in the corresponding connector module cavity and extending through the corresponding window. Each bridging assembly has multiple plates arranged in a plate stack. The plates are movable relative to each other within the plate stack. Each plate includes an upper edge and a lower edge. The lower edge engages the cable connector module housing. The electrical assembly includes a load plate coupled to the cover assembly using compression hardware. The load plate has an upper edge on which the bridging assembly engages the plate of the bridging assembly. The load plate presses against the plate of the bridging assembly to drive the bridging assembly into the cable connector module using the compression assembly. As the load plate presses the plate of the bridging assembly into the cable connector module, the cable connector module compresses the inserter contacts of the inserter assembly.

[0005] According to the present invention, a compression assembly for an electronic package of a communication system is provided. The compression assembly includes a cover assembly configured to be coupled to an upper surface of the electronic package and connected to a cable connector module coupled to the upper surface of the electronic package via an inserter assembly. The cover assembly includes a cover having a plate and a partition wall extending from the plate to form a connector module cavity configured to receive a corresponding cable connector module. The plate includes a window associated with each connector module cavity. The compression assembly includes a bridging assembly received in the corresponding connector module cavity and extending through the corresponding window. Each bridging assembly has a plurality of plates arranged in a plate stack. The plates are movable relative to each other within the plate stack. Each plate includes an upper edge and a lower edge. The lower edge is configured to engage a cable connector module housing. The compression assembly includes a load plate coupled to the cover assembly using compression hardware that imparts a compressive force. The load plate has a bottom surface that engages the upper edge of the plate of the bridging assembly. The load plate uses the compressive force to press against the plate of the bridging assembly to drive the bridging assembly into the cable connector module. The compression force is configured to compress the inserter contacts of the inserter assembly when the load plate presses the bridging assembly plate into the cable connector module. Attached Figure Description

[0006] Figure 1 This is a perspective view of a communication system with electronic components according to an exemplary embodiment.

[0007] Figure 2 This is an exploded view of a communication system and electronic components according to an exemplary embodiment.

[0008] Figure 3 This is a perspective view of an electronic component according to an exemplary embodiment.

[0009] Figure 4 This is a perspective view of a cable connector module according to an exemplary embodiment.

[0010] Figure 5 This is a side view of a cable connector module according to an exemplary embodiment.

[0011] Figure 6 This is a bottom view of a cable connector module according to an exemplary embodiment.

[0012] Figure 7 This is a perspective view of a cable connector module according to an exemplary embodiment.

[0013] Figure 8 This is a side view of a cable connector module according to an exemplary embodiment.

[0014] Figure 9 This is a bottom view of a cable connector module according to an exemplary embodiment.

[0015] Figure 10 This is a side view of a portion of a cable connector module according to an exemplary embodiment, showing a cable terminated to the connector module substrate.

[0016] Figure 11 This is a perspective view of a portion of a cable connector module according to an exemplary embodiment, showing a cable terminated to the connector module substrate.

[0017] Figure 12 This is a top view of the inserter component according to an exemplary embodiment.

[0018] Figure 13 This is a bottom view of the inserter component according to an exemplary embodiment.

[0019] Figure 14 This is a perspective view of the inserter component according to an exemplary embodiment.

[0020] Figure 15 This is a side view of a portion of an inserter assembly according to an exemplary embodiment, showing a support plate and a plurality of inserter contacts located between a package substrate and a connector module substrate.

[0021] Figure 16 This is a perspective view of a portion of an electrical assembly according to an exemplary embodiment, showing one of the inserter assemblies prepared to mate with an electronic package.

[0022] Figure 17 This is a perspective view of a portion of an electronic assembly according to an exemplary embodiment, showing one of the cable connector modules prepared to mate with a corresponding inserter assembly and electronic package.

[0023] Figure 18 This is a perspective view of a portion of an electronic assembly according to an exemplary embodiment, showing one of the cover assemblies prepared to mate with an electronic package via a cable connector module.

[0024] Figure 19 This is a top view of the cover assembly according to an exemplary embodiment.

[0025] Figure 20 This is a side view of the cover assembly according to an exemplary embodiment.

[0026] Figure 21 This is a bottom view of the cover assembly according to an exemplary embodiment.

[0027] Figure 22 This is an exploded view of the cover assembly according to an exemplary embodiment.

[0028] Figure 23 This is a perspective view of a bridging component according to an exemplary embodiment.

[0029] Figure 24 This is a perspective view of a portion of an electronic assembly according to an exemplary embodiment, showing one of the cover assemblies prepared to mate with an electronic package via a cable connector module.

[0030] Figure 25 This is a cross-sectional view of a communication system according to an exemplary embodiment, showing electrical components connected to a main circuit board.

[0031] Figure 26 This is a cross-sectional view of a communication system according to an exemplary embodiment, showing electrical components connected to a main circuit board.

[0032] Figure 27 This is a cross-sectional view of a part of a communication system according to an exemplary embodiment.

[0033] Figure 28-36 An assembly of a communication system according to an exemplary embodiment is shown.

[0034] Figure 37 This is a perspective view of a part of a communication system during assembly, according to an exemplary embodiment.

[0035] Figure 38 This is a perspective view of a part of a communication system during assembly, according to an exemplary embodiment. Detailed Implementation

[0036] Figure 1 This is a perspective view of a communication system 1100 having electronic components 1102 according to an exemplary embodiment. Figure 2 This is an exploded view of a communication system 1100 and electronic components 1102 according to an exemplary embodiment. Electrical component 1102 includes a cable connector module 1104. Figure 2 ), which is achieved through inserter component 1108 ( Figure 2 Electrically connected to the electronic package 1106 ( Figure 2 Electrical component 1102 is electrically connected to main circuit board 1110, for example using board connector 1112. Figure 2 The board connector can transmit power and / or data between the main circuit board 1110 and the electrical component 1102. In various other embodiments, the electrical component 1102 can be mounted directly to the main circuit board 1110 without using the board connector 1112.

