Method of manufacturing a chuck and a lithographic apparatus

Abstract

The application discloses a manufacturing method of a suction disc and a photoetching device, and comprises the following steps: providing a plate body with plasticity; extruding the plate body to form a plurality of suction cavities penetrating through the plate body along a first direction, the plurality of suction cavities are arranged at intervals along a second direction, and the first direction and the second direction are both perpendicular to the thickness direction of the plate body; forming a plurality of suction holes on one side of the plate body in the thickness direction, each of the suction cavities is communicated with at least one of the suction holes, and forming a suction groove communicated with the plurality of suction cavities on the other side of the plate body in the thickness direction. The manufacturing method of the suction disc has the advantages of convenient processing, low cost and high strength.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photolithography, and in particular, to a chuck manufacturing method and a photolithography device. BACKGROUND

[0002] The chuck is a core device in the photolithography device, and the chuck can fix a circuit board through vacuum adsorption, so as to expose the circuit board.

[0003] In the related art, the chuck is usually formed through mechanical cutting or die casting. In the mechanical cutting, the material is cut and punched as a whole, and then the features such as the front support boss array, the internal air duct, the back vacuum opening, and the external shape are processed. The mechanical cutting has problems of long processing time, much material waste, and high cost. In the die casting, the features such as the front support boss array, the internal air duct, the back vacuum opening, and the external shape are cast through a mold and a large-tonnage die casting machine. In the die casting process, the chuck is prone to have air holes, and the chuck has a problem of low structural strength at the air holes, which cannot be used to install screws and other mounting parts and cannot bear the load. SUMMARY

[0004] The present application aims to at least solve one of the problems in the prior art. To this end, one object of the present application is to provide a chuck manufacturing method, which has the advantages of convenient processing, low cost, and high strength.

[0005] The present application also provides a photolithography device.

[0006] To achieve the above object, a first aspect of the present application provides a chuck manufacturing method, comprising: providing a plate body having plasticity; extruding the plate body to form a plurality of adsorption cavities penetrating through the plate body along a first direction, the plurality of adsorption cavities being arranged at intervals along a second direction, the first direction and the second direction being perpendicular to the thickness direction of the plate body; forming a plurality of adsorption holes on one side of the plate body in the thickness direction, each adsorption cavity being communicated with at least one adsorption hole, and forming an adsorption groove communicated with the plurality of adsorption cavities on the other side of the plate body in the thickness direction.

[0007] The chuck manufacturing method according to the present application has the advantages of convenient processing, low cost, and high strength.

[0008] According to some specific embodiments of the present application, after the adsorption holes and the adsorption groove are formed on the plate body, heat treatment is performed on the two sides of the plate body in the thickness direction to correct the two sides of the plate body in the thickness direction to be flat.

[0009] According to some embodiments of the present application, after the plate body is configured with the adsorption holes and the adsorption grooves, a sealing plate is provided and installed on both sides of the plate body in the first direction to seal both ends of each adsorption cavity.

[0010] According to some embodiments of the present application, a mounting hole is configured on the other side of the plate body in the thickness direction, and the mounting hole is arranged apart from the adsorption grooves.

[0011] According to some embodiments of the present application, the mounting holes are arranged in multiple rows.

[0012] According to some embodiments of the present application, after the plate body is configured with the adsorption holes and the adsorption grooves, a cover plate is provided and installed on the plate body to cover the adsorption grooves after the adsorption grooves are connected with a suction device.

[0013] According to some embodiments of the present application, the axial direction of each adsorption hole is parallel to the thickness direction of the plate body, and the adsorption grooves extend along the second direction.

[0014] According to some embodiments of the present application, the length of the adsorption grooves is not greater than the size of the plurality of adsorption cavities in the second direction, and the two ends of the adsorption grooves do not exceed the outermost two side walls of the plurality of adsorption cavities.

[0015] According to some embodiments of the present application, the distance between the adsorption grooves and the two sides of the plate body in the first direction is not the same.

[0016] According to a second aspect of the present application, a lithography device is provided, comprising a chuck manufactured by the manufacturing method of the chuck according to the first aspect of the present application, and a suction device connected with the adsorption grooves.

