Device for processing substrates

Abstract

The present invention relates to an apparatus for processing a substrate, the apparatus comprising: a processing container having an internal space; a support unit for supporting and rotating the substrate in the internal space; a discharge unit for discharging airflow in the internal space, wherein the processing container includes an outer cup-shaped object providing the internal space; and an inner cup-shaped object disposed in the internal space and spaced apart from the outer cup-shaped object, wherein the outer cup-shaped object has protrusions on its side walls.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0180312, filed with the Korean Intellectual Property Office on December 21, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to an apparatus for processing a substrate, and more specifically, to an apparatus for processing a substrate by supplying liquid to a rotating substrate. Background Technology

[0004] Various processes (such as photolithography, etching, ashing, thin film deposition, and cleaning) are performed to manufacture semiconductor devices or flat panel display panels. Among these processes, photolithography involves supplying photoresist to a semiconductor substrate to form a photoresist film on the substrate surface, exposing the photoresist film using a photomask, and then supplying a developer to selectively remove portions of the photoresist film. These processes are performed within a process chamber.

[0005] Figure 1 This is a schematic diagram illustrating a substrate processing apparatus 1 used to apply photoresist to a substrate. (Refer to...) Figure 1 The substrate processing apparatus 1 includes a processing container 10 having an internal space, a support unit 20 for supporting a substrate W within the internal space, and a nozzle 30 for supplying processing liquid 82 to the substrate W placed on the support unit 20. The processing container 10 has an outer cup 12 and an inner cup 14. Furthermore, a fan filter unit (not shown) for supplying downward airflow into the internal space is provided above the processing container 10, and an exhaust pipe 60 for discharging processing liquid and an exhaust pipe 70 for discharging atmosphere from the processing space are connected to the bottom region of the internal space.

[0006] When have Figure 1 When the substrate processing apparatus 1, as described above, processes substrate W by supplying processing liquid 82 to a rotating substrate, airflow 84 on the surface of substrate W flows from the center of substrate W toward the edge of substrate W along the rotation direction of substrate W by centrifugal force. Subsequently, airflow 84 flows into the space A1 between the outer cup 12 and the inner cup 14, collides with the bottom plate of the outer cup 12, flows into the discharge pipe 70 through the space A2 between the inner cup 14 and the discharge pipe 70, and... Figure 2The airflow described above is discharged to the outside. At this time, since the width of the space A1 between the outer cup 12 and the inner cup 14 is greater than the width of the space A2 between the inner cup 14 and the discharge pipe 70, the volume of the airflow flowing into the space A2 between the inner cup 14 and the discharge pipe 70 is reduced, thus generating a vortex near the bottom plate of the outer cup 12. The airflow 84 stagnates at the point where the vortex is generated, and therefore the internal space cannot be smoothly emptied.

[0007] Furthermore, when the film of the processing liquid 82 is formed on the substrate W, eddies and stagnant airflow impede the airflow above the edge region of the substrate W. As a result, the thickness of the film on the edge region of the substrate W is greater than the thickness of the film on the center region of the substrate W. In addition, due to the eddies, contaminants such as flue gas can flow back to the substrate W, thereby contaminating the substrate W. Summary of the Invention

[0008] An embodiment of the present invention provides a substrate processing apparatus for improving the efficiency of substrate processing.

[0009] An embodiment of the present invention provides a substrate processing apparatus for smoothly discharging airflow in a processing space while processing a substrate by supplying processing liquid to a rotating substrate in a processing space.

[0010] An embodiment of the present invention provides a substrate processing apparatus for forming a liquid film of uniform thickness over a whole area of ​​a substrate by supplying a processing liquid onto a rotating substrate.

[0011] An embodiment of the present invention provides a substrate processing apparatus for preventing contaminants from being re-adsorbed onto a substrate when processing the substrate by supplying a processing liquid to a rotating substrate.

[0012] The technical problems to be solved by the present invention are not limited to those described above, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0013] An embodiment of the present invention provides a substrate processing apparatus.

[0014] The device includes: a processing container having an internal space; a support unit that supports and rotates a substrate within the internal space; and a discharge unit that discharges airflow from the internal space, wherein the processing container includes: an outer cup that provides the internal space; and an inner cup disposed in the internal space and spaced apart from the outer cup, the outer cup including protrusions disposed on a side wall.

[0015] In one embodiment, the outer cup includes: a bottom wall; a side wall extending upward from the outer edge of the bottom wall; and a top wall extending inward from the side wall. The inner cup includes: an outer wall opposite to the side wall of the outer cup; an inner wall opposite to the outer wall; and a top wall connecting the outer wall and the inner wall, and the protrusion protrudes toward the outer wall of the inner cup.

[0016] In one embodiment, the protrusion is formed to extend circumferentially along the side wall of the outer cup, and the distance between the protrusion and the bottom wall of the outer cup is uniform.

[0017] In one embodiment, the protrusion is formed to extend circumferentially along the side wall of the outer cup, and the distance between the protrusion and the bottom wall of the outer cup gradually decreases in the direction from the top end of the outer cup to the bottom wall.

[0018] In one embodiment, the discharge unit includes: a discharge pipe disposed inside the inner side of the internal cup; and a pressure regulating member that forces the discharge of airflow within the internal space.

[0019] In one embodiment, a first channel is formed between the protrusion and the outer wall of the inner cup-shaped object, and a second channel is formed between the outer wall of the inner cup-shaped object and the discharge unit, wherein the width of the first channel and the width of the second channel are set to be equal.

[0020] In one embodiment, the pressure of the airflow drawn in at the first channel is equal to the pressure of the airflow drawn in at the second channel and introduced into the first channel.

[0021] In one embodiment, the top wall of the outer cup-shaped object includes: an outer top wall that extends upward and slopes from the side wall of the outer cup-shaped object; and an inner top wall that extends downward and slopes from the top wall of the outer cup-shaped object, the inner top wall having a hole for introducing airflow.

[0022] In one embodiment, the inner top wall of the outer cup-shaped part includes: a top guide portion disposed above the hole; and a bottom guide portion disposed below the hole; the top guide portion and the bottom guide portion each include at least partially curved surfaces, and the curved surfaces of the top guide portion and the bottom guide portion configure the inner side of the hole.

