Antenna Structure and Image Display Device

Abstract

An antenna structure and an image display device are provided. The antenna structure includes a passivation layer, an antenna element at least partially embedded in an upper portion of the passivation layer, and an insulating layer disposed on a top surface of the passivation layer to cover the antenna element. The spatial efficiency of the antenna structure is improved, and the thickness of the image display device is reduced, thereby improving the bending characteristics.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority of Korean Patent Application No. 10 - 2020 - 0177303, filed with the Korean Intellectual Property Office (KIPO) on December 17, 2020, the entire disclosure of which is incorporated herein by reference. Technical field

[0003] The present invention relates to an antenna structure and an image display device. More particularly, the present invention relates to an antenna structure including an antenna unit and a passivation layer, and an image display device including the antenna structure. Background art

[0004] With the development of information technology, wireless communication technologies such as Wi - Fi and Bluetooth are combined with image display devices in the form of smartphones. In this case, an antenna can be combined with an image display device to provide a communication function.

[0005] Recently, as a bendable image display device such as a flexible display, the demand for an antenna that can be applied to a flexible display is increasing.

[0006] However, when forming an additional thin film or structure for introducing an antenna, the overall thickness of the flexible display may increase, or the laminated structure for folding the flexible display may be changed. Therefore, the ideal folding or bending characteristics of the flexible display may deteriorate.

[0007] Therefore, a configuration for introducing an antenna in a limited space while achieving sufficient radiation and gain characteristics of the antenna is required.

[0008] For example, Korean Patent Laid - Open Application No. 2013 - 0113222 discloses an antenna integrated into a mobile terminal, but does not fully consider the antenna configuration as described above. Summary of the invention

[0009] According to one aspect of the present invention, there is provided an antenna structure having improved space efficiency and reliability.

[0010] According to one aspect of the present invention, there is provided an image display device including an antenna structure having improved space efficiency and reliability.

[0011] (1) An antenna structure, comprising: a passivation layer; an antenna unit at least partially embedded in an upper portion of the passivation layer; and an insulating layer provided on a top surface of the passivation layer for covering the antenna unit.

[0012] (2) According to the antenna structure of (1) above, wherein the antenna element is spaced apart from the bottom surface of the passivation layer in the thickness direction.

[0013] (3) According to the antenna structure of (2) above, wherein the antenna element includes a radiator, a transmission line extending from the radiator, and a signal pad connected to the end portion of the transmission line.

[0014] (4) According to the antenna structure of (3) above, wherein the passivation layer covers the radiator and at least partially exposes the signal pad.

[0015] (5) According to the antenna structure of (3) above, it further includes a first adhesive layer bonded to the bottom surface of the passivation layer.

[0016] (6) According to the antenna structure of (5) above, it further includes a circuit board disposed between the first adhesive layer and the antenna element and electrically connected to the signal pad of the antenna element.

[0017] (7) According to the antenna structure of (6) above, wherein the thickness of the first adhesive layer is greater than or equal to the thickness of the circuit board.

[0018] (8) According to the antenna structure of (5) above, it further includes a second adhesive layer formed on the top surface of the insulating layer.

[0019] (9) According to the antenna structure of (1) above, wherein the top surface of the passivation layer and the top surface of the antenna element are coplanar with each other.

[0020] (10) According to the antenna structure of (1) above, wherein the insulating layer includes a first insulating layer and a second insulating layer stacked in sequence starting from the top surface of the passivation layer, and the first insulating layer and the second insulating layer contain different insulating materials.

[0021] (11) An image display device, comprising: a display panel; and an antenna structure according to the above embodiments disposed on the display panel.

[0022] (12) According to the image display device of (11) above, it further includes a ground layer disposed below the display panel.

[0023] (13) According to the image display device of (11) above, wherein the antenna structure is stacked on the display panel such that the bottom surface of the passivation layer faces the display panel.

[0024] (14) According to the image display device of (13) above, it further includes: a first adhesive layer formed between the bottom surface of the passivation layer and the display panel; and a second adhesive layer formed on the top surface of the insulating layer of the antenna structure.

[0025] (15) The image display device according to (14) above, wherein the thickness of the first adhesive layer is 50 μm to 500 μm, and the thickness of the second adhesive layer is 20 μm to 200 μm.

[0026] (16) The image display device according to (14) above, further comprising a cover window disposed on the second adhesive layer.

