An integrated device coupled to a stepped heat sink configured to provide shielding

Abstract

An assembly includes: a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a stepped heat sink coupled to the frame such that the stepped heat sink is located above the first integrated device and the second integrated device. The assembly may also include a shield coupled to the frame such that the shield is located between the frame and the stepped heat sink. The shield may include a stepped shield. The assembly may also include a heat pipe coupled to the stepped heat sink.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Non-Provisional Application No. 17 / 066,083, filed in the United States Patent and Trademark Office on October 8, 2020, and Provisional Application No. 62 / 923,108, filed in the United States Patent and Trademark Office on October 18, 2019, the entire contents of which are incorporated herein by reference as if fully set forth below and for all applicable purposes. Technical Field

[0003] Various features are directed to integrated devices implemented with heat sinks. Background Art

[0004] Figure 1 A first integrated device 110 and a second integrated device 120 coupled to a printed circuit board (PCB) 100 are illustrated. A first heat sink 112 is positioned on top of the first integrated device 110. The first heat sink 112 is configured to dissipate heat away from the first integrated device 110. A second heat sink 122 is positioned on top of the second integrated device 120. The second heat sink 122 is configured to dissipate heat away from the second integrated device 120. There continues to be a need to improve the performance of heat dissipation devices. Summary of the invention

[0005] Various features are directed to integrated devices implemented with heat sinks.

[0006] One example provides an assembly including: a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate, and a stepped heat sink coupled to the frame. The frame at least partially surrounds the first integrated device and the second integrated device. The stepped heat sink is located above the first integrated device and the second integrated device.

[0007] Another example provides an apparatus including a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate, and a component for heat dissipation coupled to the frame.

[0008] The components for heat dissipation are located on the first integrated device and the second integrated device. The frame at least partially surrounds the first integrated device and the second integrated device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Various features, properties and advantages will become apparent from the detailed description set forth below, taken in conjunction with the accompanying drawings, wherein like reference numerals are correspondingly identified throughout.

[0010] Figure 1 A cross-sectional view of a heat sink coupled to an integrated device is illustrated.

[0011] Figure 2 A view of an assembly including an integrated device, a stepped shield, a stepped heat sink, and a heat pipe is illustrated.

[0012] Figure 3 An assembly diagram of an assembly including an integrated device, a stepped shield, a stepped heat sink, and a heat pipe is illustrated.

[0013] Figure 4 A view of an assembly including an integrated device, a stepped shield, a stepped heat sink, and a heat pipe is illustrated.

[0014] Figure 5 An assembly diagram of an assembly including an integrated device, a stepped shield, a stepped heat sink, and a heat pipe is illustrated.

[0015] Figure 6 A view of an assembly including an integrated device, shield, stepped heat sink, and heat pipe is illustrated.

[0016] Figure 7 An assembly diagram of an assembly including an integrated device, shield, stepped heat sink, and heat pipe is illustrated.

[0017] Figure 8 A view of an assembly including an integrated device, a stepped shield, a stepped heat sink, and a heat pipe as implemented in a computer device is illustrated.

[0018] Figure 9-10 A graph showing the thermal performance of an assembly without and with a stepped heat sink is illustrated.

[0019] Fig.11 An exemplary sequence for manufacturing a stepped heat sink is illustrated.

[0020] Fig.12 An exemplary sequence for manufacturing a stepped shield is illustrated.

[0021] Figures 13A-13D An exemplary sequence for fabricating an assembly including an integrated device, a stepped shield, a stepped heat sink, and a heat pipe is illustrated.

[0022] Fig.14 An exemplary flow chart of a method for fabricating an assembly including an integrated device, a stepped shield, a stepped heat sink, and a heat pipe is illustrated.

[0023] Fig.15 Various electronic devices are illustrated that may integrate the dies, integrated devices, integrated passive devices (IPDs), passive components, packages, and / or device packages described herein. DETAILED DESCRIPTION

[0024] In the following description, specific details are given to provide a thorough understanding of various aspects of the present disclosure. However, it will be understood by those of ordinary skill in the art that these aspects can be practiced without these specific details. For example, circuits may be shown in block diagrams to avoid obscuring various aspects in unnecessary detail. In other cases, well-known circuits, structures, and techniques may not be shown in detail to avoid obscuring various aspects of the present disclosure.

[0025] The present disclosure describes an assembly comprising: a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate so that the frame at least partially surrounds the first integrated device and the second integrated device, and a stepped heat sink coupled to the frame so that the stepped heat sink is located above the first integrated device and the second integrated device. The assembly may also include a shield coupled to the frame so that the shield is located between the frame and the stepped heat sink. The shield may include a stepped shield. The stepped heat sink may be configured to provide shielding (e.g., electromagnetic interference shielding). The assembly may also include a heat pipe coupled to the stepped heat sink. As will be further described below, the stepped heat sink may be configured to help provide improved heat dissipation for the first integrated device and / or the second integrated device while also reducing the rate at which the surface temperature of the device including the assembly increases. Exemplary assembly including integrated devices and stepped heat sink

[0026] Figure 2 An assembly 200 including an integrated device and a stepped heat sink is shown. Figure 2 As shown in FIG, assembly 200 includes substrate 201, first integrated device 202, second integrated device 204, frame 207, shield 210, stepped heat sink 220, and heat pipe 230. As will be described in further detail below, first integrated device 202 is coupled to substrate 201, second integrated device 204 is coupled to substrate 201, frame 207 is coupled to substrate 201 so that frame 207 at least partially surrounds (e.g., laterally surrounds) first integrated device 202 and second integrated device 204, and stepped heat sink 220 is coupled to frame 207 so that stepped heat sink 220 is located above first integrated device 202 and second integrated device 204. Stepped heat sink 220 is configured to help dissipate heat from first integrated device 202 and from second integrated device 204.

[0027] Substrate 201 may be a laminate substrate. Substrate 201 may include interconnects (pads, traces, through holes) not shown. First integrated device 202 and second integrated device 204 are each coupled to a first surface of substrate 201. First integrated device 202 and second integrated device 204 may be coupled to an interconnect of substrate 201 via a plurality of solder interconnects and / or pillar interconnects. For example, second integrated device 204 is coupled to substrate 201 via a plurality of solder interconnects 203. A plurality of solder interconnects 203 may include a land grid array (LGA). First integrated device 202 and / or second integrated device 204 may include a die (e.g., a bare die). Integrated devices may include radio frequency (RF) devices, analog devices, passive devices, filters, capacitors, inductors, antennas, transmitters, receivers, surface acoustic wave (SAW) filters, bulk acoustic wave (BAW) filters, light emitting diode (LED) integrated devices, silicon (Si) based integrated devices, silicon carbide (SiC) based integrated devices, GaAs based integrated devices, GaN based integrated devices, memories, power management processors and / or combinations thereof.

