Semiconductor test socket

Abstract

The present invention relates to the field of semiconductor package testing, and discloses a semiconductor test socket. The semiconductor test socket includes a test socket main body (10), a guiding frame (20), and a height adjusting mechanism (30). The guiding frame is installed above the test socket main body and has a central socket (21). The height adjusting mechanism is embedded at the edge of the central socket. The height adjusting mechanism includes an operable operation part (31) and a moving part (32) that can move between a first position located outside the central socket and a second position located inside the central socket by operating the operation part. The moving part includes a supporting surface (321) for supporting the device under test in the second position. According to different types of packages of the devices under test, they can be selectively supported on the supporting surface in the second position or on the top surface of the test socket main body, without replacing the test socket, thus improving the efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging and testing, and particularly to a semiconductor test socket. Background Art

[0002] When testing semiconductor packages, since different forms of packaging may be performed on the same type of wafer, the local structures of the packages are different, but the pin information of the chips is the same, and basically the same test socket can be used. For example, for two types of packages, BGA and LGA, the only difference is that the bottom of the chip in the BGA package is solder balls, while the bottom of the chip in the LGA package is flat. During testing, many parameters of the testing equipment (such as the optimal use height of the probe, the limit of the test cover or the test ram) are defined based on the test socket. Therefore, when testing chips in BGA and LGA packages, test sockets with different heights need to be replaced. When testing chips of different types of packages, due to the need to replace the test socket, the efficiency is low. Summary of the Invention

[0003] The object of the present invention is to overcome the problem of low efficiency caused by the inability of the existing test socket to adapt to the testing of different packages, and to provide a semiconductor test socket to adapt to the testing of different packages.

[0004] To achieve the above object, on the one hand, the present invention provides a semiconductor test socket, wherein the semiconductor test socket includes a test socket body, a guiding frame and a height adjusting mechanism. The guiding frame is installed above the test socket body and has a central socket. The height adjusting mechanism is embedded at the edge of the central socket. The height adjusting mechanism includes an operating part that can be operated and a moving part that can move between a first position located outside the central socket and a second position located inside the central socket by operating the operating part. The moving part includes a supporting surface for supporting the workpiece to be tested when in the second position.

[0005] Optionally, the guiding frame is provided with a through hole arranged in the height direction, and the operating part is arranged to be able to be contacted through the through hole to be operated from the outside.

[0006] Optionally, the central socket is rectangular, and the height adjusting mechanisms are respectively arranged at the four corners of the central socket.

[0007] Optionally, the moving part includes a first supporting edge and a second supporting edge arranged at right angles to each other and a moving block connecting the first supporting edge and the second supporting edge. The moving block is arranged to be able to move along the diagonal of the corner where the height adjusting mechanism is located.

[0008] Optionally, the operating part includes a driving block and a sliding block connected to the driving block. The driving block is rotatably arranged in the through hole, the sliding block is arranged deviating from the rotation axis of the driving block, a sliding groove is arranged on the moving block, and the sliding block is rotatably and slidably matched with the sliding groove.

[0009] Optionally, a resistance member for increasing the rotational resistance is arranged between the through hole and the driving block.

[0010] Optionally, the driving block is provided with a rotating groove for facilitating the rotation operation from the outside.

[0011] Optionally, the driving block is provided with an indicating mark for indicating the rotation position, and the top surface of the guiding frame is provided with a first identifier and a second identifier corresponding to the indicating mark at the first position and the second position.

[0012] Optionally, the sliding groove is a straight groove and the sliding block is cylindrical.

[0013] Optionally, the guiding frame is provided with guiding grooves for guiding the first supporting edge and the second supporting edge at the corners of the central socket; and / or, the socket body is provided with a limiting edge for limiting the moving part at the second position.

[0014] Through the above technical solutions, according to the test specimens to be tested with different types of packages, they can be selectively supported on the supporting surface when in the second position or on the top surface of the test socket body. That is to say, by operating the height adjusting mechanism, after the test specimens to be tested with different types of packages are inserted into the central socket, the parameters of the relevant test equipment can be set with the top surface of the guiding frame as a reference, without replacing the test socket, improving the efficiency. Description of the Drawings

[0015] Figure 1 is an exploded view of an embodiment of the semiconductor test socket of the present application;

[0016] Figure 2 is Figure 1 a schematic diagram of the moving part of a height adjusting mechanism of the semiconductor test socket in the first position;

[0017] Figure 3 is Figure 2 a view making the guiding frame transparent;