[0027] (17) The image display device according to (14) above, further comprising an optical layer disposed between the first adhesive layer and the display panel.

[0028] According to an embodiment of the present invention, the antenna structure may include a passivation layer, an antenna unit pattern at least partially buried in an upper portion of the passivation layer, and an insulating layer stacked on the passivation layer. The antenna unit may be included in an adhesive layer or a protective layer of the image display device without inserting an additional antenna substrate interposed in the antenna structure.

[0029] Therefore, the total thickness of the image display device including the antenna structure can be reduced. Therefore, flexibility and mechanical durability can be enhanced while maintaining the antenna radiation performance, and thus an image display device including an antenna with high reliability can be realized.

[0030] The first adhesive layer may be disposed between the antenna structure and the display panel of the image display device. The first adhesive layer may have a predetermined thickness range. Therefore, it is possible to prevent the ground layer and / or the conductive member of the display panel from excessively absorbing the signal radiated from the antenna unit, and the circuit board can be stably disposed.

[0031] In some embodiments, a ground layer may be disposed below the display panel included in the image display device. In this case, the conductive member and the ground layer of the display panel may be together provided as a ground portion of the antenna unit. Therefore, the vertical radiation characteristics of the antenna unit can be achieved with high efficiency and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 and Figure 2 is a schematic cross-sectional view showing an antenna structure according to an exemplary embodiment.

[0033] Figure 3 is a schematic top plan view showing an antenna unit according to an exemplary embodiment.

[0034] Figure 4 and Figure 5 is a schematic cross-sectional view showing an image display device according to an exemplary embodiment.

[0035] Figure 6 is a schematic top plan view showing an image display device according to an exemplary embodiment. Detailed Implementation Modes

[0036] According to an exemplary implementation mode of the present invention, an antenna structure including a buried antenna unit structure is provided.

[0037] The antenna structure may include, for example, a microstrip patch antenna, a monopole antenna, or a dipole antenna in the form of a transparent film. The antenna structure can be applied to a communication device for mobile communication in a high-frequency band or an ultra-high-frequency band corresponding to, for example, 3G, 4G, 5G, or higher mobile communication.

[0038] According to an exemplary implementation mode of the present invention, an image display device including the antenna structure is also provided. The application of the antenna structure is not limited to the image display device, and the antenna structure can be applied to various objects or structures, such as vehicles, household appliances, buildings, etc.

[0039] Hereinafter, the present invention will be described in detail with reference to the drawings. However, those skilled in the art will understand that these implementation modes described with reference to the drawings are for further understanding the spirit of the present invention and are not intended to limit the subject matter to be protected disclosed in the detailed description and the appended claims.

[0040] Terms such as "first", "second", "upper", "lower", "top", "bottom", "front", "rear", etc. used in the text do not represent absolute positions but are used relatively to distinguish different elements or different positions.

[0041] In the drawings, the first direction shown may be the width direction of the passivation layer 100 or the antenna structure, the second direction may be the length direction of the passivation layer 100 or the antenna structure, and the third direction may be the thickness direction of the antenna structure.

[0042] Figure 1 and Figure 2 are schematic cross-sectional views showing the antenna structure according to an exemplary implementation mode.

[0043] For example, Figure 1 is a cross-sectional view taken along the first direction in the thickness direction (e.g., the third direction) of the antenna structure, and Figure 2 is a cross-sectional view taken along the second direction in the thickness direction of the antenna structure.

[0044] Referring to Figure 1 the antenna structure may include a passivation layer 100, an antenna unit 120 at least partially embedded in the upper part of the passivation layer 100, and an insulating layer 110 provided on the top surface of the passivation layer 100 for covering the antenna unit 120.

[0045] In an exemplary embodiment, the passivation layer 100 can be used as an insulating layer that can electrically isolate the antenna unit 120 from other materials.

[0046] For example, the passivation layer 100 can include an organic insulating material such as an epoxy resin, an acrylic resin, a silicone resin, or a polyimide resin, or an inorganic insulating material such as silicon oxide or silicon nitride.

[0047] In some embodiments, the thickness of the passivation layer 100 can be 5 μm or less. Therefore, compared with the case of inserting an additional antenna substrate layer, the thickness of the antenna structure can be reduced.

