Improve the splicing efficiency and increase the display size structure

Abstract

The embodiment of the application discloses a structure for improving splicing efficiency and increasing display size, which comprises a unit box, the unit box comprises a first unit box and a second unit box, the first unit box is integrally formed with the second unit box, a PCB control board is arranged in the unit box, wherein the PCB control board comprises a first PCB control board and a second PCB control board, the first PCB control board is integrally formed with the second PCB control board to form a harrow tooth structure. The application not only reduces the number of unit boxes required when assembling a large screen, reduces the splicing times, but also reduces the adverse display phenomenon caused by splicing, reduces the material cost of the PCB control board, reduces the product weight and reduces the product cost itself.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of RGB direct display technology, and particularly relates to a structure for improving splicing efficiency and increasing display size. BACKGROUND

[0002] Mini LED, also known as "sub-millimeter light-emitting diode", is a transitional technology between traditional LED and micro-LED. As a backlight source applied to liquid crystal display screens, it can achieve fine display effect, and has advantages of high resolution, high color contrast, faster response speed, long service life and power saving. Due to its unique technical and cost advantages, Mini LED has broad commercialization prospects.

[0003] With the regularization of the unit box size of Mini LED products, the current industry uses a unit box with an outer size of 600mm*337.5mm for LED spacing of 0.625 / 0.78 / 0.9375 / 1.25 / 1.56 / 1.875, and the outer size is standard 27-inch display for seamless splicing LED direct display. However, the unit box of this size not only consumes a lot of manpower and material resources when assembling large screens, but also requires a separate PCB control board in each unit box, greatly increasing the cost of materials, and the more the number of unit boxes spliced, the greater the potential risks. SUMMARY

[0004] In view of the deficiencies of the prior art, the present application provides a structure for improving splicing efficiency and increasing display size, aiming to solve the technical problems of low efficiency and high cost in splicing and installing multiple unit boxes of Mini LED products in the prior art.

[0005] To solve the above problems, the present application provides a structure for improving splicing efficiency and increasing display size, which comprises:

[0006] A unit box, the unit box comprises a first unit box and a second unit box, the first unit box and the second unit box are integrally formed;

[0007] A PCB control board, the PCB control board is arranged in the unit box;

[0008] Among them, the PCB control board comprises a first PCB control board and a second PCB control board, the first PCB control board and the second PCB control board are integrally formed to form a harrow tooth structure.

[0009] Further, in the structure for improving splicing efficiency and increasing display size, the first PCB control board is arranged in the first unit box, and the second PCB control board is arranged in the second unit box.

[0010] Further, in the structure of improving splicing efficiency and increasing display size, the bottom of the first unit box and the bottom of the second unit box are provided with support parts, and the support parts are used to carry the PCB substrate.

[0011] Further, in the structure of improving splicing efficiency and increasing display size, the bottom of the first unit box and the bottom of the second unit box are provided with positioning foolproof parts, and the positioning foolproof parts are used to position and prevent the PCB substrate from being mistaken.

[0012] Further, in the structure of improving splicing efficiency and increasing display size, the PCB control board is provided with through holes, the support parts pass through the through holes to carry the PCB substrate, and the positioning foolproof parts pass through the through holes to position and prevent the PCB substrate from being mistaken.

[0013] Further, in the structure of improving splicing efficiency and increasing display size, the through holes include a plurality of first through holes and a plurality of second through holes, the support parts pass through each of the first through holes to carry a corner of four PCB substrates, and the support parts pass through the second through holes to carry one side of two PCB substrates.

[0014] Further, in the structure of improving splicing efficiency and increasing display size, the positioning foolproof parts pass through each of the first through holes and each of the second through holes to position and prevent the PCB substrate from being mistaken.

[0015] Further, in the structure of improving splicing efficiency and increasing display size, the plurality of first through holes are arranged in an array in the first unit box and the second unit box.

[0016] Further, in the structure of improving splicing efficiency and increasing display size, the plurality of second through holes are arranged in an array in the first unit box and the second unit box.

