A film profile material detection sensor performance research platform and a use method thereof

Abstract

The present application relates to a kind of film profile material detection sensor performance research platform and its using method, belong to measurement technical field.The platform includes target object operating module, probe fixing and connecting module, control module and support module.Target object operating module is composed of lifting submodule and rotating submodule;Probe fixing and connecting module is composed of probe placement rotary table, binding post, annular guide rail and spring positioning pin;Control module is composed of microcontroller, power supply unit and acquisition analysis unit.In use, target object is fixed in the target object carrying platform of rotating submodule, sensor probe is affixed to probe placement rotary table, control lifting submodule to change the distance of target object and sensor probe, control rotating submodule to make each target object in turn pass through sensor probe, and the impedance signal of sensor in the above process is obtained by acquisition analysis unit.The platform designed in the present application can provide experimental environment and condition for film profile material detection sensor performance research.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of measurement technology, and particularly relates to performance research of a thin film material detection sensor. BACKGROUND

[0002] Metal material detection plays an important role in modern production and life. With the development of science and technology, many engineering application occasions require the material detection sensor to work in a bending and stretching state, so it is urgent to have a thin film type structure for the material detection sensor, which can be flexibly attached to the curved surface to complete the detection task. However, since the thin film material detection sensor is a new research direction, there is currently no complete and mature experimental platform to ensure that relevant performance research can be carried out, which has become a bottleneck for further development of the sensor prototype. Therefore, how to build a special platform for performance research of the thin film material detection sensor is a difficult problem to be solved in the field at present. SUMMARY

[0003] The object of the present application is to overcome the shortcomings of the prior art, and provide a thin film material detection sensor performance research platform and a use method thereof. The thin film material detection sensor performance research experimental platform comprises a target object operating module, a probe fixing and connecting module, a control module and a support module; the target object operating module is composed of a lifting sub-module and a rotating sub-module; the lifting sub-module is composed of a lead screw, a lifting rod, a vertical guide, a servo motor, a bevel gear transmission box, an up-limit switch and a down-limit switch; the rotating sub-module is composed of a wheel hub motor, a target object bearing table, a quadrature connecting piece and an encapsulation cover; the probe fixing and connecting module is composed of a probe placing rotary table, a terminal post, an annular guide rail and a spring positioning pin; the control module is composed of a microcontroller, a power supply unit and a collection and analysis unit; the support module is composed of a water platform surface and an overall support frame table; characterized in that the servo motor of the lifting sub-module controls the lifting of the lifting sub-module, the lifting sub-module is connected with the rotating sub-module to drive the lifting of the rotating sub-module; the target object bearing table of the rotating sub-module is used for fixing the target object, the wheel hub motor of the rotating sub-module directly drives the rotation of the target object bearing table of the rotating sub-module to drive the rotation of the target object; the probe fixing and connecting module is used for fixing the sensor probe and connecting the sensor probe with the collection and analysis unit of the control module; the control module communicates with the upper computer through an RS232 connecting line, controls the lifting sub-module to change the distance between the target object and the sensor probe, controls the rotating sub-module to make each target object pass through the sensor probe in turn, and acquires the impedance signal of the sensor probe in the above process through the collection and analysis unit of the control module and uploads the impedance signal to the upper computer; the water platform surface of the support module is used for fixing the target object operating module and the probe fixing and connecting module, and the overall support frame table of the support module serves as a support of the water platform surface of the support module, and is internally used for fixing the lead screw, the servo motor, the bevel gear transmission box, the up-limit switch and the down-limit switch of the lifting sub-module and the control module; the modules are matched with each other to form a complete thin film material detection sensor performance research platform.

[0004] The vertical guide of the lifting sub-module is used for fixing the lifting sub-module at the center of the water platform surface of the support module, and limiting the movement direction of the lifting sub-module to be vertical; the bevel gear transmission box of the lifting sub-module transmits the output of the servo motor of the lifting sub-module to the lifting rod of the lifting sub-module; the rotating sub-module is connected with the lifting sub-module to drive the lifting of the rotating sub-module, and the lifting speed is determined by the output of the servo motor of the lifting sub-module; the signal outputs of the up-limit switch and the down-limit switch of the lifting sub-module are output to the microcontroller of the control module, and are used for limiting the maximum rising position, the maximum falling position and the maximum lifting stroke of the lifting sub-module.

