Light detection device

Abstract

The present invention provides a light detection device comprising: a mounting substrate; and a light sensor device having a first surface on the mounting substrate side and a second surface on the opposite side of the mounting substrate and mounted on the mounting substrate. The light sensor device comprises: a light sensor having a light receiving surface on the second surface side; a signal processing circuit electrically connected to the light sensor; and a lead frame disposed on the second surface side relative to the signal processing circuit, shielding the second surface side of the signal processing circuit. The mounting substrate has a conductive pattern opposite to the signal processing circuit and shielding the first surface side of the signal processing circuit.

Description

Technical Field

[0001] This invention relates to a light detection device. Background Technology

[0002] Patent document 1 describes the following: Figure 1 (a)~ Figure 1 As shown in (d), the infrared sensor component 50 includes: a third component 41 having a through opening h2 and a chip pad 42; an IR sensor element 43 disposed within the opening h2 of the third component 41; a signal processing IC 44 mounted on one side (i.e., the surface 41a side) of the chip pad 42; wires 45 made of gold (Au) or the like, which electrically connect the IR sensor element 43 to the third component 41, the signal processing IC 44 to the third component 41, and the IR sensor element 43 to the signal processing IC 44; and a molded component 46 covering the third component 41, the IR sensor element 43, the signal processing IC 44, and the wires 45.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 6039789 Summary of the Invention

[0006] In the technical solution of the present invention, a light detection device is provided. Alternatively, the light detection device may have a mounting substrate. Alternatively, the light detection device may have a light sensor device having a first surface on the mounting substrate side and a second surface on the opposite side of the mounting substrate, and the light sensor device is mounted on the mounting substrate. Alternatively, the light sensor device may have a light sensor having a light receiving surface on the second surface side. Alternatively, the light sensor device may have a signal processing circuit electrically connected to the light sensor. Alternatively, the light sensor device may have a lead frame disposed on the second surface side relative to the signal processing circuit, shielding the second surface side of the signal processing circuit. Alternatively, the mounting substrate may have a conductive pattern opposite to the signal processing circuit and shielding the first surface side of the signal processing circuit.

[0007] Alternatively, the signal processing circuit can be positioned between the lead frame and the conductive pattern, and when viewed from the light-receiving side, the area of ​​the signal processing circuit is smaller than the area of ​​the lead frame and the conductive pattern.

[0008] Alternatively, the lead frame may have an opening for exposing the light receiver of the light sensor to the outside.

[0009] Alternatively, the light sensor can be a rear-facing receiver type, with a circuit surface on the mounting substrate side.

[0010] Alternatively, the light sensor could be an infrared sensor.

[0011] Alternatively, the signal processing circuit can be an integrated circuit chip with a circuit surface on the mounting substrate side.

[0012] Alternatively, the lead frame can be electrically connected to the conductive pattern.

[0013] Alternatively, the lead frame may have a single terminal that is electrically connected to the conductive pattern.

[0014] Alternatively, the lead frame may have two or more terminals that are electrically connected to the conductive pattern.

[0015] Alternatively, the conductive pattern can be electrically connected to the grounding wire of the mounting substrate.

[0016] Alternatively, the lead frame may have at least a portion of the edge of the optical sensor device having a plurality of terminals spaced at intervals of less than 2.85 mm.

[0017] Alternatively, the conductive pattern can be set on the surface of the optical sensor device side of the mounting substrate.

[0018] Alternatively, the conductive pattern may be disposed on at least one of the inner layer of the mounting substrate or on the surface of the mounting substrate opposite to the optical sensor device.

[0019] Alternatively, the conductive pattern can be further positioned opposite the photosensitive sensor to further shield the first side of the photosensitive sensor.

[0020] Alternatively, the lead frame can be thicker than the conductive pattern.

[0021] Alternatively, the optical sensor device may have a structure that integrates the optical sensor, signal processing circuitry, and lead frame using resin sealing.

[0022] Furthermore, the above summary of the invention does not list all the features of the invention. Additionally, sub-combinations of these feature groups can also constitute technical solutions. Attached Figure Description

[0023] Figure 1 This describes the structure of the optical sensor device 100 in this embodiment.

[0024] Figure 2 This describes the internal structure of the sensor block 110 in this embodiment.

[0025] Figure 3 This is a schematic cross-sectional view of the sensor block 110 in this embodiment.

[0026] Figure 4 This is a schematic cross-sectional view of the light detection device 400 of this embodiment.

[0027] Figure 5 This is a perspective view of the mounting substrate 410 of this embodiment.

[0028] Figure 6 This is a perspective view of the light detection device 400 of this embodiment.

[0029] Figure 7 This describes the structure of the light detection device 700, which is the first modified example of this embodiment.