[0017] Further, in the structure of improving splicing efficiency and increasing display size, the plurality of PCB substrates are arranged in an array in the first unit box and the second unit box.

[0018] Compared with the prior art, the display size increasing structure for improving splicing efficiency provided by the embodiment of the present application has the following advantages: the first unit box and the second unit box are integrally formed, only the first PCB control board and the second PCB control board are arranged in the integrally formed unit box, the first PCB control board and the second PCB control board are integrally formed to form a harrow tooth structure, the number of unit boxes required when assembling the large screen is reduced, the splicing times are reduced, only one integrally formed and harrow tooth structured PCB control board needs to be arranged in the box in which the first unit box and the second unit box are integrally formed, the display defects caused by splicing are greatly reduced, the material cost of the PCB control board is reduced, the product weight is reduced, and the product cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 The display size increasing structure for improving splicing efficiency provided by the embodiment of the present application is shown in the schematic diagram.

[0021] Figure 2 The display size increasing structure for improving splicing efficiency provided by the embodiment of the present application is shown in the schematic diagram.

[0022] Figure 3 The structure schematic diagram of the first PCB control board and the second PCB control board integrally formed provided by the embodiment of the present application is shown in the schematic diagram.

[0023] Figure 4 The structure schematic diagram of the PCB control board mutual splicing production provided by the embodiment of the present application is shown in the schematic diagram.

[0024] Figure 5 The display size increasing structure for improving splicing efficiency provided by another embodiment of the present application is shown in the schematic diagram.

[0025] Figure 6 The structure schematic diagram of the PCB substrate in the display size increasing structure for improving splicing efficiency provided by the embodiment of the present application is shown in the schematic diagram.

[0026] Figure 7 The local structure schematic diagram of the PCB substrate in the display size increasing structure for improving splicing efficiency provided by the embodiment of the present application is shown in the schematic diagram.

[0027] Figure 8 Another local structure schematic diagram of the PCB substrate in the display size increasing structure for improving splicing efficiency provided by the embodiment of the present application is shown in the schematic diagram.

[0028] Figure 9 A structure schematic diagram of the magnet seat in the structure for improving splicing efficiency and increasing display size is provided for the embodiment of the present application.

[0029] Figure 10 A structure schematic diagram of the magnet seat in the structure for improving splicing efficiency and increasing display size is provided for the embodiment of the present application. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0031] In the description of the application, it should be understood that the terms "center", "transverse", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In the application, the word "some embodiments" is used to mean "serving as an example, instance, or illustration". Any embodiment described as an example in the present application is not necessarily to be interpreted as more preferred or having more advantages than other embodiments. The following description is given in order to enable any person skilled in the art to implement and use the present application. In the following description, details are listed for the purpose of explanation. It should be understood that those skilled in the art can realize the present application without using these specific details. In other examples, known structures and processes will not be described in detail in order to avoid unnecessary details making the description of the present application obscure. Therefore, the present application is not intended to be limited to the shown embodiments, but is consistent with the broadest scope in accordance with the principles disclosed in the present application.

[0033] Please refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 A structure schematic diagram of the structure for improving splicing efficiency and increasing display size is provided for the embodiment of the present application. Figure 2 A structure schematic diagram of the structure for improving splicing efficiency and increasing display size is provided for the embodiment of the present application. Figure 3 A structure schematic diagram of the structure for improving splicing efficiency and increasing display size is provided for the embodiment of the present application. Figures 1-3As shown, a structure for improving splicing efficiency and increasing display size comprises:

[0034] A unit box, comprising a first unit box 11 and a second unit box 12, the first unit box 11 and the second unit box 12 are integrally formed;

[0035] A PCB control board is arranged in the unit box;

[0036] The PCB control board comprises a first PCB control board 21 and a second PCB control board 22, the first PCB control board 21 and the second PCB control board 22 are integrally formed to form a harrow tooth structure.

