Processing fluid supply device and solid removal method of processing fluid supply device

Abstract

This invention relates to a processing liquid supply device and a method for removing solids from the processing liquid supply device. It discloses a processing liquid supply device with a rinsing function and a method for removing solids such as solid silica from the processing liquid supply device. The rinsing function refers to the function of removing solids such as silica that precipitate during the supply of processing liquid in a processing liquid supply device that supplies processing liquid to a substrate processing device and recycles it.

Description

Technical Field

[0001] This invention relates to a processing liquid supply device and a method for removing solids from the processing liquid supply device, and more specifically to a processing liquid supply device having a rinsing function and a method for removing solids such as solid silica from the processing liquid supply device, wherein the rinsing function refers to the function of removing solids such as silica that precipitate along with the supply of processing liquid in a processing liquid supply device that supplies processing liquid to a substrate processing device and recycles it. Background Technology

[0002] Various types of processing solutions are typically used in the manufacturing processes of semiconductor components and display panels. These processing solutions are supplied to a substrate processing apparatus by a processing solution supply device, whose concentration, temperature, and flow rate are adjusted to meet the process conditions. At this time, the processing solution supply device supplies a single processing solution or a mixture of different processing solutions to the substrate processing apparatus.

[0003] For example, in a cleaning or etching process, a treatment solution such as an aqueous phosphoric acid solution is supplied to the surface of a substrate on which silicon nitride and silicon oxide films are formed, and a selective removal of the silicon nitride film is performed.

[0004] When silicon nitride and silicon oxide films are selectively etched using an aqueous phosphoric acid solution, the silica contained in the phosphoric acid solution is an important factor that plays a crucial role in the etching selectivity.

[0005] For example, if the silica concentration in the phosphoric acid aqueous solution is too low, the etching rate of the silicon oxide film will increase, reducing the etching selectivity for the silicon nitride film. Conversely, even if the silica concentration is too high, various problems may arise, such as inadequate selective etching or filter clogging.

[0006] Therefore, when using a treatment solution such as phosphoric acid aqueous solution to perform an etching process, it is important to adjust the concentration of silica contained in the treatment solution within a reasonable range according to the purpose of the treatment.

[0007] In particular, with the recent advancements in semiconductor technology, etching equipment has been upgraded from batch etching equipment to single-wafer etching equipment. Batch etching equipment suffers from drawbacks such as poor dispersion, flow defects, and difficulty in controlling the selectivity ratio. Therefore, the recent trend is to develop single-wafer etching equipment.

[0008] Single-piece etching equipment is suitable for supplying high-temperature phosphoric acid treatment solution to each chamber and recycling the used treatment solution.

[0009] When such a treatment liquid recycling system is applied, when the temperature of the phosphoric acid treatment liquid drops or the phosphoric acid treatment liquid is not circulated, the liquid silica precipitates as solid silica, which may become a particle source or cause pipe blockage and poor sensing.

[0010] Therefore, although silica precipitation can be prevented by supplying silica precipitation inhibitors, there is a problem that it is not easy to adjust the etching selectivity when adding silica precipitation inhibitors. In addition, there is a problem that it is difficult to fully prevent the precipitation of solid silica when the processing solution is exposed to the atmosphere during the processing of the processing solution.

[0011] Therefore, there is a need to find a solution that can more effectively remove solid precipitation such as silica and maintain stable process yield.

[0012] Patent Document 0001: Korean Patent Publication No. 10-2020-0115316

[0013] Patent Document 0002: Korean Patent Publication No. 10-2019-0099814 Summary of the Invention

[0014] The purpose of this invention is to solve the aforementioned technical problems, specifically the problem of the inability to stably maintain process yield due to the precipitation of solids such as silicon dioxide.

[0015] In particular, the aim is to provide a solution that can remove precipitated solids such as silica by centrally rinsing areas on the processing liquid supply device where silica is easily precipitated.

[0016] Furthermore, it solves the problem of solid precipitation such as solid silica acting as a particle source, and also solves the problems of pipe blockage and poor sensing in substrate processing facilities caused by solid precipitation such as solid silica.

[0017] The problems solved by the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand from the following description other problems not mentioned.

[0018] To accomplish the above-mentioned technical task, one embodiment of the processing fluid supply device according to the present invention may include: a flushing supply member for selectively supplying flushing fluid to a pre-defined solid precipitation area of ​​the processing fluid supply device; a flushing adjustment member for guiding the flushing of the solid precipitation area by the flow of flushing fluid; a flushing discharge member for discharging processing fluid or flushing fluid from the solid precipitation area; and a control unit for controlling the flushing of the solid precipitation area.

[0019] Preferably, the flushing supply component includes: a flushing fluid supply section for supplying a flushing fluid comprising one or more of hydrogen fluoride (HF), deionized water (DIW), and an inert gas; a flushing fluid supply line for supplying the flushing fluid to the solid precipitation region; and a flushing fluid supply valve for selectively supplying the flushing fluid from the flushing fluid supply section to the flushing fluid supply line.

[0020] As an example, the solid precipitation region may include a region equipped with a silica supply member that measures silica based on substrate processing conditions and supplies a quantitative amount of silica. The flushing regulating member includes a front flushing regulating valve connected to the flushing fluid supply line and to the front end of the silica measuring tube of the silica supply member, and a rear flushing regulating valve connected to the rear end of the silica measuring tube and the silica supply line, thereby guiding the discharge of residual silica and flushing based on the flushing fluid. The flushing discharge member includes a discharge line connected to the flushing regulating valve to discharge the residual silica or flushing fluid from the silica supply member.

[0021] As an example, the solid precipitation region may include a region configured with one or more of the following: a supply adjustment unit for adjusting the processing liquid based on substrate processing conditions, one or more processing liquid regeneration units for adjusting the recovered processing liquid based on regeneration conditions, and a main supply unit for supplying processing liquid to the substrate processing apparatus. The flushing adjustment member includes one or more flushing adjustment valves connected to the flushing fluid supply line and to one or more of the circulation lines of the supply adjustment unit, the processing liquid regeneration unit, and the main supply unit, thereby guiding the discharge of residual processing liquid and flushing based on the flushing fluid. The flushing discharge member includes a discharge line connected to the flushing adjustment valve for discharging residual processing liquid or flushing fluid from one or more of the supply adjustment unit, the processing liquid regeneration unit, and the main supply unit.

[0022] As an example, the solid precipitation region may include a region configured with one or more of the following: a supply adjustment unit for adjusting the processing liquid based on substrate processing conditions; one or more processing liquid regeneration units for adjusting the recovered processing liquid based on regeneration conditions; a main supply unit for supplying processing liquid to the substrate processing apparatus; and a recovery unit for recovering processing liquid from the substrate processing apparatus. The flushing adjustment member includes a front flushing adjustment valve connected to the flushing fluid supply line and connected to the front end of one or more of the tanks in the supply adjustment unit, the processing liquid regeneration unit, and the main supply unit; and a rear flushing adjustment valve connected to the rear end of one or more of the tanks in the supply adjustment unit, the processing liquid regeneration unit, and the main supply unit, thereby guiding the discharge of residual processing liquid and flushing based on the flushing fluid. The flushing discharge member includes a discharge line connected to the rear flushing adjustment valve for discharging residual processing liquid or flushing fluid from the tank.

[0023] As an example, the solid precipitation region may include a region equipped with a sampling line for sampling the processing liquid supplied to the substrate processing device to determine the silica concentration. The flushing regulating member includes a front flushing regulating valve connected to the flushing fluid supply line and connected to the front end of the silica concentration meter on the sampling line, and a rear flushing regulating valve connected to the rear end of the silica concentration meter on the sampling line, thereby guiding the discharge of residual processing liquid and flushing based on the flushing fluid. The flushing discharge member includes a discharge line connected to the rear flushing regulating valve to discharge the residual processing liquid or flushing fluid from the sampling line.

[0024] Preferably, the flushing and discharge component may include: multiple discharge lines for discharging the treatment liquid remaining in each of the solid precipitation areas or the flushing fluid after flushing; and one or more distribution tanks for combining the treatment liquid or flushing fluid discharged from multiple discharge lines selected from the multiple discharge lines and discharging it through a single discharge line.

[0025] More preferably, the flushing and discharge component may further include a buffer tank for receiving and storing waste liquid from one or more of the distribution boxes.

[0026] Furthermore, the processing liquid supply device may include: a processing liquid supply unit, including a main supply section for supplying processing liquid to a substrate processing apparatus and a supply adjustment section for adjusting the processing liquid according to substrate processing conditions and supplying it to the main supply section; and a processing liquid reuse unit, including a recovery section for recovering processing liquid from the substrate processing apparatus and a processing liquid regeneration section for receiving recovered processing liquid from the recovery section, adjusting the processing liquid according to regeneration conditions, and supplying it to the supply adjustment section, with the rinsing supply member, the rinsing adjustment member, and the rinsing discharge member configured corresponding to each of the processing liquid supply unit and the processing liquid reuse unit.

[0027] Alternatively, one embodiment of the solid removal method of the processing liquid supply device according to the present invention may include: a processing liquid discharge step, discharging processing liquid material remaining in a pre-defined solid precipitation zone of the processing liquid supply device; a rinsing step, supplying rinsing fluid to the solid precipitation zone to perform rinsing; and a rinsing fluid discharge step, selectively discharging the rinsing fluid after rinsing from the solid precipitation zone.

[0028] Preferably, the treatment liquid discharge step may involve shutting off the treatment liquid supply to the solid precipitation area and opening the discharge line to discharge the treatment liquid remaining in the solid precipitation area, and selectively performing the opening and closing of the flushing fluid supply line and the opening and closing of the discharge line, thereby repeatedly performing the flushing step and the flushing fluid discharge step on the solid precipitation area with one or more different flushing fluids.

[0029] More preferably, the rinsing step and the rinsing fluid discharge step are repeated in the following order: hydrogen fluoride (HF), deionized water (DIW), and inert gas; or deionized water (DIW), hydrogen fluoride (HF), deionized water (DIW), and inert gas; or deionized water (DIW), and inert gas.

[0030] Furthermore, the flushing step and the flushing fluid discharge step may selectively involve opening and closing the flushing fluid supply line and the discharge line to the solid precipitation area in sequence with hydrogen fluoride (HF) and deionized water (DIW) or with deionized water (DIW) to flush the solid precipitation area and discharge the flushing fluid after flushing. Alternatively, the flushing fluid may be selectively discharged or removed by the flow of inert gas by opening and closing the flushing fluid supply line and the discharge line to the solid precipitation area.

[0031] As an example, the processing liquid discharge step may involve determining the silica (Silica) level based on the substrate processing conditions, shutting off the silica supply of a silica supply component that supplies a fixed amount of silica, and opening the discharge line to discharge residual silica. The rinsing step may involve opening the rinsing fluid supply line to perform rinsing on the silica measuring tube and the silica supply line through the flow of rinsing fluid. The rinsing fluid discharge step may involve opening the discharge line to discharge the rinsing fluid after rinsing.

[0032] As another example, the processing liquid discharge step may involve shutting off the processing liquid supply and opening the discharge line to discharge the residual processing liquid in a selected section of any one of the following circulation lines: one or more processing liquid supply adjustment sections that adjust the processing liquid supply based on substrate processing conditions, one or more processing liquid regeneration sections that adjust the recovered processing liquid based on regeneration conditions, and one main supply section that supplies processing liquid to the substrate processing apparatus. The rinsing step may involve opening the rinsing fluid supply line and performing rinsing on the selected section of the circulation line by the flow of rinsing fluid. The rinsing fluid discharge step may involve opening the discharge line and discharging the rinsing fluid after rinsing.