[0023] In one embodiment, the curved surface of the top guide is curved in the opposite direction to the curvature of the curved surface of the bottom guide.

[0024] In one embodiment, the curved surfaces of the top guide and the bottom guide are respectively configured with streamlined shapes.

[0025] In one embodiment, the apparatus further includes a liquid supply unit that supplies a processing liquid, which is a photoresist liquid, to a substrate supported by a support unit.

[0026] An embodiment of the present invention provides a substrate processing apparatus.

[0027] The apparatus includes: a processing container having an internal space; a support unit supporting and rotating a substrate within the internal space; and a discharge unit discharging airflow from the internal space. The processing container includes: an outer cup providing the internal space; and an inner cup disposed within the internal space and spaced apart from the outer cup. The outer cup includes: a bottom wall; side walls extending upward from the bottom wall; an outer top wall sloping upward from the side walls; and an inner top wall sloping downward from the outer top wall. The inner top wall includes: a top guide disposed above an opening formed in the inner top wall; and a bottom guide disposed below the opening. The top guide and the bottom guide are respectively disposed inside the opening and at least partially include curved surfaces configured in a rounded shape.

[0028] In one embodiment, the curved surfaces of the top guide and the bottom guide are respectively configured with streamlined shapes.

[0029] In one embodiment, the curved surface of the top guide is curved in the opposite direction to the curvature of the curved surface of the bottom guide.

[0030] In one embodiment, the width of the opening in the inner top wall decreases as it follows a direction from the top surface to the bottom surface of the inner top wall.

[0031] In one embodiment, the outer cup includes a protrusion disposed on a portion of the side wall of the outer cup opposite to the outer wall of the inner cup.

[0032] In one embodiment, the discharge unit includes: a discharge pipe disposed inside the inner side of the inner cup; and a pressure regulating member that forces the discharge of airflow within the inner space, wherein a first channel is formed between the protrusion and the outer wall of the inner cup, a second channel is formed between the outer wall of the inner cup and the discharge unit, and the widths of the first channel and the second channel are set to be equal.

[0033] In one embodiment, the pressure of the airflow drawn in at the first channel is equal to the pressure of the airflow drawn in at the second channel and introduced into the first channel.

[0034] An embodiment of the present invention provides a substrate processing apparatus.

[0035] The device includes: a processing container having an internal space; a support unit supporting and rotating a substrate within the internal space; and a discharge unit discharging airflow from the internal space. The processing container includes: an outer cup providing the internal space; and an inner cup spaced apart from and placed within the internal space. The outer cup includes: a bottom wall; side walls extending upward from the bottom wall; an outer top wall sloping upward from the side walls; and an inner top wall sloping downward from the outer top wall. The top wall of the inner cup includes: a top guide portion disposed above a hole formed in the inner top wall; and a bottom guide portion disposed below the hole. The top guide portion and the bottom guide portion are respectively disposed inside the hole and include at least partially curved surfaces configured in a rounded shape. The outer cup includes a protrusion disposed on a portion of the side wall of the outer cup opposite to the outer wall of the inner cup. The width of a first channel formed between the protrusion and the outer wall of the inner cup and the width of a second channel formed between the outer wall of the inner cup and the discharge pipe are set to be equal.

[0036] According to the present invention, a substrate processing apparatus can be provided that can improve the efficiency of substrate processing.

[0037] Furthermore, when processing a substrate by supplying processing liquid to a rotating substrate in the processing space, eddies and backflow can be prevented, and the discharge flow rate can be increased to smoothly discharge the airflow in the processing space.

[0038] Furthermore, when a processing liquid is supplied to a rotating substrate to form a liquid film on the substrate, the thickness of the liquid film can be uniformly provided over the entire area of ​​the substrate.

[0039] Furthermore, when processing the substrate by supplying a processing liquid to the rotating substrate, it is possible to prevent contaminants from being re-adsorbed onto the substrate.

[0040] The effects of this invention are not limited to those described above, and those skilled in the art can clearly understand the effects not mentioned from the present specification and drawings. Attached Figure Description

[0041] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals refer to the same parts throughout the figures, and in the figures:

[0042] Figure 1 A cross-sectional view of a substrate processing apparatus with a general structure is shown, which is used to perform liquid processing on a substrate while the substrate is rotated.

[0043] Figure 2 To show in Figure 1 A cross-sectional view of the airflow at the substrate processing device.

[0044] Figure 3 A perspective view of the substrate processing apparatus of the present invention is shown for illustrative purposes.

[0045] Figure 4 To show Figure 3 A cross-sectional view of a substrate processing apparatus for coating blocks (COT) and / or developing blocks (DEV);

[0046] Figure 5 for Figure 3 A plan view of the substrate processing apparatus;

[0047] Figure 6 To illustrate Figure 5 A plan view of the transfer robot;

[0048] Figure 7 To show Figure 5 A schematic plan view of the implementation scheme for the heat treatment chamber;

[0049] Figure 8 for Figure 5 Front view of the heat treatment chamber;

[0050] Figure 9 A schematic cross-sectional view illustrating the structure of a substrate processing apparatus for processing a substrate by supplying liquid to a rotating substrate, according to an embodiment of the present invention.

[0051] Figure 10 for Figure 9 An enlarged view of a portion of the substrate processing apparatus;

[0052] Figure 11 for Figure 9 A perspective view of the substrate processing apparatus;

[0053] Figure 12 To show when passing Figure 9 A partial cross-sectional view of the airflow path within the internal space of the processing container when the device processes liquid onto a substrate.

[0054] Figure 13 This is a schematic cross-sectional view illustrating the structure of a substrate processing apparatus for processing a substrate by supplying liquid to a rotating substrate, according to another embodiment of the invention. Detailed Implementation

[0055] The inventive concept can be modified in various ways and can take many forms, and specific embodiments thereof will be shown and described in detail in the accompanying drawings. However, embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions contained within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of related known technologies will be omitted where such obscurity is unnecessarily obscured. Furthermore, throughout the drawings, the same reference numerals are used for components performing similar functions and purposes.

[0056] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that, as used in this specification, the terms “comprise” and / or “include” specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0057] Singular expressions include plural expressions unless they have different meanings in the context. Furthermore, the shape and size of elements in the accompanying drawings may be exaggerated for clearer interpretation.

