A method for enhanced and magnified inspection of edge fuzzy defect features

Abstract

The present invention discloses a method for strengthening and amplifying inspection of edge fuzzy defect features. First, an X-ray reflection detection camera is used to shoot a flexible integrated circuit substrate to be inspected, and then an adaptive median filter is used to eliminate defect-free weld areas and background areas. Then, a boundary extraction algorithm of a fuzzy enhanced image is used to make the edges of edge fuzzy defect features clear so that they are strengthened and amplified. Then, the strengthened and amplified edge fuzzy defect features are integrated into a defect pattern and stored in a processing terminal. Then, a line scan camera is used to scan the surface of the flexible integrated circuit substrate to obtain a high-definition picture and superimpose it with the defect pattern to obtain a high-definition picture of the surface of the flexible integrated circuit substrate with the defect position marked. Finally, the picture is projected and overlapped with the body to complete the detailed marking of the edge fuzzy defect features on the body. The present invention has the advantage of providing an inspection method that can amplify and strengthen tiny edge fuzzy defects.

Description

Technical Field

[0001] The invention relates to the field of surface defect detection, in particular to a method for enhancing and amplifying the inspection of edge fuzzy defect features. Background Art

[0002] Flexible integrated circuit substrate (Flexible Printed Integrated Circuit Substrates, referred to as FICS), based on flexible printed circuit board (Flexible Printed Circuit Board, referred to as FPC), is a printed circuit substrate that uses copper foil to etch the surface of polyimide flexible substrate material to form a circuit. Flexible IC substrates have the characteristics of light weight, small size, high density and bendability, and are widely used in aerospace, military, mobile terminals and other fields.

[0003] With the demand for miniaturization of electronic products, the circuits of flexible IC substrates are becoming more and more sophisticated, and the appearance defects produced in the manufacturing process are becoming more and more complex, and the control of quality and defects in the manufacturing process is becoming more and more stringent. At present, there are nearly 100 different types of substrate defects produced by different production processes, and more than 10 common defects, which seriously affect the quality of products, especially edge fuzzy defects. Since there are many linear areas in flexible integrated circuit substrates, for small edge fuzzy defects, the use of traditional line scanning and other methods to inspect the entire flexible integrated circuit substrate is likely to ignore small edge fuzzy defects, resulting in the risk of defective finished products.

[0004] To solve this problem, we need an inspection method that can magnify and enhance small, blurred-edge defects. Summary of the invention

[0005] Purpose of the invention: The purpose of the present invention is to provide a method for enhancing and magnifying the inspection of edge fuzzy defect features in order to address the deficiencies in the prior art.

[0006] Technical solution: The method for enhancing and amplifying the inspection of edge fuzzy defect features described in the present invention comprises the following steps:

[0007] S1. Use an X-ray reflection detection camera to shoot the flexible integrated circuit substrate to be inspected, then use adaptive median filtering to eliminate the defect-free weld area and background area of ​​the digital image shot by X-ray, and then use the boundary extraction algorithm of the fuzzy enhanced image to make the edge of the edge fuzzy defect feature on the flexible integrated circuit substrate clear so that it can be enhanced and magnified;

[0008] S2, integrating the enhanced and amplified edge fuzzy defect features into a defect pattern and storing it in the processing terminal;

[0009] S3, then use a line scan camera to scan the surface of the flexible integrated circuit substrate again to obtain a high-definition image of the surface of the flexible integrated circuit substrate, and then superimpose the defect pattern with the high-definition image of the surface of the flexible integrated circuit substrate to obtain a high-definition image of the surface of the flexible integrated circuit substrate where the defect position is marked;

[0010] S4. Project and overlap the high-definition image of the surface of the flexible integrated circuit substrate where the defect is marked with the flexible integrated circuit substrate body to complete the detailed marking of the edge fuzzy defect features on the body.

[0011] Preferably, when a line scan camera is used to scan the surface of the flexible integrated circuit substrate in S3, tunnel stereo scanning is used to construct a stereo model of the flexible integrated circuit substrate.

[0012] Preferably, in S1, tunnel scanning is used to photograph the flexible integrated circuit substrate to be inspected using an X-ray reflection detection camera, and a full-angle defect pattern of the flexible integrated circuit substrate to be inspected is constructed based on this in S2, and then the full-angle defect pattern obtained in S2 and the three-dimensional modeling obtained in S3 are nested and projected to overlap.

[0013] Preferably, when generating the defect pattern in S2, each edge fuzzy defect feature is graded and marked, and in S4, detailed marks of the edge fuzzy defect features with graded levels are marked on the body.

[0014] Compared with the prior art, the present invention has the following beneficial effects: an X-ray reflection detection camera and a line scan camera are used in steps to photograph the surface of a flexible integrated circuit substrate; the X-ray reflection detection camera cooperates with an adaptive median filter and a boundary extraction algorithm of a fuzzy enhanced image to obtain a defect pattern integrated with enhanced and enlarged edge fuzzy defect features; a line scan camera obtains a high-definition image of the surface of the flexible integrated circuit substrate; the two are superimposed to obtain a high-definition image of the surface of the flexible integrated circuit substrate with the defect position marked; and finally, detailed marking of the edge fuzzy defect features is performed on the main body. This method can realize enhanced and enlarged edge fuzzy defect features on the flexible integrated circuit substrate, which is convenient for inspection, and can realize correct marking of edge fuzzy defect features on the main body. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0017] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0019] Embodiment 1: A method for enhancing and amplifying the inspection of edge fuzzy defect features, comprising the following steps:

