Depth camera module and assembly method thereof, shooting component and electronic device

Abstract

The present application discloses a depth camera module and its assembly method, shooting component and electronic device. The depth camera module includes a circuit board, a light source, a sensor, an integrated bracket, a first optical component and a second optical component. The circuit board includes a bottom surface, a first bearing surface and a second bearing surface, and the distance from the first bearing surface to the bottom surface is different from the distance from the second bearing surface to the bottom surface. The light source is mounted on the first bearing surface and electrically connected to the circuit board, and the light source is used to emit light. The sensor is mounted on the circuit board and electrically connected to the circuit board. The sensor is used to receive at least part of the light reflected back by the object and convert it into an electrical signal. The bracket is mounted on the circuit board, and the first optical component and the second optical component on the bracket are arranged on the bracket. The first optical component is arranged corresponding to the light source, and is used to guide the light emitted by the light source to the outside of the depth camera module. The second optical component is arranged corresponding to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

Description

Technical Field

[0001] The present application relates to the field of ranging technology, and more specifically, to a depth camera module, an assembling method of a depth camera module, a shooting component and an electronic device. Background Art

[0002] Time of flight (ToF) technology is a technology that measures the time difference between the transmitted signal and the signal reflected by the object, and uses this time difference to calculate the distance between the object and the sensor. In existing time-of-flight modules, the distance between the optical center of the transmitter and the optical center of the receiver is too large, which is not conducive to the miniaturization of the overall module. Summary of the invention

[0003] Embodiments of the present application provide a depth camera module, an assembling method of a depth camera module, a shooting component, and an electronic device.

[0004] The depth camera module of the present application includes a circuit board, a light source, a sensor, an integrated bracket, a first optical component and a second optical component. The circuit board includes a bottom surface, a first bearing surface and a second bearing surface, and the distance from the first bearing surface to the bottom surface is different from the distance from the second bearing surface to the bottom surface. The light source is carried on the first bearing surface and electrically connected to the circuit board, and the light source is used to emit light. The sensor is mounted on the circuit board and electrically connected to the circuit board, and the sensor is used to receive at least part of the light reflected back by the object and convert it into an electrical signal. The bracket is mounted on the circuit board and forms a receiving cavity with the circuit board, and the receiving cavity is used to accommodate the light source and the sensor. The first optical component and the second optical component are arranged on the bracket, the first optical component is arranged corresponding to the light source, and is used to guide the light emitted by the light source to the outside of the depth camera module, and the second optical component is arranged corresponding to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0005] The electronic device of the present application includes a housing and a depth camera module. The depth camera module is combined with the housing. The depth camera module includes a circuit board, a light source, a sensor, an integrated bracket, a first optical component and a second optical component. The circuit board includes a bottom surface, a first bearing surface and a second bearing surface, and the distance from the first bearing surface to the bottom surface is different from the distance from the second bearing surface to the bottom surface. The light source is carried on the first bearing surface and electrically connected to the circuit board, and the light source is used to emit light. The sensor is mounted on the circuit board and electrically connected to the circuit board, and the sensor is used to receive at least part of the light reflected back by the object and convert it into an electrical signal. The bracket is mounted on the circuit board and forms a receiving cavity with the circuit board, and the receiving cavity is used to accommodate the light source and the sensor. The first optical component and the second optical component are arranged on the bracket, the first optical component is arranged corresponding to the light source, and is used to guide the light emitted by the light source to the outside of the depth camera module, and the second optical component is arranged corresponding to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0006] The shooting assembly of the present application includes a depth camera module and a two-dimensional camera module, and the distance between the center of the sensor of the depth camera module and the center of the two-dimensional camera module is less than a second preset distance. The two-dimensional camera module is used to obtain a two-dimensional image, and the depth camera module is used to obtain a depth information image. The depth camera module includes a circuit board, a light source, a sensor, an integrated bracket, a first optical component and a second optical component. The circuit board includes a bottom surface, a first bearing surface and a second bearing surface, and the distance from the first bearing surface to the bottom surface is different from the distance from the second bearing surface to the bottom surface. The light source is carried on the first bearing surface and is electrically connected to the circuit board, and the light source is used to emit light. The sensor is mounted on the circuit board and is electrically connected to the circuit board. The sensor is used to receive at least part of the light reflected back by the object and convert it into an electrical signal. The bracket is mounted on the circuit board and forms a housing cavity with the circuit board, and the housing cavity is used to accommodate the light source and the sensor. The first optical component and the second optical component are arranged on the bracket, the first optical component is arranged corresponding to the light source, and is used to guide the light emitted by the light source to the outside of the depth camera module, and the second optical component is arranged corresponding to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0007] The electronic device of the present application includes a housing and a shooting component, and the housing is combined with the shooting component. The shooting component includes a depth camera module and a two-dimensional camera module, and the distance between the center of the sensor of the depth camera module and the center of the two-dimensional camera module is less than a second preset distance. The two-dimensional camera module is used to obtain a two-dimensional image, and the depth camera module is used to obtain a depth information image. The depth camera module includes a circuit board, a light source, a sensor, an integrated bracket, a first optical component and a second optical component. The circuit board includes a bottom surface, a first bearing surface and a second bearing surface, and the distance from the first bearing surface to the bottom surface is different from the distance from the second bearing surface to the bottom surface. The light source is carried on the first bearing surface and is electrically connected to the circuit board, and the light source is used to emit light. The sensor is mounted on the circuit board and is electrically connected to the circuit board. The sensor is used to receive at least part of the light reflected back by the object and convert it into an electrical signal. The bracket is mounted on the circuit board and forms a housing cavity with the circuit board, and the housing cavity is used to accommodate the light source and the sensor. The first optical component and the second optical component are arranged on the bracket, the first optical component is arranged corresponding to the light source, and is used to guide the light emitted by the light source to the outside of the depth camera module, and the second optical component is arranged corresponding to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0008] The assembly method of the depth camera module of the present application includes: providing a circuit board, the circuit board includes a bottom surface, a first bearing surface and a second bearing surface, the distance from the first bearing surface to the bottom surface is different from the distance from the second bearing surface to the bottom surface; installing a light source on the first bearing surface and electrically connected to the circuit board, the light source is used to emit light, installing the sensor on the second bearing surface and electrically connected to the circuit board, the sensor is used to receive at least part of the light reflected back by the object and convert it into an electrical signal; fixing a first optical component on an integrated bracket; fixing the bracket on which the first optical component is installed to the circuit board, the bracket and the circuit board form a receiving cavity, the light source and the sensor are accommodated in the receiving cavity, so that the first optical component corresponds to the light source, the first optical component is used to guide the light emitted by the light source to the outside of the depth camera module; and fixing a second optical component on the bracket so that the second optical component corresponds to the sensor, the second optical component is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0009] The assembly method of the depth camera module of the present application includes: providing a circuit board, the circuit board includes a bottom surface, a first bearing surface and a second bearing surface, the distance from the first bearing surface to the bottom surface is different from the distance from the second bearing surface to the bottom surface; installing a light source on the first bearing surface and electrically connected to the circuit board, the light source is used to emit light, installing the sensor on the second bearing surface and electrically connected to the circuit board, the sensor is used to receive at least part of the light reflected back by the object and convert it into an electrical signal; fixing an integrated bracket to the circuit board, the bracket and the circuit board form a receiving cavity, the light source and the sensor are accommodated in the receiving cavity; fixing a first optical component and a second optical component on the bracket so that the first optical component corresponds to the light source, and the second optical component corresponds to the sensor, the first optical component is used to guide the light emitted by the light source to the outside of the depth camera module, and the second optical component is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0010] The depth camera module, assembly method of the depth camera module, shooting component and electronic device of the present application, by installing the sensor and light source in the depth camera module on the same circuit board, and the first optical component and the second optical component are fixedly installed on an integrated bracket, compared with the traditional depth camera module (the transmitting end and the receiving end each have a separate bracket and a separate circuit board), can make the depth camera module structure more compact and can also shorten the baseline distance of the depth camera module. In addition, the depth camera module, assembly method of the depth camera module, shooting component and electronic device of the present application, by carrying the light source on the first bearing surface of the circuit board, and the first bearing surface and the second bearing surface have a certain height difference, can shorten the baseline distance of the depth camera module while leaving more space for the electronic devices that need to be set on the circuit board, thereby shortening the baseline distance of the depth camera module while ensuring the normal operation of the depth camera module.

