A MLPC substrate type electroplated terminal structure capacitor

Abstract

The present invention relates to an MLPC (Multi-layer PC) substrate-type capacitor with electroplated terminal structure, comprising: a housing, a core, and electroplated terminals. The core is disposed within the housing cavity; the housing is formed by joining a first packaging plate and a second packaging plate; the electroplated terminals are formed by electroplating and coated on both sides of the housing to form anode and cathode electrodes extending from the core; the first packaging plate is composed of a substrate, a pole piece, and a metal plate; the inner surface of the first packaging plate is inlaid with two separate metal plates, and the outer surface is inlaid with pole pieces at both ends; the ends of the anode and cathode regions are respectively connected to conductive adhesive; the conductive adhesive is electrically connected to the electroplated terminals; the electroplated terminals are coated on both ends of the housing and sealed to form a single body. The use of electroplating to form the electrode terminal structure as the lead-out electrode overcomes the limitations of traditional bent terminals, achieving lightweight and thinness while reducing product impedance. Furthermore, the negative electrode design area of ​​the electrode sheet can be maximized, thereby increasing the product's capacitance and service life.

Description

Technical Field

[0001] The present invention belongs to the technical field of capacitors, and in particular to an MLPC substrate type electroplated terminal structure capacitor. Background Art

[0002] Capacitors are one of the most widely used electronic components in electronic devices and are an essential component of circuits. Advances in electronic science and technology are driving the development of electronic products towards higher frequencies, miniaturization, and higher reliability. MLPC conductive polymer multilayer capacitors depart from the traditional wound structure and employ parallel electrode connections, embodying the ideal electrical properties of low resistance and high capacitance. MLPC conductive polymer multilayer capacitors are primarily used in consumer electronics. With the global trend toward thinner electronic components, the height of capacitors is also expected to increase. Traditional capacitors, which use bent leadframes as terminals, are also limited, significantly compressing the bending space. This bent leadframe terminal structure is a constraint on the trend toward thinner electronic components. The bent leadframe occupies a considerable amount of space, increasing the thickness of the capacitor and preventing mass production of thin capacitors. Summary of the Invention

[0003] The present invention aims to overcome the shortcomings of the prior art and provide an MLPC substrate-type electroplated terminal structure capacitor. Electroplating is used to form an electrode terminal structure as a lead-out electrode, solving the limitations of traditional bent terminals. This achieves lightweight and thinness while reducing product impedance. In addition, the negative electrode design area of ​​the electrode sheet can be maximized, thereby increasing the product's capacitance and service life.

[0004] The present invention solves the technical problem by adopting the following technical solutions:

[0005] A MLPC (Multi-layer PC-type capacitor with electroplated terminal structure) comprising: a housing, a core, and electroplated terminals; characterized in that: the core is disposed in the housing cavity; the housing is formed by joining a first encapsulation plate and a second encapsulation plate; an encapsulation curing adhesive is filled between the housing cavity wall and the outer surface of the core, so that the core is sealed and fixed in the housing cavity; the electroplated terminals are formed by electroplating and coated on both sides of the housing to form an anode electrode 301 and a cathode electrode extending from the core; the first encapsulation plate is provided on the first and second surfaces of the core, respectively, and the second encapsulation plate is provided on the third surfaces of both sides; the first encapsulation plate is composed of a substrate, an electrode, and a metal plate; the inner surface of the first encapsulation plate is inlaid with two separate metal plates, and the outer surface is inlaid with electrode plates at both ends; the core is divided into an anode region and a cathode region by an insulating isolation layer; the ends of the anode region and the cathode region away from the insulating isolation layer are respectively connected to conductive adhesive; the conductive adhesive is electrically connected to the electroplated terminals; the electroplated terminals are coated on both ends of the housing and sealed to form a single body with the housing.

[0006] Furthermore, there are two first packaging boards which are symmetrically arranged opposite to each other, and the second packaging board is vertically joined between the two opposite first packaging boards to form a rectangular shell.

[0007] Furthermore, the anode area and the cathode area on the first surface of the core are respectively provided with conductive paste and are respectively electrically connected to the metal plates at both ends of the inner side of the first packaging plate.

[0008] Furthermore, the core is composed of a plurality of stacked single pieces, and the first surface, second surface and third surface of the core are respectively poured with encapsulation curing glue so that the core and the shell are sealed and integrated.

[0009] Furthermore, the entire structure of the electroplating terminal is formed through an electroplating process, and the formed electroplating terminal is electrically connected to the pole pieces at both ends of the first packaging board, the metal plate inside the first packaging board, and the conductive glue at both ends of the core, respectively serving as the anode electrode and cathode electrode led out of the core.