[0037] In an exemplary embodiment, compression assembly 1114 is used to load electrical component 1102 into inserter assembly 1108 to electrically connect cable connector module 1104 to electronic package 1106. In an exemplary embodiment, compression assembly 1114 includes a load plate 1120 for pressing downward against various components of electrical component 1102 to load contacts of electrical component 1102. Compression hardware 1116, such as threaded fasteners with biasing members (e.g., springs), is used to engage load plate 1120 to pad 1118. Optionally, insulator 1128 may be disposed between pad 1118 and main circuit board 1110. In various embodiments, pad 1118 may be located above main circuit board 1110. Alternatively, pad 1118 may be located below main circuit board 1110. Load plate 1120 is forced downward to engage cable connector module 1104 to inserter assembly 1108. For example, load plate 1120 can compress the contacts of inserter assembly 1108. In an alternative embodiment, load plate 1120 is coupled to cover assembly 1130 and / or pad 1118 using fixing hardware instead of compression hardware to fix the position of load plate 1120 relative to electronic package 1106. In such an embodiment, compression of cable connector module 1104 can originate from other compression members, such as internal springs. In an exemplary embodiment, compression assembly 1114 includes heat transfer element 1122 to dissipate heat from electronic package 1106 and / or cable connector module 1104. Load plate 1120 can define heat transfer element 1122. Heat transfer element 1122 can be a cold plate having cooling channels for actively cooling the cold plate. For example, cooling channels can have liquid cooling to dissipate heat from the cold plate. In various other embodiments, heat transfer element can be a heat sink having heat dissipation fins to passively cool the heat sink using airflow through the heat dissipation fins, thereby dissipating heat from the heat sink.

[0038] In various embodiments, the electronic package 1106 is an integrated circuit component, such as an ASIC. However, the electronic package 1106 can be another type of communication component. A cable connector module 1104 directly engages with the ASIC via an inserter assembly 1108 independent of the main circuit board 1110. For example, high-speed data signals are transmitted between the electronic package 1106 and the cable connector module 1104 via the inserter assembly 1108, without passing through the main circuit board 1110. In exemplary embodiments, multiple cable connector modules 1104 are coupled to the electronic package 1106. For example, the cable connector modules 1104 may be disposed on multiple sides of the integrated circuit or other communication element of the electronic package 1106. In the illustrated embodiment, the cable connector modules 1104 are disposed on all four sides of the integrated circuit. In alternative embodiments, other arrangements are possible.

[0039] In an exemplary embodiment, compression hardware 1116 includes a spring member configured to transmit spring force from compression hardware 1116 to load plate 1120. In alternative embodiments, other types of compression members may be used. In the illustrated embodiment, compression hardware 1116 is disposed on all four sides of load plate 1120; however, in alternative embodiments, compression hardware 1116 may be coupled to other areas of load plate 1120.

[0040] In an exemplary embodiment, electrical component 1102 includes one or more cover assemblies 1130 coupled to electronic package 1106. Cover assemblies 1130 cover cable connector modules 1104 and inserter assemblies 1108. In the illustrated embodiment, electrical component 1102 includes a plurality of cover assemblies 1130, for example, on each side of the integrated circuit of electronic package 1106. Each cover assembly 1130 covers a plurality of cable connector modules 1104. Cover assembly 1130 includes a cover 1132 and a bridging assembly 1134 coupled to the cover 1132. Fasteners are used ( Figure 18 The cover 1132 is attached to the pad 1118. The bridging assembly 1134 is aligned with the cable connector module 1104. The bridging assembly 1134 is used to transfer a compressive load from the load plate 1120 to the inserter assembly 1108. The compressive load may come from the compression hardware 1116. The compressive load may additionally or alternatively come from an internal spring element, such as a spring element within the bridging assembly 1134. The load plate 1120 presses against the bridging assembly 1134 and drives the bridging assembly 1134 into the cable connector module 1104. The force from the load plate 1120 compresses the inserter assembly 1108 against the integrated circuit or substrate of the electronic package 1106. The bridging assembly 1134 presses the cable connector module 1104 into the inserter assembly 1108. The compressive force from the load plate 1120 can be transmitted to the inserter contacts by the compressive force applied to each cable connector module 1104.

[0041] In an exemplary embodiment, the load plate 1120 may be thermally coupled to the cable connector module 1104 via a bridging assembly 1134. For example, the bridging assembly 1134 defines a heat sink for dissipating heat from the cable connector module 1104 to the heat transfer element 1122 defined by the load plate 1120.

[0042] In an exemplary embodiment, inserter assembly 1108 defines a separable mating interface. For example, each inserter assembly 1108 includes an upper separable mating interface, such as a compressible interface. Thus, the cable connector module 1104 can be removable or replaceable. Each inserter assembly 1108 may include a lower separable mating interface, such as a compressible interface. The contacts of the inserter assembly 1108 may be compressible cylindrical contacts, such as conductive elastomer contacts. In other embodiments, the contacts of the inserter assembly 1108 may be stamped contacts, such as those including a spring beam. The spring beam may be disposed at the top and / or bottom of the inserter assembly 1108. In alternative embodiments, the contacts may be press-fit contacts, solder contacts, or other types of contacts. In various embodiments, multiple inserter assemblies 1108 are mounted to an electronic package 1106. For example, each cable connector module 1104 is mounted to a separate inserter assembly 1108. In alternative embodiments, multiple cable connector modules 1104 may be mounted to a single inserter assembly 1108. For example, a separate inserter assembly 1108 may be provided along each side of the electronic package 1106. In another embodiment, a single inserter assembly is configured to extend along all four sides of the electronic package 1106.

[0043] Figure 3 This is a perspective view of an electronic component 1102 according to an exemplary embodiment. The electrical component 1102 includes an electronic package 1106 supporting a plurality of cable connector modules 1104. An inserter assembly 1108 electrically connects the cable connector modules 1104 to the electronic package 1106. A cover assembly 1130 is used to attach the cable connector modules 1104 to the electronic package 1106. When a load plate 1120 (such as...) is placed... Figure 1 When coupled to cover assembly 1130 (as shown), bridging assembly 1134 is used to compress insert assembly 1108 between cable connector module 1104 and electronic package 1106.

