Display panel and display panel manufacturing method

Abstract

The application is suitable for the technical field of display, and provides a display panel, which comprises a first substrate and a second substrate arranged oppositely; a plurality of micro-LEDs arranged at intervals on the first substrate; a plurality of color converters arranged on the second substrate and corresponding to the micro-LEDs respectively, wherein the color converter comprises a color filter film and a quantum dot layer stacked, and the quantum dot layer is used for changing the wavelength of light; and a light shielding piece located between adjacent color converters, wherein the light shielding piece comprises at least a first color resistance layer and a second color resistance layer stacked on the second substrate in sequence and different in color, and the gap between the light shielding piece and the adjacent micro-LED is arranged correspondingly. The application further provides a display panel manufacturing method. The display panel and the display panel manufacturing method provided by the application can effectively avoid color mixing between sub-pixels, are simple in process and low in cost.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a display panel and a display panel manufacturing method. BACKGROUND

[0002] Quantum dot display has become a new generation of display innovation technology due to its performance advantage of high color saturation. At present, a display device prepared based on quantum dot material generally comprises a single-color micro LED or mini LED and a quantum dot color conversion layer. With the development of technology, the chip size of the micro LED or mini LED and the spacing between the chips are becoming smaller and smaller. In order to prevent color mixing between different sub-pixels, a quantum dot barrier layer is generally prepared in the manufacturing process of the quantum dot color conversion layer. However, the preparation of the quantum dot barrier layer increases a yellow light process, which is relatively complicated and high in cost. SUMMARY

[0003] The present application provides a display panel and a display panel manufacturing method, which can solve the problem of color mixing.

[0004] The present application provides a display panel, which comprises:

[0005] a first substrate and a second substrate arranged oppositely;

[0006] a plurality of micro LEDs arranged on the first substrate at intervals;

[0007] a plurality of color converters arranged on the second substrate and opposite to the micro LEDs respectively, the color converters comprising a color filter film and a quantum dot layer stacked, and the quantum dot layer being used for changing the wavelength of light;

[0008] a light shielding member located between adjacent color converters, the light shielding member comprising at least a first color resistance layer and a second color resistance layer stacked on the second substrate in sequence and different in color, and the gap between the light shielding member and adjacent micro LEDs being arranged opposite.

[0009] In an embodiment, the height of the light shielding member is greater than the height of the color converter, the height difference between the light shielding member and the color converter is less than 2 microns, and the end of the light shielding member is inserted into the gap between adjacent micro LEDs.

[0010] In an embodiment, the first substrate is further provided with an encapsulation layer for encapsulating the micro LEDs on the first substrate, and the encapsulation layer is a patterned light shielding photoresist; and the end surface of the light shielding member away from the second substrate is attached to the encapsulation layer.

[0011] In an embodiment, the micro-LED includes an LED chip and an electrode connected to the LED chip, and the encapsulation layer is flush with a lower surface of the LED chip facing the first substrate.

[0012] In an embodiment, the plurality of LEDs are all blue light LEDs, and the plurality of quantum dot layers are respectively a first unit having red quantum dots, a second unit having green quantum dots, and a third unit without quantum dots.

[0013] In an embodiment, the light shielding member further includes a third color resistance layer disposed on a side of the second color resistance layer facing away from the second substrate, the first color resistance layer is a blue color resistance layer, one of the second color resistance layer and the third color resistance layer is a red color resistance layer, and the other is a green color resistance layer.

[0014] In an embodiment, the first color resistance layer is a blue color resistance layer, and the second color resistance layer is a red color resistance layer.

[0015] The present application also provides a display panel manufacturing method, including:

[0016] providing a first substrate, disposing a plurality of micro-LEDs on the first substrate, and arraying the plurality of micro-LEDs on the first substrate with mutual spacing;

[0017] providing a second substrate, manufacturing a plurality of color filter films and a light shielding member on the second substrate, the light shielding member being located between adjacent color filter films, and the light shielding member including a first color resistance layer and a second color resistance layer with different colors disposed on the second substrate in sequence;

[0018] manufacturing a quantum dot layer on the color filter film, the quantum dot layer and the corresponding color filter film forming a color converter;

[0019] assembling and adhering the first substrate and the second substrate, the color converter being disposed opposite to the micro-LED, and the light shielding member being disposed opposite to the gap between adjacent micro-LEDs.