[0058] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “exemplary” is intended to refer to an embodiment or example. Additionally, the terms “connected” or “connecting” as used herein refer not only to the case where component A and component B are directly connected to each other, but also to the case where component C is inserted between component A and component B to indirectly connect them to each other.

[0059] Unless otherwise defined, all terms used herein (including technical or scientific terms) shall have the same meaning as commonly accepted by one of ordinary skill in the art to which the inventive concept pertains. Unless expressly defined in this application, terms such as those defined in common dictionaries shall be interpreted as consistent with the content of the relevant art, rather than as ideal or overly formal.

[0060] The embodiments of the inventive concept can be modified in various ways, and the scope of the inventive concept should not be construed as limited to the following embodiments. The embodiments are provided to more fully illustrate the inventive concept to those skilled in the art. Therefore, the shapes of the elements in the drawings are exaggerated to emphasize a clearer explanation. The apparatus of the embodiments can be used to perform photolithography processes on a circular substrate. In particular, the apparatus of the embodiments can be connected to an exposure apparatus and can be used to perform application and development processes on the substrate. However, the technical concept of the inventive concept is not limited thereto and can be used in various types of processes for supplying processing liquids to a substrate while it is rotating. Hereinafter, the use of a wafer as a substrate will be described as an example.

[0061] In the following text, reference will be made to Figures 3 to 12 An embodiment of the present invention is shown.

[0062] Figure 3 A substrate processing apparatus according to an embodiment of the present invention is shown. Figure 4 It shows Figure 3 The coating block or developing block, and Figure 5 It shows Figure 3 Substrate processing apparatus.

[0063] Reference Figures 3 to 5 According to an embodiment of the present invention, a substrate processing apparatus 10 includes an index module 100, a processing module 300, and an interface module 500. According to one embodiment, the index module 100, the processing module 300, and the interface module 500 are arranged sequentially in a row. Hereinafter, the direction in which the index module 100, the processing module 300, and the interface module 500 are arranged is referred to as a first direction 12, the direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and the direction perpendicular to both the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0064] The indexing module 100 transfers the substrate W from the container F containing the substrate W to the processing module 300, and removes the processed substrate W from the processing module 300 for storage in the container F. The indexing module 100 has a length extending along a second direction 14. The indexing module 100 has a loading port 110 and an index frame 130. The index frame 130 is positioned between the loading port 110 and the processing module 300. The container F containing the substrate W is positioned at the loading port 110. Multiple loading ports 110 can be provided, and the multiple loading ports 110 can be positioned along the second direction 14.

[0065] For container F, a closed container F, such as a front-open unified pod (FOUP), can be used. Container F can be placed on loading port 110 by means of a transport vehicle (not shown), such as an overhead conveyor, overhead transport, or automated guided vehicle, or by an operator.

[0066] An indexing robot 132 is disposed inside the index frame 130. Within the index frame 130, a guide rail 136 extends along a second direction 14, and the indexing robot 132 is movable along the guide rail 136. The indexing robot 132 includes a hand, on which a substrate W is placed, and the hand is configured to be movable forward and backward, rotatable about a third direction 16, and movable along the third direction 16.

[0067] The processing module 300 can perform coating and developing processes on the substrate W. The processing module 300 can receive the substrate W stored in the container F and perform substrate processing processes. The processing module 300 has a coating block (COT) 300a and a developing block (DEV) 300b. The coating block 300a performs the coating process on the substrate W, and the developing block 300b performs the developing process on the substrate W. Multiple coating blocks 300a are provided and stacked on top of each other. Multiple developing blocks 300b are provided and stacked on top of each other. Figure 3 In one embodiment, two coating blocks 300a and two developing blocks 300b are provided. The coating blocks 300a may be positioned below the developing blocks 300b. In this embodiment, the two coating blocks 300a perform the same process and may be configured with the same structure. Similarly, the two developing blocks 300b perform the same process and may be configured with the same structure.

[0068] Reference Figure 5 The coating block 300a includes a heat treatment chamber 320, a transfer chamber 350, a liquid processing chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 may be a chamber for performing heat treatment processes on a substrate W. The heat treatment processes may include cooling processes and heating processes. The liquid processing chamber 360 supplies liquid to the substrate W to form a liquid layer. The liquid layer may be a photoresist film or an anti-reflective film. The transfer chamber 350 transfers the substrate W between the heat treatment chamber 320 and the liquid processing chamber 360 in the coating block 300a.

[0069] The transfer chamber 350 is configured such that its longitudinal direction is parallel to the first direction 12. A transfer manipulator 352 is disposed in the transfer chamber 350. The transfer manipulator 352 transfers the substrate W between the heat treatment chamber 320, the liquid treatment chamber 360, and the buffer chambers 312 and 316. According to one embodiment, the transfer manipulator 352 has a hand on which the substrate W is placed, and the hand can be configured to be movable forward and backward, rotatable about a third direction 16, and movable along the third direction 16. A guide rail 356 is disposed in the transfer chamber 350 such that its length direction is parallel to the first direction, and the transfer manipulator 352 can be configured to be movable on the guide rail 356.

[0070] Figure 7 An embodiment of the hand portion of a transfer robot is shown. (Refer to...) Figure 7 The hand portion 352 has a base 352a and a support protrusion 352b. The base 352a may have an annular ring shape, wherein a portion of the circumference is curved. The inner diameter of the base 352a is larger than the diameter of the substrate W. The support protrusion 352b extends inward from the base 352a. A plurality of support protrusions 352b are provided, and the plurality of support protrusions 352b support the edge region of the substrate W. According to an embodiment, four support protrusions 352b may be provided at equal intervals.

[0071] Multiple heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged along the first direction 12. The heat treatment chambers 320 are placed on one side of the transfer chamber 350.

[0072] Figure 7 Show Figure 5 The heat treatment chamber, and Figure 8 The embodiment of the invention is shown. Figure 7 The heat treatment chamber.

[0073] Reference Figure 7 and Figure 8 The heat treatment chamber 320 includes a shell 321, a cooling unit 322, a heating unit 323, and a transfer plate 324.