[0030] Figure 8 This describes the structure of the light detection device 800, which is a second variation of this embodiment.

[0031] Figure 9 The structure of the light detection device 900 in the third variation of this embodiment is shown.

[0032] Figure 10 The structure of the light detection device 1000 in the fourth variation of this embodiment is shown.

[0033] Figure 11 This describes the structure of the light detection device 1100 in this embodiment.

[0034] Figure 12 Here is an example showing the thickness of each part of the light detection device 400 in this embodiment.

[0035] Figure 13 The plate structure 1300 represents the fifth variation of this embodiment.

[0036] Explanation of reference numerals in the attached figures

[0037] 100. Optical sensor device; 110. Sensor block; 120. Lead frame; 130. Terminal; 140. Filter block; 200. Optical sensor; 205. Opening; 210. Signal processing circuit; 400. Optical detection device; 410. Mounting substrate; 420. Conductive pattern; 430. Conductive pattern; 700. Optical detection device; 710. Mounting substrate; 720. Conductive pattern; 730. Conductive pattern; 800. Optical detection device; 810. Mounting Substrate; 820, conductive pattern; 830, conductive pattern; 840, capacitor; 900, photodetector; 910, mounting substrate; 920, conductive pattern; 1000, photodetector; 1010, mounting substrate; 1020, conductive pattern; 1100, photodetector; 1110, mounting substrate; 1115, cover; 1120, conductive pattern; 1130, conductive pattern; 1300, plate structure; 1310, conductive plate; 1320, opening. Detailed Implementation

[0038] The present invention will now be described through embodiments thereof, which are not intended to limit the scope of the claims. Furthermore, not all combinations of the features described in the embodiments are necessary for the solution of the invention.

[0039] Figure 1 This diagram shows the structure of the optical sensor device 100 of this embodiment as viewed from the top surface, bottom surface, long side surface, and short side surface. The optical sensor device 100 receives light and converts it into an electrical signal. In this embodiment, as an example, the optical sensor device 100 is an infrared sensor device that receives infrared light and converts it into an electrical signal. The optical sensor device 100 may also receive light of other wavelengths instead of infrared light and convert it into an electrical signal. Here, for ease of explanation, the side of the optical sensor device 100 or the sensor block 110 of the optical sensor device 100 that is mounted on the mounting substrate is referred to as the "bottom surface," "first surface," or "mounting surface," and the side of the optical sensor device 100 or the sensor block 110 that receives light is referred to as the "top surface," "second surface," or "light receiving surface."

[0040] The optical sensor device 100 includes a sensor block 110 and a filter block 140. The sensor block 110 has a lead frame 120, as shown in... Figure 2 As shown in the following figures, sensor block 110 has a built-in light sensor and signal processing circuitry.

[0041] The lead frame 120 supports or fixes the built-in devices (IC, LSI, or ASIC, etc.) such as the optical sensor and signal processing circuit within the optical sensor device 100, and functions as a terminal for electrical wiring connection between the built-in devices within the optical sensor device 100 and external components. The lead frame 120 is formed by etching or stamping a metal plate such as copper. In this embodiment, the lead frame 120 is exposed on the upper surface of the sensor block 110. Furthermore, the lead frame 120 has a plurality of terminals 130 on at least a portion or all of the edges of the sensor block 110. Each terminal 130 is exposed from the upper surface to the side and lower surfaces of the sensor block 110, and is connected to a terminal pattern on a mounting substrate on the lower surface of the sensor block 110. A portion of the terminals 130 (in this embodiment, the two terminals on the top and bottom edges in the top view, and the first, second, and seventh terminals from the top on the right and left sides) are connected to a rectangular plate portion of the lead frame 120 that is largely exposed on the upper surface of the sensor block 110.

[0042] A filter block 140 is fixedly disposed on the upper surface side of the sensor block 110, above the photosensitive sensor of the sensor block 110. The filter block 140 allows light of the wavelength band that the photosensitive sensor device 100 should receive to pass through, while blocking light of wavelengths outside the filter band. Here, as an example, the photosensitive sensor could also be an infrared sensor, and the filter block 140 could allow infrared light to pass through. Furthermore, in this embodiment, the photosensitive sensor device 100 has a filter block 140, but the photosensitive sensor device 100 could also have a structure without a filter block 140.

[0043] Figure 2 This diagram shows the internal structure of the optical sensor device 100 of this embodiment as viewed from the lower surface side. The lead frame 120, located at the portion of the sensor block 110 where the terminals 130 are provided, has a thickness extending from the upper surface to the lower surface of the sensor block 110. Furthermore, the lead frame 120 includes a rectangular plate portion that forms the bottom of a recessed portion when viewed from the lower surface of the sensor block 110, and is largely exposed to the upper surface of the sensor block 110.

