Test equipment, component handling device thereof, and test method for test equipment

Abstract

A test device, a component handling device thereof, and a test method for the test device, wherein the test device includes a test carrier and a component handling device. The component handling device includes a pick-and-place arm, a vacuum adsorption unit, a working bottom cover, and a fluid transfer group. The vacuum adsorption unit is connected to the pick-and-place arm for removably adsorbing onto an object to be tested. One end of the working bottom cover is connected to the pick-and-place arm, and the other end has a recessed groove and an elastic airtight ring. The elastic airtight ring surrounds the recessed groove for airtightly covering the top surface of the object to be tested, and the recessed groove and the top surface of the object to be tested jointly define a liquid holding space. The fluid transfer group partially extends into the liquid holding space, allowing a liquid temperature control device to inject and withdraw a working liquid that can exchange heat with the top surface of the object to be tested. Through the above structure, the test device directly contacts the test component with liquid, omitting layers of thermal resistance to improve heat dissipation efficiency and eliminate problems caused by heat accumulation.

Description

Technical Field

[0001] The present invention relates to a testing device, and in particular to a testing device with a heat dissipation module, a component transporting device thereof, and a testing method for the testing device. Background Art

[0002] Generally speaking, when performing electrical testing on a semiconductor device (such as a semiconductor circuit chip, called a device under test, DUT), the DUT is placed on a test socket of a test device. The crimping head of the test device presses the DUT downward so that the DUT can be effectively electrically connected to the test socket, thereby performing a test operation on the DUT.

[0003] However, during the test process, the crimping head will quickly accumulate a lot of heat energy on the device under test, leading to heat accumulation problems. In addition, the crimping head has limited heat dissipation efficiency for the device under test, which may cause the device under test to be damaged due to overheating. It may also lead to inaccurate test data, affecting the test results. Summary of the Invention

[0004] An object of the present invention is to provide a testing device, a component handling device thereof, and a testing method for the testing device to solve the difficulties mentioned in the above-mentioned prior art.

[0005] One embodiment of the present invention provides a testing device. The testing device includes a first vacuum pumping device, a liquid temperature control device, a test carrier and a component transporting device. The component transporting device is used to pick up and transport an object to be tested to the test carrier. The component transporting device includes a pick-up and placement arm, a vacuum adsorption unit, a working bottom cover and a fluid transfer group. The vacuum adsorption unit is connected to the pick-up and placement arm and the first vacuum pumping device, and is used to be removably adsorbed onto the object to be tested. The working bottom cover includes a cover body and an elastic airtight ring. One end of the cover body is connected to the pick-up and placement arm, and the other end has a recessed groove. The elastic airtight ring is fixedly arranged at the other end of the cover body and surrounds the recessed groove to airtightly cover a top surface of the object to be tested, so that a liquid holding space is jointly defined between the recessed groove and the top surface of the object to be tested. The fluid transfer group is located on the working bottom cover, connected to the liquid temperature control device, and partially extends into the liquid holding space. In this way, the liquid temperature control device continuously injects a working liquid onto the top surface of the object to be tested through the fluid transmission group, so that the working liquid and the object to be tested exchange heat, and then withdraws the working liquid through the fluid transmission group.

[0006] According to one or more embodiments of the present invention, the aforementioned testing apparatus further includes a second vacuum pumping device. The working bottom cover further includes an inner vacuum pumping tube. The inner vacuum pumping tube is formed within the cover body and surrounds the fluid transfer assembly. One end of the inner vacuum pumping tube is connected to the second vacuum pumping device, and the other end extends through an elastic airtight ring for removable attachment to the top surface of the object under test.

[0007] According to one or more embodiments of the present invention, in the aforementioned testing apparatus, the working bottom cover further includes an outer vacuum tube. This outer vacuum tube is formed within the cover body. One end of the outer vacuum tube is connected to a second vacuum pump, and the other end extends through an elastic airtight ring for removable attachment to the top surface of the object under test. The outer vacuum tube surrounds the inner vacuum tube and the fluid transfer assembly.

[0008] According to one or more embodiments of the present invention, in the aforementioned testing apparatus, the fluid transfer assembly includes at least one first delivery line and at least one second delivery line. One end of the first delivery line is located within the recessed tank, and the other end is connected to a liquid temperature control device to guide the working liquid into the liquid storage space. One end of the second delivery line is located within the recessed tank, and the other end is connected to the liquid temperature control device to guide the working liquid out of the liquid storage space.

[0009] According to one or more embodiments of the present invention, in the above-mentioned testing device, when there are multiple second delivery lines, the first delivery line is located between the second delivery lines.

[0010] According to one or more embodiments of the present invention, the aforementioned testing apparatus further includes a water pump. The fluid transfer assembly further includes a third delivery pipeline. One end of the third delivery pipeline is located within the recessed tank, and the other end is connected to the water pump. Thus, after the liquid temperature control device withdraws the working fluid, the water pump drains the remaining working fluid through the third delivery pipeline.