[0074] The housing 321 is configured in a generally rectangular parallelepiped shape. An inlet (not shown) is provided on the side wall of the housing 321 through which the substrate W enters and exits. The inlet can remain open. Optionally, a door (not shown) can be provided to open and close the inlet. A cooling unit 322, a heating unit 323, and a transfer plate 324 are disposed within the housing 321. The cooling unit 322 and the heating unit 323 are arranged side-by-side along a second direction 14. In an embodiment, the cooling unit 320 may be placed closer to the transfer chamber 350 than the heating unit 323.

[0075] The cooling unit 322 has a cooling plate 322a. When viewed from above, the cooling plate 322a may have a substantially circular shape. The cooling plate 322a is provided with a cooling member 322b. In an embodiment, the cooling member 322b is formed inside the cooling plate 322a and may be configured as a channel through which the cooling fluid flows.

[0076] The heating unit 323 includes a heating plate 323a, a cover 323c, and a heater 323b. When viewed from above, the heating plate 323a has a generally circular shape. The heating plate 323a has a diameter larger than that of the substrate W. The heating plate 323a is equipped with the heater 323b. The heater 323b can be implemented using a resistance heating element to which an applied current is applied. The heating plate 323a is provided with lifting pins 323e that are vertically movable along a third direction 16. The lifting pins 323e receive the substrate W from a transfer tool outside the heating unit 323 and place the substrate W downwards onto the heating plate 323a, or lift the substrate W away from the heating plate 323a and transfer the substrate W to the transfer tool outside the heating unit 323. In an embodiment, three lifting pins 323e may be provided. The cover 323c has a space therein, which is open at the bottom. The cover 323c is located above the heating plate 323a and moves in the up / down direction via a drive 323d. The space formed by the movable cover 323c together with the heating plate 323a serves as the heating space for the heating substrate W.

[0077] The transfer plate 324 has a generally circular shape and a diameter corresponding to the diameter of the substrate W. Notches 324b are formed at the edges of the transfer plate 324. The notches 324b may have a shape corresponding to the protrusions 352b formed on the hand 354 of the transfer manipulator 352. Furthermore, as many notches 324b as the protrusions 352b formed on the hand 354 are formed in positions corresponding to the protrusions 352b. When the vertical alignment of the hand 354 and the transfer plate 324 changes in the vertical direction, the substrate W is transferred between the hand 354 and the transfer plate 324. The transfer plate 324 can be mounted on a guide rail 324d and is movable along the guide rail 324d by a driver 324c. A plurality of slit-shaped guide grooves 324a are provided in the transfer plate 324. The guide grooves 324a extend inward from the edge of the transfer plate 324 into the inner side of the transfer plate 324. The guide groove 324a has a length extending along the second direction 14, and the guide grooves 324a are positioned spaced apart from each other along the second direction 14. When the substrate W is transferred between the transfer plate 324 and the heating unit 323, the guide groove 324a prevents the transfer plate 324 and the lifting pin 323e from interfering with each other.

[0078] The substrate is cooled by bringing the transfer plate 324, on which the substrate W is placed, into contact with the cooling plate 322a. For effective heat transfer between the cooling plate 322a and the substrate W, the transfer plate 324 is formed of a material with high thermal conductivity. In an embodiment, the transfer plate 324 may be formed of a metallic material.

[0079] Heating units 323 disposed in some heat treatment chambers 320 can supply gas while heating the substrate W to improve the adhesion of photoresist to the substrate W. In an embodiment, the gas may be hexamethylsilane (HMDS) gas.

[0080] Multiple liquid processing chambers 360 are provided. Some of the liquid processing chambers 360 can be stacked on top of each other. The liquid processing chambers 360 are located on one side of the transmission chamber 350. The liquid processing chambers 360 are arranged side by side along the first direction 12. Some of the liquid processing chambers 360 are located near the index module 100. Hereinafter, these liquid processing chambers are referred to as front liquid processing chambers 362. Other liquid processing chambers 360 are located near the interface module 500. Hereinafter, these liquid processing chambers are referred to as rear liquid processing chambers 364.

[0081] Each of the front liquid processing chambers 362 applies a first liquid to the substrate W, and each of the rear liquid processing chambers 364 applies a second liquid to the substrate W. The first liquid and the second liquid can be different types of liquids. In one embodiment, the first liquid can be a liquid for forming an anti-reflective layer, and the second liquid can be a liquid for forming a photoresist layer. Photoresist can be applied to the substrate W coated with an anti-reflective film. Alternatively, the first liquid can be a photoresist liquid, and the second liquid can be a liquid for forming an anti-reflective layer. In this case, the liquid for forming the anti-reflective layer can be applied to the substrate W coated with a photoresist layer. Alternatively, the first liquid and the second liquid can be the same type of liquid, and both the first liquid and the second liquid can be liquids used for photoresist layers.

[0082] The developing block 300b has the same structure as the coating block 300a, and the liquid processing chamber provided to the developing block 300b supplies developing solution to the substrate W.

[0083] Interface module 500 connects processing module 300 to external exposure apparatus 700. Interface module 500 has interface frame 510, additional process chamber 520, interface buffer 530 and interface robot 550.

[0084] A fan filter unit that forms a downward airflow can be disposed at the top of the interface frame 510. An additional process chamber 520, an interface buffer 530, and an interface robot 550 are arranged within the interface frame 510. The additional process chamber 520 can perform a predetermined additional process before the substrate W to be processed in the coating block 300a is transferred to the exposure apparatus 700. Alternatively, the additional process chamber 520 can perform a predetermined additional process before the substrate W to be processed in the exposure apparatus 700 is transferred to the developing block 300b. In an embodiment, the additional process can be an edge exposure process for exposing the edge region of the substrate W, a top-side cleaning process for cleaning the top side of the substrate W, or a back-side cleaning process for cleaning the back side of the substrate W. Multiple additional process chambers 520 can be provided, and the additional process chambers 520 can be stacked on top of each other. All additional process chambers 520 can be configured to perform the same process. Alternatively, some additional process chambers 520 can be configured to perform different processes.

[0085] An interface buffer 530 is provided in the space where the substrate W temporarily resides during transport between the coating block 300a, the additional process chamber 520, the exposure apparatus 700, and the developing block 300b. Multiple interface buffers 530 can be provided, and multiple interface buffers 530 can be stacked on top of each other.