[0011] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 is a schematic diagram of a three-dimensional structure of a depth camera module in certain embodiments of the present application;

[0014] Figure 2is a schematic diagram of the structure of a depth camera module in some embodiments of the present application;

[0015] Figure 3 and Figure 4 is a schematic diagram of the relationship between the baseline and the moving distance of the light spot in the sensor in the depth camera module in certain embodiments of the present application;

[0016] Figure 5 is a schematic diagram of the structure of an existing depth camera module and a depth camera module in some embodiments of the present application;

[0017] Figures 6 to 10 is a schematic diagram of the structure of a depth camera module in some embodiments of the present application;

[0018] Fig.11 It is a schematic diagram of the relationship between the back focal size of the optical component in the light emission module and the length, width and height of the light emission module;

[0019] Figure 12 to Figure 14 is a schematic structural diagram of a first optical component in a time-of-flight module in certain embodiments of the present application;

[0020] Fig.15 and Fig.16 is a schematic structural diagram of a second optical component in a time-of-flight module in certain embodiments of the present application;

[0021] Fig.17 and Fig.18 is a schematic diagram of the structure of an electronic device in some embodiments of the present application;

[0022] Fig.19 Schematic diagram of the assembly method of the depth camera module in some embodiments of the present application

[0023] Fig. 20 is a structural schematic diagram of an assembly method of a depth camera module in certain embodiments of the present application;

[0024] Fig.21 is a flowchart of an assembly method of a depth camera module in certain embodiments of the present application;

[0025] Fig. 22 is a structural schematic diagram of an assembly method of a depth camera module in certain embodiments of the present application;

[0026] Fig.23 is a flowchart of an assembly method of a depth camera module in certain embodiments of the present application;

[0027] Fig.24 is a structural schematic diagram of an assembly method of a depth camera module in certain embodiments of the present application;

[0028] Fig.25 is a flowchart of an assembly method of a depth camera module in certain embodiments of the present application;

[0029] Fig.26 It is a structural schematic diagram of an assembly method of a depth camera module in certain embodiments of the present application. DETAILED DESCRIPTION

[0030] The following further describes the embodiments of the present application in conjunction with the accompanying drawings. The same or similar reference numerals in the accompanying drawings represent the same or similar elements or elements with the same or similar functions.

[0031] In addition, the embodiments of the present application described below in conjunction with the drawings are exemplary and are only used to explain the embodiments of the present application and should not be construed as limiting the present application.

[0032] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] See also Figure 1 and Figure 2, an embodiment of the present application provides a depth camera module 100. The depth camera module 100 includes a circuit board 10, a light source 30, a sensor 40, an integrated bracket 50, a first optical component 60 and a second optical component 70. The circuit board 10 includes a bottom surface 11, a first bearing surface 12 and a second bearing surface 13, and the distance between the first bearing surface 12 and the bottom surface 11 is different from the distance between the second bearing surface 13 and the bottom surface 11. The light source 30 is mounted on the first bearing surface 12 of the circuit board 10 and is electrically connected to the circuit board 10. The light source 30 is used to emit light. The sensor 40 is mounted on the circuit board 10 and is electrically connected to the circuit board 10. The sensor 40 is used to receive at least part of the light reflected back by the object and convert it into an electrical signal. The bracket 50 is mounted on the circuit board 10 and forms a receiving cavity 503 with the circuit board 10. The receiving cavity 503 is used to accommodate the light source 30 and the sensor 40. The first optical component 60 and the second optical component 70 are both arranged on the integrated bracket 50, wherein the first optical component 60 is arranged corresponding to the light source 30, and the first optical component 60 is used to guide the light emitted by the light source 30 to the outside of the depth camera module 100; the second optical component 70 is arranged corresponding to the sensor 40, and the second optical component 70 is used to receive at least part of the light reflected back by the object and guide the received light to the sensor 40.

[0034] The transmitter and receiver in a typical depth camera module are two independent modules, each of which has a separate bracket and a separate circuit board. That is, the transmitter includes a first circuit board and a first bracket, a first optical component is disposed in the first bracket, and a light source is disposed on the first circuit board; the receiver includes a second circuit board and a second bracket, a second optical component is disposed in the second bracket, and a sensor is disposed on the second circuit board.

[0035] The depth camera module 100 in the present application, by installing the sensor 40 and the light source 30 on the same circuit board 10, and the first optical component 60 and the second optical component 70 are fixedly mounted on the integrated bracket 50, can make the depth camera module 100 more compact in structure and shorten the baseline distance of the depth camera module 100 compared to the traditional depth camera module (the transmitting end and the receiving end each have a separate bracket and a separate circuit board). Among them, the distance between the optical centers of the sensor 40 and the light source 30 is defined as the baseline, and the baseline appearing below is also explained in the same way and will not be repeated. In addition, the depth camera module 100 of the present application, by carrying the light source 30 on the first bearing surface 12 of the circuit board 10, and the first bearing surface 12 and the second bearing surface 13 have a certain height difference, can shorten the baseline distance of the depth camera module 100 while providing the electronic components 81 (such as Figure 5 As shown in the figure, more space is left, thereby shortening the baseline distance of the depth camera module 100 while ensuring the normal operation of the depth camera module 100.

[0036] It should be noted that the depth camera module 100 in the embodiment of the present application is based on the time of flight (ToF) technology to obtain the depth information of the object to be measured. The time of flight technology is based on the time difference between the emitted light and the light reflected by the object to be measured to calculate the depth information of the object to be measured. Therefore, in the design process, it is hoped that the position of the light spot irradiating the sensor in the receiving end will not change as much as possible, which is conducive to simplifying the design of the sensor readout circuit.

[0037] Since the baseline distance of the depth camera module 100 can be shortened in the present application, it is helpful for the depth camera module 100 to obtain the depth information of the object to be measured. Specifically, when the light is projected out and reflected back to the receiving end by the target, it can be received by a certain pixel or several pixels of the sensor 40 in the receiving end. For the same pixel, when the distance between the target object and the module changes, the position where the pixel is finally projected on will also change. For example, Figure 3 As shown, a laser beam is emitted from point D. When the target is at position F, the laser beam is reflected through the focal point C of the receiving end and finally irradiates point A of the image plane (the plane where point AB is located) of the sensor 40; when the target is at position E, it passes through the focal point C of the receiving end lens group (i.e., the second optical component 70) and irradiates point B of the sensor 40. It can be seen that the same laser beam may eventually be received by different areas / pixels of the sensor 40 due to the different distances between the target object and the module. The above-mentioned moving distance difference on the sensor 40 is defined as L disparity The focal length of the receiving end lens (i.e., the second optical component 70) is f, and the distance between the optical center of the light emitting module and the optical center of the light receiving module is the baseline L baseline , the distance between the target object and the laser radar ranging module is L range , the above parameters follow the following relationship: That is, at the receiving end, the focal length f of the lens (i.e., the second optical component 70) and the distance L between the target object and the laser radar ranging module are range Under certain conditions, the moving distance difference L on the sensor 40 disparity With baseline L baseline Assuming the baseline L baseline The equivalent focal length of the second optical component 70 is 1.63 mm, and the pixel size in the sensor 40 is 10 μm. The distance of the current object to be measured changes, and the movement relationship of the light spot on the sensor 40 is as follows: Figure 4 As shown. It can be understood that at the baseline L baselineThe influence mainly affects the laser spot position for short-distance ranging (such as less than 2m). Since the depth camera module 100 calculates the depth information of the object to be measured based on the time difference between the emitted light and the light reflected by the object to be measured. Figure 4 It can be seen that when the target distance is 0.3m, when the center distance between the transmitting module and the light receiving module is small (3mm), the spot position only moves about 2.5 pixels, but when the center distance between the transmitting module and the light receiving module is large (10mm), the spot position moves about 8 pixels. Therefore, it can be proved that shortening the baseline distance of the depth camera module 100 is beneficial for the depth camera module 100 to obtain the depth information of the object to be measured.

[0038] Please continue reading Figure 1 and Figure 2 In some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 is less than the first preset distance. This is beneficial for the depth camera module 100 to obtain the depth information of the object to be measured. In some embodiments, the first preset distance may be 5 mm, that is, the distance between the center of the sensor 40 and the center of the light source 30 is less than 5 mm. For example, the distance between the center of the sensor 40 and the center of the light source 30 may be 4 mm, 3.5 mm, 2 mm, etc., without limitation. Of course, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 may also be equal to 5 mm. Preferably, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 may be 3.6 mm.

[0039] In some embodiments, the circuit board 10 can be used to dissipate heat for the sensor 40 and the light source 30 disposed thereon, so that when the depth camera module 100 is operating normally, the heat generated by the sensor 40 and the light source 30 can be dissipated through the circuit board 10 to avoid excessively high temperatures inside the depth camera module 100 and burn out other components inside the depth camera module 100, thereby extending the service life of the depth camera module 100. Specifically, in some embodiments, the circuit board 10 can be a hard-soft combined circuit board or a high-temperature co-fired ceramic circuit board, which is not limited here, and only needs to be able to dissipate heat for the sensor 40 and the light source 30 disposed thereon.

[0040] See also Figure 2 The circuit board 10 includes a bottom surface 11, a first bearing surface 12, and a second bearing surface 13. The distance between the first bearing surface 12 and the bottom surface 11 is different from the distance between the second bearing surface 13 and the bottom surface 11. That is, there is a height difference between the first bearing surface 12 and the second bearing surface 13. Since other electronic devices 81 are usually arranged around the light source 30, the electronic device 81 needs to be spaced a certain distance from the light source 30 (such as Figure 5As shown on the left side, the light source 30 is arranged on the first bearing surface 12, and there is a height difference between the first bearing surface 12 and the second bearing surface 13, which can shorten the lateral distance between the electronic device 81 and the light source 30 and avoid the electronic device 81 from contacting the light source 30 (as shown on the left side). Figure 5 This can shorten the baseline distance of the depth camera module 100 while providing the electronic components 81 (such as Figure 5 As shown in the figure, more space is left, thereby shortening the baseline distance of the depth camera module 100 while ensuring the normal operation of the depth camera module 100.

