Cavity purification method, purification equipment and electron beam exposure device

Abstract

The present application provides a cavity purification method, purification equipment and electron beam exposure device, the method comprising: sending a particle adsorption structure into a vacuum cavity; emitting a predetermined charge to the particle adsorption structure so that the particle adsorption structure carries a predetermined charge, the predetermined charge being a positive charge and / or a negative charge; after the particle adsorption structure carries the predetermined charge for a predetermined period of time, sending the particle adsorption structure out of the vacuum cavity. By making the particle adsorption structure carry a predetermined charge, using the principle of electrostatic adsorption to adsorb particles in the vacuum cavity with an opposite electrical property to the predetermined charge, and then sending the particle adsorption structure adsorbing the particles out of the vacuum cavity, compared with the prior art, this method does not need to open the vacuum cavity to release to the atmosphere for cleaning, saving labor costs, and avoiding the problem of long cleaning time and low efficiency, ensuring a high efficiency of cleaning the vacuum cavity.

Description

Technical Field

[0001] The present application relates to the field of electron beam exposure, and in particular to a cavity purification method, purification equipment and electron beam exposure device. Background Art

[0002] The process chamber of the electron beam exposure machine MEBES is a high vacuum environment (2.0-07Torr). Once particles appear inside the process chamber, it is difficult to remove them. Too many particles inside will affect product quality.

[0003] Currently, there are two methods to solve the particle problem in an ultra-high vacuum environment. One method is to rely on the self-purification ability of the vacuum environment, but it requires a long wait (at least about 3 months); the other method is to open the process chamber and release the vacuum to the atmosphere for cleaning. This method has high labor costs and low efficiency.

[0004] Therefore, a method for efficiently removing particles in a process chamber is urgently needed.

[0005] The above information disclosed in the background technology section is only used to enhance the understanding of the background technology of the technology described in this article. Therefore, the background technology may contain certain information that does not form the prior art known in this country for those skilled in the art. Summary of the invention

[0006] The main purpose of the present application is to provide a cavity purification method, purification equipment and electron beam exposure device to solve the problem of lack of efficient removal of particles in the process cavity in the prior art.

[0007] According to one aspect of an embodiment of the present invention, a method for purifying a cavity is provided, comprising: sending a particle adsorption structure into a vacuum cavity; emitting a predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, wherein the predetermined charge is a positive charge and / or a negative charge; after the particle adsorption structure carries the predetermined charge for a predetermined period of time, sending the particle adsorption structure out of the vacuum cavity.

[0008] Optionally, the particle adsorption structure includes a particle adsorption layer.

[0009] Optionally, the particle adsorption structure further includes a carrier, and the particle adsorption layer is located on the surface of the carrier.

[0010] Optionally, the carrier comprises glass, and the particle adsorption layer comprises a metal layer.

[0011] Optionally, the metal layer includes a plurality of metal parts arranged at intervals.

[0012] Optionally, the material of the metal layer includes at least one of silver, copper and chromium.

[0013] Optionally, the vacuum chamber is a vacuum chamber of an electron beam exposure machine, and emitting the predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, comprising: controlling the electron emission source of the electron beam exposure machine to emit the electron beam for the predetermined time period so that the particle adsorption structure carries a negative charge.

[0014] Optionally, sending the particle adsorption structure into a vacuum chamber includes: sending the particle adsorption structure into a vacuum chamber and placing it on a workbench.

[0015] Optionally, after the particle adsorption structure is charged with the predetermined charge for a predetermined period of time and before the particle adsorption structure is sent out of the vacuum chamber, the purification method includes: controlling a workbench to move in the vacuum chamber.

[0016] According to another aspect of an embodiment of the present invention, a cavity purification device is also provided, comprising a first transmission unit, a charge emission device, and a second transmission unit, wherein the first transmission unit is used to deliver a particle adsorption structure into a vacuum cavity; the charge emission device is used to emit a predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, and the predetermined charge is a positive charge and / or a negative charge; the second transmission unit is used to deliver the particle adsorption structure out of the vacuum cavity after the particle adsorption structure carries the predetermined charge for a predetermined period of time.

