Grinding device and driving method of a grinding device

Abstract

This invention provides a grinding apparatus and a method for driving the grinding apparatus, which can prevent grinding of workpieces with unsuitable tapes attached. The thickness of the workpiece unit is determined by measurement from a measuring unit after it has been removed from the cassette and before it has been fed into the chuck table. Here, the thickness of the workpiece unit is the sum of the thicknesses of the workpiece and the tape attached to it. Therefore, based on this measurement, it is possible to determine whether the tape attached to the workpiece has the desired thickness, i.e., whether it is the desired type. In other words, it is possible to determine whether the workpiece unit is a grinding target before it is fed into the chuck table. As a result, grinding of workpieces with unsuitable tapes attached can be prevented.

Description

Technical Field

[0001] This invention relates to a grinding apparatus and a method for driving the grinding apparatus. Background Technology

[0002] Chips, such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations), are indispensable components in various electronic devices, including mobile phones and personal computers. Such chips are manufactured, for example, by thinning a wafer with numerous devices formed on its front side and then dividing it into regions containing each device.

[0003] As a method for thinning wafers, one example is grinding using a grinding apparatus having: a grinding wheel having a plurality of grinding tools arranged discretely in a ring; and a chuck stage for attracting and holding the workpiece. In the case of thinning wafers using such a grinding apparatus, a tape (protective tape) is often attached to the front side of the wafer before grinding (see, for example, Patent Document 1).

[0004] Furthermore, while the chuck stage holds the wafer with the attached tape on its front side, the back side of the wafer is ground using multiple grinding tools to thin the wafer. By attaching the tape to the front side of the wafer on which the device is formed, the impact applied to the device during wafer grinding can be mitigated, thus preventing device breakage.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2007-288031

[0006] The aforementioned tapes vary in thickness and bonding strength depending on their type. Therefore, tapes for bonding to workpieces such as wafers are used differently depending on the grinding conditions. Furthermore, in a grinding apparatus, the workpiece (workpiece unit) with the desired tape bonded to it is transported from a cassette to a chuck table for grinding.

[0007] Here, a specialized device is used to attach the belt to the workpiece, but the replacement or replenishment of the belt, which is a consumable, is done manually by the operator. Therefore, there is a concern about attaching the belt to the workpiece when the belt is not suitable for the device.

[0008] Additionally, sometimes the operator manually moves the workpiece units into the storage box and / or the storage box for the workpiece units into the grinding unit. Therefore, there is concern about moving the storage box for workpieces with unsuitable straps attached into the grinding unit.

[0009] Furthermore, even different types of belts often have similar colors and textures. Therefore, before the grinding machine grinds the workpiece, it is difficult for the operator to identify the type of belt by observing or touching the belt attached to the workpiece. Summary of the Invention

[0010] In view of these aspects, the object of the present invention is to provide a grinding apparatus that can prevent grinding of workpieces with unsuitable tapes attached.

[0011] According to one aspect of the present invention, a grinding apparatus is provided, comprising: a cassette stage for holding a cassette for storing a workpiece unit with a strip attached to one side of the workpiece; a chuck table for holding the workpiece unit; a conveying mechanism for conveying the workpiece unit between the cassette and the chuck table; a first measuring unit for measuring a value of the thickness of the workpiece unit held by the conveying mechanism or a value used in calculating the thickness of the workpiece unit; a grinding unit for grinding the workpiece unit held by the chuck table; and a control unit for controlling each component, the control unit having a determination unit that determines whether the workpiece unit is a grinding object based on a thickness value of the workpiece unit obtained by the first measuring unit after it has been removed from the cassette and before it has been moved into the chuck table.

[0012] In another embodiment of the invention, the control unit preferably has a storage section for storing the respective thickness values ​​of the workpiece and the tape. The determination section compares the value obtained by adding the respective thickness values ​​of the workpiece and the tape stored in the storage section with the thickness value of the workpiece unit obtained based on the measurement performed by the first measuring unit, thereby determining whether the desired tape is pasted on the workpiece.

[0013] In another embodiment of the invention, the first measuring unit preferably includes: a first non-contact distance measuring device disposed on one side of the workpiece unit held by the conveying mechanism, for measuring the distance between the workpiece unit and one side of the workpiece unit; and a second non-contact distance measuring device disposed on the other side of the back side of one side of the workpiece unit held by the conveying mechanism, for measuring the distance between the workpiece unit and the other side of the workpiece unit.

[0014] In another embodiment of the invention, the grinding apparatus preferably further includes a second measuring unit for measuring the thickness of the workpiece held by the chuck table or the value used in calculating the thickness of the workpiece. The determination unit compares the thickness of the workpiece obtained based on the measurement performed by the second measuring unit with the thickness of the workpiece obtained based on the measurement performed by the first measuring unit to determine whether the second measuring unit is operating normally.

[0015] According to another aspect of the present invention, a method for driving a grinding apparatus is provided, the grinding apparatus comprising: a cassette stage for holding a cassette for storing a workpiece unit with a strip attached to one side of the workpiece; a chuck stage for holding the workpiece unit; a conveying mechanism for conveying the workpiece unit between the cassette and the chuck stage; a first measuring unit for measuring a value of the thickness of the workpiece unit held by the conveying mechanism or a value used in calculating the thickness of the workpiece unit; a grinding unit for grinding the workpiece unit held by the chuck stage; and a control unit for controlling the constituent elements, wherein the method for driving the grinding apparatus includes the following steps: a first removal step, wherein the conveying mechanism... The process involves: a first measurement step, in which the first measurement unit measures the thickness of the workpiece unit removed from the box via the first removal step, or the value used in calculating the thickness of the workpiece unit; a first determination step, in which the control unit determines whether the workpiece unit is a grinding object based on the thickness value of the workpiece unit obtained from the measurement in the first measurement step; and a transfer step, in which, if the workpiece unit is determined to be a grinding object via the first determination step, the transfer mechanism transfers the workpiece unit onto the chuck table, and if the workpiece unit is determined not to be a grinding object via the first determination step, the transfer mechanism transfers the workpiece unit back into the box.