[0044] The lead frame 120 is constructed such that a portion of a metal plate having the same thickness as the terminal 130, excluding the portion of the terminal 130 exposed to the mounting surface, is partially removed from the surface on the mounting surface side toward the light receiving surface side by etching or the like, thereby forming a rectangular plate portion that is thinner than the terminal 130 at the bottom of the recess. Figure 2 The shaded area marked with a diagonal line indicates a recess etched in by means of etching or stamping. The lead frame 120 is exposed on the upper surface side of the sensor block 110 within the shaded area marked with a diagonal line in the figure, and is thinner than the portion where the terminals 130 are provided, and has a gap between it and the lower surface side of the sensor block 110.

[0045] Furthermore, regarding the plurality of terminals 130 in the lead frame 120, the terminals 130 are completely separated from each other by etching or the like. Regarding each terminal 130 that is not electrically connected to the rectangular plate portion, the portion between the rectangular plate portion in the metal plate and the terminal 130 is completely separated by etching or the like. In the figure, the two terminals at the top and bottom of the sensor block 110, as well as the first, second, and seventh terminals from the top on the right and left sides, are electrically connected to the aforementioned rectangular plate portion. In the figure, the third to sixth terminals on the right and left sides of the sensor block 110 are separated from the rectangular plate portion.

[0046] Sensor block 110 includes a light sensor 200 and a signal processing circuit 210. Lead frame 120 has an opening 205 for exposing the light-receiving surface of the light sensor 200 to the outside of sensor block 110, within which the light-receiving surface of the light sensor 200 is oriented towards... Figure 1 The upper surface is configured on the side.

[0047] The signal processing circuit 210 is disposed on the lower surface of the sensor block 110 of the lead frame 120. The signal processing circuit 210 is electrically connected to the light sensor 200 and a portion of the plurality of terminals 130 via lead bonding or the like. The signal processing circuit 210 processes the electrical signal output in response to the light received by the light sensor 200, and outputs a detection signal, for example, representing a digital value corresponding to the light intensity, from at least one terminal 130.

[0048] As shown above, the lead frame 120 covers the upper surface of the signal processing circuit 210 more than the signal processing circuit 210, thus shielding the upper surface of the signal processing circuit 210 from external noise.

[0049] Figure 3 The sensor block 110 of this embodiment is... Figure 2 A schematic diagram of the cross-section corresponding to A-A'. Figure 3 In the middle, the left side of the paper is Figure 2 Side A, the right side of the paper is Figure 2 On the A' side. Additionally, on... Figure 3 In this paper, the light receiving surface side of the sensor block 110 is taken as the lower side of the paper, and the mounting surface side of the sensor block 110 that is mounted relative to the mounting substrate is taken as the upper side of the paper.

[0050] The rectangular plate portion of the lead frame 120 is exposed to the light-receiving surface of the sensor block 110. For example... Figure 2 and Figure 3 As shown, the lead frame 120 has a through hole, i.e., an opening 205, provided in the rectangular plate portion. The light sensor 200 is disposed within the opening 205 such that its light-receiving surface is flush with the underside of the paper surface of the lead frame 120. In this embodiment, the light sensor 200 is a back-receiving type, having a circuit surface on the side opposite to the light-receiving surface (the mounting substrate side), i.e., the upper side of the paper surface. The signal processing circuit 210 is disposed on the mounting substrate side surface of the lead frame 120. In this embodiment, the signal processing circuit 210 is an integrated circuit chip having a circuit surface on the mounting substrate side.

[0051] In this embodiment, as described above, both the light sensor 200 and the signal processing circuit 210 have circuit surfaces on the mounting substrate side. Furthermore, the circuit surfaces of the light sensor 200 and the signal processing circuit 210 are connected by wire bonding.

[0052] As an example, the manufacturing method of the optical sensor device 100 is as follows. First, for a metal plate, etching or stamping is performed in the area to be included in the sensor block 110, thereby forming a lead frame 120 having multiple terminals 130 and an opening 205. Next, adhesive tape is pasted onto the underside of the paper surface of the lead frame 120, and an optical sensor 200 is arranged in the opening 205. The optical sensor 200 is then pasted onto the adhesive tape and fixed.

[0053] Next, the signal processing circuit 210 is attached to the lead frame 120 using adhesive material or adhesive tape. Figure 3 Next, the terminals on the circuit surface of the light sensor 200 and the terminals on the circuit surface of the opening 205 are electrically connected by wire bonding. Next, the lead frame 120, the light sensor 200, and the signal processing circuit 210 are sealed by molding. Then, the adhesive tape securing the lead frame 120 and the light sensor 200 is peeled off.

[0054] As an example, by using such a manufacturing method, it is possible to manufacture an optical sensor device 100 having a structure in which the optical sensor 200, signal processing circuit 210, and lead frame 120 are integrated by resin sealing.

