Image processing apparatus

Abstract

An image processing apparatus is provided. The image processing apparatus has a first substrate provided with a light-receiving element, a second substrate provided with a plurality of light-emitting elements, a third substrate provided with a power supply circuit, and a housing that houses the first substrate, the second substrate, and the third substrate, the first substrate has a first surface and a second surface, and is disposed between the third substrate and the second substrate in a first direction orthogonal to the first surface, the light-receiving element is disposed on the second surface, the second substrate has a third surface, a fourth surface, and an opening portion, the third surface faces the second surface, and the second substrate is disposed such that the opening portion overlaps the light-receiving element in the first direction, the plurality of light-emitting elements are disposed on the fourth surface in a manner surrounding the opening portion, and the power supply circuit is disposed on the third substrate in a manner not overlapping the light-receiving element in the first direction.

Description

Technical Field

[0001] This invention relates to an image processing apparatus. Background Technology

[0002] In recent years, image processing devices equipped with batteries and capable of being portable and operating independently have become widely popular. For example, Patent Document 1 describes an image processing device equipped with a calibration data setting unit and an image correction unit. The calibration data setting unit sets calibration data based on the temperature of the camera device when it photographs the subject, the temperature of the camera device when photographing color charts before and after photographing the subject, and color chart image data obtained by photographing color charts before and after photographing the subject. The calibration data setting unit sets color chart image data at a temperature closer to the temperature when photographing the subject is the temperature from the temperature of the camera device when photographing the color chart to the temperature of the camera device when photographing the color chart after photographing the subject. The image correction unit uses the calibration data set in the calibration data setting unit to correct the image data of the subject obtained by photographing the subject. According to the image processing device described in Patent Document 1, even if the shooting conditions change during shooting, the image data of the subject can be corrected with high precision.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2010-81057

[0004] However, in image processing devices that are equipped with batteries and can be carried and operated independently, in order to facilitate the arrangement of various components in a small housing, the characteristics of the light-receiving element may change due to heat from other heat-generating circuits or components, resulting in a decrease in the accuracy of image processing. There is still room for improvement in this area. Summary of the Invention

[0005] One aspect of the image processing apparatus of the present invention includes:

[0006] Light-receiving element;

[0007] Multiple light-emitting elements;

[0008] Battery;

[0009] The power supply circuit is electrically connected to the battery;

[0010] A first substrate is provided with the light-receiving element;

[0011] The second substrate is provided with the plurality of light-emitting elements;

[0012] The third substrate is provided with the power supply circuit; and

[0013] The housing contains the first substrate, the second substrate, and the third substrate.

[0014] The first substrate has a first surface and a second surface, and is disposed between the third substrate and the second substrate in a first direction orthogonal to the first surface.

[0015] The light-receiving element is disposed on the second surface.

[0016] The second substrate has a third surface, a fourth surface, and an opening. The third surface faces the second surface, and the second substrate is configured such that the opening overlaps with the light-receiving element in the first direction.

[0017] The plurality of light-emitting elements are arranged on the fourth surface in a manner that surrounds the opening.

[0018] The power supply circuit is disposed on the third substrate in a manner that does not overlap with the light-receiving element in the first direction. Attached Figure Description

[0019] Figure 1 This is a perspective view of the image processing apparatus of this embodiment.

[0020] Figure 2 This is a diagram representing an example of the information displayed in the display module.

[0021] Figure 3 It is a block diagram representing the functional structure of an image processing device.

[0022] Figure 4 This is a view of the inside of the image processing device's housing from the positive X-axis direction.

[0023] Figure 5 This is a view of the inside of the image processing device's housing from the positive Y-axis direction.

[0024] Figure 6 This is a view of the inside of the image processing device's housing from the positive Z-axis direction.

[0025] Figure 7 This is a view of the first substrate taken from the positive Z-axis direction.

[0026] Figure 8 Therefore Figure 7 A cross-sectional view of the first substrate cut along line AA.

[0027] Figure 9 This is a view of the sub-substrate from the positive Z-axis direction.

[0028] Figure 10 This is a diagram of the spacer substrate viewed from the positive Z-axis direction.

[0029] Figure 11 This is a view of the main substrate from the positive Z-axis direction.

[0030] Figure 12 This is a view of the second substrate taken from the positive Z-axis direction.

[0031] Figure 13 This is a view of the third substrate taken from the positive Z-axis direction.

[0032] Figure 14 This is a view of the fourth substrate taken from the positive Z-axis direction.

[0033] Figure 15 This is a diagram showing some of the components of an image processing device viewed from the positive Z-axis direction.

[0034] Explanation of reference numerals in the attached figures

[0035] 1…Image processing device; 10…Light-emitting element; 11…Light-emitting element driving circuit; 20…Wavelength variable filter; 21…Light-receiving element; 22…Photoelectric conversion circuit; 23…Amplification circuit; 24…C / V conversion circuit; 25…Amplification circuit; 26…Boost conversion circuit; 30…First processor; 31…Wireless communication module; 32…Operating unit; 33…Light-emitting module; 34…Buzzer; 40…Second processor; 41…Power supply circuit; 42…Switching circuit; 43…Charging circuit; 50…Display module; 51…Cable; 60…Connector; 70…Battery; 71, 72…Connectors; 81, 82, 83, 84, 85, 86, 87…Connectors; 91, 92…Flexible flat cable; 93…Cable; 100…Housing; 101…First substrate; 101a, 101b, 101c, 101d…Side of the first substrate; 101F, 101… R…face of the first substrate; 102…second substrate; 102a, 102b, 102c, 102d…edges of the second substrate; 102F, 102R…faces of the second substrate; 103…third substrate; 103a, 103b, 103c, 103d…edges of the third substrate; 103F, 103R…faces of the third substrate; 104…fourth substrate; 104a, 104b, 104c, 104d…edges of the fourth substrate; 104F, 104R…face of the fourth substrate; 111…main substrate; 111a, 111b, 111c, 111d…edge of the main substrate; 111F, 111R…face of the main substrate; 112…spacer substrate; 113…sub-substrate; 113F, 113R…face of the sub-substrate; 120…opening; 121, 122, 123, 124, 125…threaded holes; 133, 132…screws; 140…opening. Detailed Implementation

[0036] The preferred embodiments of the present invention will now be described in detail using the accompanying drawings. The drawings are for ease of explanation. Furthermore, the embodiments described below are not intended to unduly limit the scope of the invention as defined in the claims. Additionally, not all of the configurations described below are essential components of the present invention.

[0037] Hereinafter, in this embodiment, a colorimetric device will be used as an example of the image processing apparatus involved in the present invention.