[0028] Figure 3 An assembled view of assembly 200 is illustrated. Figure 2 and Figure 3 The first integrated device 202 is coupled to a first thermal interface material (TIM) 205. The first TIM 205 can be coupled to and / or located on a back side (e.g., a top side) of the first integrated device 202. The second integrated device 204 is coupled to a second thermal interface material (TIM) 206. The second integrated device 204 is coupled to and / or located on a back side (e.g., a top side) of the second integrated device 204.

[0029] The frame 207 is coupled to the first surface of the substrate 201. The frame 207 is coupled to the substrate 201 so that the frame 207 at least partially surrounds (e.g., laterally surrounds) the first integrated device 202 and the second integrated device 204. In some implementations, the frame 207 surrounds the first integrated device 202 and the second integrated device 204 so that the first integrated device 202 is located in the first compartment and the second integrated device 204 is located in the second compartment. The frame 207 may include a first opening above the first integrated device 202 and a second opening above the second integrated device 204. The frame 207 may include a conductive material. The frame 207 may be made of one component or may be made of multiple components. The frame 207 may be a continuous frame and / or an abutting frame.

[0030] The shield 210 is coupled to the frame 207 so that the shield 210 is located above the first integrated device 202 and the second integrated device 204. The shield 210 is configured to provide electromagnetic interference (EMI) shielding. The shield 210 can be a stepped shield. The shield 210 can be a component for shielding (e.g., EMI shielding). The shield 210 can be configured to be electrically coupled to the frame 207 so that both the shield 210 and the frame 207 are configured to provide shielding (e.g., EMI shielding). The shield 210 and / or the frame 207 can be configured to be coupled to ground.

[0031] The shield 210 includes a first shielding portion 210a, a second shielding portion 210b, and a third shielding portion 210c. The first shielding portion 210a, the second shielding portion 210b, and the third shielding portion 210c may be continuous and / or adjacent portions of the shield 210. In some implementations, the shield 210 may include separate portions. For example, in some implementations, at least two portions from the first shielding portion 210a, the second shielding portion 210b, and the third shielding portion 210c may be separate portions. Note that how the shield 210 is divided into a plurality of portions is arbitrary. Different implementations may divide the shield 210 into different portions and / or into different numbers of portions. These portions may have different shapes and / or sizes.

[0032] Figure 2 The shape and design of the shield 210 are illustrated such that the shield 210 comprises a stepped shield in which at least two surfaces facing the same direction (e.g., a horizontal surface, a surface substantially parallel to the back surface of the integrated device, a surface coupled to the TIM, a surface coupled to the frame, a surface coupled to the heat sink) are non-planar with respect to each other. For example, a first surface (e.g., a top surface) of a first shield portion 210a above a first integrated device 202 is non-planar with respect to a first surface (e.g., a top surface) of a second shield portion 210b above a second integrated device 204. Similarly, a second surface (e.g., a bottom surface) of the first shield portion 210a above the first integrated device 202 can be non-planar with respect to a second surface (e.g., a bottom surface) of the second shield portion 210b above the second integrated device 204. The shield 210 can be a stepped shield designed such that the stepped shield can be coupled to two non-planar surfaces. In some implementations, the two non-planar surfaces to which the stepped shield can be coupled are substantially parallel to each other.

[0033] like Figure 2 , Figure 4 and / or Figure 6As shown in and further described below, in some implementations, a second surface (e.g., bottom surface) of a first shield portion (e.g., 210a, 410a) coupled to a frame (e.g., 207, 407) and / or a first TIM 205 can be non-planar relative to a second surface (e.g., bottom surface) of a second shield portion 210b coupled to a second TIM 206.

[0034] exist Figure 2 , the first shield portion 210a is coupled to the third shield portion 210c, and the second shield portion 210b is coupled to the third shield portion 210c, such that the third shield portion 210c is located between the first shield portion 210a and the second shield portion 210b. The second shield portion 210b is non-planar relative to the first shield portion 210a. Figure 2 The shield 210 is also illustrated as including an opening over the first integrated device 202 .

[0035] The stepped heat sink 220 is coupled to the shield 210 and / or the first integrated device 202. Specifically, a portion of the stepped heat sink 220 is coupled to the shield 210 through the TIM 214, and another portion of the stepped heat sink 220 is coupled to the first integrated device 202 through the first TIM 205.

[0036] The stepped heat sink 220 may be configured to be electrically coupled to the frame 207 and / or the shield 210 such that the stepped heat sink 220, the shield 210, and / or the frame 207 are configured to provide shielding (e.g., EMI shielding). Components for shielding (e.g., components for EMI shielding) may include the stepped heat sink 220, the shield 210, and / or the frame 207. The stepped heat sink 220, the shield 210, and / or the frame 207 may be configured to be coupled to ground.

[0037] The stepped radiator 220 includes a first radiator portion 220a, a second radiator portion 220b, and a third radiator portion 220c. The stepped radiator 220 may be a component for heat dissipation. The first radiator portion 220a, the second radiator portion 220b, and the third radiator portion 220c may be continuous and / or adjacent portions of the stepped radiator 220. In some implementations, the stepped radiator 220 may include separated portions. For example, in some implementations, at least two portions from the first radiator portion 220a, the second radiator portion 220b, and the third radiator portion 220c may be separated portions. Note that how the stepped radiator 220 is divided into portions is arbitrary. Different implementations may divide the stepped radiator 220 into different portions and / or into different numbers of portions. These portions of the stepped radiator 220 may have different sizes and / or shapes.

[0038] The first heat sink portion 220a is coupled to the third heat sink portion 220c. The second heat sink portion 220b is coupled to the third heat sink portion 220c such that the third heat sink portion 220c is located between the first heat sink portion 220a and the second heat sink portion 220b, wherein the second heat sink portion 220b is non-planar relative to the first heat sink portion 220a.

[0039] Figure 2 The shape and design of the stepped heat sink 220 is illustrated such that at least two surfaces facing the same direction (e.g., horizontal surfaces, surfaces substantially parallel to the back surface of the integrated device, surfaces coupled to the TIM, surfaces coupled to the shield, surfaces coupled to the integrated) are non-planar with respect to each other. For example, a first surface (e.g., top surface) of a first heat sink portion 220a above a first integrated device 202 is non-planar with respect to a first surface (e.g., top surface) of a second heat sink portion 220b above a second integrated device 204. Similarly, a second surface (e.g., bottom surface) of a first heat sink portion 220a above a first integrated device 202 may be non-planar with respect to a second surface (e.g., bottom surface) of a second heat sink portion 220b above a second integrated device 204. The stepped heat sink 220 may be designed such that the stepped heat sink 220 may be coupled to two non-planar surfaces. In some implementations, the two non-planar surfaces to which the stepped heat sink 220 may be coupled are substantially parallel to each other.

