Treatment liquid supply device and treatment liquid supply method

Abstract

The present invention is a treatment liquid supply device and a treatment liquid supply method, and relates to the following scheme: in order to improve the selectivity in a substrate processing process by a treatment liquid, a treatment liquid supply unit mixes treatment liquid substances while adjusting the supply amount of silicon dioxide, and supplies the treatment liquid after adjusting the concentration and temperature of the treatment liquid based on a substrate processing condition to a substrate processing device, a treatment liquid recycling unit that is spatially separated from the treatment liquid supply unit recovers the treatment liquid and supplies a regenerated treatment liquid after adjusting the moisture concentration and temperature of the treatment liquid.

Description

Technical Field

[0001] This invention relates to a processing liquid supply apparatus and a processing liquid supply method, and more specifically to the following scheme: In order to improve the selectivity of the substrate processing process using the processing liquid, the processing liquid supply unit mixes the processing liquid substances while adjusting the supply amount of silicon dioxide, and adjusts the concentration and temperature of the processing liquid based on the substrate processing conditions before supplying it to the substrate processing apparatus. The processing liquid is then recovered by a processing liquid recycling unit that is spatially separated from the processing liquid supply unit, and the moisture concentration and temperature of the processing liquid are adjusted before supplying regenerated processing liquid. Background Technology

[0002] Generally, various types of processing solutions are used in the manufacturing processes of semiconductor components and display panels. These processing solutions are adjusted to suitable process conditions such as concentration, temperature, and flow rate by a processing solution supply device and then supplied to a substrate processing apparatus that processes the substrate. At this time, the processing solution supply device supplies a single processing solution or a mixture of different processing solutions to the substrate processing apparatus.

[0003] For example, in a cleaning or etching process, the following treatment is performed: a treatment solution such as an aqueous phosphoric acid solution is supplied as an etching solution to the surface of a substrate on which silicon nitride and silicon oxide films are formed, and the silicon nitride film is selectively removed.

[0004] The selectivity ratio related to the removal amount of silicon nitride film and silicon oxide film, as well as the removal amount of silicon nitride film per unit time, i.e., the etching rate, is highest when the temperature of the processing solution, such as the phosphoric acid aqueous solution, supplied to the substrate is near its boiling point. However, in monolithic substrate processing apparatuses, even if the temperature of the processing solution, such as the phosphoric acid aqueous solution, is adjusted to near its boiling point in the tank, the temperature of the processing solution drops when it is supplied to the substrate to perform the actual process. Therefore, it is difficult to supply the processing solution near its boiling point to the substrate processing process at a reasonable level.

[0005] In addition, when using an aqueous phosphoric acid solution for selective etching of silicon nitride and silicon oxide films, the silica contained in the aqueous phosphoric acid solution is a factor that plays a significant role in the etching selectivity.

[0006] For example, if the silica concentration in the phosphoric acid aqueous solution is too low, the etching rate of the silicon oxide film will increase, reducing the etching selectivity for the silicon nitride film. Conversely, even if the silica concentration is too high, various problems may arise, such as inadequate selective etching or filter clogging.

[0007] Therefore, when using a treatment solution such as phosphoric acid aqueous solution to perform an etching process, it is important to adjust the concentration of silica contained in the treatment solution within a reasonable range according to the purpose of the treatment.

[0008] (Patent Document 0001) Korean Patent Publication No. 10-2011-0080270

[0009] (Patent Document 0002) Korean Patent Publication No. 10-2015-0108329

[0010] (Patent Document 0003) Korean Patent Grant Announcement No. 10-0801656 Summary of the Invention

[0011] The purpose of this invention is to solve the problems of the prior art as described above, and to propose a solution that can improve the selectivity of substrate processing processes while maintaining constant substrate processing characteristics.

[0012] In particular, the aim is to propose a solution in which, in a process using a treatment solution containing a phosphoric acid aqueous solution, etc., when supplying and recovering a phosphoric acid aqueous solution containing silica for regeneration, the temperature and concentration of the treatment solution such as the phosphoric acid aqueous solution can be maintained at a reasonable level while keeping the silica content at a stable level.

[0013] The problems solved by the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand from the following description other problems not mentioned.

[0014] To accomplish the aforementioned technical task, one embodiment of the processing liquid supply device according to the present invention may include: a processing liquid supply unit, comprising a main supply section for supplying processing liquid to a substrate processing apparatus and an adjustment supply section for adjusting the processing liquid according to substrate processing conditions and supplying it to the main supply section; a processing liquid recycling unit, comprising a recycling section for recovering processing liquid from the substrate processing apparatus and a processing liquid regeneration section for receiving recovered processing liquid from the recycling section, adjusting the processing liquid according to regeneration conditions, and supplying it to the adjustment supply section; and a control unit for controlling the supply, adjustment, recovery, regeneration, or disposal of the processing liquid in the processing liquid supply unit and the processing liquid recycling unit.

[0015] As an example, the processing liquid supply unit may further include: a silica supply component, which measures the amount of silica supplied to supply silica according to the substrate processing conditions; the adjustment supply unit includes: an adjustment tank, which adjusts the processing liquid containing silica and supplies the adjusted processing liquid to the main supply unit; and an adjustment circulation pipeline, which circulates the processing liquid in the adjustment tank, measures the concentration of the processing liquid and adjusts the temperature; the control unit adjusts the phosphoric acid concentration by controlling the supply of phosphoric acid and DIW (De-Ionzied Water) or the heating temperature based on the measurement result of the phosphoric acid concentration of the processing liquid in the adjustment circulation pipeline.

[0016] Preferably, the processing solution supply unit may also include a mixing component that supplies an aqueous solution of phosphoric acid and DIW mixed according to the substrate processing conditions to the adjustment tank, and the control unit that supplies the aqueous solution of phosphoric acid through the mixing component to adjust the phosphoric acid concentration according to the determination result of the phosphoric acid concentration of the processing solution in the adjustment circulation pipeline.

[0017] More preferably, the adjustment supply unit may include: a first adjustment supply unit and a second adjustment supply unit, which supply the processing liquid to the main supply unit.

[0018] Alternatively, the control unit may control either the first adjustment supply unit or the second adjustment supply unit to adjust the processing liquid, while the other supplies processing liquid to the main supply unit or receives processing liquid from the processing liquid regeneration unit.

[0019] As an example, the control unit may be configured such that the first adjustment supply unit receives regenerated processing liquid from the processing liquid regeneration unit, and the second adjustment supply unit receives new processing liquid material.

[0020] As an example, the main supply unit may further include: a main supply tank for supplying processing liquid to the substrate processing apparatus; and a sampling pipeline for sampling and measuring the processing liquid supplied from the main supply tank. The control unit controls the supply of silica to the adjustment supply unit based on the measurement result of the silica concentration of the sampled processing liquid, thereby adjusting the silica concentration or discharging the processing liquid recovered to the recovery unit as waste to the outside.

[0021] Alternatively, as an example, the treatment liquid regeneration unit may include: a regeneration tank that supplies the treatment liquid received from the recovery unit with adjusted water concentration to the treatment liquid supply unit; and a regeneration circulation pipeline that circulates the treatment liquid in the regeneration tank to filter the treatment liquid, measures the concentration of the treatment liquid, and adjusts the temperature. The control unit controls the supply of DIW or the heating temperature based on the water concentration measurement result of the treatment liquid in the regeneration circulation pipeline, thereby adjusting the water concentration.

[0022] Alternatively, the recovery unit may include: a recovery tank for recovering processing liquid from the substrate processing apparatus; a plurality of branch pipes disposed between the discharge pipe of the recovery tank and the inlet pipe of the processing liquid regeneration unit; and a plurality of main filters disposed in each of the branch pipes to filter the processing liquid.

[0023] As an example, the recovery unit may include: a recovery tank for recovering processing liquid from the substrate processing apparatus; and a discharge valve for discharging the processing liquid from the recovery tank to the outside. The control unit discharges the recovered processing liquid to the outside for waste based on the measurement result of the silica concentration of the processing liquid supplied to the substrate processing apparatus or the number of times the processing liquid has been regenerated.

[0024] As an example, the processing liquid regeneration unit may include: a first processing liquid regeneration unit and a second processing liquid regeneration unit, which receive processing liquid from the recovery unit and provide adjusted processing liquid to the adjustment supply unit.

[0025] Preferably, the control unit can control either the first processing liquid regeneration unit or the second processing liquid regeneration unit to regenerate the processing liquid, while the other receives processing liquid from the recovery unit or supplies the regenerated processing liquid to the adjustment supply unit.

[0026] As an example, the processing liquid supply unit may be configured in the same space as the substrate processing device, while the processing liquid recirculation unit may be configured separately from the processing liquid supply unit in different spaces.

[0027] Alternatively, one embodiment of the processing liquid supply method according to the present invention may include: a processing liquid supply step in which the concentration and temperature of the processing liquid supplied to the adjustment supply unit are adjusted while the processing liquid is self-circulated through the adjustment circulation pipeline, and the adjusted processing liquid is supplied to the main supply unit based on the substrate processing conditions; a processing liquid recovery step in which the used processing liquid is recovered from the substrate processing apparatus to the recovery unit; and a processing liquid regeneration step in which the processing liquid supplied from the recovery unit to the processing liquid regeneration unit is filtered and adjusted based on the regeneration conditions while the processing liquid is self-circulated through the regeneration circulation pipeline, and the regenerated processing liquid is supplied to the adjustment supply unit.

[0028] As an example, the processing solution supply step may include: a silica concentration adjustment step, which measures the amount of silica supplied to supply silica according to the substrate processing conditions; a processing solution material supply step, which provides a processing solution material containing one or more of phosphoric acid and DIW to the adjustment tank of the adjustment supply unit; a phosphoric acid concentration measurement step, which measures the phosphoric acid concentration while the processing solution in the adjustment tank is circulated through the adjustment circulation pipeline; and a processing solution supply adjustment step, which adjusts the phosphoric acid concentration by supplying one or more of phosphoric acid and DIW to the adjustment tank based on the phosphoric acid concentration measurement result or by heating.

[0029] Preferably, the treatment liquid material supply step may involve supplying an aqueous solution of phosphoric acid and DIW mixed with phosphoric acid to the conditioning tank via a mixing component, and the treatment liquid conditioning step may involve supplying the aqueous solution of phosphoric acid and DIW mixed with phosphoric acid to the conditioning tank via the mixing component to adjust the phosphoric acid concentration.

[0030] More preferably, the process fluid material supply step may involve supplying regenerated process fluid to the first adjustment tank of the first adjustment supply unit and supplying new process fluid material to the second adjustment tank of the second adjustment supply unit.

[0031] As an example, the processing liquid supply step may further include: a sampling step, which samples the processing liquid supplied from the main supply unit to the substrate processing apparatus to determine the concentration of silica; and a silica concentration adjustment step, which adjusts the supply of silica from the adjustment supply unit based on the measurement result of the silica concentration of the sampled processing liquid.

[0032] Alternatively, as an example, the processing liquid supply step may include a sampling step, in which the processing liquid supplied from the main supply unit to the substrate processing apparatus is sampled to determine the concentration of silica, and the processing liquid recycling step may include a waste processing liquid recycling step, in which the processing liquid recycled from the substrate processing apparatus to the recycling unit is discharged to the outside for waste based on the measurement result of the silica concentration of the sampled processing liquid.

[0033] Furthermore, the processing liquid material supply step may include a counting step, which counts the number of times the regenerated processing liquid is supplied to the first adjustment tank of the first adjustment supply unit, and the processing liquid recycling step may include a waste processing liquid recycling step, which discharges the processing liquid recycled from the substrate processing device to the recycling unit to the outside for waste based on the number of regenerations.

[0034] As an example, the processing liquid recovery step may include: a waste processing liquid recovery step, recovering processing liquid from the substrate processing device to a recovery tank; a main filtration step, distributing the processing liquid discharged from the recovery tank to multiple branch pipes and filtering the processing liquid through the main filter of each branch pipe; and a recovered processing liquid supply step, supplying the processing liquid discharged from the multiple branch pipes to the processing liquid regeneration unit.

