Wafer Laminator and Tray

Abstract

The embodiment of the present application provides a tray and a wafer laminator, the wafer laminator comprising: a machine body, including a working disk, the working disk having a working surface; a tray, movably arranged on the working surface; and a vacuum adsorption device, arranged on the side of the working disk away from the working surface, for adsorbing the wafer on the tray. The present application arranges a tray on the working disk to carry the wafer, so that the wafer and the working disk can be isolated, and the residue after lamination can be effectively prevented from adhering to the wafer and the working disk, and the damage caused by uneven force during the wafer removal process can be avoided, which greatly reduces the breakage rate of the wafer and is conducive to improving the lamination quality of the wafer. In addition, by arranging a tray, it is avoided that the film body remains on the working disk after the lamination process, the difficulty of cleaning the working disk is reduced, and the lamination efficiency of the wafer is greatly improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a tray and a wafer laminator. Background Art

[0002] Wafers must be laminated before subsequent exposure, development and other processes can be carried out. During the lamination process, a single chip is first placed on a substrate treated with a temporary bonding material or thermal release tape (TRT), and then overmolded and cured with an epoxy molding compound (EMC).

[0003] Currently, when a vacuum laminator is laminating wafers, the wafers are usually placed directly on a work plate to perform the laminating operation. After the lamination is completed, since the edge of the wafer and the work plate cannot completely match, part of the EMC will adhere to the edge of the wafer and remain on the work plate, causing the wafer to be easily damaged due to uneven force when it is taken out, and the working plate is difficult to clean, which reduces the laminating efficiency and quality of the wafer. Summary of the invention

[0004] The purpose of the present application is to provide a tray and a wafer laminating machine, which can prevent the edge of the wafer from sticking to the working plate after laminating, thereby improving the laminating efficiency and laminating quality of the wafer.

[0005] To this end, in a first aspect, an embodiment of the present application provides a wafer laminator, comprising: a machine body, comprising a working disk, the working disk having a working surface; a tray, movably arranged on the working surface; and a vacuum adsorption device, arranged on a side of the working disk away from the working surface, for adsorbing the wafer on the tray.

[0006] In a possible implementation, the tray includes a tray body and a limiting portion disposed on the tray body, and the tray body and the limiting portion form a containing space for containing wafers.

[0007] In a possible implementation, the limiting portion includes a flat-edge limiting protrusion, the wafer includes a positioning plane, and the flat-edge limiting protrusion includes a limiting plane that matches the positioning plane.

[0008] In a possible implementation, the limiting portion further includes an arc-shaped limiting protrusion, the wafer further includes an arc-shaped surface connected to the positioning plane, and the arc-shaped limiting protrusion includes a limiting arc-shaped surface that cooperates with the arc-shaped surface.

[0009] In a possible implementation, the number of the arc-shaped limiting protrusions is three, and the three arc-shaped limiting protrusions and the flat-edge limiting protrusions are arranged at intervals along the circumferential direction of the tray body.

[0010] In a possible implementation, the height of the limiting portion is equal to or greater than the thickness of the wafer.

[0011] In a possible implementation, the tray body is further provided with a plurality of first through holes, and the plurality of first through holes are arranged in a circular array around the center of the tray body;

[0012] A plurality of concentrically arranged annular grooves are arranged on the working surface of the working disk, a plurality of second through holes corresponding to the plurality of first through holes are arranged in the plurality of annular grooves, and the plurality of second through holes are connected to the vacuum adsorption device.

[0013] In a possible implementation, a positioning boss is further provided on a side of the tray body facing away from the limiting portion.

[0014] In a possible implementation, a driving device is also included, which includes a power source and a push rod connected to the output end of the power source, and one end of the push rod away from the power source passes through the working disk and abuts against the tray to drive the tray to approach or move away from the working surface.

[0015] In a second aspect, an embodiment of the present application further provides a tray, comprising a tray body and a limiting portion arranged on the tray body, wherein the tray body and the limiting portion form a accommodating space for accommodating wafers.