[0048] The insulating layer 110 can be used as a substrate for the antenna unit 120, for example. In this case, an additional substrate for the antenna unit 120 can be not inserted. Therefore, the thickness and / or volume of the antenna structure can be reduced. Thus, the space efficiency of the antenna structure and the image display device including the antenna structure can be improved, and the flexibility, durability, and driving reliability can also be improved.

[0049] The insulating layer 110 can include polyester resins such as polyethylene terephthalate, poly(ethylene isophthalate), polyethylene naphthalate, and poly(butylene terephthalate); cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as poly(methyl)methacrylate and poly(ethyl)methacrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, cycloolefin, or polyolefin having a norbornene structure and ethylene-propylene copolymer; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allylated resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. They can be used alone or in combination of two or more.

[0050] In some embodiments, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) can be included in the insulating layer 110. In some embodiments, the insulating layer 110 can include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, etc.

[0051] In some embodiments, the dielectric constant of the insulating layer 110 can be adjusted to a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that driving in a desired high-frequency band or ultra-high-frequency band may not be achieved.

[0052] In an exemplary embodiment, the insulating layer 110 may include a first insulating layer 112 and a second insulating layer 114 that are sequentially stacked starting from the top surface of the passivation layer 100.

[0053] For example, the first insulating layer 112 may serve as a protective layer capable of protecting the antenna unit 120 from external impacts during the lamination process of the antenna structure. The first insulating layer 112 may include a material selected from materials that can serve as a protective layer, such as the above-described organic and / or inorganic insulating materials.

[0054] For example, the second insulating layer 114 may serve as a separation adhesive layer to attach the carrier substrate to the top surface of the insulating layer 110 during the lamination process of the antenna structure. For example, a protective film may be attached to the top surface of the insulating layer 110 after peeling off the carrier substrate. The second insulating layer 114 may include a material that takes into account easy attachment / detachment, and may include, for example, the organic insulating material described above.

[0055] In some embodiments, considering the above characteristics, the first insulating layer 112 and the second insulating layer 114 may include different dielectric materials. Therefore, the insulating layer 110 can simultaneously serve as a protective layer and a separation adhesive layer.

[0056] In some embodiments, the total thickness of the insulating layer 110 may be 10 μm or less. In this case, the antenna unit 120 may be disposed on a relatively thin substrate. Therefore, compared with the case of inserting an additional antenna substrate layer, the thickness of the antenna structure can be reduced.

[0057] In some exemplary embodiments, the antenna unit 120 may be spaced apart from the bottom surface of the passivation layer 100 in the thickness direction. Therefore, over-absorption of signals by the conductive member or the ground layer of the image display device can be prevented, thereby improving driving reliability.

[0058] In some embodiments, the top surfaces of the passivation layer 100 and the antenna unit 120 are coplanar with each other. For example, the top surface of the passivation layer 100 and the top surface of the antenna unit 120 may contact the bottom surface of the insulating layer 110.

[0059] Therefore, at least a part of the antenna unit 120 may be substantially covered by the passivation layer 100, so that the above-described driving reliability and insulating effect can be fully achieved. In addition, when manufacturing the antenna structure, the antenna unit 120 and the passivation layer 100 may be sequentially stacked starting from the insulating layer 110, so that the antenna unit 120 can be stably formed even without an additional antenna substrate.

[0060] Referring to Figure 2, in an exemplary embodiment, the antenna unit 120 may include a radiator 122, a transmission line 124 extending from the radiator 122, and a signal pad 126 connected to an end portion of the transmission line 124.

[0061] In some embodiments, the passivation layer 100 may cover the radiator 122 and at least partially expose a top surface of the signal pad 126, and the circuit board 150 may be bonded and electrically connected to the exposed portion of the signal pad 126. The circuit board 150 may include, for example, a flexible printed circuit board (FPCB).

[0062] For example, the circuit board 150 may extend and may be electrically connected to a main board of the image display device. In this case, the antenna unit 120 and an antenna driving integrated circuit (IC) chip mounted on the main board may be electrically connected to each other. Accordingly, a feed / control signal (e.g., a phase, a beam tilt signal, etc.) may be applied from the antenna driving IC chip to the antenna unit 120.

[0063] For example, a plurality of antenna units 120 may be embedded in the passivation layer 100 to be physically and electrically spaced apart from each other. Accordingly, an antenna structure having a relatively small thickness may be obtained while maintaining radiation performance and antenna gain of the antenna structure.

