Component crimping device and component crimping method

Abstract

The present application provides a component crimping device and a component crimping method, which can improve the quality of a mounting substrate. The component crimping device comprises: a lower receiving portion; a crimping tool for crimping a component at the edge portion of a substrate; a calibration tool for forming at least one calibration mark as a reference for position; a first camera and a second camera; and a control portion, the interval of the pair of imaging ranges is adjusted so that the pair of alignment marks of the substrate and the component respectively converge in the pair of imaging ranges as the subject, the control portion controls the first camera and the second camera to shoot the calibration mark of the calibration tool, according to the shooting result of the calibration tool, the correction for the distance between the pair of imaging ranges is carried out, and based on the shooting result of the pair of alignment marks and the correction result, the crimping of the component based on the crimping tool is controlled.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a component press-bonding apparatus or the like that press-bonds a component to a substrate. BACKGROUND

[0002] Conventionally, a component press-bonding apparatus (hereinafter, simply referred to as a "press-bonding apparatus") that press-bonds an electronic component (hereinafter, simply referred to as a "component") to a substrate such as a liquid crystal panel is provided (see Patent Literature 1). The press-bonding apparatus press-bonds the component to the substrate via an ACF (Anisotropic Conductive Film) that is an anisotropic conductive member at an end portion of the substrate. Thereby, a mounting substrate in which the component is press-bonded to the substrate is produced.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: International Publication No. 2017 / 068691

[0006] However, in the press-bonding apparatus of Patent Literature 1 described above, there is a problem in that the quality of the mounting substrate can be reduced. SUMMARY

[0007] Therefore, in the present disclosure, a press-bonding apparatus or the like that enables an improvement in the quality of a mounting substrate is provided.

[0008] A press-bonding apparatus according to an aspect of the present disclosure includes a lower receiving portion that supports a peripheral portion of a substrate on which a component is to be press-bonded from a lower side of the substrate, a press-bonding tool that press-bonds the component to the peripheral portion of the substrate supported by the lower receiving portion, a correction tool that forms at least one correction mark that serves as a reference of a position, a pair of imaging portions that image an object included in a pair of imaging ranges, respectively, and a control portion that controls the pair of imaging portions and the press-bonding tool, a distance between the pair of imaging ranges being variable, the control portion causing the pair of imaging portions to image at least one correction mark of the correction tool as the object, performing correction with respect to the distance between the pair of imaging ranges based on a result of the imaging of the correction tool, the control portion causing the pair of imaging portions to image a pair of alignment marks formed in at least one of the substrate and the component in a state in which the pair of alignment marks converge in the pair of imaging ranges as the object, respectively, by adjusting a distance between the pair of imaging ranges, and the control portion controlling press-bonding of the component by the press-bonding tool based on a result of the imaging of the pair of alignment marks and a result of the correction.

[0009] In addition, these general or specific supporting devices can also be implemented by a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, and can also be implemented by any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. In addition, the recording medium can be a non-transitory recording medium.

[0010] The component press-contacting device of the present disclosure can improve the quality of the mounting substrate.

[0011] Further advantages and effects of the present disclosure are apparent from the description and the drawings. The advantages and / or effects are provided by the features described in the several embodiments and the description and the drawings, but it is not necessary to provide all of them in order to obtain one or more of the same. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a diagram showing an outline structure of a component mounting line in an embodiment.

[0013] Figure 2 is a plan view of a component mounting line in an embodiment.

[0014] Figure 3 is a diagram showing a computer and each structural element controlled by the computer, which are provided in a component mounting line in an embodiment.

[0015] Figure 4 is a block diagram showing a functional structure of a component press-contacting device in an embodiment.

[0016] Figure 5 is a diagram showing a correction tool and each structural element around the correction tool in an embodiment.

[0017] Figure 6 is a diagram showing a positional relationship between a first camera and a correction tool when a camera interval is corrected in an embodiment.

[0018] Figure 7 is a diagram for explaining one example of a correction of a camera interval in an embodiment.

[0019] Figure 8A is a diagram showing another example of a correction tool in an embodiment.

[0020] Figure 8B is a diagram showing an example of an image of a photographing range of a first camera in a case where the correction tool shown in Figure 8A is used.

[0021] Figure 9 is a diagram for explaining another example of a correction of a camera interval in an embodiment.

[0022] Figure 10 FIG. 1 is a diagram for explaining the operation of a component press-contact device in an embodiment.

[0023] Figure 11 FIG. 2 is a diagram showing one example of the appearance of a substrate and a component in an embodiment.

[0024] Figure 12 FIG. 3 is a diagram for explaining the measurement of a substrate mark-to-mark spacing and a component mark-to-mark spacing in an embodiment.

[0025] Figure 13 FIG. 4 is a diagram for explaining the outline of process control in an embodiment.

[0026] Figure 14 FIG. 5 is a diagram showing various parameters adjusted by process control in an embodiment.

[0027] Figure 15 FIG. 6 is a diagram showing the sequence of handing over a component from a press-contact tool to a disposal section over time in an embodiment.

[0028] Figure 16 FIG. 7 is a flowchart showing the overall processing sequence of a component press-contact device in an embodiment.

[0029] Figure 17 FIG. 8 is a diagram showing a configuration example of a correction tool involved in Modification Example 1 of the embodiment.

[0030] Figure 18 FIG. 9 is a plan view of a component mounting line involved in Modification Example 2 of the embodiment.

[0031] -Explanation of Symbols-

[0032] 1 Component mounting line

[0033] 2 Computer

[0034] 2a Control section

[0035] 2b Storage section

[0036] 3 Substrate

[0037] 4, 6 Electrode section

[0038] 5 Component

[0039] 8 Correction tool

[0040] 10 Substrate loading section

[0041] 20 Adhesion section

[0042] 30, 30A Temporary press-contact section

[0043] 31, 41 substrate moving mechanism

[0044] 32 component mounting mechanism

[0045] 33, 33H component providing section

[0046] 34, 43 crimping tool

[0047] 35 component moving section

[0048] 36, 46 lower receiving section

[0049] 36a supporting surface

[0050] 36b non-supporting surface

[0051] 37, 49 worktable

[0052] 38 disposal section

[0053] 38a recycling worktable

[0054] 39 imaging mechanism

[0055] 39L first camera

[0056] 39R second camera

[0057] 40 formal crimping section

[0058] 42 crimping mechanism

[0059] 50 substrate carrying-out section

[0060] 60 conveying section

[0061] 91 ACF

[0062] 100 component crimping apparatus

[0063] A distance between substrate marks

[0064] B distance between component marks

[0065] Cp distance between cameras

[0066] Cpt target distance

[0067] DL, DR imaging range

[0068] eL, eR, fL, fR, gL, gR, hL, hR, iL, iR, δL, δR distance

[0069] h1, h2 through-hole

[0070] Ma correction mark

[0071] Ma1 1st correction mark

[0072] Ma2 2nd correction mark

[0073] Mb, Mc alignment marks DETAILED DESCRIPTION

[0074] (Recognition underlying the present disclosure)

[0075] The present inventors found that the following problems arise with the component press-contacting device of Patent Literature 1 described in the "BACKGROUND" section.

[0076] In the component press-contacting device of Patent Literature 1, the component is press-contacted to the substrate so that the two alignment marks provided to the edge portion of the substrate and the two alignment marks provided to the component overlap across the ACF. Thereby, the respective electrodes of the component and the substrate are electrically connected.

[0077] Here, in recent years, with the high-fineness of the substrate, the micro-pitching of the respective substrate and component is progressing. In other words, the interval of the adjacent two electrodes, i.e., the interlead pitch, is narrowing. For example, it can be necessary for the interlead pitch to be as narrow as 23 μm to 18 μm.

[0078] On the other hand, in the respective substrate and component, there is a deviation in the position of the electrodes such as leads. In the case where the material of the substrate and the component is a film, a deviation in the interlead pitch is likely to occur due to the manufacturing process of the substrate and the component and water absorption, etc.

[0079] Therefore, it is desirable to properly manage the interlead pitch. However, in the component press-contacting device of Patent Literature 1 described above, the accurate distance between the alignment marks cannot be measured, and thus the interlead pitch thereof cannot be properly managed. As a result, the respective electrodes of the component and the substrate can not be properly electrically connected, and the quality of the mounted substrate is reduced.

[0080] To solve the above-described problems, a component press contact device according to an embodiment of the present disclosure includes: a lower receiving portion that receives a peripheral portion of a substrate on which a component is to be press contacted from a lower side of the substrate; a press contact tool that press contacts the component to the peripheral portion of the substrate received by the lower receiving portion; a correction tool that forms at least one correction mark that is a reference for each position; a pair of imaging portions that image an object included in a pair of imaging ranges, respectively; and a control portion that controls the pair of imaging portions and the press contact tool, a distance between the pair of imaging ranges being variable, the control portion causing the pair of imaging portions to image at least one of the correction marks of the correction tool as the object, performing correction with respect to the distance between the pair of imaging ranges based on a result of imaging of the correction tool, causing the pair of imaging portions to image a pair of alignment marks formed in at least one of the substrate and the component in a state in which intervals of the pair of imaging ranges are adjusted so that the pair of alignment marks are respectively converged within the pair of imaging ranges, and controlling press contact of the component by the press contact tool based on a result of imaging of the pair of alignment marks and a result of the correction.

[0081] Thus, the distance between the pair of alignment marks can be correctly measured based on a result of the correction with respect to the distance between the pair of imaging ranges and a result of imaging of the pair of alignment marks formed in at least one of the substrate and the component.

[0082] Here, the substrate and the component each have, for example, an electrode portion in which electrodes including a plurality of lead lines are formed. If the pair of alignment marks are arranged so as to be separated by a predetermined distance, for example, so as to sandwich the electrode portions, the electrode portions of the substrate and the component can be appropriately connected. In other words, by press contacting the component to the substrate so that the pair of alignment marks of the substrate and the component overlap each other, the electrode portions can be appropriately connected. However, there is a variation in the distance between the pair of alignment marks formed in the substrate and the component and in the positions of the electrode portions. In particular, in a case where a material such as a film is used for each of the substrate and the component and a pitch between the electrodes is made small, the variation can have a large influence on the connection between the electrode portions.

[0083] Therefore, in the component press contact device according to the embodiment of the present disclosure, the distance between the pair of alignment marks can be correctly measured, and thus a variation in the positions of the electrode portions, a variation in the positions of the lead lines, or a variation in the pitch between the lead lines can be appropriately grasped and managed. Furthermore, the press contact of the component corresponding to the variation can be controlled, and thus the quality of the mounting substrate can be improved.

[0084] Further, the correction tool can be provided in the lower receiving portion.