[0044] Electronic package 1106 includes a packaging substrate 1150 having an upper surface 1152 and a lower surface 1154. Electronic package 1106 includes an integrated circuit component 1156, which is mounted to the upper surface 1152 of the packaging substrate 1150. The integrated circuit component 1156 may be a chip, ASIC, processor, memory module, or other component mounted on top of the packaging substrate 1150. In the illustrated embodiment, the integrated circuit component 1156 is rectangular and generally centered on the packaging substrate 1150; however, in alternative embodiments, the integrated circuit component 1156 may have other shapes or positions, or multiple integrated circuit components may be present. In an exemplary embodiment, the packaging substrate 1150 includes positioning features 1158 for positioning relative to a main circuit board 1110 (e.g., Figure 1(As shown) Positioning electronic package 1106. In the illustrated embodiment, positioning feature 1158 is an opening through the package substrate 1150. In alternative embodiments, other types of positioning features may be used, such as channels, recesses, extensions, tabs, pillars, pins, etc.

[0045] Package substrate 1150 includes edges 1160 extending around its periphery. In the illustrated embodiment, package substrate 1150 is a rectangular shape with four vertical edges. In alternative embodiments, package substrate 1150 may have other shapes including more or fewer edges 1160. Integrated circuit component 1156 is mounted to package substrate 1150 at component mounting region 1162, which may be approximately centered between the edges 1160. Package substrate 1150 includes package contacts (not shown) at component mounting region 1162 for electrically connecting integrated circuit component 1156 to package substrate 1150. Package contacts may be pads, traces, vias, etc.

[0046] The packaging substrate 1150 includes a lower packaging contact (not shown) on its lower surface 1154. The lower packaging contact is used to electrically connect the electronic package 1106 to the board connector 1112 (e.g., ...). Figure 2 (As shown). In an exemplary embodiment, power and low-speed data signals are transmitted between the package substrate 1150 and the board connector 1112 via lower package contacts. High-speed data signals can also be transmitted via lower package contacts. The lower package contacts are electrically connected to the integrated circuit component 1156 via corresponding package contacts. In an exemplary embodiment, the lower package contacts may be approximately centered along the lower surface 1154, for example, directly below the component mounting region 1162.

[0047] The packaging substrate 1150 includes upper packaging contacts (not shown) on its upper surface 1152. These upper packaging contacts are used to electrically connect the electronic package 1106 to the cable connector module 1104 via the inserter assembly 1108. In an exemplary embodiment, high-speed data signals are transmitted between the packaging substrate 1150 and the cable connector module 1104 via the upper packaging contacts. The upper packaging contacts are electrically connected to the integrated circuit component 1156 via corresponding packaging contacts. In an exemplary embodiment, the upper packaging contacts are disposed around the outer periphery of the packaging substrate 1150. In an exemplary embodiment, the packaging substrate 1150 includes a mounting region 1164 surrounding the outer periphery of the packaging substrate 1150. The inserter assembly 1108 and the cable connector module 1104 are coupled to the packaging substrate 1150 at the mounting region 1164. The mounting region 1164 is located between the integrated circuit component 1156 and the edge 1160 at the component mounting region 1162. In the illustrated embodiment, mounting regions 1164 are provided along all four sides of the integrated circuit component 1156 for the purpose of short electrical traces to / from the integrated circuit component 1156 (improved signal integrity).

[0048] Electronic component 1102 has a high channel density for data communication and power distribution to integrated circuit component 1156. For example, data channels are disposed on the upper surface 1152 and lower surface 1154 of package substrate 1150. A subset of data signals (e.g., low-speed and / or sideband data signals) is routed through the bottom of electronic package 1106 to main circuit board 1110, and a subset of data signals (e.g., high-speed data signals) is routed through the top of electronic package 1106 to cable connector module 1104. Performance and design efficiency are enhanced by increasing the number of data channels to integrated circuit component 1156. Additionally, the performance of communication system 1100 is enhanced by directly routing high-speed data signals to cable connector module 1104, rather than routing them through main circuit board 1110. In an exemplary embodiment, cable connector module 1104 is coupled to electronic package 1106 at multiple locations (e.g., on the four sides of the chip) to increase the density of communication system 1100 and shorten the electrical path of communication system 1100. By routing the data channels to the top of the package substrate 1150 for removal of the cable connector module 1104, this arrangement reduces the number of interfaces required along the bottom of the package substrate 1150. The cable connector module 1104 can be separated from the electronic package 1106. Each cable connector module 1104 has its own compression fit using a corresponding bridging assembly 1134. The cover assembly 1130 can be removed to service individual cable connector modules 1104, for example, to adjust or replace the cable connector module 1104.

[0049] Figure 4This is a perspective view of the cable connector module 1104 according to an exemplary embodiment. Figure 5 This is a side view of the cable connector module 1104 according to an exemplary embodiment. Figure 6 This is a bottom view of a cable connector module 1104 according to an exemplary embodiment. In the illustrated embodiment, the cable connector module 1104 may be an optical module, for example, including optical data transmission. Alternatively, the cable connector module 1104 may be a copper cable module, which uses copper conductor cables to transmit electrical data signals.

[0050] Cable connector module 1104 includes connector module housing 1170 having a cavity 1172 for receiving connector module substrate 1174. One or more cables 1178 extend from connector module housing 1170. In various embodiments, cable connector module 1104 may be an optical module having an optical engine 1176 (shown in dashed lines) for optical-to-digital conversion. In an exemplary embodiment, optical engine 1176 includes an electro-optical converter configured to convert between electrical and optical signals. Optical engine 1176 may include other electrical components. Cable 1178 may terminate to optical engine 1176. Alternatively, cable connector module 1104 is an electrical module having signal conductors. For example, cable 1178 may be a copper cable directly terminated to connector module substrate 1174, such as a pad soldered to connector module substrate 1174. Cable 1178 may be connected to substrate 1174 or other components at a detachable interface. For example, the cable may be plugged into connector module housing 1170.