[0005] The target object bearing table of the rotating sub-module is an octagon, and the target object is fixed to each side equidistantly by screws; the stator of the wheel hub motor of the rotating sub-module is connected and fixed with the lifting rod of the lifting sub-module, the rotor of the wheel hub motor of the rotating sub-module is orthogonally connected with the target object bearing table of the rotating sub-module, and the orthogonal connecting piece of the rotating sub-module is used for reinforcement and bearing; the wheel hub motor of the rotating sub-module directly drives the target object bearing table of the rotating sub-module to rotate, drives the target object to rotate, and the rotation rate is determined by the output of the wheel hub motor of the rotating sub-module.

[0006] Eight pairs of the terminal posts of the probe fixing and connecting module are equidistantly arranged in the probe placing rotary table of the probe fixing and connecting module, the upper end of the terminal post of the probe fixing and connecting module is used for connecting the sensor probe, the lower end of the terminal post of the probe fixing and connecting module is a ball spring connector used for connecting the collection and analysis unit of the control module, the sensor probe is connected with the collection and analysis unit of the control module through the terminal post of the probe fixing and connecting module, in the initial state, the sensor probe corresponds to the target object one by one and is located at the center position directly below the target object; the probe placing rotary table of the probe fixing and connecting module is connected with the annular guide rail of the probe fixing and connecting module, the sensor probe is fixed at each terminal post of the probe fixing and connecting module by rotating the probe placing rotary table of the probe fixing and connecting module; the spring positioning pin of the probe fixing and connecting module is used for positioning the probe placing rotary table of the probe fixing and connecting module, and prevents the probe fixing and connecting module from moving during testing.

[0007] The method for using the platform in the application is as follows: the power is turned on, the host computer is connected, the lifting sub-module is initialized, the lifting sub-module reaches the initial position, i.e., the maximum lifting position, the rotating sub-module is initialized, the probe of the rotating sub-module is placed on the rotating table to reach the initial position, the sensor probe is fixed on the probe fixing and connecting module, the target object is fixed on the target object bearing table of the rotating sub-module, the discrete variation of the lift-off distance between the target object and the sensor probe is controlled, the parameters to be collected are configured through the host computer, the motion parameters of the rotating sub-module are configured, the target object is controlled to rotate, each target object passes through the sensor probe in turn, the impedance signals of the sensor probe passing through each target object at the current distance are acquired through the acquisition and analysis unit and are uploaded to the host computer in real time, the motion parameters of the lifting sub-module are configured, the target object is controlled to descend to a new lift-off position, the rotating sub-module is initialized again, the target object is controlled to rotate, the impedance signals of the sensor probe passing through each target object at the new distance are acquired and are uploaded to the host computer in real time, the above steps are repeated until the host computer acquires the material-impedance response of the sensor probe at each lift-off distance, when the lift-off distance between the target object and the sensor probe is continuously changed, the parameters to be collected are configured through the host computer, the lifting sub-module is configured, the target object is controlled to descend, the impedance signals of the sensor probe under the current target object in the descending process are acquired through the acquisition and analysis unit and are uploaded to the host computer, the motion parameters of the rotating sub-module are configured, the target object is controlled to rotate by 45 degrees, the lifting sub-module is initialized again, the target object is controlled to descend, the impedance signals of the sensor probe under the new target object in the descending process are acquired and are uploaded to the host computer in real time, the above steps are repeated until the host computer acquires the lift-off-impedance response of the sensor probe under all target objects.