[0017] The lithography device according to the second aspect of the present application has the advantages of convenient processing, low cost and high strength by using the manufacturing method of the chuck according to the first aspect of the present application.

[0018] Additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description, taken in conjunction with the following drawings, in which:

[0020] Figure 1 is a structural schematic diagram of a chuck according to an embodiment of the present application.

[0021] Figure 2 is a structural schematic view of a plate body of a suction cup according to an embodiment of the present application.

[0022] Figure 3 is a structural schematic view of another perspective of a plate body of a suction cup according to an embodiment of the present application.

[0023] Figure 4 is a sectional view of a plate body of a suction cup according to an embodiment of the present application.

[0024] Figure 5 is a flow chart of a manufacturing method of a suction cup according to an embodiment of the present application.

[0025] Reference Signs:

[0026] suction cup 1, plate body 100, suction cavity 110, suction hole 120, suction groove 130, mounting hole 140, sealing plate 200. DETAILED DESCRIPTION

[0027] Embodiments of the present application are described in detail below with reference to the accompanying drawings, in which the same or similar components have the same or similar reference numbers throughout the drawings and a detailed description of the same or similar components is not repeated. The embodiments described below are exemplary and are for the purpose of explaining the present application only, and should not be understood as limiting the present application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore should not be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be understood as limiting the present application.

[0029] In the description of the present application, "first feature" and "second feature" can include one or more of the features.

[0030] In the description of the present application, the meaning of "a plurality of" is two or more, and the meaning of "several" is one or more.

[0031] A manufacturing method of a suction cup according to an embodiment of the present application is described below with reference to the accompanying drawings.

[0032] As Figures 1-5As shown in the figure (the direction indicated by arrow A is the first direction, the direction indicated by arrow B is the second direction, and the direction indicated by arrow C is the thickness direction of the plate body 100), the manufacturing method of the suction plate according to the embodiment of the present application comprises the following steps:

[0033] providing a plate body 100 with plasticity;

[0034] extruding the plate body 100 to form a plurality of suction cavities 110 through the plate body 100 along the first direction, the plurality of suction cavities 110 being arranged in intervals along the second direction, and the first direction and the second direction being both perpendicular to the thickness direction of the plate body 100;

[0035] forming a plurality of suction holes 120 on one side of the plate body 100 in the thickness direction, each of the plurality of suction cavities 110 being in communication with at least one of the plurality of suction holes 120, and forming a suction groove 130 in communication with the plurality of suction cavities 110 on the other side of the plate body 100 in the thickness direction.

[0036] It should be noted that the plate body 100 with plasticity refers to that the plate body 100 can be a thermoplastic plastic, the plate body 100 can also be a thermosetting plastic or a reinforced plastic with good fluidity, and the plate body 100 can be a metal with good extrudability, such as aluminum or aluminum alloy. Extruding the plate body 100 refers to extruding the plate body 100 to form a profile.

[0037] For example, the suction holes 120 can be processed by drilling. In addition, the first direction and the second direction can be perpendicular to each other, when the plate body 100 is rectangular, the first direction can be one of the length direction and the width direction of the plate body 100, and the second direction can be the other one of the length direction and the width direction of the plate body 100. In addition, the length, width and thickness of the plurality of suction cavities 110 can be the same.

[0038] According to the manufacturing method of the suction plate, the plate body 100 is first extruded to form a plurality of suction cavities 110 through the plate body 100 along the first direction, and the plurality of suction cavities 110 are arranged in intervals along the second direction. The suction cavities 110 are manufactured by extrusion molding, that is, the plate body 100 is heated first, then the plate body 100 is pushed through an extrusion die to change the profile of the plate body 100 to the required profile, and finally the plate body 100 is cooled to fix the shape of the plate body 100.

[0039] Compared with mechanical cutting processing, the processing time of the plate body 100 is greatly reduced without multiple cutting and deep hole drilling processes, and the material waste is reduced by avoiding the discard of the corner material, thereby reducing the cost. Compared with die casting processing, the plate body 100 is heated and pressed at the same time, which can effectively reduce the number of pores in the plate body 100, thereby the structural strength of the plate body 100 is higher, the plate body 100 can withstand greater external force, and the structure of the plate body 100 near the mounting member such as a screw is not easy to be damaged when the mounting member is connected with other objects.