[0041] It should be noted that, in some embodiments, the depth camera module 100 further includes an electronic device 81, which is disposed on the second carrying surface 13. The distance between the electronic device 81 and the light source 30 is less than a preset threshold. In this way, the lateral distance between the electronic device 81 and the light source 30 can be shortened, and the contact between the electronic device 81 and the light source 30 can be avoided, thereby shortening the baseline distance of the depth camera module 100. Among them, the electronic device 81 can be a register for controlling the emission time interval of the light source 30; or, the electronic device 81 can also be a digital-to-analog converter or an analog-to-digital converter, etc., which is not limited here.

[0042] Specifically, see Figure 2 and Figure 6 In some embodiments, the distance between the first bearing surface 12 and the bottom surface 11 is smaller than the distance between the second bearing surface 13 and the bottom surface 11, and the light source 30 is carried on the first bearing surface 12. This is not only conducive to shortening the baseline distance of the depth camera module 100, but also can reduce the overall thickness of the optical depth camera module 100 without changing the spacing between the light source 30 and the first optical component 60. Of course, in some embodiments, such as Figure 7 As shown, the distance between the first supporting surface 12 and the bottom surface 11 may also be greater than the distance between the second supporting surface 13 and the bottom surface 11 , which is also beneficial to shortening the baseline distance of the depth camera module 100 .

[0043] The light source 30 is electrically connected to the circuit board 10, and the circuit board 10 can provide power to the light source 30 so that the light source 30 can emit light. Figures 8 to 10 In some embodiments, the light source 30 includes a first side 31 and a second side 32 opposite to each other, wherein the second side 32 is mounted on the first bearing surface 12. A first solder pad 91 is provided on the side of the light source 30 away from the circuit board 10, that is, the first side 31 of the light source 30 is provided with a first solder pad 91. The depth camera module 100 also includes an electrical connection line 82, and the first solder pad 91 is used to be electrically connected to the second solder pad 92 on the circuit board 10 through the electrical connection line 82, so that the light source 30 is electrically connected to the circuit board 10.

[0044] For example, see Figure 8 In some embodiments, one end of the electrical connection line 82 is electrically connected to the first side 31 of the light source 30, and the other end is electrically connected to the pad located on the first bearing surface 12. That is, the second pad 92 is provided on the first bearing surface 12, one end of the electrical connection line 82 is electrically connected to the first pad 91, and the other end is electrically connected to the second pad 92, so that the light source 30 is electrically connected to the circuit board 10. In this way, on the one hand, the electrical connection between the light source 30 and the circuit board 10 can be achieved; on the other hand, since the light source 30 is provided on the first bearing surface 12, the first bearing surface 12 and the second bearing surface 13 have a height difference, and the lateral spacing between the electronic device 81 and the light source 30 can be shortened under the premise of ensuring the spacing between the electronic device 81 and the light source 30, so as to shorten the baseline distance of the depth camera module 100; on the other hand, since the second pad 92 is provided on the first bearing surface 12, compared with the second pad 92 provided on the second bearing surface 13, the electrical connection line 82 does not need to extend to the second bearing surface 13, which is conducive to reducing the complexity of the circuit layout of the circuit board 10.

[0045] In some embodiments, in the light emitting direction of the light source 30, the distance between the first pad 91 and the second pad 92 is greater than or less than the distance between the opposite sides of the light source 30. That is, in the light emitting direction of the light source 30, the spacing between the first pad 91 and the second pad 92 is greater than or less than the distance between the first side 31 and the second side 32 of the light source 30. It can be understood that when the second pad 92 and the second side 32 of the light source 30 are arranged on the same horizontal plane, in the light emitting direction of the light source 30, the spacing between the first pad 91 and the second pad 92 arranged on the first side 31 of the light source 30 must be equal to the distance between the first side 31 and the second side 32. The second pad 92 is electrically connected to the first pad 91 located on the first side 31 of the light source 30. If the second pad 92 is in direct contact with the light source 30 at this time, a short circuit or other faults may easily occur, causing the depth camera module 100 to fail to work properly. Therefore, it is necessary to keep a certain distance between the second pad 92 and the light source 30. However, in this embodiment, since the distance between the first pad 91 and the second pad 92 is greater or less than the distance between the opposite sides of the light source 30 in the light emitting direction of the light source 30, the second pad 92 and the second side 32 of the light source 30 are not arranged on the same horizontal plane, that is, there is a height difference between the second pad 92 and the second side 32 of the light source 30. At this time, even if the lateral spacing between the second pad 92 and the light source 30 is shortened, the second pad 92 will not directly contact the light source 30, so that the baseline distance of the depth camera module 100 can be further shortened while ensuring the normal operation of the depth camera module 100.

[0046] For example, see Fig. 9In some embodiments, in the light emitting direction of the light source 30, the distance between the first bearing surface 12 and the second bearing surface 13 is the first distance, and the distance between the two opposite sides of the light source 30 is the second distance. In the case where the distance between the first bearing surface 12 and the bottom surface 11 is smaller than the distance between the second bearing surface 13, the distance between the first solder pad 91 and the second solder pad 92 is equal to the difference between the first distance and the second distance. Specifically, Fig. 9 As shown, the second pad 92 is arranged on the second bearing surface 13, one end of the electrical connection line 82 is electrically connected to the first side 31 of the light source 30, and the other end is electrically connected to the second pad 92 located on the second bearing surface 13, so that the light source 30 is electrically connected to 10. That is, one end of the electrical connection line 82 is electrically connected to the first pad 91, and the other end is electrically connected to the second pad 92. Since the light source 30 is carried on the first bearing surface 12 of the circuit board 10 in this embodiment, the light source 10 is electrically connected to the second pad 92 located on the second bearing surface 13 through the electrical connection line 82, and the first bearing surface 12 and the second bearing surface 13 have a certain height difference, compared with the second pad 92 being arranged on the first bearing surface 13, the lateral distance between the second pad 92 and the light source 30 can be shortened while ensuring the normal electrical connection between the light source 30 and the circuit board 10, thereby further shortening the baseline distance of the camera module 100.

[0047] It should be noted that when the light source 30 is electrically connected to the second pad 92 located on the second bearing surface 13 through the electrical connection line 82, in some embodiments, in the light emitting direction of the light source 30, the distance between the side of the light source 30 away from the first bearing surface 12 and the second bearing surface 13 is within a preset range. That is, in the light emitting direction of the light source 30, the distance between the first side 31 of the light source 30 and the second bearing surface 13 is within a preset range. Gold wire is usually used as the electrical connection line 82, and based on the current process technology, the gold wire has a limit curvature, that is, the curvature of the gold wire cannot be too large. In this embodiment, since in the light emitting direction of the light source 30, the distance between the first side 31 of the light source 30 and the second bearing surface 13 is within a preset range, the curvature of the electrical connection line 82 connecting the first pad 91 and the second pad 92 can be maintained within a certain range, that is, it will not exceed the limit curvature of the gold wire, which is conducive to reducing the difficulty of manufacturing the depth camera module 100. In particular, in some embodiments, the first side 31 of the light source 30 is nearly flush with the second supporting surface 13 , which is more conducive to reducing the difficulty of manufacturing the depth camera module 100 .

[0048] Of course, in some embodiments, when the distance between the first bearing surface 12 and the bottom surface 11 is smaller than the distance between the second bearing surface 13, the distance between the first pad 91 and the second pad 92 may also be equal to the sum of the first distance and the second distance. In this way, the lateral distance between the second pad 92 and the light source 30 can be shortened while ensuring the normal electrical connection between the light source 30 and the circuit board 10, thereby further shortening the baseline distance of the camera module 100.

[0049] See also Fig.10 In some embodiments, the circuit board 10 further includes a connection surface 14 connecting the first bearing surface 12 and the second bearing surface 13. The second solder pad 92 may also be provided on the connection surface 14, and one end of the electrical connection line 82 is electrically connected to the first side 31 of the light source 30, and the other end is electrically connected to the second solder pad 92 located on the connection surface 14, so that the light source 30 is electrically connected to 10. That is, one end of the electrical connection line 82 is electrically connected to the first solder pad 91, and the other end is electrically connected to the second solder pad 92. In this way, the lateral distance between the second solder pad 92 and the light source 30 can be shortened while ensuring the normal electrical connection between the light source 30 and the circuit board 10, thereby further shortening the baseline distance of the camera module 100.

[0050] In some embodiments, the sensor 40 is directly mounted on the second bearing surface 13 of the circuit board 10 and is electrically connected to the circuit board 10. Of course, in some embodiments, the circuit board 10 may also be provided with a groove (not shown) that is recessed from the second bearing surface 13 to the bottom surface 11, and the sensor 40 is accommodated in the groove. In this way, under the premise that the distance between the sensor 40 and the second optical component 70 does not change, compared with directly arranging the sensor 40 on the second bearing surface 13 of the circuit board 10, it is beneficial to reduce the overall thickness of the depth camera module 100.

[0051] See also Figure 2 The integrated bracket 50 is fixedly mounted on the circuit board 10, and forms a receiving cavity 503 with the circuit board 10. The receiving cavity 503 is used to receive the light source 30 and the sensor 40. The first optical component 60 fixed in the bracket 50 can correspond to the light source 30, and the second optical component 70 fixed in the bracket 50 can correspond to the sensor 40. In some embodiments, the number of the receiving cavity 503 can be one, in which case the light source 30 and the sensor 40 are both received in the receiving cavity 503; or, in some embodiments, the number of the receiving cavity 503 can also be two, in which case the light source 30 and the sensor 40 are respectively received in different receiving cavities 503.