[0008] Characteristics and effects of the application

[0009] The film material quality detection sensor performance research platform designed by the application drives the rotating sub-module to lift through the lifting sub-module, accurately controls the lift-off distance between the target object and the sensor probe, directly drives the target object placing platform to rotate through the hub motor, simplifies the structure of the rotating sub-module, and improves the transmission efficiency of the rotating sub-module; eight pairs of connecting posts are equidistantly arranged in the probe placing rotary table, eight sensor probes can be fixed, the target object placing platform is a regular octagon, eight target objects can be equidistantly fixed on each side, in the initial state, the sensor probes correspond to the target objects one by one and are located at the center positions directly below the target objects; the probe placing rotary table is connected with the annular guide rail, the sensor probes are fixed at each connecting post by rotating the probe placing rotary table, the spring positioning pin is used for positioning the probe placing rotary table to prevent the probe placing rotary table from moving during testing; the film material quality detection sensor performance research experimental platform accurately controls the lift-off distance between the target object and the sensor probe through the lifting sub-module, controls the target object to rotate through the rotating sub-module, makes each target object pass through each sensor probe below in turn, acquires the impedance signals of the sensor probes through the impedance acquisition module and uploads the impedance signals to the upper computer in real time, and provides an experimental basis for impedance characteristic research of the film material quality detection sensor. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 It is a structural schematic diagram of the film material quality detection sensor performance research platform.

[0011] Figure 2 It is a structural schematic diagram of the lifting sub-module.

[0012] Figure 3 It is a structural schematic diagram of the rotating sub-module.

[0013] Figure 4 It is a structural schematic diagram of the probe connection and fixing module.

[0014] Figure 5 It is a structural schematic diagram of the control module.

[0015] Figure 6 It is a structural schematic diagram of the support module.

[0016] Figure 7 It is a flowchart of the platform use method.

[0017] Reference signs:

[0018] 1, target object operating module;

[0019] 2, lifting sub-module; 201, lead screw; 202, lifting rod; 203, vertical guide; 204, servo motor; 205, bevel gear transmission box;

[0020] 206, up limit switch; 207, down limit switch;

[0021] 3. Rotating submodule; 301. Hub motor; 302. Target support platform; 303. Orthogonal connector; 304. Encapsulation cover;

[0022] 4. Probe fixing and connection module; 401. Probe mounting rotating platform; 402. Terminal block; 403. Circular guide rail; 404. Spring positioning pin;

[0023] 5. Control module;

[0024] 6. Support module; 601. Horizontal platform; 602. Overall support frame Detailed Implementation

[0025] To facilitate understanding of the invention, a more complete description of the invention is provided below, along with preferred embodiments. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0027] like Figure 1 As shown, a thin-film material detection sensor performance research platform includes four parts: target manipulation module 1, probe fixing and connection module 4, control module 5 and support module 6, wherein the target manipulation module 1 consists of lifting sub-module 2 and rotating sub-module 3.

[0028] The lifting sub-module 2 is composed of a lead screw 201, a lifting rod 202, a vertical guide 203, a servo motor 204, a bevel gear transmission box 205, an up-limit switch 206 and a down-limit switch 207. The servo motor 204 controls the lifting of the lifting sub-module 2, and the lifting sub-module 2 is connected with the rotating sub-module 3 to drive the rotating sub-module 3 to lift. The rotating sub-module 3 is composed of a hub motor 301, a target object bearing table 302, a quadrature connector 303 and an encapsulation cover 304. The target object bearing table 302 is used to fix the target object, and the hub motor 301 directly drives the target object bearing table 302 to rotate to drive the target object to rotate. The probe fixing and connecting module 4 is composed of a probe placing rotating table 401, a terminal post 402, an annular guide rail 403 and a spring positioning pin 404. The probe placing rotating table 401 is used to fix the sensor probe and connect the sensor probe with the collection and analysis unit 403. The control module 5 is composed of a microcontroller 401, a power supply unit 402 and a collection and analysis unit 403. The control module 5 communicates with the upper computer through the RS232 connection line, is used to control the operation of the lifting sub-module 2 and the rotating sub-module 3, makes each target object pass through the sensor probe in turn at different lift-off distances, collects the impedance signal of the sensor probe and uploads to the upper computer in real time. The support module 6 is composed of a water platform surface 601 and an overall support frame table 602. The water platform surface 601 is used to fix the lifting sub-module 2 and the probe fixing and connecting module 4, and the overall support frame table 602 serves as a support for the water platform surface 601. The inside of the overall support frame table 602 is used to fix the lead screw 201, the servo motor 204, the bevel gear transmission box 205, the up-limit switch 206 and the down-limit switch 207 and the control module 5, forming a complete thin film profile material detection sensor performance research platform.