[0033] As another example, the processing liquid discharge step may involve shutting off the processing liquid supply and opening the discharge line to discharge the residual processing liquid from any one or more tanks among the following: one or more processing liquid supply adjustment units that adjust the processing liquid based on substrate processing conditions, one or more processing liquid regeneration units that adjust the recovered processing liquid based on regeneration conditions, a main supply unit that supplies processing liquid to the substrate processing apparatus, and a recovery unit that recovers the processing liquid from the substrate processing apparatus. The rinsing step may involve opening the rinsing fluid supply line to perform rinsing on the tanks by the flow of rinsing fluid. The rinsing fluid discharge step may involve opening the discharge line to discharge the rinsing fluid after rinsing.

[0034] As another example, the processing liquid discharge step may involve shutting off the processing liquid supply and opening the discharge line at any one of the following: adjusting the processing liquid supply based on substrate processing conditions, adjusting the recovered processing liquid based on regeneration conditions, adjusting the processing liquid regeneration unit, and the main supply unit supplying processing liquid to the substrate processing apparatus, thereby discharging residual processing liquid. The rinsing step and the rinsing fluid discharge step may involve supplying deionized water (DIW) rinsing fluid through the rinsing fluid supply line to flush the tank and circulation pipeline with deionized water (DIW) rinsing fluid, and opening the discharge line to discharge the rinsing fluid after rinsing. Furthermore, the step may involve supplying rinsing fluid in the order of hydrogen fluoride (HF), deionized water (DIW), and inert gas through the rinsing fluid supply line to selected sections of the circulation pipeline to flush, and opening the discharge line to discharge the rinsing fluid after rinsing.

[0035] As another example, the processing liquid discharge step may involve shutting off the processing liquid supply to the sampling line that samples the processing liquid supplied to the substrate processing apparatus to measure the silica concentration and opening the discharge line to discharge the residual processing liquid; the rinsing step may involve opening the rinsing fluid supply line and performing rinsing on the selected section of the sampling line equipped with a silica concentration meter by the flow of rinsing fluid; and the rinsing fluid discharge step may involve opening the discharge line to discharge the rinsing fluid after rinsing.

[0036] Preferably, the flushing fluid discharge step may involve supplying one or more of the treatment fluid and flushing fluid discharged from a plurality of discharge lines selected from a plurality of discharge lines to a distribution tank, and storing one or more of the treatment fluid and flushing fluid combined in the distribution tank in a buffer tank.

[0037] Furthermore, a preferred embodiment of the treatment fluid supply device according to the present invention may include: a flushing supply component comprising a flushing fluid supply section for supplying a flushing fluid comprising one or more of hydrogen fluoride (HF), deionized water (DIW), and an inert gas; a flushing fluid supply line for supplying the flushing fluid to the solid precipitation region; and a flushing fluid supply valve for selectively supplying the flushing fluid from the flushing fluid supply section to the flushing fluid supply line; a flushing regulating component comprising a flushing regulating valve for controlling the flow of the flushing fluid in the solid precipitation region, thereby guiding the discharge of residual treatment fluid and flushing based on the flushing fluid; and a flushing discharge component comprising multiple discharge lines for discharging the residual treatment fluid in each of the solid precipitation regions or the flushing fluid after flushing, and for discharging the flushing fluid from the solid precipitation region. The system comprises multiple discharge lines selected from a plurality of discharge lines, through which the treated liquid or flushing fluid is discharged, and through one or more distribution tanks, and a buffer tank for receiving and storing the treated liquid or flushing fluid from the distribution tanks; and a control unit for controlling the flushing of the solid precipitation area, the control unit selectively controlling the opening and closing of the flushing fluid supply line and the opening and closing of the discharge line, flushing the solid precipitation area in the order of hydrogen fluoride (HF), deionized water (DIW), and inert gas or in the order of deionized water (DIW) and inert gas.

[0038] According to this invention, solid precipitates such as silica can be effectively removed on the processing liquid supply device and the processing liquid can be supplied immediately after the rinsing process is performed, thus effectively maintaining the process output rate.

[0039] In particular, concentrated rinsing of areas on the processing liquid supply device where silica is easily precipitated can remove silica and other solids. Attached Figure Description

[0040] Figure 1 A structural diagram of an embodiment of the processing fluid supply device to which the present invention is applied is shown.

[0041] Figure 2 An embodiment of a processing fluid supply unit of a processing fluid supply apparatus according to the present invention is shown.

[0042] Figure 3 An embodiment of the processing liquid reuse unit according to the present invention is shown.

[0043] Figure 4 A structural diagram of another embodiment of the processing fluid supply device to which the present invention is applicable is shown.

[0044] Figure 5 Another embodiment of the processing fluid supply unit of the processing fluid supply device according to the present invention is shown.

[0045] Figure 6 Another embodiment of the processing liquid reuse unit according to the present invention is shown.

[0046] Figure 7 A flowchart illustrating an embodiment of a solids removal method in a processing liquid supply device according to the present invention is shown.

[0047] Figure 8 An embodiment is shown in which the silica supply member of the processing liquid supply device is flushed in a solid precipitation region according to the present invention.

[0048] Figure 9 as well as Figure 10 An embodiment is shown in which the supply adjustment section of the processing liquid supply device performs rinsing of the solid precipitation area according to the present invention.

[0049] Figure 11 as well as Figure 12 An embodiment is shown in which the main supply section of the processing liquid supply device is flushed in the solid precipitation area according to the present invention.

[0050] Figure 13 as well as Figure 14 An embodiment is shown in which the solid precipitation area is flushed in the processing liquid regeneration section of the processing liquid supply device according to the present invention.

[0051] Figure 15 An embodiment is shown in which the solid precipitation zone is flushed in the recovery section of the processing liquid supply device according to the present invention.

[0052] (Explanation of reference numerals in the attached diagram)

[0053] 100, 400: Processing fluid supply unit,

[0054] 110, 410: Supply Adjustment Department

[0055] 120, 420: Silicon dioxide supply components,

[0056] 170, 470: Main Supply Department

[0057] 200, 500: Processing liquid reuse unit,

[0058] 210, 510: Recycling Department

[0059] 250, 550: Processing fluid regeneration section,

[0060] 310, 360, 610, 660: Flushing supply components,

[0061] 350, 390, 650, 690: flushing and discharge components. Detailed Implementation

[0062] To illustrate the present invention and its advantages in operation, and to demonstrate the objectives achieved through its implementation, preferred embodiments of the present invention are illustrated below and described with reference thereto.

[0063] First, the terminology used in this application is only for describing specific embodiments and is not intended to limit the scope of the invention. Singular expressions may include plural expressions unless explicitly indicated in the context. Furthermore, in this application, terms such as "comprising" or "having" are intended to specify the presence of features, numbers, steps, operations, constituent elements, parts, or combinations thereof described in the specification, rather than pre-excluding the presence or additional possibilities of one or more other features or numbers, steps, operations, constituent elements, parts, or combinations thereof.

[0064] When describing this invention, detailed descriptions of related well-known structures or functions are omitted if they are deemed to obscure the main idea of ​​the invention.

[0065] This invention discloses a processing liquid supply device with a rinsing function and a method for removing solids such as solid silica from the processing liquid supply device. The rinsing function refers to the function of removing solids such as silica that precipitate along with the processing liquid in the processing liquid supply device that supplies processing liquid to the substrate processing device and recycles it.

[0066] First, an overview of the processing liquid supply device to which the present invention is applicable is observed through an embodiment, and then a specific structure of the present invention for preventing the precipitation of solids such as silica is observed through an embodiment thereof.

[0067] This invention can be applied to a processing liquid supply device for supplying processing liquids for wet etching or cleaning processes used to remove films from the surface of a substrate. Such a processing liquid supply device supplies various processing liquids to a substrate processing apparatus according to the substrate processing conditions.

[0068] In the following embodiments, the processing liquid used for the substrate processing process is described as a high-temperature phosphoric acid aqueous solution containing silicon dioxide. However, this is a limitation for ease of explanation. The processing liquid that can be used in the processing liquid supply device applicable to the present invention may include at least one substance selected from hydrogen fluoride (HF), sulfuric acid (H3SO4), hydrogen peroxide (H2O2), nitric acid (HNO3), phosphoric acid (H3PO4), ozone water, SC-1 solution (a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2) and water (H2O) used in the substrate processing process, etc. In addition, the processing liquid may include various substances that can be used in the substrate processing process.

[0069] Figure 1 A structural diagram of an embodiment of the processing fluid supply device to which the present invention is applied is shown.

[0070] The processing fluid supply device to which the present invention is applied may be configured as a processing fluid supply unit 100, a processing fluid reuse unit 200, a control unit (not shown), etc.

[0071] The processing liquid supply unit 100 may include a supply adjustment unit 110 that adjusts and supplies processing liquid based on substrate processing conditions, and a main supply unit 170 that supplies processing liquid to the substrate processing apparatus 10.

[0072] The processing liquid reuse unit 200 may include a recovery unit 210 that recovers processing liquid from the substrate processing apparatus 10 and a processing liquid regeneration unit 250 that receives the recovered processing liquid from the recovery unit 210, performs regeneration processing, and then supplies regenerated processing liquid to the supply adjustment unit 110 of the processing liquid supply unit 100.

[0073] Furthermore, the control unit (not shown) can control the supply, adjustment, recycling, regeneration, or disposal of the processing fluid for the processing fluid supply unit 100 and the processing fluid reuse unit 200.

[0074] The present invention is described Figure 1 Such a treatment fluid supply device is equipped with a rinsing function for removing solid precipitates such as silica, through Figure 2 as well as Figure 3 Observation in Figure 1 An embodiment of the treatment fluid supply device according to the present invention, which provides a rinsing function.

[0075] The processing fluid supply unit 100 and the processing fluid recycling unit 200 are observed separately. Figure 2 This illustrates a case where a rinsing structure is provided to the processing fluid supply unit 100 on the processing fluid supply device. Figure 3 This illustrates the case where a rinsing structure is provided to the treatment fluid reuse unit 200 on the treatment fluid supply device.

[0076] First, observe the processing liquid supply unit 100 applicable to the present invention.

[0077] An embodiment of the present invention can perform rinsing on the treatment fluid supply unit 100, including a rinsing supply component 310, a rinsing adjustment component, a rinsing discharge component 350, a control unit (not shown), etc.

[0078] The flushing supply member 310 can supply flushing fluid to the portion of the treatment fluid supply unit 100 designated as a solid precipitation area. Here, the flushing fluid can be used alone or in combination, and selectively utilize hydrogen fluoride (HF), deionized water (DIW), or inert gas, etc.

[0079] The flushing supply component 310 may include a flushing fluid supply unit, a flushing fluid supply line, a flushing fluid supply valve, etc.

[0080] The flushing fluid supply unit can be divided into a DIW supply unit 311, an HF supply unit 312, and an inert gas supply unit 313, depending on the flushing fluid used. It can selectively supply the flushing fluid supply line with hydrogen fluoride (HF), deionized water (DIW), or inert gas, either alone or in combination, through the flushing fluid supply valve 315.

[0081] The flushing fluid supply line provides flushing fluid to the solid precipitation area defined on the treatment fluid supply unit 100. The supply line can be configured to adjust the flushing fluid supply amount according to the corresponding solid precipitation area. For example, when a relatively small amount of flushing fluid is required, a small supply line SS 316 can be used to provide flushing fluid, or when a relatively large amount of flushing fluid is required, a large supply line BS 317 can be used to provide flushing fluid.

[0082] Furthermore, the flushing regulating member guides the flushing fluid supplied from the flushing supply member 310 to perform flushing on the corresponding solid precipitation areas disposed on the processing liquid supply unit 100. For this purpose, the flushing regulating member may include a flushing regulating valve disposed in each of the respective solid precipitation areas. The flushing regulating member will be described along with the detailed structure of the processing liquid supply unit 100.

[0083] The flushing and discharge component 350 discharges the remaining treatment liquid in the solid precipitation area set on the treatment liquid supply unit 100 and discharges the flushing fluid after the flushing has been completed.

[0084] The flushing and discharge component 350 may include discharge pipelines HD1 to HD6, one or more distribution boxes 351 and 353, a buffer tank 355, etc.

