Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a main body including dielectric layers and internal electrodes alternately disposed with the dielectric layers, and an external electrode disposed on the main body. The external electrode includes an electrode layer connected to the internal electrode, a Sn plating layer disposed on the electrode layer, a Ni plating layer disposed on the Sn plating layer, and a Pd-containing plating layer disposed on the Ni plating layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0183608, filed with the Korean Intellectual Property Office on December 24, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, etc., for charging or discharging from them.

[0004] With the recent increase in industrial interest in automotive electrical components, there is also a demand for MLCCs with high reliability and high strength characteristics for use in automobiles or infotainment systems.

[0005] In particular, multilayer ceramic capacitors (MLCCs) located near the engine compartment are exposed to high-temperature environments. Under such conditions, the external electrodes of the MLCCs and the solder that bonds the substrate and the external electrodes of the MLCCs may expand and contract with temperature changes, resulting in mechanical stress that causes the solder to crack.

[0006] To prevent this, a method has been proposed to mount multilayer capacitors onto a substrate using conductive resin adhesive instead of solder. Therefore, the structure of the MLCC plating needs to be modified. Summary of the Invention

[0007] An exemplary embodiment provides a multilayer electronic component with excellent reliability.

[0008] An exemplary embodiment provides a multilayer electronic component including a uniform coating.

[0009] An exemplary embodiment provides a multilayer electronic component suitable for mounting on a substrate using a conductive resin adhesive.

[0010] According to one aspect of this disclosure, a multilayer electronic component includes: a body including a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer; and an outer electrode disposed on the body. The outer electrode includes: an electrode layer connected to the inner electrode; a Sn plating layer disposed on the electrode layer; a Ni plating layer disposed on the Sn plating layer; and a Pd-containing plating layer disposed on the Ni plating layer. Attached Figure Description

[0011] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0012] Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to exemplary embodiments of the present disclosure;

[0013] Figure 2 It is along Figure 1 A cross-sectional view taken from line I-I';

[0014] Figure 3 It is along Figure 1 A cross-sectional view taken from line II-II';

[0015] Figure 4 This is an exploded perspective view schematically illustrating a body having a stacked dielectric layer and internal electrodes according to exemplary embodiments of the present disclosure; and

[0016] Figure 5 yes Figure 2 A magnified view of region P1. Detailed Implementation

[0017] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be readily understood by those skilled in the art. The order of operations described herein is merely illustrative and is not limited to the order presented herein; changes that will be readily understood by those skilled in the art may be made, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of functions and constructions well-known to those skilled in the art may be omitted.

[0018] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided so that this disclosure will be thorough and complete and will fully convey the scope of this disclosure to those skilled in the art.

[0019] Here, it should be noted that the use of the term "may" in relation to examples or exemplary embodiments (e.g., what an example or exemplary embodiment may include or implement) means that there exists at least one example or exemplary embodiment that includes or implements such a feature, and is not limited to all examples or exemplary embodiments including or implementing such a feature.

[0020] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected" to another element, or "bonded" to another element, that element may be directly "on" another element, directly "connected" to another element, or directly "bonded" to another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, directly "connected" to another element, or "bonded" to another element, there may be no other elements in between.

[0021] As used herein, the term “and / or” includes any one or any combination of two or more of the relevant listed items.

[0022] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts will not be limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0023] For ease of description, spatial relative terms such as “above,” “above,” “below,” and “under” are used herein to describe the relationship between one element and another as shown in the accompanying drawings. Such spatial relative terms are intended to include not only the orientation depicted in the drawings but also the different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as “above” or “above” relative to another element will then be “below” or “under” relative to said other element. Thus, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein will be interpreted accordingly.

[0024] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0025] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that occur during manufacturing.

[0026] The features of the examples described herein can be combined in a variety of ways that will be readily understood after an understanding of the disclosure of this application. Furthermore, while the examples described herein have multiple constructions, other constructions that will be readily understood after an understanding of the disclosure of this application are possible.

[0027] The accompanying drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative sizes, proportions, and depictions of the elements in the drawings may be exaggerated.

[0028] In the accompanying drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction can be defined as the length (L) direction, and the third direction can be defined as the width (W) direction.