[0016] In another embodiment of the invention, the grinding apparatus preferably further includes a second measuring unit for measuring the thickness of the workpiece held by the chuck table or a value used in calculating the thickness of the workpiece. The driving method of the grinding apparatus includes the following steps: a grinding step in which the grinding unit grinds the workpiece that has been fed onto the chuck table via the loading step; and a second measuring step in which the second measuring unit measures the thickness of the workpiece after grinding via the grinding step or a value used in calculating the thickness of the workpiece. The process includes a removal step where the conveying mechanism removes the workpiece unit whose thickness has been measured in the second measurement step from the chuck table; a third measurement step where the first measurement unit measures the thickness of the workpiece unit removed from the chuck table in the second removal step, or the value used in calculating the thickness of the workpiece unit; and a second judgment step where the control unit compares the thickness of the workpiece unit obtained based on the measurement in the second measurement step with the thickness of the workpiece unit obtained based on the measurement in the third measurement step, thereby determining whether the second measurement unit is operating normally.

[0017] Alternatively, in another aspect of the invention, the grinding apparatus preferably further comprises a second measuring unit for measuring the thickness of the workpiece held by the chuck table or the value used in calculating the thickness of the workpiece. The driving method of the grinding apparatus comprises the following steps: a fourth measuring step, in which the second measuring unit measures the thickness of the workpiece or the value used in calculating the thickness of the workpiece before grinding the workpiece that has been moved onto the chuck table by the loading step; and a third determining step, in which the control unit compares the thickness of the workpiece obtained based on the measurement of the fourth measuring step with the thickness of the workpiece obtained based on the measurement of the first measuring step, thereby determining whether the second measuring unit is operating normally.

[0018] In this invention, the thickness of the workpiece unit after it has been removed from the box and before it has been moved into the chuck worktable can be determined based on the measurement of the first measuring unit. Here, the thickness of the workpiece unit is the sum of the thicknesses of the workpiece and the tape adhered to it.

[0019] Therefore, based on this measurement, it is possible to determine whether the tape adhered to the workpiece has the desired thickness, i.e., whether it is the desired type. In other words, it is possible to determine whether a workpiece unit is a grinding target before it is loaded onto the chuck table. As a result, grinding of workpieces with unsuitable tapes can be prevented. Attached Figure Description

[0020] Figure 1 This is a perspective view schematically showing an example of a grinding apparatus.

[0021] Figure 2 This is a perspective view schematically showing an example of a workpiece unit.

[0022] Figure 3 This is a side view schematically illustrating an example of a measuring unit.

[0023] Figure 4 This is a top view schematically showing an example of the structure of the turntable and its surroundings.

[0024] Figure 5 This is a block diagram schematically illustrating an example of a control unit.

[0025] Figure 6 This is a flowchart illustrating an example of a driving method for a grinding apparatus.

[0026] Figure 7 This is a flowchart illustrating another example of a driving method for a grinding device.

[0027] Figure 8 This is a flowchart illustrating another example of a driving method for a grinding device.

[0028] Label Explanation

[0029] 11: Workpiece unit (11a: front, 11b: back); 13: Workpiece (13a: front, 13b: back); 15: Pre-defined dividing line; 17: Device; 19: Belt (19a: side not attached to the workpiece); 2: Grinding device; 4: Base (4a: opening); 6: Conveying mechanism; 8a, 8b: Box; 10a, 10b: Box mounting stage; 12: Measuring unit; 14: Support; 16: Upper surface measuring device (16a: projection part, 16b: light receiving part); 18: Lower surface measuring device (18a: projection part, 18b: light receiving part); 20: Position adjustment Mechanism; 22: Conveying mechanism; 24: Turntable; 26: Chuck worktable (26a: Holding surface); 28: Support structure; 30: Z-axis moving mechanism; 32: Guide rail; 34: Moving plate; 36: Lead screw shaft; 38: Motor; 40: Fixture; 42: Grinding unit; 44: Spindle housing; 46: Spindle; 48: Mounting base; 50a: First grinding wheel; 50b: Second grinding wheel; 52: Measuring unit; 54: Conveying mechanism; 56: Cleaning unit; 58: Control unit; 60: Processing unit; 62: Storage unit; 64: Conveying unit; 66: Measuring unit; 68: Grinding unit; 70: Judgment unit. Detailed Implementation

[0030] The embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view schematically illustrating an example of the grinding apparatus of the present invention. Additionally, Figure 1 The X-axis (front-back direction) and Y-axis (left-right direction) shown are perpendicular to each other on the horizontal plane. In addition, the Z-axis (up-down direction) is perpendicular to the X-axis and Y-axis (vertical direction).

[0031] Figure 1 The grinding apparatus 2 shown has a base 4 that supports various components. An opening 4a is formed on the front end side of the upper surface of the base 4, and a conveying mechanism 6 is disposed within the opening 4a. The conveying mechanism 6 is, for example, a robotic arm with multiple joints. Figure 2 This is a perspective view schematically showing an example of a workpiece unit being transported by a conveying mechanism 6.