[0086] In one embodiment, the additional process chamber 520 may be located on one side of an extension line opposite to the longitudinal direction of the transmission chamber 350, and the interface buffer 530 may be located on the opposite side of the extension line.

[0087] An interface robot 550 transfers a substrate W between a coating block 300a, an additional process chamber 520, an exposure apparatus 700, and a developing block 300b. The interface robot 550 may have a transfer hand for transferring the substrate W. One or more interface robots 550 may be provided. In one embodiment, the interface robot 550 has a first robot 552 and a second robot 554. The first robot 552 may be configured to transfer the substrate W between the coating block 300a, the additional process chamber 520, and the interface buffer 530, and the second robot 554 may transfer the substrate W between the interface buffer 530 and the exposure apparatus 700, and may also transfer the substrate W between the interface buffer 530 and the developing block 300b.

[0088] Each of the first robotic arm 552 and the second robotic arm 554 includes a transfer hand on which the base plate W is placed, and the hand can be configured to be movable forward and backward, rotatable relative to an axis parallel to a third direction 16, and movable along the third direction 16.

[0089] The structure of a substrate processing apparatus will be described in detail below. This apparatus is used to process a substrate by supplying a processing liquid to a rotating substrate in the substrate processing apparatus of the present invention. An example of the substrate processing apparatus is given of an apparatus for applying photoresist. However, the substrate processing apparatus can also be an apparatus for forming a film (such as a protective film or an anti-reflective film) on a rotating substrate W. Alternatively, the substrate processing apparatus can be an apparatus for supplying a processing liquid 82 (such as a developing solution) to the substrate W.

[0090] Figure 9 An embodiment of the inventive concept is shown, illustrating the structure of a substrate processing apparatus for processing a substrate by supplying a processing liquid onto a rotating substrate. Figure 10 To show Figure 9 An enlarged view of a portion of the substrate processing apparatus, and Figure 11 To show Figure 9 A perspective view of the substrate processing apparatus.

[0091] See Figures 9 to 11 The substrate processing apparatus 1000 includes a housing 1100, a processing container 1200, a support unit 1400, a liquid supply unit 1600, and a discharge unit 1700.

[0092] The housing 1100 can be configured as a rectangular container shape with an internal space 1120. An opening 1102 can be formed in the side wall of the housing 1100. The opening 1102 can serve as an inlet / outlet channel through which the substrate W enters and exits the housing 1100. A door (not shown) can be provided on the side wall of the housing 1100 to open and close the opening 1102.

[0093] The processing container 1200 can be disposed within the internal space 1120 of the housing 1100. The processing container 1200 has an internal space 1280. The internal space 1280 is open at the top.

[0094] Support unit 1400 supports substrate W within the internal space 1280 of processing container 1200. Support unit 1400 includes support plate 1420, rotating shaft 1440, and actuator 1460. Support plate 1420 has a circular top surface. Support plate 1420 has a diameter smaller than that of substrate W. Support plate 1420 supports substrate W by vacuum pressure. Optionally, support plate 1420 may have a mechanical clamping structure for supporting substrate W. Rotating shaft 1440 is coupled to the center of the bottom surface of support plate 1420, and actuator 1460, which provides torque to rotating shaft 1440, is coupled to rotating shaft 1440. Actuator 1460 may be an electric motor.

[0095] Liquid supply unit 1600 supplies processing liquid 82 to substrate W. Processing liquid 82 may be a coating solution such as photoresist. Liquid supply unit 1600 has a nozzle 1620, a nozzle moving member 1640, and a liquid supply source (not shown). Nozzle 1620 may include one or more nozzles. Nozzle 1620 supplies processing liquid 82 to substrate W. Nozzle 1620 is supported on nozzle moving member 1640. Nozzle moving member 1640 moves nozzle unit 1620 between a process position and a standby position. In the process position, nozzle 1620 supplies processing liquid 82 to substrate W placed on support plate 1420. After the processing liquid 82 is fully supplied, nozzle 1620 is in standby position. In standby position, nozzle 1620 is in standby at a main port (not shown). The main port is located outside processing container 1200 within housing 1100.

[0096] The fan filter unit 1260 is disposed on the inner side of the top wall of the housing 1100 and supplies downward airflow 84 to the interior space 1120. The fan filter unit 1260 has a fan that introduces outside air into the interior space 1120 and a filter that filters the outside air.

[0097] The discharge pipe 1140 is connected to the housing 1100 so as to be located outside the processing container 1200 and discharges the airflow 84 supplied to the space between the processing container 1200 and the housing 1100 to the outside.

[0098] The processing container 1200 may include an outer cup 1220 and an inner cup 1240.

[0099] The outer cup-shaped object 1220 can be configured to surround the support unit 1400 and the substrate W supported on the support unit 1400. The outer cup-shaped object 1220 has a bottom wall 1222, a side wall 1224, and a top wall 1226. The inner side of the outer cup-shaped object 1220 is configured as the aforementioned internal space 1280.

[0100] The bottom wall 1222 has a circular shape and an opening at its center. A side wall 1224 extends upward from the outer end of the bottom wall 1222. The side wall 1224 has an annular shape and is perpendicular to the bottom wall 1222. According to an embodiment, the side wall 1224 extends to a height equal to or slightly lower than the height of the top surface of the support plate 1420. The top wall 1226 has an annular shape and an opening at its center. The top wall 1226 includes an outer top wall extending upward and inclined from the top of the side wall 1224 toward the central axis of the outer cup 1220, and an inner top wall extending downward and inclined from the outer top wall toward the substrate.

[0101] The outer cup 1220 includes a protrusion 1228 projecting inwardly from the inner surface of the side wall 1224. The protrusion 1228 is formed to project inwardly from at least a portion of the inner surface of the side wall 1224. The protrusion 1228 is formed to extend along the inner surface of the side wall 1224 of the outer cup 1220. The protrusion 1228 may be positioned facing the outer wall 1244 of the inner cup 1240. The protrusion 1228 may be located in the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240. The protrusion 1228 is spaced apart from the outer wall 1244 of the inner cup 1240. The space between the protrusion 1228 and the outer wall 1244 of the inner cup 1240 forms a first channel R1 through which airflow 84 moves. The protrusion 1228 can prevent the backflow of airflow 84 introduced between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240, or prevent the backflow of airflow 84 introduced between the protrusion 1228 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240.