[0020] In an embodiment, the height of the light shielding member is greater than the height of the color converter, the height difference between the light shielding member and the color converter is less than 2 microns, and the end of the light shielding member is inserted into the gap between adjacent micro-LEDs.

[0021] In an embodiment, the micro-LED includes an LED chip and an electrode connected to the LED chip, and the display panel manufacturing method further includes, after disposing the plurality of micro-LEDs on the first substrate:

[0022] A packaging layer is made on the first substrate, the packaging layer is filled between the LED chip and the first substrate, the upper surface of the packaging layer away from the first substrate is flush with the lower surface of the LED chip facing the first substrate, and the packaging layer is attached to the light shielding piece.

[0023] The display panel includes a first substrate and a second substrate arranged oppositely, micro-LEDs arranged on the first substrate, color converters and light shielding pieces arranged on the second substrate, and the display panel can control the micro-LEDs to emit light to the color converters to realize color display. The light shielding pieces are located between adjacent color converters, and the light shielding pieces face the gaps between adjacent micro-LEDs. Therefore, the light shielding pieces can prevent the light emitted by the micro-LEDs from irradiating the color converters of adjacent sub-pixels to be emitted, thereby preventing color mixing, and the display panel has good display effect.

[0024] The light shielding pieces include first and second color resistance layers with different colors and arranged on the second substrate in sequence. Therefore, the light shielding pieces have good light shielding effect, and the light shielding pieces can be manufactured simultaneously in the process of manufacturing the color filter film without increasing the process steps. In addition, the display panel does not need to manufacture a black matrix and a barrier wall, thereby saving two yellow light processes. The display panel has simple structure, simple process and low cost. In addition, since the color resistance layer replaces the original position of the black matrix, and the color filter film has a certain reflectivity, the light emitted laterally by the micro-LEDs is reflected by the light shielding pieces, thereby improving the light efficiency of the micro-LEDs and improving the brightness of the product. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0026] Figure 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application;

[0027] Figure 2 is Figure 1 is a structural schematic diagram of an array substrate in the display panel shown in FIG. 1;

[0028] Figure 3 is Figure 1 is a structural schematic diagram of a color film substrate in the display panel shown in FIG. 1;

[0029] Figure 4 is a structural schematic diagram of a color film substrate in the display panel provided by an embodiment of the present application;

[0030] Figure 5 FIG. 2 is a structural schematic diagram of a color film substrate in a display panel provided by Embodiment Three of the present application;

[0031] Figure 6 FIG. 3 is a flowchart of a display panel manufacturing method provided by Embodiment Four of the present application;

[0032] Figure 7 FIG. 4 is a structural schematic diagram of a second substrate after manufacturing a color filter film and a light shielding member provided by Embodiment Four of the present application.

[0033] The meanings of the labels in the figures are as follows:

[0034] 100, display panel;

[0035] 10, array substrate; 11, first substrate; 12, micro LED; 121, LED chip; 122, electrode; 13, encapsulation layer;

[0036] 20, color film substrate; 21, second substrate; 22, color converter;

[0037] 221, color filter film; 221a, red filter film; 221b, green filter film; 221c, blue filter film;

[0038] 222, quantum dot layer; 222a, first unit; 222b, second unit; 222c, third unit;

[0039] 23, light shielding member; 231, first color resist layer; 232, second color resist layer; 233, third color resist layer. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings, i.e. embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0041] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] It should be understood that the terms "length," "width," "upper," "lower," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] To illustrate the technical solutions described in this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0045] Example 1

[0046] Embodiment 1 of the first aspect of this application provides a display panel. Please refer to... Figure 1 The display panel 100 includes an array substrate 10 and a color filter substrate 20 disposed opposite to each other.

[0047] The array substrate 10 includes a first substrate 11 and a plurality of microLEDs 12, which are arranged in an array on the first substrate 11 at intervals. A microLED 12 refers to a microLED with a chip size between 0.5 and 200 micrometers. The microLED 12 can be a microLED with a chip size between 0.5 and 100 micrometers, or a miniLED with a chip size between 50 and 200 micrometers. In this embodiment, the microLED 12 is described as a microLED.