[0085] Thus, in a case where the position of the lower receiving portion is fixed, the lower receiving portion is provided with the correction tool, so that the position deviation of the correction tool, i.e., the position deviation of at least one of the correction marks, can be suppressed. As a result, the distance between the pair of alignment marks can be measured more accurately, and the quality improvement of the mounted substrate can be further achieved.

[0086] Further, the control section, in the correction of the distance between the pair of imaging ranges, causes the pair of imaging sections to perform imaging of at least one of the correction marks of the correction tool as the object, in a state where the interval of the pair of imaging ranges is adjusted to be substantially the same as the interval at the time of imaging of the pair of alignment marks.

[0087] Thus, the interval of the pair of imaging ranges is substantially the same at the time of imaging of the pair of alignment marks and at the time of correction of the distance between the pair of imaging ranges, so that the distance between the pair of alignment marks can be measured more accurately.

[0088] Further, the pair of imaging ranges is movable in one direction, and a plurality of the correction marks can be arranged in the correction tool in the one direction.

[0089] Thus, for example, even in a case where the distance between the pair of imaging ranges is adjusted depending on the type of the substrate and the component, and the like, the correction marks can be converged in the pair of imaging ranges, respectively. As a result, the distance between the pair of alignment marks can be measured accurately regardless of the type of the substrate and the component, and the quality improvement of the mounted substrate can be achieved.

[0090] Further, the correction tool can be disposed at a position which does not overlap the substrate supported by the lower receiving portion in the vertical direction.

[0091] Thus, the component which is moved in the vertical direction for the press bonding to the substrate, and the substrate and the correction tool can be prevented from interfering with each other.

[0092] Further, the correction tool can be disposed at a position lower than a support surface in the lower receiving portion which is in contact with the edge portion of the substrate.

[0093] Thus, even if the component press-bonded to the substrate protrudes from the edge portion of the substrate in contact with the support surface in a direction parallel to the support surface, since the correction tool is disposed at a position lower than the support surface, the component and the correction tool can be prevented from interfering with each other.

[0094] Further, the control section can measure the distance between the pair of alignment marks based on the result of the imaging of the pair of alignment marks and the result of the correction, determine whether the measured distance is outside an allowable range, and prohibit the press bonding of the component based on the press bonding tool in a case where it is determined that the distance is outside the allowable range.

[0095] Thus, in a case where the distance between the pair of alignment marks measured is outside the allowable range, the press bonding of the substrate or the component that formed the pair of alignment marks is prohibited. Therefore, in a case where the position of the electrode portion of the substrate or the component largely deviates from the correct position due to a deviation in the position of the electrode portion of the substrate or the component, by prohibiting the press bonding of the substrate or the component, production of the mounting substrate of low quality can be suppressed.

[0096] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0097] In addition, the embodiments described below each represent an example of general or specific. The numerical values, shapes, materials, structural elements, arrangement positions of structural elements, connection modes, steps, order of steps, and the like shown in the embodiments below are one example, and are not intended to limit the gist of the present disclosure. Furthermore, among the structural elements in the embodiments below, the structural elements not described with respect to the independent claims representing the most general concept are described as arbitrary structural elements. Furthermore, each of the drawings is a schematic view, and is not necessarily strictly illustrated. Furthermore, in each of the drawings, the same symbols are assigned to the same structural members. Furthermore, in the embodiments below, substantially the same expressions are used. For example, substantially the same does not mean only exactly the same, but also substantially the same, that is, for example, includes an error of several percent. Furthermore, substantially the same means the same within a range capable of achieving the effects based on the present disclosure. The same applies to other expressions using "substantially".

[0098] (Embodiment)

[0099] [Outline structure of component mounting line]

[0100] Figure 1 is a view that shows the outline structure of the component mounting line in the present embodiment.

[0101] The component mounting line 1 in the present embodiment is a system that produces a mounting substrate by mounting components 5 on a display panel, that is, a substrate 3, such as a liquid crystal panel, an organic EL (Electro-Luminescence) panel, and the like. In addition, the components 5 are, for example, electronic components such as a drive circuit. Specifically, as shown in Figure 1 the component mounting line 1 has a substrate carrying-in section 10, a taping section 20, a temporary press bonding section 30, a formal press bonding section 40, and a substrate carrying-out section 50. The substrate carrying-in section 10, the taping section 20, the temporary press bonding section 30, the formal press bonding section 40, and the substrate carrying-out section 50 are sequentially linked.

[0102] The substrate carrying-in section 10 receives a rectangular substrate 3 carried in from an operator or other devices on the upstream side. Then, the substrate 3 is carried out to the taping section 20 on the downstream side.

[0103] The sticking section 20 receives the substrate 3 carried out from the substrate carrying-in section 10, and sticks the adhesive member to each of the plurality of electrode sections 4 provided at the periphery of the substrate 3. Then, the substrate 3 to which the adhesive member is stuck is carried out to the temporary press bonding section 30. Note that the plurality of electrode sections 4 each include a plurality of electrodes, for example.

[0104] The temporary press bonding section 30 receives the substrate 3 carried out from the sticking section 20, and mounts the component 5 to the portion of the substrate 3 to which the adhesive member is stuck and performs temporary press bonding. Then, the substrate 3 to which the component 5 is temporarily press-bonded is carried out to the formal press bonding section 40.

[0105] The formal press bonding section 40 receives the substrate 3 carried out from the temporary press bonding section 30, and performs formal press bonding (also referred to as heat press bonding) on the component 5 temporarily press-bonded to the substrate 3. Then, the substrate 3 on which the formal press bonding is performed is carried out to the substrate carrying-out section 50.

[0106] The substrate carrying-out section 50 receives the substrate 3 carried out from the formal press bonding section 40. The substrate 3 received by the substrate carrying-out section 50 is carried out to the downstream side.

[0107] In this way, the component mounting line 1 performs a component mounting work of mounting the component 5 to each of the plurality of electrode sections 4 provided at the periphery of the substrate 3 carried in, and carries out the substrate 3 on which the component 5 is mounted, that is, the mounting substrate, from the substrate carrying-out section 50.

[0108] [Detailed structure of the component mounting line]

[0109] Figure 2 is a plan view of the component mounting line 1 in the present embodiment. Specifically, Figure 2 indicates a structure of the component mounting line 1 viewed from above. Note that, in the present embodiment, a direction in which a substrate is transported is referred to as an X-axis direction, a vertical direction is referred to as a Z-axis direction, and a direction perpendicular to the X-axis direction and the Z-axis direction, that is, a depth direction is referred to as a Y-axis direction. Further, the negative side and the positive side of the X-axis direction correspond to the upstream side and the downstream side of the direction in which the substrate is transported, respectively, the negative side and the positive side of the Z-axis direction correspond to the lower side and the upper side of the vertical direction, respectively, and the negative side and the positive side of the Y-axis direction correspond to the front side and the back side, or the front side and the rear side of the depth direction, respectively.

[0110] The substrate carrying-in section 10 is provided with a base 1a on which the substrate 3 carried in is placed. On the base 1a of the substrate carrying-in section 10, a table 11 on which the substrate 3 is placed is provided. The table 11 is raised and lowered with respect to the base 1a in the Z-axis direction. Further, on the upper surface of the table 11, a plurality of suction holes 11a are provided. The table 11 described above sucks and holds the substrate 3 carried in and placed on the table 11 from an operator or another device on the upstream side by a suction device such as a pump, not shown, from the suction holes 11a.

[0111] The attaching section 20 has a function of performing an attaching operation (in other words, an attaching process) of attaching an ACF, which is an adhesive member, to the electrode section 4 of the substrate 3. The attaching section 20 has a substrate moving mechanism 21 and an attaching mechanism 22.

[0112] The substrate moving mechanism 21 is a mechanism that moves the substrate 3. The substrate moving mechanism 21 has, for example, an X-axis stage movable in the X-axis direction, a Y-axis stage movable in the Y-axis direction, a Z-axis stage movable in the Z-axis direction, and a stage 23. In the substrate moving mechanism 21, the X-axis stage, the Y-axis stage, the Z-axis stage, and the stage 23 are sequentially stacked on the base 1b from the bottom.

[0113] The Y-axis stage is provided along the Y-axis direction and is freely movable in the X-axis direction on the X-axis stage. The Z-axis stage is freely movable in the Y-axis direction on the Y-axis stage, and lifts and rotates the stage 23 provided on the upper portion in the Z-axis direction.

[0114] Further, on the upper surface of the stage 23, a plurality of suction holes 23a are provided, and the stage 23 performs vacuum suction and holding of the substrate 3 placed on the upper surface thereof. In this way, the substrate moving mechanism 21 performs suction and holding of the substrate 3 and moves it in the horizontal plane (specifically, the X-axis direction and the Y-axis direction), lifts it in the vertical direction (specifically, the Z-axis direction), and rotates it around the Z-axis.

[0115] The attaching mechanism 22 has, above the base 1b, for example, two attaching heads arranged in the X-axis direction. Each of the attaching heads has a supply section that supplies the ACF and an attaching tool that attaches the ACF to the substrate 3. The two attaching heads respectively attach the ACF at positions corresponding to the plurality of electrode sections 4 on the substrate 3. Further, below the positions corresponding to the two attaching heads, an attaching support table is provided.

[0116] The temporary press-bonding section 30 performs a temporary press-bonding process of temporarily press-bonding the component 5 to the region of the substrate 3 to which the ACF is attached (in other words, the press-bonding target portion). The temporary press-bonding section 30 has a substrate moving mechanism 31, a component mounting mechanism 32, a component supply section 33, a component moving section 35, and a disposal section 38.

[0117] The substrate moving mechanism 31 has the same configuration as the substrate moving mechanism 21 of the attaching section 20. Specifically, the substrate moving mechanism 31 has a table 37 that holds the substrate 3. On the upper surface of the table 37, a plurality of suction holes 37a are provided. The substrate moving mechanism 31 holds the substrate 3 placed on the table 37 by vacuum suction through the plurality of suction holes 37a. Further, the substrate moving mechanism 31 has a function of moving the table 37 that holds the substrate 3 by suction in the horizontal plane, lifting it in the vertical direction, and rotating it around the Z axis. The substrate moving mechanism 31 causes the region of the substrate 3 held by suction to be positioned above the supporting table of the component mounting mechanism 32, i.e., the lower receiving section 36, by moving and rotating the table 37.

[0118] The component supply section 33 is provided so as to protrude from the rear portion of the base 1b toward the inner side of the component mounting mechanism 32, i.e., the positive side in the Y axis direction. For example, the component supply section 33 has a supply reel 33a on which a tape carrier package (TCP) or the like is wound, a punching section 33b, a movable table 33c, and a guide rail 33d. The component supply section 33 of the above-described configuration supplies the components 5 from the tape carrier package in sequence by the operation of these structural elements.