[0016] According to the wafer laminator and tray provided in the embodiment of the present application, by arranging a movable tray on the working disk to carry the wafer, the wafer can be isolated from the working disk, effectively preventing the residue after laminating from adhering to the wafer and the working disk. When taking out the wafer, the ejector rod does not directly contact the wafer, but pushes the wafer out through the tray, so that the wafer is evenly stressed. Moreover, the tray is made of metal material and has a higher structural strength, which can effectively avoid the occurrence of damage caused by uneven force during the wafer removal process, greatly reducing the breakage rate of the wafer, which is conducive to improving the laminating quality of the wafer. In addition, by setting up a tray, it is avoided that the film body remains on the working disk after the laminating process, reducing the difficulty of cleaning the working disk, and greatly improving the laminating efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In addition, in the drawings, the same components are marked with the same reference numerals, and the drawings are not drawn according to the actual scale.

[0018] Figure 1 A partial structural schematic diagram of a wafer laminator provided in an embodiment of the present application is shown;

[0019] Figure 2 A schematic diagram of the three-dimensional structure of a tray provided in an embodiment of the present application is shown;

[0020] Figure 3 A schematic diagram of a top view of a tray provided in an embodiment of the present application is shown;

[0021] Figure 4 A schematic diagram of the bottom view of a tray provided in an embodiment of the present application is shown;

[0022] Figure 5 A schematic diagram showing the working process of the wafer laminator provided in an embodiment of the present application is shown.

[0023] Description of reference numerals:

[0024] W, wafer; W1, limiting plane; W2, arc surface;

[0025] 1. tray; 11. tray body; 111. first through hole; 12. limiting portion; 121. flat-edge limiting protrusion; 121a. limiting plane; 122. arc-shaped limiting protrusion; 122a. limiting arc-shaped surface; 13. positioning boss;

[0026] 2. Machine body; 21. Working disk; 22. Working surface; 23. Annular groove; 231. Second through hole;

[0027] 3. Driving device; 31. Power source; 32. Push rod. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] Figure 1 A partial structural schematic diagram of a wafer laminator provided in an embodiment of the present application is shown.

[0030] like Figure 1 As shown, an embodiment of the present application provides a wafer laminator, comprising: a tray 1, a body 2, and a vacuum adsorption device (not shown in the figure).

[0031] The tray 1 includes a tray body 11 and a limiting portion 12 disposed on the tray body 11, and the tray body 11 and the limiting portion 12 form a storage space for accommodating the wafer W. Optionally, the tray body 11 is made of metal, such as aluminum alloy, and the shape of the tray body 11 is circular, and the inner circle size of the tray body 11 is consistent with the outer circle size of the wafer W, so that the tray body 11 and the wafer W have a higher fit. The limiting portion 12 can limit the movement of the wafer W on the tray body 11, thereby improving the positioning accuracy of the wafer W.

[0032] The machine body 2 includes a working plate 21, and the working plate 21 has a working surface 22. The tray 1 is movably arranged on the working surface 22.

[0033] The vacuum adsorption device is disposed on a side of the working plate 21 away from the working surface 22 , and is used to adsorb the wafer W onto the tray 1 .

[0034] The vacuum adsorption device uses atmospheric pressure as a force. In the closed cavity formed between the wafer W, the tray 1 and the working disk 21, a certain amount of gas molecules are extracted through a vacuum source to reduce the pressure, so that a pressure difference is formed between the tray 1 and the wafer W and between the tray 1 and the working disk 21. Under the action of this pressure difference, the wafer W is adsorbed on the tray 1. When the vacuum adsorption device is started, a negative pressure is generated between the tray 1 and the wafer W, and the wafer W is adsorbed on the tray 1. The vacuum adsorption setting method allows the wafer W to be easily and quickly set on the tray 1. When the vacuum adsorption device is turned off or air is blown in the opposite direction to the closed cavity, the wafer W can be removed from the tray 1. The operation is simple and reliable, and the wafer lamination efficiency is improved.

[0035] In the related art, a substrate treated with a temporary bonding material or a thermal release tape (TRT) is laid on the working surface 22 of the working plate 21, and then a single chip is directly placed on the substrate of the working surface 22, and then an epoxy molding compound (EMC) is used to overmold and cure to complete the lamination process to form a wafer W. After the lamination operation is completed, the EMC will remain on the working plate 21 and adhere to the edge of the wafer W. When the wafer W is removed from the working plate 21, it is easy to cause the wafer W to be damaged due to uneven force.