[0048] The first substrate 11 is also provided with a driving circuit (not shown). The driving circuit may include a number of scan lines, a number of signal lines, and an array of thin film transistors (TFTs). The multiple scan lines and multiple signal lines intersect each other to define multiple sub-pixel regions. Each sub-pixel region is provided with at least one thin film transistor and a micro LED 12. The micro LED 12 emits light under the drive of the driving circuit.

[0049] The color film substrate 20 includes a second substrate 21 arranged opposite to the first substrate 11, a plurality of color converters 22 and a light shielding member 23 arranged on the second substrate 21. The plurality of color converters 22 are arranged opposite to the plurality of micro-LEDs 12 respectively, and each color converter 22 includes a color filter film 221 and a quantum dot layer 222 stacked, the quantum dot layer 222 is arranged on a side of the color filter film 221 away from the second substrate 21, the quantum dot layer 222 is used to change the wavelength of light, and the color filter film 221 allows the light converted by the quantum dot layer 222 to pass through or allows the unconverted light to pass through.

[0050] In an embodiment, the plurality of micro-LEDs 12 are all blue light LEDs; the color filter films 221 are respectively red (R) filter film 221a, green (G) filter film 222b and blue (B) filter film 222c; and the plurality of quantum dot layers 222 are respectively a first unit 222a with red quantum dots, a second unit 222b with green quantum dots and a third unit 222c without quantum dots, the first unit 222a is used to convert light into red light to realize the light conversion output of red color; the second unit 222b is used to convert light into green light to realize the light conversion output of green color; and the third unit 222c does not convert blue light and directly transmits blue light. In this way, the red light, the green light and the blue light after the quantum dot layer 222 pass through the red filter film 221a, the green filter film 221b and the blue filter film 221c respectively to project to the outside of the second substrate 21 to display colors. It can be understood that the plurality of micro-LEDs 12 can also be LEDs of other colors, and the color filter films 221 are not limited to the red filter film 221a, the green filter film 221b and the blue filter film 221c, as long as the color converter 22 can convert the color of light and allow light of a specific wavelength to pass through, the display effect can be realized.

[0051] Optionally, the third unit 222c corresponding to the blue filter film can be a light-transmitting film for directly transmitting blue light, or the third unit 222c corresponding to the blue filter film is a scattering film to scatter blue light and improve the uniformity of light.

[0052] The light shielding member 23 is arranged on the second substrate 21 and located between adjacent color converters 22, and the light shielding member 23 at least includes first and second color resist layers 231 and 232 which are stacked on the second substrate 21 in sequence and have different colors, so that the light shielding member 23 can have a light shielding effect and can replace the bank layer in the prior art. It can be understood that the light shielding member 23 can also include three color resist layers with different colors, or more than three color resist layers. It should be noted that the color resist layer and the color filter film 221 are made of the same material in the same process, and are distinguished here due to different positions and functions.

[0053] The array substrate 10 is attached to the color filter substrate 20, and the gap between the light shielding member 23 and the adjacent micro LED 12 is arranged opposite. Optionally, the height of the light shielding member 23 is greater than the height of the color converter 22, and the height of the light shielding member 23 is inserted into the gap between the adjacent micro LEDs 12, so that the light shielding member 23 can block the light emitted by the micro LED 12 from shining into the adjacent sub-pixels and reflecting part of the light to improve the light efficiency; further, the light shielding member 23 can fill the gap between the micro LEDs 12, or the light shielding member 23 fills part of the height of the gap between the micro LEDs 12. Optionally, the height of the light shielding member 23 can also be less than or equal to the height of the color converter 22.

[0054] It can be understood that if the first substrate 11 is provided with a light shielding part, such as a packaging layer, the light shielding member 23 can also be attached to the packaging layer on the first substrate 11, so that the light shielding part and the packaging layer together block the light emitted by the micro LED 12 from shining into the adjacent sub-pixels, at this time the light shielding member 23 can also not be inserted into the gap between the micro LEDs 12, but flush with the upper surface of the micro LED 12.