[0029] Multilayer electronic components

[0030] Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to exemplary embodiments of the present disclosure.

[0031] Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0032] Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0033] Figure 4 This is an exploded perspective view schematically illustrating a body having a stacked dielectric layer and internal electrodes according to exemplary embodiments of the present disclosure.

[0034] Figure 5 yes Figure 2 A magnified view of region P1.

[0035] In the following text, reference will be made to Figures 1 to 5 A detailed description of a multilayer electronic assembly 100 according to exemplary embodiments of the present disclosure.

[0036] The multilayer electronic assembly 100 includes: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122 alternately disposed with respect to the dielectric layer; and outer electrodes 131 and 132 disposed on the body. The outer electrodes include electrode layers 131a and 132a connected to the inner electrodes, Sn plating layers 131b and 132b disposed on the electrode layers, Ni plating layers 131c and 132c disposed on the Sn plating layers, and a Pd-containing plating layer disposed on the Ni plating layers.

[0037] In the body 110, dielectric layer 111 is stacked alternately with internal electrodes 121 and 122.

[0038] The specific shape of the body 110 is not limited, but as shown in the figure, the body 110 may have a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder particles contained in the body 110 during firing, the body 110 may not have a hexahedral shape including perfect straight lines, but rather a generally hexahedral shape.

[0039] The main body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in a third direction. Here, the second direction may be a direction perpendicular to the first direction, and the third direction may be a direction perpendicular to both the first and second directions.

[0040] The multiple dielectric layers 111 forming the body 110 are in a sintered state, and adjacent dielectric layers 111 can be integrated, making it difficult to distinguish their boundaries without the use of a scanning electron microscope (SEM).

[0041] According to exemplary embodiments of this disclosure, the material used to form the dielectric layer 111 is not limited, as long as sufficient electrostatic capacitance can be obtained therefrom. For example, barium titanate-based materials, lead-based perovskite composite materials, or strontium titanate-based materials can be used. Barium titanate-based materials may include BaTiO3-based ceramic powder particles, and the ceramic powder particles may include BaTiO3 or be obtained by partially dissolving calcium (Ca), zirconium (Zr), etc., in BaTiO3. 1-x Ca x TiO3, Ba(Ti 1-y Ca y O3、(Ba 1-x Ca x (Ti) 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3.

[0042] For the purposes of this disclosure, various ceramic additives, organic solvents, binders, dispersants, etc., can be added to powder particles such as barium titanate (BaTiO3) as materials for forming dielectric layer 111.

[0043] The thickness td of dielectric layer 111 is not particularly limited and can be determined by taking into account the desired capacitance and operating environment. For example, the thickness td of dielectric layer 111 can be less than or equal to 0.45 μm to achieve miniaturization and high capacitance of multilayer electronic components.

[0044] The main body 110 includes a capacitor forming portion Ac and covering portions 112 and 113. The capacitor forming portion Ac forms a capacitor by including a first inner electrode 121 and a second inner electrode 122 disposed facing each other and a dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122. The covering portions 112 and 113 are respectively formed above and below the capacitor forming portion Ac in a first direction.

[0045] In addition, the capacitor forming part Ac (the part that helps to form the capacitance of the capacitor) can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 and having a dielectric layer 111 between the first inner electrodes 121 and the second inner electrodes 122.

[0046] Cover portions 112 and 113 include an upper cover portion 112 and a lower cover portion 113. The upper cover portion 112 is disposed above the capacitor forming portion Ac in the first direction, and the lower cover portion 113 is disposed below the capacitor forming portion Ac in the first direction.

[0047] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming portion Ac in the thickness direction, respectively, and can be used to substantially prevent damage to the inner electrode due to physical stress or chemical stress.

[0048] The upper cover 112 and the lower cover 113 do not include internal electrodes and may include the same material as the dielectric layer 111.

[0049] In other words, the upper cover 112 and the lower cover 113 may include ceramic materials, such as barium titanate (BaTiO3) based ceramic materials.

[0050] Furthermore, the thickness of the covers 112 and 113 does not need to be particularly limited. However, the thickness tp of the covers 112 and 113 can be less than or equal to 20 μm to more easily achieve miniaturization and high capacitance of multilayer electronic components.

[0051] Additionally, edge portions 114 and 115 may be provided on the side surface of the capacitor forming portion Ac.