[0020] S1. Use an X-ray reflection detection camera to shoot the flexible integrated circuit substrate to be inspected, then use adaptive median filtering to eliminate the defect-free weld area and background area of ​​the digital image shot by X-ray, and then use the boundary extraction algorithm of the fuzzy enhanced image to make the edge of the edge fuzzy defect feature on the flexible integrated circuit substrate clear so that it can be enhanced and magnified;

[0021] S2, integrating the enhanced and amplified edge fuzzy defect features into a defect pattern and storing it in the processing terminal;

[0022] S3, then use a line scan camera to scan the surface of the flexible integrated circuit substrate again to obtain a high-definition image of the surface of the flexible integrated circuit substrate, and then superimpose the defect pattern with the high-definition image of the surface of the flexible integrated circuit substrate to obtain a high-definition image of the surface of the flexible integrated circuit substrate where the defect position is marked;

[0023] S4. Project and overlap the high-definition image of the surface of the flexible integrated circuit substrate where the defect is marked with the flexible integrated circuit substrate body to complete the detailed marking of the edge fuzzy defect features on the body.

[0024] Embodiment 2: A method for enhancing and magnifying the inspection of edge fuzzy defect features, comprising the following steps:

[0025] S1. Use an X-ray reflection detection camera to perform tunnel scanning on the flexible integrated circuit substrate to be inspected, then use adaptive median filtering to eliminate the defect-free weld area and background area of ​​the digital image taken by the X-ray, and then use a fuzzy enhanced image boundary extraction algorithm to make the edge of the edge fuzzy defect feature on the flexible integrated circuit substrate clear so that it can be enhanced and magnified;

[0026] S2, integrating the enhanced and amplified edge fuzzy defect features into a full-angle defect pattern of the flexible integrated circuit substrate to be inspected and storing it in the processing terminal, and marking each edge fuzzy defect feature in a graded manner when generating the full-angle defect pattern;

[0027] S3, then use a line scan camera to scan the surface of the flexible integrated circuit substrate again. When using the line scan camera to scan the surface of the flexible integrated circuit substrate, tunnel stereo scanning is used to construct a three-dimensional model of the flexible integrated circuit substrate, and then the full-angle defect pattern is superimposed on the three-dimensional model of the surface of the flexible integrated circuit substrate, so as to obtain a high-definition picture of the surface of the flexible integrated circuit substrate where the defect position is marked;

[0028] S4. Project the high-definition image of the surface of the flexible integrated circuit substrate where the defect is marked onto the flexible integrated circuit substrate body, and then mark the body with detailed marks of edge fuzzy defect features with graded levels.

[0029] The advantage of this technical solution is that an X-ray reflection detection camera and a line scan camera are used in steps to photograph the surface of the flexible integrated circuit substrate. The X-ray reflection detection camera cooperates with an adaptive median filter and a boundary extraction algorithm of a blur enhanced image to obtain a defect pattern integrated with enhanced and enlarged edge fuzzy defect features. The line scan camera obtains a high-definition picture of the surface of the flexible integrated circuit substrate, and the two are superimposed to obtain a high-definition picture of the surface of the flexible integrated circuit substrate with the defect position marked. Finally, detailed marking of the edge fuzzy defect features is performed on the main body. This method can realize enhanced and enlarged edge fuzzy defect features on the flexible integrated circuit substrate, which is convenient for inspection, and can achieve correct marking of edge fuzzy defect features on the main body.

[0030] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0031] Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples without contradicting each other.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for enhancing and magnifying the inspection of edge fuzzy defect features, characterized in that: The following steps are involved: S1. Use an X-ray reflection detection camera to shoot the flexible integrated circuit substrate to be inspected, then use adaptive median filtering to eliminate the defect-free weld area and background area of ​​the digital image shot by X-ray, and then use the boundary extraction algorithm of the fuzzy enhanced image to make the edge of the edge fuzzy defect feature on the flexible integrated circuit substrate clear so that it can be enhanced and magnified; S2, integrating the enhanced and amplified edge fuzzy defect features into a defect pattern and storing it in the processing terminal; S3, then use a line scan camera to scan the surface of the flexible integrated circuit substrate again to obtain a high-definition image of the surface of the flexible integrated circuit substrate, and then superimpose the defect pattern with the high-definition image of the surface of the flexible integrated circuit substrate to obtain a high-definition image of the surface of the flexible integrated circuit substrate where the defect position is marked; S4. Project and overlap the high-definition image of the surface of the flexible integrated circuit substrate where the defect is marked with the flexible integrated circuit substrate body to complete the detailed marking of the edge fuzzy defect features on the body.

2. The method for enhancing and magnifying the inspection of edge fuzzy defect features according to claim 1, characterized in that: When a line scan camera is used to scan the surface of the flexible integrated circuit substrate in S3, tunnel stereo scanning is used to construct a three-dimensional model of the flexible integrated circuit substrate.

3. The method for enhancing and magnifying the inspection of edge fuzzy defect features according to claim 2, characterized in that: In S1, an X-ray reflection detection camera is used to shoot the flexible integrated circuit substrate to be inspected by tunnel scanning, and a full-angle defect pattern of the flexible integrated circuit substrate to be inspected is constructed in S2. Subsequently, the full-angle defect pattern obtained in S2 and the three-dimensional modeling obtained in S3 are nested and projected to overlap.

4. The method for enhancing and amplifying the inspection of edge fuzzy defect features according to claim 1, characterized in that: When the defect pattern is generated in S2, each edge fuzzy defect feature is graded and marked, and detailed marks of the edge fuzzy defect features with graded levels are marked on the body in S4.