[0085] Discharge lines HD1 to HD6 are connected to the solid precipitation zones to discharge treatment liquid or flushing fluid. For this purpose, they can be configured to correspond to the number of each solid precipitation zone.

[0086] Dispensing tanks 351 and 353 can combine treatment fluid or flushing fluid discharged from multiple discharge lines selected from multiple discharge lines and discharge them through a single discharge line.

[0087] The buffer tank 355 can receive and store waste liquid from one or more distribution boxes 351 and 353, and discharge it to the outside after certain treatment of the waste liquid.

[0088] In particular, in this invention, rinsing is performed on the solid precipitation area set on the processing liquid supply unit 100. In this regard, the rinsing adjustment member will be explained by observing the various structures of the processing liquid supply unit 100.

[0089] The processing liquid supply unit 100 includes a main supply unit 170 that supplies processing liquid to the substrate processing apparatus 10 and a supply adjustment unit 110 that adjusts the processing liquid according to the substrate processing conditions and supplies the adjusted processing liquid to the main supply unit 170.

[0090] A silicon dioxide supply component 120 for supplying silicon dioxide can be installed in the supply adjustment section 110.

[0091] The silica supply component 120 includes a silica supply section 121 for supplying silica, a silica supply valve 122 for controlling the silica supply from the silica supply section 121, and a silica measuring tube 123 for measuring the amount of silica according to substrate processing conditions and supplying a quantitative amount of silica.

[0092] Such a silica supply component 120 may precipitate solid silica due to various conditions such as exposure to air, as residual silica may be exposed to air, which may cause problems such as pipe blockage or the supply of solid silica.

[0093] In particular, since the silica measuring tube 123 is not a region where silica is continuously held in a flowing state, solid silica may easily precipitate thereout. Therefore, in this invention, the region where the silica supply member 120 is provided is designated as a solid precipitation region, and a rinsing structure is configured to support this to enable rinsing.

[0094] Therefore, the flushing regulating member configured in the silica supply member 120 may include a front flushing regulating valve 321 and a rear flushing regulating valve 325.

[0095] The front flushing regulating valve 321 can be connected to the flushing fluid supply line SS and to the front end of the silica measuring tube 123 of the silica supply component 120. The front flushing regulating valve 321 can be a three-way valve or other multi-way valve to selectively form the flushing fluid supply.

[0096] In addition, the rear flushing regulating valve 325 can be connected to the rear end of the silica measuring tube 123 and the silica supply line 125 and the discharge line HD1. The rear flushing regulating valve 325 can be a three-way valve or other multi-way valve to selectively form silica supply and flushing fluid discharge.

[0097] Furthermore, the control unit can control the silica supply component 120 to perform silica supply, discharge, and flushing through the flushing adjustment component.

[0098] The supply adjustment unit 430 may include an adjustment tank 140 for storing the processing liquid, various material supply pipes 141 and 142 for supplying processing liquid substances such as phosphoric acid or DIW to the adjustment tank 140, and an inert gas supply member 143 for providing pressure to release the processing liquid stored in the adjustment tank 140. Here, nitrogen (N2) or the like can be used as the inert gas.

[0099] Furthermore, the supply adjustment unit 110 may be equipped with an adjustment circulation line 131 for self-circulating the processing liquid in the adjustment tank 140 and adjusting the processing liquid according to the substrate processing conditions. The adjustment circulation line 131 may be equipped with an adjustment line pump 132 for circulating the processing liquid in the adjustment tank 140, an adjustment line heater 133 for heating the circulating processing liquid, and a measuring component for measuring the concentration or temperature of the processing liquid. Here, the measuring component may include a phosphoric acid concentration meter 134 for measuring the phosphoric acid concentration of the phosphoric acid aqueous solution and a thermometer (not shown) for measuring the temperature of the phosphoric acid aqueous solution. The adjustment line pump 132 is preferably a pump with strong chemical resistance. For example, a diaphragm pump can be used for small-volume processing liquid delivery, while a bellows pump and a magnetic pump can be used for large-volume processing liquid delivery. Alternatively, a metering pump for precisely circulating a certain amount of mixture may also be used.

[0100] In addition, although not mentioned Figure 2As shown, but a control valve can be provided for self-circulating the treatment fluid via the adjustment circulation line 131 or discharging the adjusted treatment fluid into the adjustment treatment fluid supply line 111. Here, the control valve can be a three-way valve or a four-way valve, etc. For example, when self-circulating the treatment fluid, the control valve can be closed to circulate the treatment fluid into the adjustment circulation line 131; when supplying the adjusted treatment fluid, the control valve can be opened to discharge the adjusted treatment fluid into the adjustment treatment fluid supply line 111.

[0101] A flow meter (not shown) can be installed on the adjusted treatment fluid supply pipe 111 to measure the supply amount and flow rate of the adjusted treatment fluid.

[0102] The adjusted treatment fluid in the supply adjustment section 110 is discharged into the adjustment treatment fluid supply pipe 111 and supplied to the main supply section 170.

[0103] The operation of the supply adjustment unit 110 is controlled by the control unit. The control unit controls the silicon dioxide supply component 120 to determine the amount of silicon dioxide supplied according to the substrate processing conditions and selectively supply a fixed amount of silicon dioxide. It also controls the supply pipes 141 and 142 to selectively supply the corresponding substances. Furthermore, it controls the processing liquid to circulate by adjusting the circulation pipeline 131 and to adjust the phosphoric acid concentration and temperature.

[0104] In such a supply adjustment section 110, due to the frequent occurrence of the processing liquid not flowing continuously and stagnating in the adjustment tank 140 and adjustment circulation pipeline 131, the temperature of the processing liquid may drop and various solid substances such as silica may precipitate.

[0105] Therefore, in this invention, the selected section of the adjustment tank 140 and the adjustment circulation line 131 is set as a solid precipitation region, and a flushing structure is configured to support this so that flushing can be performed.

[0106] Therefore, flushing regulating valves of flushing regulating components can be configured in selected areas on the regulating circulation line 131 and at the input and output ends of the regulating tank 140, and these flushing regulating valves can be controlled to work organically with each other.

[0107] For example, a flushing regulating valve 331 can be configured at the input end of the regulating tank 140 of the regulating circulation line 131, and flushing regulating valves 333 and 335 can be configured at the front and rear ends of the regulating line pump 132 of the regulating circulation line 131. The selected section of the regulating tank 140 and the regulating circulation line 131 can be flushed through the organic operation of these flushing regulating valves.

[0108] The flushing regulating valve 331, located at the input end of the regulating tank 140, can be connected to the flushing fluid supply line BS, the input end of the regulating tank 140, the regulating circulation line 131, etc. Additionally, the flushing regulating valve 333, located at the front end of the regulating line pump 132, can be connected to the discharge end of the regulating tank 140, the input end of the regulating line pump 132, the discharge line HD2, the flushing fluid supply line SS, etc. The flushing regulating valve 335, located at the rear end of the regulating line pump 132, can be connected to the input end of the regulating circulation line 131, the output end of the regulating line pump 132, the discharge line HD3, the flushing fluid supply line SS, etc.

[0109] Each flushing regulating valve can be adapted to a multi-way valve according to the required input and output. For example, the flushing regulating valves 333 and 335 configured at the front and rear ends of the regulating pipeline pump 132 can be adapted to a four-way valve or other multi-way valve to selectively form the supply and discharge of the treatment liquid and the supply and discharge of the flushing fluid.

[0110] Furthermore, the control unit can control the supply, discharge, and flushing of the treatment fluid to the selected area on the adjustment circulation line 131 and the adjustment tank 140 via the flushing adjustment component.

[0111] Next, observe the main supply unit 170, which may include a main supply tank 180 for storing adjusted processing liquid, a material supply component 181 for supplying processing liquid substances such as DIW to the main supply tank 180, and an inert gas supply component 183 for providing pressure for discharging the processing liquid stored in the main supply tank 180.

[0112] Additionally, the main supply unit 170 includes a processing liquid supply pipe 171 for supplying adjusted processing liquid from the main supply tank 180 to the substrate processing apparatus 10, and a processing liquid supply pipe pump 191 for supplying processing liquid from the main supply tank 180 to the processing liquid supply pipe 171. A processing liquid supply pipe filter 193 for final filtration of the processing liquid supplied to the substrate processing apparatus 10 may also be provided in the processing liquid supply pipe 171.

[0113] In addition, a flow meter (not shown) may be provided in the processing liquid supply pipe 171 for measuring the amount of processing liquid supplied to the substrate processing apparatus 10 and the flow rate.

[0114] Furthermore, the main supply unit 170 may include a sampling line 173 for sampling the processing liquid supplied from the main supply tank 180 and a measuring component for measuring the processing liquid in the sampling line 173. Here, the measuring component may include a silica concentration meter 175 for measuring the silica concentration contained in the processing liquid.

[0115] Furthermore, a supply treatment liquid recovery line 190 can be set up for recovering treatment liquid that has not been properly adjusted based on the measurement results of the sampled treatment liquid.

[0116] The supply treatment liquid recovery line 190 can be connected to recover the treatment liquid to the main supply tank 180 based on the measured silica concentration. Alternatively, a discharge valve can be configured on the supply treatment liquid recovery line 190 as needed to discharge treatment liquid exceeding the set silica concentration to the outside for waste disposal.

[0117] The operation of the main supply unit 170 is controlled by a control unit, which controls the supply of processing liquid from the main supply tank 180 to the substrate processing apparatus 10 via the processing liquid supply pipe 171, and samples the supplied processing liquid via the sampling pipe 173 to check whether the processing liquid has been properly adjusted. For example, the silica concentration or the temperature of the processing liquid can be measured, and the supply adjustment unit 110 can be controlled based on the results to adjust the silica supply or heating temperature. In addition, the control unit can also recover or discharge the processing liquid supplied to the substrate processing apparatus 10 to the outside for disposal if the sampled processing liquid does not meet a certain level of the substrate processing conditions.

[0118] The main supply section 170 observed above may intermittently supply processing liquid to the substrate processing apparatus 10, causing the temperature of the processing liquid to drop and precipitate solids of various processing liquid substances such as silicon dioxide.

[0119] Therefore, in this invention, the main supply tank 180 of the main supply unit 170, the selected section of the processing liquid supply pipe 171, and the selected section of the sampling line 173 are set as solid precipitation areas, and a flushing structure is configured to support this so that flushing can be performed.

[0120] Therefore, flushing regulating valves of flushing regulating components can be configured in selected areas of the treatment fluid supply line 171 and at the inlet and outlet of the main supply tank 180. These flushing regulating valves can be controlled to operate organically with each other. Additionally, flushing regulating valves of flushing regulating components can be configured in selected sections of the sampling line 173 to perform flushing.

[0121] For example, a flushing regulating valve 341 can be configured at the input end of the main supply tank 180 of the recovery pipeline 190, and flushing regulating valves 343 and 345 can be configured at the front and rear ends of the processing liquid supply pump 191 of the processing liquid supply pipe 171. The selected sections of the main supply tank 180 and the processing liquid supply pipe 171 can be flushed through the organic operation of these flushing regulating valves.

[0122] The flushing regulating valve 341, located at the input end of the main supply tank 180, can be connected to the flushing fluid supply line BS, the input end of the main supply tank 180, the recovery line 190, etc. Additionally, the flushing regulating valve 343, located at the front end of the processing fluid supply pump 191, can be connected to the discharge end of the processing fluid supply pump 191, the input end of the processing fluid supply pump 191, the discharge line HD4, the flushing fluid supply line SS, etc. The flushing regulating valve 345, located at the rear end of the processing fluid supply pump 191, can be connected to the processing fluid supply line 171, the output end of the processing fluid supply pump 191, the discharge line HD5, the flushing fluid supply line SS, etc.

[0123] Each flushing regulating valve can be a multi-way valve based on the required input and output. For example, the flushing regulating valves 343 and 345 configured at the front and rear ends of the treatment fluid supply pump 191 can be multi-way valves such as four-way valves to selectively form the supply and discharge of treatment fluid and the supply and discharge of flushing fluid.