[0010] The advantages and positive effects of the present invention are:

[0011] 1. The present invention discloses an MLPC substrate-type electroplated terminal structure capacitor, which solves the limitations of traditional bent terminals, achieves lightweight and thinness, and reduces product impedance. In addition, the negative electrode design area of ​​the electrode sheet can be maximized, thereby increasing the product capacitance.

[0012] 2. By applying conductive glue to the ends of the anode and cathode areas, the anode and cathode areas of the core are directly connected to the electroplating terminals. On the other hand, the anode and cathode areas are electrically connected to the metal plates at both ends of the inner side of the first packaging board through conductive paste, which increases the lead-out conductive area, provides better electrical lead-out, and reduces product impedance.

[0013] 3. Two separate metal plates are embedded on the inner surface of the first packaging plate of the shell. On the one hand, they can electrically lead out the two poles of the inner core. On the other hand, the metal plates combined with the packaging curing glue can shield the core from moisture, thereby increasing the service life of the product.

[0014] 4. The inner surface of the first packaging board is inlaid with two separate metal plates, and the metal plates are connected to the core, which can lead the heat generated by the core to the outside, thereby improving the heat dissipation performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the cross-sectional structure of the present invention.

[0016] Figure 2 It is a partial cross-sectional structural schematic diagram of the present invention.

[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the core of the present invention.

[0019] Figure 5 It is a schematic diagram of the three-dimensional structure of the core and the cured adhesive of the present invention.

[0020] Figure 6 It is a schematic diagram of the integrated three-dimensional structure of the second packaging plate and the core of the present invention.

[0021] Figure 7 It is a schematic diagram of the cross-sectional structure of the first packaging board of the present invention.

[0022] Figure 8 It is a schematic diagram of the three-dimensional structure of the first packaging board of the present invention.

[0023] Figure 9 It is a schematic diagram of the three-dimensional structure of the second packaging board of the present invention.

[0024] Figure 10 This is a cross-sectional view of a conventional capacitor in the prior art that uses a bent lead frame structure as a terminal.

[0025] Explanation of the accompanying drawings: 1. First packaging board; 2. Second packaging board; 3. Electroplating terminal; 4. Core; 5. Conductive adhesive; 6. Conductive paste; 7. Packaging curing adhesive; 101. Substrate; 102. Pole piece; 103. Metal plate; 301. Anode electrode; 302. Cathode electrode; 401. Insulating isolation layer; 402. Anode region; 403. Cathode region; 404. First surface; 405. Second surface; 406. Third surface. DETAILED DESCRIPTION

[0026] The embodiments of the present invention are further described in detail with reference to the accompanying drawings: The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be understood that the terms "both sides," "upper," "lower," "top," "bottom," "inside," "outside," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate description and simplify the present invention. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more. Furthermore, the term "including" and any variations thereof mean "at least including."

[0028] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used to distinguish and do not refer to a sequence.

[0029] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integrally formed connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0030] The embodiments of the present invention are further described in detail with reference to the accompanying drawings: The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0031] like Figures 1-9As shown, an MLPC substrate-type electroplated terminal structure capacitor includes: a shell, a core 4, and an electroplated terminal 3; the characteristics are: the core 4 is arranged in the inner cavity of the shell; the shell is composed of a first packaging plate 1 and a second packaging plate 2; the space between the inner cavity wall of the shell and the outer surface of the core 4 is filled with an encapsulation curing glue 7 so that the core 4 is sealed and fixed in the inner cavity of the shell; the electroplated terminal 3 is formed by electroplating and coated on both sides of the shell to form an anode electrode 301 and a cathode electrode 302 led out of the core 4; the first surface 404 and the second surface 405 of the core 4 are respectively provided with the first packaging plate 1, and the third electrodes on both sides are respectively provided with the first packaging plate 1. A second packaging plate 2 is provided on the surface 406; the first packaging plate 1 is composed of a substrate 101, a pole piece 102, and a metal plate 103; the inner surface of the first packaging plate 1 is inlaid with two metal plates 103 separated from each other, and the outer surface is inlaid with pole pieces 102 at both ends; the core 4 is divided into an anode area 402 and a cathode area 403 by an insulating isolation layer 401; the end portions of the anode area 402 and the cathode area 403 away from the insulating isolation layer 401 are respectively connected with conductive glue 5; the conductive glue 5 is respectively electrically connected to the electroplating terminals 3; the electroplating terminals 3 are coated on the two ends of the shell and sealed with the shell to form a whole.