[0036] In the embodiment of the present application, a movable tray 1 is arranged on the working disk 21, and the wafer W is adsorbed on the tray 1 through a vacuum adsorption device. After the lamination is completed, the excess EMC film is cut off, so that the residual EMC film is prevented from adhering to the working disk 21 and adhering to the wafer W. When the wafer W is taken out, the ejector rod 32 does not directly contact the wafer W, but pushes the wafer W out through the tray 1, so that the force on the wafer W is uniform. Moreover, the tray 1 is made of metal and has a higher structural strength. It can effectively prevent the wafer W from being damaged due to uneven force caused by the adhesion of the lamination residue during the removal process, greatly reducing the breakage rate of the wafer W and improving the lamination quality of the wafer W.

[0037] In addition, in the related art, each time the lamination operation of a wafer is completed, the working plate 51 needs to be cleaned, otherwise the risk of wafer 4 breaking will increase. In the present application, by setting a tray 1 on the working plate 21 to carry the wafer W, the wafer W is prevented from directly contacting the working plate 21, and the wafer W can be isolated from the working plate 21 to prevent the residual EMC film from adhering to the working plate 21, which greatly reduces the cleaning times of the working plate 21. In addition, the working plate 21 is set on the machine body 2, and the production needs to be suspended to clean the working plate 21, and the work cannot be continued, which seriously affects the lamination efficiency of the wafer W.

[0038] In the present application, since the tray 1 and the working disk 21 are movably connected, and the wafer W is in direct contact with the tray 1, after the lamination operation of the wafer W is completed, the tray 1 can be disassembled and cleaned, and multiple trays 1 can be made. When cleaning the tray 1, it is only necessary to replace the tray 1 to be cleaned with a clean tray 1 to continue working, which does not affect the lamination operation, greatly improves the lamination efficiency, and reduces the abnormal risk rate of the wafer W. In order to prevent part of the EMC from adhering to the non-working surface of the working disk 21 during the lamination process, the working disk 51 can be cleaned once, for example, after completing the lamination operation of a batch of 25 wafers W, thereby further improving the lamination quality of the wafer W while improving the lamination efficiency.

[0039] According to the wafer laminator and tray 1 provided in the embodiment of the present application, by setting a movable tray 1 on the working disk 21 to carry the wafer W, the wafer W can be isolated from the working disk 21, effectively preventing the residue after lamination from adhering to the wafer W and the working disk 21. When taking out the wafer W, the ejector 32 does not directly contact the wafer W, but pushes the wafer W out through the tray 1, so that the force on the wafer W is uniform. Moreover, the tray 1 is made of metal material and has a higher structural strength, which can effectively avoid the occurrence of damage to the wafer W due to uneven force during the removal process, greatly reduce the breakage rate of the wafer W, and help improve the lamination quality of the wafer W. In addition, by setting the tray 1, it is avoided that the film body remains on the working disk 21 after the lamination process, the difficulty of cleaning the working disk 21 is reduced, and the lamination efficiency of the wafer W is greatly improved.

[0040] The specific structure of the tray provided in the embodiment of the present application is further described in detail below with reference to the accompanying drawings.

[0041] Figure 2 A schematic diagram of the three-dimensional structure of a tray provided in an embodiment of the present application is shown. Figure 3 A schematic diagram of the top structure of a tray provided in an embodiment of the present application is shown.

[0042] like Figure 2 and Figure 3As shown, in some embodiments, the limiting portion 12 includes a flat-edge limiting protrusion 121 , the wafer W includes a positioning plane W1 , and the flat-edge limiting protrusion 121 includes a limiting plane 121 a that matches the positioning plane W1 .

[0043] The positioning plane W1 serves as a positioning reference for the wafer W. By fitting the positioning plane W1 with the limiting plane 121a of the flat-edge limiting protrusion 121, the wafer W can be initially positioned on the tray 1 to prevent the wafer W from rotating on the tray body 11, thereby avoiding affecting the lamination quality and lamination effect of the wafer W.