[0037] The structure for improving splicing efficiency and increasing display size provided by the embodiment of the application is mainly applied to large-size direct type liquid crystal televisions or commercial displays. The first unit box 11 and the second unit box 12 are integrally formed, only the first PCB control board 21 and the second PCB control board 22 are arranged in the integrally formed unit box, and the first PCB control board 21 and the second PCB control board 22 are integrally formed to form a harrow tooth structure. This not only reduces the number of unit boxes required when assembling a large screen and reduces the splicing times, but also only needs to provide a PCB control board integrally formed and having a harrow tooth structure in the box where the first unit box 11 and the second unit box 12 are integrally formed. This greatly reduces the display defects caused by splicing, reduces the material cost of the PCB control board, reduces the product weight, and reduces the product cost itself.

[0038] Specifically, the first unit box 11 and the second unit box 12 are integrally formed to form a large-size unit box. This not only reduces the splicing times of the unit box of the Mini LED product, but also reduces the connecting pieces required for splicing of two unit boxes, thereby indirectly reducing the weight of the Mini LED product. For example, when the Mini LED product is a large screen of 12m x 6.75m, a unit box with a size of 600mm x 337.5mm is usually used for splicing. The number of unit boxes required is 200, and the number of fixing screws is about 800. In this application, two unit boxes with a size of 600mm x 337.5mm are integrally formed to form a unit box with a size of 600mm x 675mm. At this time, the number of unit boxes required is 100, and the number of fixing screws is about 400. Therefore, the installation efficiency is directly improved by 50%.

[0039] Furthermore, the first unit housing 11 and the second unit housing 12 are integrally molded to form the first PCB control board 21 and the second PCB control board 22 within the large-size unit housing. These are also integrally molded, forming a rake-shaped PCB control board. The integrally molded PCB control board can not only independently control the components in the first unit housing 11 and the second unit housing 12, but also reduces the area occupied by the PCB control board within the unit housing. Additionally, during production, the two integrally molded PCB control boards only need to be designed as... Figure 4 The structure shown is used for production, thereby saving on the cost of PCB board materials.

[0040] In some embodiments, the first PCB control board 21 is disposed in the first unit housing 11, and the second PCB control board 22 is disposed in the second unit housing 12. The first PCB control board 21 is used to control the components in the first unit housing 11, and the second PCB control board is used to control the components in the second unit housing 12.

[0041] It is understood that the first PCB control board 21 can also be set in the second unit box 12, and the second PCB control board 22 can be set in the first unit box 11. The positions of the first PCB control board 21 and the second PCB control board 22 in the first unit box 11 and the second unit box 12 can be set according to the actual application.

[0042] In some embodiments, such as Figure 5 As shown, the bottom of the first unit box 11 and the bottom of the second unit box 12 are both provided with support parts, which are used to support the PCB substrate 30.

[0043] Specifically, such as Figure 6As shown, a first step structure is formed at each of the four corners of each PCB substrate 30. The end face of the support portion that supports the PCB substrate 30 is parallel to the first lower step 3021 of the first step structure. The first lower step 3021 of each first step structure is on the same horizontal plane. The support portion is in contact with the first lower step 3021 of the first step structure so that the bottom plate of the unit box supports the PCB substrate 30. By directly forming a first step structure at the four corners of each PCB substrate 30, and setting a support part on the bottom plate of the unit box to support the PCB substrate 30, the end face of the support part supporting the PCB substrate 30 is parallel to the first lower step 3021 of the first step structure. The first lower step 3021 of each first step structure is at the same horizontal plane. Thus, when the PCB substrate 30 is installed on the bottom plate, the support part can directly make parallel contact with all the lower steps on the PCB substrate 30. This solves the technical problem that the height difference of the incoming PCB substrate 30 is difficult to control, resulting in height difference when splicing multiple PCB substrates 30. It also eliminates the phenomenon of bright and dark lines appearing from the side view and light leakage appearing from the front view of Mini LED products.

[0044] In some embodiments, such as Figure 6 As shown, the PCB substrate 30 is also provided with guide marks 303. When the PCB substrate 30 is spliced ​​and installed on the base plate, it can be spliced ​​and installed according to the guide marks 303, thereby improving the installation efficiency of Mini LED products.