[0051] Connector module substrate 1174 extends between the front portion 1181 and the rear portion 1183 of cable connector module 1104. Connector module substrate 1174 is disposed at the bottom 1185 of cable connector module 1104. Connector module substrate 1174 extends between the sides 1187 and 1189 of cable connector module 1104. Connector module substrate 1174 may be a printed circuit board or other suitable material for routing electrical traces. Connector module substrate 1174 includes module contacts 1188 configured for electrical connection to inserter assembly 1108 (e.g., ...). Figure 3 (As shown). For example, the module contacts can be pads on the bottom of the connector module substrate 1174.

[0052] In an exemplary embodiment, the connector module substrate 1174 includes positioning features 1180 configured to position the cable connector module 1104 relative to the inserter assembly 1108. In an exemplary embodiment, the connector module housing 1170 includes positioning features 1182 configured to position the cable connector module 1104 relative to the inserter assembly 1108. Positioning features 1180, 1182 are defined by slots aligned with each other and configured to receive positioning features of the inserter assembly 1108 to align the cable connector module 1104 with the inserter assembly 1108. In alternative embodiments, other types of positioning features 1180, 1182 may be provided, such as protrusions or pins.

[0053] In an exemplary embodiment, the connector module housing 1170 is made of a thermally conductive material, such as a metal. The connector module housing 1170 can transfer heat from heat-generating components, such as the light engine 1176, cable 1178, or other components. In an exemplary embodiment, the bridging assembly 1134 (such as...) Figure 2 (As shown) is configured to engage the top 1184 of the connector module housing 1170 to dissipate heat from the cable connector module 1104.

[0054] Figure 7 This is a perspective view of the cable connector module 1104 according to an exemplary embodiment. Figure 8 This is a side view of the cable connector module 1104 according to an exemplary embodiment. Figure 9 This is a bottom view of a cable connector module 1104 according to an exemplary embodiment. In the illustrated embodiment, the cable connector module 1104 is a copper cable module rather than an optical module. The cable 1178 is a copper cable, such as a coaxial cable or biaxial cable. The cable 1178 extends into the connector module housing 1170 to terminate to the connector module substrate 1174. The connector module housing 1170 may be differently shaped, for example, to accommodate the copper cable, which may terminate to the upper and lower surfaces of the connector module substrate 1174.

[0055] Figure 10 This is a side view of a portion of a cable connector module 1104 according to an exemplary embodiment, showing a cable 1178 terminated to a connector module substrate 1174. Figure 11 This is a perspective view of a portion of a cable connector module 1104 according to an exemplary embodiment, showing a cable 1178 terminated to a connector module substrate 1174. In the exemplary embodiment, the conductors of the cable 1178 are directly soldered to the connector module substrate 1174, for example, to the upper and lower surfaces of the connector module substrate 1174.

[0056] Figure 12 This is a top view of the inserter component 1108 according to an exemplary embodiment. Figure 13 This is a bottom view of the inserter assembly 1108 according to an exemplary embodiment. Figure 14 This is a perspective view of an inserter assembly 1108 according to an exemplary embodiment. The inserter assembly 1108 includes an array of inserter contacts 1200 held together by a support plate 1202. The inserter assembly 1108 includes an inserter frame 1204 that holds the support plate 1202 and the inserter contacts 1200. The inserter frame 1204 may be a multi-piece frame, for example, having an upper frame member and a lower frame member, with the support plate 1202 sandwiched between the upper and lower frame members. The inserter frame 1204 extends around the outer periphery of the inserter assembly 1108, for example, along all four sides of the support plate 1202. In alternative embodiments, the inserter frame 1204 may have other shapes.

[0057] In an exemplary embodiment, the inserter frame 1204 includes an upper positioning wall 1210 configured to receive a receptacle 1212 of a corresponding cable connector module 1104. The upper positioning wall 1210 may form a rectangular receptacle 1212; however, in alternative embodiments, the receptacle 1212 may have other shapes. In an exemplary embodiment, an opening 1214 is provided in one of the upper positioning walls 1210. The opening 1214 is configured to receive a portion of the cable connector module 1104. In an exemplary embodiment, a positioning surface of the upper positioning wall 1210 forms a positioning surface 1216 for positioning the cable connector module 1104 in the receptacle 1212. In an exemplary embodiment, the inserter frame 1204 includes positioning features 1218 for positioning the cable connector module 1104. For example, the edge of the upper positioning wall 1210 facing the opening 1214 forms the positioning feature 1218. The positioning feature 1218 is configured to be received in positioning features 1180, 1182 (e.g., slots) of the cable connector module 1104.

[0058] In an exemplary embodiment, the inserter frame 1204 includes a lower positioning pin 1219 extending from the lower frame member 1208. Figure 13 The lower positioning pin 1219 is used relative to the electronic package 1106 (e.g., Figure 3 (As shown) Positioning inserter assembly 1108. Lower positioning pin 1219 is received on package substrate 1150 (e.g.) Figure 3 (As shown) the inserter frame 1204 and inserter contact 1200 are positioned relative to the package substrate 1150. In alternative embodiments, other types of positioning features may be used.

[0059] Figure 15This is a side view of a portion of the inserter assembly 1108, showing a support plate 1202 and a plurality of inserter contacts 1200 located between the encapsulation substrate 1150 and the connector module substrate 1174. In an exemplary embodiment, the support plate 1202 is a thin film having an upper surface 1220 and a lower surface 1222. The support plate 1202 includes an opening 1214 therethrough to hold corresponding inserter contacts 1200. The support plate 1202 is made of an insulating material, such as polyimide, to electrically isolate the inserter contacts 1200 from each other.

[0060] Insertor contacts 1200 are held by support plates 1202. In an exemplary embodiment, insertor contacts 1200 are compressible contacts, such as conductive polymer pillars. Each insertor contact 1200 includes an upper mating interface 1226 and a lower mating interface 1228. The upper mating interface 1226 is located above the upper surface 1220 of the support plate 1202, and the lower mating interface 1228 is located below the lower surface 1222 of the support plate 1202. Insertor contacts 1200 are compressible between the upper mating interface 1226 and the lower mating interface 1228. Optionally, the upper mating interface 1226 and the lower mating interface 1228 may be planar interfaces oriented parallel to each other. Optionally, the upper side 1230 and the lower side 1232 of the insertor contact 1200 may be tapered. For example, sides 1230 and 1232 may not be oriented perpendicular to the upper mating interface 1226 and the lower mating interface 1228. The upper and lower portions of the inserter contact 1200 may be conical, such as a truncated cone. In alternative embodiments, other types of inserter contacts 1200 may be used.