[0124] Furthermore, the control unit can control the supply, discharge, and flushing of treatment fluid to the selected area on the treatment fluid supply pipe 171 and the main supply tank 180 via the flushing adjustment component.

[0125] In addition, regarding the selected section of the sampling line 173, a front flushing regulating valve 347 is configured at the front end of the silica concentration meter 175 on the sampling line 173 and a rear flushing regulating valve 349 is configured at the rear end of the silica concentration meter 175 on the sampling line 173, so that the discharge of residual treatment liquid on the sampling line 173 and flushing with flushing fluid can be performed.

[0126] Alternatively, a flushing fluid supply line SS can be connected to a front flushing regulating valve 347 located at the front end of the silica concentration meter 175, and a discharge line HD6 can be connected to a rear flushing regulating valve 349 located at the rear end of the silica concentration meter 175.

[0127] Furthermore, the control unit can control the supply, discharge, and flushing of the treatment fluid to the selected area on the sampling line 173 via the flushing adjustment component.

[0128] Next, we will observe the processing liquid reuse unit 200 to which the present invention applies.

[0129] An embodiment of the present invention can perform rinsing on the treatment liquid reuse unit 200, including a rinsing supply member 360, a rinsing adjustment member, a rinsing discharge member 390, a control unit (not shown), etc.

[0130] The flushing supply component 360 and the flushing discharge component 390 are connected to the aforementioned Figure 2 The similarities observed are so great that a description of them is omitted.

[0131] The flushing regulating member guides the flushing of corresponding solid precipitation zones on the treated liquid reuse unit 200 via flushing fluid supplied from the flushing supply member 360. For this purpose, the flushing regulating member may include a flushing regulating valve configured for each of the respective solid precipitation zones. The detailed structure of the treated liquid reuse unit 200 will be described along with the flushing regulating member.

[0132] The processing liquid recycling unit 200 can also be spatially separated from the processing liquid supply unit 100 observed above and configured as another device. That is, in order to relieve the spatial constraints of the substrate processing facility, the processing liquid recycling unit 200 can be configured as a separate device independent of the processing liquid supply unit 100, and the processing liquid recycling unit 200 can be arranged in different locations in space.

[0133] Thus, the treatment fluid supply unit 100 and the treatment fluid reuse unit 200 are spatially separated and configured as different devices, so the structures for performing rinsing on each unit can also be independently constructed separately.

[0134] The processing liquid reuse unit 200 may include a recovery unit 210 that recovers used waste processing liquid from the substrate processing apparatus 10 and a processing liquid regeneration unit 250 that regenerates the waste processing liquid recovered by the recovery unit 210 and supplies it to the processing liquid supply unit 100 through a supply adjustment unit 110.

[0135] The recycling unit 210 may include a waste treatment liquid supply pipe 220 from which waste treatment liquid is supplied from the substrate processing apparatus, and a recycling tank 230 connected to the waste treatment liquid supply pipe 220 for temporary storage of waste treatment liquid.

[0136] Additionally, the recycling unit 210 may include a recycling liquid supply pipe 240 for supplying the waste treatment liquid stored in the recycling tank 230 to the treatment liquid regeneration unit 250, and a recycling pipe pump 241 for discharging the waste treatment liquid stored in the recycling tank 230 to the recycling liquid supply pipe 240.

[0137] Furthermore, a main filter 235 for filtering impurities can be installed in the recovery unit 210 when waste treatment liquid is supplied to the treatment liquid regeneration unit 250 through the recovery treatment liquid supply pipe 240.

[0138] The operation of the recycling unit 210 is controlled by a control unit, which can control the temporary storage of waste treatment liquid in the recycling tank 230 of the recycling unit 210 and supply the waste treatment liquid in the recycling tank 230 to the treatment liquid regeneration unit 250 or discharge it to the outside for disposal.

[0139] The recycling unit 210 recycles the used processing liquid from the substrate processing apparatus 10 and temporarily stores it. As a result, it contains a large number of various impurities and may easily precipitate solids such as silicon dioxide due to the storage of the used processing liquid.

[0140] Therefore, in this invention, the selected area such as the recovery tank 230 of the recovery unit 210 is set as a solid precipitation area, and a rinsing structure is configured to support this so that rinsing can be performed.

[0141] For this purpose, flushing regulating valves with flushing regulating components are configured at the front and rear ends of the recovery tank 230. These flushing regulating valves can perform flushing on selected sections of the recovery section 210 by working together organically.

[0142] For example, a flushing regulating valve 385 for discharging waste treatment liquid to a discharge line RD3 can be provided on the waste treatment liquid supply pipe 220 that receives waste treatment liquid from the substrate processing apparatus 10 and supplies it to the recovery tank 230. Alternatively, a flushing regulating valve 281 that supplies flushing fluid to the recovery tank 230 by connecting to the flushing fluid supply line BS can be provided at the front end of the recovery tank 230, and a flushing regulating valve 287 can be provided that connects to the output end of the recovery tank 230, the recovery treatment liquid supply pipe 240, the discharge line RD4, etc.

[0143] Furthermore, the control unit can control the supply, discharge, and flushing of the treatment liquid to the selected area on the recovery section 210 and the recovery tank 230 through the flushing adjustment component.

[0144] The waste treatment liquid recovered by the recovery unit 210 can be filtered and supplied to the treatment liquid regeneration unit 250, where it is regenerated into a usable treatment liquid at an appropriate level.

[0145] The processing fluid regeneration unit 250 includes a regeneration tank 270 for storing processing fluid supplied from the recovery unit 210. The supply of processing fluid supplied from the recovered processing fluid supply pipe 240 to the regeneration tank 270 can be controlled by the processing fluid supply valve 243.

[0146] The processing liquid regeneration unit 250 may be provided with a processing liquid material supply pipe 271 for supplying DIW to the regeneration tank 270, and an inert gas supply member 273 for providing pressure for discharging the processing liquid stored in the regeneration tank 270. Here, nitrogen (N2) or the like can be used as the inert gas.

[0147] Furthermore, the processing liquid regeneration unit 250 may be equipped with a regeneration circulation line 261 for self-circulating the processing liquid in the regeneration tank 270 and regenerating the processing liquid. The regeneration circulation line 261 may be equipped with a regeneration line pump 262 for circulating the processing liquid in the regeneration tank 270, a regeneration line heater 263 for heating the circulating processing liquid, and measuring components for measuring the concentration or temperature of the processing liquid. Here, the measuring components may include a phosphoric acid concentration meter 264 for measuring the phosphoric acid moisture concentration of the processing liquid and a thermometer (not shown) for measuring the temperature of the processing liquid.

[0148] Additionally, a regenerated liquid supply valve 266 can be provided for self-circulating the treatment liquid through the regeneration circulation line 261 or discharging the regenerated treatment liquid into the regenerated treatment liquid supply line 251. Here, the regenerated liquid supply valve 266 can be a three-way valve or a four-way valve, etc., to selectively circulate the treatment liquid into the regeneration circulation line 261 or discharge the regenerated treatment liquid into the regenerated treatment liquid supply line 251.

[0149] Furthermore, a secondary filter 265 is provided in the regeneration circulation line 261 to allow the treatment liquid to circulate and be filtered.

[0150] Furthermore, a recovery line 255 can be provided to recover the treatment fluid supplied from the treatment fluid regeneration unit 250 to the supply adjustment unit 110 via the regenerated treatment fluid supply pipe 251. A regenerated treatment fluid supply valve 253 for controlling the supply of regenerated treatment fluid to the supply adjustment unit 110 can be provided on the regenerated treatment fluid supply pipe 251, and a regenerated treatment fluid recovery valve 257 for recovering regenerated treatment fluid from the recovery line 255 can be provided. Here, the regenerated treatment fluid supply valve 253 and the regenerated treatment fluid recovery valve 257 can also be replaced by a three-way valve.

[0151] The operation of the treatment liquid regeneration unit 250 is controlled by a control unit. The control unit controls the selective supply of waste treatment liquid from the recovery unit 210 to the treatment liquid regeneration unit 250, and controls the selective supply of corresponding substances such as DIW to each substance supply pipe 271, 291. It also controls the treatment liquid to regenerate by self-circulating the treatment liquid through the regeneration circulation pipeline 261 and adjusting the phosphoric acid moisture concentration and temperature.

[0152] In such a processing liquid regeneration section 250, due to the frequent occurrence of processing liquid not flowing continuously and stagnating in the regeneration tank 270 and regeneration circulation pipeline 261, the temperature of the processing liquid may drop and various solid substances such as silica may precipitate.

[0153] Therefore, in this invention, the selected section of the regeneration tank 270 and the regeneration circulation pipeline 261 is set as a solid precipitation region, and a flushing structure is configured to support this region so that flushing can be performed.

[0154] For this purpose, flushing regulating valves of flushing regulating components can be configured in selected areas of the regeneration circulation line 261 and at the inlet and outlet of the regeneration tank 270, and these flushing regulating valves can be controlled to work organically with each other.

[0155] For example, a flushing regulating valve 371 can be configured at the input end of the regeneration tank 270 of the regeneration circulation pipeline 261, and flushing regulating valves 373 and 375 can be configured at the front and rear ends of the regeneration pipeline pump 262 of the regeneration circulation pipeline 261. The selected section of the regeneration tank 270 and the regeneration circulation pipeline 261 can be flushed through the organic operation of these flushing regulating valves.

[0156] The flushing regulating valve 371, located at the input end of the regeneration tank 270, can be connected to the flushing fluid supply line BS, the input end of the regeneration tank 270, the regeneration circulation line 261, etc. Additionally, the flushing regulating valve 373, located at the front end of the regeneration line pump 262, can be connected to the discharge end of the regeneration tank 270, the input end of the regeneration line pump 262, the discharge line RD1, the flushing fluid supply line SS, etc. The flushing regulating valve 375, located at the rear end of the regeneration line pump 262, can be connected to the input end of the regeneration circulation line 261, the output end of the regeneration line pump 262, the discharge line RD2, the flushing fluid supply line SS, etc.

[0157] Each flushing regulating valve can be adapted to a multi-way valve according to the required input and output. For example, the flushing regulating valves 373 and 375 configured at the front and rear ends of the regeneration pipeline pump 262 can be adapted to a four-way valve or other multi-way valve to selectively form the supply and discharge of the treatment liquid and the supply and discharge of the flushing fluid.

[0158] Furthermore, the control unit can control the supply, discharge, and flushing of the treatment fluid to the selected area on the regeneration circulation pipeline 261 and the regeneration tank 270 through the flushing adjustment component.

[0159] As observed above, the present invention proposes a processing liquid supply device in which areas for generating solid precipitates such as silica are set in both the processing liquid supply unit 100 and the processing liquid reuse unit 200, and a structure for performing rinsing of such areas is configured to provide a rinsing function.

[0160] The description is as follows Figure 2 The processing liquid supply unit 100 and the Figure 3The treatment liquid reuse unit 200 is arranged in different spaces, and the flushing supply component and flushing discharge component for performing flushing are also separately arranged in each of the treatment liquid supply unit 100 and the treatment liquid reuse unit 200. However, this is based on the equipment configuration of the treatment liquid supply device. If the treatment liquid supply unit and the treatment liquid reuse unit are connected and arranged in one space, the structure for performing flushing can also be combined.

[0161] Furthermore, as described above... Figure 1 The observed processing fluid supply device is configured such that a supply adjustment unit 110 is provided in the processing fluid supply unit 100 and a processing fluid regeneration unit 250 is provided in the processing fluid reuse unit 200, but the number of supply adjustment units 110 in the processing fluid supply unit 100 and the number of processing fluid regeneration units 250 in the processing fluid reuse unit 200 can be changed as needed.

[0162] Regarding this, Figure 4 A structural diagram of another embodiment of the processing fluid supply device to which the present invention is applicable is shown.