[0064] In some embodiments, the first adhesive layer 130 may be attached to a bottom surface of the passivation layer 100. For example, the circuit board 150 may be disposed between the first adhesive layer 130 and the antenna unit 120. For example, an image display device and an antenna structure, which will be described later, may be combined through the first adhesive layer 130.

[0065] The first adhesive layer 130 may include, for example, a transparent resin film, an adhesive material, or an inorganic insulating material that may be included in the above-described insulating layer 110.

[0066] In some embodiments, a thickness of the first adhesive layer 130 may be greater than or equal to a thickness of the circuit board 150. In this case, when the circuit board 150 is disposed between the first adhesive layer 130 and the first insulating layer 112, the first adhesive layer having a sufficient thickness may be used to stably fix the circuit board 150. Accordingly, an antenna structure having improved durability and reliability may be achieved.

[0067] In some embodiments, the second adhesive layer 140 may be disposed on a top surface of the insulating layer 110. For example, the second adhesive layer 140 may include a material substantially the same as the material included in the first adhesive layer 130. For example, a cover window of an image display device, which will be described later, may be disposed on the insulating layer 110 through the second adhesive layer 140.

[0068] Figure 3is a schematic top plan view showing an antenna unit according to an exemplary embodiment.

[0069] Referring Figure 3 , the antenna unit 120 may be disposed on the insulating layer 110. For example, a plurality of antenna units 120 may be arranged in an array along the width direction (e.g., the first direction) of the insulating layer 110 or the antenna structure, thereby forming a horizontal row of antenna patterns.

[0070] As described above, the antenna unit 120 may include a radiator 122 and a transmission line 124. The radiator 122 may have, for example, the shape of a polygonal flat plate, and the transmission line 124 may extend from one side of the radiator 122. The transmission line 124 may be formed as a single member substantially integral with the radiator 122 and may have a narrower width than the radiator 122.

[0071] The antenna unit 120 may further include a signal pad 126. The signal pad 126 may be connected to the end portion of the transmission line 124. In one embodiment, the signal pad 126 may serve as a member substantially integral with the transmission line 124, and the end portion of the transmission line 124 may serve as the signal pad 126.

[0072] In some embodiments, a ground pad 128 may be disposed around the signal pad 126. For example, a pair of ground pads 128 may be disposed to face each other with the signal pad 126 interposed therebetween. The ground pad 128 may be electrically and physically separated from the transmission line 124 and the signal pad 126.

[0073] The antenna unit 120 or the radiator 122 may be designed, for example, to have a resonance frequency corresponding to a high frequency band or an ultra-high frequency band such as a 3G, 4G, 5G, or higher frequency band. For example, the resonance frequency of the antenna unit may be about 10 GHz or higher, or in the range of about 20 GHz to 45 GHz.

[0074] In some embodiments, radiators 122 having different sizes may be disposed on the bottom surface of the insulating layer 110. In this case, the antenna unit 120 may be used as a multi-radiator or multi-band antenna that radiates in multiple resonance frequency bands.

[0075] The antenna unit 120 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. They may be used alone or in combination.

[0076] In one embodiment, the antenna unit 120 may include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa)) to achieve a low resistance and a fine linewidth pattern.

[0077] In some embodiments, the antenna unit 120 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), etc.

[0078] In some embodiments, the antenna unit 120 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna unit may include a bilayer structure of a transparent conductive oxide layer - metal layer, or a trilayer structure of a transparent conductive oxide layer - metal layer - transparent conductive oxide layer. In this case, flexibility can be improved by the metal layer, and the signal transmission speed can be increased by the low resistance of the metal layer. Corrosion resistance and transparency can be improved by the transparent conductive oxide layer.

[0079] The antenna unit 120 may include a blackened portion, so that the reflectivity of the surface of the antenna unit 120 can be reduced to suppress the visual recognition of the antenna unit due to light reflection.

[0080] In one embodiment, the surface of the metal layer included in the antenna unit 120 may be converted into a metal oxide or a metal sulfide to form a blackened layer. In one embodiment, a blackened layer, such as a black material coating or plating, may be formed on the antenna unit 120 or the metal layer. The black material or plating may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or an oxide, sulfide, or alloy containing at least one of them.