[0040] In addition, the plate body 100 of any length can be made according to the needs, for example, a longer plate body 100 is first made by extrusion molding, and then a plate body 100 of a suitable length is cut from the whole plate body 100 according to specific needs, further reducing the processing difficulty and cost.

[0041] In addition, the plurality of adsorption cavities 110 are arranged at intervals, which can increase the adsorption area of the plate body 100, make the adsorption of the circuit board more stable, and be compatible with circuit boards of different sizes, and on the other hand, can increase the structural strength of the plate body 100 and reduce the probability of damage to the plate body 100. The first direction and the second direction are perpendicular to the thickness direction of the plate body 100, that is, the plane defined by the first direction and the second direction is parallel to the two side surfaces of the plate body 100 in the thickness direction, which is beneficial to reduce the thickness of the plate body 100 and improve the space utilization of the plate body 100.

[0042] In addition, a plurality of adsorption holes 120 are formed on one side surface of the plate body 100 in the thickness direction, each adsorption cavity 110 is communicated with at least one adsorption hole 120, and an adsorption groove 130 communicated with the plurality of adsorption cavities 110 is formed on the other side surface of the plate body 100 in the thickness direction.

[0043] For example, the plurality of adsorption holes 120 can be uniformly and interval arranged on one side surface of the plate body 100 in the thickness direction, so that the adsorption force of the suction cup 1 on the circuit board is more uniform and stable. When the circuit board is placed on one side surface of the plate body 100 in the thickness direction, at least a part of the adsorption holes 120 can be covered. The suction cup 1 can extract the air in the adsorption cavity 110 through the adsorption groove 130, so that the adsorption cavity 110 is in a negative pressure state, and the plurality of adsorption holes 120 can generate suction force to adsorb and fix the circuit board.

[0044] Therefore, the manufacturing method of the suction cup according to the embodiment of the present application has the advantages of convenient processing, low cost and high strength.

[0045] In some specific embodiments of the present application, as shown in Figure 5 After the adsorption holes 120 and the adsorption groove 130 are formed on the plate body 100, the two side surfaces of the plate body 100 in the thickness direction are subjected to heat treatment to correct the two side surfaces of the plate body 100 in the thickness direction to be flat.

[0046] The heat treatment can heat the plate body 100 to make the plate body 100 more easily deformed, so as to avoid cracks or pores of the plate body 100 when the plate body 100 is corrected, thereby better positioning the strength of the plate body 100.

[0047] Through the heat treatment, without changing the shape of the adsorption hole 120 and the shape of the adsorption groove 130, the thickness of the plate body 100 can be corrected, one side of the thickness of the plate body 100 is a plane, which can be more closely attached to the circuit board, so as to better adsorb and fix the circuit board, and the other side of the thickness of the plate body 100 is a plane, which can make the plate body 100 more stable.

[0048] In some embodiments of the present application, as shown in Figure 1 and Figure 5 After the plate body 100 is constructed with the adsorption hole 120 and the adsorption groove 130, the sealing plate 200 is provided, and the sealing plate 200 is installed on both sides of the plate body 100 in the first direction to seal both ends of each adsorption cavity 110.

[0049] Specifically, the sealing plate 200 is two, and the two sealing plates 200 are respectively installed on both sides of the plate body 100 in the first direction, wherein the length of the sealing plate 200 is adapted to the length of the plate body 100 extending in the second direction, and the width of the sealing plate 200 is not less than the thickness of the adsorption cavity 110 in the first direction. In this way, one sealing plate 200 can cover one end of the plurality of adsorption cavities 110, and the other sealing plate 200 can cover the other end of the plurality of adsorption cavities 110, and the two sealing plates 200 together cover the excess leakage of the adsorption cavity 110, so that when the adsorption groove 130 absorbs air outward, only the adsorption hole 120 can have gas flow, thereby enabling the suction cup 1 to maintain a negative pressure state when working.