[0052] Edge portions 114 and 115 may include an edge portion 114 disposed on the fifth surface 5 of the body 110 and an edge portion 115 disposed on the sixth surface 6 of the body 110. That is, edge portions 114 and 115 may be disposed on both sides of the body 110 in the width direction.

[0053] like Figure 3 As shown, the edges 114 and 115 can represent the region between the two ends of the first inner electrode 121 and the second inner electrode 122 and the boundary of the body 110 in a cross section of the body 110 taken along the width-thickness (WT) direction (or the first-third direction).

[0054] Edges 114 and 115 can be used to prevent damage to the internal electrode due to physical or chemical stress.

[0055] Edges 114 and 115 can be formed by forming internal electrodes by applying conductive paste to the ceramic green sheet except for the portion where the edges will be formed.

[0056] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, the edge portions 114 and 115 can be formed by the following method: after forming the laminate, the laminate can be cut to expose the inner electrodes to the fifth surface 5 and the sixth surface 6 of the body, and then a single dielectric layer or two or more dielectric layers can be stacked on the two side surfaces of the cut laminate in the width direction to form the edge portions 114 and 115.

[0057] Internal electrodes 121 and 122 are stacked alternately with dielectric layer 111.

[0058] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged facing each other, and the dielectric layer 111 constituting the body 110 is located between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0059] Reference Figure 2 The first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed to the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed to the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the body and connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second inner electrode 122.

[0060] In other words, the first inner electrode 121 may be connected to the first outer electrode 131 without being connected to the second outer electrode 132, and the second inner electrode 122 may be connected to the second outer electrode 132 without being connected to the first outer electrode 131. Therefore, the first inner electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance.

[0061] Here, the first inner electrode 121 and the second inner electrode 122 can be electrically separated from each other by a dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122.

[0062] Reference Figure 4 The main body 110 can be formed by alternately stacking ceramic green sheets on which a first internal electrode 121 is printed and ceramic green sheets on which a second internal electrode 122 is printed, and then sintering the ceramic green sheets.

[0063] The materials used to form the internal electrodes 121 and 122 are not limited, and materials with excellent electrical conductivity can be used for this purpose. For example, the internal electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0064] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for the internal electrodes onto a ceramic green sheet. The conductive paste includes at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The printing method for the conductive paste for the internal electrodes can be screen printing or gravure printing, but this disclosure is not limited thereto.

[0065] The thickness te of the inner electrodes 121 and 122 is not particularly limited and can be determined by taking into account the desired capacitance and the operating environment. For example, the thickness te of the inner electrodes 121 and 122 can be less than or equal to 0.45 μm to achieve miniaturization and high capacitance of the multilayer electronic components.

[0066] The outer electrodes 131 and 132 may include electrode layers 131a and 132a connected to the inner electrodes 121 and 122, Sn plating layers 131b and 132b disposed on the electrode layers, Ni plating layers 131c and 132c disposed on the Sn plating layers, and Pd plating layers 131d and 132d disposed on the Ni plating layers.

[0067] The external electrodes 131 and 132 may include a first external electrode and a second external electrode respectively disposed on the third surface 3 and the fourth surface 4 of the body 110 and respectively connected to the first internal electrode 121 and the second internal electrode 122.

[0068] Typically, to mount multilayer electronic components onto a substrate, solder is used to bond the external electrodes of the multilayer electronic components to the electrode pads of the substrate. However, when using solder, mechanical stress may occur due to the expansion and contraction caused by temperature changes in the external electrodes of the multilayer electronic components and the solder that bonds the substrate to the external electrodes, leading to cracks in the solder itself.

[0069] To prevent this, a method has been proposed for mounting multilayer capacitors onto a substrate using conductive resin adhesive instead of solder. The thermal curing temperature of the conductive resin adhesive is lower than the melting point of the solder. Therefore, using conductive resin adhesive instead of solder reduces thermal stress, thereby improving reliability.

[0070] When mounting multilayer capacitors onto a substrate using conductive resin adhesives, the outermost plating layer can be formed using a Pd plating layer to prevent corrosion or deposition of the external electrodes and improve reliability. However, if the Pd-containing plating layer is too thick, a hydrogen absorption reaction may occur, leading to volume expansion and cracking. This could expose the Ni plating layer and cause oxidation, thus reducing electrical connectivity. Furthermore, Pd is relatively expensive, which may increase the manufacturing cost of multilayer electronic components.