[0038] 1. Overview of Image Processing Devices

[0039] Figure 1 This is a perspective view of the image processing apparatus 1 of this embodiment. Figure 1 As shown, the image processing apparatus 1 of this embodiment performs colorimetric processing to determine the color of an image IMG as image processing. Specifically, when the user moves the image processing apparatus 1 above the image IMG formed on the medium M and presses the operation unit 32 disposed on the upper surface of the image processing apparatus 1, the image processing apparatus 1 emits light from a portion of the bottom surface opposite the image IMG and determines the color of the image IMG based on the wavelength of the light reflected by the image IMG. That is, the operation unit 32 functions as a measurement start button. For example, the medium M is paper or cloth, etc., and the image IMG is a monochrome image. Figure 1 As shown, a colorimetric chart containing multiple images with different colors can also be formed on the medium M. The user moves the image processing device 1 over each image and presses the operation unit 32, thereby allowing the image processing device 1 to measure the color of each image. Alternatively, the image processing device 1 can also measure the color of the medium M.

[0040] The image processing device 1 can also calculate the difference between the measured color value and the target color value, i.e., the color difference. The image processing device 1 displays the calculated color value and color difference on a display module 50 that the user can visually confirm from the outside of the housing 100. Figure 1 In this example, the display module 50 is positioned so that the user can visually confirm the image processing device 1 from the surface where the operation unit 32 is located. Figure 2 This diagram illustrates an example of the colorimetric values ​​and color differences displayed in display module 50. Figure 2 In the example, the color values ​​L, a, b, and color difference ΔE displayed in display module 50 are values ​​in the L*a*b* color space. Furthermore, the color values ​​and color difference can also be values ​​in various color spaces other than the L*a*b* color space, such as RGB, YCC, CMYK, and L*C*h.

[0041] like Figure 1 and Figure 2As shown, the image processing device 1 may also have a light-emitting module 33 that can be visually confirmed by the user from the outside of the housing 100. Figure 1 and Figure 2 In this example, the light-emitting module 33 is configured to surround the operating section 32. For instance, the light-emitting module 33 has a tubular light guide and an LED mounted at the front end of the light guide, the light emitted by the LED being guided by the light guide. LED is an abbreviation for Light Emitting Diode. Figure 1 and Figure 2 In this example, the user can visually confirm the light guide of the light-emitting module 33. The light-emitting module 33 is a status display module, and its illumination state varies depending on the user's operation of the operation unit 32. For example, the image processing device 1 can also cause the light-emitting module 33 to illuminate when it detects that the user has pressed the operation unit 32.

[0042] The image processing device 1 has a rectangular shape that is close to the size that a user can hold and operate with one hand, making it portable. Furthermore, the image processing device 1 has a built-in battery 70 (described later) and is operated by the user pressing the operation unit 32, thus it can operate independently without instructions from other devices. Therefore, the image processing device 1 offers high user convenience.

[0043] In addition, such as Figure 1 and Figure 2 As shown, the directions along the three intersecting sides of the housing 100 of the image processing device 1 are respectively designated as the X-axis, Y-axis, and Z-axis. Then, except... Figure 3 In addition, the orientation of the image processing device 1 and its relationship with the X-axis, Y-axis, and Z-axis are... Figure 1 and Figure 2 same.

[0044] 2. Functional Components of an Image Processing Device

[0045] Figure 3 This is a block diagram illustrating the functional configuration of the image processing device 1. For example... Figure 3 As shown, the image processing device 1 includes multiple light-emitting elements 10 and a light-emitting element driving circuit 11. Additionally, the image processing device 1 includes a wavelength-variable filter 20, a light-receiving element 21, a photoelectric conversion circuit 22, an amplifier circuit 23, a C / V conversion circuit 24, an amplifier circuit 25, and a boost converter circuit 26. Furthermore, the image processing device 1 includes a first processor 30, a wireless communication module 31, an operation unit 32, a light-emitting module 33, a buzzer 34, and a display module 50. Additionally, the image processing device 1 includes a second processor 40, a power supply circuit 41, a switching circuit 42, a charging circuit 43, a connector 60, and a battery 70.

[0046] Multiple light-emitting elements 10 are respectively disposed on the bottom surface of the image processing device 1, and are turned on or off according to the driving signal output from the light-emitting element driving circuit 11. When each light-emitting element 10 is lit, light is emitted from the bottom surface of the image processing device 1. Each light-emitting element 10 is, for example, an LED. For example, some of the multiple light-emitting elements 10 may emit white light, while others may emit ultraviolet light.

[0047] The light-emitting element driving circuit 11 outputs multiple driving signals to drive multiple light-emitting elements 10 respectively, based on the control signals from the first processor 30.

[0048] The wavelength-variable filter 20 allows light of a predetermined wavelength range to pass through from the bottom surface of the image processing apparatus 1. The wavelength-variable filter 20 includes an electrostatic actuator (not shown), to which a voltage output from the amplifier circuit 25 is applied. The capacitance value of the electrostatic actuator varies according to the applied voltage, and the wavelength of the light passing through the wavelength-variable filter 20 varies according to the capacitance value of the electrostatic actuator. Therefore, the wavelength of the light passing through the wavelength-variable filter 20 varies according to the voltage output from the amplifier circuit 25. For example, the wavelength-variable filter 20 may also be an etalon element.

[0049] The amplifier circuit 25 outputs a voltage of tens of volts to drive the wavelength-variable filter 20. The output voltage of the amplifier circuit 25 varies according to a control signal from the first processor 30.

[0050] The boost converter circuit 26 boosts the voltage V1 (a few volts) output from the power supply circuit 41 to a voltage V4 (tens of volts), and then outputs it to the amplifier circuit 25. The voltage V4 boosted by the boost converter circuit 26 becomes the power supply voltage of the amplifier circuit 25. The boost converter circuit 26 can also be, for example, a boost-type DC-DC converter.

[0051] The C / V conversion circuit 24 converts the charge stored in the electrostatic actuator into voltage and outputs it to the first processor 30. The first processor 30 controls the output voltage of the amplifier circuit 25 according to the digital value after A / D conversion of the output voltage of the C / V conversion circuit 24, so that the wavelength variable filter 20 allows light of the desired wavelength to pass through. That is, the wavelength of the light passing through the wavelength variable filter 20 is controlled by the first processor 30.

[0052] The light-receiving element 21 receives light transmitted through the wavelength-variable filter 20 and outputs a charge corresponding to the amount of light. For example, the light-receiving element 21 can also be a photodiode.

[0053] The photoelectric conversion circuit 22 converts the amount of light received by the light-receiving element 21 into an electrical signal and outputs it to the amplifier circuit 23. For example, the photoelectric conversion circuit 22 can also be a C / V conversion circuit that converts the charge output from the light-receiving element 21 into a voltage.

[0054] The amplifier circuit 23 amplifies the voltage output from the photoelectric conversion circuit 22 and outputs it to the first processor 30.