[0055] The display principle of the display panel 100 is that the driving circuit on the first substrate 11 drives the micro LED 12 in each sub-pixel to emit light, the light emitted by each micro LED 12 shines on the quantum dot layer 222 arranged opposite to it, the quantum dot layer 222 changes the wavelength of the light or directly transmits the light emitted by the micro LED 12, the light passing through the quantum dot layer 222 shines on the corresponding color filter film 221, and is conducted to the outside of the second substrate 21 through the color filter film 221, to realize the display effect.

[0056] In the above display panel 100, the size of the micro LED 12 is small and the pitch is small, and the gap between the light shielding member 23 and the adjacent micro LED 12 is arranged opposite, which can avoid the light emitted by the micro LED 12 from lighting the adjacent sub-pixels, Figure 1The light emitted by the micro-LED 12 is shown in FIG. 1. The micro-LED 12 emits light to its four directions. The light emitted by the micro-LED 12 to the side is obliquely arranged with the first substrate 11 and the second substrate 21. The light shielding member 23 can shield the light emitted by the micro-LED 12 to the side, so as to prevent the light emitted by the micro-LED 12 to the side from irradiating into the adjacent sub-pixel. The light shielding member 23 is composed of a color resist layer, and can also reflect part of the light. Therefore, the display panel 100 can prevent color mixing between different sub-pixels, and improve the light efficiency of the micro-LED 12. The display panel 100 includes the oppositely arranged first substrate 11 and second substrate 21, the micro-LED 12 arranged on the first substrate 11, and the color converter 22 and the light shielding member 23 arranged on the second substrate 21. The display panel 100 can control the micro-LED 12 to emit light, so that the light irradiates into the color converter 22, to realize color display. The light shielding member 23 is located between the adjacent color converters 22, and the gap between the light shielding member 23 and the adjacent micro-LED 12 is arranged opposite. Therefore, the light shielding member 23 can shield the light emitted by the micro-LED 12 from irradiating into the color converter 22 of the adjacent sub-pixel to be emitted, so that the light shielding member 23 can prevent color mixing, and the display effect of the display panel 100 is better.

[0057] The light shielding member 23 includes at least the first color resist layer 231 and the second color resist layer 232 which are sequentially stacked on the second substrate 21 and have different colors. Therefore, the light shielding member 23 can have a better light shielding effect. The light shielding member 23 can be simultaneously manufactured in the process of manufacturing the color filter 221, without increasing the process steps. The light shielding member 23 has a light shielding effect, which can not only shield the driving circuit (scanning line, signal line, thin film transistor, etc.) on the first substrate 11, but also shield and reflect the light emitted by the micro-LED 12 to the side. The display panel 100 does not need to be manufactured with a black matrix (BM) and a barrier wall, and can save 2 yellow light processes. The structure and process of the display panel 100 are simple, and the cost is low. In addition, since the light shielding member 23 replaces the original position of the black matrix, and the color resist layer in the light shielding member 23 has a certain reflectivity, part of the light emitted by the micro-LED 12 to the side can be reflected by the light shielding member 23, which improves the light efficiency of the micro-LED 12, and is beneficial to improving the brightness of the product.

[0058] Please refer to Figure 1 and Figure 2 In an embodiment, the first substrate 11 further includes an encapsulation layer 13 for encapsulating the micro-LED 12 on the first substrate 11.

[0059] Optionally, the encapsulation layer 13 is a patterned light-shielding photoresist, which can fix the micro-LED 12 and has a light-shielding effect. If the micro-LED 12 is a micro-LED, the encapsulation layer 13 can be a black light-shielding photoresist; if the micro-LED 12 is a mini-LED, the encapsulation layer 13 can also be a light-shielding or semi-transparent photoresist. The light-shielding photoresist has a light-shielding effect and is convenient for patterned production by exposure and development. It can be understood that the encapsulation layer 13 can also use other light-shielding materials, for example, a black matrix.

[0060] Optionally, the end surface of the light-shielding piece 23 away from the second substrate 21 is attached to the encapsulation layer 13. In this way, the light-shielding piece 23 can completely shield the light emitted by the micro-LED 12 from irradiating into the adjacent sub-pixel, and the anti-cross talk effect is better. It can be understood that the end surface of the light-shielding piece 23 away from the second substrate 21 can also have a certain gap with the encapsulation layer 13.