[0018] Figure 4 is Figure 1 a schematic diagram of the moving part of a height adjusting mechanism of the semiconductor test socket in the second position;

[0019] Figure 5 is Figure 4 a view making the guiding frame transparent;

[0020] Figure 6 is Figure 1 A perspective view of the moving part in

[0021] Figure 7 is Figure 1 A perspective view of the operating part in

[0022] Description of reference numerals

[0023] 10 - Test socket body, 11 - Limit edge, 20 - Guide frame, 21 - Central socket, 22 - Through hole, 23 - First identifier, 24 - Second identifier, 30 - Height adjustment mechanism, 31 - Operating part, 311 - Driving block, 311a - Rotating groove, 311b - Indication mark, 312 - Slide block, 313 - Resistance member, 32 - Moving part, 321 - Support surface, 322 - First support edge, 323 - Second support edge, 324 - Moving block, 324a - Slide groove. Detailed implementation manners

[0024] The following will describe in detail the detailed implementation manners of the present invention with reference to the accompanying drawings. It should be understood that the detailed implementation manners described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0025] In the present invention, unless otherwise stated, the orientation terms such as "upper, lower, left, right" generally refer to the upper, lower, left, and right shown in the reference drawings; "inner, outer" refer to the inner and outer relative to the contour of each component itself. The following will describe the present application in detail with reference to the drawings and in conjunction with the embodiments.

[0026] The present application provides a semiconductor test socket, wherein the semiconductor test socket includes a test socket body 10, a guide frame 20, and a height adjustment mechanism 30. The guide frame 20 is installed above the test socket body 10 and has a central socket 21. The height adjustment mechanism 30 is embedded at the edge of the central socket 21. The height adjustment mechanism 30 includes an operable operating part 31 and a moving part 32 that can move between a first position located outside the central socket 21 and a second position located inside the central socket 21 by operating the operating part 31. The moving part 32 includes a support surface 321 for supporting the test piece when in the second position.

[0027] When using the semiconductor test socket of the present application, according to the test specimens with different types of packages, they can be selectively supported on the support surface when in the second position or on the top surface of the test socket body 10. That is to say, by operating the height adjustment mechanism 30, after the test specimens with different types of packages are inserted into the central socket 21, the parameters of the relevant test equipment can be set with the top surface of the guiding frame 20 as a reference, without replacing the test socket, improving the efficiency.

[0028] Among them, it can be understood that the support surface 321 is located between the top surface of the test socket body 10 and the top surface of the guiding frame 20. To facilitate using the top surface of the guiding frame 20 as a positioning reference, the height adjustment mechanism 30 can be arranged in a way that it is embedded in the guiding frame 20 to avoid protruding beyond the top surface of the guiding frame 20 and interfering with relevant operations. In this case, to facilitate operating the operating part 31, the guiding frame 20 is provided with a through hole 22 arranged in the height direction, and the operating part 31 is arranged to be able to be contacted via the through hole 22 and be operated from the outside.

[0029] In addition, to facilitate stably supporting the test specimen on the support surface 321 in the first position, support can be provided for the test specimen at multiple positions along the circumference of the central socket 21. Preferably, as Figure 1 shown, the central socket 21 is rectangular, and the height adjustment mechanisms 30 are respectively arranged at the four corner parts of the central socket 21. When in use, when it is necessary to support through the support surface 321, when the test specimen is placed into the central socket 21, stable support can be obtained through the support surfaces 321 of the four height adjustment mechanisms 30 at the four corner parts respectively. Of course, the four height adjustment mechanisms 30 can be respectively operated to switch between the first position and the second position.

[0030] Preferably, as Figure 2 、 Figure 6 shown, the moving part 32 includes a first support edge 322 and a second support edge 323 that are arranged at right angles to each other and a moving block 324 connecting the first support edge 322 and the second support edge 323. The moving block 324 is arranged to be able to move along the diagonal of the corner where the height adjustment mechanism 30 is located. Thus, the top surfaces of the first support edge 322 and the second support edge 323 form the support surface 321 to support the adjacent edges of the corner of the test specimen, thereby providing more stable support. In addition, the moving block 324 is located between the first support edge 322 and the second support edge 323. By moving the moving block 324 along the diagonal of the corner, on the one hand, it can conveniently make the first support edge 322 and the second support edge 323 move into place simultaneously, and on the other hand, it can simplify the structure as much as possible and reduce the space required for the setting and movement of the moving part 32, which is crucial for the semiconductor test field with a compact structure and tiny sizes of relevant components.