[0017] According to another aspect of the embodiment of the present application, an electron beam exposure device is also provided, including an electron beam exposure machine, and the electron beam exposure device also includes: a particle adsorption structure for adsorbing predetermined charges; and a cavity purification device for executing any of the purification methods described.

[0018] The present application provides a cavity purification method, wherein the cavity purification method comprises the following steps: first, a particle adsorption structure is sent into a vacuum cavity; then, a predetermined charge is emitted to the particle adsorption structure, so that the particle adsorption structure carries the predetermined charge, and the predetermined charge is positive charge and / or negative charge. There are three specific cases: the first case is that the particle adsorption structure only carries positive charge, the second case is that the adsorbed particles only carry negative charge, and the third case is that the particle adsorption structure carries both positive charge and negative charge; finally, after the particle adsorption structure carries the predetermined charge for a predetermined period of time, the particle adsorption structure is sent out of the vacuum cavity, and the particle adsorption structure is made to carry the predetermined charge, and the particle with the opposite charge to the predetermined charge in the vacuum cavity is adsorbed by the principle of electrostatic adsorption, and then the particle adsorption structure with the adsorbed particles is sent out of the vacuum cavity. Compared with the method of opening the process cavity and releasing the vacuum cavity to the atmosphere for cleaning in the prior art, the purification method does not need to open the vacuum cavity to release the vacuum cavity to the atmosphere for cleaning, which saves labor costs and ensures a high cleaning efficiency for the vacuum cavity. Compared with the cleaning method in the prior art that relies on the self-cleaning ability in a vacuum environment, the purification method avoids the problems of long cleaning time and low efficiency, and ensures that the vacuum cavity is cleaned with high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1 A schematic diagram showing a flow chart of a cavity purification method according to an embodiment of the present application; and

[0021] Figure 2 A diagram showing the composition of an electron beam exposure device according to an embodiment of the present application is shown.

[0022] The reference numerals are as follows:

[0023] 100, electron emission source; 200, particle adsorption structure; 201, metal layer; 202, carrier. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] It should be understood that when an element (such as a layer, film, region, or substrate) is described as being "on" another element, the element may be directly on the other element, or there may be intermediate elements. Moreover, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element, or "connected" to the other element through a third element.

[0028] As mentioned in the background technology, the prior art lacks the problem of efficiently removing particles in the process chamber. In order to solve the above problem, in a typical embodiment of the present application, a cavity purification method, purification equipment and electron beam exposure device are provided.

[0029] According to an embodiment of the present application, a method for purifying a cavity is provided.

[0030] Figure 1 FIG. 1 is a flow chart of a method for purifying a cavity according to an embodiment of the present application. Figure 1 As shown, the method comprises the following steps:

[0031] Step S101, sending the particle adsorption structure into the vacuum chamber;

[0032] Step S102, emitting a predetermined charge to the particle adsorption structure, so that the particle adsorption structure carries the predetermined charge, wherein the predetermined charge is a positive charge and / or a negative charge;

[0033] Step S103 , after the particle adsorption structure is charged with the predetermined charge for a predetermined period of time, the particle adsorption structure is sent out of the vacuum cavity.

[0034] The above-mentioned cavity purification method firstly sends the particle adsorption structure into the vacuum cavity; then, emits a predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, which is positive and / or negative. There are three specific situations. The first is that the particle adsorption structure only carries positive charge, the second is that the adsorbed particles only carry negative charge, and the third is that the particle adsorption structure carries both positive and negative charge; finally, after the particle adsorption structure carries the predetermined charge for a predetermined period of time, the particle adsorption structure is sent out of the vacuum cavity. By making the particle adsorption structure carry the predetermined charge, the particle adsorption structure is adsorbed by the principle of electrostatic adsorption to adsorb particles with opposite electrical properties to the predetermined charge in the vacuum cavity, and then the particle adsorption structure adsorbed with particles is sent out of the vacuum cavity. Compared with the method of opening the process cavity and releasing the vacuum to the atmosphere for cleaning in the prior art, the above method does not need to open the vacuum cavity to release the vacuum to the atmosphere for cleaning, which saves labor costs and ensures a high cleaning efficiency for the vacuum cavity. Compared with the cleaning method in the prior art that relies on the self-cleaning ability in a vacuum environment, the above method avoids the problems of long cleaning time and low efficiency, and ensures that the vacuum chamber is cleaned with high efficiency.