[0119] The component moving section 35 holds the components 5 supplied from the component supply section 33 and moves them toward the crimping tool 34 included in the component mounting mechanism 32.

[0120] The component mounting mechanism 32 is provided on the base 1b and has the crimping tool 34 and the lower receiving section 36.

[0121] The lower receiving section 36 supports the predetermined portion of the substrate 3 held by the table 37, i.e., the crimping target portion, from below. The crimping target portion is the portion where the ACF is attached to the edge portion of the substrate 3. In other words, the lower receiving section 36 supports the edge portion of the substrate 3 to which the components 5 are crimped from the lower side of the substrate 3.

[0122] The crimping tool 34 holds the components 5 and crimps the components 5 to the substrate 3 held by the table 37. In other words, the crimping tool 34 crimps the components 5 to the crimping target portion of the edge portion of the substrate 3 supported by the lower receiving section 36. Specifically, the crimping tool 34 lifts the components 5 moved by the component moving section 35 from above by suction, i.e., picks up the components 5. Then, the crimping tool 34 mounts the components 5 held by suction on the ACF and presses the substrate 3 together with the components 5 against the lower receiving section 36, thereby temporarily crimping the components 5 to the substrate 3. For example, the crimping tool 34 crimps the components 5 to the substrate 3 in a state where it is heated to about 80°C. Further, the temporary crimping section 30 can have a mechanism that rotates the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0123] The waste processing unit 38 has a recycling worktable 38a. When the component 5 held in the crimping tool 34 is not mounted on the substrate 3, the waste processing unit 38 performs waste processing by moving the recycling worktable 38a to receive the component 5 from the crimping tool 34. The component 5 received by the waste processing unit 38 is, for example, discarded.

[0124] The formal pressing section 40 performs a formal pressing process that formally presses (in other words, thermally presses) the component 5, which is temporarily pressed onto the substrate 3 by the temporary pressing section 30, onto the substrate 3. In this way, the electrode section 4 and the component 5 formed on the substrate 3 are electrically connected via ACF. The formal pressing section 40 described above includes a substrate moving mechanism 41 and a pressing mechanism 42.

[0125] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the adhesive part 20. Specifically, the substrate moving mechanism 41 has a worktable 49. A plurality of adsorption holes 49a are provided on the upper surface of the worktable 49. The substrate moving mechanism 41 uses the plurality of adsorption holes 49a to vacuum adsorb and hold the substrate 3 placed on the worktable 49. In addition, the substrate moving mechanism 41 has the function of moving the worktable 49, which adsorbs and holds the substrate 3, in the horizontal plane, raising and lowering it in the vertical direction, and rotating it about the Z-axis. Through the movement and rotation of the worktable 49, the substrate moving mechanism 41 positions the area of ​​the substrate 3 to which the temporary pressing member 5 is attached to is above the lower receiving part 46 of the pressing mechanism 42.

[0126] The crimping mechanism 42 is mounted on the base 1b and includes a crimping tool 43 and a lower receiving part 46.

[0127] The crimping tool 43 is heated and presses the component 5 of the substrate 3, which is supported by the lower receiving portion 46, toward the lower receiving portion 46. For example, the crimping tool 43 presses the component 5 while it is heated to about 200°C. As a result, the component 5 is formally crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via ACF.

[0128] The substrate removal unit 50 has the function of vacuum adsorbing and holding the substrate 3 conveyed from the formal pressing unit 40 on the worktable 51. The substrate 3 held on the substrate removal unit 50 is moved to other devices downstream, or removed from the worktable 51 by the operator.

[0129] The worktable 51 moves up and down relative to the base 1c in the Z-axis direction. In addition, multiple adsorption holes 51a are provided on the upper surface of the worktable 51, and the worktable 51 vacuum adsorbs and holds the substrate 3 transferred from the formal pressing section 40 on its upper surface.

[0130] The conveyance section 60 is a device that conveys the substrate 3. Specifically, the conveyance section 60 has a function of sequentially transferring (transferring) the substrate 3 that is carried into the substrate carrying-in section 10 to the bonding section 20, the temporary press-bonding section 30, the formal press-bonding section 40, and the substrate carrying-out section 50. The conveyance section 60 is disposed in a region in front of (i.e., the negative side in the Y-axis direction of) the bonding section 20, the temporary press-bonding section 30, and the formal press-bonding section 40.

[0131] The conveyance section 60 has, on a moving base 61 that extends in the X-axis direction over the base 1a, the base 1b, and the base 1c, substrate conveyance mechanisms 62A, 62B, 62C, and 62D that are sequentially disposed from the upstream side.

[0132] The substrate conveyance mechanisms 62A to 62D each have a base 63 and one or more arm units 64. In the present embodiment, the substrate conveyance mechanisms 62A to 62D each have two arm units 64.

[0133] The base 63 is disposed on the moving base 61 and is freely movable in the X-axis direction. On the base 63, the two arm units 64 are arranged in the X-axis direction. The arm units 64 vacuum-adsorb the substrate 3 from above.

[0134] The substrate conveyance mechanisms 62A to 62D each move to a substrate transfer position at which the substrate 3 held by the stage 11, 23, 37, 49, 51 is vacuum-adsorbed from above, and receive or transfer the substrate 3 from the stage 11, 23, 37, 49, 51 that is raised. For example, the substrate conveyance mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate carrying-in section 10 and transfers it to the stage 23 of the bonding section 20. Also, for example, the substrate conveyance mechanism 62B receives the substrate 3 from the stage 23 of the bonding section 20 and transfers it to the stage 37 of the temporary press-bonding section 30. Also, for example, the substrate conveyance mechanism 62C receives the substrate 3 from the stage 37 of the temporary press-bonding section 30 and transfers it to the stage 49 of the formal press-bonding section 40. Also, for example, the substrate conveyance mechanism 62D receives the substrate 3 from the stage 49 of the formal press-bonding section 40 and transfers it to the stage 51 of the substrate carrying-out section 50.

[0135] Figure 3 is a view that shows a computer included in the component mounting line 1 and each structural element controlled by the computer.

[0136] As shown in Figure 3 , the component mounting line 1 includes a computer 2. The computer 2 is communicably connected to the bonding section 20, the temporary press-bonding section 30, the formal press-bonding section 40, the conveyance section 60, and the like, for example, by a control line, and controls these sections. The computer 2 includes a control section 2a and a storage section 2b.

[0137] The storage section 2b stores various data required for the component mounting work, such as the size of the board 3, the kind of the component 5 mounted to the board 3, the mounting position, the mounting direction, and the timing of transferring the board 3, and the control program executed by the control section 2a. The storage section 2b is realized by, for example, a ROM (Read Only Memory) or a RAM (Random Access Memory) or the like.

[0138] The control section 2a controls the board moving mechanism 21 of the tacking section 20, the board moving mechanism 31 of the temporary press bonding section 30, the board moving mechanism 41 of the formal press bonding section 40, and the conveyance section 60, and executes the board transfer work of transferring the board 3 between the sections to the next process. The transfer of the board 3 from the upstream side to the downstream side in the board transfer work can be performed in synchronization between the sections.

[0139] For example, the control section 2a changes the orientation and the position of the board 3 held by the board moving mechanism 21 of the tacking section 20, and changes the interval of the plurality of tacking heads by the head moving motor, so that the tacking section 20 performs the tacking work of tacking the ACF to the board 3 by the tacking mechanism 22.

[0140] Further, for example, the control section 2a controls the temporary press bonding section 30. In other words, the control section 2a changes the orientation and the position of the board 3 held by the board moving mechanism 31, so that the component mounting mechanism 32 performs the temporary press bonding of the component 5 to the board 3. At this time, the control section 2a can also correct or change the position of the board 3 according to the result of the photographing based on the photographing mechanism 39 provided in the temporary press bonding section 30. Further, the control section 2a moves the component 5 provided from the component supply section 33 to the component mounting mechanism 32 side by controlling the component supply section 33 and the component moving section 35. Further, the control section 2a causes the disposal processing section 38 to perform the disposal processing of the component 5 held to the press bonding tool 34 of the component mounting mechanism 32 by controlling the disposal processing section 38.

[0141] Further, for example, the control section 2a changes the orientation and the position of the board 3 held by the board moving mechanism 41 of the formal press bonding section 40, so that the press bonding mechanism 42 performs the formal press bonding of the component 5 temporarily press-bonded to the board 3.

[0142] The control section 2a described above is realized by, for example, a processor such as a CPU (Central Processing Unit) that executes the control program stored in the storage section 2b for controlling each section and each mechanism of the component mounting line 1.

[0143] [Structure of Component Press Bonding Apparatus]

[0144] Figure 4is a block diagram showing a functional configuration of the component press-contacting device 100 in the present embodiment.

[0145] The component press-contacting device 100 includes the temporary press-contacting portion 30 in the component mounting line 1, the control portion 2a of the computer 2.

[0146] Specifically, the component press-contacting device 100 is provided with the control portion 2a, the component supply portion 33, the component moving portion 35, the press-contacting tool 34, the lower receiving portion 36, the correction jig 8, the substrate moving mechanism 31, the disposal portion 38, the first camera 39L, and the second camera 39R.

[0147] The first camera 39L and the second camera 39R are a pair of imaging portions that respectively image an object included in a pair of imaging ranges, and are included in the imaging mechanism 39 described above. The distance between the respective imaging ranges of the first camera 39L and the second camera 39R is variable. In other words, the interval between the respective imaging ranges of the first camera 39L and the second camera 39R is adjusted so that a pair of alignment marks described later, which are formed in at least one of the substrate 3 and the component 5, respectively converge in the pair of imaging ranges as the objects described above. The distance between the pair of imaging ranges is also referred to as an optical system distance or a camera distance, and for example, can be the distance between the first camera 39L and the second camera 39R. Alternatively, the distance between the pair of imaging ranges can be adjusted in a state where the interval between the first camera 39L and the second camera 39R is fixed. For example, the interval between the optical axes of the cameras can be changed by moving an optical system device such as a lens or a mirror, and the distance between the pair of imaging ranges can be adjusted.

[0148] The correction jig 8 is a jig for correcting the camera distance described above, and for example, includes a material such as glass that is difficult to deform and stretch, and the like. In the correction jig 8, at least one correction mark that is a reference of a position is formed. Further, in the present embodiment, the lower receiving portion 36 is provided with the correction jig 8.