[0031] As described above, the present application relates to the field of semiconductor testing. The components involved have precise dimensions and are of a small structure. Preferably, the moving block 324 is linearly moved along the diagonal of the corner by rotating the operation part 31, so as to further reduce the required installation and moving space. Specifically, as Figure 7 shown, the operation part 31 includes a driving block 311 and a slider 312 connected to the driving block 311. The driving block 311 is rotatably arranged in the through hole 22, the slider 312 is arranged deviating from the rotation axis of the driving block 311, a sliding groove 324a is arranged on the moving block 324, and the slider 312 is rotatably and slidably matched with the sliding groove 324a. Thus, the operation part 31 and the moving part 32 form a structure similar to a cam mechanism, so as to realize the linear movement of the moving part 32 by rotating the driving block 311, and at the same time reduce the necessary space for arranging the operation part 31.

[0032] When testing a semiconductor package using the semiconductor test socket of the present application, usually, the same type of package is batch-tested before replacing with other types of packages. For this reason, it is necessary to keep the moving part 32 at the current position during the testing process, and only switch the position through an intentionally applied operation when the position needs to be changed. For this reason, a resistance member 313 for increasing the rotational resistance can be arranged between the through hole 22 and the driving block 311. Thus, the resistance member 313 can prevent the driving block 311 from rotating or the moving part 32 from loosening due to a slight force of misoperation applied. Specifically, the resistance member 313 can be in various appropriate forms as long as it has a certain resistance. For example, the resistance member 313 can be an O-ring.

[0033] To facilitate the operation of rotating the driving block 311, as Figure 7 shown, the driving block 311 can be provided with a rotation groove 311a that is convenient for rotating operation from the outside. Specifically, to facilitate rotating the driving block 311 with a tool, the rotation groove 311a can be set in a shape that matches the tool. For example, to rotate the driving block 311 with a screwdriver, the rotation groove 311a can be a slotted groove.

[0034] In addition, to simplify the structure, the switching of the moving part 32 between the first position and the second position is achieved by reciprocally rotating the driving block 311 within a certain angular range. For example, when switching from the first position to the second position, the driving block 311 is rotated in the clockwise direction; when switching from the second position to the first position, the driving block 311 is rotated back in the counterclockwise direction. To facilitate the display of the position of the driving block 311 relative to the guiding frame 20 to determine the rotation direction of the switching operation, the driving block 311 is provided with an indicating mark 311b for indicating the rotation position, and the top surface of the guiding frame 20 is provided with a first identifier 23 and a second identifier 24 corresponding to the indicating mark at the first position and the second position. Specifically, as Figure 7 shown, the indicating mark 311b can be a recess on the driving block 311, and can be visually prompted by setting a prominent color. As Figure 2 and Figure 4 shown, the first identifier 23 can be an LGA identifier, and the second identifier 24 can be a BGA identifier.

[0035] In addition, the sliding groove 324a and the slider 312 can be provided as required and are slidably engaged so as to be relatively rotatable, so as to facilitate the linear movement of the moving part 32 through the rotation of the driving block 311. For example, the sliding groove 324a is a straight groove, and the slider 312 is cylindrical. Specifically, the sliding groove 324a can extend perpendicular to the moving direction of the moving block 324 and extend from the diagonal of the corner to one side of the diagonal.

[0036] To ensure the accurate movement of the moving part 32, movement guidance can be provided for the moving part 32. Specifically, the guiding frame 20 is provided with guiding grooves at the corners of the central socket 21 for guiding the first support edge 322 and the second support edge 323. When the moving part 32 moves driven by the driving block 311, the first support edge 322 and the second support edge 323 can move along the guiding grooves respectively to ensure that the whole moving part 32 moves along the diagonal of the corner.

[0037] In addition, the socket body 10 can be provided with a limiting edge 11 for limiting the moving part 32 at the second position. Specifically, the socket body 10 can have a part extending into the central socket 21, and the limiting edge 11 is the edge of this part facing the center of the central socket 21. Among them, the limiting edge 11 can protrude upward compared with other positions of the part of the socket body 10 extending into the central socket 21 so as to stop the moving part 32 when the moving part 32 moves to the second position. Specifically, the limiting edge 11 can include parts parallel to the first support edge 322 and the second support edge 323. By providing the limiting edge 11, it is also possible to conveniently judge whether the moving part 32 has moved to the second position.

[0038] The use of the semiconductor test socket of the present application will be described below with reference to the accompanying drawings.

[0039] In the illustrated embodiment, the semiconductor test socket is used to test chips in BGA packages and chips in LGA packages.