[0061] As shown in FIG. 1, Figure 2 In an embodiment, the micro-LED 12 includes an LED chip 121 and an electrode 122 connected to the LED chip 121, and the LED chip 121 is electrically connected to the driving circuit on the first substrate 11 through the electrode 122. The encapsulation layer 13 is filled between the LED chip 121 and the first substrate 11. The encapsulation layer 13 is not only located between the electrodes 122 of adjacent micro-LEDs 12, but also located between the two electrodes 122 of each micro-LED 12, and the encapsulation effect is better.

[0062] The upper surface of the encapsulation layer 13 away from the first substrate 11 is flush with the lower surface of the LED chip 121 toward the first substrate 11. By adopting the above technical solution, the encapsulation layer 13 will not shield the light emitted by the micro-LED 12 from irradiating to the color film substrate 20, avoiding the loss of light efficiency. It can be understood that in other embodiments, the upper surface of the encapsulation layer 13 away from the first substrate 11 can also be higher or lower than the lower surface of the LED chip 121.

[0063] Please refer to Figure 1 and Figure 3 In an embodiment, a height difference H is formed between the light-shielding piece 23 and the color converter 22, that is, there is a height difference H between the height of the light-shielding piece 23 on the second substrate 21 and the height of the color converter 22 on the second substrate 21, so that the end of the light-shielding piece 23 protrudes from the color converter 22, and the height difference part of the light-shielding piece 23 can be inserted into the gap between the adjacent micro-LEDs 12. Optionally, the height difference H is less than 2 microns, for example, the height difference H is 0.5-2 microns. As shown in FIG. 1, Figure 1 In an embodiment, the height difference part of the light-shielding piece 23 is just inserted into the gap between the adjacent micro-LEDs 12 and attached to the encapsulation layer 13, which can shield the light emitted laterally by the micro-LED 12 from irradiating into the color converter 22 of the adjacent sub-pixel.

[0064] It is understandable that, in order to achieve a height difference H between the light-shielding component 23 and the color converter 22, the height of each color resist layer or the number of color resist layers in the light-shielding component 23 can be adjusted adaptively. Of course, if the height of the encapsulation layer 13 is appropriately increased, for example, if the encapsulation layer 13 is set to be flush with or slightly higher than the lower surface of the micro-LED 12 chip, the height of the light-shielding component 23 can be reduced accordingly, and the effect of preventing color mixing can be achieved by using the encapsulation layer 13 and the light-shielding component 23.

[0065] In some embodiments, the light-shielding member 23 further includes a third color resist layer 233 disposed on the side of the second color resist layer 232 away from the second substrate 21; the first color resist layer 231 is a blue color resist layer, and one of the second color resist layer 232 and the third color resist layer 233 is a red color resist layer and the other is a green color resist layer.

[0066] like Figure 3 As shown, in Embodiment 1, the first color resist layer 231 is a blue color resist layer, the second color resist layer 232 is a green color resist layer, and the third color resist layer 233 is a red color resist layer, meaning the stacking order of the color resist layers in the light-shielding component 23 is BGR. When the display panel needs to display a pure blue image, it is not necessary to excite the red and green quantum dots. If the RGB stacking order is used, the lateral light from the micro-LED 12 may pass through the blue color resist layer and excite the quantum dots in the adjacent sub-pixel area, resulting in the inability to obtain a pure blue image. In this embodiment, by placing the blue color resist layer on the side closest to the second substrate 21, the blue color resist layer can replace the black matrix; at the same time, by placing the red color resist layer on the side closest to the micro-LED 12, since the red and blue spectra do not overlap in the visible light wavelength range, the blue light will not pass through the red filter layer, resulting in a better anti-color mixing effect.

[0067] Example 2

[0068] The display panel provided in Embodiment 2 is similar to that in Embodiment 1, including a first substrate 11 and a second substrate 21 disposed opposite to each other, micro-LEDs 12 arrayed on the first substrate 11, and a color converter 22 and a light-shielding member 23 disposed on the second substrate 21. The light-shielding member 23 includes a first color resist layer 231, a second color resist layer 232 and a third color resist layer 233 sequentially stacked on the second substrate 21.

