Semiconductor package fixing device

Abstract

The application discloses a semiconductor packaging fixing device, which comprises a base and a support, the base is provided with a cushion block, the support is provided with a pressing plate, and the pressing plate and the base are fixed to connect the support and the cushion block. The semiconductor packaging fixing device provided by the application is designed by the cushion block and the pressing plate, a plurality of fixing structures are arranged on the cushion block and the pressing plate to more firmly fix the support, the pressing plate is prevented from pressing the line arc due to improper placement of the support, the pressing effect of the support in the process of pushing and pulling force is improved, and the accuracy of data is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, and particularly relates to a semiconductor packaging fixing device. BACKGROUND

[0002] In a semiconductor packaging process, a patching procedure refers to fixing a chip on a support through tin paste (silver glue), and then completing the fixation of the chip through reflow soldering and cleaning; a wire binding procedure refers to respectively welding two ends of a lead wire on a chip pad and a lead wire support or a PCB board through ultrasonic pressurization at a certain temperature, so as to realize the connection between an internal circuit of the chip and an external circuit. Among them, the firmness of the chip fixation and the firmness of the wire binding are particularly important. Therefore, the patching and wire binding effects must be tested by using a push-pull force testing machine.

[0003] The steps of the push-pull force testing are placing a product to be tested on a testing fixture, then pressing by a pressing plate, and then selecting a suitable testing cutter to perform corresponding testing. The firmness of the product to be tested fixed will directly affect the testing result.

[0004] However, the general fixture and the pressing plate have poor fixation effect, and the chip or the support will be offset or floated every time the testing is performed, which greatly affects the testing result. SUMMARY

[0005] To solve the technical problem of the general semiconductor packaging fixing device mentioned in the background art that is easy to deform and has poor fixation effect, the present application provides a semiconductor packaging fixing device, which avoids the base offset caused in the testing process and improves the accuracy of the detection structure.

[0006] To achieve the above-mentioned purpose, the specific technical scheme of the semiconductor packaging fixing device of the present application is as follows:

[0007] The semiconductor packaging fixing device comprises a base and a support, the base is provided with a pad, the support is provided with a pressing plate, and the pressing plate and the base are fixed to fixedly connect the support and the pad.

[0008] Further, the base is provided with a fixing structure, the pressing plate is provided with a matching part, and the fixing structure and the matching part are fixed to fix the support in a containing space formed by the pressing plate and the base.

[0009] Further, the fixing structure is at least one fixing column, the matching part comprises at least one fixing hole, and the fixing column and the fixing hole are clamped and matched to fixedly connect the pressing plate and the base.

[0010] Further, the fixing hole is an adjusting hole, and the adjusting hole is used to adjust the relative position of the pressing plate and the support.

[0011] Further, the base is provided with a fixing groove, and the cushion block is contained in the fixing groove to limit movement of the cushion block.

[0012] Further, the cushion block is provided with a positioning column, the support is provided with a positioning hole, and the pressing plate is provided with a mounting hole, the positioning hole is sleeved on the outer wall of the positioning column, and the mounting hole and one end of the positioning column are clamped and fixed, so that the cushion block, the support and the pressing plate are clamped and fixed.

[0013] Further, the cushion block is provided with a protruding block, and the support is provided with a base island, and the protruding block and the base island are clamped and fixed.

[0014] Further, the base, the cushion block and the pressing plate are made of tungsten steel material.

[0015] Further, the cushion block is provided with at least two positioning plates, and the at least two positioning plates are arranged at equal intervals, and each positioning plate is matched with the through groove arranged on the support.

[0016] Further, the pressing plate is provided with a pressing claw, and the pressing claw is pressed downward and contacted with the support to fix the support and the cushion block.

[0017] The semiconductor package fixing device provided by the application can fix the support more firmly by designing the cushion block and the pressing plate and arranging multiple fixing structures on the cushion block and the pressing plate, avoid the pressing plate from pressing the line arc due to improper placement of the support by human, improve the pressing effect of the support in the pushing and pulling process, and ensure the accuracy of data.

[0018] The above description is only a summary of the technical scheme of the application, in order to more clearly understand the technical means of the application, the application can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the application more obvious and easy to understand, the following specific embodiments of the application are described. BRIEF DESCRIPTION OF DRAWINGS

[0019] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Furthermore, the same reference numerals are used throughout the several drawings to represent similar components. In the drawings:

[0020] Figure 1 It is a schematic diagram of the overall structure of the semiconductor package fixing device of the application;

[0021] Figure 2 It is a schematic diagram of the structure of the support of the application;

[0022] Figure 3 It is a schematic diagram of the structure of the base of the application Figure 1 ;

[0023] Figure 4Structure diagram of the base of the present application Figure 2 ;

[0024] Figure 5 Structure diagram of the cushion block of the present application

[0025] Figure 6 Structure diagram of the pressing plate of the present application.