[0149] The control portion 2a controls the pair of imaging portions, that is, the first camera 39L and the second camera 39R, and the press-contacting tool 34 described above. Further, the control portion 2a controls the component supply portion 33, the component moving portion 35, the substrate moving mechanism 31, and the disposal portion 38.

[0150] Specifically, the control section 2a causes the first camera 39L and the second camera 39R to capture at least one of the correction marks of the correction tool 8, and performs correction with respect to the camera interval on the basis of the captured result of the correction tool 8. Then, the control section 2a causes the first camera 39L and the second camera 39R to capture the pair of alignment marks. For example, the control section 2a causes the first camera 39L and the second camera 39R to capture the pair of alignment marks formed on the component 5. Further, the control section 2a causes the first camera 39L and the second camera 39R to capture the pair of alignment marks formed on the substrate 3. Then, the control section 2a controls the press bonding of the component 5 on the basis of the press bonding tool 34 on the basis of the captured result and the correction result of the pair of alignment marks of the component 5 and the substrate 3.

[0151] [Correction tool and camera]

[0152] Figure 5 is a view that shows each structural element of the correction tool 8 and its periphery in the present embodiment.

[0153] The correction tool 8 in the present embodiment is, for example, an elongated plate-like tool including glass having light transmittance, like a ruler or a scale, and is disposed on the upper surface of the lower receiving section 36. Specifically, the upper surface of the lower receiving section 36 has a support surface 36a that is in contact with the edge portion of the substrate 3, and a non-support surface 36b that is at a lower position than the support surface 36a. The correction tool 8 is disposed along the X-axis direction on the non-support surface 36b of the lower receiving section 36. Also, in the correction tool 8 in the present embodiment, a plurality of correction marks Ma are arranged along the long direction of the correction tool 8, that is, the X-axis direction. Note that the plurality of correction marks Ma can be formed on the upper surface side of the correction tool 8, or can be formed on the lower surface side.

[0154] The first camera 39L and the second camera 39R are disposed on the lower side of the lower receiving section 36 to capture the upper side in the Z-axis direction. Further, the first camera 39L and the second camera 39R are arranged in the X-axis direction. The distance between the first camera 39L and the second camera 39R, that is, the camera interval, is variable in the X-axis direction. Therefore, in the present embodiment, the pair of imaging ranges of the first camera 39L and the second camera 39R is movable along one direction, and a plurality of correction marks Ma are arranged along the one direction on the correction tool 8. Further, the first camera 39L and the second camera 39R are freely disposed by being moved along the Y-axis direction.

[0155] When the correction of the camera interval is performed, the first camera 39L and the second camera 39R are moved along the Y-axis direction and disposed below the correction tool 8. Also, the first camera 39L and the second camera 39R capture the correction tool 8 from the lower side via the through hole of the lower receiving section 36. Note that, Figure 5In this case, the through-holes are shielded by the correction jig 8.

[0156] In the photographing of the pair of alignment marks Mc of the component 5, the first camera 39L and the second camera 39R are moved along the Y-axis direction to be disposed below the support surface 36a in the lower receiving portion 36. At this time, the press contact tool 34 holds the component 5 in a state in which the electrode portion 6 including a plurality of electrodes formed in the component 5 and the pair of alignment marks Mc disposed to sandwich the electrode portion 6 are directed downward. Also, the pair of alignment marks Mc are disposed to face the support surface 36a in the lower receiving portion 36.

[0157] The first camera 39L and the second camera 39R photograph the pair of alignment marks Mc of the component 5 from the lower side via two through-holes h1 of the lower receiving portion 36. Also, the two through-holes h1 are, for example, holes having openings in the support surface 36a of the lower receiving portion 36 and penetrating the lower receiving portion 36 in the Z-axis direction, which are arranged along the X-axis direction. The first camera 39L photographs the alignment mark Mc on the positive side of the X-axis direction in the component 5 via the through-hole h1 on the positive side of the X-axis direction. The second camera 39R photographs the alignment mark Mc on the negative side of the X-axis direction in the component 5 via the through-hole h1 on the negative side of the X-axis direction. Also, the through-holes h1 in the present embodiment are holes, but can be grooves recessed on the positive side of the Y-axis direction or can include a member having light transmittance such as glass.

[0158] In the photographing of the pair of alignment marks Mb of the substrate 3, the first camera 39L and the second camera 39R are disposed below the support surface 36a in the lower receiving portion 36 as in the photographing of the pair of alignment marks Mc of the component 5. At this time, the edge portion of the substrate 3 held on the table 37 is placed on and supported from the lower side by the support surface 36a of the lower receiving portion 36. Also, on the upper surface of the edge portion, the electrode portion 4 including a plurality of electrodes and the pair of alignment marks Mb disposed to sandwich the electrode portion 4 are formed. Further, on the upper surface of the edge portion, the ACF 91 is attached to cover the electrode portion 4.

[0159] The first camera 39L and the second camera 39R photograph the pair of alignment marks Mb of the substrate 3 from the lower side via two through-holes h1 of the lower receiving portion 36. Also, the portion of the substrate 3 in which the pair of alignment marks Mb are formed has light transmittance. Therefore, the alignment marks Mb formed on the upper surface of the substrate 3 are photographed via the portion having the light transmittance. The first camera 39L photographs the alignment mark Mb on the positive side of the X-axis direction in the substrate 3 via the through-hole h1 on the positive side of the X-axis direction. The second camera 39R photographs the alignment mark Mb on the negative side of the X-axis direction in the substrate 3 via the through-hole h1 on the negative side of the X-axis direction.

[0160] [Correction of camera distance]

[0161] Figure 6 is a view showing the positional relationship between the first camera 39L and the correction tool 8 when the correction of the camera pitch is performed.

[0162] The first camera 39L photographs the correction tool 8 from below the lower receiving portion 36. At this time, the first camera 39L photographs the correction tool 8 via the through portion h2 of the lower receiving portion 36. The through portion h2 is, for example, a hole having an opening in the non-supporting surface 36b of the lower receiving portion 36, and the lower receiving portion 36 is penetrated in the Z-axis direction. Note that the through portion h2 in the present embodiment is a hole, but can include a member having light transmittance such as glass. The second camera 39R also photographs the correction tool 8 in the same manner as the first camera 39L.

[0163] Figure 7 is a view for explaining one example of the correction of the camera pitch.

[0164] The first camera 39L generates correction-use imaging data representing an image of the imaging range DL in the correction tool 8 by photographing the imaging range DL. The second camera 39R generates correction-use imaging data representing an image of the imaging range DR in the correction tool 8 by photographing the imaging range DR. Note that the imaging range DL and the imaging range DR are each a range of approximately 1 mm in height by approximately 1 mm in width.

[0165] The image of the imaging range DL reflects the correction mark Ma formed in the correction tool 8. Similarly, the image of the imaging range DR reflects the other correction mark Ma formed in the correction tool 8.

[0166] The control section 2a determines the distance in the X-axis direction between the center of the imaging range DL and the center of the imaging range DR, that is, the camera pitch Cp, using these correction-use imaging data. The camera pitch Cp described above is adjusted in advance so that the pair of alignment marks Mb of the substrate 3 respectively converge in the imaging range DL of the first camera 39L and the imaging range DR of the second camera 39R. Note that in the case where the component 5 is press-bonded to the substrate 3, the interval of the pair of alignment marks Mb of the substrate 3 is substantially identical to the interval of the pair of alignment marks Mc of the component 5. Therefore, the adjustment of the camera pitch Cp described above can also be said to be performed so that the pair of alignment marks Mc of the component 5 respectively converge in the imaging range DL of the first camera 39L and the imaging range DR of the second camera 39R.

[0167] In other words, in the present embodiment, the control section 2a causes the first camera 39L and the second camera 39R to capture at least one of the correction marks Ma of the correction tool 8 as an object in a state where the interval of the pair of imaging ranges DL and DR is adjusted to be substantially the same as the interval at the time of capturing the pair of alignment marks, in the correction of the camera pitch Cp.

[0168] Here, in a case where the camera pitch Cp is equal to the known target pitch Cpt, the center of the imaging range DL is located at the center of the correction mark Ma that is within the imaging range DL, and the center of the imaging range DR is located at the center of the correction mark Ma that is within the imaging range DR. However, the camera pitch Cp changes, for example, over time. Alternatively, the camera pitch Cp changes depending on the ambient temperature of the surroundings including the first camera 39L and the second camera 39R. In the above case, for example Figure 7 As shown, the center of the imaging range DL deviates from the center of the correction mark Ma that is within the imaging range DL by a distance δL in the X-axis direction. Also, the center of the imaging range DR deviates from the center of the correction mark Ma that is within the imaging range DR by a distance δR in the X-axis direction. Therefore, the control section 2a derives the distance δL and the distance δR from the correction imaging data, determines that the camera pitch Cp deviates from the target pitch Cpt by a distance (δL + δR), and thereby determines the relationship between the camera pitch Cp and the target pitch Cpt. As a result, the camera pitch Cp can be corrected. Also, the control section 2a determines the camera pitch Cp by calculating the camera pitch Cp from Cp = Cpt + (δR + δR).

[0169] In addition, Figure 7 Here, the distance indicating the deviation of the center of the imaging range DL with the correction mark Ma as a reference to the positive side in the X-axis direction is a negative value, and the distance indicating the deviation to the negative side in the X-axis direction is a positive value. Also, the distance indicating the deviation of the center of the imaging range DR with the correction mark Ma as a reference to the positive side in the X-axis direction is a positive value, and the distance indicating the deviation to the negative side in the X-axis direction is a negative value.

[0170] Figure 8A is a view showing another example of the correction tool 8.

[0171] In the correction tool 8, two kinds of correction marks Ma that differ in shape from each other can also be formed. The two kinds of correction marks Ma are a quadrangular first correction mark Ma1 and a circular second correction mark Ma2. The above-mentioned first correction mark Ma1 and the second correction mark Ma2 are alternately and equally spaced in the longitudinal direction of the correction tool 8.

[0172] Figure 8B is a view showing a case where the correction tool 8 is used Figure 8AThe figure shows an example of an image captured by the first camera 39L in the case of the calibration device 8.

[0173] The spacing between adjacent first correction markers Ma1 and second correction markers Ma2 is set to satisfy a predetermined condition regardless of their position in the X-axis direction of the camera range DL. This predetermined condition is that at least one of the first correction markers Ma1 and the second correction marker Ma2 is entirely contained within the camera range DL, and that the entirety of two or more correction markers Ma of the same type is not contained within the camera range DL. Therefore, appropriate correction for the camera spacing Cp can be performed regardless of the position of the camera range DL in the X-axis direction.