[0029] As Figure 2 , Figure 3As shown, the diameter of the screw rod 201 is 25 mm, and the length is 600 mm. The diameter of the lower end of the lifting rod 202 is 50 mm, and the length is 430 mm. The diameter of the upper end of the lifting rod 202 is 40 mm, and the length is 70 mm, forming a tenon. The hub motor 301 is connected with the lifting rod 202 in a mortise and tenon joint, and is fixed on the upper end of the lifting rod 202. The vertical guide 203 fixes the lifting rod 202 at the center of the cabinet face 601, and limits the movement direction of the lifting rod 202 to be vertical. The output of the servo motor 204 drives the screw rod 201 to rotate through the bevel gear transmission box 205, so that the lifting rod 202 is lifted, and the hub motor 301 fixed on the upper end of the lifting rod 202 is lifted. The up-limit switch 206 and the down-limit switch 207 are installed on the side surface of the overall support frame table 602, and cooperate with the strip-shaped rod protruding from the bottom of the lifting rod 202, so as to limit the maximum up-limit position, the maximum down-limit position and the maximum lifting stroke of the lifting rod 202. The thickness of the sensor probe is 2 mm. When the lifting rod 202 reaches the highest position, the lifting distance between the target object and the sensor probe is 50 mm. When the lifting rod 202 reaches the lowest position, the lifting distance between the target object and the sensor probe is 0 mm, and the maximum lifting stroke is 50 mm.

[0030] As shown in Figure 3 The hub motor 301 is connected with the lifting rod 202 in a mortise and tenon joint, and is fixed on the upper end of the lifting rod 202. The packaging cover 303 is a circular cover with a diameter of 90 mm, a height of 33 mm and a thickness of 3 mm, which is installed on the top of the lifting rod 202, and is used to protect the stator, bearing and encoder of the hub motor 301. The diameter of the rotor of the hub motor 301 is 120 mm. The target object bearing table 302 is a regular octagon with a side length of 200 mm, a thickness of 8 mm. The right-angled triangle orthogonal connecting piece 303 has a horizontal side of 50 mm and a vertical side of 28 mm, and a thickness of 8 mm. The target object bearing table 302 is connected with the rotor of the hub motor 301 through four right-angled triangle orthogonal connecting pieces 303. The target object is a cuboid with a length of 200 mm, a width of 150 mm and a thickness of 5 mm, which is fixed on each side of the target object bearing table 302 by screws at equal intervals, and a maximum of 8 target objects are fixed. The hub motor 301 directly drives the target object bearing table 302 to drive the target object to rotate, and the output of the hub motor 301 is adjusted by the control module 5 to control the rotating speed of the target object.

[0031] As shown in Figure 4As shown, the probe placement rotating table 401 is a circular ring table with an inner diameter of 550 mm and an outer diameter of 900 mm, and eight pairs of connecting posts 402 are equidistantly arranged on the outer side of the probe placement rotating table 401. The inner ring of the annular guide rail 403 has an inner diameter of 590 mm, a width of 10 mm, and a height of 5 mm, and the outer ring of the annular guide rail 403 has an inner diameter of 780 mm, a width of 10 mm, and a height of 5 mm. The groove at the bottom of the probe placement rotating table 401 cooperates with the annular guide rail 403 to enable the probe placement rotating table 401 to rotate along the annular guide rail 403, thereby facilitating the fixation of the sensor probe at each connecting post 402. The spring positioning pin 404 with a diameter of 10 mm and a height of 10 mm is arranged at the lower right corner of the water platform 601. After the sensor probe is connected and fixed, the probe placement rotating table 401 is reset so that the spring positioning pin 404 is pressed into the corresponding groove at the bottom of the probe placement rotating table 401, thereby preventing the probe placement rotating table 401 from moving during testing and affecting data collection.