[0163] The Figure 4 The basic structural configuration of the embodiment is the same as that observed above. Figure 1 The embodiments are similar, but the processing fluid supply unit 400 includes two supply adjustment units 410 arranged in parallel, and the processing fluid reuse unit 500 includes two processing fluid regeneration units 550 arranged in parallel.

[0164] Multiple supply adjustment units 410 can be configured in parallel such that any one supply adjustment unit 410 supplies the main supply unit 470 with a processing liquid whose concentration and temperature are adjusted based on the substrate processing conditions, while another supply adjustment unit 410 adjusts the concentration and temperature of the processing liquid based on the substrate processing conditions.

[0165] Alternatively, multiple processing liquid regeneration units 550 can be configured in parallel, with any one processing liquid regeneration unit 550 receiving the used processing liquid from the recovery unit 510 for regeneration, while another processing liquid regeneration unit 550 supplies the regenerated processing liquid to any one of the multiple supply adjustment units 410.

[0166] The structure of multiple supply adjustment units 410 and multiple processing liquid regeneration units 550 enables continuous processing liquid adjustment and regeneration, while continuously supplying the adjusted processing liquid to the substrate processing apparatus, thereby further improving the processing liquid supply efficiency.

[0167] The present invention is as described Figure 4 Such a treatment fluid supply device is equipped with a rinsing function for removing solid precipitates such as silica, and the... Figure 4Embodiments of the treatment fluid supply device according to the present invention, which provides a rinsing function, are distinguished as follows: Figure 5 The embodiment of the processing fluid supply unit 400 shown and Figure 6 An example of the treatment liquid reuse unit 500 shown is observed.

[0168] In the Figure 5 In the embodiment of the processing fluid supply unit 400, the descriptions above are omitted. Figure 2 The description of the embodiment of the processing fluid supply unit 100 repeats the previous description, similarly, in the... Figure 6 In the embodiment of the treatment liquid recycling unit 500, the descriptions above are omitted. Figure 3 The description of the repeated portion of the embodiment of the treatment liquid reuse unit 200.

[0169] First, observe the processing liquid supply unit 400 to which the present invention applies.

[0170] In the Figure 5 The treatment fluid supply unit 400 may also include a flushing supply component 610, a flushing adjustment component, a flushing discharge component 650, a control unit (not shown), etc., for the purpose of performing flushing.

[0171] The flushing supply component 610 is equipped with a DIW supply unit 611, an HF supply unit 612, and an inert gas supply unit 613, depending on the flushing fluid used. Hydrogen fluoride (HF), deionized water (DIW), or inert gas can be selectively supplied to the flushing fluid supply line individually or in combination via the flushing fluid supply valve 615.

[0172] The flushing fluid supply line provides flushing fluid to the solid precipitation area set on the processing fluid supply unit 400, and can be divided into small supply line SS 616 and large supply line BS617 according to the required flushing fluid supply volume.

[0173] Furthermore, the flushing regulating member guides the flushing fluid supplied from the flushing supply member 610 to perform flushing on the corresponding solid precipitation zones set on the processing liquid supply unit 400. For this purpose, the flushing regulating member may include a flushing regulating valve configured for each of the respective solid precipitation zones. The detailed structure of the processing liquid supply unit 400 will be described along with the flushing regulating member.

[0174] The flushing and discharge component 650 can discharge the treatment liquid remaining in the solid precipitation area set on the treatment liquid supply unit 400 and discharge the flushing fluid after flushing, including discharge pipelines HD1 to HD8, one or more distribution boxes 651 and 653, buffer tank 655, etc.

[0175] The discharge pipelines HD1 to HD8 are connected to the solid precipitation area to discharge treatment liquid or flushing fluid. The number of pipelines can be adjusted according to the number of solid precipitation areas.

[0176] Distribution tanks 651 and 653 can combine treatment fluid or flushing fluid discharged from multiple selected discharge lines and discharge it through a single discharge line. Buffer tank 355 can receive and store waste liquid from more than one distribution tank 651 or 653, and discharge it to the outside after certain treatment of the waste liquid.

[0177] In this invention, while observing the various structures of the processing liquid supply unit 400, the flushing adjustment member configured to perform flushing on the set solid precipitation area on the processing liquid supply unit 400 will be described.

[0178] The processing liquid supply unit 400 includes a main supply unit 470 that supplies processing liquid to the substrate processing apparatus 10 and a supply adjustment unit 410 that adjusts the processing liquid according to the substrate processing conditions and supplies the adjusted processing liquid to the main supply unit 470.

[0179] The supply adjustment unit 410 may include a first supply adjustment unit 430 and a second supply adjustment unit 450, and may include a silicon dioxide supply member 420. The silicon dioxide supply member 420 may selectively supply silicon dioxide to each of the first supply adjustment unit 430 and the second supply adjustment unit 450.

[0180] The silicon dioxide supply component 420 and the previously described Figure 2 Based on the observed similarities, the area where the silica supply member 420 is configured can be set as a solid precipitation area, and a flushing structure can be configured to support this so that flushing can be performed.

[0181] As a structure for performing flushing of the silica supply component 420, the flushing regulating component may include a front flushing regulating valve 621 and a rear flushing regulating valve 625.

[0182] Here, the silicon dioxide supply line 425 supplying silicon dioxide to the first supply adjustment unit 430 and the silicon dioxide supply line 427 supplying silicon dioxide to the second supply adjustment unit 450 can be connected to the rear flushing adjustment valve 625 to adjust it so that silicon dioxide can be selectively supplied to the first supply adjustment unit 430 and the second supply adjustment unit 450.

[0183] The control unit can control the silica supply component 420 to perform silica supply, discharge and flushing through the flushing adjustment component.

[0184] Furthermore, the first supply adjustment unit 430 and the second supply adjustment unit 450 are respectively related to the previously observed... Figure 2 The structure of the supply adjustment unit 110 in the embodiment is similar.

[0185] The adjusted treatment fluid in the supply adjustment unit 410 is selectively discharged from either the first supply adjustment unit 430 or the second supply adjustment unit 450 into the adjustment treatment fluid supply pipe 411 and supplied to the main supply unit 470.

[0186] The operation of such a supply adjustment unit 410 is controlled by a control unit, which controls the silicon dioxide supply component 420 to selectively supply a fixed amount of silicon dioxide to the first supply adjustment unit 430 and the second supply adjustment unit 450 according to the silicon dioxide supply amount determined by the substrate processing conditions. In addition, it controls the supply of corresponding substances to each substance supply pipe 441, 442, 461, 462 selectively, and controls the processing liquid to circulate selectively through the first adjustment circulation line 431 and the second adjustment circulation line 451 and adjust the phosphoric acid concentration and temperature.

[0187] Preferably, the control unit can control either the first supply adjustment unit 430 or the second supply adjustment unit 450 to adjust the processing liquid, while the other supplies processing liquid to the main supply unit 470 or receives processing liquid from the processing liquid regeneration unit 550.

[0188] Moreover, in the Figure 5 In one embodiment, a rinsing structure can be configured for each set solid precipitation region of the first supply adjustment unit 430 and the second supply adjustment unit 450.

[0189] For example, the selected areas on the first adjustment tank 440 and the first adjustment circulation line 431 of the first supply adjustment unit 430 can be set as solid precipitation areas and a flushing structure for this purpose can be configured. Similarly, the selected areas on the second adjustment tank 460 and the second adjustment circulation line 451 of the second supply adjustment unit 450 can be set as solid precipitation areas and a flushing structure for this purpose can be configured.

[0190] For each solid precipitation region set in the first supply adjustment unit 430 and the second supply adjustment unit 450, the aforementioned configuration can be used. Figure 2 The flushing regulating valves of the flushing regulating component observed in the embodiment can be controlled by the control unit to work organically with each other to perform the supply, discharge and flushing of the treatment liquid to each solid precipitation area.

[0191] Observe the main supply unit 470, the main supply unit 470 is equipped with the aforementioned Figure 2With a similar structure, the main supply tank 480 of the main supply unit 470, the selected section of the processing liquid supply pipe 471, and the selected section of the sampling line 473 can be set as solid precipitation areas, and a flushing structure can be configured to support this so that flushing can be performed.

[0192] The flushing regulating valve of the flushing regulating member configured in these solid precipitation regions and the Figure 2 The structures are similar, so the explanation is omitted.

[0193] Furthermore, the control unit can control the supply, discharge, and flushing of treatment fluid to the selected area on the treatment fluid supply pipe 471, the main supply tank 480, and the selected area on the sampling line 473 via the flushing adjustment component.

[0194] Next, we will observe the processing liquid reuse unit 500 to which the present invention applies.

[0195] In the Figure 6 The treatment liquid reuse unit 500 may also include a flushing supply component 660, a flushing adjustment component, a flushing discharge component 690, a control unit (not shown), etc., for the purpose of performing flushing.

[0196] The flushing supply component 660 and the flushing discharge component 690 are similar to the previously observed embodiments, so a description of them is omitted.

[0197] The flushing regulating member guides the flushing of corresponding solid precipitation zones defined on the treated liquid reuse unit 500 via flushing fluid supplied from the flushing supply member 660. For this purpose, the flushing regulating member may include a flushing regulating valve configured for each of the respective solid precipitation zones. The detailed structure of the treated liquid reuse unit 500 will be described along with the flushing regulating member.

[0198] The processing liquid reuse unit 500 may include a recovery unit 510 that recovers used waste processing liquid from the substrate processing apparatus 10 and a processing liquid regeneration unit 550 that regenerates the waste processing liquid recovered by the recovery unit 510 and supplies it to the supply adjustment unit 410 of the processing liquid supply unit 400.

[0199] The recovery unit 510 is the same as the one described above. Figure 3 Similar to the recovery unit 210, the control unit can control the waste treatment liquid to be temporarily stored in the recovery tank 530 of the recovery unit 510 and to be supplied to either the first treatment liquid regeneration unit 560 or the second treatment liquid regeneration unit 580 of the treatment liquid regeneration unit 550 according to their operating status.

[0200] Furthermore, in this invention, the selected area such as the recovery tank 530 of the recovery unit 510 can be set as a solid precipitation area, and a rinsing structure can be configured to support this so that rinsing can be performed.

[0201] The flushing regulating valve of the flushing regulating member configured in these solid precipitation regions and the Figure 3 The structures are similar, so the explanation is omitted.

[0202] The waste treatment liquid recovered in the recovery unit 510 can be filtered and supplied to the treatment liquid regeneration unit 550, where it is regenerated to a usable level.

[0203] The processing fluid regeneration unit 550 may include a first processing fluid regeneration unit 560 and a second processing fluid regeneration unit 580, which are configured in parallel and can operate independently at the same time or at different times.

[0204] The first processing fluid regeneration unit 560 and the second processing fluid regeneration unit 580 can selectively supply the processing fluid to the supply adjustment unit 410 through the regeneration processing fluid supply pipe 551 after regenerating the processing fluid according to the regeneration conditions. The structures of the first processing fluid regeneration unit 560 and the second processing fluid regeneration unit 580 are the same as those observed above. Figure 3 The structure is similar to that of the treatment fluid regeneration section 250.

[0205] Furthermore, when the supply adjustment unit 410 includes a first supply adjustment unit and a second supply adjustment unit, the processing fluid regeneration unit 550 can selectively supply the regenerated processing fluid to either the first supply adjustment unit or the second supply adjustment unit according to their operating conditions. Alternatively, the processing fluid regeneration unit 550 can also supply the regenerated processing fluid only to the first supply adjustment unit.

[0206] The operation of such a treatment liquid regeneration unit 550 can be controlled by a control unit. The control unit controls the selective supply of waste treatment liquid from the recovery unit 510 to one or more of the first treatment liquid regeneration unit 560 and the second treatment liquid regeneration unit 580, and controls the selective supply of corresponding substances such as DIW to each substance supply pipe 571, 591. The control unit controls the treatment liquid to circulate through the first regeneration circulation pipeline 561 and the second regeneration circulation pipeline 581 and adjust the phosphoric acid moisture concentration and temperature, thereby regenerating the treatment liquid.