[0055] Figure 4 This is the light detection device 400 of this embodiment, and... Figure 2 A schematic diagram of the cross-section corresponding to B-B'. The light detection device 400 includes a light sensor device 100 and a mounting substrate 410 for mounting the light sensor device 100. Furthermore, in Figure 4 In this paper, the filter block 140 of the optical sensor device 100 is omitted.

[0056] The optical sensor device 100 has a mounting surface (first surface) on the mounting substrate 410 side and a light-receiving surface (second surface) on the opposite side of the mounting substrate 410. The optical sensor device 100 is mounted on the mounting substrate 410. The optical sensor device 100 has a lead frame 120 exposed to the light-receiving surface side (upper side of the paper in the figure) and a signal processing circuit 210 disposed on the mounting surface side of the lead frame 120 inside a recess formed on the mounting surface side. The lead frame 120 is disposed on the light-receiving surface side relative to the signal processing circuit 210, and shields the light-receiving surface side of the signal processing circuit 210.

[0057] Mounting substrate 410 mounts and supports various electronic components, including the light sensor device 100. Mounting substrate 410 has a wiring pattern that electrically connects the electronic components. Mounting substrate 410 can be any type of substrate capable of mounting the light sensor device 100, such as a printed circuit board (PCB), a substrate included in each stacked package in a PoP (PoS) package, or an intermediary layer inserted between electronic devices and printed circuit boards, etc., and changing the terminal configuration between them.

[0058] The mounting substrate 410 has a conductive pattern 420 and one or more conductive patterns 430 on the mounting surface side of the insulating substrate body, which is the mounting surface of the photosensitive device 100. As an example, the conductive pattern 420 and one or more conductive patterns 430 may be formed by etching away areas other than the desired pattern portion of a metal thin film such as copper foil formed on the insulating substrate body. The conductive pattern 420 is located on the mounting surface side of the mounting substrate 410, opposite to the rectangular plate portion of the lead frame 120 and the signal processing circuit 210. The conductive pattern 420 may be provided on the surface of the mounting substrate 410 on the photosensitive device 100 side. The conductive pattern 420 shields the surface of the signal processing circuit 210 on the mounting surface side of the photosensitive device 100. One or more conductive patterns 430 are respectively provided on positions opposite to corresponding terminals 130 of the photosensitive device 100 and connected to the corresponding terminals 130.

[0059] According to the photodetector 400 described above, the signal processing circuit 210 is disposed between the lead frame 120 and the conductive pattern 420. Here, when viewed from the light-receiving surface side of the photodetector 100, the area of ​​the signal processing circuit 210 is smaller than either the lead frame 120 or the rectangular plate portion of the lead frame 120, or the conductive pattern 420. Therefore, the signal processing circuit 210 is shielded from external influences on both the light-receiving surface side and the mounting surface side of the photodetector 100, and is unaffected by noise. Furthermore, the light detection device 400 uses the lead frame 120 built into the light sensor device 100 to shield the light receiving surface of the light sensor device 100 of the signal processing circuit 210, and uses the conductive pattern 420 formed on the mounting substrate 410 outside the light sensor device 100 to shield the mounting surface of the light sensor device 100 of the signal processing circuit 210. As a result, compared with the case where the signal processing circuit 210 is shielded from top to bottom inside the light sensor device 100, the structure of the light sensor device 100 can be simplified.

[0060] In addition, such as Figure 1 and Figure 2As shown, multiple terminals 130 are separately disposed in the optical sensor device 100. In this configuration, noise from the sides where the inter-terminal spacing is less than half the wavelength can be blocked or sufficiently reduced. Therefore, the multiple terminals 130 contained in at least a portion of the edge of the lead frame 120 can be disposed at intervals of 2.85 mm or less. Thus, the optical sensor device 100 can block or sufficiently reduce noise in the frequency band below 52.6 GHz used for communication, which is less than twice the wavelength of 2.85 mm.

[0061] Furthermore, in the light detection device 400, a light sensor device with a lead frame disposed on the mounting surface side and a signal processing circuit disposed on the light receiving surface side of the lead frame is used. Instead of leaving an opening for the light sensor and covering the light receiving surface side with a conductive cover or conductive strip, shielding is formed using the lead frame 120 and the conductive pattern 420 of the mounting substrate 410. Therefore, the light detection device 400 can form shielding during the process of mounting the light sensor device 100 on the mounting substrate 410 with the conductive pattern 420 and mounting it using reflow soldering, without using a light sensor device that shields both the light receiving surface side and the mounting surface side.