[0055] The first processor 30 is an image processing processor. It performs an A / D conversion on the output voltage of the photoelectric conversion circuit 22 to generate a digital value representing the amount of light received by the light-receiving element 21, and stores this amount of light in correspondence with the wavelength of the light. The first processor 30 can also be, for example, an MCU or an MPU. MCU is an abbreviation for Micro Control Unit, and MPU is an abbreviation for Micro-processing Unit. The first processor 30 scans the wavelengths of light transmitted through the wavelength-variable filter 20 and stores the amount of light received by the light-receiving element 21 in correspondence with each wavelength. Furthermore, the first processor 30 calculates a colorimetric value based on the amount of light corresponding to each wavelength. Given a pre-known target color value, the first processor 30 calculates the difference between the colorimetric value and the target color value, i.e., the color difference.

[0056] The wireless communication module 31 includes a wireless communication circuit and an antenna (not shown). The wireless communication circuit acquires wireless signals received from an external device via the antenna, demodulates the data, and transmits it to the first processor 30. Additionally, the wireless communication circuit acquires data from the first processor 30, modulates high-frequency signals, and transmits wireless signals to an external device via the antenna. For example, the wireless communication module 31 can also acquire colorimetric values ​​and color differences calculated by the first processor 30 and transmit them to an external device. The wireless communication circuit may also include a temperature sensor (not shown) with the function of temperature compensation for colorimetric values ​​based on signals output from the temperature sensor. The wireless communication module 31 may also be a module that transmits and receives wireless signals corresponding to wireless communication standards such as Bluetooth (registered trademark) and Wi-Fi.

[0057] The operation unit 32 outputs an operation signal based on user operation to the first processor 30. In this embodiment, the operation unit 32 functions as a measurement start button; when the user presses the operation unit 32, it outputs an operation signal indicating that the button has been pressed to the first processor 30. The first processor 30 then begins colorimetric processing based on the operation signal from the operation unit 32.

[0058] The light-emitting module 33 is a status display module that emits light according to a control signal from the first processor 30. For example, when the operation unit 32 is detected to have been pressed by the user, the first processor 30 outputs a control signal to make the light-emitting module 33 emit light.

[0059] The buzzer 34 generates a predetermined sound according to the control signal from the first processor 30, thereby notifying the user of various information. For example, if the optical axis of the light-receiving element 21 is significantly offset or shaken when the user presses the operation unit 32 to start the measurement, normal color measurement may not be possible. Therefore, when the user's operation of the operation unit 32 is malfunctioning, the first processor 30 outputs a predetermined control signal to the buzzer 34, and the buzzer 34 emits a sound.

[0060] The display module 50 displays various information based on the display signals output from the first processor 30. In this embodiment, the light-emitting module 33 includes... Figure 2 The display panel shown is accompanied by a display driver (not shown). The display panel could also be, for example, a liquid crystal panel. The display driver generates a drive signal corresponding to the display signal output from the first processor 30 and outputs it to the display panel. For example, as... Figure 2 As shown, the display panel shows the color measurement value, color difference, etc.

[0061] Battery 70 is a rechargeable battery, such as a lithium-ion battery or a lithium polymer battery. When the user presses a power button (not shown), a voltage VB corresponding to the remaining charge level is output from battery 70.

[0062] The power supply circuit 41 generates and outputs voltages V1 and V2 based on the output voltage VB of the battery 70. The power supply circuit 41 may also include a boost DC-DC converter (not shown) and a buck DC-DC converter. The boost DC-DC converter boosts the output voltage VB of the battery 70 to generate voltage V1, and the buck DC-DC converter bucks voltage V1 to generate voltage V2. Voltage V1 is supplied to the boost converter circuit 26, and voltage V2 is supplied as a power supply voltage to the second processor 40. Additionally, voltage V2 is input to the switching circuit 42.

[0063] The switching circuit 42 changes to an on or off state according to the control signal from the second processor 40. When on, the switching circuit 42 outputs a voltage V3 that is approximately equal to the voltage V2. Voltage V3 is supplied as the power supply voltage to... Figure 3 The circuits are enclosed by dashed lines. Furthermore, when the switching circuit 42 is in a non-conducting state, voltage V3 is not supplied to any of the circuits. That is, the second processor 40 is a processor for power control.

[0064] Connector 60 is a connector for connecting cables, such as a USB connector. USB is an abbreviation for Universal Serial Bus. For example, connector 60 is electrically connected to external devices such as personal computers via a USB cable. The second processor 40 can communicate data with external devices via connector 60.

[0065] The charging circuit 43 uses the power supply voltage VC supplied when the connector 60 is electrically connected to an external device to charge the battery 70.

[0066] In addition, the second processor 40 communicates with the first processor 30. The second processor 40 can also be started by being supplied with voltage V2 from the power supply circuit 41 and notify the first processor 30 of this start-up status. Alternatively, the first processor 30 can notify the second processor 40 of the transition to sleep mode after colorimetric processing is complete. Upon receiving this notification, the second processor 40 de-energizes the switching circuit 42, stopping the supply of voltage V3 to the first processor 30.

[0067] 3. Structure of the image processing device

[0068] Next, use Figures 4 to 15 The internal structure of the image processing device 1 will be described in detail. Figure 4 This is a view of the interior of the housing 100 of the image processing device 1, viewed from the positive X-axis direction. Additionally,

[0069] Figure 5 This is a view of the interior of the housing 100 of the image processing device 1, viewed from the positive Y-axis direction. Additionally, Figure 6 This is a view of the interior of the housing 100 of the image processing device 1 as seen from the positive Z-axis direction.

[0070] like Figure 4 and Figure 5 As shown, the image processing apparatus 1 has a cuboid-shaped housing 100, a first substrate 101, a second substrate 102, a third substrate 103, and a fourth substrate 104. The housing 100 houses the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104. The first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104 are fixed to the housing 100 by screws or the like. The second substrate 102 is located closest to the bottom surface of the housing 100. The first substrate 101 is located between the second substrate 102 and the third substrate 103, and the third substrate 103 is located between the first substrate 101 and the fourth substrate 104. The fourth substrate 104 is located closest to the upper surface of the housing 100.

[0071] Figure 3 The wavelength-variable filter 20, light-receiving element 21, photoelectric conversion circuit 22, amplification circuit 23, C / V conversion circuit 24, amplification circuit 25, boost conversion circuit 26, and first processor 30 shown are disposed on the first substrate 101. Furthermore, Figure 3 The plurality of light-emitting elements 10 and the light-emitting element driving circuit 11 shown are disposed on the second substrate 102. Furthermore, Figure 3 The second processor 40, power supply circuit 41, switching circuit 42, charging circuit 43, and connector 60 shown are disposed on the third substrate 103. Additionally, Figure 3 The wireless communication module 31, operation unit 32, light-emitting module 33 and buzzer 34 shown are disposed on the fourth substrate 104.

[0072] like Figure 4 , Figure 5 as well as Figure 6 As shown, Figure 3 The display module 50 shown is located between the fourth substrate 104 and the upper surface of the housing 100, and can be visually confirmed from the upper surface of the housing 100. One end of the cable 51, which is connected to a display driver (not shown) built into the display module 50, is connected to a connector 86 provided on the fourth substrate 104.