[0011] According to one or more embodiments of the present invention, the testing apparatus further includes a hot air supply device. The hot air supply device is connected to the first delivery line and the second delivery line. The hot air supply device continuously injects dry air into the liquid storage space through the first delivery line and extracts the dry air from the liquid storage space through the second delivery line.

[0012] According to one or more embodiments of the present invention, in the above-mentioned testing apparatus, the long axis of the first conveying line vertically passes through the top surface of the object to be tested.

[0013] According to one or more embodiments of the present invention, in the aforementioned testing device, the first delivery pipeline is curved to reduce the flow rate of the working fluid.

[0014] According to one or more embodiments of the present invention, in the above-mentioned testing device, one end of the first delivery pipeline further has a flow guide portion, and the flow guide portion is used to change the flow direction of the working liquid reaching the top surface of the object to be tested.

[0015] According to one or more embodiments of the present invention, in the aforementioned testing apparatus, the object under test is a semiconductor component comprising a substrate and a bare die. The bare die is located on the substrate. Thus, when the component handling device picks up the semiconductor component, the vacuum suction unit adheres to one side of the substrate, the elastic airtight ring airtightly covers the side of the bare die facing away from the substrate, and the long axis of the first conveying line passes through the center of the bare die.

[0016] According to one or more embodiments of the present invention, in the aforementioned testing apparatus, the object under test is a semiconductor component, comprising a substrate, a die unit, and a mask cover. The die unit is positioned between the substrate and the mask cover and thermally connected to the mask cover. Thus, when the component handling device picks up the semiconductor component, the vacuum unit adheres to one side of the substrate, an elastic airtight ring airtightly covers the side of the mask cover facing away from the substrate, and the long axis of the first conveying line passes through the center of the die unit.

[0017] One embodiment of the present invention provides a component handling device. The component handling device includes a pick-and-place arm, a vacuum adsorption unit, a working bottom cover, and a fluid transmission group. The vacuum adsorption unit is connected to the pick-and-place arm for removably adsorbing onto the object to be tested. The working bottom cover includes a cover body and an elastic airtight ring. One end of the cover body is connected to the pick-and-place arm, and the other end has a recessed groove. The elastic airtight ring is fixedly arranged at the other end of the cover body and surrounds the recessed groove to airtightly cover a top surface of the object to be tested, so that the recessed groove and the top surface of the object to be tested jointly define a liquid holding space. The fluid transmission group includes a plurality of delivery pipelines. These delivery pipelines are located on the working bottom cover and extend into the recessed grooves respectively for connecting to a liquid temperature control device. In this way, when the elastic airtight ring airtightly covers the top surface of the object to be tested, the recessed groove and the top surface of the object to be tested jointly define a liquid holding space connected to the delivery pipeline.

[0018] According to one or more embodiments of the present invention, in the component handling device described above, the working bottom cover includes an inner vacuum tube and an outer vacuum tube. The inner vacuum tube is formed within the cover and surrounds the fluid transfer assembly. One end of the inner vacuum tube extends through an elastic airtight ring for removable attachment to the top surface of the object to be tested. The outer vacuum tube is formed within the cover and surrounds the inner vacuum tube and the fluid transfer assembly. One end of the outer vacuum tube extends through the elastic airtight ring for removable attachment to the top surface of the object to be tested.

[0019] According to one or more embodiments of the present invention, in the aforementioned component transporting device, one of the conveying pipelines is curved.

[0020] According to one or more embodiments of the present invention, in the aforementioned component transporting device, an end of a conveying pipeline further has a flow guide portion.

[0021] One embodiment of the present invention provides a testing method. The testing method includes several steps as follows. (a) vacuum adsorption to a top surface of an object to be tested through a component transporting device; (b) airtightly covering the top surface of the object to be tested with the component transporting device so that a liquid holding space is jointly defined between the component transporting device and the top surface of the object to be tested; (c) transporting the object to be tested to a test carrier; (d) injecting a working liquid into the liquid holding space so that the working liquid and the top surface of the object to be tested perform heat exchange and extract the working liquid in the liquid holding space; (e) performing electrical testing on the object to be tested, and when it is determined that the temperature of the object to be tested does not meet a preset standard, returning to (d); (f) drying the object to be tested in the liquid holding space after completing the test of the object to be tested; and (g) moving the object to be tested from the test carrier to a collection area.

[0022] According to one or more embodiments of the present invention, in the above-mentioned testing method, step (a) and step (b) are completed simultaneously.

[0023] According to one or more embodiments of the present invention, in the above-mentioned testing method, step (f) further includes the following steps: evacuating the remaining working liquid in the liquid holding space; injecting dry air into the liquid holding space to dry the top surface of the object to be tested; and evacuating the dry air from the liquid holding space.

[0024] Thus, through the above-described structures of the embodiments, the present invention uses liquid to directly exchange heat with the test element, omitting layers of thermal resistance to improve heat dissipation efficiency and eliminate the problem of heat accumulation.