[0035] Alternatively, the treatment liquid regeneration step may include: a phosphoric acid moisture concentration determination step, in which the phosphoric acid moisture concentration is determined while the treatment liquid supplied to the regeneration tank is self-circulated through the regeneration circulation pipeline; and a treatment liquid regeneration step, in which, based on the phosphoric acid moisture concentration determination result, DIW is supplied to the regeneration tank or the phosphoric acid moisture concentration is adjusted by heating the treatment liquid.

[0036] As an example, the processing liquid supply step may involve adjusting the temperature and concentration of the processing liquid in either the first adjustment supply unit or the second adjustment supply unit, and in the other unit supplying the adjusted processing liquid to the main supply unit or receiving regenerated processing liquid from the processing liquid regeneration unit. The processing liquid regeneration step may involve adjusting the concentration and temperature of the processing liquid based on the processing liquid regeneration conditions in either the first processing liquid regeneration unit or the second processing liquid regeneration unit, and in the other unit receiving the processing liquid from the recovery unit or supplying the regenerated processing liquid to the adjustment supply unit.

[0037] A preferred embodiment of the processing liquid supply device according to the present invention may include: a processing liquid supply unit, comprising: an adjustment supply section, including a first adjustment supply section for receiving regenerated processing liquid and a second adjustment supply section for receiving new processing liquid, and enabling self-circulation of the processing liquid; selectively supplying processing liquid by measuring the supply amount of silica through a silica supply member; selectively supplying an aqueous solution of phosphoric acid and DIW mixed by a mixing member; and providing adjusted processing liquid to a main supply section by adjusting the circulation pipeline to heat the processing liquid and adjusting the processing liquid according to the substrate processing conditions; and a main supply section, supporting sampling of the supplied processing liquid while supplying processing liquid to the substrate processing apparatus, and adjusting the silica concentration of the adjustment supply section according to the silica concentration measurement result; and a processing liquid recirculation unit, comprising: a recovery section for recovering processing liquid from the substrate processing apparatus and by configuring... The system comprises multiple main filters in multiple branch pipes that filter the recovered treatment fluid and supply it to the treatment fluid regeneration unit; multiple treatment fluid regeneration units that simultaneously supply DIW or heated treatment fluid to regenerate the treatment fluid according to regeneration conditions while the recovered treatment fluid is self-circulated, and supply the regenerated treatment fluid to the first adjustment supply unit; and a control unit that controls the supply, adjustment, recovery, regeneration, or disposal of the treatment fluid in the treatment fluid supply unit and the treatment fluid recirculation unit, and controls one of the first adjustment supply unit and the second adjustment supply unit to adjust the treatment fluid, while the other supplies the treatment fluid to the main supply unit; and controls one of the multiple treatment fluid regeneration units to regenerate the treatment fluid, while the other receives the treatment fluid from the recovery unit or supplies the regenerated treatment fluid to the first adjustment supply unit, wherein the treatment fluid supply unit and the treatment fluid recirculation unit are spatially separated.

[0038] According to this invention, the selectivity of substrate processing processes can be improved while keeping substrate processing characteristics constant.

[0039] Furthermore, in processes utilizing treatment solutions containing phosphoric acid aqueous solutions, when supplying and recovering phosphoric acid aqueous solutions containing silica for regeneration, it is possible to maintain a stable temperature and concentration of the treatment solution, such as the phosphoric acid aqueous solution, while keeping the silica content at a reasonable level.

[0040] In particular, by configuring the main unit (MAIN FAB) and sub-unit (SUB FAB) separately in space, it is possible to achieve smooth supply and regeneration of processing liquid while minimizing the space constraints of the substrate processing facility.

[0041] According to one embodiment of the present invention, by means of multiple adjustment supply units, while selectively adjusting the concentration and temperature of the processing liquid according to the substrate processing conditions in any one adjustment supply unit, the processing liquid adjusted in another adjustment supply unit is supplied to the main supply unit or the regenerated processing liquid is received from the processing liquid regeneration unit, thereby enabling a continuous supply of processing liquid to the substrate processing apparatus.

[0042] Furthermore, according to one embodiment of the present invention, while selectively adjusting the concentration and temperature of the treatment liquid based on the treatment liquid regeneration conditions in any one of the multiple treatment liquid regeneration units, the treatment liquid is received from the recovery unit or the regenerated treatment liquid is supplied to the adjustment supply unit in another treatment liquid regeneration unit, thus enabling continuous regeneration of the treatment liquid.

[0043] Furthermore, continuous processing fluid regeneration can be performed together with continuous processing fluid supply by selectively combining multiple adjustment supply units and multiple processing fluid regeneration units.

[0044] In addition, according to one embodiment of the present invention, the silica concentration is adjusted or the waste is disposed of based on the silica concentration of the regeneration treatment liquid supplied to the substrate processing apparatus, thereby maintaining a stable selectivity based on the silica concentration. Attached Figure Description

[0045] Figure 1 This is a top view that schematically illustrates the substrate processing apparatus to which the present invention is applied.

[0046] Figure 2 A top view of a substrate processing apparatus in a substrate processing device to which the present invention is applied is shown.

[0047] Figure 3 A cross-sectional view of a substrate processing apparatus to which the present invention is applied is shown.

[0048] Figure 4 A structural diagram of an embodiment of the processing fluid supply device according to the present invention is shown.

[0049] Figure 5 A structural diagram of another embodiment of the processing fluid supply device according to the present invention is shown.

[0050] Figure 6 A structural diagram of an embodiment of a processing fluid supply unit in a processing fluid supply apparatus according to the present invention is shown.

[0051] Figure 7A structural diagram of another embodiment of the processing fluid supply unit in the processing fluid supply device according to the present invention is shown.

[0052] Figure 8 A structural diagram of another embodiment of the processing fluid supply unit in the processing fluid supply device according to the present invention is shown.

[0053] Figure 9 A structural diagram of another embodiment of the processing fluid supply unit in the processing fluid supply device according to the present invention is shown.

[0054] Figure 10 A structural diagram of an embodiment of a processing fluid recirculation unit in a processing fluid supply device according to the present invention is shown.

[0055] Figure 11 A flowchart illustrating an embodiment of the processing fluid supply method according to the present invention is shown.

[0056] Figure 12 as well as Figure 13 The process of supplying processing liquid substances is shown in an embodiment of the processing liquid supply unit of the processing liquid supply device according to the present invention.

[0057] Figure 14 as well as Figure 15 An embodiment of a process for supplying a processing fluid via a processing fluid supply device according to the present invention is shown.

[0058] Figure 16 as well as Figure 17 Another embodiment of the process of supplying treatment fluid via a treatment fluid supply device according to the present invention is shown.

[0059] Figure 18 The present invention illustrates a process for discarding treatment fluid via a treatment fluid supply device according to an embodiment of the present invention.

[0060] (Explanation of reference numerals in the attached diagram)

[0061] 400, 400′: Processing fluid supply unit,

[0062] 410, 410': Adjust the supply department.

[0063] 411: Adjust the treatment fluid supply pipe.

[0064] 420: Silicon dioxide supply component,

[0065] 430: First adjustment to the supply department,

[0066] 431: First adjustment of the circulation pipeline,

[0067] 440: First adjustment tank,

[0068] 450: Second adjustment to the supply department,

[0069] 451: Second adjustment of the circulation pipeline,

[0070] 460: Second adjustment tank,

[0071] 470, 470′: Main Supply Department

[0072] 473: Sampling pipeline,

[0073] 480: Main supply tank,

[0074] 500, 500′: Processing fluid recirculation unit,

[0075] 510, 510′: Recycling Department

[0076] 530: Recycling tanks,

[0077] 550, 550′: Processing fluid regeneration section,

[0078] 560: First processing fluid regeneration unit,

[0079] 561: First regeneration circulation pipeline,

[0080] 570: First regeneration tank,

[0081] 580: Second processing fluid regeneration unit,

[0082] 581: Second regeneration circulation pipeline,

[0083] 590: Second regeneration tank. Detailed Implementation

[0084] To illustrate the present invention and its advantages in operation, and to demonstrate the objectives achieved through its implementation, preferred embodiments of the present invention are illustrated below and described with reference thereto.

[0085] First, the terminology used in this application is only for describing specific embodiments and is not intended to limit the scope of the invention. Singular expressions may include plural expressions unless explicitly indicated in the context. Furthermore, in this application, terms such as "comprising" or "having" are intended to specify the presence of features, numbers, steps, operations, constituent elements, parts, or combinations thereof described in the specification, rather than pre-excluding the presence or additional possibilities of one or more other features or numbers, steps, operations, constituent elements, parts, or combinations thereof.

[0086] When describing this invention, detailed descriptions of related well-known structures or functions are omitted if they are deemed to obscure the main idea of ​​the invention.

[0087] This invention discloses a processing liquid supply device and a processing liquid supply method. In order to improve the selection ratio in the substrate processing process, the processing liquid supply unit mixes processing liquid substances while adjusting the supply amount of silicon dioxide, and adjusts the concentration and temperature of the processing liquid based on the substrate processing conditions before supplying it to the substrate processing device. The processing liquid is recovered by a processing liquid recycling unit that is spatially separated from the processing liquid supply unit, and the moisture concentration and temperature of the processing liquid are adjusted before supplying regenerated processing liquid.

[0088] Figure 1 This is a top view that schematically illustrates the substrate processing apparatus to which the present invention is applied.

[0089] The substrate processing apparatus described below is an exemplary apparatus to which the present invention can be applied. The present invention is not limited thereto, but is merely provided to aid in understanding the apparatus to which the present invention can be applied.

[0090] Reference Figure 1 The substrate processing apparatus 1 includes an indexing module 1000 and a process processing module 2000. The indexing module 1000 includes a loading port 1200 and a transfer rack 1400. The loading port 1200, the transfer rack 1400, and the process processing module 2000 are arranged in a row. Hereinafter, the direction in which the loading port 1200, the transfer rack 1400, and the process processing module 2000 are arranged will be referred to as the first direction 12. Furthermore, the direction perpendicular to the first direction 12 when viewed from above will be referred to as the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 will be referred to as the third direction 16.

[0091] A carrier 1300 housing the substrate W is mounted in the loading port 1200. Multiple loading ports 1200 are provided, which are arranged in a row along the second direction 14. Figure 1 The diagram shows four loading ports 1200. However, the number of loading ports 1200 can be increased or decreased depending on factors such as the process efficiency of the process module 2000 and space requirements. Slots (not shown) are formed in the carrier 1300 to support the edges of the substrate W. Multiple slots are provided in a third direction 16. The substrates W are stacked within the carrier 1300, spaced apart from each other along the third direction 16. The carrier 1300 can utilize a front-opening unified pod (FOUP).

[0092] The process module 2000 includes a buffer unit 2200, a transfer chamber 2400, and a process chamber 2600. The transfer chamber 2400 is configured such that its length direction is parallel to a first direction 12. In a second direction 14, process chambers 2600 are respectively arranged on one side and the other side of the transfer chamber 2400. The process chambers 2600 located on one side and the other side of the transfer chamber 2400 are provided to be symmetrical about the transfer chamber 2400. A portion of the process chambers 2600 is arranged along the length direction of the transfer chamber 2400. Furthermore, a portion of the process chambers 2600 is arranged to be stacked on top of each other. That is, on one side of the transfer chamber 2400, the process chambers 2600 are arranged in an AXB pattern (where A and B are natural numbers greater than 1). Here, A is the number of process chambers 2600 provided in a row along the first direction 12, and B is the number of process chambers 2600 provided in a row along the third direction 16. When four or six process chambers 2600 are provided on one side of the transfer chamber 2400, the process chambers 2600 can be arranged in a 2x2 or 3x2 configuration. The number of process chambers 2600 can also be increased or decreased. Unlike the above, process chambers 2600 can be provided only on one side of the transfer chamber 2400. Furthermore, unlike the above, process chambers 2600 can be provided in a single layer on one side and both sides of the transfer chamber 2400.