[0032] like Figure 1-9 As shown, an MLPC substrate-type electroplated terminal structure capacitor consists of a housing, a core 4, and electroplated terminals 3. The housing is formed by joining a first packaging plate 1 and a second packaging plate 2. The space between the housing inner cavity wall and the outer surface of the core 4 is filled with encapsulating curing adhesive 7, sealing the core 4 in the housing inner cavity. The electroplated terminals 3 are formed by electroplating and coated on both sides of the housing to form the anode electrode 301 and cathode electrode 302 extending from the core 4.

[0033] like Figure 10 As shown, conventional capacitors use a bent leadframe structure as terminals. Since the terminals need to be bent after exiting the housing, the bent terminals occupy a certain amount of space, thus limiting the thinning and lightweighting of capacitors and preventing further mass production of lighter products.

[0034] The electroplated terminal 3 generated by electroplating is not restricted in spatial structure and can be used in capacitors of different sizes. It can obtain thinner anode electrodes 301 and cathode electrodes 302, solving the problem of limited bending terminals of traditional capacitor electrodes, achieving lightweight and thinness, and reducing product impedance. In addition, the negative electrode design area of ​​the electrode sheet can be maximized, thereby improving product capacitance and service life.

[0035] like Figure 1As shown, the core 4 is disposed within the inner cavity of the shell; the shell is formed by joining a first packaging plate 1 and a second packaging plate 2; the first packaging plate 1 comprises two symmetrically opposed first packaging plates, and the second packaging plate 2 is vertically joined between the two opposing first packaging plates 1 to form a rectangular shell. The entire shell is enclosed by two opposing first packaging plates 1 and two opposing second packaging plates 2, wherein the two first packaging plates 1 and the two second packaging plates 2 are perpendicular to each other, forming a rectangular shell. In another embodiment, the entire shell can be an integrally formed body with a metal plate 103 embedded in the inner cavity. The first packaging plate 1 is composed of a substrate 101, a pole piece 102, and a metal plate 103. The inner surface of the first packaging plate 1 is embedded with two separate metal plates 103, and the outer surface is embedded with pole pieces 102 at both ends. Specifically, the substrate 101 in the first packaging plate 1 is made of insulating material, which acts as a barrier and seal to the outer periphery. The inner surface of the first packaging board 1 is inlaid with two separate metal plates 103. The size of the inlaid metal plates 103 matches that of the substrate 101, and one end of each metal plate 103 is flush with the opposite end of the substrate 101. A certain distance is reserved on the opposing sides of the two metal plates 103 to separate them. The metal plates 103 in the first packaging board 1 structurally provide a shielding and sealing function, preventing external moisture from entering the core 4. This improves the service life of the capacitor. Electrodes 102 are inlaid at both ends of the outer surface of the first packaging board 1: one for the anode and one for the cathode. During electroplating, a coating forms on the surfaces of the inlaid electrodes 102 at both ends of the outer surface of the first packaging board 1, encapsulating the electrodes 102. Encapsulating curing adhesive 7 is filled between the inner wall of the housing and the outer surface of the core 4, sealing the core 4 within the housing. The first packaging board 1 is provided on the first and second surfaces 404 and 405 of the core 4, respectively, while the second packaging board 2 is provided on the third surfaces 406 on either side. The encapsulating curing glue 7 bonds the core 4 and the shell together to form a whole, thus achieving the functions of sealing and fixing.

[0036] The anode region 402 and cathode region 403 of the first surface 404 of the core 4 are each coated with a conductive paste 6 and electrically connected to the metal plates 103 at the inner ends of the first packaging board 1. Specifically, a layer of conductive paste 6 is applied to each of the anode region 402 and cathode region 403 of the first surface 404 of the core 4, electrically connecting the anode region 402 and cathode region 403 of the first surface 404 of the core 4 to the metal plates 103 at the inner ends of the first packaging board 1. This serves to electrically direct the electrodes of the core 4. Furthermore, the metal plates 103 exhibit excellent thermal conductivity, conducting heat away from the core 4 and improving heat dissipation.

[0037] The core 4 is divided into an anode region 402 and a cathode region 403 by an insulating isolation layer 401. The ends of the anode region 402 and cathode region 403, away from the insulating isolation layer 401, are each connected to a conductive adhesive 5. The conductive adhesive 5 is electrically connected to the electroplating terminals 3. The electroplating terminals 3 are wrapped around the two ends of the shell and sealed to form a single body. Specifically, the ends of the anode region 402 and cathode region 403 are each provided with conductive adhesive 5 throughout the core 4. The conductive adhesive 5 matches the end cross-sections of the anode region 402 and cathode region 403. The conductive adhesive 5 electrically leads the positive and negative poles of the core 4 to the outside. The electroplating terminals 3 generated after the electroplating process are electrically connected to the conductive adhesive 5, forming the exposed anode electrode 301 and cathode electrode 302, respectively.