[0069] Please refer to Figure 4 , Figure 4 The illustration shows the color filter substrate 20 in the display panel provided in Embodiment 2, wherein the first color resist layer 231 in the light shield 23 is a blue color resist layer, the second color resist layer 232 is a red color resist layer, and the third color resist layer 233 is a green color resist layer, that is, the stacking order of the color resist layers in the light shield 23 is BRG.

[0070] In the embodiment, the blue light emitted by the micro LED 12 cannot penetrate the red color resistance layer in the light shielding member 23, and only a small part of the blue light can penetrate the green color resistance layer, so that the display panel has good anti-color mixing effect.

[0071] Embodiment three

[0072] The display panel provided in Embodiment Two is similar to Embodiment One, and includes a first substrate 11 and a second substrate 21 arranged oppositely, a micro LED 12 arranged on the first substrate 11, and a color converter 22 and a light shielding member 23 arranged on the second substrate 21.

[0073] Please refer to Figure 5 , Figure 5 The color film substrate 20 in the display panel provided in Embodiment Three is shown, wherein the light shielding member 23 includes a first color resistance layer 231 and a second color resistance layer 232 arranged on the second substrate 21 in sequence, the first color resistance layer 231 is a blue color resistance layer, and the second color resistance layer 232 is a red color resistance layer.

[0074] In the embodiment, the light shielding member 23 includes a blue color resistance layer and a red color resistance layer, so that the light shielding member 23 can play a role of light shielding; and the blue light emitted by the micro LED 12 cannot penetrate the red color resistance layer in the light shielding member 23, so that the display panel has good anti-color mixing effect.

[0075] It can be understood that, in order to enable the end of the light shielding member 23 to be inserted into the gap between adjacent micro LEDs 12, the thickness of the first color resistance layer 231 or the second color resistance layer 232 can be adjusted appropriately, so as to ensure that the light shielding member 23 and the color converter 22 have a preset height difference.

[0076] Embodiment four

[0077] Embodiment Four of the second aspect of the application provides a display panel manufacturing method, which can manufacture the display panel 100 of any one of the embodiments of the first aspect.

[0078] Please refer to Figure 1 and Figure 6 , the display panel manufacturing method is as follows.

[0079] In step S10, a first substrate 11 is provided, and a plurality of micro LEDs 12 are arranged on the first substrate 11, and the plurality of micro LEDs 12 are spaced apart from each other and arranged on the first substrate 11.

[0080] It can be understood that the provided first substrate 11 has a driving circuit; the micro LEDs 12 arranged on the first substrate 11 can be arranged by means of mass transfer, and the micro LEDs 12 can be micro LEDs or mini LEDs.

[0081] At step S20, a second substrate 21 is provided, and a plurality of color filter films 221 and a light shielding member 23 are formed on the second substrate 21.

[0082] The light shielding member 23 is located between adjacent color filter films 221, and the light shielding member 23 includes first color resist layers 231 and second color resist layers 232 which are sequentially stacked on the second substrate 21 and have different colors.

[0083] Please refer to the second substrate 21 shown in Figure 7 , Figure 7 The color filter films 221 and the light shielding member 23 have been formed on the second substrate 21. In the embodiment shown in Figure 7 , step S20 specifically includes: first, forming an array of first color resist layers 231 and blue color filter films 221c on the second substrate 21, and then forming an array of second color resist layers 232 and green color filter films 221b on the second substrate 21, the second color resist layers 232 being stacked on the first color resist layers 231, and the green color filter films 221b being arranged on the surface of the second substrate 21; and then forming an array of third color resist layers 233 and red color filter films 221a on the second substrate 21, the third color resist layers 233 being stacked on the second color resist layers 232, and the red color filter films 221a being arranged on the surface of the second substrate 21. In this way, the light shielding member 23 can be formed simultaneously in the step of forming the color filter films 221, without the need to form a black matrix or a barrier wall, thereby saving the yellow light process.

[0084] It can be understood that the stacking order of the color resist layers is not limited thereto, and the light shielding member 23 can also include only the first color resist layers 231 and the second color resist layers 232, or include three or more layers of color resist layers, which can be adjusted as needed.