[0040] like Figure 2 , Figure 4 and / or Figure 6 As shown in and further described below, in some implementations, a second surface (e.g., bottom surface) of a first heat sink portion (e.g., 220a, 420a, 620a) coupled to the first TIM 205, the gasket 212, the gasket 612, the first shield portion (210a, 410a), and / or the TIM 414 can be non-planar with respect to a second surface (e.g., bottom surface) of a second heat sink portion 220b coupled to the TIM 214 and / or the second shield portion (e.g., 210b, 410b).

[0041] The first heat sink portion 220a includes a protrusion 222 located above the first integrated device 202. The protrusion 222 can help reduce the thickness of the first TIM 205 between the first heat sink portion 220a and the first integrated device 202. The first heat sink portion 220a is coupled to the first TIM 205. The second heat sink portion 220b is located above the second integrated device 204. The second heat sink portion 220b is coupled to the TIM 214. The stepped heat sink 220 can be coupled to the shield 210 through the spacer 212. For example, the first heat sink portion 220a can be coupled to the first shield portion 210a through the spacer 212.

[0042] The stepped heat sink 220 can be configured to be electrically coupled to the shield 210. In some implementations, the stepped heat sink 220 can be configured to also provide shielding (e.g., EMI shielding). The stepped heat sink 220 can be configured to be electrically coupled to the shield 210 through the gasket 212. Thus, in some implementations, the gasket 212 can include an electrically conductive material. The stepped heat sink 220 can be configured to be coupled to ground.

[0043] Heat pipe 230 is coupled to stepped radiator 220. Heat pipe 230 can be a component for phase change heat dissipation. Heat pipe 230 can be a heat transfer device, which is configured to help heat dissipation through heat conduction and phase change. Heat pipe 230 can include liquid inside the shell of heat pipe 230. The liquid inside heat pipe 230 can circulate through liquid phase and steam to help heat dissipation. Heat pipe 230 is coupled to first radiator part 220a so that heat pipe 230 is located above first integrated device 202. The size and shape of heat pipe 230 make the top surface located at or below the top surface of second radiator part 220b. In some implementations, heat pipe 230 is located above first integrated device 202 because first integrated device 202 can be configured to generate more heat than second integrated device 204, and in this case, it may be more important, more critical, more relevant and / or more productive overall to dissipate heat from first integrated device 202 with the overall design of centralized components. In such a design, heat can still be dissipated from the second integrated device 204 .

[0044] As will be shown below Fig. 9 and Fig.10 As further illustrated and described in , the use of a stepped heat sink helps reduce the overall temperature (e.g., junction temperature) of an integrated device (e.g., a first integrated device, a second integrated device) by dissipating more heat from the integrated device. In addition, the use of plate 240 helps spread the heat over a larger area, thereby reducing the rate at which the temperature rises on the outer surface of the device including the component (e.g., 200).

[0045] Component 200 may be coupled to connector 250. Connector 250 is coupled to board 240. Board 240 may be a printed circuit board (PCB) and / or a system board. Connector 250 may be coupled to substrate 201 and / or an interconnect (e.g., a pin) of substrate 201. Connector 250 is configured to provide one or more electrical paths between substrate 201 and board 240. Component 200 or a portion of component 200 may be configured to operate as an M.2 module. Substrate 201 may be an M.2 compatible substrate. Substrate 201 may be a board.

[0046] Component 200 can be implemented in a device such as a computer device (e.g., a laptop computer, a tablet computer) such that the side of component 200 facing the substrate faces the front side of the device (e.g., a keyboard side, a screen side), and the side of component 200 facing the stepped heat sink faces the back side (e.g., a bottom side) of the device. Figure 2 The side of the assembly 200 facing the substrate (e.g., 201) is shown facing the keyboard side 260 of the device, while the side of the assembly 200 facing the stepped heat sink (e.g., 220) faces the bottom side 270 of the device. However, different implementations may implement the assembly in the device differently (e.g., different locations, different orientations, different configurations). The use of stepped heat sinks and / or stepped shields may be implemented when two or more integrated devices having different heights are used.

[0047] Figure 2 The sizes, dimensions, shapes, positions, and orientations of the various components shown in the drawings are exemplary and not necessarily drawn to scale. For example, the first integrated device 202 is shown as having a lower height than the second integrated device 204. In some implementations, the second integrated device 204 can be taller and / or larger. In addition, there may be other components that are not shown as parts of the assembly 200.

[0048] As mentioned above, Figure 3 2 shows an assembled view of the assembly 200. The assembly 200 can be coupled to the board 240. Figure 3 As shown in FIG. 1 , a first integrated device 202 and a second integrated device 204 are coupled to a substrate 201. The second integrated device 204 is coupled to the substrate 201 through a plurality of solder interconnects 203 (e.g., LGA). A first TIM 205 is coupled to a top portion (e.g., back side) of the first integrated device 202. A second TIM 206 is coupled to a top portion (e.g., back side) of the second integrated device 204. A frame 207 is configured to be coupled to the substrate 201 so that the frame 207 at least partially surrounds (e.g., laterally surrounds) the first integrated device 202 and the second integrated device 204.

[0049] The shield 210 includes an opening 310. The shield 210 is configured to be coupled to the frame 207 so that the shield 210 is located above the first integrated device 202 and the second integrated device 204. The opening 310 is located above the first integrated device 202 and the first TIM 205. The opening 310 is configured to allow coupling between the stepped heat sink 220 and the first integrated device 202. The shield 210 may be configured to be coupled to the second TIM 206.

[0050] The gasket 212 is configured to be coupled to the shield 210 (eg, to the first shield portion 210a). The TIM 214 is configured to be coupled to the shield 210 (eg, to the second shield portion 210b).

[0051] The stepped heat sink 220 is configured to be coupled to the first integrated device 202 through the first TIM 205. For example, the first heat sink portion 220a is configured to be coupled to the first TIM 205, and the first TIM 205 is coupled to the first integrated device 202. The stepped heat sink 220 is also configured to be coupled to the shield 210 (e.g., through the gasket 212 and / or the TIM 214). For example, the first heat sink portion 220a is configured to be coupled to the gasket 212, and the second heat sink portion 220b is configured to be coupled to the TIM 214.

[0052] The heat pipe 230 is configured to be coupled to the stepped heat sink 220 . In some implementations, the heat pipe 230 is configured to be coupled to the first heat sink portion 220 a such that the heat pipe 230 is located above the first integrated device 202 .

[0053] Various implementations may use various materials, parts, and / or accessories having various dimensions and / or properties. For example, the thermal interface material (TIM) may have a thermal conductivity value (k) in the range of approximately 1-3 Watts per meter Kelvin (W / (mk)). The shield 210 may have a thermal conductivity value (k) in the range of approximately 40-200 W / (mk). The stepped heat sink 220 may have a thermal conductivity value (k) in the range of approximately 200-400 W / (mk).