[0052] Specifically, see Figure 1 and Figure 2In some embodiments, the integrated bracket 50 includes a first support member 51, a second support member 52, and a connecting assembly 53 connecting the first support member 51 and the second support member 52. The first support member 51 and the second support member 52 are arranged at intervals and are respectively fixed to the circuit board 10. Among them, the first support member 51 and the second support member 52 can be fixedly connected to the circuit board 10 through different connection methods. Of course, the first support member 51 and the second support member 52 can also be fixedly connected to the circuit board 10 through the same connection method, which is not limited here. In addition, the connection method includes but is not limited to bonding, clamping, threaded connection, etc.

[0053] More specifically, the first support member 51 is closer to the light source 30 than the second support member 52. In some embodiments, both the first support member 51 and the second support member 52 are supported on the second supporting surface 13. Figure 6 As shown, in some embodiments, when the distance between the first bearing surface 12 and the bottom surface 11 is smaller than the distance between the second bearing surface 13 and the bottom surface 11 , the first support member 51 is supported on the first bearing surface 12 , and the second support member 52 is supported on the second bearing surface.

[0054] The connecting component 53 is connected to the first support member 51 and the second support member 52, and the connecting component 53 includes a first mounting hole 531 and a second mounting hole 532. Among them, the first mounting hole 531 is used to install the first optical component 60, and the second mounting hole 532 is used to install the second optical component 70. For example, the first mounting hole 531 is a through hole whose axis is perpendicular to the circuit board 10, so as to facilitate the propagation of the light beam. The first optical component 60 is arranged in the first mounting hole 531, and the first optical component 60 is fixedly connected to the first mounting hole 531 by an adhesive. The optical axis of the first optical component 60 coincides with the optical axis of the light source 30, so that the corresponding arrangement of the first optical component and the light source 30 is realized after the bracket 50 and the circuit board 10 are fixedly connected, so that the first optical component 60 can guide the light emitted by the light source 30 to the outside of the depth camera module 100. Of course, the first optical component 60 can also be installed and fixed in the first mounting hole 531 in other ways, which is not limited here.

[0055] The second mounting hole 532 is a through hole whose axis is perpendicular to the circuit board 10 to facilitate the propagation of the light beam, and the second optical component 70 is connected to the second mounting hole 532. After the bracket 50 and the circuit board 10 are fixedly connected, the second optical component and the light source 30 can be set correspondingly so that the light reflected back by the object to be measured can be guided to the sensor 40 via the second optical component 70.

[0056] It should be noted that, in some embodiments, the depth camera module 100 further includes a filter 84, which is disposed between the second optical component 70 and the sensor 40, and the filter 84 is used to filter light outside a predetermined wavelength range. Specifically, in some embodiments, the filter 84 and the second optical component 70 are both mounted in the second mounting hole 532 of the bracket 50, so that the light reflected back by the object to be measured passes through the second optical component 70 and the filter 84 in sequence and then enters the sensor 40.

[0057] See also Figure 8 In some embodiments, the first optical component 60 includes a collimating lens 61 and a second diffractive optical element 62, wherein the collimating lens 61 is closer to the light source 30 than the second diffractive optical element 62. The collimating lens 61 is used to collimate the light emitted by the light source 30 and guide the collimated light to the second diffractive optical element 62. The second diffractive optical element 62 is used to replicate the received light and project it outside the depth camera module 100.

[0058] In some embodiments, the light emitted by the light source 30 forms a planar pattern. For example, the light source 30 includes a plurality of light emitting elements (not shown), each of which is capable of emitting a light beam, and the light beams emitted by the plurality of light emitting elements form a planar pattern. Figure 2 , Figure 12 to Figure 14 , the first optical component 60 may include a first diffractive optical element 63. The first diffractive optical element 63 is provided with an integrated microstructure 631, and the integrated microstructure 631 can collimate the plane pattern and replicate the plane pattern to emit a speckle pattern out of the depth camera module 100. Since the integrated microstructure 631 on the first diffractive optical element 63 can collimate the plane pattern and replicate the plane pattern to emit the speckle pattern, compared with using different optical elements to respectively realize the collimation and replication functions, the depth camera module 100 of the present application can reduce the volume of the depth camera module 100 and reduce the manufacturing cost of the depth camera module 100 without affecting the optical effect of projecting the speckle image.

[0059] In addition, while keeping the distance between the first optical component 60 and the second bearing surface 13 unchanged, the distance between the first bearing surface 12 and the bottom surface 11 is smaller than the distance between the second bearing surface 13 and the bottom surface 11, and the light source 30 is disposed on the first bearing surface 12. Compared with directly disposing the light source 30 on the second bearing surface 13, the first optical component 60 needs to have a larger back focus. In addition, the electronic components 81 and gold wires around the light source 30 also cause the back focus of the first optical component 60 to become larger. Please refer to Fig.11It can be understood that the larger the back focus of the first optical component 60, the larger the volume of the light emission module composed of the light source 30 and the first optical component 60, and thus the larger the volume of the depth camera module 100. In this embodiment, an integrated microstructure 631 is used to realize the functions of a traditional lens group and a diffraction element at the same time, so that the space of the light emission module can be released to the maximum extent, which is very helpful for compressing the baseline of the depth camera module 100. That is, the integrated microstructure 631 on the first diffractive optical element 63 can collimate the plane pattern and replicate the plane pattern to emit a speckle pattern. Compared with using different optical elements to realize the collimation and replication functions respectively, the baseline of the depth camera module 100 can be further shortened.

[0060] Specifically, the integrated microstructure 631 can be formed by the fusion of a virtual phase-based first microstructure and a virtual second microstructure. Among them, the first microstructure is used to collimate the light, and the second microstructure is used to replicate the light spot formed by the received light. For example, in some embodiments, the first microstructure is a microstructure of a diffraction lens or a microstructure of a super lens with n steps, where n is greater than or equal to. In this way, the first microstructure can be used to collimate the light. For another example, in some embodiments, the second microstructure is a diffraction microstructure based on a grating or a diffraction microstructure based on a super lens. In this way, the second microstructure can be used to replicate the light spot formed by the received light.

[0061] For further information, see Fig.12 and Fig.13 , the first diffractive optical element 63 includes a first surface 6301 and a second surface 6302 facing each other, wherein the first surface 6301 faces the light source 30, and the second surface 6302 is away from the light source 30. That is, the light emitted by the light source 30 will be incident on the first surface 6301 of the first diffractive optical element 63 and then emitted from the second surface 6302 of the first diffractive optical element 63. The integrated microstructure 631 can be arranged on the first surface 6301 and / or the second surface 6302 of the first diffractive optical element 63. For example, see Fig.12 In some embodiments, the integrated microstructure 631 can be disposed on the first surface 6301 of the first diffractive optical element 63, which is advantageous in preventing the integrated microstructure 631 from being scratched and preventing moisture and dust from entering the integrated microstructure 631, thereby extending the service life of the depth camera module 100. For another example, see Fig.13In some embodiments, the integrated microstructure 631 may also be disposed on the second surface 6302 of the first diffractive optical element 63. Since strong light directly incident on the integrated microstructure 631 may cause glare, and the stray light is relatively strong, which will affect the detection accuracy of the depth camera module 100. Therefore, in this embodiment, the integrated microstructure 631 is disposed on the second surface 6302 away from the light source 30, which can reduce the volume of the depth camera module 100 while avoiding glare and reducing stray light, which is beneficial to improving the detection accuracy of the depth camera module 100. Of course, in some embodiments, the integrated microstructure 631 is disposed on both opposite surfaces of the first diffractive optical element 63, which is not limited here.

[0062] See also Fig.14 In some embodiments, the first diffractive optical element 63 includes a first layer 632 and a second layer 633, and the first layer 632 is closer to the light source 30 than the second layer 633. The integrated microstructure 631 is located in a sealed cavity 634 formed by the first layer 632 and the second layer 633. Since the integrated microstructure 631 is housed in the sealed cavity 634, moisture and dust can be prevented from entering the integrated microstructure 631, which is beneficial to extending the service life of the depth camera module 100. It should be noted that the first layer 632 and the second layer 633 of the first diffractive optical element 63 can be made of plastic. Of course, the first layer 632 and the second layer 633 of the first diffractive optical element 63 can also be other materials that are waterproof and dustproof, which is not limited here.

[0063] In some embodiments, fillers 635 (such as Fig.12 As shown). In this way, on the one hand, it is possible to prevent moisture and dust from entering the gaps between the integrated microstructures 631, thereby extending the service life of the depth camera module 100; on the other hand, it is possible to prevent the light beam emitted by the light source 30 from directly entering the human eye through the gaps between the integrated microstructures 631, thereby improving the safety of the depth camera module 100. It should be noted that, in some embodiments, the filler 635 may include organic matter or silicon dioxide.

[0064] See also Fig.15 and Fig.16 In some embodiments, the second optical component 70 includes a phase lens 71, which is used to receive at least part of the light reflected by the object and adjust the phase of the light emitted from the phase lens 71 to the sensor 40. Since the phase lens 71 capable of adjusting the phase of the light is provided to replace the traditional refractive lens group in this embodiment, the volume of the depth camera module 100 can be reduced, and the illumination of the light reaching the sensor 40 can be improved, which is beneficial for the sensor 40 to receive the light, so as to improve the detection accuracy of the depth camera module 100.