[0093] A buffer unit 2200 is disposed between the conveyor frame 1400 and the conveyor chamber 2400. The buffer unit 2200 provides space for the substrate W to rest before it is transported between the conveyor chamber 2400 and the conveyor frame 1400. The buffer unit 2200 provides slots (not shown) for placing the substrate W, and multiple slots (not shown) are provided spaced apart from each other along a third direction 16. In the buffer unit 2200, the surface facing the conveyor frame 1400 and the surface facing the conveyor chamber 2400 are respectively open.

[0094] The conveyor 1400 transports substrate W between the carrier 1300 mounted on the loading port 1200 and the buffer unit 2200. An index track 1420 and an indexing robot 1440 are provided in the conveyor 1400. The index track 1420 is provided such that its length direction is parallel to a second direction 14. The indexing robot 1440 is disposed on the index track 1420 and moves linearly along the index track 1420 in the second direction 14. The indexing robot 1440 has a base 1441, a body 1442, and an indexing arm 1443. The base 1441 is configured to move along the index track 1420. The body 1442 is attached to the base 1441. The body 1442 is provided to be movable along a third direction 16 on the base 1441. Additionally, the body 1442 is provided to be rotatable on the base 1441. The indexing arm 1443 is attached to the body 1442 and is provided to be able to move forward and backward relative to the body 1442. Multiple index arms 1443 are provided and each is independently driven. The index arms 1443 are configured to be stacked apart from each other along a third direction 16. Alternatively, a portion of the index arms 1443 may be used when transferring the substrate W from the process module 2000 to the carrier 1300, while another portion may be used when transferring the substrate W from the carrier 1300 to the process module 2000. This prevents particles generated from the substrate W before process handling from adhering to the substrate W after process handling during the insertion and removal of the indexing robot 1440.

[0095] The transfer chamber 2400 transports substrate W between the buffer unit 2200 and the process chamber 2600, as well as between the process chambers 2600.

[0096] A guide rail 2420 and a main manipulator 2440 are provided in a transfer chamber 2400. The guide rail 2420 is configured such that its length direction is parallel to a first direction 12. The main manipulator 2440 is mounted on the guide rail 2420 and moves linearly along the first direction 12 on the guide rail 2420. The main manipulator 2440 has a base 2441, a body 2442, and a main arm 2443. The base 2441 is configured to move along the guide rail 2420. The body 2442 is attached to the base 2441. The body 2442 is provided to be movable along a third direction 16 on the base 2441. In addition, the body 2442 is provided to be rotatable on the base 2441. The main arm 2443 is attached to the body 2442 and is provided to be able to move forward and backward relative to the body 2442. Multiple main arms 2443 are provided and each is independently driven.

[0097] The main arms 2443 are configured to be stacked apart from each other along the third direction 16. The main arms 2443 used when transporting the substrate W from the buffer unit 2200 to the process chamber 2600 and the main arms 2443 used when transporting the substrate W from the process chamber 2600 to the buffer unit 2200 may be different from each other.

[0098] A substrate processing apparatus 10 for performing a cleaning process on a substrate W is provided within a process chamber 2600. The substrate processing apparatus 10 provided in each process chamber 2600 may have different structures depending on the type of cleaning process being performed. Optionally, the substrate processing apparatus 10 in each process chamber 2600 may have the same structure. Optionally, the process chamber 2600 may be divided into multiple groups, with the substrate processing apparatus 10 provided in the process chambers 2600 belonging to the same group having the same structure, and the substrate processing apparatus 10 provided in the process chambers 2600 belonging to different groups having different structures. For example, when the process chambers 2600 are divided into two groups, a first group of process chambers 2600 may be provided on one side of the transfer chamber 2400, and a second group of process chambers 2600 may be provided on the other side of the transfer chamber 2400. Optionally, on one side and the other side of the transfer chamber 2400, a first set of process chambers 2600 may be provided in the lower layer, and a second set of process chambers 2600 may be provided in the upper layer. The first set of process chambers 2600 and the second set of process chambers 2600 may be divided according to the type of chemicals or cleaning methods used.

[0099] In the following embodiments, an example is given of a substrate processing apparatus for cleaning, peeling, and removing organic residues from a substrate W using a processing fluid such as an ozone-containing ozone treatment fluid, a rinsing fluid, and a drying gas in a process chamber 2600.

[0100] Figure 2 yes Figure 1 Top view of the substrate processing apparatus. Figure 3 yes Figure 1 A cross-sectional view of the substrate processing apparatus.

[0101] Reference Figure 2 and Figure 3 The substrate processing apparatus 10 includes a chamber 800, a processing container 100, a substrate support unit 200, a heating unit 290, a spraying unit 300, a processing liquid supply unit 400, a process exhaust section (not shown), a lifting unit 600, and a processing liquid recirculation unit (not shown).

[0102] The chamber 800 provides a sealed internal space. An airflow supply unit 810 is disposed above it. The airflow supply unit 810 creates a downward airflow inside the chamber 800.

[0103] The airflow supply unit 810 filters the high-humidity outside air and supplies it into the chamber. The high-humidity outside air passes through the airflow supply unit 810 and is supplied into the chamber, forming a downward airflow. The downward airflow provides a uniform airflow above the substrate W, so that the pollutants generated during the process of treating the surface of the substrate W with the processing fluid are discharged together with the air through the recovery bins 110, 120, and 130 of the processing container 100.

[0104] The chamber 800 is divided into a process area 816 and a maintenance area 818 by a horizontal partition 814. The processing container 100 and the substrate support unit 200 are located in the process area 816. In the maintenance area 818, in addition to the discharge lines 141, 143, 145 and the exhaust line (not shown) connected to the processing container 100, a drive unit for the lifting unit 600, a drive unit connected to the spraying unit 300, and supply lines are also provided. The maintenance area 818 is isolated from the process area 816.

[0105] The processing container 100 has an open-top cylindrical shape and provides a process space for processing the substrate W. The open top of the processing container 100 provides channels for loading and unloading the substrate W. A substrate support unit 200 is located within the process space. During processing, the substrate support unit 200 rotates the substrate W while supporting it.

[0106] The processing container 100 provides a lower space with an exhaust pipe 190 connected to its lower end to form forced exhaust. In the processing container 100, the first to third recovery tanks 110, 120, and 130, which are fed into and drawn into by the processing liquid and gas scattered from the rotating substrate W, are arranged in a multi-layer configuration.

[0107] The first to third annular recycling bins 110, 120, and 130 have exhaust ports H that communicate with a common annular space.

[0108] Specifically, the first to third recycling bins 110, 120, and 130 each include an annular bottom surface and a cylindrical side wall extending from the bottom surface. The second recycling bin 120 surrounds the first recycling bin 110 and is spaced apart from it. The third recycling bin 130 surrounds the second recycling bin 120 and is spaced apart from it.

[0109] The first to third recycling bins 110, 120, and 130 provide first to third recycling spaces RS1, RS2, and RS3 for the flow of air containing processing liquid and flue gas that have spilled from the substrate W. The first recycling space RS1 is defined by the first recycling bin 110, the second recycling space RS2 is defined by the space between the first recycling bin 110 and the second recycling bin 120, and the third recycling space RS3 is defined by the space between the second recycling bin 120 and the third recycling bin 130.

[0110] The top of each of the first to third recycling bins 110, 120, and 130 is open in the center. The first to third recycling bins 110, 120, and 130 form an inclined surface that gradually increases in distance from the corresponding bottom surface as it moves from the connected sidewall to the open portion. The processing liquid that splashes from the substrate W flows along the top of the first to third recycling bins 110, 120, and 130 into the recycling spaces RS1, RS2, and RS3.

[0111] The first processed liquid flowing into the first recovery space RS1 is discharged to an external processed liquid recirculation unit (not shown) through the first recovery line 141. The second processed liquid flowing into the second recovery space RS2 is discharged to an external processed liquid recirculation unit (not shown) through the second recovery line 143. The third processed liquid flowing into the third recovery space RS3 is discharged to an external processed liquid recirculation unit (not shown) through the third recovery line 145.

[0112] On the other hand, the processing container 100 is coupled with a lifting unit 600 that changes the vertical position of the processing container 100. The lifting unit 600 causes the processing container 100 to move linearly in the up-down direction. As the processing container 100 moves up and down, the relative height of the processing container 100 with respect to the substrate support unit 200 changes.

[0113] The lifting unit 600 includes a support 612, a moving shaft 614, and a driver 616. The support 612 is fixedly disposed on the outer wall of the processing container 100. The moving shaft 614, which moves up and down via the driver 616, is fixedly coupled to the support 612. When the substrate W is loaded onto or unloaded from the rotating head 210, the processing container 100 descends so that the rotating head 210 protrudes from above the processing container 100. Furthermore, during the process, the height of the processing container 100 is adjusted so that, depending on the type of processing liquid supplied to the substrate W, the processing liquid flows into pre-defined recovery tanks 110, 120, and 130. The relative vertical position between the processing container 100 and the substrate W is changed. The processing container 100 can accommodate different types of recovered processing liquid and contaminant gases according to the respective recovery spaces RS1, RS2, and RS3. According to one embodiment, the lifting unit 600 changes the relative vertical position between the processing container 100 and the substrate support unit 200 by vertically moving the processing container 100.

[0114] The substrate support unit 200 includes a rotating head 210, a rotating shaft 220, a drive unit 230, and a bottom nozzle assembly 240.

[0115] The rotating shaft 220, connected to the rotating head 210, rotates via the drive unit 230, thereby rotating the substrate W mounted on the rotating head 210. Furthermore, a bottom nozzle assembly 240, which passes through the rotating shaft 220, sprays a processing liquid onto the back surface of the substrate W. The rotating head 210 has a support member configured to support the substrate W in an upwardly spaced-apart state. The support member includes a plurality of chuck pins 211 that protrude at predetermined intervals along the upper edge of the rotating head 210, and a plurality of support pins 222 that protrude inside each chuck pin 211. The rotating shaft 220, connected to the rotating head 210, is a hollow shaft with an empty interior, transmitting the rotational force of the drive unit 230 (described later) to the rotating head 210.

[0116] Heating unit 290 is disposed inside substrate support unit 200. Heating unit 290 can heat substrate W during the cleaning process. Heating unit 290 can be disposed within rotating head 210. Heating units 290 are provided with different diameters. Multiple heating units 290 can be provided. Heating units 290 can be provided in a circular shape. As an example, heating unit 290 can be provided as multiple lamps, which are provided in a circular shape. Heating unit 290 can be subdivided into multiple concentric regions. Each region can be provided with a lamp capable of heating each region individually. The lamps can be provided in a circular shape arranged concentrically with respect to the center of rotating head 210 at different radial distances.

[0117] The injection unit 300 includes a nozzle support rod 310, a nozzle 320, a support shaft 330, and a driver 340.

[0118] The support shaft 330 is provided along a third direction 16 in its length direction, and the driver 340 is coupled at the lower end of the support shaft 330.

[0119] The driver 340 causes the support shaft 330 to rotate and move vertically. The nozzle support rod 310 is perpendicularly coupled to the opposite end of the support shaft 330 that engages with the driver 340. The nozzle 320 is disposed on the bottom surface of the end of the nozzle support rod 310. The nozzle 320 is moved to a process position and a standby position by the driver 340. The process position is the position where the nozzle 320 is positioned vertically above the processing container 100, and the standby position is the position where the nozzle 320 is disengaged from vertically above the processing container 100. The nozzle 320 supplies processing fluid to the substrate W.

[0120] The treatment fluid supply unit 400 supplies treatment fluid to the injection unit 300.

[0121] In such a substrate processing apparatus, the present invention can be applied to supply processing liquid and recycle and regenerate the used processing liquid. The present invention will be specifically described below through embodiments of the present invention.

[0122] This invention can be applied to wet etching or cleaning processes for removing films from substrate surfaces, in which various processing solutions are used. In the following embodiments, the processing solution used in the substrate processing process will be described as a high-temperature phosphoric acid aqueous solution containing silicon dioxide, but this is limited for ease of explanation. The processing solutions that can be used in this invention may include at least one substance selected from hydrogen fluoride (HF), sulfuric acid (H3SO4), hydrogen peroxide (H2O2), nitric acid (HNO3), phosphoric acid (H3PO4), ozone water, SC-1 solution (a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), and water (H2O) used in the substrate processing process), etc. In addition, processing solutions may include various substances that can be used in the substrate processing process.