[0081] Considering the reflection reduction effect and the antenna radiation characteristics, the composition and thickness of the blackened layer can be adjusted.

[0082] In some embodiments, the radiator 122 and the transmission line 124 may include a mesh pattern structure to improve the light transmittance. In this case, a dummy mesh pattern (not shown) may be formed around the radiator 122 and the transmission line 124.

[0083] Considering the reduction of the feed resistance, the noise absorption efficiency, the improvement of the horizontal radiation characteristics, etc., the signal pad 126 and the ground pad 128 may be formed as solid patterns including the above-mentioned metal or alloy.

[0084] In some embodiments, the radiator 122 may have a mesh pattern structure, and at least a part of the transmission line 124 may have a solid metal pattern structure.

[0085] The radiator 122 may be disposed in the display area of the image display device, and the signal pad 126 and the ground pad 128 may be disposed in the non-display area or the bezel area of the image display device. At least a part of the transmission line 124 may also be disposed in the non-display area or the bezel area of the image display device.

[0086] The above-described antenna structure may be disposed on the image display device to provide the functions of a transparent film and an antenna. The insulating layer 110 may serve as a substrate for the antenna unit 120, and thus an additional base layer or substrate for the antenna may not be inserted.

[0087] Accordingly, the total thickness of the image display device including the antenna structure may be reduced while maintaining the antenna radiation performance, thereby improving flexibility and durability to provide an image display device including an antenna with high reliability.

[0088] If an additional separate substrate layer for the antenna is inserted, the neutral plane for folding the image display device may be changed, thereby generating excessive stress at a weak portion of the image display device.

[0089] However, according to an exemplary embodiment, an additional antenna substrate may not be inserted, and thus the neutral plane of the image display device may be maintained. Accordingly, stress applied to a weak portion inside the image display device may be suppressed while maintaining the antenna radiation performance. Therefore, an image display device including an antenna with enhanced folding characteristics and reliability may be realized.

[0090] In addition, an additional thin film or layer may not be inserted in the display area, thereby preventing a reduction in the brightness of the image display device.

[0091] Figure 4 and Figure 5 are schematic cross-sectional views showing an image display device according to an exemplary embodiment.

[0092] Referring to Figure 4 and Figure 5 , the image display device 200 may include a display panel 210 and the above-described antenna structure disposed on the display panel 210. For example, the antenna structure may be stacked on the display panel 210.

[0093] The display panel 210 may include a pixel electrode 212, a pixel defining layer 214, a display layer 216, a counter electrode 218, and a encapsulation layer 219 disposed on a panel substrate 211.

[0094] A pixel circuit including a thin film transistor (TFT) may be formed on the panel substrate 211, and an insulating layer covering the pixel circuit may be formed. The pixel electrode 212 may be electrically connected to, for example, the drain electrode of the TFT on the insulating layer.

[0095] The pixel defining layer 214 may be formed on the insulating layer to expose the pixel electrode 212, thereby defining a pixel region. The display layer 216 may be formed on the pixel electrode 212, and the display layer 216 may include, for example, a liquid crystal layer or an organic light emitting layer. Preferably, the display layer 216 may include an organic light emitting layer, and the display panel 210 may be an OLED panel.

[0096] The counter electrode 218 may be disposed on the pixel defining layer 214 and the display layer 216. The counter electrode 218 may be used as, for example, a common electrode or a cathode of the image display device 200. The encapsulation layer 219 for protecting the display panel 210 may be stacked on the counter electrode 218.

[0097] In some embodiments, the conductive member included in the display panel 210 may be used as the ground portion of the antenna unit 120. The conductive member may include, for example, the gate electrode of the TFT, various wirings such as scan lines or data lines, or various electrodes such as the pixel electrode 212 and the counter electrode 218.

[0098] In one embodiment, various structures including a conductive material disposed under the display panel 210 may be used as the antenna ground portion. For example, a metal plate (e.g., a stainless steel plate, e.g., a SUS plate), a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, a digital converter, etc. may be used as the ground portion of the antenna unit 120.

[0099] In some embodiments, the ground layer 240 may be disposed under the display panel 210. In this case, the conductive member of the display panel 210 and the ground layer 240 may be used together as the ground portion of the radiator 122. Therefore, the vertical radiation characteristics of the radiator 122 can be achieved with high efficiency and high reliability.