[0065] It should be noted that, in some embodiments, the illumination of the light reaching the sensor 40 through the phase lens 71 is greater than or equal to 98%. Specifically, the phase lens 71 includes a substrate 711 and a phase microstructure 712 disposed on the substrate 711. The phase structure is used to adjust the phase of the light emitted from the phase lens 71 to the sensor 40.

[0066] More specifically, the substrate 711 includes a first surface 7111 and a second surface 7112 that are opposite to each other, and the first surface 7111 is farther away from the sensor 40 than the second surface 7112. The phase microstructure 712 can be disposed on the first surface 7111 and / or the second surface 7112 of the substrate 711. For example, see Fig.15 In some embodiments, the phase microstructure 712 may be disposed on the first surface 7111 of the substrate 711. Since the phase microstructure 712 adjusts the phase of the light emitted from the phase lens 71 to the sensor 40, compared with the light directly passing through the lens and then emitted to the sensor 40, the illumination of the light reaching the image sensor can be improved. For another example, see Fig.16 In some embodiments, the phase microstructure 712 may also be disposed on the second surface 7112 of the substrate 711. Since glare may occur when strong light directly enters the behavior microstructure, and the stray light is relatively strong, it is not conducive to the sensor 40 receiving light, thereby affecting the detection accuracy of the depth camera module 100. Therefore, in this embodiment, the phase microstructure 712 is disposed on the second surface 7112 of the substrate 711. Compared with the microstructure being disposed on the first surface 7111 of the substrate 711, it is possible to improve the illumination of the light reaching the sensor 40 while avoiding glare and reducing stray light, which is beneficial for the sensor 40 to receive light, so as to improve the detection accuracy of the depth camera module 100. Of course, in some embodiments, the opposite sides of the substrate 711 may be provided with phase microstructures 712, which is not limited here.

[0067] It should be noted that, in some embodiments, the phase-type lens 71 is a plane phase lens, and the phase microstructure 712 includes a nano-microstructure; or, in some embodiments, the phase-type lens 71 is a Fresnel lens, and the phase microstructure 712 includes an annular Fresnel microstructure, which is not limited here.

[0068] See also Fig.17 The embodiment of the present application also provides an electronic device 1000. The electronic device 1000 includes a housing 200 and a depth camera module 100 described in any one of the above embodiments, and the depth camera module 100 is combined with the housing 200. It should be noted that the electronic device 1000 can be a mobile phone, a computer, a tablet computer, a smart watch, a smart wearable device, etc., which is not limited here.

[0069] The electronic device 1000 in the present application, by installing the sensor 40 and the light source 30 in the depth camera module 100 on the same circuit board 10, and the first optical component 60 and the second optical component 70 are fixedly installed on the integrated bracket 50, can make the depth camera module 100 more compact and shorten the baseline distance of the depth camera module 100 compared to the traditional depth camera module (the transmitting end and the receiving end each have a separate bracket and a separate circuit board). In addition, the depth camera module 100 of the present application, by carrying the light source 30 on the first bearing surface 12 of the circuit board 10, and the first bearing surface 12 and the second bearing surface 13 have a certain height difference, can shorten the baseline distance of the depth camera module 100 while providing the electronic components 81 (such as Figure 5 As shown in the figure, more space is left, thereby shortening the baseline distance of the depth camera module 100 while ensuring the normal operation of the depth camera module 100.

[0070] See also Fig.18 , the embodiment of the present application also provides a shooting component 300. The shooting component 300 includes a two-dimensional camera module 301 and a depth camera module 100 described in any one of the above embodiments. The two-dimensional camera module 301 is used to obtain a two-dimensional image, and the depth camera module 100 is used to obtain a depth information image. The distance between the center of the sensor 40 of the depth camera module 100 and the center of the two-dimensional camera module 301 is less than the second preset distance. Since the distance between the center of the sensor 40 of the depth camera module 100 and the center of the two-dimensional camera module 301 is less than the second preset distance, the field of view of the depth camera module 100 can be close to the field of view of the two-dimensional camera module 301, which is conducive to the shooting component 300 to simultaneously obtain a two-dimensional image and a depth information image under the same field of view. Among them, the two-dimensional camera module 301 can be a color camera module, and the two-dimensional image obtained at this time is a color image; or, the two-dimensional camera module 301 can also be a black and white camera module, and the two-dimensional image obtained at this time is a black and white image, which is not limited here.

[0071] It should be noted that, in some embodiments, the second preset distance may be 2 cm. That is, the distance between the center of the sensor 40 of the depth camera module 100 and the center of the two-dimensional camera module 301 is less than 2 cm. For example, the distance between the center of the sensor 40 of the depth camera module 100 and the center of the two-dimensional camera module 301 may be 1.8 cm, 1.3 cm, 1 cm, 0.8 cm, etc., which are not limited here. Of course, in some embodiments, the distance between the center of the sensor 40 of the depth camera module 100 and the center of the two-dimensional camera module 301 may also be 2 cm. Preferably, in some embodiments, the distance between the center of the sensor 40 of the depth camera module 100 and the center of the two-dimensional camera module 301 is 1.5 cm, so that the field of view of the depth camera module 100 can be kept close to the field of view of the two-dimensional camera module 301, and the depth camera module 100 can be kept at a certain distance from the two-dimensional camera module 301 to avoid the temperature generated by the depth camera module 100 during the engineering process affecting the normal operation of the two-dimensional camera module 301.

[0072] In some embodiments, when the shooting component 300 is working, the temperature of the depth camera module 100 is less than a preset temperature. In some embodiments, the preset temperature may be 60°C. That is, when the shooting component 300 is working, the temperature of the depth camera module 100 is less than 60°C. For example, when the shooting component 300 is working, the temperature of the depth camera module 100 may be 55°C, 50°C, 48°C, 45°C, 42°C, 35°C, 30°C, etc. Since the temperature of the depth camera module 100 is less than the preset temperature, it is possible to avoid the temperature of the depth camera module 100 being too high, thereby affecting the normal operation of the components arranged around it (such as the two-dimensional camera module 301). Preferably, in some embodiments, when the shooting component 300 is working, the temperature of the depth camera module 100 is stabilized at about 45°C.

[0073] See also Fig.18 The embodiment of the present application also provides an electronic device 1000. The electronic device 1000 includes a housing 200 and a shooting component 300 described in any one of the above embodiments, and the shooting component 300 is combined with the housing 200. It should be noted that the electronic device 1000 can be a mobile phone, a computer, a tablet computer, a smart watch, a smart wearable device, etc., which is not limited here.

[0074] The electronic device 1000 in the present application sets the distance between the center of the sensor 40 of the depth camera module 100 and the center of the two-dimensional camera module 301 to be less than the second preset distance in the shooting component 300. In this way, the field of view of the depth camera module 100 and the field of view of the two-dimensional camera module 301 can be close, which is conducive to the electronic device 1000 to simultaneously obtain a two-dimensional image and a depth information image in the same field of view.

[0075] See also Figure 2 , Fig.19 and Fig. 20 The present application embodiment provides an assembly method of a depth camera module 100. The assembly method includes:

[0076] 011: A circuit board 10 is provided, the circuit board 10 comprises a bottom surface 11, a first bearing surface 12 and a second bearing surface 13, and a distance between the first bearing surface 12 and the bottom surface 11 is different from a distance between the second bearing surface 13 and the bottom surface 11;

[0077] 012: The light source 30 is mounted on the first bearing surface 12 and electrically connected to the circuit board 10. The light source 30 is used to emit light. The sensor 40 is mounted on the second bearing surface 13 and electrically connected to the circuit board 10. The sensor 40 is used to receive at least part of the light reflected by the object and convert it into an electrical signal.

[0078] 013: Fix the first optical component 60 to the integrated bracket 50;

[0079] 014: The bracket 50 with the first optical component 60 installed is fixedly connected to the circuit board 10, and the bracket 50 and the circuit board 10 form a receiving cavity 503, and the light source 30 and the sensor 40 are accommodated in the receiving cavity 503, so that the first optical component 60 corresponds to the light source 30, and the first optical component 60 is used to guide the light emitted by the light source 30 to the outside of the depth camera module 100;

[0080] 015: The second optical component 70 is fixedly mounted on the bracket 50 so that the second optical component 70 corresponds to the sensor 40 . The second optical component 70 is used to receive at least part of the light reflected by the object and guide the light to the sensor 40 .

[0081] The assembly method of the depth camera module 100 in the present application, by installing the sensor 40 and the light source 30 in the depth camera module 100 on the same circuit board 10, and the first optical component 60 and the second optical component 70 are fixedly installed on the integrated bracket 50, can make the depth camera module 100 more compact and shorten the baseline distance of the depth camera module 100 compared to the traditional depth camera module (the transmitting end and the receiving end each have a separate bracket and a separate circuit board). In addition, the assembly method is conducive to eliminating the assembly tolerance of the depth camera module 100.