[0102] The outer cup 1220 includes a hole 1226c formed in the top wall 1226. When the substrate W rotates, a downward airflow 84 supplied to the upper region of the substrate W flows by centrifugal force in a direction from the center region of the substrate W toward the edge region of the substrate W. On the surface of the substrate W and in the adjacent region thereto, the airflow 84 flows toward the outside of the substrate W while bending in the same direction as the rotation direction of the substrate W. When the airflow 84 deviates from the top surface of the substrate W, the airflow 84 flows through the hole 1226c into the space between the outer cup 1220 and the inner cup 1240, or flows into the space between the outer cup 1220 and the inner cup 1240 without passing through the hole 1226c.

[0103] A hole 1226c is formed in the inner top wall. The hole 1226c includes a top guide portion 1226a disposed above the hole 1226c and a bottom guide portion 1226b disposed below the hole 1226c in the inner top wall. The top guide portion 1226a includes at least a portion of a curved surface. The bottom guide portion 1226b includes at least a portion of a curved surface. The curved surfaces of the top guide portion 1226a and the bottom guide portion 1226b can form the inner surface of the hole 1226c.

[0104] The curved surfaces of the top guide 1226a and the bottom guide 1226b can be formed to face each other. The width of the hole 1226c decreases from the top surface of the inner top wall to the lower surface of the inner top wall. The curved surface of the top guide 1226a is formed to bulge in the downward inclined direction of the inner top wall. The curved surface of the bottom guide 1226b is formed to be recessed in the downward inclined direction of the inner top wall. That is, the bending directions of the curved surfaces of the top guide 1226a and the bottom guide 1226b can be opposite to each other. The curved surfaces of the top guide 1226a and the bottom guide 1226b can be formed into a streamlined shape. In this case, the airflow 84 introduced into the hole 1226c can be introduced with minimal resistance through the curved surfaces of the top guide 1226a and the bottom guide 1226b. Furthermore, by minimizing the resistance of the airflow 84 applied to the inlet orifice 1226c, flow separation of the airflow 84 can be prevented, and the reduction in the moving speed of the airflow 84 can be minimized, thereby preventing the formation of vortex-like vortices. Therefore, it becomes possible to maximize emission efficiency by preventing a reduction in the amount of emission volume.

[0105] An inner cup 1240 is located within an outer cup 1220. The inner cup 1240 has an inner wall 1242, an outer wall 1244, and a top wall 1246. The inner wall 1242 has a through-hole extending in the vertical direction. The inner wall 1242 is configured to surround the actuator 1460. The inner wall 1242 minimizes the airflow 84 exposed to the actuator 1460 in the processing space. The rotation axis 1440 of the support unit 1400 and / or the actuator 1460 extend vertically through the through-hole. The lower end of the inner wall 1242 may be located on the bottom wall 1222 of the outer cup 1220. The outer wall 1244 is configured to be spaced apart from and surround the inner wall 1242. The outer wall 1244 is configured to be spaced apart from the side walls 1224 of the outer cup 1220. The outer wall 1244 is spaced apart from the protrusion 1228 of the outer cup 1220. The inner wall 1242 is spaced upward from the bottom wall 1222 of the outer cup 1220. The top wall 1246 connects the top end of the outer wall 1244 to the top end of the inner wall 1242. The top wall 1246 has an annular shape and is configured to surround the support plate 1420. According to an embodiment, the top wall 1246 has an upwardly convex shape. The top wall 1246 has an outer top wall 1246a that slopes upward from the top end of the outer wall 1244 toward the rotation axis 1440, and an inner top wall 1246b that slopes downward from the top wall 1246 to the end of the inner wall 1242. The support plate 1420 may be located in the space surrounded by the inner top wall 1246b. According to an embodiment, the highest point of the top wall 1226 may be located outside the support plate 1420 and further inward than the end of the substrate W supported by the support unit 1400. The emission unit 1700, described later, is disposed within the interior space of the internal cup 1240.

[0106] A discharge pipe 1250 for discharging the processed liquid 82 is connected to the bottom wall 1222 of the outer cup 1220. The discharge pipe 1250 discharges the processed liquid 82 introduced between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 to the outside of the processing container 1200. According to an embodiment, the space between the side wall 1224 of the outer cup 1220 and the gas-liquid separation plate 1230 is configured as a discharge space for discharging the processed liquid 82, and the discharge pipe 1250 is configured to discharge the processed liquid 82 from the discharge space. An airflow 84 flowing into the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 flows into the space enclosed by the side wall 1224 and the bottom wall 1222 of the outer cup 1220, and into the discharge unit 1700, and flows into the inside of the discharge unit 1700 and is discharged.

[0107] One or more discharge pipes 1250 may be provided. When multiple discharge pipes 1250 are provided, the discharge pipes 1250 may be arranged along the circumference of the inner cup 1250.

[0108] Although not shown, a lift / lower actuator may be provided for adjusting the height of the external cup 1220 relative to the support plate 1420. According to an embodiment, the lift / lower actuator can move the external cup 1220 in an up / down direction. For example, the support plate 1420 is positioned higher than the top of the external cup 1220 to prevent interference between the transfer member used to transfer the substrate W and the external cup 1220 when the substrate W is loaded onto or unloaded from the support plate 1420. Furthermore, during process execution, the support plate 1420 is positioned lower than the top of the external cup 1220, such that the substrate W is located within the processing space.

[0109] The emission unit may include an emission pipe 1700.

[0110] The discharge pipe 1700 discharges the airflow 84 introduced into the processing container 1200 to the outside of the processing container 1200. According to an embodiment, the discharge pipe 1700 is located within the interior space of the inner cup 1240. The discharge pipe 1700 may extend into the space between the outer wall 1244 and the inner wall 1242 of the inner cup 1240. The discharge pipe 1700 is located closer to the inner wall 1242 of the inner cup 1240 than to the outer wall 1244 of the inner cup 1240. For example, the discharge pipe 1700 contacts the inner wall 1242 of the inner cup 1240. The discharge pipe 1700 is spaced apart from the outer wall 1244 of the inner cup 1240. The space between the discharge pipe 1700 and the outer wall 1244 of the inner cup 1240 forms a second channel R2 through which the airflow 84 moves. A pressure regulating component (not shown) is installed in the discharge pipe 1700 to force the airflow 84 in the discharge space 1248. The pressure regulating component may be a pump. The pressure regulating component provides negative pressure to the inside of the treatment container 1200.

