Method for sorting multiple chips

Abstract

A method for sorting a plurality of chips is disclosed. The method is performed by: supporting an attachment tape in which a plurality of chips classified into a plurality of grades are arranged in a matrix pattern on an adhesive layer; identifying each chip corresponding to a specific grade among the plurality of grades; grouping the chips identified as the specific grade among adjacent chips, each chip belonging to one of a plurality of groups; selecting one of the plurality of groups as a first group; picking up all chips identified as the specific grade from the attachment tape, the chips being included in the first group; and attaching the picked-up chips to a first area of a carrier in an array arrangement of the picked-up chips.

Description

Technical Field

[0001] The present invention relates to a method of sorting chips among a plurality of chips by selectively transferring chips classified into a specific grade from an attachment tape. Background Art

[0002] While performing multiple semiconductor manufacturing processes, the step of transferring multiple chips occurs quite frequently. Typically, the chips in the semiconductor chip manufacturing process have been processed, reclassified, and transferred to the subsequent steps, and the chips are loaded onto the attachment tape.

[0003] Chips that can be identified as various grades are mixed on the attachment tape. Each chip has been graded according to a specific grade, and then the chips belonging to a specific grade need to be quickly loaded onto the carrier for subsequent processing.

[0004] Therefore, in order to quickly transfer multiple chips belonging to a specific rank, a chip sorting method must be able to selectively pick up selected chips corresponding to a specific rank and load them onto a carrier. In particular, according to the prior art, all chips arranged at the same pitch in a specific area are picked up and transported, regardless of the rank of each chip. Therefore, a re-sorting step may be required to sort the transferred chips. Therefore, a chip sorting method is needed to selectively pick up selected chips from a plurality of chips arranged in a specific area. Summary of the Invention

[0005] The present invention provides an apparatus for selectively transferring a plurality of chips in a predetermined area in a graded manner without causing damage to the chips.

[0006] According to an exemplary embodiment of the present invention, a method for sorting a plurality of chips is disclosed. The method is performed by: supporting an attachment tape, wherein a plurality of chips classified into a plurality of grades are arranged in a matrix pattern on an adhesive layer; identifying chips corresponding to a particular grade in the plurality of grades; grouping the chips of the particular grade between chips identified as being adjacent to each other, wherein each chip belongs to one of a plurality of groups; selecting one of the plurality of groups as a first group; picking up all chips identified as the particular grade from the attachment tape, the chips being included in the first group; and attaching the picked-up chips to a first area of a carrier in an array arrangement of the picked-up chips.

[0007] In an exemplary embodiment, the groups may be arranged in a zigzag pattern.

[0008] In an exemplary embodiment, the method may further include: selecting a second group adjacent to the first group; picking up all chips identified as a specific grade included in the second group from the attachment tape; and attaching the picked-up chips to a second area of the carrier.

[0009] In an exemplary embodiment, the method may further include filling chips belonging to a specific level from the attach tape into the vacancies in the first area and the second area.

[0010] Here, picking up all chips identified as a specific grade may include: selectively irradiating an ultraviolet laser to a partial area on the chip attach tape where the chips of the specific grade are located to selectively cure the partial area; and picking up the chips located in the cured partial area from the attach tape.

[0011] Further, the attachment tape may include a base layer and an adhesive layer pattern formed of an ultraviolet curable resin on the base layer.

[0012] Here, the adhesive layer may include a plurality of adhesive layer patterns, each of which is in a dot shape. Further, the adhesive layer may include a plurality of adhesive layer patterns, each of which is in a stripe shape and arranged in a matrix pattern.

[0013] According to an exemplary embodiment, a plurality of chips corresponding to a specific grade can be selectively transferred and loaded onto a stage without being damaged. Therefore, the chips corresponding to the specific grade can be efficiently sorted on the stage.