[0073] like Figure 4 and Figure 5 As shown, the two ends of the flexible flat cable 91 are connected to a connector 81 disposed on the first substrate 101 and a connector 87 disposed on the fourth substrate 104, respectively. The signals input and output between the first processor 30 disposed on the first substrate 101 and the wireless communication module 31, operation unit 32, light-emitting module 33 and buzzer 34 disposed on the fourth substrate 104 are transmitted in the flexible flat cable 91.

[0074] Furthermore, the display signal output from the first processor 30 disposed on the first substrate 101 is transmitted in the flexible flat cable 91 and reaches the fourth substrate 104, and then in the cable 51 and reaches the display module 50. Therefore, the fourth substrate 104 functions as a relay substrate for relaying the display signal to the display module 50.

[0075] The two ends of the flexible flat cable 92 are connected to a connector 84 disposed on the first substrate 101 and a connector 85 disposed on the third substrate 103, respectively. The first processor 30 disposed on the first substrate 101 and the second processor 40 disposed on the third substrate 103 communicate via the flexible flat cable 92. Furthermore, a voltage V3 based on a voltage V2 generated by a power supply circuit 41 disposed on the third substrate 103 is transmitted through the flexible flat cable 92 to the first substrate 101, and then through the flexible flat cable 91 to the fourth substrate 104. That is, the wiring path from the third substrate 103 to the first substrate 101 is shorter than the wiring path from the third substrate 103 to the fourth substrate 104. Therefore, the decrease in voltage V3 supplied from the power supply circuit 41 to the first substrate 101 is smaller, resulting in a stable voltage being supplied to the light-receiving element 21 disposed on the first substrate 101.

[0076] The two ends of the cable 93 are connected to a connector 82 disposed on the first substrate 101 and a connector 83 disposed on the second substrate 102, respectively. The control signal output from the first processor 30 disposed on the first substrate 101 is transmitted in the cable 93 and reaches the second substrate 102, and is input to the light-emitting element driving circuit 11 disposed on the second substrate 102.

[0077] like Figure 4 and Figure 5 As shown, Figure 3 The battery 70 shown is located between the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104. More specifically, the battery 70 is disposed between the third substrate 103 and the fourth substrate 104. Furthermore, the third substrate 103 is disposed between the battery 70 and the first substrate 101. The battery 70 overlaps with the third substrate 103 in the Z-axis direction, which is orthogonal to the surface 101F of the first substrate 101. Therefore, in a top view taken from the positive Z-axis direction, the first substrate 101, the second substrate 102, the third substrate 103, the fourth substrate 104, and the battery 70 overlap, and the arrangement space of the first substrate 101, the second substrate 102, and the third substrate 103 is separated from the arrangement space of the fourth substrate 104 by the battery 70. Furthermore, the Z-axis direction is an example of a "first direction".

[0078] In addition, such as Figure 4 As shown, in a top view taken from the positive X-axis direction, the battery 70 has a rectangular shape. On the other hand, as... Figure 5As shown, in a top view taken from the positive Y-axis direction, the portion of the battery 70 opposite the fourth substrate 104 is semi-circular, while the portion of the battery 70 opposite the first substrate 101, the second substrate 102, and the third substrate 103 is trapezoidal in shape, with the upper base longer than the lower base. Therefore, the closer the portion of the battery 70 opposite the first substrate 101, the second substrate 102, and the third substrate 103 is to them, the smaller its cross-sectional area. Consequently, a gap is created between the battery 70 and the third substrate 103 in the X-axis direction, and connectors 71 and 72 are provided on the third substrate 103 using this gap. Connectors 71 and 72 are connected to the battery 70 via wiring (not shown). Figure 3 The power supply circuit 41 and charging circuit 43 shown are electrically connected to the battery 70 via connectors 71 and 72.

[0079] Figure 7 This is a view of the first substrate 101 viewed from the positive Z-axis direction. Figure 8 Therefore Figure 7 A cross-sectional view of the first substrate 101 cut along line AA. (See figure) Figure 7 As shown, in a top view taken from the positive direction of the Z-axis, the first substrate 101 has a rectangular shape having a side 101a, a side 101b longer than the side 101a, a side 101c opposite to the side 101a, and a side 101d opposite to the side 101b.

[0080] like Figure 7 and Figure 8 As shown, the first substrate 101 has a surface 101F facing the positive Z-axis direction and a surface 101R facing the negative Z-axis direction. Furthermore, the first substrate 101 is disposed between the third substrate 103 and the second substrate 102 in the Z-axis direction. The light-receiving element 21 is disposed on surface 101R of the first substrate 101. Surface 101F is an example of a "first surface," and surface 101R is an example of a "second surface."

[0081] like Figure 7 As shown, the first substrate 101 is constructed by fixing the main substrate 111 and the sub-substrate 113 onto the spacer substrate 112 using screws 131 and 132.

[0082] Figure 9 This is a view of the sub-substrate 113 viewed from the positive Z-axis direction. Additionally, Figure 10 This is a view of the spacer substrate 112 taken from the positive Z-axis direction. Additionally, Figure 11 This is a view of the main substrate 111 viewed from the positive Z-axis direction. Furthermore, in... Figure 9 , Figure 10 as well as Figure 11In the diagram, solid lines represent constituent elements disposed on the surface of each substrate facing the positive Z-axis, and dashed lines represent constituent elements disposed on the surface of each substrate facing the negative Z-axis.

[0083] like Figure 7 , Figure 9 , Figure 10 as well as Figure 11 As shown, screws 131 are inserted into threaded holes 121 on the main substrate 111, threaded holes 123 on the spacer substrate 112, and threaded holes 124 on the sub-substrate 113; and screws 132 are inserted into threaded holes 122 on the main substrate 111 and threaded holes 125 on the sub-substrate 113.

[0084] like Figure 9 As shown, the sub-substrate 113 has a surface 113F facing the positive Z-axis and a surface 113R facing the negative Z-axis. Surfaces 101F and 101R of the first substrate 101 are surfaces 113F and 113R of the sub-substrate 113, respectively. Figure 8 and Figure 9 As shown, a light-receiving element 21 and an amplifier circuit 23 are disposed on the surface 113R of the sub-substrate 113.

[0085] like Figure 7 and Figure 11 As shown, in a top view taken from the positive direction of the Z-axis, the shape of the first substrate 101 is consistent with the shape of the main substrate 111. The edges 101a, 101b, 101c and 101d of the first substrate 101 are the edges 111a, 111b, 111c and 111d of the main substrate 111, respectively.

[0086] like Figure 11 As shown, the main substrate 111 has a surface 111F facing the positive Z-axis and a surface 111R facing the negative Z-axis. A photoelectric conversion circuit 22, an amplifier circuit 25, a boost converter circuit 26, a first processor 30, and a connector 84 are disposed on surface 111F of the main substrate 111. Additionally, a wavelength variable filter 20, a C / V conversion circuit 24, a connector 81, and a connector 82 are disposed on surface 111R of the main substrate 111. Figure 8 and Figure 11 As shown, the main substrate 111 has a rectangular opening 120, and in a top view viewed from the positive direction of the Z-axis, the wavelength variable filter 20 overlaps with the opening 120.