[0123] Figure 4 A structural diagram of an embodiment of the processing fluid supply device according to the present invention is shown.

[0124] The processing fluid supply device according to the present invention can be divided into a main device (MAIN FAB) and a sub-device (SUBFAB). Here, the main device (MAIN FAB) may include a processing fluid supply unit 400' and the sub-device (SUB FAB) may include a processing fluid recirculation unit 500'.

[0125] In the space where the substrate processing apparatus 10 is configured, in order to supply the processing liquid with adjusted concentration and temperature to the substrate processing apparatus 10 while maintaining its state, the main unit (MAIN FAB) can be organically connected and configured in the same space as the substrate processing apparatus 10.

[0126] Furthermore, the sub-fab unit can be arranged adjacent to the main fab unit in the same space to supply the regeneration treatment fluid, but it is preferable that it can be arranged separately from the main fab unit in another space.

[0127] That is, it can be, in conjunction with the configuration through the above Figure 1 The substrate processing apparatus 10 described above has separate space configuration sub-units (SUB FABs) that recover and regenerate the used processing liquid, and supply the regenerated processing liquid to the processing liquid supply unit 400' of the main unit (MAIN FAB) through the regenerated processing liquid supply pipeline.

[0128] By using such a spatially separated main fab and sub fab configuration, it is possible to minimize the space constraints of the substrate processing facility while ensuring a smooth supply and regeneration of the processing fluid.

[0129] The processing fluid supply device according to the present invention may be configured as a processing fluid supply unit 400', a processing fluid recirculation unit 500', a control unit (not shown), etc.

[0130] The processing liquid supply unit 400' may include an adjustment supply unit 410' that adjusts and supplies processing liquid based on substrate processing conditions and a main supply unit 470' that supplies processing liquid to the substrate processing apparatus 10.

[0131] The processing liquid recycling unit 500' may include a recycling unit 510' that recovers processing liquid from the substrate processing apparatus 10 and a processing liquid regeneration unit 550' that receives the recovered processing liquid from the recycling unit 510', performs regeneration processing, and supplies regenerated processing liquid to the adjustment supply unit 410' of the processing liquid supply unit 400'.

[0132] Furthermore, the control unit (not shown) can control the treatment fluid supply unit 400' and the treatment fluid recirculation unit 500' for the supply, adjustment, recovery, regeneration, or disposal of the treatment fluid.

[0133] In the Figure 4 In one embodiment, an adjustment supply unit 410' is configured in the processing liquid supply unit 400' and a processing liquid regeneration unit 550' is configured in the processing liquid recirculation unit 500'. However, the number of adjustment supply units 410' in the processing liquid supply unit 400' and the number of processing liquid regeneration units 550' in the processing liquid recirculation unit 500' can be changed as needed.

[0134] Figure 5 A structural diagram of another embodiment of the processing fluid supply device according to the present invention is shown.

[0135] The Figure 5 The basic structural configuration of the embodiment and the Figure 4 The embodiments are similar, but the processing fluid supply unit 400 includes two adjustment supply sections 410 arranged in parallel, and the processing fluid recirculation unit 500 includes two processing fluid regeneration sections 550 arranged in parallel.

[0136] Multiple adjustment supply units 410 can be arranged in parallel such that any one adjustment supply unit 410 supplies a processing liquid with adjusted concentration and temperature based on the substrate processing conditions to the main supply unit 470, while another adjustment supply unit 410 performs concentration and temperature adjustment on the processing liquid based on the substrate processing conditions.

[0137] Alternatively, multiple processing fluid regeneration units 550 can be arranged in parallel, with any one processing fluid regeneration unit 550 receiving used processing fluid from the recovery unit 510' and regenerating it, while another processing fluid regeneration unit 550 supplies the regenerated processing fluid to any one of the multiple adjustment supply units 410.

[0138] With such a structure of multiple adjustment supply units 410 and multiple processing liquid regeneration units 550, continuous processing liquid adjustment and regeneration can be achieved, and the adjusted processing liquid can be continuously supplied to the substrate processing apparatus, thereby further improving the processing liquid supply efficiency.

[0139] The specific structures of the processing fluid supply unit 400 and the processing fluid recirculation unit 500 are described below through embodiments. Figure 5 The embodiment is based on the above. Figure 4 Based on the embodiments, therefore refer to Figures 6 to 10 To illustrate the above Figure 5 The detailed structure of the embodiments.

[0140] Figure 6 A structural diagram of an embodiment of a processing fluid supply unit in a processing fluid supply apparatus according to the present invention is shown.

[0141] The processing liquid supply unit 400 includes a main supply unit 470 that supplies processing liquid to the substrate processing apparatus 10 and an adjustment supply unit 410 that adjusts the processing liquid according to the substrate processing conditions and supplies the adjusted processing liquid to the main supply unit 470.

[0142] The adjustment supply unit 410 may include a first adjustment supply unit 430 and a second adjustment supply unit 450. Additionally, a silicon dioxide supply member 420 for supplying silicon dioxide may be provided in each of the first adjustment supply unit 430 and the second adjustment supply unit 450.

[0143] The silica supply component 420 includes a silica supply section 421 for supplying silica and a silica measuring tube 423 for measuring the amount of silica supplied from the silica supply section 421 according to substrate processing conditions and supplying a fixed amount of silica to the first adjusting supply section 430 and the second adjusting supply section 450 respectively. Additionally, a silica adjusting valve 422 is provided for restricting the supply of silica from the silica supply section 421 to the silica measuring tube 423, and a silica supply valve 424 is provided for selectively supplying the fixed amount of silica measured in the silica measuring tube 423 to the first adjusting supply section 430 and the second adjusting supply section 450 respectively.

[0144] Furthermore, the first adjustment supply unit 430 may include a first adjustment tank 440 for storing the processing liquid, various material supply components 441 and 442 for supplying processing liquid substances such as phosphoric acid or DIW to the first adjustment tank 440, and an inert gas supply component 443 for providing pressure to discharge the processing liquid stored in the first adjustment tank 440. Nitrogen (N2) may be used as the inert gas in this case.

[0145] Furthermore, the first adjustment supply unit 430 may be equipped with a first adjustment circulation line 431 for simultaneously circulating the processing liquid in the first adjustment tank 440 and adjusting the processing liquid according to the substrate processing conditions. The first adjustment circulation line 431 may be equipped with a first mixing line pump 432 for circulating the processing liquid in the first adjustment tank 440, a first mixing line heater 433 for heating the circulating processing liquid, and a measuring component for measuring the concentration or temperature of the processing liquid. Here, the measuring component may include a first phosphoric acid concentration meter 434 for measuring the phosphoric acid concentration of the phosphoric acid aqueous solution and a thermometer (not shown) for measuring the temperature of the phosphoric acid aqueous solution. The first mixing line pump 432 is preferably a pump with strong chemical resistance. For example, a diaphragm pump can be used for small-volume processing liquid transfers, while a bellows pump and a magnetic pump can be used for large-volume processing liquid transfers. Alternatively, a metering pump for precisely circulating a certain amount of mixed liquid may also be used.

[0146] In addition, although not mentioned Figure 6 As shown, but a control valve can be provided for self-circulating the processing fluid through the first adjusting circulation line 431 or discharging the adjusted processing fluid into the adjusting processing fluid supply line 411. Here, the control valve can be a three-way valve or a four-way valve, etc. For example, when self-circulating the processing fluid, the control valve can be closed to allow the processing fluid to circulate into the first adjusting circulation line 431; when supplying adjusting processing fluid, the control valve can be opened to discharge the adjusted processing fluid into the adjusting processing fluid supply line 411.

[0147] Secondly, the second adjustment supply unit 450 may include a structure similar to the first adjustment supply unit 430. The second adjustment supply unit 450 may be provided with a second adjustment tank 460, various material supply components 461 and 462 for supplying treatment liquids such as phosphoric acid or DIW, and an inert gas supply component 463 for providing pressure to discharge the treatment liquid stored in the second adjustment tank 460.

[0148] Furthermore, a second adjustment circulation line 451 for self-circulating the processing liquid of the second adjustment tank 460 can be provided in the second adjustment supply unit 450. A second mixing line pump 452, a first mixing line heater 453, a second phosphoric acid concentration meter 454 as a measuring component, a thermometer, etc. can be configured in the second adjustment circulation line 451.

[0149] Alternatively, a control valve may be provided in the second adjustment supply unit 450 for circulating the treatment fluid through the second adjustment circulation line 451 or discharging the adjusted treatment fluid into the adjustment treatment fluid supply line 411.

[0150] The first adjustment supply unit 430 and the second adjustment supply unit 450 are arranged side by side and can work independently at the same time or at different times. The first adjustment supply unit 430 and the second adjustment supply unit 450 can selectively supply the adjusted processing liquid to the adjustment processing liquid supply pipe 411 after adjusting the processing liquid according to the substrate processing conditions.

[0151] In adjusting the treatment fluid supply pipe 411, a flow meter (not shown) can be installed to measure the supply amount and flow rate of the adjusted treatment fluid.

[0152] The treatment fluid adjusted in the adjustment supply unit 410 is selectively discharged from either the first adjustment supply unit 430 or the second adjustment supply unit 450 into the adjustment treatment fluid supply pipe 411 and supplied to the main supply unit 470.

[0153] The operation of the adjustment supply unit 410 is controlled by a control unit. The control unit controls the silica supply component 420 to selectively supply a fixed amount of silica to the first adjustment supply unit 430 and the second adjustment supply unit 450 according to the amount of silica supplied based on the substrate processing conditions. In addition, it controls the supply pipes 441, 442, 461, and 462 to selectively supply the corresponding substances, and selectively regulates the phosphoric acid concentration and temperature by circulating the processing liquid through the first adjustment circulation line 431 and the second adjustment circulation line 451.

[0154] Preferably, the control unit performs the following control: either the first adjustment supply unit 430 or the second adjustment supply unit 450 adjusts the processing liquid, while the other supplies processing liquid to the main supply unit 470 or receives processing liquid from the processing liquid regeneration unit 550.

[0155] Secondly, regarding the main supply unit 470, the main supply unit 470 may be provided with a main supply tank 480 for storing and adjusting the processing liquid, a material supply member 481 for supplying processing liquid substances such as DIW to the main supply tank 480, and an inert gas supply member 483 for providing pressure to discharge the processing liquid stored in the main supply tank 480.

[0156] Additionally, the main supply unit 470 is equipped with a processing liquid supply pipe 471 for supplying adjusted processing liquid from the main supply tank 480 to the substrate processing apparatus 10, and a processing liquid supply pipe pump 491 for supplying processing liquid from the main supply tank 480 to the processing liquid supply pipe 471. A processing liquid supply pipe filter 493 for final filtration of the processing liquid supplied to the substrate processing apparatus 10 may also be provided in the processing liquid supply pipe 471.

[0157] In addition, a flow meter (not shown) may be installed in the processing liquid supply pipe 471 to measure the amount of processing liquid supplied to the substrate processing apparatus 10 and to measure the flow rate.

[0158] Furthermore, the main supply unit 470 may include a sampling line 473 for sampling the processing liquid supplied from the main supply tank 480 and a measuring component for measuring the processing liquid in the sampling line 473. Here, the measuring component may include a silica concentration meter 475 for measuring the silica concentration contained in the processing liquid.

[0159] Furthermore, a supply treatment liquid recovery line 490 can be set up to recover treatment liquid that has not been properly adjusted based on the measurement results of the sample treatment liquid.

[0160] The supply treatment liquid recovery line 490 can be connected to recover the treatment liquid to the main supply tank 480 based on the measured silica concentration. Alternatively, a discharge valve can be configured on the supply treatment liquid recovery line 490 to discharge the treatment liquid exceeding the set silica concentration to the outside for waste disposal.

[0161] The operation of the main supply unit 470 is controlled by a control unit. This control unit controls the supply of processing liquid from the main supply tank 480 to the substrate processing apparatus 10 via the processing liquid supply pipe 471. Simultaneously, it samples the processing liquid supplied via the sampling pipe 473 to check whether the processing liquid has been properly adjusted. For example, it can measure the silica concentration or the temperature of the processing liquid, and based on the results, control the supply of silica to the adjustment supply unit 410 or the heating temperature. Furthermore, if the sampled processing liquid does not meet certain levels of the substrate processing conditions, the control unit can also recover the processing liquid supplied to the substrate processing apparatus 10 via the processing liquid recovery pipe 490 or discharge it externally as waste.