[0207] Preferably, the control unit can control either the first processing liquid regeneration unit 560 or the second processing liquid regeneration unit 580 to regenerate the processing liquid, while the other supplies the regenerated processing liquid to the supply adjustment unit 410 or receives waste processing liquid from the recovery unit 510.

[0208] Moreover, in the Figure 6In one embodiment, selected areas on the first processing liquid regeneration unit 560 and the second processing liquid regeneration unit 580 can be designated as solid precipitation areas, and a rinsing structure can be configured for them.

[0209] For example, the selected section of the first regeneration tank 570 and the first regeneration circulation line 561 of the first processing liquid regeneration unit 560 can be set as a solid precipitation area and a flushing structure for this purpose can be configured. Similarly, the selected section of the second regeneration tank 590 and the second regeneration circulation line 581 of the second processing liquid regeneration unit 580 can be set as a solid precipitation area and a flushing structure for this purpose can be configured.

[0210] Furthermore, the control unit can control the supply, discharge, and rinsing of the treatment fluid through the rinsing adjustment members disposed in the first treatment fluid regeneration unit 560 and the second treatment fluid regeneration unit 580.

[0211] In this invention, the processing liquid supply device, which can be observed above, is equipped with a rinsing structure to effectively remove solid precipitates such as silica.

[0212] Furthermore, in this invention, a method for removing solids in a treatment liquid supply device using a treatment liquid supply device having the rinsing function observed above is proposed and observed.

[0213] The solid removal method in the processing liquid supply device according to the present invention may generally include: a processing liquid discharge step of discharging processing liquid substances remaining in a pre-defined solid precipitation zone of the processing liquid supply device; a rinsing step of supplying rinsing fluid to the solid precipitation zone to perform rinsing; and a rinsing fluid discharge step of selectively discharging the rinsing fluid after rinsing from the solid precipitation zone.

[0214] Figure 7 A flowchart illustrating an embodiment of a solids removal method in a processing liquid supply device according to the present invention is shown.

[0215] First, the processing fluid supply to the processing fluid supply device is stopped in order to perform rinsing (S110), and the processing fluid remaining in the processing fluid supply device is discharged (S120).

[0216] After the residual treatment liquid is discharged, flushing fluid is supplied to the solid precipitation area to perform flushing. At this time, various flushing fluids can be supplied in sequence to perform flushing.

[0217] First, a flushing fluid containing hydrogen fluoride is supplied to the corresponding solid precipitation area (S130) to perform flushing to remove solid precipitates adhering to pipes, etc., and the flushing fluid after flushing is discharged to the discharge pipeline (S140).

[0218] Here, the rinsing fluid containing hydrogen fluoride can be an aqueous solution of hydrogen fluoride with a concentration adjusted considering the type of the precipitate to be removed and the characteristics of the solid precipitate area to be rinsed. Alternatively, when the material characteristics of the solid precipitate area to be rinsed on the treatment fluid supply device are unsuitable for rinsing with hydrogen fluoride, the rinsing process can be performed without using a rinsing fluid containing hydrogen fluoride.

[0219] Next, deionized water (DIW) flushing fluid is supplied to the corresponding solid precipitation area (S150), flushing is performed, and the flushing fluid after flushing is discharged to the discharge line (S160).

[0220] The flushing fluid, deionized water (DIW), can remove precipitates remaining in pipes and the like. Since hydrogen fluoride may remain in pipes and the like due to the prior flushing with hydrogen fluoride, it can be used to dilute and remove it.

[0221] Finally, an inert gas flushing fluid is supplied to the corresponding solid precipitation area (S170) to perform flushing and discharge the impurities to the discharge line together with the inert gas (S180).

[0222] Before flushing the solid precipitation area with various types of flushing fluids, deionized water (DIW) and other substances may remain in the pipes, as well as suspended solids that may not be discharged in time. These can be removed by supplying an inert gas flushing fluid at a certain pressure. In particular, the residual deionized water (DIW) may affect the concentration when supplying the treatment liquid. Therefore, by evaporating or discharging the residual deionized water (DIW) and other flushing fluids, the solid precipitation area after flushing can be made into a completely empty space.

[0223] Furthermore, depending on the situation, rinsing can be repeatedly performed using a rinsing fluid containing hydrogen fluoride, rinsing using a rinsing fluid containing deionized water (DIW), or ultimately rinsing using a rinsing fluid containing an inert gas.

[0224] If rinsing of the corresponding solid precipitation area is completed, the supply of processing liquid via the processing liquid supply device is restarted (S190), and processing liquid can be supplied to the substrate processing device.

[0225] In this invention, by performing such a rinsing process, solid precipitates such as silica can be effectively removed from the treatment liquid supply device.

[0226] Next, we will observe the rinsing process performed according to the present invention on each part of the solid precipitation zone set on the treatment liquid supply device.

[0227] Figure 8An embodiment is shown in which rinsing is performed on an area of ​​a substrate processing apparatus equipped with a silicon dioxide supply member according to the present invention.

[0228] The Figure 8 The silicon dioxide supply component 420 is disposed in the Figure 5 The silica supply component 420 of the processing liquid supply unit 400 may include a silica measuring tube 423, which sets a selected certain range as a solid precipitation area to perform rinsing.

[0229] The Figure 8 As in (a), the control unit shuts off the silica supply to the silica supply member 420 and discharges the residual silica in the solid precipitation area equipped with the silica measuring tube 423 through the discharge line HD1. At this time, the flushing regulating valve 625 of the flushing regulating member can be used with a multi-way valve to selectively shut off the supply of silica to the supply regulating section of the silica supply member 420 and open the discharge line HD1 to discharge the residual silica.

[0230] The discharge line HD1 is connected to multiple discharge lines through the distribution box 651 of the flushing discharge component 650. The residual silica discharged through the discharge line HD1 can be stored in the buffer tank 655 and then discharged to the outside after certain treatment.

[0231] If the residual silica is discharged into the solid precipitation area equipped with silica measuring tube 423, then as described above... Figure 8 As in (b), the control unit controls the flushing fluid supply valve 615 to supply deionized water (DIW) from the DIW supply section 611 of the flushing supply member 610 to the solid precipitation area equipped with the silica measuring tube 423. At this time, the deionized water (DIW) does not need to be supplied in large quantities, so it is controlled to be supplied through a small supply line SS 316.

[0232] The rinsing fluid of deionized water (DIW) is supplied to the solid precipitation area equipped with silica measuring tube 423. At the same time, the flow and pressure of the rinsing fluid can remove the solid precipitates such as silica that remain in the solid precipitation area equipped with silica measuring tube 423.

[0233] The control unit controls the flushing regulating valve 625 to perform flushing, thereby discharging the flushing fluid containing deionized water (DIW) containing impurities such as solids through the discharge line HD1.

[0234] Depending on the situation, the control unit may also perform a flush with a flushing fluid containing hydrogen fluoride before performing a flush with a flushing fluid containing deionized water (DIW).

[0235] If rinsing with a rinsing fluid such as deionized water (DIW) is completed, then as described above... Figure 8 As in (c), the control unit controls the flushing fluid supply valve 615 to supply flushing fluid containing inert gas from the inert gas supply section 613 to the solid precipitation area equipped with the silica measuring tube 423, and controls it to open the discharge line HD1 to allow discharge.

[0236] With the supply of inert gas flushing fluid, impurities and deionized water (DIW) remaining in the solid precipitation area equipped with silica measuring tube 423 can be discharged to the discharge line HD1 by the pressure of the inert gas.

[0237] Such flushing fluid and impurities can be stored in the buffer tank 655 of the flushing discharge component 650 through the discharge pipeline HD1 and discharged to the outside after a certain treatment process.

[0238] Through this rinsing process, solid precipitates or impurities can be removed from the solid precipitation area equipped with silica measuring tube 423. In addition, the rinsing fluid is completely removed by inert gas, thereby enabling a high-quality supply of treatment fluid immediately after rinsing.

[0239] Figure 9 as well as Figure 10 An embodiment is shown in which the supply adjustment section of the processing liquid supply device performs rinsing of the solid precipitation area according to the present invention.

[0240] In the Figure 9 and the Figure 10 In the middle, the supply adjustment unit 430 is configured in the said Figure 5 The first supply adjustment unit 430 of the processing liquid supply unit 400 can set the selected section of the first adjustment tank 440 and the first adjustment circulation line 431 as a solid precipitation area to perform flushing.

[0241] The Figure 9 As in (a), the control unit shuts off the treatment fluid supply to the first supply adjustment unit 430 and discharges the remaining treatment fluid in the first adjustment tank 440 and the first adjustment circulation line 431 through the discharge lines HD2 and HD3. At this time, the flushing adjustment valves 633a and 635a of the flushing adjustment member can be controlled by using four-way valves to circulate the treatment fluid in the first adjustment tank 440 and the first adjustment circulation line 431 and discharge it through the discharge lines HD2 and HD3.

[0242] Discharge lines HD2 and HD3 can be combined through the distribution box 651 of the flushing discharge component 650 to store the discharged treatment liquid in the buffer tank 655 and then discharge it to the outside after certain treatment.

[0243] If the remaining treatment liquid is discharged from the solid precipitation area of ​​the first supply adjustment section 430, then as described above... Figure 9 As in (b), the control unit can control the flushing regulating valve 331 at the input end of the first regulating tank 440, which is located in the first regulating circulation line 431, to supply deionized water (DIW) flushing fluid to the solid precipitation area of ​​the first supply regulating unit 430. At this time, a large amount of deionized water (DIW) needs to be supplied to the first regulating tank 440 of the first supply regulating unit 430, etc., so deionized water (DIW) can be supplied through the flushing fluid supply line BS 617 to supply a large amount of flushing fluid.

[0244] In addition, the control unit can be configured to supply and circulate the deionized water (DIW) flushing fluid to the first conditioning tank 440 and the first conditioning circulation line 431, while controlling the flushing regulating valves 633a and 635a to discharge the fluid through the discharge lines HD2 and HD3.

[0245] The first conditioning tank 440 and the first conditioning circulation line 431 are flushed with such deionized water (DIW) rinsing fluid, thereby removing solid precipitates such as silica and impurities in one go.

[0246] Next, the control unit performs flushing on areas where solid precipitates such as silica may easily form. Solid precipitates and impurities may accumulate near the discharge lines of the discharge treatment liquid or flushing fluid, so such areas can be flushed in a concentrated manner.

[0247] Regarding this, as stated above Figure 10 As in (a), the control unit can control the flushing fluid containing hydrogen fluoride to be supplied from the HF supply unit 612 through the flushing fluid supply line SS 616 to the flushing regulating valves 633a and 635a respectively located at the front and rear ends of the adjusting line pump 432. Preferably, the flushing fluid is a hydrogen fluoride aqueous solution with an adjusted hydrogen fluoride concentration, which can be supplied to remove precipitates or impurities.

[0248] Furthermore, the control unit can control the supply of flushing fluid containing hydrogen fluoride while simultaneously discharging it through discharge lines HD2 and HD3, thereby concentrating flushing in the vicinity of the discharge lines.

[0249] When hydrogen fluoride remains in the corresponding area after rinsing with a flushing fluid containing hydrogen fluoride, it will subsequently affect the supply of treatment fluid, therefore, as described above... Figure 10 As in (b), the control unit can control the supply of deionized water (DIW) flushing fluid from the DIW supply unit 611 through the flushing fluid supply line SS 616. Additionally, the control unit can control the supply of deionized water (DIW) flushing fluid to be discharged through the discharge lines HD2 and HD3.

[0250] Residual impurities or hydrogen fluoride can be discharged through rinsing fluids containing deionized water (DIW).

[0251] Below, as described Figure 10 As in (c), the control unit can control the supply of inert gas flushing fluid from the inert gas supply unit 613 through the flushing fluid supply line SS 616 and discharge through the discharge line HD2 and the discharge line HD3.