[0087] In addition, in this embodiment, the first substrate 101 is composed of three substrates: a main substrate 111, a spacer substrate 112, and a sub-substrate 113, but it may also be composed of one or two substrates.

[0088] Figure 12This is a view of the second substrate 102 viewed from the positive Z-axis direction. Furthermore, in... Figure 12 In the diagram, solid lines represent constituent elements disposed on surface 102F of the second substrate 102 facing the positive Z-axis, and dashed lines represent constituent elements disposed on surface 102R of the second substrate 102 facing the negative Z-axis. Furthermore, surface 102F is an example of a "third surface," and surface 102R is an example of a "fourth surface."

[0089] like Figure 12 As shown, in a top view taken from the positive Z-axis direction, the second substrate 102 has a rectangular shape having a side 102a, a side 102b longer than side 102a, a side 102c opposite to side 102a, and a side 102d opposite to side 102b. A connector 83 is provided on surface 102F of the second substrate 102. Surface 102F of the second substrate 102 is opposite to surface 101R of the first substrate 101.

[0090] A plurality of light-emitting elements 10 and a light-emitting element driving circuit 11 are disposed on surface 102R of the second substrate 102. The second substrate 102 has a circular opening 140. In a top view taken from the positive direction of the Z-axis, the plurality of light-emitting elements 10 are disposed on surface 102R of the second substrate 102 in a manner that surrounds the opening 140. Surface 102R of the second substrate 102 faces the inner wall of the housing 100.

[0091] Figure 13 This is a view of the third substrate 103 viewed from the positive Z-axis direction. Furthermore, in... Figure 13 In the diagram, solid lines represent constituent elements disposed on the surface 103F of the third substrate 103 facing the positive Z-axis direction, and dashed lines represent constituent elements disposed on the surface 103R of the third substrate 103 facing the negative Z-axis direction.

[0092] like Figure 13 As shown, in a top view taken from the positive Z-axis direction, the third substrate 103 has a rectangular shape with side 103a, side 103b longer than side 103a, side 103c opposite side 103a, and side 103d opposite side 103b. A second processor 40, a power supply circuit 41, a switching circuit 42, a charging circuit 43, a connector 60, a connector 71, and a connector 72 are disposed on surface 103F of the third substrate 103. Surface 103F of the third substrate 103 faces the battery 70.

[0093] A connector 85 is provided on surface 103R of the third substrate 103. Surface 103R of the third substrate 103 is opposite to surface 101F of the first substrate 101.

[0094] Figure 14 This is a view of the fourth substrate 104 viewed from the positive Z-axis direction. Furthermore, in... Figure 14In the diagram, solid lines represent constituent elements disposed on the surface 104F of the fourth substrate 104 facing the positive Z-axis direction, and dashed lines represent constituent elements disposed on the surface 104R of the fourth substrate 104 facing the negative Z-axis direction.

[0095] like Figure 14 As shown, in a top view taken from the positive direction of the Z-axis, the fourth substrate 104 has a rectangular shape having a side 104a, a side 104b longer than the side 104a, a side 104c opposite to the side 104a, and a side 104d opposite to the side 104b.

[0096] An operation unit 32, a light-emitting module 33, a buzzer 34, and a connector 86 are disposed on surface 104F of the fourth substrate 104. The operation unit 32 is located on surface 104F of the fourth substrate 104 at a position overlapping with a virtual line VL equidistant from edges 104b and 104d. That is, the operation unit 32 is disposed at the center of the fourth substrate 104 in the short-side direction. The operation unit 32 is, for example, a button that is physically displaced by a user pressing it. Alternatively, the operation unit 32 may be an electrostatic capacitive button.

[0097] The surface 104F of the fourth substrate 104 is opposite to the inner wall surface of the housing 100 and the display module 50.

[0098] A wireless communication module 31 and a connector 87 are disposed on surface 104R of the fourth substrate 104. The wireless communication module 31 is disposed in the end region of surface 104R of the fourth substrate 104. This end region is the region closest to edge 104a when the entire area of ​​surface 104R of the fourth substrate 104 is divided into three regions of equal area by two line segments parallel to edge 104a. Surface 104R of the fourth substrate 104 faces the battery 70.

[0099] Figure 15 This is a diagram showing multiple light-emitting elements 10, wavelength-variable filter 20, light-receiving element 21, opening 140, first processor 30, wireless communication module 31, operation unit 32, power supply circuit 41, display module 50, and fourth substrate 104 viewed from the positive direction of the Z-axis.

[0100] like Figure 15As shown, in the Z-axis direction, the opening 140 of the second substrate 102, the wavelength-variable filter 20, and the light-receiving element 21 overlap, and a plurality of light-emitting elements 10 are arranged to surround the opening 140. That is, the opening 140 and the wavelength-variable filter 20 overlap on the optical axis of the light-receiving element 21, and the plurality of light-emitting elements 10 are arranged to surround the optical axis of the light-receiving element 21. Therefore, light emitted from the plurality of light-emitting elements 10 is reflected by the image IMG, and the reflected light enters the wavelength-variable filter 20 through the opening 140. Then, light of a predetermined wavelength that has passed through the wavelength-variable filter 20 enters the light-receiving element 21. In this way, by arranging the components of the optical system in an overlapping manner in the Z-axis direction, the space required for the optical system is reduced, and the housing 100 can be miniaturized.

[0101] In addition, such as Figure 15 As shown, the operation unit 32 and the region A1, which is configured with a plurality of light-emitting elements 10, are positioned overlapping each other on the optical axis of the light-receiving element 21. Therefore, when the user operates the operation unit 32, a force is applied directly to the optical axis of the light-receiving element 21, thus the optical axis of the light-receiving element 21 is less prone to wobbling or shifting relative to the image IMG. Furthermore, in this embodiment, the plurality of light-emitting elements 10 are disposed on the surface 102R of the second substrate 102 in a manner that surrounds the opening 140; therefore, region A1 is the region containing the smallest circle of each configuration area of ​​the plurality of light-emitting elements 10.

[0102] In addition, such as Figure 15 As shown, in the Z-axis direction orthogonal to the plane 104R of the fourth substrate 104 where the wireless communication module 31 is located, the display module 50 and the wireless communication module 31 do not overlap. Therefore, the possibility of the display module 50 causing a decrease in the receiving sensitivity of the wireless communication module 31 is reduced.

[0103] In addition, such as Figure 15 As shown, in the Z-axis direction, the first processor 30 and the light-receiving element 21 do not overlap with the power supply circuit 41. Therefore, the possibility of the heat emitted by the power supply circuit 41 causing changes in the characteristics of the light-receiving element 21 is reduced, and the heat dissipation of the power supply circuit 41, the first processor 30, and the light-receiving element 21, which are respectively heat sources, is improved.