[0025] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To make the above and other objects, features, advantages and embodiments of the present invention more apparent, the accompanying drawings are described as follows:

[0027] Figure 1 A top view of a testing device according to an embodiment of the present invention;

[0028] Figure 2 for Figure 1 A cross-sectional view of the test equipment along line segment AA;

[0029] Figure 3 for Figure 2 Electronic block diagram of the test equipment;

[0030] Figures 4A to 4C A partial schematic diagram of a fluid transfer group according to various embodiments of the present invention;

[0031] Figure 5 This is a diagram illustrating the operation of a component transport device according to an embodiment of the present invention;

[0032] Figure 6 A diagram illustrating the operation of a component transport device according to an embodiment of the present invention; and

[0033] Figure 7 FIG. 1 is a flow chart of a testing method according to an embodiment of the present invention.

[0034]

Explanation of symbols

[0035] 10: Test equipment

[0036] 101: First vacuum device

[0037] 102: First air output device

[0038] 103: Second vacuum device

[0039] 104: Second air output device

[0040] 105:Liquid temperature control device

[0041] 106: Water pump

[0042] 107: Hot air providing device

[0043] 200: Test platform

[0044] 210: Circuit board

[0045] 211: Top

[0046] 220:Test socket

[0047] 221: Groove

[0048] 222:Connection

[0049] 300, 301: Component handling device

[0050] 310: Pick and Place Arm

[0051] 320: First component

[0052] 321: Installation slot

[0053] 322: Second air intake connector

[0054] 330: First air inlet connector

[0055] 340: Second component

[0056] 350: Replaceable adsorption parts

[0057] 360: Vacuum adsorption unit

[0058] 370: Working bottom cover

[0059] 371: Cover

[0060] 372: Elastic airtight ring

[0061] 373: Depression

[0062] 374: Vacuum inner tube

[0063] 375: Vacuum outer tube

[0064] 380: Liquid storage space

[0065] 400, 401, 402, 403: Fluid transfer group

[0066] 410: First delivery line

[0067] 410A, 410B: long axis direction

[0068] 411: First delivery pipeline

[0069] 412A, 412B: First delivery pipeline

[0070] 413A, 413B: First delivery pipeline

[0071] 414A, 414B: Flow guide

[0072] 420: Second delivery line

[0073] 430: The third delivery line

[0074] 500: Temperature sensor

[0075] 600: Control unit

[0076] 701~708: Steps

[0077] 800, 801: Object under test

[0078] 810:Substrate

[0079] 820: Solder ball

[0080] 830: Strengthening Department

[0081] 840:Bare chip department

[0082] 850: Bare crystal unit

[0083] 860:Mask cover

[0084] AA: Line segment

[0085] X, Y, Z: axial DETAILED DESCRIPTION

[0086] The following drawings illustrate various embodiments of the present invention. For clarity, many practical details are included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, these practical details are not essential to the various embodiments of the present invention. Furthermore, to simplify the drawings, some well-known and conventional structures and components are depicted in simplified schematic form.

[0087] Figure 1 FIG. 1 is a top view of a testing device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 A cross-sectional view of the test device 10 along line segment AA. Figure 3 for Figure 2 The electronic block diagram of the test device 10 is shown in FIG. Figures 1 to 3 As shown, the testing apparatus 10 includes a first vacuuming device 101, a first air output device 102, a liquid temperature control device 105, a test carrier 200, a component handling device 300, a temperature sensor 500, and a control unit 600. The first vacuuming device 101, the first air output device 102, and the liquid temperature control device 105 are located near the test carrier 200. The component handling device 300 is capable of picking up and transporting a DUT 800 (e.g., a semiconductor component) to the test carrier 200 for electrical testing. The temperature sensor 500, which is not limited to being located on the component handling device 300, is used to sense the current temperature of the DUT 800. The control unit 600 is electrically connected to the first vacuuming device 101, the first air output device 102, the liquid temperature control device 105, the temperature sensor 500, and the component handling device 300, and the control unit 600 controls the first vacuuming device 101, the first air output device 102, the liquid temperature control device 105, the temperature sensor 500, and the component handling device 300 to operate accordingly. The test carrier 200 includes a circuit board 210 and a test socket 220. The test socket 220 is located on a top surface 211 of the circuit board 210. A recess 221 is formed on a side of the test socket 220 facing the circuit board 210. A connection portion 222 for connecting to the circuit board 210 is installed in the recess 221. The component handling device 300 can move relative to the test carrier 200 to move above the recess 221 of the test socket 220, or to move away from the recess 221 of the test socket 220.