[0045] In addition, such as Figure 7 As shown, before mounting the PCB substrate 30 on the base plate, each PCB substrate 30 requires processing at its four corners to form a first step structure. This first step structure can be a single step, with the first lower step 3021 at each corner formed after processing. The first step structure includes a first lower step 3021 and a first upper step, with the same height difference between them. Because the end face of the support portion on the base plate bearing the first step structure is parallel to the first lower step 3021, the flatness requirement of the PCB substrate 30 can be met after mounting the spliced ​​PCB substrate 30 on the base plate. This also eliminates the bright and dark lines appearing from the side view and the light leakage from the front view of the Mini LED product.

[0046] It can be understood that the first step structure can be designed as one step, but not limited to one step, and can also be designed as multiple steps. In the embodiment, in order to reduce the processing cost of the PCB substrate 30, the first step structure is directly designed as one step, and when the bottom plate is installed with the spliced PCB substrate 30, the support portion can be directly in contact with the first lower step 3021 of the first step structure to bear the PCB substrate 30, so as to solve the flatness problem of the spliced PCB substrate 30.

[0047] It can also be understood that one piece of PCB substrate 30 can be installed on the bottom plate, and multiple pieces of PCB substrate 30 can also be installed on the bottom plate. The number of PCB substrates 30 installed on the bottom plate can be selected according to actual application. In the embodiment, multiple pieces of PCB substrate 30 are preferably spliced and installed on the bottom plate, and the multiple pieces of PCB substrate 30 are arranged in an array on the bottom plate.

[0048] In some embodiments, as shown in Figure 8 each of the four edges of the PCB substrate 30 is formed with a second step structure, the second lower step 3022 of each of the second step structures is in the same horizontal plane as the first lower step 3021 of each of the first step structures, and the support portion is in contact with the second lower step 3022 of the second step structure. Specifically, the second step structure is formed at the four edges of the PCB substrate 30, and the support portion is in parallel contact with the second lower step 3022 of the second step structure, so as to increase the bearing area of the PCB substrate 30 and further increase the stability of the PCB substrate 30 on the bottom plate. The first step structure and the second step structure are designed as one step, the first step structure includes a first lower step 3021 and a first upper step, the second step structure includes a second lower step 3022 and a second upper step, and the height difference between the first upper step and the first lower step 3021 is equal to the height difference between the second upper step and the second lower step 3022. When the PCB substrate 30 is spliced and installed on the bottom plate, the support portion on the bottom plate is in parallel contact with the upper step of the first step structure and the second lower step 3022 of the second step structure, thereby increasing the stability of the PCB substrate 30 on the bottom plate.

[0049] It can be understood that the first step structure and the second step structure can be the same or different in shape, which can be selected according to the area on the PCB substrate 30. Since the first step structure in the embodiment is at the four corners of the PCB substrate 30, and the second step structure is at the four edges of the PCB substrate 30, the first step structure is preferably an L-shaped step structure, and the second step structure is preferably a circular arc-shaped step structure in the embodiment.

[0050] In some embodiments, the support portion includes a first support portion 1021 in contact with the first lower step 3021 of the first stepped structure and a second support portion 1022 in contact with the second lower step 3022 of the second stepped structure; the first support portion 1021 bears the end face of the PCB substrate 30 and the second support portion 1022 bears the end face of the PCB substrate 30, both of which are in the same horizontal plane. Specifically, in the present embodiment, the plurality of PCB substrates 30 are spliced and installed on the bottom plate, and the plurality of PCB substrates 30 are arranged in an array on the bottom plate. In order to reduce the complexity of processing the bottom plate, the first support portion 1021 is in contact with the first lower step 3021 of the first stepped structure to bear a corner of four PCB substrates 30; the second support portion 1022 is in contact with the second lower step 3022 of the second stepped structure to bear an edge of two PCB substrates 30. In addition, when the corner of the PCB substrate 30 coincides with the corner of the bottom plate, the first support portion 1021 can be directly designed at the corner of the bottom plate and only needs to bear a corner of one PCB substrate 30; when the edge of the PCB substrate 30 coincides with the edge of the bottom plate, the second support portion 1022 can be directly designed at the edge of the bottom plate and only needs to bear an edge of one PCB substrate 30.