[0104] 4. Effects

[0105] In order to solve at least one of the various problems arising from having a battery 70 and being portable and capable of operating as a single unit, the image processing apparatus 1 of this embodiment has conducted various studies on the configuration of each component.

[0106] One challenge is to reduce the possibility of malfunctions caused by heat generated in the confined space inside the small housing 100. In the image processing apparatus 1 of this embodiment, the light-receiving element 21, which may become a heat source during image processing, and the first processor 30 are disposed on the first substrate 101. Additionally, a plurality of light-emitting elements 10, which may become a heat source during image processing, and the light-emitting element driving circuit 11 are disposed on the second substrate 102. Furthermore, the power supply circuit 41, which may become a heat source during image processing, and the second processor 40 are disposed on the third substrate 103. Thus, in the image processing apparatus 1 of this embodiment, since the components that may become heat sources are distributed on the first substrate 101, the second substrate 102, and the third substrate 103, mutual thermal influence can be reduced, resulting in stable operation.

[0107] Furthermore, since the power supply circuit 41 does not overlap with the light-receiving element 21 in the Z-axis direction, the possibility of changes in the characteristics of the light-receiving element 21 due to heat emitted by the power supply circuit 41 is reduced, and the heat dissipation of both the power supply circuit 41 and the light-receiving element 21 is improved. Therefore, according to the image processing apparatus 1, the possibility of a decrease in the accuracy of image processing based on the amount of light received by the light-receiving element 21 is reduced, and it is possible to operate continuously for a long time while maintaining a certain quality.

[0108] In addition, according to the image processing device 1, the first processor 30, which may become a heat source, does not overlap with the power supply circuit 41 in the Z-axis direction. Therefore, the heat dissipation of the first processor 30 and the power supply circuit 41 is improved respectively.

[0109] Furthermore, in the image processing apparatus 1, the wireless communication module 31 is disposed on a fourth substrate 104, which is different from the first substrate 101, the second substrate 102, and the third substrate 103, which are respectively disposed as light-receiving elements 21, multiple light-emitting elements 10, and power supply circuit 41, which may become heat sources. Therefore, according to the image processing apparatus 1, the possibility of the wireless communication module 31, which requires stable operation, malfunctioning due to heat is reduced.

[0110] Furthermore, in the image processing apparatus 1, the battery 70 located between the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104 acts as a thermal barrier, making it difficult for heat generated by the first substrate 101, the second substrate 102, and the third substrate 103 to be transferred to the fourth substrate 104. Therefore, according to the image processing apparatus 1, the wireless communication module 31 disposed on the fourth substrate 104 is not easily affected by the rapid increase in temperature of the first substrate 101, the second substrate 102, and the third substrate 103 during image processing, thus ensuring stable communication quality.

[0111] In addition, such as Figure 5 As shown, in the image processing apparatus 1, the cross-sectional area of ​​the portion of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 is small. Therefore, compared to a battery with a cuboid shape, the gap between the battery 70 and the first substrate 101, the second substrate 102, and the third substrate 103 is large. Therefore, according to the image processing apparatus 1, heat from the first substrate 101, the second substrate 102, and the third substrate 103, which are respectively provided with a light-receiving element 21, a plurality of light-emitting elements 10, and a power supply circuit 41 (which may become heat sources), is easily dissipated, and heat dissipation is improved.

[0112] Furthermore, the fourth substrate 104 is equipped with a wireless communication module 31 and a light-emitting module 33, which operate only for short periods when necessary and thus generate little heat, an operation unit 32 that generates almost no heat, and a buzzer 34. Therefore, although the fourth substrate 104 generates heat during image processing to relay display signals to the display module 50, at least one of the first substrate 101, the second substrate 102, and the third substrate 103 generates more heat than the fourth substrate 104. In fact, unless special circumstances such as frequent wireless communication occur, the first substrate 101, the second substrate 102, and the third substrate 103 all generate more heat than the fourth substrate 104. Thus, in the image processing apparatus 1, components with relatively high heat generation are disposed on the first substrate 101, the second substrate 102, and the third substrate 103, which have high heat dissipation, while components with relatively low heat generation are disposed on the fourth substrate 104, which is less susceptible to heat. Therefore, according to the image processing apparatus 1, heat dissipation can be improved while ensuring the capacity of the battery 70, thus enabling continuous operation for extended periods while maintaining a certain quality.

[0113] Furthermore, according to the image processing apparatus 1, since the first processor 30, which may become a heat source, is disposed on the first substrate 101 with good heat dissipation, it can operate continuously for a long time while ensuring a certain quality.

[0114] Furthermore, according to the image processing apparatus 1, since the second processor 40, which may become a heat source, is disposed on the third substrate 103 with good heat dissipation, it can operate continuously for a long time while ensuring a certain quality.

[0115] Achieving good noise resistance and responsiveness is also a challenge. In the image processing apparatus 1 of this embodiment, since a first processor 30 for image processing is provided on a first substrate 101 on which the light-receiving element 21 is provided, the signal output from the light-receiving element 21 is transmitted to the first processor 30 without passing through the second substrate 102, the third substrate 103, and the fourth substrate 104. Therefore, good noise resistance and responsiveness can be achieved according to the image processing apparatus 1.

[0116] Furthermore, in the image processing apparatus 1, a second processor 40 for power control is provided on the third substrate 103 where the power supply circuit 41 is provided. Therefore, the signal output from the second processor 40 is not transmitted to the power supply circuit 41 via other substrates. Thus, according to the image processing apparatus 1, good noise immunity and responsiveness can be achieved.

[0117] Furthermore, according to the image processing apparatus 1, the wireless communication module 31 is disposed in the fourth substrate 104 at the end region of the long side direction where the distance from the inner wall surface of the housing 100 is small. Therefore, it is not easily affected by noise and can improve communication sensitivity.

[0118] Furthermore, according to the image processing apparatus 1, the light-receiving element 21, multiple light-emitting elements 10, power supply circuit 41, wireless communication module 31, and operation unit 32 are respectively disposed on different substrates. Therefore, mutual interference from heat, vibration, signals, etc., is reduced, and stable operation is achieved. Thus, according to the image processing apparatus 1, the possibility of image processing accuracy decreasing due to mutual interference from heat, vibration, signals, etc., among multiple components is reduced, and continuous operation with a certain quality can be maintained for a long time.

[0119] Furthermore, in the image processing apparatus 1, the wiring path from the third substrate 103 to the first substrate 101 is short, therefore, the decrease in voltage V3 supplied from the power supply circuit 41 disposed on the third substrate 103 to the first substrate 101 is smaller. Therefore, according to the image processing apparatus 1, a stable voltage can be supplied to the light-receiving element 21 disposed on the first substrate 101, thus reducing the possibility of decreased image processing accuracy.

[0120] Furthermore, according to the image processing apparatus 1, the wiring path between the light-receiving element 21 and the photoelectric conversion circuit 22 is shortened, the influence of noise on small signals is reduced, and thus the possibility of reduced image processing accuracy is reduced.