[0032] As shown in Figure 5 The control module 5 is composed of a microcontroller, a power supply unit, and a collection and analysis unit. The power supply unit outputs the required DC voltage for the control module 5, the lifting sub-module 2, and the rotating sub-module 3 through hardware circuit rectification of 220V power frequency alternating current. The control module 5 is a minimum system composed of a microcontroller. The microcontroller communicates with the upper computer through an RS232 connection line, configures a port to connect the servo motor 204, the up-limiting switch 206, the down-limiting switch 207, the hub motor 301, and the collection and analysis unit. The output of the servo motor 204 is adjusted by the microcontroller to control the lifting speed of the lifting sub-module 2. The output of the hub motor 301 is adjusted by the microcontroller to control the rotating speed of the rotating sub-module 3. The output signals of the up-limiting switch 206 and the down-limiting switch 207 are input to the microcontroller to limit the maximum up-limiting position, the maximum down-limiting position, and the maximum lifting stroke of the lifting sub-module 2. The collection and analysis unit can realize impedance analysis under an excitation frequency range of 100Hz-8MHz and an excitation amplitude range of 0.6V-5V, collect parameters such as impedance module, impedance angle, resistance, reactance, inductance, and capacitance, and control the collection and analysis unit by the microcontroller to collect the impedance signals of the sensor probe and upload them to the upper computer in real time.

[0033] As shown in Figure 6As shown, the support module 6 is composed of a water platform 601 and an overall support frame 602, the water platform 601 has a size of 1000mm*1000mm*10mm, and the overall support frame 602 has a size of 950mm*950mm*750mm. The water platform 601 is used for fixing the target object manipulation module 1 and the probe fixing and connecting module 4, eight pairs of connecting ports matched with the binding posts 402 in the probe placing rotary table 401 are arranged on the water platform 601, so that the binding posts 402 can be well connected with the collection and analysis unit, and the sensor probe signal can be stably transmitted to the collection and analysis unit; the overall support frame 602 is used for fixing the lead screw 201, the servo motor 204, the bevel gear transmission box 205, the up-limiting switch 206 and the down-limiting switch 207 and the control module 5. The above-mentioned modules are cooperated with each other to form a complete thin film material detection sensor performance research platform.

[0034] In the present application, the flow chart of the platform using method is as shown in the figure Figure 7 As shown, the power is turned on, the upper computer is connected, the lifting sub-module 2 is initialized to the maximum up-limiting position, and the rotating sub-module 3 is initialized. Different materials of target objects are selected, such as iron, aluminum, red copper, 45# steel, 404 stainless steel, tin, brass, and permalloy, the target object has a size of 200mm*150mm*5mm, two fixed vias are arranged at one end of the target object, the target object is fixed on each side of the target object bearing table 302 through screws, the effective measured area of the fixed target object is 150mm*150mm. The spring positioning pin 404 is pressed down, the probe placing rotary table 401 is switched from the fixed state to the active state, the sensor probe is connected with the binding post 402, and the corresponding binding post 402 of each sensor probe is recorded; after the sensor probe is fixed, the probe placing rotary table 401 is reset, the spring positioning pin 404 is popped out, and the probe placing rotary table is switched from the active state to the fixed state, at this time, the sensor probe has been stably connected with the collection and analysis unit.