[0085] At step S30, a quantum dot layer 222 is formed on the color filter films 221.

[0086] The quantum dot layer 222 and the corresponding color filter film 221 form a color converter 22, and optionally, the height of the light shielding member 23 is greater than the height of the color converter 22.

[0087] Please refer to Figure 1 , Figure 3 and Figure 7 , the plurality of quantum dot layers 222 are respectively a first unit 222a having red quantum dots, a second unit 222b having green quantum dots, and a third unit 222c without quantum dots, and the first unit 222a, the second unit 222b and the third unit 222c in the quantum dot layer 222 are respectively stacked with the red color filter film 221a, the green color filter film 221b and the blue color filter film 221c.

[0088] Optionally, the quantum dot layer 222 is manufactured by inkjet printing. Since the manufacturing method has formed the pits, the inkjet printing can avoid the uneven film thickness of the quantum dot layer 222 in the pits. It can be understood that other methods can also be used to manufacture the quantum dot layer 222, for example, coating method.

[0089] In step S40, the first substrate 11 and the second substrate 21 are assembled and bonded.

[0090] After assembly, the color converter 22 is arranged opposite to the micro LED 12, and the light shielding member 23 is arranged opposite to the gap between the adjacent micro LEDs 12.

[0091] Optionally, the end of the light shielding member 23 is inserted into the gap between the adjacent micro LEDs 12. It can be understood that the light shielding member 23 can fill the gap between the micro LEDs 12, or the light shielding member 23 fills part of the height of the gap between the micro LEDs 12.

[0092] It can be understood that the order of steps S10 and steps S20-S40 is not limited.

[0093] In the above display panel manufacturing method, the plurality of color filters 221 and the light shielding member 23 are manufactured on the second substrate 21 at the same time, and then the quantum dot layer 222 is manufactured; after the first substrate 11 and the second substrate 21 are assembled, the end of the light shielding member 23 is inserted into the gap between the adjacent micro LEDs 12, so that the light shielding member 23 can have a good light shielding effect and avoid color mixing between adjacent sub-pixels; the above display panel manufacturing method omits the manufacturing steps of the black matrix and the barrier wall, saves 2 masks; at the same time, the light shielding member 23 is composed of the color resist layer, which can also reflect a certain light, improve the light efficiency utilization rate of the micro LED 12, and further improve the product brightness. Therefore, the above display panel manufacturing method can manufacture a display panel with better display effect and higher brightness, and the process is simple and the cost is low.

[0094] In an embodiment, the micro LED 12 includes an LED chip 121 and an electrode 122 connected to the LED chip 121, after the plurality of micro LEDs 12 are arranged on the first substrate 11, the display panel manufacturing method further includes: manufacturing an encapsulation layer 13 on the first substrate 11, the encapsulation layer 13 fills between the LED chip 121 and the first substrate 11, and the upper surface of the encapsulation layer 13 away from the first substrate 11 is flush with the lower surface of the LED chip 121 facing the first substrate 11 and is in contact with the light shielding member 23.

[0095] Optionally, the encapsulation layer 13 is not only located between the electrodes 122 of adjacent micro-LEDs 12, but also between the two electrodes 122 of each micro-LED 12, and the encapsulation effect is better; the encapsulation layer 13 is in close contact with the light shielding piece 23, and can completely block the light emitted by the micro-LED 12 from irradiating into the adjacent sub-pixels, and the light shielding piece 23 can reflect part of the light, thereby improving the light efficiency.

[0096] Optionally, the encapsulation layer 13 is black photoresist, and the step of manufacturing the encapsulation layer 13 includes: coating black photoresist on the first substrate 11, exposing and developing the black photoresist to patternize the black photoresist to form the encapsulation layer 13. The black photoresist can be positive photoresist, and when the black photoresist is exposed, the black photoresist under the micro-LED 12 is blocked by the micro-LED 12 and is not exposed, and is retained on the first substrate 11 after development.

[0097] By adopting the above technical solution, the encapsulation layer 13 will not block the light emitted by the micro-LED 12 from irradiating to the color film substrate 20, thereby avoiding the loss of light efficiency. It can be understood that in other embodiments, the upper surface of the encapsulation layer 13 away from the first substrate 11 can also be higher or lower than the lower surface of the LED chip 121.