[0050] In some embodiments of the present application, as shown in Figure 2 and Figure 5 The other side of the thickness of the plate body 100 is constructed with the mounting hole 140, wherein the mounting hole 140 can penetrate the other side of the thickness of the plate body 100 or not, the mounting hole 140 is used to install the screw to fix the plate body 100, and the mounting hole 140 is arranged apart from the adsorption groove 130, so as to avoid the interference between the mounting hole 140 and the adsorption groove 130, facilitate the installation and fixation of the plate body 100, and avoid the mounting hole 140 and the adsorption groove 130 being too close to cause the structural strength of the plate body 100 to decrease, so that the plate body 100 is not easily damaged.

[0051] Optionally, as shown in Figure 2As shown, the mounting holes 140 are arranged in multiple rows. For example, two rows of mounting holes 140 can be provided, each row including two mounting holes 140, the two rows being spaced apart along the first direction, and the two mounting holes in each row being spaced apart along the second direction, so that the four mounting holes 140 can more stably fix the plate body 100, and the plate body 100 is less likely to displace or shake.

[0052] In some embodiments of the present application, as shown in Figure 5 As shown, after the adsorption holes 120 and the adsorption grooves 130 are formed in the plate body 100, a cover plate (not shown) is provided, the adsorption grooves 130 are connected to a suction device (not shown), and then the cover plate is installed on the plate body 100 to cover the adsorption grooves 130.

[0053] In this way, the cover plate can cover the gap after the adsorption grooves 130 are connected to the suction device, so as to prevent the suction disc 1 from leaking air. The suction device can suck the air in the plurality of adsorption cavities 110 to form a negative pressure in the adsorption cavities 110, and the suction disc 1 does not leak air, so that the adsorption cavities 110 can always be in a negative pressure state, and the circuit board is more stably adsorbed and fixed.

[0054] In some embodiments of the present application, as shown in Figure 4 As shown, the axial direction of each adsorption hole 120 is parallel to the thickness direction of the plate body 100, so that the length of the adsorption hole 120 can be reduced, and the flow direction of the air flow at the adsorption hole 120 can be perpendicular to the circuit board. Therefore, the direction of the suction force of the air flow at the adsorption hole 120 on the circuit board is perpendicular to the circuit board, the adsorption force is more stable, and the relative position between the circuit board and the plate body 100 is more stable.

[0055] In addition, the adsorption grooves 130 extend along the second direction, i.e., the extension direction of the adsorption grooves 130 is parallel to the arrangement direction of the plurality of adsorption cavities 110. In this way, the adsorption grooves 130 can be connected to the plurality of adsorption cavities 110, and the adsorption cavities 110 can be sucked into a negative pressure state by the suction device, so as to adsorb and fix the circuit board.

[0056] It should be noted that the extension direction of the adsorption grooves 130 is parallel to the arrangement direction of the plurality of adsorption cavities 110, so that the adsorption grooves 130 can be connected to each adsorption cavity 110 while avoiding the length of the adsorption grooves 130 being too long, and ensuring the structural strength of the plate body 100.

[0057] Further, as shown in Figure 2 The length of the adsorption grooves 130 is not greater than the size of the plurality of adsorption cavities 110 in the second direction, and the two ends of the adsorption grooves 130 do not exceed the outermost two side walls of the plurality of adsorption cavities 110. That is, the end surface of the adsorption grooves 130 is located between the two side walls of the outermost adsorption cavity 110 in the second direction.

[0058] In this way, the adsorption groove 130 can be in communication with the plurality of adsorption cavities 110, and the air in the adsorption cavities 110 can be drawn out by the air suction device, and the air leakage phenomenon of the adsorption cavities 110 in communication with the outside air through the adsorption groove 130 can be avoided. In addition, in this way, the length of the adsorption groove 130 can be prevented from being too long, the structural strength of the plate body 100 can be ensured, and the cover plate can be sealed to the adsorption groove 130, so that the adsorption disc 1 can maintain a negative pressure state during operation.

[0059] In some embodiments of the present application, as shown in Figure 2 The distance between the adsorption groove 130 and the two sides of the plate body 100 in the first direction is not the same.