[0088] The component handling device 300 includes a pick-and-place arm 310, a vacuum unit 360, a working bottom cover 370, and a fluid transfer assembly 400. The vacuum unit 360 is connected to the pick-and-place arm 310, the first vacuum pump 101, and the first air output device 102, allowing one end of the vacuum unit 360 to be removably attached to the top surface of the object under test 800, thereby stably grasping and transporting the object under test 800. More specifically, the first vacuum pump 101 generates negative pressure within the vacuum unit 360, allowing one end of the vacuum unit 360 to be removably attached to the top surface of the object under test 800. Conversely, the first air output device 102 releases the negative pressure within the vacuum unit 360, removing the end of the vacuum unit 360 from the top surface of the object under test 800. The working bottom cover 370 covers the top surface of the object under test 800, temporarily forming a liquid storage space 380 capable of containing the working fluid. The fluid transmission assembly 400 is connected to the liquid temperature control device 105 and extends into the liquid containing space 380 .

[0089] Therefore, when the object under test 800 is undergoing electrical testing, the liquid temperature control device 105 continuously injects a working liquid (e.g., deionized water, shown as a solid arrow) into the liquid holding space 380 via the fluid transfer assembly 400. After the working liquid reaches the top surface of the object under test 800, it exchanges heat with the object under test 800. The liquid temperature control device 105 then continuously withdraws the working liquid via the fluid transfer assembly 400 (see the dotted arrow), thereby controlling the temperature of the object under test 800 to within a desired range.

[0090] Thus, through the above structure, the present invention uses liquid to directly exchange heat with the test element, omitting layers of thermal resistance to improve heat dissipation efficiency and eliminate the problem of heat accumulation.

[0091] More specifically, the vacuum adsorption unit 360 is, for example, in the form of a square ring and is located on the axial X and Y planes, and the vacuum adsorption unit 360 surrounds the working bottom cover 370 and the fluid transfer group 400. However, the present invention is not limited to the shape of the vacuum adsorption unit 360. The working bottom cover 370 includes a cover body 371 and an elastic airtight ring 372. The cover body 371 is, for example, in the form of a square ring and surrounds the fluid transfer group 400. However, the present invention is not limited to the shape of the cover body 371. One end of the cover body 371 is connected to the pick-and-place arm 310, and the other end has a recessed groove 373. The elastic airtight ring 372 is fixedly disposed at the other end of the working bottom cover 370 and surrounds the recessed groove 373. Lid 371 is removably placed on top of object 800 and airtightly covers the top of object 800 via elastic airtight ring 372. The recessed groove 373 and the top of object 800 define the aforementioned liquid-holding space 380. Fluid transfer assembly 400 is connected to liquid temperature control device 105 and is partially located within liquid-holding space 380.

[0092] It should be understood that since the elastic airtight ring 372 is tightly pressed against the top surface of the object under test 800 , the working liquid does not leak out from between the elastic airtight ring 372 and the object under test 800 , and can be directly splashed onto the top surface of the object under test 800 .

[0093] In this embodiment, the testing apparatus 10 further includes a second vacuum pumping device 103 and a second air output device 104. The second vacuum pumping device 103 and the second air output device 104 are located near the test carrier 200. The working bottom cover 370 includes an inner vacuum pumping tube 374 and an outer vacuum pumping tube 375, which are independent of each other. The inner vacuum pumping tube 374 is formed in the cover body 371 and surrounds the fluid transfer group 400. One end of the inner vacuum pumping tube 374 is connected to the second vacuum pumping device 103, and the other end thereof passes through the elastic airtight ring 372 for removably adsorbing to the top surface of the object to be tested 800. The outer vacuum pumping tube 375 is formed in the cover body 371, surrounds the inner vacuum pumping tube 374 and the fluid transfer group 400, and the other end thereof passes through the elastic airtight ring 372 for removably adsorbing to the top surface of the object to be tested 800. However, the present invention may also omit the process of vacuum-absorbing the top surface of the object to be tested 800 through the working bottom cover 370 , or the working bottom cover 370 is not limited to having only the vacuum inner tube 374 or the vacuum outer tube 375 .

[0094] More specifically, the second vacuuming device 103 generates negative pressure in the inner vacuum tube 374 and the outer vacuum tube 375 , respectively, so that the elastic airtight ring 372 of the working bottom cover 370 can be removably attached to the top surface of the object under test 800 . Conversely, the second air output device 104 releases the negative pressure in the inner vacuum tube 374 and the outer vacuum tube 375 , respectively, so that the inner vacuum tube 374 and the outer vacuum tube 375 are no longer attached to the top surface of the object under test 800 .

[0095] In this way, in addition to being attached to the top surface of the object under test 800 via the vacuum adsorption unit 360 , the working bottom cover 370 of the component handling device 300 can also be attached to the top surface of the object under test 800 via the vacuum inner tube 374 and the vacuum outer tube 375 , thereby greatly improving the gripping ability of the object under test 800 and reducing the chance of the object under test 800 falling off the component handling device 300 .

[0096] For example, the top surface 211 of the circuit board 210 has a normal direction (referenced to the axis Z). The fluid transfer assembly 400 includes a first delivery line 410 and two second delivery lines 420. The first delivery line 410 is located between the second delivery lines 420, and the long axis of the first delivery line 410 (e.g., the axis Z) is parallel to the normal direction (e.g., the axis Z) of the top surface 211 of the circuit board 210. However, the present invention is not limited to the number and position of the first delivery line 410 and the second delivery line 420.