[0051] In some specific embodiments, the first support portion 1021 includes four first support platforms, each of which is in contact with the first lower step 3021 of the four first stepped structures to bear a corner of the four PCB substrates 30; the second support portion 1022 includes two second support platforms, each of which is in contact with the second lower step 3022 of the two second stepped structures to bear an edge of the two PCB substrates 30. Among them, the four first support platforms can be integrally formed to form the first support portion 1021, and the two second support platforms can be integrally formed to form the second support portion 1022; the shape of each first support platform can be designed according to the first lower step 3021 of the first stepped structure, and similarly, the shape of each second support platform can be designed according to the second lower step 3022 of the second stepped structure. In addition, all the first support platforms and the second support platforms in the bottom plate bear the end faces of the PCB substrates 30, which are in the same horizontal plane.

[0052] In some embodiments, the bottom of the first unit box 11 and the bottom of the second unit box 12 are also provided with positioning foolproof parts for positioning and preventing the PCB substrate 30.

[0053] Specifically, as shown in FIG. 1, the first unit box 11 and the second unit box 12 are arranged in an array on the bottom plate 10, and the plurality of PCB substrates 30 are arranged in an array on the bottom plate 10. Figure 6 , Figure 9As shown, the positioning fool-proof part includes an iron piece 301 fixed on the PCB substrate 30 and a magnetic assembly 101 fixed on the bottom plate of the unit box, the iron piece 301 is magnetically connected with the magnetic assembly 101 to fix the PCB substrate 30 on the bottom plate of the unit box. Wherein, the magnet seat 1011 can be integrally formed with the bottom plate or detachably fixed on the bottom plate, and the magnet 1012 can be mounted on the magnet seat 1011 by adsorption or buckle.

[0054] Wherein, a plurality of iron pieces 301 and a plurality of magnetic assemblies 101 are arranged between the PCB substrate 30 and the bottom plate, the iron piece 301 is fixed on the PCB substrate 30, and the magnetic assembly 101 is fixed on the bottom plate. When the PCB substrate 30 is installed on the bottom plate, the iron piece 301 is only magnetically connected with the magnetic assembly 101, without the need to set the bottom plate positioning column on the bottom plate, the guiding and positioning fool-proof function can be realized, the difficulty of post-processing of the bottom plate is reduced, the accuracy of the installation of the PCB substrate 30 is improved, the convenience of the installation of the PCB substrate 30 and the bottom plate is improved, and the processing cost and the material cost are saved. In addition, the PCB substrate 30 can cancel the depth control hole, which can reduce the board layer of the PCB substrate 30 to a certain extent, reduce the design wiring risk, and thus reduce the processing cost of the PCB substrate 30.

[0055] Wherein, one end face of the PCB substrate 30 is arranged with a Min-LED array, and the other end face is fixed with a plurality of iron pieces 301. Wherein, the iron piece 301 can be directly welded on the PCB substrate 30, the iron piece 301 can be an iron sheet with a certain thickness, and the thickness of the iron piece 301 can be selected according to actual application, and the specific thickness is not limited in the embodiment.

[0056] In addition, a plurality of magnetic assemblies 101 can be arranged on the bottom plate, or only one magnetic assembly 101 can be arranged, each magnetic assembly 101 can be magnetically connected with one or more iron pieces 301, and one or more iron pieces 301 can be welded on each PCB substrate 30.

[0057] It should be noted that the positioning fool-proof function of the PCB substrate 30 installed on the bottom plate is irrelevant to the number of magnetic assemblies 101 arranged on the bottom plate and the number of iron pieces 301 welded on each PCB substrate 30, which is not limited in the embodiment. In the embodiment, one magnetic assembly 101 is preferably magnetically connected with one iron piece 301, so that the positioning fool-proof function is realized after the PCB substrate 30 is installed on the bottom plate.