[0061] Figure 16 This is a perspective view of a portion of an electronic assembly 1102 according to an exemplary embodiment, showing one of an inserter assembly 1108 prepared to mate with an electronic package 1106. A package substrate 1150 includes a plurality of upper package contacts 1166 on its upper surface 1152. The upper package contacts 1166 are arranged in an array complementary to the array of inserter contacts 1200. The package contacts 1166 may be signal contacts and / or ground contacts and / or power contacts.

[0062] The package substrate 1150 includes an inserter positioning feature 1168 for positioning an inserter assembly 1108 relative to an electronic package 1106. In the illustrated embodiment, the inserter positioning feature 1168 is an opening in the package substrate 1150 configured to receive a lower positioning pin 1219 of the inserter assembly 1108. In alternative embodiments, other types of positioning features may be used, such as tabs, pillars, etc.

[0063] Figure 17This is a perspective view of a portion of an electronic assembly 1102 according to an exemplary embodiment, showing one of cable connector modules 1104 prepared to mate with a corresponding inserter assembly 1108 and electronic package 1106. The cable connector module 1104 is configured to be received in a socket 1212 and engage a positioning surface 1216 of an upper wall 1210. Positioning features 1180, 1182 of the cable connector module 1104 are aligned with positioning feature 1218 to position the cable connector module 1104 relative to the inserter assembly 1108. An opening 1214 receives a portion of the cable connector module 1104. A connector module substrate 1174 is configured to be coupled to an inserter contact 1200 of the inserter assembly 1108. For example, connector module contacts on the bottom surface of the connector module substrate 1174 are aligned and coupled to corresponding inserter contacts 1200. The connector module substrate 1174 electrically connects the inserter contacts 1200 to a cable 1178, for example, directly or via a light engine 1176.

[0064] Figure 18 This is a perspective view of a portion of an electrical assembly 1102 according to an exemplary embodiment, showing one of a cover assembly 1130 prepared to mate with an electronic package 1106 via a cable connector module 1104. During assembly, the cover assembly 1130 is placed over the cable connector module 1104 and the inserter assembly 1108. The cover assembly 1130 covers multiple cable connector modules 1104. A cover 1132 holds a bridging assembly 1134 and aligns the bridging assembly 1134 with the cable connector module 1104. The cover 1132 is engaged to a pad 1118 using fasteners 1136. When the cover assembly 1130 is engaged to the pad 1118, the bridging assembly 1134 is used to press down on the cable connector module 1104, for example, through a load plate 1120. The bridging assembly 1134 transfers a compressive load from the load plate 1120 to the inserter assembly 1108 through the cable connector module 1104.

[0065] Figure 19 This is a top view of the cover assembly 1130 according to an exemplary embodiment. Figure 20 This is a side view of the cover assembly 1130 according to an exemplary embodiment. Figure 21 This is a bottom view of the cover assembly 1130 according to an exemplary embodiment. Figure 22 This is an exploded view of the cover assembly 1130 according to an exemplary embodiment. The cover assembly 1130 includes a cover 1132 and a bridging assembly 1134.

[0066] The cover 1132 includes a plate 1140 on its top. The plate 1140 includes a fastener 1136 (such as...). Figure 18The cover 1132 includes an opening 1141 (as shown). The cover 1132 includes a wall 1142 extending from the bottom of the plate 1140 to form one or more connector module cavities 1144. The wall 1142 may be a partition wall 1142 between connector module cavities 1144. The connector module cavity 1144 is configured to receive a corresponding cable connector module 1104 (e.g., ...). Figure 18 (As shown). A partition wall 1142 separates the cable connector module 1104. The partition wall 1142 can be used to guide the mating of the cover 1132 with the cable connector module 1104. The plate 1140 includes a window 1146 passing through it, which aligns with the connector module cavity 1144. A bridging assembly 1134 is received in the corresponding connector module cavity 1144 and extends through the window 1146. The top of the bridging assembly 1134 can be positioned above the top of the plate 1140 to connect with the load plate 1120 (as shown). Figure 1 (As shown) mating. The bottom of the bridging assembly 1134 may be located below the plate 1140 in the connector module cavity 1144 to mate with the cable connector module 1104. In an exemplary embodiment, the bridging assembly 1134 is coupled to the cover 1132, for example, by welding to the bottom of the plate 1140, or by other means, such as using fasteners. In an alternative embodiment, the cover 1132 has a single connector module cavity 1144 and a single window 1146. Multiple covers 1132 may be arranged adjacently to form an array.

[0067] Figure 23 This is a perspective view of a bridging assembly 1134 according to an exemplary embodiment. The bridging assembly 1134 includes a plurality of plates 1190 arranged in a plate stack 1192. A frame 1194 holds the plates 1190 within the plate stack 1192. The plates 1190 may be coupled to the frame via internal spring elements (not shown), which may allow the plates 1190 to move relative to the frame 1194 and / or relative to each other. For example, the frame 1194 extends circumferentially around the plate stack 1192. The frame 1194 includes mounting protrusions 1195 for mounting the bridging assembly 1134 to a cover 1132 (e.g., Figure 22 (As shown). Plate 1190 extends between an upper edge 1196 and a lower edge 1198. In an exemplary embodiment, plate 1190 includes an upper plate and a lower plate that are interlocked with each other. For example, the upper plate has an upper edge 1196 and the lower plate has a lower edge 1198.