[0111] The distance d1 of the first channel R1 is formed to have a width equal to or similar to the distance d2 of the second channel R2. In this case, the negative pressure formed by the pressure regulating member is equal to or similar to the pressure in the first channel R1 and the pressure in the second channel R2. Therefore, the negative pressure used to reduce the airflow 84 introduced between the protrusion 1228 and the outer wall 1240 of the inner cup 1240, and the negative pressure introduced between the protrusion 1228 and the outer wall 1244 of the inner cup 1240, and drawn between the outer wall 1244 of the inner cup 1240 and the discharge pipe 1700, can be formed to be equal, and can be introduced into the discharge pipe 1700 or discharged to the outside without eddies or backflow.

[0112] refer to Figure 1 In the substrate processing apparatus, the distance between the side wall of the outer cup-shaped member 12 and the outer wall of the inner cup-shaped member 14 is formed to be greater than the distance between the outer wall of the inner wall 14 and the discharge pipe 70. According to... Figure 1 In the substrate processing apparatus, the negative pressure formed in the first space A1 between the side wall of the outer cup 12 and the outer wall of the inner cup 14 is greater than the negative pressure formed in the second space A2 between the outer wall of the inner cup 14 and the discharge pipe 70. In this situation, although the amount of airflow 84 flowing into the first space A1 is greater, the amount of airflow through the second space A2 is smaller. Therefore, the airflow 84 stagnates near the bottom wall of the outer cup 12, and the flow direction of the airflow 84 near the bottom wall of the outer cup 12 changes. Due to the stagnation of the airflow 84, vortices of the airflow 84 are generated near the bottom wall of the outer cup 12, and thus the airflow 84 introduced into the space between the side wall of the outer cup 12 and the discharge pipe 70 flows back into the first space A1.

[0113] However, according to the present invention, the distance between the first channel R1 and the second channel R2 is made the same, so that the amount of negative pressure formed in each channel can remain the same. Therefore, the airflow 84 introduced into the first channel R1 can be introduced into the discharge pipe 1700 through the second channel R2 without blockage, thereby preventing airflow blockage, preventing eddy current generation, and preventing liquid splashing.

[0114] Figure 12 This shows when the substrate W passes through Figure 9 The device is used to process liquids and guide the flow path of airflow within the internal space of the processing container.

[0115] Reference Figure 12In the coating process, substrate W is supported on support plate 1420 and rotated by support plate 1420. At this time, support unit 1400 rotates substrate W, so that airflow 84 generated by the rotation of substrate W flows to inlet 3722 of airflow duct 3700. External air is supplied to substrate W as downward airflow 84 from fan filter unit 1260. In addition, processing liquid 82 is supplied to substrate W from nozzle 1620. Due to the rotation of substrate W, airflow 84 on the top surface of substrate W flows toward the outside of substrate W as it bends in the rotation direction of substrate W. When airflow 84 flows to the outside of substrate W, airflow 84 and processing liquid supplied to substrate W are introduced into first channel R1 between protrusion 1228 of outer cup 1220 and outer wall 1244 of inner cup 1240. Airflow 84 introduced into first channel R1 flows through second channel 84 and into discharge pipe 1700, and then is discharged to the outside of processing container 1200 through discharge pipe 1700.

[0116] A portion of the airflow 84 introduced into the first channel R1 may collide with the bottom wall 1222 of the outer cup 1220 and flow in the opposite direction. In this case, the airflow 84 that collides with and splashes back against the bottom wall 1222 collides with the protrusion 1228 and flows back into the space between the outer cup 1220 and the discharge pipe 1700. The reintroduced airflow 84 passes through the second channel R2 and flows into the discharge pipe 1700, and is then discharged to the outside of the processing container 1200 through the discharge pipe 1700. Meanwhile, due to the downward airflow in the first channel R1, the splashed airflow 84 does not flow back into the first channel R1.

[0117] In the following description, a substrate processing apparatus 1000 according to another embodiment of the present invention will be described with reference to the accompanying drawings.

[0118] Apart from the substrate processing apparatus and protrusion 1228 configuration according to the above embodiment, the substrate processing apparatus according to another embodiment is configured to be substantially the same as the substrate processing apparatus described above. Therefore, in the following, the same reference numerals are assigned to the same configurations, redundant descriptions are omitted, and the differences will be mainly described.

[0119] Figure 13 The structure of a substrate processing apparatus for processing a substrate by supplying liquid to a rotating substrate is illustrated schematically according to another embodiment of the invention.

[0120] According to another embodiment, the substrate processing apparatus 1000 includes a protrusion 1229 projecting inwardly from the inner surface of the side wall 1224 of the outer cup 1220. The protrusion 1229 is formed to extend along the inner surface of the side wall 1224 of the outer cup 1220. In this case, according to the embodiment, the protrusion 1228 extends to the side wall 1224 of the outer cup 1220 while maintaining an equal distance between the bottom wall 1222 and the protrusion 1228. On the other hand, according to another embodiment, the protrusion 1229 extends in a spiral shape along the inner surface of the side wall 1224 of the outer cup 1220. That is, according to another embodiment, the distance between the protrusion 1229 and the bottom wall 1222 of the outer cup 1220 is set to decrease from the top of the outer cup 1220 toward the bottom wall 1222.

[0121] Apart from the protrusion 1229, the substrate processing apparatus according to another embodiment is constructed in the same manner as the substrate processing apparatus according to the embodiment, and the omitted description can be referred to the description of the substrate processing apparatus according to the embodiment.