[0174] In other words, under the conditions specified above, the correct position of the shooting range DL corresponding to the target distance Cpt can be initially set, regardless of the position of the shooting range DL in the X-axis direction, that is, the reference position of the shooting range DL. In this embodiment, the position that serves as the reference is registered as reference information in the storage unit 2b of the computer 2.

[0175] For example, in the storage unit 2b of computer 2, reference information is registered according to each target spacing Cpt. The reference information indicates the type of correction mark Ma used for correction within the imaging range DL, and the distance along the X-axis from the center of the imaging range DL to the center of that correction mark Ma. Specifically, such as... Figure 8B As shown in (a), when the target spacing Cpt = 60 mm and the camera spacing Cp is equal to the target spacing Cpt, for example, only one second correction mark Ma2 converges entirely within the imaging range DL. In such a case, reference information corresponding to the target spacing Cpt is established as the type of correction mark Ma used for correction, representing the second correction mark Ma2, and representing the distance in the X-axis direction from the center of the imaging range DL to the center of the second correction mark Ma2. Such reference information is established corresponding to the target spacing Cpt and registered in the storage unit 2b.

[0176] In addition, such as Figure 8BAs shown in (b), when the target distance Cpt = 50 mm and the camera distance Cp is equal to the target distance Cpt, for example, the entirety of a first correction mark Ma1 and a second correction mark Ma2 converges within the imaging range DL. In such a case, the reference information corresponding to the target distance Cpt is used as the type of correction mark Ma for correction, indicating the type of either the first correction mark Ma1 or the second correction mark Ma2. Furthermore, this reference information indicates the distance in the X-axis direction from the center of the imaging range DL to the center of the correction mark Ma of that type. The reference information corresponding to the target distance Cpt is registered in the storage unit 2b. In addition, when the first correction mark Ma1 is closer to the center of the imaging range DL than the second correction mark Ma2, the reference information can also be used as the type of correction mark Ma for correction, indicating the first correction mark Ma1. Conversely, if the second correction mark Ma2 is closer to the center of the camera range DL than the first correction mark Ma1, the reference information can also be used as the type of correction mark Ma used for correction, indicating the second correction mark Ma2.

[0177] In addition, such as Figure 8B As shown in (c), when the target spacing Cpt = 30 mm and the camera spacing Cp is equal to the target spacing Cpt, and... Figure 8B Similarly, in (a) only one second correction mark Ma2 converges entirely within the imaging range DL. In such a case, reference information corresponding to the target distance Cpt is established as the type of correction mark Ma used for correction, representing the second correction mark Ma2, and representing the distance in the X-axis direction from the center of the imaging range DL to the center of the second correction mark Ma2. Such reference information is established corresponding to the target distance Cpt and registered in the storage unit 2b.

[0178] This reference information applies not only to the camera range DL, but also to the camera range DR, and is generated and registered in the storage unit 2b in the same manner as the camera range DL.

[0179] Figure 9 This is a diagram illustrating other examples used for correcting camera spacing Cp. Specifically, Figure 9 It is used for Figure 8A A diagram illustrating the correction of camera spacing Cp at time 8 using the calibration tool is provided. Furthermore, Figure 9 (a) represents the respective images of the shooting range DL and the camera range DR at the time of registration of the aforementioned reference information. Figure 9 (b) represents the respective images of the shooting range DL and the camera range DR when the camera spacing Cp is corrected.

[0180] When registering the various reference information for the camera range DL and camera range DR, the camera spacing Cp is initially set to the target spacing Cpt. At this time, for example... Figure 9 As shown in (a), the reference information of the shooting range DL registered in the storage unit 2b is used as the type of correction mark Ma for correction, and is represented as the second correction mark Ma2. Further, this reference information is represented as the distance eL along the X-axis from the center of the shooting range DL to the center of the second correction mark Ma2. Additionally, the reference information of the shooting range DR registered in the storage unit 2b is used as the type of correction mark Ma for correction, and is represented as the second correction mark Ma2. Further, this reference information is represented as the distance eR along the X-axis from the center of the shooting range DR to the center of the second correction mark Ma2.

[0181] Next, for example, after a period of time following the initial setting of the camera spacing Cp to the target spacing Cpt, the control unit 2a performs calibration for the camera spacing Cp. During this calibration, the control unit 2a reads reference information for the shooting range DL and the imaging range DR corresponding to the target spacing Cpt from the storage unit 2b. Further, the control unit 2a causes the first camera 39L and the second camera 39R to use the calibration device 8. The first camera 39L generates a representation of the shooting range DL in the calibration device 8. Figure 9 (b) shows the image correction data for the shooting range DL. The second camera 39R generates the image representing the shooting range DR in the shooting correction device 8. Figure 9 (b) shows the image correction data for the DR image within the shooting range.

[0182] The control unit 2a determines a second correction mark Ma2 based on the type of correction mark Ma used for correction shown by the reference information of the shooting range DL read from the storage unit 2b. Furthermore, the control unit 2a identifies the second correction mark Ma2 from the image of the shooting range DL and determines the distance fL along the X-axis from the center of the shooting range DL to the center of the second correction mark Ma2. Next, the control unit 2a determines the distance eL shown by the reference information of the shooting range DL read from the storage unit 2b. The control unit 2a then calculates the difference between distance eL and distance fL, i.e., distance gL, using gL = (eL - fL).

[0183] The control unit 2a determines a second correction mark Ma2 based on the type of correction mark Ma used for correction shown by the reference information of the shooting range DR read from the storage unit 2b. Furthermore, the control unit 2a identifies the second correction mark Ma2 from the image of the shooting range DR and determines the distance fR along the X-axis from the center of the shooting range DL to the center of the second correction mark Ma2. Next, the control unit 2a determines the distance eR shown by the reference information of the shooting range DR read from the storage unit 2b. The control unit 2a then calculates the difference between the distance eR and the distance fR, i.e., the distance gR, using gR = (eR - fR).

[0184] As a result, the control unit 2a determines the deviation distance (gL+gR) between the camera spacing Cp and the target spacing Cpt. Therefore, the relationship between the camera spacing Cp and the target spacing Cpt can be determined, and the camera spacing Cp can be corrected. Furthermore, the control unit 2a measures the camera spacing Cp by calculating Cp using the formula Cp = Cpt + (gL+gR).

[0185] in addition, Figure 9 In this context, the distance from the center of the camera range DL to the center of the correction mark Ma in the positive X-axis direction is a negative value, while the distance to the center of the correction mark Ma in the negative X-axis direction is a positive value. Furthermore, the distance from the center of the camera range DR to the center of the correction mark Ma in the positive X-axis direction is a positive value, while the distance to the center of the correction mark Ma in the negative X-axis direction is a negative value.

[0186] [Processing after camera spacing correction]

[0187] Figure 10 This is a diagram used to explain the operation of the component crimping device 100 in this embodiment.

[0188] First, such as Figure 10 As shown in (a), the first camera 39L and the second camera 39R generate calibration image data by shooting the calibration device 8. The control unit 2a uses this calibration image data to perform calibration for the camera spacing Cp.

[0189] Next, as Figure 10As shown in (b), the first camera 39L and the second camera 39R are moved to the negative side in the Y-axis direction and are positioned below the through-hole h1. As a result, one of the pair of alignment marks Mc formed on the component 5 held in the pressing tool 34 converges to the shooting range DL of the first camera 39L. Similarly, the other of the pair of alignment marks Mc converges to the shooting range DR of the second camera 39R. Furthermore, the first camera 39L and the second camera 39R respectively capture images of the alignment marks Mc of the component 5 through the through-hole h1. Component image data is generated by capturing images of the component 5 by the first camera 39L and the second camera 39R as described above. Based on this component image data, the control unit 2a measures the distance between the pair of alignment marks Mc formed on the component 5, i.e., the component mark spacing. In this measurement, the correction result of the camera spacing Cp is used.

[0190] Next, as Figure 10 As shown in (c), the stage 37 holding the substrate 3 moves towards the lower receiving portion 36. As a result, one of the pair of alignment marks Mb formed on the substrate 3 held on the stage 37 converges to the shooting range DL of the first camera 39L. Similarly, the other of the pair of alignment marks Mb converges to the shooting range DR of the second camera 39R. Furthermore, the first camera 39L and the second camera 39R respectively capture images of the alignment marks Mb on the substrate 3 via the through portion h1. Substrate image data is generated by capturing images of the first camera 39L and the second camera 39R as described above. Based on this substrate image data, the control unit 2a measures the distance between the pair of alignment marks Mb formed on the substrate 3, i.e., the substrate mark spacing. In this measurement, the correction result of the camera spacing Cp is used. Further, the control unit 2a adjusts the position of the stage 37, etc., so that the position of the pair of alignment marks Mc shown by the two component image data is consistent with the position of the pair of alignment marks Mb shown by the two substrate image data. At this time, the control unit 2a can also adjust the position of the worktable 37, etc., so that the center position between the pair of alignment marks Mc formed on the component 5 is consistent with the center position between the pair of alignment marks Mb formed on the substrate 3.

[0191] And, as Figure 10 As shown in (d), based on the spacing between component marks and the spacing between substrate marks, the crimping tool 34 descends and temporarily crimps the component 5 to the substrate 3 via the ACF91.

[0192] Thus, in the present embodiment, the control section 2a causes the first camera 39L and the second camera 39R to capture the pair of alignment marks in a state in which the pair of imaging ranges DL and DR are adjusted so that at least one of the substrate 3 and the component 5 forms the pair of alignment marks as the subjects, respectively. Further, the control section 2a controls the press bonding of the component 5 based on the press bonding tool 34 based on the results of the capturing of the pair of alignment marks and the results of the correction. Thus, it is possible to improve the quality of the mounting substrate produced by the press bonding of the component 5 to the substrate 3.

[0193] Further, in the present embodiment, as shown in Figure 10 , the correction jig 8 is disposed at a position not overlapping the substrate 3 supported by the lower support portion 36 in the up-down direction. Thus, it is possible to suppress the interference of the component 5 and the substrate 3 moved in the up-down direction for the press bonding to the substrate 3 with the correction jig 8. Further, the correction jig 8 is disposed at a position lower than the support surface 36a of the lower support portion 36 abutting against the edge portion of the substrate 3. For example, as shown in Figure 10 , even if the component 5 press-bonded to the substrate 3 protrudes from the edge portion of the substrate 3 to the positive side of the Y-axis direction, the correction jig 8 is at a position lower than the support surface 36a, and thus it is possible to suppress the interference of the component 5 with the correction jig 8.

[0194] Figure 11 is a view showing one example of the appearance of the substrate 3 and the component 5.

[0195] As shown in Figure 11 , on the substrate 3, a pair of alignment marks Mb configured to sandwich an electrode portion 4 including electrodes of a plurality of leads and the like of the electrode portion 4 in the X-axis direction is formed. Further, the ACF 91 is attached to the substrate 3 so as to cover the electrode portion 4.