[0068] Plates 1190 can move independently relative to each other and relative to frame 1194. For example, the upper and lower plates can be moved relative to each other by internal spring elements that bias the upper and lower plates apart, for example, driving the upper plate into load plate 1120 and the lower plate into cable connector module 1104. Alternatively, plates 1190 can be grouped together, and groups of plates 1190 can move relative to other groups. Plates 1190 independently receive loads from load plate 1120 (e.g., ...). Figure 1 The pressing force (as shown) is transmitted to the cable connector module 1104 (as shown). Figure 18 (As shown). Plate 1190 may conform to the irregular shape of load plate 1120 and / or cable connector module 1104. In various embodiments, plate 1190 may be a metal plate. In such a timely departure, plate 1190 may be thermally conductive, for example, to transfer heat from cable connector module 1104 to load plate 1120 (e.g., heat transfer element 1122). Thus, plate 1190 forms a thermal bridge between cable connector module 1104 and load plate 1120. Alternatively, plate 1190 may be plastic to reduce the weight and / or cost of bridging assembly 1134.

[0069] Figure 24 This is a perspective view of a portion of an electrical assembly 1102 according to an exemplary embodiment, showing one of a cover assembly 1130 prepared to mate with an electronic package 1106 via a cable connector module 1104. During assembly, the cover assembly 1130 is placed over the cable connector module 1104 and the inserter assembly 1108. The cover assembly 1130 covers multiple cable connector modules 1104. A cover 1132 holds a bridging assembly 1134 and aligns the bridging assembly 1134 with the cable connector module 1104. The cover 1132 is engaged to a pad 1118 using fasteners 1136. When the cover assembly 1130 is engaged to the pad 1118, the bridging assembly 1134 is used to press down on the cable connector module 1104, for example, through a load plate 1120. The bridging assembly 1134 transfers a compressive load from the load plate 1120 to the inserter assembly 1108 through the cable connector module 1104.

[0070] In an exemplary embodiment, electrical component 1102 may include fiber optic module 1104a and copper cable module 1104b. Both fiber optic module 1104a and copper cable module 1104b are configured to connect to inserter assembly 1108. For example, fiber optic module 1104a and copper cable module 1104b may have a common footprint and contact layout to mate with any inserter assembly 1108. Inserter assembly 1108 is designed to mate with fiber optic module 1104a and copper cable module 1104b.

[0071] Cable connector modules 1104 are arranged into cable connector module groups 1191. The cables 1178 of each cable connector module 1104 within the cable connector module group 1191 extend in a common direction (e.g., from the same side of the electronic package 1106). The cable connector modules 1104 are mounted to the electronic package 1106 such that the front 1181 and rear 1183 of each cable connector module 1104 within the cable connector module group 1191 are aligned. The sides 1187, 1189 of the cable connector modules 1104 within the cable connector module group 1191 face each other and can be abutted against each other.

[0072] During assembly, inserter assembly 1108 is coupled to package substrate 1150 on the upper surface 1152 of package substrate 1150 at upper package contacts 1166 surrounding integrated circuit component 1156. Cable connector module 1104 is coupled to the corresponding inserter assembly 1108. Cable 1178 extends from the side of electronic package 1106 and can extend from all four sides of electronic package 1106. Cable 1178 extends generally horizontally from electronic package 1106, thereby limiting the height of electrical component 1102. Cover assembly 1130 is coupled to cable connector module 1104. Bridging assembly 1134 is held in place by cover 1132 and pressed down against cable connector module 1104 by compression assembly 1114.

[0073] Figure 25 This is a cross-sectional view of a portion of the communication system 1100, showing electrical components 1102 connected to a main circuit board 1110. A pad 1118 is mounted on top of the main circuit board 1110. An encapsulation substrate 1150 is mounted above the pad 1118, with an insulator 1128 positioned between the encapsulation substrate 1150 and the pad 1118. The encapsulation substrate 1150 and the pad 1118 can be secured to the main circuit board 1110 using fasteners 1126. A cover assembly 1130 is connected to the encapsulation substrate 1150 and the pad 1118 via a cable connector module 1104. The cover assembly 1130 is connected to the encapsulation substrate 1150 and the pad 1118 using fasteners 1136. A load plate 1120 is connected to the cover 1132 using compression hardware 1116. The compression hardware 1116 presses the load plate 1120 down against a bridging assembly 1134. The load plate 1120 forces the plate 1140 against the cable connector module 1104 to compress the cable connector module 1104 against the inserter assembly 1108. The plate 1140 can be used to dissipate heat from the cable connector module 1104 by forming a thermal bridge between the cable connector module 1104 and the load plate 1120.

[0074] Figure 26 This is a cross-sectional view of a part of the communication system 1100, showing the electrical component 1102 connected to the main circuit board 1110. Figure 26 A heat transfer element 1122 (e.g., load plate 1120) is shown that is thermally connected to the bridging assembly 1134 and the integrated circuit component 1156. The heat transfer element 1122 dissipates heat from the cable connector module 1104 and the integrated circuit component 1156.

[0075] In an exemplary embodiment, the heat transfer element 1122 is a cold plate, and may be referred to hereinafter as cold plate 1122. In the illustrated embodiment, cold plate 1122 is a multi-piece cold plate including an outer cold plate 1124 and an inner cold plate 1125 received within the outer cold plate 1124. The inner cold plate 1125 is movable relative to the outer cold plate 1124. The inner cold plate 1125 may be compressed against the integrated circuit component 1156. The inner cold plate 1125 has a thermal interface at its bottom surface. The thermal interface is compressed against the upper surface of the integrated circuit component 1156 to dissipate heat from the integrated circuit component 1156. The outer cold plate 1124 holds the bridging assembly 1134. The outer cold plate 1124 may be compressed against the bridging assembly 1134 to press the bridging assembly 1134 against the cable connector module 1104. The outer cold plate 1124 includes a thermal interface at its bottom, which is thermally connected to the plate 1140 of the bridging assembly 1134.

[0076] Figure 27 This is a cross-sectional view of a part of the communication system 1100. Figure 27 A load plate 1120 is shown mechanically coupled to a bridging assembly 1134. The bridging assembly 1134 presses down on the cable connector module 1104 via the load plate 1120. For example, individual plates 1140 press against the top of the connector module housing 1170. The pressure from the cable connector module 1104 is transmitted to the inserter assembly 1108. For example, the connector module substrate 1174 compresses the inserter contact 1200 between the connector module substrate 1174 and the encapsulation substrate 1150 to maintain electrical connections between the connector module substrate 1174 and the inserter contact 1200, and between the encapsulation substrate 1150 and the inserter contact 1200. The bridging assembly 1134 forms a reliable electrical connection between the cable connector module 1104 and the inserter assembly 1108, and a reliable electrical connection between the inserter assembly 1108 and the encapsulation substrate 1150. The inserter contact 1200 is compressed between the cable connector module 1104 and the encapsulation substrate 1150.