[0097] Furthermore, one end of the first delivery line 410 extends out of the working bottom cover 370 and connects to a connection port (not shown) of the liquid temperature control device 105. The other end of the first delivery line 410 is open-ended and located within the recessed groove 373, maintaining a distance from the top surface of the object under test 800. Each second delivery line 420 extends out of the working bottom cover 370 and connects to another connection port (not shown) of the liquid temperature control device 105. The other end of the second delivery line 420 is open-ended and located within the recessed groove 373, maintaining a distance from the top surface of the object under test 800. In this manner, the working liquid directly contacts the surface of the object under test 800 (see solid arrows), absorbing heat energy. The working liquid then flows to the second delivery lines 420 on either side of the first delivery line 410. The absorbed heat energy can then be transferred back to the liquid temperature control device 105 via the second delivery lines 420 (see dashed arrows).

[0098] In addition, if Figure 2 and Figure 3 As shown, the test device 10 also includes a water pump 106. The water pump 106 is electrically connected to the control unit 600, and the control unit 600 controls the water pump 106 to work accordingly. The fluid transmission group 400 also includes at least one third delivery pipeline 430. One end of the third delivery pipeline 430 extends out of the working bottom cover 370 and is connected to a connection port (not shown) of the water pump 106. The other end of the third delivery pipeline 430 is an end opening, located in the recessed groove 373, and maintaining a distance from the top surface of the object to be tested 800. However, the present invention is not limited to the number of third delivery pipelines 430. Furthermore, the third delivery pipeline 430 is close to the inner wall of the cover body 371 and is located between the cover body 371 and the second delivery pipeline 420 to receive the remaining working liquid (see the dotted arrow).

[0099] Thus, after the electrical testing of the object under test 800 is completed and the liquid temperature control device 105 withdraws the working liquid, the water pump 106 pumps out the remaining working liquid (see the dotted arrow) in the liquid holding space 380 through the third delivery line 430. However, the present invention can also omit the process of pumping out the remaining working liquid.

[0100] In addition, the testing device 10 further includes a hot air supply device 107. The hot air supply device 107 is connected to the first delivery line 410 and the second delivery line 420 respectively, and is electrically connected to the control unit 600, so that the control unit 600 controls the hot air supply device 107 to work accordingly. In this way, when the electrical testing of the object to be tested 800 is completed and the working liquid (see the dotted arrow) is withdrawn, the hot air supply device 107 begins to continuously inject dry air (such as hot air) into the liquid holding space 380 through the first delivery line 410, and to withdraw dry air (such as hot air) from the liquid holding space 380 through the second delivery line 420 to dry the top surface of the object to be tested 800 and reduce the potential risks caused by moisture. However, the present invention can also omit the process of drying the top surface of the object to be tested 800.

[0101] For example, the object under test 800 is a semiconductor device. The semiconductor device includes a substrate 810, a solder ball 820, and a bare die portion 840, wherein the bare die portion 840 is partially located on one side of the substrate 810. This side of the substrate 810 also has a stiffener 830. The solder ball 820 is located on the other side of the substrate 810 for connecting to the aforementioned connecting portion 222. The vacuum adsorption unit 360 is used to adsorb to the stiffener 830 on this side of the substrate 810. The elastic airtight ring 372 of the working bottom cover 370 airtightly covers the side of the bare die portion 840 facing away from the substrate 810. In this embodiment, a long axis direction (such as the axial direction Z) of the first conveying pipeline 410 points straightly to the center position of the bare die portion 840.

[0102] In this way, since the bare die portion 840 of the semiconductor element will emit higher heat energy than the substrate 810 when undergoing electrical testing, when the liquid temperature control device 105 continuously injects the working liquid into the liquid holding space 380 through the first delivery line 410, the working liquid directly contacts the surface of the bare die portion 840 (see the solid arrow), which can immediately cool down the bare die portion 840, thereby controlling the expected temperature of the semiconductor element.

[0103] However, in other embodiments of the present invention, the liquid temperature control device 105 may also continuously inject high-temperature working liquid into the liquid containing space 380 to increase the expected temperature of the object to be tested 800 .

[0104] Figures 4A to 4CFIG. 4 is a partial schematic diagram of a fluid transfer group 401 according to various embodiments of the present invention. Figure 4A As shown, the fluid transmission group 401 of this embodiment is Figure 2 The fluid transfer assembly 400 is substantially similar to the fluid transfer assembly 400 of the TS-1000. However, the difference between the two is that the first delivery line 411 is curved to change the flow direction of the working fluid (see the solid curved arrow), thereby reducing the flow rate of the working fluid. Furthermore, the first delivery line 411 is not straight, thus changing the flow direction of the working fluid delivered from the first delivery line 411, preventing the working fluid from vertically impacting the object under test 800.