[0014] At the same time, it is possible to selectively transfer selected chips from a plurality of chips without damaging the plurality of chips. Therefore, it is possible to selectively pick up only selected chips from a plurality of chips arranged in a specific area. Consequently, the re-sorting step of sorting the transferred chips can be omitted. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a cross-sectional view illustrating an apparatus for transferring a chip according to an exemplary embodiment of the present invention.

[0016] Figure 2 is a cross-sectional view illustrating an attachment tape to which a plurality of chips are attached.

[0017] Figure 3 is a top view illustrating one example of an attachment tape.

[0018] Figure 4 is a top view illustrating another example of the attachment tape.

[0019] Figure 5 is a flowchart illustrating a method of transferring a chip according to an exemplary embodiment of the present invention.

[0020] Figure 6 is a top view illustrating the arrangement of chips attached to the attachment tape in each level.

[0021] Figure 7 This means that the chip corresponding to a specific level will be Figure 6 A top view of the method of attaching the tape assortment to the carrier. DETAILED DESCRIPTION

[0022] While the various embodiments are susceptible to various modifications and alternative forms, details thereof have been shown by way of example in the drawings and will be described in detail. However, it should be understood that it is not intended to limit the claimed invention to the specific embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the claims.

[0023] Hereinafter, specific embodiments of a raceway unit and an OHT having the raceway unit will be described in detail with reference to the drawings. However, the present invention can be implemented in different forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art. Throughout the text, similar reference numerals refer to similar elements. In the drawings, the sizes of layers and regions are exaggerated for clarity of illustration. Terms such as first, second, etc. may be used to describe various elements, but the above-mentioned components defined by the above-mentioned terms should not be limited. The above terms are only used to distinguish one component from other components. For example, in the present invention, similar naming can be performed without departing from the scope of the first component to the second component, and the second component to the first component can also be named.

[0024] The terms used herein are for the purpose of describing specific exemplary embodiments only and are not intended to limit the present inventive concept. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that when the terms "comprises" and / or "includes" are used in this specification, they specify the presence of the stated features, integers, steps, operations, components, and / or assemblies, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, assemblies, and / or groups thereof.

[0025] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as understood by those of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries, unless expressly defined herein, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and not in an idealized or overly formal sense.

[0026] Figure 1 is a cross-sectional view illustrating an apparatus for transferring a chip according to an exemplary embodiment of the present invention. Figure 2 is a cross-sectional view showing an attach tape to which a plurality of chips are attached.

[0027] Reference Figure 1 and Figure 2 The device 100 for transferring chips according to an embodiment of the present invention includes a tape support 20, an ultraviolet (UV) laser source 60, and a pick-up tool 30. The device 100 can pick up a plurality of chips 12 attached to an attachment tape 14 and place the chips 12 on a substrate (not shown). The attachment tape 14 and the plurality of chips 12 attached to the attachment tape 14 are defined as an object 10. Each chip 12 includes a chip body 12a and a chip pad 12b.

[0028] The attachment tape 14 includes a base layer 14a and adhesive layer patterns 14b formed on the base layer 14a using a UV-curable resin. When UV rays are irradiated on the adhesive layer patterns 14b, each adhesive layer pattern 14b exhibits a second adhesive force that is reduced from the first adhesive force. Because the chip 12 is adhered to the adhesive layer patterns 14b under the second adhesive force, the chip 12 located on the adhesive layer patterns 14b can be easily separated from the attachment tape 14. Because the adhesive layer patterns 14b do not cover the entire area of the base layer 14a but are patterned to cover a portion thereof, the pickup tool 30 can easily pick up the chip from the attachment tape 14.

[0029] The tape support portion 20 supports the attachment tape 14 having the plurality of chips 12 attached to the adhesive layer pattern 14b. For example, the tape support portion 20 may support the attachment tape 14 by holding the outer circumference of the attachment tape 14.

[0030] The belt support 20 may include a support ring 24 for supporting the outer periphery of the attachment belt 14 and an extension ring 26 for extending the attachment belt 14 by lowering the support ring 24 and the mounting frame 16 .