[0035] According to a specific embodiment of the present application, the particle adsorption structure includes a particle adsorption layer. By emitting a predetermined charge to the particle adsorption layer, the particle adsorption layer has a better effect of adsorbing particles, which further ensures that particles with electrical properties opposite to the predetermined charge in the vacuum chamber can be adsorbed more quickly, further ensuring a higher purification efficiency in the vacuum chamber.

[0036] In actual application, in order to facilitate the manufacture of the particle adsorption structure, in a specific embodiment of the present application, the particle adsorption structure further includes a carrier, and the particle adsorption layer is located on the surface of the carrier.

[0037] In another specific embodiment of the present application, the carrier includes glass, and the particle adsorption layer includes a metal layer. The particle adsorption layer includes a metal layer, so that the particle adsorption layer can be charged with the predetermined charge more quickly, which further ensures that the particles in the vacuum chamber can be purified more efficiently. Glass is used as a carrier, which is easy to obtain and has a simple manufacturing process. At the same time, the metal layer can be easily manufactured on the surface of the glass, which further facilitates the manufacture of the particle adsorption structure.

[0038] In another specific embodiment of the present application, the metal layer includes a plurality of spaced metal parts. By arranging a plurality of spaced metal parts on the carrier, when a predetermined charge is emitted to the particle adsorption structure, the plurality of metal parts can carry the predetermined charge, and the surface of the carrier without the metal parts will attract charges with opposite electrical properties to the predetermined charge, so that the surface of the carrier without the metal parts carries charges with opposite electrical properties to the predetermined charge, thereby ensuring that the particle adsorption structure can simultaneously adsorb positively and negatively charged particles in the vacuum cavity, and ensuring a better purification effect in the vacuum cavity.

[0039] Specifically, when the electron beam is projected onto the metal layer, a large amount of negative charge accumulates on the surface of the metal layer, so that the positively charged particles in the cavity are adsorbed onto the metal layer. According to the principle of directional motion of electrons, the electrons in the particle adsorption structure will continuously move from negative charge to positive charge. Since the metal layers are arranged at intervals, the surface of the particle adsorption structure will form separated positive and negative electric fields. Under the action of the electric field force, the metal layer can adsorb positively charged particles and negatively charged particles at the same time. When the positron beam is projected onto the metal layer, the principle is the same as that of the negative electron beam being projected onto the metal layer. The metal layer can also adsorb positively charged particles and negatively charged particles at the same time, which will not be repeated here.

[0040] In actual application, the material of the metal layer includes at least one of silver, copper and chromium.

[0041] In a specific embodiment, the material of the metal layer includes silver or copper, which can make the metal layer have better conductivity, thereby further ensuring the subsequent more efficient adsorption of particles in the vacuum chamber, thereby achieving the effect of purifying the vacuum chamber.

[0042] In another specific embodiment, the material of the metal layer includes chromium, and the chromium plating process is relatively simple, so that the chromium metal layer can be obtained relatively easily, and the surface smoothness and uniformity of the chromium metal layer are good, and the corrosion resistance is good.

[0043] Of course, the material of the metal layer may also include other metal materials with good electrical conductivity, and those skilled in the art may flexibly select them according to actual conditions.