[0105] like Figure 4B As shown, the fluid transmission group 402 of this embodiment is Figure 2 The fluid transfer assembly 400 is substantially similar to the fluid transfer assembly 400, however, the difference between the two is that the first delivery lines 412A and 412B are multiple straight lines arranged at an angle. These first delivery lines 412A and 412B surround the second delivery line 420, and the long axis direction (e.g., the axial direction Z) of the second delivery line 420 is parallel to the normal direction (e.g., the axial direction Z) of the top surface 211 of the circuit board 210. The first delivery lines 412B on the left side of the second delivery line 420 are parallel to each other, and the long axis direction 410B of each first delivery line 412B on this left side intersects the long axis direction (e.g., the axial direction Z) of the second delivery line 420. The first delivery lines 412A on the right side of the second delivery line 420 are parallel to each other, and the long axis direction 410A of each first delivery line 412A on this right side intersects the long axis direction (e.g., the axial direction Z) of the second delivery line 420. In this way, by the inclined configuration of the first delivery lines 412A and 412B, the first delivery lines 412A and 412B can reduce the flow rate of the working liquid, thereby reducing the impact on the top surface of the object to be measured 800.

[0106] like Figure 4C As shown, the fluid transmission group 403 of this embodiment is Figure 4BThe fluid transfer assembly 400 is substantially similar to the first and second delivery lines 413A and 413B, however, the difference between the two is that each first delivery line 413A and 413B further has a flow guide 414A and 414B at one end. The flow guide 414A and 414B are used to change the flow direction of the working liquid reaching the top surface of the test object 800. For example, the flow guide 414A is a tube arranged obliquely at the end of the first delivery line 413A. The flow guides 414B on the left side of the second delivery line 420 are parallel to each other, and the flow guides 414A on the right side of the second delivery line 420 are parallel to each other. The long axis directions 410A and 410B of the flow guides 414A and 414B on both sides of the second delivery line 420 intersect with the long axis direction (e.g., the axial direction Z) of the second delivery line 420. In this way, by guiding the flow direction guides 414A and 414B, the first delivery lines 413A and 413B can reduce the flow rate of the working liquid, thereby reducing the impact on the top surface of the object to be measured 800.

[0107] Figure 5 FIG. 3 is a diagram showing the operation of a component transport device 301 according to an embodiment of the present invention. Figure 5 As shown, in this embodiment, the pick-and-place arm 310 includes a first component 320 and a second component 340. The first component 320 has a mounting slot 321. One side of the second component 340 is fixedly connected to the aforementioned vacuum adsorption unit 360, working bottom cover 370, and fluid transfer assembly 400, forming a replaceable adsorption member 350. The replaceable adsorption member 350 is designed to be removably mounted in the mounting slot 321.

[0108] Therefore, through the use of air inlet connectors, the vacuum adsorption unit 360, the working bottom cover 370, and the fluid transfer assembly 400 are each connected to the second air inlet connector 322 within the mounting slot 321 via the first air inlet connector 330, thereby quickly connecting the first vacuum pump 101, the second vacuum pump 103, the liquid temperature control device 105, the water pump 106, and the hot air supply device 107. In this way, to accommodate the different sizes of the DUT 800, the component handling device 300 can be equipped with vacuum adsorption units 360, working bottom covers 370, and fluid transfer assemblies 400 of specific sizes at appropriate locations, allowing the replaceable adsorption member 350 to be quickly replaced from the first component 320.

[0109] It should be understood that the first delivery pipeline 410 and the second delivery pipeline 420 described in the present invention may be physical pipelines or fluid channels separated by partitions.

[0110] Figure 6 FIG. 1 is a diagram showing the operation of a component transport device 300 according to an embodiment of the present invention. Figure 6As shown, in another embodiment, the object under test 801 is a semiconductor device. The semiconductor device includes a substrate 810, a die unit 850, and a mask cover 860. The die unit 850 is partially located on one side of the substrate 810. The mask cover 860 covers the substrate 810 and the die unit 850. In other words, the die unit 850 is located between the substrate 810 and the mask cover 860 and is thermally connected to the mask cover 860. Therefore, when the component handling device 300 picks up the object under test 801, the vacuum adsorption unit 360 is adsorbed onto one side of the substrate 810, and the elastic airtight ring 372 of the working bottom cover 370 airtightly covers the side of the mask cover 860 facing away from the substrate 810. The long axis of the first conveying pipeline 410 is directed straight toward the center of the die unit 850.

[0111] Thus, when the semiconductor device undergoes electrical testing, the die unit 850 generates higher heat energy than the substrate 810, which is quickly directed to the mask cover 860. Therefore, when the liquid temperature control device 105 continuously injects working liquid into the liquid holding space 380 through the first delivery line 410, the working liquid directly contacts the surface of the mask cover 860, immediately cooling the die unit 850 and thereby controlling the desired temperature of the semiconductor device.