[0040] When testing a chip in a BGA package, the moving part 32 needs to be located at the second position to support the chip through the supporting surface 321. If the moving part 32 is at the first position at this time, that is Figure 2 and Figure 3 the position shown, it can be seen that the indicating mark 311b points to the first identifier 23, prompting the operator to rotate the driving block 311 clockwise. At this time, a screwdriver can be engaged with the rotation groove 311a to rotate the driving block 311 clockwise until the indicating mark 311b points to the second identifier 24. At the same time, the driving block 311 drives the moving part 32 to move, and the first supporting edge 322 and the second supporting edge 323 move along the guiding groove into the center socket 21, that is, reaching Figure 4 and Figure 5 the position shown. The front edges of the first supporting edge 322 and the second supporting edge 323 are stopped by the limiting edge 11. At this time, a chip in a BGA package is placed into the center socket 21, and the chip can be supported by the first supporting edge 322 and the second supporting edge 323.

[0041] When it is necessary to change to testing a chip in an LGA package, the moving part 32 needs to be located at the first position to support the chip through the test socket body 10. The operator can know that the driving block 311 needs to be rotated counterclockwise to move the moving part 32 to the first position by the indicating mark 311b pointing to the second identifier 24 and the relative position relationship between the first identifier 23 and the second identifier 24. Specifically, a screwdriver can be engaged with the rotation groove 311a to rotate the driving block 311 counterclockwise until the indicating mark 311b points to the first identifier 23. At the same time, the driving block 311 drives the moving part 32 to move, and the first supporting edge 322 and the second supporting edge 323 move along the guiding groove outside the center socket 21, that is, reaching Figure 4 and Figure 5 the position shown. At this time, a chip in an LGA package is placed into the center socket 21, and the chip can be supported by the top surface of the test socket body 10.

[0042] The preferred embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited thereto. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention. This application includes any suitable combination of each specific technical feature. To avoid unnecessary repetition, the present invention will not separately describe various possible combination methods. But these simple modifications and combinations should also be regarded as the content disclosed by the present invention and all fall within the protection scope of the present invention.

Claims

1. A semiconductor test socket, characterized in that, The semiconductor test socket includes a test socket body (10), a guiding frame (20), and a height adjustment mechanism (30). The guiding frame (20) is installed above the test socket body (10) and has a central socket (21). The height adjustment mechanism (30) is embedded at the edge of the central socket (21). The height adjustment mechanism (30) includes an operable operation part (31) and a moving part (32) that can move between a first position located outside the central socket (21) and a second position located inside the central socket (21) by operating the operation part (31). The moving part (32) includes a support surface (321) for supporting the test piece when in the second position. The guiding frame (20) is provided with a through hole (22) arranged in the height direction. The operation part (31) is arranged to be able to be contacted via the through hole (22) for being operated from the outside. The central socket (21) is rectangular, and the height adjustment mechanism (30) is respectively arranged at four corner parts of the central socket (21). The moving part (32) includes a first support edge (322) and a second support edge (323) arranged at right angles to each other, and a moving block (324) connecting the first support edge (322) and the second support edge (323). The moving block (324) is arranged to be able to move along the diagonal of the corner where the height adjustment mechanism (30) is located. The operation part (31) includes a driving block (311) and a slider (312) connected to the driving block (311). The driving block (311) is rotatably arranged in the through hole (22). The slider (312) is arranged deviating from the rotation axis of the driving block (311). A chute (324a) is arranged on the moving block (324), and the slider (312) is rotatably slidably engaged with the chute (324a).

2. The semiconductor test socket according to claim 1, characterized in that, A resistance member (313) for increasing the rotation resistance is arranged between the through hole (22) and the driving block (311).

3. The semiconductor test socket according to claim 1, characterized in that, The driving block (311) is provided with a rotation groove (311a) for facilitating rotation operation from the outside.

4. The semiconductor test socket according to claim 1, characterized in that, The driving block (311) is provided with an indication mark (311b) for indicating the rotation position. The top surface of the guiding frame (20) is provided with a first identifier (23) and a second identifier (24) corresponding to the indication mark in the first position and the second position.

5. The semiconductor test socket according to claim 1, characterized in that, The chute (324a) is a straight groove, and the slider (312) is cylindrical.

6. The semiconductor test socket according to any one of claims 1-5, characterized in that: The guiding frame (20) is provided with guiding grooves for guiding the first support edge (322) and the second support edge (323) at the corner of the central socket (21); and / or, The test socket body (10) is provided with a limiting edge (11) for limiting the moving part (32) in the second position.

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