[0071] According to this disclosure, by arranging a Sn plating layer on an electrode layer, the surface on which the Ni plating layer will be formed is planarized and imparted with conductivity, thereby uniformly forming the Ni plating layer. Therefore, a uniform and thin Pd-containing plating layer can be formed. In other words, by planarizing the surface on which the Ni plating layer will be formed, the surface on which the Pd-containing plating layer will be formed on the Ni plating layer can be planarized, thus forming a thin and uniform Pd-containing plating layer.

[0072] Sn plating layers 131b and 132b are disposed on electrode layers 131a and 132a, and can be used to planarize the surfaces on which Ni plating layers 131c and 132c will be formed and impart conductivity.

[0073] When using conductive resin adhesives to mount multilayer electronic components onto a substrate, the plating of the external electrodes is typically formed by sequentially performing Ni and Pd plating on the electrode layers. In this case, plating breakage may occur due to breaks in the electrode layers, such as glass beads protruding outwards within the electrode layers. Furthermore, during Ni plating, Ni primarily grows in the longitudinal direction (perpendicular to the surface to be plated), thus plating breakage may also occur. Additionally, even without Ni plating breakage, if the Ni plating surface is uneven, the Pd plating will be thin, making Pd plating breakage highly probable.

[0074] During plating, Sn grows primarily in the lateral direction (parallel to the surface on which the plating is performed). Therefore, when Sn plating layers 131b and 132b are disposed on electrode layers 131a and 132a, the Sn plating layers 131b and 132b cover the uneven surfaces of electrode layers 131a and 132a, thus planarizing the surfaces on which Ni plating layers 131c and 132c will be formed and imparting conductivity. Consequently, the surfaces of Ni plating layers 131c and 132c can also be planarized, and thin and uniform Pd-containing plating layers 131d and 132d can be formed on Ni plating layers 131c and 132c.

[0075] Here, the thickness of Sn coatings 131b and 132b can be from 0.02 μm to 0.1 μm.

[0076] If the thickness of the Sn plating layers 131b and 132b is less than 0.02 μm, the effect of planarizing the surface on which the Ni plating layer will be formed and imparting conductivity may be insufficient.

[0077] In addition, if the thickness of Sn plating layers 131b and 132b is greater than 0.1 μm, a thicker Ni-Sn intermetallic compound may form between the Ni plating layer and the Sn plating layer, and in this case, cracks may occur due to external stress.

[0078] For corrosive metallic components (such as sulfur), Ni plating layers 131c and 132c can be used to prevent corrosion by forming a passivation film. Furthermore, Ni plating layers 131c and 132c can be configured to cover the electrode layer to protect it from external harmful gases, etc. Additionally, Ni plating layers 131c and 132c can prevent metal from the electrode layer from depositing on the outside.

[0079] Here, the thickness of the Ni coatings 131c and 132c can be from 1 μm to 8 μm. That is, the thickness of the Ni coatings 131c and 132c can be greater than the thickness of the Sn coatings 131b and 132b.

[0080] If the thickness of the Ni plating layers 131c and 132c is less than 1 μm, the protective effect of the electrode layer may be insufficient. Furthermore, if the thickness of the Ni plating layers 131c and 132c is greater than 8 μm, the capacitance per unit volume will decrease as the volume of the multilayer electronic component increases, which may be detrimental to miniaturization and high capacitance.

[0081] The Pd-containing platings 131d and 132d, which have excellent corrosion resistance, can increase the affinity between the external electrodes 131 and 132 and the conductive resin adhesive, and improve the electrical connection with the conductive resin adhesive.

[0082] Furthermore, the Pd-containing coatings 131d and 132d disclosed herein may refer to coatings containing metal. However, this does not mean that the Pd-containing coatings 131d and 132d are composed solely of Pd; they may also contain Pd-Ni alloys or other Pd alloys, and may include any other metallic element besides Pd.

[0083] Here, the thickness of the Pd-containing plating layers 131d and 132d can be from 0.1 μm to 1 μm.