[0121] Furthermore, according to the image processing apparatus 1, the wireless communication module 31 does not overlap with the display module 50 in a direction orthogonal to the fourth substrate 104, thus reducing the possibility of decreased receiving sensitivity due to the display module 50.

[0122] Improving user operability and convenience is also a key issue. In the image processing apparatus 1 of this embodiment, a first substrate 101 is disposed between a third substrate 103 and a second substrate 102 in the Z-axis direction, and a third substrate 103 is disposed between a battery 70 and the first substrate 101. The battery 70 is located between the third substrate 103 and a fourth substrate 104, and the battery 70 overlaps with the third substrate 103. Therefore, according to the image processing apparatus 1, the second substrate 102, the first substrate 101, the third substrate 103, the battery 70, and the fourth substrate 104 are sequentially overlapped, thus enabling the width of the housing 100 in the X-axis and Y-axis directions to be smaller than its height in the Z-axis direction. Therefore, the user can easily identify the position of the light-receiving element 21, and the operability of the image processing apparatus 1 is improved.

[0123] Furthermore, according to the image processing apparatus 1, in the Z-axis direction, the opening 140 of the second substrate 102, the wavelength variable filter 20, and the light-receiving element 21 overlap, and the multiple light-emitting elements 10 are arranged in a manner that surrounds the opening 140, thereby reducing the space required for the configuration of the optical system and thus enabling the housing 100 to be miniaturized.

[0124] Furthermore, in the image processing apparatus 1, the operation unit 32 and buzzer 34, which generate almost no heat, and the light-emitting module 33, which generates little heat, have virtually no impact on communication quality. Therefore, by arranging the operation unit 32, buzzer 34, and light-emitting module 33 on the fourth substrate 104 on which the wireless communication module 31 is disposed, the area of ​​the fourth substrate 104 is effectively utilized. Additionally, the display module 50, which generates less heat than the first substrate 101, second substrate 102, and third substrate 103, has less impact on communication quality. Therefore, the fourth substrate 104 on which the wireless communication module 31 is disposed is also effectively used as a relay substrate for relaying display signals to the display module 50. Therefore, according to the image processing apparatus 1, the housing 100 can be miniaturized, improving user operability.

[0125] Furthermore, in the image processing apparatus 1, the operation unit 32 disposed on the fourth substrate 104, the region A1 of the second substrate 102 on which a plurality of light-emitting elements 10 are disposed, and the light-receiving element 21 overlap on the optical axis of the light-receiving element 21. Therefore, when the user operates the operation unit 32, a force is directly applied to the optical axis of the light-receiving element 21. Thus, according to the image processing apparatus 1, when the user operates the operation unit 32, the optical axis of the light-receiving element 21 is less likely to wobble or shift relative to the image IMG of the object being processed, thereby increasing the probability of obtaining normal data.

[0126] For example, if the operation unit 32 is a button with physical displacement, the operation unit 32 will be physically displaced by the user's operation. Therefore, it is possible to reliably identify that the user has performed an operation. On the other hand, even if a large force is applied by the user's operation, the optical axis of the light-receiving element 21 is not prone to shaking or shifting.

[0127] In addition, if the operation unit 32 is an electrostatic capacitive button, the operation is detected by the user touching the operation unit 32. Therefore, the force applied by the user is small, and the optical axis of the light receiving element 21 is less likely to wobble or deviate.

[0128] Furthermore, according to the image processing apparatus 1, since the operation unit 32 is arranged at the center of the short side of the fourth substrate 104, it is easy for the user to operate, thus improving operability. Moreover, due to the improved operability, when the user operates the operation unit 32, the optical axis of the light-receiving element 21 is less prone to wobbling or shifting relative to the image IMG being processed.

[0129] Furthermore, according to the image processing device 1, even without applying a large force, the user can identify that the operation unit 32 has been operated based on the light emission state of the light-emitting module 33. Therefore, the amount of wobbling or offset of the optical axis of the light-receiving element 21 is reduced, and the probability of obtaining normal data is increased.

[0130] Furthermore, according to the image processing device 1, the user can identify the malfunction through the beeping sound and quickly restart the operation of the operation unit 32, thus improving the user's convenience.

[0131] Furthermore, according to the image processing device 1, it can operate independently without being instructed by other devices and is portable, thus providing high convenience to the user.

[0132] Improving maintainability is also an issue. In the image processing apparatus 1 of this embodiment, the light-receiving element 21, the plurality of light-emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 are respectively disposed on different substrates. Therefore, according to the image processing apparatus 1 of this embodiment, when any one of the light-receiving element 21, the plurality of light-emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 fails, only one substrate needs to be replaced, and it is not necessary to replace the other three substrates, thus ensuring good maintainability.

[0133] Furthermore, according to the image processing apparatus 1, since the light-emitting element driving circuit 11 and a plurality of light-emitting elements 10 are disposed on the second substrate 102, when at least one of them fails, the second substrate 102 can be replaced with a substrate that combines other light-emitting element driving circuits and other light-emitting elements and whose characteristics have been checked, thus ensuring good maintainability.

[0134] Furthermore, according to the image processing apparatus 1, since the light-receiving element 21 and the photoelectric conversion circuit 22 are disposed on the sub-substrate 113 of the first substrate 101, when at least one of them fails, the sub-substrate 113 of the first substrate 101 can be replaced with a substrate that combines other light-receiving elements and other photoelectric conversion circuits and whose characteristics have been checked, thus ensuring good maintainability.

[0135] As described above, the image processing apparatus 1 according to this embodiment can solve at least one of the various problems that are easily caused by having a battery 70 and being portable or operating as a single unit.

[0136] This invention is not limited to this embodiment, and various modifications can be made within the scope of the spirit of this invention.

[0137] For example, as an image processing apparatus according to the present invention, a colorimetric device was listed as an example in the above embodiments. However, the present invention can be applied to various image processing apparatuses with image processing functions, in addition to colorimetric devices. Examples of image processing apparatuses to which the present invention can be applied include mobile terminals such as smartphones, portable printers, portable scanners, portable display devices, and digital cameras.

[0138] The present invention has been described above in terms of its embodiments and modifications, but it is not limited to these embodiments or modifications and can be implemented in various ways without departing from its spirit. For example, the above embodiments and modifications can be appropriately combined.

[0139] This invention includes configurations that are substantially the same as those described in the embodiments, such as configurations with the same function, method, and result, or configurations with the same purpose and effect. Additionally, this invention includes configurations that replace non-essential parts of the configurations described in the embodiments. Furthermore, this invention includes configurations that can achieve the same effect as those described in the embodiments or that can achieve the same purpose. Additionally, this invention includes configurations that incorporate known techniques into the configurations described in the embodiments.

[0140] The following can be derived from the above implementation methods and variations.