[0044] According to another specific embodiment of the present application, the vacuum chamber is a vacuum chamber of an electron beam exposure machine, and emitting the predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, including: controlling the electron emission source of the electron beam exposure machine to emit the electron beam for the predetermined time period so that the particle adsorption structure carries a negative charge. Since the vacuum chamber of the electron beam exposure machine carries the electron emission source, the cost of installing the electron emission source in the vacuum chamber is saved.

[0045] According to another specific embodiment of the present application, sending the particle adsorption structure into a vacuum chamber includes: sending the particle adsorption structure into a vacuum chamber and placing it on a workbench.

[0046] In another specific embodiment of the present application, the electron emission source is located directly above the workbench. By placing the particle adsorption structure on the workbench, it is ensured that the electron emission source can be aligned with the particle adsorption structure, thereby ensuring that the electron beam emitted by the electron emission source can fall on the surface of the particle adsorption structure, so that the particle adsorption structure can carry a certain amount of the predetermined charge in a relatively short time, further ensuring a high efficiency in purifying the vacuum chamber.

[0047] In actual application, after the particle adsorption structure is charged with the predetermined charge for a predetermined period of time, before the particle adsorption structure is sent out of the vacuum cavity, the method includes: controlling the workbench to move in the vacuum cavity. By controlling the workbench to move in the vacuum cavity, the particle adsorption structure moves in the vacuum cavity, so that the particles in the entire vacuum cavity can be adsorbed well, thereby ensuring a good purification effect on the entire vacuum cavity.

[0048] It should be noted that the steps shown in the flowcharts of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and that, although a logical order is shown in the flowcharts, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0049] An embodiment of the present application also provides a cavity purification device, which includes a first transmission unit, a charge emission device and a second transmission unit, wherein the first transmission unit is used to send a particle adsorption structure into a vacuum cavity; the charge emission device is used to emit a predetermined charge to the particle adsorption structure, so that the particle adsorption structure carries the predetermined charge, and the predetermined charge is positive charge and / or negative charge; the second transmission unit is used to send the particle adsorption structure out of the vacuum cavity after the particle adsorption structure carries the predetermined charge for a predetermined period of time.

[0050] The above-mentioned cavity purification equipment, through the above-mentioned first transmission unit, sends the particle adsorption structure into the vacuum cavity, and through the above-mentioned charge emission device, emits a predetermined charge to the above-mentioned particle adsorption structure, so that the above-mentioned particle adsorption structure carries the above-mentioned predetermined charge, and the above-mentioned predetermined charge is positive charge and / or negative charge. There are three specific situations. The first situation is that the above-mentioned particle adsorption structure only carries positive charge, the second situation is that the above-mentioned adsorbed particles only carry negative charge, and the third situation is that the above-mentioned particle adsorption structure carries positive charge and negative charge at the same time; after the above-mentioned particle adsorption structure carries the above-mentioned predetermined charge for a predetermined period of time through the above-mentioned second transmission unit, the above-mentioned particle adsorption structure is sent out of the above-mentioned vacuum cavity, and by making the particle adsorption structure carry the predetermined charge, the particle with the opposite electrical property to the predetermined charge in the above-mentioned vacuum cavity is adsorbed by the principle of electrostatic adsorption, and then the above-mentioned particle adsorption structure with adsorbed particles is sent out of the above-mentioned vacuum cavity. Compared with the method of opening the process cavity and releasing the vacuum to the atmosphere for cleaning in the prior art, the above-mentioned device does not need to open the vacuum cavity to release to the atmosphere for cleaning, which saves labor costs and ensures a high cleaning efficiency of the vacuum cavity. Compared with the cleaning method in the prior art that relies on the self-cleaning ability in a vacuum environment, the above method avoids the problems of long cleaning time and low efficiency, and ensures that the vacuum chamber is cleaned with high efficiency.

[0051] According to a specific embodiment of the present application, the particle adsorption structure includes a particle adsorption layer. By emitting a predetermined charge to the particle adsorption layer, the particle adsorption layer has a better effect of adsorbing particles, which further ensures that particles with electrical properties opposite to the predetermined charge in the vacuum chamber can be adsorbed more quickly, further ensuring a higher purification efficiency in the vacuum chamber.