[0054] The first TIM 205 may have a thickness in the range of about 0.02-0.2 millimeters (mm). The second TIM 206 may have a thickness in the range of about 0.15-0.2 mm. The TIM 214 may have a thickness in the range of about 0.15-0.2 mm. The first heat sink portion 220a and / or the second heat sink portion 220b may have a thickness of about 0.5 mm. The heat pipe 230 may have a thickness of about 0.5 mm.

[0055] The first TIM 205 may include liquid grease. The second TIM 206 and / or TIM 214 may include a silicon-based thermal pad. The shield 210 may include a conductive material (eg, aluminum, iron, steel). The stepped heat sink 220 may include a conductive material (eg, Cu, gold, silver).

[0056] Note that the above dimensions and materials may apply to any of the components, TIMs, substrates, shields, heat sinks, and / or heat pipes described in this disclosure.

[0057] Example assembly including an integrated device and a stepped heat sink

[0058] As mentioned above, different implementations may include different configurations of components with integrated devices and stepped heat sinks. Figure 4 and Figure 5 Another assembly 400 is shown. Assembly 400 is similar to Figure 2 and Figure 3 Component 200 of, and therefore includes similar accessories and arrangements as, component 200.

[0059] like Figure 4 and Figure 5 As shown in FIG. 4 , assembly 400 includes substrate 201 , first integrated device 202 , second integrated device 204 , plurality of solder interconnects 203 , first TIM 205 , second TIM 206 , frame 407 , shield 410 , TIM 412 , TIM 214 , stepped heat sink 420 , and heat pipe 230 .

[0060] Frame 407 is similar to frame 207. Shield 410 is similar to shield 210. However, shield 410 does not include an opening (e.g., 310). TIM 412 is similar to TIM 214. Stepped heat sink 420 is similar to stepped heat sink 220. However, stepped heat sink 420 does not include an opening (e.g., 310). Figure 2 and Figure 3 The stepped heat sink 220 is shown with protrusions.

[0061] like Figure 4 and Figure 5 As shown in FIG. 4 , a first integrated device 202 and a second integrated device 204 are coupled to a substrate 201. The second integrated device 204 is coupled to the substrate 201 through a plurality of solder interconnects 203 (e.g., LGA). A first TIM 205 is coupled to a top portion (e.g., backside) of the first integrated device 202. A second TIM 206 is coupled to a top portion (e.g., backside) of the second integrated device 204. A frame 407 is configured to be coupled to the substrate 201 so that the frame 407 at least partially surrounds (e.g., laterally surrounds) the first integrated device 202 and the second integrated device 204.

[0062] The shield 410 is configured to be coupled to the frame 407 so that the shield 410 is located above the first integrated device 202 and the second integrated device 204. The shield 410 can be configured to be coupled to the first TIM 205 and the second TIM 206. The TIM 412 is configured to be coupled to the shield 410 (e.g., coupled to the first shield portion 410a). The TIM 214 is configured to be coupled to the shield 410 (e.g., coupled to the second shield portion 410b).

[0063] The stepped heat sink 420 is configured to be coupled to the first integrated device 202 through the TIM 412, the shield 410, and the first TIM 205. For example, the first heat sink portion 420a is configured to be coupled to the TIM 412, which is coupled to the shield 410. The shield 410 is coupled to the first TIM 205, which is coupled to the first integrated device 202. The second heat sink portion 420b is configured to be coupled to the TIM 214.

[0064] The heat pipe 230 is configured to be coupled to the stepped heat sink 420 . In some implementations, the heat pipe 230 is configured to be coupled to the first heat sink portion 420 a such that the heat pipe 230 is located above the first integrated device 202 .

[0065] Example assembly including an integrated device and a stepped heat sink

[0066] Figure 6 and Figure 7 Another assembly 600 is shown. Assembly 600 is similar to Figure 2 and Figure 3 Component 200 of, and therefore includes similar accessories and arrangements as, component 200.

[0067] like Figure 6 and Figure 7 As shown, assembly 600 includes substrate 201 , first integrated device 202 , second integrated device 204 , plurality of solder interconnects 203 , first TIM 205 , second TIM 206 , frame 607 , shield 610 , gasket 612 , TIM 214 , stepped heat sink 620 , and heat pipe 230 .

[0068] Frame 607 is similar to frame 207 . Shield 610 is similar to shield 210 . However, shield 610 is configured to be positioned over second integrated device 204 . Spacer 612 is similar to spacer 212 . Stepped heat sink 620 may be similar to stepped heat sink 420 .

[0069] like Figure 6 and Figure 7As shown in FIG. 6 , a first integrated device 202 and a second integrated device 204 are coupled to a substrate 201. The second integrated device 204 is coupled to the substrate 201 through a plurality of solder interconnects 203 (e.g., LGA). A first TIM 205 is coupled to a top portion (e.g., backside) of the first integrated device 202. A second TIM 206 is coupled to a top portion (e.g., backside) of the second integrated device 204. A frame 607 is configured to be coupled to the substrate 201 so that the frame 607 at least partially surrounds (e.g., laterally surrounds) the first integrated device 202 and the second integrated device 204.

[0070] The shield 610 is configured to be coupled to the frame 607 such that the shield 610 is located above the second integrated device 204. The shield 610 may be configured to be coupled to the second TIM 206.

[0071] The gasket 612 is configured to be coupled to the frame 607. The TIM 214 is configured to be coupled to the shield 610.

[0072] The stepped heat sink 620 is configured to be coupled to the first integrated device 202 through the first TIM 205. For example, the first heat sink portion 620a is configured to be coupled to the first TIM 205, which is coupled to the first integrated device 202. The stepped heat sink 620 is configured to be coupled to the shield 610. For example, the second heat sink portion 620b is configured to be coupled to the TIM 214, which is coupled to the shield 610.

[0073] The heat pipe 230 is configured to be coupled to the stepped heat sink 620 . In some implementations, the heat pipe 230 is configured to be coupled to the first heat sink portion 620 a such that the heat pipe 230 is located above the first integrated device 202 .

[0074] Figure 8 Device 800 is illustrated, which includes an assembly with an integrated device, a shield, and a stepped heat sink. Device 800 can be a computer device, such as a laptop or a tablet computer. Device 800 includes a housing 810 and a screen portion 820. Housing 810 is configured to store various accessories, such as components, boards, integrated devices, energy storage devices (e.g., batteries), storage devices (e.g., solid state devices (e.g., SSDs)). Housing 810 can include input / output devices, such as a keyboard.