[0032] Figure 2 The workpiece unit 11 shown has a disk-shaped workpiece 13. The workpiece 13 is, for example, a wafer formed from a semiconductor material such as silicon (Si). The front side 13a of the workpiece 13 is divided into multiple regions by multiple intersecting predetermined dividing lines 15, and devices such as ICs or LSIs are formed in each region.

[0033] Furthermore, there are no restrictions on the material, shape, structure, and size of the workpiece 13. For example, the workpiece 13 can be a substrate formed from other semiconductor materials, ceramics, resins, and metals. Similarly, there are no restrictions on the type, quantity, shape, structure, size, and arrangement of the devices 17.

[0034] Additionally, a film-like strip 19 is adhered to the front side 13a of the workpiece 13. The film-like strip 19 has a diameter approximately equal to that of the workpiece 13. The strip 19 is formed of resin, for example, and protects the device 17 by mitigating the impact applied to the front side 13a when the back side 13b of the workpiece 13 is being ground.

[0035] Furthermore, in this embodiment, while holding one side 11a (the side 19a of the workpiece unit 11 that is not attached to the workpiece 13) of the workpiece unit 11, grinding is performed on the other side 11b (the back side 13b of the workpiece 13) of the workpiece 11, which is the back side of the workpiece unit 11a.

[0036] exist Figure 1 The opening 4a shown has a box-holding platform 10a, 10b in front of it for holding and storing boxes 8a, 8b of the workpiece unit 11. Furthermore, the conveying mechanism 6 can not only hold and convey the workpiece unit 11, but also flip the workpiece unit 11 up and down.

[0037] In addition, a measuring unit (first measuring unit) 12 is provided behind the opening 4a for calculating the thickness of the workpiece unit 11 held by the conveying mechanism 6. Figure 3 This is a schematic side view of the measuring unit 12.

[0038] The measuring unit 12 includes: a prism-shaped support portion 14 extending along the Z-axis direction; and prism-shaped upper surface measuring devices 16 and lower surface measuring devices 18, which are fixed to the front surface side (conveyor mechanism 6 side) of the support portion 14 and extend along the X-axis direction. The upper surface measuring devices 16 and lower surface measuring devices 18 are separated in the Z-axis direction. Furthermore, the upper surface measuring devices 16 and lower surface measuring devices 18 are non-contact distance measuring devices that use a laser beam to measure the distance to the object being measured.

[0039] Specifically, the upper surface measuring device 16 includes: a light-projecting section 16a that projects a laser beam downwards; and a light-receiving section 16b that receives the laser beam reflected from the upper surface of the object being measured (e.g., the other surface 11b of the workpiece unit 11). Furthermore, the upper surface measuring device 16 measures the distance between itself and the upper surface of the object being measured based on factors such as the phase difference between the projected laser beam and the received laser beam.

[0040] Similarly, the lower surface measuring device 18 includes a light-projecting section 18a that projects a laser beam upwards, and a light-receiving section 18b that receives the laser beam reflected from the lower surface of the object being measured (e.g., one surface 11a of the workpiece unit 11). Furthermore, the lower surface measuring device 18 measures the distance between itself and the lower surface of the object being measured based on factors such as the phase difference between the projected laser beam and the received laser beam.

[0041] Additionally, the projection section 16a includes, for example, a light source that projects light of a wavelength reflected from the upper surface of the object being measured (e.g., the back surface 13b of the workpiece 13); and a lens and / or a reflector that guides the light from the light source toward the object being measured. Similarly, the projection section 18a includes, for example, a light source that projects light of a wavelength reflected from the lower surface of the object being measured (e.g., the surface 19a of the strip 19); and a lens and / or a reflector that guides the light from the light source toward the object being measured.

[0042] Therefore, the wavelength of the light projected from the projection section 16a can be different from the wavelength of the light projected from the projection section 18a. Additionally, the light-receiving sections 16b, 16b, include, for example, a lens and / or a reflector that guides the light reflected by the object being measured toward the light-receiving element; and a light-receiving element such as a CMOS image sensor that detects the light reflected by the object being measured.

[0043] exist Figure 1A position adjustment mechanism 20 for adjusting the position of the workpiece unit 11 is provided at the oblique rear of the opening 4a shown (to the side of the measuring unit 12). The position adjustment mechanism 20 has, for example, a disc-shaped stage and a plurality of pins disposed around the stage.

[0044] By moving multiple pins radially along the table, for example, the center of the workpiece unit 11, which has been moved from the box 8a by the conveying mechanism 6 and placed on the table of the position adjustment mechanism 20, is aligned in a predetermined position in the X-axis and Y-axis directions. Furthermore, in this embodiment, the workpiece unit 11 is placed on the table of the position adjustment mechanism 20 with its back side 11b facing upwards.

[0045] In addition, in this embodiment, the workpiece unit 11 that is moved out of the box 8a by the conveying mechanism 6 is moved into the position adjustment mechanism 20 after the outer periphery of the workpiece unit 11 is positioned between the upper surface side measuring device 16 and the lower surface side measuring device 18 of the measuring unit 12 and the thickness value of the workpiece unit 11 is calculated.

[0046] A conveying mechanism 22 is provided behind the measuring unit 12 to hold and move the workpiece unit 11 backward. The conveying mechanism 22 includes a holding pad that attracts and holds the upper surface (back side 11b in this embodiment) of the workpiece unit 11; and an arm connected to the holding pad. The conveying mechanism 22 rotates the holding pad by means of the arm, thereby moving the workpiece unit 11, whose position has been adjusted by the position adjustment mechanism 20, backward.