[0100] For example, the ground layer 240 may be disposed under the display panel 210 and may be provided as a metal plate, a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, or a digital converter.

[0101] For example, the ground layer 240 may include the above-mentioned metal or alloy.

[0102] In some embodiments, the cover window 230 may be disposed on the above-mentioned antenna structure. For example, the cover window 230 may be stacked on the second adhesive layer 140. For example, the insulating layer 110 and the cover window 230 may be attached to each other through the second adhesive layer 140.

[0103] For example, the top surface of the insulating layer 110 of the antenna structure may be disposed facing or towards the cover window 230. In this case, the top surface of the insulating layer 110 may be closer to the cover window 230 than the bottom surface of the insulating layer 110.

[0104] For example, the cover window 230 can be used as a window lid, cover glass, protective cover film, or protective cover layer of an image display device. In this case, the cover window 230 can provide a viewing surface or the outermost surface to the user of the image display device 200.

[0105] The cover window 230 can include, for example, glass or a flexible resin material such as polyimide, polyethylene terephthalate, acrylic resin, silicone resin, etc.

[0106] In some embodiments, the first adhesive layer 130 can be disposed between the antenna structure and the display panel 210. The first adhesive layer 130 can include, for example, a transparent resin film, an adhesive material, or an inorganic insulating material that can be included in the above-mentioned support layer 100.

[0107] For example, the first adhesive layer 130 can adhere the display panel 210 or the optical layer 230 to the antenna structure. In this case, the first adhesive layer 130 can include, for example, a pressure-sensitive adhesive (PSA) or an optically clear adhesive (OCA) containing an acrylic resin, a silicone resin, an epoxy resin, etc.

[0108] For example, if the distance between the display panel 210 or the ground layer 240 and the antenna unit 120 is too small, the applied signal may not form an electric field in the radiator 122 and may be absorbed by the conductive member of the display panel 210 or the ground layer 240, resulting in signal loss.

[0109] In some embodiments, the thickness of the first adhesive layer 130 can be 50 μm to 500 μm, and the thickness of the second adhesive layer 140 can be 20 μm to 200 μm.

[0110] In this case, while sufficiently providing radiation characteristics by preventing signal loss from the antenna unit 120, an improved flexibility of the antenna structure or the image display device 200 can be achieved. Therefore, an antenna structure or an image display device with improved signal efficiency, radiation characteristics, and high reliability can be realized.

[0111] In some embodiments, the thickness of the first adhesive layer 130 can be greater than the thickness of the second adhesive layer 140.

[0112] In some embodiments, the optical layer 220 can be disposed between the first adhesive layer 130 and the display panel 210.

[0113] The optical layer 220 can be, for example, a coating-type polarizer or a polarizing layer including a polarizing plate. The coating-type polarizer can include a liquid crystal coating including a polymerizable liquid crystal compound and a dichroic dye. In this case, the optical layer 220 can also include an alignment layer for providing alignment to the liquid crystal coating.

[0114] For example, the polarizer may include a polyvinyl alcohol-based polarizer and a protective film attached to at least one surface of the polyvinyl alcohol-based polarizer.

[0115] Hereinafter, a method of manufacturing an image display device 200 according to an exemplary embodiment is provided.

[0116] For example, a laminate including an insulating layer 110 that may include a first insulating layer 112 and a second insulating layer 114 and a carrier substrate adhered to the second insulating layer 114 may be prepared. For example, the carrier substrate may include an inorganic insulating material such as glass.

[0117] The above metal or alloy may be patterned on the insulating layer 110 to form an antenna unit 120.

[0118] For example, a passivation layer 100 may be formed on the insulating layer 110 such that at least a part of the antenna unit 120 may be embedded therein. For example, the passivation layer 100 may be formed to cover the radiator 122 and at least partially expose the top surface of the signal pad 126.

[0119] Thereafter, the carrier substrate may be peeled off from the second insulating layer 114, and a protective film may be attached to the second insulating layer 114 to form an antenna structure.

[0120] For example, the signal pad 126 of the antenna unit 120 may be bonded to the circuit board 150.

[0121] In an exemplary embodiment, the above antenna structure may be flipped and laminated on a stack of a first adhesive layer 130 - an optical layer 220 - a display panel 210.