[0075] like Figure 8 As shown in FIG. 8 , assembly 200 is implemented with device 800 such that the assembly is located within a housing 810 of device 800 . Figure 8The side of the component 200 facing the substrate (e.g., 201) is illustrated facing the keyboard side 260 of the device 800, while the side of the component 200 facing the stepped heat sink (e.g., 220) faces the bottom side 270 of the device 800. However, different implementations may implement the components in the device differently (e.g., different positions, different orientations, different configurations). In some implementations, the component 200 may be implemented in the screen portion 820 of the device 800. In this case, the side of the component 200 facing the substrate (e.g., 201) may face the screen side of the device 800, while the side of the component 200 facing the stepped heat sink (e.g., 220) may face the back side of the screen portion 820 of the device 800. Any component (e.g., 400, 600) described in the present disclosure may be implemented with the device 800 in a similar manner or in a different manner.

[0076] Fig. 9 and Fig.10 Graphs illustrating heat dissipation performance when using a non-stepped heat sink and when using a stepped heat sink are illustrated. Graph 900 illustrates the temperature distribution (e.g., junction temperature distribution) of an integrated device when a non-stepped heat sink is implemented with a device, the bottom surface temperature distribution of the device, and the top surface temperature distribution of the device (e.g., keyboard surface temperature distribution). Graph 1000 illustrates the temperature distribution (e.g., junction temperature distribution) of an integrated device (e.g., first integrated device 202) when a stepped heat sink (e.g., 220, 420, 620) is implemented with a device (e.g., 800), the bottom surface temperature distribution of the device, and the top surface temperature distribution (e.g., keyboard surface temperature distribution).

[0077] Graph 900 illustrates that within 40 seconds, the junction temperature of the integrated device has risen to approximately 80 degrees Celsius. In contrast, as shown in graph 1000, when a particular stepped heat sink is implemented, the junction temperature of the integrated device has risen to less than 70 degrees Celsius. Graph 900 illustrates that within 140 seconds, the top surface temperature (e.g., keyboard surface temperature) has reached 42 degrees Celsius (which is a normal skin temperature for a person). In contrast, as shown in graph 1000, when a particular stepped heat sink is implemented, the top surface temperature (e.g., keyboard surface temperature) does not reach 42 degrees Celsius until at least approximately 200 seconds. With a particular stepped heat sink, the integrated device may not need to be throttled until 200 seconds.

[0078] Fig.10The use of a stepped heat sink (e.g., 220, 420, 620) is illustrated to provide better heat dissipation of an integrated device (e.g., 202) while also reducing the rate at which the surface temperature of the device rises, thereby making the device more comfortable for a user of the device. It should be noted that the shield (e.g., 210, 410, 610), substrate 201, and / or plate 240 can be configured to help dissipate heat away from the integrated device and spread the heat over a larger area, which helps reduce the surface temperature of a device including the stepped heat sink, shield, substrate, and / or plate 240. As shown in FIG. Fig.10 As shown in , the particular design of the stepped heat sink used for the graph causes the temperature change at the top surface of the device to be approximately the same as the temperature change at the bottom surface of the device. However, different implementations of the stepped heat sink may provide different results in terms of how and where heat is dissipated from heat generating areas (e.g., areas including integrated devices).

[0079] Having described various assemblies having a shield and a stepped heat sink, a sequence for making the stepped heat sink and shield will now be described below.

[0080] Exemplary sequence for making a stepped heat sink

[0081] Fig.11 An exemplary sequence for providing or manufacturing a stepped heat sink is illustrated. In some implementations, Fig.11 The sequence can be used to provide or make Figure 2 and Figure 3 or any stepped heat sink described in this disclosure. However, Fig.11 The sequence can be used to make any stepped heat sink described in this disclosure.

[0082] It should be noted that Fig.11 The sequence of steps may combine one or more stages to simplify and / or clarify the sequence for providing or manufacturing a stepped heat sink. In some implementations, the order of the processes may be changed or modified. In some implementations, one or more processes may be replaced or substituted without departing from the spirit of the present disclosure. However, different implementations may manufacture stepped heat sinks differently.

[0083] Stage 1 illustrates a state after providing thermally conductive material 1100. Thermally conductive material 1100 may have a high thermal conductivity value (k) (e.g., 200 W / (mk) or higher), such as copper. Different implementations may use (multiple) different materials for thermally conductive material 1100. In some implementations, thermally conductive material 1100 may be an alloy.

[0084] Stage 2 illustrates a state after a portion 1102 of the thermally conductive material 1100 has been removed. A mechanical process may be used to remove the portion 1102. For example, a milling machine may be used to remove the portion 1102.

[0085] Stage 3 illustrates a state after portions 1104a and 1104b of thermally conductive material 1100 have been removed. Portions 1104a and 1104b may be removed using a mechanical process (e.g., a milling process). Figure 3 As shown in FIG. 2 , a protrusion 222 is formed in the stepped heat sink 220 .

[0086] In some implementations, a stamping process can be used to form the stepped heat sink 220. Depending on the material(s) used for the stepped heat sink (e.g., 220), a milling process or a stamping process can be used to manufacture the stepped heat sink. Examples of stamping processes are shown in FIG. Fig.12 are illustrated and described in. Fig.12 The stamping process may be used to manufacture the stepped heat sink (eg, 220). The stepped heat sink (eg, 220) may be a one-piece stepped heat sink or may include several parts to form the stepped heat sink.

[0087] Exemplary sequence for making a stepped shield

[0088] Fig.12 An exemplary sequence for providing or manufacturing a stepped shield is illustrated. In some implementations, Fig.12 The sequence can be used to provide or make Figure 2 and Figure 3 or any stepped shield described in this disclosure. However, Fig.12 The sequence can be used to make any of the stepped shields described in this disclosure.

[0089] It should be noted that Fig.12 The sequence of steps may combine one or more stages to simplify and / or clarify the sequence for providing or manufacturing a stepped shield. In some implementations, the order of the processes may be changed or modified. In some implementations, one or more processes may be replaced or substituted without departing from the spirit of the present disclosure. However, different implementations may manufacture stepped shields differently.

[0090] Stage 1 illustrates a state after providing the conductive material 1200. The conductive material 1200 may also be a thermally conductive material having a thermal conductivity value (k) of about 40 W / (mk) or higher. The conductive material 1200 may include a metal.

[0091] Stage 2 illustrates a state after portions 1202 (eg, 1202a, 1202b, 1202c) of the conductive material 1200 have been removed. Portions 1202 (eg, 1202a, 1202b, 1202c) may be removed using a mechanical process (eg, a stamping process).

[0092] Stage 3 illustrates a state after portions of material 1200 are folded to form first, second, and third shield portions 210a, 210b, and 210c. Shield portions 210a, 210b, and 210c may be formed using a mechanical process (eg, a stamping process).