[0047] A disc-shaped turntable 24 is provided behind the conveying mechanism 22. The turntable 24 is connected to a rotary drive source (not shown) such as an electric motor and rotates about a rotation axis that is approximately parallel to the Z-axis. Three chuck worktables 26 are provided on the upper surface of the turntable 24 to hold the workpiece unit 11.

[0048] The three chuck worktables 26 are arranged at approximately equal intervals along the circumference of the rotary table 24. Furthermore, there is no limitation on the number of chuck worktables 26 provided on the rotary table 24.

[0049] Figure 4 This is a schematic top view showing the structure of the turntable 24 and its surroundings. Additionally, in Figure 4 In the diagram, for ease of explanation, some elements are represented by dashed lines. The conveying mechanism 22 moves the workpiece unit 11 held by the holding pad into the inlet / outlet area A (see reference 22). Figure 4 ) chuck worktable 26.

[0050] Turntable 24, for example, in Figure 1 and Figure 4Rotate in the direction indicated by the middle arrow to move each chuck table 26 sequentially to the loading / unloading area A, the rough grinding area B, and the fine grinding area C. Each chuck table 26 is connected to a rotary drive source (not shown) such as an electric motor and rotates about a rotation axis that is approximately parallel to the Z-axis.

[0051] Each chuck worktable 26 has, for example, a disc-shaped frame made of a metal material such as stainless steel. A recess with a circular opening at the top is formed on the upper surface of the frame, and a disc-shaped perforated plate made of ceramic or the like is fixed in the recess.

[0052] The upper surface of the chuck table 26 is shaped like the side of a cone that protrudes slightly from the center to the outer edge, and functions as a holding surface 26a for holding the lower surface (front 11a in this embodiment) of the workpiece unit 11. That is, each chuck table 26 has a holding surface 26a for holding the workpiece unit 11 at its upper part.

[0053] The holding surface 26a is connected to a suction source (not shown) such as a vacuum pump via a suction path (not shown) formed inside the chuck table 26. The lower surface of the workpiece unit 11, which is brought into the chuck table 26, is attracted by the negative pressure acting on the suction source of the holding surface 26a.

[0054] like Figure 1 As shown, columnar support structures 28 are respectively provided behind the rough grinding area B and the fine grinding area C (behind the rotary table 24). A Z-axis moving mechanism 30 is provided on the front surface side of each support structure 28. Each Z-axis moving mechanism 30 has a pair of guide rails 32 that are approximately parallel to the Z-axis direction, and a moving plate 34 is slidably mounted on the guide rails 32.

[0055] A nut (not shown) constituting a ball screw is fixed to the rear surface (back side) of each movable plate 34, and a screw shaft 36, which is substantially parallel to the guide rail 32, is rotatably connected to the nut. A motor 38 is connected to one end of the screw shaft 36. The screw shaft 36 is rotated by the motor 38, thereby moving the movable plate 34 along the guide rail 32 in the Z-axis direction.

[0056] A fixing device 40 is provided on the front surface (front side) of each movable plate 34. A grinding unit 42 for grinding the workpiece unit 11 is supported on each fixing device 40. Each grinding unit 42 has a spindle housing 44 fixed to the fixing device 40.

[0057] Each spindle housing 44 houses a spindle 46 that serves as a rotation axis approximately parallel to the Z-axis. The lower end of each spindle 46 protrudes from the lower end face of the spindle housing 44. A disc-shaped mounting base 48 is fixed to the lower end of each spindle 46.

[0058] A first grinding wheel 50a for rough grinding is mounted on the lower surface of the mounting base 48 of the grinding unit 42 on the B side of the rough grinding area. The first grinding wheel 50a for rough grinding has a first grinding wheel base formed of a metal such as stainless steel or aluminum with a diameter approximately the same as that of the mounting base 48.

[0059] On the lower surface of the first grinding wheel base, a plurality of first grinding tools are arranged in a ring, which are formed by fixing abrasive grains such as diamond suitable for rough grinding with a bonding agent such as vitrification or resinification. In addition, a first rotary drive source (not shown) such as an electric motor connected to the upper end of the spindle 46 is housed in the spindle housing 44 of the grinding unit 42 on the rough grinding area B side.

[0060] Powered by the first rotary drive source, the first grinding wheel 50a rotates together with the spindle 46. A liquid supply nozzle (not shown) is provided next to the first grinding wheel 50a to supply a liquid (grinding fluid) such as pure water to the part (machining point) where the workpiece unit 11 contacts the first grinding tool. However, instead of this liquid supply nozzle, or together with the liquid supply nozzle, a liquid supply port for supplying liquid may be provided on the first grinding wheel 42a.

[0061] Similarly, a second grinding wheel 50b for fine grinding is mounted on the lower surface of the mounting base 48 of the grinding unit 42 on the fine grinding area C side. The second grinding wheel 50b for fine grinding has a second grinding wheel base formed of a metal such as stainless steel or aluminum with a diameter approximately the same as that of the mounting base 48.

[0062] On the lower surface of the second grinding wheel base, a plurality of second grinding tools are arranged in a ring, which are formed by fixing abrasive grains such as diamond suitable for fine grinding with a bonding agent such as vitrification or resinification. In addition, a second rotary drive source (not shown) such as an electric motor connected to the upper end of the spindle 46 is housed in the spindle housing 44 of the grinding unit 42 on the fine grinding area C side.

[0063] Powered by the second rotary drive source, the second grinding wheel 50b rotates together with the spindle 46. A liquid supply nozzle (not shown) is provided next to the second grinding wheel 50b to supply a liquid (grinding fluid) such as pure water to the part (machining point) where the workpiece unit 11 contacts the second grinding wheel. However, instead of this liquid supply nozzle, or together with the liquid supply nozzle, a liquid supply port for supplying liquid may be provided on the second grinding wheel 50b.