[0060] In other words, the distance between the adsorption groove 130 and one side of the plate body 100 in the first direction is less than the distance between the adsorption groove 130 and the other side of the plate body 100. In this way, when the air suction device is connected to the plate body 100, the air suction device does not occupy too much area of the plate body 100, and the central area of the plate body 100 can be used for mounting and fixing, so that the fixation of the plate body 100 can be facilitated.

[0061] The lithography apparatus according to an embodiment of the present application includes the adsorption disc 1 manufactured by the manufacturing method of the adsorption disc according to the above-mentioned embodiments of the present application and the air suction device connected to the adsorption groove 130. The lithography apparatus can be a laser direct imaging (LDI) apparatus.

[0062] The air suction device can provide suction, and then draw out the air in the adsorption cavities 110 through the adsorption groove 130, so that a negative pressure state is formed in the adsorption cavities 110, and the circuit board can be pressed on one side surface of the plate body 100 by the atmospheric pressure. In addition, the air suction device can also introduce air into the adsorption cavities 110 through the adsorption groove 130, so that the air pressure in the adsorption cavities 110 is the same as the atmospheric pressure, so as to eliminate the suction of the adsorption disc 1 to the circuit board, and facilitate the removal of the circuit board from the adsorption disc 1 after the circuit board is processed

[0063] The lithography apparatus according to an embodiment of the present application has the advantages of convenient processing, low cost and high strength by using the manufacturing method of the adsorption disc according to the above-mentioned embodiments of the present application.

[0064] The manufacturing method of the adsorption disc and other configurations and operations of the lithography apparatus according to an embodiment of the present application are known to those skilled in the art, and will not be described in detail here.

[0065] In the description of the specification, reference to the description of the terms "specific embodiment", "specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0066] Although embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, alternatives, and variations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A method of manufacturing a suction cup, characterized by, The application relates to a plate body with adsorption holes and adsorption grooves. The plate body is made of thermoplastic plastic, or good flowability thermosetting plastic or reinforced plastic. The plate body is heated and pushed into a mold to change the profile of the plate body into a desired profile, and then the plate body is cooled to fix the shape of the plate body, so that the plate body is formed with a plurality of adsorption cavities penetrating through the plate body along a first direction, and the plurality of adsorption cavities are arranged at intervals along a second direction, and the first direction and the second direction are both perpendicular to the thickness direction of the plate body. A plurality of adsorption holes are formed on one side of the plate body in the thickness direction, each of the adsorption cavities is communicated with at least one of the adsorption holes, and an adsorption groove communicated with the plurality of adsorption cavities is formed on the other side of the plate body in the thickness direction. The two sides of the plate body in the thickness direction are subjected to heat treatment to correct the two sides of the plate body in the thickness direction into planes.

2. The method of claim 1, wherein After the plate body is formed with the adsorption holes and the adsorption groove, An enclosure plate is provided. The enclosure plate is installed on the two sides of the plate body in the first direction to seal the two ends of each of the adsorption cavities.

3. The method of claim 1, wherein the method further comprises: Mounting holes are formed on the other side of the plate body in the thickness direction, and the mounting holes are arranged at intervals with the adsorption groove.

4. The method of claim 3, wherein the step of forming the suction cup comprises the steps of: forming a first layer of a first material on the substrate; and forming a second layer of a second material on the first layer. The mounting holes are arranged in multiple rows.

5. The method of claim 1, wherein After the plate body is formed with the adsorption holes and the adsorption groove, A cover plate is provided. After the adsorption groove is connected with an air suction device, the cover plate is installed on the plate body to cover the adsorption groove.

6. The method of claim 1-5, wherein The axial direction of each of the adsorption holes is parallel to the thickness direction of the plate body. The adsorption groove extends along the second direction.

7. The method of claim 1-5, wherein The length of the adsorption groove is not greater than the size of the plurality of adsorption cavities in the second direction. The two ends of the adsorption groove do not exceed the outermost two side walls of the plurality of adsorption cavities.

8. The method of claim 1-5, wherein, The distance between the adsorption groove and the two sides of the plate body in the first direction is not the same.

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