[0093] Stage 4 illustrates a state after portions of material 1200 are further folded to form sidewalls of shield 210. In some implementations, a stamping process may be used to form the sidewalls. Different implementations may fold material 1200 differently. A shield (e.g., 210) may be a one-piece stepped shield or may include several parts to form a stepped shield. Example sequence for manufacturing an assembly including an integrated device, a stepped heat sink, and a shield

[0094] Figures 13A-13D An exemplary sequence for providing or manufacturing an assembly including a stepped heat sink and a shield is illustrated. In some implementations, Figures 13A-13D The sequence can be used to provide or make Figure 3 Component 200, or any component described in this disclosure.

[0095] It should be noted that Figures 13A-13D The sequence of steps may combine one or more stages to simplify and / or clarify the sequence for providing or manufacturing an assembly including a stepped heat sink and a shield. In some implementations, the order of the processes may be changed or modified. In some implementations, one or more processes may be replaced or substituted without departing from the spirit of the present disclosure. However, different implementations may manufacture the assembly differently.

[0096] like Fig.13A As shown in FIG. 1 , stage 1 illustrates a state after the first integrated device 202 and the second integrated device 204 are coupled to the substrate 201. The substrate 201 may be a laminate substrate. The first integrated device 202 and the second integrated device 204 may be coupled to the substrate 201 through a plurality of interconnects. For example, the second integrated device 204 may be coupled to the substrate 201 through a plurality of solder interconnects 203 (e.g., LGA).

[0097] Stage 2 illustrates a state after the first TIM 205 is coupled to the first integrated device 202 and the second TIM 206 is coupled to the second integrated device 204. The first TIM 205 may be disposed over the backside of the first integrated device 202 and the second TIM 206 may be disposed over the backside of the second integrated device 204.

[0098] Stage 3 illustrates a state after the frame 207 is coupled to the substrate 201. Solder and / or adhesive may be used to couple the frame 207 to the substrate 201. However, different implementations may use different processes and / or assemblies to couple the frame 207 to the substrate 201.

[0099] like Fig. 13B , stage 4 illustrates a state after the shield 210 is coupled to the frame 207. The shield 210 may be coupled to the frame 207 using solder and / or adhesive. However, different implementations may use different processes and / or accessories to couple the shield 210 to the frame 207. The shield 210 may be a stepped shield. The shield 210 is coupled to the frame 207 so that the first shield portion 210a is located above the first integrated device 202 and the second shield portion 210b is located above the second integrated device 204.

[0100] Stage 5 illustrates a state after substrate 201 is coupled to board 240. Board 240 may include a printed circuit board (PCB). Substrate 201 may be a part of assembly 200. As such, stage 5 may illustrate assembly 200 coupled to board 240. Substrate 201 and / or assembly 200 may be coupled to board 240 via connector 250. Connector 250 may be an M.2 module compatible connector. For example, substrate 201 may include an interconnect (e.g., pin) that may be coupled to connector 250.

[0101] like Fig. 13C As shown in FIG. 6 , stage 6 illustrates a state after the gasket 212 is coupled to the shield 210, and the TIM 214 is coupled to the shield 210. The gasket 212 is coupled to the first shield portion 210a and the TIM 214 is coupled to the second shield portion 210b.

[0102] Stage 7 illustrates a state after the heat pipe 230 is coupled to the stepped heat sink 220. The heat pipe 230 may be coupled to the first heat sink portion 220a.

[0103] like Fig.13D, stage 8 illustrates a state after the heat pipe 230 and the stepped heat sink 220 are coupled to the shield 210. The stepped heat sink 220 is coupled to the first TIM 205, the spacer 212, and the TIM 214. The first heat sink portion 220a is located above the first integrated device 202. The heat pipe 230 is located above the first integrated device 202. In some implementations, stage 8 may illustrate the assembly 200.

[0104] Exemplary flow chart of a method for manufacturing an assembly including an integrated device, a stepped heat sink, and a shield

[0105] In some implementations, manufacturing an assembly including a stepped heat sink and a shield includes several processes. Fig.14 An exemplary flow chart of a method 1400 for providing or manufacturing an assembly including a stepped heat sink and a shield is illustrated. Fig.14 The method 1400 may be used to provide or manufacture the Figure 2 and Figure 3 However, the method 1400 may be used to provide or manufacture any component described in the present disclosure.

[0106] It should be noted that Fig.14 One or more processes may be combined in order to simplify and / or clarify the method for providing or manufacturing an assembly including a stepped heat sink and a shield. In some implementations, the order of the processes may be changed or modified. In some implementations, one or more processes may be replaced or substituted without departing from the spirit of the present disclosure. Different implementations may manufacture the assembly differently.

[0107] The method couples (at 1405) the first integrated device 202 and the second integrated device 204 to the substrate 201. The substrate 201 may be a laminate substrate. The first integrated device 202 and the second integrated device 204 may be coupled to the substrate 201 via a plurality of interconnects. For example, the second integrated device 204 may be coupled to the substrate 201 via a plurality of solder interconnects 203 (e.g., LGA). Fig.13A Stage 1 illustrates and describes an example of an integrated device coupled to a substrate.

[0108] The method couples (at 1410) a first TIM 205 to a first integrated device 202 and a second TIM 206 to a second integrated device 204. The first TIM 205 may be disposed over a backside of the first integrated device 202 and the second TIM 206 may be disposed over a backside of the second integrated device 204. Fig.13A An example of a TIM coupled to an integrated device is illustrated and described in Stage 2 of FIG.

[0109] The method couples (at 1415) the frame 207 to the substrate 201. Solder and / or adhesive may be used to couple the frame 207 to the substrate 201. However, different implementations may use different processes and / or assemblies to couple the frame 207 to the substrate 201. Fig.13A An example of a frame coupled to a substrate is illustrated and described in Stage 3.

[0110] The method couples (at 1420) the shield 210 to the frame 207. Solder and / or adhesive may be used to couple the shield 210 to the frame 207. However, different implementations may use different processes and / or accessories to connect the shield 210 to the frame 207. The shield 210 may be a stepped shield. The shield 210 is coupled to the frame 207 so that the first shield portion 210a is located above the first integrated device 202 and the second shield portion 210b is located above the second integrated device 204. Fig. 13B Stage 4 of the drawings illustrates and describes an example of a shield coupled to a frame.

[0111] The method couples (at 1425) the assembly to board 240. The method may couple substrate 201 to board 240. Board 240 may include a printed circuit board (PCB). Substrate 201 may be part of assembly 200. Substrate 201 and / or assembly 200 may be coupled to board 240 via connector 250. Connector 250 may be an M.2 module compatible connector. Fig. 13B Stage 5 of the present invention illustrates and describes an example of components coupled to the board.

[0112] The method couples (at 1430) the shim 212 to the shield 210 and the TIM 214 to the shield 210. The shim 212 may be coupled to the first shield portion 210a and the TIM 214 may be coupled to the second shield portion 210b. Fig. 13C Stage 6 of FIG. 1 illustrates and describes an example of a gasket and a TIM coupled to a shield.