[0035] When the lift-off distance between the target object and the sensor probe is continuously changed, the parameters to be collected are configured by the upper computer, such as impedance modulus, impedance angle, resistance and reactance; the motion parameters of the rotating sub-module 3 are configured, such as rotating speed and rotating angle; the motion parameters of the lifting sub-module 2 are configured, such as lifting speed and lifting stroke. The test parameters are set as resistance and reactance, the lifting speed and lifting stroke are set according to the needs, the target object is controlled to descend, the equivalent resistance and equivalent reactance of the sensor probe under the current target object in the descending process are collected and uploaded to the upper computer in real time; the rotating speed is set according to the needs, the target object carrying table 302 is controlled to rotate by 45°, the target object is controlled to descend after the lifting sub-module 2 is initialized again, the equivalent resistance and equivalent reactance of the sensor probe under the new target object in the descending process are collected and uploaded to the upper computer in real time, the above steps are repeated until the collection is completed, the lift-off-impedance response of the sensor probe under each target object is recorded by the upper computer, and the material-impedance characteristics of the sensor probe under the continuous lift-off change are obtained by comparison and analysis.

[0036] When the lift-off distance between the target object and the sensor probe is continuously changed, the parameters to be collected are configured by the upper computer, such as impedance modulus, impedance angle, resistance and reactance; the motion parameters of the rotating sub-module 3 are configured, such as rotating speed and rotating angle; the motion parameters of the lifting sub-module 2 are configured, such as lifting speed and lifting stroke. The test parameters are set as resistance and reactance, the lifting speed and lifting stroke are set according to the needs, the target object is controlled to descend, the equivalent resistance and equivalent reactance of the sensor probe under the current target object in the descending process are collected and uploaded to the upper computer in real time; the rotating speed is set according to the needs, the target object carrying table 302 is controlled to rotate by 45°, the target object is controlled to descend after the lifting sub-module 2 is initialized again, the equivalent resistance and equivalent reactance of the sensor probe under the new target object in the descending process are collected and uploaded to the upper computer in real time, the above steps are repeated until the collection is completed, the lift-off-impedance response of the sensor probe under each target object is recorded by the upper computer, and the material-impedance characteristics of the sensor probe under the continuous lift-off change are obtained by comparison and analysis.

[0037] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the patent of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A thin film material detection sensor performance research platform, comprising: The target object operating module, the probe fixing and connecting module, the control module and the support module; The target object operating module is composed of a lifting sub-module and a rotating sub-module, the lifting sub-module is composed of a lead screw, a lifting rod, a vertical guide, a servo motor, a bevel gear transmission box, an up-limit switch and a down-limit switch, and the rotating sub-module is composed of a wheel hub motor, a target object bearing table, a right-angle connecting piece and a packaging cover; the probe fixing and connecting module is composed of a probe placing rotary table, a terminal post, an annular guide rail and a spring positioning pin; the control module is composed of a microcontroller, a power supply unit and a collection and analysis unit; and the support module is composed of a water platform surface and an overall support frame table; characterized in that the servo motor of the lifting sub-module controls the lifting of the lifting sub-module, the lifting sub-module is connected with the rotating sub-module to drive the lifting of the rotating sub-module; the target object bearing table of the rotating sub-module is used for fixing a target object, the wheel hub motor of the rotating sub-module directly drives the rotation of the target object bearing table of the rotating sub-module to drive the rotation of the target object; the probe fixing and connecting module is used for fixing a sensor probe and connecting the sensor probe with the collection and analysis unit of the control module; the control module communicates with an upper computer through an RS232 connecting line, controls the lifting sub-module to change the distance between the target object and the sensor probe, controls the rotating sub-module to make each target object pass through the sensor probe in turn, and acquires the impedance signal of the sensor probe in the above process through the collection and analysis unit of the control module and uploads the impedance signal to the upper computer; the water platform surface of the support module is used for fixing the target object operating module and the probe fixing and connecting module, the overall support frame table of the support module serves as a support of the water platform surface of the support module, and the inside is used for fixing the lead screw, the servo motor, the bevel gear transmission box, the up-limit switch and the down-limit switch of the lifting sub-module and the control module; the modules are matched with each other to form a complete film profile material detection sensor performance research platform.