[0162] In the processing fluid supply device according to the present invention, the processing fluid supply unit can be modified in various ways, and embodiments of modified processing fluid supply units will be described.

[0163] In describing an embodiment of the deformation-processing fluid supply unit, regarding the previously described... Figure 6The embodiment of the processing fluid supply unit has the same structure, and its description is omitted.

[0164] First, the structure of the supplied processing fluid can be changed, in the... Figure 6 In one embodiment, there are various material supply components 441, 442, 461, 462 for directly supplying processing liquid substances such as phosphoric acid or DIW to the first adjustment tank 440 or the second adjustment tank 460. In contrast, a mixing component may be provided to supply a phosphoric acid aqueous solution that mixes phosphoric acid and DIW according to the substrate processing conditions to the adjustment tanks 440 and 460.

[0165] That is, the mixing component receives treatment liquid substances such as phosphoric acid or DIW to generate a phosphoric acid aqueous solution that is mixed with it and supplies it to the conditioning tanks 440 and 460, thereby generating new treatment liquid or forming a conditioning of the treatment liquid.

[0166] Regarding this, Figure 7 as well as Figure 8 A structural diagram of another embodiment of the processing fluid supply unit in the processing fluid supply device according to the present invention is shown.

[0167] In the Figure 7 In this case, the supply unit 400a is adjusted to include a mixing component, namely a mixing stirrer 412, and the mixing stirrer 412 is installed on the treatment liquid supply pipeline of each material supply component 413, 414 that supplies treatment liquid materials such as phosphoric acid or DIW.

[0168] The mixing agitator 412 receives processing liquid substances such as phosphoric acid and DIW from the various material supply components 413 and 414 and mixes the phosphoric acid and DIW to generate a phosphoric acid aqueous solution. Furthermore, the mixing agitator 412 selectively supplies the phosphoric acid aqueous solution to the first adjustment tank 440a of the first adjustment supply section 430a and the second adjustment tank 460a of the second adjustment supply section 450a according to the substrate processing conditions.

[0169] That is, the phosphoric acid aqueous solution is supplied from the mixing stirrer 412 to the first conditioning tank 440a and the second conditioning tank 460a, instead of receiving individual substances from the first conditioning tank 440a and the second conditioning tank 460a to mix into a phosphoric acid aqueous solution.

[0170] Secondly, in the Figure 8 In this case, the supply unit 400b is adjusted to include a mixing tank 415 as a mixing component, and various material supply components 416 and 417 for supplying treatment liquid substances such as phosphoric acid or DIW are arranged in the mixing tank 415. In addition, an inert gas supply component 418 for providing pressure for discharging and supplying the mixed phosphoric acid aqueous solution can be provided in the mixing tank 415.

[0171] The mixing tank 415 receives processing liquid substances such as phosphoric acid and DIW from the various material supply components 416 and 417 and mixes the phosphoric acid and DIW to generate a phosphoric acid aqueous solution. Moreover, the mixing tank 415 selectively supplies the phosphoric acid aqueous solution to the first adjustment tank 440b of the first adjustment supply unit 430b and the second adjustment tank 460b of the second adjustment supply unit 450b according to the substrate processing conditions.

[0172] That is, the phosphoric acid aqueous solution is supplied from the mixing tank 415 to the first conditioning tank 440b and the second conditioning tank 460b, instead of receiving individual substances from the first conditioning tank 440b and the second conditioning tank 460b to mix the phosphoric acid aqueous solution.

[0173] Thus, the first and second adjustment supply units receive the phosphoric acid aqueous solution according to the substrate processing conditions, making the adjustment of the processing solution easier and shortening the adjustment time, thereby enabling the efficient execution of continuous processing solution supply.

[0174] Furthermore, the processing fluid supply unit can also be configured as multiple adjustment supply sections, each performing different functions. Regarding this... Figure 9 A structural diagram of another embodiment of the processing fluid supply unit in the processing fluid supply device according to the present invention is shown.

[0175] In the Figure 9 In one embodiment, the first adjustment supply unit 430c receives regenerated processing liquid from the processing liquid regeneration unit 550, and the second adjustment supply unit 450c receives new processing liquid.

[0176] The first adjustment supply unit 430c receives regenerated treatment fluid from the treatment fluid regeneration unit 550 and stores it in the first adjustment tank 440c. At the same time, it adjusts the concentration and temperature of the treatment fluid by self-circulating the treatment fluid through the first adjustment circulation pipeline 431, and supplies the adjusted treatment fluid to the main supply unit 470.

[0177] In contrast, the second adjustment supply unit 450c receives new processing liquid material and stores it in the second adjustment tank 460c. At the same time, it adjusts the concentration and temperature of the processing liquid by self-circulating the processing liquid through the second adjustment circulation line 451, and supplies the adjusted processing liquid to the main supply unit 470.

[0178] Furthermore, the first adjustment supply unit 430c can also adjust the regeneration treatment liquid and supply it to the second adjustment supply unit 450c.

[0179] Through the various processing liquid supply units of the present invention, the concentration of silica, the concentration of phosphoric acid, the temperature of the processing liquid, etc., can be adjusted to suit the substrate processing conditions, so as to supply the processing liquid to the substrate processing apparatus in an optimal state.

[0180] Secondly, regarding the treatment fluid recirculation unit 500, refer to... Figure 10 The invention is described by way of a structural diagram showing an embodiment of a process fluid recirculation unit in a process fluid supply device according to the invention.

[0181] The processing liquid recycling unit 500 can also be spatially separated from the processing liquid supply unit 400 described above and configured as a different device. That is, in order to eliminate the space constraints of the substrate processing facility, the processing liquid recycling unit 500 can be configured as a separate device from the processing liquid supply unit 400, and the processing liquid recycling unit 500 can be arranged in different spatial locations.

[0182] The processing liquid recycling unit 500 may include a recycling unit 510 for recovering used waste processing liquid from the substrate processing apparatus 10 and a processing liquid regeneration unit 550 for regenerating the waste processing liquid recovered by the recycling unit 510 and supplying it to the adjustment supply unit 410 of the processing liquid supply unit 400.

[0183] The recycling unit 510 may include a waste treatment liquid supply pipe 520 that supplies waste treatment liquid from the substrate processing apparatus and a recycling tank 530 connected to the waste treatment liquid supply pipe 520 and temporarily storing the waste treatment liquid.

[0184] Additionally, the recovery unit 510 may include a recovery liquid supply pipe 540 for supplying waste treatment liquid stored in the recovery tank 530 to the treatment liquid regeneration unit 550, and a recovery pipe pump 531 for discharging waste treatment liquid stored in the recovery tank 530 to the recovery liquid supply pipe 540.

[0185] The recovery unit 510 may also be equipped with a discharge valve 537 and a waste treatment liquid discharge pipe 539 for discharging the waste treatment liquid recovered in the recovery tank 530 to the outside. A silica concentration meter (not shown) may also be provided for measuring the silica concentration of the recovered treatment liquid. Preferably, the discharge valve 537 may be a three-way valve, selectively transferring the treatment liquid discharged from the recovery tank 530 to the recovery treatment liquid supply pipe 540 or discharging it to the waste treatment liquid discharge pipe 539.

[0186] Furthermore, a main filter 535 can be provided in the recovery unit 510 to filter out foreign matter and the like when waste treatment liquid is supplied to the treatment liquid regeneration unit 550 through the recovery treatment liquid supply pipe 540.

[0187] Furthermore, when high-temperature wastewater is filtered through the main filter 535, the permissible pressure range for proper filtration decreases as the physical properties of the resin filter deteriorate for the high-temperature wastewater. Therefore, it is possible that filtration may not be properly performed for a certain level or higher supply of wastewater.

[0188] To eliminate this problem, in this invention, multiple branch pipes can be provided at the middle of the recovery liquid supply pipe 540, and each of the multiple branch pipes can be equipped with a main filter. That is, the recovery liquid supply pipe 540 between the discharge pipe of the recovery tank 530 and the inlet pipe of the treatment liquid regeneration unit 550 is configured as multiple branch pipes, and each branch pipe is equipped with a separate main filter, thereby improving the filtration effect by distributing and filtering the supply of treatment liquid by each main filter.

[0189] The operation of the recovery unit 510 is controlled by a control unit, which can control the following: temporarily store the waste treatment liquid in the recovery tank 530 of the recovery unit 510, and simultaneously supply the waste treatment liquid from the recovery tank 530 to the treatment liquid regeneration unit 550 or discharge it to the outside. Preferably, the control can be adjusted to supply waste treatment liquid to either the first treatment liquid regeneration unit 560 or the second treatment liquid regeneration unit 580 of the treatment liquid regeneration unit 550, based on their operating status.

[0190] Next, the processing fluid regeneration unit 550 is described.

[0191] Alternatively, the waste treatment liquid recovered in the recovery unit 510 can be filtered and supplied to the treatment liquid regeneration unit 550, where it can be regenerated into a usable treatment liquid at a reasonable level.

[0192] The processing fluid regeneration unit 550 may include a first processing fluid regeneration unit 560 and a second processing fluid regeneration unit 580. The first processing fluid regeneration unit 560 includes a first regeneration tank 570 for storing processing fluid supplied from the recovery unit 510. The processing fluid supplied from the recovered processing fluid supply pipe 540 may be controlled to be supplied to the first regeneration tank 570 by a first recovered processing fluid supply valve 543.

[0193] The first processing liquid regeneration unit 560 may be provided with a processing liquid material supply pipe 571 for supplying DIW to the first regeneration tank 570, and an inert gas supply member 573 for providing pressure to discharge the processing liquid stored in the first regeneration tank 570. Here, nitrogen (N2) may be used as the inert gas.

[0194] Furthermore, the first processing liquid regeneration unit 560 may be equipped with a first regeneration circulation line 561 for regenerating the processing liquid while simultaneously circulating it in the first regeneration tank 570. The first regeneration circulation line 561 may be equipped with a first regeneration line pump 562 for circulating the processing liquid in the first regeneration tank 570, a first regeneration line heater 563 for heating the circulating processing liquid, and measuring components for measuring the concentration or temperature of the processing liquid. Here, the measuring components may include a first phosphoric acid concentration meter 564 for measuring the phosphoric acid moisture concentration of the processing liquid and a thermometer (not shown) for measuring the temperature of the processing liquid.

[0195] Additionally, a first regenerated liquid supply valve 566 may be provided for self-circulating the treatment liquid through the first regeneration circulation line 561 or discharging the regenerated treatment liquid to the regenerated treatment liquid supply line 551. Here, the first regenerated liquid supply valve 566 may be a three-way valve or a four-way valve, etc., to selectively circulate the treatment liquid to the first regeneration circulation line 561 or discharge the regenerated treatment liquid to the regenerated treatment liquid supply line 551.

[0196] Furthermore, a first auxiliary filter 565 is provided in the first regeneration circulation line 561 for filtering the treatment liquid while it is circulating.

[0197] The second processing liquid regeneration unit 580 may include a structure similar to the first processing liquid regeneration unit 560. The second processing liquid regeneration unit 580 may include a second regeneration tank 590, a material supply member 591 for supplying processing liquids such as DIW, and an inert gas supply member 593 for providing pressure to discharge the processing liquid stored in the second regeneration tank 590.

[0198] Furthermore, a second regeneration circulation line 581 for self-circulating the treatment liquid in the second regeneration tank 590 can be provided in the second treatment liquid regeneration unit 580. A second regeneration line pump 582, a second regeneration line heater 583, a second phosphoric acid concentration meter 584 as a measuring component, a thermometer, etc. can be configured in the second regeneration circulation line 581.

[0199] The first processing liquid regeneration unit 560 and the second processing liquid regeneration unit 580 are arranged side by side and can work independently at the same time or at different times. The first processing liquid regeneration unit 560 and the second processing liquid regeneration unit 580 can regenerate the processing liquid according to the regeneration conditions and then selectively discharge the regenerated processing liquid into the regeneration processing liquid supply pipe 551.