[0141] One aspect of an image processing apparatus includes:

[0142] Light-receiving element;

[0143] Multiple light-emitting elements;

[0144] Battery;

[0145] The power supply circuit is electrically connected to the battery;

[0146] A first substrate is provided with the light-receiving element;

[0147] The second substrate is provided with the plurality of light-emitting elements;

[0148] The third substrate is provided with the power supply circuit; and

[0149] The housing contains the first substrate, the second substrate, and the third substrate.

[0150] The first substrate has a first surface and a second surface, and is disposed between the third substrate and the second substrate in a first direction orthogonal to the first surface.

[0151] The light-receiving element is disposed on the second surface.

[0152] The second substrate has a third surface, a fourth surface, and an opening, the third surface being opposite to the second surface, and the second substrate being configured such that the opening overlaps with the light-receiving element in the first direction;

[0153] The plurality of light-receiving elements are arranged on the fourth surface in such a manner that they surround the opening.

[0154] The power supply circuit is disposed on the third substrate in a manner that does not overlap with the light-receiving element in the first direction.

[0155] In this image processing apparatus, since the light-receiving element, light-emitting element, and power supply circuit, which could potentially become heat sources, are respectively disposed on different substrates, mutual thermal influence can be reduced, thus stabilizing operation. Furthermore, in this image processing apparatus, since the power supply circuit does not overlap with the light-receiving element in the first direction, the possibility of changes in the characteristics of the light-receiving element due to heat generated by the power supply circuit is reduced, and the heat dissipation of both the power supply circuit and the light-receiving element is improved. Therefore, according to this image processing apparatus, the possibility of a decrease in the accuracy of image processing based on the amount of light received by the light-receiving element is reduced, and continuous operation with a certain quality can be maintained for a long time.

[0156] Furthermore, according to the image processing apparatus, the opening of the second substrate overlaps with the light-receiving element in the first direction, and multiple light-emitting elements are arranged to surround the opening, thereby reducing the space required for the optical system and enabling miniaturization of the housing.

[0157] In one embodiment of the image processing apparatus, it may also be:

[0158] The image processing device has a processor.

[0159] The processor is disposed on the first substrate.

[0160] In this image processing apparatus, since a processor is mounted on a first substrate on which a light-receiving element is provided, the signal output from the light-receiving element is transmitted to the processor without passing through other substrates. Therefore, according to this image processing apparatus, good noise immunity and responsiveness can be achieved.

[0161] In one embodiment of the image processing apparatus, it may also be:

[0162] The processor is disposed on the first substrate in a manner that does not overlap with the power supply circuit in the first direction.

[0163] According to this image processing device, the processor, which may become a heat source, does not overlap with the power supply circuit in the first direction, thus improving the heat dissipation of both the processor and the power supply circuit.

[0164] In one embodiment of the image processing apparatus, it may also be:

[0165] The third substrate is disposed between the battery and the first substrate.

[0166] The battery overlaps with the third substrate in the first direction.

[0167] In this image processing apparatus, in a first direction, a first substrate is disposed between a third substrate and a second substrate, and a third substrate is disposed between a battery and the first substrate, with the battery and the third substrate overlapping. Therefore, according to this image processing apparatus, the second substrate, the first substrate, the third substrate, and the battery are sequentially overlapped, thus allowing the width of the housing to be less than its height. This makes it easier for the user to identify the position of the light-receiving element, improving the operability of the image processing apparatus.

[0168] In one embodiment of the image processing apparatus, it may also be:

[0169] The image processing device has:

[0170] Wireless communication module; and

[0171] Fourth substrate,

[0172] The wireless communication module is disposed on the fourth substrate.

[0173] In this image processing apparatus, the wireless communication module is disposed on a fourth substrate, separate from the first, second, and third substrates, which are respectively provided with a light-receiving element, a light-emitting element, and a power supply circuit, which may become heat sources. Therefore, according to this image processing apparatus, the possibility of the wireless communication module, which requires stable operation, malfunctioning due to heat is reduced.

[0174] In one embodiment of the image processing apparatus, it may also be:

[0175] The battery is disposed between the third substrate and the fourth substrate.

[0176] In this image processing apparatus, the battery acts as a thermal barrier, making it difficult for heat generated by the first, second, and third substrates to be transferred to the fourth substrate. Therefore, according to this image processing apparatus, the wireless communication module disposed on the fourth substrate is less affected by the rapid temperature increase of the first, second, and third substrates during image processing, ensuring stable communication quality.

[0177] In one embodiment of the image processing apparatus, it may also be:

[0178] The image processing device is capable of operating independently without instructions from other devices and is portable.

[0179] According to this image processing device, since it can operate as a single unit and is portable, user convenience is improved.

[0180] In one embodiment of the image processing apparatus, it may also be:

[0181] The image processing device has a wavelength-variable filter.

[0182] The wavelength-variable filter is disposed on the first substrate in a manner that overlaps with the light-receiving element and the opening in the first direction.

[0183] According to the image processing apparatus, in the first direction, the opening of the second substrate, the wavelength variable filter, and the light-receiving element overlap, thereby reducing the space required for the configuration of the optical system and enabling the housing to be miniaturized.

Claims

1. An image processing apparatus, characterized in that, have: Light-receiving element; Multiple light-emitting elements; Battery; The power supply circuit is electrically connected to the battery; A first substrate is provided with the light-receiving element; The second substrate is provided with the plurality of light-emitting elements; The third substrate is provided with the power supply circuit; as well as The housing contains the first substrate, the second substrate, and the third substrate. The first substrate has a first surface and a second surface, and is disposed between the third substrate and the second substrate in a first direction orthogonal to the first surface. The light-receiving element is disposed on the second surface. The second substrate has a third surface, a fourth surface, and an opening. The third surface faces the second surface, and the second substrate is configured such that the opening overlaps with the light-receiving element in the first direction. The plurality of light-emitting elements are arranged on the fourth surface in a manner that surrounds the opening. The power supply circuit is disposed on the third substrate in a manner that does not overlap with the light-receiving element in the first direction.

2. The image processing apparatus according to claim 1, characterized in that, The image processing device has a processor. The processor is disposed on the first substrate.

3. The image processing apparatus according to claim 2, characterized in that, The processor is disposed on the first substrate in a manner that does not overlap with the power supply circuit in the first direction.

4. The image processing apparatus according to any one of claims 1 to 3, characterized in that, The third substrate is disposed between the battery and the first substrate. The battery overlaps with the third substrate in the first direction.

5. The image processing apparatus according to claim 1, characterized in that, The image processing device has: Wireless communication module; and Fourth substrate, The wireless communication module is disposed on the fourth substrate.

6. The image processing apparatus according to claim 5, characterized in that, The battery is disposed between the third substrate and the fourth substrate.

7. The image processing apparatus according to claim 1, characterized in that, The image processing device is capable of operating independently without instructions from other devices and can be carried.

8. The image processing apparatus according to claim 1, characterized in that, The image processing device has a wavelength-variable filter. The wavelength-variable filter is disposed on the first substrate in a manner that overlaps with the light-receiving element and the opening in the first direction.

Images