[0084] If the thickness of the Pd-containing plating layers 131d and 132d is less than 0.1 μm, the plating layers 131d and 132d may not be able to adequately cover the surface of the Ni plating layer, and the electrical connectivity may be degraded because the oxidation of the Ni plating layer cannot be adequately prevented.

[0085] Furthermore, if the thickness of the Pd-containing plating layers 131d and 132d exceeds 1 μm, a hydrogen absorption reaction may occur, causing the volume of plating layers 131d and 132d to increase and crack. Consequently, the Ni plating layer is exposed and oxidized, leading to a decrease in electrical connectivity. In addition, manufacturing costs may increase.

[0086] In addition, the thickness t2 of the Ni coating, the thickness t1 of the Sn coating, and the thickness t3 of the Pd-containing coating can be: dimensions in the second direction measured at the center of the third and fourth surfaces of the body 110 in the first and third directions.

[0087] Reference Figure 1 , Figure 2 and Figure 5 The thicknesses t2 of the Ni plating, t1 of the Sn plating, and t3 of the Pd-containing plating can be measured from a cross-section taken at the center of the multilayer electronic assembly 100 along the first and second directions in a third-direction orientation. In other words, the thicknesses can be determined by exposing surfaces such as... Figure 2 The values ​​measured are based on the cross-section shown. Furthermore, the center of the multilayer electronic assembly 100 in the third direction can be located at half the width of the multilayer electronic assembly 100 in the third direction. The observation tools used for measurement are not particularly limited, and can be, for example, optical microscopes, scanning electron microscopes (SEM), etc.

[0088] Electrode layers 131a and 132a are used to mechanically bond the body 110 to the outer electrodes 131 and 132, and to electrically and mechanically bond the inner electrodes 121 and 122 to the outer electrodes 131 and 132.

[0089] Furthermore, electrode layers 131a and 132a can be formed using any material such as metal, as long as the material is conductive, and the specific material can be determined by taking into account electrical properties and structural stability.

[0090] For example, electrode layers 131a and 132a may comprise conductive metal and glass.

[0091] There are no restrictions on the conductive metal used for electrode layers 131a and 132a, as long as it is a material that can be electrically connected to the inner electrode to form a capacitor. For example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0092] Electrode layers 131a and 132a can be formed by coating conductive paste and then sintering the conductive paste, which is prepared by adding glass frit to conductive metal powder particles.

[0093] Furthermore, when electrode layers 131a and 132a are sintered electrodes comprising conductive metal and glass, plating breakage may occur due to electrode layer breaks or glass beads protruding outwards within the electrode layers. However, when Sn plating layers 131b and 132b are disposed on electrode layers 131a and 132a according to this disclosure, the uneven surfaces of electrode layers 131a and 132a can be covered to planarize the surfaces on which Ni plating layers 131c and 132c will be formed, and conductivity can be imparted.

[0094] Therefore, when electrode layers 131a and 132a comprise conductive metal and glass, the effects of suppressing plating breakage and forming a thin and uniform Pd-containing plating layer according to this disclosure can be more significant.

[0095] Glass is used to mechanically bond the body 110 to the outer electrodes 131 and 132, and conductive metal electrically and mechanically connects the inner electrodes 121 and 122 to the outer electrodes 131 and 132. Here, the conductive metal can be Cu.

[0096] Additionally, electrode layers 131a and 132a may include a first electrode layer connected to inner electrodes 121 and 122 and comprising conductive metal and glass, and a second electrode layer disposed on the first electrode layer and comprising conductive metal and matrix resin.

[0097] In addition, electrode layers 131a and 132a can also be formed using atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, etc.

[0098] Alternatively, electrode layers 131a and 132a can be formed by transferring a sheet containing conductive metal onto the body 110.

[0099] The size of the multilayer electronic component 100 is not subject to any particular restrictions.

[0100] However, in order to achieve both miniaturization and high capacitance, the number of stacks should be increased by thinning the dielectric layer and the internal electrode. Therefore, in multilayer electronic components with dimensions of 1005 (length × width, 1.0 mm × 0.5 mm) or smaller, the effect of suppressing plating breakage and forming a thin and uniform plating layer containing Pd can be more significant.