[0077] Figure 28-36 An assembly of a communication system 1100 according to an exemplary embodiment is shown.

[0078] Figure 28 This is a perspective view of a part of the communication system 1100 during assembly. Figure 28A pad 1118 is shown, ready to be attached to a circuit board 1110. Alignment pins 1117 can be used to orient the pad 1118 relative to the main circuit board 1110. In an exemplary embodiment, the pad 1118 includes an opening 1119 for a receiving board connector 1112.

[0079] Figure 29 This is a perspective view of a part of the communication system 1100 during assembly. Figure 29 An insulator 1128 is shown ready to be coupled to a pad 1118. The insulator 1128 includes an opening 1129 configured to align with an opening 1119 in the pad 1118 to receive a board connector 1112. The insulator 1128 may be a thin film or sheet made of a dielectric material.

[0080] Figure 30 This is a perspective view of a part of the communication system 1100 during assembly. Figure 30 An electronic package 1106 is shown, ready to be coupled to insulator 1128 and pad 1118. The package substrate 1150 may be similar in size and shape to insulator 1128 and pad 1118. For example, package substrate 1150 may be rectangular. The electronic package 1106 is configured for electrical connection to board connector 1112.

[0081] Figure 31 This is a perspective view of a part of the communication system 1100 during assembly. Figure 31 An inserter assembly 1108 is shown attached to a package substrate 1150 of an electronic package 1106. In the illustrated embodiment, the inserter assembly 1108 is disposed on all four sides of the integrated circuit component 1156. Alignment features of the inserter assembly 1108 can be used to align the inserter assembly 1108 with the package substrate 1150.

[0082] Figure 32 This is a perspective view of a part of the communication system 1100 during assembly. Figure 32 A cable connector module 1104 is shown attached to an inserter assembly 1108. The cable connector module 1104 can be attached to the inserter assembly 1108 from above. The cable connector module 1104 and the inserter assembly 1108 are used to align the cable connector module 1104 with the inserter assembly 1108.

[0083] Figure 33 This is a top view of part of the communication system 1100 during assembly. Figure 33 A cable connector module 1104 is shown that is coupled to the inserter assembly 1108. In the illustrated embodiment, the cable connector module 1104 is arranged as connector module groups 1191 on all four sides of the integrated circuit component 1156. Cables 1178 extend outward from the package substrate 1150 in all four directions.

[0084] Figure 34 This is a perspective view of a part of the communication system 1100 during assembly. Figure 34 A cover assembly 1130 is shown, ready to be coupled to cable connector module 1104. In an exemplary embodiment, a separate cover assembly 1130 is provided for each connector module group 1191. Fasteners 1136 are used to secure cover 1132 to pad 1118. Cover 1132 aligns bridging assembly 1134 with cable connector module 1104.

[0085] Figure 35 This is a perspective view of a part of the communication system 1100 during assembly. Figure 35 A cover assembly 1130 is shown connected to a pad 1118 via a cable connector module 1104. Fasteners 1136 secure the cover 1132 in place.

[0086] Figure 36 This is a perspective view of a part of the communication system 1100 during assembly. Figure 36 A load plate 1120 is shown, ready to be coupled to a cover assembly 1130. The load plate 1120 is secured to the cover assembly 1130 using compression hardware 1116. In the illustrated embodiment, the load plate 1120 includes an outer cooling plate 1124 and an inner cooling plate 1125. The inner cooling plate 1125 is received in a recess at the center of the outer cooling plate 1124. The inner cooling plate 1125 can be secured to the outer cooling plate 1124 using compression hardware 1116. The inner cooling plate 1125 is used to cool an integrated circuit component 1156. The outer cooling plate 1124 is used to cool a cable connector module 1104. For example, the outer cooling plate 1124 can be thermally coupled to the cable connector module 1104 via a thermal bridge defined by a bridging assembly 1134. When the load plate 1120 is secured to the cover assembly 1130, the load plate 1120 presses against the bridging assembly 1134. The load plate 1120 compresses the bridging assembly 1134 against the cable connector module 1104, and the cable connector module 1104 compresses the inserter contact 1200 of the inserter assembly 1108.

[0087] Figure 37 This is a perspective view of a part of the communication system 1100 during assembly. Figure 37 The load plate 1120 is shown, which is a single-piece cold plate instead of having an inner cold plate 1125 and an outer cold plate 1124 (as shown). Figure 36 (As shown).

[0088] Figure 38 This is a perspective view of a part of the communication system 1100 during assembly. Figure 37A load plate 1120 is shown as a heat sink 1121 instead of a cold plate. The heat sink 1121 includes heat dissipation fins 1123 on its top. Airflow channels are defined between the heat dissipation fins 1123. The heat sink 1121 is cooled by airflow flowing through the airflow channels to dissipate heat from the heat dissipation fins 1123.