[0064] The workpiece unit 11 held by each chuck table 26 is ground sequentially by the two sets of grinding units 42 described above. Specifically, the workpiece unit 11 held by the chuck table 26 in the rough grinding area B is ground using the grinding unit 42 on the rough grinding area B side, and the workpiece unit 11 held by the chuck table 26 in the fine grinding area C is ground using the grinding unit 42 on the fine grinding area C side.

[0065] like Figure 1 As shown, a measuring unit (second measuring unit) 52 for calculating the thickness of the workpiece unit 11 after fine grinding is provided in front of the grinding unit 42 on the C side of the fine grinding area.

[0066] The measuring unit 52 includes a first measuring section whose front end can contact the upper surface of the object being measured (in this embodiment, the back surface 11b of the workpiece unit 11); and a second measuring section whose front end can contact the holding surface 26a of the chuck table 26. Furthermore, the first and second measuring sections respectively measure the position (height) of the front end in the vertical direction. That is, the second measuring unit 52 includes two contact-type position (height) measuring devices.

[0067] A conveying mechanism 54 is provided in front of the loading / unloading area A and to the side of the conveying mechanism 22 to hold and convey the ground workpiece unit 11 forward. The conveying mechanism 54 includes: a holding pad that attracts and holds the upper surface (back surface 11b in this embodiment) of the workpiece unit 11; and an arm connected to the holding pad. The conveying mechanism 54 rotates the holding pad by means of the arm, thereby conveying the ground workpiece unit 11 forward from the chuck table 26.

[0068] A cleaning unit 56 is provided in front of the conveying mechanism 54 to clean the workpiece unit 11 that is moved out by the conveying mechanism 54. The cleaning unit 56 includes, for example, a rotary table that rotates while holding the lower surface (front 11a in this embodiment) of the workpiece unit 11; and a nozzle that sprays cleaning fluid onto the upper surface (back 11b in this embodiment) of the workpiece unit 11 held by the rotary table.

[0069] The workpiece unit 11, cleaned using the cleaning unit 56, is transported via the conveying mechanism 6. For example, after the thickness of the workpiece unit 11 is calculated by positioning its outer periphery between the upper surface measuring device 16 and the lower surface measuring device 18 of the measuring unit 12, it is transported into the box 8b. Alternatively, the workpiece unit 11 can be directly transported from the cleaning unit 56 into the box 8b.

[0070] In addition, the grinding apparatus 2 may have components other than those described above. For example, the grinding apparatus 2 may have a touch panel, which consists of a touch sensor that inputs instructions from the operator to the grinding apparatus 2 and a display that outputs various information to the operator.

[0071] The operation of each component of the grinding device 2 is controlled by a control unit built into the grinding device 2. Figure 5 This is a block diagram schematically illustrating an example of a control unit built into a grinding device. Figure 5 The control unit 58 shown includes, for example, a processing unit 60 that generates signals for controlling the components of the grinding apparatus 2; and a storage unit 62 that stores various information (data and programs, etc.) used in the processing unit 60.

[0072] In addition, the storage unit 62 may store, for example, the values ​​of the respective thicknesses of the workpiece 13 and the belt 19 constituting the workpiece unit 11 which is the grinding object in the grinding apparatus 2, as well as the value of the interval between the upper surface side measuring device 16 and the lower surface side measuring device 18 of the measuring unit 12.

[0073] The functions of the processing unit 60 are specifically implemented by a CPU (Central Processing Unit) or the like, which reads and executes programs stored in the storage unit 62. Furthermore, the functions of the storage unit 62 are specifically implemented by at least one of semiconductor memories such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and NAND flash memory, as well as magnetic storage devices such as HDD (Hard Disk Drive).

[0074] The processing unit 60 includes a conveying unit 64, a measuring unit 66, a grinding unit 68, and a judgment unit 70. In the processing unit 60, these functional units perform processing independently, either simultaneously or concurrently. Alternatively, the processing unit 60 may include functional units other than the conveying unit 64, measuring unit 66, grinding unit 68, and judgment unit 70. For example, the processing unit 60 may include a display unit that controls the display of a monitor, which is a component of the aforementioned touch panel.

[0075] The conveying unit 64 controls the operation of the conveying mechanism 6, the conveying mechanism 22, and the conveying mechanism 54. For example, the conveying unit 64 controls the operation of the conveying mechanism 6 in a manner that positions the outer periphery of the workpiece unit 11 between the upper surface measuring device 16 and the lower surface measuring device 18 of the measuring unit 12 (measurement position).

[0076] The measuring unit 66 controls the operation of the measuring unit 12 and the measuring unit 52. For example, the measuring unit 66 controls the operation of the measuring unit 12 in a manner that measures the distance between the upper surface of the workpiece unit 11, whose outer periphery is positioned at the above-mentioned measuring position, and the upper surface measuring device 16 (first distance), and the distance between the lower surface of the workpiece unit 11 and the lower surface measuring device 18 (second distance).

[0077] The grinding unit 68 controls the movement of the rotary table 24, the chuck table 26, the grinding unit 42, and their associated components. For example, the grinding unit 68 controls the movement of these components in a manner that grinds the workpiece unit 11 held by the chuck table 26.

[0078] The determination unit 70 calculates the thickness of the workpiece unit 11 based on the measurements performed by the measurement unit 12. For example, the determination unit 70 calculates the thickness of the workpiece unit 11 by subtracting the first distance and the second distance from the value of the distance between the upper surface side measuring device 16 and the lower surface side measuring device 18 of the measurement unit 12 stored in the storage unit 62.