[0058] In some specific embodiments, as Figure 10As shown, the magnet seat 1011 is provided with an open cavity, and the magnet 1012 is arranged in the open cavity. The magnet 1012 can be fixed in the open cavity by adsorption or buckling. When the PCB substrate 30 is mounted on the bottom plate, one magnet 1012 is magnetically connected with one iron piece 301 on the PCB substrate 30, and the iron piece 301 is directly embedded into the open cavity to be magnetically connected with the magnet 1012, so as to realize the positioning and foolproof function in the open cavity.

[0059] Meanwhile, the magnet 1012 can be directly in contact with the iron piece 301 for magnetic connection, or can be in non-contact magnetic connection with the iron piece 301. In the embodiment, the magnet 1012 is in non-contact magnetic connection with the iron piece 301, so as to realize the non-contact magnetic connection between the group of magnetic components 101 and the iron piece 301.

[0060] In the embodiment as shown, Figure 10 In the embodiment as shown,

[0061] In the specific implementation process, the diameter of the inner cavity 101a is smaller than the diameter of the outer cavity 101b, and the height of the open cavity is at least 0.5 mm higher than the height of the magnet 1012, so that when the PCB substrate 30 is mounted on the bottom plate, the iron piece 301 can be magnetically connected with the magnet 1012 in the outer cavity 101b, and the iron piece 301 can move forward, backward, left and right in the outer cavity 101b, so as to facilitate the slight adjustment of the installation position of the PCB substrate 30. In addition, the height of the magnet 1012 can be equal to, less than or greater than the height of the inner cavity 101a, as long as the height of the open cavity is at least 0.5 mm higher than the height of the magnet 1012, so that after the iron piece 301 is magnetically connected with the magnet 1012 in the open cavity, the PCB substrate 30 can be adsorbed and positioned at the predetermined position.

[0062] In some specific embodiments, the magnet seat 1011 can be a nail-shaped magnet seat; the magnet seat 1011 can be a magnet seat made of metal or a magnet seat made of plastic. The lower end of the magnet seat 1011 can be provided with a threaded portion 1013, and the bottom plate can be provided with a corresponding size screw hole, so as to realize the detachable fixed connection between the magnet seat 1011 and the bottom plate.

[0063] In some embodiments, one iron piece 301 is arranged at each corner of each PCB substrate 30, and a set of magnetic components 101 is arranged at the corresponding position of the bottom plate, i.e., one iron piece 301 is magnetically connected with one set of magnetic components 101. When the PCB substrate 30 is installed on the bottom plate, the iron piece 301 at each corner of the PCB substrate 30 is only required to be magnetically connected with the magnetic component 101 on the corresponding position of the bottom plate, and the iron piece 301 is buckled in the magnetic component 101, so that the installation of the PCB substrate 30 is completed. In addition, in order to further ensure the positioning foolproof of the installation of the PCB substrate 30 on the bottom plate, one iron piece 301 is welded on each of the four edges of each PCB substrate 30, and a set of magnetic components 101 is arranged at the corresponding position of the bottom plate.

[0064] In some embodiments, a through hole is arranged on the PCB control plate, the support part passes through the through hole to carry the PCB substrate 30, and the positioning foolproof part passes through the through hole to position and prevent the PCB substrate 30 from being installed. Specifically, before the PCB control plate is installed in the bottom plate, a through hole is designed at a specific position of the PCB control plate in advance, so that the support part and the positioning foolproof part on the bottom plate in the unit box pass through the PCB control plate, thereby carrying and preventing the positioning of the PCB substrate 30 on the unit box.