[0038] The entire structure of the electroplating terminal 3 is formed by an electroplating process. The formed electroplating terminal 3 is electrically connected to the pole pieces 102 at both ends of the first packaging board 1, the metal plate 103 on the inner side of the first packaging board 1, and the conductive glue 5 at both ends of the core 4, respectively serving as the anode electrode 301 and the cathode electrode 302 led out of the core 4.

[0039] Since electroplating is used to form the electroplated terminals 3 at both ends of the capacitor, the electroplated terminals 3 are connected to the conductive paste 6 at both ends of the pole piece 102, the metal plate 103, and the core 4 after they are formed. In terms of spatial structure, a metal plating layer can be formed that is tightly attached to the conductive paste 6 at both ends of the pole piece 102, the metal plate 103, and the core 4. The formed metal plating layer is not restricted by space. The formed metal plating layer wraps and connects the pole piece 102, the metal plate 103, the core 4, and the conductive adhesive 5 together, respectively serving as the anode electrode 301 and the cathode electrode 302 led out of the core 4. The plating layer is not restricted by the thickness of the capacitor structure, and electroplated terminals 3 can be generated at both ends of the capacitor, solving the problem of limited bent terminals leading out of traditional capacitor electrodes, achieving lightweight and thinness, and reducing product impedance.

[0040] It should be emphasized that the embodiments described in the present invention are illustrative rather than restrictive. Therefore, the present invention is not limited to the embodiments described in the specific implementation methods. Any other implementation methods derived by those skilled in the art based on the technical solutions of the present invention also fall within the scope of protection of the present invention.

Claims

1. A MLPC substrate type electroplated terminal structure capacitor, comprising: A shell, a core (4), and a plating terminal (3); characterized in that: the core (4) is arranged in the inner cavity of the shell; the shell is composed of a first packaging plate (1) and a second packaging plate (2); the space between the inner cavity wall of the shell and the outer surface of the core (4) is filled with a packaging curing glue (7) so that the core (4) is sealed and fixed in the inner cavity of the shell; the plating terminal (3) is formed by electroplating and coated on both sides of the shell to form an anode electrode (301) and a cathode electrode (302) led out of the core (4); the first surface (404) and the second surface (405) of the core (4) are respectively provided with the first packaging plate (1), and the third surface (406) on both sides are respectively provided with the second packaging plate (2); the first packaging board (1) is composed of a substrate (101), a pole piece (102), and a metal plate (103); the inner surface of the first packaging board (1) is inlaid with two metal plates (103) separated from each other, and the two ends of the outer surface are inlaid with pole pieces (102); the core (4) is divided into an anode area (402) and a cathode area (403) by an insulating isolation layer (401); the end portions of the anode area (402) and the cathode area (403) away from the insulating isolation layer (401) are respectively connected with conductive glue (5); the conductive glue (5) is respectively electrically connected to the electroplating terminals (3); the electroplating terminals (3) are covered at the two ends of the shell and sealed with the shell to form a whole.

2. The MLPC substrate-type electroplated terminal structure capacitor according to claim 1, characterized in that: The first packaging plates (1) are in two pieces and are symmetrically arranged opposite to each other. The second packaging plate (2) is vertically joined between the two opposite first packaging plates (1) to form a rectangular shell.

3. The MLPC substrate-type electroplated terminal structure capacitor according to claim 1, characterized in that: The anode region (402) and cathode region (403) of the first surface (404) of the core (4) are respectively provided with conductive paste (6) and are respectively electrically connected to the metal plates (103) at both ends of the inner side of the first packaging plate (1).

4. The MLPC substrate type electroplated terminal structure capacitor according to claim 1, characterized in that: The core (4) is composed of a plurality of stacked monolithic pieces, and the first surface (404), the second surface (405), and the third surface (406) of the core (4) are respectively poured with encapsulation curing glue (7) so that the core (4) and the shell are sealed and integrated.

5. The MLPC substrate type electroplated terminal structure capacitor according to claim 1, characterized in that: The entire structure of the electroplating terminal (3) is formed by an electroplating process. The formed electroplating terminal (3) is electrically connected to the pole pieces (102) at both ends of the first packaging board (1), the metal plate (103) inside the first packaging board (1), and the conductive glue (5) at both ends of the core (4), respectively serving as the anode electrode (301) and the cathode electrode (302) led out of the core (4).

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