[0200] In the regeneration fluid supply pipe 561, a flow meter (not shown) can be installed to measure the supply amount and flow rate of the regenerated fluid.

[0201] The regenerated processing fluid in the processing fluid regeneration unit 550 can be supplied to the adjustment supply unit 410 through the regenerated processing fluid supply pipe 551. When the adjustment supply unit 410 includes a first adjustment supply unit and a second adjustment supply unit, the processing fluid regeneration unit 550 can selectively supply the regenerated processing fluid to the first adjustment supply unit and the second adjustment supply unit according to the situation, preferably, it can supply only to the first adjustment supply unit.

[0202] Furthermore, a recovery line 555 can be provided to recover the treatment fluid supplied from the treatment fluid regeneration unit 550 to the adjustment supply unit 410 via the regenerated treatment fluid supply pipe 551. Specifically, a regenerated treatment fluid supply valve 553 for controlling the supply of regenerated treatment fluid to the adjustment supply unit 410 can be provided in the regenerated treatment fluid supply pipe 551, and a regenerated treatment fluid recovery valve 557 for recovering regenerated treatment fluid from the recovery line 555 can also be provided. Here, the regenerated treatment fluid supply valve 553 and the regenerated treatment fluid recovery valve 557 can also be replaced by a single three-way valve.

[0203] The operation of the treatment liquid regeneration unit 550 is controlled by a control unit. The control unit controls the selective supply of waste treatment liquid from the recovery unit 510 to one or more of the first treatment liquid regeneration unit 560 or the second treatment liquid regeneration unit 580. At the same time, it controls the selective supply of corresponding substances such as DIW to each substance supply pipe 571, 591, and controls the self-circulation of the treatment liquid through the first regeneration circulation pipeline 561 and the second regeneration circulation pipeline 581, while adjusting the phosphoric acid moisture concentration and temperature to regenerate the treatment liquid.

[0204] Preferably, the control unit can control either the first processing liquid regeneration unit 560 or the second processing liquid regeneration unit 580 to regenerate the processing liquid, while the other regenerates the processing liquid to the adjustment supply unit 410 or receives waste processing liquid from the recovery unit 510.

[0205] Furthermore, the present invention proposes a method for supplying processing fluid using the processing fluid supply apparatus according to the present invention described above.

[0206] The processing fluid supply method according to the present invention generally includes: a processing fluid supply step in which the concentration and temperature of the processing fluid supplied in the adjustment supply unit are adjusted and the processing fluid adjusted based on the substrate processing conditions is supplied to the main supply unit; a processing fluid recovery step in which the processing fluid recovered from the substrate processing apparatus to the recovery unit is filtered and supplied to the processing fluid regeneration unit; and a processing fluid regeneration step in which the processing fluid supplied in the processing fluid regeneration unit is filtered and adjusted based on the regeneration conditions while the processing fluid is circulated through the regeneration circulation pipeline, and the regenerated processing fluid is supplied to the adjustment supply unit.

[0207] The method of supplying processing fluid according to the present invention will be described with reference to the processing fluid supply apparatus described above.

[0208] When a new processing solution is supplied, based on the substrate processing conditions, the silica supply member measures the amount of silica supplied and adjusts the silica concentration by quantitatively supplying silica (S110). Based on the substrate processing conditions, a quantitative amount of silica and processing solution substances such as phosphoric acid and DIW are supplied to the adjustment tank of the adjustment supply section (S130). At this time, the phosphoric acid aqueous solution can also be supplied to the adjustment tank of the adjustment supply section by the mixing member described above.

[0209] Furthermore, the processing liquid stored in the adjustment tank of the adjustment supply unit is self-circulated (S150), and the phosphoric acid concentration and processing liquid temperature are measured at the same time. Based on the substrate processing conditions, either phosphoric acid or DIW is supplied to the adjustment tank or the processing liquid is heated to adjust the phosphoric acid concentration and temperature of the processing liquid (S170).

[0210] If the processing solution is adjusted to suit the substrate processing conditions, the adjustment supply unit supplies the adjusted processing solution to the main supply unit, which then supplies the adjusted processing solution to the substrate processing apparatus (S190). At this time, the main supply unit may sample the processing solution supplied to the substrate processing apparatus, measure the silica concentration, and check whether a reasonable level of processing solution has been supplied. If the processing solution does not meet the reasonable level, silica, phosphoric acid, or DIW may be supplied to the adjustment supply unit, or the processing solution may be further heated. Processing solution that has not reached a certain level may also be interrupted from supplying the substrate processing apparatus and recycled. Furthermore, processing solution with a silica concentration close to a certain level may be used in the substrate processing apparatus and then disposed of in the recycling unit.

[0211] Furthermore, the substrate processing apparatus performs the substrate processing process using the supplied processing liquid (S200).

[0212] The recycling unit recycles the waste treatment liquid discharged after the process of the substrate processing apparatus (S310), and supplies it to the treatment liquid regeneration unit after filtration (S330).

[0213] The treatment liquid regeneration unit stores the recovered treatment liquid in the regeneration tank and circulates it (S410). At the same time, it measures the phosphoric acid water concentration and temperature of the treatment liquid, and supplies DIW or heats the treatment liquid to adjust the concentration and temperature of the treatment liquid based on the regeneration conditions of the treatment liquid (S430), while performing the regeneration of the treatment liquid.

[0214] Furthermore, the processing fluid regeneration unit supplies the regenerated processing fluid to the conditioning supply unit (S450) to achieve the reuse of the processing fluid. When multiple conditioning supply units are provided, the processing fluid regeneration unit may also supply regenerated processing fluid only to a pre-set conditioning supply unit.

[0215] If a regenerated processing solution is supplied from the processing solution regeneration unit, the adjustment supply unit supplies silicon dioxide to the regenerated processing solution quantitatively through the processing solution supply process (S100) described above. If necessary, phosphoric acid or DIW is supplied while heat treatment is performed to adjust the processing solution to meet the substrate processing conditions.

[0216] The adjusted processing liquid is supplied to the substrate processing apparatus through the main supply unit to perform the substrate processing process (S200). The processing liquid used in the substrate processing process is reused through a recycling process (S300) and a processing liquid regeneration process (S400), or it is disposed of as waste based on the silica concentration or the number of regeneration cycles.

[0217] Such a process fluid supply method according to the invention is described by means of the specific operation of the process fluid supply device according to the invention.

[0218] First, refer to Figure 12 as well as Figure 13 The following embodiments illustrate the process of supplying processing liquid material from the processing liquid supply unit of the processing liquid supply device according to the present invention.

[0219] In the Figure 12 In one embodiment, the processing fluid supply unit directly supplies phosphoric acid and DIW processing fluid substances to the conditioning tank.

[0220] In this invention, in order to reasonably adjust the concentration of silicon dioxide contained in the processing liquid, a silicon dioxide supply member 420 is provided, which can supply a quantitative amount of silicon dioxide based on the substrate processing conditions.

[0221] The control unit can measure a quantitative amount of silicon dioxide according to the substrate processing conditions via the silicon dioxide measuring tube 423 of the silicon dioxide supply component 420 and supply it to the first adjustment tank 440 of the first adjustment supply unit 430 or the second adjustment tank 460 of the second adjustment supply unit 450. Here, the quantitative amount of silicon dioxide supplied can be set by taking into account the etching selectivity when selective etching of silicon nitride film and silicon oxide film is performed using phosphoric acid aqueous solution as processing liquid.

[0222] Furthermore, the control unit can control the various material supply components 441, 442, 461, and 462 to supply phosphoric acid and DIW, etc., to the first adjustment tank 440 of the first adjustment supply unit 430 and the second adjustment tank 460 of the second adjustment supply unit 450, respectively, selectively generating a treatment solution containing silica-containing phosphoric acid aqueous solution or adjusting the phosphoric acid concentration of the treatment solution in the first adjustment tank 440 and the second adjustment tank 460. Preferably, phosphoric acid and water can be mixed in a ratio range of 85% and 15% to generate a phosphoric acid aqueous solution, and the ratio of phosphoric acid to water can be set in various ways depending on the situation.

[0223] With the Figure 12 Compared to the embodiments described above, in the Figure 13 In one embodiment, the processing liquid supply unit mixes phosphoric acid and DIW in a mixing component to supply an aqueous phosphoric acid solution to the conditioning tank.

[0224] The content supplied after adjusting the concentration of silica via silica supply component 420 is the same as described above. Figure 12 The embodiments are similar, therefore their descriptions are omitted.

[0225] As a mixing component, a mixing stirrer 412 can be used to supply phosphoric acid and DIW, etc., to generate a phosphoric acid aqueous solution through the mixing stirrer 412 arranged on each material supply line. The control unit controls the material supply components 413 and 414 and the mixing stirrer 412 to generate a phosphoric acid aqueous solution based on the substrate processing conditions, and selectively supplies the generated phosphoric acid aqueous solution to the first adjustment tank 440a of the first adjustment supply unit 430a and the second adjustment tank 460a of the second adjustment supply unit 450a.

[0226] It is possible that the first adjusting tank 440a and the second adjusting tank 460a receive phosphoric acid aqueous solution from the mixing agitator 412 to generate a treatment solution containing silicon dioxide phosphoric acid aqueous solution or to adjust the phosphoric acid concentration of the treatment solution.

[0227] Thus, by supplying an aqueous solution of phosphoric acid, the first adjustment supply unit 430a and the second adjustment supply unit 450a can more easily adjust the phosphoric acid concentration, thereby shortening the adjustment time of the treatment solution.

[0228] Reference passed Figure 14 as well as Figure 15 The process of supplying a processing fluid according to an embodiment of the processing fluid supply device of the present invention is described in the illustration. Figure 12 or Figure 13 The embodiment is a process of receiving the processing liquid material, adjusting the concentration and temperature according to the substrate processing conditions, supplying the processing liquid to the substrate processing apparatus, and recycling and regenerating the used processing liquid.

[0229] The Figure 14 The process is shown to initially supply new processing fluid based on substrate processing conditions and then recycle used processing fluid based on regeneration conditions.

[0230] The control unit can measure a quantitative amount of silica according to the substrate processing conditions via the silica measuring tube 423 of the silica supply component 420 and supply it to the first adjustment tank 440 of the first adjustment supply unit 430. Alternatively, the control unit can control the supply of phosphoric acid and DIW, etc., to the first adjustment tank 440 of the first adjustment supply unit 430 via the various material supply components 441 and 442 to generate a processing solution containing silica in an aqueous phosphoric acid solution. Here, the phosphoric acid and DIW can also be supplied to the first adjustment tank 440 as an aqueous phosphoric acid solution via the mixing component described above.

[0231] Furthermore, the control unit can adjust the phosphoric acid aqueous solution to a high-temperature phosphoric acid aqueous solution of 170-180°C by simultaneously heating the solution through the first adjustment circulation line 431 to allow it to circulate. During this process, the water contained within the solution may evaporate, allowing the phosphoric acid concentration of the solution to be measured and additional DIW supplied as needed.

[0232] While performing such a process of generating and adjusting the processing solution, and the second adjustment supply unit 450 adjusts the processing solution of the high-temperature phosphoric acid aqueous solution to a certain level according to the substrate processing conditions, the control unit can control the processing solution of the adjusted phosphoric acid aqueous solution from the second adjustment supply unit 450 to the main supply tank 480 of the main supply unit 470.

[0233] If a certain level of processing liquid is supplied to the main supply tank 480 of the main supply section 470, the control unit controls each pump and valve to supply the processing liquid from the main supply tank 480 to the substrate processing apparatus 10.

[0234] Preferably, the concentration of silica can be detected by sampling the processing solution via sampling line 473 while the processing solution of phosphoric acid aqueous solution is supplied through the substrate processing apparatus 10. If the detected silica concentration does not meet the substrate processing conditions, the control unit can control the silica supply member 420 to adjust the silica concentration in the second adjustment tank 460 and adjust the silica concentration of the processing solution supplied to the main supply tank 480. Furthermore, when the processing solution supplied to the substrate processing apparatus 10 does not reach a certain level of the substrate processing conditions, the control unit can also interrupt the supply of processing solution and recover the processing solution supplied through the processing solution recovery line 490.