[0062] Figure 5 This is a perspective view of the mounting substrate 410 in this embodiment. Figure 6 This is a perspective view of the light detection device 400 according to this embodiment. In this embodiment, a conductive pattern 420 and one or more conductive patterns 430 are formed on the mounting surface of the light sensor device 100 of the substrate body of the mounting substrate 410. The conductive pattern 420 has a rectangular shape that is opposite to the rectangular plate portion of the lead frame 120 and the signal processing circuit 210. Figure 5 and Figure 6 As shown, the conductive pattern 420 may be further positioned opposite the light sensor 200, further shielding the surface of the light sensor 200 on the mounting substrate 410 side (first surface side).

[0063] like Figure 5 As shown, the conductive pattern 420 may have at least one terminal pattern that is connected to at least one terminal (such as a ground terminal) of the optical sensor device 100. Figure 6 As shown, in the optical sensor device 100, each terminal 130 can be connected to the corresponding terminal pattern, i.e., the conductive pattern 430, on the optical detection device 400.

[0064] In the photodetector 400 of this embodiment, the lead frame 120 can be electrically connected to the conductive pattern 420 via at least one terminal 130. Here, the conductive pattern 420 can have a predetermined potential, and the rectangular plate portion of the lead frame 120 can be connected to the conductive pattern 420 to achieve a potential approximately the same as the conductive pattern 420. For example, the conductive pattern 420 can be electrically connected to the ground wire of the mounting substrate 410, and the rectangular plate portion of the lead frame 120 and the conductive pattern 420 can be at the ground potential. Alternatively, the rectangular plate portion of the lead frame 120 and the conductive pattern 420 can be at the power supply potential or an intermediate potential between the ground and power supply potentials. Alternatively, the rectangular plate portion of the lead frame 120 and the conductive pattern 420 can be connected to fixed potentials (e.g., ground potential and power supply potential) that are different from each other. Furthermore, at least one of the rectangular plate portion of the lead frame 120 and the conductive pattern 420 may not be connected to a fixed potential, but rather be at a floating potential.

[0065] Figure 7 This describes the structure of the light detection device 700, a first modification of this embodiment. In this modification, the light detection device 700 employs a... Figures 1-3 The optical sensor device 100 shown is mounted on the mounting substrate 710 in a structure that replaces... Figures 4-6 The mounting base plate 410 shown.

[0066] The mounting substrate 710 has a conductive pattern 720 corresponding to the conductive pattern 420 of the mounting substrate 410 and conductive patterns 730a to 730b corresponding to the conductive pattern 430. The differences between the conductive patterns 720 and 730a to 730b and the conductive patterns 420 and 430 will be described below, while the commonalities with the conductive patterns 420 and 430 will be omitted.

[0067] The conductive pattern 720 is disposed in the inner layer of the mounting substrate 710, rather than on the surface of the mounting substrate 710 on the side of the photosensitive device 100. Even when disposed in the inner layer of the mounting substrate 710, the conductive pattern 720 can more extensively cover and shield the surface of the photosensitive device 100 of the signal processing circuit 210. Alternatively, or based on this method, the conductive pattern 720 can be disposed on the surface of the mounting substrate 710 on the side opposite to the photosensitive device 100.

[0068] exist Figure 7 In the example, the mounting substrate 710 has one or more conductive patterns 730a to 730b corresponding to at least one terminal 130 of the plurality of terminals 130 of the optical sensor device 100 that is connected to the rectangular plate portion of the lead frame 120. For example... Figure 7As shown, the conductive pattern 720 can be connected to at least one conductive pattern 730a via a conductive path. Additionally, the conductive pattern 720 can be formed with the conductive patterns facing each other relative to at least one conductive pattern 730b, and the conductive pattern 720 can be electrically coupled to such conductive pattern 730b via capacitive coupling (parasitic capacitor).

[0069] Figure 8 This describes the structure of the light detection device 800, a second modification of this embodiment. In this modification, the light detection device 800 employs... Figures 1-3 The optical sensor device 100 shown is mounted on the mounting substrate 810 to replace the structure of the mounting substrate 810. Figure 7 The mounting substrate 710 shown.

[0070] The mounting substrate 810 has a conductive pattern 820 corresponding to the conductive pattern 720 of the mounting substrate 710 and conductive patterns 830a to 830b corresponding to the conductive patterns 730a to 730b. The following describes the differences between the conductive patterns 820 and 830a to 830b and the conductive patterns 720 and 730a to 730b, while omitting the description of the commonalities with the conductive patterns 720 and 730a to 730b.