[0031] The UV laser source 60 is disposed below the tape support 20 and is configured to be movable toward the attachment tape 14. For example, the UV laser source 60 can be moved horizontally or vertically. The UV laser source 60 selectively irradiates the area of the attachment tape 14 where a selected chip is located with UV laser light. Specifically, as the UV laser source 60 moves, the UV laser light is selectively irradiated onto the selected area of the attachment tape 14. Therefore, when one of the adhesive layer patterns 14b in the selected area is selectively cured, the adhesive layer pattern 14b has a second adhesive force that is reduced from the first adhesive force.

[0032] In addition, since the UV laser source is turned on / off, the UV laser source 60 selectively irradiates the UV laser onto certain adhesive layer patterns 14b located in the selected area, while not irradiating the UV laser onto other adhesive layer patterns 14b. Therefore, certain adhesive layer patterns 14b located in the selected area can be selectively cured.

[0033] Therefore, as the ultraviolet laser light source 60 is moved and turned on and off, certain adhesive layer patterns 14b can be cured. The chips 12 that were previously tightly bonded to certain adhesive layer patterns 14b in the selected area lose their first adhesive force and become weakly bonded to certain adhesive layer patterns 14b. Therefore, since the pickup tool 30 can selectively pick up the selected chips 12 in the selected area of the attachment tape 14, damage to the chips that may be caused during the pickup process can be suppressed, and the pickup process can be easily performed to selectively pick up multiple chips 12 from the attachment tape 14.

[0034] The ultraviolet laser source 60 may be connected to a horizontal driving unit 70. The horizontal driving unit 70 may move the ultraviolet laser source 60 in a horizontal direction, ie, in an X direction and a Y direction.

[0035] The horizontal driving unit 70 may include, for example, a pair of guide rails (not shown) disposed to cross each other and a driving source (not shown) using a cylinder or a motor generating a driving source to move the ultraviolet laser source 60 along the guide rails.

[0036] The pick-up tool 30 is provided above the tape support 20 so as to be movable toward the attachment tape 14. The pick-up tool 30 picks up the chip 12 located in a selected area from the attachment tape 14 and then places the chip 12.

[0037] The pick-up tool 30 may include an adhesive layer having a flat surface thereunder. The adhesive layer may pick up the chip 12 from the base layer 14a. Alternatively, the pick-up tool 30 may pick up the chip 12 by using a vacuum force.

[0038] Here, the pick-up tool 30 may selectively pick up the chip 12 having the weakened adhesive force to the second adhesive force from the base layer 14 a while the flat surface of the pick-up tool 30 is in full contact with the selected area of the attachment tape 14 .

[0039] The pick-up tool 30 may be disposed above an object supported by the tape support 20 for transferring the object, and may be mounted on a tool driving unit 40. The tool driving unit 40 may drive the pick-up tool 30 in horizontal and vertical directions so that the pick-up tool 30 picks up the chip 12 separated from the attachment tape 14 and transfers the chip 12.

[0040] In addition, a vision unit 50 for determining the position of the chip 12 may be provided above the object 10 supported by the tape support 20. The vision unit 50 may acquire an image of the chip 12 to be picked up and obtain the position coordinates of the chip 12 from the acquired chip image.

[0041] Figure 3 is a top view illustrating one example of an attachment tape. Figure 4 is a top view illustrating another example of the attachment tape.

[0042] Reference Figure 3 The attachment tape 14 may include a base layer 14 a and adhesive layer patterns 14 b located on the base layer 14 a and arranged in dot shapes.

[0043] The adhesive layer pattern 14b arranged in dots partially overlaps each chip 12. Therefore, the adhesive layer pattern 14b does not fix the entire area of each chip 12 to the die attach tape 14, but partially adheres each chip to the die attach tape 14.

[0044] Certain adhesive layer patterns 14b define selected areas 14c of the attachment tape 14. In the selected areas 14c, certain adhesive layer patterns 14d may be cured, while other adhesive layer patterns 14e may remain in an uncured state.