[0112] Figure 7 FIG. 1 is a flow chart of a testing method according to an embodiment of the present invention. Figure 7 As shown, the testing method of this embodiment includes multiple steps as follows. In step 701, a component handling device is vacuum-adsorbed onto a top surface of a DUT. In step 702, the component handling device is airtightly placed over the top surface of the DUT, defining a liquid-containing space between the component handling device and the top surface of the DUT. In step 703, the DUT is transferred to a test platform, and then steps 704 and 705 are performed simultaneously. In step 704, a working liquid is injected into the liquid-containing space, allowing heat exchange between the working liquid and the top surface of the DUT. The working liquid in the liquid-containing space is then withdrawn to complete a heat exchange cycle, and then step 706 is performed. In step 705, an electrical test is performed on the DUT, and then step 708 is performed. In step 706, it is determined whether the temperature of the DUT during the test meets a predetermined standard. If so, step 707 is performed; otherwise, the process returns to step 704. This means that the testing method can remove heat energy generated by the DUT during the test through multiple heat exchange cycles. In step 707 , the test object in the liquid holding space is dried, and then step 708 is performed; and in step 708 , the test object is moved from the test carrier to a collection area.

[0113] In this embodiment, step 701 and step 702 can be completed simultaneously. More specifically, as shown in FIG. Figure 2As shown, the vacuum adsorption unit 360 and the working bottom cover 370 are simultaneously vacuum adsorbed onto the top surface of the object to be tested 800. However, the present invention is not limited thereto, and in other embodiments, step 702 is not limited to being completed before step 701.

[0114] In this embodiment, step 707 further includes the following detailed steps: The remaining working liquid in the liquid holding space is completely pumped out, and then dry air is injected into the liquid holding space to dry the top surface of the object to be tested, and then the dry air is pumped out of the liquid holding space.

[0115] In this embodiment, after step 708, a number of detailed steps are included as follows. Figure 2 As shown, the negative pressure in the vacuum inner tube 374 and the vacuum outer tube 375 of the working bottom cover 370 is released, so that the working bottom cover 370 is separated from the top surface of the object to be tested 800; then, the negative pressure in the vacuum adsorption unit 360 of the component transporting device 300 is released, so that the vacuum adsorption unit 360 is separated from the top surface of the object to be tested 800.

[0116] The heat exchange described above refers to the working fluid directly contacting the object to be measured, so that heat energy can be effectively transferred to the object to be measured or the working fluid to achieve the purpose of adjusting the temperature of the object to be measured.

[0117] Finally, the embodiments disclosed above are not intended to limit the present invention. Any skilled artisan may make various modifications and alterations without departing from the spirit and scope of the present invention, and all such modifications and alterations would be protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. A testing device, characterized in that: Include: a first vacuuming device; a second vacuuming device; a liquid temperature control device; a test platform; as well as A component transport device is used to pick up and transport a test object to the test platform, and the component transport device includes: One takes and puts the arm; a vacuum adsorption unit connected to the pick-and-place arm and the first vacuum pumping device for removably adsorbing onto the object to be tested; a working bottom cover, comprising a cover body, a vacuum inner tube, and an elastic airtight ring; one end of the cover body is connected to the pick-and-place arm, and the other end has a recessed groove; the elastic airtight ring is fixedly disposed on the other end of the cover body and surrounds the recessed groove to airtightly cover a top surface of the object to be tested, such that the recessed groove and the top surface of the object to be tested jointly define a liquid-containing space; the vacuum inner tube is formed in the cover body, and one end of the vacuum inner tube is connected to the second vacuum device, and the other end thereof passes through the elastic airtight ring to be removably attached to the top surface of the object to be tested; and A fluid transmission group is located on the working bottom cover, connected to the liquid temperature control device, surrounded by the vacuum inner tube, and partially extends into the liquid holding space. The liquid temperature control device continuously injects a working liquid onto the top surface of the object to be tested through the fluid transmission group, so that the working liquid and the object to be tested perform heat exchange, and then withdraws the working liquid through the fluid transmission group.

2. The testing device according to claim 1, characterized in that The working bottom cover further includes a vacuum outer tube formed in the cover body. One end of the vacuum outer tube is connected to the second vacuum device, and the other end thereof passes through the elastic airtight ring for removably adsorbing to the top surface of the object to be tested. The vacuum outer tube surrounds the vacuum inner tube and the fluid transfer group.

3. The testing device according to claim 1, wherein: The fluid transmission group includes at least one first delivery pipeline and at least one second delivery pipeline. One end of the first delivery pipeline is located in the recessed tank, and the other end is connected to the liquid temperature control device to guide the working liquid into the liquid holding space. One end of the second delivery pipeline is located in the recessed tank, and the other end is connected to the liquid temperature control device to guide the working liquid out of the liquid holding space.

4. The testing device according to claim 3, characterized in that When there are multiple at least one second delivery pipelines, the first delivery pipeline is located between the second delivery pipelines.