[0071] Conductive pattern 820 is disposed on the inner layer of mounting substrate 810. Conductive pattern 820 extensively covers and shields the mounting surface of the photosensitive device 100 of signal processing circuit 210. Figure 8 In the example, the mounting substrate 810 has one or more conductive patterns 830a to 830b corresponding to the terminals 130 of the plurality of terminals 130 of the optical sensor device 100 that are connected to the rectangular plate portion of the lead frame 120. For example... Figure 8 As shown, the conductive pattern 820 can be connected to at least one conductive pattern 830a via a conductive path. Alternatively, the conductive pattern 820 can be formed in the inner layer of the mounting substrate 810 relative to at least one conductive pattern 830b, or connected to the conductive pattern 830b via electronic components such as a capacitor 840 mounted on the mounting substrate 810. Such electronic components can be, for example, other electronic components such as resistors or coils.

[0072] Figure 9 This describes the structure of the light detection device 900, a third variation of this embodiment. In this variation, the light detection device 900 employs a... Figures 1-3 The optical sensor device 100 shown is mounted on the mounting substrate 910 to replace the structure of the mounting substrate 910. Figures 4-6 The mounting base plate 410 shown.

[0073] The mounting substrate 910 has a conductive pattern 920 corresponding to the conductive pattern 420 of the mounting substrate 410. The differences between the conductive pattern 920 and the conductive pattern 420 are described below, while the description of the points shared with the conductive pattern 420 is omitted.

[0074] In this modified example, the lead frame 120 has a single terminal 130 that is electrically connected to the conductive pattern 920, and the rectangular plate portion of the lead frame 120 is connected to the conductive pattern 920 via this terminal 130. The conductive pattern 920 can be connected to a fixed potential such as a ground wire, in the same way as the conductive pattern 420.

[0075] In the photodetector 900 of this modified example, the lead frame 120 is connected to the conductive pattern 920 at a single point. Therefore, the photodetector 900 does not have a loop structure that can generate resonance like a ground loop, and can stabilize a fixed potential.

[0076] Figure 10 This describes the structure of the light detection device 1000, a fourth variation of this embodiment. In this variation, the light detection device 1000 employs a... Figures 1-3 The optical sensor device 100 shown is mounted on the mounting substrate 1010 to replace the structure of the mounting substrate 1010. Figures 4-6 The mounting base plate 410 shown.

[0077] The mounting substrate 1010 has a conductive pattern 1020 corresponding to the conductive pattern 420 of the mounting substrate 410. The differences between the conductive pattern 1020 and the conductive pattern 420 will be described below, while the commonalities between them will be omitted.

[0078] In this modified example, the lead frame 120 has two or more terminals 130 electrically connected to the conductive pattern 1020, and the rectangular plate portion of the lead frame 120 is connected to the conductive pattern 1020 via these two or more terminals 130. Figure 10 In this example, two or more terminals 130 located on opposite sides of the optical sensor device 100 are connected to the conductive pattern 1020. The conductive pattern 1020 can also be connected to a fixed potential, such as a ground wire, in the same way as the conductive pattern 420.

[0079] In this modified example of the photodetector 1000, the rectangular plate portion of the lead frame 120 is connected to the conductive pattern 1020 at two or more points, forming a loop structure similar to a grounding loop. On the other hand, since the rectangular plate portion of the lead frame 120 is connected to the conductive pattern 1020 at multiple points, the photodetector 1000 can further stabilize the potential of the rectangular plate portion of the lead frame 120 while sufficiently suppressing the fixed potential fluctuation of the conductive pattern 1020.

[0080] Figure 11This diagram illustrates the structure of the light detection device 1100 according to this embodiment. As an example, the light detection device 1100 may be a light-based gas component detection device, such as an alcohol detection device. The light detection device 1100 includes multiple light sensor devices 100a-100b, a mounting substrate 1110, and a cover 1115. In this embodiment, light sensor device 100a includes a sensor block 110a and a filter block 140a, and light sensor device 100b includes a sensor block 110b and a filter block 140b. In each of the light sensor devices 100a-100b, the wavelength bands through which light passes through the filter blocks 140a and 140b are different from each other; otherwise, they are similar. Figures 1-3 The optical sensor device 100 shown is the same, and the following descriptions are omitted except for the differences.

[0081] Mounting substrate 1110 mounts a plurality of light sensor devices 100a to 100b (also referred to as "light sensor devices 100"). Mounting substrate 1110 has conductive pattern 1120a and one or more conductive patterns 1130a for mounting light sensor device 100a, and conductive pattern 1120b and one or more conductive patterns 1130b for mounting light sensor device 100b. Here, mounting substrate 1110 and... Figures 4-6 Corresponding to the mounting substrate 410 shown, conductive patterns 1120a to 1120b (also referred to as "conductive pattern 1120") are the same as conductive pattern 420, and conductive patterns 1130a to 1130b (also referred to as "conductive pattern 1130") are the same as conductive pattern 430. Therefore, descriptions other than differences are omitted below.