[0045] Therefore, when the adhesive layer patterns 14b for attaching the chip 12 to the base layer 14a are selectively cured and the adhesive force is weakened by the reduced second adhesive force, the chip 12 can be easily picked up. Therefore, when the adhesive layer patterns 14b for attaching the chip 12 to the base layer 14a are selectively cured to weaken the adhesive force and thus have the second adhesive force, the pickup tool 30 can easily pick up the chip 12.

[0046] Each adhesive layer pattern 14b may be provided corresponding to each chip 12. Each adhesive layer pattern 14b may be formed to overlap the center portion of each chip 12. Thus, the center portion of each chip 12 is bonded to the base layer 14a via each adhesive layer pattern 14b, while the periphery of each chip 12 is in a state of spanning the base layer 14a. Therefore, the pickup tool 30 can easily pick up the chip 12 from the base layer 14a.

[0047] Alternatively, each adhesive layer pattern 14 b may correspond to partially overlap the outer periphery of each chip 12 .

[0048] Figure 4 is a top view illustrating another example of the attachment tape.

[0049] Reference Figure 4The attachment tape 14 may include a base layer 14a and adhesive layer patterns 14b, each adhesive layer pattern 14b having stripes crossing each other and disposed on the upper surface of the base layer 14a. Therefore, the adhesive layer patterns 14b may be arranged in a matrix shape.

[0050] Figure 5 is a flowchart illustrating a method of transferring a chip according to an exemplary embodiment of the present invention. Figure 6 is a top view illustrating the arrangement of chips attached to an attachment tape in order of rank. Figure 7 It means from Figure 6 A top view of the method in which the attachment tape is used to sort the chips corresponding to a specific grade onto the carrier.

[0051] Reference Figure 1 and Figures 5 to 7 , a method for sorting chips identified by grade on an attachment tape on a carrier will be described.

[0052] A plurality of chips identified by level are supported on the adhesive layer pattern (S110). For example, the plurality of chips can be classified into first-level chips 12a, second-level chips 12b, and third-level chips 12c. The classification criteria for each level can be determined based on whether it is normal / abnormal or brightness value, etc.

[0053] Then, the chips belonging to a specific level in the level are inspected (S120). The measurement data previously obtained for each level can be used. Figure 6 and Figure 7 As shown, chip 12a identified as the first level may be selected.

[0054] Subsequently, the chips are classified into a plurality of groups, each group including chips identified as a specific level among adjacent chips (S130). For example, the chips identified as first-level chips 12a are defined as a group. Here, the area of the group can be defined according to the size of the chips, as long as the picking tool can pick up the chips located in the area of the group at one time. For example, Figure 6 As shown, it can be defined as a 5×5 matrix to correspond to the chips arranged in the matrix.

[0055] At the same time, the chips are grouped such that the group includes at least one chip corresponding to a specific rank.

[0056] Thereafter, one of the plurality of groups is defined as a first group G1 (S140). Figure 6 As shown, the first group G1 may be located at the upper left portion of the attachment strip.

[0057] Then, all chips 12a identified as a specific grade and included in the first group are picked up from the attachment tape (S150). A method for selectively picking up chips belonging to a specific grade and included in the first group is as follows.

[0058] The ultraviolet laser is selectively irradiated onto a portion of the attachment tape where a selected chip among the chips is located, and as a result, some adhesive layer patterns corresponding to the area are selectively cured.

[0059] Afterwards, the chip located in the selected area is picked up from the cured adhesive layer pattern formed on the base layer. Here, a pick-up tool is used to pick up the chip located in the area from the attachment tape. The pick-up tool includes an adhesive layer with a flat surface underneath.

[0060] Subsequently, the chip is attached to the first area A1 of the carrier in an arrangement state in which a pickup tool picks up the chip. The carrier may include a plurality of pockets (not shown) in which the chips can be accommodated.

[0061] The first area can be adjusted according to the arrangement state of the picked-up chips. For example, when the arrangement state of the picked-up chips has a 5×5 matrix shape, the first area of the stage can also be defined as a 5×5 matrix shape.