[0026] Explanation of the reference numerals in the drawings:

[0027] 1, support; 11, positioning hole; 12, base island; 2, base; 21, fixing groove; 22, fixing column; 3, cushion block; 31, protruding block; 32, positioning plate; 33, positioning column; 4, pressing plate; 41, adjusting hole; 42, mounting hole; 43, pressing claw. DETAILED DESCRIPTION

[0028] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0029] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the semiconductor package fixing device or the elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0031] The technical solutions of the present application will be described in detail below. Figures 1 to 6 Specifically, the present application provides a semiconductor package fixing device.

[0032] In the prior art, the packaging process of a semiconductor mainly includes a patching process, the patching process is fixed on a support 1 through tin paste (silver glue), and then the fixing of the chip is completed through reflow soldering and cleaning. The packaging process also includes a wire binding process, the wire binding process refers to that at a certain temperature, the two ends of a lead wire are respectively welded on a chip pad and a lead wire support 1 or a PCB board by using an ultrasonic pressurizing mode, so as to realize the connection between the internal circuit of the chip and the external circuit. No matter the patching process or the wire binding process, the firmness of the chip fixation and the firmness of the wire binding fixation are particularly important. Therefore, it is necessary to test the effects of patching and wire binding by using a push-pull force testing machine. In the testing process, the product to be tested is usually placed on a testing table, and then a pressing plate 4 is used for pressing, and then a suitable testing cutter is selected for corresponding testing. The fixing effect of the general pressing plate 4 and the fixing device is poor, and the chip or the support 1 will be offset or floated during each test, so that the accuracy of the test result is poor.

[0033] As shown in Figures 1 to 6 Some embodiments of the present application provide a semiconductor packaging fixing device, which comprises a base 2, a cushion block 3, a support 1 and a pressing plate 4. The support 1 is fixed in the semiconductor packaging fixing device through the base 2, the cushion block 3 and the pressing plate 4, so as to test the chip on the support 1 by using a pull force test.

[0034] Further, the embodiments provided by the present application improve the structures on the base 2, the cushion block 3 and the pressing plate 4, so as to simultaneously fix the support 1 by the base 2, the cushion block 3 and the pressing plate 4, thereby more firmly fixing the support 1 in the accommodating space formed by the cushion block 3 and the base 2.

[0035] Further, the cushion block 3 in the present embodiment is different from the long strip-shaped plate structure in the prior art. The thickness of the cushion block 3 is set, and the thickness of the cushion block 3 is increased to more closely set the surface of the support 1.

[0036] Specifically, the cushion block 3 is a square block structure. Of course, the structure of the cushion block 3 can also be set as other structures, and the thickness of the cushion block 3 is not specifically limited here, and only the preferred embodiments provided by the present application are used as the description. The structure of the cushion block 3 can also be set as a long strip shape, a circular shape, a rhombic shape and the like.

[0037] Further, the upper surface of the cushion block 3 is provided with a communication groove, which is generally arranged at the middle position. The position of the communication groove is mainly to match the welding position of the chip on the support 1. The cushion block 3 is provided with at least two positioning plates 32, which are arranged at equal intervals. Each positioning plate 32 is matched with the communication groove arranged on the support 1. Of course, the structure of the positioning plate 32 can also be other structure forms, such as a positioning column 33 or a positioning block. The specific structure of the positioning plate 32 is mainly determined according to the communication groove on the support 1. The communication groove on the support 1 refers to the interval between the welding and fixing positions of multiple chips on the support 1. The support 1 is provided with multiple chip fixing positions, and a communication groove is arranged between the adjacent two fixing positions. The positioning plate 32 can be clamped with the communication groove, further fixing the support 1, avoiding the shaking of the support 1, and increasing the firmness of the support 1.

[0038] Further, one side of the communication groove is provided with a protrusion 31. The shape and number of the protrusion 31 are not specifically limited here. The number of the protrusion 31 is preferably three, which is mainly matched with the number of the base island 12 arranged on the support 1. The support 1 is provided with multiple base islands 12, which are hollow structures. The protrusion 31 is clamped with the base island 12, further fixing the support 1 and the cushion block 3, limiting the movement of the support 1 from multiple fixing structures, so that the support 1 is more firmly accommodated in the accommodation space.

[0039] Preferably, the height of the protrusion 31 is 0.5 mm. Of course, the height of the protrusion 31 is not specifically limited here, which is mainly determined according to the arrangement position of the base island 12. The height of the fitting part is increased by 0.5 mm, which ensures the pressing firmness and avoids the offset or floating of the support 1 caused by the pushing force, which affects the test result.

[0040] Further, the base 2 is provided with a fixing structure, and the pressing plate 4 is provided with a matching part. The fixing structure and the matching part are fixed to fix the support 1 in the accommodation space formed by the pressing plate 4 and the base 2.

[0041] As a preferred embodiment, the fixing structure is at least one fixing column 22, and the matching part includes at least one fixing hole. The fixing column 22 and the fixing hole are clamped and matched to fixedly connect the pressing plate 4 and the base 2. The fixing hole is an adjusting hole 41, which is used to adjust the relative position of the pressing plate 4 and the support 1.