[0101] Therefore, taking into account factors such as manufacturing errors and external electrode dimensions, the improved reliability effect according to this disclosure is more significant when the length of the multilayer electronic component 100 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 100 may refer to the dimension of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the dimension of the multilayer electronic component 100 in the third direction.

[0102] As described above, one of the various effects of this disclosure is to suppress plating cracking by providing a Sn plating layer on the electrode layer.

[0103] One of the various effects of this disclosure is that by setting a Sn plating layer on the electrode layer, the surface on which the Ni plating layer will be formed is planarized and made conductive, thereby uniformly forming the Ni plating layer and a thin and uniform Pd-containing plating layer on the Ni plating layer.

[0104] One of the various effects of this disclosure is to prevent corrosion or precipitation of the external electrode and to improve reliability.

[0105] One of the various effects of this disclosure is to provide multilayer electronic components suitable for mounting on a substrate using conductive resin adhesives.

[0106] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The main body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer; as well as External electrodes are disposed on the main body. The external electrode includes: Electrode layer, connected to the inner electrode; A Sn plating layer is disposed on the electrode layer; A Ni coating is disposed on the Sn coating; and A Pd-containing plating layer is disposed on the Ni plating layer. The thickness of the Sn coating is 0.02 μm to 0.1 μm.

2. The multilayer electronic component according to claim 1, wherein, The Sn plating layer is in contact with the electrode layer.

3. The multilayer electronic component according to claim 1, wherein, The thickness of the Ni coating is 1 μm to 8 μm.

4. The multilayer electronic component according to claim 3, wherein, The thickness of the Pd-containing coating is from 0.1 μm to 1.0 μm.

5. The multilayer electronic component according to claim 4, wherein, The main body includes a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in a third direction. The external electrode is disposed on at least one of the third surface and the fourth surface, and The thickness of the Ni plating is the dimension of the Ni plating in the second direction, measured at the center of the third and fourth surfaces of the body in the first and third directions; the thickness of the Sn plating is the dimension of the Sn plating in the second direction, measured at the center of the third and fourth surfaces of the body in the first and third directions; and the thickness of the Pd-containing plating is the dimension of the Pd-containing plating in the second direction, measured at the center of the third and fourth surfaces of the body in the first and third directions.

6. The multilayer electronic component according to claim 5, wherein, The external electrode includes a first external electrode disposed on the third surface and a second external electrode disposed on the fourth surface, and The inner electrode includes a first inner electrode exposed on the third surface and connected to the first outer electrode, and a second inner electrode exposed on the fourth surface and connected to the second outer electrode.

7. The multilayer electronic component according to claim 4, wherein, The main body includes a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in a third direction. The external electrode is disposed on at least one of the third surface and the fourth surface, and The thicknesses of the Ni plating, the Sn plating, and the Pd-containing plating are measured from a cross-section of the multilayer electronic component taken from the center of the third direction of the main body along the first and second directions.

8. The multilayer electronic component according to claim 7, wherein, The external electrode includes a first external electrode disposed on the third surface and a second external electrode disposed on the fourth surface, and The inner electrode includes a first inner electrode exposed on the third surface and connected to the first outer electrode, and a second inner electrode exposed on the fourth surface and connected to the second outer electrode.

9. The multilayer electronic assembly according to any one of claims 1-8, wherein, The electrode layer includes a first electrode layer connected to the inner electrode and comprising conductive metal and glass, and a second electrode layer disposed on the first electrode layer and comprising conductive metal and matrix resin.

10. The multilayer electronic assembly according to any one of claims 1-8, wherein, The electrode layer comprises conductive metal and glass.

11. The multilayer electronic assembly according to claim 10, wherein, The conductive metal is Cu.

12. The multilayer electronic assembly according to claim 1, wherein, The multilayer electronic component has a size of 1005 or smaller.

13. The multilayer electronic assembly according to claim 1, wherein, The thickness of the Pd-containing coating is from 0.1 μm to 1.0 μm.

14. The multilayer electronic assembly according to claim 1, wherein, The thickness of the Sn coating is less than the thickness of the Ni coating.

15. The multilayer electronic assembly according to any one of claims 1-8, wherein, The electrode layer, the Sn plating layer, the Ni plating layer disposed on the Sn plating layer, and the Pd-containing plating layer are sequentially disposed on the body.

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