[0065] In some specific embodiments, the through hole includes a plurality of first through holes 201 and a plurality of second through holes 202, the support part passes through each first through hole 201 to carry one corner of four PCB substrates 30, and the support part passes through the second through hole 202 to carry one edge of two PCB substrates 30. Specifically, the support part includes a first support part 1021 and a second support part 1022, the first support part 1021 passes through the first through hole 201 to carry one corner of four PCB substrates 30, and the second support part 1022 passes through the second through hole 202 to carry one edge of two PCB substrates 30.

[0066] In a more specific implementation process, the positioning foolproof part passes through each first through hole 201 and each second through hole 202 to position and prevent the PCB substrate 30. Among them, the first support part 1021 is shared with a set of foolproof positioning components for one first through hole 201, and the second support part 1022 is shared with a set of foolproof positioning components for one second through hole 202. It should be noted that, since the PCB control plate does not completely cover the unit box, not all first support parts 1021, second support parts 1022 and foolproof positioning components pass through the through hole on the PCB control plate, but only part of the first support parts 1021, the second support parts 1022 and the foolproof positioning components pass through the through hole on the PCB control plate to carry and position and prevent the PCB substrate 30.

[0067] In addition, a plurality of the first through holes 201 are arranged in an array in the first unit box 11 and the second unit box 12; a plurality of the second through holes 202 are arranged in an array in the first unit box 11 and the second unit box 12; and a plurality of the PCB substrates 30 are arranged in an array in the first unit box 11 and the second unit box 12.

[0068] In some embodiments, the first PCB control board 21 and the second PCB control board 22 are integrally formed into a rake-shaped PCB control board, and a protective cover plate 203 is arranged at a power supply position of the rake-shaped PCB control board to prevent electric current from causing harm to the human body. The protective cover plate 203 is made of a Mylar sheet and is fixed to the PCB control board by means of buckling.

[0069] Each of the patents, patent applications, patent application publications, and other materials, such as articles, books, specifications, publications, documents, and the like, cited in this application is hereby incorporated by reference in its entirety for all purposes to the same extent as if each individual publication, application, or document were specifically and individually indicated to be incorporated by reference for its entirety for its cited subject matter. However, to the extent there is a conflict between the disclosure of the present application and the incorporated reference, the disclosure of the present application shall control. In addition, should there be any inconsistency between the disclosure of the application and the incorporated reference, the disclosure of the present application shall control.

[0070] The above description is merely that of the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A structure for improving splicing efficiency and increasing display size, characterized in that, The utility model relates to a kind of PCB control board and unit box, including: Unit box, the unit box includes first unit box and second unit box, the first unit box is integrally formed with the second unit box; PCB control board, the PCB control board is arranged in the unit box; Wherein, the PCB control board includes first PCB control board and second PCB control board, the first PCB control board is integrally formed with the second PCB control board to form a tine structure; The first PCB control board is arranged in the first unit box, and the second PCB control board is arranged in the second unit box; The bottom of the first unit box, the bottom of the second unit box is provided with support part, and the support part is used to carry PCB substrate; The bottom of the first unit box, the bottom of the second unit box is also provided with positioning foolproof part, and the positioning foolproof part is used to position foolproof PCB substrate; The PCB control board is provided with through hole, and the support part passes through the through hole to carry the PCB substrate, and the positioning foolproof part passes through the through hole to position foolproof PCB substrate.

2. The structure for increasing splicing efficiency and display size according to claim 1, wherein, The through hole includes several first through holes and several second through holes, and the support part passes through each first through hole to carry one corner of four PCB substrates, while the support part passes through the second through hole to carry one side of two PCB substrates.

3. The structure for increasing splicing efficiency and display size according to claim 2, wherein, The positioning foolproof part passes through each first through hole and each second through hole to position foolproof PCB substrate.

4. The structure for increasing splicing efficiency and display size according to claim 2, wherein, Several first through holes are arranged in array in the first unit box and the second unit box.

5. The structure for increasing splicing efficiency and display size according to claim 2, wherein, Several second through holes are arranged in array in the first unit box and the second unit box.

6. The structure for increasing splicing efficiency and display size according to claim 1, wherein, Several PCB substrates are arranged in array in the first unit box and the second unit box.

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