[0079] Furthermore, the determination unit 70 determines whether the workpiece unit 11 is a grinding object based on the thickness value of the workpiece unit 11 obtained from the measurement performed by the measurement unit 12. For example, the determination unit 70 compares the value obtained by adding the thickness values ​​of the workpiece 13 and the tape 19 stored in the storage unit 62 with the calculated thickness value of the workpiece unit 11 to determine whether the desired tape 19 is pasted on the workpiece 13.

[0080] Furthermore, if the determination unit 70 determines that the desired tape 19 is attached to the workpiece 13, it determines that the workpiece unit 11 is the grinding object; if it determines that the desired tape 19 is not attached to the workpiece 13, it determines that the workpiece unit 11 is not the grinding object.

[0081] Figure 6 This is a flowchart illustrating an example of a driving method for the grinding apparatus 2. In this driving method, the conveying mechanism 6 first removes the workpiece unit 11 from the box 8a placed on the box mounting stage 10a (removal step: S1). Furthermore, the conveying mechanism 6 positions the workpiece unit 11 at the aforementioned measurement position.

[0082] Next, the measurement unit 12 uses the values ​​described above, namely the first distance and the second distance, in calculating the thickness of the workpiece unit 11 (measurement step: S2). Furthermore, the determination unit 70 of the control unit 58 calculates the thickness of the workpiece unit 11 as described above.

[0083] Next, the determination unit 70 determines whether the workpiece unit 11 is a grinding object based on the thickness value of the workpiece unit 11 (determination step: S3). Specifically, the determination unit 70 determines whether the workpiece unit 11 is a grinding object based on whether the desired strip 19 is attached to the workpiece 13, as described above.

[0084] Furthermore, if it is determined that the workpiece unit 11 is a grinding object (S3: Yes), the workpiece unit 11 is moved into the chuck table 26 (moving step: S4). Specifically, the conveying mechanism 6 moves the workpiece unit 11 into the position adjustment mechanism 20, and the conveying mechanism 22 moves the workpiece unit 11, whose position has been adjusted by the position adjustment mechanism 20, out of the position adjustment mechanism 20 and into the chuck table 26.

[0085] If the workpiece unit 11 is moved into the chuck table 26, the workpiece unit 11 is ground (grinding step: S5). On the other hand, if it is determined that the workpiece unit 11 is not a grinding object (S3: No), the workpiece unit 11 is moved back into the box 8a (moving in step: S6).

[0086] As described above, in the grinding apparatus 2 and its driving method, the thickness of the workpiece unit 11 after being removed from the box 8a and before being moved into the chuck table 26 can be determined based on the measurement of the measuring unit 12. Here, the thickness of the workpiece unit 11 is the sum of the thicknesses of the workpiece 13 and the respective thicknesses of the strip 19 attached to the workpiece 13.

[0087] Therefore, based on this measurement, it is possible to determine whether the tape 19 adhered to the workpiece 13 has the desired thickness, i.e., whether it is the desired type. In other words, it is possible to determine whether the workpiece unit 11 is a grinding object before it is loaded onto the chuck table 26. As a result, grinding of the workpiece 13 with an unsuitable tape 19 adhered to it can be prevented.

[0088] In addition, the grinding apparatus 2 can also confirm whether the measuring unit (second measuring unit) 52 is operating normally. Figure 7 This is a flowchart schematically illustrating an example of a driving method for the grinding apparatus 2 that performs such verification. In this driving method, the workpiece unit 11 held by the chuck table 26 is first ground (grinding step: S11).

[0089] Next, the measurement unit 52 uses the values ​​used in the calculation of the thickness of the workpiece unit 11 held by the chuck table 26, namely the position (height) of the upper surface of the workpiece unit 11 in the vertical direction and the position (height) of the holding surface 26a of the chuck table 26 (measurement step: S12).

[0090] Furthermore, the determination unit 70 calculates the thickness of the workpiece unit 11 based on the measurement of the measurement unit 52. Specifically, the determination unit 70 calculates the difference between the position (height) of the upper surface of the workpiece unit 11 and the position (height) of the holding surface 26a of the chuck table 26 as the thickness of the workpiece unit 11.

[0091] Furthermore, the measurement by the measuring unit 52 can be performed continuously from before grinding the workpiece unit 11 until after grinding. In this case, the display, which is a component of the aforementioned touch panel, can be controlled to continuously notify the operator of the thickness, etc., of the workpiece unit 11 during grinding.

[0092] Next, the workpiece unit 11 is removed from the chuck worktable 26 (removal step: S13). Specifically, the conveying mechanism 54 moves the workpiece unit 11 into the cleaning unit 56, and the conveying mechanism 6 removes the workpiece unit 11, which has been cleaned by the cleaning unit 56, from the cleaning unit 56 and positions it at the aforementioned measurement position.

[0093] Next, the measurement unit (first measurement unit) 12 uses the values ​​described above, namely the first distance and the second distance, to calculate the thickness of the workpiece unit 11 (measurement step: S14). Furthermore, the determination unit 70 of the control unit 58 calculates the thickness of the workpiece unit 11 as described above.

[0094] Next, the determination unit 70 compares the thickness value of the workpiece unit 11 obtained by the measurement of the measurement unit 52 with the thickness value of the workpiece unit 11 obtained by the measurement of the measurement unit 12, and determines whether the measurement unit 52 is operating normally (determination step: S15).