[0044] like Figure 2 and Figure 3 As shown, in some embodiments, the limiting portion 12 further includes an arc-shaped limiting protrusion 122 , the wafer W further includes an arc-shaped surface W2 connected to the positioning plane W1 , and the arc-shaped limiting protrusion 122 includes an arc-shaped limiting surface 122 a matching the arc-shaped surface W2 .

[0045] The inner circumference of the arc-shaped limiting protrusion 122 is provided with a limiting arc-shaped surface 122a, and the outer circumference of the wafer W includes an arc-shaped surface W2 connected to the positioning plane W1. The limiting arc-shaped surface 122a is in contact with the arc-shaped surface W2 of the wafer W, further limiting the movement of the wafer W on the tray body 11. Thus, the flat-edge limiting protrusion 121 and the arc-shaped limiting protrusion 122 of the limiting portion 12 work together to prevent the wafer W from moving and rotating on the tray body 11, thereby improving the positioning accuracy of the wafer W on the tray body 11 and improving the lamination quality of the wafer W.

[0046] In an optional example, the number of the arc-shaped limiting protrusion 122 is one, and the arc-shaped limiting protrusion 122 is spaced apart from the flat edge limiting protrusion 121. The arc-shaped limiting protrusion 122 and the flat edge limiting protrusion 121 enclose an area for accommodating the wafer W, and the spaced position between the arc-shaped limiting protrusion 122 and the flat edge limiting protrusion 121 is used to take out the wafer W, so that the area of ​​the tray 1 not covered by the wafer W can be greatly reduced, thereby reducing the residual film EMC adhering to the tray 1.

[0047] In another optional example, the number of the arc-shaped limiting protrusions 122 is three, and the three arc-shaped limiting protrusions 122 and the flat-edge limiting protrusions 121 are arranged at intervals along the circumferential direction of the tray body 11. The three arc-shaped limiting protrusions 122 and one flat-edge limiting protrusion 121 of the limiting portion 12 are located on the same circumference, so that the space surrounded by the three limiting arc surfaces 122a and one limiting plane 121a can better accommodate the wafer W, thereby improving the positioning accuracy of the wafer W on the tray body 11.

[0048] It should be noted that the number of the arc-shaped limiting protrusions 122 is not limited to three. On the premise of ensuring the positioning accuracy of the wafer W, the number of the arc-shaped limiting protrusions 122 can be set to any number according to actual conditions, which will not be elaborated herein.

[0049] In some embodiments, the height of the limit portion 12 is equal to or greater than the thickness of the wafer W. This arrangement can prevent the wafer W from falling off the tray body 1 during the film pressing process. In an optional example, the height of the limit portion 12 is 0.5 mm. That is, the height of the flat edge limit protrusion 121 and the arc-shaped limit protrusion 122 are both 0.5 mm. In an optional example, the maximum width of the flat edge limit protrusion 121 and the arc-shaped limit protrusion 122 are both 0.5 mm, so as to reduce the space occupied by the tray 1, while being able to reduce the residual film EMC adhering to the tray 1, and reducing the difficulty of cleaning the tray 1.

[0050] In some embodiments, the tray body 11 is further provided with a plurality of first through holes 111 , and the plurality of first through holes 111 are arranged in a circular array around the center of the tray body 11 .

[0051] Furthermore, a plurality of concentrically arranged annular grooves 23 are provided on the working surface 22 of the working disk 21 , a plurality of second through holes 231 corresponding to the plurality of first through holes 111 are provided in the plurality of annular grooves 23 , and the plurality of second through holes 231 are connected to the vacuum adsorption device.

[0052] The rings where the multiple first through holes 111 are located correspond to the multiple annular grooves 23 respectively, and the first through holes 111 located on the same ring correspond to the second through holes 231 in the corresponding annular grooves 23 one by one, and the diameter of the first through holes 111 is not greater than the width of the annular grooves 23. The vacuum adsorption device is connected to the second through holes 231 in the annular grooves 23. When the vacuum adsorption device is started, the gas adsorbs the tray 1 on the working surface 22 through the annular grooves 23, and the gas also adsorbs the wafer W on the tray 1 through the first through holes 111. By setting the annular grooves 23, the first through holes 111 and the second through holes 231 still have a vacuum adsorption effect when they are not in a completely aligned position. The vacuum adsorption method can easily and quickly position the wafer W on the tray 1, improve the working efficiency of the wafer W, and the adsorption force on the wafer W is uniform, and the position of the wafer W remains stable, ensuring that the wafer W will not rotate or move during the film pressing process, thereby improving the film pressing quality of the wafer W.