[0082] Specifically, please combine Fig. 20, a circuit board 10, a light source 30 and a sensor 40 are provided, wherein the light source 30 is used to emit light, and the sensor 40 is used to receive at least part of the light reflected by the object and convert it into an electrical signal. The circuit board 10 includes a bottom surface 11, a first bearing surface 12 and a second bearing surface 13, and the distance between the first bearing surface 12 and the bottom surface 11 is different from the distance between the second bearing surface 13 and the bottom surface 11. That is, there is a height difference between the first bearing surface 12 and the second bearing surface 13. For example, in some embodiments, the distance between the first bearing surface 12 and the bottom surface 11 is smaller than the distance between the second bearing surface 13 and the bottom surface 11. For another example, in some embodiments, the distance between the first bearing surface 12 and the bottom surface 11 is greater than the distance between the second bearing surface 13 and the bottom surface 11.

[0083] The light source 30 is mounted on the first bearing surface 12 and electrically connected to the circuit board 10. Since other electronic devices 81 are usually arranged around the light source 30, the electronic devices 81 need to be spaced a certain distance from the light source 30 (e.g. Figure 5 As shown on the left side, the light source 30 is arranged on the first bearing surface 12, and there is a height difference between the first bearing surface 12 and the second bearing surface 13, which can shorten the lateral distance between the electronic device 81 and the light source 30 and avoid the electronic device 81 from contacting the light source 30 (as shown on the left side). Figure 5 This can shorten the baseline distance of the depth camera module 100 while providing the electronic components 81 (such as Figure 5 As shown in the figure, more space is left, thereby shortening the baseline distance of the depth camera module 100 while ensuring the normal operation of the depth camera module 100.

[0084] Specifically, in some embodiments, the light source 30 can be mounted on the first bearing surface 12 by adhesive. Subsequently, the light source 30 can be electrically connected to the circuit board 10 by a gold wire bonding process. Figures 8 to 10 As shown, the light source 30 includes a first side 31 and a second side 32 opposite to each other, wherein the second side 32 is combined with the circuit board 10, and the first side 31 is provided with a first solder pad 91. The circuit board 10 is provided with a second solder pad 92, and an electrical connection line 82 is provided, and the first solder pad 91 is electrically connected to the second solder pad 92 through the electrical connection line 82, so as to realize the electrical connection between the light source 30 and the circuit board 10. Among them, the second solder pad 92 can be arranged on any one of the first bearing surface 12, the second bearing surface 13 and the connecting surface 14, which is not limited here.

[0085] The sensor 40 is mounted on the second bearing surface 13 and electrically connected to the circuit board 10. Specifically, in some embodiments, the sensor 40 can be mounted on the second bearing surface 13 by adhesive. Then, the sensor 40 can be electrically connected to the circuit board 10 by a gold wire bonding process, that is, the pads on the sensor 40 are connected to the pads on the circuit board 10 by wires (such as gold wires or other conductive wires) to electrically connect the sensor 40 to the circuit board 10.

[0086] The first optical component 60 is fixedly mounted on the integrated bracket 50. Specifically, the first optical component 60 is mounted in the first mounting hole 531 of the bracket 50. For example, in some embodiments, the first optical component 60 can be fixed in the first mounting hole 531 by gluing.

[0087] See also Fig. 20 In some embodiments, the bracket 50 includes a first side 501 and a second side 502 opposite to each other. After the bracket 50 is assembled with the circuit board 10, the first side 501 is closer to the circuit board 10 than the second side 502. The first optical component 60 includes a collimating lens 61 and a second diffractive optical element 62. The collimating lens 61 is used to collimate the light emitted by the light source 30, and the second diffractive optical element 62 is used to receive the collimated light, and replicate the received light and project it outside the depth camera module 100. At this time, in some embodiments, fixing the first optical component 60 on the integrated bracket 50 includes: fixing the second diffractive optical element 62 and the collimating lens 61 in the first mounting hole 531 of the bracket 50 in sequence along the direction from the second side 502 of the bracket 50 to the first side 501.

[0088] Specifically, the second diffractive optical element 62 is placed in the first mounting hole 531 along the direction from the second side 502 of the bracket 50 to the first side 501, and then the second diffractive optical element 62 is fixedly connected to the first mounting hole 531. For example, in some embodiments, the second diffractive optical element 62 can be attached to the first mounting hole 531 by adhesive. Then, along the same direction, that is, still along the direction from the second side 502 of the bracket 50 to the first side 501, the collimating lens 61 is placed in the first mounting hole 531, and then the second diffractive optical element 62 is fixedly connected to the first mounting hole 531. Similarly, in some embodiments, the collimating lens 61 can also be attached to the first mounting hole 531 by adhesive. In this way, the first optical component 60 is fixedly mounted to the bracket 50. It should be noted that when installing the collimating lens 61, it is necessary to first align it according to the second diffractive optical element 62 in the first mounting hole 531, and then fix the collimating lens 61 after completing the alignment, so that the light collimated by the collimating lens 61 can smoothly enter the second diffractive optical element 62.

[0089] Then, the bracket 50 with the first optical component 60 is mounted on the circuit board with the sensor 40 and the light source 30, and the bracket 50 and the circuit board 10 form a receiving cavity 503 (such as Figure 2 As shown in the figure, the light source 30 and the sensor 40 are accommodated in the accommodating cavity 503, so that the first optical component 60 corresponds to the light source 30, and the first optical component 60 is used to guide the light emitted by the light source 30 to the outside of the depth camera module 100. For example, in some embodiments, the first optical component 60 mounted on the bracket 50 is aligned with the light source 30 provided on the circuit board 10 through an alignment process (Active Alignment, AA process, the same below, no further description is given here), and after the alignment is completed, the bracket 50 is fixed to the circuit board 10, and the first optical component 60 corresponds to the light source 30. It should be noted that in some embodiments, the first optical component 60 and the light source 30 are aligned through an alignment process, and the relative position between the first optical component 60 and the light source 30 is gradually adjusted so that the first optical component 60 and the light source 30 gradually approach a facing setting. After adjusting the relative position between the first optical component 60 and the light source 30 to meet the alignment accuracy of the first optical component 60 and the light source 30, the bracket 50 is fixed to the circuit board 10 to ensure the stability of the connection.

[0090] After the first optical component 60 is installed, the second optical component 70 is installed on the bracket 50 so that the second optical component 70 corresponds to the sensor 40. The second optical component 70 is used to receive at least part of the light reflected by the object and guide the light to the sensor 40. For example, in some embodiments, the second optical component 70 is aligned with the sensor 40 provided on the circuit board 10 through an alignment process, and after the alignment is completed, the second optical component 70 is installed in the second mounting hole 532 of the bracket 50 so that the second optical component 70 corresponds to the sensor 40. Since usually in the process of assembling the depth camera module 100, if the second optical component 70 at the receiving end needs to be aligned to the depth camera module 100, it is necessary to perform error correction in combination with the speckle projected by the transmitting end (i.e., the light emitting module composed of the light source 30 and the first optical component 60) , which is relatively complicated. In this embodiment, the second optical component 70 is aligned with the sensor 40 provided on the circuit board 10 through an alignment process, which can reduce the difficulty of assembling the depth camera module 100 while eliminating the influence of translation, rotation, and tilt as much as possible.

[0091] In some embodiments, before the bracket 50 with the first optical component 60 mounted thereon is fixedly connected to the circuit board 10, the assembly method further includes: installing a filter 84 in the second mounting hole 532 of the bracket 50, and the filter 84 is used to filter light outside a predetermined wavelength range. Specifically, in some embodiments, before the bracket 50 with the first optical component 60 mounted thereon is mounted on the circuit board 10, the filter 84 may also be installed in the second mounting hole 532 of the bracket 50, and then the bracket 50 with the first optical component 60 and the filter 84 mounted thereon is mounted on the circuit board 10. The filter 84 may be installed before or after the first optical component 60 is installed, and this is not limited here.

[0092] See also Figure 2 , Fig.21 and Fig. 22 The present application also provides an assembly method of a depth camera module 100. The assembly method includes:

[0093] 021: A circuit board 10 is provided, the circuit board 10 comprises a bottom surface 11, a first bearing surface 12 and a second bearing surface 13, the distance between the first bearing surface 12 and the bottom surface 11 is different from the distance between the second bearing surface 13 and the bottom surface 11;

[0094] 022: The light source 30 is mounted on the first bearing surface 12 and electrically connected to the circuit board 10. The light source 30 is used to emit light. The sensor 40 is mounted on the second bearing surface 13 and electrically connected to the circuit board 10. The sensor 40 is used to receive at least part of the light reflected by the object and convert it into an electrical signal.

[0095] 0242: The integrated bracket 50 is fixedly connected to the circuit board 10, the bracket 50 and the circuit board 10 form a receiving cavity 503, and the light source 30 and the sensor 40 are received in the receiving cavity 503;

[0096] 024: Fix the first optical component 60 and the second optical component 70 on the bracket 50 so that the first optical component 60 corresponds to the light source 30, and the second optical component 70 corresponds to the sensor 40. The first optical component 60 is used to guide the light emitted by the light source 30 to the outside of the depth camera module 100, and the second optical component 70 is used to receive at least part of the light reflected back by the object and guide the light to the sensor 40.

[0097] The assembly method of the depth camera module 100 in the present application, by installing the sensor 40 and the light source 30 in the depth camera module 100 on the same circuit board 10, and the first optical component 60 and the second optical component 70 are fixedly mounted on the bracket 50, can make the depth camera module 100 more compact and shorten the baseline distance of the depth camera module 100 compared to the traditional depth camera module (the transmitting end and the receiving end each have a separate bracket and a separate circuit board). In addition, the assembly method is conducive to eliminating the assembly tolerance of the depth camera module 100.