[0095] For example, if the two values ​​are equal, the determination unit 70 determines that the measurement unit 52 is operating normally; if the two values ​​are different, the determination unit 70 determines that the measurement unit 52 is not operating normally. Alternatively, the determination unit 70 may determine that the measurement unit 52 is operating normally if the difference between the two values ​​is below a predetermined threshold, and determine that the measurement unit 52 is not operating normally if the difference between the two values ​​exceeds the predetermined threshold. In this case, the storage unit 62 may also pre-store the threshold.

[0096] Furthermore, if it is determined that the measuring unit 52 is not operating normally (S15: No), the operator is notified of this (notification step: S16). For example, an error message (indicating that the measuring unit 52 is not operating normally) is displayed on the display, which is a component of the touch panel. Then, the conveying mechanism 6 moves the workpiece unit 11 into the box 8b placed on the box placement stage 10b (moving step: S17).

[0097] On the other hand, if it is determined that the measuring unit 52 is operating normally (S15: Yes), no special processing is performed, and the conveying mechanism 6 moves the workpiece unit 11 to the box 8b placed on the box placement stage 10b (moving step: S17).

[0098] In addition, the confirmation of whether the measuring unit (second measuring unit) 52 is operating normally can also be performed before the workpiece unit 11 is ground. Figure 8 This is a flowchart illustrating an example of a driving method for the grinding apparatus 2 that performs such verification. In this driving method, the conveying mechanism 6 first removes the workpiece unit 11 from the box 8a placed on the box stage 10a (removal step: S21).

[0099] Next, the measurement unit (first measurement unit) 12 uses the values ​​mentioned above, namely the first distance and the second distance, to calculate the thickness of the workpiece unit 11 (measurement step: S22). Furthermore, the determination unit 70 of the control unit 58 calculates the thickness of the workpiece unit 11 as described above.

[0100] Next, the workpiece unit 11 is moved into the chuck table 26 (moving step: S23). Specifically, the conveying mechanism 6 moves the workpiece unit 11 into the position adjustment mechanism 20, and the conveying mechanism 22 moves the workpiece unit 11, whose position has been adjusted by the position adjustment mechanism 20, out of the position adjustment mechanism 20 and into the chuck table 26.

[0101] Next, the measurement unit (second measurement unit) 52 uses the values ​​used in the calculation of the thickness of the workpiece unit 11 held by the chuck table 26, namely the position (height) of the upper surface of the workpiece unit 11 in the vertical direction and the position (height) of the holding surface 26a of the chuck table 26 (measurement step: S24).

[0102] Furthermore, the determination unit 70 calculates the thickness of the workpiece unit 11 based on the measurement of the measurement unit 52. Specifically, the determination unit 70 calculates the difference between the position (height) of the upper surface of the workpiece unit 11 and the position (height) of the holding surface 26a of the chuck table 26 as the thickness of the workpiece unit 11.

[0103] Next, the determination unit 70 compares the thickness value of the workpiece unit 11 obtained by the measurement of the measurement unit 52 with the thickness value of the workpiece unit 11 obtained by the measurement of the measurement unit 12, and determines whether the measurement unit 52 is operating normally (determination step: S25).

[0104] For example, if the two values ​​are equal, the determination unit 70 determines that the measurement unit 52 is operating normally; if the two values ​​are different, the determination unit 70 determines that the measurement unit 52 is not operating normally. Alternatively, the determination unit 70 may determine that the measurement unit 52 is operating normally if the difference between the two values ​​is below a predetermined threshold, and determine that the measurement unit 52 is not operating normally if the difference between the two values ​​exceeds the predetermined threshold. In this case, the storage unit 62 may pre-store the threshold.

[0105] Furthermore, if it is determined that the measurement unit 52 is not operating properly (S25: No), the operator is notified of this (notification step: S26). For example, an error message (indicating that the measurement unit 52 is not operating properly) is displayed on the display, which is a component of the touch panel.

[0106] exist Figure 7 and Figure 8 In the driving method of the grinding device 2 shown in the figure, the thickness value of the workpiece unit 11 obtained by the measurement unit (second measurement unit) 52 is compared with the thickness value of the workpiece unit 11 obtained by the measurement unit (first measurement unit) 12 to confirm whether the measurement unit 52 is operating normally.

[0107] Therefore, malfunctions or abnormal operation of the measuring unit 52 can be detected as early as possible. Consequently, problems such as machining defects caused by over- or under-grinding of the workpiece unit 11 can be detected early.

[0108] Furthermore, in the grinding apparatus 2, both the confirmation of whether the workpiece unit 11 is the object to be ground and the confirmation of whether the measuring unit (second measuring unit) 52 is operating normally are performed using the measuring unit (first measuring unit) 12. Therefore, compared to grinding apparatuses that have components for performing the above two confirmations, the grinding apparatus 2 is preferred in terms of structural simplification.

[0109] Furthermore, the grinding apparatus 2 is merely one example of the grinding apparatus of the present invention, and the grinding apparatus of the present invention is not limited to the grinding apparatus 2. For example, the measuring unit 12 and the measuring unit 52 can be replaced with measuring units that directly measure the thickness of the workpiece unit 11. Similarly, the measuring unit 12 can be replaced with a measuring unit that performs measurements in contact with the object being measured, and the measuring unit 52 can be replaced with a measuring unit that performs measurements in a non-contact state without contact with the object being measured.

[0110] in addition, Figures 6-8 The driving method of the grinding device 2 shown is only one example of the driving method of the grinding device of the present invention, and the driving method of the grinding device of the present invention is not limited to this. Figures 6-8The driving method of the grinding device 2 shown in any figure. For example, arbitrary combinations. Figures 6-8 The driving method of the grinding apparatus included in each step is also an example of the driving method of the grinding apparatus of the present invention.

[0111] In addition, the above-described embodiments and variations can be appropriately modified and implemented as long as they do not depart from the scope of the present invention.