[0098] The display panel 100 and the display panel manufacturing method provided by the present application can effectively prevent color mixing and improve the light efficiency of the micro-LED, thereby improving the brightness of the product; the process of the display panel 100 and the display panel manufacturing method is simple and the cost is low.

[0099] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A display panel, characterized by, include: A first substrate and a second substrate arranged opposite to each other; Multiple microLEDs are arrayed on the first substrate at intervals, and all of the microLEDs are blue LEDs; Multiple color converters are disposed on the second substrate and respectively facing the micro-LEDs. Each color converter includes a stacked color filter film and a quantum dot layer, wherein the quantum dot layer is used to change the wavelength of light. A light-shielding member is disposed on the second substrate and located between adjacent color converters. The light-shielding member includes at least a first color resist layer and a second color resist layer of different colors that are sequentially stacked on the second substrate. The light-shielding member is disposed opposite to the gap between adjacent micro-LEDs and inserted into the gap. The light-shielding member can block the lateral light emitted by the micro-LEDs from shining on the color converters corresponding to the adjacent micro-LEDs. The first color resist layer is a blue color resist layer and is disposed on the side closest to the second substrate.

2. The display panel of claim 1, wherein, The height of the light-shielding component is greater than the height of the color converter, and the height difference between the light-shielding component and the color converter is less than 2 micrometers. The end of the light-shielding component is inserted into the gap between adjacent micro-LEDs.

3. The display panel of claim 2, wherein, The first substrate is further provided with an encapsulation layer, which is used to encapsulate the microLED on the first substrate. The encapsulation layer is a patterned light-shielding photoresist. The end face of the light-shielding member facing away from the second substrate is attached to the encapsulation layer.

4. The display panel of claim 3, wherein, The microLED includes an LED chip and electrodes connected to the LED chip, and the encapsulation layer is flush with the upper surface of the LED chip facing away from the first substrate and the lower surface of the LED chip facing the first substrate.

5. The display panel of claim 1, wherein, The multiple quantum dot layers are respectively a first unit with red quantum dots, a second unit with green quantum dots, and a third unit without quantum dots.

6. The display panel of claim 5, wherein, The light-shielding member further includes a third color resist layer disposed on the side of the second color resist layer opposite to the second substrate; One of the second color resist layer and the third color resist layer is a red color resist layer, and the other is a green color resist layer.

7. The display panel of claim 5, wherein, The second color resist layer is a red color resist layer.

8. A display panel manufacturing method, characterized by, include: A first substrate is provided, and a plurality of microLEDs are disposed on the first substrate. The plurality of microLEDs are spaced apart from each other and arrayed on the first substrate. The plurality of microLEDs are all blue LEDs. A second substrate is provided, on which a plurality of color filter films and light-shielding members are fabricated. The light-shielding members are located between adjacent color filter films. The light-shielding members include a first color resist layer and a second color resist layer of different colors that are sequentially stacked on the second substrate. The first color resist layer is a blue color resist layer and is disposed on the side closest to the second substrate. A quantum dot layer is fabricated on the color filter film, and the quantum dot layer and the corresponding color filter film form a color converter; The first substrate and the second substrate are assembled and attached, the color converter is arranged opposite to the micro LED, the light shielding piece is arranged opposite to the gap between adjacent micro LEDs and is inserted into the gap, and the light shielding piece can shield the lateral light emitted by the micro LED from irradiating the color converter corresponding to the adjacent micro LED.

9. The display panel manufacturing method according to claim 8, wherein The height of the light shielding piece is greater than the height of the color converter, and the height difference between the light shielding piece and the color converter is less than 2 microns.

10. The display panel manufacturing method according to claim 9, wherein The micro LED includes an LED chip and an electrode connected to the LED chip, and after a plurality of micro LEDs are arranged on the first substrate, the display panel manufacturing method further includes: An encapsulation layer is made on the first substrate, the encapsulation layer is filled between the LED chip and the first substrate, and the upper surface of the encapsulation layer away from the first substrate is flush with the lower surface of the LED chip facing the first substrate and is attached to the light shielding piece.

Images