[0122] Thereafter, the image display device 200 may be formed by laminating a second adhesive layer 140 and a cover window 230 on the insulating layer 110.

[0123] Figure 6 is a schematic top plan view showing an image display device according to an exemplary embodiment.

[0124] Referring to Figure 6 , the image display device 200 may be formed in the form of a smart phone, for example, and Figure 6 shows the front or window surface of the image display device 200.

[0125] The front of the image display device 200 may include a display area DA and a non-display area NDA. The non-display area NDA may correspond to a light-shielding portion or a border portion of the image display device, for example.

[0126] The antenna unit 120 included in the above antenna structure may be disposed toward the front of the image display device 200 and may be disposed on the display panel 210.

[0127] In an exemplary embodiment, the above antenna structure may be disposed on the display panel 210. In this case, the antenna unit 120 may be integrated with the image display device 200 without an additional substrate layer. Accordingly, the thickness and / or volume of the image display device 200 may be reduced, and thus the bending characteristics and durability of the image display device 200 may be improved.

[0128] In one embodiment, at least a portion of the radiator 122 and at least a portion of the transmission line 124 may overlap the display area DA. In this case, at least a portion of the radiator 122 and at least a portion of the transmission line 124 may include a mesh pattern structure, so that a reduction in light transmittance due to the radiator 122 and the transmission line 124 may be prevented. The signal pad 126 and the ground pad 128 included in the antenna unit 120 may be formed of a solid metal pattern and may be disposed in the non-display area NDA to prevent deterioration of image quality.

[0129] In some embodiments, the circuit board 150 may be bent and extended to the rear of the image display device 200 and may be electrically connected to the main board on which the antenna driving IC chip is mounted. Accordingly, feeding and antenna driving control of the antenna unit 120 by the antenna driving IC chip may be achieved.

[0130] As described above, the antenna unit 120 may be substantially integrally formed with the insulating layer 110 or the first adhesive layer 130 of the image display device 200 without an additional antenna substrate layer, so that the thickness of the image display device 200 and the antenna structure may be reduced. Accordingly, an antenna structure and an image display device 200 having flexibility and high reliability may be obtained.

Claims

1. An image display device, comprising: A display panel; And An antenna structure disposed on the display panel, wherein the antenna structure includes: A passivation layer; An antenna unit at least partially embedded in the upper portion of the passivation layer; and An insulating layer disposed on the top surface of the passivation layer for covering the antenna unit, wherein the antenna structure is stacked on the display panel such that the bottom surface of the passivation layer faces the display panel, and The top surface of the passivation layer and the top surface of the antenna unit are coplanar with each other, and the antenna unit is spaced apart from the bottom surface of the passivation layer.

2. The image display device according to claim 1, wherein The antenna unit includes a radiator, a transmission line extending from the radiator, and a signal pad connected to the end portion of the transmission line.

3. The image display device according to claim 2, wherein The passivation layer covers the radiator and at least partially exposes the signal pad.

4. The image display device according to claim 2, wherein It further includes a first adhesive layer bonded to the bottom surface of the passivation layer.

5. The image display device according to claim 4, wherein It further includes a circuit board disposed between the first adhesive layer and the antenna unit and electrically connected to the signal pad of the antenna unit.

6. The image display device according to claim 5, wherein The thickness of the first adhesive layer is greater than or equal to the thickness of the circuit board.

7. The image display device according to claim 4, characterized in that, It further includes a second adhesive layer formed on the top surface of the insulating layer.

8. The image display device according to claim 1, wherein, The insulating layer includes a first insulating layer and a second insulating layer sequentially stacked starting from the top surface of the passivation layer, and The first insulating layer and the second insulating layer contain different insulating materials from each other.

9. The image display device according to claim 1, wherein It further includes a ground layer disposed below the display panel.

10. The image display device according to claim 1, wherein It further includes: A first adhesive layer formed between the bottom surface of the passivation layer and the display panel; and A second adhesive layer formed on the top surface of the insulating layer of the antenna structure.

11. The image display device according to claim 10, wherein The thickness of the first adhesive layer is 50 μm to 500 μm, and the thickness of the second adhesive layer is 20 μm to 200 μm.

12. The image display device according to claim 10, wherein It further includes a cover window disposed on the second adhesive layer.

13. The image display device according to claim 10, wherein It further includes an optical layer disposed between the first adhesive layer and the display panel.

Images