[0122] The above description illustrates the concept of the invention. Furthermore, while the foregoing describes embodiments of the inventive concept, it can be used in various other combinations, variations, and environments. That is, variations or modifications can be made to the inventive concept without departing from the scope of the inventive concept disclosed herein, its equivalents, and / or the technical or knowledge scope of those skilled in the art. The written embodiments describe the optimal state for realizing the technical spirit of the inventive concept and various changes can be made as needed for specific applications and purposes of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiments. Additionally, it should be understood that the appended claims include other embodiments.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: A processing container having an internal space; A support unit that supports and rotates the substrate within the internal space; as well as The exhaust unit discharges airflow from the internal space. The processing container includes: An external cup-shaped structure that provides the internal space; and An internal cup-shaped element, disposed within the internal space and spaced apart from the external cup-shaped element. The external cup-shaped object includes: Bottom wall; Side walls, the side walls extending upward from the outer edge of the bottom wall; and Top wall, which extends inward from the side wall. The internal cup-shaped component includes: The outer wall opposite to the side wall of the outer cup-shaped object; An inner wall opposite to the outer wall; and The top wall connecting the outer wall and the inner wall, and The emission unit includes: A discharge pipe, wherein the discharge pipe is disposed within the inner side of the internal cup-shaped object; and A pressure regulating component that forces airflow out of the internal space. The outer cup-shaped object includes a protrusion disposed on the side wall, the protrusion protruding toward the outer wall of the inner cup-shaped object, and A first channel is formed between the protrusion and the outer wall of the inner cup-shaped object, and a second channel is formed between the outer wall of the inner cup-shaped object and the discharge unit, wherein the width of the first channel and the width of the second channel are set to be equal.

2. The apparatus according to claim 1, wherein, The protrusion is formed to extend circumferentially along the side wall of the outer cup, and the distance between the protrusion and the bottom wall of the outer cup is uniform.

3. The apparatus according to claim 1, wherein, The protrusion is formed to extend circumferentially along the side wall of the outer cup, and the distance between the protrusion and the bottom wall of the outer cup gradually decreases in the direction from the top of the outer cup to the bottom wall.

4. The apparatus according to claim 1, wherein, The pressure of the airflow drawn in at the first channel is equal to the pressure of the airflow drawn in at the second channel and introduced into the first channel.

5. The apparatus according to claim 1, wherein, The top wall of the outer cup-shaped object includes: An outer top wall, which extends upward and slopes from the side wall of the outer cup-shaped object; and An inner top wall that extends downward from and slopes along the top wall of the outer cup-shaped structure. The inner top wall has holes for introducing airflow.

6. The apparatus according to claim 5, wherein, The inner top wall of the outer cup-shaped object includes a top guide portion disposed above the hole and a bottom guide portion disposed below the hole. The top guide and the bottom guide each include at least a partially curved surface, and The curved surfaces of the top guide and the bottom guide are configured inside the hole.

7. The apparatus according to claim 6, wherein, The curved surface of the top guide is curved in a direction opposite to the curvature direction of the curved surface of the bottom guide.

8. The apparatus according to claim 6, wherein, The curved surfaces of the top guide portion and the bottom guide portion are respectively configured with streamlined shapes.

9. The apparatus according to any one of claims 1 to 8, further comprising a liquid supply unit that supplies a processing liquid, the processing liquid being a photoresist liquid, to the substrate supported by the support unit.

10. An apparatus for processing a substrate, the apparatus comprising: A processing container having an internal space; A support unit that supports and rotates the substrate within the internal space; The exhaust unit discharges airflow from the internal space. The processing container includes: An external cup-shaped structure that provides the internal space; and An internal cup-shaped element, disposed within the internal space and spaced apart from the external cup-shaped element. The external cup-shaped object includes: Bottom wall; Side wall, the side wall extending upward from the bottom wall; An outer top wall, which slopes upward from the side wall; and An inner top wall that slopes downwards from the outer top wall. The inner top wall includes a top guide portion disposed above the hole and a bottom guide portion disposed below the hole, the hole being formed in the inner top wall. The top guide portion and the bottom guide portion are respectively configured inside the hole and at least partially include curved surfaces configured in a rounded shape, and The emission unit includes: A discharge pipe, wherein the discharge pipe is disposed within the inner side of the internal cup-shaped object; and A pressure regulating component that forces airflow out of the internal space. The outer cup-shaped object includes a protrusion disposed on the portion of the side wall of the outer cup-shaped object opposite to the outer wall of the inner cup-shaped object. A first channel is formed between the protrusion and the outer wall of the inner cup-shaped object, and a second channel is formed between the outer wall of the inner cup-shaped object and the discharge unit, wherein the width of the first channel and the width of the second channel are set to be equal.

11. The apparatus according to claim 10, wherein, The curved surfaces of the top guide portion and the bottom guide portion are respectively configured with streamlined shapes.

12. The apparatus according to claim 10, wherein, The curved surface of the top guide is curved in a direction opposite to the curvature direction of the curved surface of the bottom guide.

13. The apparatus according to claim 10, wherein, The width of the hole in the inner top wall decreases as it follows a direction from the top surface to the bottom surface of the inner top wall.

14. The apparatus according to claim 10, wherein, The pressure of the airflow drawn in at the first channel is equal to the pressure of the airflow drawn in at the second channel and introduced into the first channel.

15. An apparatus for processing a substrate, the apparatus comprising: A processing container having an internal space; A support unit that supports and rotates the substrate within the internal space; as well as The exhaust unit discharges airflow from the internal space. The processing container includes: An external cup-shaped structure that provides the internal space; An inner cup-shaped object, spaced apart from the outer cup-shaped object and placed within the inner space. The external cup-shaped object includes: Bottom wall; Side wall, the side wall extending upward from the bottom wall; An outer top wall, which slopes upward from the side wall; and An inner top wall that slopes downwards from the outer top wall. The inner top wall includes a top guide portion disposed above the hole and a bottom guide portion disposed below the hole, the hole being formed in the inner top wall. The top guide portion and the bottom guide portion are respectively configured inside the hole and include at least partially curved surfaces configured in an inverted round shape. The internal cup-shaped component includes: The outer wall opposite to the side wall of the outer cup-shaped object; An inner wall opposite to the outer wall; and The top wall connecting the outer wall and the inner wall, and The emission unit includes: A discharge pipe, wherein the discharge pipe is disposed within the inner side of the internal cup-shaped object; and A pressure regulating component that forces airflow out of the internal space. The outer cup-shaped object includes a protrusion disposed on the portion of the side wall of the outer cup-shaped object opposite to the outer wall of the inner cup-shaped object. The width of the first channel formed between the protrusion and the outer wall of the inner cup is set to be equal to the width of the second channel formed between the outer wall of the inner cup and the discharge pipe.

Images