[0052] In actual application, the particle adsorption structure further includes a carrier, and the particle adsorption layer is located on the surface of the carrier.

[0053] According to another specific embodiment of the present application, the carrier includes glass, and the particle adsorption layer includes a metal layer. The particle adsorption layer includes a metal layer, so that the particle adsorption layer can be charged with the predetermined charge more quickly, which further ensures that the particles in the vacuum chamber can be purified more efficiently. Glass is used as a carrier, which is easy to obtain and has a simple manufacturing process. At the same time, the metal layer can be easily manufactured on the surface of the glass, which further facilitates the manufacture of the particle adsorption structure.

[0054] In another specific embodiment of the present application, the metal layer includes a plurality of spaced metal parts. By arranging a plurality of spaced metal parts on the carrier, when a predetermined charge is emitted to the particle adsorption structure, the plurality of metal parts can carry the predetermined charge, and the surface of the carrier without the metal parts will attract charges with opposite electrical properties to the predetermined charge, so that the surface of the carrier without the metal parts carries charges with opposite electrical properties to the predetermined charge, thereby ensuring that the particle adsorption structure can simultaneously adsorb positively and negatively charged particles in the vacuum cavity, and ensuring a better purification effect in the vacuum cavity.

[0055] In actual application, the material of the metal layer includes at least one of silver, copper and chromium.

[0056] In a specific embodiment, the material of the metal layer includes silver or copper, which can make the metal layer have better conductivity, thereby further ensuring the subsequent more efficient adsorption of particles in the vacuum chamber, thereby achieving the effect of purifying the vacuum chamber.

[0057] In another specific embodiment, the material of the metal layer includes chromium, and the chromium plating process is relatively simple, so that the chromium metal layer can be obtained relatively easily, and the surface smoothness and uniformity of the chromium metal layer are good, and the corrosion resistance is good.

[0058] Of course, the material of the metal layer may also include other metal materials with good electrical conductivity, and those skilled in the art may flexibly select them according to actual conditions.

[0059] According to another specific embodiment of the present application, the vacuum chamber is a vacuum chamber of an electron beam exposure machine, and the first control unit includes a control module, which is used to control the electron emission source of the electron beam exposure machine to emit the electron beam for the predetermined time period, so that the particle adsorption structure is negatively charged. Since the vacuum chamber of the electron beam exposure machine is provided with an electron emission source, the cost of installing the electron emission source in the vacuum chamber is saved.

[0060] In order to further ensure efficient removal of particles in the process chamber, according to another specific embodiment of the present application, the first transmission unit includes a transmission module, and the transmission module is used to deliver the particle adsorption structure into the vacuum chamber and place it on the workbench.

[0061] In another specific embodiment of the present application, the electron emission source is located directly above the workbench. By placing the particle adsorption structure on the workbench, it is ensured that the electron emission source can be aligned with the particle adsorption structure, thereby ensuring that the electron beam emitted by the electron emission source can fall on the surface of the particle adsorption structure, so that the particle adsorption structure can carry a certain amount of the predetermined charge in a relatively short time, further ensuring a high efficiency in purifying the vacuum chamber.

[0062] In actual application, the device further includes a control unit, which is used to control the workbench to move in the vacuum cavity after the particle adsorption structure is charged with the predetermined charge for a predetermined period of time and before the particle adsorption structure is sent out of the vacuum cavity. By controlling the workbench to move in the vacuum cavity, the particle adsorption structure moves in the vacuum cavity, so that the particles in the entire vacuum cavity can be adsorbed well, thereby ensuring a good purification effect on the entire vacuum cavity.

[0063] According to another typical embodiment of the present application, an electron beam exposure device is also provided, including an electron beam exposure machine, and the above-mentioned electron beam exposure device also includes: a particle adsorption structure for adsorbing predetermined charges; and a cavity purification device for performing any of the above-mentioned purification methods.