[0062] Therefore, only chips belonging to a specific class can be efficiently sorted in the first area of the stage.

[0063] In an exemplary embodiment of the present invention, the groups can be arranged in a zigzag pattern. Thus, when the picking tool moves in a scanning manner, chips belonging to a specific class can be efficiently picked from the attachment tape.

[0064] In an exemplary embodiment of the present invention, a second group G2 adjacent to the first group G1 is selected (S170). Thereafter, all chips corresponding to a specific level included in the second group are picked up from the attachment tape (S180). Subsequently, the picked-up chips are attached to the second area A2 of the carrier (S190). The second area A2 can be adjusted according to the arrangement state of the picked-up chips and the arrangement state of the chips located in the first area A1. For example, when the arrangement state of the picked-up chips has a 3×3 matrix shape (the third group, G3, see Figure 6 ), the second area of the carrier can also be limited to a 3×3 matrix shape.

[0065] Meanwhile, the first area A1 and the second area A2 may partially overlap each other. Chips belonging to the second group G2 may be located in empty pockets formed in the first area A1.

[0066] Subsequently, chips corresponding to a specific level belonging to the third to fifth areas may be sequentially picked up and attached to the third to fourth areas A3 to A4 of the stage.

[0067] At the same time, step S200 of filling the vacancies in the first and second areas with chips belonging to a specific level picked up from the attachment tape may be additionally performed. Therefore, chips corresponding to the specific level can be completely attached to all areas of the carrier.

[0068] Embodiments of the present invention can be applied to the process of manufacturing a semiconductor device or an organic light-emitting device (OLED). Embodiments of the present invention can be applied to the process of manufacturing semiconductor devices such as storage devices and light-emitting diode devices. Although the wireless power transmission device and the wireless power transmission method have been described with reference to specific embodiments, they are not limited thereto. Therefore, it will be readily understood by those skilled in the art that various modifications and changes may be made thereto without departing from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A method for sorting a plurality of chips, the method comprising: a supporting attachment tape in which a plurality of chips classified into a plurality of grades are arranged in a matrix pattern on an adhesive layer; identifying each of the chips corresponding to a particular rank among the plurality of ranks; grouping the chips identified as the specific class among the chips classified into a plurality of classes that are adjacent to each other, wherein each of the chips corresponding to the specific class belongs to one of a plurality of groups; selecting one of the plurality of groups as a first group; picking up all the chips identified as the specific grade from the attachment tape at once, the chips corresponding to the specific grade being included in the first group; attaching the picked-up chips corresponding to the specific grade to a first area of a carrier in such a manner that the picked-up chips corresponding to the specific grade are arranged in an array; selecting a second group adjacent to the first group; picking up all the chips identified as the specific grade from the attachment tape at once, the chips corresponding to the specific grade being included in the second group; attaching the picked-up chips corresponding to the specific level to a second area of a carrier; as well as filling the vacancies in the first region and the second region with the chips belonging to the particular grade from the attachment tape; wherein the plurality of groups are arranged in a zigzag pattern; and Picking up all the chips identified as the specific grade at one time includes: selectively irradiating ultraviolet (UV) laser to a partial area of the attachment tape where the chips of the specific grade are located, so as to selectively cure the partial area.

2. The method according to claim 1, wherein Picking up all the chips identified as the specific grade at one time further includes: The chips identified as the specific grade located in the cured partial area are picked up from the attachment tape. 3 . The method of claim 1 , wherein the attachment tape comprises a base layer and an adhesive layer pattern formed of an ultraviolet curable resin on the base layer. The method according to claim 3 , wherein the adhesive layer comprises a plurality of adhesive layer patterns, each of the adhesive layer patterns being in a dot shape. 5 . The method of claim 3 , wherein the adhesive layer comprises a plurality of adhesive layer patterns, each of the adhesive layer patterns being in a stripe shape and arranged in a matrix pattern.

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