2. The film material sensor performance research platform according to claim 1, wherein, The vertical guide of the lifting sub-module is used for fixing the lifting sub-module at the center of the water platform surface of the support module to limit the movement direction of the lifting sub-module to be vertical; the bevel gear transmission box of the lifting sub-module transmits the output of the servo motor of the lifting sub-module to the lifting rod of the lifting sub-module, the rotating sub-module is connected with the lifting sub-module to drive the rotating sub-module to lift along with the lifting sub-module, and the lifting speed is determined by the output of the servo motor of the lifting sub-module; the signal outputs of the up-limit switch and the down-limit switch of the lifting sub-module are output to the microcontroller of the control module to limit the maximum rising position, the maximum falling position and the maximum lifting stroke of the lifting sub-module.

3. The thin film material sensor performance research platform according to claim 1, wherein, The target object bearing table of the rotating sub-module is a regular octagon, and the target object is fixed equidistantly on each side by screws; the stator of the wheel hub motor of the rotating sub-module is connected and fixed with the lifting rod of the lifting sub-module, and the rotor of the wheel hub motor of the rotating sub-module is orthogonally connected with the target object bearing table of the rotating sub-module, and the orthogonal connecting piece of the rotating sub-module is used for reinforcement and bearing; The wheel hub motor of the rotating sub-module directly drives the target object bearing table of the rotating sub-module to rotate, and drives the target object to rotate, and the rotation rate is determined by the output of the wheel hub motor of the rotating sub-module.

4. The thin film material sensor performance research platform according to claim 1, wherein, Eight pairs of wire posts of the probe fixing and connecting module are equidistantly arranged in the probe placing rotary table of the probe fixing and connecting module, the upper end of the wire post of the probe fixing and connecting module is used for connecting the sensor probe, the lower end of the wire post of the probe fixing and connecting module is a ball spring connector used for connecting the collection and analysis unit of the control module, the sensor probe is connected with the collection and analysis unit of the control module through the wire post of the probe fixing and connecting module, in the initial state, the sensor probe corresponds to the target object one by one and is located at the center position directly below the target object; the probe placing rotary table of the probe fixing and connecting module is connected with the annular guide rail of the probe fixing and connecting module, and the sensor probe is fixed at each wire post of the probe fixing and connecting module by rotating the probe placing rotary table of the probe fixing and connecting module; the spring positioning pin of the probe fixing and connecting module is used for positioning the probe placing rotary table of the probe fixing and connecting module, and prevents the probe fixing and connecting module from moving during testing.

5. A method for using the thin film material sensor performance research platform, which adopts any one of the thin film material sensor performance research platforms according to claims 1-4, characterized in that, Power on, connect the host computer, initialize the lifting sub-module, make the lifting sub-module reach the initial position, that is, the maximum lifting position, initialize the rotating sub-module, make the probe of the rotating sub-module reach the initial position; Fix the sensor probe on the probe fixing and connecting module, fix the target object on the target object carrying table of the rotating sub-module; When the lifting distance between the target object and the sensor probe is discretely changed, configure the parameters to be collected through the host computer, configure the motion parameters of the rotating sub-module, control the target object to rotate, so that each target object passes through the sensor probe in turn, acquire the impedance signals of each target object passing through the sensor probe at the current distance through the acquisition and analysis unit and upload to the host computer in real time; Configure the motion parameters of the lifting sub-module, control the target object to descend to a new lifting position, re-initialize the rotating sub-module, control the target object to rotate, collect the impedance signals of each target object passing through the sensor probe at the new distance and upload to the host computer in real time, repeat the above steps until the host computer acquires the material-impedance response of the sensor probe at each lifting distance; When the lifting distance between the target object and the sensor probe is continuously changed, configure the parameters to be collected through the host computer, configure the lifting sub-module, control the target object to descend, acquire the impedance signals of the sensor probe under the current target object during the descending process through the acquisition and analysis unit and upload to the host computer; Configure the motion parameters of the rotating sub-module, control the target object to rotate by 45°, re-initialize the lifting sub-module, control the target object to descend, collect the impedance signals of the sensor probe under the new target object during the descending process and upload to the host computer in real time, repeat the above steps until the host computer acquires the lifting-impedance response of the sensor probe under all target objects.

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