Claims

1. An electronic component (1102), comprising: An electronic package (1106) includes a package substrate (1150) having an upper surface (1152) and a lower surface (1154), the electronic package includes an integrated circuit component (1156) electrically connected to the package substrate, the electronic package includes a lower package contact electrically connected to the integrated circuit component and configured to be electrically connected to a main circuit board (1110), and the electronic package includes an upper package contact (1166) electrically connected to the integrated circuit component. An inserter assembly (1108) electrically connected to the electronic package includes an array of inserter contacts (1200) that are compressible, each inserter contact having an upper mating interface (1226) and a lower mating interface (1128) that mates with a corresponding upper package contact, the inserter assembly defining a separable interface from the electronic package; A cable connector module (1104) is connected to the inserter assembly. Each cable connector module includes a cable connector module housing (1170) that holds a connector module base plate (1174). The cable connector module is configured to have a cable (1178) communicatively connected to the connector module base plate and extending from the cable connector module housing. The connector module base plate has a cable connector module contact (1188) that mates with an upper mating interface of a corresponding inserter contact. At least one cover assembly (1130) is coupled to the upper surface of the electronic package, the cover assembly including a cover (1132) having a plate (1140) and a wall (1142), the wall extending from the plate to form at least one connector module cavity (1144) configured to receive a corresponding cable connector module, the plate including at least one window (1146) associated with the at least one connector module cavity, the cover assembly including at least one bridging assembly (1134) received in the corresponding connector module cavity and extending through the corresponding window, each bridging assembly having a plurality of plates (1190) arranged as a plate stack (1192), the plates including an upper edge (1196) and a lower edge (1198), the lower edge engaging the cable connector module housing; and A compression hardware (1116) is connected to a load plate (1120) of the cover assembly. The load plate has a bottom surface that engages the upper edge of the plate of the bridging assembly. The load plate presses against the plate of the bridging assembly to drive the bridging assembly into the cable connector module using the compression hardware. When the load plate presses the plate of the bridging assembly into the cable connector module, the cable connector module compresses the inserter contacts of the inserter assembly.

2. The electronic component (1102) of claim 1, wherein the plate (1190) of the bridging component (1134) is thermally conductive, the plate transferring heat from the cable connector module (1104) to the load plate (1120).

3. The electronic component (1102) of claim 1, wherein the load plate (1120) is a cold plate with cooling channels, the bridging component (1134) is thermally connected between the cable connector module (1104) and the cold plate, the cold plate comprising an outer cold plate (1124) and an inner cold plate (1125), the inner cold plate being received in the outer cold plate and movable relative to the outer cold plate, the inner cold plate being compressible against the integrated circuit component (1156), and the outer cold plate holding the bridging component and being compressible against the cable connector module.

4. The electronic assembly (1102) of claim 3, wherein each bridging assembly (1134) includes a frame (1194) that holds a corresponding board (1190) in the board stack (1192), the frame being mounted to the board of the cover (1132), the board being movable relative to the frame and the cover.

5. The electronic component (1102) as claimed in claim 4, wherein the inner cooling plate (1125) and the outer cooling plate (1124) have different compressive forces.

6. The electronic component (1102) of claim 4, wherein the inner cooling plate (1125) and the outer cooling plate (1124) are capable of operating at different temperatures.

7. The electronic component (1102) of claim 1, wherein the load plate (1120) is a heat sink (1121) with heat dissipation fins (1123), and the bridging component (1134) is thermally connected between the cable connector module (1104) and the heat sink.

8. The electronic component (1102) of claim 1, wherein the cable (1178) of the cable connector module (1104) is an optical fiber cable, and the cable connector module includes an optical engine (1176) for communicatively connecting the optical fiber cable and the connector module substrate (1174).

9. A compression assembly (1114) for an electronic package (1106) in a communication system, the compression assembly comprising: At least one cover assembly (1130) is configured to be coupled to the upper surface (1152) of the electronic package via an inserter assembly (1108) and to a cable connector module (1104) coupled to the upper surface of the electronic package. Each cover assembly includes a cover having a plate (1140) and a wall (1142) extending from the plate to form at least one connector module cavity (1144), the at least one connector module cavity being configured to receive a corresponding cable connector module. The plate includes at least one window (1146) associated with the corresponding connector module cavity. A bridging assembly (1134) is received in a corresponding connector module cavity and extends through a corresponding window. Each bridging assembly has a plurality of plates (1190) arranged as a plate stack (1192), the plates including an upper edge (1196) and a lower edge (1198), the lower edge being configured to engage the cable connector module housing (1170). as well as A load plate (1120) is coupled to the at least one cover assembly using compression hardware that imparts a compressive force. The load plate has a bottom surface that engages the upper edge of the plate of the bridging assembly. The load plate presses against the plate of the bridging assembly by the compressive force to drive the bridging assembly into the cable connector module. The compressive force is configured to compress the inserter contact (1200) of the inserter assembly when the load plate presses the plate of the bridging assembly into the cable connector module.

10. The compression assembly (1114) of claim 9, wherein the plate (1190) of the bridging assembly (1134) is thermally conductive, the plate transferring heat from the cable connector module (1104) to the load plate (1120).

11. The compression assembly (1114) of claim 9, wherein the load plate (1120) is a cold plate with cooling channels, and the bridging assembly (1134) is thermally connected between the cable connector module (1104) and the cold plate.

12. The compression assembly (1114) of claim 11, wherein the electronic package includes an integrated circuit component (1156), the cold plate includes an outer cold plate (1124) and an inner cold plate (1125), the inner cold plate being received in the outer cold plate and movable relative to the outer cold plate, the inner cold plate being configured to compress against the integrated circuit component (1156), and the outer cold plate holding the bridging assembly (1134) and configured to compress against the cable connector module (1104).

13. The compression assembly (1114) of claim 12, wherein the inner cold plate (1125) and the outer cold plate (1124) have different compressive forces.

14. The compression assembly (1114) of claim 9, wherein the load plate (1120) is a heat sink (1121) with heat dissipation fins (1123), and the bridging assembly (1134) is thermally connected between the cable connector module (1104) and the heat sink.

15. The compression assembly (1114) of claim 9, wherein each bridging assembly (1134) includes a frame (1194) that holds a corresponding plate (1190) in the plate stack (1192), the frame being mounted to the plate of the cover, the plate being movable relative to the frame and the cover.

16. The compression assembly (1114) of claim 9 further includes a pad (1118) configured to be coupled to the electronic package, the cover being coupled to the pad by a fastener (1126), and the inserter assembly (1108) and the cable connector module (1104) being configured to be sandwiched between the pad and the cover.

17. The compression assembly (1114) of claim 9, wherein each cover (1132) includes a plurality of cable contact cavities (1172) and holds a plurality of bridging assemblies (1134) for cooperating with a plurality of inserter assemblies.

18. The compression assembly (1114) of claim 9, wherein the plate (1190) of the bridging assembly (1134) includes an upper plate and a lower plate (1190) that are movable relative to each other.

Images