[0196] The control section 2a measures the distance between the pair of alignment marks Mb, that is, the substrate mark-to-mark distance A, using the substrate imaging data generated by the imaging of the first camera 39L and the second camera 39R, respectively, and the correction result for the camera pitch Cp.

[0197] Further, as shown in Figure 11 , on the component 5, a pair of alignment marks Mc configured to sandwich an electrode portion 6 including electrodes of a plurality of leads and the like of the electrode portion 6 in the X-axis direction is formed.

[0198] The control section 2a measures the distance between the pair of alignment marks Mc, that is, the component mark-to-mark distance B, using the component imaging data generated by the imaging of the first camera 39L and the second camera 39R, respectively, and the correction result for the camera pitch Cp.

[0199] Figure 12This is a diagram used to illustrate the measurement of the spacing A between substrate marks and the spacing B between component marks. Additionally, Figure 12 (a) represents the image data from the two substrate cameras. Figure 12 (b) represents the image of the camera data of the two components.

[0200] like Figure 12 As shown in (a), the alignment mark Mb is reflected in the image of the shooting range DL shown by the substrate imaging data of the first camera 39L. Similarly, the alignment mark Mb is also reflected in the image of the shooting range DR shown by the substrate imaging data of the second camera 39R.

[0201] The control unit 2a determines the distance hL in the X-axis direction from the center of the imaging range DL to the center of the alignment mark Mb located within the imaging range DL. Furthermore, the control unit 2a determines the distance hR in the X-axis direction from the center of the imaging range DR to the alignment mark Mb located within the imaging range DR. The distance between the center of the imaging range DL and the center of the imaging range DR is the camera pitch Cp, and correction has been performed for this camera pitch Cp. In other words, the camera pitch Cp is correctly measured. Therefore, the control unit 2a calculates the substrate mark spacing A using A = Cp + (hL + hR). Thus, the substrate mark spacing A can be accurately measured.

[0202] In addition, such as Figure 12 As shown in (b), the alignment mark Mc is reflected in the image of the shooting range DL shown by the component imaging data of the first camera 39L. Similarly, the alignment mark Mc is also reflected in the image of the shooting range DR shown by the component imaging data of the second camera 39R.

[0203] Control unit 2a determines the distance iL in the X-axis direction from the center of the imaging range DL to the alignment mark Mc located within the imaging range DL. Furthermore, control unit 2a determines the distance iR in the X-axis direction from the center of the imaging range DR to the alignment mark Mc located within the imaging range DR. The distance between the center of the imaging range DL and the center of the imaging range DR is the camera spacing Cp, and correction has been performed for this camera spacing Cp. In other words, the camera spacing Cp is correctly measured. Therefore, control unit 2a calculates the component mark spacing B using B = Cp + (iL + iR). Thus, the component mark spacing B can be accurately measured.

[0204] in addition, Figure 12In this case, a distance of the alignment mark from the center of the imaging range DL to the positive side of the X-axis direction is a negative value, and a distance of the alignment mark from the center of the imaging range DL to the negative side of the X-axis direction is a positive value. Further, a distance of the alignment mark from the center of the imaging range DR to the positive side of the X-axis direction is a positive value, and a distance of the alignment mark from the center of the imaging range DR to the negative side of the X-axis direction is a negative value.

[0205] Here, if the measured substrate mark-to-mark distance A and the component mark-to-mark distance B are within the allowable range, respectively, the control section 2a in the present embodiment performs process control. On the other hand, if at least one of the measured substrate mark-to-mark distance A and the component mark-to-mark distance B is outside the allowable range, the control section 2a prohibits the press bonding of the component 5 to the substrate 3 based on the press bonding tool 34. In other words, in the present embodiment, the control section 2a measures the distance between a pair of alignment marks based on the results of the photographing and the correction of the pair of alignment marks, determines whether the measured distance is outside the allowable range, and in the case where it is determined that the distance is outside the allowable range, prohibits the press bonding of the component 5 based on the press bonding tool 34. Thus, in the case where the position of the electrode portion of the substrate 3 or the component 5 deviates greatly from the correct position due to the deviation of the position of the substrate 3 or the electrode portion of the component 5, the press bonding using the substrate 3 or the component 5 is prohibited, and thus it is possible to suppress the production of a mounting substrate of low quality. For example, if the component mark-to-mark distance B is outside the allowable range, the control section 2a prohibits the press bonding of the component 5, and the disposal section 38 performs the disposal of the component 5.

[0206] [Process control]

[0207] Ideally, in the component 5 and the substrate 3 to which the component 5 is press-bonded, the substrate mark-to-mark distance A is equal to the component mark-to-mark distance B. However, there is a deviation in the distance between the component 5 and the substrate 3, respectively. The process control is a process of adjusting parameters used in the press bonding of the component 5 to the substrate 3 based on the difference Δ between the substrate mark-to-mark distance A and the component mark-to-mark distance B. The difference Δ is calculated by difference Δ = (substrate mark-to-mark distance A) - (component mark-to-mark distance B). The control section 2a adjusts a plurality of parameters used in the temporary press bonding of the component 5 to the substrate 3 based on the temporary press bonding section 30 according to the difference Δ, and controls the temporary press bonding section 30 according to the adjusted plurality of parameters. Further, the control section 2a adjusts a plurality of parameters used in the formal press bonding of the component 5 to the substrate 3 based on the formal press bonding section 40 according to the difference Δ, and controls the formal press bonding section 40 according to the adjusted plurality of parameters.

[0208] Figure 13 is a diagram for explaining an outline of the process control.

[0209] For example, in the formal press bonding in the formal press bonding portion 40, the press bonding tool 43 heated by a heater or the like is lowered, and the member 5 to be temporarily press-bonded to the substrate 3 is pressed toward the substrate 3. The substrate 3 is supported from below by the lower support portion 46. As a result, the member 5, the ACF 91, and the substrate 3 are sandwiched between the press bonding tool 43 and the lower support portion 46, and are pressed from the top and bottom directions. Thus, the electrode portion 6 of the member 5 and the electrode portion 4 of the substrate 3 are electrically connected via the ACF 91.

[0210] Here, in a case where the difference Δ between the substrate mark-to-mark spacing A and the member mark-to-mark spacing B is large, even if the member 5 is formally press-bonded to the substrate 3, the electrode portion 6 of the member 5 and the electrode portion 4 of the substrate 3 can not be properly connected. Further, in a case where the member 5 includes a film or the like, such as a TCP, the member 5 is easily deformed due to the influence of pressure or heat. Therefore, if the press bonding tool 43 is heated and presses the member 5, the member 5 can be stretched in the X-axis direction and the Y-axis direction due to the heat and the pressure from the press bonding tool 43.

[0211] Therefore, in the process control, the parameters such as the temperature and the load used in the press bonding of the member 5 to the substrate 3 are adjusted in accordance with the above difference Δ, so that the deformation of the member 5 is promoted or suppressed, and the electrode portion 6 of the member 5 and the electrode portion 4 of the substrate 3 can be properly connected.

[0212] Figure 14 is a graph showing a plurality of parameters adjusted by the process control.

[0213] The plurality of parameters used in the temporary press bonding are, for example, a load speed, a maximum value of a load, a maximum value of a temperature of the press bonding tool 34, a maximum value of a temperature of the lower support portion 36, a difference between the temperature of the press bonding tool 34 and the temperature of the lower support portion 36, and a lowering speed of the press bonding tool 34. The load speed is an amount of change per unit time of the load applied to the member 5 and the substrate 3 by the press bonding tool 34. The maximum value of the load is a maximum value of the load applied to the member 5 and the substrate 3 by the press bonding tool 34. The maximum value of the temperature of the press bonding tool 34 is a maximum value of the temperature of the press bonding tool 34 heated by a heater or the like. The maximum value of the temperature of the lower support portion 36 is a maximum value of the temperature of the lower support portion 36 heated by a heater or the like.

[0214] The various parameters used in the formal press bonding are also the same as those used in the provisional press bonding. In other words, the various parameters used in the formal press bonding are, for example, a load speed, a maximum value of the load, a maximum value of the temperature of the press tool 43, a maximum value of the temperature of the lower receiving portion 46, a difference between the temperature of the press tool 43 and the temperature of the lower receiving portion 46, and a lowering speed of the press tool 43. The load speed is the amount of change per unit time of the load applied to the component 5 and the substrate 3 by the press tool 43. The maximum value of the load is the maximum value of the load applied to the component 5 and the substrate 3 by the press tool 43. The maximum value of the temperature of the press tool 43 is the maximum value of the temperature of the press tool 43 heated by a heater or the like. The maximum value of the temperature of the lower receiving portion 46 is the maximum value of the temperature of the lower receiving portion 46 heated by a heater or the like.

[0215] The control portion 2a sets a reference value corresponding to the kind of the parameter to the parameter if the difference Δ is within the reference range, as shown in FIG. 6. On the other hand, the control portion 2a sets a value increased or decreased from the reference value set in advance to the kind of the parameter to the parameter if the difference Δ is outside the reference range. The reference range can be, for example, -1 μm or more and 1 μm or less. Figure 14

[0216] For example, with respect to the parameter of the load speed in the provisional press bonding, the control portion 2a sets a value larger than the reference value set in advance to the parameter to the parameter if the difference Δ is smaller than the reference range. In contrast, the control portion 2a sets a value smaller than the reference value set in advance to the parameter to the parameter if the difference Δ is larger than the reference range. With respect to each of the parameters of the maximum value of the load and the maximum value of the temperature of the lower receiving portion 36 in the provisional press bonding, the values are set in the same manner as the parameter of the load speed.

[0217] In addition, with respect to the parameter of the maximum value of the temperature of the press tool 34 in the provisional press bonding, the control portion 2a sets a value smaller than the reference value set in advance to the parameter to the parameter if the difference Δ is smaller than the reference range. In contrast, the control portion 2a sets a value larger than the reference value set in advance to the parameter to the parameter if the difference Δ is larger than the reference range. With respect to each of the parameters of the difference between the temperature of the press tool 34 and the temperature of the lower receiving portion 36 and the lowering speed of the press tool 34 in the provisional press bonding, the values are set in the same manner as the parameter of the maximum value of the temperature of the press tool 43.

[0218] In addition, with respect to the various parameters of the formal press bonding, the values are set in the same manner as the various parameters of the provisional press bonding.