Claims

1. A grinding apparatus, wherein, This grinding device has the following features: A box-mounting platform for holding boxes that hold workpiece units with tapes attached to one side of the workpiece. A chuck table, used to hold the workpiece unit; A conveying mechanism for conveying the workpiece unit between the box and the chuck table; The first measuring unit is used to measure the thickness of the workpiece unit held by the conveying mechanism or the value used in the calculation of the thickness of the workpiece unit, the thickness of which is obtained by adding the thickness of the workpiece and the thickness of the strip attached to the workpiece. A grinding unit for grinding the workpiece unit held by the chuck table; as well as The control unit is used to control the various components. The control unit has a determination unit that determines whether the workpiece is a grinding object based on the thickness value of the workpiece obtained by the first measuring unit after it has been removed from the box and before it has been moved into the chuck table.

2. The grinding apparatus according to claim 1, wherein, The control unit has a storage section for storing the thickness values ​​of the workpiece and the belt, respectively. The determination unit compares the value obtained by adding the respective thickness values ​​of the workpiece and the tape stored in the storage unit with the thickness value of the workpiece unit obtained based on the measurement performed by the first measuring unit, thereby determining whether the desired tape is pasted on the workpiece.

3. The grinding apparatus according to claim 1, wherein, The first measuring unit has: A first non-contact distance measuring device is disposed on one side of the workpiece unit held by the conveying mechanism to measure the distance between itself and one side of the workpiece unit. as well as A second non-contact distance measuring device is disposed on the other side of the back side of the workpiece unit held by the conveying mechanism, and measures the distance between the workpiece unit and the other side of the workpiece unit.

4. The grinding apparatus according to claim 2, wherein, The first measuring unit has: A first non-contact distance measuring device is disposed on one side of the workpiece unit held by the conveying mechanism to measure the distance between itself and one side of the workpiece unit. as well as A second non-contact distance measuring device is disposed on the other side of the back side of the workpiece unit held by the conveying mechanism, and measures the distance between the workpiece unit and the other side of the workpiece unit.

5. The grinding apparatus according to any one of claims 1 to 4, wherein, The grinding apparatus also includes a second measuring unit for measuring the thickness of the workpiece unit held by the chuck table, or a value used in calculating the thickness of the workpiece unit. The determination unit compares the thickness value of the workpiece unit obtained based on the measurement performed by the second measuring unit with the thickness value of the workpiece unit obtained based on the measurement performed by the first measuring unit, thereby determining whether the second measuring unit is operating normally.

6. A method for driving a grinding device, This grinding device has the following features: A box-mounting platform for holding boxes that hold workpiece units with tapes attached to one side of the workpiece. A chuck table, used to hold the workpiece unit; A conveying mechanism for conveying the workpiece unit between the box and the chuck table; The first measuring unit is used to measure the thickness of the workpiece unit held by the conveying mechanism or the value used in the calculation of the thickness of the workpiece unit. A grinding unit for grinding the workpiece unit held by the chuck table; as well as The control unit is used to control the various components. The driving method of the grinding device includes the following steps: In the first removal step, the conveying mechanism removes the workpiece unit from the box placed on the box platform; In the first measurement step, the first measurement unit measures the thickness of the workpiece unit removed from the box through the first removal step, or the value used in calculating the thickness of the workpiece unit, wherein the thickness of the workpiece unit is obtained by adding the respective thicknesses of the workpiece and the strip attached to the workpiece. In the first determination step, the control unit determines whether the workpiece unit is a grinding object based on the thickness value of the workpiece unit obtained from the measurement in the first measurement step; and In the loading step, if the first judgment step determines that the workpiece unit is a grinding object, the conveying mechanism loads the workpiece unit onto the chuck worktable. If the first judgment step determines that the workpiece unit is not a grinding object, the conveying mechanism loads the workpiece unit back into the box.

7. The driving method of the grinding apparatus according to claim 6, wherein, The grinding apparatus also includes a second measuring unit for measuring the thickness of the workpiece unit held by the chuck table, or a value used in calculating the thickness of the workpiece unit. The driving method of this grinding device has the following steps: The grinding step involves the grinding unit grinding the workpiece unit that has been moved onto the chuck table via the loading step. The second measurement step involves the second measurement unit measuring the thickness of the workpiece unit that has been ground through the grinding step, or the value used in calculating the thickness of the workpiece unit. In the second removal step, the conveying mechanism removes the workpiece unit, whose thickness value has been measured through the second measurement step, from the chuck table. In the third measurement step, the first measurement unit measures the thickness of the workpiece unit that has been removed from the chuck table through the second removal step, or the value used in the calculation of the thickness of the workpiece unit. as well as In the second determination step, the control unit compares the thickness value of the workpiece unit obtained based on the measurement in the second measurement step with the thickness value of the workpiece unit obtained based on the measurement in the third measurement step, thereby determining whether the second measurement unit is operating normally.

8. The driving method of the grinding apparatus according to claim 6, wherein, The grinding apparatus also includes a second measuring unit for measuring the thickness of the workpiece unit held by the chuck table, or a value used in calculating the thickness of the workpiece unit. The driving method of this grinding device has the following steps: The second measurement step involves measuring the thickness of the workpiece unit or the value used in calculating the thickness of the workpiece unit before grinding the workpiece unit that has been moved onto the chuck table via the loading step. as well as In the second determination step, the control unit compares the thickness value of the workpiece unit obtained based on the measurement in the second measurement step with the thickness value of the workpiece unit obtained based on the measurement in the first measurement step, thereby determining whether the second measurement unit is operating normally.

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