5. The testing device according to claim 3, characterized in that The fluid transmission assembly further comprises a water pump, and the fluid transmission assembly further comprises at least one third delivery pipeline, one end of the third delivery pipeline is located in the recessed groove, and the other end is connected to the water pump. After the liquid temperature control device draws back the working liquid, the water pump draws out the remaining working liquid through the third delivery pipeline.

6. The testing device according to claim 3, characterized in that It also includes a hot air supply device, which is connected to the first conveying pipeline and the second conveying pipeline. The hot air providing device continuously injects dry air into the liquid containing space through the first conveying pipeline, and draws the dry air out of the liquid containing space through the second conveying pipeline.

7. The testing device according to claim 3, characterized in that The long axis direction of the first conveying pipeline vertically passes through the top surface of the object to be tested.

8. The testing device according to claim 3, characterized in that The first delivery pipeline is curved to reduce the flow rate of the working liquid.

9. The testing device according to claim 3, characterized in that One end of the first delivery pipeline further has a flow direction guide portion, and the flow direction guide portion is used to change the flow direction of the working liquid reaching the top surface of the object to be tested.

10. The testing device according to claim 3, characterized in that The object to be tested is a semiconductor device, which includes a substrate and a bare die portion, wherein the bare die portion is located on the substrate. The vacuum adsorption unit is adsorbed onto one side of the substrate, the elastic airtight ring airtightly covers the side of the bare die facing away from the substrate, and a long axis of the first conveying pipeline passes through the center of the bare die.

11. The testing device according to claim 3, characterized in that The object to be tested is a semiconductor device, which includes a substrate, a bare die unit and a mask cover. The bare die unit is located between the substrate and the mask cover and is thermally connected to the mask cover. The vacuum adsorption unit is adsorbed onto one side of the substrate, the elastic airtight ring airtightly covers the side of the mask cover facing away from the substrate, and a long axis of the first conveying pipeline passes through the center of the bare crystal unit.

12. A component transport device, characterized in that: Include: One takes and puts the arm; a vacuum adsorption unit connected to the pick-and-place arm for removably adsorbing onto an object to be tested; A working bottom cover, comprising a cover body, a vacuum inner tube, and an elastic airtight ring. One end of the cover body is connected to the pick-and-place arm, and the other end has a recessed groove. The elastic airtight ring is fixedly disposed on the other end of the cover body and surrounds the recessed groove. The vacuum inner tube is formed in the cover body. One end of the vacuum inner tube passes through the elastic airtight ring for removably adsorbing to the top surface of the object to be tested; and A fluid transmission group is surrounded by the vacuum inner tube, and the fluid transmission group includes a plurality of transmission pipelines, each of which extends into the recessed groove and is used to connect to a liquid temperature control device. When the elastic airtight ring airtightly covers a top surface of the object to be tested, a liquid containing space connected to the plurality of delivery pipelines is defined between the recessed groove and the top surface of the object to be tested.

13. The component transport device according to claim 12, wherein: The working bottom cover also includes: a vacuum inner tube formed in the cover body and surrounding the fluid transmission group, one end of the vacuum inner tube passing through the elastic airtight ring for being removably adsorbed to the top surface of the object to be tested; and An outer vacuum tube is formed in the cover body and surrounds the inner vacuum tube and the fluid transmission group. One end of the outer vacuum tube passes through the elastic airtight ring so as to be removably adsorbed to the top surface of the object to be tested.

14. The component transporting device according to claim 12, wherein: One of the plurality of conveying pipelines is curved.

15. The component transporting device according to claim 12, wherein: One of the plurality of conveying pipelines further has a flow guide portion.

16. A testing method, characterized in that: Include: (a) vacuum adsorption onto a top surface of an object to be tested by a component handling device; (b) air-tightly covering the top surface of the object to be tested with the component transporting device so that a liquid-containing space is jointly defined between the component transporting device and the top surface of the object to be tested, wherein (b) air-tightly covering the top surface of the object to be tested with an elastic airtight ring of the component transporting device, and a vacuum inner tube passing through the elastic airtight ring is removably adsorbed to the top surface of the object to be tested; (c) transporting the object to be tested to a test platform; (d) injecting a working liquid into the liquid containing space so that the working liquid exchanges heat with the top surface of the object to be measured, and extracting the working liquid from the liquid containing space; (e) performing electrical testing on the object to be tested and returning to step (d) when it is determined that the temperature of the object to be tested does not meet a preset standard; (f) drying the object to be tested in the liquid containing space after completing the test of the object to be tested; and (g) moving the test object from the test platform to a collection area.

17. The testing method according to claim 16, characterized in that: Wherein (a) and (b) are completed simultaneously.

18. The testing method according to claim 16, characterized in that: Wherein said (f) further comprises: draining the working liquid remaining in the liquid containing space; and Dry air is injected into the liquid containing space to dry the top surface of the object to be tested, and the dry air is extracted from the liquid containing space.

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