[0064] The electron beam exposure device described above performs any of the above purification methods through the purification equipment of the above cavity, so that the particle adsorption structure carries a predetermined charge, and uses the principle of electrostatic adsorption to adsorb particles with an electrical property opposite to the predetermined charge in the above vacuum cavity, and then sends the above particle adsorption structure with adsorbed particles out of the above vacuum cavity. Compared with the method of opening the process cavity and releasing the vacuum to the atmosphere for cleaning in the prior art, the above method does not need to open the vacuum cavity to release the vacuum to the atmosphere for cleaning, which saves labor costs and ensures a high cleaning efficiency for the vacuum cavity. Compared with the method of cleaning in the prior art that relies on the self-cleaning ability in a vacuum environment, the above method avoids the problem of long cleaning time and low efficiency, and ensures a high efficiency cleaning of the vacuum cavity.

[0065] In a specific embodiment, the composition diagram of the electron beam exposure device is as follows: Figure 2 As shown, the electron beam exposure device includes a particle adsorption structure 200 and a cavity purification device, the cavity purification device includes an electron emission source 100, the particle adsorption structure 200 includes a metal layer 201 and a carrier 202, and the electron emission source emits an electron beam for a predetermined time period to the metal layer so that the metal layer 201 carries the predetermined charge.

[0066] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0067] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the above-mentioned units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0068] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0069] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0070] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0071] 1) The present application provides a cavity purification method. The cavity purification method includes firstly sending a particle adsorption structure into a vacuum cavity; then, emitting a predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, which is positive and / or negative. There are three specific cases. The first case is that the particle adsorption structure only carries a positive charge; the second case is that the adsorbed particles only carry a negative charge; and the third case is that the particle adsorption structure carries both positive and negative charges; finally, after the particle adsorption structure carries the predetermined charge for a predetermined period of time, the particle adsorption structure is sent out of the vacuum cavity. By making the particle adsorption structure carry a predetermined charge, the particle with the opposite charge to the predetermined charge in the vacuum cavity is adsorbed by the principle of electrostatic adsorption, and then the particle adsorption structure with the adsorbed particles is sent out of the vacuum cavity. Compared with the method of opening the process cavity and releasing the vacuum to the atmosphere for cleaning in the prior art, the method does not need to open the vacuum cavity to release the vacuum to the atmosphere for cleaning, which saves labor costs and ensures a high cleaning efficiency for the vacuum cavity. Compared with the cleaning method in the prior art that relies on the self-cleaning ability in a vacuum environment, the above method avoids the problems of long cleaning time and low efficiency, and ensures that the vacuum chamber is cleaned with high efficiency.

[0072] 2) The present application also provides a cavity purification device, wherein the cavity purification device sends the particle adsorption structure into the vacuum cavity through the first transmission unit, and emits a predetermined charge to the particle adsorption structure through the charge emission device, so that the particle adsorption structure carries the predetermined charge, and the predetermined charge is positive and / or negative. There are three specific situations. The first situation is that the particle adsorption structure only carries positive charge, the second situation is that the adsorbed particles only carry negative charge, and the third situation is that the particle adsorption structure carries both positive and negative charge. After the particle adsorption structure carries the predetermined charge for a predetermined period of time through the second transmission unit, the particle adsorption structure is sent out of the vacuum cavity. By making the particle adsorption structure carry the predetermined charge, the particle with the opposite charge to the predetermined charge in the vacuum cavity is adsorbed by the principle of electrostatic adsorption, and then the particle adsorption structure with adsorbed particles is sent out of the vacuum cavity. Compared with the method of opening the process cavity and releasing the vacuum to the atmosphere for cleaning in the prior art, the device does not need to open the vacuum cavity to release the vacuum to the atmosphere for cleaning, which saves labor costs and ensures a high cleaning efficiency for the vacuum cavity. Compared with the cleaning method in the prior art that relies on the self-cleaning ability in a vacuum environment, the above method avoids the problems of long cleaning time and low efficiency, and ensures that the vacuum chamber is cleaned with high efficiency.