[0219] The control portion 2a controls the provisional press bonding portion 30 and the formal press bonding portion 40 in accordance with the various parameters whose values are thus set. As a result, the electrode portion 6 of the component 5 and the electrode portion 4 of the substrate 3 can be properly connected, and the quality of the mounted substrate can be improved.​

[0220] [Disposal]

[0221] If the component mark-to-component mark distance B of the component 5 adsorbed to the crimping tool 34 is outside the allowable range, the control section 2a prohibits crimping of the component 5 to the substrate 3 based on the crimping tool 34. At this time, the control section 2a further causes the disposal section 38 to perform disposal of the component 5. At this time, the disposal section 38 receives the component 5 from the crimping tool 34 for disposal.

[0222] Figure 15 is a view that represents a procedure of handing over the component 5 from the crimping tool 34 to the disposal section 38 along the time series. In addition, Figure 15 represents a state of observing the temporary crimping section 30 from the inside (i.e., the positive side of the Y-axis direction). Further, the disposal section 38 in the present embodiment is provided with a shaft driving section 38b, a movable shaft 38c, and a recovery stage 38a. The shaft driving section 38b reciprocates the movable shaft 38c in the X-axis direction. The recovery stage 38a is installed to the front end of the movable shaft 38c and is configured to place the component 5.

[0223] First, as shown in (a) of Figure 15 , the crimping tool 34 adsorbs and holds the component 5. Further, the disposal section 38 is in a state in which the movable shaft 38c converges inside the shaft driving section 38b. In other words, the recovery stage 38a is in the origin position. At this time, the first camera 39L and the second camera 39R, via the lower receiving section 36, perform imaging of the component 5 held to the crimping tool 34. The control section 2a measures the component mark-to-component mark distance B of the component 5 based on the component imaging data of the component 5 obtained by the imaging. Here, in a case in which the component mark-to-component mark distance B is not within the allowable range, the control section 2a determines that disposal of the component 5 is required.

[0224] As a result, the control section 2a controls the disposal section 38 for disposal of the component 5. The disposal section 38, by being controlled based on the control section 2a, as shown in (b) of Figure 15 , draws out the movable shaft 38c from the shaft driving section 38b and moves the recovery stage 38a to the positive side of the X-axis direction. Thereby, the recovery stage 38a enters the space between the crimping tool 34 and the lower receiving section 36. At this time, the component 5 held to the crimping tool 34 opposes the recovery stage 38a in the Z-axis direction.

[0225] Next, as shown in (c) of Figure 15 , the crimping tool 34 descends along the Z-axis direction. As a result, the component 5 held to the crimping tool 34 comes into contact with the recovery stage 38a.

[0226] Next, as shown in (d) of Figure 15As shown in (d), the press tool 34 releases the component 5 by stopping the suction of the component 5, and rises in the Z-axis direction. Thus, the component 5 is placed on the recovery stage 38a.

[0227] Also, as shown in Figure 15 As shown in (e), the disposal section 38 moves the movable shaft 38c into the inside of the shaft drive section 38b, and moves the recovery stage 38a to the negative side in the X-axis direction. As a result, the recovery stage 38a retreats from the space between the press tool 34 and the lower receiving section 36, and returns to the above-mentioned original position. Thus, the component 5 placed on the recovery stage 38a also moves with the recovery stage 38a, retreats from the space, and reaches the original position. The operator takes out the component 5 placed on the recovery stage 38a at the original position to the outside of the temporary press section 30.

[0228] [Process flow of component press device]

[0229] Figure 16 is a flowchart showing the overall process procedure of the component press device 100 in the present embodiment.

[0230] First, the control section 2a of the component press device 100 performs the correction of the camera pitch Cp by controlling the first camera 39L and the second camera 39R (step Sll). Then, the control section 2a moves the first camera 39L and the second camera 39R in the Y-axis direction by controlling an actuator such as a motor (step S12). By this movement, the first camera 39L and the second camera 39R are disposed below the press tool 34. Further, the press tool 34 suctions and holds the component 5 moved from the component supply section 33 through the component moving section 35 (step S13).

[0231] Next, the control section 2a causes the first camera 39L and the second camera 39R to take an image of the pair of alignment marks Mc of the component 5 suctioned to the press tool 34, and measures the component mark-to-mark pitch B based on the result of the image taking (step S14). Then, the control section 2a judges whether the component mark-to-mark pitch B is within the allowable range (step S15). Here, if the control section 2a judges that the component mark-to-mark pitch B is not within the allowable range (NO in step S15), the press of the component 5 is prohibited (step S16). Also, the control section 2a causes the disposal of the component 5 to be performed by controlling the disposal section 38 (step S17).

[0232] On the other hand, if the control section 2a judges that the component mark-to-mark pitch B is within the allowable range (YES in step S15), the control section 2a moves the substrate 3 held by the stage 37 to the lower receiving section 36 side (step S18). By this movement, the pair of alignment marks Mb of the substrate 3 is disposed below the first camera 39L and the second camera 39R.

[0233] Next, the control section 2a causes the first camera 39L and the second camera 39R to capture the pair of alignment marks Mb of the substrate 3, and based on the captured results, measures the substrate mark-to-substrate mark distance A (step S19). Also, the control section 2a determines whether the substrate mark-to-substrate mark distance A is within the allowable range (step S20). Here, if the control section 2a determines that the substrate mark-to-substrate mark distance A is not within the allowable range (NO in step S20), the control section 2a prohibits the press bonding of the substrate 3 (step S21). At this time, the control section 2a can also separate the stage 37 holding the substrate 3 from the lower support section 36, and notify the operator of the removal of the substrate 3 from the stage 37.

[0234] On the other hand, if the control section 2a determines that the substrate mark-to-substrate mark distance A is within the allowable range (YES in step S20), the control section 2a determines the difference Δ between the measured substrate mark-to-substrate mark distance A and the component mark-to-component mark distance B (step S22). Also, the control section 2a adjusts the position of the stage 37 so that the pair of alignment marks Mc of the component 5 overlaps the pair of alignment marks Mb of the substrate 3, and causes the press bonding tool 34 to perform the temporary press bonding of the component 5 to the substrate 3. At this time, the control section 2a performs the process control corresponding to the difference Δ between the substrate mark-to-substrate mark distance A and the component mark-to-component mark distance B, and causes the press bonding tool 34 to perform the temporary press bonding of the component 5 to the substrate 3 (step S23). In addition, the control section 2a can also cause the formal press bonding section 40 to perform the formal press bonding of the component 5 based on the process control corresponding to the difference Δ.

[0235] Thus, in the present embodiment, the camera pitch Cp is corrected. Therefore, the distance between the pair of alignment marks can be correctly measured based on the results of the correction of the camera pitch Cp and the capturing of the pair of alignment marks of the substrate 3 and the component 5. As a result, the position of each electrode portion of the substrate 3 and the component 5, the position of the lead, or the deviation of the lead-to-lead distance can be properly grasped and managed. Also, the control of the press bonding of the component 5 corresponding to the deviation is performed, such as the disposal of the component 5, so that the quality improvement of the mounting substrate can be achieved.

[0236] Further, in the present embodiment, the lower support section 36 to be fixed is provided with the correction jig 8, so that the positional deviation of the correction jig 8, i.e., the positional deviation of at least one correction mark Ma, can be suppressed. As a result, the distance between the pair of alignment marks can be more correctly measured, and the quality improvement of the mounting substrate can be further achieved.

[0237] Further, in the present embodiment, the camera pitch Cp is substantially the same when the capturing of the pair of alignment marks is performed and when the correction of the camera pitch Cp is performed. Therefore, the distance between the pair of alignment marks, i.e., the substrate mark-to-substrate mark distance A and the component mark-to-component mark distance B, can be more correctly measured.

[0238] Further, in the present embodiment, the plurality of correction marks Ma are arranged along the movable directions of the pair of imaging ranges DL and DR, i.e., the X-axis directions, of the correction jig 8. Thereby, for example, even in a case where the distance between the pair of imaging ranges DL and DR is adjusted depending on the kind of the substrate 3 and the component 5, or the like, the correction marks Ma can be respectively converged in the pair of imaging ranges DL and DR. As a result, the respective distances of the substrate mark-to-substrate mark distance A and the component mark-to-component mark distance B can be correctly measured regardless of the kind of the substrate 3 and the component 5, and the quality improvement of the mounting substrate can be achieved.

[0239] (Modified Example 1)

[0240] In the above embodiment, the correction jig 8 is disposed on the upper surface of the lower receiving portion 36. However, the lower receiving portion 36 can not be disposed on the upper surface thereof.

[0241] Figure 17 is a view showing a disposition example of the correction jig 8 in the present modified example.

[0242] In the present modified example, as shown in Figure 17 , the correction jig 8 is disposed below the lower receiving portion 36. In this case, the through portion h2 can not be formed in the lower receiving portion 36.

[0243] Thus, in the present modified example, the correction jig 8 is disposed below the lower receiving portion 36, and therefore the interference of the substrate 3 disposed on the upper surface of the lower receiving portion 36 with the correction jig 8 can be further suppressed. Further, in a case where the component 5 held by the press contact tool 34 is formed longer in the positive side of the Y-axis direction using a soft material such as a film, a portion of the component 5 can sag and cover the non-supporting surface 36b of the lower receiving portion 36. In other words, if the press contact tool 34 descends toward the supporting surface 36a of the lower receiving portion 36 for temporary press contact, the portion of the component 5 held by the press contact tool 34 in the positive side of the Y-axis direction is covered on the non-supporting surface 36b. At this time, in a case where the correction jig 8 is disposed on the non-supporting surface 36b of the lower receiving portion 36, the correction jig 8 can interfere with the portion of the component 5 in the positive side of the Y-axis direction as described above. However, in the present modified example, the correction jig 8 is disposed below the lower receiving portion 36, and therefore the interference of the correction jig 8 with the component 5 can be further suppressed.

[0244] (Modified Example 2)

[0245] In the above embodiment, the component supply portion 33 of the temporary press contact portion 30 is punched out from a tape component housing body such as a TCP and supplies the component 5, but the component 5 placed on a tray can be supplied.

[0246] Figure 18 is a plan view of the component mounting line 1 to which the present modification pertains. Specifically, Figure 18 indicates the structure of the component mounting line 1 as viewed from above.

[0247] The component mounting line 1 to which the present modification pertains is provided with the substrate carrying-in section 10, the tacking section 20, the formal press bonding section 40, the substrate carrying-out section 50, and the conveyance section 60, as in the above-described embodiment, and further, in place of the temporary press bonding section 30, is provided with a temporary press bonding section 30A. In other words, the component press bonding apparatus 100 to which the present modification pertains includes the temporary press bonding section 30A and the control section 2a of the computer 2.

[0248] The temporary press bonding section 30A is in place of the component supply section 33 of the above-described embodiment, and is provided with a component supply section 33H.