[0053] Optionally, the diameter of the first through hole 111 may be, for example, 1 mm. The plurality of first through holes 111 are arranged in a circular array. Without affecting the structural strength of the tray body 11 , the diameter of the first through holes 111 may be increased to reduce the weight of the tray body 11 .

[0054] In order to enable the wafer W to be quickly placed on or removed from the tray 1, the wafer laminating machine provided in the embodiment of the present application also includes a driving device 3, the driving device 3 includes a power source 31 and a push rod 32 connected to the output end of the power source 31, and the end of the push rod 32 away from the power source 31 passes through the working disk 21 and abuts against the tray 1 to drive the tray 1 close to or away from the working disk 21.

[0055] like Figure 1 As shown, in an optional example, a guide hole allowing a push rod 32 to pass through is provided on the working disk 21, and one end of the push rod 32 away from the power source 31 abuts against the tray 1 to drive the tray 1 to reciprocate along the axial direction of the push rod 32, thereby approaching or moving away from the working disk 21.

[0056] Optionally, the power source 31 is any one of a motor, a cylinder and a hydraulic cylinder, and any power machine that can drive the push rod 32 to perform linear reciprocating motion can be used as the power source.

[0057] When lamination is completed, the power source 31 drives the ejector pin 32 to lift the tray 1 to move the wafer W away from the working disk 21, so as to facilitate the removal of the lamination wafer W. When lamination is performed again, the power source 31 drives the ejector pin 32 to move the tray 1 toward the working disk 21, so as to restore the tray 1 to its original position.

[0058] Optionally, there are three push rods 32, which are arranged in a circular array along the circumferential direction of the working plate 21. With such an arrangement, the tray 1 can be evenly stressed, thereby improving the lamination quality of the wafer W.

[0059] It is understandable that the number of the push rods 32 is not limited to three. The number of the push rods 32 can be any value as long as the force on the tray 1 is uniform. Obviously, the number of the guide holes should be the same as the number of the push rods 32.

[0060] like Figure 4 As shown, in some embodiments, a positioning boss 13 is further provided on the side of the tray body 11 away from the limiting portion 12, and the height of the positioning boss 13 is less than 2 mm. The position of the positioning boss 13 corresponds to the position of the ejector pin 32, and the number of the positioning boss 13 is the same as the number of the ejector pin 32. The ejector pin 32 passes through the guide hole of the working disk 21 and is connected to the positioning boss 13 of the tray body 11. When film pressing is required, the ejector pin 32 moves toward the direction close to the working disk 21 and retracts into the guide hole of the working disk 21. At this time, the positioning boss 13 is embedded in the guide hole of the working disk 21 to play a positioning role. When the positioning boss 13 cooperates with the guide hole of the working disk 21, the first through hole 111 is aligned with the second through hole 231, so that the vacuum adsorption effect reaches the best state.

[0061] When the power source 31 drives the push rod 32 to move the tray 1 to the extreme position in the direction close to the working disk 21, the first through hole 111 located on the same ring is aligned with the second through hole 231 in the corresponding annular groove 23, and the wafer W is adsorbed onto the tray 1 by the vacuum adsorption device for film pressing. When the power source 31 drives the push rod 32 to move the tray 1 to the extreme position in the direction away from the working disk 21, the wafer W can be taken out from the tray 1. In this way, the tray 1 can be placed on the working disk 21 instead of manually, which saves manpower, enables the tray 1 to be quickly and accurately raised and lowered relative to the working disk 21, and at the same time, the adsorption effect of the vacuum adsorption device is optimized.