[0073] 3) The present application also provides an electron beam exposure device. The electron beam exposure device performs any of the above purification methods through the purification equipment of the above cavity, so that the particle adsorption structure carries a predetermined charge, and uses the principle of electrostatic adsorption to adsorb particles with an electrical property opposite to the predetermined charge in the above vacuum cavity, and then sends the above particle adsorption structure with adsorbed particles out of the above vacuum cavity. Compared with the method of opening the process cavity and releasing the vacuum to the atmosphere for cleaning in the prior art, the above method does not need to open the vacuum cavity to release the vacuum to the atmosphere for cleaning, which saves labor costs and ensures a high cleaning efficiency for the vacuum cavity. Compared with the cleaning method in the prior art that relies on the self-cleaning ability in a vacuum environment, the above method avoids the problem of long cleaning time and low efficiency, and ensures a high efficiency cleaning of the vacuum cavity.

[0074] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for purifying a cavity, characterized in that: include: Sending the particle adsorption structure into the vacuum chamber; emitting a predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, wherein the predetermined charge is a negative charge; After the particle adsorption structure is charged with the predetermined charge for a predetermined period of time, the particle adsorption structure is sent out of the vacuum chamber, The particle adsorption structure comprises a particle adsorption layer, The particle adsorption structure further comprises a carrier, and the particle adsorption layer is located on the surface of the carrier. The particle adsorption layer includes a metal layer, The metal layer includes a plurality of metal parts arranged at intervals, so that when the predetermined charge is emitted to the particle adsorption structure, the plurality of metal parts are charged with the predetermined charge. The vacuum chamber is a vacuum chamber of an electron beam exposure machine, and emitting the predetermined charge to the particle adsorption structure so that the particle adsorption structure carries the predetermined charge, including: The electron emission source of the electron beam exposure machine is controlled to emit the electron beam for the predetermined period of time, so that the particle adsorption structure is negatively charged.

2. The purification method according to claim 1, characterized in that: The material of the metal layer includes at least one of silver, copper and chromium.

3. The purification method according to claim 1, characterized in that: The particle adsorption structure is sent into a vacuum chamber, comprising: The particle adsorption structure is sent into a vacuum chamber and placed on a workbench.

4. The purification method according to claim 1, characterized in that: After the particle adsorption structure is charged with the predetermined charge for a predetermined period of time and before the particle adsorption structure is sent out of the vacuum chamber, the method includes: The workbench is controlled to move in the vacuum chamber.

5. A cavity purification device, characterized in that: include: A first transmission unit, used for delivering the particle adsorption structure into the vacuum chamber; A charge emission device, used for emitting a predetermined charge to the particle adsorption structure, so that the particle adsorption structure carries the predetermined charge, wherein the predetermined charge is a negative charge; a second transmission unit, configured to send the particle adsorption structure out of the vacuum chamber after the particle adsorption structure is charged with the predetermined charge for a predetermined period of time; The particle adsorption structure comprises a particle adsorption layer, The particle adsorption structure further comprises a carrier, and the particle adsorption layer is located on the surface of the carrier. The particle adsorption layer includes a metal layer, The metal layer includes a plurality of metal parts arranged at intervals, so that when the predetermined charge is emitted to the particle adsorption structure, the plurality of metal parts are charged with the predetermined charge. The vacuum chamber is a vacuum chamber of an electron beam exposure machine, and the charge emission device is further used to: control the electron emission source of the electron beam exposure machine to emit the electron beam for the predetermined time period so that the particle adsorption structure is negatively charged.

6. An electron beam exposure device, comprising an electron beam exposure machine, characterized in that: The electron beam exposure device further comprises: A particle adsorption structure for adsorbing a predetermined charge; A cavity purification device, used to perform the purification method described in any one of claims 1 to 4.

Images