[0252] Residual impurities or deionized water (DIW) can be discharged by the pressure of inert gas, and residual deionized water (DIW) can also be removed by evaporation.

[0253] By performing such a rinsing process, solid precipitates or impurities can be removed from the solid precipitate area of ​​the first supply adjustment unit 430, and the rinsing fluid can also be completely removed by inert gas, thereby enabling the supply of high-quality treatment fluid immediately after rinsing.

[0254] Figure 11 as well as Figure 12 An embodiment is shown in which the main supply section of the processing liquid supply device is flushed in the solid precipitation area according to the present invention.

[0255] In the Figure 11 and the Figure 12 In the middle, the main supply unit 470 is configured in the aforementioned Figure 5 The main supply section 470 of the processing liquid supply unit 400 can set the selected area of ​​the main supply tank 480, the processing liquid supply pipe 471 and the selected area of ​​the sampling line 473 as the solid precipitation area and perform flushing.

[0256] As described Figure 11 As in (a), the control unit shuts off the processing fluid supply to the main supply unit 470 and discharges the remaining processing fluid in the main supply tank 480 and the processing fluid supply pipe 471 through discharge lines HD6 and HD7. At this time, the flushing regulating valves 643 and 645 of the flushing regulating member can be controlled by using four-way valves to circulate the processing fluid in the main supply tank 480 and the processing fluid supply pipe 471 and discharge it through discharge lines HD6 and HD7.

[0257] If the remaining treatment liquid is discharged into the solid precipitation area of ​​the main supply section 470, then as described... Figure 11As in (b), the control unit can control the flushing regulating valve 641, which is configured at the input end of the main supply tank 480 of the recovery line 490, to supply deionized water (DIW) flushing fluid to the solid precipitation area of ​​the main supply unit 470. At this time, a large amount of deionized water (DIW) needs to be supplied to the main supply tank 480 of the main supply unit 470, etc., so deionized water (DIW) can be supplied through the flushing fluid supply line BS 617 to supply a large amount of flushing fluid.

[0258] In addition, the control unit can control the supply and circulation of deionized water (DIW) flushing fluid to the main supply tank 480 and the recovery line 490, and control the flushing regulating valves 643 and 645 to discharge through the discharge lines HD6 and HD7.

[0259] The main supply tank 480 and the recovery line 490 are flushed with such deionized water (DIW) to remove solid precipitates and impurities such as silica in one go.

[0260] Next, the control unit performs flushing on areas where solid precipitates such as silica may easily form. Solid precipitates and impurities may accumulate near the discharge lines of the discharge treatment liquid or flushing fluid, so such areas can be flushed in a concentrated manner.

[0261] Regarding this, as stated above Figure 12 As in (a), the control unit can control the flushing fluid containing hydrogen fluoride to be supplied from the HF supply unit 612 through the flushing fluid supply line SS 616 to the flushing regulating valves 643 and 645 respectively located at the front and rear ends of the processing liquid supply pump 491. Preferably, the flushing fluid is a hydrogen fluoride aqueous solution with an adjusted hydrogen fluoride concentration, which can be supplied to remove precipitates or impurities.

[0262] Furthermore, the control unit can control the supply of flushing fluid containing hydrogen fluoride while simultaneously discharging it through discharge lines HD6 and HD7, thereby concentrating flushing in the vicinity of the discharge lines.

[0263] When hydrogen fluoride remains in the corresponding area after rinsing with a flushing fluid containing hydrogen fluoride, it will subsequently affect the supply of treatment fluid, therefore, as described above... Figure 12 As in (b), the control unit can control the supply of deionized water (DIW) flushing fluid from the DIW supply unit 611 through the flushing fluid supply line SS 616. Additionally, the control unit can control the supply of deionized water (DIW) flushing fluid to be discharged through the discharge lines HD6 and HD7.

[0264] Residual impurities or hydrogen fluoride can be discharged through rinsing fluids containing deionized water (DIW).

[0265] Below, as described Figure 12 As in (c), the control unit can control the supply of inert gas flushing fluid from the inert gas supply unit 613 through the flushing fluid supply line SS 616 and discharge through the discharge line HD2 and the discharge line HD3.

[0266] Residual impurities or deionized water (DIW) can be discharged by the pressure of inert gas, and residual deionized water (DIW) can also be removed by evaporation.

[0267] Furthermore, it is also possible to transfer the data to the level described above. Figure 11 A similar process involves sampling the processing liquid supplied to the substrate processing apparatus and shutting off the processing liquid supply to the sampling line 473 for measuring silica concentration. After opening the discharge line HD8 to discharge the residual processing liquid, the flushing fluid supply line SS is opened to perform flushing on the selected area equipped with the silica concentration meter 475 on the sampling line 473 by the flow of flushing fluid. Finally, the discharge line HD8 is opened to discharge the flushing fluid after the flushing is performed.

[0268] By performing such a rinsing process, solid precipitates or impurities can be removed from the solid precipitate area of ​​the main supply section 470, and the rinsing fluid can also be completely removed by inert gas, thereby enabling the immediate supply of high-quality treatment fluid after rinsing.

[0269] Figure 13 as well as Figure 14 An embodiment is shown in which the solid precipitation area is flushed in the processing liquid regeneration section of the processing liquid supply device according to the present invention.

[0270] The processing fluid regeneration unit 560 is disposed in the above Figure 6 The first processing liquid regeneration unit 560 of the processing liquid reuse unit 500 can set the selected area of ​​the first regeneration tank 570 and the first regeneration circulation pipeline 561 as a solid precipitation area and perform rinsing.

[0271] As described Figure 13 As in (a), the control unit shuts off the treatment fluid supply to the first treatment fluid regeneration unit 560 and discharges the remaining treatment fluid in the first regeneration tank 570 and the first regeneration circulation line 561 through discharge lines RD1 and RD2. At this time, the flushing regulating valves 673a and 675a ​​of the flushing regulating member can be controlled by using four-way valves to circulate the treatment fluid in the first regeneration tank 570 and the first regeneration circulation line 561 and discharge it through discharge lines RD1 and RD2.

[0272] Discharge lines RD1 and RD2 are merged through the distribution box 691 of the flushing discharge component 690. The discharged treatment liquid can be stored in the buffer tank 695 and then discharged to the outside after certain treatment.

[0273] If the remaining treatment liquid is discharged into the solid precipitation area of ​​the first treatment liquid regeneration section 560, then as described above... Figure 13 As in (b), the control unit can control the flushing regulating valve 671a at the input end of the first regeneration tank 570, which is located in the first regeneration circulation line 561, to supply deionized water (DIW) flushing fluid to the solid precipitation area of ​​the first processed liquid regeneration unit 560. At this time, a large amount of deionized water (DIW) needs to be supplied to the first regeneration tank 570 of the first processed liquid regeneration unit 560, etc., so deionized water (DIW) can be supplied through the flushing fluid supply line BS 667 to supply a large amount of flushing fluid.

[0274] In addition, the control unit can control the supply of deionized water (DIW) flushing fluid to the first regeneration tank 570 and the first regeneration circulation line 561 and circulate it, and control the flushing regulating valves 673a and 675a ​​to discharge it through the discharge line RD1 and the discharge line RD2.

[0275] The first regeneration tank 570 and the first regeneration circulation line 561 are flushed with such deionized water (DIW) rinsing fluid, thereby removing solid precipitates such as silica and impurities in one go.

[0276] Next, the control unit performs flushing on areas where solid precipitates such as silica may easily form. Solid precipitates and impurities may accumulate near the discharge lines of the discharge treatment liquid or flushing fluid, so such areas can be flushed in a concentrated manner.

[0277] Regarding this, as stated above Figure 14 As in (a), the control unit can control the flushing fluid containing hydrogen fluoride to be supplied from the HF supply unit 662 through the flushing fluid supply line SS 666 to the flushing regulating valves 673a and 675a ​​respectively located at the front and rear ends of the regeneration line pump 592. Preferably, the flushing fluid is a hydrogen fluoride aqueous solution with an adjusted hydrogen fluoride concentration, which can be supplied to remove precipitates or impurities.

[0278] Furthermore, the control unit can control the supply of flushing fluid containing hydrogen fluoride while simultaneously discharging it through discharge lines RD1 and RD2, thereby concentrating flushing in the vicinity of the discharge lines.

[0279] When hydrogen fluoride remains in the corresponding area after rinsing with a flushing fluid containing hydrogen fluoride, it will subsequently affect the supply of treatment fluid, therefore, as described above... Figure 14 As in (b), the control unit can control the supply of deionized water (DIW) flushing fluid from the DIW supply unit 661 through the flushing fluid supply line SS 666. Additionally, the control unit can control the supply of deionized water (DIW) flushing fluid to be discharged through the discharge lines RD1 and RD2.

[0280] Residual impurities or hydrogen fluoride can be discharged through rinsing fluids containing deionized water (DIW).

[0281] Below, as described Figure 14 As in (c), the control unit can control the inert gas flushing fluid to be supplied from the inert gas supply unit 663 through the flushing fluid supply line SS 666 and discharged through the discharge line RD1 and the discharge line RD2.

[0282] Residual impurities or deionized water (DIW) can be discharged by the pressure of inert gas, and residual deionized water (DIW) can also be removed by evaporation.

[0283] By performing such a rinsing process, solid precipitates or impurities can be removed from the solid precipitation area of ​​the first treatment fluid regeneration unit 560, and the rinsing fluid can also be completely removed by inert gas, thereby enabling a high-quality supply of treatment fluid immediately after rinsing.

[0284] Figure 15 An embodiment is shown in which the solid precipitation zone is flushed in the recovery section of the processing liquid supply device according to the present invention.

[0285] In the Figure 15 In the middle, the recycling unit 510 is configured in the Figure 6 The recovery unit 510 of the treatment liquid recycling unit 500 can set the selected area, such as the recovery tank 530 of the recovery unit 510, as a solid precipitation area and perform rinsing.

[0286] As described Figure 15 As in (a), the control unit can shut off the processing liquid recovery and supply of the recovery unit 510, control the flushing regulating valve 665 to discharge the processing liquid supplied from the substrate processing device 10 directly through the discharge line RD5, and control the flushing regulating valve 687 to discharge the remaining processing liquid in the recovery tank 530, etc., through the discharge line RD6.

[0287] If the remaining treated liquid is discharged into the solid precipitation area of ​​the recovery section 510, then as described above... Figure 12As in (b), the control unit can control the flushing regulating valve 681 configured at the input end of the recovery tank 530 to supply deionized water (DIW) flushing fluid to the recovery tank 530 of the recovery unit 510. At this time, a large amount of deionized water (DIW) needs to be supplied to the recovery tank 530, etc., so deionized water (DIW) can be supplied through the flushing fluid supply line BS 667 to supply a large amount of flushing fluid.

[0288] Additionally, the control unit can be configured to supply deionized water (DIW) flushing fluid to the recovery tank 530 and control the flushing regulating valve 687 to discharge it through the discharge line RD6.

[0289] By rinsing the recovery tank 530 with such deionized water (DIW) rinsing fluid, solid precipitates such as silica and impurities remaining in the recovery tank 530 can be removed.

[0290] Below, as described Figure 15 As in (c), the control unit can control the flushing fluid, which is an inert gas, to be supplied from the inert gas supply unit 663 through the flushing fluid supply line BS 667 and discharged through the discharge line RD6 via the recovery tank 530, etc.

[0291] Residual impurities or deionized water (DIW) can be discharged by the pressure of inert gas, and residual deionized water (DIW) can also be removed by evaporation.

[0292] By performing such a rinsing process, solid precipitates or impurities can be removed from the solid precipitate area of ​​the recovery section 510. Additionally, the rinsing fluid is also completely removed by inert gas, thereby enabling the immediate supply of high-quality treatment fluid after rinsing.

[0293] Based on the above observations, the present invention can effectively remove solid precipitates such as silica on the processing liquid supply device and immediately supply the processing liquid after performing the rinsing process, thus effectively maintaining the process output rate.