[0062] like Figure 5 As shown, the working process of the wafer molding machine provided in the embodiment of the present application is as follows:

[0063] Step S1: placing a tray 1 on the working surface 22 of the working plate 21, then placing a wafer W on the tray 1, and starting a vacuum adsorption device so that the wafer W is vacuum adsorbed on the tray 1;

[0064] Step S2: Covering the EMC film onto the wafer W, laminating the wafer W, and cutting off the excess film after laminating;

[0065] Step S3: turn off the vacuum adsorption device, start the power source 31 of the driving device 3, drive the push rod 32 to drive the tray 1 to move away from the working plate 21, and after the tray 1 leaves the working surface 22 and reaches a predetermined position, remove the tray 1 and the wafer W;

[0066] Step S4: the power source 31 drives the push rod 32 to retract toward the working disk 21, and the tray 1 is placed back on the working disk 21, completing a film pressing cycle.

[0067] Therefore, the tray and wafer pressing machine provided in the embodiment of the present application can isolate wafer W from the working disk 21 by arranging the tray 1 on the working disk 21 to carry wafer W, effectively prevent the residue after film pressing from adhering to wafer W and working disk 21, avoid the occurrence of damage caused by uneven force during the removal of wafer W, greatly reduce the breakage rate of wafer W, and improve the film pressing quality of wafer W. In addition, by arranging the tray 1, it can be avoided that the film body remains on the working disk 21 after the film pressing process, and the difficulty of cleaning the working disk 21 is reduced. By arranging the flat-edge limiting protrusion 121 and the arc-shaped limiting protrusion 122 on the tray 1, the wafer W can be firmly positioned on the tray 1, and through the first through hole 111 set on the tray 1 and the second through hole 231 set on the working disk 21, the wafer W can be easily and quickly positioned on the tray 1 by vacuum adsorption, thereby improving the efficiency of film pressing.

[0068] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0069] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0070] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0071] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer laminator, characterized in that: include: A machine body, comprising a working disk, wherein the working disk has a working surface; A tray, detachably connected to the work surface; as well as A vacuum adsorption device, arranged on a side of the working plate away from the working surface, for adsorbing the wafer on the tray; The tray comprises a tray body and a limiting portion arranged on the tray body, wherein the tray body and the limiting portion form a storage space for storing wafers; The limiting portion includes a flat-edge limiting protrusion, the wafer includes a positioning plane, and the flat-edge limiting protrusion includes a limiting plane matched with the positioning plane; The wafer laminator also includes a driving device, which includes a power source and a push rod connected to the output end of the power source. The end of the push rod away from the power source passes through the working disk and abuts against the tray to drive the tray to approach or move away from the working surface.

2. The wafer laminator according to claim 1, characterized in that: The limiting portion further includes an arc-shaped limiting protrusion, the wafer further includes an arc-shaped surface connected to the positioning plane, and the arc-shaped limiting protrusion includes a limiting arc-shaped surface matched with the arc-shaped surface.

3. The wafer laminator according to claim 2, characterized in that: The number of the arc-shaped limiting protrusions is three, and the three arc-shaped limiting protrusions and the flat-edge limiting protrusions are arranged at intervals along the circumferential direction of the tray body.

4. The wafer laminator according to claim 1, characterized in that: The height of the limiting portion is equal to or greater than the thickness of the wafer.

5. The wafer laminator according to claim 1, characterized in that: The tray body is also provided with a plurality of first through holes, and the plurality of first through holes are arranged in a circular array around the center of the tray body; The working surface is provided with a plurality of concentrically arranged annular grooves, the plurality of annular grooves are provided with a plurality of second through holes corresponding to the plurality of first through holes one by one, and the plurality of second through holes are connected to the vacuum adsorption device.

6. The wafer laminator according to claim 1, characterized in that: A positioning boss is also provided on a side of the tray body away from the limiting portion.

7. A tray used for the wafer laminator according to claim 1, characterized in that: The tray comprises a tray body and a limiting portion arranged on the tray body, wherein the tray body and the limiting portion form a storage space for storing wafers; The limiting portion includes a flat-edge limiting protrusion, the wafer includes a positioning plane, and the flat-edge limiting protrusion includes a limiting plane matched with the positioning plane; The limiting portion further includes an arc-shaped limiting protrusion, the wafer further includes an arc-shaped surface connected to the positioning plane, and the arc-shaped limiting protrusion includes a limiting arc-shaped surface matched with the arc-shaped surface.

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