[0042] Specifically, the adjusting hole 41 is a long hole, the hole diameter of the long hole is different, the hole diameter of one end of the long hole is larger than the outer diameter of the positioning column 33, so that the positioning column 33 is inserted into the long hole on the pressing plate 4, the hole diameter of the other end of the long hole is matched with the outer diameter of the positioning column 33, so that the positioning column 33 is inserted into the adjusting hole 41, the pressing plate 4 is moved, the pressing plate 4 and the base 2 are fixedly connected, thereby realizing the adjustability of the pressing plate 4. The bottom end of the positioning column 33 is provided with a thread, the positioning column 33 is twisted to descend, the pressing plate 4 is pressed against the support 1 by the fixing device, and the fixing effect is guaranteed.

[0043] Further, the base 2 is provided with a fixing groove 21, and the cushion block 3 is accommodated in the fixing groove 21 to limit the movement of the cushion block 3. The groove shape of the fixing groove 21 provided on the base 2 is matched with the outer shape of the cushion block 3, so that the cushion block 3 is clamped on the base 2 to pre-fix the cushion block 3. The cushion block 3 is placed on the base 2, and the positioning pin is required to be matched with the fixing groove 21, and the combined part is fitted without shaking.

[0044] Further, the cushion block 3 is provided with a positioning column 33, the support 1 is provided with a positioning hole 11, and the pressing plate 4 is provided with a mounting hole 42. The positioning hole 11 is sleeved on the outer wall of the positioning column 33, and the mounting hole 42 is clamped and fixed with one end of the positioning column 33, so that the cushion block 3, the support 1 and the pressing plate 4 are clamped and fixed. The cushion block 3 is provided with a protruding block 31, and the support 1 is provided with a base island 12. The protruding block 31 and the base island 12 are clamped and fixed. The positioning column 33 on the cushion block 3 avoids the need to adjust the position again when manually placing the support 1, and avoids the risk of crushing the line arc and the chip.

[0045] Further, the pressing plate 4 is provided with a pressing claw 43, which is pressed downward and in contact with the support 1 to fix the support 1 and the cushion block 3, thereby increasing the stability of the semiconductor packaging fixing device. The pressing plate 4 is provided with a mounting groove, which is a through groove structure. The opposite sides of the mounting groove are provided with the pressing plate 4. The pressing plate 4 can be adjusted and arranged in position. One end of the pressing plate 4 is a fixed end, and the other end of the pressing plate 4 is a free end. According to the position of the support 1 in the accommodating space, the free end of the pressing plate 4 can be adjusted, so that the pressing plate 4 presses the support 1 tightly, and the displacement of the support 1 does not change.

[0046] The semiconductor packaging fixing device in the embodiment of the application is made of tungsten steel material, and the surface of the jig is required to be smooth and flat to prevent the support 1 from deforming.

[0047] The semiconductor packaging fixing device provided by the application is designed by the cushion block 3 and the pressing plate 4, a plurality of fixing structures are arranged on the cushion block 3 and the pressing plate 4, the support 1 is fixed more firmly, the pressing plate 4 is prevented from crushing the line arc due to improper manual placement of the support 1, the pressing effect of the support 1 during the pushing and pulling process is improved, and the accuracy of data is ensured.

[0048] It should be pointed out finally that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; and although the present application has been described in detail with reference to the foregoing embodiments, it should be appreciated by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features thereof can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor package fixing device characterized by comprising: The base is provided with a cushion block, the support is provided with a pressing plate, the pressing plate and the base are fixed to make the support and the cushion block fixedly connected, the cushion block is provided with a positioning column, the support is provided with a positioning hole, the pressing plate is provided with a mounting hole, the positioning hole is sleeved on the outer wall of the positioning column, the mounting hole and one end of the positioning column are clamped and fixed, the cushion block is provided with a protruding block, the support is provided with a base island, and the protruding block and the base island are clamped and fixed.

2. The semiconductor package securing apparatus of claim 1, wherein The base is provided with a fixing structure, the pressing plate is provided with a matching part, the fixing structure and the matching part are fixed to make the support fixed in the accommodating space formed by the pressing plate and the base.

3. The semiconductor package fixing device according to claim 2, wherein: The fixing structure comprises at least one fixing column, the matching part comprises at least one fixing hole, the fixing column and the fixing hole are clamped and matched to make the pressing plate and the base fixedly connected.

4. The semiconductor package securing apparatus of claim 3, wherein The fixing hole is an adjusting hole, which is used for adjusting the relative position of the pressing plate and the support.

5. The semiconductor package securing apparatus of claim 1, wherein The base is provided with a fixing groove, and the cushion block is accommodated in the fixing groove to limit the movement of the cushion block.

6. The semiconductor package securing apparatus of claim 1, wherein The base, the cushion block and the pressing plate are made of tungsten steel material.

7. The semiconductor package securing apparatus of claim 1, wherein The cushion block is provided with at least two positioning plates, the at least two positioning plates are arranged at equal intervals, each positioning plate is matched with a through groove arranged on the support.

8. The semiconductor package securing apparatus of claim 1, wherein The pressing plate is provided with a pressing claw, the pressing claw is pressed downward and contacted with the support to make the support and the cushion block fixed.

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