[0235] The substrate processing apparatus 10 performs a substrate processing process using a processing solution containing a high-temperature phosphoric acid aqueous solution with silica supplied from the main supply unit 470. Furthermore, the processing solution of the phosphoric acid aqueous solution used in the substrate processing apparatus 10 is recycled to the recycling tank 530 of the recycling unit 510.

[0236] The control unit can perform the following controls: it can also store the recovered treatment liquid in the recovery tank 530 to a certain level, or immediately supply the treatment liquid recovered to the recovery tank 530 to the treatment liquid regeneration unit 550.

[0237] At this time, the control unit controls the supply of processing fluid from the recovery tank 530 to either the first processing fluid regeneration unit 560 or the second processing fluid regeneration unit 580 according to their operating states. For example, it can be controlled as described above. Figure 14 During the regeneration process of the processing fluid in the second processing fluid regeneration unit 580, the processing fluid from the recovery tank 530 is supplied to the first regeneration tank 570 of the first processing fluid regeneration unit 560.

[0238] When the recovered processing fluid is supplied from the recovery unit 510 to the processing fluid regeneration unit 550, the processing fluid is recovered after being filtered by the main filter 535 to remove foreign matter. In order to improve the filtration efficiency of the main filter based on the amount of processing fluid supplied, the processing fluid discharged from the recovery tank 530 can also be distributed to multiple branch pipes (not shown), and the distributed processing fluid can be filtered by the main filter arranged in each branch pipe.

[0239] If processing fluid is supplied to the first regeneration tank 570 of the first processing fluid regeneration unit 560, the control unit can either store the processing fluid to a certain level or immediately recirculate the processing fluid through the first regeneration circulation line 561 to perform regeneration processing while receiving the recovered processing fluid.

[0240] The control unit can perform the following control: while the first processing liquid regeneration unit 560 receives the recovered processing liquid from the recovery tank 530, it performs the regeneration processing operation of the processing liquid stored in the second regeneration tank 590 of the second processing liquid regeneration unit 580.

[0241] To this end, the control unit can control the treatment liquid stored in the second regeneration tank 590 of the second treatment liquid regeneration unit 580 to circulate through the second regeneration circulation line 581 while simultaneously heating and filtering. Furthermore, the control unit can control the treatment liquid circulating in the second regeneration circulation line 581 to measure the phosphoric acid water concentration, and based on this concentration, supply DIW to the second regeneration tank 590 or heat the treatment liquid in the second regeneration circulation line 581. For example, the treatment liquid circulating in the second regeneration circulation line 581 can be adjusted to contain phosphoric acid and water at a ratio of 50%, more preferably at a ratio of 85% and 15%, respectively. The ratio of phosphoric acid and water in such a treatment liquid can be reasonably changed and set according to the situation.

[0242] This process can be used to supply new phosphoric acid aqueous solution and regenerate used phosphoric acid aqueous solution.

[0243] The Figure 15 This illustrates a process in which the regenerated processing liquid is supplied after being adjusted based on the substrate processing conditions, and the used processing liquid is recycled and regenerated based on the regeneration conditions.

[0244] When the recovered treatment liquid is being regenerated in the second treatment liquid regeneration unit 580 according to the regeneration conditions, the control unit can control the regenerated treatment liquid to be supplied from the second regeneration tank 590 of the second treatment liquid regeneration unit 580 to the adjustment supply unit 410.

[0245] At this time, the control unit is configured to supply regenerated processing fluid to either the first adjustment supply unit 430 or the second adjustment supply unit 450, taking into account their operating states, for example, as described above. Figure 15 During the period when the first adjustment supply unit 430 supplies the adjusted treatment fluid to the main supply unit 470, the control unit can control the second treatment fluid regeneration unit 580 to supply the regenerated treatment fluid to the second adjustment tank 460 of the second adjustment supply unit 450.

[0246] Preferably, the flow meter (not shown) configured on the regeneration liquid supply pipe 561 can measure the amount of liquid supplied to the second adjustment tank 460. When the amount of liquid stored in the second adjustment tank 460 is above a certain level, the control unit can also control the liquid supplied to the second adjustment tank 460 through the recovery line 555 to be recycled back to the liquid regeneration unit 550.

[0247] The second adjustment supply unit 450 receives the regenerated processing liquid from the second processing liquid regeneration unit 580 and adjusts it according to the substrate processing conditions. For this purpose, the control unit can control the processing liquid of phosphoric acid aqueous solution stored in the second adjustment tank 460 to be heated and the phosphoric acid concentration is measured while circulating through the second adjustment circulation pipeline 451. Based on the measurement results, phosphoric acid or DIW is supplied to the second adjustment tank 460.

[0248] While the second adjustment supply unit 450 receives the regenerated processing liquid and performs regeneration processing, the first adjustment supply unit 430 supplies the processing liquid adjusted based on the substrate processing conditions to the main supply unit 470, and the main supply unit 470 supplies the adjusted processing liquid to the substrate processing apparatus 10.

[0249] Alternatively, the processing liquid used in the substrate processing apparatus 10 can be recycled back to the recycling tank 530 of the recycling unit 510, filtered in the recycling unit 510, and then supplied to the processing liquid regeneration unit 550.

[0250] Figure 16 as well as Figure 17 Another embodiment of the process of supplying processing fluid via a processing fluid supply device according to the present invention is shown, illustrating its applicability to the described process. Figure 9 The process of supplying the processing fluid during an embodiment of the processing fluid supply unit described herein.

[0251] In explaining the above Figure 16 and the Figure 17 In the embodiments described above, the details are omitted. Figure 14 and the Figure 15 The description of the repeated parts of the embodiments.

[0252] In the Figure 16 and the Figure 17 In one embodiment, the first adjustment supply unit 430c receives regenerated processing liquid from the processing liquid regeneration unit 550 and supplies it after adjusting it according to the substrate processing conditions; the second adjustment supply unit 450c receives new processing liquid material, generates new processing liquid, and supplies it after adjusting it according to the substrate processing conditions.

[0253] First, describe the Figure 16 In one embodiment, the second adjustment supply unit 450c generates a new processing liquid substance and adjusts it before supplying it to the main supply unit 470, and the main supply unit 470 supplies the processing liquid to the substrate processing apparatus 10.

[0254] During the supply of new treatment liquid by the second adjustment supply unit 450c, the control unit performs the following control: the first adjustment supply unit 430c receives regenerated treatment liquid from the second treatment liquid regeneration unit 580, and while the treatment liquid of the phosphoric acid aqueous solution is self-circulated through the first adjustment circulation line 431, the phosphoric acid concentration is measured and heated, and phosphoric acid or DIW or the like is supplied to the first adjustment tank 440c to adjust the phosphoric acid concentration and temperature of the treatment liquid of the phosphoric acid aqueous solution.

[0255] Furthermore, the processing liquid used in the substrate processing apparatus 10 is recycled to the recycling tank 530 of the recycling unit 510, and the control unit controls the recycled processing liquid to be supplied to the first processing liquid regeneration unit 560 to perform regeneration processing.

[0256] In passing the Figure 16 In the embodiment, under the state where the first adjustment supply unit 430c receives the regeneration processing liquid and adjusts the processing liquid according to the substrate processing conditions, as described above... Figure 17 As in the embodiment, the control unit controls the first adjustment supply unit 430c to supply the adjustment processing liquid to the main supply unit 470, and the processing liquid supplied from the first adjustment supply unit 430c is supplied from the main supply unit 470 to the substrate processing apparatus 10.

[0257] Furthermore, during the period when the first adjustment supply unit 430c supplies the adjusted processing liquid to the main supply unit 470, the control unit controls the supply of new processing liquid material to the second adjustment supply unit 450c and performs the adjustment of the processing liquid.

[0258] In addition, during the period when the first adjustment supply unit 430c supplies the adjusted processing fluid to the main supply unit 470, the control unit controls the first processing fluid regeneration unit 560 to receive the processing fluid recovered from the recovery tank 530 of the recovery unit 510, and the second processing fluid regeneration unit 580 performs processing fluid regeneration while circulating the processing fluid through the second regeneration circulation pipeline 581.

[0259] When the first processing fluid regeneration unit 560 supplies regenerated processing fluid, it also supplies regenerated processing fluid to the first adjustment supply unit 430c.

[0260] Furthermore, the first adjustment supply unit 430c can also adjust the regenerated processing liquid received from the processing liquid regeneration unit 550 and supply it to the second adjustment supply unit 450c, thereby mixing the regenerated processing liquid and the new processing liquid and supplying it to the substrate processing apparatus.

[0261] Furthermore, in this invention, when the recycled treatment liquid is repeatedly regenerated and supplied, the recycled treatment liquid can also be disposed of as waste based on the number of regenerations or the concentration of silica. Regarding this... Figure 18 The present invention illustrates a process for discarding treatment fluid via a treatment fluid supply device according to an embodiment of the present invention.

[0262] After the first adjustment supply unit 430c receives the regenerated processing liquid from the processing liquid regeneration unit 550 and adjusts the processing liquid according to the substrate processing conditions, it supplies the adjusted processing liquid to the main supply unit 470. When the main supply unit 470 supplies the processing liquid supplied from the first adjustment supply unit 430c to the substrate processing apparatus 10, if the number of times the same regenerated processing liquid is adjusted and repeatedly supplied reaches a preset value, the control unit can recover the processing liquid supplied from the first adjustment supply unit 430c after it is used in the substrate processing apparatus 10 to the recovery tank 530 of the recovery unit 510 and discharge it to the waste processing liquid discharge pipe 539 through the discharge valve 537, thereby performing waste treatment.

[0263] Therefore, a counter (not shown) can be set in the first adjustment supply unit 430c to count the number of times the regenerated treatment liquid is received from the treatment liquid regeneration unit 550 or the number of times the treatment liquid is supplied to the main supply unit 470. The control unit can determine whether the treatment liquid should be discarded based on the counter in the first adjustment supply unit 430c. When new treatment liquid is regenerated after discarding, the counter can be reset and a new counter can be formed.

[0264] When determining waste disposal based on the number of times the processing liquid is regenerated, it can also be determined based on the concentration of silica contained in the regenerated processing liquid. When the main supply unit 470 supplies the processing liquid supplied from the first adjustment supply unit 430c to the substrate processing apparatus 10, the silica concentration can be measured by sampling the processing liquid through the sampling line 473. If the processing liquid supplied to the substrate processing apparatus 10 has a silica concentration that exceeds the set extreme value, the control unit will use the corresponding processing liquid in the substrate processing apparatus 10, recover it to the recovery tank 530 of the recovery unit 510, and discharge it to the waste processing liquid discharge pipe 539 through the discharge valve 537, thereby performing waste disposal.

[0265] As described above, in this invention, by means of multiple adjustment supply units, while selectively adjusting the concentration and temperature of the processing liquid according to the substrate processing conditions in any one adjustment supply unit, the processing liquid adjusted in another adjustment supply unit is supplied to the main supply unit or the regenerated processing liquid is received from the processing liquid regeneration unit, thus enabling a continuous supply of processing liquid to the substrate processing apparatus.

[0266] Furthermore, in this invention, by means of multiple processing liquid regeneration units, while selectively adjusting the concentration and temperature of the processing liquid based on the processing liquid regeneration conditions in any one processing liquid regeneration unit, processing liquid is received from the recovery unit or the regenerated processing liquid is supplied to the adjustment supply unit in another processing liquid regeneration unit, thus enabling continuous regeneration of the processing liquid.

[0267] The above description is merely illustrative of the technical concept of the present invention. Those skilled in the art to which this invention pertains should be able to make various modifications and variations without departing from the essential characteristics of the invention. Therefore, the embodiments described in this invention are for illustrative purposes only and are not intended to limit the technical concept of the invention. The technical concept of the invention is not limited to such embodiments. The scope of protection of this invention should be interpreted through the appended claims, and all technical concepts within the same scope should be interpreted as being included within the scope of the claims of this invention.