[0113] The method couples (at 1435) a heat pipe 230 to the stepped heat sink 220. The heat pipe 230 can be coupled to the first heat sink portion 220a. Fig. 13C Stage 7 of the present invention illustrates and describes an example of a heat pipe coupled to a stepped heat sink.

[0114] The method couples (at 1440) the heat pipe 230 and the stepped heat sink 220 to the shield 210. The stepped heat sink 220 can be coupled to the first TIM 205, the spacer 212, and the TIM 214. The first heat sink portion 220a can be located above the first integrated device 202. The heat pipe 230 can be located above the first integrated device 202. Fig.13DStage 8 illustrates and describes an example of a heat pipe and stepped heat sink coupled to a shield.

[0115] Exemplary Electronic Devices

[0116] Fig.15 Various electronic devices are illustrated that may be integrated with any of the above-described components, heat sinks, shields, heat pipes, devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, package stacks (PoP), system-in-package (SiP), or system-on-chip (SoC). For example, a mobile phone device 1502, a laptop computer device 1504, a fixed location terminal device 1506, a wearable device 1508, or a motor vehicle 1510 may include a device 1500 as described herein. For example, the device 1500 may be any device and / or package described herein. Fig.15 The electronic devices 1502, 1504, 1506, and 1508 and the vehicle 1510 illustrated in the device 1500 are exemplary only. Other electronic devices may also feature the device 1500, including but not limited to a group of devices (e.g., electronic devices) including: mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, devices supporting global positioning systems (GPS), navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units such as meter reading equipment, communication devices, smart phones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), or any other devices that store or retrieve data or computer instructions, or any combination thereof.

[0117] exist Figure 2-Figure 8 , Figure 11-Figure 12 , Figures 13A-13D and / or Figure 14-15 One or more of the components, processes, features, and / or functions illustrated in the drawings may be rearranged and / or combined into a single component, process, feature, or function, or embodied in several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from the present disclosure. It should also be noted that Figure 2-Figure 8 , Figure 11-Figure 12 , Figures 13A-13D and / or Figure 14-15 and its corresponding description in this disclosure are not limited to die and / or IC. In some implementations, Figure 2-Figure 8 , Figure 11-Figure 12 , Figures 13A-13D and / or Figure 14-15The invention and its corresponding description may be used to manufacture, create, provide and / or produce a device and / or an integrated device. In some implementations, the device may include a die, an integrated device, an integrated passive device (IPD), a die package, an integrated circuit (IC) device, a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, a heat sink and / or an interposer.

[0118] Note that the drawings in this disclosure may represent actual representations and / or conceptual representations of various components, accessories, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some cases, these drawings may not be drawn to scale. In some cases, for clarity, not all components and / or parts may be shown. In some cases, the position, location, size, and / or shape of various parts and / or components in the drawings may be exemplary. In some implementations, the various components and / or parts in the drawings may be optional.

[0119] The word "exemplary" is used herein to mean "serving as an example, instance or illustration". Any implementation or aspect described herein as "exemplary" is not necessarily to be construed as superior or advantageous to other aspects of the present disclosure. Likewise, the term "aspect" does not require that all aspects of the present disclosure include the features, advantages or modes of operation discussed. The term "coupled" is used herein to refer to a direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A is in physical contact with object B, and object B is in contact with object C, objects A and C can still be considered to be coupled to each other - even if they are not in direct physical contact with each other. The term "electrically coupled" may mean that two objects are coupled together directly or indirectly so that an electric current (e.g., a signal, power supply, ground) can propagate between the two objects. Two electrically coupled objects may or may not have an electric current propagating between the two objects. The use of the terms "first", "second", "third" and "fourth" (and / or anything greater than the fourth) is arbitrary. Any accessory described may be a first accessory, a second accessory, a third accessory or a fourth accessory. For example, an accessory referred to as a second accessory may be a first accessory, a second accessory, a third accessory or a fourth accessory. The term "encapsulate" means that an object can partially encapsulate or completely encapsulate another object. The term "surrounding" means that an object can partially surround or completely surround another object. The terms "top" and "bottom" are arbitrary. An accessory located at the top can be located above an accessory located at the bottom. A top accessory can be considered a bottom accessory and vice versa. As described in the present disclosure, a first accessory located "above" a second accessory can mean that the first accessory is located above or below the second accessory (e.g., depending on how the bottom or top is arbitrarily defined). In another example, the first accessory can be located above (e.g., above) a first surface of the second accessory, and the third accessory can be located above (e.g., below) a second surface of the second accessory, where the second surface is opposite to the first surface. Further note that the term "above" as used in the context of one accessory being located above another accessory in this application can be used to mean an accessory on and / or in another accessory (e.g., on the surface of the accessory or embedded in the accessory). Thus, for example, a first part being above a second part may mean that (1) the first part is above the second part, but not directly contacting the second part, (2) the first part is on (e.g., on a surface of) the second part, and / or (3) the first part is in (e.g., embedded in) the second part. A first part being "in" a second part may be partially in or completely in the second part. The term "about 'X value'" or "approximately X value" as used in this disclosure means within 10% of "X value". For example, a value of about 1 or approximately 1 would mean a value in the range of 0.9-1.1.

[0120] In some implementations, an interconnect is a device or packaged component or accessory that allows or facilitates electrical connection between two points, elements and / or accessories. In some implementations, the interconnect may include traces, vias, pads, pillars, metallization layers, redistribution layers and / or under bump metallization (UBM) layers / interconnects. In some implementations, the interconnect may include a conductive material that may be configured to provide an electrical path for a signal (e.g., a data signal), ground and / or power supply. The interconnect may include more than one element or accessory. The interconnect may be defined by one or more interconnects. The interconnect may include one or more metal layers. The interconnect may be part of a circuit. Different implementations may use different processes and / or sequences to form the interconnect. In some implementations, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, a spray coating and / or an electroplating process may be used to form the interconnect.

[0121] In addition, it should be noted that the various disclosures contained herein can be described as processes, which are depicted as flow charts, flow charts, structure diagrams, or block diagrams. Although flow charts can describe operations as sequential processes, many operations can be performed in parallel or simultaneously. In addition, the order of operations can be rearranged. A process terminates when its operations are completed.

[0122] Without departing from the present disclosure, the various features of the present disclosure described herein can be implemented in different systems. It should be noted that the above aspects of the present disclosure are merely examples and should not be interpreted as limiting the present disclosure. The description of the various aspects of the present disclosure is intended to be illustrative, rather than limiting the scope of the claims. Therefore, this teaching can be easily applied to other types of devices, and many substitutions, modifications and variations will be obvious to those skilled in the art.