[0082] A cover 1115 is disposed on the mounting surface side of the plurality of optical sensor devices 100a to 100b on the mounting substrate 1110, covering the plurality of optical sensor devices 100a to 100b. The cover 1115 may have an opening for obtaining external air in the space between the cover 1115 and the optical sensor devices 100a to 100b.

[0083] The light detection device 1100 uses light sensor devices 100a and 100b to detect light generated from an infrared light source (not shown). Here, light sensor device 100a has a filter block 140a that selectively allows one of the infrared absorption frequencies absorbed by the gas being detected to pass through, and light sensor device 100b has a filter block 140b that selectively allows another of the infrared absorption frequencies absorbed by the gas being detected to pass through. Therefore, when the concentration of the gas being detected increases, light sensor devices 100a and 100b reduce the output value of the detection signal representing the light intensity.

[0084] A detection circuit (not shown) mounted on the mounting substrate 1110 detects the presence of the gas to be detected when the detection signals from the optical sensor devices 100a to 100b fall below their respective threshold values. According to the optical detection device 1100 of this embodiment, for each of the plurality of optical sensor devices 100, a signal processing circuit 210 is provided between the lead frame 120 on the light-receiving surface side of the optical sensor device 100 and the conductive pattern 1120 of the mounting substrate 1110, thereby preventing external noise from being applied to the signal processing circuit 210.

[0085] Figure 12 Here is an example showing the thickness of each part of the light detection device 400 in this embodiment. Figure 12 The light detection device 400 in this embodiment and Figure 2 A schematic diagram of the cross section corresponding to A-A' shows an example of the thickness of each part.

[0086] exist Figure 12 In the example, the optical sensor device 100 has a thickness of 0.4 ± 0.1 mm. The signal processing circuit 210 has a thickness of 0.1 mm ± 0.01 mm. The lead frame 120 has a thickness of 0.1 mm ± 0.05 mm. The distance between the surface of the mounting substrate 410 of the signal processing circuit 210 and the first surface of the optical sensor device 100 is the distance obtained by subtracting the thicknesses of the lead frame 120 and the signal processing circuit 210 from the thickness of the optical sensor device 100. Figure 12 In the example, it is 0.2±0.16mm.

[0087] Through having Figure 12 As shown in the cross-sectional structure, the signal processing circuit 210 can contact the lead frame 120, which functions as an electromagnetic shield, on the second side of the optical sensor device 100, and can also be positioned on the first side of the optical sensor device 100 at a location with the smallest possible distance from the conductive pattern 420, which functions as a shielding structure. Therefore, compared to using a conductive cover or conductive strip to form a shield, the optical sensor device 100 can more effectively block electromagnetic waves from the outside.

[0088] In addition, such as Figure 12 As shown, the lead frame 120 can be thicker than the conductive pattern 420. Compared to electromagnetic noise from the side opposite to the light-receiving surface of the light sensor 200, such a light sensor device 100 can more effectively block electromagnetic noise from the light-receiving surface side of the light sensor 200. Therefore, the light sensor device 100 can effectively block electromagnetic noise from the light source side that is being detected, and can detect the light that is being detected more accurately.

[0089] For example, in the case where the optical sensor device 100 is used as a gas sensor in the NDIR (Non-Dispersive Infrared) mode, an infrared light source that outputs infrared light is disposed on the light-receiving surface side of the optical sensor 200. The infrared light source is sometimes driven by a pulse drive circuit that operates with a rectangular wave. By making the lead frame 120 thicker than the conductive pattern 420, the optical sensor device 100 can more effectively block electromagnetic noise from the drive circuit of such an infrared light source.

[0090] Figure 13 This describes the plate structure 1300 of the fifth variation of this embodiment. Alternatively, instead of having at least one of the lead frame 120, conductive pattern 420, conductive pattern 720, conductive pattern 820, conductive pattern 920, or conductive pattern 1020 as an openable conductive plate, it can be configured as follows: Figure 13 The conductive plate 1310 shown has multiple openings 1320.

[0091] exist Figure 13 In this example, multiple openings 1320 are arranged in a grid pattern on the surface of the conductive plate 1310. Figure 13 In the example, the conductive plate 1310 has a structure in which a conductive frame with a width of 0.1250 mm is arranged between adjacent openings 1320 within a 5.6000 mm square surface, and the openings 1320 are arranged in a 0.5600 mm square configuration. Alternatively, the multiple openings 1320 can be arranged in a honeycomb pattern on the surface of the conductive plate 1310, or they can be arranged randomly, or they can be arranged in any other arbitrary position. Furthermore, each opening 1320 in… Figure 13 In the example, the shape is square, but it can also be replaced by a rectangle, triangle, hexagon, circle, or other arbitrary shape. The area of ​​such a lead frame 120 or conductive pattern 420 with multiple openings 1320 is represented by the total area of ​​the region within the outer shape of the conductive plate 1310 containing the multiple openings 1320.