Claims

1. A processing liquid supply device characterized by comprising: including: a processing liquid supply unit including a main supply section that supplies a processing liquid to a substrate processing apparatus and an adjustment supply section that adjusts the processing liquid according to a substrate processing condition and supplies the main supply section; a processing liquid recirculation unit including a recovery section that recovers the processing liquid from the substrate processing apparatus and a processing liquid regeneration section that receives the recovered processing liquid from the recovery section, adjusts the processing liquid according to a regeneration condition, and supplies the adjustment supply section; and a control unit that controls supply, adjustment, recovery, regeneration, or disposal of the processing liquid of the processing liquid supply unit and the processing liquid recirculation unit, the main supply section includes: a main supply tank that supplies the processing liquid to the substrate processing apparatus; a processing liquid supply pipe that supplies the processing liquid from the main supply tank to the substrate processing apparatus; a sampling line that branches from the processing liquid supply pipe, is connected to the main supply tank, and is used to sample and measure the processing liquid supplied from the main supply tank; and a silicon dioxide concentration meter that measures a silicon dioxide concentration in the processing liquid sampled from the sampling line.

2. The processing liquid supply apparatus according to claim 1, wherein the processing liquid supply unit further includes: a silicon dioxide supply member that measures a supply amount of silicon dioxide to supply silicon dioxide according to a substrate processing condition, the adjustment supply section includes: an adjustment tank that adjusts the processing liquid containing silicon dioxide and supplies the adjusted processing liquid to the main supply section; and an adjustment circulation line that circulates the processing liquid of the adjustment tank, measures a concentration of the processing liquid, and adjusts a temperature, the control unit controls supply of phosphoric acid and DIW or a heating temperature to adjust a phosphoric acid concentration according to a measurement result of the phosphoric acid concentration of the processing liquid of the adjustment circulation line.

3. The processing liquid supply apparatus according to claim 2, wherein the processing liquid supply unit further includes: a mixing member that supplies an aqueous phosphoric acid solution in which phosphoric acid and DIW are mixed according to a substrate processing condition to the adjustment tank, the control unit supplies the aqueous phosphoric acid solution by the mixing member to adjust the phosphoric acid concentration according to a measurement result of the phosphoric acid concentration of the processing liquid of the adjustment circulation line.

4. The processing liquid supply apparatus according to claim 2 or 3, wherein the adjustment supply section includes: first and second adjustment supply sections that supply the processing liquid to the main supply section.

5. The processing liquid supply apparatus according to claim 4, wherein the control unit controls one of the first and second adjustment supply sections to adjust the processing liquid and the other to supply the processing liquid to the main supply section or receive the processing liquid from the processing liquid regeneration section.

6. The processing liquid supply apparatus according to claim 4, wherein the control unit controls the first adjustment supply section to receive the regenerated processing liquid from the processing liquid regeneration section and the second adjustment supply section to receive a new processing liquid material.

7. The processing liquid supply apparatus according to claim 2, wherein ​ The control unit controls the supply of the silicon dioxide from the adjustment supply section based on the measurement result of the silicon dioxide concentration of the sampled treatment liquid, thereby adjusting the silicon dioxide concentration or discharging the treatment liquid recovered to the recovery section to the outside.

8. The treatment liquid supply apparatus according to claim 1, wherein The treatment liquid regeneration section includes: a regeneration tank that adjusts the moisture concentration of the treatment liquid received from the recovery section and supplies the treatment liquid to the treatment liquid supply unit; and a regeneration circulation line that circulates the treatment liquid of the regeneration tank to filter the treatment liquid, measures the concentration of the treatment liquid, and adjusts the temperature, The control unit controls the supply of the DIW or the heating temperature based on the measurement result of the moisture concentration of the treatment liquid of the regeneration circulation line, thereby adjusting the moisture concentration.

9. The treatment liquid supply apparatus according to claim 8, wherein The recovery section includes: a recovery tank that recovers the treatment liquid from the substrate processing apparatus; a plurality of branch pipes that are provided between a discharge pipe of the recovery tank and an introduction pipe of the treatment liquid regeneration section; and a plurality of main filters that are provided in each of the branch pipes to filter the treatment liquid.

10. The treatment liquid supply apparatus according to claim 7, wherein The recovery section includes: a recovery tank that recovers the treatment liquid from the substrate processing apparatus; and a discharge valve that discharges the treatment liquid of the recovery tank to the outside, The control unit discharges the recovered treatment liquid to the outside based on the measurement result of the silicon dioxide concentration of the treatment liquid supplied to the substrate processing apparatus or the number of times of regeneration of the treatment liquid.

11. The treatment liquid supply apparatus according to claim 4, wherein The treatment liquid regeneration section includes: a first treatment liquid regeneration section and a second treatment liquid regeneration section that receive the treatment liquid from the recovery section and supply the adjusted treatment liquid to the adjustment supply section.

12. The treatment liquid supply apparatus according to claim 11, wherein The control unit controls so that one of the first treatment liquid regeneration section and the second treatment liquid regeneration section regenerates the treatment liquid, and the other receives the treatment liquid from the recovery section or supplies the regenerated treatment liquid to the adjustment supply section.

13. The treatment liquid supply apparatus according to claim 1, wherein The treatment liquid supply unit is provided in the same space as the substrate processing apparatus, and the treatment liquid recirculation unit is provided separately from the treatment liquid supply unit in a different space.

14. A method of supplying a treatment liquid, characterized by includes: a treatment liquid supply step of adjusting the concentration and the temperature of the treatment liquid supplied to the adjustment supply section while circulating the treatment liquid through the adjustment circulation line, and supplying the adjusted treatment liquid to the main supply section based on the substrate processing condition; a treatment liquid recovery step of recovering the used treatment liquid from the substrate processing apparatus to the recovery section; and a treatment liquid regeneration step of regenerating the treatment liquid supplied from the recovery section to the treatment liquid regeneration section while circulating the treatment liquid through the regeneration circulation line based on the regeneration condition, and supplying the regenerated treatment liquid to the adjustment supply section, The treatment liquid supply step includes: a sampling step of sampling and measuring the concentration of the silicon dioxide from a sampling line branched from a treatment liquid supply pipe connected to the main supply tank and connected to the substrate processing apparatus, the treatment liquid being supplied to the substrate processing apparatus from the main supply tank through the treatment liquid supply pipe; and a silicon dioxide concentration adjustment step of adjusting the supply of the silicon dioxide from the adjustment supply section based on the measurement result of the concentration of the silicon dioxide of the sampled treatment liquid.

15. The treatment liquid supply method according to claim 14, wherein the treatment liquid supply step includes: a silicon dioxide concentration adjustment step of adjusting the amount of the silicon dioxide to be supplied based on the substrate processing conditions; a treatment liquid material supply step of supplying one or more treatment liquid materials including phosphoric acid and DIW to an adjustment tank of the adjustment supply section; a phosphoric acid concentration measurement step of measuring the concentration of the phosphoric acid while circulating the treatment liquid of the adjustment tank through the adjustment circulation line; and a supply treatment liquid adjustment step of adjusting the concentration of the phosphoric acid by supplying any one or more of the phosphoric acid and the DIW to the adjustment tank or by heating based on the measurement result of the concentration of the phosphoric acid.

16. The treatment liquid supply method according to claim 15, wherein the treatment liquid material supply step supplies an aqueous phosphoric acid solution in which the phosphoric acid and the DIW are mixed by a mixing member to the adjustment tank, the supply treatment liquid adjustment step adjusts the concentration of the phosphoric acid by supplying the aqueous phosphoric acid solution in which the phosphoric acid and the DIW are mixed by the mixing member to the adjustment tank.

17. The treatment liquid supply method according to claim 14, wherein the treatment liquid material supply step supplies a regenerated treatment liquid to a first adjustment tank of a first adjustment supply section and supplies a new treatment liquid material to a second adjustment tank of a second adjustment supply section.

18. The treatment liquid supply method according to claim 14, wherein the treatment liquid supply step includes: a sampling step of sampling the treatment liquid supplied from the main supply section to the substrate processing apparatus to measure the concentration of the silicon dioxide, the treatment liquid recovery step includes: a recovery treatment liquid disposal step of discharging and disposing of the treatment liquid recovered from the substrate processing apparatus to the recovery section to the outside based on the measurement result of the concentration of the silicon dioxide of the sampled treatment liquid.

19. The treatment liquid supply method according to claim 17, wherein the treatment liquid material supply step includes: a counting step of counting the number of times of supplying the regenerated treatment liquid to the first adjustment tank of the first adjustment supply section, the treatment liquid recovery step includes: a recovery treatment liquid disposal step of discharging and disposing of the treatment liquid recovered from the substrate processing apparatus to the recovery section to the outside based on the number of times of regeneration.

20. The treatment liquid supply method according to claim 14, wherein the treatment liquid recovery step includes: a waste treatment liquid recovery step of recovering the treatment liquid from the substrate processing apparatus to a recovery tank; a main filtration step of distributing the treatment liquid discharged from the recovery tank to a plurality of branch pipes and filtering the treatment liquid through a main filter of each branch pipe; and The treatment liquid recovery step includes:

21. The treatment liquid supply method according to claim 14, wherein the treatment liquid recovery step includes: the treatment liquid recovery step includes:

22. The treatment liquid supply method according to claim 14, wherein the treatment liquid supply step adjusts the temperature and concentration of the treatment liquid in either one of the first adjustment supply section and the second adjustment supply section, and supplies the adjusted treatment liquid to the main supply section or receives the recovered treatment liquid from the treatment liquid recovery section in the other one, the treatment liquid recovery step adjusts the concentration and temperature of the treatment liquid in either one of the first treatment liquid recovery section and the second treatment liquid recovery section, and receives the treatment liquid from the recovery section or supplies the recovered treatment liquid to the adjustment supply section in the other one, includes:

23. A processing liquid supply device characterized by comprising: a treatment liquid supply unit including: an adjustment supply section including a first adjustment supply section that receives the recovered treatment liquid and a second adjustment supply section that receives the new treatment liquid, and cyclically circulating the treatment liquid, selectively supplying the amount of the silicon dioxide supplied by the silicon dioxide supply member, selectively supplying the phosphoric acid aqueous solution in which the phosphoric acid and the DIW are mixed by the mixing member, heating the treatment liquid by the adjustment circulation line and adjusting the treatment liquid according to the substrate processing conditions to supply the adjusted treatment liquid to the main supply section; and a main supply section that supports the supply of the treatment liquid to the substrate processing apparatus while sampling the supplied treatment liquid, and adjusts the concentration of the silicon dioxide of the adjustment supply section according to the measurement result of the silicon dioxide concentration; a treatment liquid recirculation unit including: a recovery section that recovers the treatment liquid from the substrate processing apparatus, and supplies the recovered treatment liquid to the treatment liquid recovery section after filtering the recovered treatment liquid by a plurality of main filters disposed in a plurality of branch pipes; and a plurality of treatment liquid recovery sections that supply the DIW or heat the treatment liquid while cyclically circulating the recovered treatment liquid according to the recovery conditions to recover the treatment liquid, and supply the recovered treatment liquid to the first adjustment supply section; and a control unit that controls the supply, adjustment, recovery, recovery, or disposal of the treatment liquid of the treatment liquid supply unit and the treatment liquid recirculation unit, and controls either one of the first adjustment supply section and the second adjustment supply section to adjust the treatment liquid, and the other one to supply the treatment liquid to the main supply section, and controls either one of the plurality of treatment liquid recovery sections to recover the treatment liquid, and the other one to receive the treatment liquid from the recovery section or supply the recovered treatment liquid to the first adjustment supply section, the treatment liquid supply unit and the treatment liquid recirculation unit are spatially separated and disposed, the main supply section includes: a main supply tank that supplies the treatment liquid to the substrate processing apparatus; a treatment liquid supply pipe that supplies the treatment liquid from the main supply tank to the substrate processing apparatus; and a treatment liquid recovery pipe that recovers the treatment liquid from the substrate processing apparatus to the recovery section. a sampling line branched from the treatment liquid supply pipe to be connected to the main supply tank and used to sample and measure the treatment liquid supplied from the main supply tank; and a silica concentration meter used to measure the silica concentration contained in the treatment liquid sampled from the sampling line.

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