Claims

1. An electronic device assembly, comprising: substrate; a first integrated device coupled to the substrate; a second integrated device coupled to the substrate; a frame made of a single piece comprising a conductive material, said frame being coupled to said substrate, wherein the frame at least partially surrounds the first integrated device and the second integrated device, wherein the frame is configured to provide a first compartment and a second compartment, wherein at least a portion of the frame is located between the first integrated device and the second integrated device, wherein the frame is coupled to the substrate such that the first integrated device is located in the first compartment of the frame and the second integrated device is located in the second compartment of the frame; a shield electrically coupled to at least a portion of the frame between the first integrated device and the second integrated device; wherein the shield and the frame are configured to provide electromagnetic interference (EMI) shielding between the first integrated device and the second integrated device; A stepped heat sink, coupled to the frame, wherein the stepped heat sink is located above the first integrated device and the second integrated device, The stepped radiator comprises: a first radiator portion; a third heat sink portion coupled to the first heat sink portion; and a second heat sink portion coupled to the third heat sink portion, and A heat pipe coupled to the stepped heat sink, wherein the heat pipe is located above the first integrated device and the first heat sink portion of the stepped heat sink, and The heat pipe and the second heat sink portion of the stepped heat sink are located in the same horizontal plane.

2. The assembly according to claim 1, wherein the third heat sink portion is located between the first heat sink portion and the second heat sink portion, The second radiator portion and the first radiator portion are located in different horizontal planes.

3. The assembly of claim 2, wherein the first heat sink portion, the second heat sink portion, and the third heat sink portion are contiguous portions and / or continuous portions.

4. The assembly of claim 2, wherein the first heat sink portion, the second heat sink portion, and the third heat sink portion comprise at least two separate portions.

5. The assembly of claim 1, wherein the shield is located between the frame and the stepped heat sink.

6. The assembly of claim 5, wherein the shield comprises a stepped shield.

7. The assembly of claim 6, wherein the stepped shield comprises: a first shielding portion; a third shielding portion coupled to the first shielding portion; and a second shielding portion coupled to the third shielding portion, wherein the third shielding portion is located between the first shielding portion and the second shielding portion, and The second shielding part and the first shielding part are located in different horizontal planes.

8. The assembly of claim 1, further comprising: A first thermal interface material TIM coupled to the first integrated device and the shield; and A second thermal interface material (TIM) is coupled to the second integrated device and the shield. 9 . The assembly of claim 8 , wherein the first thermal interface material (TIM) is further coupled to the stepped heat sink.

10. The assembly of claim 1, wherein the stepped heat sink is configured to provide electromagnetic interference (EMI) shielding.

11. The assembly of claim 1 further comprising a spacer coupled to the frame and the stepped heat sink.

12. The assembly of claim 1, wherein the first integrated device comprises a radio frequency (RF) device, a die, an integrated device, a passive device, a filter, a capacitor, an inductor, an antenna, a transmitter, a receiver, and / or combinations thereof.

13. The assembly of claim 1, wherein the assembly is implemented in a computer device such that a stepped heat sink side of the assembly faces a bottom side of the computer device and a base plate side of the assembly faces a keyboard side of the computer device.

14. The component of claim 1, wherein the component is incorporated into a specific device selected from the group consisting of: a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in an automobile.

15. An electronic device comprising: substrate; a first integrated device coupled to the substrate; a second integrated device coupled to the substrate; a frame made of a single assembly including a conductive material, the frame coupled to the substrate, wherein the frame at least partially surrounds the first integrated device and the second integrated device, wherein the frame at least partially surrounds the first integrated device and the second integrated device, wherein the frame is configured to provide a first compartment and a second compartment, wherein at least a portion of the frame is located between the first integrated device and the second integrated device, wherein the frame is coupled to the substrate such that the first integrated device is located in the first compartment of the frame and the second integrated device is located in the second compartment of the frame, a shielding member electrically coupled to at least a portion of the frame between the first integrated device and the second integrated device; wherein the shielding component and the frame are configured to provide electromagnetic interference (EMI) shielding between the first integrated device and the second integrated device; A component for heat dissipation, coupled to the frame, wherein the component for heat dissipation is located on the first integrated device and the second integrated device, The components for heat dissipation include: a first radiator portion; a third heat sink portion coupled to the first heat sink portion; and a second heat sink portion coupled to the third heat sink portion, and a component for phase change heat dissipation coupled to the component for heat dissipation, wherein the component for phase change heat dissipation is located above the first integrated device and the first heat sink portion of the component for heat dissipation, and The component for phase change heat dissipation and the second heat sink portion of the component for heat dissipation are located in the same horizontal plane.

16. The electronic device according to claim 15, wherein the third heat sink portion is located between the first heat sink portion and the second heat sink portion, and The second radiator portion and the first radiator portion are located in different horizontal planes. 17 . The electronic device according to claim 16 , wherein the first heat sink portion, the second heat sink portion, and the third heat sink portion are adjacent portions and / or continuous portions. 18 . The electronic device of claim 16 , wherein the first heat sink portion, the second heat sink portion, and the third heat sink portion include at least two separate portions.

19. The electronic device according to claim 15, wherein the member for shielding is located between the frame and the member for heat dissipation.

20. The electronic device of claim 19, wherein the means for shielding comprises a stepped shield.

21. The electronic device of claim 20, wherein the stepped shield comprises: a first shielding portion; a third shielding portion coupled to the first shielding portion; and a second shielding portion coupled to the third shielding portion, wherein the third shielding portion is located between the first shielding portion and the second shielding portion, and The second shielding part and the first shielding part are located in different horizontal planes.

22. The electronic device according to claim 15, further comprising: A first thermal interface material TIM coupled to the first integrated device and the component for shielding; and A second thermal interface material TIM is coupled to the second integrated device and the shielding component. 23 . The electronic device according to claim 22 , wherein the first thermal interface material (TIM) is further coupled to the component for heat dissipation.

24. The electronic device of claim 15, wherein the component for dissipating heat is further configured to provide electromagnetic interference (EMI) shielding.

25. The electronic device of claim 15, further comprising a spacer coupled to the frame and the means for dissipating heat.

26. The electronic device of claim 15, wherein the first integrated device comprises a radio frequency (RF) device, a die, an integrated device, a passive device, a filter, a capacitor, an inductor, an antenna, a transmitter, a receiver, and / or combinations thereof.

27. The electronic device according to claim 15, wherein the substrate, the first integrated device, the second integrated device, the frame and the component for heat dissipation are part of an assembly, wherein the electronic device comprises a computer device, and The stepped heat sink side of the component faces the bottom side of the computer device, and the base plate side of the component faces the keyboard side of the computer device.

28. The electronic device of claim 15, wherein the electronic device comprises a specific device selected from the group consisting of: a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in a car.

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