[0294] In particular, concentrated rinsing of areas on the processing liquid supply device where silica is easily precipitated can remove silica and other solids.

[0295] The above description is merely illustrative of the technical concept of the present invention. Those skilled in the art to which this invention pertains should be able to make various modifications and variations without departing from the essential characteristics of the invention. Therefore, the embodiments described in this invention are for illustrative purposes only and not for limiting the technical concept of the invention. The technical concept of the invention is not limited to such embodiments. The scope of protection of this invention should be interpreted through the appended claims, and all technical concepts within the same scope should be interpreted as included within the scope of the claims of this invention.

Claims

1. A processing liquid supply apparatus for supplying processing liquid to a substrate processing apparatus, characterized in that, The processing fluid supply device includes: The flushing supply component includes a flushing fluid supply unit for supplying flushing fluid, a flushing fluid supply line for supplying flushing fluid to a pre-defined solid precipitation zone of a treatment fluid supply device, and a flushing fluid supply valve for selectively supplying flushing fluid from the flushing fluid supply unit to the flushing fluid supply line. A flushing regulating component guides the flushing of the solid precipitation area through the flow of flushing fluid; The flushing and discharge components include discharge lines that discharge treatment liquid or flushing fluid from the solid precipitation area to the outside; and The control unit controls the rinsing of the solid precipitation area. The control unit shuts off the treatment fluid supply to the solid precipitation area and opens the discharge line to discharge the treatment fluid remaining in the solid precipitation area. It also selectively opens and closes the flushing fluid supply line and the discharge line to flush the solid precipitation area in the order of hydrogen fluoride, deionized water, and inert gas, or in the order of deionized water and inert gas. The flushing and discharge component also includes: Multiple discharge lines discharge the treatment liquid remaining in each of the solid precipitation zones or the flushing fluid after flushing. One or more distribution boxes combine and discharge treatment fluid or flushing fluid from multiple selected discharge lines through a single discharge line; and A buffer tank receives and stores waste liquid from one of the aforementioned distribution boxes.

2. The treatment fluid supply device according to claim 1, characterized in that, The solid precipitation region includes a region equipped with a silicon dioxide supply member that measures and supplies a quantitative amount of silicon dioxide based on substrate processing conditions. The flushing regulating component includes a front flushing regulating valve connected to the flushing fluid supply line and to the front end of the silica measuring tube of the silica supply component, and a rear flushing regulating valve connected to the rear end of the silica measuring tube and the silica supply line, thereby guiding the discharge of residual silica and flushing based on the flushing fluid. The flushing and discharge component includes a discharge line connected to the flushing regulating valve to discharge residual silica or flushing fluid from the silica supply component.

3. The treatment fluid supply device according to claim 1, characterized in that, The solid precipitation region includes a region equipped with one or more of the following: a supply adjustment unit that adjusts the processing liquid based on substrate processing conditions; a processing liquid regeneration unit that adjusts the recovered processing liquid based on regeneration conditions; and a main supply unit that supplies processing liquid to the substrate processing apparatus. The flushing regulating component includes one or more flushing regulating valves connected to the flushing fluid supply line and to any one or more circulation lines of the supply regulating unit, the treated fluid regeneration unit, and the main supply unit, thereby guiding the discharge of residual treated fluid and flushing based on the flushing fluid. The flushing discharge component includes a discharge line connected to the flushing regulating valve to discharge residual treatment liquid or flushing fluid from any one or more of the supply adjustment section, the treatment liquid regeneration section, and the main supply section.

4. The processing fluid supply device according to claim 1, characterized in that, The solid precipitation region includes a region equipped with one or more of the following: a supply adjustment unit that adjusts the processing liquid based on substrate processing conditions; a processing liquid regeneration unit that adjusts the recovered processing liquid based on regeneration conditions; a main supply unit that supplies processing liquid to the substrate processing apparatus; and a recovery unit that recovers the processing liquid from the substrate processing apparatus. The flushing regulating component includes a front flushing regulating valve connected to the flushing fluid supply line and connected to the front end of one or more of the tanks in the supply regulating section, the treated fluid regeneration section, and the main supply section, and a rear flushing regulating valve connected to the rear end of one or more of the tanks in the supply regulating section, the treated fluid regeneration section, and the main supply section, thereby guiding the discharge of residual treated fluid and flushing based on the flushing fluid. The flushing and discharge component includes a discharge line connected to the rear flushing regulating valve to discharge residual treatment liquid or flushing fluid from the tank.

5. The treatment fluid supply device according to claim 1, characterized in that, The solid precipitation region includes an area equipped with a sampling pipeline for sampling the processing liquid supplied to the substrate processing device to determine the silica concentration. The flushing regulating component includes a front flushing regulating valve connected to the flushing fluid supply line and connected to the front end of the silica concentration meter on the sampling line, and a rear flushing regulating valve connected to the rear end of the silica concentration meter on the sampling line, thereby guiding the discharge of residual treatment liquid and flushing based on the flushing fluid. The flushing and discharge component includes a discharge pipeline connected to the rear flushing regulating valve to discharge residual treatment liquid or flushing fluid from the sampling pipeline.

6. The processing fluid supply device according to claim 1, characterized in that, The processing fluid supply device includes: The processing liquid supply unit includes a main supply section for supplying processing liquid to a substrate processing apparatus and a supply adjustment section for adjusting the processing liquid according to substrate processing conditions and supplying it to the main supply section; and The processing liquid recycling unit includes a recovery unit that recovers processing liquid from the substrate processing apparatus and a processing liquid regeneration unit that receives the recovered processing liquid from the recovery unit, adjusts the processing liquid according to regeneration conditions, and supplies it to the supply adjustment unit. The flushing supply component, the flushing adjustment component, and the flushing discharge component are configured corresponding to each of the treatment liquid supply unit and the treatment liquid reuse unit.

7. A method for removing solids from a processing liquid supply device, wherein rinsing is performed on the processing liquid supply device that supplies processing liquid to a substrate processing device, characterized in that, The solid removal method of the treatment liquid supply device includes: The process liquid discharge step involves discharging the residual process liquid material from the pre-defined solid precipitation area of ​​the process liquid supply device to the outside. The rinsing step involves supplying rinsing fluid to the solid precipitation area to perform rinsing; and The flushing fluid discharge step involves selectively discharging the flushing fluid after flushing from the solid precipitation area. The treatment fluid discharge step involves shutting off the treatment fluid supply to the solid precipitation area and opening the discharge line to discharge the treatment fluid remaining in the solid precipitation area. The flushing fluid supply line and the discharge line are selectively opened and closed in the following order: hydrogen fluoride, deionized water, and inert gas; deionized water, hydrogen fluoride, deionized water, and inert gas; or deionized water and inert gas. This flushing step and the flushing fluid discharge step are repeated sequentially. The flushing fluid discharge step provides one or more of the treatment fluid and flushing fluid discharged from multiple discharge lines selected from multiple discharge lines to the distribution tank, and stores one or more of the treatment fluid and flushing fluid combined in the distribution tank in a buffer tank.

8. The solid removal method of the treatment liquid supply device according to claim 7, characterized in that, The flushing step and the flushing fluid discharge step selectively execute the opening and closing of the flushing fluid supply line and the discharge line of the solid precipitation area to flush the solid precipitation area in the order of hydrogen fluoride and deionized water or with deionized water and discharge the flushing fluid after flushing, and selectively execute the opening and closing of the flushing fluid supply line and the discharge line of the solid precipitation area to discharge or remove residual flushing fluid by the flow of inert gas.

9. The solid removal method of the treatment liquid supply device according to claim 7, characterized in that, The process liquid discharge step involves determining the silica content based on the substrate processing conditions, shutting off the silica supply to the silica supply component that supplies a fixed amount of silica, and opening the discharge line to discharge any residual silica. The flushing step involves opening the flushing fluid supply line to flush the silica measuring tube and the silica supply line through the flow of flushing fluid. The flushing fluid discharge step involves opening the discharge line to discharge the flushing fluid after flushing has been performed.

10. The solid removal method of the processing liquid supply device according to claim 7, characterized in that, The process liquid discharge step involves shutting off the process liquid supply and opening the discharge line in a selected section of one or more circulation lines among the following: one or more process liquid supply adjustment units that adjust the process liquid supply based on substrate processing conditions, one or more process liquid regeneration units that adjust the recovered process liquid based on regeneration conditions, and one main supply unit that supplies process liquid to the substrate processing apparatus; thereby discharging the residual process liquid. The flushing step involves opening the flushing fluid supply line and performing flushing on a selected section of the circulation line by the flow of flushing fluid. The flushing fluid discharge step involves opening the discharge line to discharge the flushing fluid after flushing has been performed.

11. The solid removal method of the processing liquid supply device according to claim 7, characterized in that, The process liquid discharge step involves shutting off the process liquid supply and opening the discharge pipeline to discharge the residual process liquid from any one or more tanks selected from the following: one or more process liquid supply adjustment units that adjust the process liquid based on substrate processing conditions, one or more process liquid regeneration units that adjust the recovered process liquid based on regeneration conditions, the main supply unit that supplies process liquid to the substrate processing apparatus, and the recovery unit that recovers process liquid from the substrate processing apparatus. The flushing step involves opening the flushing fluid supply line and flushing the tank with the flow of flushing fluid. The flushing fluid discharge step involves opening the discharge line to discharge the flushing fluid after flushing has been performed.

12. The solid removal method of the treatment liquid supply device according to claim 7, characterized in that, The process liquid discharge step involves shutting off the process liquid supply and opening the discharge line at any one of the following: one or more process liquid supply adjustment units that adjust the process liquid supply based on substrate processing conditions, one or more process liquid regeneration units that adjust the recovered process liquid based on regeneration conditions, and one or more main supply units that supply process liquid to the substrate processing apparatus, thereby discharging the residual process liquid. The flushing step and the flushing fluid discharge step are performed by supplying deionized water flushing fluid through the flushing fluid supply line to flush the tank and the circulation line with deionized water flushing fluid and opening the discharge line to discharge the flushing fluid after flushing. The selected section of the circulation line is flushed by supplying flushing fluid in the order of hydrogen fluoride, deionized water and inert gas through the flushing fluid supply line and opening the discharge line to discharge the flushing fluid after flushing.

13. The solid removal method of the processing liquid supply device according to claim 7, characterized in that, The process liquid discharge step involves shutting off the sample line that samples the process liquid supplied to the substrate processing apparatus to measure the silica concentration, and opening the discharge line to discharge the residual process liquid. The flushing step involves opening the flushing fluid supply line and flushing the selected section of the sampling line equipped with a silica concentration meter by the flow of flushing fluid. The flushing fluid discharge step involves opening the discharge line to discharge the flushing fluid after flushing has been performed.

14. A processing liquid supply apparatus for supplying processing liquid to a substrate processing apparatus, characterized in that, The processing fluid supply device includes: The flushing supply component includes a flushing fluid supply unit that supplies flushing fluid containing one or more of hydrogen fluoride, deionized water, and an inert gas; a flushing fluid supply line that supplies flushing fluid to a solid precipitation region; and a flushing fluid supply valve that selectively supplies flushing fluid from the flushing fluid supply unit to the flushing fluid supply line. The flushing regulating component includes a flushing regulating valve that controls the flow of flushing fluid over the solid precipitation area, thereby guiding the discharge of residual treatment liquid and flushing based on the flushing fluid; The flushing and discharge system includes multiple discharge lines for discharging residual treatment liquid or flushing fluid after flushing in each of the solid precipitation zones; one or more distribution tanks for discharging the treatment liquid or flushing fluid from multiple selected discharge lines through a single discharge line; and a buffer tank for receiving and storing the treatment liquid or flushing fluid from the distribution tanks before discharging it externally. The control unit controls the rinsing of the solid precipitation area. The control unit selectively controls the opening and closing of the flushing fluid supply line and the opening and closing of the discharge line to flush the solid precipitation area in the order of hydrogen fluoride, deionized water and inert gas or in the order of deionized water and inert gas.

Images