[0098] Specifically, please combine Fig. 22 , a circuit board 10, a light source 30 and a sensor 40 are provided, wherein the light source 30 is used to emit light, and the sensor 40 is used to receive at least part of the light reflected by the object and convert it into an electrical signal. The circuit board 10 includes a bottom surface 11, a first bearing surface 12 and a second bearing surface 13, and the distance between the first bearing surface 12 and the bottom surface 11 is different from the distance between the second bearing surface 13 and the bottom surface 11. That is, there is a height difference between the first bearing surface 12 and the second bearing surface 13. For example, in some embodiments, the distance between the first bearing surface 12 and the bottom surface 11 is smaller than the distance between the second bearing surface 13 and the bottom surface 11. For another example, in some embodiments, the distance between the first bearing surface 12 and the bottom surface 11 is greater than the distance between the second bearing surface 13 and the bottom surface 11.

[0099] The light source 30 is mounted on the first bearing surface 12 and electrically connected to the circuit board 10; and the sensor 40 is mounted on the second bearing surface 13 and electrically connected to the circuit board 10. The specific mounting method of the light source 30 and the sensor 40 is the same as the specific mounting method of the light source 30 and the sensor 40 in the above embodiment, and will not be described in detail here.

[0100] Then, the bracket 50 is fixedly connected to the circuit board 10, and the bracket 50 and the circuit board 10 form a receiving cavity 503 (such as Figure 2 As shown in FIG. 5 , the light source 30 and the sensor 40 are accommodated in the accommodating cavity 503. Specifically, the bracket 50 is fixedly mounted on the circuit board 10. The bracket 50 and the circuit board 10 form an accommodating cavity 503, and the light source 30 and the sensor 40 are accommodated in the accommodating cavity 503. It should be noted that at this time, the first mounting hole 531 of the bracket 50 needs to correspond to the light source 30 so that the light emitted by the light source 30 can be emitted through the first mounting hole 531; the second mounting hole 532 of the bracket 50 needs to correspond to the sensor 40 so that at least part of the light reflected by the object to be measured can be emitted into the sensor 40 through the second mounting hole 532.

[0101] After the bracket 50 and the circuit board 10 are assembled, the first optical component 60 and the second optical component 70 are fixed on the bracket 50 so that the first optical component 60 corresponds to the light source 30, and the second optical component 70 corresponds to the sensor 40. The first optical component 60 is used to guide the light emitted by the light source 30 to the outside of the depth camera module 100, and the second optical component 70 is used to receive at least part of the light reflected back by the object and guide the light to the sensor 40.

[0102] Specifically, see Fig.23 and Fig.24 In some embodiments, fixing the first optical component 60 and the second optical component 70 on the bracket 50 so that the first optical component 60 corresponds to the light source 30 and the second optical component 70 corresponds to the sensor 40 may include:

[0103] 0241: The first optical component 60 is fixedly mounted on the bracket 50 so that the first optical component 60 corresponds to the light source 30; and the second optical component 70 is fixedly mounted on the bracket 50 provided with the first optical component 60 so that the second optical component 70 corresponds to the sensor 40.

[0104] After the bracket 50 and the circuit board 10 are assembled, in some embodiments, the first optical component 60 is first fixedly mounted on the bracket 50 so that the first optical component 60 corresponds to the light source 30. For example, the first optical component 60 is placed in the first mounting hole 531 of the bracket 50, and then the first optical component 60 is aligned and calibrated with the light source 30. For example, in one example, this step requires the first optical component 60 to be aligned and calibrated with the light source 30 by at least one of the AA (Active Alignment, AA) alignment calibrations of translation, tilt, and rotation. After the alignment and calibration, the first optical component 60 is fixedly connected to the bracket 50 by gluing. In this way, the first optical component 60 is fixedly mounted on the bracket 50, and the first optical component 60 corresponds to the light source 30. At this time, the light emitted by the light source 30 can be emitted to the outside of the depth camera module 100 through the first optical component 60. Of course, the first optical component 60 can also be fixedly connected to the bracket 50 in other ways, which is not limited here.

[0105] See also Fig.24In some embodiments, the bracket 50 includes a first side 501 and a second side 502 opposite to each other. After the bracket 50 is assembled with the circuit board 10, the first side 501 is closer to the circuit board 10 than the second side 502. The first optical component 60 includes a collimating lens 61 and a second diffractive optical element 62. The collimating lens 61 is used to collimate the light emitted by the light source 30, and the second diffractive optical element 62 is used to receive the collimated light, and replicate the received light and project it outside the depth camera module 100. At this time, in some embodiments, fixing the first optical component 60 to the bracket 50 includes: fixing the collimating lens 61 and the second diffractive optical element 52 to the first hole of the bracket 50 in sequence along the direction from the first side 501 to the second side 502 of the bracket 50.

[0106] Specifically, along the direction from the first side 501 to the second side 502 of the bracket 50, the collimating lens 61 is placed in the first mounting hole 531, and then the collimating lens 61 is aligned and calibrated with the light source 30. For example, in one example, this step requires the first optical component 60 and the light source 30 to be aligned and calibrated in AA by translation, tilt, and rotation. After the alignment and calibration, the collimating lens 61 is fixedly connected to the bracket 50. Then, along the direction from the first side 501 to the second side 502 of the bracket 50, the second diffractive optical element 62 is assembled into the first mounting hole 531. In this step, tilt and rotation AA alignment and calibration are required. After the alignment and calibration, the second diffractive optical element 62 is fixedly connected to the bracket 50, so that the first optical component 60 is fixedly mounted on the bracket 50. On the one hand, since in this embodiment, the collimating lens 61 and the second diffractive optical element 62 are both assembled into the first mounting hole 531 along the direction from the first side 501 to the second side 502 of the bracket 50, it is more conducive to automated assembly compared to flip-mounting (i.e., assembled into the first mounting hole 531 along the direction from the second side 502 of the bracket 50 to the first side 501); on the other hand, if the bracket 50 provided with the second diffractive optical element 62 and the collimating lens 61 is directly mounted on the circuit board 10, since the second diffractive optical element 62 and the collimating lens 61 have been assembled, when they are aligned and calibrated in combination with the light source 30, the tilt and / or rotation errors between the second diffractive optical element 62 and the collimating lens 61 cannot be eliminated. However, in this embodiment, since the bracket 50 is first assembled with the circuit board 10 provided with the light source 30, and then the collimating lens 61 and the second diffractive optical element 62 are assembled in sequence, compared with directly installing the bracket 50 provided with the second diffractive optical element 62 and the collimating lens 61 on the circuit board 10, it is beneficial to reduce the assembly tolerance of the depth camera module 100.

[0107] Subsequently, the second optical component 70 is fixedly mounted on the bracket 50 provided with the first optical component 60, so that the second optical component 70 corresponds to the sensor 40. For example, the second optical component 70 is placed in the second mounting hole 532 of the bracket 50, and then the second optical component 70 is aligned and calibrated. For example, in one example, this step requires the second optical component 70 to be aligned and calibrated with the sensor 40 by at least one of the AA (Active Alignment, AA) alignment calibration of translation, tilt, and rotation; or, this step requires the second optical component 70 to be aligned and calibrated with the light emission module by at least one of the AA (Active Alignment, AA) alignment calibration of translation, tilt, and rotation, wherein the light emission module is composed of the first optical component 60 and the light source 30. After the alignment and calibration, the second optical component 70 is fixedly connected to the bracket 50 by gluing. In this way, the second optical component 70 is fixedly mounted on the bracket 50, and the second optical component 70 corresponds to the sensor 40, and at least part of the light reflected back by the object to be measured can be incident on the sensor through the second optical component 70. Of course, the second optical component 70 may also be fixedly connected to the bracket 50 in other ways, which is not limited here.

[0108] In some embodiments, the second optical component 70 may be installed first and then the first optical component 60. Fig.25 and Fig.26 In some embodiments, the first optical component 60 and the second optical component 70 are fixed on the bracket 50 so that the first optical component 60 corresponds to the light source 30 and the second optical component 70 corresponds to the sensor 40, and may also include:

[0109] 0242: Fix the second optical component 70 to the bracket 50 so that the second optical component 70 corresponds to the sensor 40; and fix the first optical element to the bracket 50 provided with the second optical component 70 so that the first optical component 60 corresponds to the light source 30.

[0110] After the bracket 50 and the circuit board 10 are assembled, in some embodiments, the second optical component 70 is first fixedly mounted on the bracket 50 so that the second optical component 70 corresponds to the sensor 40. For example, the second optical component 70 is placed in the second mounting hole 532 of the bracket 50, and then the second optical component 70 is aligned and calibrated with the sensor 40. For example, in one example, this step requires the first optical component 60 and the sensor 40 to be aligned and calibrated by at least one of the AA (Active Alignment, AA) alignment calibrations of translation, tilt, and rotation. After the alignment and calibration, the second optical component 70 is fixedly connected to the bracket 50 by gluing. In this way, the second optical component 70 is fixedly mounted on the bracket 50, and the second optical component 70 corresponds to the sensor 40, and the light passing through the second optical component 70 can be incident on the sensor 40. Of course, the second optical component 70 can also be fixedly connected to the bracket 50 in other ways, which is not limited here.