[0249] At the component supply section 33H, two tray groups are arranged along the X-axis direction. The tray groups include a plurality of trays 7 stacked along the Z-axis direction. Further, at the trays 7, a plurality of components 5 are placed, for example, in a matrix shape. The component supply section 33H supplies the plurality of components 5 together with the trays 7.

[0250] The component moving section 35 in the present modification moves the tray 7 on which the plurality of components 5 are placed, which is supplied from the component supply section 33H, to the negative side in the Y-axis direction.

[0251] Further, the component mounting mechanism 32 in the present modification is provided with the press bonding tool 34, the moving mechanism 35a, and the lower receiving section 36. The moving mechanism 35a moves the press bonding tool 34 in the X-axis direction and the Y-axis direction. Therefore, the press bonding tool 34 is moved in the X-axis direction and the Y-axis direction by the moving mechanism 35a, and is stopped on the component 5 that is the press bonding target placed on the tray 7. Then, the press bonding tool 34 is lowered, sucks and holds the component 5 that is the press bonding target, and is raised. Further, the press bonding tool 34 is moved in the X-axis direction and the Y-axis direction by the moving mechanism 35a, and is stopped on the lower receiving section 36. The press bonding tool 34 is lowered, and press bonds the component 5 on the press bonding target portion of the substrate 3 supported by the lower receiving section 36.

[0252] The component press bonding apparatus 100 in the component mounting line 1 to which the present modification pertains as described above can also function similarly to the above-described embodiment. In other words, the component mounting line 1 to which the present modification pertains can also be provided with the correction jig 8, and can perform correction of the camera pitch Cp between the first camera 39L and the second camera 39R. Further, if the component mark-to-component mark pitch B of the component 5 held by the press bonding tool 34 is outside the allowable range, the disposal processing section 38 can perform disposal processing on the component 5.

[0253] (Other Modification)

[0254] The above describes the component press-bonding device according to one or more of the embodiments and modifications thereof, but the present disclosure is not limited to the embodiments and modifications. Any of the modifications that a person skilled in the art can conceive of, and any of the configurations that a person skilled in the art can conceive of by combining the elements of the embodiments and modifications, are also included in the scope of the present disclosure, as long as they do not depart from the spirit of the present disclosure.

[0255] For example, in the above embodiments and modifications, the correction jig 8 forms a plurality of correction marks Ma, but it can form only one correction mark Ma. Also, the correction marks Ma can not be circular or quadrangular, but can be other shapes. Further, the plurality of correction marks Ma can be scales.

[0256] Also, in the above embodiments and modifications, the pair of alignment marks Mc of the component 5 and the pair of alignment marks Mb of the substrate 3 are imaged, but imaging of only one of them can be performed. In this case, only one of the substrate mark-to-substrate mark distance A and the component mark-to-component mark distance B is measured, and the press-bonding of the component 5 is controlled based on the measurement result.

[0257] Also, in the above embodiments and modifications, the camera distance Cp is not changed but is substantially the same when imaging the alignment marks of the component 5 and the substrate 3 and imaging the correction jig 8. However, the camera distance Cp can be changed. In other words, in the correction of the camera distance Cp, the relationship between the camera distance Cp and the target distance Cpt can be determined. In other words, the amount of deviation of the actual camera distance Cp from the target distance Cpt can be determined. Therefore, even if the camera distance Cp is changed to coincide with another target distance Cpt, if the amount of deviation is reflected with respect to the other target distance Cpt, the changed camera distance Cp can be correctly determined. The above other target distance Cpt is a distance corresponding to the distance between the pair of alignment marks of the component 5 and the substrate 3, and when imaging the alignment marks of the component 5 and the substrate 3, the camera distance Cp at that time can also be correctly determined.

[0258] Also, in the above embodiments and modifications, the imaging of the substrate 3 is performed after the imaging of the component 5, but the imaging of the component 5 can be performed after the imaging of the substrate 3.

[0259] Also, in the above embodiments and modifications, process control can be performed for the temporary press-bonding and the final press-bonding separately, or process control can be performed for only the temporary press-bonding or only the final press-bonding.

[0260] Further, in the above embodiment and its variations, the component press-contacting device 100 includes the temporary press-contacting portion 30 and the control portion 2a of the computer 2, but can further include the formal press-contacting portion 40.

[0261] Further, in the above embodiment and its variations, the allowable range for the substrate mark-to-mark spacing A and the allowable range for the component mark-to-mark spacing B can be the same or different.

[0262] Further, the timing of the correction of the camera spacing Cp in the above embodiment and its variations can be before the press-contacting of the component 5, or can be any timing. The correction of the camera spacing Cp can be performed whenever the substrate 3 is placed on the table 37, or whenever a predetermined period elapses.

[0263] Further, in the above embodiment and its variations, the substrate 3 is a display panel, and the component 5 is temporarily and formally press-contacted on the display panel, but the substrate 3 can be a substrate other than a display panel.

[0264] Further, in the above embodiment and its variations, all or a part of the structural elements of the computer 2 can include a dedicated hardware, or can be realized by a software program appropriate for each structural element. Each structural element can be realized by a program execution portion such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded in a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution portion causes the temporary press-contacting portion 30 to perform each step included in the flowchart shown in the above embodiment. Figure 16

[0265] Further, the structural elements of the computer 2 can include one or more electronic circuits. The one or more electronic circuits can each be a general-purpose circuit, or can be a dedicated circuit. The one or more electronic circuits can include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration), or the like. The IC or LSI can be integrated in one chip, or can be integrated in a plurality of chips. Here, the IC or LSI is referred to, but depending on the degree of integration, it can be referred to as a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). Further, a FPGA (Field Programmable Gate Array) that is programmed after the manufacture of the LSI can also be used with the same purpose.

[0266] Industrial Applicability​

[0267] The present disclosure can be utilized, for example, in a component crimping device possessed by a component mounting line or the like in which a display panel mounting component is mounted.

Claims

1. A component press bonding apparatus comprising: a lower support portion that supports a peripheral portion of a substrate from a lower side of the substrate; a press bonding tool that press bonds a component to the peripheral portion of the substrate supported by the lower support portion; a correction tool that forms at least one correction mark as a reference of a position; a pair of imaging portions that image an object included in a pair of imaging ranges, respectively; and a control portion that controls the pair of imaging portions and the press bonding tool, wherein a distance between the pair of imaging ranges is variable, the control portion causes the pair of imaging portions to image at least one correction mark of the correction tool as the object, and performs correction of the distance between the pair of imaging ranges based on a result of the imaging of the correction tool, the control portion causes the pair of imaging portions to image a pair of alignment marks formed in at least one of the substrate and the component, in a state where an interval of the pair of imaging ranges is adjusted so that one of the pair of alignment marks is converged in one of the pair of imaging ranges as the object and the other of the pair of alignment marks is converged in the other of the pair of imaging ranges as the object, and the control portion controls press bonding of the component based on the press bonding tool based on a result of the imaging of the pair of alignment marks and a result of the correction.

2. The component press bonding apparatus according to claim 1, wherein the correction tool is provided to the lower support portion.

3. The component press bonding apparatus according to claim 1, wherein in the correction of the distance between the pair of imaging ranges, the control portion causes the pair of imaging portions to image at least one correction mark of the correction tool as the object in a state where the interval of the pair of imaging ranges is adjusted to be substantially the same as when the imaging of the pair of alignment marks is performed.

4. The component press bonding apparatus according to claim 1, wherein the pair of imaging ranges are movable along one direction, and a plurality of correction marks are arranged in the correction tool along the one direction.

5. The component press bonding apparatus according to claim 1, wherein the correction tool is disposed at a position that does not overlap the substrate supported by the lower support portion in a vertical direction.

6. The component press bonding apparatus according to claim 5, wherein the correction tool is disposed at a position lower than a support surface of the lower support portion that is in contact with the peripheral portion of the substrate.

7. The component press bonding apparatus according to any one of claims 1 to 6, wherein the control portion measures a distance between the pair of alignment marks based on a result of the imaging of the pair of alignment marks and a result of the correction, the control portion determines whether the measured distance is outside an allowable range, and the control portion prohibits press bonding of the component based on the press bonding tool in a case where it is determined that the distance is outside the allowable range.

8. A component press bonding method of a component press bonding apparatus that press bonds a component to a substrate, the component press bonding apparatus comprising: a lower support portion that supports a peripheral portion of a substrate from a lower side of the substrate; a press bonding tool that press bonds a component to the peripheral portion of the substrate supported by the lower support portion; a correction tool that forms at least one correction mark as a reference of a position; a pair of imaging portions that image an object included in a pair of imaging ranges, respectively; and a control portion that controls the pair of imaging portions and the press bonding tool, wherein a distance between the pair of imaging ranges is variable, the control portion causes the pair of imaging portions to image at least one correction mark of the correction tool as the object, and performs correction of the distance between the pair of imaging ranges based on a result of the imaging of the correction tool, the control portion causes the pair of imaging portions to image a pair of alignment marks formed in at least one of the substrate and the component, in a state where an interval of the pair of imaging ranges is adjusted so that one of the pair of alignment marks is converged in one of the pair of imaging ranges as the object and the other of the pair of alignment marks is converged in the other of the pair of imaging ranges as the object, and the control portion controls press bonding of the component based on the press bonding tool based on a result of the imaging of the pair of alignment marks and a result of the correction. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a lower receiving portion that supports a rim portion of the substrate from a lower side of the substrate; a press tool that presses the component against the rim portion of the substrate supported by the lower receiving portion; a correction tool that forms at least one correction mark as a reference of a position; and a pair of imaging portions that capture an object included in a pair of imaging ranges, respectively, a distance between the pair of imaging ranges is variable, in the component press method, the pair of imaging portions is caused to capture, with at least one correction mark of the correction tool as the object, and correction of the distance between the pair of imaging ranges is performed based on a result of the capturing of the correction tool, in a state where a gap between the pair of imaging ranges is adjusted so that one of a pair of alignment marks formed in at least one of the substrate and the component is converged in one of the pair of imaging ranges as the object and the other of the pair of alignment marks is converged in the other of the pair of imaging ranges as the object, the pair of imaging portions captures the pair of alignment marks, based on a result of the capturing of the pair of alignment marks and a result of the correction, the press of the component based on the press tool is controlled.

9. The component press method according to claim 8, wherein in the control of the press of the component, based on the result of the capturing of the pair of alignment marks and the result of the correction, a distance between the pair of alignment marks is measured, it is determined whether the measured distance is outside an allowable range, in a case where it is determined that the distance is outside the allowable range, the press of the component based on the press tool is prohibited.

Images