[0092] Even when using the conductive plate 1310 as the lead frame 120 or conductive pattern 420, the photosensitive device 100 can at least partially block electromagnetic waves from the outside. The smaller the aperture ratio (the ratio of the area of ​​the opening portion to the area of ​​the conductive plate 1310) of the conductive plate 1310, the higher the blocking rate of the conductive plate 1310 against electromagnetic waves. When using the conductive plate 1310 as the lead frame 120 or conductive pattern 420, the aperture ratio can be 90% or less, more preferably 64% or less.

[0093] By using the conductive plate 1310 as the lead frame 120 or conductive pattern 420, the amount of conductive material used can be reduced at the expense of reducing the shielding effect of electromagnetic waves. Therefore, by increasing the aperture ratio of the conductive plate 1310 within the range where the required shielding effect can be obtained, the optical sensor device 100 can be made lighter or cheaper.

[0094] The present invention has been described above using various embodiments, but the scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. As described in the claims, such modifications or improvements are also included within the scope of the present invention, which is obvious.

[0095] It should be noted that the execution order of actions, sequences, steps, and stages in the apparatus, system, program, and method shown in the claims, specification, and drawings can be implemented in any order, unless specifically stated as "before" or "prior to," and the output of the preprocessing is not used in the post-processing. Even if the flow of actions in the claims, specification, and drawings is described using terms such as "firstly" or "next" for convenience, it does not mean that they must be implemented in that order.

Claims

1. A light detecting device, wherein the light detecting device has: a mounting substrate; and a light sensor device having a first surface on the mounting substrate side and a second surface on the side opposite to the mounting substrate, the light sensor device being mounted on the mounting substrate; the light sensor device has: a light sensor having a light receiving surface on the second surface side; a signal processing circuit electrically connected to the light sensor; and a lead frame provided on the second surface side with respect to the signal processing circuit to shield the surface on the second surface side of the signal processing circuit, the mounting substrate has a conductive pattern opposite to the signal processing circuit to shield the surface on the first surface side of the signal processing circuit, the lead frame has an opening for exposing the light receiving surface of the light sensor to the outside, the light sensor is disposed in the opening, the signal processing circuit is electrically connected to the surface on the first surface side of the light sensor by wire bonding, the lead frame is electrically connected to the conductive pattern, in the direction opposite to the light sensor device with respect to the mounting substrate, the lead frame and the light sensor do not overlap, the lead frame and the signal processing circuit overlap, and the conductive pattern and the signal processing circuit overlap.

2. The light detecting device according to claim 1, wherein the signal processing circuit is disposed between the lead frame and the conductive pattern, and an area of the signal processing circuit is smaller than areas of the lead frame and the conductive pattern when viewed from the light receiving surface side of the light sensor.

3. The light detecting device according to claim 1 or 2, wherein the light sensor is a back surface receiving type having a circuit surface on the mounting substrate side.

4. The light detecting device according to claim 1 or 2, wherein the light sensor is an infrared ray sensor.

5. The light detecting device according to claim 1 or 2, wherein the signal processing circuit is an integrated circuit chip having a circuit surface on the mounting substrate side.

6. The light detecting device according to claim 1, wherein the lead frame has a single terminal electrically connected to the conductive pattern.

7. The light detecting device according to claim 1, wherein the lead frame has two or more terminals electrically connected to the conductive pattern.

8. The light detecting device according to claim 1 or 2, wherein the conductive pattern is electrically connected to a ground line of the mounting substrate.

9. The light detecting device according to claim 1 or 2, wherein the lead frame has a plurality of terminals provided at intervals of 2.85 mm or less at least a part of the edge portion of the light sensor device.

10. The light detecting device according to claim 1 or 2, wherein the conductive pattern is provided on the surface of the mounting substrate on the light sensor device side.

11. The light detecting device according to claim 1 or 2, wherein the conductive pattern is provided at least one of on the inner layer of the mounting substrate or on the surface of the mounting substrate on the side opposite to the light sensor device. ​ 12. The light detecting device according to claim 1 or 2, wherein the conductive pattern is further opposed to the light sensor, further shielding the surface of the first surface side of the light sensor.

13. The light detecting device according to claim 1 or 2, wherein the lead frame is thicker than the conductive pattern.

14. The light detecting device according to claim 1 or 2, wherein the light sensor device has a configuration in which the light sensor, the signal processing circuit, and the lead frame are integrated by resin sealing.

15. The light detecting device according to claim 1 or 2, wherein the conductive pattern has at least one terminal pattern connected to at least one terminal possessed by the light sensor device.

16. The light detecting device according to claim 1 or 2, wherein a cover is provided on the mounting surface side of the light sensor device of the mounting substrate.

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