[0111] Subsequently, the first optical component 60 is fixedly mounted on the bracket 50 provided with the second optical component 70, so that the first optical component 60 corresponds to the light source 30. For example, the first optical component 60 is placed in the first mounting hole 531 of the bracket 50, and then the first optical component 60 is aligned and calibrated. For example, in one example, this step requires the first optical component 60 to be aligned and calibrated with the light source 30 by at least one of the AA (Active Alignment, AA) alignment calibration of translation, tilt, and rotation; or, this step requires the first optical component 60 to be aligned and calibrated with the light receiving module by at least one of the AA (Active Alignment, AA) alignment calibration of translation, tilt, and rotation, wherein the light receiving module is composed of the second optical component 70 and the sensor 40. After the alignment and calibration, the first optical component 60 is fixedly connected to the bracket 50 by gluing. In this way, the first optical component 60 is fixedly mounted on the bracket 50, and the first optical component 60 corresponds to the light source 30. At this time, the light emitted by the light source 30 can be emitted through the first optical component 60, and at least part of the light reflected by the object to be measured can be incident on the sensor through the second optical component 70. Of course, the first optical component 60 can also be fixedly connected to the bracket 50 in other ways, which is not limited here.

[0112] It should be noted that when the first optical component 60 includes a collimating lens 61 and a second diffractive optical element 62, the specific installation method of the collimating lens 61 and the second diffractive optical element 62 is the same as the specific installation method of the collimating lens 61 and the second diffractive optical element 62 in the above embodiment, and will not be repeated here.

[0113] In some embodiments, before the first optical component 60 and the second optical component 70 are fixed to the bracket 50, the assembly method further includes: installing a filter 84 in the second mounting hole 532 of the bracket 50, and the filter 84 is used to filter light outside a predetermined wavelength range. Specifically, in some embodiments, before the bracket 50 is fixedly connected to the circuit board 10, the filter 84 can also be installed in the second mounting hole 532 of the bracket 50, and then the bracket 50 with the filter 84 installed is installed on the circuit board 10. Of course, in some embodiments, the filter 84 can also be installed after the bracket 50 is fixedly connected to the circuit board 10 and before the second optical component 70 is installed. This is not limited here, and the filter 84 only needs to be installed to the bracket 50 before the second optical component 70.

[0114] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0115] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, unless otherwise clearly and specifically defined.

[0116] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A depth camera module, characterized in that: The depth camera module is based on the time-of-flight technology to obtain the depth information of the object to be measured, and the depth camera module includes: A circuit board, the circuit board comprising a bottom surface, a first bearing surface and a second bearing surface, wherein a distance from the first bearing surface to the bottom surface is different from a distance from the second bearing surface to the bottom surface; a light source, the light source being carried on the first carrying surface and electrically connected to the circuit board, the light source being used to emit light; A sensor, the sensor is mounted on the circuit board and electrically connected to the circuit board, the sensor is used to receive at least part of the light reflected by the object and convert it into an electrical signal; An integrated bracket, the bracket is mounted on the circuit board and forms a receiving cavity with the circuit board, the receiving cavity is used to accommodate the light source and the sensor; an electronic device, wherein the electronic device is disposed on the second carrying surface, and a distance between the electronic device and the light source is less than a preset distance; and A first optical component and a second optical component are arranged on the bracket, wherein the first optical component is arranged corresponding to the light source and is used to guide the light emitted by the light source to the outside of the depth camera module, and the second optical component is arranged corresponding to the sensor and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

2. The depth camera module according to claim 1, characterized in that: The distance between the center of the sensor and the center of the light source is less than a first preset distance.

3. The depth camera module according to claim 1, characterized in that: A first soldering pad is provided on a side of the light source away from the circuit board, and the first soldering pad is used to be electrically connected to a second soldering pad on the circuit board so as to electrically connect the light source to the circuit board; wherein, in the light emitting direction of the light source, the distance between the first soldering pad and the second soldering pad is greater than or less than the distance between the opposite sides of the light source.

4. The depth camera module according to claim 1, characterized in that: The light source includes a first side and a second side opposite to each other, the second side is mounted on the first bearing surface, and the depth camera module also includes an electrical connection line. One end of the electrical connection line is electrically connected to the first side, and the other end is electrically connected to the second pad located on the first bearing surface; or One end of the electrical connection line is electrically connected to the first side, and the other end is electrically connected to the second pad located on the second bearing surface; or One end of the electrical connection line is electrically connected to the first side, and the other end is electrically connected to a second pad located on a connection surface, wherein the connection surface connects the first bearing surface and the second bearing surface.

5. The depth camera module according to claim 1, characterized in that: The bracket includes a first support member, a second support member, and a connecting component connecting the first support member and the second support member, wherein the first support member and the second support member are respectively fixed to the circuit board, and the connecting component includes: The first mounting hole is used to mount the first optical component and The second mounting hole is used to mount the second optical component.

6. The depth camera module according to claim 1, characterized in that: The light emitted by the light source forms a planar pattern, and the first optical component includes: A first diffractive optical element is provided with an integrated microstructure, and the integrated microstructure is capable of collimating the planar pattern and replicating the planar pattern to emit a speckle pattern outside the depth camera module.

7. The depth camera module according to claim 1, characterized in that: The first optical component comprises: a collimating lens, used for collimating the light emitted by the light source; and The second diffractive optical element is used to receive the collimated light, and replicate the received light and then project it outside the depth camera module.

8. The depth camera module according to claim 1, characterized in that: The second optical component comprises: A phase type lens is used to receive at least part of the light reflected by the object and adjust the phase of the light emitted from the phase type lens to the sensor.

9. The depth camera module according to claim 1, characterized in that: The depth camera module also includes a filter, which is arranged between the second optical component and the sensor, and is used to filter light outside a predetermined wavelength range.

10. An electronic device, characterized in that: include: case; and The depth camera module described in any one of claims 1-9, wherein the shell is combined with the depth camera module.

11. A shooting component, characterized in that: include: A two-dimensional camera module, used for acquiring two-dimensional images; and The depth camera module described in any one of claims 1-9 is used to obtain a depth information image, and the distance between the center of the sensor of the depth camera module and the center of the two-dimensional camera module is less than a second preset distance.

12. The shooting assembly according to claim 11, characterized in that: When the shooting component is working, the temperature of the depth camera module is lower than a preset temperature.

13. An electronic device, characterized in that: include: case; and The shooting assembly according to claim 11 or 12, wherein the shell is combined with the shooting assembly.

14. A method for assembling a depth camera module, characterized in that: The depth camera module is based on the time-of-flight technology to obtain the depth information of the object to be measured. The assembly method includes: A circuit board is provided, the circuit board comprising a bottom surface, a first bearing surface and a second bearing surface, wherein a distance from the first bearing surface to the bottom surface is different from a distance from the second bearing surface to the bottom surface; A light source is mounted on the first bearing surface and electrically connected to the circuit board, the light source is used to emit light, a sensor is mounted on the second bearing surface and electrically connected to the circuit board, the sensor is used to receive at least part of the light reflected by the object and convert it into an electrical signal; the depth camera module includes an electronic device, the electronic device is arranged on the second bearing surface, and the distance between the electronic device and the light source is less than a preset distance; The first optical component is fixedly mounted on the integrated bracket; The bracket on which the first optical component is installed is fixedly connected to the circuit board, and the bracket and the circuit board form a receiving cavity, and the light source and the sensor are accommodated in the receiving cavity, so that the first optical component corresponds to the light source, and the first optical component is used to guide the light emitted by the light source to the outside of the depth camera module; The second optical component is fixedly mounted on the bracket so that the second optical component corresponds to the sensor, and the second optical component is used to receive at least part of the light reflected by the object and guide the light to the sensor.

15. A method for assembling a depth camera module, characterized in that: The depth camera module is based on the time-of-flight technology to obtain the depth information of the object to be measured. The assembly method includes: A circuit board is provided, the circuit board comprising a bottom surface, a first bearing surface and a second bearing surface, wherein a distance from the first bearing surface to the bottom surface is different from a distance from the second bearing surface to the bottom surface; A light source is mounted on the first bearing surface and electrically connected to the circuit board, the light source is used to emit light, a sensor is mounted on the second bearing surface and electrically connected to the circuit board, the sensor is used to receive at least part of the light reflected by the object and convert it into an electrical signal; the depth camera module includes an electronic device, the electronic device is arranged on the second bearing surface, and the distance between the electronic device and the light source is less than a preset distance; The integrated bracket is fixedly connected to the circuit board, the bracket and the circuit board form a receiving cavity, and the light source and the sensor are accommodated in the receiving cavity; The first optical component and the second optical component are fixed on the bracket so that the first optical component corresponds to the light source, and the second optical component corresponds to the sensor, the first optical component is used to guide the light emitted by the light source to the outside of the depth camera module, and the second optical component is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

16. The assembly method according to claim 15, characterized in that: The step of fixing the first optical component and the second optical component on the bracket so that the first optical component corresponds to the light source and the second optical component corresponds to the sensor comprises: The first optical component is fixedly mounted on the bracket so that the first optical component corresponds to the light source; and the second optical component is fixedly mounted on the bracket provided with the first optical component so that the second optical component corresponds to the sensor; or The second optical component is fixed to the bracket so that the second optical component corresponds to the sensor; and the first optical component is fixedly installed on the bracket provided with the second optical component so that the first optical component corresponds to the light source.

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